Gas-fired water heating device

Abstract

The present application relates to the technical field of water heating equipment, and discloses a gas-fired water heating device. The gas-fired water heating device comprises a housing, a motor, and an electronic control assembly, wherein the motor is arranged within the housing, the electronic control assembly is arranged within the housing and spaced apart from the motor, and the electronic control assembly is electrically connected to the motor by means of a connecting member. The technical solution of the present application reduces the impact of heat generated by motors on heat-generating power components, and reduces motor volume.

Description

Gas-fired water heater

[0001] Related applications

[0002] This application claims priority to Chinese patent application No. 202520163600.3, filed on January 22, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of hot water equipment technology, and in particular to a gas-fired hot water equipment. Background Technology

[0004] Currently, water heaters commonly use motors for fans and water pumps. The water pump circulates water and regulates water flow, while the fan exhausts fumes. The motor drive board for the water pump is usually installed inside the water pump body and located close to the water pump motor, while the motor drive board for the fan is installed inside the fan body and located close to the fan motor. Summary of the Invention

[0005] The main objective of this application is to propose a gas-fired water heater that aims to reduce the impact of heat generated by the motor on the heating power devices, while also reducing the size of the motor.

[0006] To achieve the above objectives, the present application proposes a gas-fired water heater, which includes: a housing, a motor, and an electrical control assembly.

[0007] In one embodiment, the motor is disposed within the housing.

[0008] In one embodiment, the electronic control component is disposed within the housing and spaced apart from the motor, and the electronic control component is electrically connected to the motor via a connector.

[0009] In one embodiment, the electronic control component includes: an electronic control board, a main control circuit, and a motor drive circuit.

[0010] In one embodiment, the main control circuit is disposed on the electronic control board.

[0011] In one embodiment, the motor drive circuit is disposed on the electronic control board, and the motor drive circuit is electrically connected to the main control circuit and the motor respectively, and the motor drive circuit is used to drive the motor to work.

[0012] In one embodiment, the electronic control component includes a main control board and a driver board.

[0013] In one embodiment, the main control board is provided with a main control circuit.

[0014] In one embodiment, the drive board is provided with a motor drive circuit, which is electrically connected to the main control circuit and the motor respectively, and the motor drive circuit is used to drive the motor to work.

[0015] In one embodiment, the motor is a fan.

[0016] In one embodiment, the motor is a water pump.

[0017] In one embodiment, when the motor is a fan or a water pump, there are two drive boards, namely a first drive board and a second drive board.

[0018] The first drive board is provided with a fan drive circuit, which is electrically connected to the main control circuit and the fan respectively. The fan drive circuit is used to drive the fan to work.

[0019] The second drive board is provided with a water pump drive circuit, which is electrically connected to the main control circuit and the water pump respectively, and is used to drive the water pump to work.

[0020] In one embodiment, the main control board and the drive board are spaced apart, and the electronic control component further includes a heat dissipation structure, which is disposed on at least one of the main control board and the drive board.

[0021] In one embodiment, the main control board is connected to the driver board through the heat dissipation structure, so as to dissipate heat from the driver board and the main control board through the heat dissipation structure.

[0022] In one embodiment, the heat dissipation structure includes:

[0023] A heat dissipation medium is disposed between the main control board and the driver board.

[0024] In one embodiment, the heat dissipation structure includes:

[0025] A heat sink is disposed on at least one of the main control board and the driver board.

[0026] In one embodiment, the heat dissipation structure includes: a pin header and pin headers.

[0027] In one embodiment, one of the main control board and the drive board is provided with the pin header socket, and one of the main control board and the drive board is provided with pin header holes.

[0028] In one embodiment, one end of the pin header is fixed to the pin header seat, and the other end of the pin header passes through the pin header hole to connect the main control board and the drive board.

[0029] In one embodiment, the electronic control component further includes:

[0030] The functional modules are located on the main control board and the drive board, and include at least one of the following: a switching power supply module, a flame sensing needle module, an ignition module, a gas valve control module, a gas proportional valve module, a sensor module, a thermostat module, and a display module.

[0031] In one embodiment, the electronic control component further includes:

[0032] A communication circuit is provided, which is used to communicate with the main control circuit. The signal input terminal of the communication circuit is used to receive control signals, and the signal output terminal of the communication circuit is connected to the signal input terminal of the motor drive circuit. The signal output terminal of the motor drive circuit is connected to the motor. The motor drive circuit is used to receive the control signals output by the main control circuit through the communication circuit and control the motor to work according to the control signals.

[0033] In one embodiment, the communication circuit includes at least one of a UART communication circuit, an I2C communication circuit, and an SPI communication circuit.

[0034] The gas-fired water heater technical solution of this application, by arranging the motor and electrical control components separately within the casing and electrically connecting them via connectors, allows the electrical control components to control the motor's operation via the connectors. Simultaneously, it reduces the impact of heat generated by the motor on the electrical control components, thereby improving their operational stability and lifespan. Furthermore, since the electrical control components are no longer integrated into the motor, this helps reduce the motor's size and eliminates the need for fasteners to secure the electrical control components to the motor. This not only protects the motor's structure but also saves on the costs associated with using fasteners. Attached Figure Description

[0035] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 is a structural schematic diagram of an embodiment of the gas-fired water heater provided in this application;

[0038] Figure 2 is a structural schematic diagram of an embodiment of the electronic control component provided in this application;

[0039] Figure 3 is a schematic diagram of another embodiment of the electronic control component provided in this application;

[0040] Figure 4 is a structural schematic diagram of another embodiment of the electronic control component provided in this application;

[0041] Figure 5 is a structural schematic diagram of another embodiment of the electronic control component provided in this application;

[0042] Figure 6 is a structural schematic diagram of another embodiment of the electronic control component provided in this application.

