Low-shrinkage-rate epoxy resin composition and use thereof in IPM packaging

By combining epoxy resin with a specific structure, curing agent, inorganic filler, and catalyst, the problems of insufficient shrinkage and temperature resistance of epoxy resin in IPM encapsulation are solved, resulting in an epoxy resin composition with low shrinkage and high heat resistance, suitable for IPM module encapsulation.

WO2026156943A1PCT designated stage Publication Date: 2026-07-30SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO LTD
Filing Date
2025-02-08
Publication Date
2026-07-30

AI Technical Summary

Technical Problem

Existing epoxy resins cannot simultaneously meet the requirements for shrinkage rate and temperature resistance in IPM encapsulation, affecting the dimensional stability and reliability of the encapsulated components.

Method used

By combining epoxy resins with specific structures, curing agents, inorganic fillers, and catalysts, and by adjusting the formulation and preparation process, the molding shrinkage rate is reduced and the glass transition temperature is increased, thus forming an epoxy resin composition with high heat resistance and dimensional stability.

Benefits of technology

This achieves low shrinkage and high heat resistance in the epoxy resin composition, ensuring dimensional stability and reliability of the encapsulated products, and is suitable for the processing requirements of IPM modules.

✦ Generated by Eureka AI based on patent content.

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  • Figure PCTCN2025076505-FTAPPB-I100001
    Figure PCTCN2025076505-FTAPPB-I100001
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    Figure PCTCN2025076505-FTAPPB-I100002
  • Figure PCTCN2025076505-FTAPPB-I100003
    Figure PCTCN2025076505-FTAPPB-I100003
Patent Text Reader

Abstract

The present invention relates to the technical field of electronic packaging materials, and in particular to a low-shrinkage-rate epoxy resin composition and a use thereof in IPM packaging. The raw materials of the epoxy resin composition comprise, in parts by weight, 3-18 parts of an epoxy resin, 1-10 parts of a curing agent, 50-120 parts of an inorganic filler, and 0.01-3 parts of a catalyst. According to the present invention, by means of the effects of the epoxy resin having a specific structure, the curing agent, etc., the shrinkage rate during molding can be greatly reduced. This characteristic is crucial for ensuring the dimensional stability and precision of a final packaged product. By inhibiting shrinkage, deformation or defects caused by uneven material shrinkage can be effectively avoided, thereby improving the overall quality and reliability of the product, so as to meet use requirements on electronically packaged (especially IPM module) parts.
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