Vapor chamber, electronic device, and temperature control method

Abstract

The present application discloses a vapor chamber, an electronic device, and a temperature control method. The vapor chamber comprises a first substrate, a second substrate, a capillary layer, and particles. The second substrate and the first substrate define an inner cavity, and the inner wall of the second substrate is provided with a groove. The capillary layer is disposed in the inner cavity and covers an opening of the groove. There are a plurality of particles and the particles are disposed in the groove. In the vapor chamber in the present application, providing the groove on the inner wall of the second substrate and providing the particles in the groove actually increase a specific surface area in the groove, such that in an initial phase in which a liquid-phase cooling medium is heated and boils, bubbles can form not only on the wall of the groove, but also on the surface of the particles, thereby increasing the number of bubble nucleation sites, increasing a boiling heat transfer coefficient, accelerating a vaporization speed from the liquid-phase cooling medium to a gas-phase cooling medium, improving a heat release capability and a response speed of the vapor chamber, and avoiding energy loss or even damage caused by instantaneous overheating of a heating element.

Description

Heat spreader, electronic equipment and temperature control methods Technical Field

[0001] This application relates to the technical field of heat spreaders, and more specifically, to a heat spreader, electronic equipment, and temperature control method. Background Technology

[0002] A vapor chamber is a heat dissipation device that uses capillary force to drive the gas-liquid phase change phenomenon to achieve cooling. It is widely used in electronic devices that require a thinner and lighter design.

[0003] Due to the diverse operating scenarios of electronic devices, the power consumption of electronic components is also uncertain. In particular, electronic components will heat up instantly when some high-power programs are started and during operation. Existing heat spreaders have a slow heat dissipation response and cannot guarantee rapid heat dissipation in such scenarios, which may cause electronic components to overheat, leading to malfunction or even damage. Summary of the Invention

[0004] The purpose of this application is to provide a heat spreader, electronic device and temperature control method. By setting a groove on the inner wall of the second substrate and setting particles in the groove, when the liquid cooling medium in the groove vaporizes, the presence of particles increases the number of bubble nucleation, thereby increasing the vaporization rate of the liquid cooling medium to the gas cooling medium in the groove, and thus improving the heat dissipation capacity of the heat spreader.

[0005] In one aspect, this application provides a heat spreader, including a first substrate, a second substrate, a capillary layer, and particles.

[0006] A second substrate and a first substrate enclose an inner cavity, and a groove is provided on the side of the second substrate facing the inner cavity. A capillary layer is disposed in the inner cavity and covers the opening of the groove. Multiple particles are disposed in the groove.

[0007] The vapor chamber in this application has a groove on the side of the second substrate facing the inner cavity, i.e., a groove is set in the inner wall of the second substrate, and particles are set in the groove. This actually increases the specific surface area in the groove. As a result, in the initial stage of the liquid cooling medium being heated and boiling, not only can bubbles be generated on the groove wall, but bubbles can also be generated on the surface of the particles, thereby increasing the number of bubble nucleation, thus improving the boiling heat transfer coefficient, thereby accelerating the vaporization rate of the liquid cooling medium to the gas cooling medium, improving the heat dissipation capacity and response speed of the vapor chamber, and avoiding instantaneous overheating of the heating element leading to failure or even damage.

[0008] In one possible design, the particles are movably disposed within the grooves.

[0009] The presence of particles not only increases the number of bubble nuclei, but also, because the particles are movably set in the grooves, the boiling liquid cooling medium drives the particles to rotate, vibrate laterally and longitudinally, making it easier for bubbles on the particle surface to fall off. Furthermore, as the particles are stirred in the grooves, it is also easier for bubbles formed on the groove walls to fall off, increasing the frequency of bubble fall. The combined effect of these two effects can significantly improve the boiling heat transfer coefficient, further enhancing the heat dissipation capacity and response speed of the heat spreader.

[0010] In one possible design, the particles and grooves satisfy the following relationship:

[0011] 2D > H > D;

[0012] Where D is the particle size and H is the depth of the groove.

[0013] The particles and the groove satisfy the above relationship, which allows the particles to be laid out in a single layer in the groove, avoiding the situation where the particles are piled up into two layers and become stuck. This gives the particles sufficient space to move in the groove, and when the liquid cooling medium boils, it can drive the particles to rotate, vibrate laterally and longitudinally.

[0014] In one possible design, a limiting structure is provided in the groove, which can restrict the range of movement of the particles in a first direction, which is parallel to the bottom wall of the groove.

[0015] The limiting structure can restrict the position of the particles. When the heat spreader is tilted, it can prevent all the particles from accumulating at the edge of the groove, thus ensuring the flexibility of the particles. It can also ensure that the particles can rotate and vibrate when the liquid cooling medium boils.

[0016] In one possible design, the limiting structure includes multiple limiting grooves arranged in an array, with each particle correspondingly positioned in one of the limiting grooves.

[0017] The limiting groove can be set on the bottom wall of the groove or in the capillary layer, both of which can limit the range of movement of particles in the first direction.

[0018] In one possible design, the bottom wall of the groove is provided with multiple intersecting first and second convex ridges, which together form multiple limiting grooves.

[0019] The bottom wall of the groove is provided with multiple intersecting first and second protrusions. This design not only encloses and forms a limiting groove, but also the first and second protrusions fixed on the bottom wall of the groove create a technical effect similar to "particles fixed in the groove". That is, the first and second protrusions can increase the number of bubble nucleation, thereby improving the boiling heat transfer coefficient and accelerating the vaporization rate of the liquid phase cooling medium to the gas phase cooling medium, thus improving the heat dissipation capacity of the heat spreader.

[0020] In one possible design, the area directly opposite the capillary layer and the groove is provided with multiple intersecting third and fourth convex ridges, which together form multiple limiting grooves.

[0021] In one possible design, the capillary layer, the third ridge, and the fourth ridge are integrally molded.

[0022] This design offers two technical advantages: First, it reduces assembly steps, as the third and fourth protruding ridges are directly formed during the manufacturing of the capillary layer, eliminating the need for separate assembly on the capillary layer. Second, since the third and fourth protruding ridges are made of the same material as the capillary layer, they also possess capillary force. This allows them to accelerate the flow of the cooled liquid cooling medium into the groove, speeding up the return flow of the liquid cooling medium and thus increasing the vaporization rate of the liquid cooling medium to the gaseous cooling medium within the groove, thereby further enhancing the heat dissipation capacity of the heat spreader.

[0023] In one possible design, there is a gap between the third and fourth convex ridges and the bottom wall of the groove.

[0024] This design has two technical advantages: First, it facilitates the assembly of the capillary layer with the second substrate, avoiding the third and fourth protruding ridges from hitting the bottom wall of the groove due to tolerance issues; second, the gap acts as a "communicating vessel," allowing the liquid cooling medium entering the groove to flow into each limiting groove, ensuring that the liquid cooling medium is evenly filled in the groove to guarantee the heat dissipation capacity of the heat spreader.

[0025] In one possible design, the limiting structure includes a first rod and a second rod. On a plane parallel to the bottom wall of the groove, multiple first rods and multiple second rods intersect and enclose each other to form multiple holes arranged in an array, with particles correspondingly disposed in the holes. There are gaps between the first rod and the second rod and the capillary layer, as well as gaps between the first rod and the bottom wall of the groove.

[0026] By restricting the movement range of the particles in the first direction using the first and second rods, it is possible to prevent all particles from accumulating at the edge of the groove when the heat spreader is tilted, thus ensuring the flexibility of the particles.

[0027] In one possible design, there are two limiting structures formed by the first rod and the second rod, and the two limiting structures are spaced apart in the thickness direction of the heat exchange plate.

[0028] In one possible design, the limiting structure includes multiple limiting posts arranged in an array, with every three or four limiting posts forming a constraint space, and the particles are arranged one-to-one in the constraint space.

[0029] Compared to convex ridges and mesh, the limiting posts do not have any physical structure to occupy the internal space of the groove. This ensures the amount of liquid cooling medium filling the groove, thus ensuring that the heat spreader has enough liquid cooling medium in the groove for vaporization and heat dissipation.

[0030] In one possible design, the limiting post is located on the bottom wall of the groove.

[0031] The limiting posts are set on the bottom wall of the groove. This design not only allows the limiting posts to restrict the movement range of the particles, but also increases the number of bubble nucleation in the groove, thereby improving the boiling heat transfer coefficient and accelerating the vaporization rate of the liquid phase cooling medium to the gas phase cooling medium, thus improving the heat dissipation capacity of the heat spreader.

[0032] In one possible design, the limiting post is positioned on the capillary layer in the area directly opposite the groove.

[0033] In one possible design, the capillary layer and the limiting post are integrally molded structures.

[0034] This design has two technical advantages: First, it reduces assembly steps, as the limiting column is formed directly during the manufacturing of the capillary layer, eliminating the need for separate assembly of the limiting column; second, the limiting column and the capillary layer are made of the same material, meaning the limiting column also has capillary force, which allows the limiting column to accelerate the flow of the cooled liquid phase cooling medium into the groove, speeding up the return flow rate of the liquid phase cooling medium and further enhancing the heat dissipation capacity of the heat spreader.

[0035] In one possible design, some of the limiting posts are integrally formed in the capillary layer, while the other part of the limiting posts are set on the bottom wall of the groove.

[0036] The limiting columns set in the capillary layer have capillary force, which accelerates the reflux speed of the liquid phase cooling medium; the limiting columns set in the bottom wall of the groove can increase the number of bubble nucleation, thereby improving the boiling heat transfer coefficient; in addition, the movable particles in the groove increase the bubble detachment frequency. With the superposition of the three effects, the heat dissipation capacity of the heat spreader can be greatly improved.

[0037] In one possible design, a protrusion is provided on the side of the second substrate facing away from the inner cavity, and at least a portion of the groove is recessed into the protrusion.

[0038] The second substrate has a protrusion on the side opposite to the inner cavity, that is, the outer wall of the second substrate has a protrusion. At least part of the groove is sunk into the protrusion. In this way, while ensuring the thickness of the groove wall, the thickness of the plate in other areas of the second substrate can be reduced, thereby preventing the overall thickness of the heat spreader from being too large, which is beneficial for the use of the heat spreader in scenarios where it is thinner and lighter.

[0039] In one possible design, the surface roughness of particle 40 is 0.005 mm to 0.01 mm.

