In-vehicle optical communication system

Abstract

An in-vehicle optical communication system, comprising an optoelectric composite cable (500), a data acquisition optical module (100), and an optoelectric connector assembly (400). The data acquisition optical module (100) comprises an optical transceiver assembly (130). The optical transceiver assembly (130) comprises a round-square tube body (131), an optical emission component (132), a second connecting sleeve (189), and a light homogenizing member (1893). An isolator (1818), a first optical filter (186) and a first lens (185) are arranged inside the round-square tube body (131). The optical emission component (132) comprises a VCSEL laser chip (1824) and a second lens (1826). A second through hole (1892) is formed on a light exit surface of the second connecting sleeve (189), the light homogenizing member (1893) is embedded in the second through hole (1892), and the light homogenizing member (1893) is used for adjusting the uniformity of the light intensity of light spots emitted by the VCSEL laser chip (1824), thereby improving the uniformity of the light spots emitted by the VCSEL laser chip (1824). An optical emission signal emitted by the VCSEL laser chip (1824) is collimated by the second lens (1826), and then the collimated light is inputted into the light homogenizing member (1893). The light homogenizing member (1893) performs light homogenization on the collimated light, and the collimated light provides the light homogenizing member (1893) with incident light having a consistent incident angle and a stable optical path difference, thereby ensuring the light homogenizing effect of the light homogenizing member (1893).

Description

Vehicle-mounted optical communication system

[0001] This application claims priority to Chinese Patent Application No. CN2025201429075, filed January 21, 2025; priority to Chinese Patent Application No. CN2025205775170, filed March 28, 2025; and priority to Chinese Patent Application No. CN2025211370133, filed June 4, 2025; the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of vehicle-mounted optical communication technology, and more particularly to a vehicle-mounted optical communication system. Background Technology

[0003] With the development of autonomous driving and intelligent driving assistance technologies, vehicles are increasingly demanding the collection and processing of camera data. While traditional electrical transmission methods can meet basic requirements, they have limitations in terms of high bandwidth, low latency, and interference resistance. Summary of the Invention

[0004] This disclosure provides a vehicle-mounted optical communication system, including an optoelectronic composite cable, a data acquisition optical module, and an optoelectronic connector assembly. The data acquisition optical module is used to acquire electrical signal data and convert it into optical signals. The optoelectronic composite cable supports the transmission of both optical and power signals, and is connected to the optoelectronic connector assembly. The optoelectronic connector assembly is used to establish an optical connection between the data acquisition optical module and the optoelectronic composite cable, enabling the transmission of the optical signals converted by the data acquisition optical module through the optoelectronic composite cable; it also facilitates the transmission of electrical signals between the data acquisition optical module and the optoelectronic composite cable, allowing the reception of power signals from the optoelectronic composite cable. The data acquisition optical module includes an optical transceiver assembly. The optical transceiver assembly includes a rectangular tube, an optical emitting component, a second connecting sleeve, and a beam homogenizer. The rectangular tube contains an isolator, a first filter, and a first lens. The optical emitting component is connected to one end of the rectangular tube and is located on one side of the isolator. The optical emitting component includes a VCSEL laser chip and a second lens. The automotive environment places high demands on the temperature adaptability of components. Due to its short resonant cavity length and high-reflectivity DBR mirror, the VCSEL laser chip exhibits a very low threshold current, low sensitivity to temperature changes, and strong high-temperature resistance, maintaining stable laser output even in high-temperature environments. Simultaneously, the VCSEL laser chip's high power and large spot size contribute to a more stable optical path in automotive optical communication. A second lens, located on the output optical path of the VCSEL laser chip, is used to collimate the emitted light signal. An isolator prevents the emitted light signal from returning to the VCSEL laser chip, thus ensuring the stability of the output light quality. Automotive optical communication systems have specific requirements for laser beam energy distribution to avoid detector saturation due to excessive energy or detection blind spots due to insufficient energy. However, the VCSEL laser chip's internal optical field mode and carrier distribution result in relatively poor uniformity of emitted light intensity. To this end, a second through-hole is formed on the light-emitting surface of the second connecting sleeve, and a beam homogenizer is embedded in the second through-hole. The beam homogenizer is used to adjust the uniformity of the light intensity of the emitted light spot from the VCSEL laser chip. The beam homogenizer readjusts the non-uniform light intensity distribution emitted by the VCSEL laser chip to form a light spot with a uniform light intensity distribution throughout the target area, thereby improving the uniformity of the emitted light spot from the VCSEL laser chip. In addition, the second through-hole is formed in the light-emitting path of the second lens, so the beam homogenizer is located in the light-emitting path of the second lens. Therefore, the light emission signal emitted by the VCSEL laser chip is collimated by the second lens, and the collimated light is input into the beam homogenizer. The beam homogenizer homogenizes the collimated light, and the collimated light provides the beam homogenizer with incident light with a consistent incident angle and stable optical path difference, reducing the design difficulty and control complexity of the beam homogenizer, thereby ensuring the beam homogenization effect of the beam homogenizer. Attached Figure Description

[0005] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0006] Figure 1 is a diagram of an in-vehicle optical communication system architecture according to some embodiments;

[0007] Figure 2A is a partial structural diagram of a vehicle-mounted optical communication system according to some embodiments;

[0008] Figure 2B is a partial exploded view of a vehicle-mounted optical communication system according to some embodiments;

[0009] Figure 2C is a partial exploded view of a vehicle-mounted optical communication system according to some embodiments;

[0010] Figure 3A is a structural diagram of a data acquisition optical module according to some embodiments;

[0011] Figure 3B is an exploded view of a data acquisition optical module according to some embodiments;

[0012] Figure 4A is a schematic diagram of a sensor and circuit board assembly according to some embodiments;

[0013] Figure 4B is an exploded view of a sensor and circuit board assembly according to some embodiments;

[0014] Figure 4C is a schematic diagram of the electrical connection between a sensor and a circuit board according to some embodiments;

[0015] Figure 4D is an exploded schematic diagram of the electrical connection between a sensor and a circuit board according to some embodiments;

[0016] Figure 5A is a structural diagram of a sensor according to some embodiments;

[0017] Figure 5B is a cross-sectional structural diagram of a sensor according to some embodiments;

[0018] Figure 5C is a partial cross-sectional structural diagram of a sensor according to some embodiments;

[0019] Figure 6A is a structural diagram of an optical transceiver component according to some embodiments;

[0020] Figure 6B is an exploded view of an optical transceiver component according to some embodiments;

[0021] Figure 6C is an internal structural diagram of an optical transceiver component according to some embodiments;

[0022] Figure 7A is a structural diagram of another optical transceiver component according to some embodiments;

[0023] Figure 7B is an exploded view of another optical transceiver component according to some embodiments;

[0024] Figure 7C is a cross-sectional view of another optical transceiver assembly according to some embodiments;

[0025] Figure 7D is a structural diagram of a round square tube according to some embodiments;

[0026] Figure 7E is a structural diagram of a round-square tube according to some embodiments;

[0027] Figure 7F is a cross-sectional view of a round square tube according to some embodiments;

[0028] Figure 7G is a diagram showing the usage state of a round square tube according to some embodiments;

[0029] Figure 8A is a structural diagram of a light emitting component according to some embodiments;

[0030] Figure 8B is an exploded view of a light emitting component according to some embodiments;

[0031] Figure 8C is an exploded view of a light emitting component according to some embodiments;

[0032] Figure 8D is an exploded view of a light emitting component according to some embodiments;

[0033] Figure 8E is a partial view of a light emitting component according to some embodiments;

[0034] Figure 8F is a cross-sectional view of a light emitting component according to some embodiments;

[0035] Figure 8G is a schematic diagram of the assembly of a light emitting component and a second connecting sleeve according to some embodiments;

[0036] Figure 8H is an internal cross-sectional structural diagram of an optical transceiver assembly according to some embodiments;

[0037] Figure 8I is an exploded cross-sectional view of an optical transceiver assembly according to some embodiments;

[0038] Figure 8J is a cross-sectional structural diagram of a light emitting component according to some embodiments;

[0039] Figure 8K is an exploded cross-sectional view of a light emitting component according to some embodiments;

[0040] Figure 8L is an exploded cross-sectional view of a light emitting component according to some embodiments;

[0041] Figure 9A is an exploded view of a light emitting component according to some embodiments;

[0042] Figure 9B is a partial view of the internal structure of an optical module according to some embodiments;

[0043] Figure 9C is a partially exploded view of the internal structure of an optical module according to some embodiments;

[0044] Figure 9D is an optical path diagram of an optical module according to some embodiments;

[0045] Figure 9E is a transmission optical path diagram of another optical module according to some embodiments;

[0046] Figure 9F is a test diagram of the height distribution of a superlens diffraction surface according to some embodiments;

[0047] Figure 9G is a comparison diagram of the irradiance distribution of a light spot according to some embodiments;

[0048] Figure 9H is a comparison diagram of light spots provided according to some embodiments;

[0049] Figure 10A is a cross-sectional structural diagram of a vehicle-mounted optical communication system layout according to some embodiments;

[0050] Figure 10B is a cross-sectional structural diagram of a data acquisition optical module according to some embodiments;

[0051] Figure 11 is a schematic diagram of an assembly of a photoelectric connector assembly and a photoelectric composite interface according to some embodiments;

[0052] Figure 12A is a structural diagram of a photoelectric connector assembly according to some embodiments;

[0053] Figure 12B is an exploded view of an optocoupler assembly according to some embodiments. Detailed Implementation

[0054] The following description, in conjunction with the accompanying drawings, provides a clear and detailed account of some embodiments of this disclosure. However, the described embodiments are merely some, and not all, of the embodiments described herein. All other embodiments obtained by those skilled in the art based on the embodiments provided herein are within the scope of protection of this disclosure.

[0055] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0056] Electricity has replaced gasoline and chemical energy as the driving force for automobiles, not only promoting the development of new energy vehicles but also providing ample power for vehicle functions such as road condition imaging detection and advanced driver assistance systems. The high-power electricity requirements of in-vehicle communication and display devices such as lidar, multi-camera systems surrounding the vehicle, high-performance advanced driver assistance chips, and large in-vehicle screens can be met by the vehicle's battery pack.

[0057] Currently, the average number of in-vehicle cameras exceeds 10, with each camera boasting over 8 million pixels. Autonomous driving chips also possess computing power exceeding 500 TOPS. This indicates that in-vehicle signal communication has entered the realm of high-frequency signal transmission. This field demands high standards for signal transmission quality, transmission speed, and anti-interference capabilities, which traditional cables can no longer meet. Signal transmission in in-vehicle communication and display devices is gradually evolving towards replacing traditional cables with optical fibers, extending optical communication technology into automotive products.

[0058] The electrical signals output by the vehicle-mounted cameras are converted by the MAC chip and transmitted to the laser driver chip. The laser driver chip then loads the electrical signals into light for transmission. In a vehicle scenario, multiple vehicle-mounted cameras are distributed around the vehicle body, transmitting multiple video signals from different directions to the vehicle-mounted processing chip (including the driver assistance chip and the vehicle infotainment chip) to form multi-view driving images or detection images for driver assistance. The vehicle-mounted cameras are numerous and distributed around the vehicle body; the vehicle-mounted processing chips are located inside the vehicle and are fewer in number. A majority-to-minority communication network topology is formed between the vehicle-mounted cameras and the vehicle-mounted processing chips, with the unit communication architecture consisting of multiple vehicle-mounted cameras corresponding to one vehicle-mounted processing chip.

