Optical transceiver, optical module, optical communication apparatus, and data center
By using a protective cover and heat dissipation components made of dielectric shielding material in the optical module, signal crosstalk and thermal management issues were resolved, resulting in improved signal quality and equipment stability.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- CLOUD INTELLIGENCE ASSETS HOLDING (SINGAPORE) PTE LTD
- Filing Date
- 2025-12-02
- Publication Date
- 2026-07-30
AI Technical Summary
In existing optical modules, signal crosstalk can easily occur between the transmitting and receiving components, and the heat generated by the transmitting components can cause the temperature to rise, affecting signal quality and equipment stability.
A protective cover made of dielectric shielding material is combined with a heat dissipation component to reduce signal crosstalk and effectively dissipate heat. The protective cover is at least partially made of dielectric shielding material and has an installation port for installing the heat dissipation component. The heat dissipation component is made of metal to improve heat dissipation.
It effectively reduces signal crosstalk, improves signal quality, and lowers component temperature through heat dissipation components, thereby improving equipment stability and heat dissipation efficiency.
Smart Images
Figure CN2025139311_30072026_PF_FP_ABST
Abstract
Description
Optical transceivers, optical modules, optical communication equipment and data centers
[0001] This disclosure claims priority to Chinese Patent Application No. 202510125590.9, filed on January 26, 2025, entitled "Optical Transceiver, Optical Module, Optical Communication Equipment and Data Center", the entire contents of which are incorporated herein by reference. Technical Field
[0002] This disclosure relates to the field of optical communication technology, and in particular to an optical transceiver, an optical module, an optical communication device, and a data center. Background Technology
[0003] Currently, more and more data centers are going into operation, and the switches in these data centers require a large number of optical modules, such as optical transceivers or active optical cables (AOCs). Optical modules contain precision components such as optical chips and optical devices, which need to be encapsulated for protection. However, in optical modules where the transmitting and receiving components are encapsulated together, signal crosstalk can easily occur between the transmitting and receiving components. Furthermore, the transmitting components generate a significant amount of heat, causing the optical module temperature to rise continuously. Summary of the Invention
[0004] This disclosure provides an optical transceiver, optical module, optical communication device, and data center to reduce or mitigate technical problems existing in the prior art.
[0005] In a first aspect, embodiments of this disclosure provide an optical transceiver, comprising: a circuit board; a transmitting component module and a receiving component module, spaced apart on one side of the circuit board; a protective cover connected to the circuit board, the protective cover and the circuit board forming a receiving cavity, the transmitting component module and the receiving component module being located within the receiving cavity, at least a portion of the protective cover being made of a dielectric shielding material and having an opening for mounting; and a heat dissipation assembly disposed at the mounting opening, having a contact end and a heat dissipation end, the contact end directly or indirectly contacting the transmitting component module, and the heat dissipation end being located outside the protective cover.
[0006] In one embodiment, the protective cover is made of a dielectric shielding material, and / or the heat dissipation component is made of a metallic material.
[0007] In one embodiment, the dielectric shielding material comprises plastic, and the protective cover is injection molded.
[0008] In one embodiment, the protective cover includes a protective cover body made of metal material, and the inner wall of the protective cover body is coated with a dielectric shielding material layer.
[0009] In one embodiment, the heat dissipation end is exposed in the heat dissipation space.
[0010] In one embodiment, the transmitting component module includes a silicon photonics chip and a transmitting electrical chip. The silicon photonics chip is disposed on one side of the circuit board, and the transmitting electrical chip is disposed on the side of the silicon photonics chip opposite to the circuit board. The contact end is disposed on the side of the transmitting electrical chip opposite to the circuit board.
[0011] In one embodiment, the projection of the contact end on the circuit board overlaps the projection of the power-generating chip on the circuit board; the projection of the heat dissipation end on the circuit board overlaps the projection of the mounting port on the circuit board.
[0012] In one embodiment, the projection of the mounting port on the circuit board overlaps the projection of the contact end on the circuit board.
[0013] In one embodiment, a heat dissipation medium layer is provided between the contact end and the transmitting end chip.
[0014] In one embodiment, the projection of the heat dissipation medium layer on the circuit board covers the projection of the power-generating chip on the circuit board.
