Automatic encapsulation apparatus for semiconductor panels

Abstract

Disclosed in the present invention is an automatic encapsulation apparatus for semiconductor panels, comprising a machine base (1). A feeding station (11) is mounted on the machine base (1), a discharging station (12) is mounted on one side of the feeding station (11), a plurality of linearly arranged linear transport modules (2) are mounted between the feeding station (11) and the discharging station (12), film lamination fixtures (3) are mounted on the linear transport modules (2), a loading and unloading transfer mechanism (4) is mounted at one end between the plurality of linear transport modules (2), a film supply station (5) is mounted on one side of the other end between the linear transport modules (2), a film lamination transfer mechanism (6) is mounted on one side of the film supply station (5), a film peeling mechanism (7) is provided on one side of the film lamination transfer mechanism (6), a waste collection chamber (8) is mounted on one side of the film peeling mechanism (7), and a film pressing mechanism (9) is mounted above each linear transport module (2). The automatic encapsulation apparatus for semiconductor panels of the present invention achieves fully automatic lamination and encapsulation of semiconductor panels, and can simultaneously perform lamination and encapsulation on a plurality of semiconductor panels in parallel, thereby achieving high production efficiency and high film lamination precision.

Description

An automated packaging equipment for semiconductor boards Technical Field

[0001] This utility model relates to the technical field of film-applying machines for semiconductor boards, and particularly to an automatic packaging device for semiconductor boards. Background Technology

[0002] Automated encapsulation of semiconductor boards refers to the process of automatically bonding a film material to semiconductor boards and then pressing the boards together for a period of time to effectively ensure the quality of the encapsulation bonding.

[0003] Semiconductor components include LED modules, transistor modules, and PCB integrated circuit boards, etc.

[0004] Membrane materials include films, adhesive films, or prepregs, etc.

[0005] Previously, semiconductor boards were packaged and bonded manually. Now, semiconductor boards are packaged and bonded using automated packaging and bonding equipment. Using automated packaging and bonding equipment can greatly improve the packaging and bonding efficiency and quality of semiconductor boards, and significantly reduce the generation of air bubbles after packaging and bonding.

[0006] However, current semiconductor packaging bonding equipment still suffers from low production efficiency.

[0007] For example, Chinese invention patent CN114043735B, entitled "A MINI LED Packaging Film Applying Machine and Its Usage Method," mainly discloses a production line-type semiconductor packaging bonding machine and its usage method. However, this machine has the following defects:

[0008] 1. Due to the mechanical limitations of this packaging and bonding machine, it can only package one semiconductor board at a time, and cannot package multiple semiconductor boards at once, resulting in low film bonding production efficiency.

[0009] (There are two reasons for the low production efficiency of this film application:)

[0010] First, this packaging and bonding machine cannot perform parallel film bonding; it can only linearly arrange multiple packaging and bonding machines for packaging (which would greatly increase equipment costs, so we will not consider it). If this packaging and bonding machine were to perform parallel film bonding, it would cause the semiconductor boards to run asynchronously, and the parallel semiconductor boards would be torn by the protective film, resulting in poor film bonding quality. Therefore, it can be deduced that this packaging and bonding machine is not suitable for parallel film bonding and can only perform film bonding on one semiconductor board at a time, just like a production line.

[0011] Second: The first unwinding mechanism of this packaging and bonding machine is used to apply protective films to semiconductor boards, while the second unwinding mechanism is used to press the semiconductor boards with the protective film. The former requires less time, while the latter requires more time (a certain holding time is needed to improve the film application quality and reduce air bubble formation). At this time, while one semiconductor board is being pressed, the next semiconductor board is waiting, which leads to very slow production efficiency and low utilization of the first unwinding mechanism, leaving it idle for extended periods.

[0012] 2. Each time the machine is turned on, manual handling is still required, which is cumbersome, poses safety hazards, and is not conducive to achieving unmanned, fully automated film application production.

[0013] Utility Model Content

[0014] The purpose of this invention is to overcome the aforementioned deficiencies in the prior art and provide an automated packaging device for semiconductor boards.

[0015] First, this semiconductor board packaging equipment can package and bond semiconductor boards on several linear transport modules and film-applying fixtures in one go, resulting in high production efficiency.

[0016] Secondly, this semiconductor board packaging and bonding machine achieves unmanned, fully automated packaging and bonding, greatly reducing the labor intensity of manual handling and making operation simpler.

