Imaging apparatus and imaging device

Abstract

Provided are an imaging apparatus (100) and an imaging device (1000). The imaging apparatus (100) comprises: a first housing (10), a sensing layer (20), and a sound source plate (30). The first housing (10) defines a first accommodating cavity (Q1). The first housing (10) is provided with a first opening (K1) and a second opening (K2) in communication with the first accommodating cavity (Q1), and the first opening (K1) and the second opening (K2) are opposite to each other in a first direction (X). The sensing layer (20) covers the first opening (K1), and the sensing layer (20) is a flexible structure. The sound source plate (30) covers the second opening (K2). An emission sound source (31) is arranged on the sound source plate (30), and an acoustic radiation surface (S1) of the sound source plate (30) faces the sensing layer (20). The sound source plate (30) is a rigid structure, and in the first direction (X), there is spacing between the sensing layer (20) and the acoustic radiation surface (S1). The first direction (X) is perpendicular to the acoustic radiation surface (S1).

Description

Imaging devices and imaging equipment Technical Field

[0001] This disclosure relates to the field of ultrasound imaging technology, and in particular to an imaging device and imaging equipment. Background Technology

[0002] Ultrasound imaging technology uses ultrasound waves to scan the inside of the human body, obtaining clear images that help doctors detect lesions, assess conditions, and develop treatment plans. With the continuous advancement of medical technology, ultrasound imaging technology is also constantly developing and improving. Summary of the Invention

[0003] On one hand, an imaging device is provided. The imaging device includes: a first housing, a sensing layer, and a sound source plate. The first housing forms a first receiving cavity, and the first housing has a first opening and a second opening communicating with the first receiving cavity, the first opening and the second opening being opposite to each other in a first direction. The sensing layer covers the first opening and is a flexible structure. The sound source plate covers the second opening, and the sound source plate is provided with a sound emission source, and the sound radiation surface of the sound source plate faces the sensing layer; the sound source plate is a rigid structure, and there is a gap between the sensing layer and the sound radiation surface along the first direction; the first direction is perpendicular to the sound radiation surface.

[0004] In some embodiments, the first housing includes a first side plate, a first bottom plate, and a support portion; a first end of the first side plate in the first direction forms the first opening; a second end of the first side plate in the first direction is connected to the first bottom plate, such that the first side plate and the first bottom plate form the first receiving cavity; the first bottom plate is provided with a second opening; a first end of the support portion is connected to the first end of the first side plate, the support portion surrounds the first opening, and a second end of the support portion extends along a preset direction; the preset direction is perpendicular to the first direction, and the preset direction is any direction radiating from the center of the first opening to the periphery of the first opening; the edge of the sensing layer is disposed on the support portion.

[0005] In some embodiments, the device further includes: a limiting member disposed on the edge of the sensing layer away from the support portion and surrounding the first opening; the limiting member, the sensing layer, and the support portion are connected.

[0006] In some embodiments, the limiting member has a first through hole, the sensing layer has a second through hole, and the supporting part has a first fixing hole; the imaging device further includes: a first fixing member, which passes through the first through hole, the second through hole and the first fixing hole to connect the limiting member, the sensing layer and the supporting part.

[0007] In some embodiments, the first housing further includes a connecting portion and an extension portion; the connecting portion surrounds the supporting portion, and the extension portion surrounds the connecting portion; the connecting portion is connected between the second end of the supporting portion and the extension portion, and the extension portion extends along the preset direction; along the first direction, the distance from the extension portion to the sound source plate is greater than the distance from the supporting portion to the sound source plate, so that the extension portion, the connecting portion, and the supporting portion form a groove; the sensing layer and the limiting member are disposed in the groove.

[0008] In some embodiments, the connecting portion is provided with a third opening; the imaging device further includes a circuit board, one end of which is electrically connected to the sensing layer, and the other end of which passes sequentially through the third opening between the support portion and the limiting member.

[0009] In some embodiments, the first housing further includes an extension platform, one end of which is connected to a portion of the support portion exposed in the third opening, and the other end extends along the preset direction; a portion of the circuit board is disposed on the surface of the extension platform.

[0010] In some embodiments, it further includes: a first adhesive layer disposed between the extension platform and the circuit board.

[0011] In some embodiments, the surface of the limiting member away from the sound source plate is lower than the surface of the extension portion away from the sound source plate relative to the sound source plate; or, the surface of the limiting member away from the sound source plate is flush with the surface of the extension portion away from the sound source plate.

[0012] In some embodiments, the connection between the connecting portion and the extension portion is a rounded transition.

[0013] In some embodiments, the limiting member includes a first portion and a second portion; the first portion overlaps with the bearing portion in the first direction; the second portion surrounds the first portion and is connected to the first portion, and the second portion extends along the preset direction.

[0014] In some embodiments, the device further includes a circuit board, one end of which is electrically connected to the sensing layer, and the other end of which extends through the space between the carrier and the limiting member.

[0015] In some embodiments, the surface of the carrier portion facing the sensing layer is provided with a first groove, the first groove surrounding the first opening; the imaging device further includes a first sealing ring disposed within the first groove.

[0016] In some embodiments, the surface of the carrier portion facing the sensing layer is further provided with a second groove, the second groove being disposed on the side of the first groove away from the first opening and surrounding the first opening; the imaging device further includes: a second sealing ring disposed in the second groove.

[0017] In some embodiments, the first fixing hole is disposed between the first sealing ring and the second sealing ring.

[0018] In some embodiments, the first sealing ring is provided with a third through hole, and the first fixing member passes through the first through hole, the second through hole, the three-way hole and the first fixing hole to connect the limiting member, the sensing layer, the first sealing ring and the bearing portion.

[0019] In some embodiments, there is a gap between the side of the first sealing ring away from the first opening and the side of the first groove away from the first opening; the imaging device further includes: a sealant layer filling the gap and surrounding the first sealing ring.

[0020] In some embodiments, a portion of the bottom of the first groove is recessed to form a third groove, the dimension of the third groove along the preset direction is smaller than the dimension of the first groove along the preset direction, and the third groove surrounds the first opening; a portion of the first sealing ring is located within the third groove.

[0021] In some embodiments, the first receiving cavity is filled with coupling fluid.

[0022] In some embodiments, the sound source plate further includes a fixing plate, the edge of which is connected to the first base plate and the fixing plate blocks the second opening; the fixing plate is provided with a plurality of first openings, the emitting end of the sound source extends into the first opening and is connected to the fixing plate, and the non-emitting end of the sound source extends away from the first receiving cavity.

[0023] In some embodiments, the first base plate is provided with a second fixing hole, and the fixing plate is provided with a fourth through hole; the imaging device further includes a second fixing member, which passes through the fourth through hole and the second fixing hole to connect the fixing plate to the first base plate.

[0024] In some embodiments, the system further includes: a second housing, the second housing including a second side plate and a second bottom plate; one end of the second side plate is connected to the second bottom plate, and the other end of the second side plate is connected to the first housing, so that the second side plate and the second bottom plate form a second receiving cavity; the sound source plate is disposed in the second receiving cavity.

[0025] In some embodiments, the sound source plate further includes a fixing plate, the non-emitting end of the sound source is connected to the fixing plate, and the emitting end of the sound source extends toward the first receiving cavity; the imaging device further includes: a second housing, the second housing including a second side plate and a second bottom plate, one end of the second side plate being connected to the second bottom plate, and the other end of the second side plate being connected to the first housing, so that the second side plate and the second bottom plate form a second receiving cavity; the sound source plate is disposed in the second receiving cavity, and the fixing plate is connected to the second bottom plate.

[0026] In some embodiments, the sound source plate further includes a third side plate; one end of the third side plate is connected to the fixing plate, and the other end of the third side plate abuts against the first base plate, so that the third side plate and the fixing plate form a third receiving cavity; the third receiving cavity is connected to the first receiving cavity, and the coupling fluid is also filled in the third receiving cavity.

[0027] In some embodiments, the sound source board further includes a third side plate and an encapsulation layer; one end of the third side plate is connected to the fixing plate, and the encapsulation layer blocks the opening formed by the other end of the third side plate and the second opening; the encapsulation layer is provided with a plurality of second openings, and the emitting end of the sound source extends into the second openings.

[0028] In some embodiments, a first connecting structure is provided at one end of the first housing near the second housing, and a second connecting structure is provided at one end of the second side plate of the second housing near the first housing, wherein the first connecting structure and the second connecting structure are connected.

[0029] In some embodiments, the second side plate of the second housing is further provided with a wire passage groove for signal lines connected to the sound source board to pass through; the wire passage groove and the second connection structure are spaced apart along the circumference of the second housing.

[0030] In some embodiments, the first base plate has a fourth groove on the side away from the sensing layer, the fourth groove surrounding the second opening; the imaging device further includes a fourth sealing ring disposed in the fourth groove.

[0031] In some embodiments, the first base plate is provided with an injection port, which is in communication with the first receiving cavity.

[0032] In some embodiments, the sound source includes a first sound source configured to emit a first ultrasonic wave and a second ultrasonic wave in a time-division manner; or, the sound source includes a first sound source and a second sound source, the first sound source being configured to emit a first ultrasonic wave and the second sound source being configured to emit a second ultrasonic wave; the first ultrasonic wave and the second ultrasonic wave have different frequencies.

[0033] In some embodiments, the sensing layer includes a first sensor configured to receive the first ultrasonic wave and the second ultrasonic wave in a time-division manner; or, the sensing layer includes a first sensor and a second sensor, the first sensor being configured to receive the first ultrasonic wave and the second sensor being configured to receive the second ultrasonic wave.

[0034] On the other hand, an imaging device is provided. The imaging device includes an imaging apparatus and a processor as described in any of the above embodiments, the processor being electrically connected to the sensing layer. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0036] Figure 1 is a cross-sectional structural diagram of an imaging device according to some embodiments;

[0037] Figure 2 is a structural diagram of the imaging device according to some embodiments before it is attached to a human body;

[0038] Figure 3 is a structural diagram of the imaging device according to some embodiments after it is attached to a human body;

[0039] Figure 4 is a top view of the imaging device in Figure 1;

[0040] Figure 5 is a structural diagram of the sensing layer in an imaging device according to some embodiments;

[0041] Figure 6 is a structural diagram of the sensing layer in an imaging apparatus according to some other embodiments;

[0042] Figure 7 is a structural diagram of the sensing layer in an imaging apparatus according to some other embodiments;

[0043] Figure 8 is a partial structural diagram of the imaging device in Figure 1 at point M;

[0044] Figure 9 is a partial structural diagram of the imaging device in Figure 1 at point N;

[0045] Figure 10 is a top view of the first housing in an imaging device according to some embodiments;

[0046] Figure 11 is a bottom view of the first housing in an imaging device according to some embodiments;

[0047] Figure 12 is an exploded view of an imaging apparatus according to some other embodiments;

[0048] Figure 13 is a cross-sectional structural diagram of an imaging device according to some other embodiments;

[0049] Figure 14 is a partial structural diagram of an imaging apparatus according to some other embodiments;

[0050] Figure 15 is a partial structural diagram of an imaging device according to some other embodiments;

[0051] Figure 16 is an exploded view of an imaging apparatus according to some other embodiments;

[0052] Figure 17 is a structural diagram of the second housing in an imaging apparatus according to some embodiments;

[0053] Figure 18 is a cross-sectional structural diagram of an imaging device according to some other embodiments;

[0054] Figure 19 is a cross-sectional structural diagram of an imaging device according to some other embodiments;

[0055] Figure 20 is a cross-sectional structural diagram of an imaging device according to some other embodiments;

[0056] Figure 21 is a structural diagram of an imaging device according to some embodiments. Detailed Implementation

[0057] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0058] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0059] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0060] In describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be interpreted broadly; for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0061] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0062] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0063] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0064] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0065] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0066] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0067] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0068] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0069] Ultrasound imaging devices are an indispensable high-tech tool in modern medical diagnostics, and their importance is increasingly prominent. An ultrasound imaging device typically consists of two main parts: a sound source plate and a sensing layer. The sound sources mounted on the sound source plate are the sources of ultrasonic waves, and these sound sources can precisely control the direction and intensity of the emitted ultrasonic waves.

