Liquid-cooling device, board, network apparatus and liquid-cooling system

Abstract

A liquid-cooling device, a board, a network apparatus and a liquid-cooling system, which relate to the technical field of liquid-cooling heat dissipation. The liquid-cooling device comprises a liquid-cooling bottom plate and a liquid-cooling cover plate (12), wherein a first surface of the liquid-cooling bottom plate is provided with a plurality of flow channels, and the liquid-cooling cover plate (12) is fixed to the first surface of the liquid-cooling bottom plate and covers the plurality of flow channels; the plurality of flow channels are configured to allow a coolant between the liquid-cooling bottom plate and the liquid-cooling cover plate (12) to flow; and a second surface of the liquid-cooling bottom plate facing away from the flow channels is configured to be in contact with a chip. The liquid-cooling device comprises a first liquid-blocking structure (31) and a second liquid-blocking structure (32), which are configured to block the coolant from flowing onto a circuit board where the chip is located, thereby protecting the circuit board.

Description

Liquid cooling units, circuit boards, network equipment, and liquid cooling systems

[0001] This disclosure claims priority to Chinese Patent Application No. 202510129092.1, filed on January 27, 2025, entitled "Liquid Cooling Device, Circuit Board, Network Equipment and Liquid Cooling System", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of liquid cooling technology, and in particular to a liquid cooling device, circuit board, network device and liquid cooling system. Background Technology

[0003] With the rapid development of intelligent computing, the computing power of chips has increased dramatically, and the corresponding heat dissipation requirements are getting higher and higher. Air cooling is difficult to meet the high heat dissipation requirements, and the demand for liquid cooling with stronger heat dissipation capabilities is gradually increasing.

[0004] In liquid cooling, the heat sink is placed in the network device and fixed together with the chip. The heat sink is filled with coolant, which carries away the heat from the chip as it circulates.

[0005] After prolonged use, the coolant inside the heat sink may leak from the connection between the liquid cooling base plate and the liquid cooling cover plate. The leaked coolant will flow onto the circuit board where the chip is located, causing a short circuit fault on the circuit board. Summary of the Invention

[0006] This disclosure provides a liquid cooling device, board, network device, and liquid cooling system capable of preventing leaked liquid from flowing into the circuit board where the chip is located.

[0007] In a first aspect, this disclosure provides a liquid cooling device, which includes a liquid cooling base plate and a liquid cooling cover plate;

[0008] The first surface of the liquid-cooled base plate has multiple flow channels, and the liquid-cooled cover plate is fixed to the first surface of the liquid-cooled base plate and covers the multiple flow channels;

[0009] The plurality of flow channels are used to allow coolant to flow between the liquid-cooled base plate and the liquid-cooled cover plate, and the second surface of the liquid-cooled base plate opposite to the flow channels is used to contact the chip;

[0010] The liquid cooling device also includes a liquid-blocking structure, which is used to prevent the coolant from flowing onto the circuit board where the chip is located.

[0011] In the solution disclosed herein, the liquid cooling device for chip heat dissipation includes a liquid-blocking structure. In the event of leakage at the connection between the liquid cooling base plate and the liquid cooling cover plate, the liquid-blocking structure can prevent the leaked liquid from flowing onto the circuit board fixed to the liquid cooling base plate, thereby protecting the circuit board.

[0012] In one possible implementation, the liquid cooling device further includes a liquid storage tray, in which the liquid cooling base plate is located.

[0013] In the solution disclosed herein, if liquid leakage occurs at the connection between the liquid-cooled base plate and the liquid-cooled cover plate, the leaked liquid flows onto the liquid storage pan, preventing the liquid from flowing further onto the circuit board.

[0014] In one possible implementation, the liquid storage tray has a cutout for the second surface of the liquid cooling base plate opposite to the flow channel to contact the chip;

[0015] The liquid-blocking structure includes a first liquid-blocking structure, which is located between the liquid storage pan and the liquid-cooled base plate, within the area enclosed by the outer edge of the liquid-cooled base plate, and surrounds the hollow.

[0016] In the solution disclosed herein, the first liquid-blocking structure surrounds the perforation on the liquid storage tray, ensuring that the liquid flowing onto the liquid storage tray flows from the perforation onto the circuit board.

[0017] In one possible implementation, the liquid-cooled base plate has a plurality of mounting holes that penetrate the thickness, the plurality of mounting holes being used to fix the liquid-cooled base plate and the circuit board;

[0018] The liquid storage tray also has multiple through holes that penetrate the thickness, and the multiple through holes and the multiple mounting holes are positioned opposite each other.

[0019] The first liquid-blocking structure surrounds the hollow and the plurality of through holes.

[0020] In the solution disclosed herein, since the via also penetrates the thickness of the liquid storage tray, the first liquid-blocking structure also surrounds the via, thereby preventing leaked liquid from flowing onto the circuit board through the via.

[0021] In one possible implementation, the first liquid-blocking structure is a sealing ring, or the first liquid-blocking structure is a protrusion structure disposed on the surface of the liquid storage tray and protruding relative to the surface.

[0022] In one possible implementation, the first liquid-blocking structure is a sealing ring, and a sealing groove is provided on the surface of the liquid storage pan facing the liquid-cooled base plate; or, a sealing groove is provided on the surface of the liquid-cooled base plate facing the liquid storage pan, and the sealing ring is located in the sealing groove.

