Housing mechanism of electronic device, and electronic device
By using a shell structure of unequal thickness and a rationally arranged accommodating slot design, the problem of excessive thickness in the folded state of foldable electronic devices is solved, achieving miniaturization and weight reduction while meeting the space requirements of the device and improving its appearance and functionality.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2025-08-26
- Publication Date
- 2026-07-30
AI Technical Summary
Existing foldable electronic devices are too thick when folded, which limits their miniaturization and lightweight design, and reducing the thickness of the casing affects the space requirements of the device.
The design employs a shell structure with varying thicknesses, where the thickness of the first and third shells gradually decreases. By rationally arranging the accommodating slots and grooves, the installation space requirements of the devices are met, and the thicknesses are stacked in a folded state to achieve complementary stacking, thereby reducing the overall thickness.
It effectively reduces the overall thickness of electronic devices in the folded state, achieving miniaturization and lightweight design, while meeting the installation space requirements of various components and improving appearance quality and functional layout.
Smart Images

Figure CN2025117035_30072026_PF_FP_ABST
Abstract
Description
A housing mechanism for an electronic device and the electronic device itself.
[0001] Cross-references to related applications
[0002] This application claims priority to Chinese Patent Application No. 202510125295.3, filed on January 26, 2025, entitled "A Housing Mechanism for an Electronic Device and an Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field
[0003] This application relates to the field of electronic equipment technology, and in particular to a housing mechanism for an electronic device and the electronic device itself. Background Technology
[0004] With the gradual maturation of first display technology, the way electronic devices display information has undergone tremendous changes. Foldable first display phones, foldable first display tablets, and wearable electronic devices with foldable first displays represent a major direction for the evolution of future smart electronic devices.
[0005] To meet users' demands for large displays and portability in foldable electronic devices, tri-fold phones are increasingly being used in daily life. A common tri-fold phone includes a first shell, a second shell, a third shell, and two hinge mechanisms. The first and second shells are rotatably connected via one hinge mechanism, and the second and third shells are rotatably connected via another hinge mechanism. When the phone is folded, the third shell overlaps with the second shell, and the first shell overlaps with the folded third shell. It can be seen that the thickness of the phone in the folded state is equal to the thickness of the three shells stacked together. The excessive thickness of the phone in the folded state limits its miniaturization and lightweight design. To reduce the thickness of the phone in the folded state, one feasible method is to thin the individual shells. However, thinning the shell often affects the internal components. Therefore, how to arrange the space within the thinner shell to meet the space requirements of the components is a pressing technical problem that needs to be solved. Summary of the Invention
[0006] This application provides a housing mechanism for an electronic device and an electronic device, so as to reduce the folding thickness of the housing mechanism and make the housing mechanism meet the installation space requirements of various components of the electronic device.
[0007] In a first aspect, this application provides a housing mechanism for an electronic device. The housing mechanism includes a first housing, a second housing, and a third housing, wherein the second housing is connected between the first housing and the third housing. The thickness of the first housing gradually decreases in the direction away from the second housing, and the thickness of the third housing also gradually decreases in the direction away from the second housing. The first housing includes a first support surface and a first inner surface disposed opposite to each other. The first support surface is used to support a first display screen of the electronic device. The first inner surface is provided with a first receiving groove and a second receiving groove. The first receiving groove includes a first sub-groove and a second sub-groove. The first sub-groove and the second receiving groove are arranged along the length direction of the first housing, and the second sub-groove and the second receiving groove are arranged along the width direction of the first housing, with the second sub-groove located on the side of the second receiving groove opposite to the second housing. The first receiving groove can be used to accommodate a first circuit board of the electronic device. The first sub-groove includes a first mounting area disposed near the second housing, which is used to mount a first speaker of the electronic device. The second receiving groove can be used to accommodate a first battery of the electronic device.
[0008] In this application, when the housing mechanism is folded, the third housing is stacked on top of the second housing, and the first housing is stacked on the side of the third housing facing away from the second housing. The first, third, and second housings are stacked in layers. After the first and third housings are stacked, the thinner areas of the first housing are opposite to the thicker areas of the third housing, and vice versa. The first and third housings are stacked in a complementary thickness configuration. Compared to a straight-plate housing of equal thickness, this application can effectively reduce the overall thickness of the housing mechanism in the folded state, thereby contributing to the miniaturization and lightweight design of electronic devices. Furthermore, in the first housing, through the rational design of the first and second receiving slots, the larger area of the first receiving slot can be utilized to meet the installation space requirements of the first speaker, while also maximizing the receiving space of the second receiving slot, allowing it to accommodate a larger capacity first battery. Therefore, this design allows the first housing to fully utilize its internal space while employing a structure with unequal thickness, meeting the installation space requirements of various devices.
[0009] In some embodiments, the first housing includes a first middle frame and a first rear shell, a first support surface and a first inner surface being two opposite surfaces of the first middle frame, and the first rear shell being fixed to the first inner surface, thereby sealing the first receiving groove and the second receiving groove.
[0010] In some embodiments, the first frame includes a first border and a second border, the first border extending along the width direction of the first housing and the second border extending along the length direction of the first housing. At least a portion of the first border and at least a portion of the second border can be used to form an antenna for an electronic device. The portion of the first sub-slot near the second sub-slot can be used to accommodate an RF chip for the electronic device. This design allows the RF chip to be positioned close to both the first and second borders, thereby helping to shorten the connection length between the antenna and the RF chip.
[0011] In some implementations, the first sub-slot includes a second mounting area and a third mounting area, which are arranged sequentially on the side of the first mounting area opposite to the second housing. The second mounting area is used to mount a first camera of the electronic device, and the third mounting area is used to mount a second camera of the electronic device. Since the height of the camera is usually lower than the height of the speaker, this arrangement can meet the installation space requirements of the first speaker and the two cameras, and also make full use of the space inside the first housing. In addition, the first support surface is provided with a first through hole, which communicates with the first sub-slot. The first through hole exposes the light-receiving side of the first camera to the first support surface, thereby allowing light to enter from one side of the first support surface.
[0012] In some embodiments, the first inner surface of the first housing is used to support the second display screen of the electronic device, in which case the second display screen can be regarded as the first rear housing. The first receiving groove also includes a third sub-groove, which is located on the side of the second receiving groove opposite to the first sub-groove. The third sub-groove is used to accommodate the cable exit area of the second display screen, thereby facilitating the electrical connection between the cable exit area of the second display screen and the first circuit board.
[0013] In some embodiments, the third housing includes a third support surface and a third inner surface disposed opposite to each other. The third support surface supports the first display screen of the electronic device, and the third inner surface includes a third receiving groove and a fourth receiving groove, which are arranged along the length of the third housing. The area of the third receiving groove near the second housing is used to accommodate the second speaker of the electronic device, and the third receiving groove is also used to accommodate the second circuit board of the electronic device. The fourth receiving groove can be used to accommodate the second battery of the electronic device. Through the rational design of the third and fourth receiving grooves, the installation space requirements of the second speaker can be met by utilizing the thicker area of the third receiving groove, and the accommodating space of the fourth receiving groove can be maximized, thereby allowing the fourth receiving groove to accommodate a second battery with a larger capacity. Therefore, this design allows the third housing to make full use of its internal space and meet the installation space requirements of various devices even with a structure of unequal thickness.
[0014] In some embodiments, the third housing includes a third middle frame and a third rear shell, with the third support surface and the third inner surface being two opposing surfaces of the third middle frame, and the third rear shell being fixed to the third inner surface, thereby sealing the third receiving groove and the fourth receiving groove.
[0015] In some embodiments, the first inner surface is inclined toward the first support surface in the direction away from the second housing, with an angle α between the first inner surface and the first support surface; the third inner surface is inclined toward the third support surface in the direction away from the second housing, with an angle β between the third inner surface and the third support surface, where α = β. Using this design, the first and third housings can be stacked into a straight plate structure of equal thickness, thereby helping to improve the appearance quality of the electronic device in its folded state.
[0016] For example, α=β≤0.5°, which can reduce the thickness of the folding mechanism in the folded state to a certain extent, without excessively affecting the shape and feel of the folding mechanism in the unfolded state, and can ensure that the first and third housings have enough space to accommodate other functional modules of the electronic device.
[0017] In some embodiments, the third support surface is provided with a fifth receiving groove, which is located on the side of the third and fourth receiving grooves away from the second housing; the fifth receiving groove can be used to accommodate the cable exit area of the first display screen. The third inner surface is provided with a second through hole, which communicates with the fifth receiving groove, and the cable exit area of the first display screen can be electrically connected to the second circuit board through the second through hole.
[0018] In some embodiments, a first receiving slot is disposed near the top of the first housing, and a third receiving slot is disposed near the top of the third housing. Therefore, the first speaker can be disposed in the region near the top of the first housing, and the second speaker can be disposed in the region near the top of the third housing. The second housing includes a second support surface and a second inner surface. The second support surface supports the first display screen of the electronic device, and the second inner surface includes a sixth receiving slot disposed near the bottom of the second housing. The sixth receiving slot can be used to accommodate the third speaker of the electronic device, so the third speaker can be disposed in the region near the bottom of the second housing. With this design, the electronic device can achieve 3D sound effects when all three speakers are emitting sound simultaneously.
[0019] In some embodiments, the second housing includes a second middle frame and a second rear shell, with the second support surface and the second inner surface being two opposing surfaces of the second middle frame, and the second rear shell being fixed to the second inner surface, thereby sealing the sixth receiving groove.
[0020] In some implementations, the first receiving slot is located near the top of the first housing, and the third receiving slot is located near the bottom of the third housing. Therefore, the first speaker can be located in the region near the top of the first housing, and the second speaker can be located in the region near the bottom of the third housing. In this way, the electronic device can achieve 3D sound effects even when both speakers are emitting sound simultaneously.
