Heating layer structure, baking tray and base of baking tray

Abstract

The present invention belongs to the technical field of electric heating, and provides a heating layer structure, a baking tray and a base of the baking tray. The heating layer structure comprises a substrate, an electric heating layer and a heat insulation layer; the electric heating layer is connected to an external power supply so as to be electrified for heating; the substrate is arranged above the electric heating layer and is configured to be in contact with a material to be heated; the heat insulation layer is arranged below the electric heating layer and is used for reducing heat leakage. Providing the heat insulation layer at the bottom of the electric heating layer effectively reduces the heat loss downwards transferred from the electric heating layer, and therefore heat can concentrate in the electric heating layer and in the region of the substrate thereabove, so as to improve the use efficiency of overall energy and the efficiency of heat conduction, such that the temperature is rapidly increased or decreased in a short time, so as to adapt to the requirement of devices for rapid temperature adjustment, thus reducing the thickness of an overall structure, meeting requirements for portability and space saving, and adapting to the fields of electrical appliances, electronic products, heating pads, etc.

Description

A heating layer structure, a baking pan and a base for the baking pan. Technical Field

[0001] This invention belongs to the field of electric heating technology, and particularly relates to a heating layer structure, a baking pan and a base for the baking pan. Background Technology

[0002] Most existing electrical appliances use contact-based heat conduction for heating. Taking an existing electric baking pan as an example, the food to be heated is placed directly on the pan. The electric baking pan mainly consists of a base, a heating element, and a tray. The base provides support and stability, assists in heat conduction, and provides protection and insulation. However, due to the inherent characteristics of the heating element, traditional baking pans are heavy, bulky, and unsightly. They take up a lot of space when stored and are inconvenient to carry for camping or picnics. Furthermore, the heat generated by the heating element is transferred to both the base and the tray, resulting in significant heat loss during the transfer process. This causes the temperature on the tray to rise very slowly, resulting in a long preheating time and an inability to quickly reach the required operating temperature, thus affecting heating efficiency.

[0003] Existing electric baking pans mainly consist of a base, a heating element, and a baking pan. The base provides support and stability, assists in heat conduction, and provides protection and insulation. The heating element is usually located inside the base, and the bottom surface of the baking pan directly contacts the heating element for heating. It takes a certain amount of time for heat to transfer from the bottom surface of the baking pan to the top surface, and the heat from the baking pan is also transferred to the base, increasing the high-temperature burden on the base and the circuit. To protect the circuit, the base needs to have additional heat insulation space, making the electric baking pan too bulky and inconvenient to move.

[0004] Chinese patent document CN222323411U discloses a grilling machine, including a grilling pan assembly. The grilling pan assembly includes a grilling pan, a shell, a heating element, and a temperature controller. The heating element is used to heat the grilling pan. A first heat-insulating cavity is formed between the grilling pan and the shell. The heating element is located in the first cavity. The shell is provided with a heat-insulating second cavity. The cavity wall of the second cavity is provided with a clearance through hole. The temperature controller is located in the second cavity. The temperature controller includes a temperature sensing part. The temperature sensing part extends into the first cavity through the clearance through hole and is in contact with the grilling pan.

[0005] As can be seen from the technical solution and figures in the above-mentioned patent documents, the heating tube is located in the first cavity of the shell and directly contacts the bottom surface of the baking pan for heating. When the baking pan is removed for cleaning, the first cavity of the base is exposed to the external environment, and the heating tube will come into contact with moisture or dust residue in the air, which may cause short circuits or uneven temperature distribution, causing circuit failures. At the same time, cleaning and maintenance of the heating tube is relatively troublesome.

[0006] Electric baking pans, as appliances for heating food, are gradually becoming integrated into people's daily lives. In the current appliance market, electric baking pans mainly consist of a base, a heating element, and a serving dish. The base provides support and stability, assists in heat conduction, and provides protection and insulation. However, due to the characteristics of the heating element, traditional baking pan bases are heavy, bulky, and unsightly, taking up considerable space during storage and being inconvenient to carry for camping or picnics. A new type of heat source has been developed to replace the traditional heating element for heating the baking pan. This new heat source is only about 0.5 mm thick and is directly attached and encapsulated to the bottom of the baking pan. It has multiple advantages, such as uniform heating and ultra-thin thickness. This new heat source is composed of multiple layers of materials, typically with a heat-insulating mica sheet at the bottom. Existing baking pan bases can no longer meet market demands or the usage requirements of this new heat source baking pan. Summary of the Invention

[0007] The primary objective of this invention is to provide a heating layer structure that addresses the problems of existing heating structures being bulky, having long preheating times, and affecting heating efficiency.

