Display module and electronic device

Abstract

The present application provides a display module and an electronic device. The display module is used for an electronic device, and the display module comprises a display panel and a transmission layer which are stacked. The transmission layer is arranged on the side facing away from a light-exit surface of the display panel, and the transmission layer comprises a metal layer, a substrate, and a first shielding layer which are stacked. The first shielding layer is used for providing shielding between stacked layers above the transmission layer and components below the transmission layer, so as to reduce interference between different parts. The metal layer comprises a first transmission line and a second transmission line, and the first transmission line is used for electrically connecting components in the electronic device. The transmission layer is arranged among the stacked layers of the display module, facilitating the thin and lightweight design of the electronic device. The transmission layer further comprises a sensing unit, and the sensing unit is connected to the second transmission line. By providing the sensing unit and the second transmission line in the transmission layer, the transmission layer can further incorporate a sensing function, thereby making full use of the space of the transmission layer, and achieving more functions.

Description

Display modules and electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202510106112.3, filed with the State Intellectual Property Office of China on January 22, 2025, entitled “Display Module and Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and more particularly to a display module and an electronic device. Background Technology

[0003] Currently, as mobile phones and other electronic devices are developing towards thinner, lighter, more reliable, and longer battery life, display modules are also developing towards higher integration. In addition to realizing basic display functions, they will also integrate touch on encapsulation (TOE), in-screen fingerprint, electromagnetic induction, and pressure functions.

[0004] Electronic devices contain numerous transmission lines, such as display signal transmission lines, camera signal transmission lines, radio frequency signal transmission lines, audio signal transmission lines, sensor transmission lines, and power transmission lines. In scenarios requiring long-range signal transmission, flexible printed circuit boards (FPCs) are used as the medium for these signal transmissions, enabling communication and power supply between the system-on-a-chip (SOC) and various hardware interfaces.

[0005] However, in order to achieve interconnection between devices, FPCs will pass through the overall structural components, which usually need to be hollowed out or otherwise specially treated. This limits the flexibility of the overall architecture design, affects the overall space and thickness, and is not conducive to the further thinning and lightening of terminal electronic products. Summary of the Invention

[0006] This application provides a display module and an electronic device, which solves the problem that the interconnection of components within the electronic device affects the overall architecture.

[0007] To achieve the above objectives, this application adopts the following technical solution:

[0008] A first aspect of this application provides a display module for use in an electronic device. The display module includes: a display panel and a transmission layer stacked together, the transmission layer being disposed on a side opposite to the light-emitting surface of the display panel; the transmission layer includes: a metal layer, a substrate, and a first shielding layer stacked together; the metal layer includes: a first transmission line and a second transmission line, the first transmission line being used for electrically connecting devices within the electronic device; the transmission layer further includes: a sensing unit connected to the second transmission line. Thus, by providing a first transmission line within the transmission layer, the transmission layer can perform signal transmission functions, enabling signal connections between devices within the electronic device. Since the transmission layer is located within the stacked layers of the display module, it eliminates the need for additional transmission lines in other locations within the electronic device, reducing the number of transmission lines and facilitating a thinner and lighter design. This saves space in the overall electronic device architecture, increases battery capacity, and provides more options for signal transmission between devices. Furthermore, the sensing unit and the second transmission line can also be provided within the transmission layer, allowing the transmission layer to simultaneously add sensing functionality, fully utilizing its space and enabling more functions. Furthermore, by adding a shielding layer, shielding can be achieved between the layers above and below the transmission layer, reducing interference between different parts. This transmission layer adopts a circuit board-like structure and can be manufactured using similar processes, reducing manufacturing complexity and facilitating mass production.

[0009] In one alternative implementation, the projection of the sensing unit onto the substrate and the projection of the first transmission line onto the substrate are spaced apart. This reduces interference between the sensing unit and the first transmission line.

[0010] In one alternative implementation, the projections of the first transmission line onto the substrate and the projections of the second transmission line onto the substrate are spaced apart. This reduces interference between the sensing unit and the first transmission line.

[0011] In one optional implementation, the sensing unit is connected to the substrate and is disposed on the same layer as the metal layer. This allows the sensing unit, the first transmission line, and the second transmission line to be fabricated simultaneously using a process similar to circuit fabrication. The first and second transmission lines can be co-layered circuit structures, formed in a single step, reducing the number of process steps and lowering the manufacturing complexity. Furthermore, the co-layering of the sensing unit with the metal layer reduces the space occupied in the thickness direction of the electronic device compared to arranging the sensing unit and the metal layer along the thickness direction, which is beneficial for achieving a thinner and lighter design of the electronic device.

[0012] In one optional implementation, the sensing unit includes a coil. This coil can be a wireless charging coil. The electronic device also includes a charging management module, which can receive wireless charging input through the wireless charging coil. While charging the battery, the charging management module can also supply power to the electronic device through a power management module. Alternatively, the coil can also be an electromagnetic induction coil. This electromagnetic induction coil can be used to detect the intensity of received electromagnetic radiation. When the electronic device receives strong magnetic field coupling interference, the electromagnetic induction coil can detect the strong magnetic field and then use system notifications, prompts, or other means to avoid or reduce it. Therefore, by placing a coil in the transmission layer, it can be used to detect the magnitude of received electromagnetic radiation, or for wireless charging. This fully utilizes the space of the metal layer, integrating more functions within a limited space, and achieving both a thin and light design and a multi-functional design for the electronic device.

[0013] In one alternative implementation, the sensing unit is disposed on the side of the metal layer facing away from the substrate. This reduces interference between the sensing unit and the metal layer. The second transmission line is connected to the sensing unit, and the second and first transmission lines are an integral structure, formed together using the manufacturing process of a display module. For example, the first and second transmission lines can be manufactured simultaneously using a process similar to circuit board manufacturing. The first and second transmission lines can be co-layered circuit structures, formed in a single step, reducing process steps and lowering manufacturing complexity.

[0014] In one alternative implementation, the sensing unit includes a piezoelectric thin-film sensor. Thus, by integrating the piezoelectric thin-film sensor within the display module, the foldable screen architecture is significantly optimized with minor modifications, increasing overall functionality while eliminating the need for through-axis transmission lines in the electronic device. The sensor can recognize the pressure applied by the user's touch, enabling different operations through point pressure and varying degrees of force. Furthermore, it can monitor module pressure throughout its entire lifecycle, optimizing production line operations and user experience.

[0015] In one optional implementation, the display module includes: a first non-bending area, a bending area, and a second non-bending area connected sequentially. The sensing unit is disposed within the bending area, the first connecting portion is connected to the first non-bending area, and the second connecting portion is connected to the second non-bending area. Therefore, by placing the sensing unit within the bending area, pressure changes in the bending area can be detected, which can be used for bending stress detection. This fully utilizes the space of the metal layer, integrating more functions within a limited space, and balancing the thin and light design with the multi-functional design of electronic devices.

[0016] In one optional implementation, the electronic device further includes a first electronic device and a second electronic device, and the transmission layer further includes a first connection portion and a second connection portion. The first connection portion connects the first transmission line and the first electronic device, and the second connection portion connects the first transmission line and the second electronic device. Thus, the transmission line of the transmission layer and the devices within the electronic device can be connected via the connection portions, and the first electronic device and the second electronic device can transmit signals through the first connection portion, the first transmission line, and the second connection portion.