[0023] In the solution disclosed herein, the height of the sealing ring is greater than the depth of the sealing groove. Therefore, the sealing ring is located within the sealing groove and extends beyond its opening; for example, the height of the sealing ring extending beyond the opening of the sealing groove is greater than or equal to 7 mm. In this way, liquid flowing onto the reservoir is prevented from continuing to flow into the perforations and through-holes by the sealing ring, thus preventing liquid from flowing onto the circuit board through the perforations and through-holes.

[0024] In one possible implementation, the first liquid-blocking structure is a raised structure, and the surface of the liquid-cooled base plate facing the liquid storage pan has a groove, in which the raised structure is located.

[0025] In the solution disclosed herein, the height of the first liquid-blocking structure protruding from the surface of the liquid storage tray is greater than or equal to 7 mm. Therefore, the liquid flowing onto the liquid storage tray cannot continue to flow into the cutouts and vias due to the obstruction of the first liquid-blocking structure, thereby preventing the liquid from flowing onto the circuit board through the cutouts and vias.

[0026] In one possible implementation, the liquid-blocking structure further includes a second liquid-blocking structure located on the surface of the liquid storage pan facing the liquid-cooled base plate and surrounding the liquid-cooled base plate.

[0027] In the solution disclosed herein, the second liquid-blocking structure can prevent liquid on the liquid reservoir from flowing from the outer edge of the liquid reservoir onto the circuit board.

[0028] In one possible implementation, the second liquid-blocking structure is a protrusion located at the outer edge of the liquid reservoir and protruding relative to the surface of the liquid reservoir.

[0029] In the solution disclosed herein, the second liquid-blocking structure is a raised structure that acts as a wall around the liquid storage pan, effectively preventing liquid on the liquid storage pan from leaking from the outer edge of the liquid storage pan onto the circuit board.

[0030] In one possible implementation, the liquid cooling device further includes a liquid supply pipe and a liquid return pipe, and the liquid cooling cover plate includes a liquid inlet pipe and a liquid outlet pipe, wherein the liquid inlet pipe is connected to the liquid supply pipe and the liquid outlet pipe is connected to the liquid return pipe;

[0031] The liquid supply pipe, the liquid return pipe, the liquid inlet pipe, and the liquid outlet pipe are all located in the liquid storage pan.

[0032] In the solution disclosed herein, both the liquid supply pipe and the liquid return pipe are located on the liquid storage pan. Therefore, the connection between the liquid supply pipe and the liquid inlet pipe on the liquid cooling cover, as well as the connection between the liquid return pipe and the liquid outlet pipe on the liquid cooling cover, are all on the liquid storage pan. Thus, if a leak occurs at these connections, the leaked liquid will fall onto the liquid storage pan, thereby preventing the leaked liquid from flowing onto the circuit board.

[0033] In one possible implementation, the liquid-cooled base plate has a plurality of mounting holes that penetrate the thickness, the plurality of mounting holes being used to fix the liquid-cooled base plate and the circuit board;

[0034] On the surface of the liquid-cooled base plate facing the liquid-cooled cover plate, there is a liquid-retaining ring at the position corresponding to each mounting hole, which surrounds the mounting hole and protrudes relative to the surface of the liquid-cooled base plate.

[0035] In the solution disclosed herein, the mounting hole penetrating the liquid-cooled base plate is surrounded by a liquid-retaining ring. Therefore, although the leaked liquid accumulates on the liquid-cooled base plate, it will not flow into the mounting hole due to the obstruction of the liquid-retaining ring, and thus will not flow onto the circuit board through the mounting hole.

[0036] In one possible implementation, the liquid storage tray has a first drain outlet outside the area enclosed by the first liquid-blocking structure.

[0037] In the solution disclosed herein, the liquid accumulated on the storage pan is discharged outward through the first drain port. For example, the first drain port is connected to the drain port in the network device. In this way, the liquid accumulated on the storage pan can be discharged into the drain port of the network device through the first drain port without affecting other devices on the network device.

[0038] In one possible implementation, the surface of the liquid storage tray facing the liquid-cooled base plate has a slope, and the first drain outlet is located at the bottom of the slope of the liquid storage tray.

[0039] In the scheme shown in this disclosure, the first drain outlet is located at the bottom of the slope, making it easier to drain the liquid accumulated on the storage pan.

[0040] In one possible implementation, a liquid-absorbing plate is arranged in the liquid storage tray to absorb the liquid in the liquid storage tray.

[0041] In the solution disclosed herein, the liquid absorber can promptly remove the liquid from the storage tray, preventing excessive liquid accumulation on the tray.

[0042] In one possible implementation, an overflow rope is arranged on the liquid storage tray. The overflow rope is used to send an overflow signal to the controller of the network device where the liquid cooling device is located when liquid is detected in the liquid storage tray. The overflow signal is used to instruct the controller to control the overflow reminder device to provide an overflow reminder.

[0043] In the solution disclosed herein, an overflow rope is arranged on the liquid storage pan, which can detect liquid leakage in a timely manner and prevent the leakage of liquid from continuing.

[0044] In one possible implementation, the liquid-blocking structure is a structure disposed on the surface of the liquid-cooled base plate facing the liquid-cooled cover plate and protruding relative to the surface, and the liquid-blocking structure surrounds the fixed connection between the liquid-cooled base plate and the liquid-cooled cover plate.

