Circuit board assembly and electronic device

Abstract

Provided in the present application are a circuit board assembly and an electronic device, relating to the technical field of electronic devices. The present invention is used for solving the problem that due to the reduction of the internal space of electronic devices, the size of main boards is limited, which is not conducive to providing a large number of electronic devices on the main boards. The circuit board assembly comprises a first circuit board, a second circuit board, a frame board, and a support assembly. The first circuit board and the second circuit board are stacked. The frame board is disposed between the first circuit board and the second circuit board. The support assembly is supported between the first circuit board and the second circuit board, and is spaced apart from the frame board. The circuit board assembly is applied to electronic devices as a main board.

Description

A circuit board assembly and an electronic device

[0001] This application claims priority to Chinese Patent Application No. 202510128011.6, filed on January 27, 2025, entitled "A Circuit Board Assembly and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic equipment technology, and more particularly to a circuit board assembly and an electronic device. Background Technology

[0003] The motherboard of an electronic device connects various electronic components to enable communication between them, allowing the device to perform various functions. With the trend towards thinner and lighter electronic devices, the internal space is constantly shrinking, further compressing the space available for the motherboard. This limits the size of the motherboard, making it difficult to accommodate a large number of electronic components. Summary of the Invention

[0004] This application provides a circuit board assembly and an electronic device to solve the problem that the reduced internal space of the electronic device leads to a limitation on the size of the motherboard, which is not conducive to setting up a large number of electronic components on the motherboard.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, a circuit board assembly is provided, comprising a first circuit board, a second circuit board, a frame board, and a support assembly. The first circuit board and the second circuit board are stacked. The frame board is disposed between the first circuit board and the second circuit board. The support assembly is supported between the first circuit board and the second circuit board, and the support assembly and the frame board are spaced apart.

[0007] The circuit board assembly provided in the first aspect of this application can increase the area of ​​the first circuit board, that is, increase the area of ​​the suspended area of ​​the first circuit board extending beyond the frame plate, thereby increasing the area on the first circuit board where electronic devices can be mounted. Furthermore, the support assembly can provide support for the suspended area of ​​the first circuit board extending beyond the frame plate, reducing the risk of the first circuit board bending and deforming due to excessive weight of the electronic devices it carries, thus improving the reliability of the circuit board assembly.

[0008] In one possible implementation of the first aspect of this application, the circuit board assembly further includes reinforcing ribs disposed on the surface of the first circuit board, and at least a portion of the vertical projection of the reinforcing ribs onto the second circuit board is located outside the vertical projection of the frame plate onto the second circuit board. In this structure, by providing reinforcing ribs on the first circuit board, the strength of the first circuit board is improved, thereby further reducing the risk of damage caused by bending deformation of the first circuit board.

[0009] In one possible implementation of the first aspect of this application, the reinforcing rib includes a first reinforcing rib, and multiple first reinforcing ribs are provided, which are distributed circumferentially around the frame plate. This structure helps to improve the strength of the suspended area of ​​the first circuit board, thereby ensuring the reliability of the first circuit board.

[0010] In one possible implementation of the first aspect of this application, a first reinforcing rib extends from the central region of the first circuit board to the edge region; the reinforcing rib includes a second reinforcing rib that extends circumferentially around the frame plate and is fixedly connected to a plurality of first reinforcing ribs. In this structure, the first and second reinforcing ribs are cross-fixed to form a mesh-like reinforcing rib structure, which is more conducive to improving the strength of the first circuit board.

[0011] In one possible implementation of the first aspect of this application, reinforcing ribs are provided on both sides of the first circuit board. This structure further enhances the strength of the first circuit board. Exemplarily, the reinforcing ribs on both sides of the first circuit board can be distributed in exactly the same structure, or they can be distributed in different structures on the two surfaces of the first circuit board.

[0012] In one possible implementation of the first aspect of this application, the surface of the first circuit board is used to mount electronic devices, and multiple electronic devices are mounted at intervals, with reinforcing ribs disposed in the gaps between adjacent electronic devices. In this structure, the reinforcing ribs do not occupy the area on the surface of the first circuit board used for mounting electronic devices, which is beneficial to the rationality of the electronic device layout.

[0013] In one possible implementation of the first aspect of this application, the support component includes a shielding cover fixed to the surface of the second circuit board facing the first circuit board. The shielding cover is located outside the frame plate and connected to the surface of the first circuit board facing the second circuit board. In this structure, using a shielding cover disposed on the second circuit board as the support component helps save space on the second circuit board, thereby increasing the number of electronic devices mounted on the circuit board assembly and improving the overall structural reliability.

[0014] In one possible implementation of the first aspect of this application, the shielding cover is welded and fixed to the first circuit board.

[0015] In one possible implementation of the first aspect of this application, a plurality of first protrusions are provided on the surface of the shielding cover facing the first circuit board, and a plurality of second protrusions are provided on the surface of the first circuit board facing the shielding cover. Along the stacking direction of the first and second circuit boards, the plurality of first protrusions and the plurality of second protrusions are arranged in a one-to-one correspondence, and the first protrusions are soldered to their corresponding second protrusions. For example, the first protrusions on the shielding cover can be formed by stamping from the inner surface of the shielding cover outwards using a stamping process, which helps to reduce the difficulty of the process. The second protrusions on the first circuit board can be solder pads.

[0016] In one possible implementation of the first aspect of this application, a first insulating protrusion is provided on the shielding cover, and the first insulating protrusion is disposed between two adjacent first protrusions; a second insulating protrusion is provided on the first circuit board, and the second insulating protrusion is disposed between two adjacent second protrusions. This structure avoids the soldering areas from forming large sheets, thereby reducing the risk of cracks appearing in the soldering areas.

[0017] In one possible implementation of the first aspect of this application, the circuit board assembly includes an adhesive layer that bonds and fixes the shielding cover to the first circuit board. Exemplarily, double-sided adhesive can be used as the adhesive layer, or the adhesive layer can be filled into the gap between the shielding cover and the first circuit board using an underfill process.

[0018] In one possible implementation of the first aspect of this application, a plurality of raised structures are provided on the shielding cover or the first circuit board, and an adhesive layer covers the plurality of raised structures. This structure increases the coverage area of ​​the adhesive layer, making the adhesion stronger and improving the reliability of the adhesion.

[0019] In one possible implementation of the first aspect of this application, the protrusion structure includes a third protrusion and a fourth protrusion. A plurality of third protrusions are provided on the surface of the shield facing the first circuit board, and a plurality of fourth protrusions are provided on the surface of the first circuit board facing the shield. This structure can further increase the coverage area of ​​the adhesive layer, thereby further improving the reliability of the adhesion.

[0020] In one possible implementation of the first aspect of this application, the vertical projections of a plurality of third protrusions and a plurality of fourth protrusions on the first circuit board are staggered. This structure helps to reduce the gap between the shield and the first circuit board, thereby helping to reduce the thickness of the circuit board assembly.

[0021] In one possible implementation of the first aspect of this application, the circuit board assembly includes a fastener, with a first end connected to a first circuit board and a second end connected to a shielding cover. In this structure, the first circuit board and the shielding cover are fixedly connected by fasteners such as screws and bolts, forming a support between them, making installation simpler and more convenient.

[0022] In one possible implementation of the first aspect of this application, the fastener includes a limiting portion and a connecting portion. The limiting portion is disposed on the side of the first circuit board away from the shielding cover. A through hole is formed on the first circuit board. One end of the connecting portion is connected to the limiting portion, and the other end of the connecting portion passes through the through hole and is connected to the shielding cover. In this structure, the fastener can be a screw, i.e., the head of the screw is the limiting portion, and the shank of the screw is the connecting portion, so that the fastener can be connected between the first circuit board and the shielding cover. Alternatively, the fastener can be a screw and a nut, with the nut as the limiting portion and the screw as the connecting portion. One end of the connecting portion is threadedly connected to the limiting portion, and the other end of the connecting portion is connected to the shielding cover.

[0023] In one possible implementation of the first aspect of this application, a first threaded hole is provided on the shielding cover, and the end of the connecting portion extends into the first threaded hole so that the connecting portion is threadedly connected to the shielding cover. With this structure, the fastener is threadedly connected to the shielding cover, eliminating the need for other structural components and thus reducing costs.

[0024] In one possible implementation of the first aspect of this application, the circuit board assembly includes a boss disposed on the surface of the shielding cover facing the first circuit board, and the boss abuts against the first circuit board. In this structure, the boss abuts against the shielding cover to form support between the shielding cover and the first circuit board, eliminating the need for the shielding cover to directly contact the first circuit board, which helps to reduce the thickness of the shielding cover.

[0025] In one possible implementation of the first aspect of this application, the circuit board assembly includes a first stud fixed to a shielding cover. The first stud has a second threaded hole, and the end of a connecting portion extends into the second threaded hole to achieve a threaded connection between the connecting portion and the first stud. In this structure, the fastener is threadedly connected to the second stud fixed to the shielding cover; therefore, no additional threading steps are required on the shielding cover, which helps reduce processing difficulty. Exemplarily, the first stud can be welded or bonded to the shielding cover.

[0026] In one possible implementation of the first aspect of this application, the circuit board assembly includes a first buffer member abutting between a first stud and a first circuit board. In this structure, the first buffer member can absorb impact energy to reduce the risk of bending deformation of the circuit board assembly. Exemplarily, the first buffer member can be made of a flexible material, such as foam or a rubber layer. Alternatively, the first buffer member can also be an elastic component such as a spring.