[0043] Explanation of icon numbers:

[0044] 100. Gas-fired hot water equipment; 1. Shell; 2. Motor; 21. Fan; 22. Water pump; 3. Electrical control components; 31. Electrical control board; 32. Main control circuit; 33. Motor drive circuit; 331. Fan drive circuit; 332. Water pump drive circuit; 34. Main control board; S3. Third side surface; S2. Fourth side surface; 35. Drive board; S1. First side surface; S2. Second side surface; 351. First drive board; 352. Second drive board; 36. Heat dissipation structure; 361. 362. Heat sink; 363. Snap-fit ​​assembly; 364. Pin header; 365. Pin header; 366. Pin header hole; 367. Heat dissipation layer; 368. Thermal conductive medium; 37. Functional module; 371. Switching power supply module; 372. Flame sensor module; 373. Ignition module; 374. Gas valve control module; 375. Gas proportional valve module; 376. Sensor module; 377. Temperature controller module; 378. Display module; 38. Communication circuit; 4. Connector.

[0045] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Embodiments of the present invention

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0047] Currently, water heaters commonly use motors for fans and pumps. The pump circulates water and regulates water flow, while the fan exhausts fumes. The pump motor drive board is typically installed inside the pump body, close to the pump motor, while the fan motor drive board is installed inside the fan body, close to the fan motor. As is well known, both pump and fan motors are heat-generating components, producing a significant amount of heat during operation. This heat originates from several sources: 1. Core loss: Energy loss occurs during the magnetization and demagnetization of the motor core, converting into heat and increasing the motor temperature. 2. Bearing friction: Friction between the rotor and stator also leads to energy loss, again converting into heat and increasing the motor temperature. 3. Winding temperature rise: Current flowing through the motor windings also generates energy loss, which is also converted into heat, further increasing the motor temperature.

[0048] Since motors (fans, water pumps, etc.) need to be waterproof, the water pump motor and / or fan motor, along with their corresponding motor drive board, are typically sealed inside the motor. This means that when the motor is running, it continuously heats the motor drive board. This heat significantly impacts the integrated drive chip and its internal power devices, primarily in the following ways: 1. High temperatures cause aging of the power devices within the drive chip, such as transistors and diodes, leading to performance degradation or even failure. 2. High temperatures can cause the power devices within the drive chip to burn out. When these devices are damaged to a certain extent, the entire drive chip will fail and cannot function properly. 3. High temperatures degrade the performance of the internal circuitry of the drive chip, such as slowing signal transmission speed and increasing power consumption, all of which affect the drive chip's efficiency and stability.

[0049] In addition, integrating the motor drive board with the corresponding motor can easily result in a relatively large motor size, and the cost of fixing it with structural components is also high.

[0050] This application proposes a gas-fired water heater 100, which aims to reduce the impact of heat generated by the motor 2 on the heating power device, while reducing the size of the motor 2.

[0051] In one embodiment of this application, referring to FIG1, the gas water heater 100 includes a housing 1, a motor 2 and an electrical control component 3; the motor 2 is disposed inside the housing 1; the electrical control component 3 is disposed inside the housing 1 and spaced apart from the motor 2, and the electrical control component 3 is electrically connected to the motor 2 through a connector 4.

[0052] The gas-fired water heating equipment 100 includes, but is not limited to, gas water heaters, wall-hung boilers, etc. Taking a gas water heater as an example, the gas water heater can be a forced-draft type gas water heater with the fan 21 mounted below, or a forced-extraction type gas water heater with the fan 21 mounted above; the gas water heater can be a forward-firing type gas water heater with the burner mounted below, or a reverse-firing type gas water heater with the burner mounted above, and the specific model is not limited here.

[0053] In this embodiment, the gas-fired water heater 100 includes a housing 1. The housing 1 serves as the external protective structure for the entire gas-fired water heater 100, providing not only mechanical support and protection but also is responsible for isolating internal components from the external environment, ensuring the safety and reliability of the equipment. The gas-fired water heater 100 also includes a main body, which is the primary component for combustion and heat exchange. This main body may include a fan 21, a burner, and a heat exchanger arranged from bottom to top. When the gas-fired water heater 100 is operating, driven by the fan 21, the high-temperature flue gas generated by the burner flows upwards to the heat exchanger. The main body also includes a water pump 22. Driven by the water pump 22, external cold water is first transported to the heat exchanger via the inlet pipe for heating. The hot water generated inside the heat exchanger is then output to the user's water supply via the outlet pipe.

[0054] The motor 2 is housed within the housing 1. The motor 2 can be a fan 21 and / or a water pump 22. It can be understood that the motor 2 can be either a fan 21 or a water pump 22, or both. Of course, the motor 2 is not limited to a fan 21 and a water pump 22, and can also be other devices, which will not be described in detail here.