[0045] In the solution disclosed herein, the liquid-blocking structure is directly installed on the liquid-cooled base plate, surrounding the connection between the liquid-cooled base plate and the liquid-cooled cover plate, so that liquid leaking at the connection between the liquid-cooled base plate and the liquid-cooled cover plate will not flow onto the circuit board through the outer edge of the liquid-cooled base plate.

[0046] In one possible implementation, the liquid-cooled base plate has a plurality of mounting holes that penetrate the thickness, the plurality of mounting holes being used to fix the liquid-cooled base plate and the circuit board;

[0047] Multiple mounting holes are located outside the area enclosed by the liquid-blocking structure.

[0048] In the solution disclosed herein, the mounting holes on the liquid cooling base plate are located outside the area enclosed by the liquid-blocking structure, so that liquid leaking from the connection between the liquid cooling base plate and the liquid cooling cover plate will not flow onto the circuit board through the mounting holes on the liquid cooling base plate.

[0049] In one possible implementation, the liquid-cooled base plate has a second drain port that communicates with the area enclosed by the liquid-blocking structure.

[0050] In the solution disclosed herein, the liquid-cooled base plate has a second drain port, which can promptly discharge the liquid accumulated in the area enclosed by the liquid-blocking structure.

[0051] In one possible implementation, the sidewall of the liquid-cooled base plate has a liquid supply port and a liquid return port, and the interior of the liquid-cooled base plate has a channel connecting the liquid supply port and the flow channel, as well as a channel connecting the liquid return port and the flow channel.

[0052] In the scheme disclosed herein, the channels connecting the liquid supply port and the flow channel, as well as the channels connecting the liquid return port and the flow channel, are located inside the liquid-cooled base plate. This type of liquid-cooled block is called an embedded liquid-cooled block. This type of liquid-cooled block only has the possibility of leakage at the connection between the liquid-cooled base plate and the liquid-cooled cover plate. Therefore, the liquid-blocking structure only needs to surround the connection between the liquid-cooled base plate and the liquid-cooled cover plate.

[0053] In a second aspect, a board is provided, the board comprising a circuit board, a chip, and a liquid cooling device as described in the first aspect or any one of the first aspects;

[0054] The chip is fixed on the circuit board, and the liquid cooling base plate of the liquid cooling device is located on the surface of the chip facing away from the circuit board, and the liquid cooling base plate is fixed to the circuit board.

[0055] Thirdly, a network device is provided, the network device including a cabinet and the board described in the second aspect, the board being located in the cabinet.

[0056] Fourthly, a liquid cooling system is provided, the liquid cooling system including a cooling device, a cooling capacity distribution device and the network device described in the third aspect, wherein the primary side of the cooling capacity distribution device is connected to the cooling device via a pipeline, and the secondary side of the cooling capacity distribution device is connected to the network device via a pipeline.

[0057] Fifthly, a liquid storage tray is provided, which is applied to a circuit board having a liquid cooling block, the liquid storage tray being arranged on the circuit board of the circuit board, and the liquid cooling base plate of the liquid cooling block being arranged in the liquid storage tray.

[0058] In the solution disclosed herein, the liquid reservoir can be a heat-conducting disc-shaped structure or plate-shaped structure laid on the circuit board. Some components on the circuit board, such as chips, capacitors, resistors, and inductors, are located below the liquid reservoir. The aforementioned liquid cooling block is arranged on the liquid reservoir. The liquid reservoir is used to isolate the liquid cooling block from the components on the circuit board to prevent the leaked liquid from flowing onto the circuit board when the liquid cooling block leaks, causing a short circuit between the components on the circuit board and resulting in board burnout.

[0059] In one possible implementation, the liquid reservoir has a cutout for the liquid-cooled base plate to contact the chips on the circuit board.

[0060] In the solution disclosed herein, the liquid storage tray has a cutout at the location of the corresponding chip to accelerate the heat transfer between the liquid cooling base plate and the chip.

[0061] In one possible implementation, a first liquid-blocking structure is arranged on the liquid storage tray, the first liquid-blocking structure surrounds the hollow, and the orthographic projection of the first liquid-blocking structure on the liquid-cooled base plate falls on the area enclosed by the outer edge of the liquid-cooled base plate.

[0062] In the solution disclosed herein, the first liquid-blocking structure is used to block the liquid accumulated on the liquid storage pan from flowing from the cutout onto the circuit board.

[0063] In one possible implementation, the liquid storage tray also has a plurality of through holes of the thickness, and the plurality of through holes and the plurality of mounting holes of the thickness of the liquid cooling base plate are positioned opposite each other.

[0064] The first liquid-blocking structure surrounds the hollow and the plurality of through holes.

[0065] In the solution disclosed herein, the first liquid-blocking structure is used to block liquid accumulating on the liquid storage tray from flowing onto the circuit board through the cutout or through-hole.

[0066] In one possible implementation, the first liquid-blocking structure is a sealing ring, or the first liquid-blocking structure is a protrusion structure disposed on the surface of the liquid storage tray and protruding relative to the surface.

[0067] In one possible implementation, the first liquid-blocking structure is a sealing ring, and a sealing groove is provided on the surface of the liquid storage tray, with the sealing ring located in the sealing groove.