[0027] In one possible implementation of the first aspect of this application, a third threaded hole is formed on the end face of the first stud facing the shield; the circuit board assembly includes a second stud and a connector, the second stud is fixed to the second circuit board and located inside the shield, and a fourth threaded hole is formed on the second stud. One end of the connector passes through the shield and extends into the third threaded hole, so that the connector is threadedly connected to the first stud; the other end of the connector extends into the fourth threaded hole, so that the connector is threadedly connected to the second stud. In this structure, the connector can form a support between the shield and the second circuit board, thereby further improving the support effect between the first circuit board and the second circuit board.

[0028] In one possible implementation of the first aspect of this application, the circuit board assembly includes a second buffer member, which abuts against the second stud and the shielding cover along the stacking direction of the first and second circuit boards. In this structure, the second buffer member can absorb impact energy to reduce the risk of bending deformation of the circuit board assembly. Exemplarily, the second buffer member can be made of a flexible material, such as foam or a rubber layer. Alternatively, the second buffer member can also be an elastic component such as a spring.

[0029] In one possible implementation of the first aspect of this application, the support component further includes an elastic element that abuts against the shielding cover and the first circuit board. In this structure, the support between the shielding cover and the first circuit board can be provided solely by the elastic element, which on the one hand provides support for the first circuit board, and on the other hand absorbs impact energy, reducing the risk of bending deformation of the first circuit board. Exemplarily, the elastic element can be made of a flexible material, such as foam or a rubber layer. Alternatively, the elastic element can also be a spring or other elastic component.

[0030] In one possible implementation of the first aspect of this application, the support component includes a first structural member abutting between a first circuit board and a second circuit board. In this structure, the first structural member directly abuts between the first and second circuit boards to improve the support effect between them. For example, the first structural member can be made of a metal material such as copper or aluminum. Furthermore, the first structural member can abut against the edge region of the first circuit board, thereby further improving the support effect on the first circuit board.

[0031] In one possible implementation of the first aspect of this application, the first structural member is welded and fixed to the second circuit board, and the circuit board assembly further includes a third buffer member abutting between the first structural member and the first circuit board. In this structure, the third buffer member can absorb impact energy to reduce the risk of bending deformation of the circuit board assembly. Exemplarily, the third buffer member can be made of a flexible material, such as foam or a rubber layer. Alternatively, the third buffer member can also be an elastic component such as a spring.

[0032] In one possible implementation of the first aspect of this application, the circuit board assembly further includes a third circuit board, which is stacked between the first and second circuit boards. The third circuit board is connected to the first circuit board via a frame board, and the third circuit board is connected to the second circuit board via another frame board. With this structure, the circuit board assembly can have multiple circuit boards, which is beneficial for further increasing the number of electronic devices that can be installed.

[0033] In a second aspect, an electronic device is provided, comprising a housing and a motherboard, wherein the motherboard is a circuit board assembly as described in any of the above technical solutions, and the motherboard is disposed within the housing.

[0034] The electronic device provided in the second aspect of this application, by including the circuit board assembly as described in any of the above technical solutions, is able to solve the same technical problem and achieve the same technical effect.

[0035] In one possible implementation of the second aspect of this application, the outer casing includes a middle frame and a rear cover. The circuit board assembly is fixed to the middle frame, and a second structural member is disposed on the inner surface of the rear cover, abutting against the circuit board assembly. In this structure, the second structural member abuts between the rear cover and the circuit board assembly to improve the support effect between the two. For example, the second structural member can be made of metal materials such as copper or aluminum. Furthermore, the second structural member can be symmetrically disposed on both sides of the first circuit board with the first structural member, thereby further improving the support effect on the first circuit board.

[0036] In one possible implementation of the second aspect of this application, the electronic device includes a fourth buffer member abutting between the second structural member and the circuit board assembly. In this configuration, the fourth buffer member can absorb impact energy to reduce the risk of bending deformation of the circuit board assembly. Exemplarily, the fourth buffer member can be made of a flexible material, such as foam or a rubber layer. Alternatively, the fourth buffer member can also be an elastic component such as a spring. Attached Figure Description

[0037] Figure 1 is a structural diagram of an electronic device provided in an embodiment of this application;

[0038] Figure 2 is an exploded view of an electronic device provided in an embodiment of this application;

[0039] Figure 3 is an internal structure diagram of an electronic device provided in an embodiment of this application;

[0040] Figure 4 is a structural diagram of another electronic device provided in an embodiment of this application;

[0041] Figure 5 is a front view of another electronic device provided in the embodiment of this application in an unfolded state;

[0042] Figure 6 is a front view of another electronic device in a folded state provided in an embodiment of this application;

[0043] Figure 7 is an internal structure diagram of another electronic device provided in an embodiment of this application;

[0044] Figure 8 is an internal structure diagram of another electronic device (with the motherboard located in the middle frame) provided in an embodiment of this application;

[0045] Figure 9 is an internal structure diagram of another electronic device (with the motherboard located in the middle frame on both sides) provided in an embodiment of this application;

[0046] Figure 10 is an internal structure diagram of another electronic device provided in an embodiment of this application;

[0047] Figure 11 is a structural diagram of the circuit board assembly provided in an embodiment of this application;

[0048] Figure 12 is a structural diagram of the frame plate provided in an embodiment of this application;

[0049] Figure 13 is a structural diagram of the RF board provided in an embodiment of this application;

[0050] Figure 14 is a structural diagram of a circuit board assembly provided in an embodiment of this application;

[0051] Figure 15 is a schematic diagram of the electronic devices disposed on the circuit board assembly provided in the embodiment of this application;

[0052] Figure 16 is a structural diagram of a first type of support component for a circuit board assembly provided in an embodiment of this application;

[0053] Figure 17 is a structural diagram of the second protrusion of the circuit board assembly shown in Figure 16;

[0054] Figure 18 is a structural diagram of the first protrusion of the circuit board assembly shown in Figure 16;

[0055] Figure 19 is a schematic diagram of the structure of the first protrusion and the second protrusion before welding, as shown in Figure 16;

[0056] Figure 20 is a structural diagram of the second circuit board soldering electronic device of the circuit board assembly provided in the embodiment of this application;

[0057] Figure 21 is a structural diagram of the welding frame plate on the second circuit board provided in Figure 20;

[0058] Figure 22 is a structural diagram of the first circuit board welding electrical components of the circuit board assembly provided in the embodiment of this application;

[0059] Figure 23 is a structural diagram of the frame board and the first shielding cover provided in Figure 21 undergoing tin plating;

[0060] Figure 24 is a structural diagram of the first and second circuit boards provided in Figure 23 during the soldering process;

[0061] Figure 25 is a structural diagram of a second type of support component for the circuit board assembly provided in an embodiment of this application;

[0062] Figure 26 is a structural diagram of another adhesive layer provided in an embodiment of this application;

[0063] Figure 27 is a structural diagram of a third type of support component for the circuit board assembly provided in an embodiment of this application;

[0064] Figure 28 is a top view of the first circuit board of the circuit board assembly shown in Figure 27;

[0065] Figure 29 is a top view of the second circuit board of the circuit board assembly shown in Figure 27;

[0066] Figure 30 is a structural diagram of the fourth type of support component for the circuit board assembly provided in the embodiments of this application;

[0067] Figure 31 is a structural diagram of the fifth type of support component for the circuit board assembly provided in the embodiments of this application;

[0068] Figure 32 is an enlarged view of the support component shown in Figure 31;

[0069] Figure 33 is a structural diagram of the sixth type of support component for the circuit board assembly provided in the embodiments of this application;

[0070] Figure 34 is a structural diagram of the boss provided in Figure 33;

[0071] Figure 35 is a structural diagram of the seventh type of support component for the circuit board assembly provided in the embodiments of this application;

[0072] Figure 36 is a structural diagram of another elastic element of the support assembly provided in Figure 35;

[0073] Figure 37 is a structural diagram of the eighth type of support component for the circuit board assembly provided in the embodiments of this application;

[0074] Figure 38 is a structural diagram of the ninth type of support component for the circuit board assembly provided in the embodiments of this application;

[0075] Figure 39 is a structural diagram of another circuit board assembly provided in an embodiment of this application;

[0076] Figure 40 is a structural diagram of another circuit board assembly provided in an embodiment of this application;

[0077] Figure 41 is a structural diagram of the distribution of reinforcing ribs provided in an embodiment of this application.

