Easy-open sealing gasket

Abstract

Disclosed in the present invention is an easy-open sealing gasket, comprising an upper layer, a bonding layer and an adhesive sealing composite layer laminated in sequence from top to bottom. The upper layer comprises a surface film. The adhesive sealing composite layer comprises a lower bonding film, an electromagnetic induction heating layer and an adhesive sealing layer laminated in sequence from top to bottom. The bonding layer comprises a bonding adhesive; the bonding layer bonds the upper layer and the adhesive sealing composite layer via the bonding adhesive, and forms an unbonded area between the upper layer and the adhesive sealing composite layer. The present invention has the advantage of easy opening.

Description

Easy-open sealing gasket Technical Field

[0001] This invention relates to the field of sealing gaskets, and in particular to an easy-open sealing gasket. Background Technology

[0002] To prevent the contents of packaging containers (such as beverage cans and medicine cans) from leaking out and deteriorating due to external environmental influences, sealing gaskets are used to seal the opening of the packaging containers. By using sealing gaskets to tightly seal the opening of the containers, the contents can be prevented from leaking out and can be sealed and preserved.

[0003] However, conventional sealing gaskets are designed primarily for sealing, without considering ease of opening. In this case, the aluminum foil or cardboard sealing gaskets used to close the container opening are not easy to open with fingers, and cutting with a knife or poking with an awl is both troublesome and dangerous, causing inconvenience to users.

[0004] In view of the above problems, it is necessary to study an easy-open sealing gasket that has the advantage of being easy to open. Summary of the Invention

[0005] The purpose of this invention is to provide an easy-open sealing gasket, which has the advantage of being easy to open.

[0006] To achieve the above objectives, the solution of the present invention is:

[0007] An easy-open sealing gasket includes an upper layer, a connecting layer, and an adhesive sealing composite layer sequentially laminated from top to bottom; the upper layer includes a surface film; the adhesive sealing composite layer includes a lower connecting film, an electromagnetic induction heating layer, and an adhesive sealing layer sequentially laminated from top to bottom; the connecting layer includes a connecting adhesive, which laminates the upper layer and the adhesive sealing composite layer together, and forms an unbonded area between the upper layer and the adhesive sealing composite layer.

[0008] The cross-sectional width of the adhesive coating area of ​​the bonding layer is greater than or equal to one-sixth of the cross-sectional width of the easy-open sealing gasket, and the cross-sectional width of the adhesive coating area is less than or equal to five-sixths of the cross-sectional width of the easy-open sealing gasket.

[0009] The bonding layer also includes an interlayer and a coating layer; the interlayer is disposed in the unbonded area and is bonded to the upper layer by a composite adhesive; the interlayer includes at least one of PET film, PP film, PA film, PEN film and PI film, and the thickness of the interlayer is 12 to 24 µm; the coating layer is applied to the lower surface of the interlayer, the coating layer is made of varnish or silicone oil, and the thickness of the coating layer is 0.5 to 20 µm.

[0010] The composite adhesive is a dry composite adhesive or a hot melt laminate. The hot melt laminate is made of one of the following materials: PE, PP, EMAC, EMAA, EEA, EAA, and EMMA. The thickness of the hot melt laminate is 4 to 60 µm.

[0011] The bonding layer also includes an interlayer and a coating layer; the interlayer is disposed in the unbonded area and is bonded to the sealing composite layer by a composite adhesive; the interlayer includes at least one of PET film, PP film, PA film, PEN film and PI film, and the thickness of the interlayer is 12 to 24 µm; the coating layer is applied to the upper surface of the interlayer, the coating layer is made of varnish or silicone oil, and the thickness of the coating layer is 0.5 to 20 µm.

[0012] The bonding layer also includes a coating layer, which is applied to the lower surface of the upper layer or the upper surface of the adhesive composite layer. The coating layer is made of varnish or silicone oil and has a thickness of 0.5 to 20 µm.

[0013] The coating layer is applied in either a full-area coating or a dot-area coating method.

[0014] The cross-sectional width of the coating area of ​​the coating layer is greater than or equal to one-sixth of the cross-sectional width of the easy-open sealing gasket, and the cross-sectional width of the coating area of ​​the coating layer is less than or equal to five-sixths of the cross-sectional width of the easy-open sealing gasket.

[0015] The lower connecting membrane includes at least one of PE membrane, PP membrane, PET membrane, PA membrane, EPP membrane and EPE membrane, and the thickness of the lower connecting membrane is 12 to 200 µm.

[0016] The upper layer also includes an upper connecting membrane disposed below the surface membrane; the upper connecting membrane includes at least one of PE membrane, PP membrane, PA membrane, EMMA membrane and EMAC membrane, and the thickness of the upper connecting membrane is 12 to 100 µm.

[0017] The adhesive composite layer also includes a thickening layer disposed above the electromagnetic induction heating layer. The thickening layer includes at least one of EPE layer, EPP layer, PE layer, PP layer and paper, and the thickness of the thickening layer is 60 to 2000 µm.

[0018] The sealing composite layer also includes a composite film, which is disposed above the electromagnetic induction heating layer. The composite film includes at least one of PET film, PEN film, PP film, PA film and PE film, and the thickness of the composite film is 12 to 100 µm.

[0019] The adhesive is a dry composite adhesive or a hot melt laminate. The hot melt laminate is made of one of the following materials: PE, PP, EMAC, EMAA, EEA, EAA, and EMMA. The thickness of the hot melt laminate is 4 to 60 µm.

[0020] The surface film includes at least one of PP film, PET film, PE film, PA film, PEN film, PI film and EMAC film, and the thickness of the surface film is 12 to 150 µm.

[0021] The sealing layer is a hot melt adhesive, which is made of one of the following materials: EVA, PIB, EBA, EAA, EMAA, EMAC, acrylic copolymer and polyacrylate. The thickness of the hot melt adhesive is 4 to 100 µm.

[0022] The sealing layer includes a sealing film and an adhesive. The sealing film is at least one of PE film, PP film, PA film, PVDC film, EVOH film and PET film. The adhesive is disposed between the sealing film and the electromagnetic induction heating layer.

[0023] The electromagnetic induction heating layer is made of aluminum foil.

[0024] The electromagnetic induction heating layer uses a wireless information integrated chip; the wireless information integrated chip includes a base film, an information and heating layer and a first adhesive layer; the information and heating layer includes an information area and an electromagnetic induction heating ring; the information area has an antenna and a chip that are mutually connected, the electromagnetic induction heating ring surrounds the information area, and the first adhesive layer is located between the base film and the information and heating layer.