[0021] Secondly, this application also provides an electronic device, which includes a housing mechanism, a first rotating shaft mechanism, a second rotating shaft mechanism, and a first display screen. The housing mechanism includes a first housing, a second housing, and a third housing. The first housing is rotatably connected to one side of the second housing via the first rotating shaft mechanism, and the thickness of the first housing gradually decreases in the direction away from the second housing. The third housing is rotatably connected to the other side of the second housing via the second rotating shaft mechanism, and the thickness of the third housing also gradually decreases in the direction away from the second housing. The first display screen continuously covers the first housing, the first rotating shaft mechanism, the second housing, the second rotating shaft mechanism, and the third housing. The first housing includes a first support surface and a first inner surface disposed opposite to each other. The first support surface is used to support the first display screen. The first inner surface is provided with a first receiving groove and a second receiving groove. The first receiving groove includes a first sub-groove and a second sub-groove. The first sub-groove and the second receiving groove are arranged along the length direction of the first housing. The first sub-groove includes a first mounting area disposed near the second housing. The second sub-groove and the second receiving groove are arranged along the width direction of the first housing, and the second sub-groove is located on the side of the second receiving groove opposite to the second housing. The electronic device also includes a first circuit board, a first speaker, and a first battery. The first circuit board and the first speaker are disposed in a first receiving slot, and the first speaker is disposed in a first mounting area, while the first battery is disposed in a second receiving slot.
[0022] In this application, when the electronic device is folded, the third housing is stacked on top of the second housing, and the first housing is stacked on the side of the third housing facing away from the second housing. The first, third, and second housings are stacked in layers. After the first and third housings are stacked, the thinner areas of the first housing face the thicker areas of the third housing, and vice versa. The first and third housings exhibit a complementary thickness stacking. Compared to a straight-plate housing of equal thickness, this application effectively reduces the overall thickness of the electronic device in the folded state, thus contributing to miniaturization and lightweight design. Furthermore, in the first housing, through the rational design of the first and second receiving slots, the larger area of the first receiving slot can be utilized to meet the installation space requirements of the first speaker, while also maximizing the receiving space of the second receiving slot, allowing it to accommodate a larger capacity first battery. Therefore, this design allows the first housing to fully utilize its internal space while employing a structure with unequal thickness, meeting the installation space requirements of various components.
[0023] In some embodiments, the electronic device further includes a processor and a first conductive element. The second housing includes a second supporting surface and a second inner surface disposed opposite to each other. The second supporting surface supports the first display screen. The second inner surface includes a seventh receiving groove disposed near the top of the second housing, and the processor is disposed within the seventh receiving groove. The first circuit board includes a first terminal block disposed near a first rotating mechanism. The first conductive element includes a first connecting portion and a second connecting portion that are bent together. The first connecting portion is disposed within the first housing, and one end of the first connecting portion away from the second connecting portion is electrically connected to the first terminal block. The other end of the second connecting portion away from the first connecting portion extends into the second housing via the first rotating mechanism, and the second connecting portion is electrically connected to the processor. Using the first conductive element, various electronic components within the first housing can be electrically connected to the processor.
[0024] In some embodiments, the first housing includes a first middle frame, the first middle frame including a first side frame and a second side frame, the first side frame extending along the width direction of the first housing, and the second side frame extending along the length direction of the first housing; at least a portion of the first side frame and at least a portion of the second side frame are used to form an antenna. The first circuit board includes a first sub-board and a second sub-board bent and connected, the first sub-board being disposed within a first sub-slot and electrically connected to the antenna formed by the first side frame, thereby transmitting electromagnetic wave signals received by the antenna to the first sub-board; the second sub-board is disposed within a second sub-slot and electrically connected to the antenna formed by the second side frame, thereby transmitting electromagnetic wave signals received by the antenna to the second sub-board.
[0025] In some implementations, the electronic device also includes a radio frequency (RF) chip disposed in the region of the first sub-slot near the second sub-slot, and electrically connected to the first sub-board. This design allows the RF chip to be positioned close to both the first and second frame edges, thereby helping to shorten the connection line length between the antenna and the RF chip and simplifying the design of the first circuit board.
[0026] In some embodiments, a first terminal is disposed on a first sub-board along the length of the first housing, at least partially opposite to the first speaker, and located on the side of the first speaker away from the first frame. A first connecting portion is disposed along the length of the first housing and extends away from the first speaker, while a second connecting portion is disposed along the width of the first housing. This design allows the first speaker and the first conductive element to be disposed relatively close to the first pivot mechanism and helps to shorten the length of the connection line between the first speaker and the first terminal.
[0027] In some implementations, the electronic device may also include a fingerprint recognition module. The fingerprint recognition module may be disposed in a second sub-slot and electrically connected to a second sub-board. This allows the fingerprint recognition module to be located close to the second bezel, facilitating user finger pressing.
[0028] In some implementations, the electronic device may further include a second display screen, a first camera, and a second camera. The second display screen is disposed on the first inner surface, the first display screen has a first opening, and the second display screen has a second opening. A first support surface has a first through hole communicating with a first sub-slot, and the first through hole and the first opening are positioned opposite each other. The first sub-slot includes a second mounting area and a third mounting area, which are arranged sequentially on the side of the first mounting area facing away from the second housing. The first camera is disposed in the first mounting area, with its light-receiving side facing the first opening; the second camera is disposed in the second mounting area, with its light-receiving side facing the second opening. This arrangement satisfies the installation space requirements of the first speaker and the two cameras, while also making full use of the space inside the first housing.
[0029] In some implementations, the first opening and the second opening are respectively centered in the width direction of the first housing. One of the first and second openings is an oblong hole, and the other is a round hole. The oblong hole corresponds to the non-centered camera placement, which neither affects the light intake of the two cameras nor compromises the appearance quality of the electronic device.
[0030] Of course, in some other implementations, both the first opening and the second opening can be oblong holes.
[0031] In some embodiments, the electronic device further includes a second conductive element. The first receiving slot includes a third sub-slot located on the side of the second receiving slot opposite to the first sub-slot, and the cable exit area of the second display screen is disposed in the third sub-slot. The first sub-board is provided with a second terminal, and the second conductive element is electrically connected to both the second terminal and the cable exit area of the second display screen, thereby enabling the cable exit area of the second display screen to be electrically connected to the processor via the second conductive element and the first conductive element, and to display data according to the processor's display signals.
[0032] In some embodiments, the electronic device further includes a second circuit board, a second speaker, and a third conductive element. The third housing includes a third support surface and a third inner surface disposed opposite to each other. The third support surface supports the first display screen, and the third inner surface includes a third receiving groove and a fourth receiving groove, which are arranged along the length of the third housing. The second circuit board and the second speaker are disposed in the third receiving groove, with the third speaker located in the region of the third receiving groove near the second rotating mechanism. The second speaker is electrically connected to the second circuit board. The third guide element includes a bent-connected third connecting portion and a fourth connecting portion. The third connecting portion is disposed within the third housing, with one end of the third connecting portion away from the fourth connecting portion electrically connected to a third terminal. The other end of the fourth connecting portion away from the third connecting portion extends into the second housing via the second rotating mechanism, and the second connecting portion is electrically connected to the processor. Through a reasonable design of the third and fourth receiving grooves, the installation space requirements of the second speaker can be met by utilizing the thicker area of the third receiving groove, while the accommodating space of the fourth receiving groove can be maximized, allowing the fourth receiving groove to accommodate a second battery with a larger capacity.
[0033] In some embodiments, the third receiving slot is located at one end of the third housing along its length. Along the length of the third housing, the third terminal is at least partially opposite to the second speaker, and the third terminal is located on the side of the second speaker away from the edge of the third housing; the third connecting portion is disposed along the length of the third housing and extends away from the second speaker; the fourth connecting portion is disposed along the width of the third housing. This design allows both the second speaker and the third conductive element to be disposed relatively close to the second pivot mechanism, and helps to shorten the length of the connection line between the second speaker and the third terminal.
[0034] In some embodiments, the third support surface may be provided with a fifth receiving groove, which is located on the side of the third and fourth receiving grooves opposite to the second housing. The cable exit area of the first display screen is located in the fifth receiving groove, so as to utilize the third housing to provide installation space for the cable exit area of the first display screen.
[0035] In some implementations, the electronic device further includes a fourth conductive element. A second through hole is provided on the third inner surface, and the second through hole communicates with a fifth receiving groove; a fourth terminal is provided on the second circuit board, and the fourth conductive element passes through the second through hole. The fourth conductive element is electrically connected to the output area of the first display screen and the fourth terminal, respectively, so that the output area of the first display screen can be electrically connected to the main circuit board and the processor through the fourth conductive element and the third conductive element, and display is performed according to the display signal of the processor.
[0036] In some embodiments, the electronic device further includes a third speaker. The second housing includes a second support surface and a second inner surface disposed opposite to each other. The second support surface supports the first display screen, and the second inner surface includes a sixth receiving groove disposed near the bottom of the second housing. The third speaker can be disposed in the sixth receiving groove. A first receiving groove is disposed near the top of the first housing, and a third receiving groove is disposed near the top of the third housing. Thus, the first speaker can be disposed near the top of the first housing, the second speaker can be disposed near the bottom of the third housing, and the third speaker can be disposed near the bottom of the second housing. When all three speakers operate simultaneously, the electronic device can achieve 3D sound effects.
[0037] In some implementations, the first receiving slot is located near the top of the first housing, and the third receiving slot is located near the bottom of the third housing. This allows the first speaker to be positioned near the top of the first housing and the second speaker to be positioned near the bottom of the third housing, enabling the electronic device to achieve 3D sound effects when both speakers are operating simultaneously.
