Sensor and electronic device

Abstract

A sensor, the sensor (100) comprising a substrate (1) and a housing (2) covering the substrate (1), wherein the substrate (1) and the housing (2) form an accommodating cavity (3). A vibration assembly (7), and an MEMS chip (6) and an integrated chip assembly (5) that are in signal connection are arranged in the accommodating cavity (3). The integrated chip assembly (5) is in signal connection with the substrate (1). The MEMS chip (6) is mounted on the substrate (1) and forms a rear cavity with the substrate (1). The vibration assembly (7) comprises a support member (72) and a sensing film (71) mounted on the support member (72), wherein the support member (72) is mounted on the substrate (1); the support member (72), the sensing film (71) and the substrate (1) form a vibration cavity (10); and a channel (4) is formed in the substrate (1), with two ends of the channel (4) respectively being in communication with the rear cavity (31) and the vibration cavity (10). Further disclosed is an electronic device.

Description

Sensors and electronic devices

[0001] Related applications

[0002] This application claims priority to Chinese patent application No. 202510091974.3, filed on January 21, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of sensor technology, and more particularly to a sensor and electronic device. Background Technology

[0004] For sensors that need to monitor vibration, a vibration component senses changes in the external environment and vibrates, causing changes in the pressure within the housing. The MEMS chip can then detect these pressure changes, thus monitoring the external vibration. However, current sensors with vibration monitoring capabilities are relatively large, making it difficult to meet the market's demand for miniaturization.

[0005] Therefore, it is necessary to provide a new sensor and electronic device to solve or at least alleviate the aforementioned technical defects. Summary of the Invention

[0006] In view of the above problems, this application provides a sensor and electronic device, which aims to solve the technical problem of large sensor height in related technologies.

[0007] According to some embodiments of this application, this application provides a sensor, including a substrate and a housing covered on the substrate. The substrate and the housing form a receiving cavity. A vibration component, a MEMS chip and an integrated chip assembly connected by signal are disposed in the receiving cavity. The integrated chip assembly is connected to the substrate by signal. The MEMS chip is mounted on the substrate and forms a rear cavity with the substrate. The vibration component includes a support member and a sensing membrane mounted on the support member. The support member is mounted on the substrate. The support member, the sensing membrane and the substrate form a vibration cavity. A channel is formed in the substrate. The two ends of the channel are respectively connected to the rear cavity and the vibration cavity.

[0008] In one embodiment, the sensor further includes a bracket disposed above the vibration assembly, the integrated chip assembly disposed on the bracket, the bracket and the sensing membrane cooperating to form an acoustic cavity, the receiving cavity including a front cavity and a rear cavity, the acoustic cavity and the front cavity communicating.

[0009] In one embodiment, the bracket is provided with a through hole, which connects the acoustic cavity and the front cavity.

[0010] In one embodiment, the number of vias is multiple, and the multiple vias are arranged at intervals around the periphery of the integrated chip assembly.

[0011] In one embodiment, the support includes a support plate and a side plate arranged around the support plate. There is a spatial gap between the support plate and the sensing membrane. The integrated chip assembly is disposed on the support plate, and the support plate is disposed on the vibration assembly. The support plate, the side plate, and the sensing membrane cooperate to form the acoustic cavity. The through hole is disposed on the side plate or the support plate.

[0012] In one embodiment, the bracket includes a support panel and support plates disposed on opposite sides of the support panel. There is a spatial gap between the support plate and the sensing membrane. The integrated chip assembly is disposed on the support panel, and the support plates are disposed on the vibration assembly. The support panel, the two support plates, and the sensing membrane cooperate to form the acoustic cavity with an opening.

[0013] In one embodiment, the support has a heat dissipation hole at the position facing the integrated chip assembly, and the heat dissipation hole is in communication with the acoustic cavity.

[0014] In one embodiment, the integrated chip assembly is disposed on the sensing film.

[0015] In one embodiment, the vibration assembly further includes a mass element disposed on the sensing membrane and located within the vibration cavity, and the integrated chip assembly is disposed on the side of the sensing membrane opposite to the mass element.

[0016] In one embodiment, the sensing film includes a flexible circuit board with integrated pads. The integrated chip assembly is signal-connected to the flexible circuit board through the integrated pads. The support member has conductive pillars that electrically connect the flexible circuit board and the substrate.