[0008] To achieve the above objectives, an embodiment of the present invention provides a heating layer structure, including a substrate, an electric heating layer, and a heat insulation layer. The electric heating layer is connected to an external power source for heating. The substrate is disposed above the electric heating layer for contacting the material to be heated. The heat insulation layer is disposed below the electric heating layer for reducing heat loss.

[0009] Furthermore, the electric heating layer is composed of multiple basic heating units arranged in a row, and the basic heating units are connected to terminals through positive and negative electrodes respectively.

[0010] Furthermore, the basic thermal unit is made of graphene glass fiber.

[0011] Furthermore, a heat-conducting layer is provided between the substrate and the electric heating layer.

[0012] Furthermore, the thickness of the thermally conductive layer is 0.04 mm to 0.12 mm.

[0013] Furthermore, a silicone layer is provided between the electric heating layer and the heat insulation layer, and a silicone layer is also provided between the electric heating layer and the heat conducting layer.

[0014] Furthermore, the thickness of the silicone layer is from 0.04 mm to 0.12 mm.

[0015] Furthermore, the substrate is made of a thermally conductive metal or non-metal. Furthermore, the insulation layer is made of mica sheets.

[0016] Furthermore, the thickness of the substrate is 0.9 mm to 11 mm, the thickness of the electric heating layer is 0.04 mm to 0.4 mm, and the thickness of the heat insulation layer is 0.4 mm to 6 mm.

[0017] The heating layer structure provided in this invention has at least the following technical effects: The bottom of the electric heating layer is provided with a heat insulation layer, which effectively reduces heat loss from downward transfer, allowing heat to concentrate on the electric heating layer and the substrate area above, thus improving overall energy efficiency. It also accelerates heat conduction, enabling rapid heating or cooling in a shorter time, meeting the needs of equipment requiring rapid temperature adjustment; furthermore, it reduces the overall structural thickness, meeting the requirements of lightweight and space-saving design, and is suitable for applications in electrical appliances, electronic products, and heating pads.

[0018] Another objective of this invention is to provide a baking pan that solves the problem in existing electric baking pan machines where the heating element is located on the base and the baking pan is detachably connected to the base, thus exposing the heating element to the air and affecting the safety and normal use of the electric baking pan.

[0019] To achieve the above objectives, an embodiment of the present invention provides a baking pan, comprising a baking pan body and a base. The baking pan body is encapsulated with the aforementioned heating layer structure. The heating layer structure is provided with a first conductive terminal extending out of the bottom side of the baking pan body. The base is provided with a second conductive terminal, which is connected to an external power source. The first conductive terminal and the second conductive terminal are electrically connected so that the baking pan body can be detachably mounted on the base.

[0020] Furthermore, the first conductive terminal and the second conductive terminal are fixedly electrically connected by magnetic attraction.

[0021] Furthermore, the first conductive terminal is a male terminal with magnetic attraction, and the second conductive terminal is a female terminal with magnetic attraction.

[0022] Furthermore, the first conductive terminal and the second conductive terminal are wrapped with insulating material.

[0023] Furthermore, the baking pan body is provided with outwardly extending sidewalls around its perimeter, and the sidewalls and the bottom of the baking pan body form a cavity.

[0024] Furthermore, the top of the sidewall is provided with a handle away from the cavity.

[0025] Furthermore, the handle is made of heat-insulating material.

[0026] Furthermore, the baking pan body is made of metal or non-metal with good thermal conductivity.

[0027] Furthermore, the bottom of the baking pan body is recessed inward and has a mounting groove, and the base plate has an upwardly extending boss. The boss extends into the mounting groove to support the baking pan body, so that the bottom surface of the baking pan body and the top surface of the base plate form a gap.

[0028] The baking pan provided in this invention provides at least the following technical effects: The first conductive terminal is electrically connected to the second conductive terminal, and the second conductive terminal is connected to a power source to enable the heating layer to generate heat. Heat is directly transferred from inside the baking pan body to the surface of the baking pan body to achieve the food heating effect, improving heating efficiency and reducing the impact of high temperatures on the bottom plate. The baking pan body has only the first conductive terminal as its electrical connection point. The encapsulated design reduces exposed electronic components, helping to reduce the risk of electric shock due to improper operation or damage. It also prevents water, oil, and other substances from entering the internal electrical components, improving the baking pan's waterproof and dustproof capabilities. Simultaneously, it reduces the impact of external electromagnetic and temperature changes on the heating layer performance, improving the safety and durability of the baking pan. Furthermore, the encapsulated design makes the baking pan's appearance simple and aesthetically pleasing. When cleaning the baking pan body separately, the heating layer is prevented from being exposed to the air, reducing cleaning difficulty and improving the user experience.

[0029] Another objective of this invention is to provide a baking pan base that addresses the technical problem that existing baking pan bases are heavy, bulky, unattractive, and fail to meet the usage requirements of novel heat source baking pans.

