Display module and electronic device

Abstract

The present application relates to the technical field of display and provides a display screen and an electronic device. The display module comprises a display screen; the display screen comprises a display area, a folding area and a connection area; the folding area is located on the side of the display area facing away from a display surface, the connection area connects the display area and the folding area, and a gap is provided between the folding area and the display area; the display module further comprises a first circuit board and a first electrical connection structure; the first circuit board comprises a first part and a second part; the first part is located in the gap; the second part is located outside the gap, and is provided with an electronic component; and the first electrical connection structure connects the second part and the folding area. In the present application, by changing the positions of the first circuit board and the electronic component, the space occupied by the display module is reduced, and when the display module is applied to the electronic device, the installation space saved by the display module can be used for increasing the size of a battery, thereby increasing the capacity of the battery.

Description

Display modules, electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202510129542.7, filed with the State Intellectual Property Office of China on January 27, 2025, entitled “Display Module, Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and more particularly to a display module and an electronic device having the display module. Background Technology

[0003] With the development of human-computer interaction technology, display has become an important element of human-computer interaction, and for example, foldable screen display devices have emerged.

[0004] In electronic devices such as foldable phones, the requirements for the compactness of the internal structure are becoming increasingly stringent. This is because the arrangement of the internal structure can affect not only the physical dimensions of the electronic device but also its performance, such as battery capacity.

[0005] In some electronic devices, the display screen includes a display area and a tilting area. The tilting area is bent to the side opposite to the light-emitting surface of the display area; that is, the tilting area is located on the back side of the display area. A display driver integrated circuit (DDIC) is located in the tilting area. Additionally, a control circuit board electrically connected to the display screen and the DDIC is located next to the tilting area. This control circuit board occupies a significant amount of space, for example, limiting the space available for the battery, thus limiting the increase in battery capacity and consequently limiting the improvement in the battery life of the electronic device. Summary of the Invention

[0006] This application provides a display module and an electronic device including the display module. The purpose is to provide a way to save space occupied by the display module by changing the placement of the circuit board and electronic components.

[0007] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0008] Firstly, this application provides a display module that can be used in electronic devices, such as mobile phones, tablets, and other terminal devices.

[0009] The display module provided in this application includes a display screen, which includes a display area, a folding area, and a connecting area. The folding area is located on the side of the display area away from the display surface, that is, the folding area is located on the back of the display area. The connecting area connects the display area and the folding area, and there is a gap between the folding area and the display area. The display module also includes a first circuit board and a first electrical connection structure. The first circuit board includes a first part and a second part. The first part is located within the gap, and the second part is located outside the gap. Electronic devices are disposed on the second part. The first electrical connection structure is connected to the second part and is also connected to the folding area.

[0010] In a display module, because the electronic components mounted on the first circuit board need to be electrically connected to the folding area, the first circuit board requires wiring, resulting in a large area and occupying a significant amount of space. Compared to existing technologies where the first circuit board and folding area are arranged alternately, for example, when the first circuit board and folding area are arranged along the length of the electronic device in the prior art, the first circuit board occupies a large amount of space in the length direction, thus making the display module occupy a large amount of space in the length direction. However, in this application, by placing the first part of the first circuit board within the gap between the folding area and the display area, fully utilizing the space between the folding area and the display area, and by using the second part exposed outside the gap to mount the electronic components, the space occupied by the display module can be saved, for example, by saving dimensions in the length direction of the electronic device. Therefore, this application can save space occupied by the display module by changing the position of the first circuit board and the electronic components. When the display module is applied to an electronic device, the saved installation space of the display module can be used to increase the size of the battery, thereby increasing the battery capacity.

[0011] In addition, the second part is connected to the folded area through the first electrical connection structure. Since the second part is located outside the gap, it is also easy to connect to the first electrical connection structure, which will not pose a challenge to the process.

[0012] The first part is placed between the folding area and the display area. This first part can also serve as a support and work together with the support member to improve the overall strength of the display module. Alternatively, because the first part has a supporting function, the first part of this application can also replace the support member in the prior art to serve as a support. This can save the space occupied by the support member and further compress the dimensions in the stacking direction of the folding area and the display area. For example, the dimensions of the display module in the Z direction can be compressed.

[0013] In one possible implementation, the first electrical connection structure includes a flexible circuit board, one end of which is connected to the folded area and the other end of which is connected to the second portion.

[0014] In one possible implementation, the first electrical connection structure includes a metal wire, one end of which is connected to the folded area and the other end of which is connected to the second part.

[0015] Since there is a height difference between the first circuit board and the folding area, using a flexible circuit board or metal wires with better flexibility to connect the first circuit board and the folding area can improve the stability and reliability of the connection.

[0016] In one possible implementation, the second part has connecting contact points, the folding area has connecting contact points, the flexible circuit board is connected to the connecting contact points on the second part through a conductive film layer, and the flexible circuit board is connected to the connecting contact points on the folding area through a conductive film layer.

[0017] In one possible implementation, the second part has connecting contact points, the folded area has connecting contact points, and the metal wire is connected to the connecting contact points on the second part through a conductive film layer, and the metal wire is connected to the connecting contact points on the folded area through a conductive film layer.

[0018] In one possible implementation, the first electrical connection structure includes a conductive via disposed within the folded area, the conductive via being electrically connected to the second portion at one end facing the first circuit board.

[0019] In this example, conductive vias are used to connect the first circuit board and the folding area, i.e., a vertical connection is used. The vertical connection can shorten the signal transmission path between the folding area and the first circuit board, reduce link loss, and reduce the loss of the display module.

[0020] In one possible implementation, the folded area facing the first circuit board has a first connecting contact point, one end of the conductive via facing the first circuit board is connected to the first connecting contact point, and the first portion of the folded area facing the first circuit board has a second connecting contact point, with the first connecting contact point connected to the second connecting contact point through a conductive film layer.

[0021] In this electrical connection method, a vertical connection structure consisting of conductive vias, a first connecting contact point, a conductive film layer, and a second connecting contact point is adopted to achieve vertical interconnection between the folding area and the first circuit board.

[0022] In one possible implementation, the second part includes a bottom portion and a protruding portion, the bottom portion being connected to the first part, and the protruding portion being located on the side of the bottom portion opposite to the display area; the folding area has a first surface opposite to the display area, and the protruding portion has a second surface opposite to the display area; the first surface and the second surface are flush; and a first electrical connection structure is connected to the protruding portion.

[0023] This can be understood as follows: by setting a protruding part on the first circuit board, the surface of the protruding part is flush with the surface of the folded area. In this way, in the feasible process, the first electrical connection structure can be connected to the folded area and the first circuit board in one process. For example, the first electrical connection structure and the folded area can be connected in one wire bonding process, and the first electrical connection structure can be connected to the first circuit board.

[0024] In one possible implementation, the second part has multiple third contact points, and the folded area has multiple fourth contact points. The arrangement direction of the multiple fourth contact points is consistent with the arrangement direction of the multiple third contact points. The spacing between two adjacent third contact points is greater than the spacing between two adjacent fourth contact points.

[0025] In this example, increasing the distance between the contact points on the first circuit board can alleviate the problem of unreliable or even failed connection between the first circuit board and the first electrical connection structure due to the mismatch in the thermal expansion coefficients of the first circuit board and the first electrical connection structure.

[0026] In one possible implementation, the first circuit board has a first set of connection contacts and a second set of connection contacts, which are arranged along a first direction; each of the first set of connection contacts and the second set of connection contacts includes a plurality of third connection contacts arranged along a second direction, wherein the first direction intersects the second direction, for example, the first direction is perpendicular to the second direction.

[0027] In one possible implementation, the folding area has multiple fourth contact points, which are arranged along a second direction; the spacing between two adjacent third contact points in the first group of contact points is greater than the spacing between two adjacent fourth contact points.

[0028] That is, by setting multiple third connection contact points on the first circuit board as multiple groups, the spacing between two adjacent third connection contact points in a row can be increased, which can alleviate the problem of unreliable connection or even failure of the first circuit board and the first electrical connection structure due to the mismatch of thermal expansion coefficients.

[0029] In one possible implementation, the third contact in the first set of contact points includes a signal contact, and the third contact in the second set of contact points includes a power contact.

[0030] When the connection contacts on the first circuit board are set into multiple groups, each group of connection contacts can have different functions. For example, the first group of connection contacts can be signal connection contacts, and the second group of connection contacts can be power connection contacts. This facilitates connection and maintenance.

[0031] In one possible implementation, the area occupied by the power connection contact on the second part is larger than the area occupied by the signal connection contact on the second part.

[0032] When the area of ​​the power supply contact point is large, the transmission impedance can be reduced, thus optimizing the display effect.

[0033] In one possible implementation, the size of the power connection contact in the second direction is greater than the size of the signal connection contact in the second direction, and the size of the power connection contact in the first direction is equal to the size of the signal connection contact in the first direction.

[0034] In this example, the area of ​​the power connection contact point is increased by increasing the size of the power connection contact point in the second direction. In some electronic devices, it is necessary to compress the size in the first direction, for example, the width direction of the electronic device. In this case, the size of the power connection contact point in the second direction can be increased, and the second direction can be the length direction of the electronic device.

[0035] In one possible implementation, the substrate of the second part is the same as the substrate of the first electrical connection structure.

[0036] In this example, since the substrate of the second part is the same as the substrate of the first electrical connection structure, the problem of unreliable connection or even failure of the first circuit board and the first electrical connection structure due to the mismatch of thermal expansion coefficients can be reduced. If the first circuit board is a rigid-flex board, the rigid part of the second part can be removed to expose the flexible part, so that the substrate of the second part is the same as the substrate of the first connection structure.

[0037] In one feasible approach, the second part and the first electrical connection structure are integrally formed.

