Optical cage assembly, heat sink and communication device

Abstract

The present disclosure belongs to the technical field of optical communications. Provided are an optical cage assembly, a heat sink and a communication device. The optical cage assembly comprises an optical cage and an optical module connector, wherein the optical module connector has a first connection end, a second connection end and a third connection end, and both the second connection end and the third connection end are electrically connected to the first connection end; the optical cage has a socket allowing the insertion of an optical module, and the first connection end is located in the optical cage and faces the socket, and is used for electrically connecting to the optical module inserted into the optical cage; and both the second connection end and the third connection end are located on the side of the first connection end that faces away from the socket, the second connection end is used for press-fitting or soldering to a circuit board, and the third connection end is connected to a cable, with the circuit board being located on the side of the first connection end that faces away from the socket, and the cable being used for electrically connecting to a service chip. The present disclosure can enhance the heat dissipation for an optical module.

Description

Optical cage components, heat sinks and communication equipment

[0001] This disclosure claims priority to Chinese Patent Application No. 202510127531.5, filed on January 27, 2025, entitled "Optical Cage Assembly, Heat Sink and Communication Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of optical communication technology, and in particular to an optical cage assembly, a heat sink, and a communication device. Background Technology

[0003] With the upgrading and evolution of communication networks, the volume and transmission rate of communication data have significantly increased. Correspondingly, the power consumption of various modular devices in these networks has also increased, placing higher demands on their heat dissipation. Taking optical modules, a common component in communication networks, as an example, their main function is to achieve the conversion between photoelectric and electro-optical signals. Therefore, to meet the signal transmission requirements of communication networks, optical modules need to be upgraded and expanded. However, with the improvement in signal transmission performance, the power consumption of optical modules is also increasing, leading to increasingly severe heat generation. Summary of the Invention

[0004] This disclosure provides an optical cage assembly, a heat sink, and a communication device that can enhance heat dissipation for optical modules.

[0005] In a first aspect, this disclosure provides an optical cage assembly, the optical cage assembly including an optical cage and an optical module connector;

[0006] The optical module connector has a first connection end, a second connection end and a third connection end, and the second connection end and the third connection end are both electrically connected to the first connection end.

[0007] The optical cage has a socket for inserting an optical module. The first connection end is located in the optical cage and faces the socket, and is used to electrically connect with the optical module inserted into the optical cage.

[0008] Both the second connection end and the third connection end are located on the side of the first connection end opposite to the socket. The second connection end is used for crimping or soldering with the circuit board, and the third connection end is connected to a cable. The circuit board is located on the side of the first connection end opposite to the socket, and the cable is used for electrical connection with the business chip.

[0009] In the solution disclosed herein, the circuit board is located on the side of the first connection end away from the socket of the optical cage, so that there is no longer a fixed connection between the circuit board and the bottom wall of the optical cage. Therefore, after the bottom wall of the optical cage absorbs the heat from the optical module, it can quickly dissipate it outwards without being affected by the low thermal conductivity of the circuit board, thereby enhancing the heat dissipation effect for the optical module.

[0010] In addition, since there is no longer a fixed relationship between the bottom wall of the optical cage and the circuit board, a heat sink can also be arranged on the outer surface of the bottom wall of the optical cage. In this way, heat sinks are arranged on both the outer surface of the top wall and the outer surface of the bottom wall of the optical cage, so as to achieve double-sided heat dissipation for the optical module inserted into the optical cage, and further enhance the heat dissipation of the optical module.

[0011] In one possible implementation, the second connection end is located between the top and bottom walls of the optical cage, such that the circuit board pressed or welded to the second connection end is located between the outer surface of the top wall and the outer surface of the bottom wall, wherein both the outer surface of the top wall and the outer surface of the bottom wall are surfaces located outside the optical cage.

[0012] In the solution disclosed herein, the circuit board is located in the space between the outer surfaces of the top and bottom walls of the optical cage. Therefore, in the thickness direction of the communication device (which is also the height direction of the communication device's panel and the thickness direction of the optical module), the circuit board no longer occupies additional space. The space saved in the thickness direction of the communication device can be used to arrange more layers of optical cages, or to provide more air inlet and outlet space for the communication device. Arranging more layers of optical cages in the thickness direction is beneficial for high-density arrangement of optical interfaces on the communication device's panel. More air inlet and outlet space enhances the internal heat dissipation effect of the communication device.

[0013] In one possible implementation, the second connection end is located outside the optical cage and on the side of the optical cage opposite to the socket, so that the circuit board crimped or soldered to the second connection end is located outside the optical cage and on the side opposite to the socket.

[0014] In the solution shown in this disclosure, the circuit board is located outside the optical cage and on the side of the optical cage opposite to the optical cage's socket. Therefore, the circuit board no longer occupies additional space in the thickness direction of the communication device. The space saved in the thickness direction of the communication device can be used to arrange more layers of optical cages, or the communication device can have more air inlet and outlet space.

[0015] In one possible implementation, the optical cage assembly further includes a heat sink, and both the top and bottom walls of the optical cage have windows;

[0016] The heat sink is arranged on the outer surface of the top wall, and a portion of the heat sink on the top wall extends through a window in the top wall into the light cage;

[0017] The heat sink is arranged on the outer surface of the bottom wall, and a portion of the heat sink on the bottom wall extends through a window on the bottom wall into the light cage.

[0018] In the scheme disclosed herein, heat sinks are arranged on the outer surface of the top wall and the outer surface of the bottom wall of the optical cage, so that the heat generated by the optical module can be dissipated outward through both the top and bottom surfaces of the optical module, thereby enhancing the heat dissipation of the optical module.

[0019] In one possible implementation, the heat sink includes a heat dissipation base plate and a thermally conductive film, the thermally conductive film being fixed to the surface of the heat dissipation base plate, and a cavity being formed between the thermally conductive film and the surface of the heat dissipation base plate, the cavity containing a thermally conductive material;

[0020] The heat dissipation base plate is arranged on the outer surface of the top wall or the bottom wall, and the heat-conducting film extends into the light cage through the window on the top wall or the bottom wall.

[0021] In the solution disclosed herein, a thermally conductive film is fixed on the outer surface of the heat dissipation base plate, and a thermally conductive material is arranged in the cavity between the thermally conductive film and the heat dissipation base plate. When the optical module is inserted into the optical cage, it will cause the thermally conductive film to deform, thereby absorbing the fit tolerance between the optical module and the optical cage. The thermally conductive film is attached to the optical module, and a thermally conductive material is arranged between the thermally conductive film and the heat dissipation base plate, which can accelerate the heat transfer between the optical module and the heat sink.

[0022] In one possible implementation, the thermally conductive film has a plurality of holes penetrating its thickness, the size of which satisfies the following conditions: when no optical module is inserted in the optical cage, the thermally conductive material in the cavity is confined within the cavity; when an optical module is inserted in the optical cage, the thermally conductive material in the cavity flows out from the holes to fill the space between the thermally conductive film and the optical module.

[0023] In the scheme disclosed herein, the thermal conductive film has holes. After the optical module is inserted into the optical cage, the thermally conductive material between the thermal conductive film and the heat dissipation base plate is squeezed out from the holes under the pressure of the optical module and fills the gap between the thermal conductive film and the optical module. This achieves the effect of absorbing the air gap between the thermal conductive film and the optical module, thereby reducing the thermal resistance between the optical module and the thermal conductive film and further enhancing the heat transfer between the two.

[0024] In one possible implementation, the optical cage assembly includes one or more optical cages, each optical cage including multiple optical cages, and multiple thermally conductive films are fixed on the surface of the heat dissipation base plate.

[0025] On the outer surface of the top wall of the light cage located on the same layer, at least one heat dissipation base plate is arranged, and multiple heat-conducting films on the surface of the heat dissipation base plate extend into the multiple light cages through the windows on the top wall respectively.

[0026] On the outer surface of the bottom wall of the light cage located on the same layer, at least one heat dissipation base plate is arranged, and multiple heat-conducting films on the surface of the heat dissipation base plate extend into the multiple light cages through the windows on the bottom wall.

[0027] In the solution disclosed herein, because the thermally conductive film fixed on the surface of the heat dissipation base plate is relatively thin, it can deform under pressure. Therefore, it can absorb the fit tolerance of the optical module inserted into the optical cage, eliminating the need for the heat dissipation base plate to float up and down to absorb the tolerance. Thus, the heat dissipation base plate can be fixed to the outer surface of the top or bottom wall of multiple optical cages in the same layer, achieving the effect of a single heat sink dissipating heat for multiple optical modules. For example, a single heat sink can dissipate heat for all optical modules in the same layer, or a single heat sink can dissipate heat for multiple optical modules in the same layer. This allows for a larger heat sink area; the larger the heat sink area, the stronger the heat dissipation effect.