[0015] In one embodiment, the receiving-end component module includes a receiving-end electrical chip, and the optical transceiver further includes: a transmitting-end fiber array assembly, disposed on the same side of the circuit board as the silicon photonics chip, one end of the transmitting-end fiber array being connected to the silicon photonics chip, and the other end of the transmitting-end fiber array being used to connect to a transmitting-end fiber optic cable; and a receiving-end fiber array assembly, disposed on the same side of the circuit board as the receiving-end electrical chip, one end of the receiving-end fiber array being connected to the receiving-end electrical chip, and the other end of the receiving-end fiber array being used to connect to a receiving-end fiber optic cable.
[0016] In one embodiment, the protective cover is provided with a first through hole and a second through hole, the first through hole being used for the transmitting optical fiber cable to pass through the protective cover, and the second through hole being used for the receiving optical fiber cable to pass through the protective cover.
[0017] Secondly, embodiments of this disclosure provide an optical module, comprising: a housing having a receiving space; an optical transceiver as described in any of the first aspects, the optical transceiver being disposed in the receiving space, and a heat dissipation component of the optical transceiver being spaced apart from the housing.
[0018] Thirdly, embodiments of this disclosure provide an optical communication device, comprising: at least one optical module as described in the second aspect; and a cage having at least one optical module connector for inserting and removing the optical module.
[0019] Fourthly, embodiments of this disclosure provide a data center, including a computer room and at least one optical communication device as described in the third aspect, wherein the optical communication device is disposed in the computer room.
[0020] According to the technical solution of the present disclosure, the protective cover is at least partially made of dielectric shielding material to reduce signal crosstalk caused by the back-and-forth reflection of high-frequency electromagnetic waves between components (such as transmitting component modules and receiving component modules) inside the protective cover, and heat dissipation components are provided on the protective cover to dissipate heat from the internal heat-generating components (such as transmitting component modules).
[0021] The foregoing overview is merely for summarizing the purposes of this disclosure and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this disclosure will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description
[0022] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments according to this disclosure and should not be construed as limiting the scope of this disclosure.
[0023] Figure 1 shows an exploded view of an optical transceiver 100 according to an embodiment of the present disclosure;
[0024] Figure 2 shows an exploded view of an optical transceiver 200 according to an embodiment of the present disclosure;
[0025] Figure 3 shows a top view of an optical transceiver 200 according to an embodiment of the present disclosure;
[0026] Figure 4 shows a side view of an optical transceiver 200 according to an embodiment of the present disclosure.
[0027] Explanation of reference numerals in the attached drawings: Optical transceiver 100; Optical transceiver 200; Circuit board 110; Base 111; Transmitter component module 120; Silicon photonics chip 121; Transmitter electrical chip 122; Receiver component module 130; Receiver electrical chip 131; Protective cover 140; Mounting port 141; First through hole 142; Second through hole 143; Heat dissipation assembly 150; Contact end 151; Heat dissipation end 152; Heat dissipation medium layer 160; Transmitter fiber array assembly 170; Receiver fiber array assembly 180; Transmitter fiber cable 10; Receiver fiber cable 20. Detailed Implementation
[0028] Numerous specific details are set forth in the following description to provide a full understanding of this disclosure. However, this disclosure can be implemented in many other forms than those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this disclosure. Therefore, this disclosure is not limited to the specific implementations disclosed below.
[0029] Optical modules are core components used in data communication, transmission, and telecommunications for sending and receiving optical signals. They are widely used in optical networks and typically consist of an optical transceiver and an active optical cable (AOC). Traditional optical modules usually employ a discrete structure, using passive components such as lenses to couple the optical signals from the optical chip to the optical fiber. In long-distance transmission modules, due to the need for numerous passive components, this process often involves precise coupling and alignment of each component. This not only increases assembly complexity but also requires significant time, manpower, manufacturing processes, and material costs.
[0030] Silicon photonics technology is based on waveguide transmission and fully utilizes the mature silicon wafer fabrication processes of the semiconductor industry. Various devices, such as Mach-Zehnder (MZ) modulators, receivers, and passive waveguide devices, are highly integrated by etching them onto a silicon substrate. This integration method gives silicon photonics chip modules significant advantages in terms of small size and high integration. More importantly, silicon photonics technology can significantly reduce assembly steps and the adjustment of passive components, thereby improving testing efficiency and significantly reducing costs in terms of time, manpower, processes, and materials.