[0068] In the scheme shown in this disclosure, after the liquid cooling base plate is placed on the liquid storage pan, the sealing ring between the liquid cooling base plate and the liquid storage pan is in a compressed state, and the thickness of the sealing ring in the compressed state is greater than the depth of the sealing groove.

[0069] In one possible implementation, the first liquid-blocking structure is a protruding structure, which is used to extend into a groove on the surface of the liquid-cooled base plate facing the liquid storage pan.

[0070] In one possible implementation, the liquid storage tray has a first drain outlet outside the area enclosed by the first liquid-blocking structure.

[0071] In the scheme shown in this disclosure, the liquid accumulated on the storage pan is discharged through the first drain port, such as into the drain port of the network device.

[0072] In one possible implementation, the surface of the liquid storage tray facing the liquid-cooled base plate has a slope, and the first drain outlet is located at the bottom of the slope of the liquid storage tray.

[0073] In the scheme shown in this disclosure, the first drain outlet is located at the bottom of the slope of the liquid storage pan, which is more conducive to draining the liquid on the liquid storage pan.

[0074] In one possible implementation, the surface of the liquid reservoir has a second liquid-blocking structure for surrounding a liquid-cooled base plate located on the liquid reservoir.

[0075] In the solution disclosed herein, the second liquid-blocking structure is used to block the liquid accumulated on the liquid reservoir from flowing from the outer edge of the liquid reservoir to the circuit board below.

[0076] In one possible implementation, the second liquid-blocking structure is a protrusion located at the outer edge of the liquid reservoir and protruding relative to the surface of the liquid reservoir.

[0077] In one possible implementation, the liquid storage tray is arranged on the circuit board of the board, and the liquid cooling block of the board, the liquid inlet pipe and the liquid outlet pipe of the liquid cooling block, the liquid supply pipe connected to the liquid inlet pipe, and the liquid return pipe connected to the liquid outlet pipe are all arranged in the liquid storage tray.

[0078] In the solution disclosed herein, when a leak occurs at the connection between the liquid-cooled base plate and the liquid-cooled cover plate, the leaked liquid is caught by the liquid reservoir. Similarly, when a leak occurs at the connection between the inlet pipe and the supply pipe, the leaked liquid is also caught by the liquid reservoir. This arrangement ensures that in the event of a leak at any connection, the leaked liquid flows onto the liquid reservoir instead of onto the circuit board, thus protecting the circuit board.

[0079] In one possible implementation, a liquid-absorbing plate is arranged in the liquid storage tray to absorb the liquid in the liquid storage tray.

[0080] In the scheme disclosed herein, a liquid-absorbing plate is arranged on the liquid storage tray, which can promptly absorb the liquid accumulated on the liquid storage tray. Attached Figure Description

[0081] Figure 1 is a schematic diagram of a liquid cooling system provided in an exemplary embodiment of this disclosure;

[0082] Figure 2 is a schematic diagram of the structure of a liquid coolant block provided in an exemplary embodiment of this disclosure;

[0083] Figure 3 is a schematic diagram of the disassembly of a liquid cooling block provided in an exemplary embodiment of this disclosure;

[0084] Figure 4 is a schematic diagram of the cross-section of the liquid coolant block along section AA in Figure 2;

[0085] Figure 5 is a schematic diagram of the structure of a liquid cooling device provided in an exemplary embodiment of the present disclosure;

[0086] Figure 6 is a schematic cross-sectional view of the liquid cooling device cut along AA in Figure 5;

[0087] Figure 7 is a schematic diagram of the liquid storage tray shown in Figures 5 and 6;

[0088] Figure 8 is a schematic diagram of the structure of a liquid cooling device provided in another exemplary embodiment of the present disclosure;

[0089] Figure 9 is a schematic diagram of the liquid cooling device taken along AA and BB in Figure 8;

[0090] Figure 10 is a schematic diagram of the liquid storage tray shown in Figures 8 and 9;

[0091] Figure 11 is a schematic diagram of the disassembly of a liquid coolant block provided in another exemplary embodiment of this disclosure;

[0092] Figure 12 is a schematic diagram of the structure of a liquid coolant block provided in another exemplary embodiment of the present disclosure;

[0093] Figure 13 is a schematic diagram of the structure of a liquid coolant block provided in another exemplary embodiment of the present disclosure;

[0094] Figure 14 is a schematic diagram of the architecture of a cabinet or chassis-type network device provided in an exemplary embodiment of this disclosure;

[0095] Figure 15 is a logical schematic diagram of a network device provided in an exemplary embodiment of this disclosure.

[0096] Figure Labeling Explanation: 100. Network equipment; 200. Cooling distribution equipment; 300. Cooling equipment. 1. Liquid cooling block; 11. Liquid cooling base plate; 12. Liquid cooling cover plate; 13. Cover plate. 111. Boss; 112. Mounting hole; 113. Liquid baffle ring; 114. Notch; 115. Liquid supply port; 116. Liquid return port; 117. Second drain port; 118. Settling tank. 121. Liquid inlet pipe; 122. Liquid outlet pipe. 2. Liquid storage tray; 21. Hollowed-out; 22. Through hole; 23. First drain port. 31. First liquid baffle structure; 32. Second liquid baffle structure; 33. Third liquid baffle structure. 4. Liquid supply pipe; 5. Liquid return pipe. Detailed Implementation

[0097] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0098] This embodiment relates to liquid cooling heat dissipation. As shown in Figure 1, it is a schematic diagram of the principle of liquid cooling heat dissipation. Referring to Figure 1, the liquid cooling system includes a cooling distribution device 200, a cooling device 300, and a network device 100. The cooling device 300 is generally arranged outdoors, while the cooling distribution device 200 and the network device 100 are arranged indoors, such as in a data center or energy storage cabinet. The cooling distribution device is also called a cooling distribution unit (CDU).

