Heat dissipation structure, circuit board assembly, and electronic device

Abstract

The present application relates to the technical field of heat dissipation, and provides a heat dissipation structure, a circuit board assembly, and an electronic device, for use in solving the problem of poor heat dissipation effects of electronic components in existing electronic devices. The heat dissipation structure comprises a housing, an emitting device, and a receiving device. The housing is provided with an air inlet and an air outlet. The emitting device and the receiving device are arranged in the housing. The emitting device is used for generating charged ions, and the receiving device is used for attracting the charged ions. The heat dissipation structure provided in the present application is used for dissipating heat of the electronic components in the electronic devices.

Description

Heat dissipation structure, circuit board assembly and electronic equipment

[0001] This application claims priority to Chinese Patent Application No. 202510129021.1, filed on January 27, 2025, entitled "Heat Dissipation Structure, Circuit Board Assembly and Electronic Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure, circuit board assembly, and electronic device. Background Technology

[0003] As people's living standards continue to improve, electronic devices such as mobile phones, smartwatches, tablets, and laptops are widely used. These electronic devices generally include circuit boards. With the continuous improvement of user needs, electronic devices are capable of increasingly diverse functions. Correspondingly, to achieve these different functions, the number of electronic components mounted on the circuit boards is also increasing.

[0004] However, as the number of electronic components on circuit boards gradually increases, the heat generated by these components during operation also gradually increases, thus affecting the normal operation of electronic devices. Currently, heat dissipation of electronic components mainly relies on heat conduction, using heat-conducting components to conduct heat away, but this method is not very effective. Summary of the Invention

[0005] This application provides a heat dissipation structure, a circuit board assembly, and an electronic device to solve the problem of poor heat dissipation of electronic devices in existing electronic devices.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, embodiments of this application provide a heat dissipation structure, including a housing, an emitting device, and a receiving device. The housing has an air inlet and an air outlet. The emitting device and the receiving device are disposed within the housing. The emitting device is used to generate charged ions, and the receiving device is used to attract charged ions.

[0008] The heat dissipation structure provided in this application embodiment allows the receiving device to attract charged ions after the emitting device generates them. During this movement, the charged ions can drive the surrounding air molecules to move together, forming an airflow. Simultaneously, because the housing has an air inlet and an air outlet, the internal air pressure balance is maintained. External air can enter the housing under the influence of the airflow and be blown out from the air outlet, thus dissipating heat from the electronic components requiring cooling.

[0009] In one possible implementation of the first aspect, the heat dissipation structure further includes a pulse generator. The pulse generator includes a positive port and a negative port. The positive port is electrically connected to the transmitting device, and the negative port is electrically connected to the receiving device. Thus, the pulse generator can generate pulses, enabling the transmitting device to ionize the air and generate charged ions. Simultaneously, the receiving device can attract the generated charged ions, thereby causing surrounding air molecules to flow and form an airflow.

[0010] In one possible implementation of the first aspect, the pulse generator includes a step-up transformer. The step-up transformer includes a first coil winding and a second coil winding. The first coil winding has a greater number of turns than the second coil winding, and the diameter of the first coil winding is smaller than the diameter of the second coil winding. The first coil winding includes a positive terminal and a negative terminal. Because the first coil winding has a greater number of turns than the second coil winding, and its diameter is smaller, the voltage output by the first coil winding increases. This allows the transmitting device to ionize the air more effectively, increasing the number of charged ions, and the receiving device to attract charged ions more effectively, thereby enabling the airflow to move more rapidly and increasing wind speed.

[0011] In one possible implementation of the first aspect, the ratio of the number of turns in the first coil winding to the number of turns in the second coil winding is greater than or equal to 1000, and the ratio of the coil diameter of the second coil winding to the coil diameter of the first coil winding is greater than or equal to 10. Based on the aforementioned ratio of the number of turns and coil diameter of the first and second coil windings, the voltage can be increased by more than 1000 times, ensuring that the first coil winding can output sufficient voltage to ionize the air.

[0012] In one possible implementation of the first aspect, the number of turns in the first coil winding is greater than or equal to 10,000 and less than or equal to 50,000. The number of turns in the second coil winding is greater than or equal to 10 and less than or equal to 50. The diameter of the first coil winding is greater than or equal to 0.05 and less than or equal to 0.2. The diameter of the second coil winding is greater than or equal to 0.8 and less than or equal to 2.

[0013] In one possible implementation of the first aspect, the transmitting device includes a conductive element. The conductive element includes a conductive body and an extension electrically connected to the conductive body. At least a portion of the extension is located on the side of the conductive body facing the receiving device. Thus, the extension can form a pointed structure, and when the conductive element is connected to an external power supply device through the conductive body, an electric field can be formed at the end of the extension. When the electric field reaches an intensity capable of ionizing air, the air can be ionized at the end of the extension to form charged ions.

[0014] In one possible implementation of the first aspect, there are multiple extensions. These extensions are arranged in a circular array. By providing multiple extensions, the ability of the conductive component to ionize air can be further enhanced, generating more charged ions, thereby better driving airflow.

[0015] In one possible implementation of the first aspect, the extension is a conical structure. The bottom of the extension is connected to the conductive body. Because the extension is conical, the top of the extension more easily ionizes the air to generate charged ions, thereby improving the ionization efficiency of the emitting device.

[0016] In one possible implementation of the first aspect, the conductive body has a first ventilation hole. The first ventilation hole penetrates the conductive body along the arrangement direction of the transmitting and receiving devices. Thus, when charged ions generated by the transmitting device are attracted by the receiving device, the air around the transmitting device also flows towards the receiving device along with the charged ions. Because the conductive body has a first ventilation hole, air can flow towards the receiving device through the first ventilation hole, resulting in smoother airflow and better airflow formation.

[0017] In one possible implementation of the first aspect, the transmitting device further includes a protective member. The protective member includes a first surface facing the receiving device and a second surface opposite to the first surface. A conductive body is disposed on the second surface. At least a portion of the extension is embedded within the protective member. At least the end face of the extension facing the receiving device is exposed outside the protective member. The protective member can alter the electric field, causing a change in the electric field distribution. This change can alter the electric field distribution within the protective member where the extension is embedded, resulting in a more concentrated electric field at the end face of the extension facing the receiving device, thereby improving the discharge efficiency at that end and ionizing more air.

[0018] In one possible implementation of the first aspect, the receiving device has a second ventilation hole. The second ventilation hole penetrates the receiving device along the arrangement direction of the transmitting and receiving devices. Thus, during the process of attracting charged ions, the gas also moves towards the receiving device, forming an airflow. Because the receiving device has a second ventilation hole, the airflow can pass directly through the second ventilation hole, ensuring smooth airflow.

[0019] In one possible implementation of the first aspect, the receiving device includes a receiving body and a conductive layer. The receiving body has a second ventilation hole. The conductive layer covers the surface of the receiving body and the inner surface of the second ventilation hole. When the conductive layer is connected to an external power supply device, it can attract charged ions, causing the charged ions to be attracted to the conductive layer, thereby driving airflow to form an ion wind. Simultaneously, by providing a receiving body, the discharge phenomenon of the receiving device can be improved, the charge flow path can be better controlled, and unnecessary discharge phenomena can be avoided.

[0020] In one possible implementation of the first aspect, the housing includes a top plate and side plates. The side plates are located on one side of the top plate and are arranged around the perimeter of the top plate. In this way, the housing and the circuit board can form a sealed space, providing protection.

[0021] In one possible implementation of the first aspect, the housing further includes a base plate. The base plate is located on the side of the side plate away from the top plate and is connected to the side plate. The base plate, side plate, and top plate enclose an accommodating space. The transmitting device and the receiving device are accommodated in the accommodating space and disposed on the base plate. Thus, the housing itself can directly form the accommodating space. In use, the housing can be directly fixed to the circuit board.

[0022] In one possible implementation of the first aspect, the base plate includes a base plate body and conductive lines disposed within the base plate body. The conductive lines are electrically connected to the transmitting device and the receiving device. In this way, the transmitting device and the receiving device can be directly connected to the conductive lines within the base plate body, using these conductive lines for electrical connection, without the need to design other circuit connections.