[0040] Particles with porous or pitted surfaces are more prone to nucleation compared to particles with smooth surfaces. Furthermore, the porous or pitted surface increases the specific surface area of ​​the particles, allowing for the generation of more bubbles and further increasing the number of bubble nuclei.

[0041] In one possible design, the particles could be made of metal or polymer.

[0042] Secondly, this application also provides an electronic device, which includes a heating element and a heat spreader plate of any of the above. The heating element is disposed on the side of the second substrate facing away from the inner cavity, and at least a portion of the heating element is opposite to the groove in the thickness direction of the heat spreader plate.

[0043] The electronic device in this application includes a heat spreader. The heat spreader has grooves on the inner wall of a second substrate, and particles are disposed in the grooves. This effectively increases the specific surface area in the grooves. As a result, in the initial stage of the liquid cooling medium being heated and boiling, bubbles can be generated not only on the groove walls, but also on the surface of the particles. This increases the number of bubble nucleation, thereby improving the boiling heat transfer coefficient and accelerating the vaporization rate of the liquid cooling medium to the gas cooling medium. This improves the heat dissipation capacity and response speed of the heat spreader, and avoids the heating element from instantaneous overheating, which could lead to failure or even damage.

[0044] In one possible design, the electronic device also includes a vibration exciter, which is fixed relative to the heat spreader and is used to drive the second substrate to vibrate.

[0045] An external vibration exciter is used to assist in the shedding of air bubbles, thereby enhancing the heat dissipation capacity of the heat spreader.

[0046] In one possible design, the vibration exciter includes a vibration motor and / or a loudspeaker.

[0047] Using the existing vibration motors and / or speakers of electronic devices as vibration exciters can save manufacturing costs.

[0048] In one possible design, the electronic device also includes a processor and a temperature monitoring module, which are electrically connected in sequence to the processor and the vibration exciter. The temperature monitoring module is used to monitor the temperature of the heating element and send the temperature information to the processor. When the temperature is greater than a set threshold, the processor controls the vibration exciter to vibrate.

[0049] By working together with a temperature monitoring module and a processor, the temperature of the heating element can be monitored in real time. The vibration excitation device can be automatically activated to drive the first and second substrates to vibrate, so as to provide a rapid thermal response and rapid deheating for the heating element.

[0050] In one possible design, the heat-generating element includes the processor.

[0051] In one possible design, the vibration exciter includes a first speaker and a second speaker, with the first speaker located at the bottom of the electronic device and the second speaker located at the top of the electronic device, and the second speaker being positioned closer to the groove of the second substrate than the first speaker.

[0052] When an electronic device is running a program such as a video call, the first speaker plays the call content normally and radiates sound waves outward, while the second speaker can emit audio at 5Hz-20Hz or 20KHz-40KHz. Furthermore, the sound waves radiated by the second speaker are more likely to cover the grooves of the second substrate. This not only does not affect the phone call, but also makes it easier for the plate and particles in the grooves to vibrate, thereby accelerating the shedding of bubbles and improving the heat dissipation capacity of the heat spreader.

[0053] Thirdly, this application also provides a temperature control method applied to an electronic device. The electronic device includes a heating element, a vibration excitation element, and any one of the aforementioned heat spreaders. The heating element is disposed on the side of the second substrate facing away from the inner cavity, and at least a portion of the heating element is opposite to the groove in the thickness direction of the heat spreader. The vibration excitation element is fixedly disposed relative to the heat spreader. The temperature control method includes:

[0054] When the temperature of the heating element is determined to be greater than a set threshold, the vibration exciter is controlled to vibrate.

[0055] The temperature of the heating element can be monitored in real time, and the vibration exciter can be automatically controlled to drive the first and second substrates to vibrate, so as to provide rapid thermal response and rapid deheating for the heating element.

[0056] In one possible design, the vibration exciter includes a first speaker and a second speaker, and the temperature control method includes:

[0057] When the temperature of the heating element is determined to be greater than the set threshold, and the first speaker plays audio in the range of 20Hz-20KHz, the second speaker is controlled to play audio in the range of 5Hz-20Hz or 20KHz-40KHz, or;

[0058] When the temperature of the heating element is determined to be greater than the set threshold and the first speaker is not working, the first speaker and / or the second speaker are controlled to play audio at 5Hz-20Hz or 20KHz-40KHz.

[0059] When the processor is running programs such as video calls, the first speaker plays the call content normally and radiates sound waves outward, while the processor controls the second speaker to play audio at 5Hz-20Hz or 20KHz-40KHz to drive the second substrate to vibrate. This does not affect the phone call and makes it easier for the plate and particles in the groove to vibrate, thereby accelerating the release of air bubbles and improving the heat dissipation capability of the heat-generating plate for the heat-generating components. When the phone is in silent mode and the processor is running high-power programs such as shooting games, the processor controls the first speaker and / or the second speaker to play audio at 5Hz-20Hz or 20KHz-40KHz to drive the second substrate to vibrate. This does not startle the user with sudden sound and also makes the plate and particles in the groove vibrate, thereby accelerating the release of air bubbles and improving the heat dissipation capability of the heat dissipation plate for the processor. Attached Figure Description

[0060] Figure 1 is a front view of the mobile phone provided in an embodiment of this application;

[0061] Figure 2 is a schematic diagram of the back of the mobile phone provided in an embodiment of this application;

[0062] Figure 3 is an exploded view of the mobile phone in Figure 2;

[0063] Figure 4 is a schematic diagram of the heat spreader provided in an embodiment of this application;

[0064] Figure 5 is a schematic diagram of the heat spreader in Figure 4 from another perspective;

[0065] Figure 6 is an exploded view of the heat spreader in Figure 4;

[0066] Figure 7 is a cross-sectional view of an example of AA in Figure 4;

[0067] Figure 8 is an enlarged view of point B in Figure 7;

[0068] Figure 9 is a cross-sectional view of another example of AA in Figure 4;

[0069] Figure 10 is an enlarged view of point C in Figure 9;

[0070] Figure 11 is a schematic diagram of the heat spreader in Figure 10 when it absorbs heat.

[0071] Figure 12 is a cross-sectional view of another example of AA in Figure 4;

[0072] Figure 13 is an enlarged view of point D in Figure 12;

[0073] Figure 14 is a schematic diagram of the temperature distribution plate being tilted when there is no limiting structure;

[0074] Figure 15 is a schematic diagram of an example of a capillary layer provided in an embodiment of this application;

[0075] Figure 16 is an enlarged view of point E in Figure 15;

[0076] Figure 17 is a cross-sectional view of an example of the capillary layer and the second substrate at the groove;

[0077] Figure 18 is a schematic diagram of the temperature distribution plate being tilted when there is a limit structure;

[0078] Figure 19 is an enlarged view of point F in Figure 17;

[0079] Figure 20 is a schematic diagram of an example of the second substrate provided in an embodiment of this application;

[0080] Figure 21 is an enlarged view of point G in Figure 20;

[0081] Figure 22 is a cross-sectional view of another example of the capillary layer and the second substrate at the groove;

[0082] Figure 23 is a schematic diagram of the first and second rods provided in an embodiment of this application;

[0083] Figure 24 is a cross-sectional view of another example of the capillary layer and the second substrate at the groove;

[0084] Figure 25 is a cross-sectional view of another example of the capillary layer and the second substrate at the groove;

[0085] Figure 26 is a schematic diagram of another example of the capillary layer provided in the embodiments of this application;

[0086] Figure 27 is an enlarged view of point H in Figure 26;

[0087] Figure 28 is a cross-sectional view of another example of the capillary layer and the second substrate at the groove;

[0088] Figure 29 is a schematic diagram of another example of the second substrate provided in the embodiments of this application;

[0089] Figure 30 is an enlarged view of point I in Figure 29;

[0090] Figure 31 is a cross-sectional view of another example of the capillary layer and the second substrate at the groove;

[0091] Figure 32 is a cross-sectional view of another example of the capillary layer and the second substrate at the groove;

[0092] Figure 33 is a schematic diagram of an example of a heat spreader provided in this application in a mobile phone;

[0093] Figure 34 is a schematic diagram of the second substrate in Figure 33 vibrating;

[0094] Figure 35 is a schematic diagram of the second substrate under vibration, according to another embodiment of this application.

[0095] Figure 36 is a schematic diagram of another example of the heat spreader provided in this application embodiment in a mobile phone;

[0096] Figure 37 is a schematic diagram of another example of the heat spreader provided in this application embodiment in a mobile phone;

[0097] Figure 38 is a simulation diagram of the liquid cooling medium in the groove during vaporization;

[0098] Figure 39 is a heat flux density curve of the heat spreader.

[0099] Figure 40 is a bar chart of the total heat absorption of the heat exchanger;

[0100] Figure 41 is a temperature curve of the processor as it is deheated by the vapor chamber.

[0101] Figure 42 is a temperature curve of the processor when running a high-power program;

[0102] Figure 43 is a sound pressure level distribution diagram when the speaker radiates sound waves into the inside of the mobile phone.

[0103] Reference numerals: 10, First substrate; 20, Second substrate; 21, Groove; 22, First protrusion; 23, Second protrusion; 24, Protrusion; 30, Capillary layer; 31, Third protrusion; 32, Fourth protrusion; 33, Gap; 40, Particle; 50, Limiting structure; 51, Limiting groove; 521, Hole; 522, First rod; 523, Second rod; 53, Limiting post; 60, Bubble; 100, Heat spreader; 101, Inner cavity; 200, Housing; 201, Middle frame; 202, Back cover; 300, Screen; 400, Motherboard; 500, Processor; 501, Temperature monitoring module; 502, Thermal adhesive; 600, Vibration motor; 700, Speaker; 701, First speaker; 702, Second speaker; 800, RF front-end module. Detailed Implementation

[0104] The following are exemplary descriptions of relevant content that may be involved in the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0105] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0106] In the description of this application, it should be understood that the terms "upper", "lower", "side", "inner", "outer", "top", "bottom", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0107] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or part as an example in the figure. It should be understood that the reference numerals are also applicable to other identical parts or parts.

[0108] In the description of this application, it should be noted that the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0109] Electronic devices generate heat during operation, causing a rapid rise in internal temperature. This is directly due to the power consumption of electronic components. Every electronic component consumes power to varying degrees, and the intensity of heat generation varies with the power consumption. If this heat is not dissipated promptly, the electronic components will continue to heat up, eventually leading to overheating and failure. This, in turn, reduces the functional stability of the electronic device, or even causes complete malfunction. Furthermore, as electronic devices become increasingly miniaturized, thinner, and higher-performance, the integration of electronic components is also increasing, along with power consumption. Therefore, how to quickly and effectively dissipate the heat generated by electronic components is a key issue that needs to be addressed in the development of miniaturized, thinner, and higher-performance electronic devices.

