Thickness control cooling air device for forming substrate glass by overflow process, and method for using same

Abstract

The present application belongs to the technical field of glass manufacturing. Disclosed are a thickness control cooling air device for forming substrate glass by an overflow process, and a method for using same. The device comprises two thermal equalization boxes and a cooling mechanism which are arranged at the bottom of an overflow brick, wherein the thermal equalization boxes are respectively located on two sides of substrate glass, and the cooling mechanism comprises a plurality of first cooling air pipes, a second cooling air pipe and a fixing assembly; each first cooling air pipe is arranged outside the thermal equalization boxes, and an air inlet of the first cooling air pipe is configured to communicate with cooling air; the second cooling air pipe extends through the thermal equalization boxes, an air outlet of the second cooling air pipe is arranged close to the substrate glass, and the second cooling air pipe is made of a high-temperature-resistant material; and the first cooling air pipes and the second cooling air pipe are in communication with each other by means of the fixing assembly. The present application can solve the problems of repeated thickness adjustment of a glass plate, low efficiency and poor accuracy caused by the failure to accurately adjust the relative position between the cooling air and the glass plate due to susceptibility to deformation of thickness control air pipes after long-term use.

Description

A thickness cooling air device for overflow method substrate glass forming and its usage method Technical Field

[0001] This application belongs to the field of glass manufacturing technology, and specifically relates to a thickness cooling air device for overflow method substrate glass forming and its usage method. Background Technology

[0002] In the development of the flat panel display industry, the overflow pull-down method is a crucial process in substrate glass production. Molten glass flows down from the overflow brick, passing through a thickness forming zone, a stress control zone, and a warpage adjustment zone to form a glass sheet with uniform thickness and a smooth surface. The thickness forming zone is particularly critical. To ensure rapid cooling and forming of the glass sheet, a thickness duct is installed in the heat exchange chamber, using cooling airflow to exchange heat with the glass sheet and adjust its thickness.

[0003] However, as display technology develops towards higher resolution, thinner profiles, and larger sizes, the requirements for controlling the thickness uniformity of glass substrates are becoming increasingly stringent.

[0004] Traditional technology, due to the thickness of the duct, is prone to deformation after long-term use, making it impossible to accurately adjust the relative position of the cooling air with the glass plate. This leads to problems such as repeated adjustments to the glass plate thickness, low efficiency, and poor precision. Summary of the Invention

[0005] The purpose of this application is to provide a thickness cooling air device and its usage method for overflow method substrate glass forming. This addresses the problems mentioned in the background art, such as the thick air duct being prone to deformation after long-term use, making it impossible to accurately adjust the relative position of the cooling air with the glass plate, leading to repeated thickness adjustments, low efficiency, and poor precision.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] In one aspect, a thickness cooling air device for overflow method substrate glass forming is provided, including two heat exchange boxes and a cooling mechanism disposed at the bottom of the overflow brick;

[0008] The heat exchange chambers are located on both sides of the substrate glass.

[0009] The cooling mechanism includes multiple first cooling ducts, second cooling ducts, and fixing components;

[0010] The first cooling duct is installed outside the heat exchange box, and the air inlet of the first cooling duct is connected to the cooling air.

[0011] The second cooling duct is installed through the heat exchange chamber, the air outlet of the second cooling duct is located close to the substrate glass, and the second cooling duct is made of a high temperature resistant material.

[0012] The first cooling duct and the second cooling duct are both connected by a fixed component.

[0013] In one possible implementation, the fixing component includes a fixing base, a mounting step, and a fixing member;

[0014] The fixing seat and the mounting step are respectively disposed between the first cooling air duct and the second cooling air duct;

[0015] The fixing base is connected to the first cooling air duct, and the mounting step is connected to the second cooling air duct;

[0016] The fastener is fixed to the heat exchange box body at one end through the fixing seat, so as to realize the connection between the first cooling air duct and the second cooling air duct.

[0017] In one possible implementation, the mounting step protrudes 5-15mm from the surface of the heat exchanger.

[0018] In one possible implementation, the mounting base has a mounting groove for accommodating the mounting step.

[0019] In one possible implementation, a seal is provided within the mounting groove.

[0020] In one possible implementation, the first cooling duct is made of a metal material.