[0023] In one possible implementation of the first aspect, the housing includes a metal layer, a first insulating layer, and a second insulating layer. The first insulating layer and the second insulating layer are respectively disposed on opposite sides of the metal layer. In this way, the housing can serve a shielding function, utilizing the metal layer within the housing to prevent external electronic devices from being affected by discharges, thus ensuring the normal operation of the equipment. Simultaneously, the first and second insulating layers can serve an insulating function, preventing the metal layer from affecting other devices.

[0024] In one possible implementation of the first aspect, the transmitting device and the receiving device are arranged sequentially along the direction from the air inlet to the air outlet. In this way, after the external airflow enters through the air inlet, the airflow generated by the attraction of the receiving device moves towards a position close to the receiving device. Because the transmitting and receiving devices are arranged sequentially along the direction from the air inlet to the air outlet, the receiving device can be positioned relatively close to the air outlet, allowing the airflow to be blown out from the air outlet more effectively.

[0025] Secondly, embodiments of this application provide a circuit board assembly, including a circuit board, electronic components, and any one of the heat dissipation structures described in the first aspect. The heat dissipation structure is disposed on the circuit board, and the air outlet area of ​​the heat dissipation structure is thermally connected to the electronic components.

[0026] Since the circuit board assembly provided in this application includes any of the heat dissipation structures in the first aspect, it can solve the same technical problems as the heat dissipation structures described above and achieve the same technical effects, it will not be described again here.

[0027] In one possible implementation of the second aspect, the circuit board includes a first circuit board, a second circuit board, and a third circuit board. The second circuit board is disposed on one side of the first circuit board, surrounding it. The third circuit board is disposed on the side of the second circuit board away from the first circuit board and is connected to the second circuit board. In this way, the first and third circuit boards can form a stacked structure, allowing electronic devices to be placed at different heights, thereby achieving rational space utilization and improving space efficiency. Simultaneously, because the second circuit board surrounds the first circuit board, the first, second, and third circuit boards can form independent chamber spaces, providing a certain degree of shielding and reducing the probability of interference to the electronic devices placed within these chamber spaces.

[0028] In one possible implementation of the second aspect, the electronic device includes a first electronic device. The first electronic device is disposed on a first circuit board, located on the side of the first circuit board closest to the third circuit board. The circuit board assembly also includes a first separator. The first separator is disposed on the side of the first circuit board closest to the third circuit board, forming a housing with portions of the first, second, and third circuit boards. The first separator has an air outlet. The receiving device and the first electronic device are located on opposite sides of the first separator. The first separator allows the receiving device and the first electronic device to be located in a relatively isolated space. This solution utilizes the first, second, and third circuit boards to form an isolated space, eliminating the need for additional components to isolate the transmitting and receiving devices.

[0029] In one possible implementation of the second aspect, the electronic device includes a first electronic device and a second electronic device. The first electronic device is disposed on one side of a first circuit board. The second electronic device is disposed on the side of the first circuit board away from the first electronic device. The circuit board assembly also includes a first shielding cover. The first shielding cover is disposed on the side of the first circuit board closer to the second electronic device, covering the exterior of the second electronic device. A second separator is disposed inside the first shielding cover, forming a housing with the first circuit board and a portion of the first shielding cover. An air outlet is provided on the second separator. The receiving device and the second electronic device are located on opposite sides of the second separator. The second separator also allows the receiving device and the second electronic device to be located in relatively isolated spaces. This solution utilizes the second separator, the first circuit board, and the first shielding cover to form an isolated space, eliminating the need for additional components to isolate the transmitting and receiving devices.

[0030] Thirdly, embodiments of this application provide an electronic device, including a housing assembly and any of the circuit board assemblies described in the second aspect. The circuit board assembly is mounted on the housing assembly.

[0031] Since the electronic device provided in this application includes any of the circuit board assemblies in the second aspect, it can solve the same technical problems as the circuit board assemblies described above and achieve the same technical effects, it will not be described again here.

[0032] In one possible implementation of the third aspect, the number of circuit board assemblies is multiple. Attached Figure Description

[0033] Figure 1 is a schematic diagram of a circuit board assembly in the related technology;

[0034] Figure 2 is a perspective view of an electronic device provided in some embodiments of this application, which is a candybar phone;

[0035] Figure 3 is an exploded view of the electronic device shown in Figure 2;

[0036] Figure 4 is a schematic diagram of the planar structure of the electronic device shown in Figure 2;

[0037] Figure 5 shows the structural layout of the electronic equipment as a double-layer machine;

[0038] Figure 6 is a partial structural schematic diagram of an electronic device provided in an embodiment of this application;

[0039] Figure 7 is a partial structural schematic diagram of another electronic device provided in an embodiment of this application;

[0040] Figure 8 is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0041] Figure 9 is a schematic diagram of the circuit connection of the heat dissipation structure;

[0042] Figure 10 is a line graph showing the temperature of the electronic device over time;

[0043] Figure 11 is a line graph showing the change of the input voltage of the pulse generator over time;

[0044] Figure 12 is a circuit diagram of a pulse transmitter provided in an embodiment of this application;

[0045] Figure 13 is a schematic diagram of a step-up transformer provided in an embodiment of this application;

[0046] Figure 14 is a schematic diagram of a heat dissipation structure provided in an embodiment of this application;

[0047] Figure 15 is a schematic diagram of the structure of the transmitting device shown in Figure 14;

[0048] Figure 16 is a schematic diagram of another heat dissipation structure provided in an embodiment of this application;

[0049] Figure 17 is a schematic diagram of the structure of the transmitting device shown in Figure 16;

[0050] Figure 18 is a schematic diagram of the receiving device shown in Figure 14;

[0051] Figure 19 is a schematic diagram of another heat dissipation structure provided in an embodiment of this application;

[0052] Figure 20 is a partial cross-sectional view of a housing provided in an embodiment of this application;

[0053] Figure 21 is a structural schematic diagram of the side where the air inlet is located in Figure 14;

[0054] Figure 22 is a schematic diagram of the structure on the side where the air inlet is located in Figure 16;

[0055] Figure 23 is a schematic diagram of the structure on the side where the air outlet is located in Figure 14;

[0056] Figure 24 is a schematic diagram of the structure on the side where the air outlet is located in Figure 16;

[0057] Figure 25 is a dimensioning diagram of the structure shown in Figure 14;

[0058] Figure 26 is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0059] Figure 27 is a schematic diagram of another circuit board assembly provided in an embodiment of this application.

[0060] Reference numerals: 100 - Electronic device; 10 - Housing assembly; 101 - First hinge; 10a - Back cover; 10b - Mid-frame; 10b1 - Frame; 10b2 - Mid-plate; 11 - First housing; 12 - Second housing; 21 - Circuit board assembly; 21a - Main board; 21b - Sub-board; 21c - First sub-main board; 211 - Circuit board; 212 - Electronic device; 2121 - System-on-a-chip; 2122 - Flash memory; 2123 - First electronic device; 2124 - Second electronic device; 2125 - Third electronic device; 213 - First circuit board; 214 - Second circuit board; 215 - Third circuit board; 216 - Shielding cover; 2161 - First shielding cover; 2162 - Second separator; 217 - Voltage regulating IC; 218 - Connector; 219 - Temperature sensor; 220 - First separator; 221 - Camera module; 222 - Type 223-SIM card interface; 30-battery; 40-screen; 41-light-transmitting cover; 42-display; 43-heat spreader; 50-flexible circuit board; 61-first through-shaft circuit board; 70-heat dissipation structure; 71-housing; 711-air inlet; 712-air outlet; 713-top plate; 714-side plate; 7141-partition; 715-bottom plate; 7151-bottom plate body; 7152-conductive circuit; 7153-pad; 7154-grounding pad; 716-metal layer; 717a-first insulating layer; 7 17b - Second insulating layer; 718 - Substrate; 719 - Protrusion; 7191 - First protrusion; 7192 - Second protrusion; 72 - Transmitting device; 721 - Conductive element; 7211 - Conductive body; 7212 - Extension; 7213 - First ventilation hole; 722 - Protective element; 73 - Receiving device; 731 - Second ventilation hole; 732 - Receiving body; 733 - Conductive layer; 74 - Pulse generator; 741 - Step-up transformer; 7411 - First coil winding; 7412 - Second coil winding; 742 - Charging circuit. Detailed Implementation

[0061] In the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0062] In the embodiments of this application, it should be understood that the directional terms mentioned, such as "up", "down", "left", "right", "inner", "outer", etc., are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0063] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0064] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0065] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0066] In the embodiments of this application, it should be noted that the descriptions of "vertical" and "parallel" respectively indicate approximately vertical and approximately parallel within a certain error range. This error range can be a range with a deviation angle of less than or equal to 5°, 8° or 10° relative to absolute verticality and absolute parallelism, respectively, and is not specifically limited here.