[0099] Referring to Figure 1, one side of the cooling capacity distribution device 200 is connected to the cooling device 300 via two pipelines. One pipeline is used to supply low-temperature coolant from the cooling device 300 to the cooling capacity distribution device 200; this pipeline is denoted as the primary-side supply pipeline. The other pipeline is used to supply high-temperature coolant from the cooling capacity distribution device 200 to the cooling device 300; this pipeline is denoted as the primary-side return pipeline. The circulation pipeline formed by the cooling capacity distribution device 200 and the cooling device 300 is generally referred to as the primary-side pipeline, primary-side circulation pipeline, or primary-side circulation.

[0100] Referring again to Figure 1, the other side of the cooling distribution device 200 is also connected to the network device 100 via two pipelines. One pipeline is used to supply low-temperature coolant from the cooling distribution device 200 to the network device 100; this pipeline is denoted as the secondary-side supply pipeline. The other pipeline is used to supply high-temperature coolant from the network device 100 to the cooling distribution device 200; this pipeline is denoted as the secondary-side return pipeline. The circulation pipeline formed by the cooling distribution device 200 and the network device 100 is generally referred to as the secondary-side pipeline, secondary-side circulation pipeline, or secondary-side circulation.

[0101] Referring to Figure 1, the coolant flowing in the primary circulation pipe (generally referred to as primary coolant) and the coolant flowing in the secondary circulation pipe (generally referred to as secondary coolant) exchange heat within the cooling capacity distribution device 200. Therefore, the primary low-temperature coolant becomes the primary high-temperature coolant after flowing through the cooling capacity distribution device 200, and the secondary high-temperature coolant becomes the secondary low-temperature coolant after flowing through the cooling capacity distribution device 200. The secondary low-temperature coolant is then transported to the network device 100 to dissipate heat for the network device 100.

[0102] Specifically, network device 100 can be a chassis-type device or a box-type device, such as a chassis router or chassis switch, or a box router or box switch. Network device 100 can also be a server, etc. This embodiment does not limit the specific type of network device 100.

[0103] Network device 100 includes a liquid cooling block, also known as a cold plate or water-cooled block. The aforementioned cooling distribution device 200 is connected to network device 100 via two pipelines, forming a secondary circulation pipeline. That is, the cooling distribution device 200 and the liquid cooling block of network device 100 are connected via two pipelines, forming a secondary circulation pipeline. The liquid cooling block comes into contact with components of network device 100 that generate significant heat. For example, if network device 100 includes a chip, and the liquid cooling block contacts the chip, the coolant flowing within the liquid cooling block absorbs the heat from the chip, achieving the purpose of heat dissipation. Similarly, if network device 100 has an optical port connected to an optical module, or if network device 100 includes an optical module, and the liquid cooling block contacts the optical module, the coolant flowing within the liquid cooling block absorbs the heat from the optical module, achieving the purpose of heat dissipation. In this context, the liquid cooling block's function of dissipating heat from the optical module can also be understood as the liquid cooling block dissipating heat from the driver chip within the optical module.

[0104] To improve the heat dissipation effect of liquid coolers, many flow channels are usually set inside the liquid cooler. The coolant flowing into the liquid cooler flows in these channels and carries away the heat absorbed by the liquid cooler. In this way, the flow channels increase the contact area between the coolant and the liquid cooler.

[0105] In order to process flow channels inside the liquid cooling block, the liquid cooling block typically includes a liquid cooling base plate and a liquid cooling cover plate in terms of structure. A large number of flow channels are set on the surface of the liquid cooling base plate, and the liquid cooling cover plate is then fixed to the liquid cooling base plate and covers the flow channels on the liquid cooling base plate. Thus, a chamber for the flow of coolant is formed between the liquid cooling base plate and the liquid cooling cover plate, and the flow channels on the liquid cooling base plate are located in this chamber.

[0106] Since the liquid cooling block consists of a separate liquid cooling base plate and a liquid cooling cover plate, there is a risk that the internal coolant will leak from the connection between the liquid cooling base plate and the liquid cooling cover plate after long-term use.

[0107] For example, after the liquid cooling base plate and liquid cooling cover plate are welded together, cracks may easily develop at the weld joint over a long period of time, or there may be poor soldering at the weld joint. These factors can cause the coolant inside the liquid cooling block to leak out. Once the coolant inside the liquid cooling block leaks, it will flow onto the circuit board on which the liquid cooling block is located, causing a short circuit on the circuit board. In severe cases, it can cause the circuit board to burn out.

[0108] Therefore, this embodiment provides a liquid cooling device, which includes a liquid-blocking structure. The liquid-blocking structure can prevent coolant leaking from inside the liquid cooling block from flowing onto the circuit board where the liquid cooling block is located, thereby protecting the circuit board.