[0038] In this implementation, the second part of the first circuit board can be bent to serve as the first electrical connection structure, which can not only reduce the number of structural components but also simplify the process. For example, a one-time bonding process can be used to connect the first circuit board to the folded area.

[0039] In one possible implementation, the display module further includes a reinforcing plate; the reinforcing plate is disposed between the first circuit board and the folding area, and / or, the reinforcing plate is disposed between the first circuit board and the display area.

[0040] By setting a reinforcing plate between the folding area and the display area, the reinforcing plate can provide support and protection for both the folding area and the display area.

[0041] In one possible implementation, a cavity is formed in the first circuit board, and a display driver chip is disposed on the side of the folded area opposite to the display area; the display driver chip is at least partially opposite to the cavity.

[0042] By creating a recess in the first circuit board and positioning the display driver chip relative to at least a portion of the recess, effectively hollowing out the first circuit board, the recess can act as a buffer, preventing significant impact on the display screen or the display driver chip from external forces such as micro-movements or drops.

[0043] In one possible implementation, the first part includes a multi-layered stacked circuit layer; the multi-layered stacked circuit layer includes a surface circuit layer and an inner circuit layer; the inner circuit layer includes high-speed signal lines.

[0044] Since this application stacks the first part between the folding area and the display area, the distance between the first part and the display screen is shortened. In order to avoid electromagnetic interference to high-speed signals, in this example, the high-speed signal line is set in the internal circuit layer of the first part. Through the thicker dielectric layer located on both sides of the internal circuit layer, the dielectric layer can play an electrical isolation role and reduce the electromagnetic interference of external electromagnetic fields to high-speed signals.

[0045] In one possible implementation, the first part includes a multi-layered stacked circuit layer; the multi-layered stacked circuit layer includes a surface circuit layer and an inner circuit layer; the surface circuit layer includes high-speed signal lines; and a shielding layer is disposed on the surface circuit layer.

[0046] In this implementation, the high-speed signal line is placed in the surface circuit layer of the first part, and electromagnetic isolation can be achieved by a shielding layer disposed on the surface circuit layer. For example, the shielding layer can be a metal layer.

[0047] In one possible implementation, a shielding layer is provided on the surface of the first electrical connection structure away from the folding area.

[0048] By providing a shielding layer on the surface of the first electrical connection structure, electromagnetic isolation of high-speed signals can be further achieved.

[0049] In one possible implementation, the display module also includes a buffer layer; the buffer layer is disposed between the first circuit board and the folding area.

[0050] For example, the buffer layer can be made of at least one of foam, polyethylene terephthalate (PET), or thermoplastic polyurethanes (TPU). This buffer structure protects the folding area and display area, preventing significant impact on the display screen from external forces such as micro-movements or drops.

[0051] Secondly, this application provides an electronic device, which includes a housing and a display module as described in any of the above implementations, with the display area connected to the housing.

[0052] The electronic device provided in this application includes a display module with any of the above-mentioned implementations. In the display module, since the electronic devices mounted on the first circuit board need to be electrically connected to the folding area, the first circuit board needs to be wired, resulting in a large area and occupying a large space. Compared with the prior art where the first circuit board and the folding area are arranged alternately, for example, when the first circuit board and the folding area are arranged along the length of the electronic device in the prior art, the first circuit board occupies a large space in the length direction, resulting in a large space occupied by the display module in the length direction. However, in this application, since the first part of the first circuit board is placed in the gap between the folding area and the display area, that is, the space between the folding area and the display area is fully utilized, and the second part exposed outside the gap is used to mount the electronic devices, the space occupied by the display module can be saved, for example, the size in the length direction of the electronic device can be saved. Therefore, by changing the position of the first circuit board and the electronic devices, this application can save the space occupied by the display module. The saved installation space of the display module can increase the size of the battery, thereby increasing the battery capacity.

[0053] In addition, the second part is connected to the folded area through the first electrical connection structure. Since the second part is located outside the gap, it is also easy to connect to the first electrical connection structure, which will not pose a challenge to the process.

[0054] The first part is positioned between the folding area and the display area. This first part can also serve as a support, working together with the support member to enhance the overall strength of the display module. Alternatively, since the first part has a supporting function, the first part of this application can replace the support member in the prior art, thus saving the space occupied by the support member and further compressing the dimensions in the stacking direction of the folding area and the display area. For example, the dimensions of the display module in the Z direction can be compressed.

[0055] In one possible implementation, the electronic device further includes a second circuit board and a second electrical connection structure, the second electrical connection structure connecting the second circuit board and the first circuit board; electronic devices are disposed on the second circuit board.

[0056] For example, the electronic device can be a passive or active device that is electrically connected to the display screen.

[0057] In one possible implementation, the electronic device further includes a battery disposed within a housing; the battery and the display area form a receiving cavity, and a folding area, a first circuit board, and a first electrical connection structure are located within the receiving cavity.

[0058] By stacking portions of the first circuit board between the folding area and the display area, the battery size and capacity can be increased.

[0059] Thirdly, this application provides a display module that can be used in electronic devices, such as mobile phones, tablets and other terminal devices.

[0060] The display module provided in this application includes a display screen, which includes a display area, a folding area, and a connecting area. The folding area is located on the side of the display area away from the display surface, that is, the folding area is located on the back of the display area. The connecting area connects the display area and the folding area, and there is a gap between the folding area and the display area. The display module also includes a first circuit board and a first electrical connection structure. The first circuit board includes a first part and a second part. The first part is located within the gap, and the second part is located outside the gap. The second part has reserved connection contacts for electrical connection of electronic devices. The first electrical connection structure is connected to the second part and is also connected to the folding area.

[0061] In a display module, because the electronic components in the electronic device need to be electrically connected to the folding area, the first circuit board needs to be wired, resulting in a large area and occupying a significant amount of space. Compared to the prior art where the first circuit board and folding area are arranged alternately, for example, when the first circuit board and folding area are arranged along the length of the electronic device in the prior art, the first circuit board occupies a large amount of space in the length direction, resulting in a large space occupied by the display module in the length direction. However, in this application, because the first part of the first circuit board is placed in the gap between the folding area and the display area, that is, the space between the folding area and the display area is fully utilized, and the second part has reserved connection contacts for electrical connection of electronic components, the space occupied by the display module can be saved, for example, the size in the length direction of the electronic device can be saved. Therefore, this application can save the space occupied by the display module by changing the position of the first circuit board. When the display module is applied to an electronic device, the electronic components are placed in an empty space on a circuit board in the electronic device, and the connection contacts on this circuit board are connected to the reserved connection contacts on the second part. In this way, the installation space of the display module saved can be used to increase the size of the battery, thereby increasing the battery capacity.

[0062] In addition, the second part is connected to the folded area through the first electrical connection structure. Since the second part is located outside the gap, it is also easy to connect to the first electrical connection structure, which will not pose a challenge to the process.

[0063] The first part is placed between the folding area and the display area. The first part can also serve as a support and work together with the support member to improve the overall strength of the display module. Alternatively, since the first part has a supporting function, the first part of this application can also replace the support member in the prior art to serve as a support, thus saving the space occupied by the support member and further compressing the size in the stacking direction of the folding area and the display area. For example, the size of the display module in the Z direction can be compressed.

[0064] In one possible implementation, the first electrical connection structure includes a flexible circuit board, one end of which is connected to the folded area and the other end of which is connected to the second portion.

[0065] In one possible implementation, the first electrical connection structure includes a metal wire, one end of which is connected to the folded area and the other end of which is connected to the second part.

[0066] Since there is a height difference between the first circuit board and the folding area, using a flexible circuit board or metal wires with better flexibility to connect the first circuit board and the folding area can improve the stability and reliability of the connection.

[0067] In one possible implementation, the second part has connecting contact points, the folding area has connecting contact points, the flexible circuit board is connected to the connecting contact points on the second part through a conductive film layer, and the flexible circuit board is connected to the connecting contact points on the folding area through a conductive film layer.

[0068] In one possible implementation, the second part has connecting contact points, the folded area has connecting contact points, and the metal wire is connected to the connecting contact points on the second part through a conductive film layer, and the metal wire is connected to the connecting contact points on the folded area through a conductive film layer.

[0069] In one possible implementation, the first electrical connection structure includes a conductive via disposed within the folded area, the conductive via being electrically connected to the second portion at one end facing the first circuit board.

[0070] In this example, conductive vias are used to connect the first circuit board and the folding area, i.e., a vertical connection is used. The vertical connection can shorten the signal transmission path between the folding area and the first circuit board, reduce link loss, and reduce the loss of the display module.

[0071] In one possible implementation, the folded area facing the first circuit board has a first connecting contact point, one end of the conductive via facing the first circuit board is connected to the first connecting contact point, and the first portion of the folded area facing the first circuit board has a second connecting contact point, with the first connecting contact point connected to the second connecting contact point through a conductive film layer.

[0072] In this electrical connection method, a vertical connection structure consisting of conductive vias, a first connecting contact point, a conductive film layer, and a second connecting contact point is used to achieve interconnection between the folding area and the first circuit board.

[0073] In one possible implementation, the second part includes a bottom portion and a protruding portion, the bottom portion being connected to the first part, and the protruding portion being located on the side of the bottom portion opposite to the display area; the folding area has a first surface opposite to the display area, and the protruding portion has a second surface opposite to the display area; the first surface and the second surface are flush; and a first electrical connection structure is connected to the protruding portion.

[0074] This can be understood as follows: by setting a protruding part on the first circuit board, the surface of the protruding part is flush with the surface of the folded area. In this way, in the feasible process, the first electrical connection structure can be connected to the folded area and the first circuit board in one process. For example, the first electrical connection structure and the folded area can be connected in one wire bonding process, and the first electrical connection structure can be connected to the first circuit board.

