Heat dissipation structural member, electronic device and heat dissipation apparatus

Abstract

Provided in the embodiments of the present application are a heat dissipation structural member, an electronic device and a heat dissipation apparatus, relating to the technical field of heat dissipation devices, and aiming at efficiently implementing heat dissipation of electronic devices. The heat dissipation structural member comprises a first base layer and a first anti-fouling layer. The first base layer has a first mesh hole area, the first mesh hole area is provided with first mesh holes, and the first mesh holes penetrate through the first base layer in the wall thickness direction. The first anti-fouling layer is disposed on the wall surfaces of the first mesh holes, and the first anti-fouling layer is hydrophobic and / or oleophobic. The embodiments of the present application use the microporous features of the first mesh holes for ventilation, so as to ensure the heat dissipation capability of the heat dissipation structural member while also reducing the passage of contaminants through the heat dissipation structural member, and can also use the first anti-fouling layer for reducing clogging of the first mesh holes; and thus if the heat dissipation structural member is used for an electronic device, the heat dissipation effect of the heat dissipation structural member on the electronic device can be ensured.

Description

A heat dissipation structure, electronic device and heat dissipation device

[0001] This application claims priority to Chinese Patent Application No. 202510125396.0, filed on January 26, 2025, entitled "A Heat Dissipation Structure, Electronic Device and Heat Dissipation Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heat dissipation device technology, and in particular to a heat dissipation structure, electronic device and heat dissipation apparatus. Background Technology

[0003] As the computing power demands of electronic devices increase, the density of integrated circuits in chips has significantly increased, leading to higher heat density and greater heat generation during operation. As chip manufacturing processes approach their physical limits, the heat generation remains high, making heat dissipation a major challenge for electronic devices. This is especially true for mobile devices, which require increased integration of electronic components and smaller device size to improve portability. This not only further increases the heat density of components but also significantly increases the difficulty of heat dissipation design within limited space. Taking smartphones as an example, in high-load scenarios such as running demanding games and artificial intelligence (AI) applications, chip heat generation and power consumption increase, leading to a significant rise in heat dissipation requirements.

[0004] Therefore, how to efficiently dissipate heat from electronic devices is a problem that urgently needs to be solved by technical personnel. Summary of the Invention

[0005] This application provides a heat dissipation structure, electronic device, and heat dissipation device, the main purpose of which is to efficiently dissipate heat from electronic devices.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, embodiments of this application provide a heat dissipation structure, which includes a first substrate layer and a first anti-fouling layer. The first substrate layer has a first mesh area, wherein the first mesh area is provided with first mesh holes, and the first mesh holes penetrate through the wall thickness direction of the first substrate layer. The first anti-fouling layer is disposed on the surface of the hole wall of the first mesh holes, and the first anti-fouling layer has hydrophobic and / or oleophobic properties.

[0008] The heat dissipation structure provided in some embodiments of the first aspect includes a first mesh on a first substrate layer. The first mesh allows for ventilation, enabling the heat dissipation structure to achieve its function of ventilation and heat dissipation. For example, when the heat dissipation structure is used as a housing for an electronic device, the first mesh allows for ventilation both inside and outside the electronic device, thereby improving the heat dissipation and cooling capacity of the electronic device and helping it maintain high-performance operation for extended periods. A first anti-fouling layer on the surface of the mesh wall has hydrophobic and / or oleophobic properties, resulting in a low surface energy on the mesh wall surface, effectively preventing dust, oil stains, water stains, and other contaminants from clogging the mesh. For example, when the heat dissipation structure is used as a housing for an electronic device, it also effectively prevents contaminants from entering the interior of the electronic device, ensuring the ventilation capacity of the first mesh and thus guaranteeing the heat dissipation effect of the heat dissipation structure on the electronic device.

[0009] In conjunction with the first aspect, in one possible implementation, the heat dissipation structure further includes a second substrate layer. The second substrate layer is opposite to the first substrate layer and has a gap between them. The second substrate layer has a second mesh area, which is opposite to the first mesh area. The second mesh area is provided with second mesh holes, which penetrate the wall thickness direction of the second substrate layer. In this implementation, a double-layer mesh is achieved using the first and second substrate layers, thereby ensuring both the ventilation of the mesh (including the first and second mesh holes) of the heat dissipation structure and enhancing its ability to block contaminants. For example, if the heat dissipation structure is used as a housing for electronic devices, the double-layer mesh can more effectively prevent contaminants from entering the interior of the electronic device.

[0010] In conjunction with the first aspect, in one possible implementation, the orthographic projection of the first mesh opening onto the second substrate layer does not coincide with the second mesh opening. This allows for better shielding of the first mesh opening by the second substrate layer, or better shielding of the second mesh opening by the first substrate layer, further enhancing the double-layer mesh's ability to block pollutants.

[0011] In conjunction with the first aspect, in one possible implementation, the heat dissipation structure further includes a second anti-fouling layer. The second anti-fouling layer is disposed on the surface of the pore walls of the second mesh, and the second anti-fouling layer is hydrophobic and / or oleophobic. Thus, the second anti-fouling layer can be used to improve the dirt resistance of the second mesh.

[0012] In conjunction with the first aspect, in one possible implementation, the first anti-fouling layer is further disposed on the surface of the first substrate layer facing the second substrate layer. And / or, the second anti-fouling layer is further disposed on the surface of the second substrate layer facing the first substrate layer. In this implementation, in the double-layer mesh design, the provision of an anti-fouling layer (including the first anti-fouling layer or the second anti-fouling layer) on the inner side of the first substrate layer and / or the second substrate layer helps to prevent contaminants from accumulating between the first substrate layer and the second substrate layer, partially or completely preventing contaminants from clogging the first mesh or the second mesh, and ensuring the ventilation of the mesh of the heat dissipation structure.

[0013] In conjunction with the first aspect, in one possible implementation, the first anti-fouling layer is further disposed on the surface of the first substrate layer facing away from the second substrate layer. Alternatively, the second anti-fouling layer is further disposed on the surface of the second substrate layer facing away from the first substrate layer. In this implementation, in the design of the double-layer mesh, disposing of an anti-fouling layer on one side of the double-layer mesh can better adapt to the application scenarios of the heat dissipation structure. For example, when the heat dissipation structure surrounds a heat dissipation channel, disposing of an anti-fouling layer on the side of the heat dissipation structure facing the heat dissipation channel can partially or completely prevent contaminants from clogging the heat dissipation channel, ensuring the ventilation of the heat dissipation channel. As another example, if the heat dissipation structure serves as the casing of an electronic device, disposing of an anti-fouling layer on the side of the heat dissipation structure facing the inside of the electronic device can partially or completely prevent contaminants from remaining inside the electronic device, while the side of the heat dissipation structure facing the outside of the electronic device may not require an anti-fouling layer, thus maintaining a good appearance, texture, and feel for the electronic device.

