Light-emitting device and reflex sight

Abstract

The present application discloses a light-emitting device and a reflex sight. The light-emitting device comprises a first substrate, a first light-emitting element and a second light-emitting element that are arranged inside a die-bonding region of the first substrate, and a diaphragm; the first light-emitting element and the second light-emitting element are connected in parallel to the first substrate; the second light-emitting element and the first light-emitting element are arranged in a first direction, and in the first direction, the spacing distance between the side of the first light-emitting element close to the second light-emitting element and the second light-emitting element is 1-50 microns; the diaphragm is disposed on light-exit sides of the first light-emitting element and the second light-emitting element, and the orthographic projection of a light through hole of the diaphragm onto the first substrate is located at adjacent centers of the first light-emitting element and the second light-emitting element, so that light emitted by both the first light-emitting element and the second light-emitting element can pass through the light through hole. The light-emitting device can serve as a point light source having adjustable brightness levels or colors for a reflex sight.

Description

A light-emitting device and a reflective sight Technical Field

[0001] This application relates to the field of reflective aiming technology, and more particularly to a light-emitting device and a reflective aiming device. Background Technology

[0002] A reflex sight is a common type of sight, consisting of a reflecting lens and a light source. The light source, also known as the aiming dot, is located at the focal point of the reflecting lens. It is typically a red or green dot. A red aiming dot uses a red-emitting point light source, while a green aiming dot uses a green-emitting point light source. Users choose different colored aiming dots depending on the application. A red aiming dot is suitable for backgrounds with a distinct color contrast to red light, such as cool-toned environments like forests or oases; a green aiming dot is suitable for backgrounds with a distinct color contrast to green light, such as warm-toned environments like deserts or Gobi. Red and green aiming dots can essentially cover all application scenarios.

[0003] The light-emitting devices in reflex sights in related technologies are usually monochromatic, meaning a reflex sight either has a red or a green aiming dot, limiting its application scenarios. If a user wants to use a reflex sight in different environments, they need to purchase an additional light-emitting device of a different color. This not only increases costs but also requires recalibrating the aiming point of the reflex sight relative to the bullet's impact point after each replacement, making the calibration process cumbersome and complex. Summary of the Invention

[0004] Embodiments of this application provide a light-emitting device and a reflective sight to solve the problem that the light-emitting device in the reflective sight of the related art has a single color and poor versatility.

[0005] In a first aspect, embodiments of this application provide a light-emitting device, including a first substrate, a first light-emitting element, a second light-emitting element, and an aperture. The first substrate includes a die-bonding region; the first light-emitting element is disposed inside the die-bonding region and is electrically connected to the first substrate; the second light-emitting element is disposed inside the die-bonding region and is electrically connected to the first substrate, such that the second light-emitting element is connected in parallel with the first light-emitting element; the second light-emitting element and the first light-emitting element are arranged along a first direction, wherein the distance between the side of the first light-emitting element closest to the second light-emitting element and the second light-emitting element in the first direction is 1 to 50 micrometers; the aperture is disposed on the light-emitting side of the first light-emitting element and the second light-emitting element, and the orthographic projection of the light-transmitting hole of the aperture on the first substrate is located at the adjacent center of the first light-emitting element and the second light-emitting element, so that the light emitted by the first light-emitting element and the second light-emitting element can pass through; wherein, the first direction is perpendicular to the thickness direction of the first substrate.

[0006] In some embodiments, the first light-emitting element can emit a first light signal, and the second light-emitting element can emit a second light signal, wherein the wavelength of the second light signal is different from the wavelength of the first light signal.

[0007] In some embodiments, the light-transmitting hole is a circular hole with a diameter of 5 micrometers to 80 micrometers.

[0008] In some embodiments, the first light-emitting element is soldered to the first substrate via a first bonding wire, and the second light-emitting element is soldered to the first substrate via a second bonding wire. The first substrate is also provided with a protective adhesive, which is used to completely cover the solder joints at both ends of the first bonding wire, the second bonding wire, and the solder joints at both ends of the first bonding wire and the second bonding wire.

[0009] In some embodiments, the first light-emitting element includes a first LED chip, which is a single-electrode chip or a dual-electrode chip; the second light-emitting element includes a second LED chip, which is a single-electrode chip or a dual-electrode chip.

[0010] In some embodiments, the first substrate has two first solder joints and two second solder joints, the first solder joints and the second solder joints being located outside the die-bonding region; one of the third solder joints corresponding to the two first solder joints is disposed on the first light-emitting element and the other third solder joint is disposed on the die-bonding region, or both of the third solder joints corresponding to the two first solder joints are disposed on the first light-emitting element; one of the fourth solder joints corresponding to the two second solder joints is disposed on the second light-emitting element and the other fourth solder joint is disposed on the die-bonding region, or both of the fourth solder joints corresponding to the two second solder joints are disposed on the second light-emitting element; one end of the first bonding wire is soldered to the first solder joint and the other end is soldered to the third solder joint; one end of the second bonding wire is soldered to the second solder joint and the other end is soldered to the fourth solder joint.

[0011] In some embodiments, in the second direction, a first solder joint and a second solder joint located on one side of the die-bonding region are integrally formed; another first solder joint and another second solder joint located on the other side of the die-bonding region are spaced apart; wherein the second direction, the first direction, and the thickness direction of the first substrate are perpendicular to each other.

[0012] In some embodiments, a transparent encapsulation layer is provided on the first substrate, the transparent encapsulation layer is located on the light-emitting side of the first light-emitting element and the second light-emitting element, and the orthogonal projection of the transparent encapsulation layer on the first substrate completely covers the first substrate; the aperture is fixed on the side of the transparent encapsulation layer away from the first substrate.

[0013] In some embodiments, the first light-emitting element is any one of a surface light source, a line light source, and a point light source, and the second light-emitting element is any one of a surface light source, a line light source, and a point light source.

[0014] Secondly, embodiments of this application also provide a reflective sight, including: a reflective lens and a light-emitting device as described in the first aspect, wherein the light-emitting device has a light-transmitting aperture located at the focal point of the reflective lens.

[0015] In some embodiments, the light-transmitting aperture is a circular aperture, and the center of the light-transmitting aperture coincides with the focal point of the reflecting lens.

[0016] In some embodiments, the reflective surface of the reflective lens is provided with a high-reflectivity coating.