[0030] To achieve the above objectives, the present invention provides a baking pan base, characterized in that: it includes a bottom cover, the side walls of which are inclined outwards, a support plate is provided in the bottom cover, the support plate forms a groove in the bottom cover, a notch is provided on the inner side of the top of the support plate, a support column and a limiting frame are provided in the groove formed by the support plate on the bottom cover, an upper cover is provided above the bottom cover, a notch is provided on the outer periphery of the bottom of the side wall of the upper cover, a mating plate is provided on the upper cover, the mating plate forms a through hole in the upper cover, a notch is provided on the outer periphery of the bottom of the mating plate, a reinforcing plate is provided between the side wall of the upper cover and the mating plate, a notch is provided on the bottom of the end of the reinforcing plate that contacts the side wall of the upper cover, the mating of the bottom cover and the upper cover forms a cavity behind the base, a carrier plate is provided above the cavity, a mating column is provided at the bottom of the carrier plate, and the mating column is fixed in the support column.

[0031] Preferably, the bottom cover has an upward-opening groove-shaped structure, and a portion perpendicular to the bottom plate of the bottom cover is provided on the top of the side wall of the bottom cover.

[0032] Preferably, the bottom plate of the bottom cover is provided with an auxiliary block, which is provided in correspondence with the screw hole. The auxiliary block has a circular hole in the middle that communicates with the screw hole, and a groove is provided at the upper end of the auxiliary block.

[0033] Preferably, the bottom plate of the bottom cover is provided with reinforcing ribs.

[0034] Preferably, the support column is a hollow cylindrical structure, and the support column is provided with a support frame and a rubber gasket.

[0035] Preferably, the limiting frame is provided with a limiting plate.

[0036] Preferably, a fixing post is provided below the top plate of the cover, and the fixing post is a cylindrical structure with a hollow center.

[0037] Preferably, the upper cover is provided with a circuit board fixing bracket.

[0038] Preferably, the mating post is provided with a groove for the rubber washer to be fitted.

[0039] Preferably, the carrier plate is a groove with an upward opening, and positioning plates are formed outward on the side walls around the carrier plate.

[0040] The above-mentioned technical solutions of one or more of the baking pan bases provided in the embodiments of the present invention have at least one of the following technical effects: The baking pan base of the present invention, under the cooperation of the support plate in the bottom cover and the mating plate in the top cover, forms a cavity in the base. Simultaneously, under the cooperation of the support column and the mating column, the carrier plate can be supported and fixed. The baking pan with a heat source is placed on the carrier plate. The grooved design of the carrier plate creates a gap between the bottom plate of the carrier plate and the bottom surface of the baking pan, meeting the heat dissipation requirements of the heat source. At the same time, a cavity is also formed under the carrier plate, which can fully meet the heat dissipation requirements of the heat source and also meet the heat insulation requirements to prevent the heat source from damaging the countertop. The bottom reinforcing ribs reduce the weight of the base while ensuring its structural strength. The reinforcing plate in the top cover increases the structural strength of the base and improves the convenience of installation. Furthermore, the special structural design of the bottom and top covers makes the base both compact and stylish. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 is a schematic diagram of the heating layer structure provided in an embodiment of the present invention.

[0043] Figure 2 is a schematic diagram of an embodiment of the electrothermal layer of the heating layer structure provided in this invention.

[0044] Figure 3 is a structural diagram of the baking pan body provided in an embodiment of the present invention.

[0045] Figure 4 is another structural diagram of the baking pan body provided in an embodiment of the present invention.

[0046] Figure 5 is a schematic diagram of the structure of the heating layer encapsulated in the baking pan body of the baking pan provided in an embodiment of the present invention.

[0047] Figure 6 is a structural diagram of the base of the baking pan provided in an embodiment of the present invention.

[0048] Figure 7 is a top view of the base of a baking pan provided in an embodiment of the present invention.

[0049] Figure 8 is a cross-sectional view of section AA in Figure 7.

[0050] Figure 9 is an enlarged view of point B in Figure 8.

[0051] Figure 10 is a partial perspective view of the base of a baking pan provided in an embodiment of the present invention.

[0052] Figure 11 is a top view of the bottom cover of a baking pan base provided in an embodiment of the present invention.

[0053] Figure 12 is an enlarged view of point C in Figure 11.

[0054] Figure 13 is a perspective view of the top cover of the base of a baking pan provided in an embodiment of the present invention.

[0055] Figure 14 is an enlarged view of point D in Figure 13.