[0078] Reference numerals: 01-Electronic device; 10-Display module; 11-Light-transmitting cover; 12-Display screen; 13-First part; 14-Second part; 20-Housing shell; 21-Back cover; 21a-Second structural component; 21b-Fourth buffer component; 22-Middle frame; 22a-Frame; 22b-Middle plate; 23-Hinge mechanism; 30-Main board; 40-Battery; 50-Electronic components; 60-Sub-board; 70-FPC board; 80-Sub-screen; 90-Circuit board assembly; 91-Circuit board; 91a-RF board; 91b-AP board; 92-Frame board; 93-First circuit board; 93a-First area; 93b-Second area; 93c-Second protrusion; 93d-Second insulating protrusion; 93e-Fourth protrusion; 94-Second circuit board; 95-Support assembly ; 100-First shielding cover; 110-First protrusion; 120-First insulating protrusion; 130-Third protrusion; 140-First threaded hole; 150-Boss; 200-Adhesive layer; 300-Fastener; 310-Limiting part; 320-Connecting part; 400-First stud; 410-Second threaded hole; 420-Third threaded hole; 500-Second stud; 510-Fourth threaded hole; 600-Connector; 700-Elastic part; 710-First buffer; 720-Second buffer; 730-Third buffer; 800-Boss; 900-First structural part; 96-Second shielding cover; 97-Third circuit board; 98-Reinforcing rib; 98a-First reinforcing rib; 98b-Second reinforcing rib; 02-Solder ball; 03-Pressure block; 04-Tooling. Detailed Implementation

[0079] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0080] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0081] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0082] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral part; it may be a direct connection or an indirect connection through an intermediate medium.

[0083] This application provides an electronic device. Specifically, the electronic device can be a portable electronic device or other types of electronic devices. For example, the electronic device can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), monitor, camera, personal computer, laptop computer, wearable device, etc. For ease of explanation, the following description uses a mobile phone as an example.

[0084] In some embodiments, please refer to Figures 1, 2, and 3. Figure 1 is a structural diagram of an electronic device 01 provided in an embodiment of this application; Figure 2 is an exploded view of an electronic device 01 provided in an embodiment of this application; and Figure 3 is an internal structural diagram of an electronic device 01 provided in an embodiment of this application. The electronic device 01 can be a candybar phone, and it can have an approximately rectangular plate-like structure. The electronic device 01 may include a display module 10, a casing 20, a motherboard 30, and a battery 40.

[0085] For ease of description below, an XYZ coordinate system is established, defining the width direction of electronic device 01 as the X-axis, the length direction of electronic device 01 as the Y-axis, and the thickness direction of electronic device 01 as the Z-axis. It is understood that the coordinate system of electronic device 01 can be flexibly set according to actual needs; this application only provides one example and should not be considered a specific limitation of this application. Figures 1 and 2 only schematically show some components included in electronic device 01; the actual shape, size, position, and structure of these components are not limited by Figures 1 and 2.

[0086] The aforementioned display module 10 is used to display images, videos, etc. The display module 10 may include a light-transmitting cover 11 and a display screen 12 (also known as a display panel), with the light-transmitting cover 11 and the display screen 12 stacked together. The material of the light-transmitting cover 11 includes, but is not limited to, glass. For example, the light-transmitting cover 11 can be a common light-transmitting cover 11, used to protect the display screen 12 from damage caused by external forces and to provide dust protection. Alternatively, the light-transmitting cover 11 can also be a touch-enabled light-transmitting cover 11, enabling the electronic device 01 to have touch functionality, thus making it more convenient for users. Therefore, this application does not specifically limit the material of the light-transmitting cover 11.

[0087] Furthermore, the aforementioned display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode display screen, a micro light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0088] The aforementioned housing 20 is used to protect the electronic components 50 inside the electronic device 01. The housing 20 may include a back cover 21 and a frame 22a. The back cover 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11 and is stacked with the light-transmitting cover plate 11 and the display screen 12. The frame 22a is located between the light-transmitting cover plate 11 and the back cover 21. The frame 22a is fixed to the back cover 21. Exemplarily, the frame 22a can be fixed to the back cover 21 by means of adhesive, threaded connection, welding, snap-fit, etc.; or, the frame 22a can also be integrally formed with the back cover 21, that is, the frame 22a and the back cover 21 form a structural unit. The light-transmitting cover plate 11 can be fixed to the frame 22a by adhesive, so that the light-transmitting cover plate 11, the back cover 21 and the frame 22a form a receiving cavity inside the electronic device 01, and the aforementioned motherboard 30 and electronic components 50 can be disposed in this receiving cavity.

[0089] Furthermore, the aforementioned housing 20 may also include a middle plate 22b, which is disposed within the aforementioned receiving cavity and located on the side of the display screen 12 away from the light-transmitting cover plate 11. The middle plate 22b is fixedly connected to the frame 22a to form the middle frame 22 of the electronic device 01. Exemplarily, the middle plate 22b and the frame 22a can be fixedly connected by adhesive, threaded connection, welding, snap-fit, or other methods; alternatively, the middle plate 22b and the frame 22a can also be an integrally formed structure, i.e., the middle plate 22b and the frame 22a form a single structural component. The middle plate 22b divides the aforementioned receiving cavity into two independent spaces. One space is located between the light-transmitting cover plate 11 and the middle plate 22b, and the display screen 12 is located within this space. The other space is located between the middle plate 22b and the rear cover 21, and the aforementioned mainboard 30 is located within this space.

[0090] The aforementioned motherboard 30 is used to house the electronic components 50 inside the electronic device 01 and to enable electrical connections between the electronic components 50. The motherboard 30 can be fixed to the middle plate 22b by means of adhesive bonding, threaded connection, welding, snap-fit, etc. Therefore, this application does not impose any special limitations on the fixing method of the motherboard 30.

[0091] The battery 40 is used to power the electronic device 01. The battery 40 can be connected to the motherboard 30 via a flexible connector 600. For example, the flexible connector 600 can be an FPC board 70 (Flexible Printed Circuit, flexible circuit board 91), so that the battery 40 can power the various electronic components 50 of the electronic device 01 through the circuit board 91.

[0092] For example, the electronic device 50 described above can realize various functions of the electronic device 01. For example, the electronic device 50 can be a control chip (e.g., a system-on-chip, SOC), a graphics processing unit (GPU), universal flash storage (UFS), a camera module, a flash module, a speaker, a Type-C interface module, etc.

[0093] In some possible examples, the aforementioned electronic device 01 may also include a sub-board 60. For example, along the Y-axis, the main board 30 and the sub-board 60 may be respectively disposed on both sides of the battery 40, and the main board 30 and the sub-board 60 may also be electrically connected through the aforementioned FPC board 70. The aforementioned SOC chip, camera module, flash module, and other electronic devices 50 may be disposed on the main board 30, while the aforementioned speaker and Type-C interface module may be disposed on the sub-board 60.

[0094] In other embodiments, please refer to Figures 4, 5, and 6. Figure 4 is a structural diagram of another electronic device 01 provided in this application embodiment, Figure 5 is a front view of another electronic device 01 provided in this application embodiment in an unfolded state, and Figure 6 is a front view of another electronic device 01 provided in this application embodiment in a folded state. This electronic device 01 can be a foldable screen phone, including a display module 10 and a housing 20. The display module 10 is a foldable screen, supported and attached to the housing 20, which allows the display module 10 to rotate between the unfolded and folded states. It is understood that Figures 4, 5, and 6 only schematically show some components of the electronic device 01; the actual shape, size, position, and structure of these components are not limited by the structures shown in Figures 4, 5, and 6.

[0095] Specifically, the display module 10 may include a plurality of first portions 13 and at least one second portion 14, with a second portion 14 disposed between two adjacent first portions 13, and the plurality of first portions 13 are sequentially distributed along the aforementioned X-axis direction. When the display module 10 is in a folded state, the second portion 14 of the display module 10 is bent, and the plurality of first portions 13 are stacked along the Z-axis direction. At least the second portion 14 of the display module 10 uses a flexible screen, and the first portion 13 of the display module 10 may use a flexible screen, a non-flexible screen, or a combination of both. Therefore, this application does not impose specific limitations in this regard.

[0096] The aforementioned housing 20 may include multiple housings and at least one pivot mechanism 23. A pivot mechanism 23 is provided between two adjacent housings. The electronic device 01 shown in Figures 4-6 includes two housings and a pivot mechanism 23, that is, the electronic device 01 is a two-folding device. The aforementioned display module 10 also includes two corresponding first parts 13 and a second part 14.

[0097] The housing includes the aforementioned middle frame 22 and rear cover 21. The rear cover 21 and the first part 13 of the display module 10 are respectively fixed to both sides of the middle frame 22. Two adjacent middle frames 22 are rotatably connected by a rotating mechanism, thereby enabling the electronic device 01 to rotate between the unfolded state and the folded state. The first part 13 of the display module 10 is correspondingly attached to the middle frame 22, and the second part 14 of the display module 10 is correspondingly attached to the pivot mechanism 23. That is, the first part 13 of the display module 10 and the middle frame 22 are arranged in a one-to-one correspondence, and the second part 14 of the display module 10 and the pivot mechanism 23 are arranged in a one-to-one correspondence.

[0098] With the electronic device 01 in its unfolded state, please refer to Figures 4 and 5, which show the structural diagrams of the electronic device 01 in this unfolded state. At this time, the display module 10 can be fully unfolded, meaning that the first part 13 and the second part 14 of the display module 10 are on the same plane, ensuring the flatness of the display module 10. In this state, a large-screen display of the electronic device 01 can be achieved, providing a better user experience. For example, when watching a movie, a large screen can be used, which enhances the viewing experience.

[0099] With the electronic device 01 in a folded state, please refer to Figure 6, which shows the structure of the electronic device 01 in this folded state. In this state, the first part 13 of the electronic device 01 is stacked, and the second part 14 is bent, allowing the outer casing 20 to protect the display module 10. In this state, the display module 10 is not visible to the user, preventing scratches or damage and thus providing effective protection for the display module 10. For example, when the phone is not needed, the electronic device 01 can be folded to avoid screen damage.