[0059] The applicant discovered that this communication architecture shares some similarities with the ONU and OLT communication architecture in access network optical communication, but also exhibits the following significant differences. While the ONU and OLT also follow a multiple-to-one communication architecture, it lacks image detection and processing capabilities. Furthermore, the ONU and OLT act as the host computer for the optical modules, with the host computer supplying power to the optical modules and establishing signal interaction and transmission between them. Additionally, the external structural form of the ONU, OLT, and optical modules is unsuitable for automotive installation environments. These similarities offer some design inspiration for automotive optical communication, but the aforementioned differences also present significant technical obstacles to the implementation of automotive optical communication design solutions.

[0060] Figure 1 is an architecture diagram of an in-vehicle optical communication system according to some embodiments. As shown in Figure 1, in some embodiments, the in-vehicle optical communication system 1000 is electrically connected to the in-vehicle main processing device 2000. The in-vehicle optical communication system 1000 includes multiple sensors for acquiring image data or video data of the vehicle's surroundings. The in-vehicle main processing device 2000 can identify the channel addresses of the sensors and analyze and process the sensor-acquired data to achieve real-time perception of the vehicle's surrounding environment.

[0061] In some embodiments, the vehicle-mounted optical communication system 1000 may include a data acquisition optical module 100. The data acquisition optical module 100 includes a circuit board 110, a sensor 120, and an optical transceiver assembly 130. The sensor 120 transmits the acquired electrical signals via the circuit board 110 to the optical transceiver assembly 130, which converts the electrical signals into optical signals. Thus, the electrical signal data acquired by the sensor 120 is transmitted in the form of optical signals. Optical signal transmission has a high transmission rate and strong anti-interference capability, improving the data security of the vehicle-mounted system, and is particularly suitable for scenarios with high data security requirements, such as autonomous driving.

[0062] In some embodiments, the vehicle-mounted optical communication system 1000 may include an optical signal data processing device 200. The optical signal data processing device 200 performs photoelectric conversion. The optical signal data processing device 200 is located between the data acquisition optical module 100 and the vehicle-mounted main processing device 2000. Optical signal transmission occurs between the optical signal data processing device 200 and the data acquisition optical module 100.

[0063] In some embodiments, the optical signal data processing device 200 receives optical signals from the data acquisition optical module 100 and converts the optical signals into electrical signals suitable for processing by the vehicle-mounted main processing device 2000. During the signal conversion process, the optical signal data processing device 200 can process and optimize the optical signals to improve signal quality. Simultaneously, the optical signal data processing device 200 can manage the channel addresses of multiple sensors 120, ensuring that the vehicle-mounted main processing device 2000 can accurately identify and process data from different sensors 120.

[0064] In some embodiments, under certain application scenarios, the vehicle-mounted main processing device 2000 sends control signals to the sensor 120 via the optical signal data processing device 200 and the data acquisition optical module 100 to adjust the parameters of the sensor 120, such as exposure time and focal length, and to monitor the working status of the sensor 120 in real time. Specifically, the control signals or control commands issued by the vehicle-mounted main processing device 200 are transmitted to the optical signal data processing device 200, which converts the electrical signals into optical signals. These optical signals are then transmitted to the data acquisition optical module 100, which in turn converts the optical signals back into electrical signals. The converted electrical signals are then transmitted to the sensor 120 via the circuit board 110 to control the operation of the sensor 120.

[0065] In some embodiments, the vehicle-mounted optical communication system 1000 may include a fiber optic composite cable 500. The fiber optic composite cable 500 integrates optical fiber and electrical cable to simultaneously transmit optical signals and power signals. The fiber optic composite cable 500 is optically connected to the data acquisition optical module 100. The fiber optic composite cable 500 is located between the data acquisition optical module 100 and the optical signal data processing device 200 to establish optical signal transmission between the data acquisition optical module 100 and the optical signal data processing device 200, while simultaneously providing a power signal to the data acquisition optical module 100.

[0066] In some embodiments, the optical signal output by the data acquisition optical module 100 is transmitted to the optical signal data processing device 200 via the optoelectronic composite cable 500, or the optical signal output by the optical signal data processing device 200 is transmitted to the data acquisition optical module 100 via the optoelectronic composite cable 500. Simultaneously, a power signal is transmitted to the data acquisition optical module 100 via the optoelectronic composite cable 500, thereby supplying power to the data acquisition optical module 100.

[0067] In some embodiments, the vehicle-mounted optical communication system 1000 may include an optocoupler assembly 400. The optocoupler assembly 400 is disposed between the data acquisition optical module 100 and the optocoupler composite cable 500. The optocoupler assembly 400 serves as an interface for connecting the data acquisition optical module 100 and the optocoupler composite cable 500, thereby establishing an optocoupler connection between them. On one hand, the optocoupler assembly 400 optically connects the data acquisition optical module 100 and the optocoupler composite cable 500, establishing an optical connection between them. On the other hand, the optocoupler assembly 400 electrically connects the data acquisition optical module 100 and the optocoupler composite cable 500, providing the power signal transmitted in the optocoupler composite cable 500 to the data acquisition optical module 100.

[0068] In some embodiments, the vehicle-mounted optical communication system 1000 may include a composite connector 600. One end of the composite connector 600 is connected to an optical-electric composite cable 500, and the other end is connected to a wire 610 and an optical fiber 620. The optical fiber 620 is used to transmit optical signals, and the wire 610 is used to transmit power signals.

[0069] In some embodiments, one end of the optical fiber 620 is optically connected to the optoelectronic composite cable 500 via a composite connector 600, so that the optical signal transmitted by the optoelectronic composite cable 500 is transmitted externally via the optical fiber 620. One end of the wire 610 receives a power signal, and the other end is electrically connected to the optoelectronic composite cable 500 via the composite connector 600, so that the power signal is transmitted to the optoelectronic composite cable 500 via the wire 610, and then supplies power externally via the optoelectronic composite cable 500.

[0070] In some embodiments, the optical fiber 620 is used to connect the optoelectronic composite cable 500 and the optical signal data processing device 200. The optical signal transmitted in the optoelectronic composite cable 500 is then transmitted to the optical signal data processing device 200 via the optical fiber 620. The wire 610 is electrically connected to the vehicle-mounted power supply device. The power signal is then transmitted to the optoelectronic composite cable 500 via the wire 610. The optoelectronic composite cable 500 transmits the power signal to the data acquisition optical module 100, supplying power to the data acquisition optical module 100.

[0071] In some embodiments, multiple sensors 120 are respectively installed at the front of the vehicle, parking space, and both sides of the vehicle body. One of the sensors 120 can be integrated into a corresponding data acquisition optical module 100. When setting up multi-channel sensors 120, a beam splitter 300 is provided at the transmission end of the multi-channel optical fiber 620. One end of the beam splitter 300 is connected to the optical fiber 620, and the other end is connected to the optical signal data processing device 200, so that multiple vehicle-mounted sensors 120 correspond to one optical signal data processing device 200.

[0072] Figure 2A is a partial structural diagram of a vehicle-mounted optical communication system according to some embodiments. As shown in Figure 2A, in some embodiments, the data acquisition optical module 100 includes an optoelectronic composite interface 140. The optoelectronic composite interface 140 is used to realize the external coupling connection of the data acquisition optical module 100 to transmit the optical signal generated by the data acquisition optical module 100 to the outside. The optoelectronic composite interface 140 is fixed to the surface of the circuit board 110, and one end of the optical transceiver component 130 extends into the optoelectronic composite interface 140 to guide the optical signal generated by the optical transceiver component 130 into the optoelectronic composite interface 140.

[0073] In some embodiments, the optoelectronic composite interface 140 is fixed to the end of the circuit board 110. The optoelectronic connector assembly 400 is connected to the optoelectronic composite cable 500, and the optoelectronic connector assembly 400 is inserted into the optoelectronic composite interface 140 to establish an optoelectronic connection between the data acquisition optical module 100 and the optoelectronic composite cable 500.

[0074] In some embodiments, the optocoupler assembly 400 integrates a fiber optic adapter for connecting the optical cable in the optocoupler composite cable 500. The fiber optic adapter in the data acquisition optical module 100 connects to the fiber optic adapter in the optocoupler assembly 400, thereby establishing an optical connection between the optical fiber inside the data acquisition optical module 100 and the optical cable in the optocoupler composite cable 500, enabling the transmission of optical signals. The optocoupler assembly 400 also integrates a cable connection terminal for electrically connecting the cable in the optocoupler composite cable 500. Simultaneously, the cable connection terminal is electrically connected to the data acquisition optical module 100, establishing an electrical connection between the optocoupler composite cable 500 and the data acquisition optical module 100, thereby providing the power signal transmitted in the optocoupler composite cable 500 to the data acquisition optical module 100.

[0075] Figure 2B is a partial exploded view of a vehicle-mounted optical communication system according to some embodiments, and Figure 2C is a partial exploded view of a vehicle-mounted optical communication system according to some embodiments. As shown in Figures 2B-2C, in some embodiments, the data acquisition optical module 100 includes a first fiber optic adapter 134. The optoelectronic connector assembly includes a second fiber optic adapter. The first fiber optic adapter 134 is connected to the internal optical fiber of the data acquisition optical module 100, and the second fiber optic adapter is connected to the optical cable in the optoelectronic composite cable 500.

[0076] In some embodiments, the optoelectronic composite interface 140 has a first opening 141 at one end and a second opening 142 at the other end. The first fiber optic adapter 134 is embedded in the optoelectronic composite interface 140 along the first opening 141 to introduce the optical signal output by the optical transceiver component 130 into the optoelectronic composite interface 140.

[0077] In some embodiments, the optocoupler assembly 400 is embedded in the optocoupler composite interface 140 along the second opening 142. The second fiber optic adapter in the optocoupler assembly 400 is optically coupled to the first fiber optic adapter 134 to realize the optical connection between the optocoupler composite cable 500 and the data acquisition optical module 100.

[0078] Figure 3A is a structural diagram of a data acquisition optical module according to some embodiments, and Figure 3B is an exploded view of a data acquisition optical module according to some embodiments. As shown in Figures 3A and 3B, in some embodiments, the data acquisition optical module 100 is mainly used to acquire electrical signals for analysis and processing by the on-board main processing device 2000, thereby realizing real-time perception of the vehicle's surrounding environment.

[0079] In some embodiments, the data acquisition optical module 100 includes a circuit board 110. The circuit board 110 includes circuit traces, electronic components, and chips, etc., and the electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), media access controllers (MAC) chips, physical layer chips (PHY) chips, etc.

[0080] In some embodiments, the data acquisition optical module 100 may include a sensor 120. The sensor 120 is fixed to the surface of a circuit board. The sensor 120 can identify the environment surrounding the vehicle and obtain information such as road conditions, vehicle position, and obstacles, converting this information into electrical signals, which may be image data or video data. The sensor 120 is electrically connected to the circuit board to transmit the acquired electrical signal data to the circuit board. The sensor 120 may include a camera to acquire image data or video data.