[0056] Figure 15 is a perspective view of the carrier plate in the base of a baking pan provided in an embodiment of the present invention. Detailed Implementation

[0057] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0058] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0059] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0060] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0061] In one embodiment of the heating layer structure of the present invention, referring to Figures 1 and 2, the heating layer structure 1 includes a substrate 10, an electric heating layer 20, and a heat insulation layer 30. The electric heating layer 20 is connected to an external power source for heating. The substrate 10 is disposed above the electric heating layer 20 for contacting the material to be heated. The heat insulation layer 30 is disposed below the electric heating layer 20 to reduce heat loss. Specifically, the bottom of the electric heating layer 20 is provided with a heat insulation layer 30, which effectively reduces the loss of heat transferred downwards from the electric heating layer 20, allowing heat to be concentrated in the area of ​​the electric heating layer 20 and the substrate 10 above it, improving the overall energy utilization efficiency and accelerating the efficiency of heat conduction. This allows the heating layer structure to heat up or cool down rapidly in a short time, meeting the needs of equipment requiring rapid temperature adjustment. Furthermore, it can reduce the thickness of the overall structure, meeting the requirements of being lightweight and space-saving, and is suitable for applications in electrical appliances, electronic products, and heating pads.

[0062] Furthermore, the electric heating layer 20 is composed of multiple basic heating units 21 arranged together, and the basic heating units 21 are connected to terminals through positive and negative electrodes respectively. Specifically, depending on the power density and product specifications, the electric heating layer 20 can be a single piece of basic heating unit 21, or multiple basic heating units 21 arranged in series or parallel. The electric heating layer 20 is then connected to a power source through terminals to achieve the heating effect.

[0063] Furthermore, the basic heating unit 21 is made of graphene glass fiber. Specifically, graphene glass fiber possesses excellent thermal stability and electrothermal performance, good strength and rigidity, and a relatively light weight, enabling it to effectively and rapidly convert heat. Its thermal stability effectively extends the service life of the electrothermal layer 20.

[0064] Furthermore, a heat-conducting layer 40 is provided between the substrate 10 and the electric heating layer 20. Specifically, the heat-conducting layer 40 improves the efficiency of heat transfer, enabling it to quickly transfer the heat from the electric heating layer 20 to the upper substrate 10 area, ensuring rapid heat dispersion, preventing local overheating, reducing temperature fluctuations, and improving heating efficiency.

[0065] Furthermore, the thickness of the thermally conductive layer 40 is from 0.04 mm to 0.12 mm. Specifically, the thickness of the thermally conductive layer can be 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.11 mm, and 0.12 mm. The thermally conductive layer is made of copper, which has extremely high thermal conductivity, further improving thermal conductivity efficiency.

[0066] Furthermore, a silicone layer 50 is provided between the electric heating layer 20 and the heat insulation layer 30, and also between the electric heating layer 20 and the heat-conducting layer 40. Specifically, silicone layers 50 are provided on both the top and bottom of the electric heating layer 20 to help distribute heat evenly and provide some insulation to prevent excessive heat loss, thus concentrating heat in the heating area and improving heating efficiency. At the same time, the silicone layer 50 has a certain degree of elasticity and good waterproof and dustproof properties to protect the electric heating layer 20 from damage caused by external environmental factors.

[0067] Furthermore, the thickness of the silicone layer 50 is between 0.04 mm and 0.12 mm. Specifically, the silicone layer is made of insulating silicone resin, which has excellent insulation properties, prevents current leakage, ensures electrical isolation between the electric heating layer 20 and other structures, and guarantees the safety and stability of the heating layer structure during use. The thickness of the heat-conducting layer can be 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.11 mm, and 0.12 mm.

[0068] Furthermore, the substrate 10 is made of a thermally conductive metal or non-metal. Specifically, metals include alloys, aluminum products, etc., and non-metals include ceramics, glass, etc., all of which have strong mechanical properties, are resistant to high temperatures and pressure, can maintain their integrity under high temperature conditions, and effectively prevent structural damage caused by external pressure or thermal expansion.

[0069] Furthermore, the heat insulation layer 30 is made of mica sheets. Specifically, mica sheets are an excellent heat insulation material that will not be damaged even after prolonged exposure to high temperatures or corrosive environments, effectively protecting the structure of the electric heating layer 20 and preventing damage from external environmental interference. In another embodiment, the heat insulation layer 30 is composed of aerogel. Aerogel is the solid with the lowest density, possessing extremely light weight, extremely low thermal conductivity, good mechanical strength, and waterproof properties. It can effectively block heat transfer and is not easily affected by environmental factors in terms of performance.

