Pull-tab seal liner

Abstract

A pull-tab seal liner (50), sequentially comprising, from top to bottom, an upper layer (100), a bonding layer (200), and an adhesive sealing composite layer (300). The upper layer (100) comprises a surface film (110). The bonding layer (200) comprises a bonding adhesive (210A) or a bonding agent (220A), and a pull-tab layer (230). The adhesive sealing composite layer (300) sequentially comprises, from top to bottom, an electromagnetic induction heating layer (310) and an adhesive sealing layer (320). The bonding layer (200) bonds the upper layer (100) and the adhesive sealing composite layer (300) together by means of the bonding adhesive (210A) or the bonding agent (220A), and an unbonded area is formed between the upper layer (100) and the adhesive sealing composite layer (300). The pull-tab layer (230) is configured in the unbonded area, and the pull-tab layer (230) is bonded to one of the upper layer (100) and the adhesive sealing composite layer (300) by means of a composite adhesive (210B) or a composite agent (220B).

Description

Flap-type sealing gasket Technical Field

[0001] This disclosure relates to a sealing gasket, and more particularly to a flap-type sealing gasket. Background Technology

[0002] To prevent leakage and spoilage due to external environmental factors, sealing gaskets are used to seal the openings of packaging containers such as beverage cans and medicine bottles. Generally, sealing gaskets are made of materials such as aluminum foil or cardboard.

[0003] By using a sealing gasket to tightly seal the container opening, the contents can be prevented from leaking out and the contents can be sealed and preserved. Summary of the Invention

[0004] However, because the existing sealing gaskets are designed primarily for sealing and not for ease of opening, the aluminum foil or cardboard at the container opening is not easy to open with a finger, and cutting it with a knife or poking it with an awl is both troublesome and dangerous, causing inconvenience to the user.

[0005] Therefore, how to solve the aforementioned problems encountered by existing sealing gaskets and effectively improve the ease of opening has become an urgent problem that this technical field hopes to solve.

[0006] To address the aforementioned problems, this disclosure provides a flap-type sealing gasket, which, from top to bottom, comprises an upper layer, a connecting layer, and an adhesive-sealing composite layer. The upper layer includes a surface film. The connecting layer includes a bonding adhesive or binder and a flap layer. The adhesive-sealing composite layer, from top to bottom, comprises an electromagnetic induction heating layer and an adhesive-sealing layer. The connecting layer bonds the upper layer and the adhesive-sealing composite layer together using a bonding adhesive or binder, forming an unbonded area between the upper layer and the adhesive-sealing composite layer. The flap layer is disposed in the unbonded area and is bonded to one of the upper layer and the adhesive-sealing composite layer using a composite adhesive or binder.

[0007] In some embodiments, the upper layer is laminated to the adhesive-sealing composite layer via a bonding adhesive, and the flap layer is laminated to the upper layer via a composite adhesive, forming a void region between the flap layer and the adhesive-sealing composite layer. The flap layer includes a single-piece flap diaphragm. The single-piece flap diaphragm is made of at least one material selected from the group consisting of paper, polyethylene terephthalate (PET), polypropylene (PP), polyamide (PA), polyethylene naphthalate (PEN), and polyimide (PI).

[0008] In some embodiments, the upper layer is bonded to the sealing composite layer via a bonding adhesive, and the flap layer is bonded to the sealing composite layer via a composite adhesive, forming a void region between the upper layer and the flap layer. The flap layer includes a single-piece flap liner. The single-piece flap liner is made of at least one material selected from the group consisting of paper, PET, PP, PA, PEN, and PI.

[0009] In some embodiments, the upper layer is bonded to the adhesive-sealing composite layer via a binder, the flap layer is bonded to the upper layer via a composite agent, and the flap layer is bonded to the adhesive-sealing composite layer via an adhesive. The flap layer includes a folded flap diaphragm. The folded flap diaphragm includes an upper folded flap diaphragm and a lower folded flap diaphragm. The upper folded flap diaphragm is bonded to the upper layer, and the lower folded flap diaphragm is bonded to the adhesive-sealing composite layer, forming a gap region between the upper and lower folded flap diaphragms. The upper and lower folded flap diaphragms are made of at least one material selected from the group consisting of PA, PP, PET, PEN, and PI. The cross-sectional width of the upper folded flap diaphragm is less than or equal to the cross-sectional width of the lower folded flap diaphragm.

[0010] In some embodiments, the upper layer is laminated to the adhesive-sealing composite layer via a bonding adhesive, and the flap layer is laminated to the upper layer via a composite adhesive, forming a gap region between the flap layer and the adhesive-sealing composite layer. The flap layer includes a spliced ​​flap membrane. The spliced ​​flap membrane includes a first flap membrane and a second flap membrane, and a gap region is formed between the first flap membrane and the second flap membrane. The material of the first flap membrane is selected from at least one of the group consisting of PP, PET, PA, PEN, and PI, and the material of the second flap membrane is selected from at least one of the group consisting of paper, PP, PET, PA, PEN, and PI.

[0011] In some embodiments, the upper layer is bonded to the adhesive-sealing composite layer via a binder, the flap layer is bonded to the upper layer via a composite agent, and the flap layer is bonded to the adhesive-sealing composite layer via an adhesive. The flap layer includes a folded, spliced ​​flap film. The folded, spliced ​​flap film includes an upper flap film and a lower flap film. The upper flap film is bonded to the upper layer, and the lower flap film is bonded to the adhesive-sealing composite layer, forming a gap region between the upper and lower flap films. The upper flap film includes a first flap film and a second flap film, forming a gap region between the first and second flap films. The materials of the first and lower flap films of the upper flap film are each selected from at least one of the group consisting of PA, PP, PET, PEN, and PI. The material of the second flap film of the upper flap film is selected from at least one of the group consisting of paper, PA, PP, PET, PEN, and PI.

[0012] In some embodiments, the cross-sectional width of the flap layer is greater than or equal to one-sixth of the cross-sectional width of the flap-type sealing gasket, and the cross-sectional width of the flap layer is less than or equal to five-sixths of the cross-sectional width of the flap-type sealing gasket.

[0013] In some embodiments, the adhesive composite layer further includes a bonding membrane. The bonding membrane is disposed on the uppermost layer of the adhesive composite layer. The bonding membrane is made of at least one selected from the group consisting of polyethylene (PE), PP, PA, expandable polypropylene (EPP), and expandable polyethylene (EPE).

[0014] In some embodiments, the adhesive composite layer further includes a composite film. The composite film is disposed above the electromagnetic induction heating layer. The composite film is made of at least one material selected from the group consisting of PP, PET, PEN, PE, and PA.

[0015] In some embodiments, the bonding adhesive is configured to provide a peel strength between the upper layer and the adhesive-sealed composite layer greater than or equal to 17.8 N / 15 mm.

[0016] In some embodiments, the material of the surface film is selected from at least one of the group consisting of PEN, PI, PET, PE, PP and PA.

[0017] In some embodiments, the sealing layer is a hot melt adhesive or a combination of a sealing film and an adhesive. The hot melt adhesive is made of at least one material selected from the group consisting of ethylene / vinyl acetate copolymer (EVA), polyisobutylene (PIB), ethylene butyl acrylate copolymer (EBA), ethylene acrylate copolymer (EAA), ethylene-methyl acrylate copolymer (EMAC), polyacrylate, polyacetate, and ethylene-methacrylic acid copolymer (EMAA). The adhesive film is made of at least one of the group consisting of PE, PP, PA, polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), and PET, and the adhesive is located between the adhesive film and the electromagnetic induction heating layer.

[0018] In some embodiments, the binder, composite adhesive, binder, and composite agent are dry composite adhesives or hot melt laminates, and the material of the hot melt laminate is selected from at least one of the group consisting of PE, PP, EMAA, EAA, ethylene ethyl acrylate copolymer (EEA), EMAC, and ethylene methyl methacrylate copolymer (EMMA).

[0019] In some embodiments, the electromagnetic induction heating layer is an aluminum foil or a wireless information integration sheet.

[0020] In some embodiments, the wireless information integration sheet includes: a base film; an information and heating layer including an information area and an electromagnetic induction heating ring; and a first adhesive layer located between the base film and the information and heating layer; wherein the information area has an antenna and a chip that are mutually connected, and the electromagnetic induction heating ring surrounds the information area in a planar view.

[0021] In some embodiments, the wireless information integration sheet further includes a protective layer and a second adhesive layer, wherein the protective layer is located on the side of the information and heating layer away from the base film, and the second adhesive layer is located between the information and heating layer and the protective layer.

[0022] In some embodiments, there is a gap between the electromagnetic induction heating ring and the information area. Additionally, in some embodiments, the gap is the distance between the outermost edge of the information area and the innermost edge of the electromagnetic induction heating ring, which is 0.1 mm to 3 mm. In some preferred embodiments, the gap between the electromagnetic induction heating ring and the information area is completely filled.

[0023] In some embodiments, the information and heating layer further includes at least one physical connection bridge for connecting the information area and the electromagnetic induction heating ring.