[0014] In conjunction with the first aspect, in one possible implementation, the water contact angle of the first antifouling layer is θ, where θ ≥ 110°. Therefore, the first antifouling layer is hydrophobic, thereby reducing the adhesion of water-based contaminants with lower surface energy and improving the antifouling capability of the heat dissipation structure.

[0015] In conjunction with the first aspect, in one possible implementation, the oil contact angle of the first antifouling layer is φ, where φ ≥ 60°. Therefore, the first antifouling layer is oleophobic, thereby reducing the adhesion of oily contaminants with lower surface energy and improving the antifouling capability of the heat dissipation structure.

[0016] In conjunction with the first aspect, in one possible implementation, the material of the first antifouling layer includes fluorocarbon resin and / or siloxane. This gives the first antifouling layer superior hydrophobicity and oleophobicity.

[0017] Secondly, embodiments of this application provide an electronic device including an internal structural component, a fan, and a heat dissipation structural component as described in any of the above embodiments. The internal structural component and the heat dissipation structural component together enclose a channel. A first mesh area is located at the entrance and / or exit of the channel. The first mesh area includes an air intake area located at the entrance of the channel, and the fan is configured to allow air to enter the channel through the first mesh of the air intake area. And / or, the first mesh area includes an air outlet area located at the exit of the channel, and the fan is configured to allow air to leave the channel through the first mesh of the air outlet area.

[0018] The electronic device provided in some embodiments of the second aspect utilizes a heat dissipation structure and internal structural components to jointly enclose a channel within the electronic device. A fan drives airflow, accelerating ventilation within the electronic device. External air carries away heat from the device, effectively improving its heat dissipation and cooling capacity, thus helping to maintain high-performance operation for extended periods. For example, the electronic device could be a gaming phone. The first mesh of the heat dissipation structure is located at the inlet and / or outlet of the channel, allowing air to pass through. This mesh design not only prevents larger contaminants from entering the device but also utilizes a first anti-fouling layer on the mesh wall surface to reduce the adhesion of dust, oil, water, and other contaminants, preventing clogging of the first mesh and ensuring the channel's ventilation capacity, thereby further guaranteeing the heat dissipation effect of the electronic device.

[0019] In conjunction with the second aspect, in one possible implementation, the electronic device further includes any one of the following internal structural components: a camera module, a battery module, a shielding cover, a mid-frame, a rear cover, a lens protective cover, and a frame; and a heat dissipation structural component including any one of the rear cover, lens protective cover, and frame. This allows for heat dissipation at different locations within the electronic device, improving its overall heat dissipation capabilities.

[0020] In conjunction with the second aspect, in one possible implementation, the first antifouling layer is also disposed on the surface of the first substrate layer facing the channel. This reduces or prevents the adhesion of contaminants to the inner surface of the channel, improves or solves the problem of contaminant retention within the channel, and better ensures the ventilation capacity of the channel.

[0021] In conjunction with the second aspect, in one possible implementation, the aperture of the first mesh in the air intake zone is smaller than the aperture of the first mesh in the air outlet zone. In this implementation, the first mesh in the air intake zone blocks some pollutants. Even if other pollutants enter the channel, the size of these pollutants is smaller than the aperture of the first mesh in the air intake zone. Therefore, these pollutants can quickly pass through the first mesh in the air outlet zone and leave the channel, further improving or solving the problem of pollutant retention in the channel and ensuring the ventilation capacity of the channel.

[0022] Thirdly, embodiments of this application provide a heat dissipation device, which includes a fan and a heat dissipation structural member as described in any of the above embodiments. The heat dissipation structural member encloses a channel. A first mesh area includes an air inlet area located at the entrance of the channel, and the fan is configured to allow air to enter the channel through the first mesh of the air inlet area. And / or, the first mesh area includes an air outlet area located at the exit of the channel, and the fan is configured to allow air to leave the channel through the first mesh of the air outlet area.

[0023] The heat dissipation device provided in some embodiments of the third aspect utilizes heat dissipation structural components to enclose channels, thereby achieving air exchange between the inside and outside of the heat dissipation device and thus achieving heat dissipation and cooling. The heat dissipation device can be used to achieve heat dissipation and cooling of electronic devices. For example, the heat dissipation device can be used as an external device of electronic devices, and the heat dissipation structural components and channels can be used in close contact with the housing of electronic devices to achieve heat dissipation and cooling of electronic devices, which helps to maintain high-performance operation of electronic devices for a long time.

[0024] Unless otherwise specified, the technical effects of any of the design methods in the second or third aspect can be found in the technical effects of different design methods in the first aspect, and will not be repeated here. Attached Figure Description

[0025] Figure 1 is a structural diagram of an electronic device provided in an embodiment of this application;

[0026] Figure 2 is an exploded view of the electronic device in the embodiment shown in Figure 1;

[0027] Figure 3 is a structural diagram of another electronic device provided in an embodiment of this application;

[0028] Figure 4 is a structural diagram of a heat dissipation structure provided in an embodiment of this application;

[0029] Figure 5 is a bottom view of the heat dissipation structure of the embodiment shown in Figure 4;

[0030] Figure 6 is a partial cross-sectional view of the heat dissipation structure of the embodiment shown in Figure 5 along the “AA’” direction;

[0031] Figure 7 is a diagram of the mesh opening at point "B" of the heat dissipation structure in the embodiment shown in Figure 6;

[0032] Figure 8 is another partial cross-sectional view of the heat dissipation structure of the embodiment shown in Figure 5 along the “AA’” direction;

[0033] Figure 9 is a diagram of the mesh opening at point "C" of the heat dissipation structure in the embodiment shown in Figure 8;

[0034] Figure 10 is a structural diagram of a heat dissipation device provided in an embodiment of this application;

[0035] Figure 11 is a flowchart of the manufacturing method of the heat dissipation structure component in the embodiment shown in Figure 4;

[0036] Figure 12 is a process diagram of the manufacturing of the heat dissipation structure component in the embodiment shown in Figure 4.