[0081] In some embodiments, the data acquisition optical module 100 may include an optical transceiver component 130. The optical transceiver component 130 is physically separated from the circuit board 110, and then electrically connected to the circuit board 110 via a flexible circuit board 130a. The optical transceiver component 130 is configured to transmit and receive optical signals. The optical transceiver component 130 converts electrical signals acquired by the sensor 120 into optical signals for signal transmission; or converts received optical signals into electrical signals to receive control signals.

[0082] In some embodiments, the data acquisition optical module 100 may include a flexible circuit board 130a. One end of the flexible circuit board 130a is connected to the circuit board 110, and the other end is connected to the optical transceiver assembly 130, thereby establishing an electrical connection between the circuit board 110 and the optical transceiver assembly 130. The electrical signals transmitted on the circuit board 110 are transmitted to the optical transceiver assembly 130 via the flexible circuit board 130a. The optical transceiver assembly 130 receives the electrical signals from the flexible circuit board 130a and converts them into optical signals.

[0083] In some embodiments, the data acquisition optical module 100 may include an optoelectronic composite interface 140. The optoelectronic composite interface 140 is fixed to the surface of the circuit board 110. The optoelectronic composite interface 140 is adapted to and connected to the optoelectronic connector assembly 400. Exemplarily, the two are connected by a plug-in method. The optoelectronic connector assembly 400 may include a second fiber optic adapter. Within the optoelectronic composite interface 140, the first fiber optic adapter 134 and the second fiber optic adapter are optically coupled together, so that the optical signal output by the optical transceiver assembly 130 is transmitted through the first fiber optic adapter 134 and the second fiber optic adapter and accessed into the optical cable in the optoelectronic composite cable 500. Within the optoelectronic composite interface 140, the cable connection terminal integrated inside the optoelectronic connector assembly 400 is electrically connected to the circuit board 110, so that the power signal transmitted in the optoelectronic composite cable 500 is powered through the traces on the surface of the circuit board.

[0084] In some embodiments, the sensor 120 is disposed on the second surface of the circuit board 110. The flexible circuit board 130a, the optical transceiver assembly 130, and the optoelectronic composite interface 140 are disposed on the first surface of the circuit board 110, thus fully utilizing the space of the circuit board 110, avoiding spatial conflicts between components, optimizing spatial layout, and facilitating miniaturization. Furthermore, since the flexible circuit board 130a and the optical transceiver assembly 130 generate electromagnetic noise, disposing of the sensor 120 on a different surface reduces interference from electromagnetic noise on the first surface, improving the data acquisition accuracy of the sensor 120. Since the optical transceiver assembly 130 generates significant heat during operation, disposing of the sensor 120 on a different surface reduces the impact of heat on the sensor 120, improving the data acquisition accuracy of the sensor 120.

[0085] In some embodiments, the data acquisition optical module 100 may include a MAC chip 150. The MAC chip 150 is disposed on the surface of the circuit board 110. The MAC chip 150 is electrically connected to the circuit board 110. The data acquisition optical module 100 may include a driver chip 160. The driver chip 160 is disposed on the surface of the circuit board 110. The driver chip 160 is electrically connected to the circuit board 110. The electrical signal output by the sensor 120 is converted by the MAC chip 150 and then transmitted to the driver chip 160.

[0086] In some embodiments, the electrical signal collected by the sensor 120 is transmitted to the circuit board 110, and then processed by the MAC chip 150 and the driver chip 160 on the surface of the circuit board 110. The processed electrical signal is then transmitted to the optical transceiver assembly 130 via the flexible circuit board 130a. The optical transceiver assembly 130 converts the received electrical signal into an optical signal and transmits the data collected by the sensor 120 in the form of light.

[0087] In some embodiments, the MAC chip 150 receives electrical signal data collected by multiple sensors 120 and encapsulates the raw electrical signals collected by each sensor 120, including adding frame header information such as source address and destination address to the raw electrical signals to ensure correct data transmission in the network. Simultaneously, the MAC chip 150 can allocate bandwidth to different sensors 120 to avoid frame loss during congestion. The driver chip 160 provides drive current to the optical transceiver component 130 to drive the optical transceiver component 130 to convert electrical signals into optical signals. Furthermore, since the electrical signals collected by the sensors 120 are relatively weak, the driver chip 160 can amplify the amplitude of the electrical signals, facilitating the optical transceiver component 130 to effectively convert them into optical signals. Additionally, the driver chip 160 can provide a synchronization clock for the multiple sensors 120 to prevent sampling timing errors in the sensors 120.

[0088] Figure 4A is a schematic diagram of a sensor and circuit board assembly according to some embodiments, and Figure 4B is an exploded view of a sensor and circuit board assembly according to some embodiments. As shown in Figures 4A and 4B, in some embodiments, the sensor 120 and the photoelectric composite interface 140 are located on different surfaces of the circuit board 110. The photoelectric composite interface 140 is located on the first surface of the circuit board 110, and the sensor 120 is located on the second surface of the circuit board 110.

[0089] In some embodiments, the sensor 120 is electrically connected to the circuit board 110 to transmit the electrical signal output by the sensor 120 to the circuit board 110, and then to the optical transceiver assembly 130 via the circuit board 110. The optical transceiver assembly 130 converts the electrical signal into an optical signal for transmission via light.

[0090] In some embodiments, a first electrical connector 121 is formed on the end face of the sensor 120 facing the circuit board 110. A second electrical connector 112 is formed on the surface of the circuit board 110. The first electrical connector 121 is electrically connected to the second electrical connector 112, and the second electrical connector 112 is electrically connected to the circuit board 110, thereby electrically connecting the sensor 120 to the circuit board 110. Exemplarily, the first electrical connector 121 and the second electrical connector 112 are electrically mated together to achieve electrical connection between them.

[0091] Figure 4C is a schematic diagram of an electrical connection between a sensor and a circuit board according to some embodiments, and Figure 4D is an exploded schematic diagram of an electrical connection between a sensor and a circuit board according to some embodiments. As shown in Figures 4C and 4D, in some embodiments, a first electrical connector 121 and a second electrical connector 112 are electrically connected to achieve an electrical connection between the sensor 120 and the circuit board 110. The first electrical connector 121 serves as an output interface, and the second electrical connector 112 serves as an input interface; electrical contact is ensured between them through a mating method. The first electrical connector 121 includes two rows of electrical connection terminals 122. The second electrical connector 112 includes an electrical connection groove 1121 and pins 1122 located on the outer walls of both sides of the electrical connection groove. One end of each pin 1122 is electrically connected to the wall of the electrical connection groove 1121, and the other end is electrically connected to the surface of the circuit board 110.

[0092] In some embodiments, when the first electrical connector 121 and the second electrical connector 112 are electrically mated, the electrical connection terminal 122 is inserted into the electrical connection groove 1121 and electrically connected to the electrical connection groove 1121, thereby realizing the electrical connection between the electrical connection terminal 122 and the pin 1122, and thus realizing the electrical connection between the first electrical connector 121 and the second electrical connector 112. The size of the first electrical connector 121 is larger than the size of the second electrical connector 112. The first electrical connector 121 acts as a socket, and the second electrical connector 112 acts as a plug; the two are plugged together to achieve electrical connection. The width between the two sidewalls of the first electrical connector 121 is greater than the width between the two sidewalls of the second electrical connector 112, and the first electrical connector 121 can wrap around the second electrical connector 112 to insert the electrical connection terminal 122 into the electrical connection groove 1121.

[0093] Figure 5A is a structural diagram of a sensor according to some embodiments, Figure 5B is a cross-sectional structural diagram of a sensor according to some embodiments, and Figure 5C is a partial cross-sectional structural diagram of a sensor according to some embodiments. As shown in Figures 5A-5C, in some embodiments, a first electrical connector 121 is formed on the end face of the sensor 120 facing the circuit board 110. The first electrical connector 121 has a socket for the second electrical connector 112 to be inserted, thereby realizing the electrical connection between the two. The first electrical connector 121 includes two rows of electrical connection terminals 122. The electrical connection terminals 122 are inclined toward the side wall of the first electrical connector 121 so that the ends of the electrical connection terminals 122 can contact the inner wall of the electrical connection groove 1121, thereby realizing the electrical connection between the electrical connection terminals 122 and the second electrical connector 112.

[0094] Figure 6A is a structural diagram of an optical transceiver component according to some embodiments, and Figure 6B is an exploded view of an optical transceiver component according to some embodiments. As shown in Figures 6A and 6B, in some embodiments, the optical transceiver component 130 may be in a TO package.

[0095] In some embodiments, the optical transceiver assembly 130 may include a rectangular tube 131. Each sidewall of the rectangular tube 131 has an opening.

[0096] In some embodiments, the optical transceiver assembly 130 may include an optical emitting component 132. The optical emitting component 132 is embedded in the opening of the round-square tube 131.

[0097] In some embodiments, the optical transceiver assembly 130 may include an optical receiving component 133. The optical receiving component 133 is embedded within the opening of the round-square tube 131. The optical receiving component 133 and the optical emitting component 132 are located on adjacent sidewalls of the round-square tube 131.

[0098] In some embodiments, the optical transceiver assembly 130 may include a first fiber optic adapter 134. The first fiber optic adapter 134 is embedded in the opening of the round-square tube 131. The first fiber optic adapter 134 and the transmitting component 132 are located on opposite sidewalls of the round-square tube 131.

[0099] In some embodiments, the light emitting component 132 is electrically connected to the circuit board 110. Electrical signal data acquired by the sensor 120 is transmitted via the circuit board 110 to the light emitting component 132, which converts the electrical signal into an optical signal. The optical signal is output along the first fiber optic adapter 134 and transmitted to the optical signal data processing device 200. The optical signal data processing device 200 receives the optical signal from the data acquisition optical module 100 and converts it into an electrical signal suitable for processing by the vehicle-mounted main processing device 2000.

[0100] In some embodiments, the optical receiving component 133 is electrically connected to the circuit board 110. The optical receiving component 133 converts the optical signal transmitted along the first fiber optic adapter 134 into an electrical signal, and the converted electrical signal is transmitted along the circuit board 110. Exemplarily, control signals or control commands issued by the vehicle main processing device 2000 are transmitted in the form of optical signals to the first fiber optic adapter 134 and then to the optical receiving component 133. The optical receiving component 133 converts the received optical signal into an electrical signal, and the electrical signal is transmitted to the sensor 120 via the circuit board 110.

[0101] In some embodiments, the light emitting component 132 and the light receiving component 133 can be electrically connected to the surface of the circuit board 110 via flexible circuit boards. One flexible circuit board has one end electrically connected to the light emitting component 132 and the other end electrically connected to the surface of the circuit board 110. Another flexible circuit board has one end electrically connected to the light receiving component 133 and the other end electrically connected to the surface of the circuit board 110.

[0102] Figure 6C is an internal structural diagram of an optical transceiver assembly according to some embodiments. As shown in Figure 6C, in some embodiments, the optical emitting component 132 and the optical receiving component 133 are respectively fixed to the side wall of the round-square tube 131.