[0100] In some examples, please refer to Figures 5 and 6. The electronic device 01 may also include a secondary screen 80 (also called an outer screen), which can be located on the side of any of the mid-frames 22 away from the display module 10; that is, the secondary screen 80 replaces a back cover 21. When the electronic device 01 is in a folded state, the secondary screen 80 can be used to display images, allowing users to operate it with one hand, thus making the use cases of the electronic device 01 more diverse. For example, when a user is riding public transportation, one hand needs to hold the handrail; in this case, the secondary screen 80 can be used for display and one-handed operation, further improving the user experience.

[0101] Furthermore, please refer to Figure 7, which is an internal structural diagram of another electronic device 01 provided in an embodiment of this application. This electronic device 01 also includes a main board 30, a sub-board 60, and a battery 40. The main board 30 and the sub-board 60 can be respectively disposed within different middle frames 22, and each middle frame 22 contains the aforementioned battery 40. For example, when the electronic device 01 is a two-folding device, the electronic device 01 includes two middle frames 22, with the main board 30 and the sub-board 60 respectively disposed within the two middle frames 22, and the main board 30 and the sub-board 60 are electrically connected via an FPC board 70.

[0102] In some examples, please refer to Figure 8, which is an internal structure diagram of another electronic device 01 (the main board 30 is located in the middle frame 22) provided in the embodiment of this application. The electronic device 01 can be a three-fold device, that is, the electronic device 01 includes three middle frames 22. The main board 30 can be disposed in the middle frame 22. Each middle frame 22 is provided with a sub-board 60, and each sub-board 60 is electrically connected to the main board 30 through an FPC board 70.

[0103] Alternatively, please refer to Figure 9, which is an internal structure diagram of another electronic device 01 (the main board 30 is located in the middle frame 22 on both sides) provided in the embodiment of this application. The main board 30 can also be set in the middle frame 22 on both sides, and the two sub-boards 60 can be electrically connected to the main board 30 through the same FPC board 70.

[0104] In other examples, please refer to Figure 10, which is an internal structure diagram of another electronic device 01 provided in the embodiments of this application. The electronic device 01 can also be a four-fold device, that is, the electronic device 01 includes four middle frames 22, and two adjacent middle frames 22 are rotatably connected by a pivot mechanism 23. The main board 30 can be disposed in any one of the middle frames 22, and each middle frame 22 is provided with a sub-board 60. The sub-board 60 can be directly or indirectly electrically connected to the main board 30 through the FPC board 70.

[0105] Both the main board 30 and the sub-board 60 can be PCBs (printed circuit boards 91), and the electronic components 50 are respectively mounted on the main board 30 and the sub-board 60. As the electronic device 01 needs to perform increasingly more functions, the number of electronic components 50 installed inside the electronic device 01 is increasing. Furthermore, the trend towards thinner and lighter electronic devices 01 is causing the internal space of the casing 20 of the electronic device 01 to continuously decrease. Therefore, this limits the size of the main board 30 and the sub-board 60, as well as the number of electronic components 50 mounted on them.

[0106] Based on this, please refer to Figure 11, which is a structural diagram of the circuit board assembly 90 provided in an embodiment of this application. To make the distribution of electronic components 50 inside the electronic device 01 more rational, a stacked circuit board 91 structure can be adopted to form the circuit board assembly 90, thereby facilitating the centralized placement of more electronic components 50. The circuit board assembly 90 may include a circuit board 91 and a frame board 92. For example, the circuit board 91 may be a radio frequency board (RFPCB, hereinafter referred to as RF board 91a), or it may be an application processor board (AP PCB, hereinafter referred to as AP board 91b), so that different electronic components 50 can be disposed respectively.

[0107] In some examples, the RF board 91a and AP board 91b are stacked, and the frame board 92 is fixed between the RF board 91a and AP board 91b, so that electronic devices 50 can be set on both sides of the RF board 91a and both sides of the AP board 91b, and the RF board 91a and AP board 91b can be electrically connected through the frame board 92, which facilitates the centralized setting of electronic devices 50 and helps to increase the number of electronic devices 50.

[0108] However, in order to ensure the overall support strength of the circuit board assembly 90, the size of the RF board 91a needs to be comparable to that of the frame board 92, so as to avoid the RF board 91a from being deformed or even damaged due to the excessive weight of the electronic components 50 on the RF board 91a.

[0109] For example, please refer to Figures 12 and 13. Figure 12 is a structural diagram of the frame plate 92 provided in an embodiment of this application, and Figure 13 is a structural diagram of the RF plate 91a provided in an embodiment of this application. Taking the example that the surfaces of both the frame plate 92 and the RF plate 91a facing the AP plate 91b are square structures, and the square formed by the outer edge of the frame plate 92 is the standard. The ratio of the area of ​​the frame plate 92 to the area of ​​the RF plate 91a is 80%-99%, the ratio of the side length L1 of the frame plate 92 to the side length L3 of the RF plate 91a is 90%-99%, and the ratio of the diagonal L2 of the frame plate 92 to the diagonal L4 of the RF plate 91a is 75%-99%.

[0110] Therefore, the similarity in size between the frame plate 92 and the RF plate 91a restricts the size of the RF plate 91a, limiting the number of electronic components 50 that can be mounted on it. Furthermore, because the frame plate 92 has a hollow structure in the middle, to prevent the central area of ​​the RF plate 91a from concave and deforming into the frame plate 92, the size of the frame plate 92 should not be too large to ensure support strength, further restricting the size of the RF plate 91a.

[0111] To solve the above-mentioned technical problems, please refer to Figures 14 and 15. Figure 14 is a structural diagram of the first type of circuit board assembly 90 provided in the embodiment of this application, and Figure 15 is a schematic diagram of the electronic devices disposed on the circuit board assembly 90 provided in the embodiment of this application. The circuit board assembly 90 can be applied to the above-mentioned various electronic devices 50, and the circuit board assembly 90 can be used as the above-mentioned main board 30 or sub-board 60.

[0112] Specifically, the circuit board assembly 90 may include a first circuit board 93, a second circuit board 94, a frame board 92, and a support assembly 95. Exemplarily, one of the first circuit board 93 and the second circuit board 94 may be the aforementioned RF board 91a, and the other of the first circuit board 93 and the second circuit board 94 may be the aforementioned AP board 91b. In the following embodiments, the first circuit board 93 will be RF board 91a and the second circuit board 94 will be AP board 91b as examples for illustration.

[0113] Furthermore, the first circuit board 93 and the second circuit board 94 are electrically connected via a frame plate 92. In a plane parallel to the surface of the first circuit board 93 facing the second circuit board 94, the frame plate 92 can form a closed annular frame structure, such as a square or rectangular quadrilateral structure. Alternatively, the frame plate 92 can form an approximately L-shaped structure, including two mutually perpendicular sides. Or, it can form an open frame structure formed by three sides connected sequentially, with adjacent sides perpendicular to each other. The frame plate 92 can also form other possible structures; therefore, this application does not impose any special limitations on this. In the following embodiments, an example of a frame plate forming a closed quadrilateral structure will be used for explanation.

[0114] Furthermore, the second circuit board 94 can be fixedly connected to the middle frame 22; for example, the second circuit board 94 can be fixed to the middle plate 22b. A support component 95 is supported between the first circuit board 93 and the second circuit board 94, and the support component 95 is spaced apart from the frame plate 92. For example, one support component 95 may be provided, or multiple support components 95 may be provided; this application does not limit the specific number of support components 95. It is understood that when the frame plate 92 forms a quadrilateral structure with its four sides closed, the support component 95 is located on the outside of the frame plate 92, and the support component 95 is spaced apart from the frame plate 92.

[0115] For example, the first circuit board 93 may include a first region 93a and a second region 93b. The vertical projection of the first region 93a onto the second circuit board 94 coincides with the vertical projection of the frame plate 92 onto the second circuit board 94. The vertical projection of the second region 93b onto the second circuit board 94 is offset from the vertical projection of the frame plate 92 onto the second circuit board 94, i.e., they do not coincide. The aforementioned support component 95 is supported between the second region 93b of the first circuit board 93 and the second circuit board 94. That is, the first region 93a of the first circuit board 93 is supported by the frame plate 92, the second region 93b of the first circuit board 93 forms a suspended region, and the support component 95 is supported between the second region 93b and the second circuit board 94, which can reduce the risk of damage caused by bending deformation of the second region 93b.

[0116] Furthermore, taking the dimensions shown in Figures 12 and 13 as an example, the first circuit board 93 is the RF board 91a shown in Figures 12 and 13. The ratio of the area of ​​the frame board 92 to the area of ​​the first circuit board 93 can be 100%-200%, the ratio of the side length L1 of the frame board 92 to the side length L3 of the first circuit board 93 can be 100%-150%, and the ratio of the diagonal L2 of the frame board 92 to the diagonal L4 of the first circuit board 93 can be 100%-170%.

[0117] In this way, the circuit board assembly 90 provided in this embodiment can increase the area of ​​the first circuit board 93, that is, increase the area of ​​the second region 93b, so that the area of ​​the first circuit board 93 is larger than the area of ​​the frame board 92, thereby allowing more electronic devices 50 to be placed on the first circuit board 93. Furthermore, by providing effective support to the second region 93b of the first circuit board 93 through the support assembly 95, the risk of bending and deformation of the second region 93b due to the weight of the electronic devices 50 can be reduced. This ensures that more electronic devices 50 can be placed on the circuit board assembly 90 while also maintaining the support strength of the circuit board assembly 90.