[0017] In one optional implementation, the display module includes a first window and a second window, located on the side of the transmission layer opposite to the display panel. A first connecting portion is electrically connected to a first transmission line within the first window, and a second connecting portion is electrically connected to the first transmission line within the second window. Thus, the first and second connecting portions are independent structures from the metal layer, and electrical connections between them can be achieved using gold fingers or other electrical connection structures. The first and second connecting portions can employ conductive structures, such as gold fingers, solder pads, board-to-board connectors, etc., to connect the first connecting portion to the metal layer, or to connect the second connecting portion to the metal layer. Furthermore, the closer proximity of the first and second connecting portions within the windows of the display module to the first transmission line allows for a smaller size of the first and second connecting portions, facilitating the thinner and lighter design of electronic devices.

[0018] In one optional implementation, the first connecting portion is connected to a first side of the metal layer, and the second connecting portion is connected to a second side of the metal layer, with the first and second sides corresponding to each other. Thus, the first and second connecting portions and the metal layer can be integrally formed. That is, the first and second connecting portions and the metal layer can be integrally formed using the manufacturing process of a display module, or the first and second connecting portions and the metal layer can be manufactured simultaneously using a process similar to circuit fabrication. The first and second connecting portions and the conductive portions on the metal layer can be a circuit structure arranged on the same layer, formed in a single step. Therefore, the first and second connecting portions and the conductive portions on the metal layer are arranged on the same layer and can be formed simultaneously, reducing the complexity of the manufacturing process.

[0019] In one optional implementation, the display module further includes a support layer disposed between the transmission layer and the display panel. Therefore, the support layer can be used to shield signals inside the electronic device, reducing interference from the transmission layer and devices below the display module to the display panel.

[0020] In one optional implementation, the display module further includes a support layer disposed on the side of the transmission layer opposite to the display panel. Therefore, the support layer can be used to shield signals inside the electronic device, reducing interference from devices below the display module to the display panel.

[0021] In one optional implementation, the display module further includes a support layer disposed on the side of the transmission layer opposite to the display panel. The support layer includes a protective layer and a support member, with the transmission layer disposed between the protective layer and the support member. Thus, the transmission layer can be disposed within the support layer, and the transmission layer can reuse the stacked layers of the support layer. For example, the protective layer in the support layer can serve as the base of the transmission layer, and the support member can serve as a shielding layer. In this way, the transmission layer can be obtained simply by placing a metal layer on the surface of the support layer near the display panel, which is beneficial for further achieving a thinner and lighter design of electronic devices.

[0022] In one alternative implementation, the transmission layer and the display panel are bonded together with an adhesive layer. This allows the transmission layer and the display panel to be connected, achieving an integrated design of the transmission layer and the display module.

[0023] In one alternative implementation, the sensing unit is connected to an external device, including a wireless charger. Thus, the sensing unit can be a coil, used for wirelessly charging electronic devices, and can also be used for strong magnetic field warnings, wireless charging sensing, and other functions.

[0024] In one optional implementation, the electronic device includes a third electronic device, and the transmission layer further includes a third connection portion that connects the second transmission line and the third electronic device. Thus, the transmission line of the transmission layer and the devices within the electronic device can be connected via the connection portion, and the third electronic device and the sensing unit can transmit signals via the third connection portion and the second transmission line.

[0025] In one optional implementation, the display panel includes: a substrate layer, a second shielding layer, and a panel functional layer stacked together, wherein the transmission layer and the display panel are at least partially isolated from each other by the second shielding layer. This further reduces interference from signals within the electronic device to the display panel.

[0026] A second aspect of this application provides an electronic device, comprising: a first electronic device, a second electronic device, and a display module as described above, wherein the first transmission line is connected to the first electronic device and the second electronic device.

[0027] In one optional implementation, the electronic device includes a main circuit board and a sub-circuit board, wherein the first electronic device is disposed on the main circuit board or the sub-circuit board, and the second electronic device is disposed on the main circuit board or the sub-circuit board.

[0028] This application provides a display module and an electronic device. The display module is used in the electronic device and includes: a display panel and a transmission layer stacked together, the transmission layer being disposed on the side opposite to the light-emitting surface of the display panel; the transmission layer includes: a metal layer, a substrate, and a first shielding layer stacked together. The first shielding layer is used to shield between the upper and lower stacked layers of the transmission layer and the devices below it, reducing interference between different parts. The metal layer includes: a first transmission line and a second transmission line, the first transmission line being used to electrically connect the devices within the electronic device. By setting the first transmission line within the transmission layer, the transmission layer can perform signal transmission functions, enabling signal connections between various devices within the electronic device. Since the transmission layer is disposed within the stacked layers of the display module, it eliminates the need for additional transmission lines in other locations within the electronic device, reducing the number of transmission lines within the electronic device. This facilitates the design of a thinner and lighter electronic device, saves space in the overall structure, increases the overall battery capacity, and provides more options for signal transmission between various devices within the electronic device. The transmission layer also includes: a sensing unit connected to the second transmission line. By incorporating a sensing unit and a second transmission line into the transmission layer, the transmission layer can simultaneously enhance its sensing capabilities, fully utilizing its space and enabling more functionalities. Furthermore, this transmission layer employs a circuit board-like structure, allowing it to be manufactured using similar processes, thus reducing manufacturing complexity and facilitating mass production.

[0029] The sensing unit can be an induction coil, a sensing electrode, or a piezoelectric thin-film sensor. The induction coil and sensing electrode can be disposed on the same layer as the metal layer, only needing to avoid the first transmission line. The first and second transmission lines of the sensing unit can be fabricated simultaneously using a process similar to circuit board manufacturing. The first and second transmission lines can be a circuit structure arranged on the same layer, formed in a single step, reducing process steps and lowering the manufacturing difficulty. The piezoelectric thin-film sensor can, for example, be disposed on the side of the metal layer closer to the display panel, i.e., the piezoelectric thin film is stacked with the metal layer. This sensing unit can reuse the substrate and shielding layer of the transmission layer. Compared to making the sensing unit independent of the transmission layer, this reduces the space occupied in the thickness direction of the electronic device, which is beneficial for the thinner and lighter design of the electronic device.

[0030] The transmission layer can also reuse part of the stacked layers of the support layer. For example, the protective layer in the support layer can be used as the base of the transmission layer, and the support member in the support layer can be used as the first shielding layer of the transmission layer. In this way, the transmission layer can be obtained by simply setting a metal layer on the surface of the support layer near the display panel, which is conducive to further realizing the thinner and lighter design of electronic devices. Attached Figure Description

[0031] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0032] Figure 2 is a structural schematic diagram of a candybar mobile phone provided in an embodiment of this application;

[0033] Figure 3 is a structural schematic diagram of a flexible screen mobile phone provided in an embodiment of this application;

[0034] Figure 4 is a structural schematic diagram of another flexible screen mobile phone provided in an embodiment of this application;

[0035] Figure 5 is an NN cross-sectional view of the mobile phone shown in Figure 4;

[0036] Figure 6 is a schematic diagram of the internal interconnection structure of an electronic device;

[0037] Figure 7 is a schematic diagram of the structure of a display module provided in an embodiment of this application;

[0038] Figure 8 is a schematic diagram of the structure of another electronic device provided in an embodiment of this application;

[0039] Figure 9 is a schematic diagram of another display module provided in an embodiment of this application;

[0040] Figure 10A is a schematic diagram of the wiring of a metal layer provided in an embodiment of this application;

[0041] Figure 10B is a schematic diagram of another electronic device provided in an embodiment of this application;

[0042] Figure 11 is a top view of another electronic device provided in an embodiment of this application;

[0043] Figure 12 is a cross-sectional view (AA) of the electronic device shown in Figure 11;

[0044] Figure 13 is a BB cross-sectional view of the electronic device shown in Figure 11;

[0045] Figure 14 is a CC cross-sectional view of the electronic device shown in Figure 11;

[0046] Figure 15 is a schematic diagram of another display module provided in an embodiment of this application;

[0047] Figure 16 is a schematic diagram of another electronic device provided in an embodiment of this application. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0049] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0050] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0051] This application provides an electronic device. This electronic device can be a tablet computer, mobile phone, e-reader, remote control, personal computer (PC), laptop computer, personal digital assistant (PDA), in-vehicle device, smart TV, wearable device, television set, or other products with a display interface, as well as smart display wearable products such as smartwatches and smart bracelets. This application does not impose any special limitations on the form of the above-mentioned electronic device. For ease of explanation, the following embodiments all use a mobile phone as an example for illustration.

