Surge protective device having surface-mount base and electronic device

Abstract

The present application provides a surge protective device having a surface-mount base and an electronic device. The surge protective device having a surface-mount base comprises: a surface-mount base having a bottom wall, wherein a first contact elastic piece and a second contact elastic piece are provided on the surface-mount base, the end of the first contact elastic piece close to the bottom wall has a first mounting plane parallel to the bottom wall, and the end of the second contact elastic piece close to the bottom wall has a second mounting plane parallel to the bottom wall; and a pluggable module having a first pin electrode and a second pin electrode, wherein one end of the first pin electrode is pluggably connected to the end of the first contact elastic piece away from the bottom wall, and one end of the second pin electrode is pluggably connected to the end of the second contact elastic piece away from the bottom wall. In the embodiments of the present application, the surface-mount base can be mounted onto a circuit board by means of a reflow soldering process, and after soldering is completed, the pluggable module is inserted into the surface-mount base, so that a tripping solder joint in the pluggable module does not melt, and tripping will not occur during the soldering process; moreover, product miniaturization is facilitated.

Description

Surface mount surge protectors and electronic equipment Technical Field

[0001] This application belongs to the field of electrical technology, and more specifically, relates to a surface mount surge protector and electronic device. Background Technology

[0002] A surge protector (SPD) is a device used to protect electronic equipment from voltage surges or transient overvoltages. It is widely used in power systems, communication equipment, and household appliances. Traditional surge protectors typically use a DIP (Dual In-line Package) form factor, which offers advantages such as simple structure and easy installation.

[0003] However, DIP-packaged surge protectors have some significant drawbacks in practical applications, specifically: When connecting a DIP-packaged surge protector to a circuit, excessively high temperatures at the pin electrodes during soldering can cause the tripping solder joints to melt, affecting the product's electrical connection and mechanical stability. This problem is particularly pronounced in high-density circuit boards or high-temperature environments, increasing the risk of product failure. Technical issues

[0004] One of the objectives of this application is to provide a patch-type base surge protector and electronic device. Technical solutions

[0005] The technical solution adopted in this application is as follows: Firstly, a surface-mount base surge protector is provided, comprising:

[0006] A patch-type base has a bottom wall, and a first contact spring and a second contact spring are provided on the patch-type base. The end of the first contact spring near the bottom wall has a first mounting plane parallel to the bottom wall, and the end of the second contact spring near the bottom wall has a second mounting plane parallel to the bottom wall.

[0007] The plug-in module has a first pin electrode and a second pin electrode. One end of the first pin electrode is plugged into and plugged into the end of the first contact spring away from the bottom wall, and one end of the second pin electrode is plugged into and plugged into the end of the second contact spring away from the bottom wall.

[0008] In an optional embodiment of the first aspect, the plug-in module includes a housing and a mounting base, the mounting base being disposed within the housing, the mounting base including a partition perpendicular to the bottom wall and a first top plate and a bottom plate parallel to the bottom wall;

[0009] The partition, the first top plate, and the bottom plate divide the space inside the outer shell into a first cavity and a second cavity that are opposite to each other, and a third cavity on the side of the first cavity and the second cavity away from the bottom wall.

[0010] The first cavity contains a varistor; the second cavity contains the other end of the first pin electrode and the other end of the second pin electrode; the third cavity contains a tripping electrode and a tripping mechanism.

[0011] In one alternative embodiment of the first aspect, the varistor has a first electrode and a second electrode, the first electrode extending into the third cavity, and the second electrode passing through the partition and located within the second cavity;

[0012] The other end of the first pin electrode is connected to one end of the tripping electrode via a wire;

[0013] The other end of the tripping electrode is welded to the first electrode;

[0014] The other end of the second pin electrode is connected to the second electrode;

[0015] The tripping mechanism is used to change the varistor from a first state to a second state, wherein the first state is a state in which the other end of the tripping electrode is in contact with the first electrode, and the second state is a state in which the other end of the tripping electrode is separated from the first electrode.