[0055] The gas-fired water heater 100 also includes an electrical control component 3, which serves as the control center of the gas-fired water heater 100 and is mainly responsible for managing and regulating its operation. Specifically, the electrical control component 3 is electrically connected to the fan 21, burner, heat exchanger, and water pump 22. When the gas-fired water heater 100 is working, the electrical control component 3 controls the burner to ignite, controls the fan 21 to drive the high-temperature flue gas generated by the burner to the heat exchanger, controls the water pump 22 to deliver external cold water to the heat exchanger through the inlet, and controls the heat exchanger to heat the external cold water. The electrical control component 3 may include an electrical control board 31, which may integrate a main control circuit 32, a motor drive circuit 33, and functional modules 37. The main control circuit 32 can be implemented using a microprocessor or microcontroller, responsible for controlling the operation of the burner and other devices according to a preset program. The motor drive circuit 33 is electrically connected to the main control circuit 32 and is connected to the fan 21 and / or water pump 22 via connector 4. The motor drive circuit 33 receives control signals output by the main control circuit 32 and drives the fan 21 and / or water pump 22 according to the received control signals. The selection of connector 4 should consider factors such as conductivity, temperature resistance, and anti-interference capability to ensure the normal operation of the electronic control component 3. In practical applications, connectors can be provided on both the electronic control component 3 and the motor 2. For example, a male connector can be provided on the electronic control component 3 and a female connector on the motor 2. When it is necessary to assemble the electronic control component 3 and the motor 2 and establish an electrical connection, the two ends of connector 4 can be connected to the male connector of the electronic control component 3 and the female connector of the motor 2 respectively to quickly complete the electrical connection between the two. This simplifies the assembly process of the electronic control component 3 and the motor 2 and ensures the stability and convenience of the connection. Functional module 37 may include sensor module 376, switching power supply module 371, etc., wherein sensor module 376 may be temperature sensor module 376, which is used to monitor water temperature or ambient temperature to ensure that the output temperature of gas water heater 100 meets the user set value. Common types include NTC thermistors. The power supply module provides a stable operating voltage for the entire electronic control component 3. It may include transformer, rectifier, filter and voltage regulator circuit, etc., to ensure that the input AC power is converted into DC power suitable for use by internal electronic components.The electronic control component 3 is also housed within the casing 1, but maintains a certain distance from the motors 2, such as the fan 21 and water pump 22. For example, the casing 1 has a first sidewall and a second sidewall arranged opposite each other. The electronic control component 3 can be located on one of the first and second sidewalls of the casing 1, and the motor 2 can be located on the other sidewall. Alternatively, the casing 1 has an adjacent first and third sidewalls. The electronic control component 3 can be located on one of the first and third sidewalls of the casing 1, and the motor 2 can be located on the other sidewall. In this case, there is a gap between the motor 2 and the electronic control component 1. Of course, there can be other layouts for the electronic control component 1 and the motor 2, which will not be elaborated here. This layout can more effectively handle the heat generated by the motor 2, avoiding the impact of high temperature on the electronic control component 3. At the same time, the reasonable space planning reduces the mutual influence between the electronic control component 3 and the motor 2, reducing the risk of failure.

[0056] The technical solution of the gas-fired water heater 100 of this application involves spaced-apart motor 2 and electrical control component 3 within the housing 1, electrically connected via a connector. This design allows the electrical control component 3 to control the motor 2 via the connector 4, while simultaneously reducing the impact of heat generated by the motor 2 on the electrical control component 3, thereby improving its operational stability and lifespan. Furthermore, since the electrical control component 3 is no longer integrated into the motor 2, it helps reduce the size of the motor 2 and eliminates the need for fasteners to fix the electrical control component 3 to the motor 2. This not only protects the structure of the motor 2 but also saves on the cost associated with using fasteners.

[0057] In one embodiment of this application, referring to FIG2, the electronic control component 3 includes:

[0058] Electronic control board 31;

[0059] The main control circuit 32 is located on the electronic control board 31;

[0060] The motor drive circuit 33 is disposed on the electronic control board 31. The motor drive circuit 33 is electrically connected to the main control circuit 32 and the motor 2 respectively. The motor drive circuit 33 is used to drive the motor 2 to work.

[0061] In this embodiment, the control board 31 serves as the core carrier of the control assembly 3, housing all electronic circuits and components. It not only provides a physical mounting platform but also ensures electrical connections between various circuits. The main control circuit 32, mounted on the control board 31, is responsible for the control logic of the entire gas-fired water heater 100. The main control circuit 32 typically includes modules such as a microprocessor, memory, communication interface, and power management module, used to receive sensor signals, process user commands, and coordinate the operating status of components such as the fan 21 of the gas-fired water heater 100. The motor drive circuit 33 is also mounted on the circuit board. The motor drive circuit 33 is electrically connected to the main control circuit 32 and to the motor 2 via connector 4. Although the motor drive circuit 33 and the motor 2 are physically separated, they still need to maintain reliable power transmission and signal communication. The motor drive circuit 33 can adjust the speed, direction, and other operating parameters of the motor 2 according to the control signals output by the main control circuit 32, ensuring that the motor 2 operates accurately according to preset requirements. To ensure the high-speed operation of motor 2, motor drive circuit 33 typically includes modules such as power amplifier, current detection circuit, and protection circuit to adapt to different load conditions and ensure the safety of electronic control component 3. By integrating the main control circuit 32 and motor drive circuit 33 onto the electronic control board 31, not only can the length of the connecting cable between the main control circuit 32 and motor drive circuit 33 be shortened, but the number of connecting cables between multiple independent circuit boards can also be reduced, reducing assembly complexity and improving the production efficiency of electronic control component 3. In addition, the single electronic control board 31 design allows for a more compact arrangement of circuit components, helping to reduce the size of electronic control component 31.