[0052] As shown in Figure 1, Figure 1 is a structural schematic diagram of an electronic device provided in an embodiment of this application. The electronic device 1 includes a display module 10, a middle frame 11, and a housing 12. The middle frame 11 is located between the display module 10 and the housing 12.

[0053] Display module 10 is used to display images.

[0054] The display module 10, the middle frame 11, and the housing 12 can be disposed on different layers in the thickness direction of the electronic device. These layers can be parallel to each other, and the plane in which each layer is located can be called the XY plane, and the direction perpendicular to the XY plane can be called the Z direction. For example, the display module 10, the middle frame 11, and the housing 12 can be distributed in layers in the Z direction.

[0055] Display module 10 may include a display screen and a flexible printed circuit (FPC). The display screen can be electrically connected to the printed circuit board (PCB) disposed on the middle frame 11 via the FPC as shown in FIG. 1. This allows the PCB to transmit display data to the display module 10 to control the display module 10 to display images.

[0056] The middle frame 11 is located between the display module 10 and the housing 12. The surface of the middle frame 11 away from the display module 10 is used to mount internal components such as batteries, printed circuit boards (PCBs), cameras, and antennas. After the housing 12 is closed with the middle frame 11, the aforementioned internal components are located between the housing 12 and the middle frame 11.

[0057] The housing 12 is connected to the middle frame 11 to form a cavity for accommodating the aforementioned electronic components such as the PCB, camera, and battery. This prevents external moisture and dust from entering the cavity and affecting the performance of the electronic components.

[0058] This application does not limit the structure of the mobile phone in its embodiments. In some embodiments of this application, as shown in FIG2, the mobile phone can be a candybar phone, which includes a display screen 100. FIG2 is a schematic diagram of the structure of a candybar phone provided in an embodiment of this application.

[0059] Alternatively, as shown in Figure 3, the phone can also be a foldable screen phone. Figure 3 is a structural schematic diagram of a flexible screen phone provided in an embodiment of this application. When the foldable screen phone is in a folded state, the display screen 100 is located inside the device; for example, the phone can be an inward-folding phone. In other embodiments, when the foldable screen phone is in a folded state, the display screen 100 is located outside the device; for example, the phone can be an outward-folding phone.

[0060] In some embodiments, as shown in FIG4, the display screen of the foldable screen phone includes: a first display screen 200 and a second display screen 300, a mid-frame 11 (or support member) and a housing 12 as shown in FIG5. FIG4 is a schematic diagram of another flexible screen phone provided in an embodiment of this application.

[0061] As shown in Figure 4, the first display screen 200 includes a first part A and a second part B. When the foldable screen phone is in a folded state (the angle between the first part A and the second part B of the first display screen 200 is 0°), the first display screen 200 is located on the inner side, the second display screen 300 is located on the outer side, and the first part A of the first display screen 200 is opposite to the second part B of the first display screen 200.

[0062] The first part A of the first display screen 200 and the second display screen 300 are stacked together, the second part B of the first display screen 200 and the housing 12 are stacked together, and the second display screen is positioned opposite to the first part A of the first display screen 200.

[0063] Taking the mobile phone shown in Figure 4 as an example, Figure 5 is an NN cross-sectional view of the mobile phone shown in Figure 4. As shown in Figure 5, the PCB may include a main circuit board 101 and a sub-circuit board 102.

[0064] For example, the main circuit board 101 can be used to integrate electronic devices such as control chips. These control chips include, but are not limited to, system-on-chip (SOC), charging management chips, power management units (PMUs), radio frequency (RF) chips, display chips, application processors (APs), double data rate synchronous dynamic random access memory (DDR), and universal flash storage (UFS). Among these, the radio frequency chip can also be referred to as a radio frequency power amplifier (RF PA).

[0065] The main circuit board 101 can be fixed between the housing 12 and the second part B of the first display screen 200 by means of threaded connection, snap-fit, adhesive, etc. The housing 12 has a camera 14 on the side opposite to the first display screen 200, for example.

[0066] For example, the secondary circuit board 102 can integrate electronic components such as a universal serial bus (USB) device, a subscriber identity module (SIM), a sensor module, a smart power amplifier (smart PA), a fingerprint sensor (FP), a dual / stereo digital microphone interface (DMIC), a charging management module, and a power management module. The USB device can be a USB Type-C interface device, a USB Type-A interface device, a USB Type-Mini-B interface device, or a USB Type-B interface device. A port is provided on the frame corresponding to the USB device. Accessories such as chargers, headphones, and data cables can be electrically connected to the USB device via this port to achieve power, signal, and data transmission.

[0067] The secondary circuit board 102 can also be fixed between the first part A of the first display screen 200 and the second display screen 300 by means of threaded connection, snap-fit, adhesive bonding or welding. A battery 13 and a rotating shaft 15 are provided between the secondary circuit board 102 and the main circuit board 101.

[0068] The display screen has opposing light-emitting and non-light-emitting sides. The light-emitting side refers to the side where the display surface of the screen is located (e.g., the left side of display module 10 in Figure 1), and the non-light-emitting side refers to the side opposite to the light-emitting side (e.g., the right side of display module 10 in Figure 1). The PCB can be located on the non-light-emitting side of the display screen.

[0069] The sensor module may include a gravity sensor, an acceleration sensor, a pressure sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, a distance sensor, a proximity sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, a bone conduction sensor, etc.

[0070] Gyroscope sensors can be used to determine the motion posture of electronic devices. In some embodiments, the angular velocity of the electronic device around three axes (i.e., the x, y, and z axes) can be determined using a gyroscope sensor. Gyroscope sensors can also be used for image stabilization. For example, when the shutter is pressed, the gyroscope sensor detects the angle of the electronic device's movement, calculates the distance the lens module needs to compensate based on the angle, and then uses the lens to counteract the movement of the electronic device, thus achieving image stabilization. Gyroscope sensors can also be used in navigation and motion-sensing gaming scenarios.

[0071] A barometric pressure sensor is used to measure air pressure. In some embodiments, electronic devices use the air pressure values ​​measured by the barometric pressure sensor to calculate altitude, aiding in positioning and navigation.

[0072] Magnetic sensors include Hall sensors. Electronic devices can use magnetic sensors to detect the opening and closing of flip covers. In some embodiments, when the electronic device is a flip phone, it can detect the opening and closing of the flip cover using a magnetic sensor. Based on the detected opening and closing state of the cover or the flip cover, features such as automatic unlocking of the flip cover can be configured.

[0073] Accelerometers can detect the magnitude of acceleration in various directions (typically three axes) of electronic devices. When the electronic device is stationary, they can detect the magnitude and direction of gravity. They can also be used to identify the posture of electronic devices, and are applied in applications such as screen orientation switching and pedometers.

[0074] A distance sensor is used to measure distance. Electronic devices can measure distance using infrared or laser. In some embodiments, during a shooting scene, the electronic device can utilize a distance sensor to measure distance for rapid focusing.