[0070] Furthermore, the thickness of the substrate 10 is 0.9 mm to 11 mm, the thickness of the electric heating layer 20 is 0.04 mm to 0.4 mm, and the thickness of the heat insulation layer 30 is 0.4 mm to 6 mm. Specifically, the thickness of the substrate 10 can be 0.9 mm, 1 mm, 2 mm, 4 mm, 6 mm, 8 mm, 10 mm, and 11 mm; the thickness of the electric heating layer 20 can be 0.04 mm, 0.05 mm, 0.1 mm, 0.2 mm, 0.3 mm, and 0.4 mm; and the thickness of the heat insulation layer 30 can be 0.4 mm, 0.5 mm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, and 6 mm. The thickness of the multiple structural layers is still controlled within 2 cm, so that the overall thickness of the heating layer structure is relatively thin while maintaining high power output, thus saving space.

[0071] In one embodiment of the baking pan of the present invention, please refer to Figures 3 to 6. The baking pan 100 includes a baking pan body 110 and a base 120. The heating layer structure 1 described above is encapsulated within the baking pan body 110. The heating layer 1 is provided with a first conductive terminal 112 extending from the bottom side of the baking pan body 10. A second conductive terminal 121 is provided on the base 120, and the second conductive terminal 121 is connected to an external power source. The first conductive terminal 112 and the second conductive terminal 121 are electrically connected, so that the baking pan body 110 can be detachably mounted on the base 120. Specifically, the first conductive terminal 112 and the second conductive terminal 121 are electrically connected, and the second conductive terminal 121 is connected to a power source to realize the function of heating the heating layer structure 1. Heat is directly transferred from the inside of the baking pan body 110 to the surface of the baking pan body 110 to achieve the food heating effect, improve heating efficiency, and reduce the high temperature impact on the base 120. The only electrical connection point of the baking pan body 110 is the first conductive terminal 112. The encapsulation design reduces exposed electronic components and helps to reduce the risk of electric shock caused by improper operation or damage. It prevents water, oil, and other substances from entering the internal electrical components, improving the baking pan's waterproof and dustproof capabilities. It also reduces the impact of external electromagnetic and temperature changes on the performance of the heating layer structure 1, enhancing the safety and durability of the baking pan. Furthermore, the encapsulated design makes the baking pan's appearance simple and aesthetically pleasing. The baking pan body 110 can be cleaned separately, preventing the heating layer structure 1 from being exposed to air, reducing cleaning difficulty, and improving the user experience.

[0072] Furthermore, the first conductive terminal 112 and the second conductive terminal 121 are fixedly electrically connected by magnetic attraction. Specifically, the two terminals are automatically attracted and fixed by magnetic force, reducing electrical faults or operational problems caused by incomplete insertion or loose connection.

[0073] Furthermore, the first conductive terminal 112 is a male terminal with magnetic attraction, and the second conductive terminal 121 is a female terminal with magnetic attraction. Specifically, the first conductive terminal 112 is a male terminal, which makes the design of the baking pan body 110 more compact and simple. At the same time, the male terminal itself has a certain contact pressure, reducing the occurrence of poor contact problems.

[0074] Furthermore, the first conductive terminal 112 and the second conductive terminal 121 are wrapped with insulating material. Specifically, the insulating material provides protection, reducing the risk of electric shock, preventing short circuits and electromagnetic interference, effectively isolating heat, protecting against external environmental damage, and ensuring the stability and long-term reliable operation of the electrical connection.

[0075] Furthermore, the baking pan body 110 has outwardly extending sidewalls 113 around its perimeter, forming a cavity 114 with the bottom of the baking pan body 110. Specifically, the cavity 114 can hold food, preventing liquids generated during heating from flowing out from the edge of the baking pan body and affecting hygiene.

[0076] Furthermore, a handle 115 is provided at the top of the side wall 113, away from the cavity 114. Specifically, the handle 115 facilitates the user in connecting or separating the baking pan body 110 and the base 120. Preferably, the handle 115 is made of heat-insulating material. The heat insulation of the handle 115 is used to protect the user from burns caused by the heated baking pan.

[0077] Furthermore, the baking pan body 110 is made of a metal or non-metal with good thermal conductivity. Specifically, metal materials include alloys, aluminum products, or stainless steel, while non-metal materials include ceramics.

[0078] Furthermore, the upper and lower bottom surfaces of the baking pan body 110 are the substrate layer 10 of the aforementioned heating layer structure 1, which encapsulates the electric heating layer 20, heat insulation layer 30, and heat-conducting layer 40 of the aforementioned heating layer structure 1. The heat-conducting layer 40 is disposed above the electric heating layer 20. Specifically, the electric heating layer 20 can be a single unit or composed of multiple electric heating units connected in series or parallel to meet the specification requirements and power density requirements of different products. The heat-conducting layer 40 is disposed above the electric heating layer 20, so that the heat generated by the electric heating layer 20 is evenly transferred to the surface of the baking pan body 110. Furthermore, the bottom of the baking pan body 110 is recessed with a mounting groove 118, and the base 120 is provided with an upwardly extending boss 122. The boss 122 extends into the mounting groove 118 to support the baking pan body 110, so that a gap is formed between the bottom surface of the baking pan body 110 and the top surface of the base 120. Specifically, the boss 122 extends into the mounting groove 118 to provide support and fixation, preventing the baking pan body 110 from tilting due to the weight of the food. A gap is formed between the bottom surface of the baking pan body 110 and the top surface of the base 120 to meet the heat dissipation requirements of the baking pan and prevent the baking pan body 110 from directly contacting the table surface and causing damage.