[0037] Explanation of reference numerals in the attached drawings: 1000, electronic device; 100, internal structural component; 200, fan; 300, heat dissipation structural component; 400, motherboard; 500, mid-frame; 600, camera module; 700, screen; 201, channel; 31, face; 32, ring; 310, first substrate layer; 311, first mesh area; 3111, air intake area; 3112, air outlet area; 301, first mesh; 320, first anti-fouling layer; 330, second substrate layer; 331, second mesh area; 302, second mesh; 340, second anti-fouling layer; 2000, heat dissipation device; 800, fixture. Detailed Implementation

[0038] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0039] In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more. "At least one" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, and c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be a single item or multiple items.

[0040] Furthermore, to facilitate a clear description of the technical solutions in the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with substantially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that "first" and "second" are not necessarily different. Meanwhile, in the embodiments of this application, words such as "exemplary" or "for example" are used to indicate that something is being used as an example, illustration, or description. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete manner for ease of understanding.

[0041] In describing some embodiments, the term "connection" and its derivative expressions are used. The term "connection" should be interpreted broadly; for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0042] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0043] In the accompanying drawings, the thickness of some layers or regions has been selectively exaggerated for clarity, and the dimensional proportions between the portions shown do not reflect actual dimensional proportions. Therefore, variations in shape relative to the drawings are conceivable due to factors such as manufacturing techniques and / or tolerances. Consequently, exemplary embodiments should not be construed as being limited to the shapes of the regions shown in this application, but rather include shape deviations caused, for example, by manufacturing processes. For instance, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0044] Traditional electronic devices, due to the inability to integrate sufficiently effective heat dissipation structures within a limited size, often struggle to simultaneously achieve portability and the ability to operate under high loads for extended periods. For example, while technologies employing graphite thermal conductivity in smartphones to achieve uniform heat distribution can help maintain high performance for shorter periods, the difficulty in quickly dissipating heat means that such technologies still cannot achieve rapid cooling of the entire smartphone or maintain high performance for extended periods.

[0045] In the embodiments of this application, unless otherwise specified, if a certain value range is between the value of A and the value of B, the value range may include the value of A and the value of B.

[0046] Figure 1 is a structural diagram of an electronic device provided in an embodiment of this application, and Figure 2 is an exploded view of the electronic device in the embodiment shown in Figure 1.

[0047] In view of this, as shown in Figure 1, an embodiment of this application provides an electronic device 1000.

[0048] As shown in Figure 2, the electronic device 1000 includes an internal structural component 100, a fan 200, and a heat dissipation structural component 300.

[0049] As shown in Figure 2, the internal structural component 100 and the heat dissipation structural component 300 together form a channel 201, which can play a role in air cooling.

[0050] In this embodiment, the fan 200 is configured to allow air from outside the electronic device 1000 to flow through the channel 201, thereby cooling the electronic device 1000.

[0051] The specific location of the fan 200 may not be limited in the embodiments of this application.

[0052] In some alternative implementations, as shown in FIG2, the fan 200 may be located outside the channel 201 and disposed on one side inside the channel 201.

[0053] In some alternative embodiments, the fan 200 may also be disposed within the channel 201, or at one end of the channel 201.

[0054] Through the above embodiments, the internal structural component 100, fan 200 and heat dissipation structural component 300 are integrated into the electronic device 1000 to achieve air cooling of the electronic device 1000, thereby improving the heat dissipation and cooling capacity of the electronic device and helping the electronic device maintain a high-performance operating state for a long time.

[0055] The aforementioned electronic devices include, but are not limited to, electronic devices in the fields of information technology (IT) and communication technology (CT), and can be applied to various scenarios. These electronic devices include, for example, consumer products, home products, automotive products, wearable products, financial terminal products, and communication products. For example, the electronic device may include, but is not limited to, mobile phones, tablets, smart wearable products (e.g., smartwatches, smart bracelets), handheld game consoles, smart TVs, routers, headphones, microphones, extended reality (XR) devices, inertial navigation systems, supplemental inflatable restraint systems (SRS) devices, smart door locks, stethoscopes, helmets, controllers, and fluid pressure gauges. The aforementioned XR devices include, for example, virtual reality (VR) devices, augmented reality (AR) devices, mixed reality (MR) devices, and robots.

[0056] As shown in Figure 2, taking a mobile phone as an example, the electronic device 1000 may also include any one of the following: a motherboard 400, a mid-frame 500, a camera module 600, a screen 700, a battery module, a shielding cover, a rear cover, a lens cover, and a frame. For example, the rear cover and the lens cover may be a single integrated structure. Similarly, the frame and the mid-frame 500 may be a single integrated structure.

[0057] In some optional embodiments, the internal structural component 100 includes any one of a camera module, a battery module, a shielding cover, and a mid-frame 500. The heat dissipation structural component 300 includes any one of a rear cover, a lens cover, and a frame. Thus, heat dissipation can be applied to different locations within the electronic device 1000, improving the heat dissipation capacity of the electronic device 1000.

[0058] In some optional implementations, as shown in FIG2, the internal structural component 100 may be connected to the motherboard 400 or the mid-frame 500. In some examples, the internal structural component 100 may be an integral structure with the motherboard 400, or the internal structural component 100 may be an integral structure with the mid-frame 500.

[0059] For example, the material of the internal structural component 100 may include metal to improve the thermal conductivity of the internal structural component 100. For example, the heat dissipation structure 300 is a rear cover of the device, the internal structural component 100 is located between the motherboard 400 and the heat dissipation structure 300, an insulating layer is provided on the side of the internal structural component 100 facing the motherboard 400, and a metal layer is provided on the side of the internal structural component 100 facing the channel 201.

[0060] In some examples, as shown in Figure 2, the internal structural component 100 may be located between the motherboard 400 and the rear cover, and the heat dissipation structural component 300 may be the rear cover.

[0061] Figure 3 is a structural diagram of another electronic device provided in an embodiment of this application.

[0062] In some other examples, as shown in Figure 3, the internal structural component 100 can be a camera module 600, and the heat dissipation structural component 300 can be a lens protective cover.