[0028] In one possible implementation, the optical module connector includes a fixed connection part and a floating connection part;

[0029] The second connecting end is located on the fixed connecting part, and the first connecting end and the third connecting end are both located on the floating connecting part;

[0030] The floating connection is located within the optical cage and can move up and down in a direction perpendicular to the height of the optical cage.

[0031] In the solution disclosed herein, the optical module connector includes a fixed connection portion and a floating connection portion. A first connection end for connecting to the optical module is disposed on the floating connection portion. Therefore, when the optical module is inserted into the optical cage, even if the first connection end and the optical module's electrical signal connector are not perfectly aligned, as long as the optical module's electrical signal connector can extend into the first connection end, the floating connection portion can be moved along the thickness direction as the optical module continues to be inserted, ensuring that the first connection end and the optical module's electrical signal connector are perfectly aligned, ultimately achieving electrical connection between the first connection end and the optical module's electrical signal connector. This optical module connector including a floating connection portion can reduce the processing precision of the optical module connector and also reduce the assembly precision between the optical module connector and the optical cage.

[0032] In a second aspect, a heat sink is provided, the heat sink comprising a heat dissipation base plate and a heat-conducting film;

[0033] The thermally conductive film is fixed to the surface of the heat dissipation base plate, and a cavity is formed between the thermally conductive film and the surface of the heat dissipation base plate, wherein the cavity contains a thermally conductive material;

[0034] The thermally conductive film has multiple holes that penetrate its thickness. The size of the holes satisfies the following conditions: when the thermally conductive film is not in contact with the device to be cooled, the thermally conductive material in the cavity is confined within the cavity; when the thermally conductive film is in contact with the device to be cooled, the thermally conductive material in the cavity flows out from the holes to fill the space between the thermally conductive film and the device to be cooled.

[0035] The device to be cooled can be a chip or an optical module. If the device to be cooled is a chip, the heat sink is fixed on the circuit board where the chip is located and covers the chip. The thermal conductive film on the heat sink is in contact with the chip. If the device to be cooled is an optical module, the heat sink is fixed on the outer surface of the top or bottom wall of the optical cage. The thermal conductive film on the heat sink extends into the optical cage to contact the optical module inserted into the optical cage.

[0036] In the solution disclosed herein, a thermally conductive film is fixed on the outer surface of the heat dissipation base plate, and a thermally conductive material is arranged in the cavity between the thermally conductive film and the heat dissipation base plate. When the device to be cooled comes into contact with the thermally conductive film, the heat transfer between the device to be cooled and the heat sink can be accelerated, thereby enhancing the heat dissipation of the device to be cooled.

[0037] In the solution disclosed herein, the thermal conductive film has pores. After the heat dissipation device is fixed to the heat sink, the heat dissipation device and the thermal conductive film are attached. Under the pressure of the heat dissipation device, the thermally conductive material between the thermal conductive film and the heat sink base plate is squeezed out from the pores and fills the gap between the thermal conductive film and the heat dissipation device. This achieves the effect of absorbing the air gap between the thermal conductive film and the heat dissipation device, thereby reducing the thermal resistance between the heat dissipation device and the thermal conductive film and further enhancing the heat transfer between the two.

[0038] In one possible implementation, a plurality of the heat-conducting films are fixed on the same surface of the heat dissipation base plate;

[0039] Multiple thermally conductive films on the same surface of the heat dissipation base plate are used to contact multiple devices to be cooled, which are arranged on the same layer.

[0040] In the solution disclosed herein, multiple thermally conductive films are fixed on the same surface of the heat dissipation base plate, enabling a single heat dissipation base plate to dissipate heat for multiple devices to be cooled, thereby increasing the heat dissipation area of ​​the heat dissipation base plate, enhancing the heat dissipation effect of the heat dissipation base plate, and thus improving the heat dissipation effect for the devices to be cooled.

[0041] In one possible implementation, at least one of the heat-conducting films is fixed to the first surface of the heat dissipation base plate, and at least one of the heat-conducting films is fixed to the second surface of the heat dissipation base plate, wherein the first surface and the second surface of the heat dissipation base plate are positioned opposite each other.

[0042] The heat dissipation base plate is used to be arranged between the first layer of heat dissipation devices and the second layer of heat dissipation devices. The thermal conductive film fixed on the first surface of the heat dissipation base plate is used to contact the first layer of heat dissipation devices, and the thermal conductive film fixed on the second surface of the heat dissipation base plate is used to contact the second layer of heat dissipation devices.

[0043] In the solution shown in this disclosure, the device to be cooled can be an optical module. Then, the heat dissipation base plate can be fixed between two optical cages. The thermal conductive film on the first surface of the heat dissipation base plate extends into the first optical cage and contacts the optical module inside the first optical cage. The thermal conductive film on the second surface of the heat dissipation base plate extends into the second optical cage and contacts the optical module inside the second optical cage.

[0044] In one possible implementation, the device to be cooled is an optical module, the heat dissipation base plate is used to fix it to the outer surface of the top wall or the outer surface of the bottom wall of the optical cage, and the thermally conductive film fixed on the surface of the heat dissipation base plate is used to extend into the optical cage to contact the optical module inserted into the optical cage.

[0045] In the scheme disclosed herein, a heat dissipation base plate can be arranged on the outer surface of the top wall of the optical cage. A thermally conductive film on the surface of the heat dissipation base plate extends from the top wall of the optical cage into the optical cage, contacting the top surface of the optical module inserted into the optical cage. Similarly, a heat dissipation base plate can be arranged on the outer surface of the bottom wall of the optical cage. A thermally conductive film on the surface of the heat dissipation base plate extends from the top wall into the optical cage, contacting the top surface of the optical module inserted into the optical cage. The thermally conductive film on the heat dissipation base plate on the bottom wall extends from the bottom wall into the optical cage, contacting the bottom surface of the optical module inserted into the optical cage. This achieves double-sided heat dissipation for the optical module, enhancing the heat dissipation effect.

[0046] Thirdly, a heat dissipation structure is provided, which includes an optical cage and a heat sink as described in the second aspect or any one of the second aspects. In application, the optical cage can be fixed to a circuit board, or, as described in the first aspect, the optical cage can be no longer fixed to the circuit board.

[0047] Fourthly, a communication device is provided, the communication device comprising the optical cage assembly described in the first aspect or any one of the first aspects.

[0048] Fifthly, a communication device is provided, the communication device comprising the heat sink described in the second aspect or any one of the second aspects.

[0049] In a sixth aspect, a communication device is provided, the communication device including the heat dissipation structure described in the third aspect. Attached Figure Description

[0050] Figure 1 is a schematic diagram of an optical cage fixed on a circuit board according to the prior art;

[0051] Figure 2 is a schematic diagram of the connection between the optical cage assembly and the circuit board provided in an exemplary embodiment of this disclosure;

[0052] Figure 3 is a schematic diagram of the connection between the optical cage assembly and the circuit board provided in another exemplary embodiment of this disclosure;

[0053] Figure 4 is a schematic diagram of an optical cage assembly including multiple optical cages provided in an exemplary embodiment of the present disclosure;

[0054] Figure 5 is a schematic diagram of a circuit board extending into an optical cage according to an exemplary embodiment of the present disclosure;

[0055] Figure 6 is a schematic diagram of the structure of a circuit board provided in an exemplary embodiment of this disclosure;

[0056] Figure 7 is a schematic diagram of the connection between the optical cage assembly and the circuit board provided in another exemplary embodiment of this disclosure;

[0057] Figure 8 is a schematic diagram of an optical module inserted into an optical cage according to an exemplary embodiment of the present disclosure;

[0058] Figure 9 is a schematic diagram of an optical module inserted into an optical cage and connected to a first connection end according to an exemplary embodiment of the present disclosure;

[0059] Figure 10 is a schematic diagram of a light cage provided in an exemplary embodiment of the present disclosure, in which heat sinks are arranged on the outer surfaces of both the top and bottom walls of the light cage.

[0060] Figure 11 is a schematic diagram of a heat sink provided in an exemplary embodiment of the present disclosure;

[0061] Figure 12 is a schematic diagram of a single heat sink arranged on multiple optical cages in a single optical cage according to an exemplary embodiment of the present disclosure;

[0062] Figure 13 is a schematic diagram of a light cage assembly including multiple layers of light cages provided in another exemplary embodiment of the present disclosure.