[0017] To achieve the above objectives, this utility model provides an automatic packaging equipment for semiconductor boards, including a machine base. A feeding station is mounted on the machine base, and a discharging station is mounted on one side of the feeding station. A plurality of linearly arranged linear transport modules are installed between the feeding station and the discharging station. A film-applying fixture is mounted on each linear transport module. One end of each linear transport module is equipped with a loading / unloading transfer mechanism for transferring semiconductor boards from the feeding station to one of the film-applying fixtures or transferring semiconductor boards from the film-applying fixture to the discharging station. The other end of the two mechanisms is equipped with a film feeding station. A film-applying transfer mechanism is mounted on one side of the film feeding station. A film-tearing mechanism that cooperates with the film-applying transfer mechanism is mounted on one side of the film-tearing mechanism. A waste collection bin is mounted on one side of the film-tearing mechanism. A film-pressing mechanism is mounted above each of the linear transport modules.

[0018] Preferably, the feeding station is equipped with two symmetrically arranged first mounting plates, each first mounting plate is equipped with a first transport drive motor, and each first transport drive motor is connected to a first transport belt for transporting semiconductor board materials. A first lifting cylinder is installed between the two first mounting plates, and the first lifting cylinder is equipped with a first vacuum nozzle assembly for gripping semiconductor board materials.

[0019] Preferably, the unloading station is equipped with two symmetrically arranged second mounting plates, each of which is equipped with a second transport drive motor, and each of the second transport drive motors is connected to a second transport belt for transporting semiconductor board materials.

[0020] Preferably, the loading and unloading transfer mechanism includes a first mounting frame on both sides of one end between several linear transport modules, a first Y-axis drive module mounted on the first mounting frame, a first X-axis drive module mounted between two first Y-axis drive modules, a first Z-axis drive module mounted on the first X-axis drive module, a first rotary drive module mounted on the first Z-axis drive module, and a clamping manipulator mounted on the first rotary drive module. A first CCD imaging module is mounted below the clamping manipulator. The clamping manipulator includes a clamping drive cylinder mounted at the bottom of the first rotary drive module, clamping arms mounted at both ends of the clamping drive cylinder, and grippers mounted on both sides of the clamping arms.

[0021] Preferably, the membrane material feeding station is equipped with synchronous wheel and synchronous belt transport modules at both ends, and a material bin is connected between the two synchronous wheel and synchronous belt transport modules. A lifting drive module is installed at the bottom of the material bin.

[0022] Preferably, the film-applying and transferring mechanism includes a second mounting frame mounted on both sides of the other end between several linear transport modules, a second Y-axis drive module mounted on the second mounting frame, a second X-axis drive module mounted between two second Y-axis drive modules, a second Z-axis drive module mounted on the second X-axis drive module, a second rotary drive module mounted on the second Z-axis drive module, and a film-applying module mounted on the second rotary drive module. A second CCD imaging module is mounted below the film-applying module. The film-applying module includes a vacuum suction cup mounted at the bottom of the second rotary drive module and a film-applying roller assembly mounted at one end of the vacuum suction cup. The film-applying roller assembly includes a first support plate mounted on the top of the vacuum suction cup, a pressing cylinder mounted on the first support plate, a slide rail slider assembly mounted on both sides of the first support plate, a second support plate mounted on the pressing cylinder and slidably connected to the slide rail slider assembly, a film-applying roller hinged to the second support plate, and a pressing spring mounted on the top of the film-applying roller.

[0023] Preferably, the film-tearing mechanism includes a support frame, a rotary motor mounted on the support frame, a pneumatic gripper cylinder mounted on the rotary motor, and an air nozzle mounted on one side of the pneumatic gripper cylinder.

[0024] Preferably, each of the linear transport modules is equipped with a film-supporting mechanism on one side, which cooperates with the film-applying and transferring mechanism. The film-supporting mechanism includes a linear cylinder module installed on one side of the linear transport module, a sliding frame installed on the linear cylinder module, a proximity sensor installed on the sliding frame, a first support arm installed on the sliding frame, a second support arm hinged to the first support arm, and film-supporting rods respectively installed on the first support arm and the second support arm.

[0025] Preferably, the film-applying fixture is provided with a vacuum suction hole, and a PTC heating tube is installed inside the film-applying fixture.

[0026] Preferably, the pressing mechanism includes a base frame mounted above a corresponding linear transport module, an unwinding roller mounted on the base frame, a take-up roller mounted on one side of the unwinding roller, a release film connected to the unwinding roller and the take-up roller respectively, and a pressing roller assembly mounted between the unwinding roller and the take-up roller for pressing the top of the release film downward. The pressing roller assembly includes a lifting drive motor mounted on the base frame, a guide sleeve mounted on the base frame, a guide rod slidably connected to the guide sleeve, and a pressing roller mounted on the lifting drive motor and connected to the guide rod. A heating rod is inserted into one side of the pressing roller.

[0027] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0028] 1. The feeding station of this utility model can be used for automated feeding of semiconductor board materials. The semiconductor board materials are picked up by the loading and unloading transfer mechanism and transferred to the film-applying fixture of one of the linear transport modules.