[0063] Figures 1 to 3 only illustrate some components included in the electronic device 1000 by way of example. The actual shape, size, position, and structure of these components are not limited by Figures 1 to 3. For example, the electronic device 1000 may not include the camera module 600. Alternatively, the electronic device 1000 may not include the screen 700.

[0064] The aforementioned electronic device 1000 is cooled by air cooling, which can achieve efficient heat dissipation. However, during actual operation, contaminants such as dust, water stains, and oil stains are prone to enter the channel 201 with the air. As the channel 201 is an air duct, the long-term accumulation of contaminants will cause blockage of the air duct, affecting the heat dissipation of the electronic device 1000.

[0065] Figure 4 is a structural diagram of a heat dissipation structure provided in an embodiment of this application, and Figure 5 is a bottom view of the heat dissipation structure of the embodiment shown in Figure 4.

[0066] In view of this, embodiments of this application provide a heat dissipation structure 300. In the example shown in FIG4, the heat dissipation structure 300 may be a lens protective cover in the electronic device 1000 shown in FIG3, which serves to protect and decorate the camera module.

[0067] In some examples, the material of the heat dissipation structure 300 may include, but is not limited to, metal, plastic and glass.

[0068] For example, as shown in FIG4, the lens cover includes a face 31 as a planar portion.

[0069] For example, face 31 can be used to face the camera module 600, and can also be used to allow incident light through the camera module 600. Therefore, the glass can be a transparent material; for example, the material of face 31 can be glass, thereby ensuring that light enters the camera module 600.

[0070] As exemplarily shown in FIG4, the lens cover also includes a ring portion 32 as a side portion.

[0071] For example, the ring 32 can be located on one side of the extended plane of the face 31 and can be used to surround the camera module 600. For example, the ring 32 can be made of metal to improve heat dissipation.

[0072] As shown in Figure 5, the heat dissipation structure 300 includes a first base layer 310.

[0073] For example, the heat dissipation structure 300 is a lens cover in the electronic device 1000 shown in FIG. 3. The heat dissipation structure 300 may include a face 31 facing the camera module and a ring 32 surrounding the camera module. For example, the heat dissipation structure 300 may be integrally formed. The first substrate layer 310 may be located on the side of the lens cover, or the first substrate layer 310 may be disposed in the ring 32.

[0074] In some other examples, the heat dissipation structure 300 is the rear cover of the electronic device 1000 shown in Figure 2, and the first substrate layer 310 may be located in the plane of the rear cover.

[0075] Figure 6 is a partial cross-sectional view of the heat dissipation structure of the embodiment shown in Figure 5 along the “AA’” direction.

[0076] In this embodiment of the application, as shown in FIG6, the first substrate layer 310 has a first mesh area 311, the first mesh area 311 is provided with a first mesh 301, and the first mesh 301 penetrates through the wall thickness direction of the first substrate layer 310.

[0077] In some alternative implementations, the first substrate layer 310 includes one or more first mesh regions 311.

[0078] For example, the first substrate layer 310 includes one or more first mesh areas 311, and the first substrate layer 310 also includes through holes. The aperture of the through holes is larger than the aperture of the first mesh 301 of the first mesh area 311. For example, the first mesh area 311 may be located at one end of the heat dissipation structure 300, and the opening may be located at the other end of the heat dissipation structure 300. In a more specific example, the heat dissipation structure 300 is used to enclose the channel 201, the through hole may be located at the outlet of the channel 201, and the first mesh area 311 may be located at the inlet of the channel 201. In this way, not only can pollutants be effectively blocked from entering the channel 201, but the through holes can also be used to ensure unobstructed airflow from the channel 201, preventing pollutants from accumulating in the channel 201, thereby ensuring the heat dissipation effect of the heat dissipation structure 300.

[0079] In some other examples, the first substrate layer 310 includes a plurality of first mesh regions 311. Exemplarily, a portion of the first mesh regions 311 may be located at one end of the heat dissipation structure 300, and the remaining portion of the first mesh regions 311 may be located at the other end of the heat dissipation structure 300.

[0080] For example, as shown in FIG5, the first mesh area 311 includes an air inlet area 3111 and an air outlet area 3112. The air inlet area 3111 may be located at one end of the heat dissipation structure 300, and the air outlet area 3112 may be located at the other end of the heat dissipation structure 300.

[0081] For example, if the heat dissipation structure 300 is used for heat dissipation of electronic device 1000, and the heat dissipation structure 300 and the internal structure 100 form a channel 201, then the first mesh 301 of the air inlet area 3111 can be used as the entrance of the channel 201, and the first mesh 301 of the air outlet area 3112 can be used as the exit of the channel 201.

[0082] In some alternative implementations, as shown in FIG6, the shape of each first mesh 301 can be rhomboid, which helps to ensure the structural strength of the first substrate layer, increase the ventilation area of ​​the first mesh area 311, and facilitate the fabrication of the first substrate layer 310.

[0083] In some alternative embodiments, the shape of each first mesh 301 may also include, but is not limited to, any one of a circle, a rectangle, or a triangle.

[0084] In some examples, the shapes of multiple first mesh openings 301 in the same heat dissipation structure 300 may not be exactly the same. For example, in the same heat dissipation structure 300, some of the first mesh openings 301 may be rectangular in shape, while others may be rhomboid in shape.

[0085] In some examples, the heat dissipation structure 300 includes a plurality of first mesh areas, and the shapes of the plurality of first mesh holes 301 in the same first mesh area may not be exactly the same.

[0086] In some alternative embodiments, the aperture of the first mesh 301 can be between 50 μm and 400 μm. This ensures both the size of the inlet or outlet of the channel 201 and its ventilation, while also blocking contaminants as much as possible. In some examples, the aperture of the first mesh 301 can be its maximum radial dimension.

[0087] In some examples, the aperture of each first mesh 301 in the same heat dissipation structure 300 may be unequal.

[0088] For example, the first mesh 301 is rhomboid in shape, and the aperture of the first mesh 301 can be the maximum diagonal size of the rhombus. In some other examples, the first mesh 301 is circular in shape, and the aperture of the first mesh 301 can be the diameter of the circle.

[0089] For example, the aperture of the first mesh 301 may be, but is not limited to, any one of 50μm, 100μm, 200μm, 300μm, and 400μm.