[0025] The wireless information integrated sheet also includes a protective layer and a second adhesive layer. The protective layer is located on the side of the information and heating layer away from the base film, and the second adhesive layer is located between the information and heating layer and the protective layer.

[0026] There is a gap between the electromagnetic induction heating ring and the information area.

[0027] The distance between the electromagnetic induction heating ring and the information area is 0.1mm to 3mm.

[0028] The electromagnetic induction heating ring and the information area are filled with gaps.

[0029] The information and heating layer also includes at least one physical connection bridge that connects the information area to the electromagnetic induction heating ring.

[0030] The adhesive binds to ensure that the peel strength between the upper layer and the adhesive-sealed composite layer is greater than or equal to 17.8 N / 15 mm.

[0031] After adopting the above solution, the easy-open sealing gasket of the present invention forms an unbonded area between the upper layer and the adhesive composite layer. In this way, the user can easily peel off the part of the easy-open sealing gasket of the present invention above the unbonded area, and easily tear off the easy-open sealing gasket of the present invention by applying force to the part above the unbonded area, thereby having the advantage of being easy to open. Attached Figure Description

[0032] Figure 1 is a schematic diagram of the structure of the easy-open sealing gasket of Embodiment 1 of the present invention.

[0033] Figure 2 is a schematic diagram of the use of the easy-open sealing gasket of Embodiment 1 of the present invention.

[0034] Figure 3 is a structural schematic diagram of the easy-open sealing gasket of Embodiment 2 of the present invention.

[0035] Figure 4 is a schematic diagram of the use of the easy-open sealing gasket according to Embodiment 2 of the present invention.

[0036] Figure 5 is a structural schematic diagram of the easy-open sealing gasket of Embodiment 3 of the present invention.

[0037] Figure 6 is a structural schematic diagram of the easy-open sealing gasket of Embodiment 4 of the present invention.

[0038] Figure 7 is a structural schematic diagram of the easy-open sealing gasket of Embodiment 5 of the present invention.

[0039] Figure 8 is a structural schematic diagram of the easy-open sealing gasket of Embodiment 6 of the present invention.

[0040] Figure 9 is a structural schematic diagram of the easy-open sealing gasket of Embodiment 7 of the present invention.

[0041] Figure 10 is a structural schematic diagram of the easy-open sealing gasket of Embodiment 8 of the present invention.

[0042] Figure 11 is a cross-sectional schematic diagram of the first embodiment of the wireless information integration chip of the present invention.

[0043] Figure 12 is a planar schematic diagram of the information and heating layer of the first embodiment of the wireless information integration chip of the present invention.

[0044] Figure 13 is a plan view of the information area of ​​the first embodiment of the wireless information integration chip of the present invention.

[0045] Figure 14 is a cross-sectional schematic diagram of a second embodiment of the wireless information integration chip of the present invention.

[0046] Figure 15 is a planar schematic diagram of the information and heating layer of the third embodiment of the wireless information integration chip of the present invention.

[0047] Figure 16 is a plan view of the information area of ​​the third embodiment of the wireless information integration chip of the present invention. Reference numerals:

[0048] Upper layer 100, surface film 110, upper connecting film 120,

[0049] Connecting layer 200, bonding adhesive 210, composite adhesive 220, interlayer 230A, coating layer 230B

[0050] Adhesive composite layer 300, electromagnetic induction heating layer 310, adhesive layer 320, adhesive film 321, adhesive 322, lower connecting film 330, composite film 340, thickening layer 350.

[0051] Adhesive a,

[0052] Void region SA,

[0053] Unbonded area UA.

[0054] Base film 1W, first adhesive layer 2W, information and heating layer 3W, information area 31W, chip 311W, antenna 312W, electromagnetic induction heating ring 32W, physical connection bridge 33W, second adhesive layer 4W, protective layer 5W, spacer ITV. Embodiments of the present invention

[0055] To further explain the technical solution of the present invention, the present invention will be described in detail below through specific embodiments.

[0056] Example 1:

[0057] As shown in Figures 1 and 2, in Embodiment 1 of the present invention, the easy-open sealing gasket of the present invention includes an upper layer 100, a connecting layer 200, and an adhesive composite layer 300 sequentially laminated from top to bottom; wherein, the upper layer 100 includes a surface film 110, the connecting layer 200 includes a connecting adhesive 210, and the adhesive composite layer 300 includes a lower connecting film 330, an electromagnetic induction heating layer 310, and an adhesive layer 320 sequentially laminated from top to bottom.

[0058] In Embodiment 1 of the present invention, the upper layer 100 is disposed on the topmost layer of the easy-open sealing gasket of the present invention. Referring to Figure 1, the upper layer 100 includes a surface film 110, which serves as the topmost layer (i.e., the surface layer) of the easy-open sealing gasket of the present invention. The upper and / or lower surfaces of the surface film 110 can be printed surfaces, which can be used to print different patterns. The surface film 110 includes at least one of PP film, PET film, PE film, PA film, PEN film, PI film, and EMAC film; the thickness of the surface film 110 is preferably 12 to 150 µm, within which range the tensile strength is high, the surface is smooth, and the gloss is good; furthermore, when the bottom of the easy-open sealing gasket of the present invention experiences heat conduction, the surface film 110 can be prevented from sticking to other external components (e.g., bottle caps).

[0059] In Embodiment 1 of the present invention, a connecting layer 200 is disposed between the upper layer 100 and the adhesive composite layer 300. As shown in FIG. 1, the connecting layer 200 includes a connecting adhesive 210, and the connecting layer 200, through the connecting adhesive 210, bonds the upper layer 100 and the adhesive composite layer 300 together, forming an unbonded area UA between the upper layer 100 and the adhesive composite layer 300. This ensures that a portion of the area between the upper layer 100 and the adhesive composite layer 300 is separated from each other (i.e., not completely bonded), allowing the user to easily peel off the easy-open sealing gasket of the present invention by hand without the aid of external objects. The easy-open sealing gasket of the present invention, through the connecting adhesive 210, ensures that the peel strength between the upper layer 100 and the adhesive composite layer 300 is greater than or equal to 17.8 N / 15 mm, thereby firmly bonding the upper layer 100 and the adhesive composite layer 300 together. The bonding adhesive 210 may be, but is not limited to, an adhesive that enables a peel strength between the upper layer 100 and the adhesive composite layer 300 to be greater than or equal to 17.8 N / 15 mm. The bonding adhesive 210 may also be a dry laminating adhesive or a hot melt laminating adhesive, wherein the material of the hot melt laminating adhesive is one of PE, PP, EMAC, EMAA, EEA, EAA, and EMMA, and the thickness of the hot melt laminating adhesive is preferably 4 to 60 µm.