[0118] The aforementioned support component 95 may include a shielding cover. Since the electronic device 01 is provided with multiple shielding covers, in the following embodiments, the shielding cover serving as the support component 95 is referred to as the first shielding cover 100, and the remaining shielding covers are referred to as the second shielding covers 96.

[0119] The first shielding cover 100 is fixed to the surface of the first circuit board 93 facing the second circuit board 94. The first shielding cover 100 is located outside the frame plate 92 and is connected to the surface of the first circuit board 93 facing the second circuit board 94, so that the first shielding cover 100 on the first circuit board 93 provides support for the second region 93b of the first circuit board 93. Furthermore, the first shielding cover 100 provides electromagnetic shielding for the electronic device 50; that is, the electronic device 50 is disposed inside the first shielding cover 100. Therefore, the area of ​​the first shielding cover 100 is relatively large, meaning that the supporting surface area of ​​the first shielding cover 100 supporting the first circuit board 93 is large, thereby improving the supporting effect of the first shielding cover 100 on the first circuit board 93.

[0120] In some embodiments, please refer to FIG16, which is a structural diagram of a first support component 95 of a circuit board assembly 90 provided in this application embodiment. The first shielding cover 100 can be soldered and fixed to the first circuit board 93. Exemplarily, a plurality of first protrusions 110 can be provided on the surface of the first shielding cover 100 facing the first circuit board 93. For example, the first protrusions 110 can be formed by stamping from the inner surface of the first shielding cover 100 outward. A plurality of second protrusions 93c can be provided on the surface of the first circuit board 93 facing the first shielding cover 100. For example, the second protrusions 93c can be pads provided on the first circuit board 93. Along the stacking direction of the first circuit board 93 and the second circuit board 94, the plurality of first protrusions 110 and the plurality of second protrusions 93c are provided in a one-to-one correspondence, and the first protrusions 110 are soldered to the corresponding second protrusions 93c.

[0121] In this way, by providing a one-to-one correspondence between the first protrusion 110 and the second protrusion 93c, and by welding the first protrusion 110 and the second protrusion 93c together, the first shielding cover 100 is fixedly connected to the first circuit board 93, thereby providing effective support for the first circuit board 93 through the first shielding cover 100. Furthermore, by stamping the first protrusion 110 onto the first shielding cover 100 and using it for welding and fixing to the second protrusion 93c, the flatness requirement between the first shielding cover 100 and the first circuit board 93 is reduced; that is, it is not necessary to ensure a surface-to-surface fit between the first shielding cover 100 and the first circuit board 93, thus improving connection reliability.

[0122] In addition, please refer to Figures 17, 18 and 19. Figure 17 is a structural diagram of the second protrusion 93c of the circuit board assembly 90 provided in Figure 16, Figure 18 is a structural diagram of the first protrusion 110 of the circuit board assembly 90 provided in Figure 16, and Figure 19 is a structural schematic diagram of the first protrusion 110 and the second protrusion 93c provided in Figure 16 before soldering.

[0123] The first shielding cover 100 may be provided with a first insulating protrusion 120, which is disposed between two adjacent first protrusions 110. For example, the first insulating protrusion 120 may be an insulating film. The first circuit board 93 is provided with a second insulating protrusion 93d, which is disposed between two adjacent second protrusions 93c. For example, the second insulating protrusion 93d may be an ink layer forming a rib. In this structure, when the first protrusions 110 of the first shielding cover 100 and the second protrusions 93c of the first circuit board 93 are soldered, it is possible to avoid adjacent second protrusions 93c and adjacent first protrusions 110 from forming a sheet, which helps to reduce the risk of soldering cracks.

[0124] For example, the spacing A between two adjacent second protrusions 93c can be 0.3mm-2mm, the distance B between a second protrusion 93c and an adjacent second insulating protrusion 93d can be 0.025mm-0.5mm, and the width C of the second protrusion 93c can be 0.15mm-1mm. The width D of the second insulating protrusion 93d can be 0.025mm-0.5mm, and the thickness E of the second insulating protrusion 93d can be 0.03mm-0.1mm. The width F of the first protrusion 110 can be 90%-120% of the spacing A, for example, the width F is 0.27mm-2.4mm. The length G of the first protrusion 110 can also be 90%-120% of the spacing A, for example, the length G is 0.27mm-2.4mm. The thickness H of the first protrusion 110 can be 0.02mm-0.08mm. The width L of the first insulating protrusion 120 can be 90%-150% of the width D, for example, the width L can be 0.0225mm-0.75mm. The thickness M of the first insulating protrusion 120 can be 0.05mm-0.1mm. When the first protrusion 110 and the second protrusion 93c are soldered, the thickness N of the solder ball 02 disposed between them can be 0.15mm-1mm.

[0125] It is understood that the spacing between the second protrusions 93c refers to the spacing between the geometric centers of two adjacent second protrusions 93c. The aforementioned thickness dimension refers to the dimension along the stacking direction of the first circuit board 93 and the second circuit board 94, i.e., the thickness direction of the electronic device 01. Furthermore, the aforementioned dimension range is only one possible example and can be flexibly varied based on actual needs. Therefore, this application embodiment does not impose any special limitations on this.

[0126] Based on this, the circuit board assembly 90 provided in this application embodiment can centrally house more electronic components 50, and by using a shield as a support component 95, the support strength of the first circuit board 93 can be improved, reducing the risk of bending and deformation of the first circuit board 93 due to the large number of electronic components 50 and the resulting high stress, thereby improving the overall strength of the circuit board assembly 90. The manufacturing process of the circuit board assembly 90 provided in this application embodiment is described below.

[0127] First, please refer to Figure 20. Figure 20 is a structural diagram of the second circuit board 94 of the circuit board assembly 90 provided in the embodiment of this application, on which the electronic device 50 is soldered. The electronic device 50 and the above-mentioned second shielding cover 96 are soldered on the surface of the second circuit board 94. For example, the electronic device 50 can be a SOC chip, etc.

[0128] Next, please refer to Figure 21, which is a structural diagram of the frame plate 92 soldered on the second circuit board 94 provided in Figure 20. The frame plate 92, electronic device 50 and first shield 100 are soldered on the side of the second circuit board 94 away from the second shield 96.

[0129] Next, please refer to Figure 22, which is a structural diagram of the first circuit board 93 of the circuit board assembly 90 provided in the embodiment of this application, wherein the electronic device 50 and the second shielding cover 96 are welded on the surface of the first circuit board 93.

[0130] Next, please refer to Figure 23. Figure 23 is a structural diagram of the frame plate 92 and the first shielding cover 100 provided in Figure 21 being sprayed with tin. Tin is sprayed on the frame plate 92 and the first shielding cover 100 to form solder balls 02.

[0131] Finally, please refer to Figure 24, which is a structural diagram of the first circuit board 93 and the second circuit board 94 provided in Figure 23 during welding. The surface of the first circuit board 93 away from the second shield 96 is welded to the frame plate 92 and the first protrusion 110. During welding, the pressure block 03 is used to press the first circuit board 93 and the second circuit board 94 onto the fixture 04 to ensure the flatness of the first circuit board 93 and the second circuit board 94, thereby forming the circuit board assembly 90.

[0132] It is understood that the above manufacturing process only describes the components involved in the circuit board assembly 90 provided in the embodiments of this application. Other steps may also be included in the above manufacturing process, such as soldering more electrical components and a second shielding cover 96 on the first circuit board 93 and the second circuit board 94, which will not be described in detail.

[0133] In other embodiments, please refer to FIG25, which is a structural diagram of a second type of support component 95 for a circuit board assembly 90 provided in an embodiment of this application. The circuit board assembly 90 may include an adhesive layer 200, and the first shielding cover 100 and the first circuit board 93 may also be bonded and fixed together by the adhesive layer 200. For example, before the first circuit board 93 is soldered to the frame plate 92, an adhesive layer 200 formed by double-sided adhesive can be provided on the surface of the first shielding cover 100. Then, while the first circuit board 93 is soldered to the frame plate 92, the first circuit board 93 is attached to the adhesive layer 200, thereby achieving bonding and fixation between the first circuit board 93 and the first shielding cover 100.

[0134] Alternatively, please refer to Figure 26, which is a structural diagram of another adhesive layer 200 provided in an embodiment of this application. After the first circuit board 93 is welded and fixed to the frame plate 92, the adhesive layer 200 can be filled between the first shield 100 and the first circuit board 93 through an underfill process (as shown by the arrow in Figure 26). After the adhesive layer 200 solidifies, the first circuit board 93 and the first shield 100 can be bonded and fixed.

[0135] Please refer to Figures 25 and 26. To improve the adhesion between the first shielding cover 100 and the first circuit board 93, at least one of the two opposing surfaces of the first circuit board 93 and the first shielding cover 100 may be provided with a raised structure. For example, the raised structure may include a third protrusion 130 and a fourth protrusion 93e. The third protrusion 130 may be disposed on the first shielding cover 100 and may be formed by stamping from the inner surface of the first shielding cover 100 outwards. The fourth protrusion 93e is disposed on the surface of the first circuit board 93 facing the first shielding cover 100 and may be a pad on the first circuit board 93. This results in an uneven structure on the surfaces of both the first shielding cover 100 and the first circuit board 93, increasing surface roughness and thus increasing the contact area with the adhesive layer 200, thereby improving the adhesion between the first circuit board 93 and the first shielding cover 100.