[0017] In one embodiment, the integrated chip assembly includes a voice processing chip and an ASIC chip. The vibration component, the voice processing chip, and the ASIC chip are stacked sequentially. The ASIC chip is signal-connected to the MEMS chip, and the ASIC chip and the voice processing chip are signal-connected to the substrate, respectively.

[0018] In one embodiment, the sensor further includes a heat-insulating adhesive layer that encapsulates the ASIC chip and the voice processing chip.

[0019] According to some embodiments of this application, this application provides an electronic device that includes the sensor described above.

[0020] In the technical solution of this application, by setting channels inside the substrate, the channels connect the rear cavity and the vibration cavity respectively, so that the air pressure change signal generated by the vibration component can be transmitted to the MEMS chip through the channels and received by the MEMS chip, ultimately realizing the reception and monitoring of the vibration signal. This embodiment can horizontally set the MEMS chip and the vibration component on the substrate, which is beneficial to reduce the height of the sensor and achieve a thinner and lighter design compared to stacking the MEMS chip and the vibration component in the vertical direction.

[0021] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0022] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the embodiments described below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0023] Figure 1 is a structural schematic diagram of a sensor according to some embodiments of this application;

[0024] Figure 2 is a partial structural schematic diagram of Figure 1;

[0025] Figure 3 is a structural schematic diagram of the sensor bracket and integrated chip assembly of some embodiments of this application;

[0026] Figure 4 is a structural schematic diagram of the sensor bracket, integrated chip assembly, and vibration assembly of some embodiments of this application;

[0027] Figure 5 is another structural schematic diagram of a sensor according to some embodiments of this application;

[0028] Figure 6 is another structural schematic diagram of a sensor according to some embodiments of this application;

[0029] Figure 7 is a schematic diagram of another part of the structure of the sensor in some embodiments of this application.

[0030] The reference numerals in the detailed embodiments are as follows:

[0031] 100. Sensors;

[0032] 1. Substrate; 2. Outer shell; 3. Receiving cavity; 31. Rear cavity; 32. Front cavity; 4. Channel; 5. Integrated chip assembly; 51. ASIC chip; 52. Voice processing chip; 6. MEMS chip; 61. Sensitive membrane; 62. Substrate; 7. Vibration assembly; 71. Sensing membrane; 72. Support; 73. Mass component; 8. Bracket; 81. Carrier plate; 82. Side panel; 83. Through hole; 84. Carrier panel; 85. Support plate; 86. Opening; 9. Acoustic cavity; 10. Vibration cavity; 11. Conductive pillar. Embodiments of the present invention

[0033] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0035] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0036] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0037] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0038] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0039] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0040] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0041] There are many types of sensors, such as acoustic sensors, optical sensors, and vibration sensors. Acoustic sensors monitor air pressure signals through acoustic apertures, optical sensors monitor light signals, and vibration sensors monitor external vibration signals.

[0042] As people's demands increase, the need for miniaturized and thinner sensor products is also growing. However, current vibration sensors generally suffer from a relatively large height.

[0043] After careful research, the applicant discovered that, compared to acoustic sensors, sensors that need to monitor vibration signals generally require an additional vibration component within the sensor's housing. When external vibrations are received, the vibration component vibrates, causing the air inside the sensor to vibrate, which in turn changes the air pressure within the sensor's housing. This pressure primarily refers to atmospheric pressure. The MEMS chip can sense these pressure changes, thus monitoring external vibration signals. However, placing an additional vibration component within the housing requires significant space, resulting in a larger sensor size that fails to meet market demands for miniaturization. Further research revealed that, to enable the MEMS chip to promptly sense the air pressure changes caused by the vibration component, the MEMS chip is typically stacked vertically on top of the vibration component, with a vent between the vibration component and the MEMS chip for airflow. However, this stacking method results in a relatively large sensor height, making it difficult to meet the market's increasing demand for thinner and lighter sensors.

[0044] Therefore, the applicant provides a sensor.

[0045] Referring to Figures 1 and 2, according to some embodiments of this application, this application provides a sensor 100, including a substrate 1 and a housing 2 covering the substrate 1. The substrate 1 and the housing 2 form a receiving cavity 3. The receiving cavity 3 is provided with a vibration component 7, a MEMS chip 6 and an integrated chip assembly 5 connected by signal, and the integrated chip assembly 5 is connected to the substrate 1 by signal. The MEMS chip 6 is mounted on the substrate 1 and forms a rear cavity 31 with the substrate 1. The vibration component 7 includes a support member 72 and a sensing membrane 71 mounted on the support member 72. The support member 72 is mounted on the substrate 1. The support member 72, the sensing membrane 71 and the substrate 1 form a vibration cavity 10. A channel 4 is formed in the substrate 1. The two ends of the channel 4 are respectively connected to the rear cavity 31 and the vibration cavity 10.