[0024] Those skilled in the art to which this disclosure pertains can utilize the pull-tab sealing gasket provided by this disclosure to not only prevent leakage of contents and deterioration due to external environmental influences, but also allow users to easily peel off the container opening by directly pinching the pull-tab layer and the surface film without the aid of external objects, thereby further achieving the effect of easy opening.

[0025] One embodiment of this disclosure addresses the problems of the prior art described above, and its purpose is to provide a pull-tab sealing gasket that further improves the ease of opening for the user. In other words, the pull-tab sealing gasket provided by this disclosure simultaneously ensures the airtightness of the contents and the ease of opening for the user.

[0026] Overview of the attached figures

[0027] Figure 1A is a cross-sectional schematic diagram illustrating the flap-type sealing gasket of the first embodiment of the present disclosure.

[0028] Figure 1B is a cross-sectional schematic diagram illustrating the local variations of the flap-type sealing gasket shown in Figure 1A.

[0029] Figure 1C is a cross-sectional schematic diagram illustrating the local variations of the flap-type sealing gasket shown in Figure 1A.

[0030] Figure 1D is a cross-sectional schematic diagram illustrating the local variations of the flap-type sealing gasket shown in Figure 1C.

[0031] Figure 2A is a cross-sectional schematic diagram illustrating the flap-type sealing gasket of the second embodiment of the present disclosure.

[0032] Figure 2B is a cross-sectional schematic diagram illustrating a flap-type sealing gasket according to a third embodiment of the present disclosure.

[0033] Figure 2C is a cross-sectional schematic diagram illustrating the flap-type sealing gasket of the fourth embodiment of the present disclosure.

[0034] Figure 3 is a cross-sectional schematic diagram illustrating the flap-type sealing gasket of the fifth embodiment of the present disclosure.

[0035] Figure 4 is a cross-sectional schematic diagram illustrating the flap-type sealing gasket of the sixth embodiment of the present disclosure.

[0036] Figure 5 is a cross-sectional schematic diagram illustrating the flap-type sealing gasket of the seventh embodiment of the present disclosure.

[0037] Figures 6A to 6D are side views illustrating the flap-type sealing gasket of this disclosure.

[0038] Figure 7 is a cross-sectional schematic diagram of a wireless information integration chip according to an embodiment of the present disclosure.

[0039] Figure 8A is a plan view of information and heating layer according to an embodiment of the present disclosure.

[0040] Figure 8B is a plan view of information and heating layer according to another embodiment of this disclosure.

[0041] Figure 9A is a plan view of a specific example of an information area according to an embodiment of the present disclosure.

[0042] Figure 9B is a plan view of a specific example of the information area according to another embodiment of this disclosure.

[0043] Figure 10 is a cross-sectional schematic diagram of a wireless information integration chip according to another embodiment of the present disclosure.

[0044] Figure reference numeral 50 Flange-type sealing gasket 100 Upper layer 110 Surface film 150 First connecting film 190 Adhesive 200 Connecting layer 210A Connecting adhesive 210B Composite adhesive 220A Connector 220B Composite agent 230 Flange layer 231 Folded flap 231A Upper folded flap 231B Lower folded flap 232 Spliced ​​flap 232A First flap 232B Second flap 233 Folded spliced ​​flap 233A Upper folded flap 233B Lower folded flap 234 Single-piece flap 240 Adhesive 270 Hot melt bonding adhesive 300 Sealing composite layer 310 Electromagnetic induction heating layer 320 Sealing layer 321 Sealing film 322 Adhesive 330 Connecting film 340, Protective film 350, Second connecting film 360, Thickening layer 370, Composite film 390, Adhesive 1w, Base film 2w, First adhesive layer 3w, Information and heating layer 4w, Second adhesive layer 5w, Protective layer 31w, Information area 32w, Electromagnetic induction heating ring 33w, Physical connection bridge 100w, 100w', Wireless information integration chip 311w, Chip 312w, Antenna GA, Gap area ITV, Spacing SA, Gap area W1, W2, W3, W4, Section width

[0045] Preferred embodiments of this disclosure

[0046] The following describes the implementation of this disclosure through specific embodiments. Those skilled in the art can understand other advantages and effects of this disclosure from the content disclosed in this specification. This disclosure can also be implemented or applied through other different embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of this disclosure.

[0047] Unless otherwise stated herein, the term "A to B" as used in the specification and appended claims includes "more than A and less than B". For example, the term "10 to 40% by weight" includes "more than 10% by weight and less than 40% by weight".

[0048] Furthermore, it should be noted that in the descriptions herein, terms such as "first," "second," and "third" are used to distinguish between elements, not to limit the elements themselves or to indicate a specific order of elements. It should also be noted that in the descriptions below, the same elements or steps may be represented by the same numbering.

[0049] Please refer to FIG1A, which is a cross-sectional schematic diagram illustrating the flap-type sealing gasket 50 of the first embodiment of the present disclosure. As shown in FIG1A, the flap-type sealing gasket 50 includes, from top to bottom, an upper layer 100, a connecting layer 200, and an adhesive composite layer 300. The upper layer 100 includes a surface film 110, the connecting layer 200 includes a connecting adhesive 210A and a flap layer 230, and the adhesive composite layer 300 includes, from top to bottom, an electromagnetic induction heating layer 310 and an adhesive layer 320. The various structures will be described in more detail below.

[0050] Additionally, please refer to Figure 1B, which is a cross-sectional schematic diagram illustrating a partial variation of the flap-type sealing gasket 50 shown in Figure 1A. Compared to Figure 1A, the bonding adhesive 210A and composite adhesive 210B shown in Figure 1A can be replaced by a dry composite adhesive or a hot melt laminate 270, respectively, and the material of the hot melt laminate 270 can be at least one selected from the group consisting of PE, PP, EMAA, EAA, EEA, EMAC, and EMMA. The thickness of the hot melt laminate 270 is preferably 4 μm to 60 μm. In some embodiments, the hot melt laminate 270 can be, for example, a laminating adhesive used during lamination, but is not limited thereto. In some embodiments, the hot melt laminate 270 can make the peel strength between the upper layer 100 and the sealing composite layer 300 greater than or equal to 17.8 N / 15 mm, and can make the peel strength between the upper layer 100 and the flap layer 230 greater than or equal to 17.8 N / 15 mm. In this way, by using hot melt adhesive 270, the upper layer 100 and the sealing composite layer 300, as well as the upper layer 100 and the flap layer 230, can be firmly bonded together.

[0051] It should be noted that the bonding adhesive and composite adhesive described in this disclosure can be bonded using the same adhesive, thereby simplifying manufacturing complexity and improving manufacturing convenience. Alternatively, the bonding adhesive and composite adhesive described in this disclosure can also be bonded using different adhesives. Similarly, the binder and composite agent described in this disclosure can also be bonded using the same adhesive, thereby simplifying manufacturing complexity and improving manufacturing convenience. Alternatively, the binder and composite agent described in this disclosure can also be bonded using different adhesives.

[0052] <<Upper Layer 100>>

[0053] The upper layer 100 is disposed on the topmost layer of the flap-type sealing gasket 50. Taking FIG. 1A as an example, the upper layer 100 includes a surface film 110, which serves as the topmost layer (i.e., surface layer) of the flap-type sealing gasket 50. In some embodiments, the upper and / or lower surfaces of the surface film 110 may be printable surfaces, which can be used to print different patterns. In some embodiments, the material of the surface film 110 may be at least one selected from the group consisting of PEN, PI, PET, PE, PP, and PA. The thickness of the surface film 110 is preferably from 12 μm to 150 μm, within which tensile strength is greater, surface is smooth and glossy; additionally, when heat conduction is felt below the flap-type sealing gasket 50, the surface film 110 can be prevented from sticking to other external components (e.g., bottle caps).

[0054] <<Connection Layer 200>>

[0055] A connecting layer 200 is disposed between the upper layer 100 and the adhesive-sealed composite layer 300. Taking FIG. 1A as an example, the connecting layer 200 includes a connecting adhesive 210A and a flap layer 230, and the connecting layer 200 can bond the upper layer 100 and the adhesive-sealed composite layer 300 through the connecting adhesive 210A, forming an unbonded area between the upper layer 100 and the adhesive-sealed composite layer 300. In some embodiments, the flap-type sealing gasket 50 can achieve a peel strength greater than or equal to 17.8 N / 15 mm between the upper layer 100 and the adhesive-sealed composite layer 300 through the connecting adhesive 210A, thereby enabling a stable composite. In some embodiments, taking FIG. 1A as an example, the connecting adhesive 210A can be an adhesive bonding agent, achieving a peel strength greater than or equal to 17.8 N / 15 mm between the upper layer 100 and the adhesive-sealed composite layer 300, thereby enabling a stable composite, but is not limited to this. In some embodiments, the adhesive 210A may be a dry composite adhesive or the aforementioned hot melt laminate, but is not limited thereto.