[0038] In some implementations, the top of the second housing may be provided with a slot into which a card tray is inserted. The card tray can be used to install a SIM card so that the electronic device can perform corresponding functions based on the SIM card. Attached Figure Description
[0039] Figure 1 is a side view of an electronic device in a folded state according to an embodiment of this application;
[0040] Figure 2 is a side view of the electronic device shown in Figure 1 in its unfolded state;
[0041] Figure 3 is a partial side view of the electronic device provided in the embodiment of this application in the unfolded state;
[0042] Figure 4 is a partial side view of the electronic device provided in the embodiment of this application in the unfolded state;
[0043] Figure 5 is a side view of the second housing provided in an embodiment of this application;
[0044] Figure 6 is a partial structural plan view of a shell mechanism in the unfolded state according to an embodiment of this application;
[0045] Figure 7 is a schematic cross-sectional view of the shell mechanism shown in Figure 6 at point AA;
[0046] Figure 8a is a partial structural plan view of an electronic device in its unfolded state according to an embodiment of this application;
[0047] Figure 8b is a partial structural plan view of an electronic device in its unfolded state, provided by an embodiment of this application;
[0048] Figure 9a is a schematic diagram of a cross-sectional structure at BB in Figure 8a;
[0049] Figure 9b is a schematic diagram of another cross-sectional structure at BB in Figure 8a;
[0050] Figure 10 is a schematic diagram of a cross-sectional structure at CC in Figure 8a;
[0051] Figure 11a is a partial structural schematic diagram of the first display screen provided in an embodiment of this application;
[0052] Figure 11b is a partial structural schematic diagram of the second display screen provided in an embodiment of this application;
[0053] Figure 12 is a schematic diagram of a cross-sectional structure at DD in Figure 8a;
[0054] Figure 13 is a partial structural plan view of another shell mechanism provided in the embodiment of this application in the unfolded state;
[0055] Figure 14 is a partial structural plan view of another electronic device provided in the embodiment of this application in the unfolded state.
[0056] Figure Descriptions: 1000 - Electronic device; 100 - First housing; 100A - First middle frame; 100B - First rear housing; 100a - First support surface; 100b - First inner surface; 100c - First outer surface; 1001 - First receiving groove; 10011 - First sub-groove; 100111 - First mounting area; 100112 - Second mounting area; 100113 - Third mounting area; 10012 - Second sub-groove; 10012 - Third sub-groove; 1002 - Second receiving groove; 1003 - Ninth receiving groove; 1001 - First through hole; 101 - First battery; 1011 - First sub-part; 1012 - Second sub-part; 102 - First speaker; 103 - First circuit board; 1031 - First terminal; 1032 - First sub-board; 1033 - Second sub-board; 1034 - Second terminal; 104 - First conductive element; 1041 - First connecting part; 1042 - Second connecting part; 105 - First frame; 106 - Second frame; 107 - Radio frequency chip; 108 - Fingerprint recognition module; 109 - Second conductive element; 110 - First camera; 111 - Second camera; 200 - Second housing; 200A - Second middle frame; 200B - Second rear housing; 200a - Second support surface; 200b - Second inner surface; 200c - Second outer surface; 200c1 - First area; 200c2 - Second area; 200c3 - Third area; 2001 - Sixth receiving slot; 2002 - Seventh receiving slot; 2003 - Eighth receiving slot; 2004 - Tenth receiving slot; 2005 - Eleventh receiving slot; 201-Main circuit board; 202-Processor; 203-Rear camera; 204-User identification card; 205-Top edge of the second middle frame; 206-Third battery; 207-Wireless charging module; 208-Connector; 209-Bottom edge of the second middle frame; 210-Motor; 211-Sub-circuit board; 212-Third speaker; 300-Third housing; 300A-Third middle frame; 300B-Third rear housing; 300a-Third support surface; 300b-Third inner surface; 300c-Third outer surface; 3001-Third receiving slot; 3002-Fourth receiving slot; 3003-Fifth receiving slot; 3004-Twelfth receiving slot; 3005-Second through hole; 301-Second battery; 3011-Third sub-part; 3012 - Fourth sub-component; 302 - Second speaker; 303 - Second circuit board; 3031 - Third terminal; 3032 - Fourth terminal; 304 - Third conductive element; 3041 - Third connecting part; 3042 - Fourth connecting part; 305 - Top frame of the third middle frame; 306 - Fourth conductive element; 307 - Bottom frame of the third middle frame; 400 - First rotating shaft mechanism; 500 - Second rotating shaft mechanism; 600 - First display screen; 610 - First opening; 620 - Cable exit area of the first display screen; 700 - Second display screen;710 - Cable exit area of the second display screen; 720 - Second opening; Detailed Implementation
[0057] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are only for illustrating relative positional relationships and do not represent actual scale.
[0058] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, the embodiments of this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the embodiments of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0059] Figure 1 is a side view of an electronic device 1000 in a folded state according to an embodiment of this application, and Figure 2 is a side view of the electronic device 1000 shown in Figure 1 in an unfolded state. Referring to Figures 1 and 2, the electronic device 1000 can be a mobile phone, a personal digital assistant (PDA), a tablet computer, or other devices with foldable functionality. The electronic device 1000 of the embodiment shown in Figure 1 is illustrated using a foldable mobile phone as an example.
[0060] In this embodiment, the electronic device 1000 is a three-fold folding device, comprising a housing mechanism, two pivot mechanisms, and a flexible screen. The housing mechanism comprises three housings, which are hereinafter referred to as the first housing 100, the second housing 200, and the third housing 300 for easy distinction. The two pivot mechanisms are hereinafter referred to as the first pivot mechanism 400 and the second pivot mechanism 500, and the flexible screen is referred to as the first display screen 600. The second housing 200 is connected between the first housing 100 and the third housing 300. The first housing 100 is rotatably connected to one side of the second housing 200 via the first pivot mechanism 400, and the third housing 300 is rotatably connected to the other side of the second housing 200 via the second pivot mechanism 500. When in use, the electronic device 1000 allows the first housing 100 and the second housing 200 to rotate relative to or away from each other under the action of the first rotating mechanism 400, and the second housing 200 and the third housing 300 to rotate relative to or away from each other under the action of the second rotating mechanism 500. This enables the electronic device 1000 to be folded and unfolded according to different usage scenarios. It is easy to understand that when the electronic device 1000 is in the unfolded state, the first housing 100, the first rotating mechanism 400, the second housing 200, the second rotating mechanism 500, and the third housing 300 are arranged side by side in sequence.
[0061] The first housing 100, the second housing 200, and the third housing 300 each have a support surface facing the first display screen 600. The support surface of the first housing 100 is defined as the first support surface 100a, the support surface of the second housing 200 is defined as the second support surface 200a, and the support surface of the third housing 300 is defined as the third support surface 300a. The first display screen 600 can continuously cover the first support surface 100a, the support surface of the first rotating shaft mechanism 400, the second support surface 200a, the support surface of the second rotating shaft mechanism 500, and the third support surface 300a. The first display screen 600 includes a first planar area 600a, a first bendable area 600b, a second planar area 600c, a second bendable area 600d, and a third planar area 600e connected in sequence. The first planar area 600a is connected to a first support surface 100a, the second planar area 600c is connected to a second support surface 200a, and the third planar area 600e is connected to a third support surface 300a. The first bendable area 600b and the second bendable area 600d are respectively disposed opposite to a first rotating shaft mechanism 400 and a second rotating shaft mechanism 500. For example, the connection method between each planar area of the first display screen 600 and its corresponding support surface may be, but is not limited to, adhesive bonding.
[0062] When the electronic device 1000 is in the unfolded state, the first support surface 100a, the support surface of the first rotating mechanism 400, the second support surface 200a, the support surface of the second rotating mechanism 500, and the third support surface 300a can be connected to form a flat support surface, thereby supporting the first display screen 600. When the electronic device 1000 is in the folded state, the third housing 300 is stacked on the second housing 200, and the third support surface 300a is facing the second support surface 200a. The first housing 100 is stacked on the side of the third housing 300 that is away from the second housing 200, and the first support surface 100a is facing the third housing 300. That is to say, the first housing 100, the third housing 300, and the second housing 200 are stacked, and the first display screen 600 is hidden inside the folded part of the electronic device. This folding method can be regarded as a "G"-shaped fold.
[0063] The process of the electronic device 1000 changing from the folded state shown in Figure 1 to the unfolded state shown in Figure 2, or from the unfolded state shown in Figure 2 to the folded state shown in Figure 1, is the process of the first housing 100 and the second housing 200 rotating in opposite directions or relative to each other around the first rotating shaft mechanism 400, and the process of the second housing 200 and the third housing 300 rotating in opposite directions or relative to each other around the second rotating shaft mechanism 500.
[0064] The electronic device 1000 can be deployed and closed by manual drive, electric drive, or a combination of manual and electric drive. Manual drive means the electronic device 1000 deploys and closes entirely by force applied by the user; electric drive means the electronic device 1000 deploys and closes entirely by the driving force output by the motor; and a combination of manual and electric drive means the electronic device 1000 deploys and closes under the combined force of the force applied by the user and the driving force output by the motor.
[0065] In some embodiments, the first housing 100 may include a first middle frame 100A and a first rear housing 100B. The first middle frame 100A can provide support for related electronic devices and structural components within the first housing 100, thereby ensuring the mechanical strength and appearance quality of the first housing 100. The first middle frame 100A includes a first inner surface 100b, and the first rear housing 100B covers the first inner surface 100b. The side surface of the first middle frame 100A facing away from the first rear housing can serve as a first support surface 100a of the first housing 100, for supporting the first display screen 600. The side surface of the first rear housing 100B facing away from the first middle frame 100A can serve as a first outer surface 100c of the first housing 100. It is easy to understand that the first outer surface 100c and the first support surface 100a are located on opposite sides of the first housing 100. In both the folded and unfolded states of the electronic device 1000, the first outer surface 100c is exposed on the outside of the electronic device 1000.