[0060] In Embodiment 1 of the present invention, the adhesive-sealing composite layer 300 is disposed at the bottom layer of the easy-open sealing gasket of the present invention. As shown in Figure 1, the adhesive-sealing composite layer 300 includes, from top to bottom, a lower connecting film 330, an electromagnetic induction heating layer 310, and an adhesive layer 320. The electromagnetic induction heating layer 310 can be aluminum foil, a structure already present in conventional sealing gaskets. The thickness of the aluminum foil is preferably 10 to 40 µm, thereby enhancing the barrier function against moisture and oxygen, producing the effect of preventing leakage of contents and sealing and preserving the contents. The electromagnetic induction heating layer 310 can also be a wireless information integration chip, which increases the function of wireless information transmission, reduces aluminum foil material waste, lowers energy consumption, avoids manpower waste, avoids interference from metals and liquids, improves production efficiency, provides good communication performance and significantly increases communication distance, greatly enhancing the automation, digitalization, and intelligent development of factories, warehouses, logistics, shops, and unmanned checkout management. The thickness of the wireless information integration chip is preferably 27µm to 2.5mm.

[0061] In Embodiment 1 of the present invention, the sealing layer 320 is mainly used to seal the container opening, and the sealing layer 320 can be a hot melt adhesive. The hot melt adhesive is one of EVA, PIB, EBA, EAA, EMAC, polyacrylate, acrylic copolymer, and EMAA, chosen for its ease of opening after electromagnetic induction sealing or its ability to be easily and cleanly opened from the bottle opening, but is not limited to these. The thickness of the hot melt adhesive is preferably 4 to 100 µm. The hot melt adhesive can achieve a continuous sealing effect even when the contents of the glass container contain water, and can also achieve a continuous sealing effect even when the contents of the glass container contain chili peppers, garlic, fermented bean curd, honey, or spicy additives.

[0062] In Embodiment 1 of the present invention, the lower connecting film 330 is disposed above the electromagnetic induction heating layer 310. The lower connecting film 330 can be directly laminated above the electromagnetic induction heating layer 310, or it can be indirectly laminated above the electromagnetic induction heating layer 310 (i.e., other structures are disposed between the lower connecting film 330 and the electromagnetic induction heating layer 310). As shown in FIG1, the lower connecting film 330 is disposed on the uppermost layer of the adhesive composite layer 300. The lower connecting film 330 is used for lamination with the upper layer 100, and the lower connecting film 330 is laminated with the surface film 110 of the upper layer 100 through the adhesive 210. The lower connecting film 330 includes at least one of PE film, PP film, PET film, PA film, EPP film, and EPE film. The thickness of the lower connecting film 330 is preferably 12 to 200 µm, thereby improving the peel strength after lamination between the lower connecting film 330 and the upper layer 100.

[0063] In Embodiment 1 of the present invention, when the easy-open sealing gasket of the present invention seals the opening of the packaging container, it not only prevents the contents from leaking out and deteriorating due to the influence of the external environment, but also allows the user to easily open the container opening by directly pinching the easy-open sealing gasket of the present invention above the unbonded area UA without the aid of external objects, thereby achieving the effect of easy opening.

[0064] In Embodiment 1 of the present invention, the cross-sectional width W1 of the coating area of ​​the adhesive 210 can be greater than or equal to one-sixth of the cross-sectional width W2 of the easy-open sealing gasket of the present invention, and the cross-sectional width W1 of the coating area of ​​the adhesive 210 can be less than or equal to five-sixths of the cross-sectional width W2 of the easy-open sealing gasket of the present invention. This allows manufacturers to adjust the coating area of ​​the adhesive 210 according to actual needs, thereby further increasing the manufacturer's design flexibility. Furthermore, when the cross-sectional width W2 of the easy-open sealing gasket of the present invention is relatively large, the cross-sectional width W1 of the coating area of ​​the adhesive 210 can be smaller; conversely, when the cross-sectional width W2 of the easy-open sealing gasket of the present invention is relatively small, the cross-sectional width W1 of the coating area of ​​the adhesive 210 can be larger.

[0065] Example 2:

[0066] As shown in Figures 3 and 4, the difference between Embodiment 2 and Embodiment 1 of the present invention is that the easy-open sealing gasket also includes an interlayer 230A and a coating layer 230B.

[0067] Specifically, in Embodiment 2 of the present invention, the interlayer 230A can be disposed in the unbonded area UA; the interlayer 230A is bonded to the upper layer 100 by a composite adhesive 220. The interlayer 230A includes at least one of PET film, PP film, PA film, PEN film, and PI film, and the thickness of the interlayer 230A is preferably 12 to 24 µm; the composite adhesive 220 makes the peel strength between the interlayer 230A and the upper layer 100 greater than or equal to 17.8 N / 15 mm, thereby securing the composite interlayer 230A and the upper layer 100. The composite adhesive 220 can be a bonding adhesive that makes the peel strength between the interlayer 230A and the upper layer 100 greater than or equal to 17.8 N / 15 mm, but is not limited thereto. The composite adhesive 220 can also be a dry laminating adhesive or a hot melt laminating adhesive. The hot melt laminating adhesive can be made of one of PE, PP, EMAC, EMAA, EEA, EAA, and EMMA, and its thickness is preferably 4 to 60 µm. To improve manufacturing convenience, the composite adhesive 220 can be the same as the bonding adhesive 210, meaning that the bonding adhesive 210 and the composite adhesive 220 can be used as the same adhesive and coated simultaneously.

[0068] In Embodiment 2 of the present invention, coating layer 230B can be applied to the lower surface of interlayer 230A. The material of coating layer 230B can be varnish or silicone oil, and the thickness of coating layer 230B is preferably 0.5 to 20 µm. Since coating layer 230B is applied to the lower surface of interlayer 230A, and interlayer 230A is bonded to adhesive composite layer 300 without the use of other adhesives, a gap region SA can exist between coating layer 230B and adhesive composite layer 300. This ensures that a portion of the area between interlayer 230A and adhesive composite layer 300 is separated from each other (i.e., not completely bonded), allowing the user to easily open the easy-open sealing gasket of the present invention by hand without the aid of external objects.