[0110] Heat pipes and vapor chambers are heat dissipation devices that utilize capillary action to drive a gas-liquid phase change phenomenon to achieve cooling. They are widely used in electronic devices that require a slimmer and lighter design. A vapor chamber is a sealed cavity with a capillary layer on its inner wall and filled with a cooling medium. The working principle of a vapor chamber includes four main processes: conduction, evaporation, convection, and condensation. Specifically, taking water as the cooling medium, heat enters the chamber from the outside via heat conduction. Water near the heat source absorbs heat and rapidly evaporates, carrying away a large amount of heat. When the vapor diffuses from the high-pressure area to the low-pressure area, it quickly condenses into a liquid state upon contact with the cooler inner wall, releasing heat energy. The condensed water returns to the heat source through the capillary action of the capillary layer, thus completing one heat conduction cycle. The vapor chamber continuously repeats this process to remove heat from the heat source, achieving cyclic heat dissipation.

[0111] Due to the diverse operating scenarios of electronic devices, the power consumption of electronic components is also uncertain. In particular, electronic components will heat up instantly when some high-power programs are started and during operation. Existing heat spreaders have a slow heat dissipation response and cannot guarantee rapid heat dissipation in such scenarios, which may cause electronic components to overheat, leading to malfunction or even damage.

[0112] In view of this, in order to solve the above-mentioned technical problems, this application provides a heat spreader, an electronic device and a temperature control method. By setting a groove on the inner wall of the second substrate and setting particles in the groove, when the liquid phase cooling medium in the groove vaporizes, the presence of particles increases the number of bubble nucleation, thereby increasing the vaporization rate of the liquid phase cooling medium to the gas phase cooling medium in the groove, and thus improving the heat dissipation capacity of the heat spreader.

[0113] This application first provides an electronic device, which may also be referred to as a mobile device, terminal device, mobile terminal, or terminal. This electronic device includes, but is not limited to, handheld devices, in-vehicle devices, wearable devices, computing devices, or other processing devices connected to a wireless modem. For example, the electronic device may include smartwatches, smart bracelets, mobile phones, personal digital assistant computers, tablet computers, laptops, in-vehicle computers, smart glasses, handheld game consoles, and may also be other electronic devices with heat dissipation plates that require improved heat dissipation.

[0114] Figure 1 is a front view of the mobile phone provided in an embodiment of this application. Figure 2 is a back view of the mobile phone provided in an embodiment of this application. As shown in Figures 1 and 2, to more conveniently illustrate the electronic device provided in the embodiments of this application, and as an example rather than a limitation, the technical solution of this application will be described in detail below using a mobile phone as an example. Meanwhile, for the convenience of the description of the embodiments below, an XYZ coordinate system is established for the mobile phone. Specifically, the extension direction of the short side of the mobile phone is defined as the X direction, the extension direction of the long side of the mobile phone is defined as the Y direction, and the thickness direction of the mobile phone is defined as the Z direction, and the X, Y, and Z directions are mutually perpendicular.

[0115] Figure 3 is an exploded view of the mobile phone in Figure 2. As shown in Figure 3, the mobile phone provided in this embodiment includes a screen 300 and a housing 200. The housing 200 includes a mid-frame 201 and a back cover 202 (or battery cover). The mid-frame 201 includes a mid plate and a frame surrounding the mid plate. The screen 300 and the back cover 202 can be attached to the frame by snap-fitting, adhesive, or other means. A sealing ring can be provided between the screen 300 and the frame, and between the back cover 202 and the frame, to improve the sealing and waterproofing effect at the joints of the screen 300 and the frame, and the back cover 202 and the frame.

[0116] The screen 300, the mid-frame 201, and the back cover 202 together define the accommodating space of the mobile phone, which is used to install various functional components of the mobile phone, such as the heat spreader 100, vibration motor 600, speaker 700, motherboard 400, processor 500, and other functional components mentioned in the embodiments below.

[0117] In addition, the mobile phone may also include: a universal serial bus (USB) interface, a charging management module, a power management module, a battery, a microphone, a mobile communication module, a wireless communication module, an audio module, a camera module, a headphone jack, a sensor module, buttons, and a subscriber identification module (SIM) card interface, among other functional components. These functional components can be modified according to user needs. It is understood that the specific embodiments described above are merely one specific implementation of this application, and other methods that can implement the solution of this application are also within the scope of protection of this application, and will not be elaborated upon here.

[0118] Among the functional components described above, the electronic components that generate significant heat include the RF front-end module 800, the processor 500, and the battery. The RF front-end module 800 is a crucial component of the mobile phone's wireless communication module, forming a series of components between the RF transceiver and the antenna. The RF front-end module 800 mainly includes power amplifiers, antenna switches, filters, duplexers, and low-noise amplifiers, and generates considerable heat during power amplification. The processor 500 can be one of the following: System-on-Chips (SoC), Central Processing Unit (CPU), Graphics Processing Unit (GPU), Digital Signal Processor (DSP), Application Processor (AP), Baseband Processor (BP), or an integrated combination of multiple chips. The processor 500 consumes significant power when handling multiple tasks, and also consumes considerable power and generates significant heat when running games and video calls. The battery generates significant heat during charging, especially during fast charging. The RF front-end module 800, processor 500, and battery can all use the heat spreader 100 described in this application.

[0119] Of course, besides heat-generating components such as the RF front-end module 800, processor 500, and battery, other electronic components that generate significant heat can also utilize the heat spreader 100 described in this application. For example, a camera module typically includes a lens assembly and a photosensitive chip. The lens assembly can be composed of multiple spherical or aspherical lenses, possessing optical properties. The photosensitive chip receives the light emitted from the lens assembly. Photosensitive chips include, but are not limited to, complementary metal-oxide-semiconductor (CMOS) image sensors or charge-coupled device (CCD) image sensors. The light signal of the subject formed by the lens assembly is reflected to the photosensitive chip, which converts the corresponding light signal into an image signal. This process involves significant power consumption and heat generation; therefore, the heat spreader 100 described in this application can be used for heat dissipation.

[0120] The vapor chamber 100 provided in this application is described in detail below with reference to the accompanying drawings. Figure 4 is a schematic diagram of the vapor chamber 100 provided in an embodiment of this application, Figure 5 is a schematic diagram of the vapor chamber 100 in Figure 4 from another perspective, and Figure 6 is an exploded view of the vapor chamber 100 in Figure 4. As shown in Figures 4-6, the vapor chamber 100 provided in an embodiment of this application includes a first substrate 10, a second substrate 20, a capillary layer 30, and particles 40. The second substrate 20 and the first substrate 10 enclose an inner cavity 101, and a cooling medium (not shown in the figure) is disposed in the inner cavity 101. The capillary layer 30 is disposed in the inner cavity 101 and is used to provide capillary force for the return flow of the liquid phase cooling medium.

[0121] It should be noted that, in another embodiment provided in this application, in order to improve the structural strength of the heat spreader 100, a plurality of support pillars are provided between the first substrate 10 and the second substrate 20. In another embodiment provided in this application, the capillary layer 30 can be fixedly disposed not only on the second substrate 20, but also on the first substrate 10, so that the entire inner wall of the heat spreader 100 is covered with the capillary layer 30.

[0122] Referring again to Figure 6, a groove 21 is provided on the side of the second substrate 20 facing the inner cavity 101, that is, a groove 21 is provided on the inner wall of the second substrate 20. The capillary layer 30 covers the opening of the groove 21, and multiple particles 40 are disposed in the groove 21. There are two ways in which the particles 40 are disposed in the groove 21: the particles 40 can be fixedly disposed in the groove 21, or the particles 40 can be movably disposed in the groove 21. These two embodiments will be described in detail below.

[0123] Figure 7 is a cross-sectional view of an example of AA in Figure 4, and Figure 8 is an enlarged view of point B in Figure 7. As shown in Figures 7 and 8, in one embodiment provided in this application, particles 40 are fixedly disposed on the bottom wall of the groove 21. When the heat spreader 100 of this embodiment is applied to a mobile phone, taking the processor 500 on the motherboard 400 as an example, the processor 500 is disposed on the outer wall of the second substrate 20 and in the area corresponding to the groove 21. When the processor 500 is working and generating heat, the heat of the processor 500 is conducted through the plate body of the second substrate 20 to the liquid phase cooling medium in the groove 21, causing the liquid phase cooling medium to vaporize. During the vaporization process, the presence of particles 40 increases the number of bubble nucleation, thereby accelerating the vaporization rate of the liquid phase cooling medium to the gas phase cooling medium, thereby improving the heat dissipation capacity of the heat spreader 100 and preventing the processor 500 from overheating and causing failure or even damage.

[0124] The following text will explain in detail the underlying principles to understand the above technical effects.

[0125] First, it's important to understand that boiling heat transfer of the cooling medium is one of the core processes in a refrigeration cycle system. This process is commonly used in evaporators and condensers in the chemical and energy industries. The basic process of boiling heat transfer involves the cooling medium generating bubbles during heating. When these bubbles burst, latent heat is released, thus achieving heat transfer. Latent heat, short for latent heat of phase change, refers to the heat absorbed or released by a substance when it changes from one phase to another under isothermal and isobaric conditions.

[0126] The boiling heat transfer coefficient is an important parameter related to boiling heat transfer. It measures the efficiency of heat exchange between the cooling medium and the wall surface in a boiling state. Simply put, it is the amount of heat transferred per unit time per unit heat exchange area when the cooling medium changes from a liquid to a gaseous state. According to relevant research theories, the formula for calculating the boiling heat transfer coefficient is as follows: h = 2(πk l ρ l c pl ) 0.5 Nad 2 f 0.5

[0127] Where, k l ρ is the thermal conductivity of the cooling medium. l c is the density of the cooling medium. pl Where is the specific heat capacity of the cooling medium, Na is the number of bubble nucleation sites, d is the bubble detachment diameter, and f is the bubble detachment frequency.

[0128] The formula for calculating the boiling heat transfer coefficient h described above is not only used in the design of evaporators and condensers in the chemical and energy fields, but also in the design of temperature distribution plates 100 for electronic devices such as mobile phones. According to the formula, the boiling heat transfer coefficient h is directly proportional to the number of bubble nucleation sites, Na.