[0063] Explanation of reference numerals in the attached drawings: 1. Optical cage; 11. Socket; 12. Top wall; 13. Bottom wall; 2. Optical module connector; 21. First connection end; 22. Second connection end; 23. Third connection end; 2a. Fixed connection part; 2b. Floating connection part; 3. Heat sink; 31. Heat dissipation base plate; 32. Thermal conductive film; 311. First heat dissipation base plate; 312. Second heat dissipation base plate; 4. Circuit board; 41. Connection part; 42. Slot; 5. Optical module; 6. Cable; 61. Signal connector. Detailed Implementation

[0064] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0065] This embodiment relates to an optical cage component, which is used in communication equipment as an optical interface for connecting to optical modules. The communication equipment can be a network communication device such as a router or switch, or a computing device such as a server. This embodiment does not limit the specific type of communication equipment to which the optical cage component is applied.

[0066] Figure 1 shows a schematic diagram of a common optical cage assembly in the current technology. Referring to Figure 1, the optical cage assembly includes an optical cage 1 and an optical module connector 2 (not shown in Figure 1). The bottom wall of the optical cage 1 is fixed to a circuit board 4. The optical module connector 2 is located in the optical cage 1 and is electrically connected to the circuit board 4. The circuit board 4 is the circuit board of the communication device in which the optical cage assembly is located.

[0067] As shown in Figure 1, since the bottom wall of the optical cage 1 is fixed to the circuit board 4, a heat sink is usually only placed on the outer surface of the top wall 12 of the optical cage 1 to dissipate heat for the optical module inserted into the optical cage 1. This method of single-sided heat dissipation for the optical module is difficult to meet the heat dissipation requirements of high-bandwidth optical modules.

[0068] Therefore, this embodiment provides an optical cage assembly, which includes an optical cage 1 and an optical module connector 2. The bottom wall of the optical cage 1 is no longer fixed to the circuit board 4. The circuit board 4 can be located on the side of the optical cage 1 away from the insertion port 11 of the optical cage 1. Therefore, a heat sink can be arranged not only on the outer surface of the top wall of the optical cage 1, but also on the outer surface of the bottom wall of the optical cage 1, so as to achieve double-sided heat dissipation for the optical module inserted into the optical cage, thereby enhancing the heat dissipation of the optical module.

[0069] Furthermore, even if no heat sink is installed on the outer surface of the bottom wall of the optical cage 1, the circuit board 4 being located on the side of the optical cage 1 away from the socket 11 of the optical cage 1 still facilitates heat dissipation of the optical module. This is because most of the bottom wall of the optical cage 1 is no longer fixed to the circuit board 4, and the heat from the optical module is transferred to the bottom wall of the optical cage 1. The bottom wall is generally made of a metal material with a high thermal conductivity, so the heat can dissipate outward through the bottom wall. If most of the bottom wall of the optical cage 1 were fixed to the circuit board 4, although the bottom wall is not made of metal, the substrate of the circuit board 4 fixed to the bottom wall is an insulating material with a relatively low thermal conductivity. Therefore, the heat absorbed by the bottom wall of the optical cage 1 would be difficult to dissipate outward.

[0070] The features of the optical cage assembly are described below.

[0071] Figures 2 to 4 show schematic diagrams of the optical cage assembly. Referring to Figure 2, the optical cage assembly includes an optical cage 1 and an optical module connector 2. One end of the optical cage 1 is open, serving as a socket 11 for inserting an optical module. The optical module connector 2 has three connection ends, denoted as the first connection end 21, the second connection end 22, and the third connection end 23. The first connection end 21 is located inside the optical cage 1 and faces the socket 11, used for electrical connection with the electrical signal connector of the optical module. The second connection end 22 and the third connection end 23 are both located on the side of the first connection end 21 opposite to the socket 11, and are both electrically connected to the first connection end 21. The second connection end 22 is used to transmit low-speed signals, such as power signals, monitoring signals, and detection signals, excluding service signals carrying service information. The third connection end 23 is used to transmit high-speed signals, i.e., service signals carrying service information.

[0072] It should be noted that, unless otherwise specified, "inside the optical cage 1" and "within the optical cage 1" in this embodiment refer to the area enclosed by all the cage walls of the optical cage 1, while "outside the optical cage 1" refers to the area outside the area enclosed by all the cage walls of the optical cage 1.

[0073] It should be noted that the optical cages described in this embodiment are all single optical cages with a single socket 11, equipped with an optical module connector 2 for inserting an optical module. The optical cage assembly may include multiple optical cages, such as M×N optical cages, where M represents the number of layers and is an integer greater than or equal to 1, and N represents the number of optical cages included in each layer and is an integer greater than or equal to 1.

[0074] In one example, service signals can be transmitted via a cable, while signals other than service signals can be transmitted via circuit board 4. Accordingly, referring to Figure 2, the third connection end 23 is connected to cable 6, and the other end of cable 6 has a signal connector 61. The signal connector 61 at the end of cable 6 is used to connect to the circuit board where the service chip is located to realize the electrical connection between the optical module and the service chip.

[0075] It should be noted that the circuit board where the business chip is located (i.e., the circuit board connected to the signal connector 61 of cable 6) and the circuit board connected to the second connection end 22 can be the same circuit board or different circuit boards. This embodiment does not limit this. The attached figure shows that the circuit board connected to the signal connector 61 and the circuit board connected to the second connection end 22 are the same circuit board.

[0076] Referring again to Figure 2, the second connection end 22 is directly connected to the circuit board 4. For example, the second connection end 22 is directly soldered to the surface of the circuit board 4, or the second connection end 22 is pressed onto the surface of the circuit board 4.

[0077] The circuit board 4 is located on the side of the first connection end 21 opposite to the socket 11. For example, referring to Figure 2, the circuit board 4 is located on the left side of the first connection end 21 opposite to the socket 11.

[0078] This circuit board 4 is located on the left side of the first connection end 21, opposite to the socket 11, so that the bottom wall 13 of the light cage 1 is no longer fixed to the circuit board 4. This allows the heat absorbed by the bottom wall 13 to dissipate outward, and the circuit board 4 no longer blocks the bottom wall 13 from dissipating heat outward. Moreover, a heat sink can also be arranged on the outer surface of the bottom wall 13, so that heat sinks can be arranged on the outer surface of both the top wall 12 and the bottom wall 13 of the light cage 1, thereby achieving double-sided heat dissipation.

[0079] Furthermore, the service signals transmitted between the optical module and the service chip are transmitted via cable, while other signals (generally referred to as low-speed signals) are transmitted via circuit board 4. Compared to transmitting all signals via the circuit board, this method can accelerate the transmission rate of service signals, reduce the operational burden on the circuit board, and significantly reduce the size and area of ​​the circuit board.

[0080] This is because if all signals are transmitted through cable 6, especially low-speed signals other than service signals, the number of cables will inevitably increase, making the cable layout more chaotic. Moreover, the signal connector 61 at the other end of the cable (i.e. the end away from the optical module connector 2) will be larger (because the signal connector has more pins). Once the signal connector 61 of cable 6 is larger, it will occupy a larger physical space on the circuit board, thus increasing the area of ​​circuit board 4.

[0081] Therefore, service signals are transmitted through cables, while signals other than service signals are transmitted through circuit boards. This ensures high-speed transmission of service signals without requiring a large number of cables or a large circuit board area.

[0082] Regarding the positions of the first connection terminal 21, the second connection terminal 22, and the third connection terminal 23 within the optical cage 1: Referring to Figures 2 and 3, both the first connection terminal 21 and the third connection terminal 23 are located within the optical cage 1. The first connection terminal 21 faces the socket 11 to facilitate the insertion of the optical module into the optical cage 1 through the socket 11, and its electrical signal connector is electrically connected to the first connection terminal 21. The third connection terminal 23 faces away from the socket 11 so that the cable on the third connection terminal 23 can extend from the end of the optical cage 1, which is the end opposite to the socket 11.

[0083] Referring to Figure 2, the second connection terminal 22 is located outside the optical cage 1. Therefore, the circuit board 4, which is directly connected to the second connection terminal 22, is located outside the optical cage 1. For example, it can be located on the left side of the socket 11 of the optical cage 1, opposite to the optical cage 1.

[0084] Referring to Figure 3, the second connection end 22 is located in the optical cage 1. Therefore, the circuit board 4, which is directly connected to the second connection end 22, can extend into the optical cage 1 and is located to the left of the first connection end 21.