[0090] Through the above embodiments, the first mesh 301 provided on the heat dissipation structure 300 gives the heat dissipation structure 300 a microporous feature, allowing the first mesh 301 to be used for ventilation, thus enabling the heat dissipation structure 300 to achieve the function of ventilation and heat dissipation. For example, the heat dissipation structure 300 is used as the housing of the electronic device 1000 (e.g., a lens cover or a rear cover). The first mesh 301 enables ventilation both inside and outside the electronic device 1000, thereby improving the heat dissipation and cooling capacity of the electronic device 1000. This helps the heat dissipation capacity of the electronic device 1000 to exceed the limits of natural heat dissipation and allows the electronic device 1000 to maintain a high-performance operating state for a long time.

[0091] Dust and slime can easily accumulate and clog the mesh, causing blockages. If the first mesh 301 is blocked, it may reduce the heat dissipation capacity of the heat dissipation structure 300, and may also cause abnormal noise from the fan used in conjunction with the heat dissipation structure 300. For example, if the heat dissipation structure 300 is used in electronic device 1000, contaminants may clog the mesh, adversely affecting the heat dissipation of electronic device 1000, thereby affecting the performance of electronic device 1000.

[0092] Figure 7 is a diagram of the mesh opening at point "B" of the heat dissipation structure in the embodiment shown in Figure 6.

[0093] For the reasons mentioned above, in this embodiment of the application, as shown in FIG7, the heat dissipation structure 300 further includes a first anti-fouling layer 320. The first anti-fouling layer 320 is disposed on the surface of the hole wall of the first mesh 301, and the first anti-fouling layer 320 has hydrophobic and / or oleophobic properties.

[0094] In this embodiment, the first antifouling layer 320 being hydrophobic can mean that the water contact angle on the surface of the first antifouling layer 320 is greater than a preset water contact angle, for example, the preset water contact angle can be greater than 100°. The first antifouling layer 320 being oleophobic can mean that the oil contact angle on the surface of the first antifouling layer 320 is greater than a preset oil contact angle, for example, the preset oil contact angle can be greater than 50°.

[0095] In some optional embodiments, the water contact angle of the first antifouling layer 320 is θ, where θ ≥ 110°. Therefore, the first antifouling layer 320 is hydrophobic, thereby reducing the adhesion of waterborne contaminants with lower surface energy and improving the antifouling capability of the heat dissipation structure 300. Exemplarily, θ may include, but is not limited to, any one of 110°, 115°, 120°, 125°, and 130°.

[0096] In some optional embodiments, the oil contact angle of the first antifouling layer 320 is φ, where φ ≥ 60°. Therefore, the first antifouling layer 320 is oleophobic, thereby reducing the adhesion of oily contaminants with lower surface energy and improving the antifouling capability of the heat dissipation structure 300. Exemplarily, φ may include, but is not limited to, any one of 60°, 63°, 65°, 70°, and 75°.

[0097] In some alternative embodiments, the material of the first antifouling layer 320 may be a polymer compound. For example, the material of the first antifouling layer 320 may be a mixture of polymer compounds.

[0098] In some examples, the material of the first antifouling layer 320 may include a fluorocarbon resin. In still other examples, the material of the first antifouling layer 320 may include a siloxane. In yet another example, the material of the first antifouling layer 320 may include both fluorocarbon resin and siloxane. Thus, by utilizing materials with low surface energy such as fluorocarbon resin and / or siloxane, the first antifouling layer 320 can possess superior hydrophobicity and oleophobicity.

[0099] In some alternative embodiments, the first antifouling layer 320 may be formed by spraying. For example, the thickness of the first antifouling layer 320 may be on the order of micrometers.

[0100] In some examples, the thickness of the first antifouling layer 320 can be between 5 μm and 30 μm. For example, the thickness of the first antifouling layer 320 can be, but is not limited to, 5 μm, 10 μm, 15 μm, 20 μm, and 30 μm.

[0101] Through the above embodiments, a first anti-fouling layer 320 is provided on the surface of the hole wall of the first mesh 301 of the heat dissipation structure 300. This layer has hydrophobicity and / or oleophobicity, thereby giving the surface of the hole wall of the first mesh 301 a low surface energy, effectively preventing dust, oil stains, water stains and other contaminants from clogging the first mesh 301. For example, if the heat dissipation structure 300 is used as the housing of the electronic device 1000, it can also effectively prevent contaminants from entering the interior of the electronic device 1000, ensuring the ventilation capacity of the first mesh 301, thereby ensuring the heat dissipation effect of the heat dissipation structure 300 on the electronic device 1000.

[0102] Furthermore, the design of the first mesh 301 and the first anti-fouling layer 320 enables the heat dissipation structure 300 to have the effect of weak adhesion to contaminants, easy removal of contaminants, and easy cleaning. For example, in the electronic device 1000, the heat dissipation structure 300 can be repeatedly disassembled, thereby facilitating the cleaning of contaminants. As another example, the electronic device 1000 has waterproof properties, allowing the heat dissipation structure 300 to be directly rinsed to clean contaminants.

[0103] Figure 8 is another partial cross-sectional view of the heat dissipation structure 300 of the embodiment shown in Figure 5 along the “AA’” direction.

[0104] In some optional embodiments, as shown in FIG8, the heat dissipation structure 300 further includes a second substrate layer 330. The second substrate layer 330 is opposite to the first substrate layer 310 and has a gap. Thus, mesh holes can be provided in the second substrate layer 330, and the double-layer mesh holes enhance the heat dissipation structure 300's ability to block contaminants.

[0105] In some optional embodiments, the spacing between the second substrate layer 330 and the first substrate layer 310 is equal everywhere. Taking Figure 8 as an example, if the heat dissipation structure 300 is a lens cover, the first substrate layer 310 and the second substrate layer 330 are located on the side of the lens cover, or in other words, the first substrate layer 310 and the second substrate layer 330 are located in the ring portion 32 of the lens cover.

[0106] In some examples, the shape of the first substrate layer 310 and the shape of the second substrate layer 330 can be parallel arc surfaces. The first substrate layer 310 can intersect and connect with the face 31 of the lens cover, and the second substrate layer 330 can intersect and connect with the face 31 of the lens cover.

[0107] In some other examples, the shape of the first substrate layer 310 and the shape of the second substrate layer 330 can be mutually parallel planes, for example, the heat dissipation structure 300 is the rear cover of the device.