[0056] A bonding layer 200 is disposed between the upper layer 100 and the adhesive composite layer 300. Taking FIG. 1B as an example, the bonding layer 200 includes a hot-melt adhesive 270 and a flap layer 230. The bonding layer 200 can bond the upper layer 100 and the adhesive composite layer 300 together via the hot-melt adhesive 270, forming an unbonded area between the upper layer 100 and the adhesive composite layer 300. In some embodiments, the flap-type sealing gasket 50 can achieve a peel strength greater than or equal to 17.8 N / 15 mm between the upper layer 100 and the adhesive composite layer 300 via the hot-melt adhesive 270, thereby ensuring a stable bond. In some embodiments, the material of the hot-melt adhesive 270 can be at least one selected from the group consisting of PE, PP, EMAA, EAA, EEA, EMAC, and EMMA. The thickness of the hot-melt adhesive 270 is preferably 4 μm to 60 μm.

[0057] The flap layer 230 is disposed in the aforementioned unbonded area, and the flap layer 230 can be bonded to one of the upper layer 100 and the adhesive-sealing composite layer 300 described later by means of the composite adhesive 210B. That is, as shown in FIG1A, the flap layer 230 is bonded to the upper layer 100 only by means of the composite adhesive 210B (but not to the adhesive-sealing composite layer 300), or as shown in FIG1C, the flap layer 230 is bonded to the adhesive-sealing composite layer 300 only by means of the composite adhesive 210B (but not to the upper layer 100).

[0058] Taking Figure 1A as an example, the flap layer 230 is disposed in the aforementioned unbonded area, and the flap layer 230 can be bonded to the upper layer 100 by a composite adhesive 210B. In some embodiments, the flap-type sealing gasket 50 can achieve a peel strength greater than or equal to 17.8 N / 15 mm between the upper layer 100 and the flap layer 230 by using the composite adhesive 210B, thereby achieving a stable bond. In some embodiments, taking Figure 1A as an example, the composite adhesive 210B can be a dry bonding adhesive or the aforementioned hot melt bonding adhesive, achieving a peel strength greater than or equal to 17.8 N / 15 mm between the upper layer 100 and the flap layer 230, thereby achieving a stable bond, but is not limited to this. In some embodiments, to improve manufacturing convenience, the composite adhesive 210B can be the same as the bonding adhesive 210A, that is, the same adhesive (e.g., the hot melt bonding adhesive 270 shown in Figure 1B) can be used as both the bonding adhesive 210A and the composite adhesive 210B. In some embodiments, the bonding adhesive 210A and the composite adhesive 210B can be applied simultaneously as the same adhesive.

[0059] Please refer to Figures 1C and 1D. Figure 1C is a cross-sectional schematic diagram illustrating the local changes of the flap-type sealing gasket 50 shown in Figure 1A, and Figure 1D is a cross-sectional schematic diagram illustrating the local changes of the flap-type sealing gasket 50 shown in Figure 1C.

[0060] Taking Figure 1C as an example, the flap layer 230 is disposed in the aforementioned unbonded area, and the flap layer 230 can be bonded to the sealing composite layer 300 by a composite adhesive 210B. In some embodiments, the flap-type sealing gasket 50 can achieve a peel strength greater than or equal to 17.8 N / 15 mm between the flap layer 230 and the sealing composite layer 300 by using a composite adhesive 210B such as the aforementioned hot melt laminating adhesive or dry laminating adhesive, thereby achieving a stable bond. Furthermore, in some embodiments, to improve manufacturing convenience, the composite adhesive 210B can be the same as the bonding adhesive 210A, i.e., the same adhesive (e.g., the hot melt laminating adhesive 270 shown in Figure 1D) can be used for both the bonding adhesive 210A and the composite adhesive 210B. In some embodiments, the bonding adhesive 210A and the composite adhesive 210B can be applied simultaneously as the same adhesive.

[0061] In some embodiments, taking FIG1A as an example, as shown in FIG1A, the flap layer 230 can be a single-piece flap diaphragm. In some embodiments, the material of the single-piece flap diaphragm can be at least one selected from the group consisting of paper, PET, PP, PA, PEN, and PI, but is not limited thereto. The thickness of the single-piece flap diaphragm is preferably 12 μm to 50 μm. Furthermore, in other embodiments, the flap layer 230 can also be a folded flap diaphragm (as shown in FIG2A), a spliced ​​flap diaphragm (as shown in FIG2B), or a folded spliced ​​flap diaphragm (as shown in FIG2C).

[0062] Taking a single-piece or spliced ​​flap diaphragm 232 as an example, a gap area SA will be formed between the flap layer 230 and the adhesive composite layer 300 to ensure that the flap layer 230 and the adhesive composite layer 300 are separated from each other (i.e., not composite with each other). Alternatively, a gap area SA will be formed between the spliced ​​flap diaphragm 232 and the adhesive composite layer 300 to ensure that the spliced ​​flap diaphragm 232 and the adhesive composite layer 300 are separated from each other (i.e., not composite with each other). This allows the user to easily peel off the flap sealing gasket 50 by hand without the aid of external objects.

[0063] Taking the folded flap diaphragm 231 or the folded spliced ​​flap diaphragm 233 as an example, the flap layer 230 can be bonded to the sealing composite layer 300 by the adhesive 240, and the flap-type sealing gasket 50 can achieve a peel strength greater than or equal to 4N / 15mm between the sealing composite layer 300 and the flap layer 230 by the adhesive 240. In some embodiments, the adhesive 240 can be a dry composite adhesive or the aforementioned hot melt lamination adhesive, but is not limited thereto. Although the flap layer can be bonded to the sealing composite layer 300 by adhesive 240, since the folded flap 231 or folded spliced ​​flap 233 in the flap layer can include an upper folded flap and a lower folded flap, and a gap area will be formed between the upper folded flap and the lower folded flap, it can be ensured that the upper folded flap and the lower folded flap are in a separate state (i.e., not bonded to each other), so that the user can easily peel off the flap-type sealing gasket 50 by hand without the aid of external objects.

[0064] Referring again to Figure 1A, in some embodiments, the cross-sectional width W1 of the flap layer 230 is greater than or equal to one-sixth of the cross-sectional width W2 of the flap-type sealing gasket 50, and the cross-sectional width W1 of the flap layer 230 is less than or equal to five-sixths of the cross-sectional width W2 of the flap-type sealing gasket 50. When the diameter of the sealing gasket is relatively large, the cross-sectional width of the flap layer 230 can be smaller. When the diameter of the sealing gasket is relatively small, the cross-sectional width of the flap layer 230 can be larger. Additionally, the flap layer 230 is not limited to a semi-circular shape to increase the user's design flexibility.

[0065] <<Acrylic Composite Layer 300>>

[0066] The sealing composite layer 300 is disposed at the bottom of the flap-type sealing gasket 50. Taking Figure 1A as an example, the sealing composite layer 300 includes, from top to bottom, an electromagnetic induction heating layer 310 and a sealing layer 320. The electromagnetic induction heating layer 310 can be aluminum foil or a wireless information integration sheet described later. Aluminum foil is an existing structure in existing sealing gaskets, and the thickness of the aluminum foil is preferably 10μm to 40μm, thereby enhancing the barrier function against moisture and oxygen, generating the effect of preventing leakage of contents and sealing and preserving the contents. The wireless information integration sheet described later can be used to replace aluminum foil, which can effectively reduce the amount of aluminum foil used and reduce energy consumption. Specifically, by means of the wireless information integration sheet of this disclosure, the function of wireless information transmission can be increased, while reducing aluminum foil material waste, reducing energy consumption, avoiding manpower waste, avoiding interference from metals and liquids, improving production efficiency, providing good communication performance and significantly increasing communication distance, and greatly improving the automation, digitalization and intelligentization of factories, warehouses, logistics, shops and unmanned checkout management. In some embodiments, the thickness of the wireless information integration sheet is preferably 27 μm to 2.5 mm.

[0067] The sealing layer 320 is primarily used to seal the container opening. In some embodiments, the sealing layer 320 may be, for example, a hot melt adhesive. The hot melt adhesive may be, but is not limited to, at least one of the group consisting of EVA, PIB, EBA, EAA, EMAC, polyacrylate, acrylic copolymer, and EMAA. The thickness of the hot melt adhesive is preferably from 4 μm to 100 μm. With hot melt adhesives formulated from certain of these types, an adhesive can be eliminated, and a continuous sealing effect can be achieved even when the contents of the glass container contain water, and also when the contents of the glass container contain chili peppers, garlic, fermented bean curd, honey, or other pungent additives.

[0068] In another embodiment (referring to Figures 3 to 5), taking Figure 3 as an example, the adhesive layer 320 can be a combination of an adhesive film 321 and an adhesive 322, with the adhesive 322 located between the adhesive film 321 and the electromagnetic induction heating layer 310. In some embodiments, the material of the adhesive film 321 can be at least one selected from the group consisting of PE, PP, PA, PVDC, EVOH, and PET, and the thickness of the adhesive film 321 is preferably 12 μm to 100 μm; while the adhesive 322 can be an existing adhesive (e.g., dry composite adhesive), but is not limited thereto.

[0069] As described above, when the sealing layer 320 uses a combination of hot melt adhesive or sealing film and adhesive, it makes it easier for the user to peel off the flap-type sealing gasket 50 from the bottle opening, or makes it easier for the user to peel off the clean flap-type sealing gasket 50 from the bottle opening.