[0079] In one embodiment of the present invention, as shown in Figures 7-10, a baking tray base is provided, including a bottom cover 210, an upper cover 220, a circuit board 230, a carrier board 240, and a baking tray 100.

[0080] The bottom cover 210 has an upward-opening groove structure and a recess is formed in the bottom cover 210. An upper cover 220 is provided above the bottom cover 210. The upper cover 220 has a downward-opening groove structure and a through hole that matches the recess formed in the bottom cover 210. The upper cover 220 and the bottom cover 210 are combined to form a complete base with an upward-opening cavity at the rear and a panel at the front. The circuit board 230 is located between the upper cover 220 and the bottom cover 210. The carrier plate 240 is located in the cavity formed by the upper cover 220 and the bottom cover 210. The baking tray 100 is located above the carrier plate 240.

[0081] The side walls of the bottom cover 210 are inclined outwards, and the top of the side wall is provided with a part perpendicular to the bottom plate of the bottom cover 210. This vertical part plays a role in cooperating with the top cover 220. The design of the shape of the side wall of the bottom cover 210 not only improves the aesthetics of the base, but also makes the base easy to pick up, thus improving the practicality of the base.

[0082] As shown in Figures 7-10, the bottom cover 210 is provided with screw holes 211, auxiliary blocks 212, support plates 213, reinforcing ribs 214, support columns 215, rubber washers 216, limiting frames 217, and joint holes 218.

[0083] There are multiple screw holes 211 located at the bottom of the bottom cover 210. The auxiliary block 212 is located on the bottom plate of the bottom cover 210 and is correspondingly arranged with respect to the screw holes 211. The auxiliary block 212 has a circular hole in the middle that communicates with the screw holes 211, and a groove is provided on the top of the auxiliary block 212.

[0084] The support plate 213 is disposed on the bottom plate of the bottom cover 210. The arrangement of the support plate 213 forms a groove in the bottom cover 210. The support plate 213, in cooperation with the top cover 220, plays the role of supporting the baking tray 100.

[0085] The support plate 213 has a notch 2131 on the inner side of its top, and the notch 2131 is arranged around the support plate 213. The support plate 213 has a passage 2132 at the front, which allows the line to pass through.

[0086] The reinforcing rib 214 is located at the bottom of the groove formed by the support plate 213, and the reinforcing rib 214 serves to strengthen the bottom cover 210.

[0087] There are multiple support columns 215. Each support column 215 is a hollow cylindrical structure. The support column 215 serves to support the carrier plate 240, thereby creating a gap between the carrier plate 240 and the bottom cover 210. Each support column 215 is provided with a support frame 2151, and the height of the support frame 2151 is lower than that of the support column 215.

[0088] The rubber washer 216 is disposed in the support column 215, and the rubber washer 216 serves to engage and connect the carrier plate 240 and the support column 215.

[0089] The limiting frame 217 is located behind the passage 2132. The limiting frame 217 serves to limit the position of the protrusions on the carrier plate 240 and the terminals on the baking tray 100, and to protect the terminals on the baking tray 100.

[0090] The limiting frame 217 is provided with multiple limiting plates 2171, which serve to assist the limiting frame 217 in limiting the terminals on the baking tray 100.

[0091] The connector hole 218 is located on one side of the bottom cover 210, and the connector hole 218 serves to install the power cord connector.

[0092] As shown in Figures 13 and 14, the upper cover 220 is provided with a fixing post 221, a notch 222, a mating plate 223, a reinforcing plate 224, and a circuit board fixing frame 225.

[0093] The fixing post 221 is located below the top plate of the upper cover 220. The fixing post 221 is a cylindrical structure with a hollow center. The fixing post 221 extends into the groove in the auxiliary block 212. The fixing post 221 cooperates with the auxiliary block 212 to fix the bottom cover 210 and the upper cover 220.

[0094] The second notch 222 is located on the outer periphery of the bottom of the side wall of the upper cover 220, and the second notch 222 is arranged around the outer periphery of the upper cover 220.

[0095] The mating plate 223 is located at the rear of the upper cover 221. The mating plate 223 is correspondingly arranged with the support plate 213. The arrangement of the mating plate 223 forms a through hole in the upper cover 220 that corresponds to the groove in the bottom cover 210. The mating plate 223 cooperates with the support plate 213 to form a cavity at the rear of the base. At the same time, the mating plate 223, in cooperation with the support plate 213, keeps the interior of the base sealed.