[0029] After several film-applying fixtures are loaded, the corresponding linear transport module moves the film-applying fixture to the other end.

[0030] The film-applying and transferring mechanism takes a film material from the film material feeding station, and then moves to the film-tearing mechanism, which peels off the protective film from the film material and puts it into the waste collection bin.

[0031] The film-applying and transfer mechanism applies the film material to the semiconductor board material of the film-applying fixture;

[0032] The linear transport module moves the film-applying fixture to the underside of the film-pressing mechanism, which then applies pressure to the semiconductor board material.

[0033] After the molding and pressure holding are completed, the linear transport module moves the film-applying fixture to one end, and the semiconductor board material is picked up and transferred to the unloading station by the loading and unloading transfer mechanism.

[0034] 2. In the operation process described in 1 above, the present invention provides an automatic packaging equipment for semiconductor boards.

[0035] First: It has achieved fully automated semiconductor board packaging and bonding, with no human intervention throughout the process. The operation is simple, greatly reducing the labor intensity of operators and avoiding safety hazards.

[0036] Second: It can encapsulate and bond several semiconductor boards using film-coating fixtures in parallel at one time, thereby effectively improving production efficiency;

[0037] Among them, the loading and unloading transfer mechanism has the fastest loading speed, and can quickly load and unload boards from multiple semiconductor fields.

[0038] The film-applying transfer mechanism has a fast film-applying speed, enabling rapid film application to multiple semiconductor boards.

[0039] The molding and pressure holding process of the laminating mechanism requires a certain amount of time. The laminating mechanism and the film-applying fixture perform molding and pressure holding one-to-one.

[0040] The aforementioned loading / unloading transfer mechanism, film-applying transfer mechanism, and film-pressing mechanism can be controlled by program logic to achieve the fastest production efficiency and ensure that each of these mechanisms operates at its maximum efficiency. (This avoids the lower efficiency issues that occur when the loading / unloading transfer mechanism has to wait for the film-pressing mechanism to complete its pressing and pressure holding process before loading the next film-applying fixture.) Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 is a schematic diagram of the structure of an automatic packaging equipment for semiconductor boards provided in an embodiment of this utility model;

[0043] Figure 2 is a schematic diagram of the structure of the feeding station, loading and unloading transfer mechanism, linear transport module, film-applying fixture, and unloading station provided in the embodiment of this utility model;

[0044] Figure 3 is a schematic diagram of the feeding station provided in an embodiment of this utility model;

[0045] Figure 4 is a structural schematic diagram of the loading and unloading transfer mechanism provided in an embodiment of this utility model;

[0046] Figure 5 is a schematic diagram of the material discharge station provided in an embodiment of this utility model;

[0047] Figure 6 is a schematic diagram of the structure of the linear transport module, film application fixture, film material feeding station, film application and transfer mechanism, film tearing mechanism and waste collection bin provided in the embodiment of this utility model;

[0048] Figure 7 is a schematic diagram of the film-applying and transferring mechanism provided in an embodiment of this utility model;

[0049] Figure 8 is a schematic diagram of the film-tearing mechanism provided in an embodiment of this utility model;

[0050] Figure 9 is a structural schematic diagram of the linear transport module and film-applying fixture provided in an embodiment of this utility model;

[0051] Figure 10 is a schematic diagram of the pressing mechanism provided in an embodiment of this utility model.

[0052] The diagram includes: 1. Machine base; 11. Feeding station; 110. First mounting plate; 111. First transport drive motor; 112. First conveyor belt; 113. First lifting cylinder; 114. First vacuum nozzle assembly; 12. Discharge station; 120. Second mounting plate; 121. Second transport drive motor; 122. Second conveyor belt; 2. Linear transport module; 3. Film application fixture; 31. Vacuum suction hole; 35. Film support module; 350. Linear cylinder module; 351. Sliding frame; 352. Proximity sensor; 353. First support arm; 354. Second support arm; 355. Film support rod; 4. Loading / unloading transfer mechanism; 40. First mounting frame; 41. First Y-axis drive module; 42. First X-axis drive module; 43. First Z-axis drive module; 44. First rotary drive module; 45. Clamping robot; 451. Clamping drive cylinder; 452. Clamping arm; 453. Gripper; 46. First CCD imaging module; 5. Film material feeding station; 51. Synchronous pulley and synchronous belt transport module; 52. Material bin; 53. 6. Lifting drive module; 6. Film application and transfer mechanism; 60. Second mounting bracket; 61. Second Y-axis drive module; 62. Second X-axis drive module; 63. Second Z-axis drive module; 64. Second rotation drive module; 65. Film application module; 651. Vacuum suction cup; 652. Film application roller assembly; 6520. First support plate; 6521. Pressing cylinder; 6522. Slide rail slider assembly; 6523. Second support plate; 6524. Film application roller; 6525. Compression spring; 66. Second CCD camera module; 7. Film tearing mechanism; 70. Support frame; 71. Rotary motor; 72. Pneumatic gripper cylinder; 73. Air nozzle; 8. Waste collection bin; 9. Film pressing mechanism; 90. Base frame; 91. Unwinding roller; 92. Rewinding roller; 93. Release film; 94. Film pressing roller assembly; 941. Lifting drive motor; 942. Guide sleeve; 943. Guide rod; 944. Film pressing roller; 945. Heating rod. Detailed Implementation