[0070] Therefore, the pull-tab sealing gasket 50 shown in Figure 1A not only prevents leakage of the contents and spoilage due to external environmental influences, but also allows users to easily open the container opening by simply pinching the pull-tab layer 230 and the surface film 110 without the aid of any external object, thus further achieving the effect of easy opening. In other words, the pull-tab sealing gasket 50 shown in Figure 1A can simultaneously ensure the airtightness of the contents and the convenience of opening for the user.

[0071] Furthermore, although not illustrated, the layers of the flap-type sealing gasket 50 in this embodiment can be composited in various ways (e.g., adhesive, bonding, or connection).

[0072] Please refer to FIG2A, which is a cross-sectional schematic diagram illustrating the flap-type sealing gasket 50 of the second embodiment of the present disclosure. More specifically, FIG2A discloses an embodiment in which the flap layer is a folded flap film 231, and the adhesive 210A and composite adhesive 210B shown in FIG1A are replaced by a binder 220A and a composite agent 220B, respectively, while the other components are substantially the same as those in the flap-type sealing gasket 50 shown in FIG1A, and will not be described again here.

[0073] In some embodiments, the binder 220A used in FIG2A can be a dry composite adhesive or the aforementioned hot melt laminate adhesive, such that the peel strength between the upper layer 100 and the adhesive composite layer 300 is greater than or equal to 4N / 15mm, and the composite agent 220B used in FIG2A can be a dry composite adhesive or the aforementioned hot melt laminate adhesive, such that the peel strength between the upper layer 100 and the flap layer 230 is greater than or equal to 4N / 15mm.

[0074] Taking Figure 2A as an example, the valve-pulling layer may include a folded valve-pulling membrane 231. The folded valve-pulling membrane 231 may include an upper folded valve-pulling membrane 231A and a lower folded valve-pulling membrane 231B. The upper folded valve-pulling membrane 231A is composited with the upper layer 100, and the lower folded valve-pulling membrane 231B is composited with the adhesive composite layer 300, forming a void region SA between the upper folded valve-pulling membrane 231A and the lower folded valve-pulling membrane 231B. In some embodiments, the materials of the upper folded valve-pulling membrane 231A and the lower folded valve-pulling membrane 231B may be selected from at least one of the group consisting of PA, PP, PET, PEN, and PI, but are not limited thereto. The thicknesses of the upper folded valve-pulling membrane 231A and the lower folded valve-pulling membrane 231B are preferably 12 μm to 24 μm, respectively. In this configuration, the folded flap 231 has a large breaking strength. At this time, the user can open the container opening by pinching the flap sealing gasket 50 mainly due to the strong breaking strength of the folded flap 231.

[0075] As shown in Figure 2A, the upper folded flap 231A of the folded flap 231 in the flap layer can be bonded to the surface film 110 in the upper layer 100 by the composite agent 220B. The flap-type sealing gasket 50 can achieve a peel strength greater than or equal to 4 N / 15 mm between the upper layer 100 and the flap layer through the composite agent 220B. The lower folded flap 231B of the folded flap 231 in the flap layer can be bonded to the electromagnetic induction heating layer 310 in the adhesive composite layer 300 by the adhesive 240. The flap-type sealing gasket 50 can achieve a peel strength greater than or equal to 4 N / 15 mm between the adhesive composite layer 300 and the flap layer through the adhesive 240.

[0076] In existing sealing gaskets, the high peel strength required between the flap layer and the underlying layer in certain situations makes it difficult to bond the flap layer and the underlying layer together. As shown in Figure 2A, the flap-type sealing gasket 50 can form a gap region SA between the upper flap film 231A and the lower flap film 231B, ensuring that the upper flap film 231A and the lower flap film 231B are separated (i.e., not bonded), allowing the user to easily peel off the flap-type sealing gasket 50 by hand without the aid of external tools. Additionally, the folded flap film 231 can be made of a film with low elongation at break and high tensile strength (materials such as PA, PP, PET, PEN, or PI), thereby significantly compensating for the insufficient peel strength between the flap layer and the underlying layer by leveraging the film's high tensile strength.

[0077] In some embodiments, the cross-sectional width W3 of the upper folded valve 231A can be less than or equal to the cross-sectional width W4 of the lower folded valve 231B. When the cross-sectional width W3 of the upper folded valve 231A is less than the cross-sectional width W4 of the lower folded valve 231B, a small space will appear at the outermost edge of the upper folded valve 231A, and air will be present in this space. In this case, even if the adhesive composite layer 300 is very thin, the user can easily open the valve by hand, so that the user can easily peel off the valve-type sealing gasket 50 by hand without the aid of external objects.

[0078] Please refer to Figure 2B, which is a cross-sectional schematic diagram illustrating the flap-type sealing gasket 50 of the third embodiment of this disclosure. More specifically, Figure 2B discloses an embodiment with a flap layer of spliced ​​flap membrane 232, while the other components are substantially the same as those shown in Figure 1A for the flap-type sealing gasket 50, and will not be described again here.

[0079] In some embodiments, the adhesive 210A used in FIG2B may be a dry composite adhesive or the aforementioned hot melt laminate, such that the peel strength between the upper layer 100 and the adhesive composite layer 300 is greater than or equal to 17.8 N / 15 mm, while the composite adhesive 210B used in FIG2B may be a dry composite adhesive or the aforementioned hot melt laminate that is coated or laminated simultaneously using a sandwich method.

[0080] Taking Figure 2B as an example, the valve-pulling layer may include a spliced ​​valve-pulling membrane 232. The spliced ​​valve-pulling membrane 232 may include a first valve-pulling membrane 232A and a second valve-pulling membrane 232B, and a gap region GA is formed between the first valve-pulling membrane 232A and the second valve-pulling membrane 232B. In some embodiments, the material of the first valve-pulling membrane 232A may be at least one selected from the group consisting of PP, PET, PA, PEN, and PI, but is not limited thereto. In some embodiments, the material of the second valve-pulling membrane 232B may be at least one selected from the group consisting of paper, PP, PET, PA, PEN, and PI, but is not limited thereto. The thickness of the spliced ​​valve-pulling membrane 232 is preferably from 12 μm to 50 μm.

[0081] As shown in Figure 2B, the flap-type sealing gasket 50 can form a gap area SA between the flap layer and the adhesive sealing composite layer 300, thereby ensuring that the flap layer and the adhesive sealing composite layer 300 are separated from each other (i.e., not bonded to each other), so that the user can easily peel off the flap-type sealing gasket 50 by hand without the aid of external objects.

[0082] When the flap-type sealing gasket 50 adopts the spliced ​​flap film 232, the space reserved at the splice (i.e., the gap area GA) will be subject to the interaction of thermal expansion and edge compression during electromagnetic induction sealing, so that the flap-type sealing gasket 50, as shown in Figure 2B, can retain some space at the splice (i.e., the gap area GA), allowing the user to open the flap layer more easily.

[0083] Please refer to Figure 2C, which is a cross-sectional schematic diagram illustrating the flap-type sealing gasket 50 of the fourth embodiment of this disclosure. More specifically, Figure 2C discloses an embodiment for which the flap layer is a folded spliced ​​flap film 233, and the connecting adhesive 210A and composite adhesive 210B shown in Figure 1A are replaced by a binder 220A and a composite agent 220B, respectively. The other components are substantially the same as those in the flap-type sealing gasket 50 shown in Figure 1A, and will not be described again here.

[0084] In some embodiments, the binder 220A used in FIG2C can be a dry composite adhesive or the aforementioned hot melt laminate adhesive, such that the peel strength between the upper layer 100 and the adhesive composite layer 300 is greater than or equal to 4N / 15mm, and the composite agent 220B used in FIG2C can be a dry composite adhesive or the aforementioned hot melt laminate adhesive, such that the peel strength between the upper layer 100 and the flap layer 230 is greater than or equal to 4N / 15mm.

[0085] Taking Figure 2C as an example, the valve layer may include a folded, spliced ​​valve 233. The folded, spliced ​​valve 233 may include an upper folded valve 233A and a lower folded valve 233B. The upper folded valve 233A is composited with the upper layer 100, and the lower folded valve 233B is composited with the adhesive composite layer 300, forming a gap region SA between the upper folded valve 233A and the lower folded valve 233B. The upper folded valve 233A may include a first valve 232A and a second valve 232B, forming a gap region GA between the first valve 232A and the second valve 232B. In some embodiments, the materials of the first valve 232A and the lower folded valve 233B of the upper folded valve 233A may be selected from at least one of the group consisting of PA, PP, PET, PEN, and PI, but are not limited thereto. The thicknesses of the first pull flap 232A and the lower pull flap 233B of the upper folding pull flap 233A are preferably 12 μm to 24 μm. The material of the second pull flap 232B of the upper folding pull flap 233A can be at least one selected from the group consisting of paper, PA, PP, PET, PEN and PI, and the thickness of the second pull flap 232B of the upper folding pull flap 233A is preferably 12 μm to 50 μm. In this configuration, the bi-folded spliced ​​pull flap 233 has greater breaking strength, and the user can open the container opening by pinching the pull flap sealing gasket 50 mainly due to the strong breaking strength of the bi-folded pull flap 231.