[0136] Furthermore, the vertical projections of the third protrusion 130 and the fourth protrusion 93e on the first circuit board 93 can be staggered to each other, thereby preventing the third protrusion 130 and the fourth protrusion 93e from abutting each other, which is beneficial to further increase the bonding area with the adhesive layer 200. Also, at least a portion of the third protrusion 130 can extend into the gap between adjacent fourth protrusions 93e, and at least a portion of the fourth protrusion 93e can also extend into the gap between adjacent third protrusions 130, thereby helping to reduce the distance between the first shielding cover 100 and the first circuit board 93, and thus helping to reduce the thickness of the circuit board assembly 90.

[0137] Alternatively, in the above embodiments, the third protrusion 130 may be provided only on the first shielding cover 100, or the fourth protrusion 93e may be provided only on the first circuit board 93, to improve the surface roughness of the first shielding cover 100 or the first circuit board 93. Therefore, this application does not impose any special limitations on this.

[0138] In some other embodiments, please refer to FIG27, which is a structural diagram of a third type of support component 95 for the circuit board assembly 90 provided in an embodiment of this application. This support component 95 may include a fastener 300, and the first circuit board 93 and the first shielding cover 100 may be connected via the fastener 300, specifically, the first end of the fastener 300 is connected to the first circuit board 93, and the second end of the fastener 300 is connected to the first shielding cover 100. In this way, even if the first shielding cover 100 and the first circuit board 93 are spaced apart, the fastener 300 can provide effective support between the first circuit board 93 and the first shielding cover 100, thereby improving the strength of the first circuit board 93.

[0139] It is understood that one or more fasteners 300 can be provided between the first shielding cover 100 and the first circuit board 93. When multiple fasteners 300 are provided, please refer to Figures 28 and 29. Figure 28 is a top view of the first circuit board 93 of the circuit board assembly 90 provided in Figure 27, and Figure 29 is a top view of the second circuit board 94 of the circuit board assembly 90 provided in Figure 27. The dashed box in Figure 28 represents the frame plate 92. Therefore, multiple fasteners 300 can form multiple support points between the first shielding cover 100 and the first circuit board 93, thereby improving the support effect. Therefore, this application embodiment does not impose any special limitations on this aspect.

[0140] The fastener 300 may include a limiting portion 310 and a connecting portion 320. The limiting portion 310 is disposed on the side of the first circuit board 93 away from the first shielding cover 100. The first circuit board 93 has a through hole. One end of the connecting portion 320 is connected to the limiting portion 310, and the other end of the connecting portion 320 passes through the through hole and is connected to the first shielding cover 100. For example, the fastener 300 may be a screw, with the limiting portion 310 being the head of the screw and the connecting portion 320 being the shank of the screw; that is, the limiting portion 310 and the connecting portion 320 are an integral structure. The first shielding cover 100 may have a first threaded hole 140. The end of the connecting portion 320 away from the limiting portion 310 extends into the first threaded hole 140, so that the fastener 300 is threadedly connected to the first shielding cover 100.

[0141] Alternatively, the limiting part 310 and the connecting part 320 can be separate components. For example, the limiting part 310 can be a nut, the connecting part 320 can be a screw, one end of the connecting part 320 is threadedly connected to the limiting part 310, and the other end of the connecting part 320 extends into the first threaded hole 140 and is threadedly connected to the first shield 100.

[0142] In some examples, please refer to Figure 30, which is a structural diagram of a fourth type of support component 95 for the circuit board assembly 90 provided in an embodiment of this application. This support component 95 may further include a first stud 400, which is fixed to the surface of the first shielding cover 100 facing the first circuit board 93. The first stud 400 has a second threaded hole 410. One end of the connecting portion 320, away from the limiting portion 310, extends into the second threaded hole 410, so that the connecting portion 320 is threadedly connected to the first stud 400. For example, the first stud 400 can be fixed to the first shielding cover 100 by welding or bonding.

[0143] This reduces the height of the first shield 100, allowing the first stud 400 to connect with the fastener 300, thus forming a support between the first shield 100 and the first circuit board 93. This increases the distance between the first shield 100 and the first circuit board 93, enabling electronic devices 50 to be installed on the surface of the first circuit board 93 opposite to the first shield 100, and further increases the number of electronic devices 50 installed on the circuit board assembly 90.

[0144] Furthermore, the aforementioned circuit board assembly 90 may also include a first buffer 710, which abuts against the first stud 400 and the first circuit board 93. Exemplarily, the first buffer 710 may be made of a flexible material, such as foam or rubber. Alternatively, the first buffer 710 may be a spring. The fastener 300 may pass through the first buffer 710, or the first buffer 710 may extend around the circumference of the fastener 300. This allows the first buffer 710 to absorb some energy when the first circuit board 93 is subjected to impact, thereby reducing the risk of damage caused by bending deformation of the first circuit board 93.

[0145] Based on this, please refer to Figures 31 and 32. Figure 31 is a structural diagram of the fifth support component 95 of the circuit board assembly 90 provided in this application embodiment, and Figure 32 is an enlarged view of the support component 95 provided in Figure 31. A third threaded hole 420 may be formed on the end face of the first stud 400 facing the first shield 100. The circuit board assembly 90 may further include a second stud 500 and a connector 600. A fourth threaded hole 510 is formed on the second stud 500. One end of the connector 600 can penetrate the first shield 100 and extend into the third threaded hole 420, so that the connector 600 is threadedly connected to the first stud 400. The other end of the connector 600 extends into the fourth threaded hole 510, so that the connector 600 is threadedly connected to the second stud 500.

[0146] It is understood that the second threaded hole 410 and the third threaded hole 420 on the first stud 400 can be interconnected, meaning the axially oriented threaded hole on the first stud 400 penetrates both end faces. Alternatively, the second threaded hole 410 and the third threaded hole 420 can be non-interconnected, meaning the second threaded hole 410 and the third threaded hole 420 are respectively formed on the two end faces of the first stud 400. Furthermore, the second stud 500 can be fixed to the second circuit board 94 by welding or bonding.

[0147] In this way, the second stud 500 and the connector 600 can form a support point inside the first shield 100, and the fastener 300, the first stud 400, the connector 600 and the second stud 500 are connected sequentially along the stacking direction of the first circuit board 93 and the second circuit board 94, thereby forming a support between the first circuit board 93 and the second circuit board 94, which is beneficial to further improve the support effect on the first circuit board 93.

[0148] In some examples, referring further to Figures 31 and 32, the circuit board assembly 90 may also include a second buffer 720, which abuts against the inner wall of the second stud 500 and the first shield 100. Exemplarily, the second buffer 720 may be made of a flexible material, such as foam or rubber. Alternatively, the second buffer 720 may also be a spring. Furthermore, the connector 600 may pass through the first buffer 710, or the first buffer 710 may extend around the circumference of the connector 600. This allows the second buffer 720 to form a buffer between the first shield 100 and the second stud 500, further reducing the risk of damage caused by bending deformation of the first circuit board 93.

[0149] In other examples, please refer to Figures 33 and 34. Figure 33 is a structural diagram of a sixth type of support component 95 of the circuit board assembly 90 provided in an embodiment of this application, and Figure 34 is a structural diagram of the boss 150 provided in Figure 33. The support component 95 may include a boss 150, which is disposed on the surface of the first shielding cover 100 facing the first circuit board 93. For example, the boss 150 may be a structural component made of metal material, and the boss 150 may be welded or bonded to the first shielding cover 100. The boss 150 abuts against the first circuit board 93. Therefore, the boss 150 can provide further support for the first circuit board 93, thereby improving the support effect on the first circuit board 93.

[0150] For example, the fastener 300 can pass through the boss 150 and be threadedly connected to the first shield 100, thereby saving space on the first circuit board 93 so that more electronic components 50 can be installed on the first circuit board 93. Alternatively, the boss 150 and the fastener 300 can be spaced apart to form more support points between the first circuit board 93 and the first shield 100, which helps to improve the support effect on the first circuit board 93.

[0151] Alternatively, please refer to Figures 35 and 36. Figure 35 is a structural diagram of a seventh type of support component 95 for the circuit board assembly 90 provided in this application embodiment, and Figure 36 is a structural diagram of another type of elastic element 700 for the support component 95 provided in Figure 35. This support component 95 may include an elastic element 700, which abuts against the first shielding cover 100 and the first circuit board 93. For example, the elastic element 700 may be a support structure formed of flexible materials such as foam or rubber, or it may be a spring. This allows the elastic element 700 to absorb some energy when the circuit board assembly 90 is subjected to impact, thereby reducing the risk of damage caused by bending deformation of the first circuit board 93.

[0152] For example, the fastener 300 can pass through the elastic member 700 and be threadedly connected to the first shield 100. When the elastic member 700 is a spring, the spring can be sleeved on the fastener 300 so that the fastener 300 can limit the compression direction of the spring, which helps to protect the elastic member 700 and improve the reliability of the overall structure.