[0053] The technical solution of this embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiment is one embodiment of the present invention, and not all embodiments thereof. Based on this embodiment of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0054] Please refer to Figures 1 to 10. An embodiment of this utility model provides an automatic packaging equipment for semiconductor boards, including a machine base 1. The machine base 1 is equipped with a feeding station 11, and a discharging station 12 is installed on one side of the feeding station 11. A plurality of linearly arranged linear transport modules 2 are installed between the feeding station 11 and the discharging station 12. A film-applying fixture 3 is installed on the linear transport modules 2. One end of the plurality of linear transport modules 2 is equipped with a loading and unloading transfer mechanism 4 for transferring semiconductor boards from the feeding station 11 to one of the film-applying fixtures 3 or transferring semiconductor boards from the film-applying fixture 3 to the discharging station 12. One side of the other end is equipped with a film material feeding station 5. A film-applying transfer mechanism 6 is installed on one side of the film material feeding station 5. A film-tearing mechanism 7 that cooperates with the film-applying transfer mechanism 6 is provided on one side of the film-tearing mechanism 6. A waste collection bin 8 is installed on one side of the film-tearing mechanism 7. A film-pressing mechanism 9 is installed above each linear transport module 2.

[0055] The feeding station 11 is equipped with two symmetrically arranged first mounting plates 110. Each first mounting plate 110 is equipped with a first transport drive motor 111, and each first transport drive motor 111 is connected to a first transport belt 112 for transporting semiconductor circuit boards. A first lifting cylinder 113 is installed between the two first mounting plates 110, and a first vacuum nozzle assembly 114 for gripping the semiconductor circuit board is installed on the first lifting cylinder 113. The feeding station 11 is also equipped with a pressure sensor. The first vacuum nozzle assembly 114 includes several first vacuum nozzles. By using these first vacuum nozzles to hold and lift the semiconductor circuit board, the pressure value can be adjusted in real time.

[0056] The working principle of the feeding station 11 is as follows: the first mounting plate 110 is used to install the first transport drive motor 111, the first transport drive motor 111 is used to drive the first transport belt 112 to rotate back and forth, and the first mounting plate 110 is also equipped with driven wheels to facilitate the tension and movement of the first transport belt 112. The two first transport belts 112 transport the semiconductor board material. Then, the first lifting cylinder 113 drives the first vacuum nozzle assembly 114 to lift the semiconductor board material out, waiting for the loading and unloading transfer mechanism 4 to grab it.

[0057] The unloading station 12 is equipped with two symmetrically arranged second mounting plates 120. Each second mounting plate 120 is equipped with a second transport drive motor 121. Each second transport drive motor 121 is connected to a second transport belt 122 for transporting semiconductor board materials.

[0058] The working principle of the unloading station 12 is as follows: the second mounting plate 120 is used to install the second transport drive motor 121, the second transport drive motor 121 is used to drive the second transport belt 122 to rotate back and forth, and the second mounting plate 120 is also equipped with driven wheels to facilitate the tensioning and movement of the second transport belt 122. The two second transport belts 122 transport semiconductor board materials to the next automated equipment.

[0059] The loading and unloading transfer mechanism 4 includes a first mounting frame 40 mounted on both sides of one end between several linear transport modules 2, a first Y-axis drive module 41 mounted on the first mounting frame 40, a first X-axis drive module 42 mounted between two first Y-axis drive modules 41, a first Z-axis drive module Z43 mounted on the first X-axis drive module 42, a first rotary drive module 44 mounted on the first Z-axis drive module Z43, and a gripping robot 45 mounted on the first rotary drive module 44. A first CCD imaging module 46 is mounted below the gripping robot 45. The gripping robot 45 includes a gripping drive cylinder 451 mounted at the bottom of the first rotary drive module 44, gripping arms 452 mounted at both ends of the gripping drive cylinder 451, and grippers 453 mounted on both sides of the gripping arms 452.

[0060] The working principle of the loading and unloading transfer mechanism 4 is as follows:

[0061] The first Y-axis drive module 41, the first X-axis drive module 42, and the first Z-axis drive module Z43 are used to provide three-dimensional transfer motion;

[0062] The gripping robot 45 is used to transfer semiconductor field boards on the feeding station 11 to one of the film-applying fixtures 3 or to transfer semiconductor field boards on the film-applying fixture 3 to the unloading station 12;

[0063] The gripping robot 45, through the combination of gripping drive cylinder 451, gripping arm 452 and gripper 453, can achieve rapid gripping and releasing, thereby improving loading and unloading efficiency.