[0070] The working principle of an ultrasound imaging device is as follows: A sound source emits ultrasound waves into the human body. As these waves penetrate human tissue, their propagation speed and reflection characteristics differ significantly in media of different densities. Therefore, when these waves encounter tissue interfaces, reflection, refraction, and scattering occur. The reflected ultrasound waves return along their original path to the sensing layer. The sensing layer efficiently converts the received ultrasound signals into electrical signals. These electrical signals undergo a series of complex processing steps, including amplification, filtering, and digitization, ultimately generating ultrasound image information. Because ultrasound waves have different propagation speeds and reflection characteristics in tissues of different densities, these reflected ultrasound waves carry structural information about the internal tissues, resulting in images with different grayscale levels, providing doctors with intuitive visual diagnostic information.

[0071] When using ultrasound imaging devices for large-area imaging detection on the human body surface (such as complex-shaped areas like the abdomen and waist), a series of challenges arise. These challenges mainly stem from the structural design of the sound source plate and the sensing layer, as well as the irregularities of the human body surface. In pursuing a more comfortable and snug fit, if both the sound source plate and the sensing layer are flexible structures, the irregularities of the human body surface often cause the plane containing the sound source plate to deform due to pressure or stretching after the ultrasound imaging device is worn. This makes it impossible to accurately calculate the absolute position of the sensing layer. Without accurate calculation of the sensing layer's position, it's impossible to accurately calculate the path of the ultrasound waves emitted from the sound source within the body and the location where they are reflected back by tissues. This inaccuracy further affects the accuracy and reliability of imaging, potentially leading to blurred images, increased artifacts, and even the inability to identify critical structures or lesions. Conversely, if both the sound source plate and the sensing layer are rigid structures, the poor deformability of rigid structures results in poor adhesion between the sensing layer and the human body surface. Ultrasound waves may not be able to fully penetrate the body, leading to insufficient imaging depth and severely impacting the accuracy and reliability of ultrasound imaging.

[0072] To address the aforementioned technical problems, embodiments of this disclosure provide an imaging device 100. Referring to FIG1, the imaging device 100 includes: a first housing 10, a sensing layer 20, and a sound source plate 30. The first housing 10 forms a first receiving cavity Q1, and the first housing 10 has a first opening K1 and a second opening K2 communicating with the first receiving cavity Q1. The first opening K1 and the second opening K2 are opposite to each other in a first direction X. The sensing layer 20 covers the first opening K1 and is a flexible structure. The sound source plate 30 covers the second opening K2, and a sound emission source 31 is provided on the sound source plate 30, with the sound radiation surface S1 of the sound source plate 30 facing the sensing layer 20; the sound source plate 30 is a rigid structure, and there is a gap between the sensing layer 20 and the sound radiation surface S1 along the first direction X.

[0073] The sound source plate 30 is provided with multiple sound emitting sources 31, each of which has a transmitting end. The transmitting end is a component in the sound source 31 that emits ultrasonic waves, and the transmitting end is located on the side of the sound source 31 facing the sensing layer 20. The end faces of the transmitting ends of the multiple sound emitting sources 31 form a sound radiation surface S1. The first direction X is perpendicular to the sound radiation surface S1.

[0074] The imaging device 100 provided in this embodiment, as shown in Figures 2 and 3, features a flexible sensing layer 20 that can maintain close contact with the measurement area of ​​the human body P as the measurement area deforms. This close contact is beneficial in preventing gaps between the sensing layer 20 and the measurement area of ​​the human body P, avoiding signal discontinuity or instability during transmission, reducing measurement errors, and improving the accuracy and reliability of imaging. The sound source plate 30 is equipped with a sound source 31, and the sound source plate 30 is a rigid structure. Because rigid structures are not easily deformed under external forces, the position of the sound source 31 and the direction of sound radiation remain constant during measurement. Based on this, by obtaining the time it takes for the sound wave emitted by the sound source 31 to reach the sensing layer 20, and combining this with the sound velocity of the sound wave emitted by the sound source 31, the distance from the sound source 31 to the sensing layer 20 can be calculated. This allows for accurate calculation of the absolute position of the sensing layer 20, thereby avoiding measurement errors caused by changes in the position of the sound source 31 during measurement. Therefore, the imaging device 100 provided in this embodiment has high imaging accuracy and reliability.

[0075] Secondly, since the first housing 10 is provided with a first opening K1 and a second opening K2 that communicate with the first receiving cavity Q1, the sensing layer 20 covers the first opening K1, and the sound source plate 30 covers the second opening K2. Along the first direction X, there is a gap between the sensing layer 20 and the sound radiation surface S1. This not only provides space for the deformation of the sensing layer 20, but also increases the area covered by the sound waves emitted by the sound source 31 to the sensing layer 20. In this way, the sensing layer 20 can collect more signals, which helps to improve the imaging quality of the imaging device 100.

[0076] Furthermore, since the sensing layer 20 is a flexible structure, the material itself has excellent extensibility and resilience, and can deform with the natural curves and movements of the human body, thus conforming to the body contours of different users. In this way, users will not feel restricted or uncomfortable when wearing the device.

[0077] Furthermore, in the imaging device 100 provided in this embodiment, the sensing layer 20 and the sound source plate 30 are designed to be separate from each other. This not only helps to reduce electromagnetic interference between the sensing layer 20 and the sound source plate 30, avoiding affecting the emission efficiency of the sound source plate 30 and the reception efficiency of the sensing layer 20, but also facilitates the adjustment and optimization of the structure of the emitting sound source 31 and the sensing layer 20, such as their shape, size, and arrangement. This allows for an increase in the emission sensitivity of the emitting sound source 31 and the reception sensitivity of the sensing layer 20 to sound waves, thereby further enhancing the overall sensitivity of the imaging device 100. Moreover, this arrangement can also improve the depth of tissue imaging, ensuring that imaging is not limited to the skin surface.

[0078] Therefore, the imaging device 100 provided in this embodiment not only has high accuracy and reliability, but also wearability.

[0079] The use of multiple sound sources 31 allows for independent adjustment of their emission parameters (such as amplitude and frequency), enabling flexible adaptation to different imaging needs and individual patient differences. Furthermore, the combined effect of multiple sound sources 31 enhances the coverage of sound waves within the sensing layer 20, ensuring that all parts of the target area can be effectively detected. When multiple sound sources 31 operate simultaneously, their emitted ultrasound waves superimpose within the target area, forming a denser and more uniform sound field. This ensures that any part of the target area can be effectively detected, improving the integrity and reliability of the imaging device 100.

[0080] Using multiple sound emission sources 31 also helps to improve the imaging speed and resolution of the imaging device 100. Since the ultrasonic waves emitted by multiple sound emission sources 31 have a wider coverage area, each imaging session can cover a larger area, thereby reducing the number of scans and the time required. At the same time, by finely adjusting the parameters of each sound emission source 31, the sound field distribution can be further optimized, reducing interference and noise, and improving the clarity of the imaging device 100.

[0081] When calculating the position of the sensing layer 20, the spatial coordinates of a certain position of the sensing layer 20 can be determined by at least three non-collinear sound emission sources 31. For example, the spatial coordinates of a certain position of the sensing layer 20 can be determined by four, five, or seven non-collinear sound emission sources 31. An even greater number of non-collinear sound emission sources 31 can also be used to determine the spatial coordinates of a certain position of the sensing layer 20.

[0082] The more sound sources 31 there are, the more non-collinear sound sources 31 can be used to emit ultrasonic waves from multiple angles and positions to obtain more position information. This position information can be used to correct or verify previous measurement results, thereby reducing the measurement error of the position of the sensing layer 20 and making the spatial coordinates of a certain position of the sensing layer 20 more accurate, which in turn helps to improve the imaging quality of the imaging device 100.

[0083] In some embodiments, multiple sound sources 31 are spaced apart and uniformly arranged on the sound source plate 30, for example, multiple sound sources 31 are arranged in an array on the sound source plate 30. This allows the sound waves emitted by the multiple sound sources 31 to cover a larger area, and the sound waves emitted by the sound sources 31 can complement each other, which helps to reduce sound wave blind zones, thereby improving the integrity and accuracy of the imaging by the imaging device 100. Secondly, it also ensures that the sound waves propagate uniformly throughout the target area, avoiding situations where the sound waves are too strong in some areas and too weak in others, thereby improving the uniformity and quality of the imaging by the imaging device 100.

[0084] Referring again to Figure 1, along the first direction X, multiple sound sources 31 are located within the boundary of the second opening K2. In this way, the sound waves emitted by the sound sources 31 will not be obstructed by the first housing 10 during propagation. The sound waves can be emitted directly from the boundary enclosed by the second opening K2, which can reduce the interference of the first housing 10 on the propagation of the sound waves, thereby improving the accuracy and clarity of the imaging device 100.

[0085] In some embodiments, the sound source 31 includes a first sound source configured to emit a first ultrasonic wave and a second ultrasonic wave in a time-division manner.

[0086] For example, the first sound source first emits a first ultrasonic wave, and immediately after emitting the first ultrasonic wave, the first sound source emits a second ultrasonic wave. Alternatively, after emitting the first ultrasonic wave, the first sound source emits the second ultrasonic wave after a certain interval.

[0087] For example, the first sound source first emits a second ultrasonic wave, and immediately after emitting the second ultrasonic wave, the first sound source emits a first ultrasonic wave. Alternatively, after emitting the second ultrasonic wave, the first sound source emits the first ultrasonic wave after a certain interval.

[0088] The first and second ultrasonic waves have different frequencies. For example, the first ultrasonic wave is used to detect the shape of the sensing layer 20, while the second ultrasonic wave is used for human tissue imaging. Because the sensing layer 20 is a flexible structure, it can completely adhere to the human body surface during ultrasonic testing. The first ultrasonic wave, detecting the shape of the sensing layer 20, is essentially detecting the shape of the human body surface. Furthermore, since the sensing layer 20 is completely adhered to the human body surface, the second ultrasonic wave emitted by the sound source 31 can directly reach the human body after passing through the sensing layer 20. It is then reflected back to the sensing layer 20 by tissues of different densities within the human body to create an image of the internal tissues. This process only detects the propagation path and reflection location of the second ultrasonic wave within the human body, without interference from other media (primarily the air between the sensing layer 20 and the human body surface). Finally, the detected shape of the human body surface, combined with the propagation path and reflection location of the second ultrasonic wave within the human body, yields an image of the internal tissues.