[0016] In one alternative embodiment of the first aspect, the tripping mechanism includes a tension spring, a compression spring, and a slider;

[0017] The tripping electrode is rotatably connected to the first top plate, one end of the tension spring is fixed to the first top plate, and the other end of the tension spring is connected to the tripping electrode;

[0018] The first top plate is provided with a slide rail, and the slider is slidably mounted on the slide rail;

[0019] The slider is provided with a first protrusion and a first limiting plate, and the first top plate is provided with a second limiting plate. The compression spring is located between the first limiting plate and the second limiting plate. In the first state, the first protrusion of the varistor abuts against the other end of the tripping electrode. In the second state, the first protrusion of the varistor is located between the tripping electrode and the first electrode.

[0020] In an optional embodiment of the first aspect, a first alarm electrode and a second alarm electrode are further included; the slider is also provided with a second protrusion extending into the second cavity;

[0021] One end of the first alarm electrode and one end of the second alarm electrode are located in the second cavity. When the piezoresistor is in the first state, one end of the first alarm electrode and one end of the second alarm electrode are in contact and abut against the second protrusion. When the piezoresistor is in the second state, one end of the first alarm electrode and one end of the second alarm electrode are separated.

[0022] The patch-type base is also provided with a third contact spring and a fourth contact spring that are pluggably connected to the other end of the first alarm electrode and the other end of the second alarm electrode.

[0023] In one optional embodiment of the first aspect, the third contact spring has a third mounting plane parallel to the bottom wall at one end near the bottom wall, and the fourth contact spring has a fourth mounting plane parallel to the bottom wall at one end near the bottom wall.

[0024] In one alternative embodiment of the first aspect, the housing has a second top plate disposed opposite to the first top plate; the second top plate is provided with a window, which is directly opposite the slider when the piezoresistor is in a first state; and directly opposite the slide rail when the piezoresistor is in a second state.

[0025] In one alternative embodiment of the first aspect, silicone is disposed within the first cavity.

[0026] In one alternative embodiment of the first aspect, the housing is snap-fitted to the mounting base.

[0027] In one alternative embodiment of the first aspect, the patch base has a first anti-detachment structure between it and the plug-in module.

[0028] In one alternative embodiment of the first aspect, the first anti-detachment structure includes a first buckle disposed on the plug-in module and a first slot disposed on the patch base and cooperating with the first buckle.

[0029] In an alternative embodiment of the first aspect, the first contact spring and the second contact spring have a second anti-detachment structure between them and the patch-type base.

[0030] In one optional embodiment of the first aspect, the patch-type base is provided with a first mounting hole and a second mounting hole, and the second anti-detachment structure includes a first boss disposed in the first mounting hole, a second boss disposed in the second mounting hole, a third slot disposed on the first contact spring and cooperating with the first boss, and a fourth slot disposed on the second contact spring and cooperating with the second boss.

[0031] In a second aspect, an electronic device is provided, comprising a patch-type base surge protector as described in any one of the first aspects. Beneficial effects

[0032] This application embodiment utilizes a reflow soldering process to mount the surface-mount base onto the circuit board. After soldering, the plug-in module is inserted into the surface-mount base, preventing the tripping solder joints within the plug-in module from melting and thus avoiding tripping during the soldering process. The reflow soldering process significantly improves production efficiency, reduces labor costs, and facilitates installation. The surface-mount base surge protector of this application embodiment can also increase the area of ​​the first and second mounting planes without increasing the product size, which is beneficial for product miniaturization. Furthermore, the larger area of ​​the first and second mounting planes allows the surface-mount base to withstand higher current surges, improving overall protection performance. The plug-in connection design between the plug-in module and the surface-mount base makes replacement and maintenance of the plug-in module more convenient, while effectively ensuring the stability of the electrical connection. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or exemplary technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 is a schematic diagram of the structure of the patch-type base surge protector provided in an embodiment of this application;