[0153] In other possible examples, please refer to Figure 37, which is a structural diagram of the eighth support component 95 of the circuit board assembly 90 provided in the embodiment of this application. Alternatively, only the elastic element 700 can be provided between the first circuit board 93 and the first shield 100 so that the elastic element 700 forms a flexible support between the first shield 100 and the first circuit board 93, which can absorb more energy when the first circuit board 93 is impacted, thereby obtaining a better buffering effect.

[0154] Furthermore, the aforementioned elastic element 700 can be disposed on the two opposite surfaces of the first circuit board 93, which helps to balance the force on both surfaces of the first circuit board 93, thereby reducing the risk of the first circuit board 93 bending, deforming, or even being damaged due to excessive force on one side.

[0155] Furthermore, if an electronic device 50 is disposed on the surface of the first circuit board 93 in the area opposite to the first shield 100, the aforementioned elastic member 700 can be placed between the electronic device 50 and the first shield 100 to avoid direct contact between the electronic device 50 and the first shield 100, thereby reducing the risk of failure caused by a collision between the electronic device 50 and the first shield 100.

[0156] Based on the above embodiments, please refer to Figure 38, which is a structural diagram of the ninth type of support component 95 of the circuit board assembly 90 provided in this application embodiment. This support component 95 can also be a first structural member 800. For example, the first structural member 800 can be made of metal materials such as aluminum or copper, and its structural form can be a support block, support column, or similar structure. Therefore, this application embodiment does not impose special limitations on the material and structure of the first structural member 800.

[0157] The first structural component 800 can be soldered to the surface of the second circuit board 94 facing the first circuit board 93, and the first structural component 800 abuts against the first circuit board 93. In this way, the first structural component 800 can be disposed on the area of ​​the second circuit board 94 where the first shield 100 is not provided, so that more support points can be formed between the first circuit board 93 and the second circuit board 94, which is conducive to further improving the support effect on the first circuit board 91.

[0158] For example, the first structural member 800 can abut against the edge of the first circuit board 93, and multiple first structural members 800 can be provided, distributed at intervals along the edge of the first circuit board 93. This allows the edge of the first circuit board 93 to have multiple support points, preventing the edge area of ​​the first circuit board 93 from being suspended in the air. This reduces the risk of the second region 93b of the first circuit board 93 extending outside the frame plate 92 shaking when the circuit board assembly 90 is subjected to impact, thus improving the reliability of the circuit board assembly 90.

[0159] Alternatively, the first structural member 800 can also be disposed in the gap between adjacent electronic devices 50 on the second circuit board 94, so that multiple first structural members 800 can form multiple support points between the first circuit board 93 and the second circuit board 94, so as to further improve the support effect on the first circuit board 93.

[0160] It is understood that the aforementioned first structural member 800 is used to form a support point between the first circuit board 93 and the second circuit board 94. The placement of the first structural member 800 can be determined based on the electronic devices 50 disposed on the first circuit board 93 and the second circuit board 94, that is, the placement of the first structural member 800 does not affect the placement of the electronic devices 50. Therefore, this application does not impose any special limitations on the placement or quantity of the first structural member 800.

[0161] Furthermore, the aforementioned circuit board assembly 90 may also include a third buffer 730, which abuts against the first structural member 800 and the first circuit board 93. Exemplarily, the third buffer 730 may be made of a flexible material, such as foam or rubber. Alternatively, the third buffer 730 may also be a spring. This allows the third buffer 730 to form a buffer between the first structural member 800 and the first circuit board 93, further reducing the risk of damage caused by bending deformation of the first circuit board 93.

[0162] To further enhance the support effect of the first structural component 800 on the first circuit board 93, please continue to refer to FIG38. The electronic device 01 provided in this embodiment may further include a second structural component 21a. The second structural component 21a may be fixed to the aforementioned rear cover 21. For example, the second structural component 21a may be glued or welded to the rear cover 21. The second structural component 21a abuts against the surface of the first circuit board 93 away from the second circuit board 94. For example, the second structural component 21a may abut against the edge region of the first circuit board 93, or the second structural component 21a may abut against the gap between adjacent electronic devices 50 on the first circuit board 93, thereby providing multiple support points between the first circuit board 93 and the rear cover 21 to further enhance the support effect on the first circuit board 93.

[0163] In some examples, the surface of the first circuit board 93 away from the second circuit board 94 may be provided with the aforementioned second shield 96. Therefore, some of the second structural members 21a may also abut against the second shield 96, thereby improving the flexibility of the second structural members 21a.

[0164] Furthermore, the electronic device 01 may also include a fourth buffer 21b, which abuts against the second structural member 21a and the first circuit board 93. Exemplarily, the fourth buffer 21b may be made of a flexible material, such as foam or rubber. Alternatively, the fourth buffer 21b may also be a spring. This allows the fourth buffer 21b to form a buffer between the second structural member 21a and the first circuit board 93, further reducing the risk of damage caused by bending deformation of the first circuit board 93.

[0165] In other examples, along the stacking direction of the first circuit board 93 and the second circuit board 94, the vertical projection of the first structural member 800 on the second circuit board 94 overlaps with the vertical projection of the second structural member 21a on the second circuit board 94 in at least a portion of the area. That is, the first structural member 800 and the second structural member 21a respectively abut against the two side surfaces of the first circuit board 93 and are correspondingly arranged along the stacking direction of the first circuit board 93 and the second circuit board 94.

[0166] In this way, the first structural member 800 and the second structural member 21a can form supports on both sides of the first circuit board 93 respectively, so that the forces on both sides of the first circuit board 93 are balanced, which helps to further reduce the risk of the first circuit board 93 bending and deforming to one side when it is subjected to impact.

[0167] Furthermore, multiple first structural members 800 and multiple second structural members 21a can be provided, and the multiple first structural members 800 and multiple second structural members 21a can be arranged in a one-to-one correspondence, that is, the number of first structural members 800 and second structural members 21a is equal, and they abut against the two side surfaces of the first circuit board 93 in a one-to-one correspondence along the distribution direction of the first circuit board 93 and the second circuit board 94. Alternatively, only a portion of the first structural members 800 and a portion of the second structural members 21a can be provided to abut against the two side surfaces of the first circuit board 93. Therefore, this application does not impose any special limitations in this regard.

[0168] It is understood that the circuit board assembly 90 provided in this application embodiment may include multiple support components 95, and the multiple support components 95 may adopt the same structure. For example, the multiple support components 95 may all adopt the first structural member 800 described above. Alternatively, the multiple support components 95 may adopt different structures. For example, in the area where the first shielding cover 100 is provided, the first shielding cover 100 is used as the support component 95. In the area where there is no first shielding cover 100, the first structural member 800 is used as the support component 95. Therefore, this application does not impose any special limitations in this regard.

[0169] In other possible embodiments, the circuit board assembly 90 provided in this application may include multiple layers of first circuit boards 93, which are stacked and connected to each adjacent first circuit board 93 by a frame plate 92. Furthermore, the aforementioned support components 95 may be provided between adjacent first circuit boards 93 and between the second circuit board 94 and the nearest first circuit board 93, thereby facilitating a further increase in the number of electronic devices 50 mounted on the circuit board assembly 90 and ensuring the overall support strength of the circuit board assembly 90.

[0170] For example, please refer to FIG39, which is a structural diagram of another circuit board assembly 90 provided in the embodiment of this application. The circuit board assembly 90 may also include a third circuit board 97, which may also be the RF board 91a. The third circuit board 97 is disposed between the first circuit board 93 and the second circuit board 94. The third circuit board 97 is connected to the first circuit board 93 and the second circuit board 94 through a frame plate 92.

[0171] The third circuit board 97 can be approximately the same size as the frame board 92, for example, as shown in Figures 12 and 13. Support can be formed between the first circuit board 93 and the second circuit board 94 via the aforementioned support component 95, thereby enabling the circuit board assembly 90 to form a multi-layer structure, which is beneficial for increasing the number of electronic devices 50 mounted on the circuit board assembly 90.

[0172] It is understood that the number of the aforementioned third circuit boards 97 can also be multiple, with adjacent third circuit boards 97 connected by a frame plate 92. Thus, the number of electronic devices 50 disposed on the circuit board assembly 90 can be increased by increasing the number of stacked first circuit boards 93 or third circuit boards 97. Therefore, this application embodiment does not limit this.

[0173] Based on this, please refer to Figure 40, which is a structural diagram of another circuit board assembly 90 provided in an embodiment of this application. This circuit board assembly 90 may further include reinforcing ribs 98, which are disposed on the surface of the first circuit board 93. At least a portion of the vertical projection of the reinforcing rib 98 onto the second circuit board 94 is located outside the vertical projection of the frame plate 92 onto the second circuit board 94. That is, at least a portion of the reinforcing rib 98 is fixed to the second region 93b of the first circuit board 93 (as shown in Figure 14). In this way, the strength of the first support plate can be increased through the reinforcing rib 98, which helps to further reduce the risk of damage caused by bending deformation of the first circuit board 93.

[0174] For example, a plurality of electronic devices 50 are disposed on the first circuit board 93, and reinforcing ribs 98 may be disposed in the gaps between adjacent electronic devices 50. Alternatively, reinforcing ribs 98 may also be disposed at the edge of the first circuit board 93 and extend along the edge of the first circuit board 93. This can improve the strength of the first circuit board 93.