[0067] With the continuous development of technology, electronic devices such as smartwatches, mobile phones, laptops, and tablets have gradually become essential products for people. To achieve certain functions, electronic devices generally include many electronic components, which are arranged on a circuit board to achieve electrical connections between them.

[0068] As electronic devices become more functional, the number of electronic components on circuit boards also increases. Therefore, in order to reduce the space occupied by circuit boards and electronic components, some electronic devices have multiple circuit boards stacked together, and multiple electronic components are designed in a stacked manner to improve space utilization.

[0069] For example, as shown in FIG1, FIG1 is a schematic diagram of the structure of a circuit board assembly in the related art. The circuit board assembly 010 includes a lower circuit board 011, a middle circuit board 012, an upper circuit board 013, electronic devices 014, a lower shielding cover 015, and an upper shielding cover 016.

[0070] The lower circuit board 011, the middle circuit board 012, and the upper circuit board 013 are stacked sequentially. The lower circuit board 011 and the upper circuit board 013 are fixed to both sides of the middle circuit board 012 by solder balls. The middle circuit board 012 has through holes, and the middle circuit board 012, the lower circuit board 011, and the upper circuit board 013 enclose the first receiving space.

[0071] The lower shield 015 is fixed to the surface of the lower circuit board 011 facing away from the upper circuit board 013, and the lower shield 015 and the lower circuit board 011 enclose a second receiving space. The upper shield 016 is fixed to the surface of the upper circuit board 013 facing away from the lower circuit board 011, and the upper shield 016 and the upper circuit board 013 enclose a third receiving space.

[0072] There are multiple electronic components 014. Some electronic components 014 can be disposed in the first accommodating space and fixed to the surface of the lower circuit board 011 and / or the upper circuit board 013; another group of electronic components 014 can be disposed in the second accommodating space and fixed to the surface of the lower circuit board 011; and yet another group of electronic components 014 can be disposed in the third accommodating space and fixed to the surface of the upper circuit board 013. In this way, by using multiple circuit boards stacked together to centrally arrange the electronic components 014, that is, by optimizing the structure of the circuit board assembly 010, the area space occupied by the circuit board assembly 010 is reduced, so as to make full use of the internal space of the electronic device 100.

[0073] Due to the large number of electronic components 014, the heat generation problem of electronic components 014 is becoming increasingly prominent. The increase in their temperature will lead to a weaker performance release, making it unable to perform its function. It will also cause the temperature of other components (such as the mobile phone casing or mid-frame) to rise, thereby affecting the normal operation of electronic devices.

[0074] For example, the normal operating temperature range for a mobile phone display is -20℃ to 70℃. If the display temperature remains above 70℃ for an extended period, the display's luminous efficiency will decrease rapidly, resulting in noticeable light decay and ultimately irreversible damage. Similarly, the normal operating temperature range for a mobile phone's CPU is 25℃ to 75℃. Excessive temperature can trigger overheat protection, causing the phone to restart or even crash. Furthermore, the normal operating temperature range for peripheral circuits in a mobile phone is -10℃ to 65℃. Temperatures exceeding 70℃ can easily lead to overload or burnout. Finally, the normal operating temperature range for the battery in a mobile phone is generally 0℃ to 40℃. If the battery temperature remains above 40℃ for an extended period, the discharge voltage will decrease, reducing the battery's maximum capacity and shortening its lifespan.

[0075] In related technologies, the heat generated by electronic device 014 is generally dissipated through thermal conduction, using heat-conducting components to conduct the heat away to cool the electronic device 014. Alternatively, active cooling is achieved using a fan.

[0076] However, when using heat-conducting components for heat dissipation, heat needs to be conducted along a specific heat transfer path. Therefore, when the conduction path is long, the overall heat transfer efficiency is low and cannot meet the heat dissipation requirements. When using fans for cooling, the vibration of the fan may cause solder joints or electronic components to vibrate, potentially leading to electronic component failure.

[0077] Based on this, embodiments of this application provide an electronic device, which is a type of electronic device including a circuit board assembly. The circuit board assembly of this application embodiment can provide different functions in different areas.

[0078] The electronic device in this application embodiment can be a candybar electronic device or a foldable electronic device. For example, the electronic device can be a mobile phone, tablet computer, laptop computer, personal digital assistant (PDA), camera, personal computer, in-vehicle equipment, and wearable device. Among them, wearable devices include, but are not limited to, headphones, wristbands, watches, augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses, VR helmets, etc.

[0079] In the following description, a mobile phone is used as an example of an electronic device. However, it should be noted that in the embodiments of this application, all structural layout diagrams are only used to illustrate the composition, approximate arrangement, and connection method of some structures of the electronic device, and do not limit the specific structural type, location, shape, etc. This should not be considered as a limitation of this application.

[0080] In the following embodiments, for ease of understanding, please refer to Figures 2 and 3. Figure 2 is a perspective view of an electronic device 100 as a candybar phone according to some embodiments of this application, and Figure 3 is an exploded view of the electronic device 100 shown in Figure 2. The description uses the candybar phone shown in Figure 2 as an example, which should not be construed as a limitation on the embodiments of this application. In this case, the electronic device 100 includes a housing assembly 10, a circuit board assembly 21, a camera module 221, a battery 30, and a screen 40. The housing assembly 10, circuit board assembly 21, camera module 221, and battery 30 are located on the back of the screen 40 (opposite to the display surface of the screen 40).

[0081] To facilitate the explanation of the candybar phone's structure, an XYZ coordinate system is established in Figure 2. The XY plane can be parallel to the screen's display surface. When the electronic device's outline is rectangular, the X-axis can be aligned with the direction of the shorter side of the outline, and the Y-axis can be aligned with the direction of the longer side. The Z-axis is perpendicular to the XY plane and can represent the stacking direction of the casing components and screen, i.e., the thickness direction of the electronic device.

[0082] It is understood that Figures 2 and 3 only schematically illustrate some of the components included in the electronic device 100, and the actual shape, size, location, and construction of these components are not limited by Figures 2 and 3. In some other examples, the electronic device 100 may also not include the screen 40.

[0083] Screen 40 is used to display images, videos, etc. Referring to Figure 3, screen 40 includes a light-transmitting cover 41 and a display screen 42. The light-transmitting cover 41 and the display screen 42 are stacked together. The light-transmitting cover 41 mainly serves to protect the display screen 42 and prevent dust. The material of the light-transmitting cover 41 includes, but is not limited to, glass. The display screen 42 can be a flexible display screen or a rigid display screen.

[0084] The housing assembly 10 protects the internal components of the electronic device 100. Referring to Figures 1 and 2, the housing assembly 10 includes a back cover 10a and a frame 10b1. The back cover 10a is located on the side of the display screen 42 opposite to the light-transmitting cover plate 41, and is stacked with the light-transmitting cover plate 41 and the display screen 42. The back cover 10a and the light-transmitting cover plate 41 are disposed opposite each other on both sides of the frame 10b1. The light-transmitting cover plate 41, the back cover 10a, and the frame 10b1 form an internal housing space for the electronic device 100. This internal housing space accommodates the display screen 42, the camera module 221, the circuit board assembly 21, and the battery 30.