[0085] Whether the second connection end 22 is located outside or inside the optical cage 1, it is always positioned between the top wall 12 and the bottom wall 13 of the optical cage 1. Referring to Figures 2 and 3, the circuit board 4, which is pressed or soldered to the second connection end 22, is located between the outer surface of the top wall 12 and the outer surface of the bottom wall 13. Both the outer surfaces of the top wall 12 and the bottom wall 13 are located outside the optical cage 1. Referring to Figure 2, the outer surface of the top wall 12 is also its upper surface, and the outer surface of the bottom wall 13 is also its lower surface.

[0086] In one example, the circuit board 4 is located between the outer surface of the top wall 12 and the outer surface of the bottom wall 13 of the optical cage 1, which is conducive to the high-density arrangement of the optical cage assembly.

[0087] For example, referring to Figure 4, the optical cage assembly includes multiple layers of optical cages, such as M layers, where M is an integer greater than or equal to 2. Each layer of optical cages includes at least one optical cage, such as N optical cages, where N is an integer greater than or equal to 1. Thus, the optical cage assembly includes M×N optical cages. The number of optical module connectors 2 is also multiple, such as M×N, equal to the number of optical cages. Each optical cage is used to insert one optical module to connect with the optical module connector 2 housed within that optical cage. For example, if the optical cage assembly includes three layers of optical cages, with each layer containing five optical cages, then the number of optical cages is fifteen, and the number of optical module connectors 2 is also fifteen. The number of circuit boards 4 is also multiple, equal to the number of layers of optical cages. For example, if the optical cage has three layers, then the number of circuit boards 4 is three. Each optical cage corresponds to a circuit board 4, and the second connection end 22 of the optical module connector 2 of each optical cage is crimped or soldered to the same circuit board 4.

[0088] Referring to Figure 4, since each circuit board 4 is located between the outer surfaces of the top and bottom walls of its corresponding optical cage layer, meaning that each circuit board 4 is not fixed to the bottom wall 13 of its corresponding optical cage layer, as shown in Figure 4, the circuit board 4 does not occupy additional height space of the communication device in the height direction (also the thickness direction). Therefore, more layers of optical cage assemblies can be arranged in the height direction, which is beneficial for high-density arrangement of the optical cage assemblies. As mentioned above, the optical cage assembly is also the optical interface of the communication device; therefore, this embodiment is beneficial for high-density arrangement of the optical interface of the communication device.

[0089] It should be noted that, as described above, the circuit board 4 can extend into the optical cage 1 and be crimped or soldered to the second connecting end 22 inside the optical cage 1. However, the area of ​​the circuit board 4 is usually larger than the diameter of the optical cage 1. In order for the circuit board 4 to extend into the optical cage 1, one implementation method is as shown in Figure 5, where the two side walls of the optical cage 1 have notches at positions away from the insertion port 11. The circuit board 4 can extend into the notches on both sides of the optical cage 1 and enter the optical cage 1 to be crimped or soldered to the second connecting end 22 inside the optical cage 1. Another implementation method is as shown in Figure 6, where one end of the circuit board 4 has a connecting part 41, which is used to crimp or weld with the second connecting end 22 of the optical module connector 2. The connecting part 41 has slots 42 on both sides in the width direction. The width of the slots 42 is adapted to the thickness of the side wall of the optical cage 1. Then, a single connecting part 41 of the circuit board 4 extends into the optical cage 1 and is crimped or welded to the second connecting end 22 of the optical cage 1. The slots 42 on both sides of the connecting part 41 are respectively inserted into the two side walls of the optical cage 1. This also enables the circuit board 4 to extend into the optical cage 1 and be electrically connected to the second connecting end 22.

[0090] In one example, referring to Figures 2 to 4, the first connecting end 21, the second connecting end 22, and the third connecting end 23 can be processed into a single plastic part.

[0091] In another example, as shown in Figure 7, the first connecting end 21, the second connecting end 22, and the third connecting end 23 can be processed into two plastic parts. For example, referring to Figure 7, the optical module connector 2 includes a fixed connecting part 2a and a floating connecting part 2b. The second connecting end 22 is located on the fixed connecting part 2a, while the first connecting end 21 and the third connecting end 23 are both located on the floating connecting part 2b. Since the second connecting end 22, integrated on the fixed connecting part 2a, is pressed or soldered to the circuit board 4, the fixed connecting part 2a is fixedly connected to the circuit board 4. Since the circuit board 4 is immovable in the communication device, the fixed connecting part 2a is also a non-movable component.

[0092] Regarding the relationship between the fixed connection part 2a and the optical cage 1, please refer to Figure 7. The fixed connection part 2a can be located inside the optical cage 1. Of course, in some other examples, the fixed connection part 2a can also be located outside the optical cage 1.

[0093] The floating connection part 2b is located inside the optical cage 1, and the floating connection part 2b can move up and down in the optical cage 1 in a direction perpendicular to the height of the optical cage 1.

[0094] Thus, after the optical module is inserted into the optical cage 1, the electrical signal connector of the optical module 5 is aligned with the first connection end 21. Referring to Figure 8, even if the center line of the electrical signal connector of the optical module 5 is slightly misaligned with the center line of the first connection end 21, the floating connection part 2b can move up and down in the thickness direction. Referring to Figure 9, this allows the electrical signal connector of the optical module 5 to be smoothly inserted into the first connection end 21, thereby realizing the electrical connection between the optical module 5 and the optical module connector 2.

[0095] For example, referring to Figure 8, after the optical module 5 is inserted into the optical cage 1, even if the electrical signal connector of the optical module 5 is not completely aligned with the first connection end 21, under the action of the guiding structure of the first connection end 21, the electrical signal connector of the optical module 5 extends into the first connection end 21. As the optical module 5 continues to be inserted, the floating connection part 2b where the first connection end 21 is located moves upward. Thus, referring to Figure 9, the electrical signal connector of the optical module 5 is completely aligned with the first connection end 21, and the electrical signal connector of the optical module 5 is inserted into the first connection end 21, realizing the electrical connection between the optical module 5 and the optical module connector 2.

[0096] In one example, as described above, the first connecting end 21 and the second connecting end 22 are electrically connected. Therefore, referring to FIG9, the fixed connecting part 2a and the floating connecting part 2b can be electrically connected by a wire, or the fixed connecting part 2a and the floating connecting part 2b can be electrically connected by a spring or elastic sheet. In this way, the electrical connection between the first connecting end 21 and the second connecting end 22 is ensured, while also ensuring that the fixed connecting part 2a does not interfere with the up-and-down movement of the floating connecting part 2b.

[0097] It should be noted that the length of the wire is greater than the distance between the fixed connection part 2a and the floating connection part 2b. As shown in Figure 7, the wire is connected between the fixed connection part 2a and the floating connection part 2b in a curved shape. In this way, the fixed connection part 2a will not interfere with the floating connection part 2b as it floats up and down in the thickness direction.

[0098] This optical module connector 2 includes a fixed connection part 2a and a floating connection part 2b. The floating connection part 2b can move up and down, which helps to reduce the processing tolerance of the optical module connector 2 and the assembly tolerance of the optical module connector 2 within the optical cage 1.

[0099] As described above, the circuit board 4 is located between the outer surface of the top wall 12 and the outer surface of the bottom wall 13 of the optical cage 1. The circuit board 4 is not fixed to the bottom wall of the optical cage 1. Therefore, heat sinks 3 can be arranged on both the outer surface of the top wall 12 and the outer surface of the bottom wall 13 of the optical cage 1.

[0100] Figure 10 shows a schematic diagram of the optical cage assembly including the heat sink 3. Both the top wall 12 and the bottom wall 13 of the optical cage 1 have windows. Referring to Figure 10, one heat sink 3 is arranged on the outer surface of the top wall 12 of the optical cage 1, and a portion of the heat sink 3 extends into the optical cage 1 through the window on the top wall 12. Continuing to refer to Figure 10, another heat sink 3 is arranged on the outer surface of the bottom wall 13 of the optical cage 1, and a portion of this heat sink 3 extends into the optical cage through the window on the bottom wall 13. Thus, after the optical module 5 is inserted into the optical cage 1, the top surface (i.e., the top surface) of the optical module 5 contacts the heat sink 3 on the top wall 12, and the bottom surface (i.e., the bottom surface) of the optical module 5 contacts the heat sink 3 on the bottom wall 13, thereby achieving double-sided heat dissipation for the optical module.

[0101] Specifically, the radiator 3 can be a liquid-cooled radiator or an air-cooled radiator. This embodiment does not limit the type of heat dissipation of the radiator.