[0089] Since the ultrasonic waves used to detect the shape of the sensing layer 20 and the ultrasonic waves used for human tissue imaging detection come from the same sound source 31, the propagation paths of the two ultrasonic waves emitted by the sound source 31 located in the same position are closer, thereby reducing the error caused by the positional difference between the sensing layer 20 and the human tissue. This not only improves the imaging accuracy of the imaging device 100, but also reduces the complexity of the sound source 31, thereby reducing production and maintenance costs.

[0090] For example, the frequency of the second ultrasound is greater than that of the first ultrasound. Since the second ultrasound is used for imaging detection of human tissue, the higher frequency of the second ultrasound can provide finer image details, helping doctors to see the tiny structures inside the human body more clearly, thereby improving the accuracy of diagnosis.

[0091] For example, the frequency of the first ultrasound is 1MHz, 1.2MHz, or 1.5MHz, and the frequency of the second ultrasound is 5MHz, 5.2MHz, or 5.8MHz.

[0092] In other embodiments, referring to Figures 2 or 3, the sound source 31 includes a first sound source 311 and a second sound source 312. The first sound source 311 is configured to emit a first ultrasonic wave, and the second sound source 312 is configured to emit a second ultrasonic wave. The first ultrasonic wave is used to detect the shape of the sensing layer 20, and the second ultrasonic wave is used for human tissue imaging detection. Since the first sound source 311 and the second sound source 312 are independent of each other, the second sound source 312 can emit the second ultrasonic wave while the first sound source 311 emits the first ultrasonic wave. This not only helps to save the detection time of the imaging device 100 but also improves the imaging speed of the imaging device 100.

[0093] In some embodiments, referring to Figures 4 and 5, the sensing layer 20 includes a sensing area AA and a border area BB, the border area BB surrounding the sensing area AA, and the sensing layer 20 includes a first sensor 201 located in the sensing area AA. The first sensor 201 is configured to receive a first ultrasonic wave and a second ultrasonic wave in a time-division multiplexing manner.

[0094] For example, the first sensor 201 first receives the first ultrasonic wave, and after receiving the first ultrasonic wave, the first sensor 201 immediately receives the second ultrasonic wave. Alternatively, after receiving the first ultrasonic wave, the first sensor 201 receives the second ultrasonic wave after a certain interval.

[0095] For example, the first sensor 201 first receives the second ultrasonic wave, and after receiving the second ultrasonic wave, the first sensor 201 immediately receives the first ultrasonic wave. Alternatively, after receiving the second ultrasonic wave, the first sensor 201 receives the first ultrasonic wave after a certain interval.

[0096] Referring again to Figure 4, using a single sensor not only reduces costs but also allows for a greater number of sensing units 2010 to be placed within the limited area of ​​the sensing layer 20, increasing the coverage area of ​​the sensing units 2010. This not only increases the area for receiving the first and second ultrasonic waves but also improves the imaging resolution of the first sensor 201, thereby improving image quality. Because the area covered by the first sensor 201 is increased, the imaging device 100 can capture more data, which helps improve the accuracy and clarity of the imaging device. Referring to Figure 5, the sensing layer 20 also includes a pixel circuit 22 for reading the electrical signals in the first sensor 201. When the first sensor 201 receives the first and second ultrasonic waves in a time-division manner, the pixel circuit 22 also reads the electrical signals used for human tissue imaging detection and the electrical signals used to calculate the shape of the sensing layer 20 in a time-division manner. That is, the pixel circuit used for human tissue imaging detection and the pixel circuit used to calculate the shape of the sensing layer 20 are the same circuit. This not only simplifies the fabrication process of the sensing layer 20 but also saves costs.

[0097] Referring to Figure 4, the sensing area AA is provided with multiple sensing units 2010. The multiple sensing units 2010 are arranged in an array in the sensing area AA.

[0098] Referring to Figures 4 and 5, the sensing unit 2010 includes a piezoelectric unit 210 and a pixel circuit 22 connected to the piezoelectric unit 210. After receiving a first ultrasonic wave, the piezoelectric unit 210 generates and outputs an electrical signal. This electrical signal can be further processed and analyzed for detecting the shape of the sensing layer 20. After receiving a second ultrasonic wave, the piezoelectric unit 210 generates and outputs an electrical signal. This electrical signal can be further processed and analyzed for human tissue imaging.

[0099] Referring to Figure 5, when the sensing layer 20 includes only one type of sensor, the sensing layer 20 includes a substrate 21, a pixel circuit layer V1, a piezoelectric transducer layer V2, and a protective layer 26 stacked sequentially.

[0100] The substrate 21 is made of polyimide (PI), and in other embodiments, the substrate 21 may also be made of other flexible materials. This allows the sensing layer 20 to fit closely to the human body surface when the imaging device 100 is worn, thereby improving imaging accuracy and wearing comfort.

[0101] The pixel circuit layer V1 includes pixel circuits 22 formed by conductive layers and insulating layers 27 located between the conductive layers.

[0102] The piezoelectric transducer layer V2 includes a first electrode 23, a second electrode 25, and a piezoelectric layer 24 located between the first electrode 23 and the second electrode 25. The first electrode 23 is closer to the substrate 21 than the second electrode 25. The first electrode 23 is an electrode block arranged in a matrix, and the second electrode 25 is a continuous electrode covering an entire surface. A piezoelectric unit 210 is formed by a first electrode 23, the piezoelectric layer 24, and the second electrode 25 disposed opposite to the first electrode 23.

[0103] The piezoelectric transducer layer V2 also includes a dielectric layer 28 located between adjacent first electrodes 23 for insulating adjacent first electrodes 23.

[0104] Here, the piezoelectric layer 24 and the second electrode 25 disposed opposite to the first electrode 23 refer to the piezoelectric layer 24 and the second electrode 25 that overlap with the first electrode 23 in the thickness direction of the substrate 21.

[0105] The material of the first electrode 23 includes silver (Ag) or indium tin oxide (ITO); in other embodiments, the electrode material of the first electrode 23 may also include other conductive materials.

[0106] The piezoelectric layer 24 is made of polyvinylidene fluoride (PVDF) or lead zirconate titanate (PZT) film.

[0107] The material of the second electrode 25 includes silver (Ag) or indium tin oxide (ITO); in other embodiments, the electrode material of the second electrode 25 may also include other conductive materials.

[0108] The protective layer 26 is disposed on the side of the second electrode 25 away from the first electrode 23, so that the protective layer 26 can provide insulation protection for the second electrode 25.

[0109] In other embodiments, referring to FIG6, the sensing layer 20 includes a first sensor 201 and a second sensor 202. The first sensor 201 is configured to receive a first ultrasonic wave, and the second sensor 202 is configured to receive a second ultrasonic wave. Wherein, while the first sensor 201 receives the first ultrasonic wave, the second sensor 202 can also receive the second ultrasonic wave. That is, human tissue imaging detection and shape calculation of the sensing layer 20 can be performed simultaneously. This not only helps to save the detection time of the imaging device 100, but also improves the imaging speed of the imaging device 100.

[0110] For example, the sensing area AA is provided with a plurality of first sensing units and a plurality of second sensing units. The plurality of first sensing units are arranged in an array in the sensing area AA, and the plurality of second sensing units are arranged in an array in the sensing area AA. Moreover, the first sensing units and the second sensing units are located in different layers of the sensing layer 20.

[0111] Referring to Figure 6, when the sensing layer 20 includes a first sensor 201 and a second sensor 202, the first sensor 201 includes a first substrate 211, a first pixel circuit layer V11, a first piezoelectric transducer layer V21, and a first protective layer 261, which are stacked sequentially.

[0112] The second sensor 202 includes a second substrate 212, a second pixel circuit layer V12, a second piezoelectric transducer layer V22, and a second protective layer 262, which are stacked sequentially.

[0113] The sensing layer 20 also includes an adhesive layer 291, which bonds the first sensor 201 and the second sensor 202 together. Specifically, the adhesive layer 291 bonds the first protective layer 261 of the first sensor 201 and the second substrate 212 of the second sensor 202 together.

[0114] The first substrate 211 and the second substrate 212 are made of polyimide (PI). In other embodiments, the first substrate 211 and the second substrate 212 may also be made of other flexible materials. In this way, when the imaging device 100 is worn, the sensing layer 20 can fit closely to the surface of the human body to improve the accuracy of imaging and the comfort of wearing it.

[0115] The first pixel circuit layer V11 includes a first pixel circuit 221 formed by conductive layers and a first insulating layer 271 located between the conductive layers.

[0116] The second pixel circuit layer V12 includes a second pixel circuit 222 formed by conductive layers and a second insulating layer 272 located between the conductive layers.

[0117] The first piezoelectric transducer layer V21 includes a first electrode 231, a second electrode 251, and a first piezoelectric layer 241 located between the first electrode 231 and the second electrode 251. The first electrode 231 is closer to the first substrate 211 than the second electrode 251. The first electrode 231 is an electrode block arranged in a matrix, and the second electrode 251 is a continuous electrode on one entire surface.

[0118] The first piezoelectric transducer layer V21 also includes a first dielectric layer 281 located between adjacent first electrodes 231 for insulating adjacent first electrodes 231.

[0119] The second piezoelectric transducer layer V22 includes a first electrode 232, a second electrode 252, and a second piezoelectric layer 242 located between the first electrode 232 and the second electrode 252. The first electrode 232 is closer to the second substrate 212 than the second electrode 252. The first electrode 232 is an electrode block arranged in a matrix, and the second electrode 252 is a continuous electrode on one entire surface.

[0120] The second piezoelectric transducer layer V22 also includes a second dielectric layer 282 located between adjacent first electrodes 232 for insulating adjacent first electrodes 232.

[0121] In order for the sensing layer 20 to effectively receive ultrasonic waves, the thickness of the piezoelectric element is typically matched to the wavelength of the ultrasonic wave. Therefore, when the frequency of the second ultrasonic wave is different from that of the first ultrasonic wave, and when the sensing layer 20 includes a first sensor 201 and a second sensor 202, the thickness of the first piezoelectric layer 241 in the first piezoelectric transducer layer V21 is different from the thickness of the second piezoelectric layer 242 in the second piezoelectric transducer layer V22.

[0122] For example, the frequency of the second ultrasonic wave is greater than the frequency of the first ultrasonic wave, that is, the wavelength of the second ultrasonic wave is less than the wavelength of the first ultrasonic wave. In this case, the thickness of the first piezoelectric layer 241 in the first piezoelectric transducer layer V21 is greater than the thickness of the second piezoelectric layer 242 in the second piezoelectric transducer layer V22.

[0123] The materials of the first electrode 231 of the first piezoelectric transducer layer V21 and the first electrode 232 of the second piezoelectric transducer layer V22 both include silver (Ag) or indium tin oxide (ITO); in other embodiments, the materials of the first electrode 231 of the first piezoelectric transducer layer V21 and the first electrode 232 of the second piezoelectric transducer layer V22 may also include other conductive materials.

[0124] The materials of the first piezoelectric layer 241 of the first piezoelectric transducer layer V21 and the second piezoelectric layer 242 of the second piezoelectric transducer layer V22 both include polyvinylidene fluoride (PVDF) or lead zirconate titanate (PZT) films.