[0062] In one embodiment of this application, referring to FIG3, the electronic control component 3 includes:

[0063] Main control board 34, on which a main control circuit 32 is provided;

[0064] A drive board 35 is provided with a motor drive circuit 33, which is electrically connected to the main control circuit 32 and the motor 2 respectively. The motor drive circuit 33 is used to drive the motor 2 to work.

[0065] In this embodiment, the main control board 34 is the core of the entire electronic control assembly 3, carrying the main control circuit 32 and responsible for processing data, making logical judgments, and coordinating the working status of components such as the fan 21 of the gas water heater 100. The main control board 34 typically includes modules such as a microprocessor, memory, communication interface, and power management module. The drive board 35 provides the drive signals and power support required by the motor 2, and the motor drive circuit 33 mounted on it is connected to the motor 2 via the connector 4. The structure and working principle of the motor drive circuit 33 can be referred to the above embodiment, and will not be repeated here. By separating the heat-generating drive board 35 from the main control board 34, heat can be better managed and distributed, preventing the heat generated by the drive board 35 and / or the motor 2 from damaging the main control circuit 32 on the main control board 34. Even if the drive board 35 fails, it will not directly affect the core control logic on the main control board 34, thereby improving the fault tolerance of the electronic control assembly 3.

[0066] In one embodiment of this application, referring to FIG4, the motor 2 is a fan 21;

[0067] And / or, the motor 2 is a water pump 22.

[0068] In this embodiment, the motor 2 in the gas-fired water heater 100 can specifically refer to a fan 21 or a water pump 22, or both. The fan 21 is used to exhaust the exhaust gas generated during the combustion process of the gas-fired water heater 100, preventing exhaust gas from accumulating indoors and ensuring safe use. The fan 21 is also used to draw in air, providing sufficient oxygen for the combustion process, ensuring complete combustion of the gas and improving thermal efficiency. The water pump 22 is used to drive water to the heat exchanger, realizing water circulation during the heating process and ensuring that hot water is evenly distributed to each outlet point. By controlling the speed of the water pump 22, the water flow rate can be flexibly adjusted according to actual water demand, achieving energy-saving effects. The electrical control component 3 can coordinate the operation of the fan 21 and the water pump 22, ensuring maximum synergy between them. For example, before starting heating, the fan 21 can be started for preheating or ventilation. On the one hand, any unburned gas or exhaust gas that may exist can be discharged, avoiding the risk of explosion or fire during ignition. On the other hand, by introducing an appropriate amount of fresh air through the fan 21, complete combustion of the gas can be ensured, improving combustion efficiency and thus heating water more effectively.

[0069] In one embodiment of this application, referring to FIG4, when the motor 2 is a fan 21 and a water pump 22, there are two drive plates 35, namely a first drive plate 351 and a second drive plate 352.

[0070] The first drive board 351 is provided with a fan drive circuit 331, which is electrically connected to the main control circuit 32 and the fan 21 respectively. The fan drive circuit 331 is used to drive the fan 21 to work.

[0071] The second drive board 352 is provided with a water pump drive circuit 332, which is electrically connected to the main control circuit 32 and the water pump 22 respectively. The water pump drive circuit 332 is used to drive the water pump 22 to work.

[0072] In this embodiment, the first drive board 351 drives the fan 21 to ensure the functions of smoke exhaust, gas exhaust, and combustion air supply are realized. The second drive board 352 drives the water pump 22 to ensure the functions of water circulation and water flow regulation are realized. By setting the fan drive circuit 331 of the fan 21 on the first drive board 351 and the water pump drive circuit 332 of the water pump 22 on the second drive board 352, the heat generated by the fan 21 and the water pump 22 can be managed and dissipated more effectively, avoiding local overheating of the first drive board 351 and the second drive board 352 from affecting the performance of the heat-generating power devices on them. The first drive board 351 and the second drive board 352 can also each adopt targeted heat dissipation measures according to the characteristics of the drive circuit, such as dedicated heat sinks or fans, thereby improving the overall heat dissipation effect. Furthermore, the arrangement of the first drive board 351 and the second drive board 352 allows for the separation of the operation of the fan 21 and the water pump 22. Even if one drive board 35 fails, the other drive board 35 can still operate normally, improving the fault tolerance of the gas water heater 100. Moreover, if either the first drive board 351 or the second drive board 352 fails, it can be replaced or repaired individually without affecting the operation of the entire gas water heater 100, reducing the risk of downtime. For physical installation and thermal management, the first drive board 351 and the second drive board 352 can be fixed to the main control board using pin headers, fixing clips, etc. The heat generated by these boards can also be conducted to the main control board 34 through the heat dissipation structure 36, using the main control board 34 as an additional heat dissipation path to promote overall heat diffusion and improve heat dissipation efficiency.

[0073] It is understandable that the heat-generating power devices such as IGBTs, MOS, and IPMs in the motor drive circuit 33 have a certain resistance when they are turned on, and the current flowing through them generates Joule heat, thus producing heat. When they are turned off, there is a turn-off voltage, and the higher the turn-off voltage, the greater the heat generated. Furthermore, some heat-generating power devices require high-frequency switches to turn on or off. High-frequency switches also generate a certain amount of heat when switching, and the higher the switching frequency, the greater the heat generated.

