Electronic device

Abstract

The present application relates to the technical field of electronic products, and discloses an electronic device, which reduces near-field coupling between an antenna and an electrical connector. The electronic device comprises a ground plane, an antenna main body, a first structural member, a second structural member, and an electrical connector, wherein the antenna main body is electrically connected to the ground plane, a clearance area is provided between the antenna main body and the ground plane, and the antenna main body has an accommodating space; the first structural member and the second structural member are electrically connected by means of the electrical connector; a portion where an orthographic projection of the electrical connector on a first reference plane overlaps with an orthographic projection of the antenna main body on the first reference plane is a first section, the first section is arranged within the accommodating space, and the orthographic projection of the electrical connector on the first reference plane does not overlap with an orthographic projection of the clearance area on the first reference plane; and the first reference plane is perpendicular to a thickness direction of the ground plane.

Description

electronic devices Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0002] In related technologies, electronic devices typically include electrical connectors to achieve electrical connections between two structural components. However, with technological advancements, electronic devices have become increasingly feature-rich and their structures more compact, resulting in closer proximity between antennas and electrical connectors. This leads to stronger near-field coupling between the antenna and the connector, causing problems such as excessive radiated spurious emission (RSE), antenna clutter, and antenna interference. Furthermore, when the antenna is operating, it can also generate electromagnetic interference to sensor ICs within some structural components, affecting the performance of those components. Summary of the Invention

[0003] This application provides an electronic device that can reduce near-field coupling between the antenna and electrical connectors.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] This application provides an electronic device including a ground plane, an antenna body, a first structural member, a second structural member, and an electrical connector. The antenna body is electrically connected to the ground plane, and a clearance area is formed between the antenna body and the ground plane. The antenna body has an accommodating space. The first structural member and the second structural member are electrically connected via the electrical connector. The first structural member is located on one side of the ground plane in the thickness direction. The portion where the orthographic projection of the electrical connector on a first reference plane overlaps with the orthographic projection of the antenna body on the first reference plane is a first segment, which is disposed within the accommodating space. The orthographic projection of the electrical connector on the first reference plane does not overlap with the orthographic projection of the clearance area on the first reference plane. The first reference plane is perpendicular to the thickness direction of the ground plane. The opening of the accommodating space is located on the surface of the antenna body.

[0006] The electronic device of this application, by creating a receiving space on the antenna body, places the first segment of the electrical connector within the receiving space, and ensures that the electrical connector avoids the clearance area of ​​the antenna body in the path connecting the first structural component and the second structural component, placing the electrical connector in a region with weak electric field strength. On the one hand, this effectively reduces the coupling current between the antenna body and the electrical connector, improves the signal isolation between the antenna body and the electrical connector, thereby helping to reduce mutual interference between the antenna signal and the signal transmitted on the electrical connector, thus improving the performance of the antenna and the second structural component, and mitigating the RSE problem. On the other hand, it eliminates the need to reserve additional space for the first segment of the electrical connector inside the electronic device, which helps to reduce the space occupied by the electrical connector inside the electronic device, thereby optimizing the spatial layout of the electronic device and facilitating the miniaturization design of the electronic device.

[0007] In one possible implementation, the receiving space has a through-hole through which an electrical connector passes; the orthographic projection of the through-hole onto the first reference plane lies within the orthographic projection of the ground plane onto the first reference plane. In this way, the area of ​​the receiving space includes the grounding terminal of the antenna body. After passing through the through-hole, the electrical connector can extend along the surface of the ground plane towards the location of the first structural member, allowing the electrical connector to avoid the clearance area. This reduces the coupling current between the antenna body and the electrical connector. Furthermore, this structure is simple and easy to implement.

[0008] In one possible implementation, the antenna body includes a first stub and a second stub. The first stub is spaced apart from the ground plane, and the second stub is connected to the first stub and electrically connected to the ground plane. The first stub serves as the radiator of the antenna, and the second stub can serve as a grounding structure. This enables the radiation or reception of electromagnetic waves and allows the antenna body to be grounded.

[0009] In one possible implementation, the ground plane includes a connected body portion and a protrusion portion. The body portion includes a first side facing the first stub, and the protrusion portion protrudes from the first side side. The second stub is electrically connected to the protrusion portion. This approach helps to reduce the length of the second stub, thereby shortening the return path of the antenna body and further improving the return current of the antenna body.

[0010] In one possible implementation, the containing space includes a first subspace formed in a first branch. Alternatively, the containing space includes a second subspace formed in a second branch. Or, the containing space includes a first subspace and a second subspace, with the first subspace formed in the first branch and the second subspace formed in the second branch. A specific structure for the containing space is provided.

[0011] In one possible implementation, the first subspace includes a first opening, and the first branch includes a first conductive element and a second conductive element that are opposite and spaced apart, with at least a portion of the first conductive element and at least a portion of the second conductive element arranged in a first direction; a first opening is formed between one end of the first conductive element in a second direction and one end of the second conductive element in a second direction, the second direction being perpendicular to the first direction; wherein, the first direction is perpendicular to the thickness direction of the ground plane. A specific structure of the first branch is provided.

[0012] In this way, the first segment can be limited by the first conductive element, preventing the first segment from slipping out of the first subspace into the clearance area of ​​the antenna body. This helps to improve the positional stability of the electrical connector, thereby improving the performance stability of the antenna body and the performance stability of the second structural component.

[0013] In one possible implementation, the first direction is parallel to the thickness direction of the ground plane. Another specific structure for the first branch is provided.

[0014] In one possible implementation, the distance between the first conductive element and the second conductive element is smaller than the operating wavelength of the antenna body. This facilitates the formation of parasitic capacitance between the first and second conductors.

[0015] In one possible implementation, the first conductive element and the second conductive element are electrically connected, and the distance between two adjacent electrical connection points between the first and second conductive elements is less than or equal to one-quarter of the operating wavelength of the antenna body. This is beneficial for improving the radiation performance of the antenna body, thereby improving the antenna's radiation efficiency and system efficiency.

[0016] In one possible implementation, the first segment includes a first sub-segment located between the first conductive element and the second conductive element; the dimension of the first sub-segment in the second direction is less than or equal to the dimension of the first subspace in the second direction. This ensures that the first sub-segment is located in a region with a weak electric field, effectively reducing the coupling current between the antenna body and the first sub-segment.

[0017] In one possible implementation, the first segment includes a first sub-segment located between the first conductive element and the second conductive element; the first sub-segment is a flexible circuit board, and the thickness direction of the first sub-segment is parallel to the arrangement direction of the first conductive element and the second conductive element (i.e., the first direction).

[0018] This approach helps reduce the space occupied by the first segment in the first direction, thereby reducing the distance between the first and second conductive elements. On the one hand, it helps reduce the size of the first branch in the first direction, increasing the net size of the antenna body without increasing the size of the electronic device in the first direction (e.g., the length or width of the electronic device). On the other hand, it helps reduce the size of the electronic device in the first direction while ensuring the net size of the antenna body, which is beneficial for miniaturizing the electronic device. Furthermore, it facilitates the formation of parasitic capacitance between the first and second conductive elements, reducing the electric field strength inside the accommodating space.

[0019] In one possible implementation, the first branch further includes a third conductive element electrically connected between the first and second conductive elements; the first, second, and third conductive elements form a first subspace. Thus, the electrical connection between the first and second conductive elements can be achieved through the third conductive element.

[0020] In one possible implementation, at least one of the first conductive element and the second conductive element is integrally formed with the third conductive element. Specifically, the first conductive element and the third conductive element are integrally formed, or the second conductive element and the third conductive element are integrally formed, or both are integrally formed. This not only simplifies the manufacturing process of the antenna body but also improves the structural strength of the antenna body, thereby enhancing its impact resistance and performance stability.

[0021] In one possible implementation, the first conductive element and the third conductive element are separate structural components; or the second conductive element and the third conductive element are separate structural components; or the first conductive element and the third conductive element are both separate structural components. This provides another specific structure for the antenna body. This allows for greater flexibility in the design of the antenna body.

[0022] In one possible implementation, the electrical connector includes a first substrate and a signal line layer, with a first conductive element disposed on the surface of the first substrate facing away from the second conductive element; the signal line layer is disposed on the surface of the first substrate facing the second conductive element. Yet another specific structure of the antenna body is provided.

[0023] This is beneficial for further reducing the spacing between the first and second conductive elements, which not only facilitates the formation of parasitic capacitance between the first and second conductive elements, but also helps to reduce the size of the first branch.

[0024] In one possible implementation, the first conductive element includes a middle portion and an edge portion. The orthographic projection of the middle portion onto the second reference plane lies within the orthographic projection of the first substrate onto the second reference plane. The orthographic projection of the edge portion onto the second reference plane does not overlap with the orthographic projection of the first substrate onto the second reference plane. The edge portion is electrically connected to the second conductive element. The second reference plane is perpendicular to the arrangement direction of the first substrate and the first conductive element. This facilitates both electrical and physical connections between the first and second conductive elements, reduces the difficulty of connecting them, and results in a simple and ingenious design.

[0025] In one possible implementation, the third conductive element includes a first conductive portion, a second conductive portion, and a third conductive portion. The first conductive portion is disposed on the surface of the first substrate facing the second conductive element, and is located outside the signal line layer. A through-hole is provided on the first substrate, and the second conductive portion is disposed within the through-hole, with its two ends electrically connected to the first conductive element and the second conductive portion, respectively. The two ends of the third conductive portion are electrically connected to the second conductive portion and the second conductive element, respectively. Another method for electrically connecting the first and second conductive elements is also provided.

[0026] This expands the range of materials that can be selected for the first conductive element, making the design of the first conductive element more flexible and helping to reduce the thickness of the first conductive element, which in turn helps to reduce the superposition thickness of the first conductive element and the first sub-segment.

[0027] In one possible implementation, the first conductive element includes at least one of a metal sheet, conductive cloth, carbon fiber sheet, and metal plating. These materials have good conductivity and are readily available, ensuring the radiation performance of the antenna body.

[0028] In one possible implementation, the second subspace includes a second opening, with the first direction perpendicular to the thickness direction of the ground plane, and the orientation of the second opening is the same as that of the first opening. This allows the first and second subspaces to be manufactured in the same processing step, which helps reduce the manufacturing difficulty and efficiency of the antenna body, thereby reducing the manufacturing cost of the electronic device.

[0029] In one possible implementation, the second subspace includes a second opening, with a first direction parallel to the thickness direction of the ground plane. Both the first and second openings face the clearance area between the first stub and the ground plane. This allows both the first and second subspaces to be fabricated in the same step, reducing the fabrication difficulty and efficiency of the antenna body, and consequently lowering the manufacturing cost of the electronic device.

[0030] In one possible implementation, the second subspace is connected to the first subspace. The first segment includes a first sub-segment and a second sub-segment connected together. The first sub-segment is located within the first subspace, and the second sub-segment is located within the second subspace. The first branch includes a first end. The first subspace is located between the second branch and the first end. In the direction from the first branch to the ground plane, the second branch extends obliquely away from the first end.

[0031] This increases the angle between the second segment and the first segment, making the extension direction of the second segment deviate less from the extension direction of the first segment as the first segment extends from the first structural component (e.g., fingerprint recognition component) to the second structural component (circuit board). This reduces the bending angle of the first segment, effectively preventing breakage failure of the electrical connector and improving the reliability of the electrical connection between the first and second structural components.

[0032] In one possible implementation, the second branch includes a fourth conductive element and a fifth conductive element, the fifth conductive element being opposite to and spaced apart from the fourth conductive element; the first segment includes a second sub-segment located between the fourth and fifth conductive elements. A specific structure for the second branch is provided.

[0033] In one possible implementation, the second subspace includes a second opening formed between one end of the fourth conductive element and one end of the fifth conductive element. The second branch also includes a sixth conductive element, the two ends of which are electrically connected to the fourth and fifth conductive elements respectively, and are opposite to the second opening. This improves the structural strength of the second branch.

[0034] In one possible implementation, the second structural component includes a fingerprint recognition assembly. The antenna body has a mounting slot communicating with a receiving space, extending through the surface of the antenna body facing away from the ground plane. At least a portion of the fingerprint recognition assembly is disposed within the mounting slot. The fingerprint recognition assembly is stacked on one side surface of the first segment.

[0035] In this way, on the one hand, the external surface of the fingerprint recognition component can be exposed in the mounting slot, making it easier for the fingerprint recognition component to recognize fingerprints, or for the user to press the fingerprint recognition component to trigger the corresponding function of the electronic device; on the other hand, the electrical connector can also be assembled from the mounting slot into the receiving space, which can reduce the assembly difficulty of the electrical connector; furthermore, the part of the electrical connector that connects to the fingerprint recognition chip can be set in the receiving space, so that the fingerprint recognition chip is in a region with weak electric field strength, which is conducive to improving the isolation between the antenna body and the fingerprint recognition chip, thereby helping to improve the signal interference problem and RSE problem between the antenna body and the fingerprint recognition chip.

[0036] In one possible implementation, the second structural component is a camera module, which includes an image sensor stacked on one side surface of the first segment. The antenna body has a clearance opening, with the photosensitive surface of the image sensor facing the clearance opening. The image sensor is located within the receiving space. This allows the photosensitive surface of the image sensor to be exposed through the clearance opening, facilitating the image sensor's reception of external light and ensuring normal image capture by the camera module. Simultaneously, it places the image sensor in a region with a weak electric field, improving the isolation between the antenna body and the image sensor, thereby mitigating signal interference and reactive safety (RSE) issues between them.

[0037] In one possible implementation, the electronic device includes a frame surrounding a ground plane, with the antenna body formed on the frame. This allows the frame to be reused as the antenna body, saving space and cost associated with separately configuring the antenna body.