[0096] The bottom periphery of the mating plate 223 is provided with a notch 2231 arranged around the mating plate 223. The notch 2231 serves to cooperate with the notch 2131 to improve the sealing of the cavity formed in the base.

[0097] Multiple reinforcing plates 224 are provided between the mating plate 223 and the side wall of the upper cover 220. The bottom of the end of the reinforcing plate 224 that contacts the side wall of the upper cover 220 is provided with a notch 2241. The notch 2241 is connected to the notch 222, and the two notches form a large notch so that the side wall of the bottom cover 210 can be engaged in the upper cover 220. The reinforcing plate 224 not only increases the structural strength of the base, but also cooperates with the side wall of the upper cover 220 so that the bottom cover 210 can be connected to the upper cover 220 conveniently, quickly, firmly, stably and in a sealed manner.

[0098] The circuit board mounting bracket 225 is located in front of the mating plate 223. The circuit board mounting bracket 225 contains a circuit board 230 and serves to install and fix the circuit board 230.

[0099] As shown in Figure 15, the carrier plate 240 is disposed in the cavity formed by the bottom cover 210 and the top cover 220, and is located above the support column 215. The carrier plate 240 is a groove with an upward opening, and positioning plates are formed outward on the side walls around the carrier plate 240. The positioning plates play a role in limiting the position of the baking tray. A protrusion is provided at the front of the carrier plate, which plays a role in assisting the limiting frame 217 to limit the terminals of the baking tray 100. The bottom of the carrier plate 240 is provided with a plurality of mating columns 241 that cooperate with the support column 215. The mating columns 241 are provided with grooves for rubber gaskets 216 to be fitted. The mating columns 241 extend into the support column 215, and the bottom surface of the mating columns 241 contacts the top surface of the support frame 2151 in the support column 215.

[0100] The baking tray 100 is positioned above the carrier plate 240 and is located in the cavity formed by the bottom cover 210 and the top cover 220.

[0101] The working principle of this invention is as follows: A baking tray base is constructed by fixing a circuit board 230 to a circuit board mounting bracket 225 in an upper cover 220. The upper cover 220 is then aligned with a bottom cover 210, with the sidewall of the bottom cover 210 extending into the notches 222 and 2241 in the upper cover 220. The top of the sidewall of the bottom cover 210 is positioned between the sidewall of the upper cover 220 and the reinforcing plate 224. The upper cover 220 completely encloses the bottom cover 210, resulting in a seamless and aesthetically pleasing base when viewed from above. Furthermore, the inclined design of the bottom cover 210's sidewall and the enclosing design of the upper cover 220 ensure a low base thickness while allowing the bottom cover to be easily lifted from the countertop, enhancing practicality. At this point, the fixing post 221 extends into the auxiliary block 212, and the notches 2131 and 2241... The support plate 213 and the mating plate 23 are tightly connected by the cooperation of the two components. A cavity is formed at the rear of the base and a panel is formed at the front. Then, the rubber gasket 216 is fitted into the groove on the mating post 241 at the bottom of the carrier plate 240. The mating post 241 is inserted into the support post 215. At this time, the bottom surface of the carrier plate 240 is in contact with the top surface of the support post 215, thereby supporting and fixing the carrier plate 240. Then, the baking tray 100 is placed on the carrier plate 240. The shape of the carrier plate 240 is designed so that there is a gap between the carrier plate 240 and the baking tray 100, which can dissipate heat when the heat source is working. At the same time, the cavity formed under the carrier plate 240 can dissipate heat when the heat source is working, and also prevents the heat source from damaging the work surface. In addition, the overall structure of the base has good sealing performance, which improves the safety of the baking tray.

[0102] The rest of this embodiment is the same as that in Embodiment 1. Features not explained in this embodiment are explained using the methods in Embodiment 1, and will not be repeated here.

[0103] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heating layer structure, characterized in that, It includes a substrate, an electric heating layer, and a heat insulation layer. The electric heating layer is connected to an external power source for heating. The substrate is located above the electric heating layer and is used to contact the material to be heated. The heat insulation layer is located below the electric heating layer and is used to reduce heat loss.

2. The heating layer structure according to claim 1, characterized in that: The electric heating layer is composed of multiple basic heating units arranged in a row, and the basic heating units are connected to terminals through positive and negative electrodes respectively.

3. The heating layer structure according to claim 2, characterized in that: The basic thermal unit is made of graphene glass fiber.

4. The heating layer structure according to any one of claims 1 to 3, characterized in that: A heat-conducting layer is provided between the substrate and the electric heating layer.

5. The heating layer structure according to claim 4, characterized in that: The thickness of the thermally conductive layer is 0.04 mm to 0.12 mm.