[0074] Therefore, in one embodiment of this application, referring to FIG. n, the main control board 34 and the drive board 35 are spaced apart, and the electronic control component 3 further includes a heat dissipation structure 36, which is disposed on at least one of the main control board 34 and the drive board 35;

[0075] And / or, the main control board 34 is connected to the drive board 35 through the heat dissipation structure 36, so as to dissipate heat from the drive board 35 and the main control board 34 through the heat dissipation structure 36.

[0076] In this embodiment, by physically separating the main control board 34 and the drive board 35, heat transfer between them is reduced, preventing the heat generated by the motor drive circuit 33 on the drive board 35 from adversely affecting the main control circuit 32 on the main control board 34. Based on this structure, a heat dissipation structure 36 can be provided on at least one of the main control board 34 and the drive board 35. The heat dissipation structure 36 can be a heat sink, thermal pad, heat pipe, fan, etc., for directly contacting and dissipating heat from the main control board 34 or the drive board 35. The heat dissipation structure 36 can be installed only on the main control board 34 to help the main control circuit 32 on the main control board 34 maintain a low-temperature working environment; or, the heat dissipation structure 36 can be installed only on the drive board 35 to reduce the high temperature generated by the motor drive circuit 33 on the drive board 35 due to high power output; or, part of the heat dissipation structure 36 can be installed on the main control board 34 and another part can be installed on the drive board 35, that is, the heat dissipation structure 36 can be installed on both the main control board 34 and the drive board 35, to prevent any component of the main control board 34 and the drive board 35 from malfunctioning due to overheating, thus comprehensively improving the heat dissipation effect of the entire electrical control component 3, thereby improving the reliability and safety of the gas water heater 100.

[0077] Based on the above embodiments, in another embodiment, the main control board 34 and the drive board 35 are connected by a heat dissipation structure 36. With this design, the heat dissipation structure 36 not only dissipates heat but also serves as a heat conduction path, transferring heat from the drive board 35 to the main control board 34. Since the main control board 34 is typically larger than the drive board 35, this allows for more efficient heat transfer and improves heat dissipation efficiency. It can be noted that the heat dissipation structure 36 can be designed as a connector 4, both fixing the main control board 34 and the drive board 35 and providing heat dissipation, simplifying the overall structure and reducing assembly complexity.

[0078] In one embodiment of this application, referring to FIG5, the heat dissipation structure 36 includes:

[0079] Heat dissipation medium 361 is disposed between the main control board 34 and the drive board 35.

[0080] In this embodiment, the heat dissipation medium 361 can be thermal grease, thermal pads, or other highly efficient thermally conductive materials, used to fill the gap between the main control board 34 and the drive board 35, providing a good heat conduction path and reducing thermal resistance. Some types of heat dissipation medium 361 also have a certain degree of elasticity, which can absorb vibration or impact to a certain extent, protecting the main control board 34 and / or drive board 35 from mechanical damage.

[0081] In one embodiment of this application, referring to FIG5, the heat dissipation structure 36 includes:

[0082] Heat sink 362 is disposed in at least one of the main control board 34 and the driver board 35.

[0083] In this embodiment, the heat sink 362 can be made of a metal with high thermal conductivity (such as aluminum or copper), and its large-area fin structure increases the contact area with air, rapidly dissipating heat. Combined with forced convection devices such as fans, the heat dissipation efficiency can be further improved, ensuring that the main control board 34 and / or drive board 35 and the devices on it operate at a suitable temperature. The heat sink 362 can be disposed only on the main control board 34; or, the heat sink 362 can be disposed only on the drive board 35; or the heat sink 362 can be disposed on both the main control board 34 and the drive board 35. Taking the example of heat sink 362 being only installed on drive board 35, drive board 35 has a first side surface S1 and a second side surface S2 that are arranged opposite to each other. The first side surface S1 is set towards the main control board 34, and the second side surface S2 is set away from the main control board 34. The motor drive circuit 33 is set on the first side surface S1, and the heat sink 362 is set on the second side surface S2. With this design, the heat generated by the motor drive circuit 33 can be transferred to the heat sink 362 through drive board 35, and then dissipated to the external environment by heat sink 362, thereby realizing the heat dissipation of motor drive circuit 33.

[0084] Of course, in another embodiment, in conjunction with the above embodiments, when a heat dissipation medium 361 is provided between the main control board 34 and the drive board 35, the heat generated by the motor drive circuit 33 can not only be transferred to the heat sink 362 via the drive board 35, but also be transferred to the main control board 34 via the drive board 35 and the heat dissipation medium 361, and then dissipated via the larger main control board 34, thus realizing heat dissipation through two heat dissipation paths.

[0085] In another embodiment, in conjunction with the above embodiments, when the heat sink 362 is disposed on the drive plate 35 and on the side opposite to the main control board 34, the heat dissipation structure 36 further includes a thermally conductive medium 368. The thermally conductive medium 368 can be made of a material with high thermal conductivity (such as thermal paste, thermal pads, liquid metal, etc.). The thermally conductive medium 368 is used to fill the small gaps or uneven surfaces between the heat sink 362 and the drive plate 35, ensuring good contact between the two, thereby improving the high heat conduction efficiency. The thermally conductive medium 368, disposed between the heat sink 362 and the drive plate 35, can effectively transfer the heat generated by the motor drive circuit 33 from the drive plate 35 to the heat sink 362, reducing thermal resistance, thereby significantly improving the working efficiency of the heat sink 362 and ensuring that the motor drive circuit 33 operates within a safe temperature range. It is worth noting that the thermally conductive medium 368 is also a thermally conductive but non-conductive dielectric layer, which can reduce the probability of short circuits in the drive plate 35 and improve its operational reliability.