[0038] In one possible implementation, the electrical connector includes at least one of a flexible circuit board and a wire. A specific embodiment is provided.

[0039] In one possible implementation, the first structural component is a circuit board. A specific implementation method is provided. Attached Figure Description

[0040] Figure 1 is a schematic diagram of an electronic device provided in some embodiments of this application in an unfolded state;

[0041] Figure 2 is a schematic diagram of the electronic device shown in Figure 1 when it is in a folded state;

[0042] Figure 3 is a cross-sectional view of the electronic device shown in Figure 1 at line AA;

[0043] Figure 4 is a partial structural schematic diagram of an electronic device provided in some embodiments of this application;

[0044] Figure 5 is a cross-sectional view of the electronic device shown in Figure 4 at line BB;

[0045] Figure 6a is a simulation diagram of the electric field distribution around the antenna body in the electronic device shown in Figure 4.

[0046] Figure 6b is a simulation diagram of the current distribution around the antenna body in the electronic device shown in Figure 4.

[0047] Figure 6c is a simulation diagram of the coupling current distribution on the electrical connector in the electronic device shown in Figure 4.

[0048] Figure 7a is a partial structural schematic diagram of an electronic device provided in some other embodiments of this application;

[0049] Figure 7b is a schematic diagram of the antenna body, electrical connectors, clearance area and ground plane of the electronic device shown in Figure 7a on the first reference plane.

[0050] Figures 8a and 8b are simplified schematic diagrams of the antenna body and ground plane provided in some embodiments of this application;

[0051] Figure 8c is a graph showing the electric field intensity at multiple locations on the surface of the antenna body shown in Figure 8a as a function of frequency.

[0052] Figure 8d is a graph showing the electric field intensity at multiple locations within the accommodating space on the antenna body shown in Figure 8b as a function of frequency.

[0053] Figure 9a is a simulation diagram of the electric field distribution around the antenna body in the electronic device shown in Figure 7a;

[0054] Figure 9b is a simulation diagram of the current distribution around the antenna body in the electronic device shown in Figure 7a;

[0055] Figure 9c is a simulation diagram of the coupling current distribution on the electrical connector in the electronic device shown in Figure 7a;

[0056] Figure 10 is a simplified assembly diagram of the antenna body and electrical connector in the electronic device shown in Figure 7a;

[0057] Figure 11 is an enlarged view of region A in the electronic device shown in Figure 7a;

[0058] Figure 12 is a cross-sectional view of the electronic device shown in Figure 7a at the CC line;

[0059] Figure 13 is a cross-sectional view of the electronic device shown in Figure 7a at the DD line;

[0060] Figure 14 is a schematic diagram of the electronic device shown in Figure 13 from another angle;

[0061] Figure 15 is a cross-sectional view of the electronic device shown in Figure 7a at line EE;

[0062] Figure 16 is a graph showing the electric field intensity at different locations within the containment space of the electronic device shown in Figure 11 as a function of frequency.

[0063] Figure 17 is a partial exploded view of the electronic device shown in Figure 7a;

[0064] Figure 18 is a partial structural schematic diagram of an electronic device provided in some other embodiments of this application;

[0065] Figure 19 is a partial structural schematic diagram of an electronic device provided in some embodiments of this application;

[0066] Figure 20 is a cross-sectional view of the electronic device shown in Figure 19 at FF;

[0067] Figure 21 is a partial structural schematic diagram of an electronic device provided in some embodiments of this application;

[0068] Figure 22 is a cross-sectional view of the electronic device shown in Figure 21 at point GG;

[0069] Figure 23 is a top view of the first conductive component, the first sub-segment, and the second conductive component in the electronic device shown in Figure 18;

[0070] Figure 24 is a cross-sectional view of an electronic device provided in some other embodiments of this application;

[0071] Figure 25 is a partial structural schematic diagram of an electronic device provided in some embodiments of this application;

[0072] Figure 26 is a cross-sectional view of the electronic device shown in Figure 25 at line HH;

[0073] Figure 27 is a schematic diagram of the assembly of the antenna body and electrical connectors in the electronic device shown in Figure 25;

[0074] Figures 28a and 28b are comparison diagrams of the signal isolation between one end of the electrical connector connecting the circuit board and the antenna in different embodiments of this application as a function of frequency.

[0075] Figures 28c and 28d are comparison diagrams of the signal isolation between the end of the electrical connector connecting the fingerprint recognition component and the antenna in different embodiments of this application as a function of frequency.

[0076] Figure 29 is a comparison of the radiation efficiency of the antenna in different embodiments of this application as a function of frequency;

[0077] Figure 30 is a comparison of the system efficiency of the antenna in different embodiments of this application as a function of frequency;

[0078] Figure 31 is a partial schematic diagram of an electronic device provided in some embodiments of this application;

[0079] Figure 32 is a comparison of the signal isolation between one end of the electrical connector connecting the circuit board and the antenna in different embodiments of this application as a function of frequency;

[0080] Figures 33a and 33b are comparison diagrams showing the signal isolation between the end of the electrical connector connecting to the fingerprint recognition component and the antenna in different embodiments of this application as a function of frequency.

[0081] Reference numerals: Electronic device 100; Screen 10; First display portion 11; Second display portion 12; Third display portion 13; Housing assembly 20; Housing 21; Middle frame 211; Middle plate 2111; Frame 2112; Back cover 212; Receiving cavity Q1; Rotating mechanism 22; Circuit board 30; Battery 40; Antenna 50; Receiving space C1; First slot sidewall C101; Second slot sidewall C102; First subspace C11; First opening C111; Second subspace C12; Second opening C121; Clear area 501; First branch 51; First conductive element 511; Second conductive element 512; Third conductive element 513; First part 5131; Second part 5132; First conductive section 513a; Second conductive section 513b; Third conductive section 513c; Second branch 52; Fourth conductive element 521; Fifth conductive element 522; Sixth conductive element 523; Third branch 53; Through opening K1; Assembly slot C2; Clearance opening K3; Button module 60; Fingerprint recognition component 61; Fingerprint substrate 611; Fingerprint recognition chip 612; Packaging structure 613; Electrical connector 70; First segment 71; First sub-segment 711; First substrate 7111; Through hole K2; Signal line layer 7112; Second sub-segment 712; Second segment 72; Ground plane 80; Body part 81; Protrusion 82; Camera module 90; Image sensor 91. Detailed Implementation

[0082] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0083] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0084] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0085] In the description of the embodiments of this application, "and / or" is merely a way of describing the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this application generally indicates that the related objects before and after it are in an "or" relationship.

[0086] In the embodiments of this application, directional terms such as "top", "bottom", "inner", and "outer" may be defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms can be relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0087] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after the connection.

[0088] In the description of embodiments of this application, the terms "same orientation," "perpendicular," "parallel," and "equal" include the described situation and situations that are similar to the described situation, where the range of similarity is within an acceptable deviation range. For example, "same orientation" includes absolutely same orientation and approximately same orientation, wherein the acceptable deviation range for approximately same orientation can be a deviation within 10° relative to the absolute orientation. "Perpendicular" includes absolutely perpendicular and approximately perpendicular, wherein the acceptable deviation range for approximately perpendicular orientation can also be, for example, a deviation within 10°. "Parallel" includes absolutely parallel and approximately parallel, wherein the acceptable deviation range for approximately parallel orientation can be, for example, a deviation within 10°. "Equal" includes absolutely equal and approximately equal, wherein the acceptable deviation range for approximately equal is, for example, the difference between the two equals is less than or equal to 10% of either one.

[0089] To facilitate understanding, before providing a detailed description of the electronic devices in the embodiments of this application, the relevant terms involved in the embodiments of this application will be explained first.

[0090] Orthographic projection refers to projection where the projection ray is perpendicular to the projection plane. Specifically, the orthographic projection of a region onto the projection plane can be understood as the area enclosed by the orthographic projection of the region's outer contour onto the projection plane. The orthographic projection of a space onto the projection plane can be understood in the same way. For example, the orthographic projection of the "clearance area" onto the projection plane can be understood as the area enclosed by the orthographic projection of the clearance area's outer contour onto the projection plane.

[0091] Stacked configuration: This refers to the stacking of individual layers along the thickness direction of the layer structure. The individual layers in a stacked configuration can be in direct contact with each other, or other layers can be interspersed among them.

[0092] Near-field coupling refers to the exchange of energy or transmission of signals between two or more electromagnetic components through the near-field region between them (usually a distance less than a fraction of the wavelength).

[0093] Operating wavelength: refers to the wavelength at which the antenna primarily radiates or receives electromagnetic waves.

[0094] Isolation: refers to the ratio of the input power of one port to the output power of another port. It represents the ability of a signal to travel from one circuit or system to another, and is a parameter used to measure the degree of mutual interference between two circuits, devices, or systems.

[0095] Antenna system efficiency: refers to the ratio of the power radiated into space by the antenna (i.e. the power that is effectively converted into electromagnetic waves) to the input power of the antenna.

[0096] Antenna radiation efficiency: refers to the ratio of the power radiated into space by the antenna (i.e., the power effectively converted into electromagnetic waves) to the active power input to the antenna. The active power input to the antenna = antenna input power - antenna loss; antenna loss mainly includes ohmic loss of the metal and / or dielectric loss.

[0097] This application provides an electronic device with communication functions. The electronic device in this application provides an accommodating space on the antenna body, within which a portion of an electrical connector for electrically connecting a first structural component and a second structural component is housed. This ensures that the electrical connector completely avoids the antenna's clearance area. On one hand, this effectively reduces the coupling current between the antenna and the electrical connector, improving signal isolation and mitigating mutual interference. This, in turn, enhances the performance of the antenna and the first and second structural components, thus mitigating resistance to signal interference (RSE). On the other hand, it also reduces the space occupied by the electrical connector within the electronic device, optimizing its spatial layout and facilitating miniaturization.

[0098] The electronic devices in this application embodiment can be mobile phones, tablets, laptops, personal computers, in-vehicle devices, smart wearable devices (e.g., smartwatches, smart bracelets, smart glasses, smart helmets), virtual reality (VR) electronic devices, augmented reality (AR) electronic devices, etc. This application embodiment does not impose any special limitations on the specific form of the electronic devices.

[0099] The electronic device can be a foldable electronic device (such as a foldable screen phone) or a non-foldable electronic device (such as a candybar phone). The embodiments of this application use a foldable screen phone as an example for illustrative purposes, which should not be construed as a limitation on the embodiments of this application.

[0100] Please refer to Figure 1, which is a schematic diagram of an electronic device 100 provided in some embodiments of this application in an unfolded state. The electronic device 100 includes a screen 10 and a housing assembly 20.

[0101] It is understood that Figures 1 and 2, as well as the related figures below, only schematically show some of the components included in the electronic device 100, and the actual shape, size, location and construction of these components are not limited by Figures 1 and 2, as well as the figures below.

[0102] Screen 10 is used to display images, videos, and other information. In this embodiment, screen 10 is a flexible screen, capable of bending and deforming between a folded state and an unfolded state. Referring to Figure 1, screen 10 includes a first display portion 11, a second display portion 12, and a third display portion 13. The third display portion 13 is connected between the first display portion 11 and the second display portion 12. When screen 10 is in the unfolded state, it can achieve large-screen display, providing users with richer information and a better user experience.

[0103] In Figure 1, the first display portion 11, the second display portion 12, and the third display portion 13 are schematically divided by dashed lines. These dashed lines do not actually exist in the screen 10. The same interpretation applies to the dashed lines on other components mentioned later, and they will not be elaborated upon further.

[0104] Please refer to Figure 2, which is a structural schematic diagram of the electronic device 100 shown in Figure 1 in a folded state. The screen 10 of this electronic device 100 is also in a folded state. Specifically, when the screen 10 is folded, the first display portion 11 and the second display portion 12 of the screen 10 are opposite each other, and the third display portion 13 is bent. At this time, the third display portion 13 can be teardrop-shaped, U-shaped, etc. In this state, the electronic device 100 is smaller in size and easier to carry.

[0105] It is understood that in other embodiments, when the electronic device 100 is in a folded state, the third display portion 13 of the screen 10 can also be folded into other shapes, and this application embodiment does not limit this. Additionally, in the embodiment shown in FIG2, when the electronic device 100 is in a folded state, the housing assembly 20 protects the outside of the screen 10, and the screen 10 is not visible to the user. That is, the electronic device 100 is an inward-folding electronic device. In other embodiments, when the electronic device 100 is in a folded state, the screen 10 can also be located outside the housing assembly 20, and the screen 10 is visible to the user. That is, the electronic device 100 is an outward-folding electronic device.

[0106] The housing assembly 20 can be used to support the screen 10. Specifically, the screen 10 can be mounted on the housing assembly 20. Please refer to Figure 3, which is a cross-sectional view of the electronic device 100 shown in Figure 1 at line AA. The housing assembly 20 includes a pivot mechanism 22 and two housings 21. The two housings 21 can respectively support the first display portion 11 and the second display portion 12 of the screen 10. The pivot mechanism 22 is connected between the two housings 21 and can be used to support the third display portion 13 of the screen 10. The two housings 21 can rotate relative to each other through the pivot mechanism 22.

[0107] In this embodiment, the housing assembly 20 includes two housings 21, and the housing assembly 20 can be folded once. It is understood that in other embodiments, the housing assembly 20 may also include three, four, or more housings 21, and adjacent housings 21 can be connected by a pivot mechanism 22. Thus, the housing assembly 20 can be folded multiple times (two or more times).