[0102] In one example, the radiator 3 includes a heat dissipation base plate 31. Referring to Figure 10, the radiator 3 arranged on the top wall 12 of the light cage 1 has the heat dissipation base plate 31 fixed to the outer surface of the top wall 12. The radiator 3 arranged on the bottom wall 13 of the light cage 1 has the heat dissipation base plate 31 fixed to the outer surface of the bottom wall 13.

[0103] As described above, a portion of the heat sink 3 on the top wall 12 and a portion of the heat sink 3 on the bottom wall 13 extend into the optical cage to contact the optical module inserted into the optical cage. Correspondingly, a boss may be provided on the surface of the heat sink base plate 31, and the boss may extend into the optical cage 1.

[0104] In other examples, the radiator 3 may also include heat dissipation fins located on the surface of the heat dissipation base plate 31, which are used to increase the heat dissipation area.

[0105] In another example, as shown in the schematic diagram of the heat sink in Figure 11, the heat sink 3 may also include a heat-conducting film 32, which is fixed on the surface of the heat sink base plate 31. Furthermore, a cavity may be formed between the heat-conducting film 32 and the surface of the heat sink base plate 31, in which a heat-conducting material is arranged.

[0106] Specifically, the thermally conductive material can be thermally conductive gel, thermally conductive grease, or phase change material (PCM). For PCM thermally conductive materials, the material is solid at lower temperatures and liquid at higher temperatures.

[0107] Referring to Figure 10, the heat sink 3, arranged on the outer surface of the top wall 12 of the light cage 1, has its heat dissipation base plate 31 fixed to the outer surface of the top wall 12. The heat-conducting film 32 fixed on the surface of the heat dissipation base plate 31 extends into the light cage 1 through the window on the top wall 12. Similarly, the heat sink 3, arranged on the outer surface of the bottom wall 13 of the light cage 1, has its heat dissipation base plate 31 fixed to the outer surface of the bottom wall 13. The heat-conducting film 32 fixed on the surface of the heat dissipation base plate 31 extends into the light cage 1 through the window on the bottom wall 13.

[0108] In one example, the thermal conductive film 32 is relatively thin and has a certain degree of extensibility, so the thermal conductive film 32 can be used to absorb the fit tolerance between the optical cage 1 and the optical module 5.

[0109] In one example, referring to Figure 11, the thermally conductive film 32 has multiple holes that penetrate its thickness. The dimensions of these holes satisfy the following: when no optical module 5 is inserted in the optical cage 1, the thermally conductive material in the cavity between the heat dissipation base plate 31 and the thermally conductive film 32 is confined within the cavity; when the optical module 5 is inserted in the optical cage 1, the thermally conductive material in the cavity between the heat dissipation base plate 31 and the thermally conductive film 32 flows out from the holes to fill the space between the thermally conductive film 32 and the optical module 5.

[0110] When the optical module 5 is not inserted into the optical cage 1, the heat-conducting material in the cavity between the heat dissipation base plate 31 and the heat-conducting film 32 can be in a solid state or a viscous paste or liquid. Furthermore, the surface tension of the liquid makes it difficult for the heat-conducting material to flow out of the holes. However, after the optical module 5 is inserted into the optical cage 1, the optical module 5 generates heat during operation, causing the temperature of the heat sink 3 to rise. The heat-conducting material in the cavity undergoes a phase change, changing from solid to liquid, or its viscosity decreases. Moreover, the heat-conducting film 32 is compressed by the optical module, allowing the liquid in the cavity to flow out of the holes. The flowing liquid fills the space between the heat-conducting film 32 and the optical module 5, reducing the thermal resistance between them and enhancing heat transfer. This strengthens heat dissipation for the optical module.

[0111] It should be noted that after the optical module is inserted into the optical cage, it will squeeze out the heat-conducting material in the cavity between the heat sink and the thermally conductive film. Therefore, after frequent insertion and removal of the optical module, the amount of heat-conducting material in the cavity will decrease. To address this, the volume of the cavity can be increased to store more heat-conducting material. Alternatively, the thermally conductive film 32 can have a liquid replenishment hole. When liquid replenishment is not required, the replenishment hole is sealed with a plug. When liquid replenishment is needed, the plug can be removed, and heat-conducting material can be added to the cavity using a liquid replenishment tool.

[0112] In one example, a thermally conductive film 32 is fixed to the surface of the heat dissipation base plate 31. The thermally conductive film 32 has a certain degree of elasticity and can absorb the fit tolerance between the optical cage 1 and the optical module 5. Therefore, one heat dissipation base plate 31 can dissipate heat for the optical modules in multiple optical cages 1, making the heat sink 3 a pooled heat sink. A pooled heat sink is a heat sink that resembles a heat dissipation pool, sharing heat dissipation for multiple optical modules. This increases the area of ​​the heat sink 3 and enhances the heat dissipation effect.

[0113] Accordingly, as shown in Figure 12, the optical cage assembly includes M layers of optical cages, where M is an integer greater than or equal to 1. Therefore, the optical cage assembly includes one or more layers of optical cages. Figure 12 illustrates one layer. A single optical cage layer includes N optical cages, where N is an integer greater than or equal to 2. Thus, a single optical cage layer includes at least two optical cages. Figure 12 illustrates a single optical cage layer including two optical cages 1. It is understood that each optical cage 1 contains an optical module connector 2, which is not shown in the figure.

[0114] As shown in Figure 12, a single heat sink 3 includes a heat dissipation base plate 31 and multiple thermally conductive films 32. The number of thermally conductive films 32 is related to the number of optical cages included in a single optical cage layer. Specifically, the number of thermally conductive films 32 is less than or equal to the number of optical cages included in a single optical cage layer. For example, if a single optical cage layer in Figure 12 includes two optical cages, then the number of thermally conductive films 32 can be two.

[0115] It should be noted that if the number of thermally conductive films 32 fixed on the surface of the heat dissipation base plate 31 is equal to the number of optical cages included in one optical cage, it means that all optical modules in the same optical cage are cooled by one heat sink 3 (refer to Figure 12). If the number of thermally conductive films 32 fixed on the surface of the heat dissipation base plate 31 is less than the number of optical cages included in one optical cage, it means that the optical modules in the same optical cage are cooled by at least two heat sinks 3.

[0116] Referring again to Figure 12, two thermal conductive films 32 are fixed on the surface of the heat dissipation base plate 31. Each thermal conductive film 32 forms a cavity with the heat dissipation base plate 31. The thermal conductive material described above is arranged in the cavity, and the thermal conductive film 32 has the pores described above.

[0117] Referring to Figure 12, at least one heat dissipation base plate 31 is arranged on the outer surface of the top wall 12 of the optical cage 1 located in the same layer. Multiple heat-conducting films 32 on the surface of the heat dissipation base plate 31 extend into the multiple optical cages included in the optical cage 1 in the same layer.

[0118] Referring to Figure 12, at least one heat dissipation base plate 31 is arranged on the outer surface of the bottom wall 13 of the optical cage 1 located in the same layer. Multiple heat-conducting films 32 on the surface of the heat dissipation base plate 31 extend into the multiple optical cages included in the same layer of optical cages.

[0119] Because the heat-conducting film 32 fixed on the surface of the heat dissipation base plate 31 has a certain elasticity, when the optical module is inserted into the optical cage, the deformation of the heat-conducting film 32 absorbs the tolerance of the optical module in the thickness direction, without the need for the heat dissipation base plate 31 to float up and down to absorb the tolerance. Therefore, as shown in Figure 12, a single heat dissipation base plate 31 can be arranged on the outer surface of the top wall or the outer surface of the bottom wall of multiple optical cages 1 to dissipate heat for the optical modules in multiple optical cages 1.

[0120] It should be noted that in the scheme of the optical cage assembly including M layers of optical cages, M is an integer greater than or equal to 1. Alternatively, a heat dissipation base plate 31 can be arranged only on the top wall of a single-layer optical cage, or only on the bottom wall of a single-layer optical cage, to achieve single-sided heat dissipation. Figure 12 illustrates that heat dissipation base plates 31 are arranged on the outer surfaces of both the top and bottom walls of a single-layer optical cage.

[0121] It should be noted that the heat sink with the thermally conductive film 32 fixed on the surface of the heat sink base plate 31 can be directly fixed to the top or bottom wall of the optical cage. It cannot float vertically in the thickness direction. When the optical module is inserted into the optical cage, the deformation of the thermally conductive film 32 absorbs the tolerance. Alternatively, the heat sink with the thermally conductive film 32 fixed on the surface of the heat sink base plate 31 can be a floating heat sink. After being installed on the outer surface of the top or bottom wall of the optical cage using fasteners, the heat sink can also float vertically. Therefore, during optical module insertion, the deformation of the thermally conductive film 32 on the surface of the heat sink base plate 31, as well as the vertical floating of the heat sink base plate 31, can absorb the tolerance.