[0075] Proximity sensors can include, for example, light-emitting diodes (LEDs) and light detectors, such as photodiodes. The LED can be an infrared LED. Electronic devices emit infrared light through LEDs. The electronic device uses a photodiode to detect infrared reflected light from nearby objects. When sufficient reflected light is detected, it can be determined that an object is near the electronic device. When insufficient reflected light is detected, the electronic device can determine that no object is nearby. Electronic devices can use proximity sensors to detect when a user holds the device close to their ear during a call, automatically turning off the screen to save power. Proximity sensors can also be used in holster mode and pocket mode for automatic unlocking and locking of the screen.

[0076] An ambient light sensor is used to detect ambient light levels. Electronic devices can then adaptively adjust their display brightness based on the detected ambient light. Ambient light sensors can also be used to automatically adjust white balance when taking photos. Furthermore, ambient light sensors can work in conjunction with proximity sensors to detect if an electronic device is in a pocket, preventing accidental touches.

[0077] A fingerprint sensor is used to collect fingerprints. Electronic devices can use the collected fingerprint characteristics to unlock devices, access app locks, take photos, and answer calls, among other things.

[0078] A temperature sensor is used to detect temperature. In some embodiments, the electronic device uses the temperature detected by the temperature sensor to execute a temperature handling strategy. For example, when the temperature reported by the temperature sensor exceeds a threshold, the electronic device reduces the performance of a processor located near the temperature sensor to reduce power consumption and implement thermal protection. In other embodiments, when the temperature falls below another threshold, the electronic device heats the battery to prevent abnormal shutdown of the electronic device due to low temperature. In still other embodiments, when the temperature falls below yet another threshold, the electronic device boosts the battery's output voltage to prevent abnormal shutdown due to low temperature.

[0079] A touch sensor, also known as a "touch device," is a component of an electronic device. Touch sensors can be mounted on a display screen, and the touch sensor and display screen together form a touchscreen, also called a "touchscreen." The touch sensor detects touch operations applied to or near it. It then transmits the detected touch operation to an application processor to determine the type of touch event. Visual output related to the touch operation can be provided through the display screen. In some embodiments, the touch sensor may also be located on the surface of the electronic device, in a different position than the display screen.

[0080] Audio devices are used to convert digital audio information into analog audio signals for output, and also to convert analog audio input into digital audio signals. Audio devices can also be used for encoding and decoding audio signals. In some embodiments, the audio device may be located within a processor, or some functional modules of the audio device may be located within a processor.

[0081] In some embodiments, the display device, radio frequency device, camera device, power supply, audio device, sensor, etc., can be electrically connected to the system chip (SOC) via a through-axis flexible printed circuit board (FPC).

[0082] For example, as shown in Figure 6, which is a schematic diagram of the internal interconnection structure of an electronic device, the SOC is connected to the display device via transmission line L1, to the radio frequency device via transmission line L2, to the camera device via transmission line L3, to the sensor via transmission line L4, to the power supply via transmission line L5, and to the audio device via transmission line L6. Thus, Figure 6 illustrates a schematic diagram of the connection between the SOC and other devices via transmission lines.

[0083] However, as the number of internal components in electronic devices increases, the number of transmission lines also increases, occupying a significant amount of space and hindering the design of thinner and lighter electronic devices. Furthermore, when electronic devices employ foldable designs, transmission lines need to pass through the hinge to connect components on different circuit boards. To avoid these transmission lines and ensure their reliability, the battery and structural components typically require clearance or other special treatments, limiting the flexibility of the overall architecture design and affecting the battery space and thickness, thus hindering further thinner and lighter designs for end electronic products. Additionally, the portion of the transmission line within the hinge area requires a double-layer shielding layer or double-layer routing, with the outer layer being a ground wire, which affects the bending capability of the hinge area.

[0084] Therefore, this application provides a new display module for electronic devices. The display module can be set on a substrate below the display panel and conductor lines can be arranged on the substrate. Signals can be led from the SOC side to the sub-circuit board side, realizing a hinge-free FPC architecture for foldable screens. At the same time, it saves hinge design costs, increases the flexibility of hinge design and battery space, and makes the electronic device thinner and lighter, thus enhancing the competitiveness of terminal foldable products.

[0085] Figure 7 is a schematic diagram of a display module provided in an embodiment of this application. As shown in Figure 7, the display module includes a display panel 1001 and a transmission layer 1004 stacked together, wherein the transmission layer 1004 is disposed on the side opposite to the light-emitting surface of the display panel 1001.

[0086] The transmission layer 1004 includes: a stacked metal layer, a substrate 10042, and a first shielding layer 10041.

[0087] This application embodiment does not limit the materials of the metal layer, substrate 10042, and first shielding layer 10041. The substrate 10042 can be made of an insulating material, such as polyimide (PI). The metal layer and the first shielding layer 10041 are made of the same material, for example, both the metal layer and the first shielding layer 10041 are made of copper. Thus, the transmission layer adopts a circuit board-like structure, and the transmission layer 1004 can be manufactured using similar circuit board fabrication processes, reducing the manufacturing difficulty and facilitating mass production.

[0088] In other embodiments, the metal layer can also be made of silver, titanium, or other materials. The first shielding layer 10041 can also be made of a non-metallic material with shielding effect.

[0089] The metal layer includes a first transmission line 10043 and a second transmission line 10044. The first transmission line 10043 is used for electrically connecting devices within the electronic device. In some embodiments, as shown in FIG8, the first transmission line 10043 connects, for example, a first electronic device 1011 and a second electronic device 1021 within the electronic device to realize signal transmission between the first electronic device and the second electronic device 1021. The signals transmitted by the first transmission line 10043 include: current signals, digital signals, virtual signals, data signals, radio frequency signals, etc.

[0090] The embodiments of this application do not limit the positions of the first electronic device 1011 and the second electronic device 1021. In some embodiments, the first electronic device 1011 and the second electronic device 1021 may be disposed on the same circuit board. The first transmission line 10043 may be used to connect devices disposed on the same circuit board.

[0091] In some embodiments of this application, the first transmission line 10043 can be used to connect devices disposed on different circuit boards. In some embodiments of this application, the first electronic device 1011 and the second electronic device 1021 can be disposed on different circuit boards. For example, the first electronic device 1011 can be an audio device disposed on a secondary circuit board, and the second electronic device 1021 can be a System-on-a-Chip (SoC) disposed on a primary circuit board.

[0092] In some embodiments of this application, FIG8 is a schematic diagram of the structure of another electronic device provided in an embodiment of this application. As shown in FIG8, the first electronic device 1011 is a display function device. The display function device may be a display control chip or a touch control chip.

[0093] This application does not limit the position of the display functional device. In some embodiments, the electronic device further includes a display functional layer 103, which is disposed on the side of the display module opposite to the light-emitting surface and is connected to the display panel 1001. The display functional device may be disposed on the display functional layer 103. In other embodiments, the display functional device may be independent of the display functional layer 103. In some embodiments, the display functional layer includes a flexible circuit board and a display functional device disposed on the flexible circuit board.

[0094] In other embodiments, the first electronic device 1011 and the second electronic device 1021 may further include a USB interface, which can be used to connect external devices, so that the first transmission line 10043 can also be used to connect external devices.

[0095] In some embodiments, the display module further includes a first stack 1002 and a second stack 1003.

[0096] The first stack 1002 is disposed on the light-emitting side of the display panel 1001, and the second stack 1003 is disposed on the side opposite to the light-emitting surface of the display panel 1001.

[0097] The first layer 1002 includes: a cover plate, a first adhesive layer and a polarizing film stacked together, the polarizing film being connected to the display panel 1001.