[0066] Similarly, the second housing 200 may include a second middle frame 200A and a second rear housing 200B. The second middle frame 200A includes a second inner surface 200b, and the second rear housing 200B covers the second inner surface 200b. The side surface of the second middle frame 200A facing away from the second rear housing 200B may serve as the second support surface 200a of the second housing 200, and the side surface of the second rear housing 200B facing away from the second middle frame 200A may serve as the second outer surface 200c of the second housing 200. The third housing 300 may include a third middle frame 300A and a third rear housing 300B. The third middle frame 300A includes a third inner surface 300b, and the third rear housing 300B covers the third inner surface 300b. The surface of the third middle frame 300A facing away from the third rear shell 300B can be the third support surface 300a of the third shell 300, and the surface of the third rear shell 300B facing away from the third middle frame 300A can be the third exterior surface 300c of the third shell 300.
[0067] In this application embodiment, the form of the first rotating shaft mechanism 400 is not limited. For example, the first rotating shaft mechanism 400 may include a base and a rotating component. The rotating component can be used to rotatably connect the first housing 100 and the second housing 200 to the base. The connection method between the rotating component and the base, the first housing 100 and the second housing 200 can be various. For example, the rotating component can be rotatably connected to the base, or the rotating component can be fixedly connected, rotatably connected or slidably connected to the first housing 100 and the second housing 200, etc. This application does not impose specific limitations on this. As long as the first housing 100 and the second housing 200 can rotate relative to the base to realize the folding and unfolding function of the electronic device 1000, they are all within the scope covered by the embodiments of this application.
[0068] Similarly, this application does not limit the form of the second rotating mechanism 500. As long as the second housing 200 and the third housing 300 can rotate relative to the base to realize the folding and unfolding function of the electronic device 1000, they are all within the scope of the embodiments of this application.
[0069] Furthermore, the first rotating shaft mechanism 400 and the second rotating shaft mechanism 500 may adopt the same structural form or different structural forms, and this application does not impose any restrictions on this. For example, the first rotating shaft mechanism 400 may adopt a U-shaped shaft, and the second rotating shaft mechanism 500 may adopt a V-shaped shaft.
[0070] It should be noted that, in addition to restricting the movement trajectories of the first housing 100, the second housing 200, and the third housing 300, the first rotating shaft mechanism 400 and the second rotating shaft mechanism 500 can also support the first display screen 600, so that the first bendable area 600b and the second bendable area 600d of the first display screen 600 are subjected to uniform force in the unfolded state, folded state, and intermediate state of the electronic device, and can keep the length of the first display screen 600 unchanged throughout the entire unfolding or folding process of the electronic device 1000, thereby improving the reliability of the first display screen 600.
[0071] As mentioned earlier, in the folded state, the first housing 100, the third housing 300, and the second housing 200 are stacked sequentially, and the thickness of the electronic device 1000 is approximately equal to the thickness of the stacked first housing 100, second housing 200, and third housing 300. Specifically, the thickness of the first housing 100 must be at least greater than the thickness of the first pivot mechanism 400 to ensure that the first pivot mechanism 400 can be at least partially housed within the first housing 100 in the unfolded state; the thickness of the second housing 200 must be at least greater than the thickness of the first pivot mechanism 400 and the second pivot mechanism 500 to ensure that, in the unfolded state, the first pivot mechanism 400 and the second pivot mechanism 500 can each be at least partially housed within the second housing 200; and the thickness of the third housing 300 must be at least greater than the thickness of the second pivot mechanism 500 to ensure that, in the unfolded state, the second pivot mechanism 500 can be at least partially housed within the third housing 300.
[0072] In other words, the thickness of the first housing 100 is limited by the thickness of the first pivot mechanism 400, the thickness of the second housing 200 is limited by the thickness of the first pivot mechanism 400 and the second pivot mechanism 500, and the thickness of the third housing 300 is limited by the thickness of the second pivot mechanism 500. In related technologies, the first housing 100, the second housing 200, and the third housing 300 are all straight-plate structures with uniform thickness, resulting in a relatively large thickness of the electronic device 1000 in the folded state. This is not conducive to the miniaturization and lightweight design of the electronic device 1000 and affects the user experience.
[0073] Based on this, the embodiments of this application design the housing of the electronic device 1000 with a structure of unequal thickness, and adaptively arrange the internal components according to the thickness of the housing, so as to reduce the thickness of the electronic device 1000 in the folded state without affecting the functionality of the electronic device 1000, thereby achieving the miniaturization and lightweight design of the electronic device 1000. The structural design of each housing will be described next.
[0074] Figures 3 and 4 are partial side views of the electronic device provided in the embodiment of this application in the unfolded state. Figure 3 shows a partial structure of the first housing 100 and the first rotating shaft mechanism 400, and Figure 4 shows a partial structure of the third housing 300 and the second rotating shaft mechanism 500.
[0075] Referring to Figures 3 and 4, in this embodiment, the thickness of the first housing 100 gradually decreases along the direction away from the first pivot mechanism 400 (this direction can also be understood as the direction in which the first housing 100 moves away from the second housing when the electronic device is in the unfolded state), and the first housing 100 is approximately wedge-shaped. The first outer surface 100c is inclined relative to the first support surface 100a. Specifically, along the direction away from the first pivot mechanism 400, the distance between the first outer surface 100c and the first support surface 100a gradually decreases, and the thickness of the first housing 100 also gradually decreases.
[0076] In some embodiments, the electronic device further includes a second display screen 700, which may be a rigid screen. The second display screen 700 is disposed on the side of the first housing 100 facing away from the first display screen 600, thus the second display screen 700 can be considered as the first rear housing of the first housing 1000. The light-emitting surface of the second display screen 700 is formed as at least a portion of the first outer surface 100c. For example, if the second display screen 700 is a full-screen device, the light-emitting surface of the second display screen 700 is the first outer surface 100c; if the second display screen 700 is not a full-screen device, the light-emitting surface of the second display screen 700 is formed as a portion of the first outer surface 100c, and the remaining portion of the first outer surface 100c is formed by structural components of the first housing 100. By providing the second display screen 700, the electronic device can still perform display functions using the second display screen 700 in a folded state, thereby effectively improving the practicality of the electronic device and the user experience.
[0077] In this embodiment, along the direction away from the second pivot mechanism 500 (this direction can also be understood as the direction in which the third housing 300 is away from the second housing when the electronic device is in the unfolded state), the thickness of the third housing 300 gradually decreases, and the third housing 300 is approximately wedge-shaped. The third outer surface 300c is inclined relative to the third support surface 300a. Specifically, along the direction away from the second pivot mechanism 500, the distance between the third outer surface 300c and the first support surface 100a gradually decreases, and the thickness of the third housing 300 also gradually decreases.
[0078] As shown in Figure 1, in the folded state, the first housing 100 is stacked on the third housing 300, and the side of the first housing 100 away from the first pivot mechanism 400 is stacked on the side of the third housing 300 close to the second pivot mechanism 500, and the side of the first housing 100 close to the first pivot mechanism 400 is stacked on the side of the third housing 300 away from the second pivot mechanism 500. As mentioned above, the thickness of the first housing 100 gradually decreases along the direction away from the first pivot mechanism 400, and the thickness of the third housing 300 gradually decreases along the direction away from the second pivot mechanism 500. Therefore, after the first housing 100 and the third housing 300 are stacked, the thinner areas of the first housing 100 are opposite to the thicker areas of the third housing 300, and the thicker areas of the first housing 100 are opposite to the thinner areas of the third housing 300. The first housing 100 and the third housing 300 present a stacked state with complementary thicknesses. Compared with straight-plate housings of equal thickness, this design can effectively reduce the overall thickness of the first housing 100 and the third housing 300 after stacking without affecting the installation of the first pivot mechanism 400 and the second pivot mechanism 500. That is, it reduces the overall thickness of the electronic device 1000 in the folded state, realizing the miniaturization and lightweight design of the electronic device 1000.
[0079] As previously described, the first inner surface 100b of the first middle frame 100A is used to fix the second display screen 700. After the first middle frame 100A and the second display screen 700 are assembled, the first inner surface 100b is approximately parallel to the second display screen 700. Similarly, the third inner surface 300b of the third middle frame 300A is used to fix the third rear shell 300B. After the third middle frame 300A and the third rear shell 300B are assembled, the third inner surface 300b is approximately parallel to the third rear shell 300B. In this embodiment, when designing the first middle frame 100A and the third middle frame 300A, the included angle between the first inner surface 100b and the first support surface 100a is α, and the included angle between the third inner surface 300b and the third support surface 300a is β. Therefore, the included angle between the first outer surface 100c and the first support surface 100a is also approximately α, and the included angle between the third outer surface 300c and the third support surface 300a is approximately β.
[0080] In the specific implementation, α and β are equal. Since the first support surface 100a and the third support surface 300a are approximately coplanar, the above-mentioned angle constraint can make the tilt of the first appearance surface 100c the same as the tilt of the third appearance surface 300c. In this way, the thickness of the first housing 100 and the third housing 300 after being stacked will be more uniform. In other words, the first housing 100 and the third housing 300 can be stacked into a straight plate structure of equal thickness, which helps to improve the appearance quality of electronic devices in the folded state.
[0081] For example, α=β≤0.5°. By limiting the inclination of the first outer surface 100c and the third outer surface 300c to this angle range, the thickness of the electronic device in the folded state can be reduced to a certain extent without excessively affecting the shape and feel of the electronic device in the unfolded state. It can also ensure that the first housing 100 and the third housing 300 have sufficient space to accommodate other functional modules of the electronic device.
[0082] Figure 5 is a side view of the second housing 200 provided in an embodiment of this application. Referring to Figure 5, in this embodiment of the application, the second outer surface 200c includes a first region 200c1, a second region 200c2, and a third region 200c3, wherein the first region 200c1 is connected to the side of the second region 200c2 near the first rotating shaft mechanism 400, and the third region 200c3 is connected to the side of the second region 200c2 near the second rotating shaft mechanism 500.