[0109] In one example, the liquid-blocking structure can be disposed on the liquid-cooled block; in another example, the liquid-cooling device further includes a liquid storage tray, with the liquid-cooled block located in the liquid storage tray and the liquid-blocking structure arranged between the liquid storage tray and the liquid-cooled block, or the liquid-blocking structure is disposed on the liquid storage tray. The features of the liquid-blocking structure will be described below for liquid-cooling devices including and excluding a liquid storage tray. Before describing the features of the liquid-blocking structure, the features of the liquid-cooled block will be described first.

[0110] Figure 2 shows a schematic diagram of the liquid cooling block of the liquid cooling device. Referring to Figure 2, the liquid cooling block 1 includes a liquid cooling base plate 11, which is also called a liquid cooling core or heat dissipation core. Multiple flow channels are provided on the first surface of the liquid cooling base plate 11. For example, a large number of fins, also called spade teeth or fins, are provided on the first surface of the liquid cooling base plate 11. The spacing between two adjacent fins forms a flow channel for liquid flow.

[0111] Referring to Figure 2, the fins on the first surface of the liquid-cooled base plate 11 can be sunken fins. That is, the first surface of the liquid-cooled base plate 11 is provided with a sinking groove, and multiple fins are provided at the bottom of the sinking groove. These fins are lower than the surface where the opening of the sinking groove is located.

[0112] Referring to Figure 2, the liquid cooling block 1 also includes a liquid cooling cover plate 12. The area of ​​the liquid cooling cover plate 12 is smaller than the area of ​​the liquid cooling base plate 11. The liquid cooling cover plate 12 is fixed on the first surface of the liquid cooling base plate 11 and covers multiple flow channels on the liquid cooling base plate 11. A chamber for containing liquid is formed between the liquid cooling base plate 11 and the liquid cooling cover plate 12.

[0113] Regarding the fixing of the liquid-cooled base plate 11 and the liquid-cooled cover plate 12: Figures 3 and 4 show cross-sectional schematic diagrams of the liquid-cooled block 1. Referring to Figure 4, the liquid-cooled base plate 11 and the liquid-cooled cover plate 12 are welded on both sides. Referring to Figure 3, the weld joint between the liquid-cooled base plate 11 and the liquid-cooled cover plate 12 is stepped, each including two welding surfaces a. One welding surface a of the liquid-cooled base plate 11 is welded to one welding surface a of the liquid-cooled cover plate 12, and the other welding surface a of the liquid-cooled base plate 11 is welded to the other welding surface a of the liquid-cooled cover plate 12. Through double-sided welding, the reliability of the connection between the liquid-cooled base plate 11 and the liquid-cooled cover plate 12 is improved.

[0114] Referring again to Figure 4, the side wall of the liquid-cooled cover plate 12 has an inlet pipe 121 and an outlet pipe 122. The inlet pipe 121 is connected to the liquid supply pipe of the liquid cooling device, and the outlet pipe 122 is connected to the return pipe of the liquid cooling device. The coolant enters the interior of the liquid-cooled block 1 through the inlet pipe 121, flows in the flow channel, and is then discharged through the outlet pipe 122. The coolant carries away heat as it flows within the liquid-cooled block 1.

[0115] The heat from the liquid cooling block 1 comes from the heat-generating chip. Therefore, the second surface of the liquid cooling base plate 11, facing away from the flow channel, is used to contact the chip to absorb its heat. For example, in one embodiment, the second surface of the liquid cooling base plate 11 directly contacts the chip; in another embodiment, a thermal pad is placed between the second surface of the liquid cooling base plate 11 and the chip. The thermal pad absorbs the heat between the liquid cooling base plate 11 and the chip, and also transfers the heat from the chip to the liquid cooling base plate 11.

[0116] In some designs, to enable better contact between the liquid cooling base plate 11 and the chip, the second surface of the liquid cooling base plate 11 opposite to the flow channel has a protrusion 111 (see Figure 6), which is used to contact the chip (e.g., direct contact or indirect contact through a thermal pad).

[0117] In the application, the chip is fixed on the circuit board, and the liquid cooling block 1 covers the chip and is also fixed on the circuit board. However, after prolonged use, if cracks appear at the connection between the liquid cooling base plate 11 and the liquid cooling cover plate 12, the coolant inside the liquid cooling block 1 will seep out from the connection, flowing onto the first surface of the liquid cooling base plate 11, and then from the edge of the liquid cooling base plate 11 onto the circuit board. This can easily cause short circuits in the circuit board's wiring, potentially leading to the circuit board burning out.

[0118] Therefore, the liquid cooling device in this embodiment also includes a liquid-blocking structure, which blocks the seeping coolant from flowing onto the circuit board where the liquid cooling block is located.

[0119] Figures 5 and 6 show a schematic diagram of a liquid cooling device, wherein Figure 6 is a cross-sectional view taken along AA in Figure 5. Figure 7 shows a schematic diagram of the liquid storage tray in Figures 5 and 6. Figures 8 and 9 show a schematic diagram of another liquid cooling device, wherein Figure 9 is a cross-sectional view taken along AA and BB in Figure 8. Figure 10 shows a schematic diagram of the liquid storage tray in Figures 8 and 9.