[0098] The cover plate is positioned above the polarizing film. The polarizing film is positioned between the cover plate and the display panel 1001, and the display panel 1001 is positioned between the polarizing film and the support layer. The polarizing film is used to convert unpolarized light into polarized light, or to change the polarization direction of polarized light.

[0099] The second layer can be a support layer. This application does not limit the structure of the support layer; in some embodiments, the support layer adopts a single-layer structure. For example, the support layer includes a back film (BF). The material of the support layer can include at least one of thermoplastic polyurethanes (TPU), polypropylene, polyethylene terephthalate (PET), or polyimide.

[0100] In other embodiments, the support layer employs a multi-layer structure, comprising a protective layer and a bracket. The protective layer may be a backing protective film. For example, the protective layer may be made of polyethylene terephthalate.

[0101] The support component can be made of rigid materials. Rigid materials include, but are not limited to, carbon fiber or cemented carbide. Cemented carbide materials can be, but are not limited to, 304 stainless steel or titanium alloy.

[0102] In some embodiments, the transmission layer 1004 further includes a sensing unit 10045, which is connected to the second transmission line 10044.

[0103] This application does not limit the structure of the sensing unit 10045. In some embodiments, the sensing unit 10045 can be a pressure sensor. The pressure sensor is used to sense pressure signals and can convert the pressure signals into electrical signals. There are many types of pressure sensors, such as resistive pressure sensors, inductive pressure sensors, and capacitive pressure sensors. A capacitive pressure sensor may include at least two parallel plates with conductive material. When a force is applied to the pressure sensor, the capacitance between the electrodes changes. The electronic device determines the pressure intensity based on the change in capacitance. When a touch operation is applied to the display screen, the electronic device detects the intensity of the touch operation based on the pressure sensor. The electronic device can also calculate the touch position based on the detection signal from the pressure sensor.

[0104] Display panel 1001 is a layer used to implement display functions, which can convert electrical signals into visual information. In some embodiments, display panel 1001 is a screen display control panel (PNL). The support layer is disposed below the display panel and can play a role in buffering and protection.

[0105] The display module provided in this application embodiment enables signal transmission by setting a first transmission line within the transmission layer 1004, allowing the transmission layer 1004 to perform signal transmission functions and realize signal connections between various components within the electronic device. Since the transmission layer 1004 is located within the stack of the display module, it eliminates the need for additional transmission lines in other locations within the electronic device, reducing the number of transmission lines and facilitating a thinner and lighter design. This saves space in the overall electronic device architecture, increases battery capacity, and provides more options for signal transmission between components. Furthermore, a sensing unit 10045 can be set within the transmission layer 1004, allowing the transmission layer 1004 to simultaneously add sensing functionality, fully utilizing its space and enabling more functions.

[0106] This application embodiment does not limit the positional relationship between the sensing unit 10045 and the first transmission line 10043. In some embodiments, the projection of the sensing unit 10045 on the substrate 10042 and the projection of the first transmission line 10043 on the substrate 10042 are spaced apart. This can reduce interference between the sensing unit 10045 and the first transmission line 10043.

[0107] This application embodiment does not limit the positional relationship between the first transmission line 10043 and the second transmission line 10044. In some embodiments, the projections of the first transmission line 10043 and the second transmission line 10044 onto the substrate 10042 are spaced apart. This reduces interference between the sensing unit 10045 and the first transmission line 10043.

[0108] This application does not limit the positional relationship between the sensing unit 10045 and the metal layer. In some embodiments, as shown in FIG9, FIG9 is a schematic diagram of another display module structure provided by this application embodiment. The sensing unit 10045 is connected to the substrate 10042, and the sensing unit 10045 is disposed on the same layer as the metal layer. In this embodiment, the sensing unit 10045, the first transmission line 10043, and the second transmission line 10044 are an integral structure, and the two are integrally formed by the manufacturing process of the display module. For example, the sensing unit 10045, the first transmission line 10043, and the second transmission line 10044 can be manufactured simultaneously by a process similar to that used for circuit manufacturing. The first transmission line 10043 and the second transmission line 10044 can be a circuit structure arranged on the same layer, formed in one step. This reduces the number of process steps and lowers the process difficulty. Furthermore, the sensing unit 10045 is disposed on the same layer as the metal layer. Compared with the method of arranging the sensing unit 10045 and the metal layer along the thickness direction of the electronic device, the space occupied in the thickness direction of the electronic device can be reduced, which is conducive to realizing the thin and light design of the electronic device.

[0109] In this embodiment, as shown in FIG10A, FIG10A is a schematic diagram of the wiring of a metal layer provided in an embodiment of the present application. The sensing unit 10045 may include a coil. The coil may be a wireless charging coil. In some embodiments, the transmission layer further includes a first connection terminal 1004a and a second connection terminal 1004b, one end of the first transmission line 10043 is connected to the first connection terminal 1004a, and the other end is connected to the second connection terminal 1004b, and the coil is connected to the first connection terminal 1004a and the second connection terminal 1004b. The first connection terminal 1004a and the second connection terminal 1004b may be connected to internal or external devices of the electronic device.

[0110] In some embodiments, as shown in FIG10B, FIG10B is a schematic diagram of the structure of another electronic device provided in an embodiment of the present application. The sensing unit 10045 can be a coil, and the electronic device further includes a third electronic device 1031. The sensing unit 10045 can be wirelessly connected to an external device 106. The external device 106 can be a wireless charger, and the sensing unit 10045 can receive wireless charging input. The third electronic device 1031 can be a control chip, and the third electronic device 1031 can be disposed on a circuit board. In some embodiments, the control chip includes a charging management module, which can receive wireless charging input through the wireless charging coil. While charging the battery, the charging management module can also supply power to the electronic device through the power management module. The coil, the control circuit, and the external device can form an electromagnetic network.

[0111] In some embodiments, the coil can also be an electromagnetic induction coil. This electromagnetic induction coil can be used to detect the intensity of electromagnetic radiation received at that location. When an electronic device receives strong magnetic field coupling interference, the electromagnetic induction coil can detect the strong magnetic field, and then the design can be avoided or mitigated through system notifications, prompts, etc. For example, in the axis area, due to the limitation of the rotating shaft, there is a possibility of magnetic leakage. When a wireless charger is placed in the axis area, the electromagnetic power generated by the wireless charging coil can penetrate the screen, causing abnormal screen display. By setting up an electromagnetic induction coil, the magnetic field of the wireless charger can be detected, and then the design can be avoided or mitigated through system notifications, prompts, etc., realizing a strong magnetic field warning function.

[0112] In some embodiments, the coil can also be used as a wireless charging induction device. For example, the coil can be an NFC coil.

[0113] In this embodiment, the sensing unit 10045, the first transmission line 10043, and the second transmission line 10044 are arranged on the same layer. In order to reduce the interference between the sensing unit 10045, the first transmission line 10043, and the second transmission line 10044, the sensing unit 10045, the first transmission line 10043, and the second transmission line 10044 can be arranged at intervals.

[0114] In this embodiment, when the sensing unit 10045 is used as a wireless charger, it can be positioned in a non-bending area, for example. As shown in FIG11, which is a top view of an electronic device according to an embodiment of this application, the electronic device includes a display module and a first connecting portion 10043a, a second connecting portion 10043b, and a third connecting portion 10044a connected to the display module.

[0115] The display module includes a first non-bending area 10a, a bending area 10c, and a second non-bending area 10b connected in sequence. The metal layer includes a first region corresponding to the first non-bending area 10a, a second region corresponding to the second non-bending area 10b, and a third region corresponding to the bending area 10c. The sensing unit 10045 is disposed, for example, in the first region and / or the second region.