[0035] Figure 2 is a schematic diagram of the pluggable module provided in an embodiment of this application;

[0036] Figure 3 is an exploded view of the patch-type base provided in the embodiment of this application;

[0037] Figure 4 is a top view of the patch-type base provided in the embodiment of this application;

[0038] Figure 5 is a cross-sectional view along direction AA in Figure 4;

[0039] Figure 6 is an exploded structural diagram of the patch-type base surge protector provided in an embodiment of this application;

[0040] Figure 7 is a second exploded structural diagram of the patch-type base surge protector provided in the embodiment of this application;

[0041] Figure 8 is a top view of the housing assembly provided in an embodiment of this application;

[0042] Figure 9 is a cross-sectional view along the BB direction in Figure 8;

[0043] Figure 10 is a schematic diagram of the structure of the pluggable module with the outer shell removed according to an embodiment of this application;

[0044] Figure 11 is a schematic diagram of the structure of the pluggable module with the outer shell removed according to an embodiment of this application;

[0045] Figure 12 is a schematic diagram of the structure of the varistor provided in the embodiment of this application;

[0046] Figure 13 is a schematic diagram of the mounting base provided in an embodiment of this application;

[0047] Figure 14 is a schematic diagram of the structure of the mounting base provided in an embodiment of this application;

[0048] Figure 15 is a schematic diagram of the tripping electrode provided in an embodiment of this application;

[0049] Figure 16 is a schematic diagram of the slider provided in an embodiment of this application.

[0050] The following are the labeling elements in the figure:

[0051] 1-Patch type base, 101-Bottom wall, 102-Top wall, 103-First slot, 104-First mounting hole, 105-First boss, 106-Second mounting hole, 107-Second boss, 108-First positioning groove, 109-Third mounting hole, 110-Third boss, 111-Fourth mounting hole, 112-Fourth boss, 2-Mounting base, 201-Baffle, 202-First top plate, 203-Second buckle, 204-First support column, 20 5-Spindle, 206-Slide rail, 207-Second limiting plate, 208-First positioning post, 209-Baffle, 210-Second through hole, 211-Notch, 212-Second positioning post, 213-Base plate, 214-First clearance groove, 215-Second clearance groove, 216-Third clearance groove, 217-Fourth clearance groove, 218-Gap, 3-Outer shell, 301-First buckle, 302-Second slot, 303-Second top plate, 304-Window, 3 05-Support foot, 4-First pin electrode, 5-Second pin electrode, 6-Slider, 601-First protrusion, 602-Second protrusion, 603-First limiting plate, 7-Copper braided strip, 8-Varistor, 801-First electrode, 802-Second electrode, 803-First through hole, 804-Second positioning groove, 9-Trigger electrode, 901-Shaft hole, 902-Hook, 10-Compression spring, 11-Tension spring, 12-First alarm electrode, 13- Second alarm electrode, 14-plug module, 15-first contact spring, 151-first mounting plane, 152-third slot, 16-second contact spring, 161-second mounting plane, 162-fourth slot, 17-third contact spring, 171-third mounting plane, 172-fifth slot, 18-fourth contact spring, 181-fourth mounting plane, 182-sixth slot, 19-first cavity, 20-second cavity, 21-third cavity. Embodiments of the present invention

[0052] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0053] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two).

[0054] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0055] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0056] It should be understood that in the embodiments of this application, "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in the circuit structure are connected through physical lines that can transmit electrical signals, such as copper foil of a printed circuit board (PCB) or wires.

[0057] In the description of the embodiments of this application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0059] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0060] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments in any suitable manner.