[0085] In some embodiments, referring to FIG2, the housing assembly 10 further includes a middle plate 10b2. The middle plate 10b2 can be fixed to the inner surface of the frame 10b1. The middle plate 10b2 serves as the structural "skeleton" of the electronic device 100, and the circuit board assembly 21, camera module 221, battery 30, etc. can be fixed to the middle plate 10b2. The structure formed by the frame 10b1 and the middle plate 10b2 can also be referred to as the middle frame 10b. In some other embodiments, the electronic device 100 may not include the middle plate 10b2.

[0086] Referring to Figure 2, the circuit board assembly 21 includes a circuit board 211 and electronic components 212. The circuit board 211 is used to integrate the electronic components 212. The circuit board 211 can be a printed circuit board (PCB), a flexible printed circuit (FPC), an integrated circuit (or chip), etc., as long as it integrates circuitry and allows for interconnection. The shape of the circuit board 211 includes, but is not limited to, rectangles, squares, polygons, circles, etc.

[0087] Among them, electronic devices 212 include, but are not limited to, system on a chip (SOC), universal flash storage (UFS), radio frequency power amplifier (RFPA), power management unit (PMU), system in a package (SIP), radio frequency integrated circuit (RFIC), charger IC, double data rate synchronous dynamic random access memory (DDR), antenna module, Bluetooth module, WiFi module, GPS module and operation module, resistors, capacitors, inductors, potentiometers, vacuum tubes, etc.

[0088] The circuit board assembly 21 can be electrically connected to devices such as the display screen 42 and the camera module 221 to perform signal control, data signal processing, and data signal storage operations on the display screen 42, camera module 221, and other devices. For example, it enables the screen 40 to perform display or operation functions.

[0089] The camera module 221 is used to capture photos / videos. The camera module 221 may include at least one of a rear camera module and a front camera module. Multiple camera modules 221 may be included; for example, in the embodiment shown in FIG. 2, the number of camera modules 221 is three. In other embodiments, the number of camera modules 221 may be one, two, or more than three. The camera module 221 may be fixed to at least one of the circuit board 211, the middle plate 10b2, and the back cover 10a, with the light-incident surface 221a of the camera module 221 facing the back cover 10a.

[0090] The battery 30 is used to provide power to devices such as the display screen 42 and the circuit board assembly 21 within the electronic device 100. In some embodiments, the surface of the middle plate 10b2 facing the back cover 10a has a mounting groove for the battery 30, and the battery 30 is mounted in the mounting groove.

[0091] Please refer to Figure 4, which is a schematic diagram of the planar structure of the electronic device 100 shown in Figure 2. The two circuit boards 211 in Figure 2 can respectively form the main board 21a and the sub-board 21b in Figure 3. The main board 21a is located near the top of the housing assembly 10, and the sub-board 21b is located near the bottom of the housing assembly 10. The battery 30 can be located between the main board 21a and the sub-board 21b. The top and bottom refer to the top and bottom of the mobile phone in the user's direction. The main board 21a and the sub-board 21b, as well as the main board 21a and the battery 30, can be electrically connected through flexible printed circuit boards 50 (FPCs). Each flexible printed circuit board and the circuit board 211 connected to it can be electrically connected through connectors. For example, the electronic devices 212 on the main board 21a include a system-on-a-chip 2121 and a general-purpose flash memory 2122, etc., and the sub-board 21b is provided with a Type-C interface 222 and a SIM card interface 223, etc.

[0092] In other embodiments, the electronic device 100 can also be a double-layer machine. In this case, the number of circuit board assemblies 21 can be multiple. For example, please refer to FIG5, which is a structural layout diagram of the electronic device 100 as a double-layer machine. The housing assembly 10 includes a first housing 11, a second housing 12, and a first rotating shaft 101. The first housing 11 and the second housing 12 are rotatably connected by the first rotating shaft 101. After the first housing 11 and the second housing 12 rotate towards each other, the first housing 11 and the second housing 12 are stacked, and the housing assembly 10 is in a folded state. The first housing 11 and the second housing 12 can also rotate in opposite directions until the first housing 11 and the second housing 12 are on the same plane, at which point the housing assembly 10 is in an unfolded state. A battery 30 is respectively disposed inside the first housing 11 and the second housing 12. The circuit board assembly 21 includes a main board 21a and a sub-board 21b disposed in the first housing 11, and a first sub-main board 21c disposed in the second housing 12. The arrangement and connection method of the main board 21a, sub-board 21b and battery 30 in the first housing 11 are similar to those on the candybar phone in Figure 1, and will not be described in detail here. The camera module 221 is disposed in the second housing 12. The first sub-main board 21c is disposed in the second housing 12 and is located near the top of the second housing 12. The battery 30 of the second housing 12 is located on the side of the first sub-main board 21c near the bottom and is electrically connected to the first sub-main board 21c through a flexible circuit board 50. The first sub-main board 21c and the camera module 221 are electrically connected through the flexible circuit board 50. The main board 21a and the first sub-main board 21c are electrically connected through the first through-shaft circuit board 61. The first through-shaft circuit board 61 spans the first rotating shaft 101. The way it spans the first rotating shaft 101 can be by passing through the inside of the first rotating shaft 101 or by going around the outer surface of the first rotating shaft 101, thus realizing the electrical connection of each circuit board 211.

[0093] The circuit board assembly provided in the embodiments of this application will be described in detail below. As shown in FIG6, FIG6 is a partial structural schematic diagram of an electronic device 100 provided in the embodiments of this application. The circuit board 211 may include a first circuit board 213, a second circuit board 214 and a third circuit board 215.

[0094] The second circuit board 214 is disposed on one side of the first circuit board 213, surrounding the first circuit board 213. The third circuit board 215 is disposed on the side of the second circuit board 214 away from the first circuit board 213, and is connected to the second circuit board 214. In this way, the first circuit board 213 and the third circuit board 215 can form a stacked structure, allowing electronic devices 212 to be placed at different heights, thereby achieving rational use of space and improving space utilization.

[0095] Meanwhile, since the second circuit board 214 is arranged around the first circuit board 213, the first circuit board 213, the second circuit board 214, and the third circuit board 215 can form an independent cavity space, which can play a certain shielding role, reducing the probability of interference to the electronic device 212 located in the cavity space.

[0096] Of course, in some other embodiments, the circuit board 211 may only include the first circuit board 213, and the specific design can be made according to the actual situation.

[0097] Referring again to Figure 6, electronic device 212 may include a first electronic device 2123 and a second electronic device 2124. The first electronic device 2123 may be disposed on one side of the first circuit board 213, and the second electronic device 2124 may be disposed on the side of the first circuit board 213 away from the first electronic device 2123. Thus, as shown in Figure 6, the first electronic device 2123 and the second electronic device 2124 can be disposed on different sides of the first circuit board 213, making the arrangement of electronic device 212 more rational and improving space utilization.

[0098] For example, based on the scheme shown in FIG6, the first electronic device 2123 can be located on the side of the first circuit board 213 closer to the third circuit board 215, and the second electronic device 2124 can be located on the side of the first circuit board 213 away from the third circuit board 215. The first electronic device 2123 may include a PMU, a SIP, and capacitors, etc. The second electronic device 2124 may include a SOC and DDR, etc. When the second electronic device 2124 includes both a SOC and DDR, the SOC can be soldered to the first circuit board 213 using solder balls, and the DDR can be soldered to the side of the SOC away from the first circuit board 213 using solder balls.

[0099] Referring again to Figure 6, to achieve more functions, electronic device 212 may also include a third electronic device 2125. Meanwhile, since circuit board 211 includes a third circuit board 215, the third electronic device 2125 can be disposed on the third circuit board 215. Thus, by disposing of the third electronic device 2125 on the third circuit board 215, space utilization can be ensured.

[0100] Furthermore, as shown in Figure 6, in some embodiments, the circuit board assembly 21 may also include multiple shielding covers 216. The shielding covers 216 may be disposed on the circuit board 211. Some electronic components 212 may be disposed within the shielding covers 216. Thus, by providing the shielding covers 216, interference can be avoided to the electronic components 212 within the shielding covers 216, ensuring their normal operation.