[0129] Before understanding the amount of Na in bubble nucleation, it's necessary to understand a concept—nucleation, also known as the formation of nuclei. Nucleation refers to the initial stage of a substance transforming from one phase to another, and it is widely observed in physics, chemistry, materials science, and other fields. Nucleation can occur in various situations, such as water molecules aggregating to form ice, bubbles forming in liquids, and crystals precipitating from solutions.

[0130] Based on the above concepts, in the application scenario of the heat spreader 100, nucleation phenomenon means that the liquid cooling medium generates bubbles in the initial stage of boiling, and the number of bubble nucleation Na means the number of bubbles generated by the liquid cooling medium in the initial stage of boiling.

[0131] The fixed placement of particles 40 in the groove 21 effectively increases the specific surface area in the groove 21. As a result, in the initial stage of the boiling of the liquid phase cooling medium, bubbles can be generated not only on the walls of the groove 21, but also on the surface of the particles 40. This increases the number of bubble nucleation Na, thereby improving the boiling heat transfer coefficient h, which in turn accelerates the vaporization rate of the liquid phase cooling medium to the gas phase cooling medium and enhances the heat dissipation capacity of the heat spreader 100.

[0132] Figure 9 is a cross-sectional view of another example of AA in Figure 4, and Figure 10 is an enlarged view of point C in Figure 9. As shown in Figures 9-10, in one embodiment provided in this application, the particles 40 are movably disposed in the groove 21. When the heat spreader 100 of this embodiment is applied to a mobile phone, taking the processor 500 as an example, the processor 500 is disposed on the outer wall of the second substrate 20 and in the area corresponding to the groove 21. When the processor 500 is working and generating heat, the heat of the processor 500 is conducted through the plate body of the second substrate 20 to the liquid phase cooling medium in the groove 21, causing the liquid phase cooling medium to vaporize. During the vaporization process, the presence of the particles 40 increases the number of bubble nucleation, and the movable disposal of the particles 40 in the groove 21 increases the frequency of bubble shedding. The combined effect of these two effects further enhances the heat dissipation capability of the heat spreader 100.

[0133] To understand the aforementioned technical effects, let's return to the calculation formula for the boiling heat transfer coefficient h. According to this formula, the boiling heat transfer coefficient h is not only proportional to the number of bubble nucleation sites Na, but also to the bubble detachment frequency f. When the particles 40 are movably placed in the groove 21, not only is the number of bubble nucleation sites Na increased, but the liquid cooling medium also drives the particles 40 to move during boiling. Figure 11 is a schematic diagram of the heat spreader 100 in Figure 10 during heat absorption. As shown in Figure 11, the boiling liquid cooling medium drives the particles 40 to rotate, vibrate laterally, and vibrate longitudinally, making it easier for bubbles on the surface of the particles 40 to detach. Furthermore, as the particles 40 are stirred within the groove 21, bubbles formed on the walls of the groove 21 also detach more easily, thereby increasing the bubble detachment frequency f in the liquid cooling medium. Therefore, increasing both the number of bubble nucleation Na and the bubble detachment frequency f can significantly improve the boiling heat transfer coefficient h, thereby further accelerating the vaporization rate of the liquid phase cooling medium to the gas phase cooling medium and further improving the heat dissipation capacity of the heat spreader 100.

[0134] In another embodiment provided in this application, a portion of the particles 40 can be fixedly disposed on the sidewall of the groove 21, while another portion of the particles 40 can be movably disposed in the groove 21.

[0135] As shown in Figure 10, in one embodiment provided in this application, the particles 40 and the grooves 21 satisfy the following relationship: 2D > H > D. Wherein, D is the particle size of the particles 40, and H is the depth of the grooves 21.

[0136] For example, when the particle size D of particle 40 is 0.01 mm, the depth H of groove 21 is in the range of 0.02 mm > H > 0.01 mm; when the particle size D of particle 40 is 0.015 mm, the depth H of groove 21 is in the range of 0.03 mm > H > 0.015 mm.

[0137] In this embodiment, the particles 40 and the groove 21 satisfy the above relationship, which can make the particles 40 spread out in a single layer in the groove 21, avoiding the situation where the particles 40 are piled up into two layers and become stuck. This allows the particles 40 to have sufficient space to move in the groove 21, and can drive the particles 40 to rotate, vibrate laterally and longitudinally when the liquid cooling medium boils.

[0138] Figure 12 is a cross-sectional view of another example of AA in Figure 4, and Figure 13 is an enlarged view of point D in Figure 12. As shown in Figures 12 and 13, in one embodiment provided in this application, when processing the groove 21 on the second substrate 20, the groove 21 can be processed on the inner wall of the second substrate 20 by laser etching, or the groove 21 can be processed on the inner wall of the second substrate 20 by grinding, cutting, drilling, turning, milling, etc. using a CNC machine tool system.

[0139] When directly machining the groove 21 on the inner wall of the second substrate 20, it is necessary to ensure that the second substrate 20 has a certain thickness. This ensures the wall thickness of the groove 21, preventing tearing of the groove wall during machining. It also ensures the structural strength of the second substrate 20, preventing damage to the plate at the groove 21 and leakage of the cooling medium. However, if the second substrate 20 is too thick, the overall thickness of the heat spreader 100 will be too large, which is not conducive to its use in thinner and lighter applications. Therefore, to solve this problem, a special design is made for the area on the second substrate 20 where the groove 21 is located, as follows.

[0140] As shown in Figures 9-10 and in conjunction with Figure 5, in one embodiment provided in this application, a protrusion 24 is provided on the side of the second substrate 20 facing away from the inner cavity 101, and at least a portion of the groove 21 is recessed into the protrusion 24.

[0141] In this embodiment, a protrusion 24 is provided on the side of the second substrate 20 opposite to the inner cavity 101, that is, a protrusion 24 is provided on the outer wall of the second substrate 20, and at least a portion of the groove 21 is sunk into the protrusion 24. In this way, while ensuring the wall thickness of the groove 21, the thickness of the plate body in other areas on the second substrate 20 can be reduced, thereby preventing the overall thickness of the heat spreader 100 from being too large, which is beneficial for the use of the heat spreader 100 in the scenario of thinning and lightening.

[0142] When machining the groove 21 on the second substrate 20, the groove 21 can be formed by stamping. In this way, in the final formed heat spreader 100, the area on the outer wall of the second substrate 20 corresponding to the groove 21 will have a protrusion 24. Alternatively, a portion of the second substrate 20 can be thickened, and the groove 21 can be machined on the inner side of the thickened area using a CNC machine tool system by grinding, cutting, drilling, turning, milling, or other methods. In this way, in the final formed heat spreader 100, the area on the outer wall of the second substrate 20 corresponding to the groove 21 will also have a protrusion 24.

[0143] When users use electronic devices such as mobile phones and tablets with a heat spreader 100, their handholding postures are varied and not fixed, so the position of the heat spreader 100 relative to the horizontal plane is also diverse. Figure 14 is a schematic diagram of the heat spreader 100 in an inclined position without the limiting structure 50. As shown in Figure 14, when the heat spreader 100 is inclined relative to the horizontal plane, the particles 40 will accumulate at the edge of the groove 21. At this time, the movement of the particles 40 will be restricted, and it will be difficult to drive the particles 40 to rotate and vibrate when the liquid cooling medium boils, which will affect the bubble release speed and thus affect the heat dissipation effect of the heat spreader 100.

[0144] Therefore, to solve the above problems, a special design is made for the structure in the groove 21. Specifically, a limiting structure 50 is provided in the groove 21. The limiting structure 50 can restrict the range of movement of the particles 40 in a first direction, which is parallel to the bottom wall of the groove 21. The limiting structure 50 can be a limiting groove 51, a grid plate, a limiting post 53, etc., which will be described in detail below with reference to the accompanying drawings.

[0145] Figure 15 is a schematic diagram of an example of the capillary layer 30 provided in an embodiment of this application. Figure 16 is an enlarged view of point E in Figure 15. Figure 17 is a cross-sectional view of an example of the capillary layer 30 and the second substrate 20 at the groove 21. It should be noted that only three particles 40 are shown in Figure 16 to illustrate the effect of the particles 40 being placed in the limiting groove 51, and it is not limited to the requirement that there must be three particles 40. It can be understood that other limiting grooves 51 also contain particles 40. Similar situations exist in the illustrations below, and will not be described again.

[0146] As shown in Figures 15-17, in one embodiment of this application, the limiting structure 50 includes a plurality of limiting grooves 51 arranged in an array, with each particle 40 correspondingly disposed in one of the limiting grooves 51. The area of ​​the capillary layer 30 opposite to the groove 21 is provided with a plurality of intersecting third ridges 31 and fourth ridges 32, which together form the plurality of limiting grooves 51. The plurality of limiting grooves 51 can be arranged in a rectangular array or a diagonal array. The shape of the limiting grooves 51 can be rectangular, rhomboid, triangular, etc.

[0147] In this embodiment, a limiting groove 51 is formed by the intersecting third protrusion 31 and fourth protrusion 32. A particle 40 is placed in each limiting groove 51. The limiting groove 51 restricts the range of motion of the particle 40 in a first direction, which can be understood as direction a in Figure 17. Figure 18 is a schematic diagram of the heat spreader 100 in an inclined state when the limiting structure 50 is in place. As shown in Figure 18, in this embodiment, the position of the particle 40 can be restricted by the limiting groove 51. When the heat spreader 100 is in an inclined state, it can prevent all particles 40 from accumulating at the edge of the groove 21, thereby ensuring the flexibility of the particle 40 and ensuring that the particle 40 can rotate and vibrate when the liquid cooling medium boils.

[0148] The width of the limiting groove 51 does not need to be specially limited, as long as it ensures that the particle 40 can rotate and vibrate in the limiting groove 51.

[0149] The third protruding ridge 31 and the fourth protruding ridge 32 can be independent components, which are installed on the capillary layer 30 by means of bonding, snap-fitting, etc. In order to reduce the assembly difficulty, in one embodiment provided in this application, the capillary layer 30, the third protruding ridge 31 and the fourth protruding ridge 32 are integrally formed structures.