[0125] The materials of the second electrode 251 of the first piezoelectric transducer layer V21 and the second electrode 252 of the second piezoelectric transducer layer V22 include silver (Ag) or indium tin oxide (ITO); in other embodiments, the materials of the second electrode 251 of the first piezoelectric transducer layer V21 and the second electrode 252 of the second piezoelectric transducer layer V22 may also include other conductive materials.

[0126] The first protective layer 261 is located in the first sensor 201 on the side of the second electrode 251 away from the first electrode 231, so that the first protective layer 261 can provide insulation protection for the second electrode 251 in the first sensor 201.

[0127] The second protective layer 262 is located in the second sensor 202 on the side of the second electrode 252 away from the first electrode 232, so that the second protective layer 262 can provide insulation protection for the second electrode 252 in the second sensor 202.

[0128] In the case where the sensing layer 20 includes a first sensor 201 and a second sensor 202, the first pixel circuit 221 in the sensing layer 20 is used to read the electrical signal in the first sensor 201 for detecting the shape of the sensing layer 20, and the second pixel circuit 222 is used to read the electrical signal in the second sensor 202 for imaging human tissue. In this way, the electrical signals in the first sensor 201 and the second sensor 202 can be processed independently, which not only helps to avoid mutual interference or confusion between the electrical signals in the first sensor 201 and the second sensor 202, improving the accuracy of the electrical signals and thus improving the imaging quality of the imaging device 100, but also helps to improve the imaging efficiency of the imaging device 100.

[0129] In other embodiments, referring to FIG7, the sensing layer 20 includes a substrate 21, a pixel circuit layer V1, a first piezoelectric transducer layer V21, an interlayer insulating layer 292, a second piezoelectric transducer layer V22, and a protective layer 26, which are stacked sequentially. Both the first piezoelectric transducer layer V21 and the second piezoelectric transducer layer V22 are electrically connected to the pixel circuit layer V1. That is, the first piezoelectric transducer layer V21 and the second piezoelectric transducer layer V22 share a single pixel circuit. This improves the integration density of the sensing layer 20.

[0130] For example, the imaging device 100 may include a sound source 31 that includes a first sound source that emits a first ultrasonic wave and a second ultrasonic wave in a time-division manner, and a sensing layer 20 that includes a first sensor that receives the first ultrasonic wave and the second ultrasonic wave in a time-division manner.

[0131] The imaging device 100 may also include a sound source 31 comprising a first sound source, which emits a first ultrasonic wave and a second ultrasonic wave in a time-division manner, and a sensing layer 20 comprising a first sensor and a second sensor, wherein the first sensor receives the first ultrasonic wave while the second sensor receives the second ultrasonic wave.

[0132] The imaging device 100 may also include a sound source 31 comprising a first sound source 311 and a second sound source 312, wherein the first sound source 311 emits a first ultrasonic wave while the second sound source 312 emits a second ultrasonic wave, and the sensing layer 20 includes a first sensor, which receives the first ultrasonic wave and the second ultrasonic wave in a time-division manner.

[0133] The imaging device 100 may also include a sound source 31 comprising a first sound source 311 and a second sound source 312, wherein the first sound source 311 emits a first ultrasonic wave while the second sound source 312 emits a second ultrasonic wave, and the sensing layer 20 comprises a first sensor and a second sensor, wherein the first sensor receives the first ultrasonic wave while the second sensor receives the second ultrasonic wave.

[0134] Referring to Figure 2, when the sound source 31 includes a first sound source that emits first and second ultrasonic waves in a time-division manner, and the sensing layer 20 includes a first sensor that receives the first and second ultrasonic waves in a time-division manner, the larger the size of the first receiving cavity Q1 along the first direction X, the more first ultrasonic waves and second ultrasonic waves emitted by each first sound source will cover the number of first sensors in the sensing layer 20. This allows for a suitable reduction in the number of first sound sources, which helps to lower the cost of the imaging device 100. Furthermore, when one or a few first sound sources malfunction and cannot emit ultrasonic waves, the ultrasonic waves emitted by the other first sound sources 311 can still completely cover the first sensors on the sensing layer 20, thereby enhancing the reliability and stability of the imaging device 100.

[0135] Similarly, when the sound source 31 includes a first sound source that emits first and second ultrasonic waves in a time-division manner, and the sensing layer 20 includes a first sensor and a second sensor, with the first sensor receiving the first ultrasonic wave and the second sensor receiving the second ultrasonic wave, the larger the size of the first receiving cavity Q1 along the first direction X, the more first and second ultrasonic waves emitted by each first sound source will cover the number of first and second sensors in the sensing layer 20. This allows for a suitable reduction in the number of first sound sources, which helps to lower the cost of the imaging device 100. Furthermore, when one or a few first sound sources malfunction and cannot emit ultrasonic waves, the ultrasonic waves emitted by the other first sound sources 311 can still completely cover the first sensors on the sensing layer 20.

[0136] Similarly, when the sound source 31 includes a first sound source 311 and a second sound source 312, where the first sound source 311 emits a first ultrasonic wave and the second sound source 312 emits a second ultrasonic wave, and the sensing layer 20 includes a first sensor that receives the first and second ultrasonic waves in a time-division manner, the larger the size of the first receiving cavity Q1 along the first direction X, the more the first ultrasonic wave emitted by each first sound source and the second ultrasonic wave emitted by the second sound source 312 will cover the first sensor in the sensing layer 20. This allows for a suitable reduction in the number of first sound sources 311 and second sound sources 312, which helps to reduce the cost of the imaging device 100. Furthermore, when one or a few first sound sources 311 and second sound sources 312 malfunction and cannot emit ultrasonic waves, the ultrasonic waves emitted by the other first sound sources 311 and second sound sources 312 can still completely cover the first sensors on the sensing layer 20.

[0137] Similarly, when the sound source 31 includes a first sound source 311 and a second sound source 312, the first sound source 311 emits a first ultrasonic wave, the second sound source 312 emits a second ultrasonic wave, and the sensing layer 20 includes a first sensor and a second sensor, the first sensor receives the first ultrasonic wave, and the second sensor receives the second ultrasonic wave, the larger the size of the first receiving cavity Q1 along the first direction X, the more the first ultrasonic wave emitted by each first sound source and the second ultrasonic wave emitted by the second sound source 312 will cover the first sensor and the second sensor in the sensing layer 20. This can appropriately reduce the number of first sound sources 311 and second sound sources 312, which is beneficial to reducing the cost of the imaging device 100.

[0138] Since the more ultrasonic waves emitted by each first sound source 311 and second sound source 312 cover the number of first and second sensors in the sensing layer 20, the fewer the number of first and second sensors can be appropriately reduced, which helps to lower the cost of the imaging device 100. Furthermore, when one or a few first sound sources 311 and second sound sources 312 malfunction and cannot emit ultrasonic waves, the ultrasonic waves emitted by the other first sound sources 311 and second sound sources 312 can still completely cover the first and second sensors on the sensing layer 20, thereby enhancing the reliability and stability of the imaging device 100.

[0139] For example, along the first direction X, the size of the first accommodating cavity Q1 is larger than the distance between the acoustic radiation surface S1 and the non-acoustic radiation surface S2 of the sound source 31. The non-acoustic radiation surface S2 is a plane formed by the end faces of the non-emitting ends of the plurality of sound sources 31. The non-emitting end of the sound source 31 is the end of the sound source 31 that is opposite to the emitting end along the first direction X. In other embodiments, along the first direction X, the size of the first accommodating cavity Q1 can be reasonably designed according to the actual required size or mass of the imaging device 100, as long as the ultrasonic waves emitted by the sound source on the sound source plate 30 can cover a sufficiently large area of ​​the sensing layer 20.

[0140] In some embodiments, referring to FIG1, the first housing 10 includes a first side plate 11, a first bottom plate 12, and a support portion 13; the first end of the first side plate 11 in the first direction X forms a first opening K1; the second end of the first side plate 11 in the first direction X is connected to the first bottom plate 12, so that the first side plate 11 and the first bottom plate 12 form a first receiving cavity Q1; the first bottom plate 12 is provided with a second opening K2; the first end of the support portion 13 is connected to the first end of the first side plate 11, the support portion 13 surrounds the first opening K1, and the second end of the support portion 13 extends along a preset direction; the preset direction is perpendicular to the first direction X, and the preset direction is any direction radiating from the center of the first opening K1 to the surrounding area of ​​the first opening K1; the edge of the sensing layer 20 is disposed on the support portion 13. The support portion 13 provides a stable support surface for the sensing layer 20, which can prevent the sensing layer 20 from shifting or falling off during deformation, which is beneficial to improving the structural stability of the imaging device 100.

[0141] Referring again to Figure 1, the imaging device 100 further includes a limiting member 40, disposed on the edge of the sensing layer 20 away from the support portion 13, and surrounding the first opening K1; the limiting member 40, the sensing layer 20, and the support portion 13 are connected. By fixing the sensing layer 20 to the support portion 13 through the limiting member 40, movement or displacement of the sensing layer 20 during imaging can be prevented. This not only enhances the structural stability of the imaging device 100 but also improves its imaging accuracy and reliability. Therefore, the imaging device 100 provided in this embodiment also has dynamic detection capabilities, enabling real-time detection and recording during user movement or body movement.

[0142] The limiting member 40, the sensing layer 20, and the supporting part 13 are connected. The connection method can be as follows, referring to Figures 4, 8, and 11: the limiting member 40 is provided with a first through hole g1, the sensing layer 20 is provided with a second through hole g2, and the supporting part 13 is provided with a first fixing hole D1. In this case, the imaging device 100 also includes a first fixing member (not shown), which passes through the first through hole g1, the second through hole g2, and the first fixing hole D1 to connect the limiting member 40, the sensing layer 20, and the supporting part 13.

[0143] The first fixing hole D1 is arranged at intervals around the sensing area AA on the bearing part 13.

[0144] For example, the distance between adjacent first fixing holes D1 is less than 4 mm. For instance, the distance between adjacent first fixing holes D1 is 2 mm, 2.5 mm, 3 mm, or 3.5 mm.

[0145] The distance between adjacent first fixing holes D1 is within this range. In this way, the first fixing member can not only fix the relative position between the limiting member 40, the sensing layer 20 and the supporting part 13, reducing the possibility of loosening of the connection between the sensing layer 20 and the supporting part 13 due to vibration or external impact, thus improving the structural stability of the imaging device 100 and thus helping to improve the imaging accuracy of the imaging device 100, but also helps to improve the sealing between the limiting member 40, the sensing layer 20 and the supporting part 13.

[0146] Furthermore, the through-hole connection of the first fastener not only structurally achieves a stable connection between the limiting member 40, the sensing layer 20, and the supporting part 13, but also significantly simplifies the assembly process of the entire imaging device 100. This connection method avoids the complex fixing steps and additional tools that may be required during the assembly of the imaging device 100, allowing the various components to be positioned and fixed together more quickly and accurately, thereby greatly improving the assembly accuracy of the first housing 10 and even the entire imaging device 100. This reduces the performance degradation of the imaging device 100 caused by minor deviations or assembly errors, and in particular, avoids the negative impact on the imaging quality of the imaging device 100 due to improper assembly, ensuring the high-quality imaging effect of the imaging device 100.