[0120] Referring to Figure 5, the liquid cooling device includes a liquid storage pan 2 and at least one liquid cooling block 1. The liquid cooling block 1 is located within the liquid storage pan 2, also known as a drip tray or liquid receiving pan. Because the liquid cooling block 1 is located within the liquid storage pan 2, the coolant seeping from the liquid cooling block 1 flows to the first surface of the liquid cooling base plate 11 and falls onto the liquid storage pan 2 from the edge of the liquid cooling base plate 11. Thus, the liquid storage pan 2 can collect the liquid overflowing from the liquid cooling block 1, preventing the overflowing liquid from further flowing onto the circuit board.

[0121] The liquid cooling block 1 is located in the liquid storage tray 2, and the liquid cooling block 1 also needs to contact the chip. Therefore, referring to Figure 7, the liquid storage tray 2 has cutouts 21 that penetrate through its thickness. The number of cutouts 21 is equal to the number of liquid cooling blocks 1. For example, referring to Figure 5, if the liquid cooling device includes three liquid cooling blocks 1, then referring to Figure 7, the liquid storage tray 2 includes three cutouts 21. Or, for example, referring to Figure 8, if the liquid cooling device includes five liquid cooling blocks 1, then referring to Figure 10, the liquid storage tray 2 includes five cutout structures 21. These cutouts 21 allow the liquid cooling blocks 1 on the liquid storage tray 2 to pass through the cutouts 21 for heat transfer with the chip.

[0122] As described above, the surface of the liquid cooling base plate 11 facing away from the flow channel has a boss 111. Referring to Figures 6 and 7, the liquid cooling block 1 is located in the liquid storage tray 2, and the boss 111 of the liquid cooling base plate 11 is located in the cutout 21. For example, the boss 111 extends out of the cutout 21 to contact the chip.

[0123] The liquid-blocking structure specifically includes a first liquid-blocking structure 31, which is located between the liquid storage pan 2 and the liquid-cooled base plate 11. In the area enclosed by the outer edge of the liquid-cooled base plate 11, it also surrounds the hollow 21. The first liquid-blocking structure 31 is specifically used to block the liquid on the liquid storage pan 2 from flowing into the hollow 21.

[0124] As an example, referring to Figure 6, the first liquid-blocking structure 31 is specifically a sealing ring, sealing between the liquid-cooled base plate 11 and the liquid storage tray 2, and surrounding the perforation 21. Continuing to refer to Figures 6 and 7, the liquid storage tray 2 has a sealing groove on its surface facing the liquid-cooled base plate 11, the sealing ring is embedded in the sealing groove, and the height of the sealing ring is greater than the depth of the sealing groove. Alternatively, the sealing groove can also be provided on the surface of the liquid-cooled base plate 11; for example, the surface of the liquid-cooled base plate 11 facing the liquid storage tray 2 has a sealing groove, the sealing ring is embedded in the sealing groove, and the height of the sealing ring is greater than the depth of the sealing groove.

[0125] Referring to Figure 6, the coolant overflowing from the connection between the liquid-cooled base plate 11 and the liquid-cooled cover plate 12 first flows to the upper surface of the liquid-cooled base plate 11 opposite to the liquid reservoir 2. Then, it flows along the outer edge of the liquid-cooled base plate 11 to the surface of the liquid reservoir 2 and into the gap between the liquid-cooled base plate 11 and the liquid reservoir 2. However, it is stopped by the sealing ring and cannot continue flowing into the perforation 21. Therefore, the overflowing coolant will not enter the circuit board below the liquid reservoir 2 through the perforation 21.

[0126] In another example, referring to Figure 9, the first liquid-blocking structure 31 is specifically a ring-shaped protrusion structure disposed on the surface of the liquid storage pan 2 facing the liquid-cooled base plate 11 and protruding relative to the surface.

[0127] In the scheme where the first liquid-blocking structure 31 is an annular protrusion structure, the height of the first liquid-blocking structure 31 is greater than or equal to 7 mm.

[0128] Referring to Figure 9, in the scheme where the first liquid-blocking structure 31 is an annular protrusion structure, the surface of the liquid-cooled base plate 11 facing the liquid storage pan 2 has a groove, and the first liquid-blocking structure 31, as an annular protrusion structure, is located in the groove.

[0129] Referring again to Figure 9, the coolant overflowing from the connection between the liquid-cooled base plate 11 and the liquid-cooled cover plate 12 first flows to the upper surface of the liquid-cooled base plate 11 opposite to the liquid reservoir 2. Then, it flows along the outer edge of the liquid-cooled base plate 11 to the surface of the liquid reservoir 2 and into the gap between the liquid-cooled base plate 11 and the liquid reservoir 2. However, when it reaches the annular protrusion, it is blocked by the annular protrusion and cannot continue flowing into the perforation 21. Therefore, the overflowing coolant will not enter the circuit board below the liquid reservoir 2 through the perforation 21.

[0130] It should be noted that the first liquid-blocking structure 31, which is a ring-shaped protrusion structure, can be applied to floating liquid coolers. A floating liquid cooler is one that covers the chip and can float in a direction perpendicular to the chip to better absorb the air gap between the liquid cooler and the chip. Figure 8 shows a floating liquid cooler. In this design, even if the liquid cooler floats up and down, the first liquid-blocking structure 31, as a ring-shaped protrusion, can still prevent liquid from flowing into the cutout 21 and the via 22.