[0021] In one possible implementation, the second cooling duct is made of corundum.

[0022] In one possible implementation, a first crossbeam for fixing the first cooling duct is also included.

[0023] In one possible implementation, a second crossbeam is provided inside the heat exchange box, and the second cooling air ducts are all arranged through the second crossbeam.

[0024] Secondly, a method for using a thickness cooling air device for overflow method substrate glass forming is provided, including the following steps:

[0025] The first and second cooling ducts are connected and fixed by a fixing component;

[0026] Cooling air is blown in through the first cooling air duct and blown towards the heat exchange chamber through the air outlet of the second cooling air duct, so that the cooling air exchanges heat with the heat exchange chamber and the substrate glass, thereby reducing the temperature of the corresponding position of the substrate glass, increasing the viscosity, and reducing the mutual influence of the transverse tension of the substrate glass, thus realizing the adjustment of the thickness of the substrate glass.

[0027] Compared with the prior art, this application has the following beneficial effects:

[0028] This application provides a thickness cooling air device for overflow method substrate glass forming. Through a fixing component, a first cooling air duct and a second cooling air duct can be assembled. The second cooling air duct is made of high temperature resistant material, which can reduce the possibility of ablation or deformation during long-term use. It is convenient to accurately adjust the relative position of the cooling air and the substrate glass, thereby facilitating the adjustment of the substrate glass thickness and improving the adjustment accuracy and efficiency. At the same time, the increase in the size of the heat exchanger box requires a longer air duct, which greatly increases the installation difficulty. By assembling the first cooling air duct and the second cooling air duct, installation is facilitated and production costs are reduced.

[0029] In one possible implementation, the fasteners facilitate simple operation and easy assembly of the first and second cooling ducts, thereby fixing the first and second cooling ducts to the heat exchange chamber. This allows cooling air to be blown into the heat exchange chamber through the first and second cooling ducts, enabling heat exchange between the cooling air and the heat exchange chamber.

[0030] In one possible implementation, the mounting step protrudes 5-15mm from the surface of the heat exchange box, which can strengthen the installation of the second cooling duct on the heat exchange box and thus improve the installation stability of the second cooling duct.

[0031] In one possible implementation, a mounting groove for accommodating the mounting step is provided on the fixed base. This is simple to operate and easy to install, and can improve the installation stability between the fixed base and the mounting step, thereby improving adaptability.

[0032] In one possible implementation, by setting a seal in the mounting slot, the sealing performance between the first and second cooling ducts can be enhanced, improving connection stability, reducing energy loss, and simplifying maintenance and replacement, thereby improving overall performance and reliability.

[0033] In one possible implementation, by setting the second cooling duct to corundum material, the high-temperature resistance of the second cooling duct can be improved, the ablation or deformation of the second cooling duct in the heat exchanger can be reduced, the relative position of the cooling air and the substrate glass can be precisely adjusted, and the thickness of the substrate glass can be adjusted, thereby improving the adjustment accuracy and efficiency of the substrate glass.

[0034] In one possible implementation, the first crossbeam can support the first cooling duct, providing a certain support effect and improving the stability of the first cooling duct.

[0035] In one possible implementation, by setting a second crossbeam inside the heat exchange box, through which the second cooling ducts pass, a certain supporting effect can be provided for the second cooling ducts, thereby improving the stability of the second cooling ducts inside the heat exchange box.

[0036] In one possible implementation, the use of a thickness cooling air device for overflow substrate glass forming has significant beneficial effects, including improving product quality, reducing production costs, increasing production efficiency, and saving energy and protecting the environment. Attached Figure Description

[0037] Figure 1 is a cross-sectional view of a thickness cooling air device for overflow method substrate glass forming provided in this application;

[0038] Figure 2 is an enlarged schematic diagram of the fixing component in Figure 1.

[0039] The attached figures are labeled as follows: 1. Heat dissipation chamber; 2. Cooling mechanism; 21. First cooling duct; 22. Second cooling duct; 23. Fixing component; 231. Fixing base; 232. Mounting step; 233. Fixing element; 234. Mounting groove; 235. Sealing element; 24. First crossbeam; 25. Second crossbeam; 3. Substrate glass. Embodiments of the present invention

[0040] The specific embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0041] As shown in Figures 1 and 2, this application discloses a thickness cooling air device for substrate glass forming using an overflow method, which may include two heat exchange boxes 1 and a cooling mechanism 2 disposed at the bottom of the overflow brick.