[0061] Currently, when connecting traditional DIP (Dual In-line Package) surge protectors to circuits, excessively high temperatures at the pin electrodes during soldering can cause the tripping solder joints to melt, thus affecting the electrical connection and mechanical stability of the product. Therefore, this application presents a surface-mount base surge protector. Please refer to Figures 1-3. The patch-type surge protector includes: a patch base 1 with a bottom wall 101, a first contact spring 15 and a second contact spring 16 disposed on the patch base 1, the first contact spring 15 having a first mounting plane 151 parallel to the bottom wall 101 at one end, and the second contact spring 16 having a second mounting plane 161 parallel to the bottom wall 101 at one end; and a plug-in module 14 having a first pin electrode 4 and a second pin electrode 5, one end of the first pin electrode 4 being pluggable to the end of the first contact spring 15 away from the bottom wall 101, and one end of the second pin electrode 5 being pluggable to the end of the second contact spring 16 away from the bottom wall 101.

[0062] Referring to Figure 1, the bottom wall 101 of the surface mount base 1 is located in the plane of the ZO direction. When the surface mount base 1 is installed, the bottom wall 101 faces the circuit board.

[0063] It should be noted that the surface-mount base surge protector of this application differs from the soldering method of existing DIP surge protectors. Existing DIP surge protectors use wave soldering, while the surface-mount base surge protector of this application can use reflow soldering. Reflow soldering involves mounting the surface-mount base 1 onto the circuit board, melting the solder with high-temperature gas to achieve soldering, and then inserting the plug-in module 14 into the surface-mount base 1. Since only the surface-mount base 1 is exposed to the high-temperature gas during the soldering process, while the tripping solder joints inside the plug-in module 14 are not heated, the tripping solder joints inside the plug-in module 14 will not melt, thus preventing tripping during the soldering process. Furthermore, using reflow soldering can significantly improve production efficiency, reduce labor costs, and facilitate installation.

[0064] The surface mount surge protector of this application embodiment can increase the area of ​​the first mounting plane 151 and the second mounting plane 161 without increasing the product size, which is beneficial for product miniaturization. In addition, increasing the area of ​​the first mounting plane 151 and the second mounting plane 161 can make the surface mount base 1 more firmly soldered to the circuit board during reflow soldering, improving soldering reliability; the larger area of ​​the first mounting plane 151 and the second mounting plane 161 also enables the surface mount base 1 to withstand higher current surges, improving overall protection performance.

[0065] The pluggable module 14 and the surface mount base 1 are connected by a pluggable design, which makes the replacement and maintenance of the pluggable module 14 more convenient, and at the same time the stability of the electrical connection can be effectively guaranteed.

[0066] As an optional implementation, the patch base 1 and the plug-in module 14 have a first anti-detachment structure.

[0067] Specifically, referring to Figures 2 and 3, the first anti-detachment structure includes a first buckle 301 disposed on the plug-in module 14 and a first slot 103 disposed on the patch base 1 and cooperating with the first buckle 301. The first slot 103 is higher than the top wall 102 of the patch base 1. After the first buckle 301 is inserted into the first slot 103, a firm locking state is formed to prevent the plug-in module 14 from accidentally falling off.

[0068] Optionally, the plug-in module 14 is provided with a support foot 305 on the side of the top wall 102 near the surface mount base 1. The surface mount base 1 is provided with a first positioning groove 108 corresponding to the support foot 305. After the support foot 305 is inserted into the first positioning groove 108, the assembly firmness of the plug-in module 14 is further enhanced, which can prevent the first pin electrode 4 and the second pin electrode 5 from shaking in the first contact spring 15 and the second contact spring 16.

[0069] As an optional implementation, the first contact spring 15 and the second contact spring 16 have a second anti-detachment structure between them and the patch base 1.

[0070] Specifically, referring to Figures 2-5, the patch-type base 1 is provided with a first mounting hole 104 and a second mounting hole 106. The second anti-detachment structure includes a first boss 105 disposed in the first mounting hole 104, a second boss 107 disposed in the second mounting hole 106, a third slot 152 disposed on the first contact spring 15 and cooperating with the first boss 105, and a fourth slot 162 disposed on the second contact spring 16 and cooperating with the second boss 107. Through the assembly of the third slot 152 with the first boss 105 and the fourth slot 162 with the second boss 107, the first contact spring 15 and the second contact spring 16 will not loosen in the first mounting hole 104 and the second mounting hole 106, thereby improving the stability and safety of the electrical connection.