[0075] In one possible implementation, the second part has multiple third contact points, and the folded area has multiple fourth contact points. The arrangement direction of the multiple fourth contact points is consistent with the arrangement direction of the multiple third contact points. The spacing between two adjacent third contact points is greater than the spacing between two adjacent fourth contact points.

[0076] In this example, increasing the distance between the contact points on the first circuit board can alleviate the problem of unreliable or even failed connection between the first circuit board and the first electrical connection structure due to the mismatch in the thermal expansion coefficients of the first circuit board and the first electrical connection structure.

[0077] In one possible implementation, the first circuit board has a first set of connection contacts and a second set of connection contacts, which are arranged along a first direction; each of the first set of connection contacts and the second set of connection contacts includes a plurality of third connection contacts arranged along a second direction, wherein the first direction intersects the second direction, for example, the first direction is perpendicular to the second direction.

[0078] In one possible implementation, the folding area has multiple fourth contact points, which are arranged along a second direction; the spacing between two adjacent third contact points in the first group of contact points is greater than the spacing between two adjacent fourth contact points.

[0079] That is, by setting multiple third connection contact points on the first circuit board as multiple groups, the spacing between two adjacent third connection contact points in a group can be increased, thereby alleviating the problem of unreliable connection or even failure of the first circuit board and the first electrical connection structure due to thermal expansion coefficient mismatch.

[0080] In one possible implementation, the third contact in the first set of contact points includes a signal contact, and the third contact in the second set of contact points includes a power contact.

[0081] When the connection contacts on the first circuit board are set into multiple groups, each group of connection contacts can have different functions. For example, the first group of connection contacts can be signal connection contacts, and the second group of connection contacts can be power connection contacts. This facilitates connection and maintenance.

[0082] In one possible implementation, the area occupied by the power connection contact on the second part is larger than the area occupied by the signal connection contact on the second part.

[0083] When the area of ​​the power supply contact point is large, the transmission impedance can be reduced, thus optimizing the display effect.

[0084] In one possible implementation, the size of the power connection contact in the second direction is greater than the size of the signal connection contact in the second direction, and the size of the power connection contact in the first direction is equal to the size of the signal connection contact in the first direction.

[0085] In this example, the area of ​​the power connection contact point is increased by increasing the size of the power connection contact point in the second direction. In some electronic devices, it is necessary to compress the size in the first direction, for example, the width direction of the electronic device. In this case, the size of the power connection contact point in the second direction can be increased, and the second direction can be the length direction of the electronic device.

[0086] In one possible implementation, the substrate of the second part is the same as the substrate of the first electrical connection structure.

[0087] In this example, since the substrate of the second part is the same as the substrate of the first electrical connection structure, the problem of unreliable connection or even failure of the first electrical connection structure and the first circuit board due to the mismatch of the thermal expansion coefficients can be reduced.

[0088] In one feasible approach, the second part and the first electrical connection structure are integrally formed.

[0089] In this implementation, the second part of the first circuit board can be bent to serve as the first electrical connection structure, which can not only reduce the number of structural components but also simplify the process. For example, a one-time bonding process can be used to connect the first circuit board to the folded area.

[0090] In one possible implementation, the display module further includes a reinforcing plate; the reinforcing plate is disposed between the first circuit board and the folding area, and / or, the reinforcing plate is disposed between the first circuit board and the display area.

[0091] By setting a reinforcing plate between the folding area and the display area, the reinforcing plate can provide support and protection for both the folding area and the display area.

[0092] In one possible implementation, a cavity is formed in the first circuit board, and a display driver chip is disposed on the side of the folded area opposite to the display area; the display driver chip is at least partially opposite to the cavity.

[0093] By creating a recess in the first circuit board and positioning the display driver chip relative to at least a portion of the recess, effectively hollowing out the first circuit board, the recess can act as a buffer, preventing significant impact on the display screen or the display driver chip from external forces such as micro-movements or drops.

[0094] In one possible implementation, the first part includes a multi-layered stacked circuit layer; the multi-layered stacked circuit layer includes a surface circuit layer and an inner circuit layer; the inner circuit layer includes high-speed signal lines.

[0095] Since this application stacks the first part between the folding area and the display area, the distance between the first part and the display screen is shortened. In order to avoid electromagnetic interference to high-speed signals, in this example, the high-speed signal line is set in the internal circuit layer of the first part. Through the thicker dielectric layer located on both sides of the internal circuit layer, the dielectric layer can play an electrical isolation role and reduce the electromagnetic interference of external electromagnetic fields to high-speed signals.

[0096] In one possible implementation, the first part includes a multi-layered stacked circuit layer; the multi-layered stacked circuit layer includes a surface circuit layer and an inner circuit layer; the surface circuit layer includes high-speed signal lines; and a shielding layer is disposed on the surface circuit layer.

[0097] In this implementation, the high-speed signal line is placed in the surface circuit layer of the first part, and electromagnetic isolation can be achieved by a shielding layer disposed on the surface circuit layer. For example, the shielding layer can be a metal layer.

[0098] In one possible implementation, a shielding layer is provided on the surface of the first electrical connection structure away from the folding area.

[0099] By providing a shielding layer on the surface of the first electrical connection structure, electromagnetic isolation of high-speed signals can be further achieved.

[0100] In one possible implementation, the display module also includes a buffer layer; the buffer layer is disposed between the first circuit board and the folding area.

[0101] For example, the buffer layer can be made of at least one of foam, polyethylene terephthalate (PET), or thermoplastic polyurethanes (TPU). This buffer structure protects the folding area and display area, preventing significant impact on the display screen from external forces such as micro-movements or drops.

[0102] Fourthly, this application provides an electronic device, which includes a housing and a display module as described in any of the above implementations, with the display area connected to the housing; the electronic device also includes a second circuit board and a second electrical connection structure, with electronic devices disposed on the second circuit board, and the second electrical connection structure connecting the second circuit board and a reserved connection contact point.

[0103] Since the electronic device includes a display module as described in any of the above implementations, it has the same technical effect as the aforementioned display module.

[0104] In one possible implementation, the electronic device further includes a battery disposed within the housing; the battery and the display area form a receiving cavity, and the folding area, the first circuit board, and the first electrical connection structure are located within the receiving cavity.

[0105] By stacking portions of the first circuit board between the folding area and the display area, space can be saved to increase battery size and capacity. Attached Figure Description

[0106] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0107] Figure 2 is a schematic diagram of the structure of an electronic device in the related art;

[0108] Figure 3 is a partial view of the AA cross-section of Figure 1;

[0109] Figure 4 is a top view of an electronic device provided in an embodiment of this application;

[0110] Figure 5 is another structural schematic diagram of the AA cross-section view in Figure 1;

[0111] Figure 6 is another structural schematic diagram of the AA cross-section view in Figure 1;

[0112] Figure 7 is a top view of the folding area provided in an embodiment of this application;

[0113] Figure 8 is a top view of the second part of the first circuit board provided in an embodiment of this application;

[0114] Figure 9 is another structural schematic diagram of the AA cross-sectional view in Figure 1;

[0115] Figure 10 is a top view of a folding area, a flexible circuit board, and a second part of a first circuit board connected according to an embodiment of this application.

[0116] Figure 11 is a top view of a connection between a folding area, a flexible circuit board, and a second part of a first circuit board according to an embodiment of this application.

[0117] Figure 12 is a top view of a folding area and a second part of a first circuit board provided in an embodiment of this application;

[0118] Figure 13 is a top view of a folding area and a second part of a first circuit board provided in an embodiment of this application;

[0119] Figure 14 is another structural schematic diagram of the AA cross-sectional view in Figure 1;

[0120] Figure 15 is a top view of an electronic device provided in an embodiment of this application;

[0121] Figure 16 is another structural schematic diagram of the AA cross-sectional view in Figure 1;

[0122] Figure 17 is an enlarged view of point P in Figure 16;

[0123] Figure 18 is an enlarged view of point P in Figure 16;

[0124] Figure 19 is another structural schematic diagram of the AA cross-sectional view in Figure 1;

[0125] Figure 20 is a schematic diagram of the structure of a first circuit board provided in an embodiment of this application;

[0126] Figure 21 is another structural schematic diagram of the AA cross-sectional view in Figure 1;

[0127] Figure 22 is another structural schematic diagram of the AA cross-sectional view in Figure 1;

[0128] Figure 23 is another structural schematic diagram of the AA cross-sectional view in Figure 1;

[0129] Figure 24 is another structural schematic diagram of the AA cross-section view in Figure 1;

[0130] Figure 25 is a schematic diagram of the structure of the first circuit board provided in an embodiment of this application;

[0131] Figure 26 is a schematic diagram of the structure of the first circuit board provided in an embodiment of this application;

[0132] Figure 27 is a schematic diagram of the structure of the first circuit board provided in an embodiment of this application;

[0133] Figure 28 is another structural schematic diagram of the AA cross-sectional view in Figure 1;

[0134] Figure 29 is a schematic diagram of the structure of the flexible circuit board provided in an embodiment of this application;

[0135] Figure 30 is another structural schematic diagram of the AA cross-sectional view in Figure 1;

[0136] Figure 31 is a schematic diagram of the structure of the first circuit board provided in an embodiment of this application.