[0147] When the sensing layer 20, the limiting member 40, or other key components need to be replaced due to wear, aging, or technological upgrades, maintenance personnel can easily and quickly separate the limiting member 40, the sensing layer 20, and the supporting part 13 by disassembling the first fixing member, without the need for cumbersome overall disassembly. This modular design concept not only simplifies maintenance work and shortens maintenance time, but also reduces downtime of the imaging device 100 due to maintenance, thereby improving the overall operational efficiency of the imaging device 100. At the same time, because the maintenance process is more intuitive and convenient, it also reduces the need for professional technicians, thus effectively controlling maintenance costs.

[0148] For example, the first fastener can be a screw. In this case, the first fixing hole D1 in the bearing portion 13 is a threaded hole. By rotating the screw, the screw can be screwed into or out of the threaded hole, providing the imaging device 100 with a firm, stable and easy-to-install and disassemble connection. This connection method also helps the imaging device 100 to maintain and replace parts.

[0149] For example, the first fastener can also be a bolt. In this case, the first fixing hole D1 in the bearing portion 13 can also be a through hole. The bolt needs to cooperate with the nut through the first through hole g1, the second through hole g2 and the first fixing hole D1 to fix the limiting member 40, the sensing layer 20 and the bearing portion 13.

[0150] Here, when setting the second through hole g2 on the sensing layer 20, it is necessary to ensure that the position of the second through hole g2 avoids the wires on the sensing layer 20.

[0151] In some embodiments, continuing to refer to Figures 1, 8, and 9, the first housing 10 further includes a connecting portion 14 and an extension portion 15; the connecting portion 14 surrounds the support portion 13, and the extension portion 15 surrounds the connecting portion 14; the connecting portion 14 connects the second end of the support portion 13 and the extension portion 15, and the extension portion 15 extends along a preset direction; along the first direction X, the distance from the extension portion 15 to the sound source plate 30 is greater than the distance from the support portion 13 to the sound source plate 30, so that the extension portion 15, the connecting portion 14, and the support portion 13 form a groove; the sensing layer 20 and the limiting member 40 are disposed in the groove. In this way, the imaging device 100 can be worn on the human body more quickly through the extension portion 15, and the sensing layer 20 can also naturally conform to the surface of the human body as the extension portion 15 is bound to the human body, without additional restraint or adjustment, thus improving the ease of wearing the imaging device 100.

[0152] When the imaging device 100 is worn for detection, an adhesive layer can be attached to the surface of the extension portion 15 to bond the extension portion 15 to the human skin. At the same time, the sensing layer 20 is also tightly attached to the human body. This can improve the adhesion and stability of the imaging device 100 on the human body, so as to make more accurate monitoring or recording.

[0153] For example, medical double-sided tape can be attached to the surface of the extension portion 15. This medical double-sided tape is not only antibacterial and infection-preventing but also waterproof and sweatproof, allowing the imaging device 100 to maintain its adhesion even in humid environments, thus ensuring the stability of the imaging device 100's detection results. The adhesive strength of the medical double-sided tape depends on the adhesive area and the mass of the imaging device 100, calculated using the following formula:

[0154] In some embodiments, referring to Figures 8 and 9, the connection between the connecting portion 14 and the extension portion 15 is a rounded corner transition. This rounded corner transition effectively reduces the abruptness of the connecting portion 14, avoiding unnecessary friction or scratches between the imaging device 100 and the human body during use and wear. This not only improves the wearing comfort of the imaging device 100 but also enhances its durability and stability. Furthermore, because the rounded corner transition design better adapts to the curves of the human body, it helps improve the overall fit and seal between the imaging device 100 and the human skin surface during wear, reducing data errors and ensuring the accuracy and reliability of the imaging results.

[0155] Referring to Figure 9, the connecting part 14 is provided with a third opening K3; the imaging device 100 also includes a circuit board 50, one end of which is electrically connected to the sensing layer 20, and the other end passes through the third opening K3 between the supporting part 13 and the limiting member 40. Thus, when the imaging device 100 is worn, the circuit board 50 will not come into contact with the human body surface, which not only does not affect wearing comfort but also improves detection accuracy. Furthermore, the third opening K3 facilitates the installation or removal of the circuit board 50 from the sensing layer 20, making assembly or maintenance more convenient.

[0156] In some embodiments, referring to FIG4, the circuit board 50 includes a first circuit board 501 and a second circuit board 502. The first circuit board 501 is electrically connected to the pixel circuit in the sensing layer 20 via a first signal line w1, and the second circuit board 502 is electrically connected to the pixel circuit in the sensing layer 20 via a second signal line w2. The first circuit board 501 provides a scanning signal to the sensing unit 2010 in the sensing layer 20, and the second circuit board 502 provides a switching signal to the sensing unit 2010 in the sensing layer 20.

[0157] Referring again to Figure 4, the first signal line w1 and the second signal line w2 can be positioned to avoid the first fixing hole D1, thus providing more layout space for the first signal line w1 and the second signal line w2. Alternatively, the first fixing hole D1 can be positioned to avoid the first signal line w1 and the second signal line w2, thus ensuring the integrity and reliability of the first signal line w1 and the second signal line w2. It should be noted that Figure 8 is a partial structural diagram of the imaging device 100 in Figure 1 at point M, where "point M" corresponds to the position where the support portion 13 of the imaging device 100 does not have the circuit board 50. Figure 9 is a partial structural diagram of the imaging device 100 in Figure 1 at point N, where "point N" corresponds to the position where the support portion 13 of the imaging device 100 has the circuit board 50.

[0158] One end of the circuit board 50 is electrically connected to the sensing layer 20, and the other end is connected to the processor (not shown). The circuit board 50 transmits the electrical signals within the sensing layer 20 to the processor. The circuit board 50 and the processor work together to acquire and process signals, and convert the processed signals into visual information, such as ultrasound images, allowing doctors to intuitively observe the structure and lesions of internal tissues.

[0159] For example, the circuit board 50 includes a flexible printed circuit (FPC). Because the flexible circuit board has flexible properties and can be bent and folded at will, the user will not be restricted or damaged by body movements, shape changes or collisions when wearing, picking up or storing the imaging device 100, which can improve the wearing comfort and durability of the imaging device 100.

[0160] For example, the circuit board 50 may also include a rigid-flex PCB, the rigid portion of which can provide structural support to protect the electronic components inside the imaging device 100 from external impacts and damage, thereby improving the stability and reliability of the imaging device 100; at the same time, the flexibility of the flexible portion can improve the durability and wearing comfort of the imaging device 100.

[0161] Referring again to Figures 1, 9, and 10, or to Figures 1, 9, and 11, the first housing 10 further includes an extension platform 16. One end of the extension platform 16 is connected to the portion of the support portion 13 exposed in the third opening K3, and the other end extends along a predetermined direction. A portion of the circuit board 50 is disposed on the surface of the extension platform 16. This extension platform 16 prevents the circuit board 50 from bending at a large angle at its connection with the sensing layer 20, such as a right-angle bend or an obtuse-angle bend, which would affect signal transmission. It also prevents the circuit board 50 near the sensing layer 20 from frequently bending and wearing down during long-term use of the imaging device 100, thus extending the service life of the circuit board 50.

[0162] For example, the extension stage 16 extends in a preset direction by a dimension at least greater than 3 mm, such as 4 mm, 5 mm, 6 mm, or 6.5 mm. The dimension of the extension stage 16 extending in the preset direction can be designed according to the actual needs of the imaging device 100 and is not limited thereto.

[0163] In the imaging device 100 provided in this embodiment, the first housing 10, including the first side plate 11, the first base plate 12, the supporting part 13, the connecting part 14, the extension part 15, and the extension support 16, can be integrally formed. This reduces the splicing and detailed processing of various components, thereby reducing the risk of loosening and damage to individual components, and enhancing the stability and reliability of the first housing 10. Furthermore, when the first receiving cavity Q1 is filled with coupling fluid, the risk of leakage in the first housing 10 can also be avoided.

[0164] In other embodiments, the first side plate 11, the first bottom plate 12, the support portion 13, the connecting portion 14, the extension portion 15, and the extension support 16 in the first housing 10 can also be independently detachable structures, as long as the reliability and sealing of the connection between adjacent components are ensured after the first housing 10 is formed.

[0165] In some embodiments, continuing to refer to FIG9, the imaging device 100 further includes a first adhesive layer 51 disposed between the extension stage 16 and the circuit board 50. When the imaging device 100 is subjected to external impact or vibration, the first adhesive layer 51 can ensure that the circuit board 50 is firmly bonded to the extension stage 16, preventing the circuit board 50 from loosening or falling off and causing signal transmission interruption, thereby contributing to the stability and reliability of the entire imaging device 100.

[0166] For example, the first adhesive layer 51 may be double-sided tape.

[0167] In some embodiments, the surface of the limiting member 40 away from the sound source plate 30 is lower than the surface of the extension portion 15 away from the sound source plate 30 relative to the sound source plate 30. In this way, the extension portion 15 can provide a certain degree of protection for the limiting member 40, reducing the possibility of the limiting member 40 being directly impacted, causing the connection between the sensing layer 20 and the limiting member 40 to loosen, resulting in the sensing layer 20 falling off.

[0168] In other embodiments, the surface of the limiting member 40 away from the sound source plate 30 is flush with the surface of the extension portion 15 away from the sound source plate 30. This also helps the sensing layer 20 to fully adhere to the human body surface when the extension portion 15 is attached, thereby providing a smoother, seamless touch and reducing the foreign body sensation or discomfort caused by the abrupt edges of the imaging device 100, which helps to improve the overall wearing comfort of the imaging device 100.

[0169] In some embodiments, the first receiving cavity Q1 is filled with a coupling fluid. Since the coupling fluid can adequately fill the gap between the sensing layer 20 and the acoustic radiation surface S1 of the sound source 31, unnecessary reflection and scattering due to medium inhomogeneity or air gaps will not occur. This reduces the attenuation or scattering of the ultrasonic signal during propagation caused by air or other media, thus minimizing energy loss. The coupling fluid not only facilitates more stable propagation of the acoustic signal but also promotes more efficient transmission of the ultrasonic signal from the sound source 31 to the sensing layer 20, improving the penetration of the ultrasonic wave and the detection accuracy of the imaging device 100. Furthermore, the coupling fluid can also fill any unevenness on the surface of the sensing layer 20.

[0170] For example, the unevenness of the surface of the sensing layer 20 itself, or the unevenness formed because the sensing layer 20 needs to be attached to the measurement part of the human body, can prevent unnecessary reflection of the ultrasonic signal on the surface of the sensing layer 20, thereby reducing the loss of ultrasonic energy due to reflection. Furthermore, the coupling fluid can also reduce the signal-to-noise ratio and improve signal quality, thereby improving the accuracy and sensitivity of the detection results of the imaging device 100.

[0171] The coupling fluid can be water or silicone oil.

[0172] When the first accommodating cavity Q1 is filled with coupling fluid, the acoustic radiation surface S1 of the sound source 31 can be directly exposed to the coupling fluid, avoiding reflection and scattering caused by medium mismatch during ultrasonic wave propagation, which would otherwise reduce the intensity and clarity of the ultrasonic wave. With this design, the sound waves emitted by the sound source 31 can be transmitted directly to the sensing layer 20 without passing through any other medium, which helps maintain high energy consistency of the ultrasonic waves in the coupling fluid. This allows the ultrasonic waves to propagate more directly and effectively to the sensing layer 20, improving the performance and reliability of the imaging device 100.