[0017] In some embodiments, the light-emitting device is electrically connected to a power supply and a push-button switch via a control unit, wherein the push-button switch is used by the control unit to control the opening and closing of at least one of the first light-emitting element and the second light-emitting element in the light-emitting device.

[0018] In some embodiments, the light-emitting device is connected to a power source via a rotary switch, and rotating the rotary switch causes at least one of the first light-emitting element and the second light-emitting element to be turned on and off.

[0019] The light-emitting device provided in this application embodiment arranges a first light-emitting element and a second light-emitting element inside the die-bonding region of a first substrate. By adjusting the distance between the first light-emitting element and the second light-emitting element in a first direction to satisfy the range of 1 to 50 micrometers, the orthogonal projection of the aperture on the first substrate is located at the adjacent center of the first light-emitting element and the second light-emitting element. This facilitates the simultaneous emission of light emitted by the first light-emitting element and the second light-emitting element through the aperture of the aperture, thereby converting multiple light sources into a point light source. At the same time, the first light-emitting element and the second light-emitting element are electrically connected to the first substrate, realizing the parallel connection of the first light-emitting element and the second light-emitting element. That is, the first light-emitting element and the second light-emitting element can be controlled individually. In other words, by controlling the first light-emitting element and the second light-emitting element, the brightness or color of the light emitted through the aperture of the aperture can be different. When the wavelengths of the light emitted by the first and second light-emitting elements are the same, compared to setting a light-emitting element inside the die-bonding region of the first substrate, this light-emitting element has the same structure as one of the first and second light-emitting elements, and controls the first and second light-emitting elements to emit light simultaneously, thus increasing the brightness of the light-emitting device. When controlling the first or second light-emitting element to emit light, one of the first and second light-emitting elements can be used as the main light-emitting element, and the other as a backup light-emitting element, thereby not only realizing the adjustment of different brightness, but also improving the service life of the light-emitting device and reducing the frequency of replacement. When the wavelengths of the light emitted by the first and second light-emitting elements are not the same, this provides a light-emitting device that can realize dual-color light emission, which is suitable for a variety of different scenarios and has a wide range of applications.

[0020] When this light-emitting device is applied to a reflex sight, with the aperture of the aperture positioned at the focal point of the reflex sight's reflective lens, if the wavelengths of the light signals emitted by the first and second light-emitting elements are the same, controlling the switching of at least one of them can provide a point light source for the reflex sight that can achieve multiple brightness adjustments. If the wavelengths of the light signals emitted by the first and second light-emitting elements are different, for example, the first light-emitting element emits red light and the second light-emitting element emits green light, switching the switching of the first and second light-emitting elements can provide a point light source with different color adjustments for red and green light for the reflex sight. In this way, users can avoid purchasing a set of reflex sights of other colors and also eliminate the need for calibration operations when replacing reflex sights, bringing great convenience to users. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 is a schematic diagram of the structure of the light-emitting device in some embodiments of this application;

[0023] Figure 2 is a cross-sectional view of the light-emitting device in Figure 1 (AA section).

[0024] Figure 3 is a schematic diagram of the structure of a reflex sight in some embodiments of this application;

[0025] Figure 4 is a top view of the light-transmitting hole of the aperture and the first and second light-emitting elements in the light-emitting device in some embodiments of this application.

[0026] Figure 5 is a schematic diagram of a light-emitting device in some embodiments where the first light-emitting element is a dual-electrode chip and the second light-emitting element is a single-electrode chip.

[0027] Figure 6 is a schematic diagram of the structure of a light-emitting device in some embodiments, where both the first and second light-emitting elements are dual-electrode chips;

[0028] Figure 7 is a schematic diagram of the structure of a light-emitting device in some other embodiments, where both the first and second light-emitting elements are dual-electrode chips;

[0029] Figure 8 is a schematic diagram of the electric control connection of the light-emitting device in some embodiments of this application;

[0030] Figure 9 is a schematic diagram of the manual control connection of the light-emitting device in some embodiments of this application;

[0031] Figure 10 is a semi-finished product structure diagram of the finished light-emitting device in Figure 1 during the manufacturing process;

[0032] Figure 11 is a flowchart of the preparation process of the finished light-emitting device in Figure 1;

[0033] Figure 12 is a flowchart of the preparation process of the finished light-emitting device in some embodiments;

[0034] Figure 13 is a flowchart illustrating the fabrication process of the finished light-emitting device in some other embodiments.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100, substrate; 200, outer frame; 300, cutting groove;

[0037] 1. First solder joint; 2. Second solder joint; 3. Third solder joint; 4. Fourth solder joint;

[0038] 10. First substrate; 101. Die-bonding region; 11. First light-emitting element; 12. Second light-emitting element;

[0039] 13. First bonding wire; 14. Second bonding wire; 15. Transparent encapsulation layer;

[0040] 201. Light-transmitting aperture;

[0041] 30. Reflecting lens; 301. Reflecting surface;

[0042] 40. Power supply; 41. Control unit; 42. Push-button switch; 43. Rotary switch. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0044] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0045] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, as fixed connection, detachable connection, or integral connection; those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0046] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0047] A reflex sight is a common type of sight, consisting of a reflecting lens and a light source. The light source, also known as the aiming dot, is located at the focal point of the reflecting lens. It is typically a red or green dot. A red aiming dot uses a red-emitting point light source, while a green aiming dot uses a green-emitting point light source. Users choose different colored aiming dots depending on the application. A red aiming dot is suitable for backgrounds with a distinct color contrast to red light, such as cool-toned environments like forests or oases; a green aiming dot is suitable for backgrounds with a distinct color contrast to green light, such as warm-toned environments like deserts or Gobi. Red and green aiming dots can essentially cover all application scenarios.

[0048] The light-emitting devices in reflex sights in related technologies are usually monochromatic, meaning a reflex sight either has a red or a green aiming dot, limiting its application scenarios. If a user wants to use a reflex sight in different environments, they need to purchase an additional light-emitting device of a different color. This not only increases costs but also requires recalibrating the aiming point of the reflex sight relative to the bullet's impact point after each replacement, making the calibration process cumbersome and complex.

[0049] To address the aforementioned problems, embodiments of this application provide a light-emitting device, a method for manufacturing the same, and a reflective sight. The reflective sight includes a reflective lens and a light-emitting device. Typically, the light-emitting device provides a point light source for the reflective sight.