[0137] Reference numerals: 10a-First housing; 10b-Second housing; 10c-Rotating mechanism; 10d-Accommodating cavity; 20-Display screen; 30-Display driver chip; 40-Battery; 50-First circuit board; 60-First electrical connection structure; 70-Second circuit board; 801, 802-Electronic components; 90-Second electrical connection structure; 100-Reinforcing layer; 101A-Printed circuit board; 101B-Electronic components; 102-Electrical connection structure; 103-Buffer layer; 104-Reinforcing plate; 105-Shielding layer; 106-Supporting component; 107-Reinforcing component; 108-Shielding layer; 109-Adhesive layer; 110-Reserved connection contact point; 201-Display area; 202-Folding area; 203-Connection area; 2021 - Fourth contact point; 2022 - Conductive via; 2023 - First contact point; 501 - Third contact point; 502 - Second contact point; 5011 - First group of contact points; 5012 - Second group of contact points; 601 - Flexible circuit board; 60 - Conductive film layer; 602 - First conductive film layer; 603 - Second conductive film layer; 50A - First part; 50B - Second part; 50B1 - Bottom part; 50B2 - Protruding part; 50C - Cavity. Detailed Implementation

[0138] This application provides an electronic device, such as a mobile phone, tablet, laptop, smart home device, smart wearable device (e.g., smartwatch, smart bracelet, smart glasses, smart helmet), virtual reality (VR) electronic device, augmented reality (AR) electronic device, etc. The electronic device can also be a handheld device with wireless communication capabilities, a computing device or other processing device connected to a wireless modem, an in-vehicle device, an electronic device in a 5G network, or an electronic device in a future evolved public land mobile network (PLMN), etc. This application does not limit the scope of this electronic device.

[0139] For ease of explanation, the following description uses a foldable mobile phone as an example to illustrate the structure of this electronic device.

[0140] Figure 1 shows a structural diagram of a foldable screen phone, which is a dual-screen foldable phone. The foldable screen phone may include a first housing 10a, a second housing 10b, and a display screen 20. The display screen 20 covers both the first housing 10a and the second housing 10b.

[0141] In addition, the foldable screen phone may also include a hinge mechanism 10c, with a first housing 10a and a second housing 10b disposed on both sides of the hinge mechanism 10c and connected to it respectively. The hinge mechanism 10c is movable to fold or unfold the first housing 10a and the second housing 10b relative to each other, thereby flattening and closing the display screen 20.

[0142] In the aforementioned electronic devices such as mobile phones, the display screen 20 can be used to display information and provide an interactive interface for the user. In various embodiments of this application, the display screen 20 may be, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MOLED) display screen, a quantum dot light-emitting diode (QLED) display screen, etc.

[0143] Within the housing that supports the display screen 20, such as the first housing 10a and / or the second housing 10b of a foldable phone, mounting spaces can be formed for mounting electronic components such as circuit boards, batteries, receivers, speakers, cameras, and antenna modules. The circuit boards can integrate electronic components such as the main controller, storage units, antenna modules, and power management modules of the electronic device, while the batteries can power the display screen 20, main circuit boards, receivers, speakers, cameras, and other electronic components.

[0144] In some electronic devices, the circuit structure may include a circuit board, a display driver integrated circuit (DDIC), a touch panel integrated circuit (TPIC), and pixel units, as well as other electronic devices electrically connected to the display driver chip (DDIC) and the touch panel integrated circuit (TPIC). For example, other electronic devices may be passive devices, such as inductors, capacitors, resistors, etc.

[0145] The display driver chip (DDIC) and touch chip (TPIC) are crucial components of a display and touch imaging system. They integrate resistors, regulators, power transistors, and other components, responsible for driving the flexible display and controlling the drive current. Pixel units, the display driver chip (DDIC), the touch chip (TPIC), and other electronic devices can all be electrically connected to the circuit board.

[0146] Figure 2 is a schematic diagram of a structure in an electronic device in the related art.

[0147] In this implementation, the display screen 20 includes a display area 201, a folding area 202, and a connecting area 203. The connecting area 203 connects the display area 201 and the folding area 202, which is located on the back of the display area 201. Additionally, a printed circuit board 101A is included. Electronic devices 101B are mounted on the printed circuit board 101A. The printed circuit board 101A can be connected to the display screen 20 via an electrical connection structure 102. The printed circuit board 101A carrying the electronic devices 101B is positioned next to the folding area 202. For example, the folding area 202 and the printed circuit board 101A can be arranged along the length direction (e.g., the Y direction) of the electronic device. A reinforcing layer 100 is provided between the folding area 202 and the display area 201.

[0148] In the structure shown in Figure 2, within the cavity 10d formed by the battery 40 and the display area 201, space needs to be reserved for the printed circuit board 101A that carries the electronic device 101B. This will increase the volume of the cavity 10d. For example, since the folding area 202 and the printed circuit board 101A are arranged along the length direction (such as the Y direction) of the electronic device, the size of the cavity 10d along the length direction (such as the Y direction) of the electronic device needs to be increased. Consequently, the size of the battery 40 in the Y direction is compressed, and the battery capacity is reduced.

[0149] In the electronic device of this application, in order to compress the volume of the accommodating cavity, increase the volume of the battery, and improve the battery capacity, some feasible structures are provided, as detailed below.

[0150] As shown in Figure 3, Figure 3 is a cross-sectional view of an electronic device according to an example of this application, such as part of the AA cross-sectional view in Figure 1.

[0151] In this example, the display screen 20 includes a display area 201, a folding area 202, and a connecting area 203. The connecting area 203 connects the display area 201 and the folding area 202, which is located on the back of the display area 201. The display area 201, the folding area 202, and the connecting area 203 can be a single integrated structure.

[0152] The back side of the display area 201 in this application embodiment refers to the side opposite to the light-emitting surface of the display area 201, that is, the side opposite to the display surface of the display area 201.

[0153] As shown in Figure 3, a display driver chip DDIC30 can be set on the folding area 202. For example, the display driver chip DDIC30 is set on the side of the folding area 202 opposite to the display area 201. The display driver chip DDIC30 is electrically connected to the display screen 20. For example, a metal line is formed on the folding area 202, and the display driver chip DDIC30 is electrically connected to the metal line. In some examples, the display driver chip DDIC30 can be packaged in the form of a chip on panel (COP).

[0154] In some examples, see Figure 3, a support 106 may be provided on the back of the display area 201 of the display screen 20.

[0155] Continuing with Figure 3, a reinforcing member 107 can be provided between the support member 106 and the display area 201. This can reduce the risk of the display area 201 failing due to impact or compression.

[0156] As shown in Figure 3, the electronic device also includes a battery 40, which is disposed on the back of the display area 201. In order to accommodate the folding area 202 of the display screen 20, a receiving cavity 10d can be formed between the battery 40 and the display area 201, and the folding area 202 is located within the receiving cavity 10d.

[0157] As shown in Figure 3, this example also includes a first circuit board 50, which may be a printed circuit board (PCB). The first circuit board 50 includes a first part 50A and a second part 50B connected to each other. In Figure 3, the part outlined by the dashed line is schematically the first part 50A, which is located within the gap between the folding area 202 and the display area 201. The second part 50B is located outside the gap between the folding area 202 and the display area 201.

[0158] The second portion 50B of the first circuit board 50 can be connected to the folding area 202 through the first electrical connection structure 60, thereby realizing the interconnection between the first circuit board 50 and the display screen 20. For example, as shown in FIG3, the first circuit board 50 is disposed between the folding area 202 and the support member 106, which can cover the entire display area 201.

[0159] As shown in Figure 4, Figure 4 is a top view of the interior of the electronic device of the present application example.

[0160] In this example, the electronic device also includes a second circuit board 70. In some examples, the second circuit board 70 may be a motherboard within the electronic device, or it may be a small board.

[0161] In some examples, as shown in Figure 3, an electronic device 801 can be disposed on a second portion 50B of the first circuit board 50. The electronic device 801 can be connected to the folded area 202 via the first circuit board 50 and the first electrical connection structure 60. In other examples, as shown in Figure 4, an electronic device 802 can be disposed on a second circuit board 70. The electronic device 802 can be connected to the second portion 50B of the first circuit board via a second electrical connection structure 90. In still other examples, an electronic device 801 can be disposed on the first circuit board 50, and an electronic device 802 can be disposed on the second circuit board 70.

[0162] The electronic device 801 or the second electronic device 802 in this application example can be a passive device, such as at least one of a capacitor, an inductor or a resistor, or it can be an active device, such as a control chip that controls the display area.

[0163] In this application example, the position of the second circuit board 70 is not limited. For example, as shown in Figure 3, the second circuit board 70 and the battery 40 are arranged side by side. The folding area 202 and the battery 40 can be arranged along the length direction of the electronic device (such as the Y direction), and the second circuit board 70 and the battery 40 can be arranged along the width direction of the electronic device (such as the X direction).

[0164] As shown in Figure 3, the structure including the display screen 20, the first circuit board 50, and the first electrical connection structure 60 can be referred to as a display module. This display module may also include electronic components 801 disposed on the second portion 50B of the first circuit board 50. In some display modules, the electronic components 801 may not be disposed on the second portion 50B; instead, reserved connection contact points may be provided on the second portion 50B. As shown in Figure 4, the electronic components can be disposed on the second circuit board 70, and the second circuit board 70 is connected to the reserved connection contact points on the second portion 50B via the second electrical connection structure 90.

[0165] In the display module, because the electronic components in the electronic device need to be electrically connected to the folding area, the first circuit board needs to be laid out with circuits, which makes the area of ​​the first circuit board large and occupies a large space.

[0166] Compared with Figure 2 of the related art, Figure 3 of this application shows that the first part 50A of the first circuit board 50 is disposed in the gap between the folding area 202 and the display area 201. That is, the folding area 202, the first part 50A and the display area 201 are stacked. For example, they can be stacked along the thickness direction of the electronic device (such as the Z direction). In this way, the volume of the accommodating cavity 10d can be compressed, more space can be provided for the battery 40, the volume of the battery 40 can be increased, and the capacity of the battery 40 can be increased. For example, in Figure 3, the size of the battery 40 in the Y direction of the length of the electronic device can be increased, thereby increasing the battery capacity, improving the battery life of the electronic device and improving the performance of the electronic device. In some electronic devices, the size of the battery 40 in the Y direction can be increased by 1mm to 20mm. For example, the size of the battery 40 in the Y direction can be increased by 1mm to 10mm.