[0083] The second region 200c2 is arranged approximately parallel to the second support surface 200a, so the portion of the second shell 200 corresponding to the second region 200c2 has a relatively uniform thickness. The first region 200c1 is inclined relative to the second support surface 200a, and along the direction away from the second region 200c2 (i.e., the direction from the second region 200c2 to the first region 200c1), the distance between the first region 200c1 and the second support surface 200a gradually decreases, and the thickness of the portion of the second shell 200 corresponding to the first region 200c1 gradually decreases. The third region 200c3 is inclined relative to the second support surface 200a, and along the direction away from the second region 200c2 (i.e., the direction from the second region 200c2 to the third region 200c3), the distance between the third region 200c3 and the second support surface 200a gradually decreases, and the thickness of the second shell 200 at the third region 200c3 gradually decreases. It can be seen that the second shell 200 has a structure that is thick in the middle and gradually thins on both sides. The part of the second shell 200 corresponding to the second region 200c2 is approximately a cuboid structure, while the parts of the second shell 200 corresponding to the first region 200c1 and the parts of the second shell 200 corresponding to the third region 200c3 are approximately wedge-shaped structures.
[0084] In both the folded and unfolded states of the electronic device, the second outer surface 200c of the second housing 200 is exposed on the outside of the electronic device. Therefore, the shape of the second outer surface 200c has a significant impact on the appearance quality of the electronic device. By setting the second outer surface 200c in the above-described form, not only can the aesthetics of the electronic device be improved, but it can also provide a better feel for the user when holding the electronic device, thereby enhancing the user experience.
[0085] After gaining a basic understanding of the shapes of the first housing, the second housing, and the third housing, the internal layout of the first housing, the second housing 200, and the third housing will be described below, so as to reasonably design the position of the internal components according to the thickness conditions of each housing.
[0086] Figure 6 is a partial structural plan view of a housing mechanism in its unfolded state according to an embodiment of this application. Figure 7 is a cross-sectional structural diagram of the housing mechanism shown in Figure 6 at point AA. Figure 6 shows the internal structure of each housing on the side facing away from the first display screen. Referring to Figures 6 and 7 together, in this embodiment of the application, the first inner surface 100b of the first middle frame 100A is provided with a first receiving groove 1001 and a second receiving groove 1002, which are sealed by a second display screen fixed to the first inner surface 100b. The third inner surface 300b of the third middle frame 300A is provided with a third receiving groove 3001 and a fourth receiving groove 3002, which are sealed by a third rear shell fixed to the third inner surface 300b. The third support surface 300a is provided with a fifth receiving groove 3003, which is sealed by a first display screen fixed to the third support surface 300a. The second inner surface 200b of the second frame 200A is provided with a sixth receiving groove 2001, a seventh receiving groove 2002, and an eighth receiving groove 2003. The sixth receiving groove 2001, the seventh receiving groove 2002, and the eighth receiving groove 2003 are sealed by a second rear shell fixed to the second inner surface 200b. The receiving grooves of each shell are used to accommodate the components of the electronic device.
[0087] In the first housing 100, the first receiving groove 1001 may include a first sub-groove 10011 and a second sub-groove 10012. The first sub-groove 10011 and the second sub-groove 10012 are arranged along the length direction of the first housing 100, and the second sub-groove 10012 and the second receiving groove 1002 are arranged along the width direction of the first housing 100, with the second sub-groove 10012 located on the side of the second receiving groove 1002 opposite to the second housing 100. Additionally, the first receiving groove 1001 may also include a third sub-groove 10013, located on the side of the second receiving groove 1002 opposite to the first sub-groove 10011. The first sub-groove 10011, the second receiving groove 1002, and the third sub-groove 10013 are arranged sequentially along the length direction of the first housing 100. For example, the first sub-groove 10011 is disposed near the top of the first housing 100, and the third sub-groove 10013 is disposed near the bottom of the first housing 100.
[0088] In the second housing 200, the sixth receiving groove 2001 is disposed near the bottom of the second housing 200, the seventh receiving groove 2002 is disposed near the top of the second housing 200, and the eighth receiving groove 2003 is disposed between the sixth receiving groove 2001 and the seventh receiving groove 2002.
[0089] In the third housing 300, the third receiving groove 3001 and the fourth receiving groove 3002 are arranged along the length direction of the third housing 300. For example, the third receiving groove 3001 is disposed near the top of the third housing 300, and the fourth receiving groove 3002 is disposed near the bottom of the third housing 300. The fifth receiving groove 3003 is disposed on the side of the third receiving groove 3001 and the fourth receiving groove 3002 opposite to the second housing 200.
[0090] The length directions of the first housing 100, the second housing 200, and the third housing 300 are all in the same direction, which is the length direction of the electronic device, and also the axial direction of the first and second rotating shaft mechanisms of the electronic device. The width direction of the first housing 100 is the direction in which the first housing 100 approaches or moves away from the first rotating shaft mechanism, and the width direction of the third housing 300 is the direction in which the third housing 300 approaches or moves away from the second rotating shaft mechanism.
[0091] Furthermore, the first support surface 100a of the first housing 100 may also be provided with a ninth receiving groove 1003, which is located on the side edge of the first housing 100 near the second housing 200. The second support surface 200a of the second housing 200 may be provided with a tenth receiving groove 2004 and an eleventh receiving groove 2005, where the tenth receiving groove 2004 is located on the side edge of the second housing 200 near the first housing 100, and the eleventh receiving groove 2005 is located on the side edge of the second housing 200 near the third housing 300. The third support surface 300a of the third housing 300 may be provided with a twelfth receiving groove 3004, which is located on the side edge of the third housing 300 near the second housing 200. The ninth receiving groove 1003 and the tenth receiving groove 2004 are connected as a single unit, and the eleventh receiving groove 2005 and the twelfth receiving groove 3004 are also connected as a single unit.
[0092] Figures 8a and 8b are partial structural plan views of an electronic device 1000 in its unfolded state according to an embodiment of this application. Figure 8a shows the internal layout of each housing of the electronic device 1000 on the first display screen side, and Figure 8b shows the internal layout of each housing of the electronic device 1000 on the second display screen side. Referring also to Figures 6 to 8b, in this embodiment of the application, the first rotating shaft mechanism 400 is disposed in the ninth receiving groove 1003 and the tenth receiving groove 2004, so as to be rotatably connected to the first housing 100 and the second housing 200, respectively. The second rotating shaft mechanism 500 is disposed in the eleventh receiving groove 2005 and the twelfth receiving groove 3004, so as to be rotatably connected to the second housing 200 and the third housing 300, respectively.
[0093] The electronic device 1000 includes a main circuit board 201 and a processor 202, which are disposed within a second housing 200, and the processor 202 is electrically connected to the main circuit board 201. Exemplarily, both the main circuit board 201 and the processor 202 are disposed within a seventh receiving slot 2002, and the processor 202 may be disposed on the main circuit board 201.
[0094] The processor 202 is used to control the overall operation of the electronic device 1000. It may include one or more processing units, such as an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a video processing unit (VPU) controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural network processing unit (NPU). Different processing units may be independent devices or integrated into one or more processors.
[0095] The processor 202 may include a memory for storing instructions and data. In some embodiments, the memory in the processor 202 may include a cache memory. This memory can store instructions or data that the processor 202 has just used or that are used repeatedly. If the processor 202 needs to use the instruction or data again, it can directly retrieve it from the memory to avoid repeated access, reduce the waiting time of the processor 202, and thus improve the efficiency of the system.
[0096] Referring to Figures 6 to 8b, the electronic device 1000 also includes a rear camera 203, which is disposed within the second housing 200. In this embodiment, the rear camera 203 can be understood as a camera that receives light from the non-screen side of the electronic device 1000. Therefore, the light-receiving side of the rear camera 203 in the second housing 200 faces the second exterior surface. The second exterior surface is provided with a light-receiving hole, and the light-receiving side of the rear camera 203 is positioned opposite to the light-receiving hole to allow light to enter through it. A transparent cover plate may be disposed inside the light-receiving hole. The transparent cover plate can reduce the obstruction of the light-receiving hole, thereby separating the interior of the second housing 200 from the exterior and reducing the risk of water or dust from the outside entering the interior of the electronic device 1000 through the light-receiving hole.
[0097] In a specific implementation, the rear camera 203 can be disposed within the seventh receiving slot 2002. The rear camera 203 is electrically connected to the host circuit board 201 and can be electrically connected to the processor 202 through the host circuit board 201. In one implementation, the rear camera 203 can be stacked on the host circuit board 201; in another implementation, the host circuit board 201 is provided with a clearance hole or clearance slot, and the rear camera 203 can be disposed within the clearance hole or clearance slot. In this way, the rear camera 203 and the host circuit board 201 can share part of the space in the thickness direction, thereby helping to reduce the thickness of the second housing 200.
[0098] There can be one or more rear cameras 203. For example, the electronic device 1000 shown in Figure 8a has three rear cameras 203. When there are multiple rear cameras 203, each rear camera 203 can be a main camera, a wide-angle camera, a telephoto camera, a depth-sensing camera, a macro camera, etc. In addition, the multiple rear cameras 203 can be arranged according to the appearance design requirements of the electronic device 1000, and this application does not impose any restrictions on this.
[0099] In some embodiments, a slot is provided on the top of the second housing 200, and a card tray can be inserted into the slot for installing a subscriber identity module (SIM) 204. In a specific implementation, the slot can be located on the top edge 205 of the second mid-frame. The slot can be located on the side of the second housing 200 near the first pivot mechanism 400, or it can be located on the side of the second housing 200 near the second pivot mechanism 500. This application does not limit this.