[0150] In this embodiment, the third protruding ridge 31 and the fourth protruding ridge 32 are integrally formed on the capillary layer 30. This design has two technical effects: First, it can reduce assembly steps, as the third protruding ridge 31 and the fourth protruding ridge 32 are directly formed during the manufacturing of the capillary layer 30, eliminating the need to separately assemble the third protruding ridge 31 and the fourth protruding ridge 32 on the capillary layer 30. Second, the third protruding ridge 31 and the fourth protruding ridge 32 are made of the same material as the capillary layer 30, meaning that the third protruding ridge 31 and the fourth protruding ridge 32 also have capillary force. This allows the third protruding ridge 31 and the fourth protruding ridge 32 to accelerate the flow of the cooled liquid phase cooling medium into the groove 21, thereby accelerating the return speed of the liquid phase cooling medium and increasing the vaporization speed of the liquid phase cooling medium to the gas phase cooling medium in the groove 21, thus further enhancing the heat dissipation capacity of the heat spreader 100.

[0151] Figure 19 is an enlarged view of point F in Figure 17. As shown in Figure 19, in one embodiment provided in this application, there is a gap 33 between the third protrusion 31 and the fourth protrusion 32 and the bottom wall of the groove 21.

[0152] In this embodiment, there is a gap 33 between the third protrusion 31 and the fourth protrusion 32 and the bottom wall of the groove 21. This design has two technical effects: First, it facilitates the assembly of the capillary layer 30 and the second substrate 20, avoiding the third protrusion 31 and the fourth protrusion 32 from hitting the bottom wall of the groove 21 due to tolerance. Second, the gap 33 acts as a "communicator", allowing the liquid cooling medium entering the groove 21 to flow into each limiting groove 51, ensuring that the liquid cooling medium is uniformly filled in the groove 21, so as to ensure the heat dissipation capacity of the heat spreader 100.

[0153] The above embodiments describe that the limiting groove 51 is formed by a protrusion disposed on the capillary layer 30. In other embodiments provided in this application, the limiting groove 51 may also be formed by a protrusion disposed on the second substrate 20, as detailed below.

[0154] Figure 20 is a schematic diagram of an example of the second substrate 20 provided in an embodiment of this application. Figure 21 is an enlarged view of point G in Figure 20. Figure 22 is a cross-sectional view of another example of the capillary layer 30 and the second substrate 20 at the groove 21.

[0155] As shown in Figures 20-22, in one embodiment provided in this application, the bottom wall of the groove 21 is provided with a plurality of intersecting first protrusions 22 and second protrusions 23, and the first protrusions 22 and second protrusions 23 enclose to form a plurality of limiting grooves 51.

[0156] In this embodiment, the bottom wall of the groove 21 is provided with multiple intersecting first protrusions 22 and second protrusions 23. This design not only encloses and forms a limiting groove 51, but also fixes the first protrusions 22 and second protrusions 23 on the bottom wall of the groove 21, forming a technical effect similar to "particles 40 are fixedly set in the groove 21" in the aforementioned embodiment. This allows the first protrusions 22 and second protrusions 23 to increase the number of bubble nucleation, thereby improving the boiling heat transfer coefficient and accelerating the vaporization rate of the liquid phase cooling medium to the gas phase cooling medium, thereby improving the heat dissipation capacity of the heat spreader 100.

[0157] In one embodiment provided in this application, the first protruding ridge 22, the second protruding ridge 23, the third protruding ridge 31 and the fourth protruding ridge 32 can coexist in the groove 21, that is, the groove 21 forms two layers of limiting grooves 51.

[0158] The first protruding ridge 22 and the second protruding ridge 23 can be independent components, which are installed on the bottom wall of the groove 21 by means of bonding, snap-fit, etc. In order to reduce the assembly process of the first protruding ridge 22 and the second protruding ridge 23, in one embodiment provided in this application, the second substrate 20, the first protruding ridge 22 and the second protruding ridge 23 are integrally formed structures.

[0159] In one embodiment provided in this application, there is also a gap between the first protrusion 22 and the second protrusion 23 and the capillary layer 30. This design is to facilitate the assembly of the capillary layer 30 with the second substrate 20 and to avoid the first protrusion 22 and the second protrusion 23 hitting the capillary layer 30 due to tolerance effects.

[0160] Besides being a limiting groove 51, the limiting structure 50 can also be a grid plate, as detailed below. Figure 23 is a schematic diagram of the first rod 522 and the second rod 523 provided in an embodiment of this application. Figure 24 is a cross-sectional view of another example of the capillary layer 30 and the second substrate 20 at the groove 21.

[0161] As shown in Figures 23-24, in one embodiment provided in this application, the limiting structure 50 includes a first rod 522 and a second rod 523. On a plane parallel to the bottom wall of the groove 21, multiple first rods 522 and multiple second rods 523 intersect and enclose each other to form multiple holes 521 arranged in an array. Particles 40 are correspondingly disposed in each hole 521. There are gaps between the first rods 522 and second rods 523 and the capillary layer 30, and also gaps between the first rods 522 and second rods 523 and the bottom wall of the groove 21. The diameter of the holes 521 is not particularly limited, as long as it ensures that the particles 40 can rotate and vibrate within the holes 521.

[0162] In this embodiment, multiple intersecting first rods 522 and second rods 523 actually form a limiting structure 50 similar to a grid or mesh plate. A particle 40 is placed in each hole 521 of the grid or mesh plate. The first rods 522 and second rods 523 restrict the range of motion of the particle 40 in the first direction. When the temperature distribution plate 100 is tilted, it can prevent all particles 40 from accumulating at the edge of the groove 21, thereby ensuring the flexibility of the particles 40. When the liquid cooling medium boils, it can ensure the rotation and vibration of the particles 40.

[0163] As shown in Figure 24, in one embodiment provided in this application, the limiting structure 50 formed by multiple first rods 522 and second rods 523 is a single structure, disposed in the middle of the groove 21. The middle of the groove 21 can be understood as the area of ​​the groove 21 excluding the opening and the bottom wall. This allows for the flat application of only one layer of first rods 522 and second rods 523, reducing the number of first rods 522 and second rods 523 used and lowering material costs.

[0164] Figure 25 is a cross-sectional view of another example of the capillary layer 30 and the second substrate 20 at the groove 21. As shown in Figure 25, in one embodiment provided in this application, the number of limiting structures 50 formed by a plurality of first rods 522 and second rods 523 is two, and the two limiting structures 50 are spaced apart in the thickness direction of the heat spreader 100.

[0165] In this embodiment, two layers of first rod 522 and second rod 523 are actually laid flat. There is a gap between the first rod 522 and second rod 523 and the capillary layer 30, and there is also a gap between them and the bottom wall of the groove 21.

[0166] Besides being a limiting groove 51 or a grid plate, the limiting structure 50 can also be a limiting post 53, as detailed below. Figure 26 is a schematic diagram of another example of the capillary layer 30 provided in this application embodiment. Figure 27 is an enlarged view of section H in Figure 26. Figure 28 is a cross-sectional view of another example of the capillary layer 30 and the second substrate 20 at the groove 21.

[0167] As shown in Figures 26-28, in one embodiment provided in this application, the limiting structure 50 includes a plurality of limiting posts 53 arranged in an array. Every three or four limiting posts 53 form a constraint space, and the particles 40 are disposed in the constraint spaces one by one. The limiting posts 53 are disposed on the capillary layer 30 in the area directly opposite the groove 21.

[0168] In this embodiment, one particle 40 is placed in each constrained space. The movement range of the particle 40 in the first direction is restricted by the limiting post 53. When the heat spreader 100 is tilted, it can prevent all particles 40 from accumulating at the edge of the groove 21, thereby ensuring the flexibility of the particles 40 and ensuring that the particles 40 vibrate when the liquid cooling medium boils. Furthermore, compared with the protrusion and rod, there is no physical structure between the limiting posts 53 to occupy the internal space of the groove 21. This can ensure the filling amount of liquid cooling medium in the groove 21, thereby ensuring that the heat spreader 100 has enough liquid cooling medium at the groove 21 for vaporization and heat dissipation.

[0169] In one embodiment provided in this application, the capillary layer 30 and the limiting post 53 are integrally formed structures.

[0170] In this embodiment, the limiting post 53 is integrally molded onto the capillary layer 30. This design has two technical advantages: First, it reduces assembly steps, as the limiting post 53 is directly molded during the manufacturing of the capillary layer 30, eliminating the need for separate assembly of the limiting post 53. Second, the limiting post 53 and the capillary layer 30 are made of the same material, meaning the limiting post 53 also possesses capillary force. This allows the limiting post 53 to accelerate the flow of the cooled liquid phase cooling medium into the groove 21, speeding up the return flow rate of the liquid phase cooling medium. This, in turn, increases the vaporization rate of the liquid phase cooling medium to the gas phase cooling medium within the groove 21, thereby further enhancing the heat dissipation capacity of the heat spreader 100.

[0171] To facilitate the assembly of the capillary layer 30 and the second substrate 20, in one embodiment provided in this application, there is a gap between the limiting post 53 and the bottom wall of the groove 21.

[0172] Figure 29 is a schematic diagram of another example of the second substrate 20 provided in the embodiments of this application. Figure 30 is an enlarged view of point I in Figure 29. Figure 31 is a cross-sectional view of another example of the capillary layer 30 and the second substrate 20 at the groove 21.

[0173] In addition to being disposed in the capillary layer 30, as shown in Figures 29-31, in another embodiment provided in this application, the limiting post 53 is disposed in the bottom wall of the groove 21.

[0174] In this embodiment, the limiting post 53 is disposed on the bottom wall of the groove 21. This design not only allows the limiting post 53 to restrict the range of motion of the particles 40, but also creates a technical effect similar to the "particles 40 are fixedly disposed in the groove 21" in the previous embodiment. This allows the limiting post 53 to increase the number of bubble nucleation, thereby improving the boiling heat transfer coefficient and accelerating the vaporization rate of the liquid phase cooling medium to the gas phase cooling medium, thereby improving the heat dissipation capacity of the heat spreader 100.

[0175] In order to reduce the assembly process of the limiting post 53, in one embodiment provided in this application, the second substrate 20 and the limiting post 53 are integrally formed.

[0176] Figure 32 is a cross-sectional view of another example of the capillary layer 30 and the second substrate 20 at the groove 21.

[0177] As shown in Figure 32, in one embodiment provided in this application, a portion of the limiting posts 53 are integrally formed on the capillary layer 30, and another portion of the limiting posts 53 are disposed on the bottom wall of the groove 21.