[0064] The first CCD imaging module 46 includes a CCD camera and light sources mounted on both sides of the CCD camera. The first CCD imaging module 46 is used to take pictures of the semiconductor board material on the gripping robot arm 45. Then, through the above-mentioned three-dimensional transfer motion and the rotational motion of the first rotation drive module 44, the placement position of the semiconductor is adjusted, so that the semiconductor board material is accurately positioned and placed on the film-applying fixture 3 during the loading process.

[0065] Synchronous pulley and synchronous belt transport modules 51 are installed at both ends of the film material feeding station 5. A material bin 52 is connected between the two synchronous pulley and synchronous belt transport modules 51. A lifting drive module 53 is installed at the bottom of the material bin 52. The synchronous pulley and synchronous belt transport modules 51 are used to drive the material bin 52 to move back and forth, thereby facilitating the feeding of the material bin 52. Whenever the film application and transfer mechanism 6 takes a piece of film material from the film material feeding station 5, the lifting drive module 53 will drive the material bin 52 to rise a distance, thereby facilitating the film application and transfer mechanism 6 to grasp the film material.

[0066] The film-applying transfer mechanism 6 includes second mounting brackets 60 mounted on both sides of the other end between several linear transport modules 2, a second Y-axis drive module 61 mounted on the second mounting brackets 60, a second X-axis drive module 62 mounted between two second Y-axis drive modules 61, a second Z-axis drive module 63 mounted on the second X-axis drive module 62, a second rotary drive module 64 mounted on the second Z-axis drive module 63, and a film-applying module 65 mounted on the second rotary drive module 64. A second CCD imaging module 66 is mounted below the film-applying module 65, and the film-applying module 65 includes a vacuum suction cup mounted at the bottom of the second rotary drive module 64. 651 and a film-applying roller assembly 652 installed at one end of the vacuum suction cup 651. The film-applying roller assembly 652 includes a first support plate 6520 installed on the top of the vacuum suction cup 651, a pressing cylinder 6521 installed on the first support plate 6520, a slide rail slider assembly 6522 installed on both sides of the first support plate 6520, a second support plate 6523 installed on the pressing cylinder 6521 and slidably connected to the slide rail slider assembly 6522, a film-applying roller 6524 hinged to the second support plate 6523, and a pressing spring 6525 installed on the top of the film-applying roller 6524 (the top of the film-applying roller 6524 abuts against the bottom of the pressing spring 6525).

[0067] The film application principle of the film application and transfer mechanism 6 is as follows:

[0068] The second Y-axis drive module 61, the second X-axis drive module 62, and the second Z-axis drive module 63 are used to provide three-dimensional transfer motion;

[0069] The film-applying module 65 has two embodiments:

[0070] First embodiment: The film application module 65, the film peeling mechanism 7, and the film application fixture 3 work together to apply the film;

[0071] The second embodiment: The film application module 65, the film tearing mechanism 7, the film supporting mechanism 35 and the film application fixture 3 work together to apply the film (the principle will be explained below);

[0072] The second CCD imaging module 66 includes a CCD camera and light sources mounted on both sides of the CCD camera. The second CCD imaging module 66 is used to take pictures of the film material on the film application module 65. Then, the placement position of the film material is adjusted by the three-dimensional transfer motion and the rotational motion of the second rotation drive module 64, so that the film material can be accurately positioned and placed on the film application fixture 3 during the feeding process.

[0073] (Compared to existing technologies, this greatly improves the film application accuracy. If existing film application methods are used, the rolled-up protective film is used to apply the film to semiconductor boards. The rolled-up protective film itself is very long, which naturally results in a large width error. In addition, the operation of the rolling equipment will cause a certain positional offset error in the protective film. The combination of these two errors will lead to low film application quality and large film application errors in semiconductor boards. It is only suitable for film application occasions where the requirements for film application accuracy are not high.)

[0074] The film-tearing mechanism 7 includes a support frame 70, a rotary motor 71 mounted on the support frame 70, a pneumatic gripper cylinder 72 mounted on the rotary motor 71, and an air nozzle 73 mounted on one side of the pneumatic gripper cylinder 72. Further, a baffle is mounted on one side of the air nozzle 73, and a waste collection bin 8 is mounted on the side below the pneumatic gripper cylinder 72.