[0031] In data center and optical communication equipment applications, optical modules are crucial for efficient and rapid data transmission. By deploying high-speed optical modules, data centers can achieve high-bandwidth, low-latency data transmission, supporting large-scale computing and storage needs. In optical communication equipment, optical modules are responsible for converting electrical signals into optical signals, enabling high-speed connections and data exchange between different network devices. With the rapid growth of cloud computing, big data, artificial intelligence (AI), video-on-demand, and other services, internet cloud data centers are becoming increasingly large-scale, and the demand for network bandwidth is surging. Therefore, silicon photonics modules, with their high integration and low cost advantages, have become an important component in the design of modern data centers and optical communication equipment.
[0032] Example 1
[0033] Figure 1 shows an exploded view of an optical transceiver 100 according to an embodiment of the present disclosure. As shown in Figure 1, the optical transceiver 100 includes: a circuit board 110, a transmitting component module 120, a receiving component module 130, a protective cover 140, and a heat dissipation assembly 150.
[0034] The transmitting component module 120 is responsible for converting the input electrical signal into an optical signal and transmitting it through optical fiber. It is the optical signal transmitting section of the optical transceiver and includes components such as silicon photonic integrated circuits (PICs) or other types of lasers, drivers, modulators, etc. The receiving component module 130 is responsible for receiving the optical signal and converting it into an electrical signal for subsequent circuit processing and transmission. It is the optical signal receiving section of the optical transceiver and includes components such as photodetectors, amplifiers, etc.
[0035] The transmitting component module 120 and the receiving component module 130 are spaced apart on one side of the circuit board 110. The circuit board 110 can provide support and connection (such as mechanical connection and electrical connection) for the transmitting component module 120 and the receiving component module 130. The circuit board 110 is, for example, a printed circuit board (PCB).
[0036] For example, a clearance structure may be provided on the circuit board 110 for mounting the base. The base is made of a material with high hardness, such as metal. Furthermore, the transmitting component module 120 is mounted on the base of the circuit board 110. Since the transmitting component module 120 involves optical precision components, using a base that is not easily deformed, such as a metal base, to support the transmitting component module 120 can improve the stability of the transmitting component module 120, thereby improving signal quality.
[0037] The protective cover 140 is connected to the circuit board 110, such as by a snap-fit connection, adhesive connection, or welding. The protective cover 140 and the circuit board 110 form a receiving cavity, in which the transmitting component module 120 and the receiving component module 130 are located. This prevents dust and other contaminants from polluting the transmitting component module 120 and the receiving component module 130, which could lead to a decrease in optical power. At the same time, it also protects the transmitting component module 120 and the receiving component module 130 from deformation, damage, or other phenomena.
[0038] In related technologies, protective covers are generally made of metal to dissipate heat from internal heat-generating components (such as transmitting component modules). However, since the protective cover covers both the transmitting and receiving component modules, the high-speed signals emitted by the transmitting component module will have high-frequency radiation, which will reflect back and forth inside the metal protective cover and reach the receiving component module, thus affecting signal quality, i.e., the crosstalk phenomenon. In addition, signal crosstalk may also exist in the traces on the circuit board.
[0039] In this embodiment, at least a portion of the protective cover 140 is made of a dielectric shielding material. The dielectric shielding material has good insulation properties and electromagnetic shielding effect, effectively reducing or preventing the reflection of high-frequency radiation from high-speed signals within the protective cover 140. Exemplarily, the dielectric shielding material may be, for example, plastic, ceramic, resin, or composite material, wherein the plastic may be, for example, polyetherimide (PEI). This embodiment does not limit the dielectric shielding material, as long as it can reduce or eliminate crosstalk between transmitted and received signals.
[0040] In one example, the protective cover 140 includes a cover body, and the inner wall of the cover is coated with a dielectric shielding material, thereby forming a dielectric shielding material layer on the inner wall of the cover 140. The cover body of the cover 140 can be made of metal. Since protective covers 140 in related technologies are mostly made of metal, coating the inner wall of the cover 140 with a dielectric shielding material layer can reduce signal crosstalk and adapt to the processing technology of related technologies, thereby simplifying the process flow.