[0101] Based on the scheme shown in Figure 6, heat can be dissipated through conduction. For example, when the second electronic device 2124 includes a SOC and DDR, the heat it generates can be transferred to the shield 216 or copper foil through the air. The copper foil is then transferred to the heat dissipation plate 43 on the side of the middle frame 10b or the display screen 42 through the thermally conductive material. In this process, the contact thermal resistance between the second electronic device 2124 and the shield 216 or the middle frame 10b is relatively large, the heat transfer path is long, and the heat transfer effect is poor.

[0102] Therefore, in order to better dissipate heat from the electronic devices 212 on the circuit board 211, as shown in Figure 7, which is a partial structural schematic diagram of another electronic device 100 provided in an embodiment of this application, the circuit board assembly 21 may further include a heat dissipation structure 70. The heat dissipation structure 70 can ionize air to generate ion wind, using the wind force to blow away the heat generated by the electronic devices 212.

[0103] The exhaust area of ​​the heat dissipation structure 70 is thermally connected to the electronic device 212. This allows the airflow from the heat dissipation structure 70 to effectively carry away the heat generated by the electronic device 212, achieving active heat dissipation. Simultaneously, because the heat dissipation structure 70 generates ionized air, it can dissipate heat from the electronic device 212 without vibration, preventing fatigue failure caused by vibration of solder joints or the electronic device 212.

[0104] As shown in Figure 8, which is a schematic diagram of another circuit board assembly 21 provided in an embodiment of this application, in some embodiments, the heat dissipation structure 70 may include a housing 71, an emitting device 72, and a receiving device 73. The housing 71 is provided with an air inlet 711 and an air outlet 712. The emitting device 72 and the receiving device 73 are disposed inside the housing 71. The emitting device 72 is used to generate charged ions, and the receiving device 73 is used to attract charged ions.

[0105] In this way, after the emitting device 72 generates charged ions, the receiving device 73 can attract the charged ions. During the movement, the charged ions can drive the surrounding air molecules to move together, forming an airflow. At the same time, since the housing 71 has an air inlet 711 and an air outlet 712, the air pressure balance inside the housing 71 can be maintained. External air can enter the housing 71 under the drive of the above airflow and be blown out from the air outlet 712 to dissipate heat from the electronic device 212 that needs to be cooled. In addition, as mentioned above, this heat dissipation structure 70 can dissipate heat from the electronic device 212 without vibration, avoiding fatigue failure caused by vibration of solder joints and electronic device 212.

[0106] In some embodiments, as shown in FIG8, the heat dissipation structure 70 further includes a pulse generator 74. The pulse generator 74 includes a positive port and a negative port. The positive port is electrically connected to the emitting device 72, and the negative port is electrically connected to the receiving device 73. In this way, the pulse generator 74 can generate pulses, enabling the emitting device 72 to ionize the air and generate charged ions. At the same time, the receiving device 73 can attract the generated charged ions, thereby driving the surrounding air molecules to flow and form an airflow. Of course, the heat dissipation structure 70 can also generate ion wind in other ways. For example, in some embodiments, the emitting device 72 and the receiving device 73 can be connected to the positive and negative terminals of a power supply device, respectively, to generate ion wind.

[0107] In some embodiments, as shown in FIG9, which is a circuit connection diagram of the heat dissipation structure 70, the circuit board assembly 21 may further include a voltage regulating IC 217, which can be electrically connected to the pulse generator 74. The voltage regulating IC 217 can adjust the input voltage of the pulse generator 74. In this way, the pulse generator 74 can output different voltages through the adjustment of the voltage regulating IC 217, thereby achieving different heat dissipation effects.

[0108] Furthermore, as shown in Figure 9, the circuit board assembly 21 may also include a connector 218. The connector 218 can be electrically connected to the battery 30, the electronic device 212, and the voltage regulator IC 217. In this way, electrical energy from the battery 30 can be transferred to the electronic device 212 and the voltage regulator IC 217 via the connector 218. The circuit board assembly 21 may also include a temperature sensor 219. The temperature sensor 219 can be used to detect the temperature of the electronic device 212 to adjust the output voltage of the voltage regulator IC 217 according to the temperature detected by the temperature sensor 219.

[0109] Based on the above scheme, when using the heat dissipation structure 70 for heat dissipation, the heat dissipation efficiency of the heat dissipation structure 70 can be adjusted by controlling the voltage output of the pulse generator 74. When the voltage output of the pulse generator 74 increases, the emitting device 72 can ionize more air and generate more charged ions. Correspondingly, the receiving device 73 can also attract more charged ions, thereby better driving the airflow to improve heat dissipation efficiency.

[0110] For example, as shown in Figures 10 and 11, Figure 10 is a line graph showing the temperature of electronic device 212 over time, and Figure 11 is a line graph showing the input voltage of pulse generator 74 over time. During the initial startup phase, the temperature of electronic device 212 gradually rises to T1. Correspondingly, the heat dissipation structure 70 activates to cool electronic device 212, and the temperature of electronic device 212 gradually decreases from time t1 to time t2. At this time, the temperature of electronic device 212 drops to T2, and the heat dissipation structure 70 can gradually shut down. Then, the temperature of electronic device 212 gradually rises again to T3 from time t2 to time t3. At this time, the heat dissipation structure 70 can be activated again, maintaining the temperature of electronic device 212 at T3. Finally, electronic device 212 stops operating at time t4, the heat dissipation structure 70 can be shut down, and the temperature of electronic device 212 gradually decreases to T0.

[0111] Understandably, the specific value of the output voltage of the regulating IC to the pulse generator 74 can be selected according to the actual situation. As an example, the change of the voltage output of the voltage regulating IC 217 to the pulse generator 74 over time can be referred to Table 1 below. Table 1 is a table showing the change of the input voltage of the pulse generator 74 at different times.

[0112] Table 1

[0113] In some embodiments, as shown in FIG12, which is a circuit diagram of a pulse transmitter provided in an embodiment of this application, the pulse generator 74 may include a step-up transformer 741. As shown in FIG13, which is a structural diagram of a step-up transformer 741 provided in an embodiment of this application, the step-up transformer 741 includes a first coil winding 7411 and a second coil winding 7412. The number of turns in the first coil winding 7411 is greater than the number of turns in the second coil winding 7412, and the coil diameter of the first coil winding 7411 is smaller than the coil diameter of the second coil winding 7412. The first coil winding 7411 includes a positive terminal and a negative terminal.

[0114] Because the number of turns in the first coil winding 7411 is greater than the number of turns in the second coil winding 7412, and the coil diameter of the first coil winding 7411 is smaller than the coil diameter of the second coil winding 7412, the voltage output of the first coil winding 7411 increases, thereby enabling the transmitting device 72 to ionize the air more smoothly and increase the number of charged ions. The receiving device 73 can also attract charged ions better, thereby enabling the airflow to flow more quickly and increasing the wind speed.

[0115] In some embodiments, the pulse generator 74 may further include a charging circuit 742. The charging circuit 742 may be electrically connected to the second coil winding 7412. The pulse generator 74 can be connected to an external power supply via the charging circuit 742 to allow current to flow through the second coil winding 7412. Exemplarily, the charging circuit 742 may be connected to the battery 30. The charging circuit 742 may include components such as capacitors and resistors, and the specific design can be tailored to actual conditions; this is only an example.

[0116] To ensure that the first coil winding 7411 can output sufficient voltage, in some embodiments, the ratio of the number of turns in the first coil winding 7411 to the number of turns in the second coil winding 7412 is greater than or equal to 1000, and the ratio of the coil diameter of the second coil winding 7412 to the coil diameter of the first coil winding 7411 is greater than or equal to 10. Thus, based on the aforementioned ratio of the number of turns and coil diameter of the first coil winding 7411 and the second coil winding 7412, the voltage can be increased by more than 1000 times, ensuring that the first coil winding 7411 can output sufficient voltage to ionize the air.

[0117] Of course, the ratio of the number of turns of the first coil winding 7411 to the number of turns of the second coil winding 7412, and the ratio of the coil diameter of the second coil winding 7412 to the coil diameter of the first coil winding 7411, can also be other values. The specific design can be made according to the actual situation. This is only used as an example for illustration.