[0173] Referring to Figure 11, the first base plate 12 is provided with an injection port 120, which communicates with the first receiving cavity Q1. This allows for the rapid and accurate injection of coupling fluid into the first receiving cavity Q1 through the injection port 120, improving the injection efficiency. Furthermore, the injection process eliminates the need for disassembly and reinstallation, avoiding a complex injection procedure. In addition, when the coupling fluid needs to be replenished or replaced, the operation can be performed solely through the injection port 120, avoiding the risk of damage to the first housing 10 due to disassembly. This not only reduces operational difficulty and maintenance costs but also provides a strong guarantee for the long-term stable operation of the imaging device 100.

[0174] In some embodiments, referring to Figures 12 and 13, the limiting member 40 includes a first portion 401 and a second portion 402; the first portion 401 overlaps with the supporting portion 13 in a first direction X; the second portion 402 surrounds the first portion 401 and is connected to the first portion 401, and the second portion 402 extends along a preset direction. The first portion 401 is primarily connected to the sensing layer 20.

[0175] In the imaging device 100 shown in Figure 12, the circuit board 50 can be disposed on either side of the sensing layer 20, which provides more flexibility in the design of the circuit board 50 and facilitates the selection of the optimal layout and connection method of the circuit board 50 according to actual needs, so as to meet specific application requirements.

[0176] In Figure 12, the structure of the imaging device 100 from bottom to top is shown from top to bottom.

[0177] In this case, when the imaging device 100 is worn for detection, an adhesive layer can be attached to the surface of the limiting member 40 to bond the limiting member 40 to the human skin. Since both the first part 401 and the second part 402 can be attached with adhesive layers, this increases the bonding area with the human body, improving the adhesion and stability of the imaging device 100 on the human body. Furthermore, when the limiting member 40 is bonded to the human skin, the sensing layer 20 can be replaced simply by disconnecting the first fixing member. This eliminates the need for repeated removal and reattachment of the limiting member 40 and adhesive layer from the human body, improving the convenience of replacing the sensing layer 20 and avoiding discomfort or damage to the human skin caused by repeated removal of the adhesive layer.

[0178] In some embodiments, referring to Figures 1, 8, or 9, the surface of the carrier portion 13 facing the sensing layer 20 is provided with a first groove C1, the first groove C1 surrounding the first opening K1; in this case, the imaging device 100 also includes a first sealing ring m1 disposed within the first groove C1. The first sealing ring m1 can form a sealing protection, sealing the coupling fluid into the first receiving cavity Q1, which helps to prevent the coupling fluid from seeping out and flowing into the circuit board 50, causing a short circuit in the circuit board 50, thereby degrading or damaging the performance of the imaging device 100.

[0179] Secondly, when the imaging device 100 is subjected to a collision or impact, the first sealing ring m1, upon elastic deformation, can absorb and disperse part of the impact force, playing a certain buffering role and helping to reduce or prevent damage to the internal structure of the sensing layer 20 in the imaging device 100. Therefore, it is beneficial to improve the durability and reliability of the imaging device 100.

[0180] The compression of the first sealing ring m1 ranges from 10% to 90%, for example, 10%, 20%, 30%, 50%, 60%, 80%, or 90%. The compression of the first sealing ring m1 refers to the degree to which it is compressed during installation, i.e., the difference between the free height (height before installation) and the final installation height of the first sealing ring m1, divided by the percentage of the free height.

[0181] In some embodiments, the Shore hardness of the material of the first sealing ring m1 is less than 50A. For example, the Shore hardness of the first sealing ring m1 is 10A, 20A, 30A, 40A, 45A, or 45A.

[0182] For example, the material of the first sealing ring m1 can be rubber or synthetic rubber. In other embodiments, the material of the first sealing ring m1 can also be other materials that can provide a sealing effect and are elastic.

[0183] When the imaging device 100 also includes a first sealing ring m1, the first fixing member can be selected as a screw. Since the screw has high connection strength, it can provide the pre-compression of the first sealing ring m1 to ensure the sealing effect.

[0184] In some embodiments, continuing to refer to FIG1, FIG8, or FIG9, the surface of the support portion 13 facing the sensing layer 20 is further provided with a second groove C2. The second groove C2 is located on the side of the first groove C1 away from the first opening K1 and surrounds the first opening K1. In this case, the imaging device further includes a second sealing ring m2, which is disposed in the second groove C2. The second sealing ring m2 further enhances the sealing effect on the coupling fluid, so that the first sealing ring m1 and the second sealing ring m2 can play a dual sealing role, improving the durability and reliability of the imaging device 100.

[0185] The compression range of the second sealing ring m2 is between 10% and 90%, for example, 10%, 20%, 30%, 50%, 80%, or 90%. The compression of the second sealing ring m2 refers to the degree to which the second sealing ring m2 is compressed during installation, that is, the difference between the free height (height before installation) of the second sealing ring m2 and the final installation height, divided by the percentage of the free height.

[0186] Within this compression range, the risk of breakage due to excessive deformation of the second sealing ring m2 is reduced, thus extending its service life. Secondly, appropriate compression ensures tight contact between the second sealing ring m2 and the sealing surface, improving sealing performance and reducing the risk of leakage. Thirdly, appropriate compression also disperses the pressure on the second sealing ring m2 during operation, reducing the risk of localized stress concentration, which contributes to improving the reliability and safety of the imaging device 100.

[0187] The Shore hardness of the material of the second sealing ring m2 is less than 50A. For example, the Shore hardness of the second sealing ring m2 is 20A, 30A, 40A, 45A, or 45A.

[0188] The Shore hardness of the material for the second sealing ring m2 is within this range, which is beneficial for giving the material better elasticity. This allows it to better adapt to irregularities in the sealing surface, providing a tighter seal. At the same time, better elasticity also helps the second sealing ring m2 maintain its shape under pressure, making it less prone to deformation or breakage. Furthermore, the lower Shore hardness of the second sealing ring m2 material may also result in better wear resistance, which can more effectively disperse the heat and wear generated by friction, thereby extending the service life of the second sealing ring m2.

[0189] For example, the material of the second sealing ring m2 can be rubber or synthetic rubber. In other embodiments, the material of the second sealing ring m2 can also be other materials that can provide a sealing effect and are elastic.

[0190] With the first groove C1 and the second groove C2 provided on the surface of the bearing portion 13 facing the sensing layer 20, referring to Figures 8 and 11, the first fixing hole D1 is located between the first sealing ring m1 and the second sealing ring m2. That is, the first sealing ring m1 and the second sealing ring m2 are arranged to avoid the first fixing hole D1, which can prevent the first fixing member from damaging the first sealing ring m1 and the second sealing ring m2 when passing through the first fixing hole D1, thus affecting the sealing effect of the first sealing ring m1 and the second sealing ring m2.

[0191] Referring to Figure 1, after the first fixing member fixes the relative positions of the limiting member 40, the sensing layer 20 and the supporting part 13, the surface of the first sealing ring m1 and the second sealing ring m2 near the sensing layer 20 is flush with the surface of the supporting part 13 near the sensing layer 20. This ensures the sealing effect of the first sealing ring m1 and the second sealing ring m2 and prevents the coupling fluid in the first receiving cavity Q1 from leaking.

[0192] In some embodiments, referring to FIG14, the first sealing ring m1 is provided with a third through hole (not shown), and the first fixing member passes through the first through hole g1, the second through hole g2, the third through hole and the first fixing hole to connect the limiting member 40, the sensing layer 20, the first sealing ring m1 and the bearing part 13.

[0193] For example, the first fixing element is a screw. In this case, the first fixing hole is a threaded hole that matches the thread of the screw, so that the screw can be firmly screwed into the threaded hole, effectively fixing the limiting element 40, the sensing layer 20, the first sealing ring m1, and the bearing part 13 together to ensure the sealing effect of the first sealing ring m1 on the coupling fluid. In addition, by rotating the screw, the screw can be easily screwed into or out of the threaded hole, which not only improves the connection strength but also simplifies the installation and disassembly process.

[0194] In some embodiments, continuing to refer to FIG14, there is a gap L between the side of the first sealing ring m1 away from the first opening K1 and the side of the first groove C1 away from the first opening K1; in this case, the imaging device further includes a sealant layer (not shown), which fills the gap L and surrounds the first sealing ring m1. Since the sealant layer is a sealant liquid before curing, and the sealant liquid has fluidity, the sealant liquid can fully fill each gap in the gap L. The sealant layer formed after the sealant liquid cures can further effectively prevent the coupling fluid from leaking. In this way, the sealant layer and the first sealing ring m1 together form a sealing effect for the coupling fluid, improving the durability and reliability of the imaging device 100.

[0195] In some embodiments, referring to FIG15, a portion of the bottom of the first groove C1 is recessed to form a third groove C3. The dimension of the third groove C3 along a predetermined direction is smaller than the dimension of the first groove C1 along the predetermined direction, and the third groove C3 surrounds the first opening K1, that is, the first groove C1 and the third groove C3 together form a "T"-shaped groove. A portion of the first sealing ring m1 is located within the third groove C3, so that the first sealing ring m1 completely fills the space formed by the first groove C1 and the third groove C3. The third groove C3 can increase the contact area between the first sealing ring m1 and the support portion 13, extend the path of the coupling fluid from the first receiving cavity Q1 to the outside, thereby improving the reliability of the first sealing ring m1 in sealing the coupling fluid and effectively preventing the coupling fluid from seeping out. In addition, the third groove C3 also provides a space specifically for setting the first sealing ring m1, so that the first sealing ring m1 can be more easily and accurately positioned and fixed on the support portion 13, avoiding the risk of misalignment or detachment of the first sealing ring m1 during assembly.

[0196] In some embodiments, referring to Figures 1 and 16, the sound source plate 30 further includes a fixing plate 301. The edge of the fixing plate 301 is connected to the first base plate 12, and the fixing plate 301 blocks the second opening K2. The fixing plate 301 has a plurality of first openings. The emitting end of the sound source 31 extends into the first opening and is connected to the fixing plate 301, while the non-emitting end of the sound source 31 extends away from the first receiving cavity Q1. Since the fixing plate 301 blocks the second opening K2, when the first receiving cavity Q1 of the first housing 10 is filled with coupling fluid, the coupling fluid exists only in the first receiving cavity Q1, which can reduce the mass of the imaging device 100. Furthermore, the emitting end of the sound source 31 extending into the first opening and being connected to the fixing plate 301 can prevent the coupling fluid from leaking from the first opening. In Figure 16, the structure of the imaging device 100 from top to bottom is shown.

[0197] Referring to Figures 11 and 16, the first base plate 12 is provided with a second fixing hole D2, and the fixing plate 301 is provided with a fourth through hole g4. In this case, the imaging device 100 also includes a second fixing member (not shown), which passes through the fourth through hole g4 and the second fixing hole D2 to connect the fixing plate 301 to the first base plate 12.

[0198] For example, the second fastener can be a screw. In this case, the second fixing hole D2 in the first base plate 12 is a threaded hole. By rotating the screw, the screw can be screwed into or out of the threaded hole, providing the imaging device 100 with a secure, stable and easy-to-install and disassemble connection. This connection method also helps the imaging device 100 to maintain and replace parts.