[0075] Each linear transport module 2 is equipped with a film-supporting mechanism 35 on one side, which cooperates with the film-applying and transferring mechanism 6. The film-supporting mechanism 35 includes a linear cylinder module 350 installed on one side of the linear transport module 2, a sliding frame 351 installed on the linear cylinder module 350, a proximity sensor 352 installed on the sliding frame 351, a first support arm 353 installed on the sliding frame 351, a second support arm 354 hinged to the first support arm 353, and film-supporting rods 355 respectively installed on the first support arm 353 and the second support arm 354.

[0076] Among them, the linear cylinder module 350 is a rodless cylinder used to drive the sliding frame 351 to reciprocate.

[0077] The film application fixture 3 is provided with a vacuum suction hole 31, and a PTC heating tube (not shown in the attached figure) is installed inside the film application fixture 3.

[0078] The film pressing mechanism 9 includes a base frame 90 mounted above the corresponding linear transport module 2, an unwinding roller 91 mounted on the base frame 90, a take-up roller 92 mounted on one side of the unwinding roller 91, a release film 93 connected to the unwinding roller 91 and the take-up roller 92 respectively, and a film pressing roller assembly 94 mounted between the unwinding roller 91 and the take-up roller 92 for pressing the top of the release film 93 downward. The film pressing roller assembly 94 includes a lifting drive motor 941 mounted on the base frame 90, a guide sleeve 942 mounted on the base frame 90, a guide rod 943 slidably connected to the guide sleeve 942, and a film pressing roller 944 mounted on the lifting drive motor 941 and connected to the guide rod 943. A heating rod 945 is inserted into one side of the film pressing roller 944.

[0079] An embodiment of this utility model provides an automated semiconductor board packaging device, the working principle of which is as follows:

[0080] S1: Feeding station 11 is used for automated feeding of semiconductor board materials. The first lifting cylinder 113 and the first vacuum nozzle assembly 114 separate individual semiconductor board materials to facilitate the loading and unloading transfer mechanism 4 to grasp them.

[0081] S2: Loading and unloading transfer mechanism 4, which can perform three-dimensional transfer motion. After the gripping robot 45 picks up the semiconductor board material on the feeding station 11, it transfers the semiconductor board material to the top of the first CCD imaging module 46 to accurately position the semiconductor board material. Through the three-dimensional transfer motion plus the rotation motion of the first rotation drive module 44, the position of the semiconductor board material is corrected and accurately positioned into one of the idle film-applying fixtures 3.

[0082] S3: The film-applying fixture 3 adsorbs the semiconductor board material through the vacuum suction hole 31 and preheats the semiconductor board material through the PCT heating tube to facilitate subsequent film application and lamination work.

[0083] S4: The linear transport module 2 moves the film-applying fixture 3 to its other end.

[0084] The film-applying and transferring mechanism 6 has a three-dimensional transfer motion. The film-applying and transferring mechanism 6 uses the vacuum suction cup 651 of the film-applying module 65 to adsorb the film material on the top of the material box 52 of the film material feeding station 5. After adsorption, the film material is brought above the second CCD imaging module 66 for precise positioning. Through the three-dimensional transfer motion plus the rotational motion of the second rotation drive module 64, the position of the film material device is corrected, thereby improving the subsequent film-applying accuracy.

[0085] S5: The film application and transfer mechanism 6, the film peeling mechanism 7, the film supporting mechanism 35, and the film application fixture 3 work together to complete the film application process, as detailed below:

[0086] S51: First, a protective film is attached to the bottom of the membrane material. One end of the protective film has a lifting ear that extends beyond the end of the membrane material. The protective film must be peeled off before the membrane material can be used. The lifting ear makes it easy for the film peeling mechanism 7 to contact the protective film and peel it off.

[0087] The film-applying and transferring mechanism 6 brings the film material to one end of the film-tearing mechanism 7, so that the lifting ear of the protective film is put into the air gripper cylinder 72. Then, the air gripper cylinder 72 clamps the lifting ear. Then, the rotating motor 71 rotates, causing the lifting ear to rotate, thereby separating the protective film from the film material.

[0088] Next, the film transfer mechanism 6 brings the film material above the film application fixture 3. During this process, the protective film and the film material are completely separated. At this time, the air gripper cylinder 72 is released, and the air nozzle 73 blows the protective film away, causing the protective film to fall naturally into the waste collection bin 8. At this time, the baffle effectively prevents the protective film from falling into the linear transport module 2, thereby preventing abnormal film application.

[0089] S52: When the vacuum suction cup 651 of the film application module 65 of the film application transfer mechanism 6 arrives at the top of the film application fixture 3;

[0090] The pressing cylinder 6521 of the film-applying roller assembly 652 of the film-applying module 65 presses down, so that the film-applying roller 6524 adheres one end of the film material to the semiconductor board. At this time, the pressing spring 6525 can provide floating pressing force for the film-applying roller 6524 to prevent the semiconductor board from being crushed. At the same time, the vacuum suction cup 651 releases the film material, and the film-supporting rods 355 on the first support arm 353 and the second support arm 354 of the film-supporting mechanism 35 support the film material.