[0042] The heat exchange chamber 1 is located on both sides of the substrate glass 3. During the overflow and pull-down process of the substrate glass 3, the corresponding positions on both sides of the substrate glass 3 are cooled. The heat exchange chamber 1 can be made of silicon carbide material, which has high thermal conductivity and facilitates rapid heat exchange with the substrate glass 3, thereby achieving rapid cooling of the substrate glass 3, changing glass shrinkage, and achieving the purpose of glass thickness adjustment.

[0043] The cooling mechanism 2 may include multiple first cooling ducts 21, second cooling ducts 22, and fixing components 23.

[0044] The first cooling air duct 21 is installed outside the heat exchange box 1, and the air inlet of the first cooling air duct 21 is connected to the cooling air.

[0045] The second cooling duct 22 is installed through the heat exchange chamber 1, and the air outlet of the second cooling duct 22 is located near the substrate glass 3. The second cooling duct 22 is made of a high-temperature resistant material.

[0046] The first cooling duct 21 and the second cooling duct 22 are both connected by a fixing component 23.

[0047] Adjust the fixing component 23 to fix the first cooling air duct 21 and the second cooling air duct 22. In this way, a certain amount of cooling air is blown into the heat exchange box 1 through the first cooling air duct 21 and the second cooling air duct 22. Heat exchange occurs between the heat exchange box 1 and the substrate glass 3, which reduces the temperature of the corresponding position of the substrate glass 3. The increase in viscosity reduces the influence of the shrinkage force on both sides of the corresponding position of the substrate glass 3, thereby achieving the purpose of adjusting the basic thickness of the substrate glass 3.

[0048] In this embodiment, the fixing component 23 facilitates the assembly of the first cooling duct 21 and the second cooling duct 22. The second cooling duct 22 is made of high-temperature resistant material, which can reduce the risk of ablation or deformation of the second cooling duct 22 during long-term use in the heat exchanger 1. This facilitates precise adjustment of the relative position of the cooling air and the substrate glass 3, thereby facilitating the adjustment of the thickness of the substrate glass 3 and improving the adjustment accuracy and efficiency of the substrate glass 3. At the same time, the increased size of the heat exchanger requires longer ducts, which greatly increases the installation difficulty. By assembling the first cooling duct 21 and the second cooling duct 22, installation is facilitated and production costs are reduced.

[0049] In one possible implementation, the fixing component 23 may include a fixing base 231, a mounting step 232, and a fixing member 233.

[0050] The fixing seat 231 and the mounting step 232 are respectively disposed between the first cooling air duct 21 and the second cooling air duct 22. The fixing seat 231 is connected to the first cooling air duct 21 and is integrally connected to the first cooling air duct 21.

[0051] The mounting step 232 is connected to the second cooling air duct 22, and the mounting step 232 is integrally connected to the second cooling air duct 22.

[0052] The fastener 233 is fixed to the heat exchanger 1 at one end through the fixing base 231, thereby fixing the first cooling air duct 21 and the second cooling air duct 22, and allowing cooling air to be blown into the heat exchanger 1 sequentially through the first cooling air duct 21 and the second cooling air duct 22. Specifically, the fastener 233 can be configured as a fixing bolt, with one end of the fixing bolt passing through the fixing base 231 and threadedly connected to the heat exchanger 1.

[0053] In this embodiment, the fastener 233 simplifies the operation and facilitates the assembly of the first cooling duct 21 and the second cooling duct 22, thereby fixing the first cooling duct 21 and the second cooling duct 22 on the heat exchange chamber 1. This allows cooling air to be blown into the heat exchange chamber 1 through the first cooling duct 21 and the second cooling duct 22, thus enabling heat exchange between the cooling air and the heat exchange chamber 1.

[0054] In one possible embodiment, the mounting step 232 protrudes 5-15mm from the surface of the heat exchange chamber 1; optionally, the mounting step 232 protrudes 10mm from the heat exchange chamber.