[0050] As shown in Figures 1-3, this application provides a light-emitting device, including a first substrate 10, a first light-emitting element 11, a second light-emitting element 12, and an aperture (not shown in the figures; only the positional relationship between the light-transmitting aperture 201 and the first light-emitting element 11 and the second light-emitting element 12 is shown in Figure 3). The first substrate 10 includes a die-bonding region 101; the first light-emitting element 11 is disposed inside the die-bonding region 101 and is electrically connected to the first substrate 10; the second light-emitting element 12 is disposed inside the die-bonding region 101 and is electrically connected to the first substrate 10, so that the second light-emitting element 12 is connected in parallel with the first light-emitting element 1 .... The light-emitting element 12 and the first light-emitting element 11 are arranged along a first direction. In the first direction, the distance between the side of the first light-emitting element 11 that is close to the second light-emitting element 12 and the second light-emitting element 12 (distance t in FIG. 1) is 1~50 micrometers. An aperture is disposed on the light-emitting side of the first light-emitting element 11 and the second light-emitting element 12. The orthographic projection of the aperture 201 on the first substrate 10 is located at the adjacent center of the first light-emitting element 11 and the second light-emitting element 12, so that the light emitted by the first light-emitting element 11 and the second light-emitting element 12 can pass through. The first direction (the horizontal direction in FIG. 1) is perpendicular to the thickness direction of the first substrate 10.

[0051] The aforementioned aperture is an aperture plate, with a light-passing hole 201 at its center for light to pass through. The light-passing hole 201 of the aperture can be, but is not limited to, a circular hole, thus converting the area light source, line light source, or point light source emitted by the light-emitting device into a point light source the size of a target. When used in conjunction with the reflecting lens 30, it forms a reflective sight. The orthographic projection of the light-passing hole 201 on the first substrate 10 is located at the adjacent center of the first light-emitting element 11 and the second light-emitting element 12, as shown in Figure 3.

[0052] The first light-emitting element 11 is used to emit a first light signal, and the second light-emitting element 12 is used to emit a second light signal. The center wavelengths of the first light signal and the second light signal may be the same or different. The first light-emitting element 11 can be any one of a surface light source, a line light source, and a point light source. The structure of the second light-emitting element 12 is the same as that of the first light-emitting element 11, and it can also be any one of a surface light source, a line light source, and a point light source. Figure 1 is only an exemplary drawing of the shape outline of the first light-emitting element 11 and the second light-emitting element 12; the specific dimensions of the first light-emitting element 11 and the second light-emitting element 12 are not specifically limited. In addition, Figure 1 shows that the first light-emitting element 11 includes a first LED chip, and the second light-emitting element 12 includes a second LED chip. Figure 1 shows a connection diagram of the first LED chip and the second LED chip, both of which are dual-electrode chips, that is, both the first light-emitting element 11 and the second light-emitting element 12 are dual-electrode chips. The first LED chip and the second LED chip can both be single-electrode chips, or the first LED chip can be a dual-electrode chip and the second LED chip can be a single-electrode chip; the first LED chip can be a single-electrode chip and the second LED chip can be a dual-electrode chip, i.e., the connection method between the first light-emitting element 11 and the second light-emitting element 12 and the first substrate 10 is specifically referred to in the following text and Figures 5 to 7. The structures of the first LED chip and the second LED chip in the first light-emitting element 11 and the second light-emitting element 12 can be the same or different, and the number of chips included in the first light-emitting element 11 and the second light-emitting element 12 can be the same or different. This application uses the example of the first light-emitting element 11 including one first LED chip and the second light-emitting element 12 including one second LED chip, and the first LED chip and the second LED chip being a small surface light source dual-electrode chip for description. The dual-electrode chip has two connection solder joints, the single-electrode chip has one connection solder joint, and the other connection solder joint is located on the die-bonding region 101.

[0053] By arranging a first light-emitting element 11 and a second light-emitting element 12 inside the die-bonding region 101 of the first substrate 10, and by adjusting the spacing between the first light-emitting element 11 and the second light-emitting element 12 in the first direction to satisfy a range of 1 to 50 micrometers, the orthogonal projection of the aperture 201 of the aperture stop on the first substrate 10 is located at the adjacent center of the first light-emitting element 11 and the second light-emitting element 12. This adjacent center of the first light-emitting element 11 and the second light-emitting element 12 refers to the geometric center region of the two adjacent sides between the first light-emitting element 11 and the second light-emitting element 12. This allows the light emitted by the first light-emitting element 11 and the second light-emitting element 12 to simultaneously pass through the light-transmitting hole 201 of the aperture, thereby converting multiple light sources into a point light source. At the same time, the first light-emitting element 11 and the second light-emitting element 12 are electrically connected to the first substrate 10, realizing that the first light-emitting element 11 and the second light-emitting element 12 are connected in parallel. That is, the first light-emitting element 11 and the second light-emitting element 12 can be controlled individually. In other words, by controlling the first light-emitting element 11 and the second light-emitting element 12, the brightness or color of the light emitted through the light-transmitting hole 201 of the aperture can be different.

[0054] When the wavelengths of the light emitted by the first light-emitting element 11 and the second light-emitting element 12 are the same, compared to setting a light-emitting element inside the die-bonding region 101 of the first substrate 10, this light-emitting element has the same structure as one of the first light-emitting elements 11 and the second light-emitting element 12. When controlling the first light-emitting element 11 and the second light-emitting element 12 to emit light, the brightness of the light-emitting device is increased. When controlling the first light-emitting element 11 or the second light-emitting element 12 to emit light, one of the first light-emitting element 11 and the second light-emitting element 12 can be used as the main light-emitting element and the other as the backup light-emitting element. This not only achieves different brightness adjustments, but also improves the service life of the light-emitting device and reduces the frequency of replacement. When the wavelengths of the light emitted by the first light-emitting element 11 and the second light-emitting element 12 are not the same, this provides a light-emitting device that can achieve dual-color light emission, which is suitable for a variety of different scenarios and has a wide range of applications.

[0055] The aforementioned light-emitting device can be applied to, but is not limited to, reflective sights, as well as to lamps or light-emitting devices with multiple brightness adjustments or dual or multiple color adjustments.

[0056] The following explanation uses the application of a light-emitting device in a reflex sight as an example.