6. The heating layer structure according to claim 4, characterized in that: A silicone layer is provided between the electric heating layer and the heat insulation layer, and a silicone layer is also provided between the electric heating layer and the heat conducting layer.

7. The heating layer structure according to claim 4, characterized in that: The thickness of the silicone layer is from 0.04 mm to 0.12 mm.

8. The heating layer structure according to claim 1, characterized in that: The substrate is made of thermally conductive metal or non-metal.

9. The heating layer structure according to claim 1, characterized in that: The insulation layer is made of mica sheets.

10. The heating layer structure according to claim 1, characterized in that: The thickness of the substrate is 0.9 mm to 11 mm, the thickness of the electric heating layer is 0.04 mm to 0.4 mm, and the thickness of the heat insulation layer is 0.4 mm to 6 mm.

11. A baking pan, characterized in that, The invention includes a baking pan body and a base. The baking pan body is encapsulated with a heating layer structure as described in any one of claims 1-10. The heating layer structure is provided with a first conductive terminal extending from the bottom side of the baking pan body. The base is provided with a second conductive terminal, which is connected to an external power source. The first conductive terminal and the second conductive terminal are electrically connected so that the baking pan body can be detachably mounted on the base.

12. The baking pan according to claim 11, characterized in that: The first conductive terminal and the second conductive terminal are fixedly electrically connected by magnetic attraction.

13. The baking pan according to claim 12, characterized in that: The first conductive terminal is a male terminal with magnetic attraction, and the second conductive terminal is a female terminal with magnetic attraction.

14. The baking pan according to claim 11, characterized in that: The first and second conductive terminals are wrapped with insulating material.

15. The baking pan according to claim 11, characterized in that: The baking pan body has outwardly extending side walls around its perimeter, and the side walls and the bottom of the baking pan body form a cavity.

16. The baking pan according to claim 15, characterized in that: The top of the sidewall is provided with a handle away from the cavity.

17. The baking pan according to claim 16, characterized in that: The handle is made of heat-insulating material.

18. The baking pan according to claim 11, characterized in that: The baking pan body is made of metal or non-metal with good thermal conductivity.

19. The baking pan according to claim 1, characterized in that: The baking pan body has an inwardly recessed mounting groove at the bottom, and the base has an upwardly extending boss that extends into the mounting groove to support the baking pan body, thereby creating a gap between the bottom surface of the baking pan body and the top surface of the base.

20. A base for a baking pan according to any one of claims 11-19, characterized in that: The device includes a bottom cover with outwardly sloping sidewalls. A support plate is located within the bottom cover, forming a groove. A notch is located on the inner side of the top of the support plate. A support post and a limiting frame are located within the groove formed by the support plate on the bottom cover. An upper cover is located above the bottom cover. A notch is located on the outer periphery of the bottom of the sidewall of the upper cover. A mating plate is located on the upper cover, forming a through hole. A notch is located on the outer periphery of the bottom of the mating plate. A reinforcing plate is located between the sidewall of the upper cover and the mating plate. A notch is located at the bottom of the end of the reinforcing plate that contacts the sidewall of the upper cover. The mating of the bottom cover and the upper cover creates a cavity behind the base. A carrier plate is located above this cavity. A mating post is located at the bottom of the carrier plate and is fixed within the support post.

21. The base of a baking pan according to claim 20, characterized in that: The bottom cover has an upward-opening groove-shaped structure, and a portion perpendicular to the bottom plate of the bottom cover is provided on the top of the side wall of the bottom cover.

22. The base of a baking pan according to claim 20, characterized in that: The bottom plate of the bottom cover is provided with an auxiliary block, which is corresponding to the screw hole. The auxiliary block has a circular hole in the middle that communicates with the screw hole, and a groove is provided at the upper end of the auxiliary block.

23. The base of a baking pan according to claim 20, characterized in that: The bottom plate of the bottom cover is provided with reinforcing ribs.

24. The base of a baking pan according to claim 20, characterized in that: The support column is a hollow cylindrical structure, and a support frame and rubber gasket are provided in the support column.

25. The base of a baking pan according to claim 20, characterized in that: The limiting frame is equipped with a limiting plate.

26. The base of a baking pan according to claim 20, characterized in that: A fixing column is provided below the top plate of the cover, and the fixing column is a cylindrical structure with a hollow center.

27. The base of a baking pan according to claim 20, characterized in that: The upper cover is equipped with a circuit board fixing frame.

28. The base of a baking pan according to claim 20, characterized in that: The mating column is provided with a groove for the rubber gasket to be fitted.

29. The base of a baking pan according to claim 20, characterized in that: The carrier plate is a groove with an upward opening, and positioning plates are formed outward on the side walls around the carrier plate.

Images