[0103] In some embodiments, an optical component, including a filter 135, is disposed within the inner cavity of the round-square tube 131. The filter 135 is located at the intersection of the emission optical path of the light emitting component 132 and the reception optical path of the light receiving component 133. The filter 135 is tilted and gradually tilts towards the first fiber optic adapter 134 along the light emission direction of the light emitting component 132. The filter 135 is configured to transmit the optical signal generated by the light emitting component 132 and reflect the optical signal input to the light receiving component 133 via the first fiber optic adapter 134.

[0104] In some embodiments, after the optical signal emitted by the optical emitting component 132 enters the round-square tube 131, the optical signal directly passes through the optical filter 135 and enters the first optical fiber adapter 134 to realize the emission of the optical signal. The optical signal output along the first optical fiber adapter 134 is incident on the surface of the optical filter 135 and reflected by the optical filter 135 into the optical receiving component 133.

[0105] In some embodiments, to prevent reflected light from returning to the optical emitting component 132 at the fiber end face, the optical components within the circular-square tube 131 further include an optical isolator 136, located between the optical emitting component 132 and the filter 135. The optical signal generated by the optical emitting component 132 can directly pass through the optical isolator 136 and the filter 135, thereby entering the first fiber optic adapter 134. The optical signal reflected back from the fiber end face can pass through the filter 135 but cannot pass through the optical isolator 136, thus preventing it from entering the optical emitting component 132 and ensuring the light emission quality of the optical emitting component 132.

[0106] In some embodiments, since the filter 135 is a semi-transparent and semi-reflective film, when the light signal generated by the light emitting component 132 passes through the filter 135, part of the light signal is reflected at the filter 135, and the reflected light signal is diffusely reflected in the round-square tube 131, forming crosstalk light.

[0107] In some embodiments, to avoid signal crosstalk caused by crosstalk light, the optical components within the round-square tube 131 further include a light-absorbing sheet 137, which is disposed on the reflected light path of the light signal emitted by the light emitting component 132 after reflection by the filter 135. The light-absorbing sheet 137 can absorb the light signal reflected at the filter 135, reducing the formation of crosstalk light. The light-absorbing sheet 137 is fixed to the surface of the mounting base 138. The mounting base 138 is configured to support the light-absorbing sheet 137. The mounting base 138 is embedded in the opening of the round-square tube 131.

[0108] In some embodiments, another form of optical transceiver component is also provided, namely, the data acquisition optical module 100 may include an optical transceiver component 180. For example, the optical transceiver component in the data acquisition optical module 100 may adopt the structure of optical transceiver component 130 or the structure of optical transceiver component 180.

[0109] In some embodiments, the optical transceiver assembly 180 may include an optical receiving component 183 and an optical emitting component 182, which are physically separated from the circuit board 110 and then electrically connected to the circuit board 110 via corresponding flexible circuit boards or electrical connectors. The optical receiving component 183 is used to receive optical signals, and the optical emitting component 182 is used to generate optical signals.

[0110] In some embodiments, at least one of the light receiving component 183 and the light emitting component 182 is located on the side of the circuit board 110 away from the gold finger 301. At least one of the light receiving component 183 and the light emitting component 182 can be directly disposed on the circuit board 110. For example, at least one of the light emitting component 182 or the light receiving component 183 can be disposed on the surface of the circuit board 110 or on the side of the circuit board 110.

[0111] In some embodiments, the optical transceiver assembly 180 may include a first fiber optic adapter 184 located within the optical port.

[0112] In some embodiments, the optical transceiver assembly 180 further includes a rectangular tube 181, which can connect to an optical receiving component 183, an optical transmitting component 182, and a first fiber optic adapter 184. Optical devices, such as lenses or filters, may be disposed within the rectangular tube 181. These optical devices are used to change the transmission direction of the received and transmitted optical signals.

[0113] Figure 7A is a structural diagram of another optical transceiver assembly according to some embodiments, and Figure 7B is an exploded view of another optical transceiver assembly according to some embodiments. As shown in Figures 7A-7B, in some embodiments, the optical transceiver assembly 180 may include a first connecting sleeve 188. The first connecting sleeve 188 is used to connect a first fiber optic adapter 184 and a square tube 181 to facilitate connection between the first fiber optic adapter 184 and the square tube 181, and to facilitate adjustment of the relative positions of the first fiber optic adapter 184 and the square tube 181. One end of the first connecting sleeve 188 is embedded and connected to the first fiber optic adapter 184, and the other end of the first connecting sleeve 188 is connected to the end face of one end of the square tube 181.

[0114] In some embodiments, the optical transceiver assembly 180 may include a second connecting sleeve 189. The second connecting sleeve 189 is used to connect the round-square tube 181 and the optical emitting component 182, facilitating the connection between the optical emitting component 182 and the round-square tube 181, and facilitating the adjustment of the relative position of the first fiber optic adapter 184 and the round-square tube 181, thereby facilitating the adjustment of the coupling efficiency of the optical emission signal generated by the optical emitting component 182 to the round-square tube 181. Exemplarily, one end of the second connecting sleeve 189 is connected to the end face of the other end of the round-square tube 181, and the other end of the second connecting sleeve 189 is sleeved on the top of the optical emitting component 182.

[0115] Figure 7C is a cross-sectional view of another optical transceiver assembly according to some embodiments. As shown in Figure 7C, in some embodiments, the optical transceiver assembly 180 may include a first lens 185 located within a rectangular tube 181. The first lens 185 is adjacent to a first fiber optic adapter 184. The first lens 185 can collimate a received light signal and focus an emitted light signal. The optical transceiver assembly 180 may include a first filter 186 located within the rectangular tube 181. The first filter 186 is located to the side of the first lens 185. The first filter 186 allows the emitted light signal generated by the light emitting component 182 to pass through, and the first filter 186 can reflect a received light signal to the light receiving component.

[0116] In some embodiments, the optical transceiver assembly 180 may include a second filter 187 located between the optical receiving component 183 and the first filter 186, and situated in the reflected light path of the first filter 186. The second filter 187 is used to filter the light signal reflected by the first filter 186, thereby improving the quality of the light signal received by the optical receiving component.

[0117] In some embodiments, the first fiber optic adapter 184 includes an adapter body 1841 and a fiber optic ferrule 1842. One end of the fiber optic ferrule 1842 is embedded in and connected to the adapter body 1841, and the other end of the fiber optic ferrule 1842 is located within a first connecting sleeve 188. The fiber optic ferrule 1842 is used to transmit optical transmission signals and optical reception signals, facilitating the coupling of optical transmission signals into the optical fiber and the transmission of optical reception signals output through the optical fiber to the round-square tube body 181.

[0118] In some embodiments, the fiber core in the fiber ferrule 1842 can be a multimode fiber core, ensuring that the diameter of the light spot coupled into the multimode fiber core is comparable to the diameter of the multimode fiber core, thereby ensuring that the light energy distribution of the light emission signal and other signals in the multimode fiber core is more uniform, which is more conducive to back-end beam splitting applications.

[0119] Figure 7D is a structural diagram of a round-square tube according to some embodiments, Figure 7E is a structural diagram of a round-square tube according to some embodiments, Figure 7F is a cross-sectional view of a round-square tube according to some embodiments, and Figure 7G is a usage diagram of a round-square tube according to some embodiments. As shown in Figures 7D-7G, in some embodiments, a receiving cavity 1811 is formed inside the round-square tube 181, and a first filter 186 and a second filter 187 are disposed inside the receiving cavity 1811.

[0120] In some embodiments, a first mounting surface 1812 is formed on the edge of the receiving cavity 1811, and the first mounting surface 1812 supports and connects to the first filter 186. The first mounting surface 1812 is inclined, which facilitates the placement of the first filter 186 within the receiving cavity 1811. A second mounting surface 1813 is formed on the edge of the receiving cavity 1811, and the second mounting surface 1813 supports and connects to the second filter 187. The second mounting surface 1813 facilitates the fixing of the second filter 187.

[0121] In some embodiments, the round-square tube 181 has a first mounting hole 1814 that penetrates one end of the round-square tube 181 and connects to the receiving cavity 1811. A first lens 185 is embedded in the first mounting hole 1814. A second mounting hole 1815 is formed on the round-square tube 181 that penetrates the side of the round-square tube 181 and connects to the receiving cavity 1811. A connecting light receiving component 183 is embedded in the second mounting hole 1815.

[0122] In some embodiments, a mounting boss 1816 is formed at the other end of the round-square tube 181, protruding from the other end of the round-square tube 181. A first through hole 1817 is formed on the mounting boss 1816, which communicates with the receiving cavity 1811. The end face of the mounting boss 1816 is connected to one end of the second connecting sleeve 189, so as to connect the second connecting sleeve 189 through the mounting boss 1816, so as to realize the adjustment of the light emitting component 182 in the width and height directions of the round-square tube 181.

[0123] Figure 8A is a structural diagram of a light emitting component according to some embodiments; Figure 8B is an exploded view of a light emitting component according to some embodiments; Figure 8C is an exploded view of a light emitting component according to some embodiments; Figure 8D is an exploded view of a light emitting component according to some embodiments; Figure 8E is a partial view of a light emitting component according to some embodiments; and Figure 8F is a cross-sectional view of a light emitting component according to some embodiments. As shown in Figures 8A-8F, in some embodiments, the light emitting component includes a socket 1821 and a cap 1822. The cap 1822 covers the top of the socket 1821 and is fixedly connected to the socket 1821. The socket 1821 and the cap 1822 can form a relatively enclosed space, within which a laser chip or other devices can be disposed. Pins 1823 are formed on the socket 1821, and the pins 1823 are used for electrical connection to a first flexible circuit board 310 or a circuit board of a host computer, etc. Multiple pins 1823 are formed on the socket 1821, with some pins 1823 penetrating the socket 1821 and their tops protruding from the top of the socket 1821. Laser chips and other devices can be wired to the pins 1823. The pins 1823 include high-frequency pins used to transmit high-frequency signals.

[0124] In some embodiments, the light emitting component 182 may include a laser chip 1824. A socket 1821 supports and connects to the laser chip 1824, and the laser chip 1824 can be wire-connected to pins 1823. The laser chip 1824 may be a Vertical Cavity Surface Emitting Laser (VCSEL) laser chip. The optical resonant cavity of a VCSEL is perpendicular to the surface of the semiconductor substrate, and the laser beam is emitted perpendicularly along the chip surface. The laser resonant cavity of a VCSEL is composed of two distributed Bragg mirrors. The laser chip 1824 may be a VCSEL laser chip. The light-emitting surface of the laser chip 1824 is located on the top surface of the laser chip 1824. The bottom surface of the laser chip 1824 is connected to the socket 1821, and the light-emitting surface of the laser chip 1824 is located above the bottom surface of the laser chip 1824. VCSEL laser chips have a larger focal spot diameter, a wider divergence angle, and a lower focal power density.