[0108] In this embodiment, the second substrate layer 330 has a second mesh area 331, which is opposite to the first mesh area 311. The second mesh area 331 is provided with a second mesh 302, which penetrates the wall thickness direction of the second substrate layer 330.

[0109] In some optional embodiments, the orthographic projection of the second mesh region 331 onto the first substrate layer 310 may overlap with the first mesh region 311. For example, the orthographic projection of the second mesh region 331 onto the first substrate layer 310 may also coincide with the first mesh region 311.

[0110] Through the above embodiments, a double-layer mesh is achieved using the first substrate layer 310 and the second substrate layer 330, thereby ensuring the ventilation of the mesh of the heat dissipation structure 300 while enhancing its ability to block contaminants. For example, if the heat dissipation structure 300 is used as the housing of an electronic device 1000, the double-layer mesh can more effectively prevent contaminants from entering the interior of the electronic device 1000.

[0111] Figure 9 is a diagram of the mesh opening at "C" of the heat dissipation structure 300 in the embodiment shown in Figure 8.

[0112] In some optional embodiments, as shown in FIG9, the orthographic projection of the first mesh 301 on the second substrate layer 330 does not coincide with the second mesh 302. Therefore, the second substrate layer 330 can be better utilized to shield the first mesh 301, further enhancing the blocking ability of the double-layer mesh against pollutants.

[0113] For example, the orthographic projection of the first mesh 301 onto the second substrate layer 330 can overlap with but not coincide with the second mesh 302. Thus, the ventilation of the double-layer mesh is ensured to a certain extent, while also serving to block pollutants.

[0114] In some alternative embodiments, as shown in FIG9, the orthographic projection of the second mesh 302 on the first substrate layer 310 does not coincide with the second mesh 302. Therefore, the first substrate layer 310 can be used more effectively to shield the second mesh 302.

[0115] For example, the orthographic projection of the second mesh 302 onto the first substrate layer 310 can overlap with but not coincide with the first mesh 301.

[0116] In some alternative embodiments, as shown in FIG9, the heat dissipation structure 300 further includes a second anti-fouling layer 340.

[0117] In this embodiment of the application, the second antifouling layer 340 is disposed on the surface of the hole wall of the second mesh 302, and the second antifouling layer 340 has hydrophobic and / or oleophobic properties.

[0118] Through the above embodiments, the second anti-fouling layer 340 can be used to improve the anti-fouling ability of the second mesh 302.

[0119] In some optional embodiments, the second antifouling layer 340 is made of the same material as the first antifouling layer 320. For example, the second antifouling layer 340 and the first antifouling layer 320 may be manufactured simultaneously.

[0120] In some optional embodiments, an antifouling layer may also be provided between the first substrate layer 310 and the second substrate layer 330, thereby reducing contaminants trapped in the gap between the first substrate layer 310 and the second substrate layer 330.

[0121] In the first example, the first antifouling layer 320 is also provided on the surface of the first substrate layer 310 facing the second substrate layer 330, and the surface of the second substrate layer 330 facing the first substrate layer 310 is not provided with an antifouling layer.

[0122] In the second example, the second antifouling layer 340 is also provided on the surface of the second substrate layer 330 facing the first substrate layer 310, and the surface of the first substrate layer 310 facing the second substrate layer 330 is not provided with an antifouling layer.

[0123] In the third example, the first antifouling layer 320 is disposed on the surface of the first substrate layer 310 facing the second substrate layer 330, and the second antifouling layer 340 is disposed on the surface of the second substrate layer 330 facing the first substrate layer 310.

[0124] Through the above embodiments, in the design of the double-layer mesh, the anti-fouling layer is provided on the inner side of the first substrate layer 310 and / or the second substrate layer 330, which can help avoid the accumulation of pollutants between the first substrate layer 310 and the second substrate layer 330, partially or completely avoid pollutants from clogging the first mesh 301 or the second mesh 302, and ensure the ventilation of the mesh of the heat dissipation structure 300.

[0125] In some optional embodiments, an anti-fouling layer may also be provided on one side of the first substrate layer 310 and the second substrate layer 330 in the heat dissipation structure 300. For example, if the heat dissipation structure 300 is used for heat dissipation of the electronic device 1000, the anti-fouling layer may be provided on the side of the heat dissipation structure 300 facing the inside of the electronic device 1000, thereby reducing contaminants retained inside the electronic device 1000. Alternatively, the side of the heat dissipation structure 300 facing the outside of the electronic device 1000 may not have an anti-fouling layer, thereby improving the uniformity of the appearance of the electronic device 1000 and maintaining a better appearance and feel.

[0126] In some alternative embodiments, the first anti-fouling layer 320 may also be disposed on the surface of the first substrate layer 310 facing away from the second substrate layer 330. For example, if the heat dissipation structure 300 is used for heat dissipation of the electronic device 1000, the first substrate layer 310 may be located on the side of the second substrate layer 330 facing the interior of the electronic device 1000.

[0127] In some alternative embodiments, the second anti-fouling layer 340 is also disposed on the surface of the second substrate layer 330 facing away from the first substrate layer 310. For example, if the heat dissipation structure 300 is used for heat dissipation of the electronic device 1000, the second substrate layer 330 may be located on the side of the first substrate layer 310 facing the interior of the electronic device 1000.

[0128] Through the above embodiments, in the design of the double-layer mesh, setting an anti-fouling layer on one side of the double-layer mesh can better adapt to the application scenarios of the heat dissipation structure 300. For example, when the heat dissipation structure 300 encloses the heat dissipation channel 201, setting an anti-fouling layer on the side of the heat dissipation structure 300 facing the heat dissipation channel 201 can partially or completely prevent contaminants from clogging the heat dissipation channel 201, ensuring the ventilation of the heat dissipation channel 201. As another example, when the heat dissipation structure 300 serves as the outer shell of the electronic device 1000, setting an anti-fouling layer on the side of the heat dissipation structure 300 facing the inside of the electronic device 1000 can partially or completely prevent contaminants from remaining inside the electronic device 1000. The side of the heat dissipation structure 300 facing the outside of the electronic device 1000 does not need an anti-fouling layer, and the electronic device 1000 can still maintain a good appearance, texture, and feel.

[0129] In some alternative embodiments, in a single-layer mesh design, the first anti-fouling layer 320 may also be disposed on one side of the first substrate layer 310. For example, if the heat dissipation structure 300 is used for heat dissipation of the electronic device 1000, the first anti-fouling layer 320 may be located on the side of the first substrate layer 310 facing the interior of the electronic device 1000.