[0108] The housing 21 is approximately rectangular flat. For ease of description in the following embodiments, an XYZ coordinate system is established for the housing 21. Specifically, the width direction of the housing 21 is defined as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. It is understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs and is not specifically limited here. Furthermore, in some other embodiments, the housing 21 may also be square flat, circular flat, elliptical flat, etc.

[0109] Referring to Figure 3, each housing 21 may include a middle frame 211 and a back cover 212, with a portion of the screen 10 supported on the middle frame 211. The back cover 212 is fixedly connected to the middle frame 211 and is located on the side of the middle frame 211 away from the screen 10. A receiving cavity Q1 for accommodating electronic devices may be formed between the middle frame 211 and the back cover 212.

[0110] In some embodiments, the material of the mid-frame 211 may include at least one of metal, plastic, glass, ceramic, and carbon fiber. The material of the back cover 212 may also include at least one of metal, plastic, glass, ceramic, and carbon fiber. It is understood that in some embodiments, when the electronic device 100 is an inward-folding electronic device, at least one back cover 212 may also include an additional screen. Thus, when the electronic device 100 is in the folded state, the additional screen can be used as an external screen for the electronic device 100.

[0111] Referring to Figure 3, the middle frame 211 may include a middle plate 2111 and a frame 2112. The middle plate 2111 may be located between the screen 10 and the back cover 212. Specifically, the middle plate 2111 and the back cover 212 are spaced apart in the Z-axis direction. The middle plate 2111 may be used to support electronic components such as the circuit board 30, the battery 40 (not shown in Figure 3), and the camera module (not shown in Figure 3).

[0112] In some embodiments, at least a portion of the middle plate 2111 is a conductive structural component. Specifically, a portion of the middle plate 2111 may be a conductive structural component, or the entire middle plate 2111 may be a conductive structural component. For example, the material of at least a portion of the middle plate 2111 may include at least one of aluminum, aluminum alloy, magnesium-aluminum alloy, stainless steel, copper, copper alloy, titanium alloy, magnesium alloy, and carbon fiber. This improves the structural strength of the middle plate 2111, ensuring its support stability and enhancing its impact and fracture resistance, thus meeting battery safety requirements and improving the safety performance of the electronic device 100. Furthermore, at least a portion of the middle plate 2111 can also be formed as a ground plane, providing a zero-potential reference for various electronic devices in the electronic device 100. That is, the middle plate 2111 can be used as a reference ground for the electronic device 100.

[0113] The frame 2112 can surround the outer periphery of the middle plate 2111. The frame 2112 can be annular, such as a rectangular ring. Alternatively, the frame 2112 can be non-annular. In this case, the frame 2112 can be provided only on one, two, or three edges of the middle plate 2111. Specifically, the edge of the middle plate 2111 can be fixedly connected to the inner surface of the frame 2112. In this embodiment, the "inner surface" refers to the surface of the component facing the interior of the housing 21. Correspondingly, the "outer surface" refers to the surface of the component facing the exterior of the housing 21.

[0114] In some embodiments, the frame 2112 and the middle plate 2111 can be formed as an integral structural component. This simplifies the processing of the housing 21 and improves the overall structural strength of the housing 21. Alternatively, in other embodiments, the frame 2112 and the middle plate 2111 can be separate components, in which case the frame 2112 and the middle plate 2111 can be fixed by means of bonding, welding, snap-fitting, screw connection, etc.

[0115] It should be noted that the "integrated structural component" described in this application embodiment can be a structural component formed in one piece. For example, the integrated structural component can be integrally formed using processes such as stamping, etching, casting, forging, computerized numerical control (CNC), and metal injection molding (MIM). Alternatively, the integrated structural component can also be a structural component formed using processes such as insert molding and liquid injection molding (LIM).

[0116] Referring to Figure 3, the electronic device 100 also includes a circuit board 30. The circuit board 30 can be a printed circuit board (PCB) or a flexible printed circuit board (FPC).

[0117] Circuit board 30 is used to carry electronic components (not shown in Figure 3). The electronic components include at least one of the following: processor (also known as chip), antenna module, Bluetooth module, WiFi module, GPS module, charging module or screen display and operation module, resistor, capacitor, inductor, potentiometer, vacuum tube, electromechanical component, connector, discrete semiconductor device, sensor, power supply, switch, micro motor, electronic transformer, relay, SIM card slot, and universal serial bus (USB) device.

[0118] The number of circuit boards 30 can be one or more. When there are multiple circuit boards 30, circuit boards 30 can be provided in each housing 21, or circuit boards 30 can be provided in only a part of the housing 21, and circuit boards 30 can be not provided in the other part of the housing 21.

[0119] Please refer to Figures 4 and 5. Figure 4 is a partial structural schematic diagram of an electronic device 100 provided in some embodiments of this application, and Figure 5 is a cross-sectional view of the electronic device 100 shown in Figure 4 at line BB. The electronic device 100 also includes a battery 40, an antenna, a button module 60, and an electrical connector 70.

[0120] The battery 40 provides power to the circuit board 30, screen 10, etc. The battery 40 can be fixed to the middle plate 2111. In some embodiments, referring to Figures 4-5, the middle plate 2111 has a battery compartment Q2, and the battery 40 is disposed within the battery compartment Q2. Exemplarily, the battery 40 can be fixedly connected to the battery compartment Q2 by adhesive, snap-fit, or other means.

[0121] Antennas are used to transmit and receive electromagnetic wave signals to achieve communication functions. Antennas include, but are not limited to, Global Navigation Satellite System (GNSS) antennas, Bluetooth (BT) antennas, cellular antennas, Wireless Local Area Network (WLAN) antennas, and Near Field Communication (NFC) antennas.

[0122] The types of signals transmitted by the antenna include at least one of the following: low-frequency signals (700MHz to 960MHz), medium-frequency signals (1710MHz to 2170MHz), and high-frequency signals (above 2300MHz).

[0123] Please refer to Figures 4-5. The antenna includes an antenna body 50, which includes the radiator that actually radiates or receives electromagnetic waves. To enable the antenna body 50 to transmit and receive signals, it is made of a conductive material. For example, the antenna body 50 may be made of metals such as copper, copper alloys, aluminum, aluminum alloys, titanium alloys, stainless steel, or magnesium alloys. Alternatively, it may also be made of materials such as carbon fiber, as long as the antenna body 50 is conductive. There may be one or more antenna bodies 50.

[0124] The antenna body 50 has a feed point and a ground point (also referred to as a return point or ground terminal). The feed point can be electrically connected to the RF chip. The RF chip can feed RF signals to the antenna body 50 or receive RF signals from the outside world received by the antenna body 50 through the feed point. For example, the RF chip can be disposed on the circuit board 30.

[0125] The grounding point is used to ground the antenna body 50. For example, the grounding point can be electrically connected to the middle plate 2111 so that the antenna body 50 can be coupled to a ground signal. This effectively improves the antenna's return current, helps reduce harmonic generation, and prevents harmonic variations, thereby effectively suppressing excessive radiated spurious emissions (RSE) and mitigating interference from the antenna signal to other devices.

[0126] It should be noted that the "point" in the feed point and ground point in the embodiments of this application should not be narrowly interpreted as necessarily being a single point. It can also be considered as a segment of the radiator on the antenna body 50 coupled to the feed circuit, ground circuit, or other circuits. In some embodiments, a "point" may include a coupling region on the antenna body 50 coupled to other conductive structures. For example, a feed point may be a connection region on the antenna body 50 that is electrically connected to a part of the feed circuit. The ground point can be understood similarly.

[0127] The button module 60 is used to trigger one or more functions of the electronic device 100. The number of button modules 60 can be one or more. In some embodiments, referring to FIG. 5, the button module 60 can be disposed on the bezel 2112 to form a side button. It is understood that in other embodiments, the button module 60 can also be disposed below the screen 10 to form an under-screen button, or the button module 60 can also be disposed on the back cover 212 to form a rear button.

[0128] For example, referring to Figure 5, a mounting groove C2 may be provided on the frame 2112, which penetrates the surface of the frame 2112 facing away from the middle plate 2111 (i.e., the outer surface of the frame 2112). At least a portion of the button module 60 is disposed within the mounting groove C2. In some embodiments, the mounting groove C2 may be formed on a segment of the multiplexed antenna body 50 in the frame 2112. That is, the mounting groove C2 is formed on the antenna body 50. This is beneficial for increasing the number of radiators, improving the coverage frequency range of the antenna body 50, and improving the structural compactness of the electronic device 100.

[0129] In some embodiments, the button module 60 is a fingerprint button. Referring to FIG5, the button module 60 includes a fingerprint recognition component 61, which can be used to collect and recognize fingerprints. The fingerprint recognition component 61 may include a fingerprint substrate 611, a fingerprint recognition chip 612, and a packaging structure 613. The fingerprint recognition chip 612 is disposed on one side surface of the fingerprint substrate 611, and the packaging structure 613 is disposed on the fingerprint substrate 611 and encapsulates the fingerprint recognition chip 612.

[0130] In other embodiments, the button module 60 may include a trigger lever in addition to the fingerprint recognition component 61. The trigger lever may be located on the side of the fingerprint substrate 611 facing away from the fingerprint recognition chip 612. In this case, the fingerprint recognition component 61 can be used not only for fingerprint recognition but also as a button cap. When the user presses the fingerprint recognition component 61, the trigger lever can move with the fingerprint recognition component 61 to trigger the corresponding function. In this way, the button module 60 can be formed as a two-in-one button.

[0131] Electrical connector 70 is used to establish an electrical connection between the first structural member and the second structural member, so as to enable the transmission of data and signals (e.g., radio frequency signals, non-radio frequency signals, etc.) between the two structural members. In some embodiments, electrical connector 70 is a flexible electrical connector. Exemplarily, the electrical connector includes at least one of a flexible circuit board and a wire.

[0132] In some embodiments, the first structural component may include a circuit board 30, and the second structural component may include at least one of a button module 60, a camera module, and a circuit board 30. When both the first and second structural components are circuit boards 30, one of them may be a mainboard, and the other may be a sub-board. When the second structural component is a button module 60 or a camera module, the sensor chip (sensor IC) of the second structural component is electrically connected to the electrical connector 70.

[0133] For example, the sensor chip of the button module 60 may include at least one of a fingerprint recognition chip 612, a Hall sensor, and a piezoelectric sensor. The sensor chip of the camera module may include at least one of an image sensor and an autofocus sensor.

[0134] For example, the electrical connector 70 and the circuit board 30 can be electrically connected via a board-to-board (BTB) connector, a zero insertion force (ZIF) connector terminal block, or other connection structures. The sensor chip and the electrical connector 70 can be electrically connected via soldering, conductive adhesive, or other methods.

[0135] With the development of technology, the functions of electronic devices 100 are becoming increasingly rich, and the number and types of internal structural components of electronic devices 100 are also increasing. At the same time, users' demand for thinner and lighter electronic devices 100 is becoming more and more urgent. Therefore, the internal structure of electronic devices 100 is becoming more and more compact. This makes the distance between the antenna body 50 and the electrical connector 70 closer, which makes it easy for strong near-field coupling to occur between the antenna and the electrical connector 70. This can lead to problems such as excessive radiation spurious emissions, antenna clutter, and antenna interference. Moreover, when the antenna is working, it can also generate electromagnetic interference to the sensor chips in the button module 60 and the camera module, resulting in fingerprint unlocking failure, poor image quality, and affecting the performance of the button module 60 and the camera module.

[0136] Please refer to Figures 6a-6c. Figure 6a is a simulation diagram of the electric field distribution around the antenna body 50 in the electronic device 100 shown in Figure 4. Figure 6b is a simulation diagram of the current distribution around the antenna body 50 in the electronic device 100 shown in Figure 4. Figure 6c is a simulation diagram of the coupling current distribution on the electrical connector 70 in the electronic device 100 shown in Figure 4.

[0137] As can be seen from Figures 6a and 6b, the electric field strength and current strength on the antenna body 50 and the electric field strength and current strength in the area surrounding the antenna body 50 are both relatively strong. As can be seen from Figure 6c, the coupling current on the electrical connector 70 is also relatively strong.

[0138] To reduce near-field coupling between the antenna and the electrical connector 70, electronic devices 100 in related technologies typically employ the following two solutions:

[0139] Option 1: Set a filter device at the BTB terminal on the circuit board 30 to filter noise, so as to prevent the electromagnetic wave signal of the antenna from entering the circuit board 30 with the electrical connector 70, thereby improving the interference of the antenna signal on the transmitted signal in the electrical connector 70.

[0140] However, setting the filtering devices on the circuit board 30 will occupy space on the circuit board 30. On the other hand, since the length of the electrical connectors 70 and the wiring type in the electrical connectors 70 may be different in different electronic devices 100, the filtering effect of the filtering devices on noise will vary, making the improvement effect of the above-mentioned near-field coupling very uncertain.

[0141] Option 2: An exposed copper area is provided on the electrical connector 70, and the exposed copper area is electrically connected to the middle board 2111 by conductive adhesive, so that the signal loaded on the electrical connector 70 by the antenna can return to ground, thereby improving the interference of the antenna signal to the transmitted signal in the electrical connector 70.

[0142] However, due to factors such as the location and area of ​​the exposed copper area, the distance between the grounding point on the middle board 2111 and the antenna may be too far, causing some coupled signals to still enter the circuit board 30, thus failing to solve the RSE problem. Furthermore, the application of conductive adhesive not only increases cost but also occupies internal space in the electronic device 100. In addition, the conductive adhesive itself has a passive intermodulation (PIM) problem, affecting antenna performance.