[0199] For example, the second fastener can also be a bolt. In this case, the second fixing hole D2 in the first base plate 12 can also be a through hole. The bolt needs to cooperate with the nut through the fourth through hole g4 and the second fixing hole D2 to fix the first base plate 12 to the fixing plate 301.

[0200] Referring again to Figures 1 and 16, the imaging device 100 further includes a second housing 60, which includes a second side plate 61 and a second bottom plate 62. One end of the second side plate 61 is connected to the second bottom plate 62, and the other end of the second side plate 61 is connected to the first housing 10, so that the second side plate 61 and the second bottom plate 62 form a second accommodating cavity Q2. The sound source plate 30 is disposed within the second accommodating cavity Q2. In this way, the second housing 60 can prevent external objects or the environment from causing direct damage to the sound source 31, thus protecting the sound source 31.

[0201] For example, the material of the second housing 60 includes ABS plastic or PC plastic, or other plastic materials may be used, as these materials are lightweight, which can reduce the weight of the imaging device 100.

[0202] ABS plastic is a copolymer of three monomers: acrylonitrile, butadiene, and styrene.

[0203] In some embodiments, referring to FIG18, the non-emitting end of the sound source 31 is connected to the fixing plate 301, and the emitting end of the sound source 31 extends toward the first receiving cavity Q1; in this case, the imaging device 100 further includes: a second housing 60, the second housing 60 including a second side plate 61 and a second bottom plate 62, one end of the second side plate 61 being connected to the second bottom plate 62, and the other end of the second side plate 61 being connected to the first housing 10, so that the second side plate 61 and the second bottom plate 62 form a second receiving cavity Q; the sound source plate 30 is disposed in the second receiving cavity Q, and the fixing plate 301 is connected to the second bottom plate 62.

[0204] In this case, the non-emitting end of the sound source 31 is connected to the fixing plate 301. Referring to Figure 18, the non-emitting end of the sound source 31 extends into the fixing plate 301 and is fixedly connected to it. Alternatively, the non-emitting end of the sound source 31 is fixedly connected to the surface of the fixing plate 301. The sound source 31 can be fixed using the fixing plate 301.

[0205] Referring again to Figure 18, while ensuring the sealing of the connection between the second housing 60 and the first housing 10, the coupling fluid is also filled in the second receiving cavity Q, which can improve the accuracy and sensitivity of the detection results of the imaging device 100.

[0206] For example, sealant can be used to seal the connection between the second housing 60 and the first housing 10 to prevent leakage of the coupling fluid in the first and second receiving cavities Q. In other embodiments, other sealing materials can also be used, as long as the sealing at the connection between the second housing 60 and the first housing 10 can be guaranteed.

[0207] The fixing plate 301 is connected to the second base plate 62. The connection method can be screw connection, bolt connection, or adhesive connection, as long as the fixing plate 301 and the second base plate 62 are connected.

[0208] The non-emitting end of the sound source 31 is connected to the fixed plate 301. The connection method can be that the non-emitting end of the sound source 31 is connected to the surface of the fixed plate 301 with adhesive, or the non-emitting end of the sound source 31 extends into the fixed plate 301 and is connected to the fixed plate 301.

[0209] Referring to Figure 19, the sound source plate 30 also includes a third side plate 302; one end of the third side plate 302 is connected to the fixing plate 301, and the other end of the third side plate 302 abuts against the first base plate 12, so that the third side plate 302 and the fixing plate 301 form a third receiving cavity Q3; the third receiving cavity Q3 is connected to the first receiving cavity Q1, and coupling fluid is also filled in the third receiving cavity Q3. In this way, the coupling fluid can be used to reduce the signal-to-noise ratio and improve the signal quality, thereby improving the accuracy and sensitivity of the detection results of the imaging device 100.

[0210] In some embodiments, referring to FIG20, the sound source plate 30 further includes a third side plate 302 and an encapsulation layer 303; one end of the third side plate 302 is connected to the fixing plate 301, and the encapsulation layer 303 blocks the opening formed by the other end of the third side plate 302 and the second opening K2; the encapsulation layer 303 blocks the second opening K2, which can prevent the coupling fluid from flowing into the space encapsulation layer 303, the third side plate 302 and the fixing plate 301, thereby reducing the mass of the coupling fluid in the imaging device 100, which in turn helps to reduce the mass of the imaging device 100, making it lighter and more portable.

[0211] The encapsulation layer 303 also has multiple second openings, into which the emitting end of the sound source 31 extends. Since the encapsulation layer 303 blocks the second opening K2, when the first receiving cavity Q1 of the first housing 10 is filled with coupling fluid, the coupling fluid only exists in the first receiving cavity Q1, reducing the mass of the imaging device 100. Furthermore, the emitting end of the sound source 31 extending into the second opening and connecting to the encapsulation layer 303 prevents leakage of coupling fluid from the second opening.

[0212] Referring again to Figure 20, when the sound source board 30 includes the encapsulation layer 303, the sound source 31 can extend into and connect to the fixing plate 301, or the sound source 31 can be disposed on the surface of the fixing plate 301 and connected to the fixing plate 301. The key is to ensure that both the sound source 31 and the fixing plate 301 can be fixed.

[0213] Referring to Figure 8 or Figure 11, the first housing 10 has a first connecting structure J1 near the end of the second housing 60. Referring to Figure 17, the second side plate 61 of the second housing 60 has a second connecting structure J2 near the end of the first housing 10. The first connecting structure J1 and the second connecting structure J2 are connected. The first housing 10 and the second housing 60 are connected by the specially designed first connecting structure J1 and second connecting structure J2. Compared with simple contact or adhesion, this connection ensures greater reliability and stability of the connection between the first housing 10 and the second housing 60, thereby enhancing the structural strength and stability of the imaging device 100. While ensuring the structural stability of the imaging device 100, the first housing 10 and the second housing 60 can also be separated by disconnecting the first connecting structure J1 and the second connecting structure J2, facilitating subsequent maintenance and replacement of either the first housing 10 or the second housing 60.

[0214] For example, the first connecting structure J1 and the second connecting structure J2 are snap-fit ​​connections, so that the first housing 10 and the second housing 60 can be quickly and accurately joined together, improving assembly efficiency.

[0215] For example, the first connecting structure J1 and the second connecting structure J2 can be mounting holes. Based on this, bolts are used to fix the first housing 10 and the second housing 60 together through the mounting holes and nuts.

[0216] For example, the first connecting structure J1 is a through hole and the second connecting structure J2 is a threaded hole, or the first connecting structure J1 is a threaded hole and the second connecting structure J2 is a through hole. Based on this, screws are used to fix the first housing 10 and the second housing 60 through the through hole and the threaded hole.

[0217] In some embodiments, referring to FIG17, the second side plate 61 of the second housing 60 is further provided with a wire passage 63 for signal lines connected to the sound source board 30 to pass through; the wire passage 63 and the second connecting structure J2 are spaced apart along the circumference of the second housing 60. This arrangement ensures that, on the one hand, the arrangement of the wire passage 63 does not affect the reliability of the connection between the second connecting structure J2 and the first housing 10; on the other hand, the layout of the second connecting structure J2 does not obstruct the signal lines within the wire passage 63. This makes the structure of the imaging device 100 more compact and reasonable, saving space and improving the overall aesthetics of the imaging device 100.

[0218] Referring to Figure 1, a fourth groove C4 is provided on the side of the first base plate 12 away from the sensing layer 20, and the fourth groove C4 surrounds the second opening K2. In this case, the imaging device 100 also includes a fourth sealing ring m4, which is disposed in the fourth groove C4. In the imaging device 100 shown in Figure 1, when the fixing plate 301 is connected to the first base plate 12, the fixing plate 301 and the first base plate 12 press the fourth sealing ring m4 together. The fixing plate 301 and the first base plate 12 can ensure the compression of the fourth sealing ring m4 so that the fourth sealing ring m4 achieves a sealing effect. In this way, the fourth sealing ring m4 can prevent the coupling fluid from seeping out from the second opening K2 through the gap between the fixing plate 301 and the first base plate 12, thereby improving the sealing effect on the coupling fluid.

[0219] Referring to Figure 1, after the fixing plate 301 and the first base plate 12 press the fourth sealing ring m4 together, the surface of the fourth sealing ring m4 away from the sensing layer 20 is flush with the surface of the first base plate 12 away from the sensing layer 20 on the side of the fourth groove C4. This ensures the sealing effect of the fourth sealing ring m4 and prevents the coupling fluid in the first receiving cavity Q1 from leaking in the gap between the fixing plate 301 and the first base plate 12.

[0220] In the imaging device 100 shown in Figures 19 and 20, the third side plate 302 of the sound source plate 30 presses the fourth sealing ring m4. Specifically, along the thickness direction of the third side plate 302, the third side plate 302 and the first bottom plate 12 press the fourth sealing ring m4 together. In this way, the fourth sealing ring m4 can prevent the coupling fluid from seeping out from the second opening K2 through the gap between the third side plate 302 and the first bottom plate 12, thereby improving the sealing effect on the coupling fluid.

[0221] Referring to Figure 19 or Figure 20, after the third side plate 302 of the sound source plate 30 presses the fourth sealing ring m4, the surface of the fourth sealing ring m4 away from the sensing layer 20 is flush with the surface of the first bottom plate 12 of the fourth groove C4 away from the sensing layer 20. This can ensure the sealing effect of the fourth sealing ring m4 and prevent the coupling fluid in the first receiving cavity Q1 from leaking in the gap between the third side plate 302 and the first bottom plate 12.

[0222] The compression range of the fourth sealing ring m4 is between 10% and 90%, for example, 5%, 10%, 20%, 30%, 50%, 60%, 80%, or 90%. The compression of the fourth sealing ring m4 refers to the degree to which it is compressed during installation, i.e., the difference between the free height (height before installation) and the final installation height of the fourth sealing ring m4, divided by the percentage of the free height.

[0223] Within this compression range, the risk of breakage due to excessive deformation of the fourth sealing ring m4 is reduced, thus extending its service life. Secondly, appropriate compression ensures tight contact between the fourth sealing ring m4 and the sealing surface, improving the sealing effect and reducing the risk of leakage. Thirdly, appropriate compression also disperses the pressure on the fourth sealing ring m4 during operation, reducing the risk of localized stress concentration, which contributes to improving the reliability and safety of the imaging device 100.

[0224] The Shore hardness of the material for the fourth sealing ring m4 is less than 50A. For example, the Shore hardness of the fourth sealing ring m4 is 20A, 30A, 40A, 45A, or 45A.

[0225] For example, the material of the fourth sealing ring m4 can be rubber or synthetic rubber. In other embodiments, the material of the fourth sealing ring m4 can also be other materials that can provide a sealing effect and are elastic.

[0226] Embodiments of this disclosure also provide an imaging device 1000, referring to FIG21, including the imaging device 100 provided in any of the above embodiments and a processor 200, wherein the processor 200 is electrically connected to the sensing layer 20 in the imaging device 100. Specifically, the processor 200 is electrically connected to the sensing layer 20 in the imaging device 100 via a circuit board.