[0116] For example, the sensing unit 10045 includes: a first wireless charging coil and a second wireless charging coil, the first wireless charging coil being disposed in a first area, the second wireless charging coil being disposed in a second area, and the first wireless charging coil, the second wireless charging coil, the first transmission line 10043 and the second transmission line 10044 being spaced apart.

[0117] The embodiments of this application do not limit the number of charging coils. In some embodiments, the first wireless charging coil may be set only in the first area, or the second wireless charging coil may be set only in the second area.

[0118] In other examples, when the sensing unit 10045 is used as an electromagnetic induction coil, the sensing unit 10045 may be placed in the bending area 10c, for example.

[0119] For example, the sensing unit 10045 includes an electromagnetic induction coil disposed in the third region, and the first wireless charging coil, the second wireless charging coil, the first transmission line 10043 and the second transmission line 10044 are spaced apart.

[0120] The display module provided in this application embodiment can be used to detect the magnitude of electromagnetic radiation received by setting a coil in the transmission layer 1004, or it can be used for wireless charging. It can make full use of the space of the metal layer and integrate more functions in a limited space, thus taking into account the thin and light design and multi-functional design of electronic devices.

[0121] In other embodiments, as shown in FIG7, the sensing unit 10045 is disposed on the side of the metal layer opposite to the substrate 10042, and the second transmission line 10044 connected to the sensing unit 10045 can be disposed on the metal layer, on the same layer as the first transmission line 10043. In this embodiment, the first transmission line 10043 and the second transmission line 10044 are an integral structure, and are integrally formed by the manufacturing process of a display module. For example, the first transmission line 10043 and the second transmission line 10044 can be manufactured simultaneously by a process similar to that used in circuit manufacturing. The first transmission line 10043 and the second transmission line 10044 can be a circuit structure arranged on the same layer, formed in one step.

[0122] In this embodiment, the sensing unit 10045 includes a piezoelectric thin film sensor (PVDF).

[0123] The piezoelectric thin film sensor is flexible and can reuse the substrate 10042 of the transmission layer 1004. For example, the piezoelectric thin film sensor film layer can be combined with the metal layer of the transmission layer 1004. Using the upper wiring area of ​​the substrate 10042, outside the first transmission line 10043, the sensing electrodes of the piezoelectric thin film sensor are formed. The relevant sensing electrodes are uniformly arranged in the area below the display panel 1001 and above the support layer, that is, in the area of ​​the transmission layer 1004, to achieve pressure sensing integration.

[0124] This application does not limit the shape or number of sensing electrodes. The shape of the sensing electrodes includes rectangular, circular, or other shapes. The number of sensing electrodes can be adjusted according to actual needs. Simultaneously, the piezoelectric thin film sensor also has corresponding sensing in the stretching direction, enabling touch pressure detection or bending stress detection, etc.

[0125] In this embodiment, the piezoelectric thin film sensor can reuse the substrate 10042 of the transmission layer 1004. Compared to setting the piezoelectric thin film sensor independently, one substrate 10042 can be reduced. When adding an independently set piezoelectric thin film in the display module, the stack thickness increases by 75 μm. When the piezoelectric thin film sensor reuses the substrate 10042 of the transmission layer 1004 in the display module, the thickness increases by only 40 μm, and the stack thickness can be reduced by 35 μm. Furthermore, the transmission layer 1004 of this application includes a shielding layer, which can achieve electromagnetic shielding and reduce interference to the signal.

[0126] This piezoelectric thin-film sensor adds a function to the touchscreen that can respond to and provide feedback on the pressure applied by the user. It can also use the pressure applied and touch detection data to make a comprehensive judgment and provide alerts for abnormal usage scenarios. For example, it can identify scenarios such as forward or reverse folding in advance.

[0127] In this embodiment, the sensing unit 10045 is built into the module, which can detect the pressure changes experienced by the module throughout its entire life cycle. Based on this, a big data model can be established during the production process and life cycle.

[0128] The display module provided in this embodiment has a piezoelectric thin film sensor disposed on the side of the metal layer near the display panel 1001. This allows for the reuse of the substrate 10042 of the transmission layer 1004 and the shielding layer, facilitating the thinner and lighter design of electronic devices. Furthermore, the piezoelectric thin film sensor, combined with a screen pressure model, can provide timely alerts for abnormal scenarios, improving the lifespan of the foldable screen. Pressure models can be built throughout the production process and lifecycle for quality improvement and bending model establishment, enhancing the overall functionality. It can also recognize the pressure applied by the user's touch, enabling different operations through point and varying pressure levels. The module pressure can be monitored throughout its entire lifecycle, optimizing production line operations and user experience.

[0129] In this embodiment, the sensing unit 10045 and the metal layer are stacked in the thickness direction of the electronic device. In order to reduce the interference between the sensing unit 10045, the first transmission line 10043 and the second transmission line 10044, the sensing unit 10045, the first transmission line 10043 and the second transmission line 10044 can be spaced apart in the planar direction. For example, the projections of the sensing unit 10045, the first transmission line 10043 and the second transmission line 10044 on the substrate 10042 can be spaced apart to reduce the interference between the parts.

[0130] The display module includes a first non-bending area 10a, a bending area 10c, and a second non-bending area 10b connected in sequence. A sensing unit 10045 is disposed within the bending area 10c. A first connecting portion 10043a is connected to the first non-bending area 10a, and a second connecting portion is connected to the second non-bending area 10b. By placing the sensing unit 10045 within the bending area 10c, pressure changes in the bending area 10c can be detected, enabling bending stress detection. This arrangement fully utilizes the space of the metal layer, integrating more functions within a limited space, and balancing the design of thin and light electronic devices with multiple functions.

[0131] In some embodiments, as shown in FIG12, FIG12 is a cross-sectional view AA of the electronic device shown in FIG11. The electronic device includes: a display module, a first electronic device 1011, and a second electronic device 1021. The display module includes: a first stacked layer 1002, a display panel 1001, a transmission layer, and a second stacked layer 1003, wherein the transmission layer is disposed on the side opposite to the light-emitting surface of the display panel 1001. The transmission layer includes: a stacked metal layer, a substrate 10042, and a first shielding layer 10041. The metal layer includes: a first transmission line 10043.

[0132] The transmission layer further includes a first connection portion 10043a and a second connection portion 10043b. The first connection portion 10043a connects the first transmission line 10043 and the first electronic device 1011, and the second connection portion 10043b connects the first transmission line 10043 and the second electronic device 1021. Thus, the transmission line of the transmission layer 1004 and the devices within the electronic device can be connected via the first connection portion 10043a and the second connection portion 10043b. The first electronic device 1011 and the second electronic device 1021 can transmit signals via the first connection portion 10043a, the first transmission line 10043, and the second connection portion 10043b.

[0133] In some embodiments, the first connecting portion 10043a, the second connecting portion 10043b, and the metal layer are integrally formed using a display module manufacturing process. For example, the first connecting portion 10043a, the second connecting portion 10043b, and the metal layer can be manufactured simultaneously using a process similar to circuit fabrication. The first connecting portion 10043a, the second connecting portion 10043b, and the conductive portion on the metal layer can be a circuit structure arranged on the same layer, formed in a single step.

[0134] In this embodiment, when the sensing unit 10045 is used for a wireless charger, for example, the sensing unit 10045 can be placed in the first non-bending area 10a or the second non-bending area 10b as shown in FIG11.