[0122] In one example, as described above, the optical cage assembly may include M layers of optical cages, where M is an integer greater than or equal to 1, and each layer of optical cages includes N optical cages, where N is an integer greater than or equal to 1. For example, as shown in Figure 13, the optical cage assembly includes three layers of optical cages, each layer including five optical cages 1. Then, at least one heat dissipation base plate 31 as described above is arranged on the outer surface of the top wall of each layer of optical cages, or at least one heat dissipation base plate 31 as described above is arranged on the outer surface of the bottom wall of each layer of optical cages, or at least one heat dissipation base plate 31 as described above is arranged on the outer surface of the top wall of each layer of optical cages, and at least one heat dissipation base plate 31 as described above is arranged on the outer surface of the bottom wall of each layer of optical cages. Figure 13 shows a schematic diagram with heat dissipation base plates 31 arranged on both the outer surface of the top wall and the outer surface of the bottom wall of the optical cage 1.

[0123] For example, each optical cage layer includes five optical cages. Two heat dissipation plates 31, as described above, can be arranged on the outer surface of the top wall of each optical cage layer. One heat dissipation plate 31 dissipates heat from the optical modules within two optical cages, and the other heat dissipation plate 31 dissipates heat from the optical modules within the other three optical cages. Alternatively, five heat dissipation plates 31, as described above, can be arranged on the outer surface of the top wall of each optical cage layer. Each heat dissipation plate 31 dissipates heat from the optical modules within a single optical cage.

[0124] Similarly, taking an example where each optical cage layer comprises five optical cages, two heat dissipation plates 31 as described above can be arranged on the outer surface of the bottom wall of each optical cage layer. One heat dissipation plate 31 dissipates heat from the optical modules within two optical cages, and the other heat dissipation plate 31 dissipates heat from the optical modules within the other three optical cages. Alternatively, five heat dissipation plates 31 as described above can be arranged on the outer surface of the bottom wall of each optical cage layer, with each heat dissipation plate 31 dissipating heat from the optical modules within a single optical cage.

[0125] In this embodiment, the number of heat dissipation base plates 31 arranged on the outer surface of the top wall of each layer of the optical cage is not limited. An example is shown in Figure 13.

[0126] It should be noted that in this embodiment, the heat sink 3 can be arranged only on the outer surface of the top wall of the light cage, or only on the outer surface of the bottom wall of the light cage, or both the top and bottom walls of the light cage can be arranged. This embodiment does not limit whether the heat sink is arranged on the outer surface of the top wall or the bottom wall of the light cage. The example is that the heat sink is arranged on both the outer surface of the top wall and the outer surface of the bottom wall.

[0127] In one example, two adjacent light cages can share the same heat dissipation base plate 31. Referring to Figure 13, among the multiple heat dissipation base plates 31, two have multiple thermally conductive films 32 fixed to one surface. These thermally conductive films 32 correspond one-to-one with the multiple light cages in one layer. This type of heat dissipation base plate 31 with multiple thermally conductive films 32 fixed on one side can be referred to as the first heat dissipation base plate 311. The remaining heat dissipation base plates 31 all have thermally conductive films 32 fixed to both surfaces. For example, the upper surface of the heat dissipation base plate 31 has multiple thermally conductive films 32 fixed, and the lower surface also has multiple thermally conductive films 32 fixed. The thermally conductive films 32 fixed to the upper and lower surfaces of the heat dissipation base plate 31 are mirror-symmetrical. This type of heat dissipation base plate 31 with multiple thermally conductive films 32 fixed to both surfaces can be referred to as the second heat dissipation base plate 312.

[0128] Referring to Figure 13, at least one first heat dissipation base plate 311 is arranged on the outer surface of the bottom wall 13 of the lowest layer of optical cage, at least one first heat dissipation base plate 311 is arranged on the outer surface of the top wall 12 of the uppermost layer of optical cage, and at least one second heat dissipation base plate 312 is arranged between two adjacent optical cages. The thermal conductive film 32 on the lower surface of the second heat dissipation base plate 312 extends into the next layer of optical cage, and the thermal conductive film 32 on the upper surface of the second heat dissipation base plate 312 extends into the upper layer of optical cage.

[0129] It should be noted that, as described above, the optical cage 1 in this embodiment is no longer fixed to the circuit board 4. Therefore, referring to Figure 13, the optical cage 1 can be fixed to the heat dissipation base plate 31, which is fixed to the structural components of the communication equipment. For example, for frame-type or cabinet-type communication equipment, the heat dissipation base plate 31 is fixed to the protective plate of the single board. For example, for box-type communication equipment, the heat dissipation base plate 31 is fixed to the housing of the communication equipment.

[0130] In this embodiment, the optical cage assembly includes an optical cage and an optical module connector. The optical module connector includes a first connection terminal for electrical connection with the optical module, a second connection terminal for crimping or soldering with a circuit board, and a third connection terminal for connection with a service chip. When the optical cage assembly is assembled into a communication device, the circuit board is located on the side of the first connection terminal away from the optical cage's socket, thus there is no longer a fixed connection between the circuit board and the bottom wall of the optical cage. Therefore, after absorbing heat from the optical module, the bottom wall of the optical cage can quickly dissipate it outwards without being affected by the low thermal conductivity of the circuit board, thereby enhancing the heat dissipation effect for the optical module.

[0131] In addition, since there is no longer a fixed relationship between the bottom wall of the optical cage and the circuit board, a heat sink can also be arranged on the outer surface of the bottom wall of the optical cage. In this way, heat sinks are arranged on both the outer surface of the top wall and the outer surface of the bottom wall of the optical cage, so as to achieve double-sided heat dissipation for the optical module inserted into the optical cage, and further enhance the heat dissipation effect of the optical module.

[0132] Furthermore, since the bottom wall of the optical cage and the circuit board are no longer fixed together, the circuit board can either be retracted to the side of the optical cage furthest from the connector, located outside the optical cage, or it can be located in the space between the outer surfaces of the top and bottom walls of the optical cage. In either case, the circuit board no longer occupies additional space in the thickness direction of the communication device (which is also the height direction of the communication device's panel and the thickness direction of the optical module). Therefore, the space saved in the thickness direction can be used to arrange more layers of optical cages, or to provide more air inlet and outlet space for the communication device. Arranging more layers of optical cages in the thickness direction is beneficial for high-density arrangement of optical interfaces on the communication device's panel. More air inlet and outlet space enhances the internal heat dissipation of the communication device.

[0133] This disclosure also provides a heat sink, which includes the heat dissipation base plate 31 and the heat-conducting film 32 described above. The heat-conducting film 32 is fixed to the surface of the heat dissipation base plate 31, and a cavity is formed between the heat-conducting film 32 and the heat dissipation base plate 31. A heat-conducting material is disposed in the cavity. The material of the heat-conducting material can refer to the description above.

[0134] In one example, the thermally conductive film 32 may have multiple holes that penetrate its thickness. The size of the holes satisfies the following conditions: when the thermally conductive film 32 is not in contact with the device to be cooled, the thermally conductive material in the cavity is confined within the cavity; when the thermally conductive film 32 comes into contact with the device to be cooled, the thermally conductive material in the cavity flows out from the holes to fill the space between the thermally conductive film 32 and the device to be cooled.

[0135] Among them, the device to be cooled is the component that needs to be cooled, such as the optical module mentioned above, or the chip inside the communication equipment (for example, for a chassis-type communication equipment, the device to be cooled can be the service chip on the service board, or the switching chip on the switching board).

[0136] In a heat sink solution for cooling chips within a communication device, for example, both the chip and the heat sink base 31 are fixed to the circuit board of the communication device, with the heat sink base 31 covering the chip. A thermally conductive film 32 on the surface of the heat sink base 31 contacts the chip, and thermally conductive material flowing from the cavity fills the space between the thermally conductive film 32 and the chip surface. Here, "chip" generally refers to a packaged chip.

[0137] In a heat sink solution for cooling optical modules inserted into communication equipment, the heat sink base plate 31 can be fixed to the outer surface of the top wall of the optical cage 1, or it can be fixed to the outer surface of the bottom wall of the optical cage 1. The thermally conductive film 32 fixed to the surface of the heat sink base plate 31 extends into the optical cage 1 to contact the optical module inserted inside the optical cage 1. It should be noted that the optical cage 1 can be either the optical cage 1 described above that is not fixedly connected to the circuit board 4, or it can be the optical cage 1 that is fixedly connected to the circuit board 4. Therefore, this embodiment includes the following solutions.