[0167] The first portion 50A of the first circuit board 50 makes full use of the space between the folding area 202 and the display area 201. Furthermore, the first portion 50A located between the folding area 202 and the display area 201 can also serve as a support and reinforcement, protecting the folding area 202 and the display area 201. For example, the thickness of the first circuit board 50 can be from 150 micrometers to 600 micrometers, or from 180 micrometers to 250 micrometers.

[0168] Therefore, the display module provided in this application, compared with the related technology shown in Figure 2, can save space occupied by the display module by changing the position of the first circuit board and electronic components. For example, the saved space can be used to increase the size of the battery, thereby increasing the battery capacity.

[0169] Alternatively, it can be understood that: because existing circuit boards require the setting of folding areas and signal traces connecting electronic devices, as well as electronic devices and connection points, the circuit boards need to occupy a large space. In this application, the signal traces that occupy a large area can be arranged in the first part located within the gap, and the second part located outside the gap only needs to consider placing electronic devices and connection points. Therefore, the second part is much smaller than the circuit boards in the prior art. Thus, from an overall perspective, the size of the display module can be effectively reduced.

[0170] As shown in Figure 3, in this example, the second portion 50B of the first circuit board 50 extends outside the gap between the folding area 202 and the display area 201. The first electrical connection structure 60 can be connected to the exposed second portion 50B to realize the interconnection between the first circuit board 50 and the folding area 202.

[0171] Since the second part 50B extends outside the gap between the folding area 202 and the display area 201, it is also convenient to connect the first electrical connection structure to the exposed second part 50B in the implementation process.

[0172] The first part of this application example can also serve as a support, working together with the support member to improve the overall strength of the display module. Compared with the prior art of setting a support member between the folding area and the display area, this application can also compress the size in the stacking direction of the folding area and the display area, for example, it can compress the size of the display module in the Z direction.

[0173] To protect the folding area 202 and the display area 201, or to protect the display driver chip DDIC30 disposed on the folding area 202, in some examples, as shown in FIG5, which is a partial cross-sectional view of an electronic device according to an example of this application, and can be another structure of the AA cross-sectional view of FIG1, a buffer layer 103 can be disposed on one side of the first circuit board 50. For example, in the example of FIG6, a buffer layer 103 is disposed between the first portion 50A of the first circuit board 50 and the folding area 202. In other examples, a buffer layer 103 can be disposed between the first portion 50A of the first circuit board 50 and the display area 201, such as by disposing the buffer layer 103 between the first portion 50A of the first circuit board 50 and the support member 106. Alternatively, a buffer layer 103 can be disposed between the first portion 50A of the first circuit board 50 and the folding area 202, and also between the first portion 50A of the first circuit board 50 and the display area 201.

[0174] The buffer layer 103 may be selected from at least one of foam, polyethylene terephthalate (PET), or thermoplastic polyurethane (TPU).

[0175] The first electrical connection structure 60 for connecting the second part 50B and the folded area 202 has several implementations, as described below.

[0176] As shown in Figure 6, which is a partial cross-sectional view of an electronic device according to an example of this application, it can be another structure of the AA cross-sectional view in Figure 1.

[0177] In this implementation, the first electrical connection structure 60 includes a flexible printed circuit (FPC) 601. One end of the flexible printed circuit 601 is connected to the folding area 202, and the other end of the flexible printed circuit 601 is connected to the second portion 50B of the first circuit board 50. Thus, signals between the first circuit board 50 and the folding area 202 can be transmitted through the flexible printed circuit 601.

[0178] In some examples, the first electrical connection structure 60 can be a single-layer flexible circuit board 601, which can further improve the flexibility of the flexible circuit board 501, reduce the risk of fretting fatigue and wire breakage, and improve the stability and reliability of the electrical connection structure.

[0179] The single-layer flexible circuit board 601 of this application example can be understood as including a circuit layer and a flexible substrate for covering the circuit layer. In some structures, it may also include a cover film that can isolate the circuit layer from the air.

[0180] As shown in Figures 7 and 8, Figure 7 illustrates a top view of the folding area 202, and Figure 8 illustrates a top view of the second part 50B of the first circuit board 50.

[0181] In this example, as shown in Figure 7, the surface of the folding area 202 facing away from the display area has multiple connecting contact points 2021, which can be arranged at intervals along one direction. As shown in Figure 8, the surface of the second part 50B of the first circuit board 50 facing away from the display area has multiple connecting contact points 501, which can be arranged at intervals along one direction.

[0182] The arrangement direction of multiple connecting contact points 2021 can be the same as the arrangement direction of multiple connecting contact points 501, for example, they can all be arranged along the width direction X of the electronic device.

[0183] As shown in Figures 9 and 10, Figure 9 exemplarily shows a partial cross-sectional view of an electronic device, and Figure 10 illustrates a top view of the connection between the flexible circuit board 601, the first circuit board 50, and the folding area 202. To clearly show the positional relationship of the various structural components, Figure 10 is a perspective view.

[0184] Referring to Figures 9 and 10, a first conductive film layer 602 can be disposed on multiple connection contact points 2021, and a second conductive film layer 603 can be disposed on multiple connection contact points 501. One end of the flexible circuit board 601 is connected to the first conductive film layer 602, and the other end of the flexible circuit board 601 is connected to the second conductive film layer 603. For example, the flexible circuit board 601 can be connected to the first conductive film layer 602 using a bonding process, and the flexible circuit board 601 can be connected to the second conductive film layer 603 using a boodin process.

[0185] In some examples, connection contact 2021 or connection contact 501 may be referred to as a gold finger, or as a solder pad, or as a connection pin.

[0186] In some alternative structures, the first conductive film layer 602 or the second conductive film layer 603 can be anisotropically conductive adhesive film (ACF). Anisotropically conductive adhesive film (ACF) can be understood as a thin film made by uniformly mixing tiny conductive particles and epoxy resin adhesive. When the film is placed between two contact points and subjected to temperature and pressure for a period of time, an electrical path will be formed between the two contact points.

[0187] Because the coefficient of thermal expansion (CTE) of the folding area 202 of the display screen is different from that of the first circuit board 50, with the first circuit board 50 having a larger CTE, the spacing between two adjacent connection points 501 on the first circuit board 50 is larger in order to achieve the connection between the flexible circuit board 601 and the first circuit board 50. Since the CTE of the first circuit board 50 and the CTE of the flexible circuit board 601 do not match, the connection point 501 on the first circuit board 50 may shift during connection.

[0188] In one example, as shown in Figure 11, when the number of connecting contact points 501 is small, the dimensions in the arrangement direction of multiple connecting contact points 501 are ample. For example, the width direction X of the electronic device can accommodate the arrangement of multiple connecting contact points 501. Multiple connecting contact points 501 can be set as a group, and multiple connecting contact points 2021 can be set as a group. For example, the spacing S1 between two adjacent connecting contact points 501 can be greater than the spacing S2 between two adjacent connecting contact points 2021.

[0189] In some other examples, such as Figure 12, when there are many connecting contact points 501, multiple sets of second connecting contact points 501 can be set. In the example of Figure 12, there are first sets of connecting contact points 5011 and second sets of connecting contact points 5012. By setting multiple sets of connecting contact points, it can be ensured that the distance between two adjacent connecting contact points in each set is large enough. For example, in the first set of connecting contact points 5011, the distance between two adjacent connecting contact points is S3, and the distance between two adjacent connecting contact points on the folding area 202 is S4. S3 is greater than S4. This can alleviate the problem that the connection between the first circuit board 50 and the flexible circuit board 601 is unreliable or even fails due to the mismatch of thermal expansion coefficients.

[0190] Continuing with Figure 12, when multiple sets of connection contacts 501 are set, each set of connection contacts can have different functions. For example, in Figure 12, the first set of connection contacts 5011 is a signal connection contact used for transmitting signals, and the second set of connection contacts 5012 is a power connection contact used for transmitting voltage.

[0191] For example, the area of ​​the connecting contact 501 in the second set of connecting contacts 5012 used for voltage transmission can be larger than the area of ​​the connecting contact 501 in the first set of connecting contacts 5011. For voltage signals that require impedance control, increasing the area of ​​the connecting contacts reduces the transmission impedance.

[0192] In some examples, in the second set of connecting contacts 5012 used for transmitting voltage, the size of the connecting contact 501 in the second direction can be increased, such that the size d1 of the connecting contact 501 in the second set of connecting contacts 5012 in the second direction is greater than the size d2 of the connecting contact 501 in the first set of connecting contacts 5011 in the second direction. In this example, the first set of connecting contacts 5011 and the second set of connecting contacts 5012 are arranged along the first direction, which intersects the second direction, for example, the first direction is perpendicular to the second direction.

[0193] As shown in Figure 13, in this example, a reserved connection contact point 110 for connection with the second circuit board can be reserved on the second part 50B. When the reserved connection contact point 110 is connected to the second circuit board, the second electrical connection structure used to connect the reserved connection contact point 110 and the second circuit board can be at least one of flexible circuit board, metal wire, etc.

[0194] In the above example, it is shown that the flexible circuit board 601 can be used to electrically connect the folding area 202 and the second part 50B of the first circuit board 50. For example, the flexible circuit board 601 can be connected to the second part 50B of the first circuit board 50 using the BOODING process, and the flexible circuit board 601 can be connected to the folding area 202 using the BOODIN process.

[0195] Figure 14 is a structural diagram of another electrical connection structure given in an embodiment of this application, and Figure 15 is a top view of Figure 14.