[0046] The sensor 100 can be a vibration sensor. The substrate 1 can be a printed circuit board, with wiring layers and copper foil inside. Pads are provided on the surface of the substrate 1. The integrated chip assembly 5 is connected to the substrate 1 via the pads to transmit electrical signals. In one specific embodiment, the integrated chip assembly 5 can be connected to the pads via gold wires. The housing 2 refers to the shell portion of the sensor 100. The housing 2 covers the substrate 1 and forms a substantially sealed receiving cavity 3 with the substrate 1. The vibration assembly 7 includes a support member 72 and a sensing membrane 71 disposed on the support member 72. The sensing membrane 71 can be a diaphragm. The support member 72 can be a supporting portion of the vibration assembly 7, generally an annular sidewall. The support member 72, the sensing membrane 71, and the substrate 1 enclose a cavity called the vibration cavity 10. This cavity is substantially isolated from the receiving cavity 3, and there is no airflow between them. The substrate 1 has a first opening at the location where the vibration assembly 7 is disposed. MEMS chip 6 is disposed on substrate 1, forming a cavity with substrate 1. This cavity is generally referred to as rear cavity 31. Specifically, MEMS chip 6 includes a substrate 62 and a sensitive membrane 61 disposed on the substrate 62. The substrate 62 is mounted on substrate 1, and the sensitive membrane 61, substrate 62, and substrate 1 together form rear cavity 31. Substrate 1 has a second opening at the location where MEMS chip 6 is disposed. A channel 4 is disposed within substrate 1. The channel 4 is formed within substrate 1 and is interconnected. The two ends of the channel 4 are the first opening and the second opening, respectively, thus connecting the vibration cavity 10 and rear cavity 31 through the channel 4. When sensor 100 is vibrated, the sensing membrane 71 of vibration component 7 can vibrate, causing a change in air pressure within cavity 3 of vibration cavity 10. The changed air pressure signal is transmitted to MEMS chip 6 through channel 4. MEMS chip 6 receives the change in air pressure and converts it into an electrical signal, which is transmitted to integrated chip component 5. Integrated chip component 5 performs calculations to monitor external vibration signals or transmits the signal to external circuitry for monitoring. It should also be noted that in the sensor 100, the receiving cavity 3 can be divided into a front cavity 32 and a rear cavity 31. In this application, the rear cavity 31 refers to the space formed by the MEMS chip 6 and the substrate 1. The portion excluding the rear cavity 31 can be called the front cavity 32. Of course, it should be noted that the front cavity 32 referred to in this application does not include the vibration cavity 10 and the acoustic cavity 9. In the above embodiment of this application, by setting a channel 4 inside the substrate 1, the channel 4 connects the rear cavity 31 and the vibration cavity 10 respectively, so that the air pressure change signal generated by the vibration component 7 can be transmitted to the MEMS chip 6 through the channel 4 and sensed and received by the MEMS chip 6, ultimately realizing the reception and monitoring of the vibration signal. This embodiment can arrange the MEMS chip 6 and the vibration component 7 horizontally on the substrate 1. Compared with stacking the MEMS chip 6 and the vibration component 7 vertically, it is beneficial to reduce the height of the sensor 100 and realize a thinner and lighter design.It should be noted that in the embodiments of this application, the vertical direction refers to the direction perpendicular to the substrate 1, as shown by arrow A in Figure 1, and the horizontal direction refers to the direction parallel to the extension direction of the substrate 1, that is, the direction perpendicular to arrow A.

[0047] Referring to Figure 1, in one embodiment, the integrated chip assembly 5 includes a voice processing chip 52 and an ASIC chip 51. The vibration assembly 7, voice processing chip 52, and ASIC chip 51 are stacked sequentially. The ASIC chip 51 is signal-connected to the MEMS chip 6, and the ASIC chip 51 and voice processing chip 52 are respectively signal-connected to the substrate 1. The integrated chip assembly 5 may include an ASIC chip 51 and a voice processing chip 52. The MEMS chip 6 converts the received sound pressure signal into an electrical signal and transmits it to the ASIC chip 51. The ASIC chip 51 processes the signal received from the MEMS chip 6 and then sends it to the voice processing chip 52 for further processing. This embodiment has a high degree of integration, achieves localized signal processing, and reduces the risk of signal interference caused by long-distance signal propagation.