[0100] Referring again to Figures 6 to 8b, in this embodiment, the electronic device 1000 further includes a battery. The battery provides power to the various electrical components of the electronic device 1000 to ensure its normal operation. In a specific implementation, the three housings of the electronic device 1000 can each provide space for installing batteries to improve the battery life and provide a better user experience. For example, a first battery 101 is disposed in the first housing 100, a second battery 301 is disposed in the third housing 300, and a third battery 206 can be disposed in the second housing 200. Each battery is electrically connected to the host circuit board 201. The host circuit board 201 can be equipped with a battery management system (BMS). The BMS can monitor the battery's usage status and manage the charging and discharging process, which helps to extend the battery's lifespan.
[0101] In the second housing 200, the third battery 206 can be disposed within the eighth receiving slot 2003. A wireless charging module 207 can also be disposed within the eighth receiving slot 2003, overlapping with the third battery 206. For example, the wireless charging module 207 can be disposed on the side of the third battery 206 facing away from the first display screen, thus bringing the wireless charging module 207 closer to the outer surface of the second housing 200, enabling it to interact with charging devices attached to the outer surface of the second housing 200. The wireless charging module 207 is electrically connected to the main circuit board 201, which is provided with an AC / DC conversion circuit. The wireless charging module 207 can convert the electromagnetic waves received from the self-charging device into an AC voltage signal, which is then converted into a DC voltage signal by the AC / DC conversion circuit and transmitted to the battery for storage.
[0102] A connector 208 is also provided inside the second housing 200. The connector 208 is disposed within the sixth receiving slot 2001 and is electrically connected to the host circuit board 201. In one implementation, the connector 208 is disposed near the bottom of the second housing 200, and a socket is provided on the bottom edge 209 of the second middle frame, with the port of the connector 208 exposed in the socket. The port of the connector 208 can be used to connect a power cord, so the electronic device 1000 can also achieve wired charging through the connector 208. That is to say, the electronic device 1000 provided in this application embodiment can be charged both wirelessly and wiredly, with the two charging methods being redundant, allowing the electronic device 1000 to select the appropriate charging method in different charging scenarios.
[0103] In addition, the port of connector 208 can also be used to connect data cables, so electronic device 1000 can also realize data transmission function based on connector 208.
[0104] Referring to Figures 6 through 8b, a motor 210 may also be installed in the sixth receiving slot 2001. The motor 210 may be electrically connected to the host circuit board 201 and, through the host circuit board 201, to the processor 202. In one implementation, the motor 210 may be located in the sixth receiving slot 2001 on the side near the first rotating shaft mechanism 400. The processor 202 can send a vibration signal to the motor by detecting the pre-stored instructions or usage status of the electronic device 1000, thereby controlling the motor to vibrate and enabling the electronic device 1000 to perform a vibration function. For example, the processor 202 can control the motor 210 to vibrate according to pre-stored alarm or memo instructions; or, the processor 202 can control the motor 210 to vibrate when the electronic device 1000 receives an incoming call or message; or, the processor 202 can also control the motor 210 to vibrate when it detects that the electronic device 1000 has received a user operation (e.g., when it detects that a control on the first display screen 600 or the second display screen 700 has been triggered), thereby providing vibration feedback to the user.
[0105] In some embodiments, a sub-circuit board 211 may be disposed within the sixth receiving groove 2001, and the sub-circuit board 211 is electrically connected to the main circuit board 201. The connector 208 and the motor are respectively electrically connected to the sub-circuit board 211 to establish an electrical connection with the main circuit board 201, thereby simplifying the wiring layout within the second housing 200. Furthermore, without increasing the thickness of the second housing 200, the connector 208 and the motor may be disposed within the clearance groove of the sub-circuit board 211, or they may be stacked on top of the sub-circuit board 211; this application does not limit this.
[0106] In this embodiment, the electronic device 1000 includes a speaker to enable sound playback. The speaker can be a single unit, which can be located in any of the three housings. Alternatively, there can be at least two speakers, which can be located in different housings to improve the sound quality of the electronic device.
[0107] For example, in one implementation, the electronic device 1000 includes a first speaker 102, which may be disposed within a first housing 100. In another implementation, the electronic device 1000 includes a first speaker 102 and a second speaker 302, where the first speaker 102 may be disposed within the first housing 100 and the second speaker 302 may be disposed within a third housing 300. In yet another implementation, the electronic device 1000 includes a first speaker 102, a second speaker 302, and a third speaker 212, where the first speaker 102 may be disposed within the first housing 100, the second speaker 302 may be disposed within the third housing 300, and the third speaker 212 may be disposed within the second housing 200. For example, Figure 8a illustrates a scenario where the electronic device 1000 includes three speakers.
[0108] In the case where the electronic device 1000 includes three speakers, the first speaker 102 can be positioned near the top of the first housing 100, the third speaker 212 can be positioned near the top of the third housing 300, and the third speaker 212 can be positioned near the bottom of the second housing 200. In this way, when the three speakers emit sound at the same time, the electronic device can achieve 3D sound effects.
[0109] Within the second housing 200, a third speaker 212 may be disposed within a sixth receiving slot 2001. Exemplarily, the third speaker 212 is located on the side of the sixth receiving slot 2001 near the second rotating shaft mechanism 500. The third speaker 212 is electrically connected to a sub-circuit board 211, which in turn connects to the main circuit board 201, and further to the processor 202 via the main circuit board 201. Additionally, a speaker aperture is provided on the bottom edge 209 of the second mid-frame, connecting the interior and exterior of the second housing 200. Sound emitted by the third speaker 212 can be transmitted to the exterior of the electronic device 1000 through this speaker aperture.
[0110] Referring again to Figures 6 to 8b, within the first housing 100, the first sub-slot 10011 includes a first mounting area 100111 located near the second housing. The first speaker 102 can be disposed within this first mounting area 100111, utilizing the relatively large thickness of this side of the first housing 100 to meet the mounting space requirements of the first speaker 102. Additionally, the electronic device 1000 also includes a first circuit board 103, disposed within the first receiving slot 1001. The first circuit board 103 is electrically connected to electronic components such as the first speaker 102 and the first battery 101. The first circuit board 103 includes a first terminal 1031, which can be electrically connected to the main circuit board 201 via a first conductive element 104. This allows the various electronic components within the first housing 100 to be electrically connected to the processor 202 via the main circuit board 201.
[0111] In a specific implementation, the first conductive element 104 can be a flexible circuit board, thus possessing excellent deformability. Therefore, its shape and position are flexible, facilitating interconnection between the interior of the first housing 100 and the interior of the second housing 200. The first conductive element 104 includes a first connecting portion 1041 and a second connecting portion 1042. The second connecting portion 1042 is connected to the first connecting portion 1041 and is bent relative to the first connecting portion 1041. The first connecting portion 1041 is disposed within the first housing 100, with both ends electrically connected to the first terminal 1031 and the second connecting portion 1042, respectively. The second connecting portion 1042 can extend into the second housing 200 via the first rotating shaft mechanism 400. That is, the second connecting portion 1042 passes through the first rotating shaft mechanism 400, with the end of the second connecting portion 1042 away from the first connecting portion 1041 located within the second housing 200 and electrically connected to the main circuit board 201.
[0112] In this embodiment, the first terminal 1031 can be positioned close to the first rotating shaft mechanism 400. This helps to reduce the length of the first conductive element 104, thereby reducing the space occupied by the first conductive element 104. Furthermore, it confines the portion of the first conductive element 104 within the first housing 100 to the side of the first housing 100 closest to the first rotating shaft mechanism 400, improving the feasibility of stacking the first conductive element 104 with other devices in the thickness direction of the first housing 100, thus fully utilizing the space within the first housing 100. For example, in one implementation, the portion of the first conductive element 104 inside the first housing 100 is stacked with the first battery 101.
[0113] In some embodiments, the first circuit board 103 includes a first sub-board 1032 and a second sub-board 1033 connected to the first sub-board 1032, the second sub-board 1033 being bent relative to the first sub-board 1032. The first sub-board 1032 is disposed within a first sub-groove 10011 and extends along the width direction of the first housing 100. The second sub-board 1033 is disposed within a second sub-groove 10012 and extends along the length direction of the first housing 100.
[0114] In one implementation, the first speaker 102 is electrically connected to the first sub-board 1032. The first speaker 102 can be stacked on the first sub-board 1032 or disposed within a clearance groove of the first sub-board 1032; this application does not impose any limitations on this. The first frame 105 is provided with a sound-emitting hole, which connects the interior and exterior of the first housing 100, allowing the sound emitted by the first speaker 102 to be transmitted to the exterior of the electronic device 1000 through the sound-emitting hole.
[0115] The first terminal 1031 is disposed on the first sub-board 1032 along the length of the first housing 100. The first terminal 1031 and the first speaker 102 can be disposed at least partially opposite each other, so that the first speaker 102 and the first conductive member 104 can be disposed relatively close to the first rotating shaft mechanism 400, and this helps to shorten the length of the connection line between the first speaker 102 and the first terminal 1031. In a specific implementation, the first terminal 1031 can be located on the side of the first speaker 102 away from the first frame 105. The first connecting portion 1041 of the first conductive member 104 is disposed along the length of the first housing 100 and extends in a direction away from the first speaker 102. The second connecting portion 1042 is disposed along the width of the first housing 100. The first conductive member 104 is approximately “┗” shaped (view in Figure 8a).
[0116] In some embodiments, the first middle frame 100A includes a first side frame 105 and a second side frame 106. The first side frame 105 extends along the width direction of the first housing 100, and the second side frame 106 extends along the length direction of the first housing 100. The first side frame 105 is located on the side of the first sub-groove 10011 away from the second receiving groove 1002. The first side frame 105 may be the top side frame of the first middle frame 100A, and the second side frame 106 is located on the side of the first housing 100 away from the first rotating shaft mechanism 400.