[0125] In some embodiments, the automotive environment places high demands on the temperature adaptability of components. Automotive-grade components typically need to meet a temperature range of -40°C to 105°C or even wider, while some components near the engine compartment need to withstand temperatures above 125°C. However, due to its shorter resonant cavity length and high-reflectivity DBR mirror, the VCSEL laser chip exhibits a very low threshold current and low sensitivity to temperature changes, resulting in strong high-temperature resistance and stable laser output even in high-temperature environments. At high temperatures, the output power of the VCSEL laser chip is higher than that of EML or DFB laser chips.

[0126] In some embodiments, the vehicle-mounted optical communication system needs to cover the far field, such as 100–200m, for long-distance use during high-speed driving; and simultaneously cover the near field, such as 0.5–10m, for blind spot detection during parking or low-speed oncoming traffic. VCSEL laser chips have a wide divergence angle, enabling wide-range coverage, suitable for large-area scanning without blind spots, such as detecting obstacles within a 180° radius around a vehicle.

[0127] In some conventional optical emitting components 182, the laser chip mainly uses distributed feedback laser (DFB) laser chips. DFB laser chips have concentrated energy distribution, smaller focal spot diameter, narrow divergence angle, and higher focal power density, making them suitable for single-mode fiber transmission. However, they have high requirements for optical coupling accuracy and are costly to manufacture.

[0128] In some embodiments, the VCSEL laser chip is combined with a socket 1821 and a cap 1822 to encapsulate the VCSEL laser chip within the socket 1821 and cap 1822, thereby improving the VCSEL laser chip's environmental adaptability. Furthermore, the communication distance of automotive optical communication is typically no greater than 20m, making the VCSEL laser chip suitable for automotive optical communication applications. Additionally, automotive optical communication uses multimode fiber, and the high power and large spot size of the VCSEL laser chip make the optical path of automotive optical communication more stable, significantly reducing the problem of optical power drop and facilitating the meeting of automotive-grade reliability requirements. Therefore, since the optical transceiver component 180 is suitable for automotive optical communication, the optical module containing the optical transceiver component 180 is the data acquisition optical module 110.

[0129] In some embodiments, the light emitting component 182 may include a first mounting base 1825 disposed on the tube socket 1821. The bottom of the first mounting base 1825 is connected to the tube socket 1821, and the top of the first mounting base 1825 supports and connects to the laser chip 1824. The first mounting base 1825 can raise the laser chip 1824 to facilitate electrical connection between the laser chip 1824 and the corresponding pin 1823.

[0130] In some embodiments, the first mounting base 1825 is a ceramic substrate, and pads are formed on the top surface of the first mounting base 1825. A laser chip 1824 is mounted on the top surface of the first mounting base 1825, and the laser chip 1824 is wire-connected to corresponding pads on the top surface of the first mounting base 1825. The pads on the top surface of the first mounting base 1825 are wire-connected to corresponding pins 1823. The first mounting base 1825 can isolate the laser chip 1824 from the ground plane on the socket 1821.

[0131] In some embodiments, a first high-frequency pin 18231 and a second high-frequency pin 18232 are formed on the socket 1821. The first high-frequency pin 18231 and the second high-frequency pin 18232 are used to electrically connect to the laser chip to input a high-frequency driving signal to the laser chip 1824, so that the laser chip 1824 generates a light emission signal based on the high-frequency driving signal.

[0132] In some embodiments, the first mounting base 1825 is located between the first high-frequency pin 18231 and the second high-frequency pin 18232. A first pad 18251 and a second pad 18252 are formed on the top surface of the first mounting base 1825. The first pad 18251 is wire-connected to the first high-frequency pin 18231, and the second pad 18252 is wire-connected to the second high-frequency pin 18232. Exemplarily, the first pad 18251 and the second pad 18252 are located at one edge of the top surface of the first mounting base 1825, and the laser chip 1824 is mounted on the other side of the top surface of the first mounting base 1825.

[0133] In some embodiments, the light emitting component 182 may include a second lens 1826, which is located above the laser chip 1824. The second lens 1826 is used to collimate the emitted light signal, converging it into parallel light. The second lens 1826, in combination with the first lens 185, can effectively improve the coupling efficiency of the optical signal in the optical transceiver assembly 180, making it easier to adapt to automotive applications, facilitating a more stable optical path, reducing the drop in optical signal power, and meeting automotive reliability requirements.

[0134] In some embodiments, the light emitting component 182 may include a mounting post 1827 located on the side of the laser chip 1824. The mounting post 1827 supports and connects to a second lens 1826, facilitating the placement of the second lens 1826 above the laser chip 1824. Exemplarily, the side of the mounting post 1827 is connected to the second lens 1826. The mounting post 1827 may be a ceramic post, with its bottom connected to the top surface of the tube base 1821 and its side connected to the side of the second lens 1826. The ceramic post can insulate heat, reducing the heat load on the second lens 1826. Of course, in some embodiments, the mounting post 1827 may be integrally formed with the tube base 1821.

[0135] In some embodiments, the light emitting component 182 may include a backlight detector 1828. A socket 1821 may support and connect the backlight detector 1828, which can be used to detect the emitted light power of the laser chip 1824. Exemplarily, the backlight detector 1828 receives the backlight or partially reflected light emission signal from the laser chip 1824 to detect the emitted light power of the laser chip 1824. The backlight detector 1828 may be electrically connected to the socket 1821.

[0136] In some embodiments, the light emitting component 182 may include a second mounting base 1829 disposed on the tube socket 1821. The top of the second mounting base 1829 is connected to the tube socket 1821, and the top of the second mounting base 1829 supports and connects to the backlight detector 1828. The second mounting base 1829 facilitates electrical connection between the backlight detector 1828 and the tube socket 1821. The second mounting base 1829 may be a ceramic substrate.

[0137] In some embodiments, an output pin 18233 is formed on the socket 1821, and the output pin 18233 is located on the side of the second mounting base 1829. A metal layer 18291 is disposed on the top surface of the second mounting base 1829, and a backlight detector 1828 is mounted on the metal layer 18291. The cathode of the backlight detector 1828 is electrically connected to the metal layer 18291. The metal layer 18291 is wired to the output pin 18233, and the anode of the backlight detector 1828 is electrically connected to the top surface of the socket 1821, which facilitates the provision of a reverse bias voltage to the backlight detector 1828, thereby facilitating the output of a detection current by the backlight detector 1828.

[0138] In some embodiments, the cap 1822 includes a cap body 18221 and a light window 18222. The cap body 18221 has a base 1821, and the top of the cap body 18221 is connected to the light window 18222. Exemplarily, the top of the cap body 18221 is tilted to facilitate the tilted placement of the light window 18222 on top of the cap body 18221. The light emission signal generated by the laser chip 1824 is transmitted to the light window 18222; part of the light emission signal is refracted through the light window 18222, and part of the light emission signal is reflected by the light window 18222. The light signal reflected by the light window 18222 is transmitted to the backlight detector 1828 so that the backlight detector 1828 can receive the light emission signal.

[0139] In some embodiments, a support platform 18223 is formed on the cap body 18221, and the top of the cap body 18221 is recessed to form the support platform 18223, which supports the connecting light window 18222. Exemplarily, an inclined surface 18224 is formed on the top of the support platform 18223, which supports the connecting light window 18222, facilitating the inclined setting of the light window 18222. The inclined setting of the light window 18222 can reduce reflection interference generated when the light beam exits perpendicularly.

[0140] In some embodiments, the light emission signal generated by the laser chip 1824 is transmitted to the second lens 1826, collimated by the second lens 1826, and then transmitted to the optical window 18222. Part of the light emission signal is transmitted into the circular tube 181 through the optical window 18222, and part of the light emission signal is reflected by the optical window 18222 towards the backlight detector 1828.

[0141] Figure 8G is a schematic diagram of the assembly of a light emitting component and a second connecting sleeve according to some embodiments. As shown in Figure 8G, in some embodiments, the bottom dimension of the cap body 18221 is smaller than the dimension of the base 1821, and the other end of the second connecting sleeve 189 is connected to the base 1821, covering the outside of the cap 1822. Exemplarily, the other end of the second connecting sleeve 189 is connected to the top surface of the base 1821.

[0142] In some embodiments, a connecting plate 1891 is formed at one end of the second connecting sleeve 189, and the connecting plate 1891 is located at the light-emitting end of the cap 1822. The connecting plate 1891 facilitates the connection between the second connecting sleeve 189 and the round-square tube 181 and facilitates the adjustment of the positions of the second connecting sleeve 189 and the round-square tube 181, thereby ensuring the coupling efficiency of the light emission signal to the round-square tube 181 and ensuring that the light power intensity of the light emission signal transmitted to the round-square tube 181 meets the preset requirements. A second through hole 1892 is formed on the connecting plate 1891, which is used to transmit the light emission signal. The second through hole 1892 can connect to the first through hole 1817 to facilitate the transmission of the light emission signal to the round-square tube 181.

[0143] In some embodiments, the vehicle-mounted optical communication system needs to perceive the surrounding environment of the vehicle with high precision, including identifying nearby obstacles such as pedestrians and guardrails, as well as identifying medium- and long-range targets such as vehicles ahead and traffic signs. It also needs to adapt to complex environments such as strong daylight, low light at night, and rain / fog. If the laser beam energy is concentrated, with excessively high energy at the center and low energy at the edges, or vice versa, it can cause the detector to saturate due to excessive energy at nearby targets. Insufficient energy at the edges can easily create detection blind spots, such as the inability to identify obstacles in low-energy areas beside or behind the vehicle. Therefore, the vehicle-mounted optical communication system has certain requirements for the uniformity of beam energy distribution. For example, the beam energy distribution is required to meet the IEC Encircled Flux (EF) standard, a specification developed by the International Electrotechnical Commission (IEC) for measuring the performance of light sources in fiber optic communication systems, with IEC 61280-1-4 as its core standard.

[0144] In some embodiments, the emitted light from a VCSEL laser chip exhibits non-uniformity, with the intensity distribution showing weak energy at the center and strong energy at the edges. This is mainly due to two reasons. Firstly, the resonant cavity of the VCSEL laser chip is composed of upper and lower distributed Bragg mirrors. The modes of the optical field within the cavity compete due to differences in structural parameters, and the presence of higher-order modes directly disrupts the uniformity of light intensity. Secondly, the VCSEL laser chip uses ring electrodes or grid electrodes to restrict current diffusion. Since current preferentially flows along the electrode edges with lower resistance, the current density at the electrode edges is higher than at the center, resulting in a higher carrier concentration at the edge of the active region than at the center, leading to a strong energy distribution at the edge and a weak energy distribution at the center of the VCSEL laser chip.

[0145] Figure 8H is a cross-sectional view of the internal structure of an optical transceiver assembly according to some embodiments, and Figure 8I is an exploded cross-sectional view of the internal structure of an optical transceiver assembly according to some embodiments. As shown in Figures 8H and 8I, in some embodiments, the two ends of the round-square tube 181 are respectively connected to a light emitting component 182 and a first fiber optic adapter 184. A second lens 1826 is provided on the light output path of the laser chip 1824. The second lens 1826 is used to collimate the light emission signal emitted by the laser chip 1824.