[0055] In this embodiment, the mounting step 232 protrudes 5-15mm from the surface of the heat exchange box 1, which can strengthen the installation strength of the second cooling duct 22 on the heat exchange box 1, thereby improving the installation stability of the second cooling duct 22.

[0056] In one possible embodiment, the mounting base 231 has a mounting groove 234 for accommodating the mounting step 232.

[0057] Optionally, the mounting groove 234 is adapted to the cross-sectional shape of the mounting step 232, so that the outer side of the cross-sectional view of the mounting step 232 can be circular or polygonal.

[0058] In this embodiment of the application, an installation groove 234 for accommodating the installation step 232 is provided on the fixed base 231. This is simple to operate and convenient to install, and can improve the installation stability between the fixed base 231 and the installation step 232, thereby improving adaptability.

[0059] In one possible embodiment, a seal 235 is provided within the mounting groove 234.

[0060] Optionally, the seal 235 can be made of PTFE rubber, aluminum silicate, or other high-temperature resistant materials.

[0061] In this embodiment of the application, by providing a sealing element 235 in the mounting groove 234, the sealing performance between the first cooling duct and the second cooling duct 22 can be enhanced, the connection stability can be improved, energy loss can be reduced, and maintenance and replacement can be simplified, thereby improving the overall performance and reliability.

[0062] In one possible embodiment, the first cooling duct 21 is made of a metallic material.

[0063] In this embodiment of the application, the first cooling duct 21 is made of metal material, which can improve the strength and high temperature resistance of the first cooling duct 21.

[0064] In one possible embodiment, the second cooling duct 22 can be made of corundum material, which can withstand temperatures exceeding 1200°C, or it can be made of silicon carbide or other high-temperature resistant ceramic materials.

[0065] Optionally, the distance between the second cooling duct 22 and the heat exchange chamber 1 near the substrate glass 3 is 5-10mm, which further improves the heat exchange efficiency.

[0066] In this embodiment, by setting the second cooling duct 22 to corundum material, the high temperature resistance of the second cooling duct 22 can be improved, the erosion or deformation of the second cooling duct 22 in the heat exchange box 1 can be reduced, the relative position of the cooling air and the substrate glass 3 can be accurately adjusted, and the thickness of the substrate glass 3 can be adjusted, thereby improving the adjustment accuracy and efficiency of the substrate glass 3.

[0067] In one possible embodiment, a first crossbeam 24 for securing the first cooling duct 21 may also be included.

[0068] Specifically, in order to improve the support stability of the first cooling duct 21, a first crossbeam 24 is provided, so that all the first cooling ducts 21 pass through the first crossbeam 24.

[0069] In this embodiment of the application, the first crossbeam 24 can support the first cooling duct 21, thereby providing a certain support effect and improving the stability of the first cooling duct 21.

[0070] In one possible embodiment, a second crossbeam 25 is provided inside the heat exchange box 1, and the second cooling air ducts 22 are all provided through the second crossbeam 25.

[0071] In this embodiment, by providing a second crossbeam 25 inside the heat exchange box 1, and having the second cooling air ducts 22 all passing through the second crossbeam 25, the second cooling air ducts 22 can be provided with a certain support effect, thereby improving the stability of the second cooling air ducts 22 inside the heat exchange box 1.

[0072] A method of using a thickness cooling air device for overflow method substrate glass forming includes the following steps:

[0073] First, according to the design requirements, the two heat exchange chambers 1 are installed on both sides of the substrate glass 3, ensuring that their positions are accurate and stable. Next, the first cooling duct 21 and the second cooling duct 22 are connected and fixed using the fixing assembly 23.

[0074] After assembly, cooling air is blown in through the inlet of the first cooling duct 21. As the cooling air flows within the first cooling duct 21, it absorbs a certain amount of heat, thereby lowering its temperature. Then, the cooling air enters the second cooling duct 22 through the connection of the fixing component 23, continues to flow and accelerates, and finally blows out from the outlet towards the heat spreader 1. During this process, the cooling air exchanges heat with the heat spreader 1 and the substrate glass 3, carrying away the heat from the substrate glass 3, thereby lowering the temperature of the substrate glass 3.