[0069] It should be noted that, with conventional sealing gaskets, as the gap between the electromagnetic induction heating layer 310 and the interlayer 230A becomes thinner, after electromagnetic induction sealing, the interlayer 230A of the conventional sealing gasket often adheres to the film below it, making it difficult for the user to open the interlayer 230A. However, since the lower surface of the interlayer 230A is coated with varnish or silicone oil (i.e., coating layer 230B), the user can easily pry open the interlayer 230A with their fingers, thus ensuring that the user can easily open the easy-open sealing gasket of the present invention by directly pinching the interlayer 230A without the aid of external objects.

[0070] In Embodiment 2 of the present invention, the coating layer 230B can be coated in a full-area or dot-matrix manner, allowing the user to easily pry open the interlayer 230A with their fingers. This ensures that the user can easily open the easy-open sealing gasket of the present invention by directly pinching the interlayer 230A without the aid of external objects. Taking the dot-matrix coating method as an example, after electromagnetic induction sealing, the small amount of air between the dot matrix of dot-matrix coating varnish or silicone oil provided in this invention will be heated and expanded by electromagnetic induction sealing. This will cause the interlayer 230A to be pushed upward, thereby ensuring that the interlayer 230A and the adhesive composite layer 300 are separated from each other, allowing the user to more easily pry open the interlayer 230A with their fingers. This ensures that the user can easily open the easy-open sealing gasket of the present invention by directly pinching the interlayer 230A without the aid of external objects. The cross-sectional width W3 of the coating area of ​​the coating layer 230B can be greater than or equal to one-sixth of the cross-sectional width W2 of the easy-open sealing gasket of the present invention, and the cross-sectional width W3 of the coating area of ​​the coating layer 230B can be less than or equal to five-sixths of the cross-sectional width W2 of the easy-open sealing gasket of the present invention, thereby allowing manufacturers to adjust the coating area of ​​the coating layer 230B according to actual needs, thereby further increasing the manufacturer's design flexibility.

[0071] Example 3:

[0072] As shown in Figure 5, the difference between Embodiment 3 and Embodiment 1 is that the easy-open sealing gasket further includes a coating layer 230B, which is coated on the lower surface of the upper layer 100.

[0073] Specifically, in Embodiment 3 of the present invention, coating layer 230B is applied to the lower surface of the surface film 110 of the upper layer 100; the material of coating layer 230B can be varnish or silicone oil, and the thickness of coating layer 230B is preferably 0.5 to 20 µm. Since a portion of the lower surface of the upper layer 100 is coated with coating layer 230B, and the upper layer 100 is bonded to the adhesive composite layer 300 without the use of other adhesives, a gap region SA can exist between coating layer 230B and adhesive composite layer 300. This ensures that the portion of the area between coating layer 230B and adhesive composite layer 300 is separated from each other (i.e., not completely bonded), allowing the user to easily peel off the easy-open sealing gasket of the present invention by hand without the aid of external objects.

[0074] In Embodiment 3 of the present invention, the coating method of the coating layer 230B can be full-area coating or dot coating. The cross-sectional width W3 of the coating area of ​​the coating layer 230B can be greater than or equal to one-sixth of the cross-sectional width W2 of the easy-open sealing gasket of the present invention, and the cross-sectional width W3 of the coating area of ​​the coating layer 230B can be less than or equal to five-sixths of the cross-sectional width W2 of the easy-open sealing gasket of the present invention.

[0075] Example 4:

[0076] As shown in Figure 6, the difference between Embodiment 4 and Embodiment 1 is that the adhesive composite layer 300 of the easy-open sealing gasket also includes a composite film 340.

[0077] Specifically, in Embodiment 4 of the present invention, the composite film 340 is disposed above the electromagnetic induction heating layer 310. More specifically, the composite film 340 is disposed between the lower connecting film 330 and the electromagnetic induction heating layer 310. The composite film 340 is used to improve the tensile strength of the easy-open sealing gasket of the present invention. The composite film 340 includes at least one of PET film, PP film, PA film and PE film, and the thickness of the composite film 340 is preferably 12 to 100 µm.

[0078] In Embodiment 4 of the present invention, adhesive a can be used to bond the lower connecting membrane 330 and the composite membrane 340, as well as the electromagnetic induction heating layer 310 and the composite membrane 340. Adhesive a can be a composite adhesive that enables the peel strength between the two bonded layers (e.g., the lower connecting membrane 330 and the electromagnetic induction heating layer 310 or the electromagnetic induction heating layer 310 and the composite membrane 340) to be greater than or equal to 4 N / 15 mm, but is not limited thereto.

[0079] In Embodiment 4 of the present invention, the sealing layer 320 includes a sealing film 321 and an adhesive 322, with the adhesive 322 disposed between the sealing film 321 and the electromagnetic induction heating layer 310. The sealing film 321 includes at least one of PE film, PP film, PA film, PVDC film, EVOH film, and PET film, chosen for its ease of removal from the bottle opening after electromagnetic induction sealing or its easy and clean removal from the bottle opening. The thickness of the sealing film 321 is preferably 12 to 100 µm. The adhesive 322 can be, for example, a composite adhesive, but is not limited to this.

[0080] The method for manufacturing the easy-open sealing gasket of Embodiment 4 of the present invention is as follows:

[0081] First, an adhesive is applied to the lower surface of the composite film roll, and the lower surface of the composite film roll is dry-laminated with the upper surface of the electromagnetic induction heating layer roll. The roll is then placed in a curing chamber for more than 24 hours to produce the first composite section roll.

[0082] Secondly, an adhesive is applied to the composite film surface of the first composite section roll, so that the composite film surface of the first composite section roll is dry-laminated with the lower surface of the lower connecting film roll, and then placed in a curing chamber for more than 24 hours to produce the second composite section roll.

[0083] Then, an adhesive is applied to the electromagnetic induction heating layer of the second composite roll, and the electromagnetic induction heating layer of the second composite roll is dry-laminated with the upper surface of the sealing film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the lower composite roll. Alternatively, hot melt adhesive is applied to the electromagnetic induction heating layer of the second composite roll to produce the lower composite roll.

[0084] Next, a bonding adhesive is applied to a designated area on the lower surface of the surface film roll, so that the lower surface of the surface film roll is dry-laminated with the lower bonding film surface of the lower composite roll. The roll is then placed in a curing chamber for more than 24 hours to produce an easy-open sealing gasket roll. The designated area is between one-sixth and five-sixths of the cross-sectional width of the easy-open sealing gasket.

[0085] Finally, cut the easy-open sealing gasket to the appropriate size according to the user's needs.

[0086] Example 5:

[0087] As shown in Figure 7, the difference between Embodiment 5 and Embodiment 2 of the present invention lies in the upper layer 100 and the adhesive composite layer 300.