[0048] Referring to Figures 1 and 2, in one embodiment, the sensor 100 further includes a bracket 8, which is disposed above the vibration assembly 7. The integrated chip assembly 5 is disposed on the bracket 8. The bracket 8 and the sensing membrane 71 cooperate to form an acoustic cavity 9. The receiving cavity 3 includes a front cavity 32 and a rear cavity 31, and the acoustic cavity 9 and the front cavity 32 are connected.

[0049] The main function of the bracket 8 is to provide a support position for the integrated chip assembly 5. Considering the horizontal size requirements of the sensor 100, the method of stacking the vibration assembly 7 and the integrated chip assembly 5 can prevent the horizontal size of the sensor 100 from being too large. The bracket 8 can be directly installed on the support member 72, or it can be installed at the connection between the sensing diaphragm 71 and the support member 72. The bracket 8 is generally fixed and is not usually installed on the vibrating part of the sensing diaphragm 71. The bracket 8 and the sensing diaphragm 71 cooperate to form a sound cavity 9. This sound cavity 9 is not closed, but is partially connected to the front cavity 32 of the receiving cavity 3. That is, the sound cavity 9 between the sensing diaphragm 71 and the bracket 8 is not connected to the outside. When the sensing diaphragm 71 receives a vibration signal and vibrates, the vibration of the sensing diaphragm 71 towards the sound cavity 9 will compress the gas in the sound cavity 9. If this is designed to be closed, the internal air pressure will increase due to the reduction in the volume of the sound cavity 9, thus encountering greater resistance and affecting the sensitivity and accuracy of the vibration. Therefore, the sound cavity 9 is designed to be connected to the front cavity 32 to keep the air pressure in the sound cavity 9 balanced. Furthermore, the applicant needs to specifically point out that the bracket 8 in this embodiment is fundamentally different from the mounting bracket in related technologies where the MEMS chip 6 is mounted on a mounting frame and the MEMS chip 6 is stacked with the vibration component 7. This is because the mounting bracket in the MEMS chip 6 and vibration component 7 stacking scheme has a vent hole at the position where the sensing membrane 71 faces the mounting bracket, so that the air pressure change signal generated by the vibration of the sensing membrane 71 can be received by the sensitive membrane 61 of the MEMS chip 6 through the vent hole. To improve the sensitivity and accuracy of monitoring, except for the vent hole, the mounting bracket and the sensing membrane 71 are relatively sealed, i.e., not connected to the receiving cavity 3. Moreover, the vent hole is designed to connect to the MEMS chip 6, not to connect to the front cavity 32 of the receiving cavity 3 as in this application; the technical solutions and application concepts of the two are fundamentally different.

[0050] By setting up a bracket 8 to support the integrated chip assembly 5, the structure of the sensor 100 becomes more compact. In addition, the acoustic cavity 9 is connected to the front cavity 32, which reduces the resistance to vibration of the sensing diaphragm 71 and improves the sensitivity and accuracy of monitoring.

[0051] Regarding specific embodiments of the support structure 8, at least the following two are included:

[0052] Referring to Figure 3, in the first embodiment, the bracket 8 includes a support plate 81 and a side plate 82 arranged around the support plate 81. There is a space between the support plate 81 and the sensing membrane 71. The integrated chip assembly 5 is disposed on the support plate 81, and the support plate 85 is disposed on the vibration assembly 7. The support plate 81, the side plate 82 and the sensing membrane 71 cooperate to form a sound cavity 9. The through hole 83 is disposed on the side plate 82 or the support plate 81.

[0053] The side panel 82 can be a cylindrical side panel or a square side panel. The support plate 81 plays a supporting role. The integrated chip assembly 5 is set on the support plate 81. The side panel 82 is set on the support member 72 or the sensing membrane 71. The side panel 82 and the support plate 81 of the bracket 8 form an opening. The bracket 8 is placed on the sensing membrane 71 with the opening facing down to form a sound cavity 9. The side panel 82 or the support plate 81 can be provided with through holes 83 so that the sound cavity 9 can be connected to the front cavity 32. In this way, when the sensing membrane 71 vibrates, it can be ensured that the air pressure in the sound cavity 9 is balanced with that in the front cavity 32.