[0175] In some embodiments, please refer to FIG41, which is a distribution structure diagram of a reinforcing rib 98 provided in an embodiment of this application. FIG41 shows the surface of the first circuit board 93 away from the frame plate 92, and the dashed box in FIG41 represents the frame plate 92. The aforementioned reinforcing rib 98 may include first reinforcing ribs 98a, and multiple first reinforcing ribs 98a are distributed circumferentially around the frame plate 92. In this structure, the strength of the suspended area of ​​the first circuit board 93 (i.e., the second area 93b shown in FIG14) is strengthened by multiple first reinforcing ribs 98a, so as to improve the bending resistance of the first circuit board 93 and thereby reduce the risk of bending deformation of the suspended area of ​​the first circuit board 93.

[0176] The aforementioned reinforcing rib 98 may further include a second reinforcing rib 98b. The first reinforcing rib 98a may extend from the central region of the first circuit board 93 towards the edge region, and the second reinforcing rib 98b extends circumferentially around the frame plate 92 and is fixedly connected to multiple first reinforcing ribs 98a. That is, the first reinforcing ribs 98a and the second reinforcing ribs 98b intersect each other and are fixedly connected, thereby further enhancing the strength of the suspended region of the first circuit board 93.

[0177] Furthermore, multiple second reinforcing ribs 98b can be provided, and the multiple second reinforcing ribs 98b are distributed at intervals along the extension direction of the first reinforcing rib 98a and are fixedly connected to the multiple first reinforcing ribs 98a, so that the multiple first reinforcing ribs 98a and the multiple second reinforcing ribs 98b intersect to form a mesh structure, which is beneficial to further improve the strength of the suspended area of ​​the first circuit board 93.

[0178] In the case where the frame plate 92 is located in the central region of the first circuit board 93, the plurality of first reinforcing ribs 98a can be distributed at intervals around the frame plate 92, and the plurality of second reinforcing ribs 98b form a plurality of sequentially nested annular structures, so that the mesh structure formed by the intersection of the first reinforcing ribs 98a and the second reinforcing ribs 98b extends around the frame plate 92. When the frame plate 92 is located near the edge of the first circuit board 93, the first reinforcing ribs 98a and the second reinforcing ribs 98b form a mesh structure that extends circumferentially around the frame plate 92, and only covers the second region 93b on the first circuit board 93.

[0179] Furthermore, the aforementioned reinforcing rib 98 can be provided on the surface of the first circuit board 93 away from the second circuit board 94. Alternatively, the reinforcing rib 98 can be provided on the surface of the first circuit board 93 facing the second circuit board 94. Or, reinforcing ribs 98 can be provided on both sides of the first circuit board 93 to increase the strength of the first circuit board 93 and further reduce the risk of damage caused by bending deformation of the first circuit board 93.

[0180] It is understood that when the aforementioned reinforcing ribs 98 are provided on both sides of the first circuit board 93, the location and structure of the reinforcing ribs 98 on both sides of the first circuit board 93 may be the same or different. Therefore, the embodiments of this application do not impose any special limitations on this.

[0181] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0182] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit board assembly, characterized in that, include: First circuit board; The second circuit board is stacked on top of the first circuit board; A frame board is disposed between the first circuit board and the second circuit board; A support component is provided between the first circuit board and the second circuit board, and the support component and the frame board are spaced apart.

2. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly further includes reinforcing ribs disposed on the surface of the first circuit board, and at least a portion of the vertical projection of the reinforcing ribs onto the second circuit board is located outside the vertical projection of the frame plate onto the second circuit board.

3. The circuit board assembly according to claim 2, characterized in that, The reinforcing ribs include a first reinforcing rib, and multiple first reinforcing ribs are provided, which are distributed circumferentially around the frame plate.

4. The circuit board assembly according to claim 3, characterized in that, The first reinforcing rib extends from the central region of the first circuit board to the edge region; the reinforcing rib includes a second reinforcing rib that extends circumferentially around the frame plate and is fixedly connected to a plurality of the first reinforcing ribs.

5. The circuit board assembly according to any one of claims 2-4, characterized in that, The reinforcing ribs are provided on both sides of the first circuit board.

6. The circuit board assembly according to any one of claims 2-5, characterized in that, The surface of the first circuit board is used to mount electronic devices. Multiple electronic devices are mounted and spaced apart. The reinforcing ribs are mounted in the gaps between adjacent electronic devices.

7. The circuit board assembly according to any one of claims 1-6, characterized in that, The support assembly includes a shielding cover, which is fixed to the surface of the second circuit board facing the first circuit board. The shielding cover is located outside the frame plate and is connected to the surface of the first circuit board facing the second circuit board.

8. The circuit board assembly according to claim 7, characterized in that, The shielding cover is welded and fixed to the first circuit board.

9. The circuit board assembly according to claim 8, characterized in that, The shielding cover has a plurality of first protrusions on its surface facing the first circuit board, and the first circuit board has a plurality of second protrusions on its surface facing the shielding cover; along the stacking direction of the first circuit board and the second circuit board, the plurality of first protrusions and the plurality of second protrusions are arranged in a one-to-one correspondence, and the first protrusions are welded to the corresponding second protrusions.

10. The circuit board assembly according to claim 9, characterized in that, The shielding cover is provided with a first insulating protrusion, which is disposed between two adjacent first protrusions; the first circuit board is provided with a second insulating protrusion, which is disposed between two adjacent second protrusions.

11. The circuit board assembly according to claim 7, characterized in that, The circuit board assembly includes an adhesive layer, and the shielding cover is bonded and fixed to the first circuit board through the adhesive layer.

12. The circuit board assembly according to claim 11, characterized in that, The shielding cover or the first circuit board is provided with a plurality of raised structures, and the adhesive layer covers the plurality of raised structures.

13. The circuit board assembly according to claim 12, characterized in that, The protrusion structure includes a third protrusion and a fourth protrusion. The shielding cover has a plurality of the third protrusions on its surface facing the first circuit board, and the first circuit board has a plurality of the fourth protrusions on its surface facing the shielding cover.

14. The circuit board assembly according to claim 13, characterized in that, The vertical projections of the plurality of third protrusions and the plurality of fourth protrusions on the first circuit board are misaligned.

15. The circuit board assembly according to claim 7, characterized in that, The circuit board assembly includes a fastener, a first end of which is connected to the first circuit board, and a second end of which is connected to the shielding cover.

16. The circuit board assembly according to claim 15, characterized in that, The fastener includes a limiting part and a connecting part. The limiting part is disposed on the side of the first circuit board away from the shield. A through hole is provided on the first circuit board. One end of the connecting part is connected to the limiting part, and the other end of the connecting part passes through the through hole and is connected to the shield.

17. The circuit board assembly according to claim 16, characterized in that, The shielding cover has a first threaded hole, and the end of the connecting part extends into the first threaded hole so that the connecting part is threadedly connected to the shielding cover.

18. The circuit board assembly according to claim 17, characterized in that, The circuit board assembly includes a boss disposed on the surface of the shield facing the first circuit board, and the boss abuts against the first circuit board.

19. The circuit board assembly according to claim 16, characterized in that, The circuit board assembly includes a first stud, which is fixed to the shielding cover. The first stud has a second threaded hole, and the end of the connecting part extends into the second threaded hole so that the connecting part is threadedly connected to the first stud.

20. The circuit board assembly according to claim 19, characterized in that, The circuit board assembly includes a first buffer member, which abuts between the first stud and the first circuit board.

21. The circuit board assembly according to claim 19, characterized in that, The first stud has a third threaded hole on its end face facing the shield; the circuit board assembly includes a second stud and a connector, the second stud is fixed on the second circuit board and located inside the shield, and the second stud has a fourth threaded hole. One end of the connector passes through the shield and extends into the third threaded hole, so that the connector is threadedly connected to the first stud; the other end of the connector extends into the fourth threaded hole, so that the connector is threadedly connected to the second stud.

22. The circuit board assembly according to claim 21, characterized in that, The circuit board assembly includes a second buffer member, which abuts against the second stud and the shielding cover along the stacking direction of the first circuit board and the second circuit board.

23. The circuit board assembly according to any one of claims 7-22, characterized in that, The support assembly also includes an elastic element that abuts against the shield and the first circuit board.

24. The circuit board assembly according to any one of claims 1-23, characterized in that, The support component includes a first structural member, which abuts between the first circuit board and the second circuit board.

25. The circuit board assembly according to claim 24, characterized in that, The first structural component is welded and fixed to the second circuit board. The circuit board assembly also includes a third buffer component, which abuts against the first structural component and the first circuit board.

26. The circuit board assembly according to any one of claims 1-25, characterized in that, The circuit board assembly further includes a third circuit board, which is stacked between the first circuit board and the second circuit board. The third circuit board is connected to the first circuit board through one of the frame boards, and the third circuit board is connected to the second circuit board through another frame board.

27. An electronic device, characterized in that, include: shell; The circuit board assembly is the circuit board assembly according to any one of claims 1-26, and the circuit board assembly is disposed within the housing.

28. The electronic device according to claim 27, characterized in that, The housing includes a middle frame and a rear cover. The circuit board assembly is fixed to the middle frame. A second structural member is provided on the inner surface of the rear cover, and the second structural member abuts against the circuit board assembly.

29. The electronic device according to claim 28, characterized in that, The electronic device includes a fourth buffer that abuts between the second structural member and the circuit board assembly.

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