[0138] In one embodiment, a heat dissipation base plate 31 is arranged on the outer surface of the top wall 12 of the optical cage 1. A heat-conducting film 32 fixed on the surface of the heat dissipation base plate 31 passes through the window on the top wall 12 of the optical cage 1 and extends into the optical cage 1.

[0139] In another embodiment, a heat dissipation base plate 31 is arranged on the outer surface of the bottom wall 13 of the light cage 1. A heat-conducting film 32 fixed on the surface of the heat dissipation base plate 31 extends into the light cage 1 through the window on the bottom wall 13 of the light cage 1.

[0140] In another embodiment, heat dissipation base plates 31 are arranged on the outer surface of the top wall 12 and the outer surface of the bottom wall 13 of the optical cage 1. The heat-conducting film 32 on the heat dissipation base plate 31 on the top wall 12 extends into the optical cage through the window on the top wall 12, and the heat-conducting film 32 on the heat dissipation base plate 31 on the bottom wall 13 extends into the optical cage through the window on the bottom wall 13.

[0141] It should be noted that in the scheme where both the top and bottom walls of the optical cage 1 are equipped with heat dissipation base plates 31, the optical cage 1 can be as described above, where its bottom wall has no fixed connection to the circuit board 4, or it can be that the bottom wall of the optical cage 1 has a fixed connection to the circuit board. In the scheme where the bottom wall of the optical cage 1 has a fixed connection to the circuit board, a window can be opened on the circuit board. In this case, the heat dissipation base plate 31 can pass through the window on the circuit board and be arranged on the bottom wall of the optical cage 1. The thermal conductive film 32 on the heat dissipation base plate 31 then passes through the window on the bottom wall of the optical cage and extends into the optical cage. Alternatively, the heat dissipation base plate 31 can be arranged on the surface of the circuit board facing away from the optical cage, and the thermal conductive film 32 on the heat dissipation base plate 31 can pass through the window on the circuit board and the window on the bottom wall of the optical cage in sequence and extend into the optical cage.

[0142] This scheme, in which a heat dissipation base plate 31 is fixed with a thermally conductive film 32, can absorb tolerances through the deformation of the thermally conductive film 32. The thermally conductive material overflowing between the heat dissipation base plate 31 and the thermally conductive film 32 can fill the space between the thermally conductive film 32 and the device to be cooled, thereby accelerating the heat transfer between the heat sink and the device to be cooled and speeding up the heat dissipation of the device to be cooled.

[0143] In one example, one or more thermally conductive films 32 may be fixed on the same surface of the heat sink 31. In the embodiment where one thermally conductive film 32 is fixed on the surface of the heat sink 31, the heat sink 31 provides heat dissipation for a chip or an optical module. In the embodiment where multiple thermally conductive films 32 are fixed on the surface of the heat sink 31, the heat sink 31 provides heat dissipation for multiple chips arranged on the same layer, or for multiple optical modules arranged on the same layer.

[0144] For example, in a scheme where the heat dissipation base plate 31 is used to dissipate heat from multiple chips arranged on the same layer, multiple chips are arranged on the circuit board of the communication equipment. The heat dissipation base plate 31 can be fixed on the circuit board and cover the multiple chips on the circuit board. Multiple thermal conductive films 32 fixed on the surface of the heat dissipation base plate 31 contact the multiple chips one by one.

[0145] For example, in a scheme where the heat dissipation base plate 31 is used to dissipate heat from multiple optical modules arranged on the same layer, the communication equipment includes at least one optical cage, and a single optical cage includes multiple optical cages. In this case, the heat dissipation base plate 31 can be fixed on the outer surface of the top wall of one optical cage, and multiple thermal conductive films 32 fixed on the surface of the heat dissipation base plate 31 extend into each optical cage of the optical cage to contact the top surface of the optical module inserted into each optical cage.

[0146] Alternatively, the heat dissipation base plate 31 can be fixed on the outer surface of the bottom wall of a layer of optical cages, and multiple heat-conducting films 32 fixed on the surface of the heat dissipation base plate 31 can extend into each optical cage of the layer of optical cages to contact the bottom surface of the optical modules inserted into each optical cage.

[0147] Alternatively, referring to Figure 12, heat dissipation base plates 31 are arranged on the outer surfaces of the top and bottom walls of the optical cage. The heat-conducting film 32 on the heat dissipation base plate 31 on the outer surface of the top wall and the heat-conducting film 32 on the outer surface of the bottom wall both extend into the optical cage. The heat-conducting film 32 extending into the optical cage from the top wall of the optical cage contacts the top surface of the optical module, and the heat-conducting film 32 extending into the optical cage from the bottom wall of the optical cage contacts the bottom surface of the optical module, thereby achieving double-sided heat dissipation for the optical module.

[0148] In one example, thermal conductive films 32 can be fixed on two opposing surfaces of the heat dissipation base plate 31. For example, one or more thermal conductive films 32 are fixed on the first surface of the heat dissipation base plate 31, and one or more thermal conductive films 32 are fixed on the second surface of the heat dissipation base plate 31. The first and second surfaces of the heat dissipation base plate 31 are opposite to each other. For example, the first surface is the upper surface of the heat dissipation base plate 31, and the second surface is the lower surface of the heat dissipation base plate 31.

[0149] This heat dissipation base plate 31, with thermal conductive films 32 fixed on both sides, can be used in multi-layer heat dissipation devices. For example, the heat dissipation base plate 31 can be fixed between the first layer of heat dissipation devices and the second layer of heat dissipation devices. The thermal conductive film 32 fixed on the first surface of the heat dissipation base plate 31 is used to contact the first layer of heat dissipation devices, and the thermal conductive film 32 fixed on the second surface of the heat dissipation base plate 31 is used to contact the second layer of heat dissipation devices.

[0150] For example, a heat dissipation base plate 31 with heat-conducting films 32 fixed on both sides is used in the M-layer optical module scheme shown in Figure 13, where M is an integer greater than or equal to 2, such as M=3. Then, a heat dissipation base plate 31 is fixed between two adjacent optical cages. The heat-conducting film 32 fixed on the upper surface of the heat dissipation base plate 31 extends into the upper optical cage, and the heat-conducting film 32 fixed on the lower surface of the heat dissipation base plate 31 extends into the lower optical cage. The outer surface of the top wall of the uppermost optical cage can be equipped with a heat dissipation base plate 31 with a heat-conducting film 32 fixed on one side, and the outer surface of the bottom wall of the lowermost optical cage can also be equipped with a heat dissipation base plate 31 with a heat-conducting film 32 fixed on one side.

[0151] It should be noted that the number of heat dissipation base plates 31 (i.e., the number of heat sinks 3) is related to the number of optical cage layers M. For example, in a single-layer heat dissipation scheme where one heat sink dissipates heat for all optical modules within one optical cage layer, the number of heat dissipation base plates 31 is equal to the number of optical cage layers. As another example, in a double-layer heat dissipation scheme where one heat sink dissipates heat for all optical modules within one optical cage layer, the number of heat dissipation base plates 31 is (M+1), where M is the number of optical cage layers. As another example, in a single-layer heat dissipation scheme where the optical modules within one optical cage layer are dissipated by two heat sinks 3, the number of heat dissipation base plates 31 is M×2. As another example, in a double-layer heat dissipation scheme where the optical modules within one optical cage layer are dissipated by two heat sinks 3, the number of heat dissipation base plates 31 is (M+1)×2. The relationship between the number of heat dissipation base plates 31 and the number of optical cage layers will not be elaborated further.

[0152] The number of thermally conductive films 32 fixed on a single heat sink base plate 31 is related to the number of optical cages included in a single optical cage layer. Specifically, the number of thermally conductive films 32 fixed on a single heat sink base plate 31 is less than or equal to the number of optical cages included in a single optical cage layer. For example, in a scheme where a heat sink dissipates heat from all optical modules in a single optical cage layer, the number of thermally conductive films 32 fixed on a single heat sink base plate 31 is equal to the number of optical cages included in a single optical cage layer. As another example, in a scheme where a heat sink dissipates heat from a portion of optical modules in a single optical cage layer, the number of thermally conductive films 32 fixed on a single heat sink base plate 31 is less than the number of optical cages included in a single optical cage layer.

[0153] In this embodiment, the heat dissipation base plate with a thermally conductive film fixed on its surface can absorb tolerances through the deformation of the thermally conductive film. Therefore, a single heat dissipation base plate can be fixed to multiple devices to be cooled, increasing the heat dissipation area and improving the heat dissipation effect. Furthermore, the thermally conductive material overflowing between the heat dissipation base plate and the thermally conductive film can fill the space between the thermally conductive film and the device to be cooled, accelerating heat transfer between the heat sink and the device, thus speeding up heat dissipation for the device.