[0086] As shown in Figure 2C, the upper folded flap 233A of the folded flap 233 in the flap layer can be bonded to the surface film 110 in the upper layer 100 through the composite agent 220B. The flap-type sealing gasket 50 can achieve a peel strength greater than or equal to 4 N / 15 mm between the upper layer 100 and the flap layer through the composite agent 220B. The lower folded flap 233B of the folded flap 233 in the flap layer can be bonded to the electromagnetic induction heating layer 310 in the adhesive composite layer 300 through the adhesive 240. The flap-type sealing gasket 50 can achieve a peel strength greater than or equal to 4 N / 15 mm between the adhesive composite layer 300 and the flap layer through the adhesive 240.

[0087] As shown in Figure 2C, the pull-flap sealing gasket 50 can form a gap area SA between the upper pull-flap membrane 233A and the lower pull-flap membrane 233B, thereby ensuring that the upper pull-flap membrane 233A and the lower pull-flap membrane 233B are separated from each other (i.e., not combined with each other), so that the user can easily peel off the pull-flap sealing gasket 50 by hand without the aid of external objects.

[0088] With existing sealing gaskets, the high peel strength required between the flap layer and the underlying layer in certain situations makes it difficult to bond the flap layer to the underlying layer. When the flap-type sealing gasket 50 uses a folded flap film 233, the space retained at the joint (i.e., the gap area GA formed between the first flap film 232A and the second flap film 232B) allows the flap-type sealing gasket 50, as shown in Figure 2C, to retain some space at the joint (i.e., the gap area GA) during the interaction of thermal expansion and edge compression during electromagnetic induction sealing, thus allowing the user to open the flap layer more easily. Additionally, the folded flap film 233 can be made of a film with low elongation at break and high tensile strength (materials such as PA, PP, PET, PEN, or PI), thereby significantly compensating for the insufficient peel strength between the flap layer and the underlying layer by utilizing the film's high tensile strength. In some embodiments, the materials of the first pull valve 232A and the second pull valve 232B may be different from each other.

[0089] Please refer to Figure 3, which is a cross-sectional schematic diagram illustrating the pull-flap type sealing gasket 50 of the fifth embodiment of this disclosure. More specifically, the adhesive-sealing composite layer 300 of the pull-flap type sealing gasket 50 shown in Figure 3 further includes a bonding film 330 and a protective film 340, while the other components are substantially the same as those of the pull-flap type sealing gasket 50 shown in Figure 2C, and will not be described again here.

[0090] <<Conjunctival 330>>

[0091] A connecting film 330 is disposed on the uppermost layer of the adhesive composite layer 300 for bonding with the surface film 110 of the upper layer 100 and the folded flap 233 of the flap layer. More specifically, the connecting film 330 is bonded to the surface film 110 of the upper layer 100 via a binder 220A, and to the lower folded flap 233B of the folded flap 233 via an adhesive 240. In some embodiments, the material of the connecting film 330 may be at least one selected from the group consisting of PE, PP, PA, EPP, and EPE, and the thickness of the connecting film 330 is preferably 12 to 200 μm; thereby, the peel strength after bonding between the connecting film 330 and the upper layer 100 and / or the folded flap 233 can be improved.

[0092] <<Protective Film 340>>

[0093] Taking Figure 3 as an example, a protective film 340 is disposed between the connecting film 330 and the electromagnetic induction heating layer 310. In some embodiments, the material of the protective film 340 may be at least one selected from the group consisting of PET, PA and PP, and the thickness of the protective film 340 is preferably 12μm to 50μm; thereby, when the protective film 340 is sequentially laminated with the connecting film 330, the wireless information integrated chip containing the antenna and chip, and the adhesive layer 320, damage to the chip in the wireless information integrated chip can be avoided.

[0094] Taking Figure 3 as an example, adhesive 390 can be used to bond the connecting film 330 and the protective film 340, and between the protective film 340 and the electromagnetic induction heating layer 310. In some embodiments, adhesive 390 can be an existing adhesive, such as a dry laminating adhesive or the aforementioned hot melt laminating adhesive, but is not limited thereto. In some embodiments, adhesive 390 can make the peel strength between the two bonded layers (e.g., connecting film 330 and protective film 340) greater than or equal to 4 N / 15 mm.

[0095] Please refer to Figure 4, which is a cross-sectional schematic diagram illustrating the flap-type sealing gasket 50 of the sixth embodiment of this disclosure. More specifically, the adhesive composite layer 300 of the flap-type sealing gasket 50 shown in Figure 4 further includes a connecting film 330 and a composite film 370, while the other components are substantially the same as those of the flap-type sealing gasket 50 shown in Figure 2B, and will not be described again here. Furthermore, since the connecting film 330 is substantially the same as that described in Figure 3, it will also not be described again here.

[0096] <<Composite Membrane 370>>

[0097] Taking Figure 4 as an example, the composite film 370 is disposed above the electromagnetic induction heating layer 310. More specifically, the composite film 370 is disposed between the connecting film 330 and the electromagnetic induction heating layer 310, and it is used to improve the tensile strength of the flap-type sealing gasket 50. In some embodiments, the material of the composite film 370 may be at least one selected from the group consisting of PP, PET, PEN, PE and PA, and the thickness of the composite film 370 is preferably 12 μm to 100 μm.

[0098] Taking Figure 4 as an example, adhesive 390 can also be used to bond the connecting membrane 330 and the composite membrane 370 and the electromagnetic induction heating layer 310 and the composite membrane 370.

[0099] Please refer to FIG5, which is a cross-sectional schematic diagram illustrating the flap-type sealing gasket 50 of the seventh embodiment of the present disclosure. More specifically, the upper layer 100 of the flap-type sealing gasket 50 shown in FIG5 further includes a first connecting film 150, and the adhesive composite layer 300 further includes a second connecting film 350 and a thickening layer 360, while the other components are substantially the same as those of the flap-type sealing gasket 50 shown in FIG2A, and will not be described again here.

[0100] <<First conjunctival membrane 150>>

[0101] The first connecting film 150 is disposed on the bottom layer of the upper layer 100 and is used to laminate with the adhesive composite layer 300 and the flap layer. Taking FIG5 as an example, the first connecting film 150 is laminated with the second connecting film 350 of the adhesive composite layer 300 through a binder 220A, and with the folded flap 231 in the flap layer through a composite agent 220B. In some embodiments, the material of the first connecting film 150 may be at least one selected from the group consisting of PE, PP, PA, EMMA and EMAC, and the thickness of the first connecting film 150 is preferably 12μm to 100μm; thereby, the peel strength after lamination between the first connecting film 150 and the second connecting film 350 of the adhesive composite layer 300 and the folded flap 231 of the flap layer can be improved respectively.

[0102] <<Second Connective Membrane 350>>

[0103] The second connecting film 350 is disposed on the uppermost layer of the adhesive composite layer 300 for bonding with the upper layer 100 and the flap layer. Taking FIG. 5 as an example, the second connecting film 350 is bonded to the first connecting film 150 of the upper layer 100 via a binder 220A, and to the folded flap 231 in the flap layer via an adhesive 240. In some embodiments, the material of the second connecting film 350 may be at least one selected from the group consisting of PE, PP, PA, EPP, and EPE, and the thickness of the second connecting film 350 is preferably 12 μm to 200 μm; thereby, the peel strength after bonding the second connecting film 350 with the first connecting film 150 of the upper layer 100 and the folded flap 231 of the flap layer can be improved.

[0104] <<Thickened Layer 360>>

[0105] Taking Figure 5 as an example, the thickening layer 360 is disposed above the electromagnetic induction heating layer 310 (specifically, it may be located between the second connecting film 350 and the electromagnetic induction heating layer 310), and it is used to increase the thickness of the flap-type sealing gasket 50. In some embodiments, the material of the thickening layer 360 may be at least one selected from the group consisting of EPE, EPP, PE, PP and paper, and the thickness of the thickening layer 360 is preferably 60 μm to 2000 μm; thereby, the thickness of the flap-type sealing gasket 50 can be increased.

[0106] Taking Figure 5 as an example, adhesive 190 (which is substantially the same as adhesive 390) can be used to bond the surface film 110 and the first connecting film 150; while adhesive 390 can also be used to bond the second connecting film 350 and the thickened layer 360 and the thickened layer 360 and the electromagnetic induction heating layer 310.

[0107] Please refer to Figures 6A to 6D, which are side views illustrating the flap-type sealing gasket 50 of this disclosure.

[0108] Taking Figure 6A as an example, Figure 6A is a side view illustrating the flap-type sealing gasket 50 shown in Figures 1A and 1B. Because there is a gap area (the gap area SA shown in Figures 1A and 1B) between the single-piece flap film 234 in the flap layer and the adhesive composite layer 300, the user can easily peel off the flap-type sealing gasket 50 by directly pinching the single-piece flap film 234 and the surface film, thus further achieving the effect of easy opening.