[0118] In some embodiments, the number of turns of the first coil winding 7411 is greater than or equal to 10,000 and less than or equal to 50,000. The number of turns of the second coil winding 7412 is greater than or equal to 10 and less than or equal to 50. The diameter of the first coil winding 7411 is greater than or equal to 0.05 and less than or equal to 0.2. The diameter of the second coil winding 7412 is greater than or equal to 0.8 and less than or equal to 2.

[0119] In some embodiments, as shown in FIG14, which is a schematic diagram of a heat dissipation structure 70 provided in an embodiment of this application, the emitting device 72 may include a conductive element 721. The conductive element 721 includes a conductive body 7211 and an extension 7212 electrically connected to the conductive body 7211. At least a portion of the extension 7212 is located on the side of the conductive body 7211 facing the receiving device 73. Thus, the extension 7212 can form a pointed structure. When the conductive element 721 is connected to an external power supply device through the conductive body 7211, an electric field can be formed at the end of the extension 7212. When the electric field reaches an intensity capable of ionizing air, the air edge can be ionized at the end of the extension 7212 to form charged ions.

[0120] In some embodiments, as shown in FIG15, which is a schematic diagram of the structure of the emitting device 72 shown in FIG14, there are multiple extensions 7212. The multiple extensions 7212 are arranged in a ring array. Thus, by providing multiple extensions 7212, the ability of the conductive element 721 to ionize air can be further enhanced, ionizing more charged ions, thereby better driving the air to flow.

[0121] In some embodiments, as shown in FIG16, which is a schematic diagram of another heat dissipation structure 70 provided in this application embodiment, the extension 7212 is a conical structure. The bottom of the extension 7212 is connected to the conductive body 7211. Because the extension 7212 is a conical structure, the top of the extension 7212 can more easily ionize the air to generate charged ions, thereby improving the ionization efficiency of the emitting device 72. Of course, in other embodiments, the extension 7212 can also be other shapes. For example, the extension 7212 can also be a columnar structure.

[0122] In some embodiments, as shown in FIG17, which is a schematic diagram of the structure of the transmitting device 72 shown in FIG16, the conductive body 7211 has a first ventilation hole 7213. The first ventilation hole 7213 penetrates the conductive body 7211 along the arrangement direction of the transmitting device 72 and the receiving device 73. Thus, when the charged ions generated by the transmitting device 72 are attracted by the receiving device 73, the air around the transmitting device 72 also flows towards the receiving device 73 along with the charged ions. Because the conductive body 7211 has the first ventilation hole 7213, air can flow through the first ventilation hole 7213 to the receiving device 73, making the airflow smoother and thus better forming an airflow.

[0123] For example, as shown in FIG17, the conductive body 7211 may have a single first ventilation hole 7213. In this case, the diameter of the first ventilation hole 7213 may be relatively large. Of course, in other embodiments, the conductive body 7211 may also have multiple first ventilation holes 7213. In this case, the size of the first ventilation holes 7213 may be relatively small.

[0124] Of course, in some other embodiments, the conductive body 7211 may not have the aforementioned first ventilation hole 7213. In this case, airflow can also flow through the periphery of the conductive body 7211.

[0125] In some embodiments, as shown in FIG15, the transmitting device 72 further includes a protective member 722. The protective member 722 includes a first surface facing the receiving device 73 and a second surface opposite to the first surface. A conductive body 7211 is disposed on the second surface. At least a portion of the extension 7212 is embedded within the protective member 722. At least one end face of the extension 7212 facing the receiving device 73 is exposed outside the protective member 722 (as shown in FIG14).

[0126] Therefore, the protective component 722 can change the electric field, thereby altering the electric field distribution. This changes the electric field distribution within the extension 7212 embedded in the protective component 722, making the electric field more concentrated at the end face of the extension 7212 facing the receiving device 73, thus improving the discharge efficiency at that end and ionizing more air.

[0127] It is understood that the protective component 722 can be made of insulating material, and the specific material can be designed according to the actual situation. For example, the protective component 722 can be made of the same material used to make circuit board 211, and can be manufactured by making circuit board 211.

[0128] Of course, in some other embodiments, as shown in FIG16, the transmitting device 72 may only include the conductive element 721. In this case, the composition of the transmitting device 72 is simpler, the manufacturing process is simpler, and costs can be saved.

[0129] In some embodiments, the receiving device 73 has a second ventilation hole 731. The second ventilation hole 731 extends through the receiving device 73 along the arrangement direction of the transmitting device 72 and the receiving device 73. Thus, during the process of attracting charged ions, the gas also moves towards the receiving device 73, forming an airflow. Because the receiving device 73 has the second ventilation hole 731, the airflow can directly pass through the receiving device 73 from the second ventilation hole 731, ensuring smooth airflow.

[0130] Similarly, the number of second ventilation holes 731 can be designed according to actual conditions. For example, the number of second ventilation holes 731 can be a single one. In this case, the diameter of the second ventilation hole 731 can be relatively large. Of course, the number of second ventilation holes 731 can also be multiple. In this case, the diameter of the second ventilation holes 731 can be relatively small.

[0131] In some embodiments, as shown in FIG18, which is a schematic diagram of the receiving device 73 shown in FIG14, the receiving device 73 includes a receiving body 732 and a conductive layer 733. The receiving body 732 has a second ventilation hole 731. The conductive layer 733 covers the surface of the receiving body 732 and the inner surface of the second ventilation hole 731. Thus, when the conductive layer 733 is connected to an external power supply device, the conductive layer 733 can attract charged ions, causing the charged ions to be attracted to the conductive layer 733, thereby driving the air to flow and forming an ion wind. At the same time, by setting the receiving body 732, the discharge phenomenon of the receiving device 73 can be improved, the flow path of the charge can be better controlled, and unnecessary discharge phenomena can be avoided.

[0132] It is understood that the receiving body 732 can be made of insulating material. For example, the receiving body 732 can be made in the same way as the circuit board 211. Alternatively, the receiving body 732 can also be a structural component, formed by machining, and the specific manufacturing method can be selected according to the actual situation. Furthermore, the material of the conductive layer 733 can be selected according to the actual situation, as long as it can conduct electricity. For example, the conductive layer 733 can be made of pure copper. Alternatively, the conductive layer 733 can also be made of nickel silver.

[0133] Of course, in other embodiments, the receiving device 73 may also be made of only conductive material. In this case, since the receiving device 73 is made of only conductive material, it has good conductivity and can better attract and collect charges, thereby improving collection efficiency.

[0134] In some embodiments, as shown in FIG8, the housing 71 includes a top plate 713 and a side plate 714. The side plate 714 is located on one side of the top plate 713 and is disposed around the circumference of the top plate 713. In application, the housing 71 can be disposed on the circuit board 211. In this way, the housing 71 and the circuit board 211 can form a sealed space, which provides protection.

[0135] In some embodiments, as shown in FIG14, the housing 71 may further include a base plate 715. The base plate 715 is located on the side of the side plate 714 away from the top plate 713 and is connected to the side plate 714. The base plate 715, the side plate 714, and the top plate 713 form an accommodating space. The transmitting device 72 and the receiving device 73 are accommodated in the accommodating space and disposed on the base plate 715. Thus, the housing 71 itself can directly form a sealed space. In use, the housing 71 can be directly fixed to the circuit board 211.

[0136] To achieve electrical connection between the transmitting device 72 and the receiving device 73, in some embodiments, as shown in FIG14, the base plate 715 may include a base plate body 7151 and conductive lines 7152 disposed within the base plate body 7151. The conductive lines 7152 are electrically connected to the transmitting device 72 and the receiving device 73. In this way, the transmitting device 72 and the receiving device 73 can be directly connected to the conductive lines 7152 within the base plate body 7151, and electrical connection can be achieved using the conductive lines 7152, without the need to design other circuit connections.