[0196] In this example, metal wires 604 can be used to electrically connect the folding area 202 and the second part 50B of the first circuit board 50. For example, the folding area 202 has multiple connection contacts 2021, and the second part 50B of the first circuit board 50 has multiple connection contacts 501, as shown in FIG15. The multiple connection contacts 2021 and the multiple connection contacts 501 can be connected one-to-one by multiple metal wires 604.

[0197] In some processes, wire bonding can be used to connect the metal wire 604 to the connection contact 2021, and to connect the metal wire 604 to the connection contact 501. Alternatively, in some implementations, as shown in Figure 14, a first conductive film layer 602 can be provided on multiple connection contacts 2021, and a second conductive film layer 603 can be provided on multiple connection contacts 501. One end of the metal wire 604 is connected to the first conductive film layer 602, and the other end of the metal wire 604 is connected to the second conductive film layer 603.

[0198] When there are many connecting contact points 501 as shown in Figure 15, multiple sets of second connecting contact points 501 can be set. For example, there can be a first set of connecting contact points and a second set of connecting contact points. By setting multiple sets of connecting contact points, it can be ensured that the distance between two adjacent connecting contact points in each set is large enough. For example, the distance between two adjacent connecting contact points in the first set is S3, and the distance between two adjacent connecting contact points on the folding area 202 is S4. S3 is greater than S4. This can alleviate the problem that the connection between the first circuit board 50 and the flexible circuit board 601 is unreliable or even fails due to the mismatch of thermal expansion coefficients.

[0199] When multiple sets of connection contacts 501 are set, each set of connection contacts can have different functions. For example, the first set of connection contacts is a signal connection contact for transmitting signals, and the second set of connection contacts is a power connection contact for transmitting voltage.

[0200] For example, the area of ​​the connecting contact 501 in the second set of connecting contacts used for transmitting voltage can be larger than the area of ​​the connecting contact 501 in the first set of connecting contacts. For voltage signals that require impedance control, increasing the area of ​​the connecting contact reduces the transmission impedance.

[0201] In some examples, the size of the second set of connecting contacts 501 in the second direction can be increased, such that the size d1 of the connecting contact 501 in the second set of connecting contacts 501 in the second direction is greater than the size d2 of the connecting contact 501 in the first set of connecting contacts 501 in the second direction. In this example, the first set of connecting contacts and the second set of connecting contacts are arranged along the first direction, and the first direction intersects the second direction, for example, the first direction is perpendicular to the second direction.

[0202] Figure 16 is a structural diagram of another electrical connection structure according to an embodiment of this application, which illustrates a vertical interconnect structure. Figures 17 and 18 are enlarged views of point P in Figure 16.

[0203] As shown in Figures 16 and 17, a conductive via 2022 is provided in the folding area 202. One end of the conductive via 2022 is connected to the second part 50B of the first circuit board 50, thereby realizing the interconnection between the folding area 202 and the first circuit board 50.

[0204] For example, as shown in Figure 17, a conductive via 2022 can be provided in the folding area 202, and a connection contact 2023 can be provided on the surface of the folding area 202 opposite to the first circuit board 50. One end of the conductive via 2022 is connected to the connection contact 2023, and the other end is connected to the circuit layer on the folding area 202. In addition, a connection contact 502 can be provided on the surface of the first part 50A of the first circuit board 50 opposite to the folding area 202, and the connection contact 2023 is connected to the connection contact 502. For example, the connection contact 2023 and the connection contact 502 can be connected through a conductive film layer 60, thereby realizing the vertical interconnection between the folding area 202 and the first circuit board 50.

[0205] In some structures, the conductive via 2022 can be a through silicon via (TSV).

[0206] When the electrical connection structure shown in Figures 16 and 17 is used, the signal transmission path between the folding area 202 and the first circuit board 50 can be further shortened, reducing link loss and reducing the loss of the display device.

[0207] In some examples, the gap between the folded area 202 and the first portion 50A of the first circuit board 50 may be filled with an adhesive layer 109, such as a pressure-sensitive adhesive or an anisotropically conductive adhesive film (ACF).

[0208] In some examples, such as in Figures 17 and 18 above, the connecting contact point 2023 can be referred to as the first connecting contact point, the connecting contact point 502 can be referred to as the second connecting contact point, as in Figures 7 and 8, the connecting contact point 501 can be referred to as the third connecting contact point, and the connecting contact point 2021 can be referred to as the fourth connecting contact point.

[0209] Figure 19 is a structural diagram of another electrical connection structure given in the embodiment of this application, which can be another structure of the AA cross-sectional view in Figure 1.

[0210] In this implementation structure, the first circuit board 50 includes a first part 50A and a second part 50B. The substrate in the second part 50B can be a flexible substrate. The first part 50A includes a flexible substrate and a rigid substrate. That is, the first circuit board 50 provided in this example is a rigid-flex board. The second part 50B has stronger flexibility than the first part 50A. The substrate of the second part 50B is the same as the substrate of the first electrical connection structure 60. For example, the first electrical connection structure 60 is a flexible circuit board.

[0211] The stronger first part 50A can be stacked in the gap between the folding area 202 and the display area 201, providing strong support, while the more flexible second part 50B can be electrically connected to the folding area 202.

[0212] For example, in this example, a flexible circuit board 601 can be used to connect the folded area 202 and the second part 50B. Since the substrate of the second part 50B is the same as the substrate of the first electrical connection structure 60, this can reduce the problem of unreliable connection or even failure of the first circuit board 50 and the first electrical connection structure 60 due to the mismatch of the thermal expansion coefficients of the first electrical connection structure 60 and the first circuit board 50.

[0213] Figure 20 is a structural diagram of a first circuit board 50 that can be applied to Figure 19, as an example of this application. The first circuit board 50 is a rigid-flex board. Multiple connection contact points 501 can be provided on the surface of the second part 50B facing the folding area 202, and multiple connection contact points 2021 can be provided on the surface of the folding area 202 away from the display area, as shown in Figure 19. A first conductive film layer 602 can be provided on the multiple connection contact points 2021, and a second conductive film layer 603 can be provided on the multiple connection contact points 501. One end of the flexible circuit board 601 is connected to the first conductive film layer 602, and the other end of the flexible circuit board 601 is connected to the second conductive film layer 603.

[0214] When there are many connecting contact points 501 as shown in Figure 20, multiple sets of second connecting contact points 501 can be set. For example, there can be a first set of connecting contact points and a second set of connecting contact points. By setting multiple sets of connecting contact points, it can be ensured that the distance between two adjacent connecting contact points in each set is large enough. For example, the distance between two adjacent connecting contact points in the first set is S3, and the distance between two adjacent connecting contact points on the folding area 202 is S4. S3 is greater than S4. This can alleviate the problem that the connection between the first circuit board 50 and the flexible circuit board 601 is unreliable or even fails due to the mismatch of thermal expansion coefficients.

[0215] When multiple sets of connection contacts 501 are set, each set of connection contacts can have different functions. For example, the first set of connection contacts is a signal connection contact for transmitting signals, and the second set of connection contacts is a power connection contact for transmitting voltage.

[0216] For example, the area of ​​the connecting contact 501 in the second set of connecting contacts used for transmitting voltage can be larger than the area of ​​the connecting contact 501 in the first set of connecting contacts. For voltage signals that require impedance control, increasing the area of ​​the connecting contact reduces the transmission impedance.

[0217] In some examples, the size of the second set of connecting contacts 501 in the second direction can be increased, such that the size d1 of the connecting contact 501 in the second set of connecting contacts 501 in the second direction is greater than the size d2 of the connecting contact 501 in the first set of connecting contacts 501 in the second direction. In this example, the first set of connecting contacts and the second set of connecting contacts are arranged along the first direction, and the first direction intersects the second direction, for example, the first direction is perpendicular to the second direction.

[0218] Figure 21 is a structural diagram of another electrical connection structure given in the embodiment of this application, which is another structure of the AA cross-sectional view of Figure 1.

[0219] In this example, the first circuit board 50 includes a first part 50A and a second part 50B. The substrate in the second part 50B can be a flexible substrate. The first part 50A includes a flexible substrate and a rigid substrate, that is, the first circuit board 50 is a rigid-flex board. The second part 50B and the first electrical connection structure 60 are an integral structure.

[0220] Continuing with Figure 21, the second part 50B forms the first electrical connection structure, and the second part 50B is bent and connected to the folded area 202. For example, the second part 50B can be connected to the first conductive film layer 602 on the connection contact point on the folded area 202.

[0221] Since the example in this application involves bending and connecting the highly flexible second part 50B of the first circuit board 50 to the folding area 202, a single electrical connection process can be used to interconnect the first circuit board 50 and the folding area 202. For example, a single BOODING process can be used to simplify the manufacturing process, shorten the manufacturing process, and reduce manufacturing costs.

[0222] Since the second part 50B of the first circuit board 50 has low strength, in order to avoid the second part 50B being bent and interfering with the adjacent structural components, and to prevent damage to the second part 50B, and to meet the reliability requirements of dynamic scenarios such as micro-motion, drop, and rolling, as shown in Figure 21, a buffer layer 103 can be provided between the second part 50B and the outer peripheral structural components. For example, a buffer layer 103 can be provided between the second part 50B and the wall of the battery 40.

[0223] The buffer layer 103 may be selected from at least one of foam, polyethylene terephthalate (PET), or thermoplastic polyurethane (TPU).

[0224] In some examples, the bending radius of the second part 50B can be greater than or equal to 0.3, for example, it can be greater than or equal to 0.6.

[0225] Figure 22 is a structural diagram of another electrical connection structure given in the embodiment of this application, which is another structure of the AA cross-sectional view of Figure 1.

[0226] In this example, the second part 50B of the first circuit board 50 includes a bottom part 50B1 and a protruding part 50B2. The bottom part 50B1 is connected to the first part 50A, and the protruding part 50B2 is located on the side of the bottom part 50B1 away from the display area.