[0146] In some embodiments, an isolator 1818 is provided inside the round-square tube 181. The isolator 1818 is embedded in the inner cavity of the round-square tube 181. The isolator 1818 is located in the output optical path of the laser chip 1824 to prevent the light emission signal emitted by the laser chip 1824 from returning to the laser chip 1824 along the original path, thereby ensuring the output stability of the laser chip 1824. Exemplarily, the laser chip 1824 is a VCSEL laser chip, and the isolator 1818 is located in the output optical path of the second lens 1826.

[0147] In some embodiments, a first filter 186 is provided inside the round-square tube 181. The first filter 186 is disposed on one side of the isolator 1818. The first filter 186 is used to transmit the light emission signal emitted by the laser chip 1824. A first lens 185 is provided inside the round-square tube 181. The first lens 185 can collimate the light receiving signal and focus the light emission signal. The first lens 185 is disposed in the transmission light path of the first filter 186 transmitting the light emission signal.

[0148] In some embodiments, the first filter 186 is located between the isolator 1818 and the first lens 185 to transmit the isolated light emission signal and transmit the transmitted light emission signal to the first lens 185. Two connecting sleeves 189 are nested outside the tube cap 1822 to connect the light emitting component 182 and the round-square tube 181.

[0149] In some embodiments, a second through hole 1892 is formed on the light-emitting surface of the second connecting sleeve 189. A light homogenizer 1893 is embedded in the second through hole 1892. The second through hole 1892 is formed in the light-emitting path of the second lens 1826. The light homogenizer 1893 is disposed in the light-emitting path of the second lens 1826. The light homogenizer 1893 is used to adjust the uniformity of the light intensity of the emitted light spot of the laser chip 1824. The light homogenizer 1893 readjusts the non-uniform light intensity distribution emitted by the VCSEL laser chip to form a uniform light spot in the entire target area, with a small energy difference between the center and edge of the light spot. Exemplarily, the light homogenizer 1893 can convert the light spot emitted by the VCSEL laser chip into a specific structured light pattern, i.e., a light spot with a uniform light intensity distribution.

[0150] In some embodiments, since the isolator 1818 is provided inside the round-square tube 181, the space inside the round-square tube 181 is limited. Therefore, the light-diffusing element 1893 is disposed outside the round-square tube 181. Exemplarily, the light-diffusing element 1893 may also be disposed inside the round-square tube 181.

[0151] In some embodiments, the light homogenizer 1893 can be a superlens. A superlens can precisely control the phase, amplitude, and polarization of incident light through surface microstructures (such as nanostructure arrays), thereby achieving manipulation of the light field. A superlens can adjust unevenly irradiated light spots into light spots with uniform irradiance distribution.

[0152] In some embodiments, a superlens may include a substrate and a subwavelength nanostructure array disposed on the substrate. The superlens can homogenize the energy distribution of the light field and reduce scattering and diffraction caused by phase abrupt changes through phase modulation of the nanostructure array, thereby adjusting unevenly irradiated light spots into uniform ones. The substrate serves as the supporting platform for the superlens and is typically made of optical lens materials. The nanostructure array can be made of transparent materials with high refractive indices, such as silicon nitride, titanium dioxide, or silicon dioxide. The selection of these materials can be based on factors such as their optical properties, mechanical stability, and compatibility with manufacturing processes.

[0153] In some embodiments, the nanostructure array can be cylindrical or rectangular. Cylindrical nanostructure arrays can provide a more uniform light spot adjustment effect, while rectangular nanostructure arrays may have a stronger light field manipulation capability in a specific direction. By adjusting the shape, size, and arrangement of the nanostructure array, more precise control of the optical signal can be achieved, thereby meeting the needs of different application scenarios.

[0154] In some embodiments, the height of the nanostructure array is discretely distributed in 8 steps, with each step corresponding to a phase delay of 45°.

[0155] In some embodiments, the height of the nanostructure array is discretely distributed in 16 steps, with each step corresponding to a phase delay of 22.5°.

[0156] In some embodiments, phase modulation of the superlens is typically achieved by altering the height or geometric parameters of the nanostructure array. A higher degree of phase discretization (more steps) results in phase modulation of the microstructure that more closely approximates an ideal continuous change, thereby reducing light scattering and undesired diffraction effects caused by phase abrupt changes. This leads to better light homogenization in a 16-step superlens. Because of its smoother phase transitions, a 16-step superlens can more effectively concentrate incident light energy into the target light field mode (e.g., focused, vortex beams), thus improving optical efficiency.

[0157] In some embodiments, when the height of the nanostructure array is discretely distributed in 16 steps, the diameter or side length of the nanostructure array is 50-200 nm, and the height is 100-500 nm. This not only ensures sufficient phase modulation accuracy but also maintains high yield and stability in the manufacturing process. For example, the diameter or side length of a single nanostructure is 50-200 nm, and the height is 100-500 nm.

[0158] In some embodiments, the beam homogenizer 1893, by etching nanoscale periodic or non-periodic microstructures on a substrate, utilizes the diffraction and interference effects of light to reshape the incident non-uniform light beam into a target light spot with uniform energy. This meets the uniformity requirements of laser beam intensity distribution in automotive environments, reducing false detector saturation due to excessive energy and detection blind spots due to insufficient energy. Simultaneously, the beam homogenizer 1893 exhibits high diffraction efficiency. In low-light attenuation scenarios such as rain, fog, and dust storms, higher energy utilization reduces environmental losses of the light signal, ensuring reliable detection under adverse weather conditions. The microstructure of the beam homogenizer 1893 can be directly etched onto a thin substrate, resulting in a small thickness and volume, enabling high integration and meeting the lightweight requirements of automotive systems.

[0159] Figure 8J is a cross-sectional structural diagram of a light emitting component according to some embodiments, Figure 8K is an exploded cross-sectional view of a light emitting component according to some embodiments, and Figure 8L is an exploded cross-sectional view of a light emitting component according to some embodiments. As shown in Figures 8J-8L, in some embodiments, a second through hole 1892 is formed on the light-emitting surface of the second connecting sleeve 189. The light-diffusing element 1893 is embedded in the second through hole 1892.

[0160] In some embodiments, a second lens 1826, an optical window 18222, and a homogenizer 1893 are sequentially arranged along the light output path of the laser chip 1824. The second lens 1826 collimates the light emission signal emitted by the laser chip 1824, and the collimated light passes through the optical window 18222 and is transmitted to the homogenizer 1893 after transmission through the optical window 18222. After the light emission signal is collimated by the second lens 1826, the homogenizer 1893 homogenizes the collimated light. For example, the incident angle of non-collimated light is chaotic, and the optical path difference is uncontrollable, which makes it impossible for the homogenizer 1893 to achieve precise control through a fixed nanostructure. However, when the homogenizer 1893 homogenizes the collimated light, the collimated light provides the homogenizer 1893 with incident light of consistent angle and stable optical path difference, reducing the design difficulty and control complexity of the homogenizer 1893, thereby ensuring the homogenization effect of the homogenizer 1893.

[0161] In some embodiments, the beam homogenizer 1893 is disposed in the incident light path of the isolator 1818, and the isolator 1818 isolates the emitted light signal after beam homogenization. Since the beam homogenizer 1893 has converted the non-uniform light spot into a light spot with uniform energy distribution, the isolator 1818 will not experience local overload or local absorption, thereby ensuring the high forward transmission efficiency of the isolator 1818 and avoiding energy loss. In addition, the polarization state of the uniform light spot is more stable. The isolator 1818 sets the forward transmission path based on the uniform light spot with stable polarization state, which can improve the isolation of the reverse light and effectively protect the output light stability of the laser chip 1824.

[0162] Figure 9A is an exploded view of a light emitting component according to some embodiments. As shown in Figure 9A, in some embodiments, the light emitting component 400a may include a socket 410a, the top surface of which may be flush with the bottom surface of a first carrier substrate 470a. A laser chip 440a may be disposed on the top surface of the first carrier substrate 470a, and the laser chip 440a may emit light signals. The laser chip 440a may be a VCSEL laser chip. The light signal emitted by the VCSEL laser chip may include multiple modes. The light signal emitted by the VCSEL laser chip includes a (0,0) fundamental mode and a (0,1) higher-order mode.

[0163] In some embodiments, a second support substrate 450a may be provided on the top surface of the tube base 410a. The bottom surface of the second support substrate 450a is connected to the top surface of the tube base 410a, and the first side surface 451a of the second support substrate 450a may be connected to the side surface of the first support substrate 470a, so that the first support substrate 470a can be connected to the second support substrate 450aa. For example, the first side surface 451a of the second support substrate 450aa and the side surface of the first support substrate 470a may be connected by welding, adhesive, or other methods.

[0164] In some embodiments, the light emitting component 400a may include a pin 460a, which may extend through the bottom and top surfaces of the base 410a. One end of the pin 460a may be electrically connected to a circuit board via a flexible circuit board, and the other end of the pin 460a protrudes from the top surface of the base 410a and is connected to an optoelectronic device on the base 410a, thereby electrically connecting the optoelectronic device to the circuit board. For example, the pin 460a is wire-connected to a laser chip 440a, thereby electrically connecting the laser chip 440a to the circuit board, and the laser chip 440a emits a light signal under the action of an electrical signal provided by the circuit board.

[0165] In some embodiments, the light emitting component 400a may include a cap 420a, which may cover the tube base 410a to form a storage cavity. A first lens 430a may be disposed within the storage cavity. The first lens 430a may be located in the light emission direction of the laser chip 440a to receive the light signal emitted by the laser chip 440a. The first lens 430a may be a collimating lens to collimate the light signal emitted by the laser chip 440a to obtain collimated light.

[0166] Figure 9B is a partial view of the internal structure of an optical module according to some embodiments, Figure 9C is a partially exploded view of the internal structure of an optical module according to some embodiments, and Figure 9D is an optical path diagram of an optical module according to some embodiments. As shown in Figures 9B, 9C, and 9D, in some embodiments, the first housing 510 may include an inner cavity 514, a first port 511, a second port 512, and a third port 513. The inner cavity 514 is connected to the first port 511, the second port 512, and the third port 513, respectively. The first port 511 may be located on the first sidewall of the first housing 510, the second port 512 may be located on the second sidewall of the first housing 510, and the third port 513 may be located on the third sidewall of the first housing 510. The first sidewall, the second sidewall, and the third sidewall of the first housing 510 are connected sequentially, and the first sidewall and the third sidewall of the first housing 510 are disposed opposite to each other. The optical emitting component 400a can be inserted into the first port 511 so that it can be connected to the first end of the first housing 510. The optical receiving component can be inserted into the second port 512 so that it can be connected to the second end of the first housing 510. The first fiber optic adapter 700 can be inserted into the third port 513 so that it can be connected to the third end of the first housing 510. It is understood that the first housing 510 is the aforementioned round-square tube.

[0167] In some embodiments, the inner cavity 514 of the first housing 510 may be provided with a second lens 524. The second lens 524 may be a converging lens to converge the collimated light. The second lens 524 may be located between the first lens 430a and the fiber optic ferrule 701 to converge the collimated light after collimation by the first lens 430a into the fiber optic ferrule 701.

[0168] In some embodiments, the inner cavity 514 of the first housing 510 may be provided with a first filter 522. The first filter 522 may be located between the first lens 430a and the second lens 524 to filter collimated light. The first filter 522 may be tilted toward the light receiving component so that the light signal can be reflected by the first filter 522 and then incident on the light receiving component.