[0086] In another embodiment, referring to FIG5, the heat dissipation structure 36 further includes a snap-fit ​​assembly 363 for fixing the heat sink 362 to the main control board 34 and / or the drive board 35.

[0087] In one embodiment of this application, referring to FIG5, the heat dissipation structure 36 includes:

[0088] The pin header 364 is provided on one of the main control board 34 and the drive board 35, and the pin header hole 366 is provided on one of the main control board 34 and the drive board 35.

[0089] The pin header 365 has one end fixed to the pin header seat 364 and the other end passing through the pin header hole 366 to connect the main control board 34 and the drive board 35.

[0090] In this embodiment, the pin header socket 364 can be disposed on one of the main control board 34 and the drive board 35. Correspondingly, the other of the main control board 34 and the drive board 35 is provided with a pin header hole 366 for the pin header 365 to pass through. Taking the pin header socket 364 disposed on the drive board 35 and the main control board 34 provided with a pin header hole 366 for the pin header 365 to pass through as an example, one end of the pin header 365 is fixed to the pin header socket 364, and the other end of the pin header 365 passes through the pin header hole 366. This not only achieves physical fixation of the main control board 34 and the drive board 35, ensuring that the main control board 34 and the drive board 35 will not loosen or fall off due to vibration or external force, but also achieves electrical connection between the main control board 34 and the drive board 35, simplifying wiring and reducing electromagnetic interference problems caused by wire crossings. In addition, this connection method makes the main control board 34 and the drive board 35 easy to separate and reassemble, facilitating maintenance.

[0091] It is important to note that if a material with good thermal conductivity (such as copper or aluminum) is used to manufacture the pin header 365, it can not only transmit electrical signals but also act as an additional heat dissipation channel, transferring heat from the driver board 35 to the main control board 34. Based on this, the pin header 365 can also increase the contact points between the main control boards 34, indirectly expanding the heat dissipation area. This helps the main control boards 34 distribute heat more evenly, improving the overall heat dissipation effect of the electronic control component 3, and thus enhancing the operational stability and reliability of the electronic control component 3.

[0092] In one embodiment, the number of pin headers 365 is generally not limited and can be one, two, or even three. In this embodiment, there are four pin headers 365, which are spaced apart along the length of the pin header 364. Correspondingly, the main control board 34 is provided with four pin header holes 366, and the four pin headers 365 are inserted one-to-one through the four pin header holes 366 to achieve a stable physical and electrical connection between the main control board 34 and the drive board 35.

[0093] Based on the above embodiments, in one embodiment of this application, referring to FIG5, the drive board 35 has a first side surface S1 and a second side surface S2 disposed opposite to each other, and at least one of the first side surface S1 and the second side surface S2 is provided with a heat dissipation layer 367. It can be understood that only the first side surface S1 is provided with a heat dissipation layer 367; or, only the second side surface S2 is provided with a heat dissipation layer 367; or, both the first side surface S1 and the second side surface S2 are provided with heat dissipation layers 367. In this embodiment, both the first side surface S1 and the second side surface S2 are provided with heat dissipation layers 367. The heat dissipation layer 367 of the first side surface S1 is connected to the heat dissipation layer 367 of the second side surface S2 through a heat dissipation via of the drive board 35. The motor drive circuit 33 is disposed on the heat dissipation layer 367 of the first side surface S1, and the heat sink 362 is disposed on the heat dissipation layer 367 of the second side surface S2. The heat dissipation layer 367 can specifically be a copper layer. The heat generated by the motor drive circuit 33 can be transferred to the copper layer on the first side surface S1. On one hand, the heat is transferred through the copper layer on the first side surface S1 to the heat dissipation medium 361, and then through the heat dissipation medium 361 to the larger main control board 34 for heat dissipation. On the other hand, the heat is transferred through the heat dissipation holes of the drive board 35 to the copper layer on the second side surface S2, and then through the copper layer on the second side surface S2 to the radiator 362, from which it is dissipated to the external environment, thus achieving dual-path heat dissipation for the motor drive circuit 33. Each copper layer has good heat dissipation performance, which can accelerate the heat dissipation efficiency of the motor drive circuit 33 and improve the heat dissipation performance of the gas water heater 100.

[0094] In another embodiment of this application, referring to FIG5, the main control board 34 has a third side surface S3 and a fourth side surface S4 disposed opposite to each other, and at least one of the third side surface S3 and the fourth side surface S4 is provided with a heat dissipation layer 367. This can be understood as follows: only the third side surface S3 is provided with a heat dissipation layer 367; or only the fourth side surface S4 is provided with a heat dissipation layer 367; or both the third side surface S3 and the fourth side surface S4 are provided with heat dissipation layers 367. In this embodiment, both the third side surface S3 and the fourth side surface S4 are provided with heat dissipation layers 367. The heat dissipation layer 367 of the third side surface S3 is connected to the heat dissipation layer 367 of the fourth side surface S4 through a heat dissipation via of the main control board 34, and the heat dissipation layer 367 of the fourth side surface S4 is disposed facing the heat dissipation layer 367 of the first side surface S1. The heat dissipation layer 367 can be a copper layer. The heat generated by the motor drive circuit 33 is transferred to the copper layer on the fourth side surface S4 via the heat dissipation medium 361, and then transferred to the copper layer on the third side surface S3 via the heat dissipation vias of the main control board 34. The two copper layers work together to dissipate the heat transferred from the drive board 35 and the heat generated by the main control circuit 32 on the main control board 34, thereby improving the heat dissipation performance of the gas water heater 100.