[0041] In another example, the protective cover 140 is made of a dielectric shielding material, which improves the protection against signal crosstalk. Exemplarily, the protective cover 140 can be made of plastic, allowing it to be injection molded, thus simplifying the assembly process and significantly reducing production and process costs.
[0042] Furthermore, the power consumption of the transmitting component module 120 is relatively high, especially during high-frequency or high-speed transmission, where power consumption and heat generation increase significantly. Dielectric shielding materials may reduce the heat dissipation performance of the transmitting component module 120. Therefore, in this embodiment, the protective cover 140 has a mounting port 141, and the heat dissipation component 150 is disposed in the mounting port 141, having a contact end 151 and a heat dissipation end 152. Exemplarily, the heat dissipation component 150 is made of metal material to achieve better heat dissipation. The heat dissipation component 150 can be mechanically connected to the protective cover 140, for example, by adhesive bonding or snap-fitting; this embodiment does not limit the specific method of connection.
[0043] The contact end 151 is located on the side of the starting component module 120 away from the circuit board 110, that is, the contact end 151 is located inside the protective cover 140. The contact end 151 can directly or indirectly contact the starting component module 120 to absorb the heat of the starting component module 120. The heat dissipation end 152 is located outside the protective cover 140 to release the heat of the starting component module 120 to the outside of the protective cover 140, thereby achieving heat dissipation of the starting component module 120.
[0044] Therefore, the contact end 151 can absorb the heat of the starting component module 120, and the heat dissipation end 152 releases the heat absorbed by the contact end 151 to the outside of the protective cover 140, thereby dissipating heat from the starting component module 120.
[0045] In the optical transceiver of this embodiment, the protective cover is at least partially made of dielectric shielding material to reduce signal crosstalk caused by the back-and-forth reflection of high-frequency electromagnetic waves between the internal components (transmitter component module and receiver component module) of the protective cover, and heat dissipation components are provided on the protective cover to dissipate heat from the internal heat-generating components (transmitter component module).
[0046] In one embodiment, the heat dissipation end 152 is exposed in the heat dissipation space. That is, the protective cover 140 is located in the heat dissipation space, and the heat dissipation end 152 is openly disposed in the heat dissipation space. On the one hand, this can improve the heat dissipation effect. On the other hand, it can prevent the heat dissipation end 152 from contacting other components, which would cause the contact force of other components on the heat dissipation end 152 to be applied to the components inside the protective cover 140 (such as the starting component module 120), thereby causing them to deform or be damaged.
[0047] Example 2
[0048] Figure 2 shows an exploded view of an optical transceiver 200 according to an embodiment of the present disclosure. As shown in Figure 2, the optical transceiver 200 includes: a circuit board 110, a transmitting component module 120, a receiving component module 130, a protective cover 140, and a heat dissipation assembly 150. The transmitting component module 120 includes a silicon photonic chip 121 and a transmitting electrical chip 122. The silicon photonic chip 121 is disposed on one side of the circuit board 110, and the transmitting electrical chip 122 is disposed on the side of the silicon photonic chip 121 facing away from the circuit board 110. A contact terminal 151 is disposed on the side of the transmitting electrical chip 122 facing away from the circuit board 110.
[0049] Among them, the silicon photonics chip 121 is based on semiconductor manufacturing processes, on which various optical components, such as lasers, modulators, waveguides, couplers, beam splitters, and photodetectors, are etched onto a silicon substrate. That is, the optical components and the corresponding electronic control circuits are integrated on the same silicon substrate. The transmitting chip 122, also known as the driver, is used to receive signals and amplify, shape, and modulate them as necessary to drive the light source to emit corresponding light signals.
[0050] In other words, in this embodiment of the present disclosure, the transmitting component module 120 adopts silicon photonics technology, which can significantly reduce the assembly process of the optical transceiver and the adjustment of passive components, thereby significantly reducing costs in terms of time, manpower, process and materials.
[0051] For example, a clearance structure may be provided on the circuit board 110, and a base 111 may be mounted on the clearance structure. The base 111 is made of a material with high hardness, such as metal, that is, the base 111 is a metal base. Furthermore, the silicon photonic chip 121 is disposed on the base 111, so that the silicon photonic chip 121 or other optical precision components can be supported by the base 111, which is not easily deformed, thereby improving the stability of the silicon photonic chip 121 or other optical precision components and thus improving signal quality.