[0057] When this light-emitting device is applied to a reflex sight, the aperture 201 of the aperture is located at the focal point (f in Figure 3) of the reflex sight's reflecting lens 30. The light emitted by the light-emitting device illuminates the reflecting lens 30, is converged and reflected by the reflecting surface 301 of the reflecting lens 30, and then enters the human eye as parallel light, forming an image on the retina. The optical path diagram is shown in Figure 3. In Figure 3, F refers to the focal length of the reflecting lens 30. Figure 3 is merely an example illustrating the positional relationship between the reflecting lens 30, the focal point, and the focal length.

[0058] In some embodiments, the first light signal and the second light signal have the same wavelength. For example, the center wavelength of the first light signal and the second light signal is 650nm, that is, the first light signal and the second light signal are red light. Or, the center wavelength of the first light signal and the second light signal is 525nm, that is, the first light signal and the second light signal are green light. In this way, by controlling the switching of the first light-emitting element 11 and the second light-emitting element 12, a point light source with different brightness adjustment of red or green light can be provided for the reflective sight.

[0059] In other embodiments, the wavelengths of the first light signal and the second light signal are different. For example, the center wavelength of the first light signal is 650nm, that is, the first light signal is red light, and the center wavelength of the second light signal is 525nm, that is, the second light signal is green light. In this way, by controlling the switching of the first light-emitting element 11 and the second light-emitting element 12, a point light source with different color adjustment of red and green light can be provided for the reflective sight.

[0060] In summary, when the light-emitting device of this application is used in a reflex sight, if the wavelengths of the first light signal and the second light signal are the same, the light-emitting device can serve as a point light source for the reflex sight that can achieve multiple brightness adjustments; if the wavelengths of the first light signal and the second light signal are different, for example, the first light-emitting element 11 emits red light and the second light-emitting element 12 emits green light, the device can be used as a point light source for the reflex sight with different colors of red and green light by switching the switches of the first light-emitting element 11 and the second light-emitting element 12. In this way, users can avoid purchasing a reflex sight of other colors and also avoid the calibration operation caused by replacing the reflex sight, bringing great convenience to users.

[0061] As shown in Figures 1 to 4, a transparent encapsulation layer 15 is provided on the first substrate 10. The transparent encapsulation layer 15 is located on the light-emitting side of the first light-emitting element 11 and the second light-emitting element 12. The orthographic projection of the transparent encapsulation layer 15 on the first substrate 10 completely covers the first substrate 10. The aperture is fixed on the side of the transparent encapsulation layer 15 away from the first substrate 10. In other words, the aperture is fixed on the transparent encapsulation layer 15.

[0062] The transparent encapsulation layer 15 is formed of a transparent protective adhesive, which gives the transparent encapsulation layer 15 high transparency. For example, epoxy resin can be used to make the transparent encapsulation layer 15.

[0063] By providing a transparent encapsulation layer 15 on the top surface of the first substrate 10, the transparent encapsulation layer 15 completely covers the first substrate 10 upon its orthogonal projection. This allows the first light-emitting element 11, the second light-emitting element 12, the first bonding wire 13, and the second bonding wire 14 to be completely covered, forming an effective sealing layer. This effectively encapsulates the entire light-emitting device, preventing external factors from affecting the internal structure and circuitry of the first light-emitting element 11, the second light-emitting element 12, and other components on the first substrate 10. This improves the reliability and durability of the light-emitting device. Furthermore, by directly fixing the aperture to the transparent encapsulation layer 15, a strong connection between the aperture and the first substrate 10 is achieved, eliminating the need for additional adhesive layers to fix the aperture. This reduces the thickness of the light-emitting device and simplifies the manufacturing process, resulting in lower costs.

[0064] It should be noted that, after multiple experiments, the spacing t between the first light-emitting element 11 and the second light-emitting element 12 in the first direction can be 1 micrometer, 2 micrometer, 3 micrometer, 4 micrometer, 5 micrometer, 6 micrometer, 7 micrometer, 8 micrometer, 9 micrometer, 10 micrometer, 11 micrometer, 12 micrometer, 13 micrometer, 14 micrometer...19 micrometer, 20 micrometer,...25 micrometer,...30 micrometer,...35 micrometer,...40 micrometer,...45 micrometer,...50 micrometer.

[0065] In the design of a reflex sight, the position and diameter of the aperture 201 are also important parameters.

[0066] When the diameter of the light-transmitting aperture 201 is small, it hinders light transmission, making the aiming point indistinct and resulting in a poor user experience. Conversely, when the diameter of the light-transmitting aperture 201 is large, the aiming point range is larger, leading to lower aiming accuracy and increased risk of misaiming under the same light transmission conditions. Through repeated testing, it was found that when the diameter of the light-transmitting aperture 201 can be 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 9 micrometers, 10 micrometers, 11 micrometers, 12 micrometers, 13 micrometers, 14 micrometers, 15 micrometers, 16 micrometers, 17 micrometers, 18 micrometers, 19 micrometers, 20 micrometers, ..., 30 micrometers, ..., 40 micrometers, ..., 50 micrometers, ..., 60 micrometers, ..., 70 micrometers, ..., 80 micrometers, etc., the aiming point meets the optical requirements when the diameter is between 5 micrometers and 80 micrometers.

[0067] The diameter of the light-transmitting aperture 201 shown in Figure 3 is greater than the distance t between the first light-emitting element 11 and the second light-emitting element 12 in the first direction. This further ensures that as much of the light from the first light-emitting element 11 and the second light-emitting element 12 as possible is emitted through the light-transmitting aperture 201, thereby improving the brightness of the aiming point.

[0068] As shown in Figure 1, in some embodiments, the first light-emitting element 11 is soldered to the first substrate 10 via the first bonding wire 13, and the second light-emitting element 12 is soldered to the first substrate 10 via the second bonding wire 14. The first substrate 10 is also provided with protective adhesive, which is used to completely cover the solder joints at both ends of the first bonding wire 13, the second bonding wire 14, and the solder joints at both ends of the first bonding wire 13 and the second bonding wire 14.

[0069] With the above settings, the protective adhesive can completely cover the solder joints at both ends of the first bonding wire 13, the second bonding wire 14, and the solder joints at both ends of the first bonding wire 13 and the second bonding wire 14. This avoids the influence of dust and impurities on the first bonding wire 13 and the second bonding wire 14, which helps to improve the reliability of the light-emitting device.