[0143] To reduce near-field coupling between the antenna and the electrical connector 70 and minimize signal interference, please refer to Figure 7a, which is a partial structural schematic diagram of an electronic device 100 provided in some other embodiments of this application. The electronic device 100 in this embodiment includes a ground plane 80, an antenna body 50, a circuit board 30, a button module 60, and an electrical connector 70. The circuit board 30 can be formed as the first structural component in this embodiment, and the button module 60 can be formed as the second structural component in this embodiment.

[0144] Ground plane 80 serves as a reference ground for electronic device 100. Ground plane 80 may be generally plate-shaped. The thickness direction of ground plane 80 may be parallel to the Z-axis direction. Circuit board 30 (i.e., the first structural component) may be located on one side of ground plane 80 in the thickness direction. Specifically, circuit board 30 and ground plane 80 are stacked in the Z-axis direction.

[0145] The antenna body 50 is located circumferentially outside the ground plane 80 and is electrically connected to the ground plane 80. In some embodiments, referring to FIG7a, at least a portion of the middle plate 2111 can be reused as the ground plane 80, serving as a reference ground for the electronic device 100. One or more slots can be provided on the frame 2112 to divide the frame 2112 into multiple antenna bodies 50. In this way, the frame 2112 can be reused as the antenna body 50, saving space and cost associated with additional antenna bodies 50.

[0146] It is understood that in other embodiments, the antenna body 50 may also be disposed on the back cover 212. This application does not limit the placement of the antenna body 50 in its embodiments.

[0147] Referring to Figure 7a, a portion of the antenna body 50 is spaced apart from the ground plane 80. For example, the radiators in the antenna body 50 may be spaced apart from the ground plane 80. This creates a clearance area 501 between the antenna body 50 and the ground plane 80, ensuring that the antenna body 50 can effectively transmit and receive signals.

[0148] In some embodiments, an insulating material component (not shown in FIG. 7a) is provided within the clearance area 501. The insulating material component is made of materials including but not limited to plastic, resin, etc. The antenna body 50 and the ground plane 80 can be connected as a whole through the insulating material component. This helps to ensure the structural continuity and integrity of the electronic device 100.

[0149] Please refer to Figure 7a. The antenna body 50 has a receiving space C1. The electrical connector 70 includes a first segment 71 and a second segment 72 connected together. The first segment 71 can be connected between the button module 60 (i.e., the second structural component) and the second segment 72. The second segment 72 can be connected between the first segment 71 and the circuit board 30 (i.e., the first structural component).

[0150] Specifically, the first segment 71 refers to the portion where the orthographic projection of the electrical connector 70 on the first reference plane overlaps with the orthographic projection of the antenna body 50 on the first reference plane. The first reference plane is perpendicular to the thickness direction of the ground plane 80.

[0151] The first segment 71 is disposed within the receiving space C1. The second segment 72 may be located outside the receiving space C1. Exemplarily, the orthographic projection of the second segment 72 on the first reference plane may lie within the orthographic projection of the ground plane 80 on the first reference plane. It is understood that in other embodiments, the electrical connector 70 may also include only the first segment 71, without including the second segment 72. In this case, the entire electrical connector 70 is located within the receiving space C1.

[0152] The orthographic projection of the electrical connector 70 on the first reference plane does not overlap with the orthographic projection of the clearance area 501 on the first reference plane. It can be understood that, since the accommodating space C1 is formed on the antenna body 50, the orthographic projection of the accommodating space C1 on the first reference plane also does not overlap with the orthographic projection of the clearance area 501 on the first reference plane.

[0153] Please refer to Figure 7a and Figure 7b. Figure 7b is a schematic diagram of the orthographic projection of the antenna body 50, electrical connector 70, clearance area 501 and ground plane 80 in the electronic device 100 shown in Figure 7a onto the first reference plane M.

[0154] The orthographic projection of the antenna body 50 onto the first reference plane M is the first projection P1, the orthographic projection of the electrical connector 70 onto the first reference plane M is the second projection P2, the orthographic projection of the ground plane 80 onto the first reference plane M is the third projection P3, and the orthographic projection of the clearance area 501 onto the first reference plane M is the fourth projection P4. For example, the fourth projection P4 may include the area enclosed by the dashed line in Figure 7b.

[0155] The second projection P2 includes a first sub-projection P21 and a second sub-projection P22. The first sub-projection P21 is the orthographic projection of the first segment 71 of the electrical connector 70 onto the first reference plane M, and the second sub-projection P22 is the orthographic projection of the second segment 72 of the electrical connector 70 onto the first reference plane M. The first sub-projection P21 is located within the first projection P1, and the second sub-projection P22 is located outside the first projection P1. For example, the second sub-projection P22 may be located within the third projection P3.

[0156] Please refer to Figures 8a and 8b, which are simplified schematic diagrams of the antenna body 50 and ground plane 80 provided in some embodiments of this application. The difference between the antenna body 50 in the embodiment shown in Figure 8a and the antenna body 50 in the embodiment shown in Figure 8b is that the antenna body 50 in Figure 8a does not have a receiving space C1, while the antenna body 50 in Figure 8b has a receiving space C1.

[0157] Please refer to Figures 8c and 8d. Figure 8c shows the electric field intensity at multiple locations on the surface of the antenna body 50 shown in Figure 8a as a function of frequency. Figure 8d shows the electric field intensity at multiple locations within the accommodating space C1 on the antenna body 50 shown in Figure 8b as a function of frequency. In Figures 8c and 8d, the horizontal axis x represents frequency in GHz, and the vertical axis y represents electric field intensity in dB (V / m). A single curve in Figures 8c and 8d represents the electric field intensity at a specific location as a function of frequency.

[0158] As shown in Figure 8c, in the scheme where no accommodating space C1 is created on the antenna body 50, the electric field strength of the antenna body 50 is greater than or equal to 50 dB. As shown in Figure 8d, after creating the accommodating space C1 on the antenna body 50, the electric field strength at different locations within the accommodating space C1 is less than -10 dB. Therefore, it can be concluded that the electric field strength within the accommodating space C1 on the antenna body 50 is relatively weak.

[0159] Please refer to Figures 9a-9c. Figure 9a is a simulation diagram of the electric field distribution around the antenna body 50 in the electronic device 100 shown in Figure 7a. Figure 9b is a simulation diagram of the current distribution around the antenna body 50 in the electronic device 100 shown in Figure 7a. Figure 9c is a simulation diagram of the coupling current distribution on the electrical connector 70 in the electronic device 100 shown in Figure 7a.

[0160] As can be seen from Figures 9a and 9b, the electric field and current intensities on the surface of the antenna body 50 and in the area surrounding the antenna body 50 are still relatively strong, while the electric field and current intensities within the accommodating space C1 are relatively weak. Furthermore, after the electrical connector 70 is placed in the accommodating space C1, the coupling current on the electrical connector 70 is also relatively weak.

[0161] The principle behind the relatively weak electric field strength within the containment space C1 will be explained below.

[0162] Please refer to Figure 10, which is a simplified assembly diagram of the antenna body 50 and electrical connector 70 in the electronic device 100 shown in Figure 7a. The accommodating space C1 includes opposing first slot sidewalls C101 and second slot sidewalls C102, with the first segment 71 located between the first slot sidewalls C101 and C102. Since the distance d1 between the first slot sidewalls C101 and C102 is less than the operating wavelength of the antenna body 50, a parasitic capacitance can be formed between the conductor including the first slot sidewall C101 and the conductor including the second slot sidewall C102.

[0163] In this way, the current on the antenna body 50 can be transmitted through the parasitic capacitance mentioned above. Especially at high frequencies, the distance d1 between the first slot sidewall C101 and the second slot sidewall C102 is much smaller than the operating wavelength of the antenna body 50. Therefore, the current will not enter the accommodating space C1 along the first slot sidewall C101 and the second slot sidewall C102, making the current intensity and electric field intensity in the accommodating space C1 very weak.

[0164] The coupling effect is positively correlated with the electric field strength: the greater the electric field strength, the stronger the coupling effect; the smaller the electric field strength, the weaker the coupling effect. Therefore, in the embodiment of this application, the electronic device 100, by placing the first segment 71 of the electrical connector 70 within the accommodating space C1, and ensuring that the electrical connector 70 avoids the clearance area 501 of the antenna body 50 in the path connecting the circuit board 30 and the button module 60, places the electrical connector 70 in a region with a weak electric field. On the one hand, this effectively reduces the coupling current between the antenna body 50 and the electrical connector 70, improves the signal isolation between the antenna body 50 and the electrical connector 70, thereby reducing the mutual interference between the antenna signal and the signal transmitted on the electrical connector 70, thus improving the performance of the antenna and the fingerprint recognition component 61, and mitigating the RSE problem. On the other hand, it eliminates the need to reserve additional space for the first segment 71 of the electrical connector 70 inside the electronic device 100, which helps to reduce the space occupied by the electrical connector 70 inside the electronic device 100, thereby optimizing the spatial layout of the electronic device 100 and facilitating the miniaturization design of the electronic device 100.

[0165] The specific structure of the antenna body 50 will be described in detail below.

[0166] In some embodiments, referring back to FIG7a, the antenna body 50 includes a first stub 51 and a second stub 52. The first stub 51 can serve as a radiator. The antenna body 50 has a first feed point D1, through which the first stub 51 can be electrically connected to an RF chip. Exemplarily, the first stub 51 is located outside the edge of the ground plane 80 and spaced apart from the ground plane 80. The first stub 51 can extend circumferentially along the ground plane 80.

[0167] For example, the first branch 51 and the grounding plate 80 can be arranged in the X-axis direction. Alternatively, the first branch 51 and the grounding plate 80 can also be arranged in the Y-axis direction. Furthermore, a portion of the first branch 51 and the grounding plate 80 can be arranged in the X-axis direction, while another portion of the first branch 51 and the grounding plate 80 are arranged in the Y-axis direction.

[0168] The second stub 52 can be used as a grounding structure. Specifically, the second stub 52 is electrically connected to the first stub 51 and the ground plane 80. Referring to Figure 7a, one end of the second stub 52 is electrically connected to the first stub 51, and the other end of the second stub 52 is electrically connected to the ground plane 80. The grounding point of the antenna body 50 is formed in the second stub 52. In this way, the antenna body 50 can be grounded through the second stub 52.

[0169] In some embodiments, the second stub 52 and the ground plane 80 can be integrally formed. This reduces the contact resistance between the second stub 52 and the ground plane 80, thereby reducing the grounding impedance of the antenna body 50, effectively improving the return current of the antenna body 50, and further effectively reducing the energy loss of the radiated antenna body 50, improving the radiation efficiency of the antenna body 50, and reducing the generation of harmonics, thus effectively suppressing RSE problems and reducing interference.

[0170] It is understood that in other embodiments, the second branch 52 and the ground plane 80 can also be connected by welding, screw connection, snap-fit, conductive adhesive bonding, etc. Alternatively, in yet another embodiment, the second branch 52 and the ground plane 80 can be indirectly electrically connected by other conductive media. For example, the second branch 52 can be electrically connected to the ground wire on the circuit board 30, and the ground wire on the circuit board 30 is electrically connected to the ground plane 80.

[0171] The connection method between the first branch 51 and the second branch 52 can be designed with reference to the connection method between the second branch 52 and the grounding plate 80, and will not be described in detail here.

[0172] In some embodiments, referring to FIG7a, the ground plane 80 includes a body portion 81 and a protrusion 82 connected to each other. The body portion 81 includes a first side surface 810 facing the first branch 51. The protrusion 82 is fixed to the first side surface 810 and protrudes from the first side surface 810. The second branch 52 is connected to the protrusion 82. This helps to reduce the length of the second branch 52, thereby shortening the return path of the antenna body 50 and further improving the return current of the antenna body 50.

[0173] Based on this, to improve the performance of the antenna body 50, please refer to Figure 7a. In the circumferential direction of the ground plane 80, the protrusion 82 and the first stub 51 are located on opposite sides of the second stub 52. Specifically, in the circumferential direction of the ground plane 80, the protrusion 82 is located on the side of the second stub 52 facing away from the first stub 51. That is, the protrusion 82 is located outside the clearance area 501 formed by the first stub 51 and the ground plane 80.

[0174] This increases the distance between the first branch 51 and the main body 81, thereby increasing the clearance size of the antenna body 50 without increasing the size of the electronic device 100, which is beneficial to improving the performance of the antenna body 50.

[0175] Please refer to section 7. In some embodiments, the antenna body 50 further includes a third stub 53, which is spaced apart from the ground plane 80. The third stub 53 can also serve as a radiator. The third stub 53 is connected to the first stub 51, and a second stub 52 is located between the first stub 51 and the third stub 53. The third stub 53 can also achieve an electrical connection with the ground plane 80 via the second stub 52, thereby grounding the second stub 52.

[0176] The antenna body 50 has a second feed point (not shown in the figure), and the third branch 53 can be electrically connected to the RF chip through the second feed point. In this way, by setting the first feed point D1 and the second feed point on the same antenna body 50, two antenna modes can be excited, which can increase the frequency covered by the antenna body 50 while reducing the space occupied by the antenna body 50.

[0177] In some embodiments, referring to FIG7a, the accommodating space C1 includes a first subspace C11 and a second subspace C12. The first subspace C11 is formed in the first branch 51, and the second subspace C12 is formed in the second branch 52. The first subspace C11 and the second subspace C12 are connected. That is, a portion of the accommodating space C1 is formed in the first branch 51, and a portion is formed in the second branch 52.

[0178] The first segment 71 of the electrical connector 70 includes a first sub-segment 711 and a second sub-segment 712 connected together. The first sub-segment 711 is accommodated in a first subspace C11, and the second sub-segment 712 is accommodated in a second subspace C12. It is understood that in other embodiments, the accommodating space C1 may also include only one of the first subspace C11 and the second subspace C12.