[0052] Figure 3 shows a top view of the optical transceiver 200 according to an embodiment of the present disclosure; Figure 4 shows a side view of the optical transceiver 200 according to an embodiment of the present disclosure. In Embodiment 2, the protective cover 140 is made of plastic material, that is, in Figures 2, 3 and 4, the protective cover 140 is transparent. It should be noted that this is only for ease of understanding and is not a limitation on the material of the protective cover 140.
[0053] In one embodiment, the projection of the contact end 151 on the circuit board 110 covers the projection of the power transmitting chip 122 on the circuit board 110; the projection of the heat dissipation end 152 on the circuit board 110 covers the projection of the mounting port 141 on the circuit board 110.
[0054] For example, the projected area of the contact end 151 on the circuit board 110 is greater than or equal to the projected area of the power generation chip 122 on the circuit board 110, and the projected area of the heat dissipation end 152 on the circuit board 110 is greater than or equal to the projected area of the mounting port 141 on the circuit board 110.
[0055] Based on this, the heat dissipation component 150 is designed as a boss shape, wherein the contact end 151 contacts the transmitting chip 122 (either directly or indirectly). If the area is too large, it will increase crosstalk; if the area is too small, it will affect the heat dissipation effect. Furthermore, stress concentration may occur between the edge of the contact end 151 and the transmitting chip 122, potentially causing the transmitting chip 122 to break. Therefore, in this embodiment, the projection of the contact end 151 on the circuit board 110 covers the projection of the transmitting chip 122 on the circuit board 110. The heat dissipation end 152 is located outside the protective cover 140 and can be designed as the larger surface of the heat dissipation component 150, thereby improving the heat dissipation effect.
[0056] In one embodiment, the projection of the mounting port 141 onto the circuit board 110 overlaps the projection of the contact end 151 onto the circuit board 110. This facilitates the assembly of the heat dissipation component 150 with the protective cover 140, and also allows the contact end 151 to occupy less space. For example, the projected area of the mounting port 141 onto the circuit board 110 is greater than or equal to the projected area of the contact end 151 onto the circuit board 110.
[0057] In one embodiment, a heat dissipation medium layer 160 is disposed between the contact terminal 151 and the transmitting chip 122. Exemplarily, the heat dissipation medium layer 160 is formed of a heat-dissipating material coated on the side of the transmitting chip 122 facing away from the circuit board 110, or the heat dissipation medium layer 160 is formed of a heat-dissipating material filled between the contact terminal 151 and the transmitting chip 122. The heat dissipation material is a thermal interface material (TIM), such as thermal grease, thermal gel, or metal-based composites. The heat dissipation medium layer 160 can improve the heat conduction efficiency between the contact terminal 151 and the transmitting chip 122, thereby improving the heat dissipation effect of the heat dissipation assembly 150.
[0058] In one embodiment, the projection of the heat dissipation medium layer 160 onto the circuit board 110 covers the projection of the transmitting chip 122 onto the circuit board 110. That is, the heat dissipation medium layer 160 fills the gap between the contact end 151 and the transmitting chip 122, thereby further improving the heat dissipation effect.
[0059] The receiving-end component module 130 includes a receiving-end electrical chip 131, such as a trans-impedance amplifier (TIA). The optical transceiver 200 also includes a transmitting-end fiber array assembly 170 and a receiving-end fiber array assembly 180. A fiber array is an optical component that arranges multiple optical fibers together, typically used to integrate multiple optical fibers or optical channels into a compact module. It can effectively guide optical signals from one location to multiple fiber channels, or conversely, perform multi-channel reception.
[0060] The transmitting fiber array assembly 170 and the silicon photonics chip 121 are located on the same side of the circuit board 110. One end of the transmitting fiber array 170 is connected to the silicon photonics chip 121 and is responsible for transmitting the optical signal modulated by the silicon photonics chip. The other end of the transmitting fiber array 170 is used to connect to the transmitting fiber optic cable 10, through which the optical signal is transmitted to the remote device. The transmitting fiber array assembly 170 can efficiently couple the optical signal modulated by the silicon photonics chip 121 into the transmitting fiber optic cable 10. For example, the transmitting fiber array assembly 170 adopts multi-channel parallel transmission, therefore the transmitting fiber array assembly 170 may contain multiple fiber optic interfaces, supporting the simultaneous transmission of optical signals of multiple wavelengths, thereby improving the data transmission rate.