[0070] As shown in Figure 1, the first substrate 10 has a first solder joint 1 and a second solder joint 2 on one side of the die bonding region 101. The first solder joint 1 and the second solder joint 2 are located outside the die bonding region 101. The first light-emitting element 11 has a third solder joint 3 corresponding to the first solder joint 1, and the second light-emitting element 12 has a fourth solder joint 4 corresponding to the second solder joint 2. One end of the first bonding wire 13 is soldered to the first solder joint 1, and the other end is soldered to the third solder joint 3. One end of the second bonding wire 14 is soldered to the second solder joint 2, and the other end is soldered to the fourth solder joint 4.

[0071] With the above arrangement, the arrangement of the solder joints is staggered from the arrangement of the two light-emitting elements, which not only facilitates the electrical connection between the two light-emitting elements and the first substrate 10, but also helps to improve the space utilization of electrical components on the first substrate 10, thereby facilitating the miniaturization of the light-emitting device.

[0072] Specifically, when both the first light-emitting element 11 and the second light-emitting element 12 are dual-electrode chips, the electrical connection between the first light-emitting element 11 and the second light-emitting element 12 and the first substrate 10 is shown in Figure 1. The first light-emitting element 11 has two third solder points 3 at both ends in the second direction (vertical direction in Figure 1), with each first solder point 1 corresponding to one of the two third solder points 3. The second light-emitting element 12 has two fourth solder points 4 at both ends in the second direction, with each second solder point 2 corresponding to one of the two fourth solder points 4. In the second direction, one first solder point 1 and one second solder point 2 located on one side of the die-bonding region 101 (the upper side shown in Figure 1) are integrally formed, meaning that one first solder point 1 and one second solder point 2 located above the die-bonding region 101 shown in Figure 1 share a single solder point, which can serve as the positive electrode of the light-emitting device. Another first solder point 1 and another second solder point 2 located on the other side of the die-bonding region 101 (the lower side shown in Figure 1) are spaced apart, meaning that another first solder point 1 located below the die-bonding region 101 shown in Figure 1 serves as the negative electrode of the first light-emitting element 11, and another second solder point 2 serves as the negative electrode of the second light-emitting element 12, thereby realizing the first light-emitting element 11 and the second light-emitting element 12. The parallel connection; wherein the second direction, the first direction and the thickness direction of the substrate 100 are perpendicular to each other.

[0073] The above settings reduce the number of solder joints, lower the positioning accuracy and welding difficulty of the first light-emitting element 11 and the second light-emitting element 12 to the first solder joint 1 and the second solder joint 2 respectively, and facilitate welding.

[0074] When the first light-emitting element 11 is a dual-electrode chip and the second light-emitting element 12 is a single-electrode chip, the electrical connection between the first light-emitting element 11 and the second light-emitting element 12 and the first substrate 10 is shown in Figure 5.

[0075] The main difference between the light-emitting device shown in Figure 5 and the light-emitting device shown in Figure 1 is that the second light-emitting element 12 is a single-electrode chip. In this case, one of the fourth solder points 4 corresponding to the two second solder points 2 is disposed on the second light-emitting element 12, and the other fourth solder point 4 is disposed on the die-bonding region 101, thereby realizing the parallel connection of the first light-emitting element 11 and the second light-emitting element 12. The other structures in the light-emitting device shown in Figure 5 are the same as those in the light-emitting device shown in Figure 1, and will not be described again here.

[0076] When both the first light-emitting element 11 and the second light-emitting element 12 are single-electrode chips, there are two different ways to electrically connect the first light-emitting element 11 and the second light-emitting element 12 to the first substrate 10, as shown in Figures 6 and 7.

[0077] The main difference between the light-emitting device shown in Figure 6 and the light-emitting device shown in Figure 1 is that the first light-emitting element 11 and the second light-emitting element 12 are single-electrode chips. In this case, one of the third solder points 3 corresponding to the two first solder points 1 is disposed on the first light-emitting element 11, and the other third solder point 3 is disposed on the die-bonding region 101; one of the fourth solder points 4 corresponding to the two second solder points 2 is disposed on the second light-emitting element 12, and the other fourth solder point 4 is disposed on the die-bonding region 101. Since one third solder point 3 and one fourth solder point 4 need to be disposed on the die-bonding region 101, the two first solder points 1 and the two second solder points 2 disposed on the first substrate 10 are arranged alternately, thereby realizing the parallel connection of the first light-emitting element 11 and the second light-emitting element 12. The other structures in the light-emitting device shown in Figure 6 are the same as those in the light-emitting device shown in Figure 1, and will not be described again here.

[0078] The main difference between the light-emitting device shown in Figure 7 and the light-emitting device shown in Figure 6 is that the die-bonding region 101 is divided into two parts. Specifically, the die-bonding region 101 includes a first region 101a connected to the first light-emitting element 11 and a second region 101b connected to the second light-emitting element 12. The first region 101a and the second region 101b are spaced apart along a first direction. Thus, a first solder joint 1 on one side of the first region 101a and a second solder joint 2 on the same side of the second region 101b are integrally formed. Another first solder joint 1 on the other side of the first region 101a and another second solder joint 2 on the same side of the second region 101b are spaced apart, thereby achieving parallel connection of the first light-emitting element 11 and the second light-emitting element 12. Other structures in the light-emitting device shown in Figure 7 are the same as those in the light-emitting device shown in Figure 1, and will not be described again here.

[0079] As shown in Figures 1, 3, and 4, this application embodiment also provides a reflective sight, including a reflective lens 30 and a light-emitting device. The light-transmitting aperture 201 of the light-emitting device is located at the focal point of the reflective lens 30.

[0080] By placing the aperture 201 of the diaphragm at the focal point of the reflective lens 30 of the reflective sight, as shown in Figure 3, the reflective sight can freely switch between aiming points of different brightness or color. This not only makes it suitable for different application scenarios and has a wide range of applications, but also eliminates the need for users to purchase a set of reflective sights of other colors and avoids the calibration operation required when replacing reflective sights, bringing great convenience to users.

[0081] In the design of a reflex sight, the closer the center of the aperture 201 is to the focal point of the reflective lens 30, the better the aiming effect will be. The aiming effect will be even better when the center of the aperture 201 coincides with the focal point of the reflective lens 30.