[0169] In some embodiments, a second filter 523 may be disposed in the inner cavity 514 of the first housing 510. The second filter 523 can filter optical signals to reduce stray light incident on the light receiving component. The second filter 523 may be located between the first filter 522 and the light receiving component, so that the optical signal filtered by the second filter 523 is incident on the light receiving component. For example, the second filter 523 may be a bandpass filter, and the transmission wavelength range is the operating wavelength band of the light receiving component.

[0170] In some embodiments, the inner cavity 514 of the first housing 510 may be provided with a light homogenizer 521, that is, the light homogenizer 521 is disposed inside the round-square tube. The light homogenizer 521 can adjust the light signal to make the irradiance distribution of the light signal spot uniform. The light homogenizer 521 may be located between the first lens 430a and the second lens 524 so that the light homogenizer 521 can adjust the light signal collimated by the first lens 430a to make the irradiance distribution of the light signal focused by the second lens 524 uniform.

[0171] In some embodiments, the light homogenizer 521 may be a superlens. The structure of the light homogenizer 521 can be referred to the relevant description of the light homogenizer 1893 described above.

[0172] In some embodiments, the light homogenizer 521 may be located between the first lens 430a and the first filter 522, so that the irradiance of the light spot entering the first optical fiber adapter 700 is uniformly distributed, without affecting the irradiance of the light spot entering the light receiving chip of the light receiving component, thus ensuring the intensity of the light signal received by the light receiving chip.

[0173] In some embodiments, the light homogenizer 521 is disposed on the light output path of the first lens 430a. The first lens 430a is used to collimate the light emission signal emitted by the laser chip 440a. The light homogenizer 521 homogenizes the collimated light, and the collimated light provides the light homogenizer 1893 with incident light of consistent incident angle and stable optical path difference, thereby reducing the design difficulty and control complexity of the light homogenizer 1893 and ensuring the light homogenizing effect of the light homogenizer 1893.

[0174] Figure 9E is an optical path diagram of another optical module according to some embodiments. As shown in Figure 9E, in some embodiments, the second lens 524 can be placed inside the mounting base 900, the optical emitting component 400a is provided with a laser chip and a first lens 430a, and the beam homogenizer 521 can be placed inside the optical emitting component 400a or inside the mounting base 900. The optical signal emitted by the laser chip 440a is collimated by the first lens 430a, homogenized by the beam homogenizer, and focused by the second lens 524 into the fiber core of the second fiber optic ferrule 701a.

[0175] Figure 9F is a test diagram of the height distribution of the diffraction surface of a superlens according to some embodiments. In Figure 9F, the horizontal axis represents spatial position, and the vertical axis represents height. As shown in Figure 9G, the height of the nanostructure array of the superlens is discretely distributed in 16 steps.

[0176] Figure 9G is a comparison diagram of the irradiance distribution of a light spot according to some embodiments. Figure 9H is a comparison diagram of a light spot according to some embodiments. In Figure 9G, the horizontal axis is the distance from the center point of the light spot, and the vertical axis is the irradiance. In Figure 9G, (1) is the irradiance distribution diagram before uniform illumination, and (2) is the irradiance distribution diagram after uniform illumination. In Figure 9H, (1) is the light spot diagram before uniform illumination, and (2) is the light spot diagram after uniform illumination. As shown in Figures 9G and 9H, the light spot with uneven irradiance distribution becomes a light spot with uniform irradiance distribution after passing through the superlens, and the size of the light spot increases.

[0177] Figure 10A is a cross-sectional structural diagram of a vehicle-mounted optical communication system layout according to some embodiments. As shown in Figure 10A, in some embodiments, the inner cavity of the optoelectronic composite interface 140 is hollow, and the first fiber optic adapter 134 and the optoelectronic connector assembly 400 are respectively inserted from both ends of the optoelectronic composite interface 140, and the two are connected within the inner cavity of the optoelectronic composite interface 140. The optoelectronic connector assembly 400 may include a second fiber optic adapter. When the first fiber optic adapter 134 and the second fiber optic adapter are connected within the inner cavity of the optoelectronic composite interface 140, the optical signal input or output by the first fiber optic adapter 134 establishes an optical connection with the optoelectronic connector assembly 400, thereby establishing an optical connection between the first fiber optic adapter 134 and the optoelectronic composite cable 500 for optical signal transmission.

[0178] Figure 10B is a cross-sectional structural diagram of a data acquisition optical module according to some embodiments. As shown in Figure 10B, in some embodiments, the optoelectronic composite interface 140 is fixed to the surface of the circuit board 110, and the circuit board 110 supports the optoelectronic composite interface 140. The optoelectronic composite interface 140 is located at one end of the circuit board 110.

[0179] In some embodiments, a through hole 111 is formed on the surface of the circuit board 110. A locking portion 143 is formed at the bottom of the optoelectronic composite interface 140. The locking portion 143 extends toward the circuit board 110 and is inserted into the through hole 111, thereby fixing the optoelectronic composite interface 140 to the surface of the circuit board 110. The locking portion 143 includes two latches 1431 disposed opposite to each other. The latches 1431 have a certain elasticity and have protrusions 1432. By pinching the two latches 1431, they undergo elastic deformation, the latches 1431 slide into the through hole 111 and extend upward to the surface of the circuit board 110, and the protrusions 1432 are engaged on the surface of the circuit board 110, thereby inserting the optoelectronic composite interface 140 into the through hole 111, preventing the optoelectronic composite interface from falling off, and realizing the fixed connection between the optoelectronic composite interface 140 and the circuit board 110. The optical transceiver assembly 130 and the optoelectronic composite interface 140 are located on the first surface of the circuit board 110. The sensor 120 is located on the second surface of the circuit board.

[0180] In some embodiments, the data acquisition optical module 100 may include a positive electrode contact 191 and a negative electrode contact 192, which are disposed adjacent to each other. The positive electrode contact 191 is disposed on the inner surface of the optoelectronic composite interface 140, and one end is exposed relative to the optoelectronic composite interface 140 so that the end can be electrically connected to the circuit board. Similarly, the negative electrode contact 192 is disposed inside the optoelectronic composite interface 140, and one end is exposed relative to the optoelectronic composite interface 140 so that the end can be electrically connected to the circuit board.

[0181] In some embodiments, one end of the positive electrode contact 191 is electrically connected to the circuit board 110, and the other end is electrically connected to the optoelectronic composite cable 500, transmitting the positive power signal transmitted through the optoelectronic composite cable 500 to the circuit board 110. One end of the negative electrode contact 192 is electrically connected to the circuit board 110, and the other end is electrically connected to the optoelectronic composite cable 500, transmitting the negative power signal transmitted through the optoelectronic composite cable 500 to the circuit board 110, thereby providing power to the data acquisition optical module 100. The positive electrode contact 191 and the negative electrode contact 192 can be made of a metal material with good conductivity to ensure high efficiency of power transmission.

[0182] In some embodiments, the positive electrode contact 191 includes a first connecting segment 1911 and a second connecting segment 1912. The second connecting segment 1912 is connected to the first connecting segment 1911. The first connecting segment 1911 extends parallel to the long axis of the inner cavity of the optoelectronic composite interface 140 for external electrical connection. The second connecting segment 1912 extends perpendicular to the long axis of the inner cavity of the optoelectronic composite interface 140 for electrical connection to the circuit board 110. The negative electrode contact 192 is designed similarly. The first connecting segment 1911 is located on the inner surface of the optoelectronic composite interface 140 for electrical connection to the optoelectronic composite cable 500 and to receive the positive power signal transmitted by the optoelectronic composite cable 500. The second connecting segment 1912 passes through the optoelectronic composite interface 140 and the circuit board 110, and extends a certain distance beyond the outer surface of the circuit board 110, thereby electrically connecting to the circuit board 110. Exemplarily, the end of the second connecting segment 1912 extends beyond the surface of the circuit board 110, and the extended end is soldered to the circuit board 110 to ensure a strong connection. For example, the end of the second connecting segment 1912 has a height difference from the surface of the circuit board 110, and the end of the second connecting segment 1912 is soldered to the surface of the circuit board 110 to achieve electrical connection. The extension direction of the second connecting segment 1912 is perpendicular to the surface of the circuit board 110 and is perpendicularly connected to the circuit board 110, reducing the space occupied.

[0183] In some embodiments, the optoelectronic composite interface 140 includes a base plate 144, which is in contact with a circuit board 110. The base plate 144 has a first through hole 1441, and the circuit board 110 has a second through hole 113. The first through hole 1441 and the second through hole 113 are connected. A positive electrode contact 191 passes through the first through hole 1441 and the second through hole 113 in sequence and extends out of the surface of the circuit board 110 to be electrically connected to the circuit board 110.

[0184] Figure 11 is a schematic diagram of an assembly of an optoelectronic connector assembly and an optoelectronic composite interface according to some embodiments. As shown in Figure 11, in some embodiments, the optoelectronic connector assembly 400 and the optoelectronic composite interface 140 are plugged into each other to achieve assembly. The data acquisition optical module 100 is optoelectronically connected to the optoelectronic composite cable 500 through the optoelectronic connector assembly.

[0185] In some embodiments, the optoelectronic composite interface 140 has openings at both ends. A first opening 141 and a second opening 142 are formed at each end of the optoelectronic composite interface 140. The first opening 141 faces the first fiber optic adapter 134, and the second opening 142 faces the optoelectronic connector assembly 400. The first fiber optic adapter 134 enters the optoelectronic composite interface 140 through the first opening 141, and the optoelectronic connector assembly 400 enters the optoelectronic composite interface 140 through the second opening 142. The optoelectronic composite cable 500 connected to the first fiber optic adapter 134 and the optoelectronic connector assembly 400 is optically connected within the optoelectronic composite interface 140, thereby achieving optical signal coupling. Simultaneously, the circuit board 110 and the optoelectronic composite cable 500 connected to the optoelectronic connector assembly 400 are electrically connected within the optoelectronic composite interface 140.

[0186] Figure 12A is a structural diagram of an optoelectronic connector assembly according to some embodiments, and Figure 12B is an exploded view of an optoelectronic connector assembly according to some embodiments. The perspectives shown in Figures 12A and 12B represent the forward insertion direction of the optoelectronic connector assembly 400 when inserted into the second opening 142, as shown in Figure 12A. As shown in Figures 12A and 12B, in some embodiments, one end of the optoelectronic connector assembly 400 is inserted into the optoelectronic composite interface 140, and the other end is connected to the optoelectronic composite cable 500, thereby achieving an optical connection between the optoelectronic composite cable 500 and the first fiber optic adapter 134.

[0187] In some embodiments, the optocoupler assembly 400 may include a housing 410. The housing 410 serves as the outer structure of the optocoupler assembly 400 and is in contact with the optocoupler composite interface 140. The optocoupler assembly 400 may include a mating member 420. The mating member 420 is located within the housing 410. The mating member 420 engages with a snap-fit ​​member 170 inside the optocoupler composite interface 140 to connect the optocoupler assembly to the optocoupler composite interface, thus snapping the optocoupler assembly 400 into the optocoupler composite interface 140.