[0061] The receiving fiber optic array assembly 180 and the receiving electrical chip 131 are located on the same side of the circuit board 110. One end of the receiving fiber optic array 180 is connected to the receiving electrical chip 131, responsible for transmitting the received optical signal to the photodetector for processing. The other end of the receiving fiber optic array 180 is used to connect to the receiving fiber optic cable 20, through which optical signals from remote devices are received. The receiving fiber optic array assembly 180 receives optical signals from the outside and efficiently couples them into the photodetector. Similar to the transmitting fiber optic array assembly 170, the receiving fiber optic array assembly 180 can support multi-channel parallel reception, enabling simultaneous processing of optical signals of multiple wavelengths and improving data transmission rate.
[0062] The transmitting fiber optic cable 10 serves as the physical medium, transmitting optical signals to the remote receiving device via the transmitting fiber optic array assembly 170. The receiving fiber optic cable 20 serves as the physical medium, receiving optical signals from the remote transmitting device and transmitting them to the receiving section of the optical transceiver 200 via the receiving fiber optic array assembly 180.
[0063] The protective cover 140 is provided with a first through hole 142 and a second through hole 143. The first through hole 142 is used for the transmitting fiber optic cable 10 to pass through the protective cover 140 to ensure the smooth output of the optical signal. The second through hole 143 is used for the receiving fiber optic cable 20 to pass through the protective cover 140 to ensure the smooth input of the optical signal.
[0064] Example 3
[0065] This disclosure also provides an optical module, including a housing and an optical transceiver, wherein the housing forms a receiving space, and the optical transceiver is disposed in the receiving space. The optical transceiver can be either the optical transceiver 100 shown in FIG. 1 or the optical transceiver 200 shown in FIG. 2.
[0066] The heat dissipation component 150 is spaced apart from the housing, meaning the heat dissipation end 152 is also spaced apart from the housing. This allows the heat dissipation end 152 to be exposed in the heat dissipation space between the housing and the heat dissipation component. On one hand, this improves the heat dissipation effect of the heat dissipation component 150. On the other hand, it prevents the heat dissipation end 152 from contacting other components, which could cause the contact force exerted by other components on the heat dissipation end 152 to be applied to the components inside the protective cover, thereby causing them to deform or be damaged.
[0067] This disclosure also provides an optical communication device, including one or more of the above-described optical modules and a cage, wherein the cage is provided with at least one optical module connector for plugging and unplugging the optical module.
[0068] The cage is a structural component used to install and secure optical modules. The cage has one or more optical module connectors, providing a physical interface for inserting and removing the optical modules. The cage allows the optical modules to be correctly inserted into the connectors and electrically connected to the circuit boards or other components of the optical communication equipment. Optical module cages are typically made of metal or alloy materials, offering durability, interference resistance, and good heat dissipation.
[0069] Optical modules are key communication components in optical communication equipment, and multiple optical modules are typically installed in such equipment. In this embodiment, by optimizing the heat dissipation performance and crosstalk immunity of the optical modules, the optical communication equipment can maintain efficient and stable operation in complex network environments, thereby meeting the high requirements of modern data centers and high-speed networks for communication quality and transmission speed.
[0070] This disclosure also provides a data center, including a server room and one or more of the aforementioned optical communication devices, wherein the optical communication devices are installed in the server room. The data center can be a financial data center, an enterprise data center, or an internet cloud data center, etc.
[0071] Other components of the optical modules, optical communication equipment, and data centers in the above embodiments can be derived from various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.
[0072] In the description of this disclosure, it should be understood that the terms "center," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.
[0073] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.
[0074] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.
[0075] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or indirect contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0076] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify the disclosure, specific examples of components and arrangements have been described above. Of course, these are merely examples and are not intended to limit the scope of this disclosure. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.
[0077] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure, and these should all be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.