[0082] The structure of the light-emitting device in this reflex sight is the same as that in the above embodiment, and will not be described again here.

[0083] To further improve the reflection effect, a high-reflection coating (not shown in the figure) is provided on the reflecting surface 301 of the reflecting lens 30. Simultaneously, an anti-reflection coating is deposited on the side of the reflecting lens 30 facing away from the reflecting surface 301. As shown in Figure 3, by providing a high-reflection coating on the reflecting surface 301 of the reflecting lens 30, the utilization rate of light energy illuminating the reflecting lens 30 from the light-emitting device is improved, light energy loss during reflection is reduced, and the aiming point becomes brighter. The anti-reflection coating further improves the light transmittance, thus facilitating a balance between the brightness of the aiming point and positioning accuracy.

[0084] The aforementioned high-reflectivity coating refers to an optical thin film that enhances reflectivity. The working principle of a high-reflectivity coating is based on thin-film interference. When light shines on the thin film, it is reflected at both the upper and lower surfaces, and these two reflected beams interfere with each other. By adjusting the thickness and refractive index of the thin film, the optical path difference between these two reflected beams can be made to meet specific conditions, thereby enhancing the reflectivity in a certain wavelength band. Specifically, the design of the high-reflectivity coating ensures that the interference of the two reflected beams is additive, thus significantly improving reflectivity.

[0085] During the design of the high-reflectivity film, the reflective surface 301 of the reflective lens 30 needs to be coated with high-reflectivity films of different wavelength ranges. If the wavelengths of the first light signal emitted by the first light-emitting element 11 and the second light signal emitted by the second light-emitting element 12 are the same, the wavelength range of the high-reflectivity film is set with an error of ±10nm based on the center wavelength of the first light signal emitted by the first light-emitting element 11. For example, if the center wavelength of the first light signal is 650nm, i.e., the first light signal is red light, then the wavelength requirement of the high-reflectivity film is to have high reflectivity within the wavelength range of 650nm ± 10nm and high transmittance outside the above wavelength range. If the wavelengths of the first light signal emitted by the first light-emitting element 11 and the second light signal emitted by the second light-emitting element 12 are not the same, the wavelength range of the high-reflectivity film needs to simultaneously satisfy the range of the center wavelengths of the first and second light signals. For example, if the center wavelength of the first light signal is 650nm (i.e., the first light signal is red light), and the center wavelength of the second light signal is 525nm (i.e., the second light signal is green light), then the high-reflectivity film must have high reflectivity within the wavelength ranges of 650nm ± 10nm and 525nm ± 10nm, and high transmittance outside these wavelength ranges. In other words, these two wavelength ranges are mutually exclusive and must be satisfied simultaneously. This allows the first and second light signals emitted by the light-emitting device to be utilized as much as possible, resulting in higher brightness at the aiming point, while not affecting the transmission of light in other wavelength bands through the reflective lens 30, and thus not affecting the user's observation of the target through the reflective lens 30.

[0086] In the light source device of the above-mentioned reflective sight, the control and switching of the first light-emitting element 11 and the second light-emitting element 12 can be electrically controlled by the electric push-button switch 42, or the user can manually control them by rotating the knob switch 43.

[0087] As shown in Figure 5, in some embodiments, the light-emitting device is electrically connected to the power supply 40 and the push-button switch 42 via the control unit 41 (MCU in Figure 5). The push-button switch 42 is used by the control unit 41 to control the opening and closing of the first light-emitting element 11 and the second light-emitting element 12 in the light-emitting device.

[0088] The above settings enable the electric switching of the first light-emitting element 11 and the second light-emitting element 12, which is suitable for some scenarios that require electric control operation to switch the light-emitting device.

[0089] As shown in Figure 6, in some embodiments, the light-emitting device is connected to the power supply 40 via a rotary switch 43. By rotating the rotary switch 43, the first light-emitting element 11 and the second light-emitting element 12 are turned on and off.

[0090] With the above settings, users can manually switch between the first light-emitting element 11 and the second light-emitting element 12 by rotating the knob switch 43, which is suitable for some scenarios that require manual control to switch the light-emitting device.

[0091] It should be noted that the light-emitting device needs to have the following modes: first light-emitting element 11 on, first light-emitting element 11 off, second light-emitting element 12 on, second light-emitting element 12 off, first light-emitting element 11 on and second light-emitting element 12 on, and first light-emitting element 11 off and second light-emitting element 12 off. Alternatively, only three modes are required: first light-emitting element 11 on, second light-emitting element 12 on, and first light-emitting element 11 off and second light-emitting element 12 off.

[0092] The two control modes of the light-emitting device can be selected according to different customer requirements or application scenarios, and no specific limitations are made here.

[0093] As shown in Figures 7-10, this application also provides a method for preparing a light-emitting device, which is used to prepare the light-emitting device as described in the above embodiments. The preparation method includes the following steps:

[0094] Step S100: An outer frame 200 and a cutting channel 300 are arranged around the periphery of the substrate 100, and a plurality of die bonding regions 101 are arranged on the substrate 100 within the outer frame 200.

[0095] The aforementioned substrate 100 requires pre-processing to replace expensive molds for processing borders on the substrate 100, so that the pre-processed substrate 100 is provided with an outer frame 200, a cutting channel 300, and multiple arrayed die-bonding regions 101; the cutting channel 300 includes descaled marks and labels provided at the outer peripheral edge of the substrate 100; that is, the substrate 100 in this application only has a large outer frame 200 on its outer periphery, and then several die-bonding regions 101 are provided in the outer frame 200, so that the outer periphery of the fixed region is no longer provided with a border structure, effectively solving the problem of halo caused by the reflection of light from the light-emitting device by the border, and effectively reducing the production cost of the light-emitting device.

[0096] As shown in Figure 8, after step S100, step S200 is also included: a first light-emitting element 11 and a second light-emitting element 12 are disposed in each die-bonding region 101 along the first direction, and die-bonding adhesive is baked.

[0097] The first light-emitting element 11 and the second light-emitting element 12 are arranged in the solidification region 101 along a first direction (the horizontal direction in the figure), and the distance between the two adjacent sides of the first light-emitting element 11 and the second light-emitting element 12 in the first direction is 1 to 50 micrometers.