[0071] As an optional implementation, referring to Figures 6-9, the plug-in module 14 includes a housing 3 and a mounting base 2. The mounting base 2 is disposed inside the housing 3. The mounting base 2 includes a partition 201 perpendicular to the bottom wall 101, and a first top plate 202 and a bottom plate 213 parallel to the bottom wall 101. The partition 201, the first top plate 202, and the bottom plate 213 divide the space inside the housing 3 into a first cavity 19 and a second cavity 20 that are opposite to each other, and a third cavity 21 on the side of the first cavity 19 and the second cavity 20 away from the bottom wall 101. A varistor 8 is disposed in the first cavity 19. The other end of the first pin electrode 4 and the other end of the second pin electrode 5 are disposed in the second cavity 20. A tripping electrode 9 and a tripping mechanism are disposed in the third cavity 21.

[0072] Referring to Figure 6, the outer casing 3 is a box-shaped structure with an opening on one side. The opening side of the outer casing 3 is opposite to the top wall 102 of the patch-type base 1. The outer casing 3 is provided with a second slot 302, and the mounting base 2 is provided with a second buckle 203 that cooperates with the second slot 302. The mounting base 2 is fixed inside the outer casing 3 by the cooperation of the second buckle 203 and the second slot 302. The bottom plate 213, the partition plate 201, and the first top plate 202 of the mounting base 2 can be integrally formed.

[0073] This embodiment effectively isolates electrical interference and improves protection performance by placing the varistor 8 in the first cavity 19 and the first pin electrode 4 and the second pin electrode 5 in the second cavity 20.

[0074] As an optional implementation, referring to Figures 10 and 11, the varistor 8 has a first electrode 801 and a second electrode 802. The first electrode 801 extends into the third cavity 21, and the second electrode 802 passes through the partition 201 and is located in the second cavity 20. The other end of the first lead electrode 4 is connected to one end of the trip electrode 9 by a wire. The other end of the trip electrode 9 is soldered to the first electrode 801. The other end of the second lead electrode 5 is connected to the second electrode 802. The tripping mechanism is used to change the varistor 8 from a first state to a second state. The first state is when the other end of the trip electrode 9 is in contact with the first electrode 801, and the second state is when the other end of the trip electrode 9 is separated from the first electrode 801.

[0075] Referring to Figure 10, one end of the first pin electrode 4 and one end of the second pin electrode 5 pass through the base plate 213 of the mounting base 2 and are located outside the second cavity 20, for plugging and unplugging connection with the first contact spring 15 and the second contact spring 16. The other end of the first pin electrode 4 is located inside the second cavity 20 and is electrically connected to one end of the tripping electrode 9 through the copper braided strip 7.

[0076] Referring to Figure 11, a notch 211 is provided on the first top plate 202. The first electrode 801 of the varistor 8 extends through the notch 211 to the third cavity 21. A first through hole 803 is provided on the first electrode 801 (see Figure 12). The other end of the tripping electrode 9 passes through the first through hole 803 and is soldered to the first electrode 801 with tin. This soldering point is the tripping soldering point.

[0077] Referring to Figures 12 and 13, optionally, a second positioning groove 804 is provided on the varistor 8, and a second positioning post 212 that cooperates with the second positioning groove 804 is provided on the partition 201, so as to improve the stability and assembly accuracy of the varistor 8.

[0078] Referring to Figures 10 and 13, a second through hole 210 is provided on the partition 201, and the second electrode 802 passes through the second through hole 210 and is soldered to the other end of the second pin electrode 5 with tin.

[0079] After the varistor 8 is installed, silicone is poured into the first cavity 19 containing the varistor 8 for sealing, thus completing the encapsulation of the varistor 8.