[0135] The display module provided in this application embodiment can be used to detect the magnitude of electromagnetic radiation received by setting a coil in the transmission layer 1004, or it can be used for wireless charging. It can make full use of the space of the metal layer and integrate more functions in a limited space, thus taking into account the thin and light design and multi-functional design of electronic devices.

[0136] This application embodiment does not limit the position of the connection between the first connecting part 10043a and the second connecting part 10043b and the metal layer. In some embodiments, as shown in FIG15, FIG15 is a schematic diagram of another display module structure provided by this application embodiment. The first connecting part 10043a and the second connecting part 10043b are connected to the surface of the metal layer. In this embodiment, the first connecting part 10043a and the second connecting part 10043b are not integral structures with the metal layer. The first connecting part 10043a and the second connecting part 10043b are independent structures from the metal layer. The electrical connection between the first connecting part 10043a and the second connecting part 10043b and the metal layer can be achieved by gold fingers or other electrical connection structures. For example, the metal layer is fabricated in the display module using a process similar to that of a circuit board. A connection structure, such as a conductive structure (a connector in the form of gold fingers, solder pads, board-to-board connectors, etc.), can be provided to connect the first connecting part 10043a and the metal layer, or to connect the second connecting part 10043b and the metal layer.

[0137] The display module includes a first window 104 and a second window 105. The first window 104 and the second window 105 are located on the side of the transmission layer 1004 opposite to the display panel 1001. The first connecting portion 10043a is electrically connected to the transmission line within the first window 104, and the second connecting portion 10043b is electrically connected to the first transmission line 10043 within the second window 105. Thus, the first connecting portion 10043a and the second connecting portion 10043b are electrically connected to the first transmission line 10043 within the windows of the display module, and the distance between them is closer, which can reduce the size of the first connecting portion 10043a and the second connecting portion 10043b, facilitating the thinner and lighter design of electronic devices.

[0138] In some embodiments, as shown in FIG12, the first connecting portion 10043a and the second connecting portion 10043b extend from the edge of the metal layer. In this embodiment, the first connecting portion 10043a and the second connecting portion 10043b can be integrally formed with the metal layer. That is, the first connecting portion 10043a and the second connecting portion 10043b can be integrally formed with the metal layer using the manufacturing process of a display module, and the first connecting portion 10043a, the second connecting portion 10043b and the metal layer can be manufactured simultaneously using a process similar to circuit manufacturing. The first connecting portion 10043a, the second connecting portion 10043b and the conductive portion on the metal layer can be a circuit structure arranged on the same layer, formed in one step.

[0139] For example, the first connecting portion 10043a is connected to the first side of the metal layer, and the second connecting portion 10043b is connected to the second side of the metal layer, with the first and second sides corresponding to each other. Thus, the first connecting portion 10043a, the second connecting portion 10043b, and the conductive portion on the metal layer are disposed in the same layer, allowing for simultaneous molding and reducing the complexity of the process.

[0140] In other embodiments, the first connecting portion 10043a and the second connecting portion 10043b are connected to the same side of the metal layer.

[0141] In some embodiments, as shown in Figures 11 and 13, where Figure 13 is a BB cross-sectional view of the electronic device shown in Figure 11, the electronic device includes a display module and a third electronic device 1031. The display module includes a first stacked layer 1002, a display panel 1001, a transmission layer, and a second stacked layer 1003, wherein the transmission layer is disposed on a side opposite to the light-emitting surface of the display panel 1001. The transmission layer includes a stacked metal layer, a substrate 10042, and a first shielding layer 10041. The metal layer includes a second transmission line 10044.

[0142] As shown in Figure 13, the transmission layer 1004 further includes a third connection portion 10044a. The third connection portion 10044a is connected to the second transmission line 10044, and connects the second transmission line 10044 and the third electronic device 1031. Thus, the transmission line of the transmission layer 1004 and the device within the electronic device can be connected via the third connection portion 10044a, and the third electronic device 1031 can transmit signals through the third connection portion 10044a, the second transmission line 10044, and the sensing unit 10045.

[0143] In some embodiments, the first connecting portion 10043a, the second connecting portion 10043b, and the metal layer are integrally formed using a display module manufacturing process. For example, the first connecting portion 10043a, the second connecting portion 10043b, and the metal layer can be manufactured simultaneously using a process similar to circuit fabrication. The first connecting portion 10043a, the second connecting portion 10043b, and the conductive portion on the metal layer can be a circuit structure arranged on the same layer, formed in a single step.

[0144] This application does not limit the position of the transmission layer 1004 in the display module. In some embodiments, the transmission layer 1004 is disposed between the support layer and the display panel 1001. In this embodiment, the support layer can be used to shield signals inside the electronic device, reducing interference from devices below the display module to the display panel 1001. In some embodiments, the transmission layer 1004 can reuse the stack of the support layer. For example, the protective layer in the support layer can serve as the base 10042 of the transmission layer 1004, and the support frame can serve as a shielding layer. Thus, the transmission layer 1004 can be obtained simply by setting a metal layer on the surface of the support layer near the display panel 1001, which is beneficial for further achieving a thinner and lighter design of the electronic device.

[0145] In other embodiments, the transmission layer 1004 is disposed on the side of the support layer opposite to the display panel 1001. In this embodiment, the support layer can be used to shield signals inside the electronic device, reducing interference from the transmission layer 1004 and devices below the display module to the display panel 1001.

[0146] In other embodiments, the transmission layer 1004 is disposed within the support layer. In this embodiment, the support layer includes a protective layer and a support member, with the transmission layer 1004 disposed between the protective layer and the support member. In some embodiments, the protective layer in the support layer can serve as the substrate 10042 of the transmission layer 1004, and the support member can serve as a shielding layer. Thus, the transmission layer 1004 can be obtained simply by providing a metal layer on the surface of the support layer near the display panel 1001, which is beneficial for further achieving a thinner and lighter design of electronic devices.

[0147] In some embodiments, as shown in FIG14, which is a CC cross-sectional view of the electronic device shown in FIG11, the display module of the electronic device includes: a first stacked layer 1002, a display panel 1001, a transmission layer, and a second stacked layer 1003, wherein the transmission layer is disposed on the side opposite to the light-emitting surface of the display panel 1001. The transmission layer includes: a stacked metal layer, a substrate 10042, and a first shielding layer 10041. The metal layer includes: a first transmission line 10043 and a second transmission line 10044.

[0148] The display module also includes a second adhesive layer 1006, which is disposed between the transmission layer 1004 and the display panel 1001 for bonding the transmission layer 1004 and the display panel 1001.

[0149] For example, the material of the first adhesive layer and / or the second adhesive layer 1006 can be optical clear adhesive (OCA), double-sided mesh adhesive, or other conductive adhesive layers.

[0150] This application does not limit the structure of the display panel 1001. In some embodiments, the display panel 1001 includes a second shielding layer 10013, a third adhesive layer 10012, and a panel functional layer 10011 stacked together. The transmission layer 1004 and the display panel 1001 are at least partially isolated from each other through the second shielding layer 10013. Thus, by providing the second shielding layer 10013, interference from internal components of the electronic device and from the transmission layer 1004 to the panel functional layer 10011 can be reduced.

[0151] In some embodiments, the display panel 1001 further includes a back film, which is disposed on the side of the second shielding layer 10013 away from the panel functional layer 10011, and a transmission layer is disposed on the side of the back film away from the panel functional layer 10011.

[0152] In some embodiments, in order to improve the flatness of the metal layer surface, as shown in Figures 7, 9 and 14, the transmission layer 1004 further includes a planarization layer 1005, which is disposed in the same layer as the metal layer and can be disposed in the gap between the first transmission line 10043 and the second transmission line 10044.