[0098] The aforementioned die-bonding region 101 is provided with die-bonding adhesive. By placing the first light-emitting element 11 and the second light-emitting element 12 inside the die-bonding region 101 and baking the die-bonding adhesive to melt it, and then cooling and solidifying it, the first light-emitting element 11 and the second light-emitting element 12 are fixed inside the die-bonding region 101. This is possible.

[0099] In some embodiments, the die bonding process in step S200 above is performed using an ASM862 die bonder, and the die bonding and baking process specifically includes the following two stages:

[0100] The baking temperature for the first stage die bond adhesive is 140℃-150℃, and the baking time for the first stage die bond adhesive is 55-65 minutes.

[0101] The second stage die bonding baking temperature is 170℃-180℃, and the second stage die bonding adhesive baking time is 235-245min; so that the first light-emitting element 11 and the second light-emitting element 12 are fixed in the die bonding region 101.

[0102] In summary, during the first stage of baking at 150°C for 1 hour, the die bond adhesive can be effectively softened and initially flowed; during the second stage of baking at 180°C for 240 minutes, the first light-emitting element 11 and the second light-emitting element 12 can be fixed in the die bond region 101, thereby improving the die bond effect of the first light-emitting element 11 and the second light-emitting element 12.

[0103] As shown in Figures 8 to 10, after step S200, step S300 is further included: the first light-emitting element 11 is welded to the substrate 100 through the first bonding wire 13, and the second light-emitting element 12 is welded to the substrate 100 through the second bonding wire 14.

[0104] It should be noted that before step S300 above, step S110 is also included: a first solder joint 1 and a second solder joint 2 are provided on the substrate 100, a third solder joint 3 corresponding to the first solder joint 1 is provided on the first light-emitting element 11, and a fourth solder joint 4 corresponding to the second solder joint 2 is provided on the second light-emitting element 12.

[0105] It should be noted that step S110 above refers to the electrical connection between the first light-emitting element 11 and the second light-emitting element 12 and the first substrate 10 in the light-emitting device shown in Figure 1. When the light-emitting device is the light-emitting device shown in Figures 5 to 7, it is only necessary to set the positions of one of the third solder points 3 and the fourth solder point 4 accordingly. The preparation steps are similar to step S110 and will not be described in detail here.

[0106] The above step S110 only needs to be set before step S300. It can be set between step S200 and step S300, as shown in Figure 9; or it can be set between step S100 and step S200, as shown in Figure 10. In other words, after setting the die-bonding region 101 on the substrate 100, the positions of the first solder joint 1 and the second solder joint 2 can be set. Then, based on the positions of the first solder joint 1 and the second solder joint 2, the first light-emitting element 11 and the second light-emitting element 12 can be set in the die-bonding region 101. Finally, the third solder joint 3 can be set on the first light-emitting element 11 and the fourth solder joint 4 can be set on the second light-emitting element 12. Alternatively, after setting the die-bonding region 101 on the substrate 100, the first light-emitting element 11 and the second light-emitting element 12 can be set in the die-bonding region 101 first. Then, according to the positions of the first light-emitting element 11 and the second light-emitting element 12, and the positions of the third solder joint 3 on the first light-emitting element 11 and the fourth solder joint 4 on the second light-emitting element 12, the first solder joint 1 and the second solder joint 2 can be set outside the die-bonding region 101 of the substrate 100. Step S110 only needs to be completed before step S300. The specific details are not limited here.

[0107] Based on this, in step S300, the first light-emitting element 11 is soldered to the substrate 100 through the first bonding wire 13, and the second light-emitting element 12 is soldered to the substrate 100 through the second bonding wire 14.

[0108] In some embodiments, step S300 specifically includes: S310: one end of the first bonding wire 13 is welded to the first solder joint 1, and the other end is welded to the third solder joint 3; S320: one end of the second bonding wire 14 is welded to the second solder joint 2, and the other end is welded to the fourth solder joint 4.

[0109] It should be noted that the structures obtained after steps S310 and S320 are the same, and there is no requirement for the order of steps S310 and S320.

[0110] As shown in Figure 8, after step S300, step S400 is also included: applying wire protective adhesive to the first bonding wire 13 and the second bonding wire 14 and drying them.

[0111] In the preparation process of step S400 above, it is necessary not only to apply wire protective adhesive to the first bonding wire 13 and the second bonding wire 14, but also to apply wire protective adhesive to the first solder joint 1, the second solder joint 2, the third solder joint 3 and the fourth solder joint 4, so as to protect the first bonding wire 13 and the second bonding wire 14.

[0112] It should be noted that the above-mentioned wire protective adhesive is a light-absorbing adhesive.

[0113] As shown in Figure 8, after step S400, step S500 is also included: injecting transparent protective adhesive into the outer frame 200 and drying it to obtain a transparent encapsulation layer 15.

[0114] In some embodiments, step S500 specifically includes: injecting transparent protective adhesive into the outer frame 200 until the transparent protective adhesive covers the substrate 100, and then drying the transparent protective adhesive to form a transparent encapsulation layer 15.

[0115] When drying the above-mentioned transparent protective adhesive, it is not a one-time direct drying process, but rather requires three stages and multiple drying steps, specifically:

[0116] The first stage of drying involves controlling the drying temperature at 75℃-80℃ and the drying time at 28min-32min (specifically 30min).

[0117] The second stage of drying involves controlling the drying temperature at 125℃-130℃ and the drying time at 28min-32min.

[0118] The third stage of drying involves controlling the drying temperature at 145℃-150℃ and the drying time at 235min-245min.

[0119] In summary, the first drying stage, at 80°C for 30 minutes, effectively softens the die-attach adhesive and allows it to initially flow; the second drying stage, at 130°C for 30 minutes, and the third drying stage, at 150°C for 240 minutes, ensures that the transparent protective adhesive is effectively melted while drying out its moisture. This allows the transparent protective adhesive to flow fully and evenly cover the first light-emitting element 11, the second light-emitting element 12, and other components on the substrate 100, thereby effectively controlling the thickness of the transparent encapsulation layer 15.

[0120] As shown in Figure 8, after step S500, step S600 is also included: an aperture is provided on the outside of the transparent encapsulation layer 15, such that the orthographic projection of the light-transmitting hole 201 of the aperture on the first substrate 10 is located at the adjacent center of the first light-emitting element 11 and the second light-emitting element 12.