[0178] In this embodiment, the limiting post 53 disposed on the capillary layer 30 has capillary force, thereby enabling the limiting post 53 to accelerate the flow of the cooled liquid phase cooling medium into the groove 21, accelerating the return speed of the liquid phase cooling medium, and thus increasing the vaporization speed of the liquid phase cooling medium to the gas phase cooling medium. The limiting post 53 disposed on the bottom wall of the groove 21 can increase the number of bubble nucleation, thereby improving the boiling heat transfer coefficient. In addition, the movable particles 40 in the groove 21 increase the bubble detachment frequency. With the triple effect, the heat dissipation capacity of the heat spreader 100 can be greatly improved.

[0179] In one embodiment provided in this application, the shape of the particle 40 includes, but is not limited to, regular bodies such as spheres, cylinders, prisms, and pyramids, as well as irregular bodies with other irregular structures.

[0180] In one embodiment provided in this application, the surface roughness of particle 40 is 0.005mm-0.01mm. Surface roughness refers to the unevenness of a workpiece surface with machining marks such as tool marks in the machining field. Specifically, it is calculated as the average value of the peak-valley height difference of the machining marks.

[0181] In this embodiment, the surface of the particle 40 can be roughened by setting pores or pits on the surface of the particle 40. The surface roughness of the particle 40 is in the range of the average height difference between the peak of the pore or pit and the valley of the pore or pit.

[0182] In this embodiment, the surface of particle 40 has pores or pits, making it more prone to nucleation compared to particles with smooth surfaces. Simultaneously, the pores or pits on the surface of particle 40 increase its specific surface area, allowing for the generation of more bubbles and further increasing the number of bubble nucleations.

[0183] In some embodiments provided in this application, the material of the particles 40 includes metals. For example, they can be copper particles, aluminum particles, nickel particles, etc.

[0184] In some embodiments provided in this application, the material of the particles 40 includes polymers. For example, they may be polypropylene particles, polyethylene particles, polyamide particles, etc.

[0185] In some embodiments provided in this application, the capillary layer 30 can be composed of a sintered metal powder body or a sintered non-metal powder body. Sintering refers to the bonding of raw material powders at high temperatures, resulting in grain growth, a reduction in porosity and grain boundaries, and a shrinkage in overall volume and an increase in density through mass transfer, ultimately forming a dense polycrystalline sintered body with a certain microstructure. This phenomenon is called the sintering process. Sintered metal powder bodies can be formed, but are not limited to, by sintering copper powder, and sintered non-metal powder bodies can be formed, but are not limited to, by sintering ceramic powder. Most pores in sintered metal powder bodies and sintered non-metal powder bodies are very small, resulting in a large overall capillary force, which can provide a greater driving force for the gas-liquid circulation within the heat exchanger 100.

[0186] In some embodiments provided in this application, the capillary layer 30 may also be composed of at least one of foam metal, non-metallic fiber body, metal braided mesh, and metal braided braid.

[0187] Foamed metal refers to a special metal material containing foam pores. These pores form high-speed channels for the return of the liquid-phase cooling medium. Foamed metals that can form the capillary layer 30 in the embodiments of this application include foamed aluminum, foamed nickel, and foamed copper. There are many methods for preparing foamed metal. Based on the different physical states of the metal or alloy during processing, the manufacturing methods for obtaining metal foam materials can be classified as liquid-phase methods, powder-solid-phase methods, ionic methods, and gas-absorbed phase methods.

[0188] Non-metallic fibrous materials include, but are not limited to, glass fiber or carbon fiber. In this embodiment, the glass fiber that forms the capillary layer 30 is also known as glass wool, and its raw materials may include pyrophyllite, quartz sand, limestone, dolomite, borosilicate, boromagnesia, etc. Glass fiber is a type of fixed-length glass fiber, with relatively short fibers, generally less than 150mm. It has a loose, cotton-like structure and numerous internal pores, which serve as reflux channels for the liquid-phase cooling medium. Carbon fiber refers to high-strength, high-modulus fibers with a carbon content of over 90%. In this embodiment, the carbon fiber that forms the capillary layer 30 is a porous material woven from carbon fibers, and its internal channels serve as reflux channels for the liquid-phase cooling medium.

[0189] The metal braided mesh is a mesh structure made of multiple metal wires interwoven together. When the metal braided mesh is used as a capillary layer 30, the gaps between the metal wires serve as return channels for the liquid cooling medium. The metal wires used in the metal braided mesh can be made of copper or aluminum. Compared to metal braided braids, the metal braided mesh has mostly smaller gap sizes and a larger overall capillary force, which can provide a greater driving force for the gas-liquid circulation within the heat exchanger 100.

[0190] Metal braids are made by twisting and bundling multiple metal wires in a spiral, similar to the braided hairstyles often seen in women's hair. Similar to metal mesh, the gaps between the metal wires in a metal braid act as channels for the return flow of the liquid cooling medium. The metal wires used in metal braids can be made of copper or aluminum.

[0191] In some embodiments provided in this application, the capillary layer 30 can be fixedly connected to the second substrate 20 by means of welding, bonding, molecular force adsorption, etc. For example, the capillary layer 30 can be fixedly connected to the second substrate 20 by local spot welding or local adhesive application, or the capillary layer 30 can be fixed to the second substrate 20 by sintering, and the fixed connection is achieved by the mutual attraction between the substrate molecules of the capillary layer 30 and the substrate molecules of the substrate.

[0192] In some embodiments provided in this application, the cooling medium can be any liquid that facilitates evaporative heat dissipation, such as water, inorganic compounds, organic compounds, liquid metals, refrigerants, or mixtures of two or more of the aforementioned substances. When the cooling medium is water, distilled water or deionized water can be used. When the cooling medium is an organic compound, at least one of ethanol, methanol, and acetone can be used.

[0193] This application embodiment also provides a method for manufacturing a heat spreader 100, specifically: a groove 21 is provided in the heat source area of ​​the second substrate 20, the groove 21 having a minimum depth of 0.01-0.03 mm; copper particles are filled into the groove 21, and then copper powder is placed in a graphite fixture to sinter the capillary layer 30 into shape; after forming, the surface of the capillary layer 30 is subjected to superhydrophilic modification treatment; the materials of the first substrate 10 and the second substrate 20 can be copper, stainless steel, or other metal materials with high thermal conductivity and high structural strength; the first substrate 10 and the second substrate 20 are connected by laser welding, arc welding, or other welding methods; water is injected into the inner cavity 101 as a cooling medium, and after filling with the cooling medium, a vacuum is drawn to 1E-4 mbar.

[0194] As mentioned earlier when introducing the calculation formula for the boiling heat transfer coefficient h, the boiling heat transfer coefficient h is directly proportional to the number of bubble nucleation sites Na, and also directly proportional to the bubble detachment frequency f. To increase the bubble detachment frequency f, in addition to movably placing the particles 40 in the groove 21 and driving the particles 40 to stir in the groove 21 by the boiling liquid cooling medium, an external vibration exciter can also be used to assist in bubble detachment, thereby enhancing the heat dissipation capacity of the heat spreader 100. The specific design is as follows.

[0195] Figure 33 is a schematic diagram of an example of the heat spreader 100 provided in this application in a mobile phone. Figure 34 is a schematic diagram of the second substrate 20 in Figure 33 vibrating.

[0196] As shown in Figures 33-34, and in conjunction with Figure 3, this embodiment of the application also provides a mobile phone, which includes a processor 500, a temperature monitoring module 501, a vibration excitation element, and a heat spreader 100. In this embodiment, the processor 500 is used as a heat-generating element and is deheated by the heat spreader 100. The processor 500 is disposed on the side of the second substrate 20 facing away from the inner cavity 101. In the thickness direction of the heat spreader 100, at least a portion of the processor 500 is opposite to the groove 21. Alternatively, it can be understood that the processor 500 is projected toward the plane containing the bottom wall of the groove 21, and at least a portion of this projection overlaps with the bottom wall of the groove 21.

[0197] Regarding the positional relationship between the processor 500 and the recess 21, there are three specific design methods: when the upper surface area of ​​the processor 500 is greater than the bottom wall area of ​​the recess 21, at least a portion of the processor 500 is opposite to the recess 21; or the upper surface area of ​​the processor 500 is equal to the bottom wall area of ​​the recess 21, and the entire processor 500 is opposite to the recess 21; or the upper surface area of ​​the processor 500 is less than the bottom wall area of ​​the recess 21, and the entire processor 500 is opposite to the recess 21.

[0198] Referring again to Figures 33-34, the processor 500 is electrically connected to the temperature monitoring module 501, or the temperature monitoring module 501 can be directly mounted on the processor 500. The vibration excitation element is a vibration motor 600, which is electrically connected to the processor 500. The particles 40 of the heat spreader 100 are fixedly mounted in the groove 21.

[0199] The working process of this embodiment is as follows: The temperature monitoring module 501 monitors the temperature of the processor 500 and sends the temperature information to the processor 500. When the temperature monitored by the temperature monitoring module 501 is greater than a set threshold, the processor 500 controls the vibration motor 600 to start. The vibration motor 600 directly transmits the vibration mechanical energy to the second substrate 20, or indirectly transmits the vibration mechanical energy to the second substrate 20 through the middle frame 201, or indirectly transmits the vibration mechanical energy to the second substrate 20 through the first substrate 10. Regardless of the transmission method, the second substrate 20 can vibrate at this time, causing the bubbles on the groove wall of the groove 21 and the bubbles on the surface of the particles 40 to fall off more quickly.

[0200] It should be noted that the processor 500 and the second substrate 20 can be thermally connected via thermally conductive adhesive 502. This allows the thermally conductive adhesive 502 to improve the heat transfer efficiency between the processor 500 and the second substrate 20 when heat generated by the processor 500 is transferred to the second substrate 20. Furthermore, the connection between the processor 500 and the second substrate 20 via the thermally conductive adhesive 502, due to its elasticity and ductility, ensures effective thermal connection between the processor 500 and the second substrate 20 even when the second substrate 20 vibrates and undergoes slight displacement relative to the processor 500. This ensures the effective heat dissipation of the processor 500 by the heat spreader 100.

[0201] Figure 35 is a schematic diagram of the second substrate 20 of another embodiment provided in this application under vibration.

[0202] As shown in Figure 35, the particles 40 of the heat spreader 100 are movably disposed in the groove 21, and the bottom wall of the groove 21 is provided with a plurality of intersecting first protrusions 22 and second protrusions 23. The first protrusions 22 and second protrusions 23 enclose and form a plurality of limiting grooves 51, and the particles 40 are located in the limiting grooves 51.