[0227] In some examples, as shown in Figure 22, the surface of the protrusion 50B2 may be flush with the surface of the folded area 202. For instance, the protrusion 50B2 protrudes away from the display area 201; the folded area 202 has a first surface away from the display area, and the protrusion 50B2 has a second surface away from the display area 201; the first and second surfaces are flush. The first electrical connection structure may include a flexible circuit board 601, one end of which is connected to the folded area 202, and the other end of which is connected to the protrusion 50B2.

[0228] The folding area 202 has multiple connecting contact points, and the protruding portion 50B2 has multiple connecting contact points. One end of the flexible circuit board 501 is connected to the multiple connecting contact points on the folding area 202, and the other end of the flexible circuit board 501 is connected to the multiple connecting contact points on the protruding portion 50B2.

[0229] In this structure, since the surface of the protruding portion 50B2 can be flush with the surface of the folding area 202, the connection positions of the flexible circuit board 601 and the multiple connection points on the folding area 202, and the connection positions of the flexible circuit board 601 and the multiple connection points on the protruding portion 50B2 are basically at the same height. In the feasible connection process, a single connection process can be used to connect the flexible circuit board 601 and the folding area 202, and to connect the flexible circuit board 601 and the protruding portion 50B2. For example, the electrical connection structure can be connected using a single BOODING process, which can simplify the connection process and shorten the manufacturing process.

[0230] In addition, since the surface of the protruding portion 50B2 can be flush with the surface of the folded area 202, that is, the first circuit board 50 is partially raised, so that the electrical connection structure (e.g., flexible circuit board) is basically in a horizontal and unbent state. In this way, the risk of fatigue breakage of the electrical connection structure is relatively lower, and the stability and reliability of the electrical connection are improved.

[0231] In some feasible processes, the printed circuit board can be made to the height of the protruding part 50B2, and then the part that needs to be recessed can be cut into a recessed position to form the first circuit board 50 with the structure shown in Figure 22.

[0232] In the example of Figure 22, the electrical connection structure can be a metal wire, or it can be other electrical connection structures.

[0233] When there are many connecting contact points on the protruding portion 50B2 as shown in Figure 22, these connecting contact points can be set in multiple groups, such as a first group of connecting contact points and a second group of connecting contact points. By setting multiple groups of connecting contact points, it can be ensured that the distance between two adjacent connecting contact points in each group is large enough. For example, in the first group of connecting contact points, the distance between two adjacent connecting contact points is S3, and the distance between two adjacent connecting contact points on the folded area 202 is S4. S3 is greater than S4. This can alleviate the problem that the connection between the first circuit board 50 and the flexible circuit board 601 is unreliable or even fails due to the mismatch of thermal expansion coefficients.

[0234] When multiple sets of connection contacts are provided on the protruding portion 50B2, each set of connection contacts can have different functions. For example, the first set of connection contacts is a signal connection contact for transmitting signals, and the second set of connection contacts is a power connection contact for transmitting voltage.

[0235] For example, the area of ​​the connecting contacts in the second set of connecting contacts used for voltage transmission can be larger than the area of ​​the connecting contacts in the first set of connecting contacts. For voltage signals that require impedance control, increasing the area of ​​the connecting contacts reduces the transmission impedance.

[0236] In some examples, the size of the second set of contact points used for transmitting voltage can be increased in the second direction, such that the size d1 of the contact point in the second set of contact points in the second direction is greater than the size d2 of the contact point in the first set of contact points in the second direction. In this example, the first set of contact points and the second set of contact points are arranged along the first direction, which intersects the second direction, for example, the first direction is perpendicular to the second direction.

[0237] In some examples, the Young's modulus of the first circuit board 50 is 30 gigapascals (GPA). In order to improve the support strength for the folding area 202 or the display area 201, as shown in Figure 23, which is a partial cross-sectional view of another electronic device according to an embodiment of this application, and is another structure of the AA cross-sectional view of Figure 1, a reinforcing plate 104 can be provided in the gap between the folding area 202 and the display area 201. For example, the reinforcing plate 104 is provided on one side of the first circuit board 50. In the example of Figure 22, the reinforcing plate 104 is provided between the first circuit board 50 and the display area 201.

[0238] In other examples, the reinforcing plate 104 may be disposed between the first circuit board 50 and the folding area 202, for example, between the first circuit board 50 and the buffer layer 103.

[0239] The reinforcing plate 104 can be made of a metal material, such as steel sheet or aluminum sheet.

[0240] As shown in Figure 23, in this example, a reinforcing plate is set in the gap between the folding area 202 and the display area 201 to increase the Young's modulus and reduce the risk of damage to the display screen caused by external impact scenarios such as micro-motion and drops.

[0241] To avoid significant impact on the display screen or display driver chip in scenarios such as micro-movements or drops, as shown in Figure 24, which is a partial cross-sectional view of another electronic device according to an embodiment of this application, another structure of the AA cross-sectional view in Figure 1 can have a recess 50C formed in the first part 50A of the first circuit board 50, which can serve as a buffer.

[0242] In some examples, the depth of the cavity 50C may be 5% to 60% of the thickness of the first portion 50A of the first circuit board 50, for example, it may be 50% or 30% of the thickness of the first portion 50A of the first circuit board 50. In other examples, the cavity 50C may penetrate the first circuit board along the thickness direction of the first portion 50A of the first circuit board 50.

[0243] The cavity 50C may be recessed from the upper surface to the lower surface of the first portion 50A as shown in FIG. 24, or, in other examples, the cavity 50C may be recessed from the lower surface to the upper surface of the first portion 50A. In this example, the upper surface of the first portion 50A can be understood as the surface facing the folding area 202, and the lower surface of the first portion 50A can be understood as the surface facing the display area 201.

[0244] In some implementations, as shown in Figure 24, the projection of the display driver chip 30 onto the first portion 50A is a first projection. To further protect the display driver chip 30, the first projection is located within the boundary of the cavity 50C. Alternatively, the first projection at least partially overlaps with the cavity 50C.

[0245] In the display module of this application example, as shown in the above examples, the first part 50A of the first circuit board 50 is disposed between the display area 201 and the folding area 202 of the display screen. The first circuit board 50 integrates high-speed signal lines. In some examples, such as in digital circuits, when the transmission path length of the digital signal is greater than 1 / 6 times the wavelength of the transmission signal, the signal can be regarded as a high-speed signal.

[0246] Common high-speed signal interface protocols include Universal Serial Bus (USB), Mobile Industry Processor Interface (MIPI), Double Data Rate SDRAM (DDR), PCI Express (PCIe), and High Definition Multimedia Interface (HDMI).

[0247] To mitigate electromagnetic interference between high-speed signals and the display screen, this application provides examples of possible methods, as shown below.

[0248] In the first circuit board 50, at least the first portion 50A has multiple stacked circuit layers, including a surface circuit layer on the surface and an inner circuit layer on the inside, so that high-speed signal lines in the first circuit board can be set in the inner circuit layer.

[0249] As shown in Figure 25, which is a cross-sectional view of a first circuit board 50 according to an example of this application, in this example, both the first portion 50A and the second portion 50B of the first circuit board 50 include multiple stacked circuit layers, such as a first circuit layer M1, a second circuit layer M2, a third circuit layer M3, and a fourth circuit layer M4 stacked sequentially. A dielectric layer D is provided between adjacent circuit layers, and adjacent circuit layers can be connected through conductive channels penetrating the dielectric layer. High-speed signal lines can be disposed in the second circuit layer M2, or in the third circuit layer M3, or in both the second and third circuit layers M2 and M3.

[0250] This can be understood as follows: In the first circuit board 50 of this application example, high-speed signal lines are embedded inside the circuit board. Since there are dielectric layers on both the upper and lower sides of the high-speed signal lines, these dielectric layers can play an electrical isolation role, reducing the electromagnetic interference of external electromagnetic fields on high-speed signals. Alternatively, in some circuit boards, inner layer signals usually have power layers or ground layers as reference planes. Power layers and ground layers can be regarded as large-area equipotential planes, which can provide a relatively stable electromagnetic environment for high-speed signals. The electromagnetic field generated by high-speed signals during transmission will be confined to the area between the signal layer and the reference plane, reducing the possibility of outward radiation, and at the same time blocking external electromagnetic interference from entering the signal transmission area.

[0251] In some examples, as shown in FIG26, when the second portion 50B of the first circuit board 50 has a protrusion 50B2, the high-speed signal line can be in the internal circuit layer of the first portion 50A and in the internal circuit layer of the second portion 50B.

[0252] As shown in Figures 27 and 28, Figures 27 and 28 are another implementation structure of this application example to reduce electromagnetic interference between high-speed signals and the display screen.

[0253] In this example, in the first circuit board 50, at least the first part 50A includes multiple stacked circuit layers, such as a first circuit layer M1, a second circuit layer M2, a third circuit layer M3 and a fourth circuit layer M4 stacked in sequence, with a dielectric layer D between adjacent circuit layers, and adjacent circuit layers can be connected by conductive channels through the dielectric layer.

[0254] High-speed signal lines can be placed in the surface circuit layer of the first circuit board 50, and a shielding layer 105 can be placed on the surface circuit layer. For example, high-speed signal lines can be placed in the first circuit layer M1 shown in Figure 27, and a shielding layer 105 is placed on the first circuit layer M1. The shielding layer 105 can reduce electromagnetic interference between the display screen and high-speed signals, thereby improving display performance.