[0117] At least a portion of the first frame 105 can be used to form an antenna to enable the electronic device 1000 to perform communication functions. The antenna formed by the first frame 105 is electrically connected to the first sub-board 1032 to transmit the received electromagnetic wave signal to the first sub-board 1032. Similarly, at least a portion of the second frame 106 can also be used to form an antenna, and the antenna formed by the second frame 106 is electrically connected to the second sub-board 1033 to transmit the received electromagnetic wave signal to the second sub-board 1033.
[0118] The electronic device 1000 includes a radio frequency chip 107 electrically connected to a first circuit board 103. The radio frequency chip 107 can be used to select, amplify, and convert the electromagnetic wave signal received by the antenna into a baseband signal and then transmit it to the host circuit board 201 through the first conductive element 104. Alternatively, the radio frequency chip 107 can be used to convert the baseband signal received from the host circuit board 201 into an electromagnetic wave through the antenna after up-conversion and amplification.
[0119] In one implementation, the radio frequency (RF) chip 107 can be disposed in the area of the first sub-slot 10011 near the second sub-slot 10012, and the RF chip 107 is electrically connected to the first sub-board 1032. This design allows the distance between the RF chip 107 and the first frame 105, as well as the distance between the RF chip 107 and the second frame 106, to be relatively close, thereby helping to shorten the connection line length between the antenna and the RF chip 107 and simplifying the design of the first circuit board 103.
[0120] In this embodiment, the electronic device 1000 may further include a fingerprint recognition module 108 disposed within the first housing 100. The fingerprint recognition module 108 can assist the electronic device 1000 in realizing functions such as screen unlocking, quick payment, and file encryption. The fingerprint recognition module 108 can realize under-display fingerprint recognition. Specifically, the fingerprint recognition module 108 can be disposed on the side of the first display screen facing away from its light-emitting surface, or disposed on the side of the second display screen facing away from its light-emitting surface. The first display screen 600 or the second display screen 700 is provided with a fingerprint recognition area corresponding to the position of the fingerprint recognition module 108. The fingerprint recognition module 108 can recognize the fingerprint of the user's finger when the user's finger presses the fingerprint recognition area.
[0121] In one implementation, the fingerprint recognition module 108 is disposed within the second sub-slot 10012, allowing it to be close to the second frame 106 for easy finger pressing. The fingerprint recognition module 108 can be disposed on the second sub-board 1033 and electrically connected to the processor 202 via the first conductive element 104 and the host circuit board 201. The processor 202 can compare the fingerprint collected by the fingerprint recognition module 108 with stored fingerprint information, and if the fingerprints match, control the electronic device 1000 to perform operations such as screen unlocking.
[0122] In this embodiment, the first battery 101 can be disposed within the second receiving slot 1002 to maximize the volume of the first battery 101 and enable it to achieve a large capacity design. The first battery 101 can be electrically connected to the first daughter board 1032 to shorten the connection line length between the first battery 101 and the first terminal 1031.
[0123] Figure 9a is a cross-sectional structural diagram of Figure 8a at point BB. Referring to Figures 8a and 9a together, in some embodiments, the first battery 101 can be a structure of uniform thickness, and the first battery 101 is attached to the bottom of the second receiving groove 1002. Based on the wedge-shaped structure design of the first housing 100, there will be a certain gap between the first battery 101 and the second display screen. The portion of the first conductive element 104 inside the first housing 100 can be disposed within this gap, which does not affect the size design of the first battery 101 and can make full use of the space inside the first housing 100.
[0124] Referring also to Figures 8a, 8b, and 9a, in this embodiment, the cable exit area 710 of the second display screen 700 is exposed inside the first housing 100, and the cable exit area 710 of the second display screen 700 is located within the third sub-slot 10013. The first sub-board 1032 is provided with a second terminal 1034, which is electrically connected to the cable exit area of the second display screen 700 via a second conductive element 109. Furthermore, the second terminal 1034 is electrically connected to the first terminal 1031, so that the cable exit area of the second display screen 700 can be electrically connected to the main circuit board 201 and the processor 202 via the second conductive element 109 and the first conductive element 104, thereby enabling display based on the display signal from the processor 202.
[0125] In a specific implementation, the second conductive element 109 can also be a flexible circuit board, so that the shape of the second conductive element 109 can be adjusted according to the position of the wire outlet area of the second display screen 700 and the second terminal 1034. The second conductive element 109 can also be disposed in the gap between the first battery 101 and the second display screen 700 to further improve the compactness of the internal structure of the first housing 100.
[0126] Furthermore, the second terminal 1034 can be positioned closer to the first terminal 1031 than the RF chip 107. This shortens the connection line length between the second terminal 1034 and the first terminal 1031, and also helps to reduce the distance between the second conductive element 109 and the first rotating mechanism 400. Since the closer the second conductive element 109 is to the first rotating mechanism 400, the larger the gap between the first battery 101 and the second display screen 700, reducing the distance between the second conductive element 109 and the first rotating mechanism 400 provides more installation space for the second conductive element 109.
[0127] Figure 9b is a schematic diagram of another cross-sectional structure at point BB in Figure 8a. Referring also to Figures 8a, 8b, and 8b, in this embodiment, the first battery 101 can be a stepped structure, comprising a first sub-part 1011 and a second sub-part 1012. The second sub-part 1012 is located on the side of the first sub-part 1011 away from the first rotating shaft mechanism 400, and the thickness of the first sub-part 1011 is greater than the thickness of the second sub-part 1012. This design helps to further increase the size of the first battery 101, enabling the first battery 101 to achieve a larger capacity.
[0128] In one implementation, the first sub-part 1011, facing the first display screen 600, is attached to the bottom of the second receiving groove 1002, and the second sub-part 1012, also facing the first display screen 600, is attached to the bottom of the second receiving groove 1002. Based on the wedge-shaped structure design of the first housing 100, a certain gap can be formed between the first sub-part 1011 and the second display screen 700, and a certain gap can also be formed between the second sub-part 1012 and the second display screen 700. For example, the portion of the first conductive member 104 inside the first housing 100 can be disposed within the gap between the first sub-part 1011 and the second display screen 700, and the second conductive member 109 can be disposed within the gap between the second sub-part 1012 and the second display screen 700, thereby satisfying the wiring space requirements inside the first housing 100 while ensuring a large-size design for the first battery 101.
[0129] Figure 10 is a cross-sectional structural diagram of Figure 8a at point CC. Referring also to Figures 6, 8a, 8b, and 10, the electronic device 1000 further includes a first camera 110 and a second camera 111 disposed within the first housing 100. Both the first camera 110 and the second camera 111 are front-facing cameras. In this embodiment, a front-facing camera can be understood as a camera that receives light from the screen side of the electronic device 1000. In a specific implementation, the light-receiving side of the first camera 110 faces the first display screen 600, and the light-receiving side of the second camera 111 faces the second display screen 700.
[0130] In one embodiment, the first sub-slot 10011 includes a second mounting area 100112 and a third mounting area 100113, which are arranged sequentially on the side of the first mounting area 100111 opposite to the second housing 200. The first camera 110 is disposed in the second mounting area 100112, and the second camera 111 is disposed in the third mounting area 100113. Since the height of the camera is usually lower than the height of the speaker, this arrangement can meet the installation space requirements of the first speaker 102 and the two cameras, and also make full use of the space inside the first housing 100.
[0131] The first camera 110 and the second camera 111 are electrically connected to the first sub-board 1032, and are electrically connected to the processor 202 through the first conductive element 104 and the host circuit board 201. In one implementation, the first camera 110 and the second camera 111 may be disposed in a clearance groove of the first sub-board 1032.
[0132] Figure 11a is a partial structural schematic diagram of the first display screen 600 provided in an embodiment of this application, and Figure 11b is a partial structural schematic diagram of the second display screen 700 provided in an embodiment of this application. Referring together to Figures 10, 11a, and 11b, in this embodiment, the first display screen 600 is provided with a first opening 610, and the light-receiving side of the first camera 110 is disposed facing the first opening 610 to allow light to enter through the first opening 610; the second display screen 700 is provided with a second opening 720, and the light-receiving side of the second camera 111 is disposed facing the second opening 720 to allow light to enter through the second opening 720. In addition, as shown in Figure 7, the first support surface 100a is provided with a first through hole 1004, which is connected to the first sub-slot 10011. The first through hole 1004 is positioned opposite to the first opening 610, thereby preventing the light path of the first camera 110 from being blocked, and allowing ambient light to pass through the first opening 610 and the first through hole 1004 in sequence to enter the light-receiving side of the first camera 110.
[0133] It should be noted that the first display screen 600 and the second display screen 700 each include a display panel and a transparent cover plate. The transparent cover plate of the first display screen 600 is fixed to the light-emitting side of its display panel, and the transparent cover plate of the second display screen 700 is fixed to the light-emitting side of its display panel. The transparent cover plate can protect and prevent dust from the display panel. If the first opening 610 is provided on the display panel of the first display screen 600, then the transparent cover plate of the first display screen 600 can block the first opening 610; if the second opening 720 is provided on the display panel of the second display screen 700, then the transparent cover plate of the second display screen 700 can block the second opening 720.
[0134] Since the first camera 110 and the second camera 111 are arranged along the width direction of the first housing 100, if one camera is centered in the width direction of the first housing 100, the other camera will inevitably not be centered. The positions of the two cameras determine the positions of the two openings, which in turn affect the appearance quality of the electronic device. Therefore, in this embodiment, the first opening 610 and the second opening 720 are respectively centered in the width direction of the first housing 100. The opening corresponding to the centered camera can be a round hole or an oblong hole, while the opening corresponding to the non-centered camera is an oblong hole. This ensures that the light intake of the two cameras is not affected while maintaining the appearance quality of the electronic device.
[0135] For example, the first camera 110 is centered in the width direction of the first housing 100, and the second camera 111 is offset to one side of the second frame 106. In specific implementation, the first opening 610 can be a round hole, the second opening 720 can be an oblong hole, or the first opening 610 and the second opening 720 can be oblong holes respectively.