[0203] When the second substrate 20 vibrates, the first protruding ridge 22 and the second protruding ridge 23 on the bottom wall of the groove 21 also vibrate, which in turn drives the particles 40 to vibrate, thereby enhancing the vibration effect of the particles 40 in the groove 21, accelerating the shedding of bubbles on the surface of the particles 40, and accelerating the shedding of bubbles on the surface of the first protruding ridge 22 and the second protruding ridge 23, thereby accelerating the vaporization rate of the liquid phase cooling medium to the gas phase cooling medium in the groove 21, thereby improving the heat dissipation capacity of the heat spreader 100.

[0204] In one embodiment provided in this application, the vibration exciter can also be a speaker 700. When the temperature detected by the temperature monitoring module 501 is greater than a set threshold, the processor 500 controls the speaker 700 to start. To avoid startling the user or affecting the surrounding environment due to the speaker 700 suddenly emitting sound, the processor 500 controls the speaker 700 to emit audio in the range of 5Hz-20Hz or 20KHz-40KHz. Generally, the sound frequencies that the human ear can hear are in the range of 20Hz-20KHz. Audio frequencies outside the range of 20Hz-20KHz are not easily perceived by the human ear. Therefore, the processor 500 controlling the speaker 700 to emit audio in the range of 5Hz-20Hz or 20KHz-40KHz will not affect the user or the surrounding environment. Furthermore, the sound waves radiated by the speaker 700 can drive the first substrate 10 and the second substrate 20 to vibrate, causing the bubbles on the groove wall of the groove 21 and the bubbles on the surface of the particles 40 to fall off more quickly.

[0205] It should be noted that the hardware factors affecting the audio range of the speaker 700 include: the material, mass, thickness, elastic modulus, and shape of the diaphragm, as well as the magnitude and shape of the magnetic field of the magnet, and the specific structure of the front and rear sound chambers. The software factors affecting the speaker's audio range include: the frequency of the current supplied to the diaphragm, which is mainly determined by the software running on the processor 500. In this application, through reasonable hardware design, the theoretical audio range that the speaker 700 can play is 5Hz-40kHz, thus providing a large design redundancy in the audio range played by the speaker 700. In practical use, the processor 500 can control the frequency of the current supplied to the diaphragm to control the actual audio played by the speaker 700.

[0206] In one embodiment provided in this application, the vibration exciter can also be a speaker 700 and a vibration motor 600. When the processor 500 runs a high-power program with built-in audio and vibration effects, such as a shooting game, the audio waves played by the speaker 700 can drive the first substrate 10 and the second substrate 20 to vibrate. At the same time, the vibration motor 600 can also drive the first substrate 10 and the second substrate 20 to vibrate according to the game's plot, causing the bubbles on the groove wall of the groove 21 and the bubbles on the surface of the particles 40 to fall off more quickly. In this case, there is no need for the temperature monitoring module 501 and the processor 500 to perform temperature control. Alternatively, if there are no audio and vibration effects in the program, the processor 500 can control the speaker 700 to emit audio at 5Hz-20Hz or 20KHz-40KHz, and control the vibration motor 600 to vibrate.

[0207] Figure 36 is a schematic diagram of another example of the heat spreader 100 provided in this application embodiment in a mobile phone.

[0208] As shown in Figure 36, in one embodiment provided in this application, the mobile phone includes an RF front-end module 800, a processor 500, a temperature monitoring module 501, a vibration exciter, and a heat spreader 100. The RF front-end module 800 is disposed on the outer wall of the second substrate 20 and in the area corresponding to the groove 21. The RF front-end module 800 is electrically connected to the temperature monitoring module 501, or the temperature monitoring module 501 can be directly disposed on the RF front-end module 800. The vibration exciter is a speaker 700, which is electrically connected to the processor 500. The particles 40 of the heat spreader 100 are movably disposed in the groove 21.

[0209] In this embodiment, the radio frequency front-end module 800 is used as a heat-generating element and is deheated by the heat spreader 100. The temperature monitoring module 501 monitors the temperature of the radio frequency front-end module 800. When the power consumption of the radio frequency front-end module 800 is too high, causing the temperature monitored by the temperature monitoring module 501 to exceed the set threshold, the processor 500 controls the speaker 700 to emit audio at 5Hz-20Hz or 20KHz-40KHz. The sound waves radiated by the speaker 700 can drive the first substrate 10 and the second substrate 20 to vibrate, causing the bubbles on the groove wall of the groove 21 and the bubbles on the surface of the particles 40 to fall off more quickly.

[0210] Figure 37 is a schematic diagram of another example of the heat spreader 100 provided in this application embodiment in a mobile phone.

[0211] As shown in Figure 37, in one embodiment provided in this application, the mobile phone includes a processor 500, a temperature monitoring module 501, a vibration exciter, and a heat spreader 100. The vibration exciter consists of two speakers 700, namely a first speaker 701 and a second speaker 702. The first speaker 701 is located at the bottom of the mobile phone, and the second speaker 702 is located at the top of the mobile phone. Compared to the first speaker 701, the second speaker 702 is positioned closer to the groove 21 of the second substrate 20.

[0212] In this context, "bottom of the phone" refers to the part of the phone closest to the user's mouth when making a call; "top of the phone" refers to the part of the phone closest to the user's ear when making a call. In actual phone usage scenarios, the first speaker 701 can be the phone's external speaker, and the second speaker 702 can be the phone's earpiece.

[0213] The working process of this embodiment is as follows: At least two speakers 700 are configured, namely a first speaker 701 and a second speaker 702. The first speaker 701 plays audio at 20Hz-20kHz, i.e., the audio provided by the program. The processor 500 controls the second speaker 702 to play audio at 5Hz-20Hz or 20kHz-40kHz. The second speaker 702 is positioned closer to the groove 21 of the second substrate 20. Thus, when the processor 500 runs a program such as a video call, the first speaker 701 plays the call content normally and radiates sound waves outwards, while the second speaker 702 emits audio at 5Hz-20Hz or 20kHz-40kHz to avoid interfering with the user's call. Furthermore, the sound waves radiated by the second speaker 702 more easily reach the groove 21 of the second substrate 20. This not only avoids affecting the phone call but also makes it easier for the plate at the groove 21 to vibrate and for the particles 40 to vibrate, thereby accelerating the shedding of bubbles and improving the heat dissipation capacity of the heat spreader 100.

[0214] This application embodiment also provides a temperature control method applied to a mobile phone. The mobile phone includes a heating element, a vibration exciter, and a heat spreader 100. The heating element is disposed on the side of the second substrate 20 opposite to the inner cavity 101, and at least a portion of the heating element is opposite to the groove 21 in the thickness direction of the heat spreader 100. The vibration exciter is fixedly disposed relative to the heat spreader 100. The temperature control method includes:

[0215] When the temperature of the heating element is determined to be greater than the set threshold, the vibration exciter is controlled to vibrate.

[0216] In this embodiment, the temperature of the heating element can be monitored in real time, and the vibration excitation device can be automatically controlled to drive the first substrate 10 and the second substrate 20 to vibrate, so as to provide rapid thermal response and rapid deheating for the heating element.

[0217] In one embodiment provided in this application, the vibration excitation element includes a first speaker 701 and a second speaker 702, and the temperature control method includes:

[0218] When the temperature of the heating element is determined to be greater than the set threshold, and the first speaker 701 plays audio in the range of 20Hz-20KHz, the second speaker 702 is controlled to play audio in the range of 5Hz-20Hz or 20KHz-40KHz, or;

[0219] When the temperature of the heating element is determined to be greater than the set threshold and the first speaker 701 is not working, the first speaker 701 and / or the second speaker 702 are controlled to play audio at 5Hz-20Hz or 20KHz-40KHz.

[0220] The temperature control method in this embodiment is mainly aimed at two special application scenarios when the heat-generating element is the processor 500: One scenario is when the processor 500 is running a program such as a video call, the first speaker 701 normally plays the call content and radiates sound waves outwards, while the processor 500 controls the second speaker 702 to play audio at 5Hz-20Hz or 20kHz-40kHz to drive the second substrate 20 to vibrate. This does not affect the phone call, but also causes the plate at the groove 21 and the particles 40 to vibrate, thereby accelerating the shedding of bubbles and improving performance. The vapor chamber 100 enhances the heat dissipation capability of the processor 500. Another feature is that when the phone is in silent mode and the processor 500 is running high-power programs such as shooting games, the processor 500 controls the first speaker 701 and / or the second speaker 702 to play audio at 5Hz-20Hz or 20KHz-40KHz to drive the second substrate 20 to vibrate. This prevents the user from being startled by sudden sound and also causes the plate at the groove 21 and the particles 40 to vibrate, thereby accelerating the shedding of bubbles and improving the heat dissipation capability of the vapor chamber 100 for the processor 500.

[0221] Figure 38 is a simulation diagram of the liquid cooling medium in the groove 21 during vaporization. In Figure 38(a), the groove 21 is a schematic diagram without particles 40; Figure 38(b) is a schematic diagram with particles 40 fixedly disposed in the groove 21; and Figure 38(c) is a schematic diagram with particles 40 movably disposed in the groove 21.

[0222] As shown in Figure 38(a), when there are no particles 40 in the groove 21, the number of bubble nuclei 60 formed on the wall of the groove 21 during vaporization of the liquid cooling medium is 4. As shown in Figure 38(b), when the particles 40 are fixedly disposed in the groove 21, in addition to the 4 bubble nuclei formed on the wall of the groove 21 during vaporization of the liquid cooling medium, the number of bubble nuclei 60 formed on the surface of the particles 40 is 3, for a total of 7 bubble nuclei 60. As shown in Figure 38(c), when the particles 40 are movably disposed in the groove 21, in addition to the 4 bubble nuclei formed on the wall of the groove 21 during vaporization of the liquid cooling medium, the number of bubble nuclei 60 formed on the surface of the particles 40 is 3, for a total of 7 bubble nuclei 60.

[0223] It is evident that whether the particles 40 are fixedly placed in the groove 21 or are movably placed in the groove 21, compared to the case where there are no particles 40 in the groove 21, the number of bubble nucleation is significantly increased, thereby improving the boiling heat transfer coefficient and thus improving the heat dissipation capacity of the heat spreader 100.

[0224] Figure 39 is a heat flux density curve of the heat spreader 100. In Figure 39, curve L1 is the heat flux density curve of the heat spreader 100 when there are no particles 40 in the groove 21; curve L2 is the heat flux density curve of the heat spreader 100 when the particles 40 are fixedly disposed in the groove 21; and curve L3 is the heat flux density curve of the heat spreader 100 when the particles 40 are movably disposed in the groove 21.