[0088] In Embodiment 5 of the present invention, the upper layer 100 includes a surface film 110 and an upper connecting film 120, with the upper connecting film 120 disposed below the surface film 110. In other words, the upper connecting film 120 can be directly laminated below the surface film 110, or it can be indirectly laminated below the surface film 110 (i.e., other structures are disposed between the surface film 110 and the upper connecting film 120). The surface film 110 is disposed on the uppermost layer of the upper layer 100; the upper connecting film 120 is disposed on the lowermost layer of the upper layer 100 and is used for lamination with the adhesive composite layer 300; the upper connecting film 120 is laminated with the lower connecting film 330 of the adhesive composite layer 300 via a bonding adhesive 210. The upper bonding membrane 120 includes at least one of PE membrane, PP membrane, PA membrane, EMMA membrane and EMAC membrane, and the thickness of the upper bonding membrane 120 is preferably 5 to 100 µm; thereby, the peel strength between the upper bonding membrane 120 and the lower bonding membrane 330 of the adhesive composite layer 300 after lamination can be improved.

[0089] In Embodiment 5 of the present invention, the adhesive composite layer 300 includes a lower connecting film 330, a thickening layer 350, an electromagnetic induction heating layer 310 and an adhesive layer 320 sequentially laminated from top to bottom.

[0090] In Embodiment 5 of the present invention, the lower connecting film 330 is disposed on the uppermost layer of the adhesive composite layer 300 and is used to laminate with the upper layer 100; the lower connecting film 330 is laminated with the upper connecting film 120 of the upper layer 100 through the connecting adhesive 210. The lower connecting film 330 includes at least one of PE film, PP film, PET film, PA film, EPP film and EPE film, and the thickness of the lower connecting film 330 is preferably 12 to 200 µm; thereby, the peel strength after lamination between the lower connecting film 330 and the upper connecting film 120 of the upper layer 100 can be improved.

[0091] In a fifth embodiment of the present invention, a thickening layer 350 is disposed above the electromagnetic induction heating layer 310, and in this embodiment, it is used to increase the thickness of the easy-open sealing gasket of the present invention. The thickening layer 350 includes at least one of an EPE layer, an EPP layer, a PE layer, a PP layer, and paper, and the thickness of the thickening layer 350 is preferably 60 to 2000 µm; thereby, the thickness of the easy-open sealing gasket of the present invention can be increased.

[0092] In Embodiment 5 of the present invention, adhesive a can be used to bond the lower connecting film 330 and the thickening layer 350, as well as the thickening layer 350 and the electromagnetic induction heating layer 310. Adhesive a can be a composite adhesive that enables the peel strength between the two bonded layers (e.g., the lower connecting film 330 and the thickening layer 350 or the thickening layer 350 and the electromagnetic induction heating layer 310) to be greater than or equal to 4 N / 15 mm, but is not limited thereto.

[0093] In Embodiment 5 of the present invention, adhesive a can be used to bond the surface film 110 and the upper connecting film 120. The adhesive a can be a composite adhesive that enables the peel strength between the two bonded layers (e.g., the surface film 110 and the upper connecting film 120) to be greater than or equal to 4 N / 15 mm, but is not limited thereto.

[0094] The method for manufacturing the easy-open sealing gasket of Embodiment 5 of the present invention is as follows:

[0095] First, an adhesive is applied to the lower surface of the surface film roll, and the surface film roll is dry-laminated with the upper connecting film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the upper composite roll.

[0096] Secondly, apply varnish or silicone oil to the lower surface of the sandwich roll in a full-area or dot-area coating manner to create a coated flap roll.

[0097] Then, an adhesive is applied to the upper surface of the electromagnetic induction heating layer roll material, so that the upper surface of the electromagnetic induction heating layer roll material and the lower surface of the thickened layer roll material are dry-laminated, and the material is placed in the curing chamber for more than 24 hours to produce the first composite roll material.

[0098] Next, an adhesive is applied to the thickened layer of the first composite roll, so that the thickened layer of the first composite roll is dry-laminated with the lower surface of the lower connecting film roll, and then placed in a curing chamber for more than 24 hours to produce the second composite roll.

[0099] Next, an adhesive is applied to the electromagnetic induction heating layer of the second composite roll, and the electromagnetic induction heating layer of the second composite roll is dry-laminated with the upper surface of the sealing film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the lower composite roll. Alternatively, hot melt adhesive is applied to the electromagnetic induction heating layer of the second composite roll to produce the lower composite roll.

[0100] Next, a super-strong adhesive is applied to the upper connecting film surface of the upper composite roll, and a coated flap film roll is sandwiched in the middle. The lower surface of the upper connecting film roll of the upper composite roll, the upper surface of the coated flap film roll, and the lower connecting film surface of the lower composite roll are dry-laminated using a sandwich lamination method. The roll is then placed in a curing chamber for more than 24 hours to produce an easy-open sealing gasket roll.

[0101] Finally, cut the easy-open sealing gasket to the appropriate size according to the user's needs.

[0102] Example 6:

[0103] As shown in Figure 8, the difference between Embodiment 6 and Embodiment 2 of the present invention lies in the different configurations of the interlayer 230A and the coating layer 230B.

[0104] Specifically, in Embodiment Six of the present invention, interlayer 230A is disposed in the unbonded area UA; interlayer 230A is bonded to the adhesive-sealing composite layer 300 by a composite adhesive 220. Interlayer 230A includes at least one of PET film, PP film, PA film, PEN film, and PI film, and the thickness of interlayer 230A is preferably 12 to 24 µm; the composite adhesive 220 ensures a peel strength between interlayer 230A and the adhesive-sealing composite layer 300 greater than or equal to 17.8 N / 15 mm, thereby securing the composite interlayer 230A and the adhesive-sealing composite layer 300. The composite adhesive 220 can be a bonding adhesive capable of achieving a peel strength between interlayer 230A and the adhesive-sealing composite layer 300 greater than or equal to 17.8 N / 15 mm, but is not limited thereto. The composite adhesive 220 can also be a dry laminating adhesive or a hot melt laminating adhesive. The hot melt laminating adhesive can be made of one of PE, PP, EMAC, EMAA, EEA, EAA, and EMMA, and its thickness is preferably 4 to 60 µm. To improve manufacturing convenience, the composite adhesive 220 can be the same as the bonding adhesive 210, meaning that the bonding adhesive 210 and the composite adhesive 220 can be used as the same adhesive and coated simultaneously.