[0227] The processor 200 receives electrical signals from the sensing layer 20 of the imaging device 100 via a circuit board. The processor 200 processes the received electrical signals, converting them into images, which are then displayed on the screen of the processor 200. During diagnosis, doctors can utilize the image information displayed on the screen of the processor 200 to conduct a comprehensive and in-depth analysis of the patient's health condition.

[0228] In some embodiments, continuing to refer to FIG21, the processor 200 is also electrically connected to the sound source plate 30 in the imaging device 100. Specifically, the processor 200 is electrically connected to the sound source emitting in the sound source plate 30 via a signal line. The processor 200 can control the frequency of the ultrasonic waves emitted by the sound source via the signal line, so that the processor 200 can control the operating state of the sound source in real time and accurately.

[0229] Under the precise control of the processor 200, the sound source can emit ultrasonic waves according to preset parameters. The processor 200 can also dynamically adjust the frequency of the ultrasonic waves according to the depth of human tissue, ensuring that the imaging device 1000 can obtain clear and accurate images in different media or different detection targets, thereby enhancing the detection accuracy and reliability of the imaging device 1000.

[0230] Specifically, the processor 200 can dynamically adjust the frequency of the ultrasonic waves emitted by the sound source according to imaging requirements. The choice of frequency is crucial, as it directly affects key parameters such as the penetration power, resolution, and imaging depth of the ultrasonic waves. For example, when the imaging device 1000 needs to image deeper tissues of the human body, the processor 200 will instruct the sound source to emit ultrasonic waves at a lower frequency to improve penetration; while when the imaging device 1000 needs to image shallower tissues of the human body, the processor 200 will instruct the sound source to emit ultrasonic waves at a higher frequency.

[0231] The processor 200 can also monitor the start-up, shutdown, and emission intensity of the sound source in real time, ensuring that the ultrasonic waves emitted by the sound source each time meet the preset imaging parameters, thereby optimizing the imaging effect and efficiency of the imaging device 1000. This dynamic control mechanism of the imaging device 1000 not only improves the flexibility and adaptability of the imaging device 1000, but also provides solid technical support for achieving high-quality ultrasonic imaging.

[0232] The imaging device 1000 provided in this embodiment can be applied to clinical diagnosis, surgical navigation, disease monitoring, etc. Through the imaging technology of the imaging device 1000, information on the internal structure, function, and lesions of the human body can be obtained, which is beneficial for doctors to diagnose and treat patients.

[0233] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An imaging device, comprising: A first housing, the first housing having a first receiving cavity, the first housing having a first opening and a second opening communicating with the first receiving cavity, the first opening and the second opening being opposite to each other in a first direction; A sensing layer covers the first opening; the sensing layer is a flexible structure. A sound source plate covers the second opening, and the sound source plate is provided with a sound emission source, and the sound radiation surface of the sound source plate faces the sensing layer; the sound source plate is a rigid structure, and there is a gap between the sensing layer and the sound radiation surface along the first direction; The first direction is perpendicular to the acoustic radiation surface.

2. The imaging device according to claim 1, wherein, The first housing includes a first side plate, a first bottom plate, and a support portion; The first side plate forms the first opening at its first end in the first direction; the second end of the first side plate is connected to the first bottom plate in the first direction, so that the first side plate and the first bottom plate form the first receiving cavity. The first base plate is provided with the second opening; The first end of the support portion is connected to the first end of the first side plate, the support portion surrounds the first opening, and the second end of the support portion extends in a predetermined direction; The preset direction is perpendicular to the first direction, and the preset direction is any direction radiating from the center of the first opening to the surrounding area of ​​the first opening; The edge of the sensing layer is disposed on the bearing portion.

3. The imaging device according to claim 2, further comprising: A limiting member is provided on the edge of the sensing layer away from the bearing portion and surrounds the first opening; The limiting member, the sensing layer, and the supporting part are connected.

4. The imaging device according to claim 3, wherein, The limiting member is provided with a first through hole, the sensing layer is provided with a second through hole, and the bearing part is provided with a first fixing hole; The imaging device further includes a first fixing member, which passes through the first through hole, the second through hole and the first fixing hole to connect the limiting member, the sensing layer and the supporting part.

5. The imaging apparatus according to claim 4, wherein, The first housing also includes a connecting portion and an extension portion; The connecting portion surrounds the supporting portion, and the extension portion surrounds the connecting portion; the connecting portion is connected between the second end of the supporting portion and the extension portion, and the extension portion extends along the preset direction; Along the first direction, the distance from the extension portion to the sound source plate is greater than the distance from the support portion to the sound source plate, so that the extension portion, the connecting portion and the support portion form a groove; the sensing layer and the limiting member are disposed in the groove.

6. The imaging apparatus according to claim 5, wherein, The connecting part is provided with a third opening; The imaging device further includes a circuit board, one end of which is electrically connected to the sensing layer, and the other end of which passes sequentially through the third opening between the support portion and the limiting member.

7. The imaging apparatus according to claim 6, wherein, The first housing also includes an extension support, one end of which is connected to the portion of the support exposed in the third opening, and the other end extends along the preset direction; A portion of the circuit board is disposed on the surface of the extended support.

8. The imaging apparatus according to claim 7, further comprising: A first adhesive layer is disposed between the extended support and the circuit board.

9. The imaging apparatus according to any one of claims 5 to 8, wherein, Relative to the sound source plate, the surface of the limiting member away from the sound source plate is lower than the surface of the extension portion away from the sound source plate; or, The surface of the limiting member away from the sound source plate is flush with the surface of the extension portion away from the sound source plate.

10. The imaging apparatus according to any one of claims 5 to 9, wherein, The connection between the connecting part and the extension part is a rounded corner transition.

11. The imaging apparatus according to claim 4, wherein, The limiting component includes a first part and a second part; The first portion overlaps with the supporting portion in the first direction; The second part surrounds and is connected to the first part, and the second part extends along the preset direction.

12. The imaging apparatus according to claim 11, further comprising: A circuit board, one end of which is electrically connected to the sensing layer, and the other end of which extends out from between the carrier and the limiting member.

13. The imaging apparatus according to any one of claims 4 to 12, wherein, The surface of the bearing portion facing the sensing layer is provided with a first groove, and the first groove surrounds the first opening; The imaging device also includes a first sealing ring disposed within the first groove.

14. The imaging apparatus according to claim 13, wherein, The surface of the bearing portion facing the sensing layer is further provided with a second groove, the second groove being located on the side of the first groove away from the first opening and surrounding the first opening; The imaging device further includes a second sealing ring disposed within the second groove.

15. The imaging apparatus according to claim 14, wherein, The first fixing hole is located between the first sealing ring and the second sealing ring.

16. The imaging apparatus according to claim 13, wherein, The first sealing ring has a third through hole, and the first fixing member passes through the first through hole, the second through hole, the three-way hole and the first fixing hole to connect the limiting member, the sensing layer, the first sealing ring and the bearing part.

17. The imaging apparatus according to claim 16, wherein, There is a gap between the side of the first sealing ring away from the first opening and the side of the first groove away from the first opening; The imaging device further includes a sealant layer, which fills the gap and surrounds the first sealing ring.

18. The imaging apparatus according to claim 16 or 17, wherein, A portion of the bottom of the first groove is recessed to form a third groove. The dimension of the third groove along the preset direction is smaller than the dimension of the first groove along the preset direction, and the third groove surrounds the first opening. A portion of the first sealing ring is located within the third groove.

19. The imaging apparatus according to any one of claims 2 to 18, wherein, The first cavity is filled with coupling fluid.

20. The imaging apparatus according to claim 19, wherein, The sound source plate also includes a fixing plate, the edge of which is connected to the first base plate, and the fixing plate blocks the second opening; The fixing plate is provided with a plurality of first openings, the emitting end of the sound source extends into the first opening and is connected to the fixing plate, and the non-emitting end of the sound source extends away from the first receiving cavity.

21. The imaging apparatus according to claim 20, wherein, The first base plate is provided with a second fixing hole, and the fixing plate is provided with a fourth through hole; The imaging device further includes a second fixing member, which passes through the fourth through hole and the second fixing hole to connect the fixing plate to the first base plate.

22. The imaging apparatus according to claim 20 or 21, further comprising: The second housing includes a second side plate and a second bottom plate; One end of the second side plate is connected to the second bottom plate, and the other end of the second side plate is connected to the first housing, so that the second side plate and the second bottom plate form a second receiving cavity; The sound source plate is located inside the second receiving cavity.

23. The imaging apparatus according to claim 19, wherein, The sound source plate also includes a fixing plate, the non-emitting end of the sound source is connected to the fixing plate, and the emitting end of the sound source extends toward the first receiving cavity; The imaging device further includes: a second housing, the second housing including a second side plate and a second bottom plate, one end of the second side plate being connected to the second bottom plate, and the other end of the second side plate being connected to the first housing, so that the second side plate and the second bottom plate form a second receiving cavity; The sound source plate is disposed in the second receiving cavity, and the fixing plate is connected to the second base plate.

24. The imaging apparatus according to claim 23, wherein, The sound source plate also includes a third side plate; One end of the third side plate is connected to the fixed plate, and the other end of the third side plate abuts against the first bottom plate, so that the third side plate and the fixed plate form a third receiving cavity; The third receiving cavity is connected to the first receiving cavity, and the coupling fluid is also filled in the third receiving cavity.

25. The imaging apparatus according to claim 23, wherein, The sound source board also includes a third side plate and an encapsulation layer; One end of the third side plate is connected to the fixing plate, and the encapsulation layer seals the opening formed by the other end of the third side plate and the second opening; The encapsulation layer has multiple second openings, and the emitting end of the sound source extends into the second opening.

26. The imaging apparatus according to any one of claims 22 to 25, wherein, The first housing has a first connecting structure at one end near the second housing, and the second side plate of the second housing has a second connecting structure at one end near the first housing. The first connecting structure and the second connecting structure are connected.

27. The imaging apparatus according to claim 26, wherein, The second side plate of the second housing is also provided with a wire passage groove, which is used for signal lines connected to the sound source board to pass through; The threading groove and the second connecting structure are spaced apart along the circumference of the second housing.

28. The imaging apparatus according to any one of claims 19 to 27, wherein, The first base plate has a fourth groove on the side away from the sensing layer, and the fourth groove surrounds the second opening; The imaging device further includes a fourth sealing ring disposed within the fourth groove.

29. The imaging apparatus according to any one of claims 19 to 28, wherein, The first base plate is provided with a liquid injection port, which is connected to the first receiving cavity.

30. The imaging apparatus according to any one of claims 1 to 29, wherein, The sound source includes a first sound source configured to emit a first ultrasonic wave and a second ultrasonic wave in a time-division multiplexing configuration; or... The sound source includes a first sound source and a second sound source, wherein the first sound source is configured to emit a first ultrasonic wave and the second sound source is configured to emit a second ultrasonic wave. The first and second ultrasonic waves have different frequencies.

31. The imaging apparatus according to claim 30, wherein, The sensing layer includes a first sensor configured to receive the first ultrasonic wave and the second ultrasonic wave in a time-division multiplexing manner; or... The sensing layer includes a first sensor and a second sensor, the first sensor being configured to receive the first ultrasonic wave and the second sensor being configured to receive the second ultrasonic wave.

32. An imaging device, comprising: The imaging apparatus as described in any one of claims 1 to 31; The processor is electrically connected to the sensing layer.

Images