[0154] This disclosure also provides a heat dissipation structure, which includes an optical cage and the heat sink described above. It should be noted that the optical cage can be fixed to the circuit board as shown in Figure 1, or it can be disposed of separately from the circuit board, as shown in Figures 2 to 5 and Figures 7 to 10.

[0155] This embodiment also provides a communication device, which includes a circuit board and the aforementioned optical cage assembly. The circuit board is located on the side of the first connection end away from the optical cage socket, and the second connection end is crimped or soldered onto the surface of the circuit board. For detailed descriptions, please refer to the above description, which will not be repeated here.

[0156] This embodiment also provides a communication device including the heat sink described above. For example, the communication device includes a chip and the heat sink described above, with the heat sink used to dissipate heat from the chip. Both the chip and the heat sink are fixed to the circuit board of the communication device, and the heat sink's heat dissipation base plate covers the chip, with the thermally conductive film on the heat dissipation base plate in contact with the chip. As another example, the heat sink is used to dissipate heat from an optical module inserted into the communication device. In this case, the heat sink's heat dissipation base plate is fixed to the outer surface of the top or bottom wall of the optical cage, and the heat dissipation film of the heat sink extends into the optical cage to contact the optical module inserted into the optical cage. For detailed descriptions, please refer to the above description; further elaboration is unnecessary.

[0157] It should be noted that the communication equipment mentioned above can be a communication equipment with an integrated optical module, or a communication equipment with an optical interface on the panel for plugging and unplugging the optical module.

[0158] This embodiment also provides a communication device, which includes the heat dissipation structure described above.

[0159] The terminology used in the embodiments of this disclosure is for illustrative purposes only and is not intended to limit the disclosure. Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should be understood in their ordinary sense by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "an," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising," "including," and similar terms mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, but do not exclude other elements or objects. "Upper," "lower," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly. "A plurality" refers to two or more, unless otherwise expressly defined.

[0160] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A light cage assembly, characterized in that, The optical cage assembly includes an optical cage (1) and an optical module connector (2); The optical module connector (2) has a first connection end (21), a second connection end (22) and a third connection end (23), and the second connection end (22) and the third connection end (23) are both electrically connected to the first connection end (21); The optical cage (1) has a socket (11) for inserting an optical module (5), and the first connection end (21) is located in the optical cage (1) and faces the socket (11) for electrical connection with the optical module (5) inserted in the optical cage (1). The second connection end (22) and the third connection end (23) are both located on the side of the first connection end (21) opposite to the socket (11). The second connection end (22) is used to crimp or solder with the circuit board (4). The third connection end (23) is connected to a cable. The circuit board (4) is located on the side of the first connection end (21) opposite to the socket (11). The cable is used to electrically connect with the business chip.

2. The photocage assembly according to claim 1, characterized in that, The second connection end (22) is located between the top wall (12) and the bottom wall (13) of the optical cage (1), so that the circuit board (4) pressed or welded to the second connection end (22) is located between the outer surface of the top wall (12) and the outer surface of the bottom wall (13), wherein the outer surface of the top wall (12) and the outer surface of the bottom wall (13) are both surfaces located outside the optical cage (1).

3. The photocage assembly according to claim 1, characterized in that, The second connection end (22) is located outside the optical cage (1) and on the side of the optical cage (1) opposite to the socket (11), so that the circuit board that is crimped or soldered to the second connection end (22) is located outside the optical cage (1) and on the side opposite to the socket (11).

4. The photocage assembly according to any one of claims 1 to 3, characterized in that, The light cage assembly also includes a heat sink (3), and the top wall (12) and bottom wall (13) of the light cage (1) both have windows; The heat sink (3) is arranged on the outer surface of the top wall (12), and a portion of the heat sink (3) on the top wall (12) extends through the window on the top wall (12) into the light cage (1); The heat sink (3) is arranged on the outer surface of the bottom wall (13), and a portion of the heat sink (3) on the bottom wall (13) extends through the window on the bottom wall (13) into the light cage (1).

5. The photocage assembly according to claim 4, characterized in that, The radiator (3) includes a heat dissipation base plate (31) and a heat-conducting film (32). The heat-conducting film (32) is fixed on the surface of the heat dissipation base plate (31), and a cavity is formed between the heat-conducting film (32) and the surface of the heat dissipation base plate (31). The cavity contains a heat-conducting material. The heat dissipation base plate (31) is arranged on the outer surface of the top wall (12) or the bottom wall (13), and the heat-conducting film (32) extends through the window on the top wall (12) or the bottom wall (13) into the light cage (1).

6. The photocage assembly according to claim 5, characterized in that, The thermally conductive film (32) has multiple holes that penetrate its thickness. The size of the holes satisfies the following conditions: when no optical module (5) is inserted in the optical cage (1), the thermally conductive material in the cavity is confined in the cavity; when an optical module (5) is inserted in the optical cage (1), the thermally conductive material in the cavity flows out from the holes to fill the space between the thermally conductive film (32) and the optical module (5).

7. The photocage assembly according to claim 5 or 6, characterized in that, The optical cage assembly includes one or more optical cages, each optical cage including multiple optical cages (1), and multiple thermal conductive films (32) are fixed on the surface of the heat dissipation base plate (31). On the outer surface of the top wall (12) of the light cage (1) located on the same layer, a heat dissipation base plate (31) is arranged, and multiple heat-conducting films (32) on the surface of the heat dissipation base plate (31) extend into the multiple light cages (1) through the windows on the top wall (12). On the outer surface of the bottom wall (13) of the light cage (1) located on the same layer, a heat dissipation base plate (31) is arranged, and multiple heat-conducting films (32) on the surface of the heat dissipation base plate (31) extend into the multiple light cages (1) through the windows on the bottom wall (13).

8. The photocage assembly according to any one of claims 1 to 7, characterized in that, The optical module connector (2) includes a fixed connection part (2a) and a floating connection part (2b); The second connecting end (22) is located on the fixed connecting part (2a), and the first connecting end (21) and the third connecting end (23) are both located on the floating connecting part (2b); The floating connection (2b) is located in the light cage (1) and can move up and down in a direction perpendicular to the height of the light cage (1).

9. A radiator, characterized in that, The heat sink includes a heat dissipation base plate (31) and a heat-conducting film (32); The thermal conductive film (32) is fixed on the surface of the heat dissipation base plate (31), and a cavity is formed between the thermal conductive film (32) and the surface of the heat dissipation base plate (31), and the cavity contains a thermally conductive material; The thermal conductive film (32) has multiple holes that penetrate its thickness. The size of the holes satisfies the following conditions: when the thermal conductive film (32) is not in contact with the device to be cooled, the thermally conductive material in the cavity is confined within the cavity; when the thermal conductive film (32) is in contact with the device to be cooled, the thermally conductive material in the cavity flows out from the holes to fill the space between the thermal conductive film (32) and the device to be cooled.

10. The radiator according to claim 9, characterized in that, Multiple thermal conductive films (32) are fixed on the same surface of the heat dissipation base plate (31); The multiple thermal conductive films (32) on the same surface of the heat dissipation base plate (31) are respectively used to contact multiple heat dissipation devices arranged on the same layer.

11. The radiator according to claim 9, characterized in that, At least one of the heat-conducting films (32) is fixed on the first surface of the heat dissipation base plate (31), and at least one of the heat-conducting films (32) is fixed on the second surface of the heat dissipation base plate (31), wherein the first surface and the second surface of the heat dissipation base plate (31) are positioned opposite each other; The heat dissipation base plate (31) is used to be arranged between the first layer of heat dissipation device and the second layer of heat dissipation device. The heat-conducting film (32) fixed on the first surface of the heat dissipation base plate (31) is used to contact the first layer of heat dissipation device. The heat-conducting film (32) fixed on the second surface of the heat dissipation base plate (31) is used to contact the second layer of heat dissipation device.

12. The radiator according to any one of claims 9 to 11, characterized in that, The device to be cooled is an optical module. The heat dissipation base plate (31) is used to fix the outer surface of the top wall or the outer surface of the bottom wall of the optical cage. The heat-conducting film (32) fixed on the surface of the heat dissipation base plate (31) is used to extend into the optical cage to contact the optical module inserted into the optical cage.

13. A communication device, characterized in that, The communication device includes the optical cage assembly as described in any one of claims 1 to 8, and / or the heat sink as described in any one of claims 9 to 12.

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