[0091] Furthermore, the film-applying roller 6524 is slowly pressed backward by the film-applying transfer mechanism 6. Simultaneously, the linear cylinder module 350 of the film-supporting mechanism 35 drives the film-supporting rod 355 to slowly retract, thereby completing the work of applying the film material onto the semiconductor board. At this time, the advantage of setting the film-applying roller 6524 is that the uniformity and stability of the film application can be achieved by pressing down the film-applying roller 6524.

[0092] S6: The linear transport module 2 transports the film-applying fixture 3 to the bottom of the film-pressing mechanism 9. The lifting drive motor 941 of the film-pressing mechanism 9 drives the pressing roller to press down, so that the release film 93 abuts against the top of the semiconductor board. The pressing roller 944 presses and preserves the semiconductor board for a period of time.

[0093] S7: After the film pressing and preservation are completed, the linear transport module 2 transports the film-applying fixture 3 to one end, and the film-applying fixture 3 is placed on the discharge station 12 by the loading and unloading transfer mechanism 4.

[0094] An embodiment of the present invention provides an automated packaging device for semiconductor boards, the advantages of which are as follows:

[0095] First: It has achieved fully automated semiconductor board packaging and bonding, with no human intervention throughout the process. The operation is simple, greatly reducing the labor intensity of operators and avoiding safety hazards.

[0096] Second: It can encapsulate and bond several semiconductor boards in the film-coating fixture 3 in parallel at one time, thereby effectively improving production efficiency;

[0097] Among them, the loading and unloading transfer mechanism 4 has the fastest loading speed, and can quickly load and unload boards from multiple semiconductor fields.

[0098] The film-applying transfer mechanism 6 has a high film-applying speed, enabling rapid film application to multiple semiconductor boards.

[0099] The pressing and holding pressure of the molding mechanism 9 requires a certain amount of time. The molding and holding pressure of the molding mechanism 9 and the film-applying fixture 3 are performed one-to-one.

[0100] The aforementioned loading / unloading transfer mechanism 4, film-applying transfer mechanism 6, and film-pressing mechanism 9 can be controlled by program logic to achieve the fastest production efficiency and ensure that each of these mechanisms operates at its maximum efficiency. (This avoids situations where the loading / unloading transfer mechanism 4 needs to wait for the film-pressing mechanism 9 to complete its pressing and pressure holding process before the next film-applying fixture 3 can be loaded, resulting in lower efficiency.)

[0101] Third: The precise loading of semiconductor boards by the loading and unloading transfer mechanism 4 and the precise application of film by the film application transfer mechanism 6 result in high application accuracy and good application quality. This avoids the application errors caused by existing technologies that apply film using a single roll of film and its winding equipment. (A roll of film with excessive width will naturally have a certain width error, and the film winding equipment will naturally have machine position errors.)

[0102] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An automated packaging equipment for semiconductor boards, comprising a machine base (1), characterized in that, The machine (1) is equipped with a feeding station (11), and a discharging station (12) is installed on one side of the feeding station (11). A plurality of linearly arranged linear transport modules (2) are installed between the feeding station (11) and the discharging station (12). A film-applying fixture (3) is installed on the linear transport module (2). One end of the plurality of linear transport modules (2) is equipped with a device for transferring semiconductor board material on the feeding station (11) to one of the film-applying fixtures (3) or transferring the film-applying fixture to the other end. (3) The semiconductor board material is transferred to the unloading and loading transfer mechanism (4) at the unloading station (12). A film material feeding station (5) is installed on one side of the other end between the two. A film feeding station (5) is installed on one side of the film material feeding station (5). A film-applying transfer mechanism (6) is installed on one side of the film-applying transfer mechanism (6). A film-tearing mechanism (7) that cooperates with the film-applying transfer mechanism (6) is provided on one side of the film-tearing mechanism (7). A waste collection bin (8) is installed on one side of the film-tearing mechanism (7). A film-pressing mechanism (9) is installed above each of the linear transport modules (2).

2. The semiconductor board automatic packaging equipment according to claim 1, characterized in that, The feeding station (11) is equipped with two symmetrically arranged first mounting plates (110), each of the first mounting plates (110) is equipped with a first transport drive motor (111), each of the first transport drive motors (111) is connected to a first transport belt (112) for transporting semiconductor board materials, a first lifting cylinder (113) is installed between the two first mounting plates (110), and the first lifting cylinder (113) is equipped with a first vacuum nozzle assembly (114) for gripping semiconductor board materials.