[0105] In Embodiment Six of the present invention, coating layer 230B can be applied to the upper surface of interlayer 230A. The material of coating layer 230B can be varnish or silicone oil, and the thickness of coating layer 230B is preferably 0.5 to 20 µm. Since coating layer 230B is applied to the upper surface of interlayer 230A, and interlayer 230A is not bonded to upper layer 100 through other adhesives, a gap region SA can exist between coating layer 230B and upper layer 100. This ensures that a portion of the area between interlayer 230A and upper layer 100 is separated from each other (i.e., not completely bonded), allowing the user to easily open the easy-open sealing gasket of the present invention by hand without the aid of external objects.

[0106] It should be noted that, with conventional sealing gaskets, as the gap between the electromagnetic induction heating layer 310 and the interlayer 230A becomes thinner, after electromagnetic induction sealing, the interlayer 230A of the conventional sealing gasket often adheres to the film above it, making it difficult for the user to open the interlayer 230A. However, since the upper surface of the interlayer 230A is coated with varnish or silicone oil (i.e., coating layer 230B), the user can easily pry open the interlayer 230A with their fingers, thus ensuring that the user can easily open the easy-open sealing gasket of the present invention by directly pinching the interlayer 230A without the aid of external objects.

[0107] In Embodiment Six of the present invention, the coating layer 230B can be coated in a full-area or dot-matrix manner, allowing the user to easily pry open the interlayer 230A with their fingers. This ensures that the user can easily open the easy-open sealing gasket of the present invention by directly pinching the interlayer 230A without the aid of external objects. Taking the dot-matrix coating method as an example, after electromagnetic induction sealing, the small amount of air between the dot matrix of dot-matrix coating varnish or silicone oil provided in this invention will be heated and expanded by electromagnetic induction sealing. This will cause the interlayer 230A to be pushed downward, thereby ensuring that the interlayer 230A and the upper layer 100 are separated from each other, allowing the user to more easily pry open the interlayer 230A with their fingers. This ensures that the user can easily open the easy-open sealing gasket of the present invention by directly pinching the interlayer 230A without the aid of external objects. The cross-sectional width W3 of the coating area of ​​the coating layer 230B can be greater than or equal to one-sixth of the cross-sectional width W2 of the easy-open sealing gasket of the present invention, and the cross-sectional width W3 of the coating area of ​​the coating layer 230B can be less than or equal to five-sixths of the cross-sectional width W2 of the easy-open sealing gasket of the present invention, thereby allowing manufacturers to adjust the coating area of ​​the coating layer 230B according to actual needs, thereby further increasing the manufacturer's design flexibility.

[0108] Example 7:

[0109] As shown in Figure 9, the difference between Embodiment 7 and Embodiment 3 of the present invention lies in the different configuration of the coating layer 230B.

[0110] In Embodiment Seven of the present invention, coating layer 230B is applied to the upper surface of the adhesive-sealing composite layer 300. Specifically, in Embodiment Seven of the present invention, coating layer 230B is applied to the upper surface of the lower connecting film 330 of the adhesive-sealing composite layer 300; the material of coating layer 230B can be varnish or silicone oil, and the thickness of coating layer 230B is preferably 0.5 to 20 µm. Since a portion of the lower surface of the upper layer 100 is coated with coating layer 230B, and the upper layer 100 is not bonded to the adhesive-sealing composite layer 300 through other adhesives, a gap region SA can exist between coating layer 230B and upper layer 100, thereby ensuring that the portion of the area between coating layer 230B and upper layer 100 is separated from each other (i.e., not completely bonded), so that the user can easily peel off the easy-open sealing gasket of the present invention by hand without the aid of external objects.

[0111] In Embodiment Seven of the present invention, the coating method of the coating layer 230B can be full-area coating or dot coating. The cross-sectional width W3 of the coating area of ​​the coating layer 230B can be greater than or equal to one-sixth of the cross-sectional width W2 of the easy-open sealing gasket of the present invention, and the cross-sectional width W3 of the coating area of ​​the coating layer 230B can be less than or equal to five-sixths of the cross-sectional width W2 of the easy-open sealing gasket of the present invention.

[0112] Example 8:

[0113] As shown in Figure 10, the difference between Embodiment 8 and Embodiment 5 of the present invention lies in the different configurations of the interlayer 230A and the coating layer 230B.

[0114] Specifically, in Embodiment 8 of the present invention, interlayer 230A is disposed in the unbonded area UA; interlayer 230A is bonded to the adhesive-sealing composite layer 300 by a composite adhesive 220. Interlayer 230A includes at least one of PET film, PP film, PA film, PEN film, and PI film, and the thickness of interlayer 230A is preferably 12 to 24 µm; the composite adhesive 220 ensures that the peel strength between interlayer 230A and the adhesive-sealing composite layer 300 is greater than or equal to 17.8 N / 15 mm, thereby securing the composite interlayer 230A and the adhesive-sealing composite layer 300. The composite adhesive 220 can be a bonding adhesive capable of ensuring that the peel strength between interlayer 230A and the adhesive-sealing composite layer 300 is greater than or equal to 17.8 N / 15 mm, but is not limited thereto. The composite adhesive 220 can also be a dry laminating adhesive or a hot melt laminating adhesive. The hot melt laminating adhesive can be made of one of PE, PP, EMAC, EMAA, EEA, EAA, and EMMA, and its thickness is preferably 4 to 60 µm. To improve manufacturing convenience, the composite adhesive 220 can be the same as the bonding adhesive 210, meaning that the bonding adhesive 210 and the composite adhesive 220 can be used as the same adhesive and coated simultaneously.

[0115] In Embodiment 8 of the present invention, coating layer 230B can be applied to the upper surface of interlayer 230A. The material of coating layer 230B can be varnish or silicone oil, and the thickness of coating layer 230B is preferably 0.5 to 20 µm. Since coating layer 230B is applied to the upper surface of interlayer 230A, and interlayer 230A is not bonded to upper layer 100 through other adhesives, a gap region SA can exist between coating layer 230B and upper layer 100. This ensures that a portion of the area between interlayer 230A and upper layer 100 is separated from each other (i.e., not completely bonded), allowing the user to easily open the easy-open sealing gasket of the present invention by hand without the aid of external objects.

[0116] To facilitate understanding of the wireless information integration chip of the present invention, the following describes the implementation of the wireless information integration chip.

[0117] The first implementation of the wireless information integration chip:

[0118] As shown in Figures 11 to 13, in a first embodiment of the wireless information integration sheet, the wireless information integration sheet includes a base film 1w, a first adhesive layer 2w, and an information and heating layer 3w. The first adhesive layer 2w is located between the base film 1w and the information and heating layer 3w to bond the base film 1w and the information and heating layer 3w.