[0179] In some embodiments, referring to FIG7a, the first branch 51 includes a first end D2 remote from the second branch 52, and a first subspace C11 is located between the first end D2 and the second branch 52. Exemplarily, the first end D2 may be formed as an open end of the first branch 51.

[0180] Referring to Figure 7a, in the direction from the first branch 51 to the ground plane 80, the second branch 52 extends obliquely away from the first end D2. This helps to increase the angle between the second branch 52 and the first branch 51, for example, the second branch 52 and the first branch 51 can form an obtuse angle. This makes the angle of deviation of the extension direction of the second sub-segment 712 from the extension direction of the first sub-segment 711 smaller as the first segment 71 of the electrical connector 70 extends from the first structural member (e.g., fingerprint recognition component 61) to the second structural member (circuit board 30). This helps to reduce the bending angle of the first segment 71, thereby effectively preventing the electrical connector 70 from breaking and improving the reliability of the electrical connection between the first structural member and the second structural member.

[0181] The included angle between the first branch 51 and the second branch 52 can be the included angle between the first line segment formed by the line connecting the end of the second branch 52 to the first branch 51 and the end of the second branch 52 to the grounding plate 80, and the second line segment formed by the line connecting the end of the first branch 51 to the second branch 52 and the first end D2.

[0182] Please refer to Figure 11, which is an enlarged view of region A in the electronic device 100 shown in Figure 7a. The first branch 51 includes a first conductive element 511, a second conductive element 512, and a third conductive element 513. The first conductive element 511, the second conductive element 512, and the third conductive element 513 can form a first subspace C11.

[0183] Please refer to Figure 11 and Figure 12, which is a cross-sectional view of the electronic device 100 shown in Figure 7a at line CC. A first conductive element 511 and a second conductive element 512 are opposite to and spaced apart, with a first segment 711 located between the first conductive element 511 and the second conductive element 512. Specifically, the surface of the first conductive element 511 facing the second conductive element 512 forms part of a first groove sidewall C101, and the surface of the second conductive element 512 facing the first conductive element 511 forms part of a second groove sidewall C102.

[0184] The third conductive element 513 is electrically connected between the first conductive element 511 and the second conductive element 512. Specifically, the two ends of the third conductive element 513 are electrically connected to the first conductive element 511 and the second conductive element 512, respectively.

[0185] The material of the first conductive element 511 may include at least one of the following: metal sheet, metal plating, conductive adhesive, carbon fiber, and conductive cloth. The materials of the second conductive element 512 and the third conductive element 513 can be designed with reference to the first conductive element 511. In the same embodiment, the material of the first conductive element 511 may be the same as or different from the material of the second conductive element 512. Similarly, the material of the first conductive element 511 may be the same as or different from the material of the third conductive element 513.

[0186] Referring to Figure 11, in some embodiments, at least a portion of the first conductive member 511 and at least a portion of the second conductive member 512 are arranged in a first direction e1. For example, the first direction e1 may be perpendicular to the thickness direction of the ground plane 80, and the first conductive member 511 may be located on the side of the second conductive member 512 closest to the ground plane 80, with the first segment 711 located on the side of the first conductive member 511 facing away from the ground plane 80. For example, the first direction e1 may be parallel to the X-axis direction, or the first direction e1 may be parallel to the Y-axis direction. That is, the first direction e1 may be parallel to the width or length direction of the electronic device 100.

[0187] It is understood that in other embodiments, the first direction e1 may also be parallel to the thickness direction of the ground plane 80.

[0188] In some embodiments, both the first conductive element 511 and the second conductive element 512 are generally elongated plates. In this case, the entire first conductive element 511 and the entire second conductive element 512 are opposite to and spaced apart in the first direction e1. The thickness direction of the first conductive element 511 and the thickness direction of the second conductive element 512 can both be parallel to the first direction e1. The width direction of the first conductive element 511 and the width direction of the second conductive element 512 can both be parallel to the thickness direction of the ground plane 80 (e.g., the Z-axis direction in FIG11).

[0189] In this way, the first segment 711 can be limited by the first conductive element 511, preventing the first segment 711 from slipping out of the first subspace C11 into the clear area 501 of the antenna body 50. This helps to improve the positional stability of the electrical connector 70, thereby improving the performance stability of the antenna body 50 and the performance stability of the second structural component.

[0190] It is understood that in other embodiments, the first conductive element 511 and the second conductive element 512 may also be formed in an L-shape. In this case, a portion of the first conductive element 511 and a portion of the second conductive element 512 are arranged in a first direction e1, and the other portion of the first conductive element 511 and the other portion of the second conductive element 512 may be arranged in a third direction (e.g., the Y-axis direction in FIG11). The third direction is perpendicular to the first direction e1 and perpendicular to the thickness direction of the ground plane 80.

[0191] In some embodiments, referring to Figures 11-12, the first segment 711 is a flexible circuit board, and the thickness direction of the first segment 711 (e.g., the X-axis direction in Figure 11) is parallel to the first direction e1. This is beneficial for reducing the space occupied by the first segment 711 in the first direction e1, thereby reducing the spacing between the first conductive element 511 and the second conductive element 512. On the one hand, it is beneficial for reducing the size of the first branch 51 in the first direction e1, which can increase the clearance size of the antenna body 50 without increasing the size of the electronic device 100 in the first direction e1 (e.g., the length or width of the electronic device 100). On the other hand, it is beneficial for reducing the size of the electronic device 100 in the first direction e1 while ensuring the clearance size of the antenna body 50, which is beneficial for achieving miniaturization of the electronic device 100. Furthermore, it facilitates the formation of parasitic capacitance between the first conductive element 511 and the second conductive element 512, which can reduce the electric field strength inside the accommodating space C1.

[0192] To facilitate the assembly of the first segment 711 into the first subspace C11, please refer to Figures 11-12. The first subspace C11 has a first opening C111. For example, one end of the first subspace C11 is open in the second direction e2, forming the first opening C111. The second direction e2 is perpendicular to the first direction e1. Furthermore, the second direction e2 is also perpendicular to the length direction of the first segment 711.

[0193] Specifically, a first opening C111 is formed between one end of the first conductive member 511 in the second direction e2 and one end of the second conductive member 512 in the second direction e2. For example, in the embodiment shown in 11, the second direction e2 may be parallel to the thickness direction of the ground plane 80.

[0194] In some embodiments, referring to Figures 11 and 12, the third conductive element 513 includes a first portion 5131. The first portion 5131 is opposite to the first opening C111. Specifically, the first portion 5131 of the third conductive element 513 can be connected between the other end of the first conductive element 511 in the second direction e2 and the other end of the second conductive element 512 in the second direction e2. In this way, the third conductive element 513 can limit the first segment 711 in the second direction e2, which helps to further improve the positional stability of the first segment 711.

[0195] In some embodiments, the first portion 5131 may block one end of the first subspace C11 in the second direction e2. That is, one end of the first subspace C11 in the second direction e2 is open, and the other end is closed. For example, the first subspace C11 may be in the shape of a groove.

[0196] In this way, continuous electrical connection points can be formed between the first conductive element 511 and the second conductive element 512, such that the distance between two adjacent electrical connection points between the first conductive element 511 and the second conductive element 512 is less than or equal to one-quarter of the operating wavelength of the antenna body 50. This is beneficial to further improve the radiation performance of the antenna body 50, thereby improving the radiation efficiency of the antenna and the system efficiency.

[0197] In some embodiments, the first conductive element 511, the second conductive element 512, and the first portion 5131 form an integral structural line. This allows the first branch 51 to be formed as a single-piece molded part. For example, during processing, a solid first blank can be fabricated first, and then the first subspace C11 can be created on the first blank. This not only simplifies the fabrication process of the antenna body 50 but also improves the structural strength of the antenna body 50, thereby enhancing its impact resistance and performance stability.

[0198] It is understood that in other embodiments, one of the first conductive element 511 and the second conductive element 512 may be formed as an integral structural component with the first part 5131, and the other of the first conductive element 511 and the second conductive element 512 may be connected to the first part 5131 by means of welding, conductive adhesive bonding, snap-fitting, screw connection, etc.

[0199] Please refer to Figure 11 and Figure 13, where Figure 13 is a cross-sectional view of the electronic device 100 shown in Figure 7a at the DD line. The third conductive element 513 includes a second portion 5132, which is connected between the first conductive element 511 and the second conductive element 512. The second portion 5132 may enclose one end of the first subspace C11 in the circumferential direction of the ground plane 80. Specifically, the second portion 5132 may protrude from the surface of the first conductive element 511 facing the second conductive element 512, and in the circumferential direction of the ground plane 80, the second conductive element 512 and the first conductive element 511 may be located on the same side of the second portion 5132.

[0200] This helps to further increase the connection area between the first conductive element 511 and the second conductive element 512, thereby further improving the structural strength of the antenna body 50.

[0201] The connection method between the second part 5132 and the first conductive element 511, and the connection method between the second part 5132 and the second conductive element 512, can be designed with reference to the connection method between the first part 5131 and the first conductive element 511 in any embodiment of this application, and will not be repeated here. Furthermore, in the same embodiment, the way the second part 5132 connects to the first conductive element 511 can be the same as or different from the way the first part 5131 connects to the first conductive element 511. Similarly, in the same embodiment, the way the second part 5132 connects to the second conductive element 512 can be the same as or different from the way the first part 5131 connects to the second conductive element 512.

[0202] It is understood that in other embodiments, the third conductive element 513 may also include only one of the first part 5131 and the second part 5132, as long as the electrical connection between the first conductive element 511 and the second conductive element 512 can be achieved through the third conductive element 513.

[0203] In some embodiments, referring to Figures 12 and 13, the second segment 52 includes a fourth conductive element 521 and a fifth conductive element 522. The fourth conductive element 521 and the fifth conductive element 522 are disposed opposite to and spaced apart, and the second sub-segment 712 may be located between the fourth conductive element 521 and the fifth conductive element 522. The surface of the fourth conductive element 521 facing the fifth conductive element 522 forms part of the first groove sidewall C101, and the surface of the fifth conductive element 522 facing the fourth conductive element 521 forms part of the second groove sidewall C102. The thickness direction of the second sub-segment 712 may be parallel to the arrangement direction of the fourth conductive element 521 and the fifth conductive element 522.

[0204] A connection is formed between the end of the fourth conductive element 521 near the first branch 51 and the end of the fifth conductive element 522 near the first branch 51, and the first subspace C11 and the second subspace C12 are connected by this connection.

[0205] The material of the fourth conductive element 521 may include at least one of the following: metal sheet, metal plating, conductive adhesive, conductive cloth, and carbon fiber. The materials of the fifth conductive element 522 and the sixth conductive element 523 mentioned below can be designed with reference to the fourth conductive element 521, and will not be described in detail here.

[0206] In some embodiments, the fourth conductive element 521 and the fifth conductive element 522 are arranged circumferentially on the ground plane 80. This allows the fourth conductive element 521 and the fifth conductive element 522 to respectively limit the second segment 712 on both sides of the ground plane 80 in the circumferential direction, preventing the second segment 712 from slipping out of the second subspace C12 into the clear area 501 of the antenna body 50. This improves the positional stability of the electrical connector 70, thereby enhancing the stability of the antenna body 50's performance and the stability of the second structural component's performance.

[0207] Referring to Figures 12-13, the second subspace C12 includes a second opening C121, and the second segment 712 can be assembled into the second subspace C12 through the second opening C121. In some embodiments, one end of the second subspace C12 is open in the second direction e2, forming the second opening C121. The arrangement direction of the fourth conductive member 521 and the fifth conductive member 522 is perpendicular to the second direction e2, and the second direction e2 is perpendicular to the length direction of the second segment 712.

[0208] In some embodiments, referring to FIG13, the orientation of the second opening C121 is the same as that of the first opening C111. For example, both the second opening C121 and the first opening C111 face the same side in the Z-axis direction. This allows the first subspace C11 and the second subspace C12 to be manufactured in the same processing step, which helps reduce the manufacturing difficulty of the antenna body 50, improves the manufacturing efficiency of the antenna body 50, and consequently reduces the manufacturing cost of the electronic device 100.

[0209] Please refer to Figures 14 and 15. Figure 14 is a schematic diagram of the electronic device 100 shown in Figure 13 from another angle, and Figure 15 is a cross-sectional view of the electronic device 100 shown in Figure 7a at line EE. The second branch 52 also includes a sixth conductive element 523, which is electrically connected between the fourth conductive element 521 and the fifth conductive element 522. The sixth conductive element 523 is opposite to the second opening C121. For example, the sixth conductive element 523 is plate-shaped. The sixth conductive element 523 can seal one end of the second subspace C12. That is, one end of the second subspace C12 is open, and the other end is closed. This helps to improve the structural strength of the second branch 52.

[0210] In some embodiments, referring to FIG14, the sixth conductive element 523 may be connected to the first portion 5131. For example, the sixth conductive element 523 and the first portion 5131 may be integrally formed. In this way, on the one hand, the structure of the antenna body 50 can be further simplified and the structural strength of the antenna body 50 can be further improved; on the other hand, the connection area between the first branch 51 and the second branch 52 can be increased, which can further increase the return path of the antenna body 50, thereby helping to further improve the return current of the antenna body 50.

[0211] It is understood that in some embodiments, the sixth conductive element 523 and the first portion 5131 may also be connected by welding, bonding, snap-fitting, or other methods. Alternatively, in yet another embodiment, the first portion 5131 and the first conductive element 511 may not be connected. Alternatively, in yet another embodiment, the second branch 52 may not include the sixth conductive element 523.