[0080] The varistor 8 is a non-linear element whose resistance changes significantly with voltage. It can effectively absorb transient overvoltages and protect the circuit from damage. Under normal operating voltage, the varistor 8 maintains a high resistance state and is almost non-conductive. At this time, the varistor 8 is in the first state, that is, the other end of the trip electrode 9 is in contact with the first electrode 801. When the varistor 8 deteriorates or is subjected to overvoltage for a long time, the resistance of the varistor 8 decreases, rapidly discharging current to prevent voltage surges. During this process, the varistor 8 heats up, and the solder joint between the other end of the trip electrode 9 and the first electrode 801 melts. The varistor 8 switches to the second state, that is, the other end of the trip electrode 9 is separated from the first electrode 801, thereby cutting off the circuit and preventing damage to the equipment in the circuit.

[0081] As an optional implementation, referring to Figures 10 and 11, the tripping mechanism includes a tension spring 11, a compression spring 10, and a slider 6; the tripping electrode 9 is rotatably connected to the first top plate 202, one end of the tension spring 11 is fixed to the first top plate 202, and the other end of the tension spring 11 is connected to the tripping electrode 9; a slide rail 206 is provided on the first top plate 202, and the slider 6 is slidably disposed on the slide rail 206; a first protrusion 601 and a first limiting plate 603 are provided on the slider 6, and a second limiting plate 207 is provided on the first top plate 202, with the compression spring 10 located between the first limiting plate 603 and the second limiting plate 207; in the first state, the first protrusion 601 of the varistor 8 abuts against the other end of the tripping electrode 9, and in the second state, the first protrusion 601 of the varistor 8 is located between the tripping electrode 9 and the first electrode 801.

[0082] Referring to Figures 14 and 15, a rotating shaft 205 is provided on the first top plate 202, and a shaft hole 901 that cooperates with the rotating shaft 205 is provided on the tripping electrode 9. The tripping electrode 9 is connected to the rotating shaft 205 through the shaft hole 901.

[0083] Referring to Figures 14 and 15, a first support column 204 is also provided on the first top plate 202. One end of the tension spring 11 is sleeved on the first support column 204. A hook 902 is provided on the trip electrode 9. The other end of the tension spring 11 is sleeved on the hook 902. When the varistor 8 is in the first state, the tension spring 11 remains in the stretched state.

[0084] Referring to Figures 14 and 16, a set of parallel slide rails 206 are provided on the first top plate 202, and the slider 6 can slide along the slide rails 206. A gap 218 is formed in the middle of the set of parallel slide rails 206, and the compression spring 10 is located in this gap 218. A first limiting plate 603 is located at the end of the gap 218 near the first electrode 801, and a second limiting plate 207 is located at the end of the gap 218 away from the first electrode 801. The compression spring 10 is located between the first limiting plate 603 and the second limiting plate 207. In the first state, the varistor 8 is in a compressed state, and the first protrusion 601 is pressed against the tripping electrode 9. When the varistor 8 experiences an overvoltage, causing it to heat up, the solder joint between the other end of the tripping electrode 9 and the first electrode 801 becomes detached. Under the tension of the tension spring 11, the tripping electrode 9 rotates clockwise around the pivot 205 as shown in Figure 10, and the other end of the tripping electrode 9 disengages from the first through hole 803 of the first electrode 801. Under the elastic force of the compression spring 10, the first protrusion 601 of the slider 6 moves along the slide rail 206, thereby engaging between the first electrode 801 and the other end of the tripping electrode 9. The first protrusion 601 cuts off the small current arc, achieving safe tripping failure. Optionally, a baffle 209 is also provided on the first top plate 202. The baffle 209 is located on the side of the first electrode 801 away from the slide rail 206 to prevent the slider 6 from moving excessively.