[0153] This application also provides an electronic device, as shown in FIG16, which is a schematic diagram of the structure of another electronic device provided in this application embodiment. The electronic device is a dual-screen mobile phone, and includes: a first display screen 200, a second display screen 300, a first connecting part 10043a, a second connecting part 10043b, a first electronic device 1011, and a second electronic device 1021.

[0154] The first display screen 200 includes a first transmission line 10043, a first connection portion 10043a, and a second connection portion 10043b, both connected to the first transmission line 10043. The first connection portion 10043a connects the first transmission line 10043 and the first electronic device 1011, and the second connection portion 10043b connects the first transmission line 10043 and the second electronic device 1021. Thus, the transmission line of the transmission layer 1004 and the devices within the electronic device can be connected via the first connection portion 10043a and the second connection portion 10043b. The first electronic device 1011 and the second electronic device 1021 can transmit signals via the first connection portion 10043a, the first transmission line 10043, and the second connection portion 10043b.

[0155] This application provides a display module and an electronic device. The display module is used in the electronic device and includes: a display panel 1001 and a transmission layer 1004 stacked together. The transmission layer 1004 is disposed on a side opposite to the light-emitting surface of the display panel 1001. The transmission layer 1004 includes: a metal layer, a substrate 10042, and a first shielding layer 10041 stacked together. The first shielding layer 10041 is used to shield the upper layers and lower devices of the transmission layer 1004, reducing interference between different parts. The metal layer includes: a first transmission line 10043 and a second transmission line 10044. The first transmission line 10043 is used to electrically connect the devices within the electronic device. By setting a first transmission line 10043 within the transmission layer 1004, the transmission layer 1004 can perform signal transmission functions, enabling signal connections between various components within the electronic device. Since the transmission layer 1004 is located within the display module stack, it eliminates the need for additional transmission lines elsewhere in the electronic device, reducing the number of transmission lines and facilitating a thinner and lighter design. This saves space in the overall electronic device architecture, increases battery capacity, and provides more options for signal transmission between components. The transmission layer 1004 also includes a sensing unit 10045, which is connected to the second transmission line 10044. By setting the sensing unit 10045 and the second transmission line 10044 within the transmission layer 1004, sensing functions can be added simultaneously, fully utilizing the space of the transmission layer 1004 to achieve more functions. Furthermore, the transmission layer 1004 adopts a circuit board-like structure, allowing it to be manufactured using similar processes, reducing manufacturing complexity and facilitating mass production.

[0156] The sensing unit 10045 can be an induction coil, an induction electrode, or a piezoelectric thin-film sensor. The induction coil and induction electrode can be disposed on the same layer as the metal layer, only needing to avoid the first transmission line 10043. The first transmission line 10043 and the second transmission line 10044 of the sensing unit 10045 can be fabricated simultaneously using a process similar to circuit board manufacturing. The first transmission line 10043 and the second transmission line 10044 can be a circuit structure arranged on the same layer, formed in one step, reducing process steps and lowering the manufacturing difficulty. The piezoelectric thin-film sensor can, for example, be disposed on the side of the metal layer closer to the display panel 1001, that is, the piezoelectric thin film is stacked with the metal layer. The sensing unit 10045 can reuse the substrate 10042 and the shielding layer of the transmission layer 1004. Compared to making the sensing unit 10045 independent of the transmission layer 1004, this reduces the space occupied in the thickness direction of the electronic device, which is beneficial for the thinner and lighter design of the electronic device.

[0157] The transmission layer 1004 can also reuse part of the stacked layers of the support layer. For example, the protective layer in the support layer can serve as the base 10042 of the transmission layer 1004, and the support member in the support layer can serve as the first shielding layer 10041 of the transmission layer 1004. In this way, the transmission layer 1004 can be obtained by simply setting a metal layer on the surface of the support layer near the display panel 1001, which is beneficial to further realize the thin and light design of electronic devices.

[0158] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, The display module is used in an electronic device including electronic components. The display module includes: a display panel and a transmission layer stacked together, wherein the transmission layer is disposed on a side away from the light-emitting surface of the display panel. The transmission layer includes: a stacked metal layer, a substrate, and a first shielding layer; The metal layer includes: a first transmission line and a second transmission line, wherein the first transmission line is used to electrically connect the electronic components of the electronic device; The transmission layer further includes a sensing unit, which is connected to the second transmission line.

2. The display module according to claim 1, characterized in that, The projection of the sensing unit on the substrate and the projection of the first transmission line on the substrate are spaced apart.

3. The display module according to claim 1 or 2, characterized in that, The projections of the first transmission line onto the substrate and the projections of the second transmission line onto the substrate are spaced apart.

4. The display module according to any one of claims 1-3, characterized in that, The sensing unit is connected to the substrate, and the sensing unit is disposed in the same layer as the metal layer.

5. The display module according to claim 4, characterized in that, The sensing unit includes a coil.

6. The display module according to claim 1, characterized in that, The sensing unit is disposed on the side of the metal layer opposite to the substrate.

7. The display module according to claim 6, characterized in that, The sensing unit includes a piezoelectric thin film sensor.

8. The display module according to claim 6 or 7, characterized in that, The display module includes a first non-bending area, a bending area, and a second non-bending area connected in sequence, and the sensing unit is located within the bending area.

9. The display module according to any one of claims 1-8, characterized in that, The electronic device includes a first electronic device and a second electronic device. The transmission layer further includes a first connection portion and a second connection portion, wherein the first connection portion connects the first transmission line and the first electronic device, and the second connection portion connects the first transmission line and the second electronic device.

10. The display module according to claim 9, characterized in that, The display module includes a first window and a second window, the first window and the second window being located on the side of the transmission layer opposite to the display panel, the first connection portion being electrically connected to the first transmission line within the first window, and the second connection portion being electrically connected to the first transmission line within the second window.

11. The display module according to claim 9, characterized in that, The first connecting portion is connected to the first side of the metal layer, and the second connecting portion is connected to the second side of the metal layer, with the first side and the second side corresponding to each other.

12. The display module according to any one of claims 1-11, characterized in that, The display module further includes a support layer, which is disposed between the transmission layer and the display panel.

13. The display module according to any one of claims 1-11, characterized in that, The display module further includes a support layer, which is disposed on the side of the transmission layer opposite to the display panel.

14. The display module according to any one of claims 1-11, characterized in that, The display module further includes a support layer, which is disposed on the side of the display panel away from the display panel. The support layer includes a protective layer and a support member, and the transmission layer is disposed between the protective layer and the support member.

15. The display module according to any one of claims 1-14, characterized in that, The transmission layer and the display panel are bonded together by an adhesive layer.

16. The display module according to any one of claims 1-15, characterized in that, The display panel includes: a substrate layer, a second shielding layer, and a panel functional layer stacked together, wherein the transmission layer and the display panel are at least partially isolated from each other by the second shielding layer.

17. The display module according to any one of claims 1-16, characterized in that, The sensing unit is used to connect to an external device, including a wireless charger.

18. The display module according to any one of claims 1-17, characterized in that, The electronic device includes a third electronic device, and the transmission layer further includes a third connection portion, which connects the second transmission line and the third electronic device.

19. An electronic device, characterized in that, The electronic device includes a first electronic device, a second electronic device, and a display module as described in any one of claims 1-18, wherein the first transmission line is connected to the first electronic device and the second electronic device respectively.

20. The electronic device according to claim 19, characterized in that, The electronic device further includes a main circuit board and a sub-circuit board, wherein the first electronic device is disposed on the main circuit board and the second electronic device is disposed on the main circuit board or the sub-circuit board.

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