[0137] At this point, as shown in Figure 14, the pulse generator 74 can be mounted on the base plate 715 and electrically connected to the conductive lines 7152 within the base plate body 7151. In this way, the pulse generator 74 can be electrically connected to the transmitting device 72 and the receiving device 73 via the conductive lines 7152. For example, as shown in Figure 14, the conductive lines 7152 may include multiple pads 7153, which can realize electrical connections with the pulse generator 74, the transmitting device 72, and the receiving device 73.

[0138] Of course, the transmitting device 72 and the receiving device 73 can also be electrically connected in other ways. In some embodiments, as shown in FIG19, which is a schematic diagram of another heat dissipation structure 70 provided in the embodiments of this application, the base plate 715 may not include the aforementioned conductive line 7152. In this case, the transmitting device 72 and the receiving device 73 can be electrically connected through external lines, and only the transmitting device 72 and the receiving device 73 can be provided inside the housing 71, thereby making the size of the housing 71 relatively small and reducing the space occupied.

[0139] Alternatively, when the housing 71 does not include the base plate 715, as shown in FIG8, in some embodiments, the transmitting device 72 and the receiving device 73 can be electrically connected to the circuit board 211. In this way, the transmitting device 72 and the receiving device 73 can be directly electrically connected through the circuit board 211, which is simple and convenient.

[0140] In some embodiments, as shown in FIG20, which is a partial cross-sectional view of a housing 71 provided in an embodiment of the present application, the housing 71 includes a metal layer 716, a first insulating layer 717a, and a second insulating layer 717b. The first insulating layer 717a and the second insulating layer 717b are respectively disposed on opposite sides of the metal layer 716. In this way, the housing 71 can play a shielding role, using the metal layer 716 in the housing 71 to prevent the electronic devices 212 outside the housing 71 from being affected by discharge, thus ensuring the normal operation of the device. At the same time, the first insulating layer 717a and the second insulating layer 717b can play an insulating role, preventing the metal layer 716 from affecting other devices.

[0141] It is understood that the specific materials of the metal layer 716, the first insulating layer 717a, and the second insulating layer 717b can be selected according to the actual situation. For example, the metal layer 716 can be made of aluminum foil. The first insulating layer 717a and the second insulating layer 717b can be made of insulating materials such as polyurethane or polyphenylene ether.

[0142] In some embodiments, as shown in FIG20, the number of metal layers 716 can be multiple. The housing 71 may also include a substrate 718. The metal layers 716 can be stacked on opposite sides of the substrate 718. The first insulating layer 717a and the second insulating layer 717b can be stacked on the side of the metal layers 716 away from the substrate 718. By providing the substrate 718, the metal layers 716 can be formed by directly coating metal onto the surface of the substrate 718, making the manufacturing process simple and convenient.

[0143] The substrate 718 may be made of glass fiber, resin, and filler. Glass fiber enhances the stiffness and strength of the substrate 718 while ensuring its dimensional stability, preventing deformation or warping due to thermal expansion and contraction. Resin acts as a binder, binding the glass fibers together to form a robust overall structure. Filler improves the thermal properties of the substrate 718, enhancing its heat dissipation. For example, filler may include materials such as silica or alumina.

[0144] Of course, in other embodiments, the housing 71 may also exclude the substrate 718 and be made directly from the metal layer 716, the first insulating layer 717a, and the second insulating layer 717b.

[0145] Furthermore, as described above, the housing 71 includes a metal layer 716, which provides shielding. Therefore, to achieve grounding, as shown in FIG14, the conductive line 7152 may include a grounding pad 7154, which can be used for grounding.

[0146] Furthermore, based on the scheme shown in Figure 19, a plurality of protrusions 719 can be formed on the inner wall of the housing 71. These protrusions 719 may include a plurality of first protrusions 7191 and a plurality of second protrusions 7192. The plurality of first protrusions 7191 can be located between the transmitting device 72 and the receiving device 73. For example, a rectangular first protrusion 7191 can be designed on both the bottom plate 715 and the top plate 713. The first protrusions 7191 can serve as a separator and also as insulation, preventing the transmitting device 72 and the receiving device 73 from contacting each other and forming an electrical connection.

[0147] Multiple second protrusions 7192 may be distributed on the side of the receiving device 73 away from the transmitting device 72, the side of the transmitting device 72 away from the receiving device 73, and the side of the pulse generator 74 away from the transmitting device 72. The second protrusions 7192 also serve to isolate and insulate, preventing direct contact between the aforementioned components. For example, the shape of the second protrusions 7192 may be a non-perfect spherical structure.

[0148] Of course, in some other embodiments, as shown in FIG16, the protrusion 719 may not be provided inside the housing.

[0149] In order to allow external airflow to enter better and to flow out better under the action of the transmitting device 72 and the receiving device 73, in some embodiments, the transmitting device 72 and the receiving device 73 can be arranged sequentially along the direction from the air inlet 711 to the air outlet 712.

[0150] In this way, after the external airflow enters through the air inlet 711, the airflow generated by the attraction of the receiving device 73 moves towards a position close to the receiving device 73. Since the transmitting device 72 and the receiving device 73 are arranged sequentially along the direction from the air inlet 711 to the air outlet 712, the receiving device 73 can be positioned relatively close to the air outlet 712, allowing the airflow to be blown out from the air outlet 712 more effectively.

[0151] It is understandable that the specific design locations of the air inlet 711 and the air outlet 712 can be designed according to actual conditions. For example, as shown in Figure 8, the air inlet 711 can be located on the top plate 713, and the air outlet 712 can be located on the side plate 714, opposite to the receiving device 73. Alternatively, as shown in Figures 14 and 16, the air inlet 711 and the air outlet 712 can be located on the side plate 714. Along the arrangement direction of the transmitting device 72 and the receiving device 73, the air inlet 711 and the air outlet 712 are opposite to each other. Or, as shown in Figure 7, the air inlet 711 can also be located on the first circuit board 213.

[0152] Furthermore, it is understood that the specific structures of the air inlet 711 and the air outlet 712 can be designed according to actual conditions. For example, in some embodiments, as shown in Figure 21, which is a structural schematic diagram of the side where the air inlet 711 is located in Figure 14, the side plate 714 with the air inlet 711 can be a rectangular plate. Simultaneously, a partition 7141 is also formed on the side plate 714, which divides the air inlet 711 into multiple independent sub-air inlets. In this way, the partition 7141 can prevent other components from blowing in and can also separate the airflow at the air inlet 711 to form multiple airflow streams. Alternatively, as shown in Figure 22, which is a structural schematic diagram of the side where the air inlet 711 is located in Figure 16, the outer contour of the side plate 714 with the air inlet 711 can be approximately circular.

[0153] Similarly, as shown in Figures 23 and 24, Figure 23 is a structural schematic diagram of the side where the air outlet 712 is located in Figure 14. The side plate 714 with the air outlet 712 can be a rectangular plate. Alternatively, as shown in Figure 24, Figure 24 is a structural schematic diagram of the side where the air outlet 712 is located in Figure 16. The outer contour of the side plate 714 with the air inlet 711 can be approximately circular.

[0154] Based on the scheme shown in Figure 14, and in conjunction with the markings in Figures 20, 21, 23 and 25 (Figure 25 is a dimension marking diagram of the structure shown in Figure 14), in order to enable the above-mentioned heat dissipation structure 70 to adapt to the installation space of the electronic device 100 (e.g., a mobile phone), taking the structure of the embodiment shown in Figure 14 as an example, some dimensions of the heat dissipation structure 70 provided in the embodiments of this application are described by way of example. The specific dimensions are shown in Table 2 below. Table 2 is a dimension design table of a heat dissipation structure 70 provided in the embodiments of this application.

[0155] Table 2

[0156] It should be noted that the units of the values ​​in Table 2 above are all in mm.

[0157] Similarly, as an example, in order to enable the above-mentioned heat dissipation structure 70 to adapt to the installation space of the electronic device 100 (e.g., mobile phone), taking the structure of the embodiment shown in FIG16 as an example, and in conjunction with the annotations of FIG16, FIG17 and FIG24, some dimensions of the heat dissipation structure 70 provided in the embodiments of this application are described by way of example. The specific dimensions are shown in Table 3 below. Table 3 is a dimension design table of another heat dissipation structure 70 provided in the embodiments of this application.