[0109] Taking Figure 6B as an example, Figure 6B is a side view illustrating the flap-type sealing gasket 50 shown in Figure 2A. Because a gap area (gap area SA as shown in Figure 2A) is formed between the upper and lower flaps of the folded flap film 231, the user can easily pull open the flap-type sealing gasket 50 by directly pinching the upper flap and the surface film of the folded flap film 231, thereby further achieving the effect of easy opening.

[0110] Taking Figure 6C as an example, Figure 6C is a side view illustrating the flap-type sealing gasket 50 shown in Figure 2B. Because there is a gap area (gap area SA as shown in Figure 2B) between the spliced ​​flap membrane 232 in the flap layer 230 and the adhesive composite layer 300, and because there is a gap area (gap area GA as shown in Figure 2B) between the first flap membrane 232A and the second flap membrane 232B, the user can easily pull open the flap-type sealing gasket 50 by directly pinching the spliced ​​flap membrane 232 and the surface film, thus further achieving the effect of easy opening.

[0111] Taking Figure 6D as an example, Figure 6D is a side view illustrating the flap-type sealing gasket 50 shown in Figure 2C. Because a gap area (gap area SA as shown in Figure 2C) is formed between the upper and lower flaps of the folded flap film 233, and because a gap area (gap area GA as shown in Figure 2C) exists between the first and second flaps, the user can easily pull open the flap-type sealing gasket 50 by directly pinching the upper flap and the surface film of the folded flap film 233, thus further achieving the effect of easy opening.

[0112] [Wireless Information Integration Chip]

[0113] Next, a wireless information integration chip that can serve as the electromagnetic induction heating layer of this disclosure will be described.

[0114] First, please refer to Figure 7, which is a cross-sectional schematic diagram of a wireless information integration sheet 100w according to an embodiment of the present disclosure. As shown in Figure 7, the wireless information integration sheet 100w according to an embodiment of the present disclosure includes: a base film 1w; a first adhesive layer 2w; and an information and heating layer 3w. The first adhesive layer 2w is located between the base film 1w and the information and heating layer 3w, bonding the base film 1w and the information and heating layer 3w together. Hereinafter, each layer will be described in detail.

[0115] The base film 1w is the initial layer used to fabricate the wireless information integration sheet. In one specific example, the base film 1w is made of at least one of the group consisting of PI, PEN, PET, polycarbonate (PC), PP, and PE. The thickness of the base film 1w is preferably between 20 μm and 150 μm, within which the longitudinal and transverse tensile strengths are relatively high. Furthermore, as shown in FIG. 7, the lower surface of the base film 1w is bonded to the first adhesive layer 2w, while the upper surface of the base film 1w can be used as a printing surface to print different patterns.

[0116] The first adhesive layer is used to bond the base film and information to the heating layer. In one specific example, the first adhesive layer 2w only needs to be able to bond the base film 1w and information to the heating layer 3w, and its material is a composite adhesive. The thickness of the first adhesive layer 2w can be from 0.5μm to 7μm, which allows the peel strength between the two bonded materials to be greater than 4N / 15mm.

[0117] The information and heating layer 3w includes an information area 31w and an electromagnetic induction heating ring 32w. The information area 31w has wireless information read / write transmission capabilities for subsequent product traceability. The information area 31w includes an interconnected antenna 312w and a chip 311w. The electromagnetic induction heating ring 32w is heated by the electromagnetic field generated by the electromagnetic induction sealing machine, causing the sealing gasket's adhesive layer to melt and adhere to the container opening, thus acting as an electromagnetic induction sealing gasket to seal the container opening. Using the wireless information integrated chip disclosed herein, the majority of the heat is generated in the electromagnetic induction heating ring 32w, with minimal heat conduction occurring only through at least one physical connection bridge 33w between the antenna 312w and the electromagnetic induction heating ring 32w. The physical connection bridge 33w can have a length of 0.1mm to 3mm, a width of 0.01mm to 5mm, and its material can be the same as the antenna 312w. This not only prevents a large amount of heat from being transferred to the central area of ​​the sealing gasket during electromagnetic induction sealing, but also saves energy. When applied to sealing gaskets containing batteries, the thickness of the information and heating layer can be from 6μm to 2.5mm; while when applied to sealing gaskets without batteries, the thickness of the information and heating layer can be from 6μm to 300μm.

[0118] Next, Figure 8A is a plan view of the information and heating layer according to one embodiment of the present disclosure, and Figure 8B is a plan view of the information and heating layer according to another embodiment of the present disclosure. As shown in Figure 8A or Figure 8B, the electromagnetic induction heating ring 32w surrounds the information area 31w in a planar view. As shown in Figure 8A, the electromagnetic induction heating ring 32w and the information area 31w are filled with a spacer ITV, that is, there are no physical connecting elements (such as physical connecting bridges described later) between the electromagnetic induction heating ring 32w and the information area 31w. Therefore, by filling the spacer ITV between the electromagnetic induction heating ring 32w and the information area 31w, this filled spacer ITV can block heat conduction to the information area 31w when electromagnetic induction heating occurs, which is a preferred embodiment. The spacer ITV (the distance between the outermost edge of the information area 31w and the innermost edge of the electromagnetic induction heating ring 32w) can be from 0.1mm to 3mm. Next, as shown in Figure 8B, a gap ITV is present at most of the area between the electromagnetic induction heating ring 32w and the information area 31w. During electromagnetic induction heating, the gap ITV blocks most of the heat conduction to the information area 31w, and the gap ITV (the distance between the outermost edge of the information area 31w and the innermost edge of the electromagnetic induction heating ring 32w) can be 0.1mm to 3mm. Additionally, at least one physical connecting bridge 33w (indicated as two in Figure 8B and Figure 9B described later) can be present between the antenna 312w and the electromagnetic induction heating ring 32w. The length of the physical connecting bridge 33w can be 0.1mm to 3mm, and the width can be 0.01mm to 5mm. In this case, although the closed-loop electromagnetic induction heating ring 32w and the information area 31w are electrically connected, the wireless communication distance is not significantly reduced. In other words, the space between the electromagnetic induction heating ring 32w and the information area 31w can be filled with the ITV, and can have both the ITV and the physical connection bridge 33w at the same time, or it can be without the space (for example, the space between the electromagnetic induction heating ring 32w and the information area 31w can be filled with the physical connection bridge 33w).

[0119] In one specific example, the electromagnetic induction heating ring 32w can be made of metal, such as aluminum, copper, gold, silver, or tin. From the viewpoint of the effect of generating heat when subjected to a changing electromagnetic field and cost, the electromagnetic induction heating ring 32w is preferably made of aluminum foil with a thickness of 6 μm to 40 μm.

[0120] On the other hand, regarding chip 311w, it can have a unique identification code and can be selected according to the purpose. For example, it can be a radio frequency identification near field communication (RFID_NFC) chip, a radio frequency identification high frequency (RFID_HF) chip, a radio frequency identification ultra-high frequency (RFID_UHF) chip, or a radio frequency identification microwave (RFID_MW) chip, etc., without any particular limitation. All of these chips can be matched with antenna 312w described later to realize wireless information communication functions.

[0121] Next, regarding the antenna 312w, its main function is to generate wirelessly transmit signals. Its material can be metal, such as copper, silver, gold, tin or aluminum, and there are no particular restrictions.

[0122] Next, FIG9A is a plan view of a specific example of the information area of ​​one embodiment, and FIG9B is a plan view of a specific example of the information area of ​​another embodiment of the present disclosure. FIG9A shows an embodiment where the space between the electromagnetic induction heating ring 32w and the information area 31w, corresponding to FIG8A, is filled with an ITV (interval spacer). FIG9B shows an embodiment where, corresponding to FIG8B, most of the space between the electromagnetic induction heating ring 32w and the information area 31w has an ITV. Furthermore, as shown in FIG9A or FIG9B, the information area 31w includes a chip 311w and an antenna 312w. When wireless information transmission functionality is possible, the chip 311w and the antenna 312w can be arranged in the manner shown in FIG9A or FIG9B, or in other ways, based on the RFID frequency band desired by the user, and are not particularly limited.

[0123] Furthermore, although Figure 7 shows the case where the base film 1w is on top and the information and heating layer 3w is on the bottom, the order of the base film 1w and the information and heating layer 3w can be reversed as needed, i.e., adjusted so that the base film 1w is on the bottom and the information and heating layer 3w is on top.

[0124] Alternatively, the wireless information integration sheet can also be a wireless information integration sheet 100w', which, as shown in Figure 10, includes a protective layer 5w and a second adhesive layer 4w in addition to the aforementioned base film 1w, first adhesive layer 2w, and information and heating layer 3w. The protective layer 5w is located on the side of the information and heating layer 3w away from the base film 1w. The second adhesive layer 4w is located between the information and heating layer 3w and the protective layer 5w, and it serves to bond the information and heating layer 3w and the protective layer 5w together.

[0125] In one specific example, the second adhesive layer 4w only needs to be able to bond the information to the heating layer 3w and the protective layer 5w. Its material can be, for example, a dry composite adhesive or the aforementioned hot melt adhesive, and is not particularly limited. The thickness of the second adhesive layer 4w can be from 0.5 μm to 7 μm, preferably such that the peel strength between the two bonded layers is greater than 4 N / 15 mm. Furthermore, as shown in FIG10, the second adhesive layer 4w can extend to fill the gap between the electromagnetic induction heating ring 32w and the information area 31w to improve the overall structural strength of the wireless information integration piece 100w'.