[0075] As the temperature of the substrate glass 3 decreases, its fluidity also slows down. During the overflow method of substrate glass 3 molding, the fluidity of the substrate glass 3 directly affects its thickness. Therefore, by adjusting parameters such as the flow rate, speed, and temperature of the cooling air, the fluidity of the substrate glass 3 can be precisely controlled, thereby achieving adjustment of the substrate glass 3's thickness.

[0076] In this embodiment, by precisely controlling the flowability of the substrate glass 3, the thickness of the substrate glass 3 can be precisely adjusted, thereby improving the quality stability and consistency of the product. Since this device can precisely control the thickness of the substrate glass 3, the scrap rate caused by uneven thickness can be reduced, thus lowering production costs. The device is simple and convenient to operate, and can quickly adjust the thickness of the substrate glass 3, thereby improving production efficiency. By utilizing cooling air for heat exchange, the device can effectively reduce the temperature of the substrate glass 3, while simultaneously reducing energy consumption and environmental pollution.

[0077] In summary, the method of using the overflow method for substrate glass forming thickness cooling air device has significant beneficial effects, which can improve product quality, reduce production costs, increase production efficiency, and save energy and protect the environment.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications to the technical solutions described in the foregoing embodiments, or equivalent substitutions for some or all of the technical features, do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A thickness cooling air device for overflow method substrate glass forming, characterized by, It includes two heat exchange boxes (1) located at the bottom of the overflow brick and a cooling mechanism (2); The heat exchange chamber (1) is located on both sides of the substrate glass (3); The cooling mechanism (2) includes multiple first cooling ducts (21), second cooling ducts (22), and fixing components (23); The first cooling air duct (21) is located outside the heat exchange box (1), and the air inlet of the first cooling air duct (21) is used to communicate with the cooling air; The second cooling duct (22) is installed through the heat exchange box (1), the air outlet of the second cooling duct (22) is located close to the substrate glass (3), and the second cooling duct (22) is made of a high temperature resistant material; The first cooling duct (21) and the second cooling duct (22) are both connected by a fixing component (23).

2. The thickness cooling air device for overflow method substrate glass forming according to claim 1, characterized by, The fixing component (23) includes a fixing base (231), a mounting step (232), and a fixing member (233); The fixing seat (231) and the mounting step (232) are respectively disposed between the first cooling air duct (21) and the second cooling air duct (22); The fixing seat (231) is connected to the first cooling air duct (21), and the mounting step (232) is connected to the second cooling air duct (22); The fixing member (233) passes through one end of the fixing base (231) and is fixed on the heat exchange box (1) to realize the connection between the first cooling air duct (21) and the second cooling air duct (22).

3. The overflow method substrate glass forming thickness cooling air device according to claim 2, characterized by The installation step (232) protrudes 5-15mm from the surface of the heat exchange box (1).

4. The thickness cooling air device for overflow method substrate glass forming according to claim 2, characterized by, The mounting base (231) is provided with a mounting groove (234) for accommodating the mounting step (232).

5. The overflow method substrate glass forming thickness cooling air device according to claim 4, characterized by A sealing element (235) is provided in the mounting groove (234).

6. The overflow process substrate glass forming thickness cooling air device according to claim 1, characterized by The first cooling duct (21) is made of metal.

7. The overflow process substrate glass forming thickness cooling air device according to claim 1, characterized by, The second cooling duct (22) is made of corundum.

8. The overflow process substrate glass forming thickness cooling air device according to claim 1, characterized by, It also includes a first crossbeam (24) for fixing the first cooling duct (21).

9. The overflow process substrate glass forming thickness cooling air device according to claim 1, characterized by, The heat exchange box (1) is provided with a second crossbeam (25), and the second cooling air duct (22) is provided through the second crossbeam (25).

10. A method of using the thickness cooling air device for overflow method substrate glass forming according to any one of claims 1 to 9, characterized by, Includes the following steps: The first cooling duct (21) and the second cooling duct (22) are connected and fixed by the fixing component (23); Cooling air is blown in through the first cooling air duct (21) and blown towards the heat exchange chamber (1) through the air outlet of the second cooling air duct (22), so that the cooling air exchanges heat with the heat exchange chamber (1) and the substrate glass (3), thereby reducing the temperature of the corresponding position of the substrate glass (3), reducing the mutual influence of the transverse tension of the substrate glass (3), and realizing the adjustment of the thickness of the substrate glass (3).

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