[0158] Table 3

[0159] It should be noted that the units of the values ​​in Table 3 above are all mm.

[0160] In some embodiments, as shown in FIG26, which is a schematic diagram of another circuit board assembly 21 provided in this application embodiment, the circuit board assembly 21 further includes a first partition 220. The first partition 220 is disposed on the side of the first circuit board 213 near the third circuit board 215, and forms a housing 71 with portions of the first circuit board 213, the second circuit board 214, and the third circuit board 215. The first partition 220 has an air outlet 712. The receiving device 73 and the first electronic device 2123 are located on opposite sides of the first partition 220.

[0161] Therefore, the first separator 220 allows the receiving device 73 and the transmitting device 72 to be located in relatively isolated spaces. This solution utilizes the first circuit board 213, the second circuit board 214, and the third circuit board 215 to form the isolation space, eliminating the need for additional components to isolate the transmitting device 72 and the receiving device 73. Of course, in other embodiments, based on the aforementioned circuit board 211, as shown in FIG7, the heat dissipation structure 70 may also include a separate housing 71, which may be disposed on the circuit board 211.

[0162] In some embodiments, as shown in FIG27, which is a schematic diagram of another circuit board assembly 21 provided in an embodiment of this application, a plurality of shielding covers 216 may include a first shielding cover 2161. The first shielding cover 2161 is disposed on the side of the first circuit board 213 near the second electronic device 2124, covering the outside of the second electronic device 2124. A second partition 2162 is disposed inside the first shielding cover 2161, forming a housing 71 with the first circuit board 213 and a portion of the first shielding cover 2161. An air outlet 712 is provided on the second partition 2162. A receiving device 73 and the second electronic device 2124 are located on opposite sides of the second partition 2162.

[0163] Therefore, the second separator 2162 allows the receiving device 73 and the transmitting device 72 to be located in relatively isolated spaces. This solution utilizes the second separator 2162, the first circuit board 213, and the first shielding cover 2161 to form an isolated space, eliminating the need for additional components to isolate the transmitting device 72 and the receiving device 73. The heat from the first shielding cover 2161 can be transferred to the copper foil, and then through the thermally conductive material to the heat dissipation plate of the middle frame or screen. The heat transfer process can be referenced from the heat dissipation path at the second electronic device 2124 shown in Figure 6.

[0164] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0165] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation structure, characterized in that, include: The casing is equipped with an air inlet and an air outlet; A transmitting device and a receiving device are disposed within the housing; the transmitting device is used to generate charged ions, and the receiving device is used to attract the charged ions.

2. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure also includes: A pulse generator, comprising a positive port and a negative port; the positive port is electrically connected to the transmitting device; and the negative port is electrically connected to the receiving device.

3. The heat dissipation structure according to claim 2, characterized in that, The pulse generator includes: A step-up transformer includes a first coil winding and a second coil winding; the number of turns of the first coil winding is greater than the number of turns of the second coil winding, and the coil diameter of the first coil winding is smaller than the coil diameter of the second coil winding; wherein, the first coil winding includes the positive terminal and the negative terminal.

4. The heat dissipation structure according to claim 3, characterized in that, The ratio of the number of turns in the first coil winding to the number of turns in the second coil winding is greater than or equal to 1000, and the ratio of the coil diameter of the second coil winding to the coil diameter of the first coil winding is less than or equal to 10.

5. The heat dissipation structure according to claim 4, characterized in that, The number of turns in the first coil winding is greater than or equal to 10,000 and less than or equal to 50,000; the number of turns in the second coil winding is greater than or equal to 10 and less than or equal to 50; the diameter of the first coil winding is greater than or equal to 0.05 and less than or equal to 0.2; the diameter of the second coil winding is greater than or equal to 0.8 and less than or equal to 2.

6. The heat dissipation structure according to claim 1, characterized in that, The transmitting device includes: A conductive element, the conductive element comprising a conductive body and an extension electrically connected to the conductive body; at least a portion of the extension is located on the side of the conductive body facing the receiving device.

7. The heat dissipation structure according to claim 6, characterized in that, The number of the extensions is multiple; the multiple extensions are arranged in a circular array.

8. The heat dissipation structure according to claim 6, characterized in that, The extension has a tapered structure, and the bottom of the extension is connected to the conductive body.

9. The heat dissipation structure according to claim 6, characterized in that, The conductive body has a first ventilation hole; the first ventilation hole penetrates the conductive body along the arrangement direction of the transmitting device and the receiving device.

10. The heat dissipation structure according to claim 6, characterized in that, The transmitting device also includes: A protective element, the protective element comprising a first surface facing the receiving device and a second surface opposite to the first surface, the conductive body being disposed on the second surface, at least a portion of the extension being embedded within the protective element, and at least the end face of the extension facing the receiving device being exposed outside the protective element.

11. The heat dissipation structure according to claim 1, characterized in that, The receiving device has a second ventilation hole; the second ventilation hole penetrates the receiving device along the arrangement direction of the transmitting device and the receiving device.

12. The heat dissipation structure according to claim 11, characterized in that, The receiving device includes: The receiving body, wherein the receiving body is provided with the second ventilation hole; and, A conductive layer covers the surface of the receiving body and the inner surface of the second ventilation hole.

13. The heat dissipation structure according to claim 1, characterized in that, The housing includes: Top slab; and, Side panels are located on one side of the top plate and are arranged around the circumference of the top plate.

14. The heat dissipation structure according to claim 13, characterized in that, The housing also includes: A base plate is located on the side of the side plate away from the top plate and is connected to the side plate; the base plate, the side plate, and the top plate form an accommodating space; the transmitting device and the receiving device are accommodated in the accommodating space and disposed on the base plate.

15. The heat dissipation structure according to claim 14, characterized in that, The base plate includes a base plate body and conductive lines disposed within the base plate body; the conductive lines are electrically connected to the transmitting device and the receiver.

16. The heat dissipation structure according to claim 1, characterized in that, The housing includes: Metal layer; and, The first insulating layer and the second insulating layer are respectively disposed on opposite sides of the metal layer.

17. The heat dissipation structure according to claim 1, characterized in that, The transmitting device and the receiving device are arranged sequentially along the direction from the air inlet to the air outlet.

18. A circuit board assembly, characterized in that, include: Circuit board; Electronic devices, disposed on the circuit board; and, The heat dissipation structure according to any one of claims 1-17 is disposed on the circuit board; the air outlet area of ​​the heat dissipation structure is thermally connected to the electronic device.

19. The circuit board assembly according to claim 18, characterized in that, The circuit board includes: First circuit board; A second circuit board is disposed on one side of the first circuit board and arranged around the perimeter of the first circuit board; and, The third circuit board is disposed on the side of the second circuit board away from the first circuit board and is connected to the second circuit board.

20. The circuit board assembly according to claim 19, characterized in that, The electronic device includes: A first electronic device is disposed on the first circuit board and located on the side of the first circuit board close to the third circuit board; The circuit board assembly also includes: A first partition is disposed on the side of the first circuit board near the third circuit board, and forms the housing together with a portion of the first circuit board, the second circuit board, and the third circuit board; The first partition has an air outlet, and the receiving device and the first electronic device are located on opposite sides of the first partition.

21. The circuit board assembly according to claim 18, characterized in that, The circuit board includes a first circuit board; the electronic device includes: A first electronic device is disposed on one side of the first circuit board; and, The second electronic device is disposed on the side of the first circuit board away from the first electronic device; The circuit board assembly also includes: A first shielding cover is disposed on the side of the first circuit board near the second electronic device, covering the outside of the second electronic device; and, The second partition is disposed inside the first shielding cover, and together with the first circuit board and a portion of the first shielding cover, forms the housing; The second partition has an air outlet, and the receiving device and the second electronic device are located on opposite sides of the second partition.

22. An electronic device, characterized in that, It includes a housing assembly and a circuit board assembly as described in any one of claims 18-21; the circuit board assembly is mounted on the housing assembly.

23. The electronic device according to claim 22, characterized in that, The number of circuit board assemblies is multiple.

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