[0054] Referring to FIG3, in one embodiment, there are multiple vias 83, which are arranged at intervals around the periphery of the integrated chip assembly 5.

[0055] Regarding the number of through holes 83, one or more can be provided. All through holes 83 can be located on the side panel 82, all on the support plate 81, or some on the support plate 81 and others on the side panel 82. To connect the acoustic cavity 9 and the front cavity 32, the through holes 83 on the support plate 81 are not located at the position where the integrated chip assembly 5 is installed; instead, they can be arranged at intervals around the outer periphery of the integrated chip assembly 5. Providing multiple through holes 83 allows for faster airflow between the acoustic cavity 9 and the front cavity 32, thus balancing the air pressure within the acoustic cavity 9.

[0056] Referring to Figure 4, in the second embodiment, the bracket 8 includes a support panel 84 and support plates 85 disposed on opposite sides of the support panel 84. There is a spatial gap between the support panel 84 and the sensing membrane 71. The integrated chip assembly 5 is disposed on the support plate 81, and the support plates 85 are disposed on the vibration assembly 7. The support panel 84, the two support plates 85, and the sensing membrane 71 cooperate to form a sound cavity 9 with an opening 86. In this embodiment, the bracket 8 itself is not a shape that can be closed. Specifically, the bracket 8 includes a support panel 84 and support plates 85 disposed on opposite sides of the support panel. The two support plates 85 are respectively connected to the support member 72. The support panel 84, the two support plates 85, and the sensing membrane 71 cooperate to form a sound cavity 9 with an opening 86. Specifically, there can be two openings 86, which are disposed opposite to each other. The sound cavity 9 communicates with the front cavity 32 through the openings 86 to achieve air pressure balance within the sound cavity 9. In this example, the through hole 83 may not be additionally provided.

[0057] In one embodiment, the support 8 has a heat dissipation hole facing the integrated chip assembly 5, and the heat dissipation hole is connected to the acoustic cavity 9.

[0058] Like the aforementioned through-hole 83, the heat dissipation hole can be a through-hole set on the bracket 8, and structurally there may be no essential difference, but their functions are different. Specifically, the heat dissipation hole can be set at the position where the integrated chip assembly 5 is mounted on the bracket 8, that is, on the support panel 84 or support plate 81. In this way, the heat dissipated by the integrated chip assembly 5 can directly enter the acoustic cavity 9 through the heat dissipation hole, and then be conducted to the rear cavity 31 through the channel 4. Of course, the heat dissipated by the integrated chip assembly 5 will also be directly dissipated into the front cavity 32, which can reduce the temperature difference on both sides of the sensitive film 61 of the MEMS chip 6, balance the thermal pressure on both sides, and play a role in reducing thermal noise. It should also be noted that the aforementioned through-hole 83 can also play a role in heat conduction. Specifically, the heat in the front cavity 32 can enter the acoustic cavity 9 through the through-hole 83, and then be transferred to the rear cavity 31 through the channel 4.

[0059] Referring to FIG5, in one embodiment, the integrated chip assembly 5 is disposed on the sensing film 71.

[0060] Regarding the installation method of the integrated chip assembly 5, the aforementioned mounting bracket 8 is one embodiment. In other embodiments, the integrated chip assembly 5 can also be directly mounted on the sensing membrane 71. The integrated chip assembly 5 can act as a mass component 73, adjusting the vibration frequency and improving the monitoring sensitivity. This design not only eliminates the need for the bracket 8 but also eliminates the need for an additional mass component 73 for the vibration assembly 7, reducing the use of accessories.

[0061] Referring to Figure 6, in one embodiment, a mass component 73 can also be provided. The mass component 73 is disposed on the sensing membrane 71 and located inside the vibration cavity 10. The integrated chip assembly 5 is disposed on the side of the sensing membrane 71 opposite to the mass component 73. In this case, the integrated chip assembly 5 can also function as the mass component 73.

[0062] Referring to Figure 7, in one embodiment, the sensing film 71 includes a flexible circuit board with integrated pads. The integrated chip assembly 5 is signal-connected to the flexible circuit board via the integrated pads. A conductive post 11 is disposed within the support member 72, electrically connecting the flexible circuit board and the substrate 1. The flexible circuit board is a circuit board made of flexible material. The pads on the integrated chip assembly 5 are soldered to the integrated pads of the flexible circuit board via a flip-chip method. A via is provided within the support member 72, and a conductive post 11 is disposed within the via. The conductive post 11 electrically connects the pads on the substrate 1 and the flexible circuit board. In this way, the integrated chip assembly 5 can be electrically connected to the substrate 1 via the flexible circuit board, eliminating the need for gold wires. Because the sensing film 71 vibrates during use, gold wire connections are prone to loosening; the pad connection method improves the reliability of the connection.