Claims
1. An optical transceiver, characterized in that, include: Circuit board; The transmitting component module and the receiving component module are spaced apart on one side of the circuit board; A protective cover is connected to the circuit board, and the protective cover and the circuit board form a receiving cavity. The transmitting component module and the receiving component module are located in the receiving cavity. At least a portion of the protective cover is made of dielectric shielding material and has an installation port. A heat dissipation component is disposed at the mounting port and has a contact end and a heat dissipation end. The contact end directly or indirectly contacts the starting component module, and the heat dissipation end is located outside the protective cover.
2. The optical transceiver according to claim 1, characterized in that, The protective cover is made of dielectric shielding material, and / or the heat dissipation component is made of metal material.
3. The optical transceiver according to claim 2, characterized in that, The dielectric shielding material includes plastic, and the protective cover is injection molded.
4. The optical transceiver according to claim 1, characterized in that, The protective cover includes a protective cover body, which is made of metal material, and the inner wall of the protective cover body is coated with a dielectric shielding material layer.
5. The optical transceiver according to claim 1, characterized in that, The heat dissipation end is exposed in the heat dissipation space.
6. The optical transceiver according to any one of claims 1 to 5, characterized in that, The transmitting component module includes a silicon photonics chip and a transmitting electrical chip. The silicon photonics chip is disposed on one side of the circuit board, and the transmitting electrical chip is disposed on the side of the silicon photonics chip opposite to the circuit board. The contact end is disposed on the side of the transmitting electrical chip opposite to the circuit board.
7. The optical transceiver according to claim 6, characterized in that, The projection of the contact end on the circuit board overlaps the projection of the power-generating chip on the circuit board; the projection of the heat dissipation end on the circuit board overlaps the projection of the mounting port on the circuit board.
8. The optical transceiver according to claim 7, characterized in that, The projection of the mounting port on the circuit board overlaps the projection of the contact end on the circuit board.
9. The optical transceiver according to claim 6, characterized in that, A heat dissipation medium layer is provided between the contact end and the transmitting end chip.
10. The optical transceiver according to claim 9, characterized in that, The projection of the heat dissipation medium layer on the circuit board covers the projection of the power-generating chip on the circuit board.
11. The optical transceiver according to claim 6, characterized in that, The receiver-end component module includes a receiver-end electrical chip, and the optical transceiver further includes: The transmitting fiber array assembly is located on the same side of the circuit board as the silicon photonic chip. One end of the transmitting fiber array is connected to the silicon photonic chip, and the other end of the transmitting fiber array is used to connect to the transmitting fiber cable. The receiving fiber array assembly is located on the same side of the circuit board as the receiving electrical chip. One end of the receiving fiber array is connected to the receiving electrical chip, and the other end of the receiving fiber array is used to connect to the receiving fiber optic cable.
12. The optical transceiver according to claim 11, characterized in that, The protective cover is provided with a first through hole and a second through hole. The first through hole is used for the transmitting optical fiber cable to pass through the protective cover, and the second through hole is used for the receiving optical fiber cable to pass through the protective cover.
13. The optical transceiver according to claim 6, characterized in that, The circuit board may have an avoidance structure, on which a base is mounted, and the silicon photonic chip is disposed on the base.
14. The optical transceiver according to claim 13, characterized in that, The base is made of metal.
15. The optical transceiver according to claim 11, characterized in that, The transmitting fiber array assembly employs multi-channel parallel transmission; and / or, the receiving fiber array assembly employs multi-channel parallel reception.
16. The optical transceiver according to claim 9, characterized in that, The heat dissipation medium layer is formed on a heat dissipation material, which is coated on the side of the power chip facing away from the circuit board.
17. The optical transceiver according to claim 9, characterized in that, The heat dissipation medium layer is formed on the heat dissipation material, and the heat dissipation material is filled between the contact end and the transmitting end chip.
18. An optical module, characterized in that, include: The shell forms a space for containment; The optical transceiver as described in any one of claims 1 to 17, wherein the optical transceiver is disposed in the receiving space, and the heat dissipation assembly of the optical transceiver is spaced apart from the housing.
19. An optical communication device, characterized in that, include: At least one optical module as described in claim 18; The cage is equipped with at least one optical module connector for plugging and unplugging the optical module.
20. A data center, characterized in that, It includes a computer room and at least one optical communication device as described in claim 19, wherein the optical communication device is located in the computer room.