3. The semiconductor board automatic packaging equipment according to claim 1, characterized in that, The unloading station (12) is equipped with two symmetrically arranged second mounting plates (120), each of the second mounting plates (120) is equipped with a second transport drive motor (121), and each of the second transport drive motors (121) is connected to a second transport belt (122) for transporting semiconductor board materials.

4. The semiconductor board automatic packaging equipment according to claim 1, characterized in that, The loading and unloading transfer mechanism (4) includes a first mounting frame (40) on both sides of one end between several linear transport modules (2), a first Y-axis drive module (41) mounted on the first mounting frame (40), a first X-axis drive module (42) mounted between two first Y-axis drive modules (41), a first Z-axis drive module (Z43) mounted on the first X-axis drive module (42), and a first rotary axis drive module (Z43) mounted on the first Z-axis drive module (Z43). The first rotary drive module (44) and the gripping manipulator (45) mounted on the first rotary drive module (44) are provided. The gripping manipulator (45) is provided with a first CCD imaging module (46) below it. The gripping manipulator (45) includes a gripping drive cylinder (451) mounted on the bottom of the first rotary drive module (44), gripping arms (452) mounted on both ends of the gripping drive cylinder (451), and grippers (453) mounted on both sides of the gripping arms (452).

5. The semiconductor board automatic packaging equipment according to claim 1, characterized in that, The membrane material feeding station (5) is equipped with synchronous wheel and synchronous belt transport modules (51) at both ends. A material bin (52) is connected between the two synchronous wheel and synchronous belt transport modules (51). A lifting drive module (53) is installed at the bottom of the material bin (52).

6. The semiconductor board automatic packaging equipment according to claim 1, characterized in that, The film-applying transfer mechanism (6) includes a second mounting bracket (60) mounted on both sides of the other end between several linear transport modules (2), a second Y-axis drive module (61) mounted on the second mounting bracket (60), a second X-axis drive module (62) mounted between two second Y-axis drive modules (61), a second Z-axis drive module (63) mounted on the second X-axis drive module (62), a second rotation drive module (64) mounted on the second Z-axis drive module (63), and a film-applying module (65) mounted on the second rotation drive module (64). A second CCD imaging module (66) is mounted below the film-applying module (65). The film-applying module (65) includes a second CCD imaging module (66) mounted on the second rotation drive module (64). The drive module (64) has a vacuum suction cup (651) at the bottom and a film-applying roller assembly (652) installed at one end of the vacuum suction cup (651). The film-applying roller assembly (652) includes a first support plate (6520) installed on the top of the vacuum suction cup (651), a pressing cylinder (6521) installed on the first support plate (6520), a slide rail slider assembly (6522) installed on both sides of the first support plate (6520), a second support plate (6523) installed on the pressing cylinder (6521) and slidably connected to the slide rail slider assembly (6522), a film-applying roller (6524) hinged on the second support plate (6523), and a pressing spring (6525) installed on the top of the film-applying roller (6524).

7. The semiconductor board automatic packaging equipment according to claim 1, characterized in that, The film-tearing mechanism (7) includes a support frame (70), a rotary motor (71) mounted on the support frame (70), a pneumatic gripper cylinder (72) mounted on the rotary motor (71), and an air nozzle (73) mounted on one side of the pneumatic gripper cylinder (72).

8. The semiconductor board automatic packaging equipment according to claim 1, characterized in that, Each of the linear transport modules (2) is equipped with a film support mechanism (35) that cooperates with the film transfer mechanism (6) on one side. The film support mechanism (35) includes a linear cylinder module (350) installed on one side of the linear transport module (2), a sliding frame (351) installed on the linear cylinder module (350), a proximity sensor (352) installed on the sliding frame (351), a first support arm (353) installed on the sliding frame (351), a second support arm (354) hinged to the first support arm (353), and film support rods (355) respectively installed on the first support arm (353) and the second support arm (354).

9. An automated semiconductor board packaging device according to claim 8, characterized in that, The film-applying fixture (3) is provided with a vacuum suction hole (31), and a PTC heating tube is installed inside the film-applying fixture (3).

10. An automated semiconductor board packaging device according to claim 1, characterized in that, The pressing mechanism (9) includes a base frame (90) mounted above the corresponding linear transport module (2), an unwinding roller (91) mounted on the base frame (90), a take-up roller (92) mounted on one side of the unwinding roller (91), a release film (93) connected to the unwinding roller (91) and the take-up roller (92) respectively, and a pressing roller assembly (94) mounted between the unwinding roller (91) and the take-up roller (92) for pressing the top of the release film (93) downward. The pressing roller assembly (94) includes a lifting drive motor (941) mounted on the base frame (90), a guide sleeve (942) mounted on the base frame (90), a guide rod (943) slidably connected to the guide sleeve (942), and a pressing roller (944) mounted on the lifting drive motor (941) and connected to the guide rod (943). A heating rod (945) is inserted into one side of the pressing roller (944).

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