[0119] In a first embodiment of the wireless information integration sheet, the base film 1w is used as the initial layer for fabricating the wireless information integration sheet. In one specific example, the base film 1w may include at least one of PI film, PEN film, PET film, PC film, PP film, and PE film. The thickness of the base film 1w is preferably 20 to 150 µm, within which the longitudinal tensile strength of the base film 1w is relatively high. The lower surface of the base film 1w is bonded to the first adhesive layer 2w, while the upper surface of the base film 1w can serve as a printing surface for printing different patterns.

[0120] In a first embodiment of the wireless information integration sheet, the first adhesive layer 2w is used to bond the base film 1w and the information to the heating layer 3w. The first adhesive layer 2w only needs to be able to bond the base film 1w and the information to the heating layer 3w, and its material can be, for example, a composite adhesive. The thickness of the first adhesive layer 2w can be 0.5 to 7 µm, and the first adhesive layer 2w can provide a peel strength greater than 4 N / 15 mm between the bonded two layers.

[0121] In a first embodiment of the wireless information integrated chip, the information and heating layer 3w includes an information area 31w and an electromagnetic induction heating ring 32w. The information area 31w has the function of wireless information reading, writing, and transmission for subsequent product traceability. The information area 31w includes an antenna 312w and a chip 311w that are interconnected. The electromagnetic induction heating ring 32w is heated by electromagnetic induction through the electromagnetic field generated by the electromagnetic induction sealing machine, causing the sealing layer 320 of the present invention to melt and adhere to the container opening, thus acting as an electromagnetic induction sealing gasket to seal the container opening. The wireless information integrated chip of the present invention can generate most of the heat in the electromagnetic induction heating ring 32w, which can both block the heat transfer to the central area of ​​the sealing gasket during electromagnetic induction sealing and save energy. Furthermore, when applied to sealing gaskets containing batteries, the thickness of the information and heating layer 3w can be from 6µm to 2.5mm; while when applied to sealing gaskets without batteries, the thickness of the information and heating layer 3w can be from 6 to 300µm.

[0122] In a first embodiment of the wireless information integration chip, as shown in FIG12, an electromagnetic induction heating ring 32w surrounds the information area 31w in a planar view. The space between the electromagnetic induction heating ring 32w and the information area 31w is filled with an ITV, meaning there are no physical connecting elements (e.g., the physical connecting bridge 33w described later) between the electromagnetic induction heating ring 32w and the information area 31w. This ITV, which blocks heat conduction to the information area 31w, can be 0.1 to 3 mm. The electromagnetic induction heating ring 32w can be made of metal, such as aluminum, copper, gold, silver, or tin, but is not limited to these. From the viewpoint of the effect of generating heat under varying electromagnetic fields and cost, the electromagnetic induction heating ring 32w is preferably made of aluminum foil, and its thickness is preferably 6 to 40 µm.

[0123] In the first embodiment of the wireless information integrated chip, as shown in Figure 13, the information area 31w includes a chip 311w and an antenna 312w. The chip 311w and antenna 312w can realize wireless information transmission based on the RFID frequency band desired by the user. The chip 311w can have a unique identification code and can be selected according to the purpose. For example, the chip 311w can be a radio frequency identification near field communication (RFID_NFC) chip, a radio frequency identification high frequency (RFID_HF) chip, a radio frequency identification ultra-high frequency (RFID_UHF) chip, or a radio frequency identification microwave (RFID_MW) chip, etc., without particular limitation. All such chips can be matched with the antenna 312w described later to realize wireless information communication functions. The antenna 312w mainly functions to generate wirelessly transmit signals, and its material can be metal, such as copper, silver, gold, tin, or aluminum, without particular limitation.

[0124] In the first embodiment of the wireless information integrated sheet roll, the manufacturing method of the wireless information integrated sheet roll is as follows: First, a composite adhesive (first adhesive layer 2w) is applied to the composite surface of the base film roll, and then it is laminated with the composite surface of the metal foil roll to form a wireless information integrated sheet blank roll; second, the metal foil of the wireless information integrated sheet blank roll is etched to electrically connect the antenna 312w and the chip 311w, and then the chip 311w and the chip connection part are encapsulated with chip encapsulation protective adhesive using a dispensing machine for protection. At this time, the metal foil forms the information and heating layer 3w, and the wireless information integrated sheet blank roll becomes the wireless information integrated sheet roll (i.e., the electromagnetic induction heating sheet roll mentioned above). The wireless information integrated sheet can be obtained by cutting the wireless information integrated sheet roll accordingly. In addition, if a battery is to be added to the information and heating layer 3w, a welding machine or conductive adhesive can be used to process the battery cell and the chip 311w into an electrical connection.

[0125] The second implementation of the wireless information integration chip:

[0126] As shown in Figure 14, the second embodiment of the wireless information integration sheet differs from the first embodiment in that, in the second embodiment, in addition to the aforementioned base film 1w, first adhesive layer 2w, and information and heating layer 3w, the wireless information integration sheet also includes a protective layer 5w and a second adhesive layer 4w. The protective layer 5w is located on the side of the information and heating layer 3w furthest from the base film 1w. The second adhesive layer 4w is located between the information and heating layer 3w and the protective layer 5w, and it serves to bond the information and heating layer 3w and the protective layer 5w together.

[0127] In a second embodiment of the wireless information integration sheet, the second adhesive layer 4w only needs to be able to bond the information layer to the heating layer 3w and the protective layer 5w, and its material can be, for example, a dry composite adhesive, without particular limitation. The thickness of the second adhesive layer 4w can be 0.5 to 7 µm, preferably such that the peel strength between the two bonded layers is greater than 4 N / 15 mm. The second adhesive layer 4w can extend to fill the gap between the electromagnetic induction heating ring 32w and the information area 31w to improve the overall structural strength of the wireless information integration sheet.

[0128] In a second embodiment of the wireless information integrated chip, the protective layer 5w is used to protect the information area 31w (i.e., chip 311w, antenna 312w, and a separately added battery) from external damage that would affect its wireless information transmission capability. The protective layer 5w may include at least one of PET film, PP film, PE film, PA film, PVDC film, EVOH film, PEN film, and PI film, and the thickness of the protective layer 5w may be 12 to 100 µm. Furthermore, either the upper or lower surface of the protective layer 5w can be used as a printing surface.