[0136] Of course, in some other embodiments, the second camera 111 can be centered in the width direction of the first housing 100, and the first camera 110 can be offset to one side of the first rotating shaft mechanism 400. In this case, the first opening 610 is an oblong hole, and the second opening 720 can be a round hole or an oblong hole.
[0137] Referring again to Figures 6 to 8b, within the third housing 300, the second speaker 302 can be disposed within the third receiving groove 3001, and the second speaker 302 is disposed in the area of the third receiving groove 3001 near the second rotating shaft mechanism 500, so as to utilize the relatively large thickness of this side of the third housing 300 to meet the installation space requirements of the second speaker 302. The top frame 305 of the third middle frame is provided with a sound-emitting hole, which connects the interior and exterior of the third housing 300, and the sound emitted by the second speaker 302 can be transmitted to the exterior of the electronic device through the sound-emitting hole.
[0138] In addition, the electronic device 1000 also includes a second circuit board 303, which is electrically connected to electronic devices such as the second speaker 302 and the second battery 301. The second circuit board 303 is also disposed within the third receiving slot 3001. The second speaker 302 can be stacked on the second circuit board 303 or disposed within a clearance slot of the second circuit board 303; this application does not impose any limitations on this. The second circuit board 303 includes a third terminal 3031, which can be electrically connected to the main circuit board 201 via a third conductive element 304. This allows the various electronic devices within the third housing 300 to be electrically connected to the processor 202 via the main circuit board 201.
[0139] In a specific implementation, the third conductive element 304 can be a flexible circuit board to give it better deformability and facilitate adjustment of its shape and position. The third conductive element 304 includes a third connecting portion 3041 and a fourth connecting portion 3042. The fourth connecting portion 3042 is connected to the third connecting portion 3041 and is bent relative to the third connecting portion 3041. The third connecting portion 3041 is disposed within the third housing 300, and its two ends are electrically connected to the third terminal 3031 and the fourth connecting portion 3042, respectively. The fourth connecting portion 3042 can extend into the second housing 200 through the second rotating shaft mechanism 500. That is, the fourth connecting portion 3042 passes through the second rotating shaft mechanism 500, and the end of the fourth connecting portion 3042 away from the third connecting portion 3041 is located within the second housing 200 and electrically connected to the main circuit board 201.
[0140] In this embodiment, the third terminal 3031 can be positioned close to the second rotating shaft mechanism 500. This helps to reduce the length of the third conductive element 304, thereby reducing the space occupied by the third conductive element 304. Furthermore, it confines the portion of the third conductive element 304 within the third housing 300 to the side of the third housing 300 closest to the second rotating shaft mechanism 500, improving the feasibility of the third conductive element 304 being positioned with other devices in the thickness direction of the third housing 300, thus fully utilizing the space within the third housing 300. For example, in one implementation, the portion of the third conductive element 304 inside the third housing 300 is stacked with the second battery 301.
[0141] Referring again to Figures 6 to 8b, in this embodiment, along the length of the third housing 300, the third terminal 3031 and the second speaker 302 can be at least partially opposite each other, so that both the second speaker 302 and the third conductive element 304 can be positioned relatively close to the second rotating shaft mechanism 500, and this helps to shorten the length of the connection line between the second speaker 302 and the third terminal 3031. In a specific implementation, the third terminal 3031 can be located on the side of the second speaker 302 away from the top edge 305 of the third middle frame. The third connecting portion 3041 of the third conductive element 304 is arranged along the length of the third housing 300, and the third connecting portion 3041 extends in a direction away from the second speaker 302. The fourth connecting portion 3042 is arranged along the width of the third housing 300. The third conductive element 304 is approximately “┘” shaped (view from Figure 8a).
[0142] In this embodiment, the cable exit area 620 of the first display screen can be located within the fifth receiving groove 3003. A second through hole 3005 is provided on the third inner surface 300b, communicating with the fifth receiving groove 3003 (refer to FIG. 7). The second circuit board 303 is provided with a fourth terminal 3032, which is electrically connected to the cable exit area 620 of the first display screen via a fourth conductive element 306 passing through the second through hole 3005. Furthermore, the fourth terminal 3032 is electrically connected to a third terminal 3031, so that the cable exit area 620 of the first display screen can be electrically connected to the processor 202 via the fourth conductive element 306 and the third conductive element 304, and thus can display according to the display signal from the processor 202.
[0143] In a specific implementation, the fourth conductive element 306 can also be a flexible circuit board, so that the shape of the fourth conductive element 306 can be adjusted according to the position of the cable outlet area 620 of the first display screen and the third terminal 3031.
[0144] Referring again to Figures 6 through 8b, the second battery 301 is disposed within the fourth receiving slot 3002. In one embodiment, the fourth receiving slot 3002 may extend to a position near the bottom edge 307 of the third middle frame to provide more installation space for the second battery 301, enabling the second battery 301 to achieve a large-capacity design.
[0145] Figure 12 is a cross-sectional structural diagram of Figure 8a at point DD. Referring to Figures 8a and 12 together, in some embodiments, the second battery 301 has a stepped structure, including a third sub-part 3011 and a fourth sub-part 3012. The fourth sub-part 3012 is located on the side of the third sub-part 3011 opposite to the second rotating shaft mechanism 500, and the thickness of the third sub-part 3011 is greater than the thickness of the fourth sub-part 3012. This design can further increase the size of the second battery 301, enabling it to achieve a larger capacity.
[0146] In one implementation, the third sub-part 3011 is attached to the bottom of the fourth receiving groove 3002 on the side facing the first display screen 600, and the fourth sub-part 3012 is attached to the bottom of the fourth receiving groove 3002 on the side facing the first display screen 600. Based on the wedge-shaped structure design of the third housing 300, a certain gap can be formed between the third sub-part 3011 and the third rear housing 300B, and a certain gap can also be formed between the fourth sub-part 3012 and the third rear housing 300B. For example, the portion of the third conductive element 304 inside the third housing 300 can be disposed within the gap between the third sub-part 3011 and the third rear housing 300B.
[0147] Of course, in some other embodiments, the second battery 301 can also be a structure of equal thickness. The second battery 301 is attached to the bottom of the fourth receiving groove 3002, and a certain gap can also be formed between the second battery 301 and the third rear shell 300B. The part of the third conductive element 304 inside the third shell 300 can be disposed in the gap.
[0148] The above embodiments describe the layout of the three housings in the case where the electronic device 1000 includes three speakers. Referring to FIG13, a partial structural plan view of another housing mechanism provided in this application embodiment in its unfolded state, FIG13 shows the internal structure of each housing in the case where the electronic device includes two speakers. The design of the receiving slots in the first and second housings is basically the same as in the aforementioned embodiments, while the design of the third housing differs. In the third housing, the positions of the third receiving slot 3001 and the fourth receiving slot 3002 are interchanged; the third receiving slot 3001 is located near the bottom of the third housing, and the fourth receiving slot 3002 is located near the top of the third housing.
[0149] Figure 14 is a partial structural plan view of another electronic device 1000 provided in this application embodiment in its unfolded state. Referring also to Figures 13 and 14, in this application embodiment, the electronic device includes a first speaker 102 and a second speaker 302. The first speaker 102 is disposed within a first housing 100, and the second speaker 302 is disposed within a third housing 300. Specifically, the first speaker is disposed within a first sub-slot 10011 of the first housing, and the second speaker is disposed within a third receiving slot 3001 of the third housing. Therefore, the first speaker 102 is disposed near the top of the first housing 100, and the third speaker 302 is disposed near the bottom of the third housing 300. When both speakers emit sound simultaneously, the electronic device can achieve 3D sound effects.
[0150] In this embodiment, except for the removal of the speaker, all other components in the second housing 200 can be designed in accordance with the aforementioned embodiments. The components in the first housing 100 can also be designed in accordance with the aforementioned embodiments, and will not be repeated here.
[0151] Within the third housing 300, the second circuit board 303 is disposed within the third receiving slot 3001, and the second battery 301 is disposed within the fourth receiving slot 3002. The third terminal 3031 of the second circuit board 303 is electrically connected to the main circuit board 201 via a third conductive element 304, thereby connecting the various electronic devices within the first housing 100 to the processor 202 via the main circuit board 201. The third conductive element 304 includes a third connecting portion 3041 and a fourth connecting portion 3042, the fourth connecting portion 3042 being bent and connected to the third connecting portion 3041. The third connecting portion 3041 is disposed within the third housing 300, with both ends electrically connected to the third terminal 3031 and the fourth connecting portion 3042, respectively. The fourth connecting portion 3042 can extend into the second housing 200 via the second rotating shaft mechanism 500.
[0152] The third speaker 212 can be stacked on the second circuit board 303 or disposed within a clearance groove of the second circuit board 303; this application does not impose any limitation on this. Additionally, the bottom edge 307 of the third middle frame is provided with a speaker hole so that the sound emitted by the second speaker 302 can be transmitted to the outside of the electronic device 1000 through the speaker hole. Along the length of the third housing 300, the third terminal 3031 and the second speaker 302 can be at least partially opposite each other, so that both the second speaker 302 and the third conductive element 304 can be disposed relatively close to the second rotating shaft mechanism 500, and this helps to shorten the length of the connection line between the second speaker 302 and the third terminal 3031.
[0153] In a specific implementation, the third terminal 3031 can be located on the side of the second speaker 302 away from the bottom frame 307 of the third middle frame. The third connecting part 3041 of the third conductive member 304 is arranged along the length direction of the third housing 300 and extends away from the second speaker 302. The fourth connecting part 3042 is arranged along the width direction of the third housing 300. The third conductive member 304 is roughly in the shape of a "┌".
[0154] The specific structure of the second battery 301 inside the third housing 300 and the electrical connection method of the cable outlet area 620 of the first display screen can adopt the same design as in the previous embodiments, and will not be described in detail here.
[0155] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.