[0212] In some embodiments, referring to Figures 14 and 15, both the fourth conductive element 521 and the fifth conductive element 522 are electrically connected to the ground plane 80. Based on this, the fourth conductive element 521 can be connected to the first conductive element 511, and the fifth conductive element 522 can be connected to the second conductive element 512. Exemplarily, the fourth conductive element 521 and the first conductive element 511 can be integrally formed, or the fourth conductive element 521 and the first conductive element 511 can also be connected by at least one of the following methods: welding, bonding, fastener connection, and snap-fit. The connection method between the fifth conductive element 522 and the second conductive element 512 can be designed with reference to the connection method between the fourth conductive element 521 and the first conductive element 511, and will not be described further here.

[0213] This approach not only improves the structural strength of the antenna body 50, but also increases the return path of the antenna body 50, thereby improving its return efficiency and effectively improving the return current of the antenna body 50.

[0214] To ensure the structural integrity and continuity of the electronic device 100, in some embodiments, after the electrical connector 70 is assembled into the receiving space C1, a first cover plate can be provided at the first opening C111 to seal the first opening C111, and a second cover plate can be provided at the second opening C121 to seal the second opening C121. The first and second cover plates can be conductive or insulating components. Alternatively, in other embodiments, after the electrical connector 70 is assembled into the receiving space C1, the receiving space C1 can be filled with materials such as plastic to seal the first opening C111 and the second opening C121.

[0215] Referring to Figures 14 and 15, the receiving space C1 has a through-hole K1 that communicates with the outside of the receiving space C1. The orthographic projection of the through-hole K1 on the first reference plane lies within the orthographic projection of the ground plane 80 on the first reference plane. In some embodiments, the orthographic projection of the through-hole K1 on the first reference plane lies within the orthographic projection of the protrusion 82 on the first reference plane.

[0216] Specifically, the through-hole K1 can be formed in the second branch 52. For example, the through-hole K1 can penetrate the end face of the second branch 52 away from the first branch 51, or the through-hole K1 can also penetrate one of the fourth conductive member 521, the fifth conductive member 522, and the sixth conductive member 523. The electrical connector 70 passes through the through-hole K1, and the second segment 72 of the electrical connector 70 is located outside the through-hole K1. That is, a portion of the electrical connector 70 can extend from the through-hole K1 to outside the receiving space C1.

[0217] In this way, the opening area of ​​the accommodating space C1 includes the grounding terminal of the antenna body 50. After the electrical connector 70 passes through the through-hole K1, it can extend along the surface of the ground plane 80 to the location of the circuit board 30, so that the electrical connector 70 can avoid the clearance area 501, thereby reducing the coupling current between the antenna body 50 and the electrical connector 70. Moreover, this structure is simple and easy to implement.

[0218] For example, referring to Figure 15, the body portion 81 of the ground plane 80 includes a base plate 811 and a side plate 812. The side plate 812 connects to the edge of the base plate 811 and protrudes from one side surface of the base plate 811. The side plate 812 and the base plate 811 form a battery compartment Q2. After the second segment 72 of the electrical connector 70 passes through the through-hole K1, it can extend across the end face of the side plate 812 away from the base plate 811, along one side surface of the side plate 812 and one side surface of the base plate 811 toward the circuit board 30.

[0219] Based on this, please refer to Figure 15. The base plate 811 is provided with a clearance groove C3, and a part of the second section 72 of the electrical connector 70 can be disposed in the clearance groove C3. This helps to reduce the superimposed thickness of the electrical connector 70, the ground plate 80 and the battery 40.

[0220] Of course, it is understood that in other embodiments, after the second segment 72 of the electrical connector 70 passes through the through-hole K1, it may also extend along the surface of the battery 40 facing away from the base plate 811 toward the circuit board 30.

[0221] In some embodiments, as shown in Figure 15, the protrusion 82 is provided with a recessed groove C4, which communicates with the through opening K1. A portion of the second segment 72 is located within the recessed groove C4. This reduces the combined thickness of the electrical connector 70 and the protrusion 82, thus reducing the overall thickness of the electronic device 100. Furthermore, the recessed groove C4 limits the position of the second segment 72, making the position of the electrical connector 70 more stable and ensuring a cleaner and more orderly overall extension path, thereby preventing interference between the electrical connector 70 and other components within the electronic device 100.

[0222] In some embodiments, referring to Figures 12 and 13, the dimension of the first segment 711 in the second direction e2 is less than or equal to the dimension of the first subspace C11 in the second direction e2. In this embodiment, the dimension of the first segment 711 in the second direction e2 is the width of the first segment 711, and the dimension of the first subspace C11 in the second direction e2 is the depth of the first subspace C11.

[0223] For example, the size of the first subspace C11 in the second direction e2 is greater than or equal to 2 mm, and the size of the first segment 711 in the second direction e2 is less than or equal to 2 mm. In this way, both ends of the first segment 711 in the second direction e2 can be located within the first subspace C11, which helps to further reduce the coupling current between the antenna body 50 and the first segment 711.

[0224] Please refer to Figures 13-15. The dimension of the second sub-segment 712 in the second direction e2 is smaller than the dimension of the second subspace C12 in the second direction e2. For example, in this embodiment, the dimension of the second sub-segment 712 in the second direction e2 is the width of the second sub-segment 712, and the dimension of the second subspace C12 in the second direction e2 is the depth of the second subspace C12.

[0225] Please refer to Figure 16, which is a graph showing the electric field intensity at different locations within the accommodating space C1 of the electronic device 100 shown in Figure 11 as a function of frequency. In Figure 16, the horizontal axis x represents frequency in GHz, and the vertical axis y represents electric field intensity in dB (V / m). Curves s11, s12, and s13 show the electric field intensity of the antenna body 50 at the first, second, and third positions, respectively, as a function of frequency. The first position is located at the first opening C111, while the second and third positions are both located within the accommodating space C1, with the second position being closer to the first opening C111 than the third position.

[0226] As can be seen from Figure 16, the electric field strength within the accommodating space C1 is significantly lower than that at the first opening C111, and the electric field strength decreases with increasing distance from the first opening C111 within the accommodating space C1. For example, when the signal frequency of the antenna body 50 is 3.1256 GHz, the electric field strength at the first position is approximately 75 dB, at the second position it is approximately 23 dB, and at the third position it is approximately -36 dB.

[0227] Therefore, by setting the size of the first sub-segment 711 in the second direction e2 to be smaller than the size of the first subspace C11 in the second direction e2, and setting the size of the second sub-segment 712 in the second direction e2 to be smaller than the size of the second subspace C12 in the second direction e2, it can be ensured that the electrical connector 70 is in a region with a weak electric field strength, which can effectively reduce the coupling current between the antenna body 50 and the electrical connector 70.

[0228] Please refer to Figure 17, which is a partial exploded view of the electronic device 100 shown in Figure 7a. The antenna body 50 has a mounting slot C2, which communicates with the accommodating space C1. At least a portion of the fingerprint recognition component 61 (i.e., the second structural member) is disposed within the mounting slot C2.

[0229] In some embodiments, the mounting groove C2 can be formed in the first branch 51, and the mounting groove C2 can penetrate the surface of the first branch 51 facing away from the ground plane 80. In this way, on the one hand, the outer surface of the fingerprint recognition component 61 can be exposed in the mounting groove C2, which facilitates the fingerprint recognition component 61 to recognize fingerprints, or facilitates the user to press the fingerprint recognition component 61 to trigger the corresponding function of the electronic device 100; on the other hand, the electrical connector 70 can also be assembled from the mounting groove C2 to the receiving space C1, which can reduce the assembly difficulty of the electrical connector 70; furthermore, the part of the electrical connector 70 that connects to the fingerprint recognition chip 612 can be disposed in the receiving space C1, so that the fingerprint recognition chip 612 is in a region with a weak electric field strength, which is beneficial to improving the isolation between the antenna body 50 and the fingerprint recognition chip 612, thereby helping to improve the signal interference problem and RSE problem between the antenna body 50 and the fingerprint recognition chip 612.

[0230] In other embodiments, please refer to FIG18, which is a partial structural schematic diagram of an electronic device 100 provided in other embodiments of this application. The electronic device 100 in this embodiment has a generally similar structure to the electronic device 100 shown in FIG7a, except that in this embodiment, the arrangement direction (i.e., the first direction e1) of the first conductive element 511 and the second conductive element 512 of the first branch 51 is parallel to the thickness direction of the ground plane 80, and the first opening C111 faces the ground plane 80.

[0231] Since the first segment 71 is blocked by the antenna body 50 from the perspective of Figure 18, the first segment 71 is indicated by a dashed line in Figure 18.

[0232] In this embodiment, the thickness direction of the first segment 711 can be perpendicular to the arrangement direction of the first conductive element 511 and the second conductive element 512. In other embodiments, the thickness direction of the first segment 711 can also be parallel to the arrangement direction of the first conductive element 511 and the second conductive element 512. In practical applications, the arrangement of the first segment 711 can be adjusted according to the actual situation.

[0233] Please refer to Figure 18. The arrangement direction of the fourth conductive element 521 and the fifth conductive element 522 in the second branch 52 is also parallel to the thickness direction of the ground plane 80. The second opening C121 faces the clearance area 501 between the first branch 51 and the ground plane 80. In this way, both the first opening C111 and the second opening C121 face the aforementioned clearance area 501, allowing the first subspace C11 and the second subspace C12 to be processed in the same step, which helps to reduce the processing difficulty of the accommodating space C1, thereby reducing processing costs.

[0234] Other structures of the electronic device 100 in the embodiments of this application can be designed with reference to the electronic device 100 in any embodiment of this application, and will not be described in detail here.

[0235] Furthermore, it is understood that the arrangement of the first conductive element 511 and the second conductive element 512 in this embodiment can be applied to the electronic device 100 in any embodiment of this application. Similarly, the arrangement of the fourth conductive element 521 and the fifth conductive element 522 in this embodiment can be applied to the electronic device 100 in any embodiment of this application. For example, in some embodiments, when the arrangement direction of the first conductive element 511 and the second conductive element 512 is parallel to the thickness direction of the ground plane 80, the fourth conductive element 521 and the fifth conductive element 522 can be arranged circumferentially on the ground plane 80. In this case, the second opening C121 can face one side in the Z-axis direction. As another example, when the arrangement direction of the fourth conductive element 521 and the fifth conductive element 522 is parallel to the thickness direction of the ground plane 80, the arrangement direction of the first conductive element 511 and the second conductive element 512 can also be perpendicular to the thickness direction of the ground plane 80.

[0236] In some other embodiments, please refer to FIG19, which is a partial structural schematic diagram of an electronic device 100 provided in some other embodiments of this application. The electronic device 100 in this embodiment has a generally similar structure to the electronic device 100 shown in FIG7a, except that in this embodiment, the first conductive element 511 and the third conductive element 513 of the antenna body 50 structure are two separate structural components. That is, the first conductive element 511 and the third conductive element 513 are respectively processed and formed, and then the first conductive element 511 and the third conductive element 513 are connected as one unit. For example, the first conductive element 511 and the third conductive element 513 can be welded together. Alternatively, the first conductive element 511 and the third conductive element 513 can also be connected by means of bonding, snap-fitting, fastener connection, etc.

[0237] Specifically, please refer to Figure 19. The third conductive element 513 may include a second part 5132, and one end of the first conductive element 511 in the length direction is fixedly connected to the second part 5132.

[0238] Please refer to Figure 20, which is a cross-sectional view of the electronic device 100 shown in Figure 19 at the FF direction. In this embodiment, the arrangement direction of the first conductive element 511 and the second conductive element 512 is perpendicular to the thickness direction of the ground plane 80. For example, the arrangement direction of the first conductive element 511 and the second conductive element 512 can be parallel to the X-axis direction. Furthermore, the first subspace C11 also includes a third opening C112, which is opposite to the first opening C111. In this case, the third conductive element 513 does not include the first portion 5131. This saves material on the first branch 51, reduces its weight, and facilitates a lightweight design of the electronic device 100.

[0239] Furthermore, referring to Figure 20, when the fourth conductive element 521 is fixedly connected to the first conductive element 511 and the fifth conductive element 522 is fixedly connected to the second conductive element 512, the second branch 52 may not include the sixth conductive element 523. This saves material on the second branch 52, reduces its weight, and facilitates a lightweight design of the electronic device 100.

[0240] In some embodiments, in order to simplify the structure and assembly steps of the antenna body 50, the first conductive element 511 and the fourth conductive element 521 can be connected as one unit first, and then the first conductive element 511 and the fourth conductive element 521 can be assembled as a whole.

[0241] Other structures of the electronic device 100 in this embodiment can be designed with reference to the electronic device 100 in any embodiment of this application, and will not be described again here. In addition, the connection method between the first conductive element 511 and the third conductive element 513 in this embodiment can be applied to the electronic device 100 in any embodiment of this application.

[0242] In some other embodiments, please refer to FIG21, which is a partial structural schematic diagram of an electronic device 100 provided in some other embodiments of this application. The electronic device 100 in this embodiment differs from the electronic device 100 in any of the above embodiments in that the first conductive member 511 is disposed on the side surface of the first sub-segment 711 facing away from the second conductive member 512. For example, the thickness direction of the first sub-segment 711 is parallel to the arrangement direction of the first conductive member 511 and the second conductive member 512 (that is, the first direction e1 in FIG21).

[0243] Specifically, please refer to Figure 22, which is a cross-sectional view of the electronic device 100 shown in Figure 21 at point GG. The first sub-segment 711 includes a first substrate 7111 and a signal line layer 7112. The first substrate 7111 can be a flexible substrate. The signal line layer 7112 is disposed on the surface of the first substrate 7111 facing the second conductive member 512, and the first conductive member 511 is disposed on the side surface of the first substrate 7111 facing away from the second conductive member 512. That is, the signal line layer 7112 and the first conductive member 511 are respectively disposed on two sides of the first substrate 7111 in the thickness direction.