[0188] In some embodiments, the mating member 420 and the snap-fit ​​member 170 are mated and connected. The mating member 420 has a first limiting protrusion 421 and a second limiting protrusion 422 formed on its two sidewalls. The snap-fit ​​member 170 includes a first latch 171 and a second latch 172 disposed opposite to each other. The first limiting protrusion 421 engages with the first latch 171, and the second limiting protrusion 422 engages with the second latch 172, thus achieving the mating connection between the mating member 420 and the snap-fit ​​member 170. This bidirectional engagement ensures a stable connection and reduces loosening caused by vehicle vibration or impact. The first latch 171 and the second latch 172 are elastic latches; the first limiting protrusion 421 engages with the first latch 171 through elastic deformation, and the second limiting protrusion 422 engages with the second latch 172 through elastic deformation. For example, the first claw 171 and the second claw 172 undergo elastic deformation during the insertion of the photoelectric connector assembly 400, and return to their original shape after being inserted into place, thereby achieving a snap-fit ​​connection.

[0189] In some embodiments, the first limiting protrusion 421 and the second limiting protrusion 422 have guide slopes to facilitate alignment and engagement during insertion.

[0190] In some embodiments, the optoelectronic connector assembly 400 may include a second fiber optic adapter 430. The second fiber optic adapter 430 is located within the housing 410. The second fiber optic adapter 430 is assembled and connected to a mating member 420. The mating member 420 has a hollow interior, and the second fiber optic adapter 430 passes through the interior of the mating member 420. The optoelectronic composite cable 500 includes optical fibers. The second fiber optic adapter 430 has an internal optical fiber channel for accommodating and fixing the optical fiber in the optoelectronic composite cable 500. As shown in FIG10A, in some embodiments, the second fiber optic adapter 430 is mated and connected to the first fiber optic adapter 134, establishing an optical connection between the optical fiber fixed in the second fiber optic adapter 430 and the optical fiber fixed in the fiber optic adapter 431, thereby establishing an optical connection between the optoelectronic composite cable 500 and the data acquisition optical module 100 to realize optical signal transmission.

[0191] In some embodiments, the end of the second fiber optic adapter 430 is exposed relative to the housing 410, allowing it to directly interface with the first fiber optic adapter 134, reducing connection obstacles. With the end of the second fiber optic adapter 430 exposed, the optical signal can directly enter the first fiber optic adapter 134, avoiding signal attenuation caused by obstruction by the housing 410.

[0192] In some embodiments, the optoelectronic composite cable 500 includes a positive cable and a negative cable, which may be respectively disposed on both sides of the optical cable. The optoelectronic connector assembly 400 may include a positive cable connection terminal 440 and a negative cable connection terminal 450. The positive cable connection terminal 440 is used to electrically connect the positive cable in the optoelectronic composite cable 500 to the circuit board 110, and the negative cable connection terminal 450 is used to electrically connect the negative cable in the optoelectronic composite cable 500 to the circuit board 110. The positive cable connection terminal 440 and the negative cable connection terminal 450 are used to realize the electrical connection between the devices on both sides of the optoelectronic connector assembly 400.

[0193] In some embodiments, one end of the positive cable connection terminal 440 is electrically connected to the positive cable in the optoelectronic composite cable 500, and the other end is electrically connected to the positive contact 191. The positive contact 191 electrically connects the optoelectronic connector assembly 400 and the circuit board 110, thereby electrically connecting the optoelectronic composite cable 500 and the circuit board 110. The positive power signal transmitted in the optoelectronic composite cable 500 is transmitted to the circuit board 110. The positive contact 191 is electrically connected to the circuit board 110, thereby establishing an electrical connection between the positive cable in the optoelectronic composite cable 500 and the circuit board 110. The positive power signal transmitted by the optoelectronic composite cable 500 is transmitted to the surface of the circuit board 110, and then powered through traces on the surface of the circuit board 110.

[0194] In some embodiments, one end of the negative cable connection terminal 450 is electrically connected to the negative cable in the optoelectronic composite cable 500, and the other end is electrically connected to the negative contact 192. The negative contact 192 electrically connects the optoelectronic connector assembly 400 to the circuit board, and further electrically connects the optoelectronic composite cable 500 to the circuit board 110. The negative power signal transmitted in the optoelectronic composite cable 500 is transmitted to the circuit board 110. The negative contact 192 is electrically connected to the circuit board 110, thereby establishing an electrical connection between the negative cable in the optoelectronic composite cable 500 and the circuit board 110. The negative power signal transmitted by the optoelectronic composite cable 500 is transmitted to the surface of the circuit board 110, and then powered through traces on the surface of the circuit board 110.

[0195] In some embodiments, the optoelectronic connector assembly 400 may include an optical cable sheath 460. The optical cable sheath 460 is used to fix the optoelectronic composite cable 500, providing mechanical protection for the optoelectronic composite cable 500 and preventing damage to the optoelectronic composite cable 500.

[0196] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0197] Since the above embodiments are all described in conjunction with other methods, and different embodiments have the same parts, the same or similar parts between the various embodiments in this specification can be referred to mutually. They will not be described in detail here.

Claims

1. A vehicle-mounted optical communication system, comprising: Optical-electric composite cable, used to transmit optical signals and power signals; The data acquisition optical module is used to convert the acquired electrical signals into optical signals; It is also opto-connected to the opto-optical composite cable to transmit the optical signal through the opto-optical composite cable and to receive the power signal from the opto-optical composite cable. The data acquisition optical module includes: Optical transceiver components, including: The round-square tube body has an isolator, a first filter and a first lens inside, with the first filter located between the isolator and the first lens; A light-emitting component, connected to one end of the circular-square tube and disposed on one side of the isolator, includes: VCSEL laser chip, emitting light signals from the top surface; The second lens is located in the light output path of the VCSEL laser chip and is used to collimate the light emission signal emitted by the VCSEL laser chip. The second connecting sleeve is used to connect the round-square tube body and the light emitting component; a second through hole is formed on the light emitting surface of the second connecting sleeve, and the second through hole is formed in the light emitting path of the second lens; A light homogenizer is embedded in the second through hole and is used to adjust the uniformity of the light intensity of the emitted light spot of the VCSEL laser chip. An optoelectronic connector assembly is connected to the optoelectronic composite cable to achieve optoelectronic connection between the data acquisition optical module and the optoelectronic composite cable.

2. The vehicle-mounted optical communication system according to claim 1, wherein, The light homogenizer includes a substrate and a nanostructure array, wherein the nanostructure array is disposed on the substrate and the height of the nanostructure array is discretely distributed in 16 steps.

3. The vehicle-mounted optical communication system according to claim 1, wherein, The light emitting component includes: A tube socket is provided with a high-frequency pin, which passes through the tube socket and has its top protruding from the top surface of the tube socket; the high-frequency pin is electrically connected to the circuit board. The first mounting base is connected at its bottom to the top surface of the tube socket and is located on the side of the high-frequency tube pin; the top surface of the first mounting base is connected to the bottom surface of the VCSEL laser chip, which is also connected to the top surface of the first mounting base. The tube cap is connected to the tube seat at the bottom. The tube cap covers the VCSEL laser chip and the second lens. The second connecting sleeve is nested on the outside of the tube cap.

4. The vehicle-mounted optical communication system according to claim 1, wherein, The tube socket is also provided with an output pin, and the light emitting component further includes: The second mounting base is connected to the top surface of the tube seat at its bottom, and the second mounting base is located between the first mounting base and the output pin; A backlight detector is disposed on the top surface of the second mounting base; the backlight detector is electrically connected to the tube socket and the output pin; An inclined light window is formed on the top of the cap, and the light window is inclinedly positioned above the VCSEL laser chip and the backlight detector; the light reflected by the light window is transmitted to the backlight detector; and the light window is positioned between the second lens and the light homogenizer.

5. The vehicle-mounted optical communication system according to claim 4, wherein, The cap includes: The cap body has a bottom surface connected to the top surface of the tube seat, and a support platform formed on the top surface; an inclined surface is formed on the support platform, and the inclined surface is inclinedly positioned above the VCSEL laser chip; The bottom surface of the light window is connected to the inclined surface so that the light window is tilted above the VCSEL laser chip and the backlight detector; and the light window is located between the second lens and the light homogenizer, and the light emitted from the second lens enters the light homogenizer through the light window.

6. A vehicle-mounted optical communication system, comprising: Optical-electric composite cable, used to transmit optical signals and power signals; The data acquisition optical module is used to convert the acquired electrical signals into optical signals; It is also opto-connected to the opto-optical composite cable to transmit the optical signal through the opto-optical composite cable and to receive the power signal from the opto-optical composite cable. The data acquisition optical module includes: Optical transceiver components, including: The light emitting component includes: VCSEL laser chip, emitting light signals from the top surface; The first lens is located in the light output path of the VCSEL laser chip and is used to collimate the light emission signal emitted by the VCSEL laser chip. A round-square tube, one end of which is connected to the light-emitting component, has the following internal features: A light homogenizer is disposed on the light output path of the first lens and is used to adjust the uniformity of the light intensity of the emitted light spot of the VCSEL laser chip. The first filter is disposed in the light output path of the light homogenizer and is used to transmit the light emission signal; The second lens is disposed on the transmission light path of the first filter for the emitted light signal; An optoelectronic connector assembly is connected to the optoelectronic composite cable to achieve optoelectronic connection between the data acquisition optical module and the optoelectronic composite cable.

7. The vehicle-mounted optical communication system according to claim 6, wherein, The light homogenizer includes a substrate and a nanostructure array, wherein the nanostructure array is disposed on the substrate and the height of the nanostructure array is discretely distributed in 16 steps.

8. The vehicle-mounted optical communication system according to claim 6, wherein, The light emitting component includes: The tube seat has the following on its top surface: The first substrate is provided with the laser chip. A cap is placed on the tube base to form a storage cavity with the tube base, and the first lens is disposed in the storage cavity; The pin extends through the bottom and top surfaces of the socket, with one end connected to the circuit board and the other end electrically connected to the laser chip.

9. The vehicle-mounted optical communication system according to claim 6, wherein, The data acquisition optical module includes: Circuit board; The sensor is electrically connected to the circuit board and is used to transmit the collected electrical signals to the circuit board. A flexible circuit board, one end of which is electrically connected to the circuit board to receive electrical signals transmitted by the circuit board; the other end of which is electrically connected to the optical transceiver assembly to transmit the electrical signals to the optical transceiver assembly. An optoelectronic composite interface is disposed on the surface of the circuit board. One end of the optical transceiver component is connected to one end of the optoelectronic composite interface to guide the optical signal generated by the optical transceiver component into the optoelectronic composite interface. The optoelectronic connector assembly is connected to the other end of the optoelectronic composite interface.

10. The vehicle-mounted optical communication system according to claim 9, wherein, The optical transceiver assembly includes a first optical fiber adapter, which is connected to the internal optical fiber of the data acquisition laser module. The optoelectronic connector assembly includes a second optical fiber adapter, which is connected to the optoelectronic composite cable. The first fiber optic adapter and the second fiber optic adapter are optically connected inside the optoelectronic composite interface to optically connect the data acquisition optical module and the optoelectronic composite cable.

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