[0126] Next, the protective layer 5w will be described. The protective layer 5w is used to protect the information area 31w (i.e., chip 311w, antenna 312w, and a separately added battery) from external damage to the chip 311w and battery, thus preventing them from affecting the wireless information transmission. Its material can be at least one of the group consisting of polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyamide (PA), polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), polyethylene naphthalate (PEN), and polyimide (PI). In a preferred embodiment, the thickness of the protective layer 5w can be from 12 μm to 100 μm.

[0127] Furthermore, either the upper or lower surface of the protective layer 5w can be used as the printing surface. Therefore, although Figure 10 shows the case where the base film 1w is below and the protective layer 5w is above (with the upper surface of the protective layer 5w serving as the printing surface), the order of the base film 1w and the protective layer 5w can be reversed as needed, i.e., the case where the base film 1w is above and the protective layer 5w is below (with the lower surface of the protective layer 5w serving as the printing surface).

[0128] [Method for making a flap-type sealing gasket (Part 1)]

[0129] The method for making the flap-type sealing gasket 50 shown in Figure 3 will be further revealed here.

[0130] First, an adhesive is applied to the upper surface of the protective film roll, and the upper surface of the protective film roll is dry-laminated with the lower surface of the connecting film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the first composite roll.

[0131] Next, an adhesive is applied to the protective film surface of the first composite section roll, so that the protective film surface of the first composite section roll is dry-laminated with the upper surface of the electromagnetic induction heating layer roll, and then placed in a curing chamber for more than 24 hours to produce the second composite section roll.

[0132] Next, an adhesive is applied to the electromagnetic induction heating layer of the second composite roll, and the electromagnetic induction heating layer of the second composite roll is dry-laminated with the upper surface of the sealing film roll. After curing in a curing chamber for more than 24 hours, the lower composite roll is produced. Alternatively, hot melt adhesive is applied to the electromagnetic induction heating layer of the second composite roll to produce the lower composite roll (i.e., the sealing composite layer roll).

[0133] Next, the splicing flap film roll is folded and pressed into a dead fold (a dead fold here means that the plastic film is pressed into a fold that is not easy to disappear by using a roller or plate with pressure, or by using a heating method to make the heating temperature close to or slightly exceed the Vicat softening point of the plastic film, so that the fold is extremely difficult to disappear due to the effect of heat), and a dead folded splicing flap film roll is made.

[0134] Next, an adhesive is applied to the lower surface of the dead-folded flap film roll to be spliced, so that the lower surface of the dead-folded flap film roll to be spliced ​​is dry-laminated with the connecting film surface of the lower composite roll. The roll is then placed in a curing chamber for more than 24 hours to produce the structural layer roll.

[0135] Next, a binder and a composite agent are applied to the lower surface of the surface film roll, allowing the upper surface of the structural layer roll, the upper surface of the second flap film roll to be spliced, and the lower surface of the surface film roll to be dry-laminated. This is then cured in a curing chamber for at least 24 hours to produce the flap-type sealing gasket roll. Afterward, flap-type sealing gaskets of appropriate sizes are cut according to the user's requirements.

[0136] Here, the peel strength between the two layers of material bonded by the adhesive is greater than 4 N / 15 mm; while the peel strength between the two layers of material bonded by the binder, composite agent, and adhesive is greater than 4 N / 15 mm. The five temperature sections of the upper drying tunnel of the dry laminator are 60℃ to 65℃, 65℃ to 70℃, 70℃ to 75℃, 75℃ to 80℃, and 80℃ to 85℃, respectively. The temperature of the laminating roller of the dry laminator is 50℃ to 60℃. The temperature of the curing chamber is 50℃ to 55℃.

[0137] [Method for making a flap-type sealing gasket (Part 2)]

[0138] The method for making the flap-type sealing gasket 50 shown in Figure 4 will be further revealed here.

[0139] First, an adhesive is applied to the upper surface of the electromagnetic induction heating layer roll, and the upper surface of the electromagnetic induction heating layer roll is dry-laminated with the lower surface of the composite film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the first composite section roll.

[0140] Next, an adhesive is applied to the composite film surface of the first composite roll, and the composite film surface of the first composite roll is dry-laminated with the lower surface of the connecting film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the second composite roll.

[0141] Next, an adhesive is applied to the electromagnetic induction heating layer of the second composite roll, and the electromagnetic induction heating layer of the second composite roll is dry-laminated with the upper surface of the sealing film roll. After curing in a curing chamber for more than 24 hours, the lower composite roll is produced. Alternatively, hot melt adhesive is applied to the electromagnetic induction heating layer of the second composite roll to produce the lower composite roll (i.e., the sealing composite layer roll).

[0142] Next, a strong adhesive (bonding adhesive and composite adhesive) is applied to the lower surface of the surface film roll, and a spliced ​​flap film roll is sandwiched in the middle. This allows for dry lamination of the lower surface of the surface film roll, the upper surface of the spliced ​​flap film roll, and the connecting film surface of the lower composite roll using a sandwich lamination method. The roll is then placed in a curing chamber for at least 24 hours to produce the flap-type sealing gasket roll. Afterward, flap-type sealing gaskets of appropriate sizes are cut according to the user's requirements.

[0143] Here, the peel strength between the two layers of material bonded by the adhesive is greater than 4 N / 15 mm; while the peel strength between the two layers of material bonded by the strong adhesive is greater than or equal to 17.8 N / 15 mm. The five temperature sections of the upper drying tunnel of the dry laminator are 60℃ to 65℃, 65℃ to 70℃, 70℃ to 75℃, 75℃ to 80℃, and 80℃ to 85℃, respectively. The temperature of the laminating roller of the dry laminator is 50℃ to 60℃. The temperature of the curing chamber is 50℃ to 55℃.

[0144] [Method for making a flap-type sealing gasket (Part 3)]

[0145] The method for making the flap-type sealing gasket 50 shown in Figure 5 will be further revealed here.

[0146] First, an adhesive is applied to the upper surface of the electromagnetic induction heating layer roll material, so that the upper surface of the electromagnetic induction heating layer roll material and the lower surface of the thickened layer roll material are dry-laminated. The roll material is then placed in a curing chamber for more than 24 hours to produce the first composite roll material.

[0147] Next, an adhesive is applied to the thickened layer of the first composite roll, and the thickened layer of the first composite roll is dry-laminated with the lower surface of the second connecting film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the second composite roll.

[0148] Next, an adhesive is applied to the electromagnetic induction heating layer of the second composite roll, and the electromagnetic induction heating layer of the second composite roll is dry-laminated with the upper surface of the sealing film roll. After curing in a curing chamber for more than 24 hours, the lower composite roll is produced. Alternatively, hot melt adhesive is applied to the electromagnetic induction heating layer of the second composite roll to produce the lower composite roll (i.e., the sealing composite layer roll).

[0149] Next, with the cross-sectional width of the upper folded valve being less than or equal to the cross-sectional width of the lower folded valve, the valve roll is folded in half and pressed into a dead fold to create a folded valve roll.

[0150] Next, an adhesive is applied to the lower surface of the folded flap membrane roll, so that the lower surface of the folded flap membrane roll is dry-laminated with the second connecting film surface of the lower composite roll, and then placed in a curing chamber for more than 24 hours to produce the structural layer roll.

[0151] Next, an adhesive is applied to the lower surface of the surface film roll, and the lower surface of the surface film roll is dry-laminated with the upper surface of the first connecting film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the upper composite roll (i.e., the upper layer roll).

[0152] Next, a binder and a bonding agent are applied to the first connecting film surface of the upper composite roll material, allowing for dry lamination between the first connecting film surface of the upper composite roll material and the upper surface of the structural layer roll material. This is then cured in a curing chamber for at least 24 hours to produce a flap-type sealing gasket roll material. Afterward, flap-type sealing gaskets of appropriate sizes are cut according to the user's requirements.

[0153] Here, the peel strength between the two layers of material bonded by the adhesive is greater than 4 N / 15 mm; while the peel strength between the two layers of material bonded by the binder, composite agent, and adhesive is greater than 4 N / 15 mm. The five temperature sections of the upper drying tunnel of the dry laminator are 60℃ to 65℃, 65℃ to 70℃, 70℃ to 75℃, 75℃ to 80℃, and 80℃ to 85℃, respectively. The temperature of the laminating roller of the dry laminator is 50℃ to 60℃. The temperature of the curing chamber is 50℃ to 55℃.

[0154] [Fabrication of Wireless Information Integration Sheet Rolls]

[0155] Based on the following steps, a preferred embodiment of the wireless information integration sheet roll of this disclosure is produced. The wireless information integration sheet roll described herein can be used as an embodiment of the aforementioned electromagnetic induction heating layer roll in the process of producing the aforementioned flap-type sealing gasket roll.