[0244] In some embodiments, the first conductive element 511 can be conductive cloth or copper foil. Both conductive cloth and copper foil are easily bent and deformed and are not easily broken, effectively preventing the first conductive element 511 from restricting the extension path of the electrical connector 70, thereby reducing the difficulty of laying the electrical connector 70. Furthermore, both conductive cloth and copper foil have a certain structural strength. Using conductive cloth or copper foil as the first conductive element 511 allows it to not only serve as part of the first branch 51 but also as a reinforcing plate for the electrical connector 70, which helps improve the structural strength of the electrical connector 70.

[0245] In some embodiments, please refer to FIG22 and FIG23. FIG23 is a top view of the first conductive element 511, the first sub-segment 711, and the second conductive element 512 in the electronic device 100 shown in FIG18. The top view in FIG23 is a schematic diagram taken from the first conductive element 511 towards the second conductive element 512 along the arrangement direction of the first conductive element 511 and the second conductive element 512. Since the first sub-segment 711 in FIG22 is covered by the first conductive element 511, the first sub-segment 711 in FIG22 is indicated by a dashed line.

[0246] The first conductive element 511 includes a connected intermediate portion 5111 and an edge portion 5112, the edge portion 5112 being connected to at least one edge of the intermediate portion 5111. The orthographic projection of the first substrate 7111 on the second reference plane overlaps with the orthographic projection of the intermediate portion 5111 on the second reference plane, while the orthographic projection of the first substrate 7111 on the second reference plane does not overlap with the orthographic projection of the edge portion 5112 on the second reference plane. The edge portion 5112 is electrically connected to the second conductive element 512. The second reference plane is perpendicular to the arrangement direction of the first substrate 7111 and the first conductive element 511. A third conductive element 513 can be connected between the edge portion 5112 and the second conductive element 512. For example, the third conductive element 513 can be conductive adhesive.

[0247] This facilitates the electrical and physical connection between the first conductive element 511 and the second conductive element 512, reduces the difficulty of connecting the first conductive element 511 and the second conductive element 512, and has a simple structure and ingenious design.

[0248] In some embodiments, referring to FIG23, the orthographic projection of the first substrate 7111 on the second reference plane overlaps with the orthographic projection of the middle portion 5111 on the second reference plane. In this way, it can be ensured that the entire first segment 71 of the electrical connector 70 is located within the first subspace C11, which is beneficial to further reduce the coupling current between the antenna body 50 and the electrical connector 70.

[0249] The positional relationship between the fourth conductive element 521 and the second sub-segment 712, and the structure of the fourth conductive element 521, can be designed with reference to the positional relationship between the first conductive element 511 and the first sub-segment 711, and the structure of the first conductive element 511, respectively. For example, the fourth conductive element 521 can be disposed on the surface of the second sub-segment 712 facing away from the fifth conductive element 522. In some embodiments, the fourth conductive element 521 and the first conductive element 511 can be integrally formed. The structure is simple and assembly is convenient.

[0250] It is understood that the structure of the second branch 52 in this embodiment can also be designed with reference to the structure of the second branch 52 in any other embodiment of this application, and will not be described in detail here.

[0251] In some other embodiments, please refer to FIG24, which is a cross-sectional view of an electronic device 100 provided in some other embodiments of this application. The electronic device 100 in this embodiment differs from the electronic device 100 shown in FIG21 in that the third conductive element 513 in this embodiment includes a first conductive portion 513a, a second conductive portion 513b, and a third conductive portion 513c. The first conductive portion 513a is disposed on the surface of the first substrate 7111 facing the second conductive element 512. A through hole K2 is provided on the first substrate 7111, and the second conductive portion 513b is disposed within the through hole K2, with both ends of the second conductive portion 513b electrically connected to the first conductive element 511 and the first conductive portion 513a, respectively. Both ends of the third conductive portion 513c are electrically connected to the second conductive portion 513b and the second conductive element 512, respectively.

[0252] In this embodiment, the first conductive element 511 can be electrically connected to the second conductive element 512 through the middle portion 5111. In this case, the first conductive element 511 may or may not include the edge portion 5112. In this way, the material of the first conductive element 511 can be not only metal sheets such as copper foil, carbon fiber sheets, or conductive cloth, but also a metal plating, which expands the material selection range of the first conductive element 511, making the design of the first conductive element 511 more flexible, and is conducive to reducing the thickness of the first conductive element 511, thereby helping to reduce the superimposed thickness of the first conductive element 511 and the first sub-segment 711.

[0253] In some embodiments, the material of the metal plating may include at least one selected from copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and chromium (Cr). These materials have good electrical conductivity and are readily available, which helps to reduce the cost of electronic device 100.

[0254] Based on this, to avoid interference from the antenna to the signal line layer 7112, the first conductive part 513a is located outside the signal line layer 7112. In this way, the signal line layer 7112 can be located within the first subspace C11, thereby reducing the interference from the antenna to the signal line layer 7112.

[0255] In some embodiments, the second conductive portion 513b is a metal plating layer. In this case, the via K2 can be a metallized via. The second conductive portion 513b and the signal line layer 7112 can be formed in the same processing step, which helps to further reduce the processing difficulty of the electronic device 100.

[0256] It is understood that in other embodiments, the second conductive part 513b may also be a conductive structure such as a metal pillar.

[0257] In some embodiments, the third conductive part 513c can be conductive adhesive. The structure is simple and easy to assemble.

[0258] In some other embodiments, please refer to FIG25, which is a partial structural schematic diagram of an electronic device 100 provided in some other embodiments of this application. The electronic device 100 in this embodiment differs from the electronic devices 100 in the above embodiments in that the second structural component in this embodiment is a camera module 90. The camera module 90 can be a front-facing camera module or a rear-facing camera module. That is, the electrical connector 70 is used to realize the electrical connection between the camera module 90 and the circuit board 30.

[0259] Please refer to Figures 26 and 27. Figure 26 is a cross-sectional view of the electronic device 100 shown in Figure 25 at line HH, and Figure 27 is an assembly diagram of the antenna body 50 and electrical connector 70 in the electronic device 100 shown in Figure 25. The camera module 90 is not shown in either Figure 26 or Figure 27.

[0260] Specifically, in this embodiment, the accommodating space C1 is formed on the second branch 52. Specifically, the accommodating space C1 may only include the second subspace C12. Of course, in other embodiments, the accommodating space C1 may also include the first subspace C11 formed on the first branch 51.

[0261] In some embodiments, referring to FIG26 and in conjunction with FIG27, the second branch 52 includes a fourth conductive element 521, a fifth conductive element 522, a sixth conductive element 523, a seventh conductive element 524, and an eighth conductive element 525. It is understood that in other embodiments, the second branch 52 may not include at least one of the sixth conductive element 523, the seventh conductive element 524, and the eighth conductive element 525.

[0262] The fourth conductive element 521 and the fifth conductive element 522 are opposite to and spaced apart, and the first segment 71 of the electrical connector 70 is located between the fourth conductive element 521 and the fifth conductive element 522. For example, the electrical connector 70 is a flexible circuit board, and the thickness direction of the first segment 71 is parallel to the arrangement direction of the fourth conductive element 521 and the fifth conductive element 522.

[0263] Both the fourth conductive element 521 and the fifth conductive element 522 are connected to the first branch 51. For example, the arrangement direction of the fourth conductive element 521 and the fifth conductive element 522 is parallel to the thickness direction of the ground plane 80 (e.g., the Z-axis direction in FIG. 26). The thickness directions of both the fourth conductive element 521 and the fifth conductive element 522 can be parallel to the thickness direction of the ground plane 80.

[0264] The two ends of the sixth conductive element 523 are electrically connected to the fourth conductive element 521 and the fifth conductive element 522, respectively, and the seventh conductive element 524 is opposite to and spaced apart from the sixth conductive element 523. For example, the sixth conductive element 523 and the seventh conductive element 524 are arranged circumferentially on the ground plane 80. The sixth conductive element 523 and the seventh conductive element 524 can limit the position of the electrical connector 70 in the circumferential direction of the ground plane 80, which helps to improve the positional stability of the electrical connector 70.

[0265] It is understood that in other embodiments, the second branch 52 may also not include at least one of the sixth conductive element 523 and the seventh conductive element 524.

[0266] The eighth conductive element 525 is opposite to and spaced apart from the first branch 51, and at least one of the fourth conductive element 521 and the fifth conductive element 522 is electrically connected to the eighth conductive element 525. The eighth conductive element 525 is electrically connected to the ground plane 80. For example, the eighth conductive element 525 is electrically connected to the ground wire in the circuit board 30, and the ground wire in the circuit board 30 is electrically connected to the ground plane 80.

[0267] It is understood that in some embodiments, the eighth conductive element 525 may also be directly electrically connected to the ground plane 80. Alternatively, in yet another embodiment, at least one of the fourth conductive element 521 and the fifth conductive element 522 may be electrically connected to the ground plane 80. In this case, the second branch 52 may not include the eighth conductive element 525.

[0268] Please refer to Figures 26-27. The antenna body 50 is provided with a clearance opening K3. The camera module 90 includes an image sensor 91, and the photosensitive surface of the image sensor 91 is opposite to the clearance opening K3. For example, the clearance opening K3 can be formed on the fourth conductive element 521. The clearance opening K3 can face the screen 10, the back cover 212, or the frame 2112. In this way, the photosensitive surface of the image sensor 91 can be exposed through the clearance opening K3, which facilitates the image sensor 91 to receive external light, thereby ensuring the normal shooting of the camera module 90.

[0269] In some embodiments, in the stacking direction of the image sensor 91 and the electrical connector 70 (e.g., the Z-axis direction in FIG25), the stacked size of the image sensor 91 and the electrical connector 70 is less than or equal to the size of the accommodating space C1. This ensures that the image sensor 91 is entirely located within the accommodating space C1, which helps to avoid interference from antenna signals to the image sensor 91, thereby improving the shooting quality of the camera module 90.

[0270] The material and structure of the fourth conductive element 521 can be designed with reference to the material and structure of the fourth conductive element 521 in any embodiment of this application. The material and structure of the fifth conductive element 522, the sixth conductive element 523, the seventh conductive element 524, and the eighth conductive element 525 can be designed with reference to the material and structure of the fourth conductive element 521. Furthermore, the other structures of the electronic device 100 in this embodiment can be designed with reference to the electronic device 100 in any embodiment of this application, and will not be described in detail here.

[0271] To objectively evaluate the performance of the antenna of the electronic device 100 in the embodiments of this application, please refer to Figures 28a and 28b. Figures 28a and 28b are comparison diagrams of the signal isolation between the end of the electrical connector 70 connected to the circuit board 30 (i.e., the first structural component) and the antenna as a function of frequency in different embodiments of this application. In Figures 28a and 28b, the horizontal axis represents frequency in GHz; the vertical axis represents isolation in dB.

[0272] Specifically, the electrical connector 70 includes a first signal line and a second signal line. Curve s21 in Figure 28a represents the signal isolation between the first signal line connected to one end of the circuit board 30 (i.e., the BTB end) and the antenna in the electronic device 100 shown in Figure 7a, as a function of frequency. Curve s22 represents the signal isolation between the first signal line connected to the circuit board 30 and the antenna in the electronic device 100 shown in Figure 4, as a function of frequency.

[0273] Curve s23 in Figure 28b represents the signal isolation between one end of the second signal line connecting circuit board 30 and the antenna in the electronic device 100 shown in Figure 7a, as a function of frequency. Curve s24 represents the signal isolation between one end of the second signal line connecting circuit board 30 and the antenna in the electronic device 100 shown in Figure 4, as a function of frequency. The antenna body 50 in the electronic device 100 shown in Figure 7a has a receiving space C1, while the antenna body 50 in the electronic device 100 shown in Figure 4 does not have a receiving space C1.

[0274] Please refer to Figures 28a and 28b. At a frequency of around 1 GHz, in the electronic device 100 shown in Figure 7a, the signal isolation between the end of the electrical connector 70 connected to the circuit board 30 and the antenna is approximately -30 dB; in the electronic device 100 shown in Figure 4, the signal isolation between the end of the electrical connector 70 connected to the circuit board 30 and the antenna is approximately -16 dB.

[0275] Therefore, compared to the electronic device 100 in the embodiment shown in FIG4, the signal isolation between the end of the electrical connector 70 connecting the circuit board 30 and the antenna in the electronic device 100 in the embodiment shown in FIG7a can be improved by about 14dB.

[0276] Please refer to Figures 28c and 28d. Figures 28c and 28d are comparison diagrams showing the signal isolation between the end of the electrical connector 70 connected to the fingerprint recognition component 61 (i.e., the second structural component) and the antenna in different embodiments of this application as a function of frequency. In Figures 28a-28b, the horizontal axis represents frequency in GHz; the vertical axis represents isolation in dB.

[0277] Specifically, curve s31 in Figure 28c is the curve showing the signal isolation between the end of the first signal line connected to the fingerprint recognition component 61 and the antenna in the electronic device 100 shown in Figure 7a as a function of frequency, and curve s32 is the curve showing the signal isolation between the end of the first signal line connected to the fingerprint recognition component 61 and the antenna in the electronic device 100 shown in Figure 4 as a function of frequency.

[0278] Curve s41 in Figure 28d is the curve showing the signal isolation between the end of the second signal line connected to the fingerprint recognition component 61 and the antenna in the electronic device 100 shown in Figure 7a as a function of frequency. Curve s42 is the curve showing the signal isolation between the end of the second signal line connected to the fingerprint recognition component 61 and the antenna in the electronic device 100 shown in Figure 4 as a function of frequency.