[0130] This application provides an electronic device 1000, which includes an internal structural component 100, a fan 200, and a heat dissipation structural component 300 as described in any of the above embodiments.

[0131] In some alternative embodiments, the internal structural member 100 and the heat dissipation structural member 300 together enclose the channel 201. The first mesh area 311 is located at the entrance and / or exit of the channel 201.

[0132] For example, fan 200 may be an intake fan 200 located at the entrance of channel 201. Alternatively, fan 200 may also be an exhaust fan 200 located at the exit of channel 201.

[0133] In some alternative embodiments, the first mesh area 311 includes an air intake area 3111 located at the entrance of the channel 201, and the fan 200 is configured to allow air to enter the channel 201 through the first mesh 301 of the air intake area 3111.

[0134] In some alternative embodiments, the first mesh area 311 includes an air outlet area 3112 located at the outlet of the channel 201, and the fan 200 is configured to allow air to exit the channel 201 through the first mesh 301 of the air outlet area 3112.

[0135] For example, the first mesh area 311 may include both an air inlet area 3111 and an air outlet area 3112, so that the inlet and outlet of the channel 201 are provided with the first mesh 301, thereby reducing or avoiding the entry of pollutants into the channel 201 to a greater extent.

[0136] For example, the air inlet of the fan 200 is connected to the first mesh 301 of the air inlet area 3111, and the air outlet of the fan 200 is connected to the first mesh 301 of the air outlet area 3112.

[0137] In some alternative embodiments, taking the electronic device 1000 as a mobile phone or tablet computer as an example, the heat dissipation structure 300 includes, but is not limited to, at least one of a lens cover, a rear cover, and a frame. For example, the frame may be part of the mid-frame 500.

[0138] In some optional embodiments, the heat dissipation structure 300 and the internal structure 100 may also be an integral structure. For example, the heat dissipation structure 300 and the internal structure 100 are both the middle frame 500 of the electronic device 1000, that is, the frame structure of the electronic device 1000, and the inlet and outlet of the channel 201 may be set on the edge of the electronic device 1000.

[0139] In some optional embodiments, the heat dissipation structure 300 can be a combination of multiple sub-components. For example, the heat dissipation structure 300 includes both a lens cover and a rear cover. This increases the heat dissipation area of ​​the electronic device 1000, enhances the heat dissipation effect of the heat dissipation structure 300, and also separates the first mesh 301 of the inlet and outlet of the channel 201, reducing the manufacturing difficulty of the electronic device 1000.

[0140] For example, the heat dissipation structure 300 may include both a lens cover and a rear cover. A portion of the first mesh 301 may serve as the entrance to the channel 201, and this portion of the first mesh 301 may be located on the lens cover. The remaining portion of the first mesh 301 may serve as the exit from the channel 201, and this portion of the first mesh 301 may be located on the rear cover.

[0141] For example, the heat dissipation structure 300 may also include a rear cover and a frame. Some of the first mesh holes 301 can serve as inlets for the channel 201, and these first mesh holes 301 can be located on the rear cover. The remaining first mesh holes 301 can serve as outlets for the channel 201, and these first mesh holes 301 can be located on the frame.

[0142] Through the above embodiments, the electronic device 1000 utilizes the heat dissipation structure 300 and the internal structure 100 to jointly enclose the channel 201, and uses the fan 200 to drive the air, accelerating the ventilation inside the electronic device 1000. The external air carries away the heat inside the electronic device 1000, effectively improving its heat dissipation and cooling capacity, and helping it maintain high-performance operation for extended periods. For example, the electronic device 1000 can be a mobile phone or tablet computer, capable of maintaining high-performance operation for long periods, meeting the needs of high-power consumption scenarios such as e-sports. The first mesh 301 of the heat dissipation structure 300 is located at the entrance and / or exit of the channel 201, allowing air to pass through. The mesh design not only prevents larger contaminants from entering the interior of the electronic device 1000, but also utilizes the first anti-fouling layer 320 on the surface of the mesh wall to reduce the adhesion of dust, oil, water, and other contaminants, preventing contaminants from clogging the first mesh 301, ensuring the ventilation capacity of the channel 201, and further guaranteeing the heat dissipation effect of the electronic device 1000.

[0143] In some optional embodiments, the first antifouling layer 320 is also disposed on the surface of the first substrate layer 310 facing the channel 201. This reduces or prevents the adhesion of contaminants to the inner surface of the channel 201, improves or solves the problem of contaminant retention within the channel 201, and better ensures the ventilation capacity of the channel 201.

[0144] In some optional embodiments, if the heat dissipation structure 300 adopts the above-mentioned double-layer mesh design, the second substrate layer 330 can be located on the side of the first substrate layer 310 away from the channel 201, and the first anti-fouling layer 320 is also disposed on the surface of the first substrate layer 310 facing the channel 201.

[0145] In some optional embodiments, the aperture of the first mesh 301 in the air intake zone 3111 is smaller than the aperture of the first mesh 301 in the air outlet zone 3112. Through this embodiment, the first mesh 301 of the air intake zone 3111 blocks some pollutants. Even if some pollutants enter the channel 201, the size of these pollutants is smaller than the aperture of the first mesh 301 in the air intake zone 3111. Therefore, these pollutants can quickly pass through the first mesh 301 in the air outlet zone 3112 and leave the channel 201, further improving or solving the problem of pollutants remaining in the channel 201 and ensuring the ventilation capacity of the channel 201.

[0146] Figure 10 is a structural diagram of a heat dissipation device 2000 provided in an embodiment of this application.

[0147] This application provides a heat dissipation device 2000, as shown in FIG10. The heat dissipation device 2000 includes a fan 200 (not shown in FIG10, but can be referred to the fan 200 in FIG2) and a heat dissipation structure 300 in any of the above embodiments.

[0148] Referring to the above embodiments, in this embodiment of the application, the heat dissipation structure 300 can enclose a channel 201 (not shown in Figure 10, but refer to the channel 201 in Figure 2), and the first mesh area 311 is located at the entrance and / or exit of the channel 201.

[0149] In some alternative embodiments, as shown in FIG10, the first mesh area 311 includes an air intake area 3111 located at the entrance of the channel 201, and the fan 200 is configured to allow air to enter the channel 201 through the first mesh 301 of the air intake area 3111.