[0063] In one embodiment, the sensor 100 further includes a heat-insulating adhesive layer that wraps around the ASIC chip 51 and the voice processing chip 52. The heat-insulating adhesive can be applied to the voice processing chip 52 and the ASIC chip 51 to form a heat-insulating layer. This layer primarily serves to insulate against heat, reducing the impact of heat emitted by the ASIC chip 51 and the voice processing chip 52 on the thermal noise generated by the MEMS chip 6.

[0064] According to some embodiments of this application, this application provides an electronic device including the sensor 100 described above. The electronic device can be a smart wearable device, such as headphones, a computer, a mobile phone, a tablet, a bracelet, or a ring. Since the electronic device includes all the technical solutions of the embodiments of the sensor 100 described above, it possesses at least all the beneficial effects brought by all the above technical solutions, which will not be elaborated upon here.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A sensor, wherein, The sensor includes a substrate and a housing covering the substrate. The substrate and the housing form a receiving cavity. A vibration component, a MEMS chip, and an integrated chip assembly are disposed within the receiving cavity. The integrated chip assembly is signal-connected to the substrate. The MEMS chip is mounted on the substrate and forms a rear cavity with the substrate. The vibration component includes a support member and a sensing membrane mounted on the support member. The support member is mounted on the substrate. The support member, the sensing membrane, and the substrate form a vibration cavity. A channel is formed within the substrate, and the two ends of the channel are respectively connected to the rear cavity and the vibration cavity.

2. The sensor according to claim 1, wherein, The sensor also includes a bracket, which is disposed above the vibration assembly. The integrated chip assembly is disposed on the bracket. The bracket and the sensing membrane cooperate to form an acoustic cavity. The receiving cavity includes a front cavity and a rear cavity, and the acoustic cavity and the front cavity are connected.

3. The sensor according to claim 2, wherein, The bracket is provided with a through hole, which connects the acoustic cavity and the front cavity.

4. The sensor according to claim 3, wherein, The number of vias is multiple, and the multiple vias are arranged at intervals around the periphery of the integrated chip assembly.

5. The sensor according to claim 3, wherein, The support includes a support plate and a side plate arranged around the support plate. There is a space between the support plate and the sensing membrane. The integrated chip assembly is disposed on the support plate, and the side plate is disposed on the vibration assembly. The support plate, the side plate and the sensing membrane cooperate to form the acoustic cavity. The through hole is disposed on the side plate or the support plate.

6. The sensor according to claim 2, wherein, The bracket includes a support panel and support plates disposed on opposite sides of the support panel. There is a space between the support plate and the sensing membrane. The integrated chip assembly is disposed on the support panel, and the support plates are disposed on the vibration assembly. The support panel, the two support plates, and the sensing membrane cooperate to form the acoustic cavity with an opening.

7. The sensor according to claim 2, wherein, The bracket has heat dissipation holes facing the integrated chip assembly, and the heat dissipation holes are connected to the acoustic cavity.

8. The sensor according to claim 1, wherein, The integrated chip assembly is disposed on the sensing film.

9. The sensor according to claim 1, wherein, The vibration assembly further includes a mass component disposed on the sensing membrane and located within the vibration cavity, and the integrated chip assembly is disposed on the side of the sensing membrane opposite to the mass component.

10. The sensor according to claim 8 or 9, wherein, The sensing film includes a flexible circuit board with integrated pads. The integrated chip assembly is signal-connected to the flexible circuit board through the integrated pads. The support member has conductive pillars that electrically connect the flexible circuit board and the substrate.

11. The sensor according to any one of claims 1 to 9, wherein, The integrated chip assembly includes a voice processing chip and an ASIC chip. The vibration component, the voice processing chip, and the ASIC chip are stacked sequentially. The ASIC chip is signal-connected to the MEMS chip, and the ASIC chip and the voice processing chip are signal-connected to the substrate, respectively.

12. The sensor according to claim 11, wherein, The sensor also includes a heat-insulating adhesive layer that encapsulates the ASIC chip and the voice processing chip.

13. An electronic device, wherein, The electronic device includes the sensor according to any one of claims 1 to 12.

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