[0095] In one embodiment of this application, referring to FIG6, the electronic control component 3 further includes:

[0096] Functional module 37 is disposed on the main control board 34 and the drive board 35. Functional module 37 includes at least one of the following: switching power supply module 371, flame sensing needle module 372, ignition module 373, gas valve control module 374, gas proportional valve module 375, sensor module 376, thermostat module 377, and display module 378.

[0097] It is understood that functional modules 37, such as the switching power supply module 371, flame sensor module 372, ignition module 373, gas valve control module 374, gas proportional valve module 375, sensor module 376, thermostat module 377, and display module 378, can be installed on the main control board 34 and / or drive board 35 according to actual design requirements. By rationally distributing different functional modules 37 to the main control board 34 and drive board 35, the load on a single board can be reduced, improving the overall operating efficiency of the gas water heater 100. Furthermore, the separate design of different functional modules 37 reduces mutual interference between modules, improving the stability and fault tolerance of the gas water heater 100. In this embodiment, the switching power supply module 371 is installed on the main control board 34. The switching power supply module 371 provides a stable and reliable power supply to the entire electronic control assembly 3, ensuring that all circuits and components can operate normally. The flame sensing module can be located on the main control board 34 and / or near the burner. It detects the burner's combustion status, ensuring normal flame combustion, and promptly feeds back to the main control circuit 32 when the burner extinguishes, triggering the main control circuit 32's safety protection mechanism. The ignition module 373, located on the main control board 34, generates a high-voltage electric spark to ignite the gas, a crucial component for starting the gas-fired water heater 100. The gas valve control module 374, also on the main control board 34, precisely controls the gas flow based on the control signal output from the main control circuit 32, ensuring combustion efficiency and safety. The gas proportional valve module 375, located on the main control board 34, works in conjunction with the gas valve control module 374 to adjust the gas supply to meet different heating demands and optimize the combustion process. Sensor module 376, located on main control board 34, may include water temperature sensor, water flow sensor, etc., and is electrically connected to main control circuit 32 on main control board 34 via signal lines. It is used to monitor parameters such as water temperature, water flow, and ambient temperature in real time, providing decision-making basis for main control circuit 32. Thermostat module 377, also located on main control board 34, receives and processes detection signals from sensor module 376, and automatically adjusts the heating function according to the set temperature range to maintain a constant water temperature in gas water heater 100. Display module 378, located on main control board 34 and on the operation panel of gas water heater 100, displays the operating status, temperature, and fault information of gas water heater 100, enhancing user experience.

[0098] In one embodiment of this application, referring to FIG6, the electronic control component 3 further includes:

[0099] The communication circuit 38 is used to communicate with the main control circuit 32. The signal input terminal of the communication circuit 38 is used to receive control signals, and the signal output terminal of the communication circuit is connected to the signal input terminal of the motor drive circuit. The signal output terminal of the motor drive circuit 33 is connected to the motor 2. The motor drive circuit 33 is used to receive the control signals output by the main control circuit 32 through the communication circuit 38, and control the motor 2 to work according to the control signals.

[0100] It is understood that the signal input terminal of the communication circuit 38 is used to receive external or internal control signals, which can be user commands, sensor data, or commands issued by other control systems. In this embodiment, the signal input terminal of the communication circuit 38 receives the control signal output by the control circuit. The communication circuit 38 acts as an intermediary, responsible for establishing a stable communication channel between the main control circuit 32 and the motor drive circuit 33, ensuring accurate transmission of the control signal. The output terminal of the motor drive circuit 33 is directly connected to the motor 2, converting the received control signal into an actual motor drive signal, thereby controlling the operating state of the motor 2 (such as start, stop, speed adjustment, etc.). Centralized management of signal transmission through the communication circuit 38 reduces the number of direct connections between the main control circuit 32 and the motor drive circuit 33, making the wiring of the electronic control component 3 simpler and more organized.

[0101] Understandably, traditional water heater control systems use PWM duty cycle communication to communicate with motor 2. Wiring typically requires VDD, GND, the PWM signal, and the speed feedback signal—four wires for electrical control communication. In contrast, integrated drive and main control solutions only require three wires (U, V, W) to directly drive motor 2. This results in more wires and higher costs. Furthermore, with PWM duty cycle communication, if the chip's clock frequency in the main control circuit 32 has an error, both the transmitted and received duty cycles may be inaccurate. Specifically, a higher clock frequency leads to a smaller duty cycle, and a lower clock frequency leads to a larger duty cycle. This clock frequency error affects the counting accuracy of the timer in the main control circuit 32, thus affecting the calculation of the PWM duty cycle and consequently the starting target value for motor 2 control.

[0102] In one embodiment of this application, referring to FIG6, the communication circuit 38 includes at least one of a UART communication circuit, an I2C communication circuit, and an SPI communication circuit.