[0129] A third implementation of the wireless information integration chip: As shown in Figures 15 and 16, the difference between the third and first implementations of the wireless information integration chip is that in the third implementation, at least one physical connection bridge 33w is provided between the information area 31w and the electromagnetic induction heating ring 32w. The physical connection bridge 33w connects the information area 31w and the electromagnetic induction heating ring 32w. The physical connection bridge 33w, the antenna 312w of the information area 31w, and the electromagnetic induction heating ring 32w can be integrated. The length of the physical connection bridge 33w can be 0.1 to 3 mm, and the width of the physical connection bridge 33w can be 0.01 to 5 mm. In this case, although the electromagnetic induction heating ring 32w and the information area 31w are electrically connected through the physical connection bridge 33w, the wireless communication distance is not significantly reduced, and the physical connection bridge 33w conducts very little heat.

Claims

1. An easy-open sealing gasket, characterized in that: It includes an upper layer, a connecting layer, and an adhesive composite layer, which are sequentially combined from top to bottom; The upper layer includes a surface film; The adhesive-sealing composite layer comprises, from top to bottom, a lower connecting film, an electromagnetic induction heating layer, and an adhesive-sealing layer; The bonding layer includes a bonding adhesive that bonds the upper layer to the adhesive-sealing composite layer and forms an unbonded area between the upper layer and the adhesive-sealing composite layer.

2. The easy-open sealing gasket as described in claim 1, characterized in that: The cross-sectional width of the adhesive coating area of ​​the bonding layer is greater than or equal to one-sixth of the cross-sectional width of the easy-open sealing gasket, and the cross-sectional width of the adhesive coating area is less than or equal to five-sixths of the cross-sectional width of the easy-open sealing gasket.

3. The easy-open sealing gasket as described in claim 1, characterized in that: The bonding layer also includes an interlayer and a coating layer; the interlayer is disposed in the unbonded area and is bonded to the upper layer by a composite adhesive; the interlayer includes at least one of PET film, PP film, PA film, PEN film and PI film; the coating layer is applied to the lower surface of the interlayer and the coating layer is made of varnish or silicone oil.

4. The easy-open sealing gasket as described in claim 3, characterized in that: The coating layer is applied in either a full-area coating or a dot-area coating method.

5. The easy-open sealing gasket as described in claim 3, characterized in that: The cross-sectional width of the coating area of ​​the coating layer is greater than or equal to one-sixth of the cross-sectional width of the easy-open sealing gasket, and the cross-sectional width of the coating area of ​​the coating layer is less than or equal to five-sixths of the cross-sectional width of the easy-open sealing gasket.

6. The easy-open sealing gasket as described in claim 1, characterized in that: The bonding layer also includes an interlayer and a coating layer; the interlayer is disposed in the unbonded area and is bonded to the sealing composite layer by a composite adhesive; the interlayer includes at least one of PET film, PP film, PA film, PEN film and PI film; the coating layer is applied to the upper surface of the interlayer and the coating layer is made of varnish or silicone oil.

7. The easy-open sealing gasket as described in claim 1, characterized in that: The bonding layer also includes a coating layer, which is applied to the lower surface of the upper layer or the upper surface of the adhesive composite layer. The coating layer is made of varnish or silicone oil.

8. The easy-open sealing gasket as described in claim 7, characterized in that: The coating layer is applied in either a full-area coating or a dot-area coating method.

9. The easy-open sealing gasket as described in claim 7, characterized in that: The cross-sectional width of the coating area of ​​the coating layer is greater than or equal to one-sixth of the cross-sectional width of the easy-open sealing gasket, and the cross-sectional width of the coating area of ​​the coating layer is less than or equal to five-sixths of the cross-sectional width of the easy-open sealing gasket.

10. The easy-open sealing gasket as described in claim 1, characterized in that: The connecting membrane includes at least one of PE membrane, PP membrane, PET membrane, PA membrane, EPP membrane and EPE membrane.

11. The easy-open sealing gasket as described in claim 1, characterized in that: The sealing composite layer also includes a composite film, which is disposed above the electromagnetic induction heating layer. The composite film includes at least one of PET film, PEN film, PP film, PA film and PE film.

12. The easy-open sealing gasket as described in claim 1, characterized in that: The adhesive is a dry composite adhesive or a hot melt laminate, and the hot melt laminate is made of one of the following materials: PE, PP, EMAC, EMAA, EEA, EAA, and EMMA.

13. The easy-open sealing gasket as described in claim 1, characterized in that: The surface film includes at least one of PP film, PET film, PE film, PA film, PEN film, PI film and EMAC film.

14. The easy-open sealing gasket as described in claim 1, characterized in that: The sealing layer is a hot melt adhesive; the hot melt adhesive is made of one of the following materials: EVA, PIB, EBA, EAA, EMAA, EMAC, acrylic copolymer, and polyacrylate.

15. The easy-open sealing gasket as described in claim 1, characterized in that: The sealing layer includes a sealing film and an adhesive. The sealing film is at least one of PE film, PP film, PA film, PVDC film, EVOH film and PET film. The adhesive is disposed between the sealing film and the electromagnetic induction heating layer.

16. The easy-open sealing gasket as described in claim 1, characterized in that: The electromagnetic induction heating layer is made of aluminum foil.

17. The easy-open sealing gasket as described in claim 1, characterized in that: The electromagnetic induction heating layer uses a wireless information integrated chip; The wireless information integrated chip includes a base film, an information and heating layer, and a first adhesive layer; the information and heating layer includes an information area and an electromagnetic induction heating ring; the information area has an antenna and a chip that are interconnected, the electromagnetic induction heating ring surrounds the information area, and the first adhesive layer is located between the base film and the information and heating layer.

18. The easy-open sealing gasket as described in claim 17, characterized in that: The wireless information integrated sheet also includes a protective layer and a second adhesive layer. The protective layer is located on the side of the information and heating layer away from the base film, and the second adhesive layer is located between the information and heating layer and the protective layer.

19. The easy-open sealing gasket as described in claim 17, characterized in that: There is a gap between the electromagnetic induction heating ring and the information area.

20. The easy-open sealing gasket as described in claim 19, characterized in that: The distance between the electromagnetic induction heating ring and the information area is 0.1mm to 3mm.

21. The easy-open sealing gasket as described in claim 19, characterized in that: The electromagnetic induction heating ring and the information area are filled with gaps.

22. The easy-open sealing gasket as described in claim 19, characterized in that: The information and heating layer also includes at least one physical connection bridge that connects the information area to the electromagnetic induction heating ring.

23. The easy-open sealing gasket as described in claim 1, characterized in that: The adhesive binds to ensure that the peel strength between the upper layer and the adhesive-sealed composite layer is greater than or equal to 17.8 N / 15 mm.

Images