[0150] In some alternative embodiments, as shown in FIG10, the first mesh area 311 includes an air outlet area 3112 located at the outlet of the channel 201, and the fan 200 is configured to allow air to exit the channel 201 through the first mesh 301 of the air outlet area 3112.

[0151] For example, the material of the heat dissipation structure 300 may include metal.

[0152] Through the above embodiments, the heat dissipation structure 300 forms a channel 201, which allows for air exchange between the inside and outside of the heat dissipation device 2000, thereby achieving heat dissipation and cooling. The heat dissipation device 2000 can be used to dissipate heat and cool the electronic device 1000. For example, the heat dissipation device 2000 can be used as an external device of the electronic device 1000, and it can be used in close contact with the housing of the electronic device 1000 to achieve heat dissipation and cooling of the electronic device 1000, helping the electronic device 1000 maintain a high-performance operating state for a long time.

[0153] Figure 11 is a flowchart of the manufacturing method of the heat dissipation structure 300 in the embodiment shown in Figure 4.

[0154] This application provides a method for manufacturing a heat dissipation structure 300, as shown in Figure 11. The method includes:

[0155] Step S51: Provide a first substrate layer 310, the first substrate layer 310 having a first mesh 301, the first mesh 301 penetrating through the wall thickness direction of the first substrate layer 310.

[0156] Step S52: A first antifouling layer 320 is formed on the surface of the hole wall of the first mesh 301. The first antifouling layer 320 has hydrophobicity and / or oleophobicity.

[0157] Figure 12 is a process diagram of the manufacturing of the heat dissipation structure 300 of the embodiment shown in Figure 4.

[0158] In some alternative embodiments, a fixture 800 as shown in FIG12 can be used to shield one side of the first substrate layer 310 along the opening direction of the first mesh 301, and spray coating can be performed from the opposite side of the first substrate layer 310 to form a first anti-fouling layer 320 on the surface of the hole wall of the first mesh 301.

[0159] In some examples, the first substrate layer 310 is shielded on one side along the opening direction of the first mesh 301 using a jig 800 as shown in Figure 12, and spraying is performed from the opposite side of the first substrate layer 310. A first anti-fouling layer 320 can also be formed on the surface of the first substrate layer 310 on that side.

[0160] In some examples, the first substrate layer 310 can be divided into different regions, thereby allowing the jig 800 to partially occlude the first substrate layer 310.

[0161] For ease of illustration, some of the accompanying diagrams depict the XYZ coordinate system to represent directions. For example, X can represent the first direction, Y can represent the second direction, and Z can represent the third direction.

[0162] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Furthermore, with the evolution of architectures and the emergence of new scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

Claims

1. A heat dissipation structural component, characterized in that, The heat dissipation structure includes: A first substrate layer has a first mesh area, wherein the first mesh area is provided with a first mesh, and the first mesh extends through the wall thickness direction of the first substrate layer; A first antifouling layer is disposed on the surface of the hole wall of the first mesh; the first antifouling layer has hydrophobic and / or oleophobic properties.

2. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure also includes a second substrate layer; The second substrate layer is opposite to the first substrate layer and has a gap; the second substrate layer has a second mesh area, which is opposite to the first mesh area, and the second mesh area is provided with a second mesh, which penetrates through the wall thickness direction of the second substrate layer.

3. The heat dissipation structure according to claim 2, characterized in that, The orthographic projection of the first mesh onto the second substrate layer does not coincide with the second mesh.

4. The heat dissipation structure according to claim 2 or 3, characterized in that, The heat dissipation structure further includes a second anti-fouling layer; the second anti-fouling layer is disposed on the surface of the hole wall of the second mesh, and the second anti-fouling layer has hydrophobic and / or oleophobic properties.

5. The heat dissipation structure according to claim 4, characterized in that, The first antifouling layer is also disposed on the surface of the first substrate layer facing the second substrate layer; And / or, The second antifouling layer is also disposed on the surface of the second substrate layer facing the first substrate layer.

6. The heat dissipation structure according to claim 4 or 5, characterized in that, The first antifouling layer is also disposed on the surface of the first substrate layer on the side opposite to the second substrate layer; or, The second antifouling layer is also disposed on the surface of the second substrate layer on the side opposite to the first substrate layer.

7. The heat dissipation structure according to any one of claims 1 to 6, characterized in that, The water contact angle of the first antifouling layer is θ, and the oil contact angle of the first antifouling layer is φ; wherein, θ ≥ 110°, and / or, φ ≥ 60°.

8. The heat dissipation structure according to any one of claims 1 to 7, characterized in that, The material of the first antifouling layer includes fluorocarbon resin and / or siloxane.

9. An electronic device, characterized in that, The electronic device includes: Internal structural components; The heat dissipation structure as described in any one of claims 1 to 8; the internal structure and the heat dissipation structure together enclose a channel; the first mesh area is located at the entrance and / or exit of the channel; fan; The first mesh area includes an air intake area located at the entrance of the channel, and the fan is configured to allow air to enter the channel through the first mesh of the air intake area; and / or, the first mesh area includes an air outlet area located at the exit of the channel, and the fan is configured to allow air to leave the channel through the first mesh of the air outlet area.

10. The electronic device according to claim 9, characterized in that, The electronic device also includes any one of the following: camera module, battery module, shielding cover, mid-frame, rear cover, lens cover, and frame; The internal structural components include any one of the camera module, the battery module, the shielding cover, and the middle frame; The heat dissipation structure includes any one of the rear cover, the lens cover, and the frame.

11. The electronic device according to claim 9 or 10, characterized in that, The first antifouling layer is also disposed on the surface of the first substrate layer facing the channel.

12. The electronic device according to any one of claims 9 to 11, characterized in that, The aperture of the first mesh in the air intake area is smaller than the aperture of the first mesh in the air outlet area.

13. A heat dissipation device, characterized in that, The heat dissipation device includes: The heat dissipation structure as described in any one of claims 1 to 8; the heat dissipation structure encloses a channel; fan; The first mesh area includes an air intake area located at the entrance of the channel, and the fan is configured to allow air to enter the channel through the first mesh of the air intake area; and / or, the first mesh area includes an air outlet area located at the exit of the channel, and the fan is configured to allow air to leave the channel through the first mesh of the air outlet area.

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