[0225] It is important to understand that heat flux density, also known as heat transfer density, is defined as the amount of heat passing through a unit area per unit time. Heat flux density is an important indicator for evaluating the heat dissipation performance of a device or equipment. In the vapor chamber 100 of this application, heat flux density can be used to evaluate the heat dissipation performance of the vapor chamber 100.

[0226] As shown in Figure 39, by comparing curves L1-L3, it can be seen that when particles 40 are movably placed in groove 21, the average heat flux density of the heat spreader 100 is the highest; when particles 40 are fixedly placed in groove 21, the average heat flux density of the heat spreader 100 is the second highest; and when there are no particles 40 in groove 21, the average heat flux density of the heat spreader 100 is the worst.

[0227] Figure 40 is a bar chart of the total heat absorption of the heat spreader 100. In Figure 40, column L4 represents the total heat absorption of the heat spreader 100 when there are no particles 40 in the groove 21; column L5 represents the total heat absorption of the heat spreader 100 when the particles 40 are fixedly disposed in the groove 21; and column L6 represents the total heat absorption of the heat spreader 100 when the particles 40 are movably disposed in the groove 21.

[0228] As shown in Figure 40, comparing columns L4-L6, it can be seen that when particles 40 are movably placed in groove 21, the total heat absorption of the heat spreader 100 is the highest, approximately 5.70E-07J; when particles 40 are fixedly placed in groove 21, the total heat absorption of the heat spreader 100 is the second highest, approximately 4.20E-07J; and when there are no particles 40 in groove 21, the total heat absorption of the heat spreader 100 is the worst, approximately 3.90E-07J.

[0229] Figure 41 is a temperature curve of the processor 500 when it is deheated by the heat spreader 100. In Figure 41, curve L7 is the temperature curve of the processor 500 when the heat spreader 100 in the groove 21 is free of particles 40; curve L8 is the temperature curve of the processor 500 when the heat spreader 100 in the groove 21 is movably provided with particles 40.

[0230] As shown in Figure 41, comparing curves L7 and L8, it can be seen that when the processor 500 starts running, the vibration motor 600 is activated at 20 seconds, and the heat dissipation is performed using the heat spreader 100 with particles 40 movably disposed in the groove 21. Compared with the heat spreader 100 in the groove 21 without particles 40, the temperature of the processor 500 is always lower. Furthermore, when the processor 500 runs for 75 seconds, the heat dissipation is performed using the heat spreader 100 with particles 40 movably disposed in the groove 21, and the temperature difference of the processor 500 can reach up to 1.5℃.

[0231] Figure 42 is a temperature curve of processor 500 when running a high-power program. In Figure 42(a), the temperature curve of processor 500 without using vapor chamber 100 is shown; in Figure 42(b), the temperature curve of processor 500 is shown when using vapor chamber 100 with particles 40 movably disposed in groove 21.

[0232] As shown in Figure 42(a), when the processor 500 runs a high-power program, there is an instantaneous thermal spike at the initial startup, and instantaneous thermal spikes continue to appear during operation. As shown in Figure 42(b), when a heat spreader 100 with particles 40 movably disposed in the groove 21 is used, the vibration motor 600 is activated to apply a vibration effect to the heat spreader 100, enabling the heat spreader 100 to respond quickly and deheat rapidly. When the processor 500 runs a high-power program, the temperature of the processor 500 remains stable from startup to shutdown, without any instantaneous high temperatures.

[0233] Figure 43 is a sound pressure level distribution diagram of the speaker 700 radiating sound waves inside the mobile phone.

[0234] As shown in Figure 43, point G is the area of ​​the heat spreader 100 with groove 21. The speaker 700 is located at the bottom of the phone. When the speaker 700 emits sound, the radiated sound waves are about 140dB, which can be transmitted to the groove 21 area to create a vibration effect on the particles 40.

[0235] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A vapor chamber, characterized by, include: First substrate (10); The second substrate (20) and the first substrate (10) surround each other to form an inner cavity (101), and a groove (21) is provided on the side of the second substrate (20) facing the inner cavity (101); A capillary layer (30) is disposed in the inner cavity (101) and covers the opening of the groove (21); Particles (40), there are multiple particles (40) and they are disposed in the groove (21).

2. The vapor chamber of claim 1, wherein, The particles (40) are movably disposed in the grooves (21).

3. The temperature distribution plate according to claim 2, characterized in that, The particle (40) and the groove (21) satisfy the following relationship: 2D>H>D; Wherein, D is the particle size of the particle (40), and H is the depth of the groove (21).

4. The temperature distribution plate according to claim 2 or 3, characterized in that, A limiting structure (50) is provided in the groove (21), which can limit the range of motion of the particle (40) in a first direction, which is parallel to the bottom wall of the groove (21).

5. The temperature distribution plate according to claim 4, characterized in that, The limiting structure (50) includes a plurality of limiting grooves (51) arranged in an array, and the particles (40) are disposed in the limiting grooves (51) in a corresponding manner.

6. The temperature distribution plate according to claim 5, characterized in that, The bottom wall of the groove (21) is provided with a plurality of intersecting first protrusions (22) and second protrusions (23), and the first protrusions (22) and the second protrusions (23) enclose to form the plurality of limiting grooves (51).

7. The temperature distribution plate according to claim 5 or 6, characterized in that, The capillary layer (30) is provided with a plurality of intersecting third convex ridges (31) and fourth convex ridges (32) in the area directly opposite to the groove (21), and the third convex ridges (31) and the fourth convex ridges (32) enclose and form the plurality of limiting grooves (51).

8. The temperature distribution plate according to claim 7, characterized in that, The capillary layer (30), the third protrusion (31), and the fourth protrusion (32) are integrally formed structures.

9. The temperature distribution plate according to claim 7 or 8, characterized in that, The third protruding ridge (31) and the fourth protruding ridge (32) have a gap (33) between them and the bottom wall of the groove (21).

10. The temperature distribution plate according to claim 4, characterized in that, The limiting structure (50) includes a first rod (522) and a second rod (523). On a plane parallel to the bottom wall of the groove (21), a plurality of first rods (522) and a plurality of second rods (523) intersect each other and enclose each other to form a plurality of holes (521) arranged in an array. The particles (40) are correspondingly disposed in the holes (521). The first rod (522) and the second rod (523) have gaps between themselves and the capillary layer (30), and also have gaps between themselves and the bottom wall of the groove (21).

11. The temperature distribution plate according to claim 10, characterized in that, The number of limiting structures (50) formed by the first rod (522) and the second rod (523) is two, and the two limiting structures (50) are spaced apart in the thickness direction of the heat exchange plate (100).

12. The temperature distribution plate according to claim 4, characterized in that, The limiting structure (50) includes a plurality of limiting posts (53) arranged in an array, and every three or four limiting posts (53) form a constraint space, and the particles (40) are arranged in the constraint space in a one-to-one correspondence.

13. The temperature distribution plate according to claim 12, characterized in that, The limiting post (53) is disposed on the bottom wall of the groove (21).

14. The temperature distribution plate according to claim 12, characterized in that, The limiting post (53) is disposed on the capillary layer (30) in the area directly opposite the groove (21).

15. The temperature distribution plate according to claim 14, characterized in that, The capillary layer (30) and the limiting post (53) are integrally formed structures.

16. The temperature distribution plate according to claim 12, characterized in that, One portion of the limiting post (53) is integrally formed on the capillary layer (30), and the other portion of the limiting post (53) is disposed on the bottom wall of the groove (21).

17. The temperature distribution plate according to any one of claims 1-16, characterized in that, The second substrate (20) has a protrusion (24) on the side opposite to the inner cavity (101), and at least a portion of the groove (21) is recessed into the protrusion (24).

18. The temperature distribution plate according to any one of claims 1-17, characterized in that, The surface roughness of the particles (40) is 0.005 mm to 0.01 mm.

19. The temperature distribution plate according to any one of claims 1-18, characterized in that, The material of the particles (40) includes metal or polymer.

20. An electronic device, characterized in that, Includes a heating element and a heat spreader (100) as described in any one of claims 1-19, wherein the heating element is disposed on the side of the second substrate (20) opposite to the inner cavity (101), and at least a portion of the heating element is opposite to the groove (21) in the thickness direction of the heat spreader (100).

21. The electronic device according to claim 20, characterized in that, It also includes a vibration exciter, which is fixedly disposed relative to the temperature distribution plate (100) and is used to drive the second substrate (20) to vibrate.

22. The electronic device according to claim 21, characterized in that, The vibration exciter includes a vibration motor (600) and / or a loudspeaker (700).

23. The electronic device according to claim 22, characterized in that, It also includes a processor (500) and a temperature monitoring module (501), wherein the temperature monitoring module (501), the processor (500) and the vibration exciter are electrically connected in sequence; the temperature monitoring module (501) is used to monitor the temperature of the heating element and send the temperature information to the processor (500); when the temperature is greater than a set threshold, the processor (500) controls the vibration exciter to vibrate.

24. The electronic device according to claim 23, characterized in that, The heating element includes the processor (500).

25. The electronic device according to claim 23 or 24, characterized in that, The vibration exciter includes a first speaker (701) and a second speaker (702). The first speaker (701) is located at the bottom of the electronic device, and the second speaker (702) is located at the top of the electronic device. Compared with the first speaker (701), the second speaker (702) is positioned closer to the groove (21) of the second substrate (20).

26. A temperature control method, characterized in that, The method is applied to an electronic device, the electronic device including a heating element, a vibration exciter, and a heat spreader (100) as described in any one of claims 1-19, wherein the heating element is disposed on the side of the second substrate (20) opposite to the inner cavity (101), and at least a portion of the heating element is opposite to the groove (21) in the thickness direction of the heat spreader (100), the vibration exciter is fixedly disposed relative to the heat spreader (100), and the temperature control method includes: When the temperature of the heating element is determined to be greater than a set threshold, the vibration exciter is controlled to vibrate.

27. The temperature control method according to claim 26, characterized in that, The vibration exciter includes a first speaker (701) and a second speaker (702), and the temperature control method includes: When the temperature of the heating element is determined to be greater than a set threshold, and the first speaker (701) plays audio at 20Hz-20KHz, the second speaker (702) is controlled to play audio at 5Hz-20Hz or 20KHz-40KHz, or; When the temperature of the heating element is determined to be greater than a set threshold and the first speaker (701) is not working, the first speaker (701) and / or the second speaker (702) are controlled to play audio at 5Hz-20Hz or 20KHz-40KHz.

Images