[0279] Please refer to Figures 28c and 28d. At a frequency of around 1 GHz, in the electronic device 100 shown in Figure 7a, the signal isolation between the end of the electrical connector 70 connected to the fingerprint recognition component 61 and the antenna is approximately -31 dB to -33 dB; in the electronic device 100 shown in Figure 4, the signal isolation between the end of the electrical connector 70 connected to the fingerprint recognition component 61 and the antenna is approximately -23 dB to -24 dB.

[0280] Therefore, compared with the electronic device 100 in the embodiment shown in FIG4, the signal isolation between the end of the electrical connector 70 connected to the fingerprint recognition component 61 and the antenna in the electronic device 100 in the embodiment shown in FIG7a can be improved by 8dB to 10dB.

[0281] Please refer to Figure 29, which is a comparison graph of the radiation efficiency of the antenna in different embodiments of this application as a function of frequency. In Figure 29, the horizontal axis represents frequency in GHz; the vertical axis represents the radiation efficiency of the antenna in dB. Curve s51 in Figure 29 represents the radiation efficiency of the antenna in the electronic device 100 shown in Figure 7a as a function of frequency, and curve s52 in Figure 29 represents the radiation efficiency of the antenna in the electronic device 100 shown in Figure 4 as a function of frequency.

[0282] As can be seen from Figure 29, at a frequency around 1 GHz, the radiation efficiency of the antenna in the electronic device 100 shown in Figure 7a is approximately -4.2 dB, while the radiation efficiency of the antenna in the electronic device 100 shown in Figure 4 is approximately -8.7 dB. Therefore, compared to the electronic device 100 in the embodiment shown in Figure 4, the radiation efficiency of the antenna in the electronic device 100 in the embodiment shown in Figure 7a can be improved by approximately 4.5 dB.

[0283] Please refer to Figure 30, which is a comparison graph of the system efficiency of the antenna in different embodiments of this application as a function of frequency. In Figure 30, the horizontal axis represents frequency in GHz; the vertical axis represents the system efficiency of the antenna in dB. Curve s61 in Figure 30 is the curve of the system efficiency of the antenna in the electronic device 100 shown in Figure 7a as a function of frequency, and curve s62 in Figure 30 is the curve of the system efficiency of the antenna in the electronic device 100 shown in Figure 4 as a function of frequency.

[0284] As can be seen from Figure 30, at a frequency around 1 GHz, the system efficiency of the antenna in the electronic device 100 shown in Figure 7a is approximately -5.4 dB, and the radiation efficiency of the antenna in the electronic device 100 shown in Figure 4 is approximately -8.8 dB. Therefore, compared to the electronic device 100 in the embodiment shown in Figure 4, the system efficiency of the antenna in the electronic device 100 in the embodiment shown in Figure 7a can be improved by approximately 3.4 dB.

[0285] To verify the impact of the position of the through-hole K1 in the accommodating space C1 on the isolation, please refer to Figure 31, which is a partial schematic diagram of an electronic device 100 provided in some embodiments of this application. The electronic device 100 shown in Figure 31 differs from the electronic device 100 shown in Figure 7a in that, in the electronic device 100 shown in Figure 31, the orthographic projection of the through-hole K1 on the first reference plane is located outside the orthographic projection of the ground plane 80 on the first reference plane. That is, the grounding terminal of the antenna body 50 is located outside the accommodating space C1. After one end of the electrical connector 70 passes through the through-hole K1, it needs to extend through the clearance area 501 towards the ground plane 80, and then extend towards the location of the circuit board 80 to achieve electrical connection between the electrical connector 70 and the circuit board 30.

[0286] In the electronic device 100 shown in Figure 7a, the orthographic projection of the through-hole K1 on the first reference plane lies within the orthographic projection of the ground plane 80 on the first reference plane. That is, the grounding terminal of the antenna body 50 is located on the accommodating space C1.

[0287] Please refer to Figures 32-33b. Figure 32 is a comparison diagram of the signal isolation between the end of the electrical connector 70 connected to the circuit board 30 and the antenna in different embodiments of this application as a function of frequency. Figures 33a and 33b are comparison diagrams of the signal isolation between the end of the electrical connector 70 connected to the fingerprint recognition component 61 and the antenna in different embodiments of this application as a function of frequency. In Figures 32-33b, the horizontal axis represents frequency in GHz; the vertical axis represents isolation in dB.

[0288] Specifically, the electrical connector 70 includes a third signal line and a fourth signal line. Curve s71 in Figure 32 is the curve of signal isolation between one end of the third signal line connected to the circuit board 30 and the antenna in the electronic device 100 shown in Figure 7a as a function of frequency. Curve s72 is the curve of signal isolation between one end of the third signal line connected to the circuit board 30 and the antenna in the electronic device 100 shown in Figure 31 as a function of frequency.

[0289] Curve s81 in Figure 33a is the curve showing the signal isolation between the end of the third signal line connected to the fingerprint recognition component 61 and the antenna in the electronic device 100 shown in Figure 7a as a function of frequency. Curve s82 is the curve showing the signal isolation between the end of the third signal line connected to the fingerprint recognition component 61 and the antenna in the electronic device 100 shown in Figure 31 as a function of frequency.

[0290] Curve s83 in Figure 33b is the curve showing the signal isolation between the end of the fourth signal line connected to the fingerprint recognition component 61 and the antenna in the electronic device 100 shown in Figure 7a as a function of frequency. Curve s84 is the curve showing the signal isolation between the end of the fourth signal line connected to the fingerprint recognition component 61 and the antenna in the electronic device 100 shown in Figure 31 as a function of frequency.

[0291] Please refer to Figure 32. At a frequency of around 1 GHz, in the electronic device 100 shown in Figure 7a, the signal isolation between the end of the electrical connector 70 connected to the circuit board 30 and the antenna is approximately -62 dB; in the electronic device 100 shown in Figure 31, the signal isolation between the end of the electrical connector 70 connected to the circuit board 30 and the antenna is approximately -50 dB.

[0292] Please refer to Figures 33a and 33b. At a frequency of around 1 GHz, in the electronic device 100 shown in Figure 7a, the signal isolation between the end of the electrical connector 70 connected to the fingerprint recognition component 61 and the antenna is approximately -50 dB; in the electronic device 100 shown in Figure 31, the signal isolation between the end of the electrical connector 70 connected to the fingerprint recognition component 61 and the antenna is approximately -40 dB.

[0293] As can be seen from Figures 32 and 33a-33b, compared with the electronic device 100 in the embodiment shown in Figure 7a, the signal isolation between the end of the electrical connector 70 connected to the circuit board 30 and the antenna in the electronic device 100 in the embodiment shown in Figure 31 deteriorates by about 12dB, and the signal isolation between the end of the electrical connector 70 connected to the fingerprint recognition component 61 and the antenna deteriorates by about 10dB.

[0294] Therefore, making the orthographic projection of the through-hole K1 on the first reference plane lie within the orthographic projection of the ground plane 80 on the first reference plane, that is, the accommodating space C1 includes the antenna's return to ground, is beneficial to further improve signal isolation.

[0295] Based on the descriptions of the above embodiments, the electronic device 100 in the embodiments of this application can significantly reduce the coupling current between the antenna body 50 and the electrical connector 70, and can improve the signal isolation between the antenna body 50 and the electrical connector 70, thereby improving the performance of the antenna and improving the RSE problem.

[0296] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0297] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, include: Flooring; The antenna body is electrically connected to the ground plane, and there is a clearance area between the antenna body and the ground plane, and the antenna body has a receiving space; The first structural component, the second structural component, and the electrical connector are electrically connected to the second structural component via the electrical connector. The portion where the orthographic projection of the electrical connector on the first reference plane overlaps with the orthographic projection of the antenna body on the first reference plane is the first segment. The first segment is disposed within the accommodating space, and the orthographic projection of the electrical connector on the first reference plane does not overlap with the orthographic projection of the clearance area on the first reference plane; wherein, the first reference plane is perpendicular to the thickness direction of the ground plane.

2. The electronic device according to claim 1, characterized in that, The accommodating space has a through opening, and the electrical connector passes through the through opening; The orthographic projection of the through-hole onto the first reference plane lies within the orthographic projection of the grounding plate onto the first reference plane.

3. The electronic device according to claim 1 or 2, characterized in that, The antenna body includes a first branch and a second branch. The first branch is spaced apart from the ground plane, and the second branch is connected to the first branch and electrically connected to the ground plane.

4. The electronic device according to claim 3, characterized in that, The grounding plate includes a body portion and a protrusion portion connected to each other. The body portion includes a first side surface facing the first branch. The protrusion portion protrudes from the first side surface. The second branch portion is electrically connected to the protrusion portion.

5. The electronic device according to claim 3 or 4, characterized in that, The accommodating space includes: A first subspace, the first subspace being formed in the first branch; and / or The second subspace is formed in the second branch.

6. The electronic device according to claim 5, characterized in that, The first subspace includes a first opening, and the first branch includes a first conductive element and a second conductive element that are opposite to and spaced apart, with at least a portion of the first conductive element and at least a portion of the second conductive element arranged in a first direction. The first opening is formed between one end of the first conductive element in the second direction and one end of the second conductive element in the second direction, wherein the second direction is perpendicular to the first direction; Wherein, the first direction is perpendicular to the thickness direction of the ground plane; or, the first direction is parallel to the thickness direction of the ground plane.

7. The electronic device according to claim 6, characterized in that, The first segment includes a first sub-segment, which is located between the first conductive element and the second conductive element; The size of the first sub-segment in the second direction is less than or equal to the size of the first subspace in the second direction.

8. The electronic device according to claim 6 or 7, characterized in that, The first branch also includes: The third conductive element is electrically connected between the first conductive element and the second conductive element; The first conductive element, the second conductive element, and the third conductive element form the first subspace.

9. The electronic device according to claim 8, characterized in that, At least one of the first conductive element and the second conductive element is integrally formed with the third conductive element.

10. The electronic device according to claim 8, characterized in that, The first conductive element and the third conductive element are separate structural components; and / or the second conductive element and the third conductive element are separate structural components.

11. The electronic device according to claim 8, characterized in that, The electrical connector includes: A first substrate, wherein the first conductive element is disposed on the surface of the first substrate opposite to the second conductive element; A signal line layer is disposed on the surface of the first substrate facing the second conductive element.

12. The electronic device according to claim 11, characterized in that, The first conductive element includes a middle portion and an edge portion. The orthographic projection of the middle portion on the second reference plane is located within the orthographic projection of the first substrate on the second reference plane. The orthographic projection of the edge portion on the second reference plane does not overlap with the orthographic projection of the first substrate on the second reference plane. The edge portion is electrically connected to the second conductive element. The second reference plane is perpendicular to the arrangement direction of the first substrate and the first conductive element.

13. The electronic device according to claim 11 or 12, characterized in that, The third conductive element includes: A first conductive portion is disposed on the surface of the first substrate facing the second conductive element, and the first conductive portion is located outside the signal line layer; The second conductive part is disposed in the through hole on the first substrate, and the two ends of the second conductive part are electrically connected to the first conductive element and the second conductive part, respectively. The third conductive part has its two ends electrically connected to the second conductive part and the second conductive element, respectively.

14. The electronic device according to any one of claims 11-13, characterized in that, The first conductive element includes at least one of a metal sheet, a conductive cloth, a carbon fiber sheet, and a metal plating layer.

15. The electronic device according to any one of claims 6-14, characterized in that, The second subspace includes a second opening, the first direction being perpendicular to the thickness direction of the ground plane, and the orientation of the second opening being the same as the orientation of the first opening.

16. The electronic device according to any one of claims 6-14, characterized in that, The second subspace includes a second opening, the first direction being parallel to the thickness direction of the grounding plate, and both the first opening and the second opening facing the clearance area between the first branch and the grounding plate.

17. The electronic device according to any one of claims 5-16, characterized in that, The second subspace is connected to the first subspace. The first segment includes a first sub-segment and a second sub-segment that are connected. The first sub-segment is located within the first subspace, and the second sub-segment is located within the second subspace. The first branch includes a first end, the first subspace is located between the second branch and the first end, and the second branch extends obliquely away from the first end in a direction from the first branch to the ground plane.

18. The electronic device according to any one of claims 5-17, characterized in that, The second branch includes: Fourth conductive component; The fifth conductive element is disposed opposite to and spaced apart from the fourth conductive element; The first segment includes a second sub-segment located between the fourth conductive element and the fifth conductive element.

19. The electronic device according to claim 18, characterized in that, The second subspace includes a second opening, which is formed between one end of the fourth conductive element and one end of the fifth conductive element; The second branch also includes a sixth conductive element, the two ends of which are electrically connected to the fourth conductive element and the fifth conductive element, respectively, and are opposite to the second opening.

20. The electronic device according to any one of claims 1-19, characterized in that, The second structural component includes a button module. The antenna body has an assembly slot that communicates with the receiving space. The assembly slot extends through the surface of the antenna body facing away from the ground plane. At least a portion of the button module is disposed within the assembly slot.

21. The electronic device according to any one of claims 1-20, characterized in that, The antenna body is provided with a clearance opening, which is connected to the accommodating space; The second structural component includes a camera module, which includes an image sensor. The image sensor is stacked on one side surface of the first segment, and the photosensitive surface of the image sensor is opposite to the clearance opening.

22. The electronic device according to any one of claims 1-21, characterized in that, Includes a frame surrounding the ground plane, and the antenna body is formed on the frame.

23. The electronic device according to any one of claims 1-22, characterized in that, The electrical connector includes at least one of a flexible circuit board and a wire.

24. The electronic device according to any one of claims 1-23, characterized in that, The first structural component includes a circuit board.

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