[0085] As an optional implementation, referring to Figures 6 and 7, the patch-type base surge protector of this application embodiment further includes a first alarm electrode 12 and a second alarm electrode 13; the slider 6 is also provided with a second protrusion 602 extending into the second cavity 20; one end of the first alarm electrode 12 and one end of the second alarm electrode 13 are located in the second cavity 20. In the first state of the varistor 8, one end of the first alarm electrode 12 and one end of the second alarm electrode 13 are in contact with and abut against the second protrusion 602; in the second state of the varistor 8, one end of the first alarm electrode 12 and one end of the second alarm electrode 13 are separated. The patch-type base 1 is also provided with a third contact spring 17 and a fourth contact spring 18 that are pluggably connected to the other end of the first alarm electrode 12 and the other end of the second alarm electrode 13.

[0086] Referring to Figure 14, multiple positioning posts 208 can be provided on the partition 201 located in the second cavity 20 for positioning the two alarm electrodes located in the second cavity 20. The base plate 213 of the mounting base 2 is also provided with a first clearance groove 214 for one end of the first pin electrode 4 to pass through, a second clearance groove 215 for one end of the second pin electrode 5 to pass through, a third clearance groove 216 for the other end of the first alarm electrode 12 to pass through, and a fourth clearance groove 217 for the other end of the second alarm electrode 13 to pass through.

[0087] Referring to Figure 10, when the varistor 8 is in the first state, one end of the first alarm electrode 12 and one end of the second alarm electrode 13 are in contact with and abut against the second protrusion 602, achieving remote signal closure and the alarm system operates normally. When the varistor 8 changes to the second state, the first alarm electrode 12 and the second alarm electrode 13 separate, the closed circuit is broken, achieving remote signal open circuit, the alarm system triggers an alarm signal, indicating equipment abnormality, ensuring timely handling, and preventing safety accidents.

[0088] Referring to Figure 3, the patch-type base 1 is further provided with a third mounting hole 109 for mounting the third contact spring 17 and a fourth mounting hole 111 for mounting the fourth contact spring 18. Optionally, a third boss 110 is also provided on the side wall of the third mounting hole 109, and a fifth slot 172 that mates with the third boss 110 is also provided on the third contact spring 17. A fourth boss 112 is provided on the side wall of the fourth mounting hole 111, and a sixth slot 182 that mates with the fourth boss 112 is provided on the fourth contact spring 18. Through the assembly of the fifth slot 172 with the third boss 110 and the sixth slot 182 with the fourth boss 112, the third contact spring 17 and the fourth contact spring 18 will not loosen in the third mounting hole 109 and the fourth mounting hole 111, thereby improving the stability and safety of the electrical connection.

[0089] As an optional implementation, referring to FIG1, the third contact spring 17 has a third mounting plane 171 parallel to the bottom wall 101 at one end near the bottom wall 101, and the fourth contact spring 18 has a fourth mounting plane 181 parallel to the bottom wall 101 at one end near the bottom wall 101.

[0090] This embodiment increases the contact area between the third contact spring 17 and the fourth contact spring 18 and the circuit board by setting the third mounting plane 171 and the fourth mounting plane 181 on the third contact spring 17 and the fourth contact spring 18, and can achieve a firm soldering with the circuit board through the reflow soldering process.

[0091] As an optional implementation, referring to Figures 8 and 9, the outer casing 3 has a second top plate 303 disposed opposite to the first top plate 202; a window 304 is provided on the second top plate 303, and when the pressure-sensitive resistor 8 is in the first state, the window 304 is directly opposite to the slider 6; when the pressure-sensitive resistor 8 is in the second state, the window 304 is directly opposite to the slide rail 206.

[0092] Optionally, slider 6 is green and slide rail 206 is red. When varistor 8 is in the second state, it will appear red in window 304, indicating that varistor 8 needs to be replaced. Furthermore, the color difference design between slider 6 and slide rail 206 facilitates quick identification of equipment status by operators, avoids misjudgment, and ensures maintenance efficiency.

[0093] This embodiment achieves dual warnings through the setting of alarm electrodes and window 304, triggering an alarm through electrical signals and displaying visual prompts intuitively, further improving the reliability of equipment safety management.

[0094] This application also provides an electronic device that includes the above-described patch-type base surge protector.

[0095] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

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