[0255] The surface circuit layer of the first circuit board 50 includes a first surface circuit layer located on the upper surface and a second surface circuit layer located on the lower surface. In some examples, as shown in FIG28, high-speed signal lines can be disposed in the first surface circuit layer, and shielding layer 105 can be disposed on the first surface circuit layer; in other examples, high-speed signal lines can be disposed in the second surface circuit layer, and shielding layer 105 can be disposed on the second surface circuit layer; in still other examples, high-speed signal lines can be disposed in both the first and second surface circuit layers, with shielding layer 105 disposed on both the first and second surface circuit layers.

[0256] In some feasible processes, a shielding material can be coated on the surface of the first circuit board 50 to form a shielding layer; or, a shielding layer can be attached to the surface of the first circuit board 50.

[0257] The shielding layer 105 may be a metal layer, such as a copper layer; or it may include a polymer of metal or a high-conductivity material.

[0258] In some configurations, the surface of the first circuit board 50 has a solder resist layer, and the shielding layer 105 can be disposed on the solder resist layer.

[0259] The electrical connection folding area 202 and the first electrical connection structure 60 of the first circuit board 50 in this application example can have a shielding layer provided on the surface of the first electrical connection structure 60. For example, when using a flexible circuit board, a shielding layer can be provided on the surface of the flexible circuit board 601, as shown in FIG29. FIG29 shows the structure of a single-layer flexible circuit board 601. The single-layer flexible circuit board 601 includes a circuit layer M and a dielectric layer D. The circuit layer M is located on the dielectric layer D, and the shielding layer 108 is provided on the circuit layer M.

[0260] As shown in Figure 30, which is a partial structural diagram of an electronic device according to an example of this application, in this example, a shielding layer 105 is provided on the surface of a first circuit board 50, and a shielding layer 108 is provided on the surface of a flexible circuit board 601.

[0261] By providing a shielding layer 105 on the first circuit board 50 and a shielding layer 108 on the first electrical connection structure 60, the electromagnetic interference between the display screen and the circuit board can be further reduced, thereby improving the display effect of the display screen.

[0262] In some structures, as shown in Figure 30, the shielding layer 108 may be located on the side of the first electrical connection structure 60 away from the folded area 202.

[0263] In some examples, when the first circuit board 50 is a rigid-flex board, as shown in Figure 31, a shielding layer 105 can be provided on the first part 50A and the second part 50B.

[0264] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0265] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: The display screen (20) includes a display area (201), a folding area (202), and a connecting area (203). The folding area (202) is located on the side of the display area (201) facing away from the display surface. The connecting area (203) connects the display area (201) and the folding area (202). There is a gap between the folding area (202) and the display area (201). A first circuit board (50) includes a first part (50A) and a second part (50B), the first part (50A) being located within the gap and the second part (50B) being located outside the gap, and an electronic device (801) being disposed on the second part (50B). A first electrical connection structure (60) is connected to the second part (50B) and the first electrical connection structure (60) is connected to the folded area (202).

2. The display module according to claim 1, characterized in that, The first electrical connection structure (60) includes a flexible circuit board (601), or the first electrical connection structure includes a metal wire (604).

3. The display module according to claim 1, characterized in that, The first electrical connection structure (60) includes a conductive via (2022) disposed in the folding area (202), and one end of the conductive via (2022) facing the first circuit board (50) is electrically connected to the first part (50A).

4. The display module according to claim 3, characterized in that, The folding area (202) has a first connecting contact point (2023) on the side facing the first circuit board (50), and one end of the conductive via (2022) facing the first circuit board (50) is connected to the first connecting contact point (2023). The first portion (50A) has a second connecting contact point (502) on the side facing the folding area (202), and the first connecting contact point (2023) is connected to the second connecting contact point (502) through a conductive film layer (60).

5. The display module according to any one of claims 1-4, characterized in that, The second part (50B) includes a bottom part (50B1) and a protruding part (50B2), the bottom part (50B1) being connected to the first part (50A), and the protruding part (50B2) being located on the side of the bottom part (50B1) facing away from the display area (201); the folding area (202) has a first surface facing away from the display area (201), and the protruding part (50B2) has a second surface facing away from the display area (201); The first surface and the second surface are flush; The first electrical connection structure (60) is connected to the protrusion (50B2).

6. The display module according to any one of claims 1-5, characterized in that, The second part (50B) has a plurality of third connecting contact points (501). The folding area (202) has a plurality of fourth contact points (2021), and the arrangement direction of the plurality of fourth contact points (2021) is consistent with the arrangement direction of the plurality of third contact points (501); the distance between two adjacent third contact points (501) is greater than the distance between two adjacent fourth contact points (2021).

7. The display module according to any one of claims 1-5, characterized in that, The second part (50B) has a first set of connecting contact points (5011) and a second set of connecting contact points (5012), the first set of connecting contact points (5011) and the second set of connecting contact points (5012) are arranged along a first direction; Each of the first group of connecting contact points (5011) and the second group of connecting contact points (5011) includes a plurality of third connecting contact points (501) arranged along the second direction, the first direction intersecting the second direction.

8. The display module according to claim 7, characterized in that, The folding area (202) has a plurality of fourth contact points (2021), which are arranged along the second direction; The distance between two adjacent third contact points (501) in the first group of contact points (5011) is greater than the distance between two adjacent fourth contact points (2021).

9. The display module according to claim 7 or 8, characterized in that, The third connection point (501) in the first group of connection points (5011) includes a signal connection point, and the third connection point (501) in the second group of connection points (5012) includes a power connection point.

10. The display module according to claim 9, characterized in that, The area occupied by the power connection contact on the second part (50B) is greater than the area occupied by the signal connection contact on the second part (50B).

11. The display module according to claim 10, characterized in that, The size of the power connection contact point in the second direction is larger than the size of the signal connection contact point in the second direction.

12. The display module according to any one of claims 1-11, characterized in that, The substrate of the second part (50B) is the same as the substrate of the first electrical connection structure (60).

13. The display module according to claim 12, characterized in that, The second part (50B) and the first electrical connection structure (60) are integrally formed.

14. The display module according to any one of claims 1-13, characterized in that, The display module also includes a reinforcing plate (104); The reinforcing plate (104) is provided between the first circuit board (50) and the folding area (202), and / or the reinforcing plate (104) is provided between the first circuit board (50) and the display area (201).

15. The display module according to any one of claims 1-14, characterized in that, A cavity (50D) is formed in the first circuit board (50), and a display driver chip (30) is provided on the side of the folding area (202) opposite to the display area (501); The display driver chip (30) is at least partially opposite to the cavity (50D).

16. The display module according to any one of claims 1-15, characterized in that, The first part (50A) includes multiple stacked circuit layers; The multi-layered stacked circuit layers include: a surface circuit layer located on the surface and an inner circuit layer located inside. The inner circuit layer includes high-speed signal lines.

17. The display module according to any one of claims 1-15, characterized in that, The first part (50A) includes multiple stacked circuit layers; The multi-layered stacked circuit layers include: a surface circuit layer located on the surface and an inner circuit layer located inside. The surface circuit layer includes high-speed signal lines; A shielding layer (105) is provided on the surface circuit layer.

18. The display module according to any one of claims 1-17, characterized in that, A shielding layer (108) is provided on the surface of the first electrical connection structure (60) away from the folding area (202).

19. An electronic device, characterized in that, include: case; The display module as described in any one of claims 1-18, wherein the display area is connected to the housing.

20. The electronic device according to claim 19, characterized in that, The electronic device further includes a second circuit board (70) and a second electrical connection structure (90), the second electrical connection structure (90) connecting the second circuit board (70) and the second portion (50B) of the first circuit board (50); Electronic devices (802) are disposed on the second circuit board (70).

21. The electronic device according to claim 19 or 20, characterized in that, The electronic device further includes a battery (40) disposed within the housing; The battery (40) and the display area (201) form a cavity (10d), and the folding area (202), the first circuit board (50) and the first electrical connection structure (60) are located within the cavity (10d).

22. A display module, characterized in that, include: The display screen (20) includes a display area (201), a folding area (202), and a connecting area (203). The folding area (202) is located on the side of the display area (201) facing away from the display surface. The connecting area (203) connects the display area (201) and the folding area (202). There is a gap between the folding area (202) and the display area (201). A first circuit board (50) includes a first part (50A) and a second part (50B), the first part (50A) being located within the gap and the second part (50B) being located outside the gap, the second part (50B) having reserved connection contacts (110) for electrical connection of electronic devices. A first electrical connection structure (60) is connected to the second part (50B) and the first electrical connection structure (60) is connected to the folded area (202).

23. The display module according to claim 22, characterized in that, The first electrical connection structure (60) includes a flexible circuit board (601), or the first electrical connection structure includes a metal wire (604).

24. The display module according to claim 22, characterized in that, The first electrical connection structure (60) includes a conductive via (2022) disposed in the folding area (202), and one end of the conductive via (2022) facing the first circuit board (50) is electrically connected to the first part (50A).

25. The display module according to any one of claims 22-24, characterized in that, The second part (50B) includes a bottom part (50B1) and a protruding part (50B2), the bottom part (50B1) being connected to the first part (50A), and the protruding part (50B2) being located on the side of the bottom part (50B1) facing away from the display area (201); the folding area (202) has a first surface facing away from the display area (201), and the protruding part (50B2) has a second surface facing away from the display area (201); The first surface and the second surface are flush; The first electrical connection structure (60) is connected to the protrusion (50B2).

26. An electronic device, characterized in that, include: case; The display module as described in any one of claims 22-25, wherein the display area is connected to the housing; A second circuit board (70) is provided with electronic devices (802); The second electrical connection structure (90) connects the second circuit board (70) and the reserved connection contact point (110).

27. The electronic device according to claim 26, characterized in that, The electronic device further includes a battery (40) disposed within the housing; The battery (40) and the display area (201) form a cavity (10d), and the folding area (202), the first circuit board (50) and the first electrical connection structure (60) are located within the cavity (10d).

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