[0156] First, a composite adhesive (first adhesive layer) is applied to the composite surface of the base film roll, and then laminated with the composite surface of the metal foil roll to create a wireless information integrated circuit preform roll. Second, the metal foil of the wireless information integrated circuit preform roll is etched to connect the antenna and chip electrically. Then, chip encapsulation protective adhesive is used with a dispensing machine to encapsulate the chip and the connecting wires between the chip and the antenna. At this point, the metal foil of the wireless information integrated circuit preform roll forms the information and heating layers, and the wireless information integrated circuit preform roll becomes a wireless information integrated circuit roll.

[0157] The peel strength between the two layers of materials bonded by the composite adhesive is greater than 4N / 15mm.

[0158] In addition, if a battery is to be added to the information and heating layer, a welding machine or conductive adhesive can be used to process the battery cells and the chip into an electrical connection.

[0159] On the other hand, based on the aforementioned wireless information integrated sheet roll, a dry composite adhesive (second adhesive layer) is applied to the composite surface of the protective layer roll, and the information of the wireless information integrated sheet roll roll and the heating layer surface (the surface away from the base film) are dry-laminated. After curing in a curing chamber for more than 24 hours, another embodiment of the wireless information integrated sheet roll roll can be produced.

[0160] It should be noted that the above description is merely an illustrative example of manufacturing a flap-type sealing gasket. That is to say, those skilled in the art to which this disclosure pertains can adjust the sequence to manufacture a flap-type sealing gasket.

[0161] This disclosure is not limited to the various embodiments described above. Those skilled in the art to which this disclosure pertains can make various additions, subtractions, substitutions and / or changes within the scope disclosed in the claims. Furthermore, embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included within the technical scope of this disclosure.

Claims

1. A pull-apart closure gasket, characterized in that From top to bottom, it includes: The upper layer includes a surface film; The bonding layer includes a bonding adhesive or binder and a flap layer; and The adhesive-sealing composite layer, from top to bottom, includes an electromagnetic induction heating layer and an adhesive layer. The bonding layer, wherein the upper layer and the adhesive-bonded composite layer are bonded together by the bonding adhesive or the bonding agent, and an unbonded area is formed between the upper layer and the adhesive-bonded composite layer, and The flap layer is disposed in the unbonded area, and the flap layer is bonded to one of the upper layer and the adhesive composite layer by means of a composite adhesive or a composite agent.

2. The pull-apart closure gasket of claim 1, wherein, The upper layer is bonded to the adhesive-sealing composite layer via the bonding adhesive, and the flap layer is bonded to the upper layer via the composite adhesive. A void region is formed between the flap layer and the adhesive-sealing composite layer, and the flap layer comprises: A single-piece pull valve, the material of which is at least one of the group consisting of paper, polyethylene terephthalate (PET), polypropylene (PP), polyamide (PA), polyethylene naphthalate (PEN) and polyimide (PI).

3. The pull-apart closure gasket of claim 1, wherein, The upper layer is bonded to the sealing composite layer via the connecting adhesive, and the flap layer is bonded to the sealing composite layer via the composite adhesive. A void region is formed between the upper layer and the flap layer, and the flap layer comprises: A single-piece flap, the material of which is at least one of the group consisting of paper, PET, PP, PA, PEN and PI.

4. The pull-apart closure gasket of claim 1, wherein, The upper layer is bonded to the sealing composite layer via the binder, the flap layer is bonded to the upper layer via the composite agent, the flap layer is bonded to the sealing composite layer via an adhesive, and the flap layer comprises: A folded valve includes an upper folded valve and a lower folded valve. The upper folded valve is laminated with an upper layer, and the lower folded valve is laminated with an adhesive composite layer. A gap region is formed between the upper and lower folded valves. The upper folding valve and the lower folding valve are each made of at least one material selected from the group consisting of PA, PP, PET, PEN, and PI. Wherein, the cross-sectional width of the upper folded valve is less than or equal to the cross-sectional width of the lower folded valve.

5. The pull-apart closure gasket of claim 1, wherein, The upper layer is bonded to the adhesive-sealing composite layer via the bonding adhesive, and the flap layer is bonded to the upper layer via the composite adhesive. A void region is formed between the flap layer and the adhesive-sealing composite layer, and the flap layer comprises: A spliced ​​pull valve includes a first pull valve and a second pull valve, with a gap region formed between the first pull valve and the second pull valve. The material of the first pull valve is selected from at least one of the group consisting of PP, PET, PA, PEN and PI, and the material of the second pull valve is selected from at least one of the group consisting of paper, PP, PET, PA, PEN and PI.

6. The pull-apart closure gasket of claim 1, wherein, The upper layer is bonded to the sealing composite layer via the binder, the flap layer is bonded to the upper layer via the composite agent, the flap layer is bonded to the sealing composite layer via an adhesive, and the flap layer comprises: A folded, spliced ​​valve includes an upper folded valve and a lower folded valve. The upper folded valve is laminated with the upper layer, and the lower folded valve is laminated with the adhesive composite layer. A gap region is formed between the upper and lower folded valves. The upper folding valve includes a first folding valve and a second folding valve, and a gap region is formed between the first folding valve and the second folding valve. Wherein, the first pull valve of the upper pull valve and the lower pull valve are respectively made of at least one material selected from the group consisting of PA, PP, PET, PEN and PI, and The material of the second pull valve of the upper folding pull valve is selected from at least one of the group consisting of paper, PA, PP, PET, PEN and PI.

7. The pull-apart closure gasket of claim 1, wherein, The cross-sectional width of the flap layer is greater than or equal to one-sixth of the cross-sectional width of the flap-type sealing gasket, and the cross-sectional width of the flap layer is less than or equal to five-sixths of the cross-sectional width of the flap-type sealing gasket.

8. The pull-apart closure gasket of claim 1, wherein, The adhesive composite layer further includes: A bonding membrane, which is disposed on the topmost layer of the adhesive composite layer, The material of the connecting membrane is selected from at least one of the group consisting of polyethylene (PE), PP, PA, expandable polypropylene (EPP) and expandable polyethylene (EPE).

9. The pull-apart closure gasket of claim 1, wherein, The adhesive composite layer further includes: A composite film is disposed above the electromagnetic induction heating layer. The composite film is made of at least one material selected from the group consisting of PP, PET, PEN, PE and PA.

10. The pull-apart closure gasket of claim 1, wherein, The bonding adhesive is configured to provide a peel strength between the upper layer and the adhesive composite layer that is greater than or equal to 17.8 N / 15 mm.

11. The pull-apart closure gasket according to any one of claims 1 to 10, characterized in that The material of the surface film is selected from at least one of the group consisting of PEN, PI, PET, PE, PP and PA.

12. The pull-apart closure gasket of any one of claims 1 to 10, wherein, The sealing layer is a combination of hot melt adhesive or sealing film and adhesive, wherein the hot melt adhesive is made of at least one selected from the group consisting of ethylene / vinyl acetate copolymer (EVA), polyisobutylene (PIB), ethylene butyl acrylate copolymer (EBA), ethylene acrylic acid copolymer (EAA), ethylene-methyl acrylate copolymer (EMAC), polyacrylate, acrylic acid copolymer, and ethylene-methacrylic acid copolymer (EMAA), and the sealing film is made of PE, PP, PA, polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (PE). The adhesive is at least one of the group consisting of polymer (EVOH) and PET, and the adhesive is located between the sealing film and the electromagnetic induction heating layer.

13. The pull-apart closure gasket of any one of claims 1 to 10, wherein, The bonding adhesive, the composite adhesive, the binder, and the composite agent are dry composite adhesives or hot melt laminates, and the material of the hot melt laminate is selected from at least one of the group consisting of PE, PP, EMAA, EAA, ethylene ethyl acrylate copolymer (EEA), EMAC, and ethylene methyl methacrylate copolymer (EMMA).

14. The pull-apart closure gasket of any one of claims 1 to 10, wherein, The electromagnetic induction heating layer is aluminum foil or a wireless information integrated sheet.

15. The pull-apart closure gasket of claim 14, wherein, The wireless information integrated chip includes: a base film; an information and heating layer, which includes an information area and an electromagnetic induction heating ring; and a first adhesive layer located between the base film and the information and heating layer; wherein the information area has an antenna and a chip that are mutually connected, and the electromagnetic induction heating ring surrounds the information area in a planar view.

16. The pull-apart closure gasket of claim 15, wherein, The wireless information integration sheet also has a protective layer and a second adhesive layer. The protective layer is located on the side of the information and heating layer away from the base film, and the second adhesive layer is located between the information and heating layer and the protective layer.

17. The pull-apart closure gasket of claim 15, wherein, There is a gap between the electromagnetic induction heating ring and the information area.

18. The pull-apart closure gasket of claim 17, wherein, The interval is the distance between the outermost edge of the information area and the innermost edge of the electromagnetic induction heating ring, which is 0.1 mm to 3 mm.

19. The pull-apart closure gasket of claim 15, wherein, The electromagnetic induction heating ring and the information area are filled with a gap.

20. The pull-apart closure gasket of claim 15, wherein, The information and heating layer further comprises at least one physical connection bridge for connecting the information area and the electromagnetic induction heating ring. The information and heating layer further comprises at least one physical connection bridge for connecting the information area and the electromagnetic induction heating ring.

Images