[0121] By setting an aperture on the outside of the transparent encapsulation layer 15, the aperture can be directly fixed on the first substrate 10 through the transparent encapsulation layer 15. In this way, the aperture is firmly connected to the first substrate 10, and no other layers need to be set. This helps to reduce the thickness of the light-emitting device. In addition, the processing steps are simple and the cost is low.

[0122] As shown in Figure 8, after step S600, step S700 is also included: cutting along the cutting path 300 to obtain the light-emitting device.

[0123] By cutting along the pre-set cutting path 300, damage to the structure of the light-emitting device can be effectively avoided during cutting and blanking. This solves the halo problem while ensuring the structural integrity of the light-emitting device and the efficiency of cutting and blanking.

[0124] The light-emitting device obtained through the above-described fabrication process, by surrounding the substrate 100 with an outer frame 200 and a cutting channel 300, not only eliminates the need for a frame corresponding to each die-bonding region 101, thus avoiding the use of molds and reducing costs, but also eliminates the need for a frame in the finished light-emitting device. When this product light-emitting device is used in a reflective sight, it effectively avoids the problem of halos around the light source caused by light reflected from the frame, improving the aiming accuracy of the reflective sight. In addition, by directly injecting transparent protective adhesive into the outer frame 200, all adhesive application can be completed in one injection, eliminating the need for expensive special molds for sealing, further reducing the production cost of the finished light-emitting device and greatly improving the production efficiency of the light-emitting device.

[0125] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A light-emitting device for a reflective sight, characterized in that, include: The first substrate (10) includes a die-bonding region (101). A first light-emitting element (11) is disposed inside the die-bonding region (101), and the first light-emitting element (11) is electrically connected to the first substrate (10); The second light-emitting element (12) is disposed inside the die-bonding region (101). The second light-emitting element (12) is electrically connected to the first substrate (10) so that the second light-emitting element (12) and the first light-emitting element (11) are connected in parallel. The second light-emitting element (12) and the first light-emitting element (11) are arranged along a first direction. In the first direction, the distance between the side of the first light-emitting element (11) close to the second light-emitting element (12) and the second light-emitting element (12) is 1~50 micrometers. An aperture is disposed on the light-emitting side of the first light-emitting element (11) and the second light-emitting element (12). The orthographic projection of the light-transmitting hole (201) of the aperture on the first substrate (10) is located at the adjacent center of the first light-emitting element (11) and the second light-emitting element (12), so that the light emitted by the first light-emitting element (11) and the second light-emitting element (12) can pass through. The first direction is perpendicular to the thickness direction of the first substrate (10).

2. The light-emitting device according to claim 1, characterized in that, The first light-emitting element (11) can emit a first light signal, and the second light-emitting element (12) can emit a second light signal. The wavelength of the second light signal is different from the wavelength of the first light signal.

3. The light-emitting device according to claim 1, characterized in that, The light-transmitting hole (201) is a circular hole with a diameter of 5 micrometers to 80 micrometers.

4. The light-emitting device according to claim 1, characterized in that, The first light-emitting element (11) is soldered to the first substrate (10) via the first bonding wire (13), and the second light-emitting element (12) is soldered to the first substrate (10) via the second bonding wire (14). The first substrate (10) is also provided with protective adhesive, which is used to cover all the solder joints at the two ends of the first bonding wire (13), the second bonding wire (14), and the solder joints at the two ends of the first bonding wire (13) and the second bonding wire (14).

5. The light-emitting device according to claim 4, characterized in that, The first light-emitting element (11) includes a first LED chip, which is a single-electrode chip or a dual-electrode chip; The second light-emitting element (12) includes a second LED chip, which is a single-electrode chip or a dual-electrode chip.

6. The light-emitting device according to claim 5, characterized in that, The first substrate (10) is provided with two first solder joints (1) and two second solder joints (2), the first solder joints (1) and the second solder joints (2) being located outside the die bonding region (101); One of the third solder points (3) corresponding to the two first solder points (1) is disposed on the first light-emitting element (11) and the other third solder point (3) is disposed on the die-bonding region, or both of the third solder points (3) corresponding to the two first solder points (1) are disposed on the first light-emitting element (11); One of the fourth solder points (4) corresponding to the two second solder points (2) is disposed on the second light-emitting element (12), and the other fourth solder point (4) is disposed on the die-bonding region; or, the two fourth solder points (4) corresponding to the two second solder points (2) are disposed on the second light-emitting element (12); One end of the first bonding wire (13) is welded to the first solder joint (1), and the other end is welded to the third solder joint (3); one end of the second bonding wire (14) is welded to the second solder joint (2), and the other end is welded to the fourth solder joint (4).

7. The light-emitting device according to claim 6, characterized in that, In the second direction, one first solder joint (1) and one second solder joint (2) located on one side of the die-bonding region are integral structures; another first solder joint (1) and another second solder joint (2) located on the other side of the die-bonding region are spaced apart; The second direction, the first direction, and the thickness direction of the first substrate are all perpendicular to each other.

8. The light-emitting device according to any one of claims 1 to 7, characterized in that, A transparent encapsulation layer (15) is provided on the first substrate (10). The transparent encapsulation layer (15) is located on the light-emitting side of the first light-emitting element (11) and the second light-emitting element (12). The orthographic projection of the transparent encapsulation layer (15) on the first substrate (10) completely covers the first substrate (10). The aperture is fixed on the side of the transparent encapsulation layer (15) away from the first substrate (10).

9. A reflex sight, characterized in that, include: The reflective lens (30) and the light-emitting device as described in any one of claims 1 to 8, wherein the light-transmitting aperture (201) of the aperture in the light-emitting device is located at the focal point of the reflective lens (30).

10. The reflex sight according to claim 9, characterized in that, The light-transmitting hole (201) is a circular hole, and the center of the light-transmitting hole (201) coincides with the focal point of the reflecting lens (30), and / or, the reflecting surface (301) of the reflecting lens (30) is provided with a high-reflectivity film.

11. The reflex sight according to claim 9 or 10, characterized in that, The light-emitting device is electrically connected to a power supply (40) and a push-button switch (42) via a control unit (41). The push-button switch (42) is used by the controller to control the opening and closing of at least one of the first light-emitting element (11) and the second light-emitting element (12) in the light-emitting device. Alternatively, the light-emitting device is connected to the power supply (40) via a rotary switch (43), and by rotating the rotary switch (43), at least one of the first light-emitting element (11) and the second light-emitting element (12) is turned on and off.

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