[0103] In this embodiment, the communication circuit 38 is a UART communication circuit, but it is not limited to I2C communication circuits, SPI communication circuits, or other communication circuits. By setting up the aforementioned communication circuit 38, the main control circuit 32 sends at least one of the following to the motor drive circuit 33: drive mode, target speed, power, voltage, and current. The motor drive circuit 33 then drives the motor 2 to operate as required and reports the operating status, speed, current, power, mode, and operating faults (e.g., start-up failure, overheating, short circuit, stall, overvoltage, undervoltage) to the main control circuit 32 via the communication circuit 38. Because this type of communication involves verification, it has high data accuracy. The target speed can be accurately communicated to the target motor 2, and the motor 2 can accurately feed back its current speed to the main control circuit 32. The communication transmission error is generally 1%-3%, which can further improve the accuracy of the output speed or duty cycle, thus enhancing the control precision of the gas-fired water heater 100. Furthermore, by using this communication circuit 38, the connector 4 between the motor drive circuit 33 and the motor 2 can be changed from the existing four wire harnesses to three wire harnesses. The three wire harnesses form a three-phase wire harness, specifically a U-phase power connection line, a V-phase power connection line, and a W-phase power connection line, further reducing costs.

[0104] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A gas-fired water heating apparatus (100), wherein, The gas-fired water heater (100) includes: Shell (1); The motor (2) is disposed inside the housing (1); An electronic control component (3) is disposed inside the housing (1) and spaced apart from the motor (2). The electronic control component (3) is electrically connected to the motor (2) via a connector (4).

2. The gas water heating apparatus (100) as claimed in claim 1, wherein, The electronic control component (3) includes: Electronic control board (31); The main control circuit (32) is located on the electronic control board (31); The motor drive circuit (33) is located on the electronic control board (31). The motor drive circuit (33) is electrically connected to the main control circuit (32) and the motor (2) respectively. The motor drive circuit (33) is used to drive the motor (2) to work.

3. The gas water heating apparatus (100) according to claim 1 or 2, wherein The electronic control component (3) includes: Main control board (34), on which a main control circuit (32) is provided; A drive board (35) is provided with a motor drive circuit (33). The motor drive circuit (33) is electrically connected to the main control circuit (32) and the motor (2) respectively. The motor drive circuit (33) is used to drive the motor (2) to work.

4. The gas water heating apparatus (100) as claimed in claim 3, wherein, The motor (2) is a fan; And / or, the motor (2) is a water pump.

5. The gas water heating apparatus (100) as claimed in claim 4, wherein, When the motor (2) is a fan and a water pump, there are two drive plates (35), namely the first drive plate (351) and the second drive plate (352). The first drive board (351) is provided with a fan drive circuit (331), which is electrically connected to the main control circuit (32) and the fan respectively. The fan drive circuit (331) is used to drive the fan to work. The second drive board (352) is provided with a water pump drive circuit (332), which is electrically connected to the main control circuit (32) and the water pump respectively. The water pump drive circuit (332) is used to drive the water pump to work.

6. The gas water heating apparatus (100) according to any one of claims 3 to 5, wherein The main control board (34) and the drive board (35) are spaced apart. The electronic control component (3) also includes a heat dissipation structure (36), which is disposed on at least one of the main control board (34) and the drive board (35). And / or, the main control board (34) is connected to the drive board (35) through the heat dissipation structure (36) so as to dissipate heat from the drive board (35) and the main control board (34) through the heat dissipation structure (36).

7. The gas water heating apparatus (100) as claimed in claim 6, wherein, The heat dissipation structure (36) includes: A heat dissipation medium (361) is disposed between the main control board (34) and the drive board (35); And / or, the heat dissipation structure (36) includes: A heat sink (362) is disposed in at least one of the main control board (34) and the drive board (35); And / or, the heat dissipation structure (36) includes: A pin header (364) is provided on one of the main control board (34) and the drive board (35), and a pin header hole (366) is provided on one of the main control board (34) and the drive board (35). A pin header (365) is provided, one end of which is fixed to the pin header seat (364), and the other end of which passes through the pin header hole (366) to connect the main control board (34) and the drive board (35).

8. The gas water heating apparatus (100) as claimed in claim 7, wherein, When the heat dissipation structure (36) includes a heat sink (362), the heat sink (362) is disposed on the drive plate (35) on the side opposite to the main control board (34); The heat dissipation structure (36) further includes a heat-conducting medium (368), which is disposed between the heat sink (362) and the drive plate (35).

9. The gas water heating apparatus (100) according to any one of claims 3 to 8, wherein, The electronic control component (3) also includes: Functional module (37), which is located on the main control board (34) and the drive board (35), includes at least one of the following: switching power supply module (371), flame sensing needle module (372), ignition module (373), gas valve control module (374), gas proportional valve module (375), sensor module (376), thermostat module (377), and display module (378).

10. The gas water heating apparatus (100) according to any one of claims 2 to 9, wherein, The electronic control component (3) also includes: The communication circuit (38) is used to communicate with the main control circuit (32). The signal input terminal of the communication circuit (38) is used to receive control signals. The signal output terminal of the communication circuit (38) is connected to the signal input terminal of the motor drive circuit (33). The signal output terminal of the motor drive circuit (33) is connected to the motor (2). The motor drive circuit (33) is used to receive the control signals output by the main control circuit (32) through the communication circuit (38) and control the motor (2) to work according to the control signals.

11. The gas water heating apparatus (100) as claimed in claim 10, wherein, The communication circuit (38) includes at least one of a UART communication circuit, an I2C communication circuit, and an SPI communication circuit.

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