[0131] It should be noted that, whether the first liquid-blocking structure 31 is a sealing ring or an annular protrusion, since the first liquid-blocking structure 31 is used to prevent liquid from flowing into the perforation 21, the number of the first liquid-blocking structures 31 is equal to the number of perforations 21. Referring to Figure 7, the number of sealing grooves used to place the sealing ring is equal to the number of perforations 21; referring to Figure 10, the number of annular protrusions is equal to the number of perforations 21.

[0132] In one example, since the liquid cooling base plate 11 and the circuit board are fixed together, for example, by screws or bolts, the liquid cooling base plate 11 has a through-hole 112 as shown in FIG. 4, and the liquid reservoir 2 has a through-hole 22 at the corresponding position of the mounting hole as shown in FIG. 7. In this case, liquid flowing onto the liquid reservoir 2, once flowing into the through-hole 22, will also flow onto the circuit board below the liquid reservoir 2. For this reason, as shown in FIG. 7, the first liquid-blocking structure 31 also surrounds the through-hole 22 around the cutout 21.

[0133] For example, referring to Figure 7, six through holes 22 are arranged around a single hollow 21. Then, the first liquid-blocking structure 31 surrounds the hollow 21 and the six through holes 22, wherein the through holes 22 and the hollow 21 in Figure 7 are connected.

[0134] For example, referring to Figure 10, four through holes 22 are arranged around a single hollow 21. Then, the first liquid-blocking structure 31 surrounds the hollow 21 and the four through holes 22. In Figure 10, the through holes 22 and the hollow 21 are not connected.

[0135] As described above, the liquid-cooled base plate 11 has mounting holes 112 that penetrate its thickness. Therefore, referring to FIG. 4, liquid overflowing from the liquid-cooled block 1 will also flow into the mounting holes of the liquid-cooled base plate 11 and from there onto the circuit board below. To address this, referring to FIG. 4, at the location of each mounting hole, a liquid-blocking ring 113 is provided, surrounding the mounting hole 112 and protruding relative to the surface of the liquid-cooled base plate. The liquid-blocking ring 113 is used to prevent liquid on the surface of the liquid-cooled base plate 11 from flowing into the mounting hole 112. The height of the liquid-blocking ring 113 protruding relative to the surface of the liquid-cooled base plate 11 is greater than or equal to 7 mm.

[0136] In one example, liquid overflowing into the reservoir 2 is prevented from flowing onto the circuit board below through the cutouts 21 and through-holes 22 by the first liquid-blocking structure 31. However, it may flow onto the circuit board below from the outer edge of the reservoir 2. Therefore, the liquid-blocking structure also includes a second liquid-blocking structure 32, which is located on and surrounds the liquid-cooling base plate 11 on the surface of the reservoir 2 facing the liquid-cooling base plate 11. The second liquid-blocking structure 32 is used to prevent liquid overflowing into the reservoir 2 from flowing onto the circuit board from the outer edge of the reservoir 2.

[0137] Referring to Figures 7 and 10, the second liquid-blocking structure 32 is specifically a protruding structure disposed at the outer edge of the liquid storage tray 2 and protruding relative to the surface of the liquid storage tray 2. The second liquid-blocking structure 32 acts as a wall around the liquid storage tray 2, confining the liquid overflowing onto the liquid storage tray 2 within the area between the first liquid-blocking structure 31 and the second liquid-blocking structure 32.

[0138] The second liquid-blocking structure 32 protrudes above the surface of the liquid storage tray 2 by a height greater than or equal to 7 mm. In one example, the height of the second liquid-blocking structure 32 may be equal or unequal at different locations, but it must be greater than or equal to 7 mm. For example, in some locations, where connection to external pipelines is required (i.e., pipelines from outside the liquid storage tray 2 need to be led to the liquid storage tray 2), the height of the second liquid-blocking structure 32 will be lower, but it will still be greater than or equal to 7 mm.

[0139] In one example, there are several ways to discharge the liquid that accumulates between the first liquid-blocking structure 31 and the second liquid-blocking structure 32. For example, as shown in FIG7, the liquid storage tray 2 has a drain port (denoted as the first drain port 23) in the area between the first liquid-blocking structure 31 and the second liquid-blocking structure 32. Then, the liquid that accumulates between the first liquid-blocking structure 31 and the second liquid-blocking structure 32 is discharged outward through the first drain port 23.

[0140] In one example, the surface of the liquid storage tray 2 facing the liquid-cooled base plate 11 can have a certain slope. Then, the first drain port 23 can be set at the bottom of the slope of the liquid storage tray 2, which makes it easier to drain the liquid that falls on the liquid storage tray 2.

[0141] Another method for draining liquid from the reservoir 2 is to place an absorbent pad in the area between the first liquid-blocking structure 31 and the second liquid-blocking structure 32 on the reservoir 2. The absorbent pad is used to absorb the liquid in the reservoir. This method requires technicians to replace the absorbent pad periodically. The absorbent pad is made of a water-absorbing material; for example, the material can be one or more of activated carbon, cotton cloth, absorbent sponge, absorbent polymer, and absorbent paper towels.

[0142] It should be noted that even if no liquid suction plate is installed in the liquid storage pan 2 and no first drain port 23 is opened in the liquid storage pan 2, the liquid on the liquid storage pan 2 can still be discharged. This is because the temperature inside the network equipment is generally relatively high. Under high temperature, the liquid that overflows into the liquid storage pan 2 can be evaporated. Moreover, although the liquid cooling block 1 overflows outward, the leakage is not large. Therefore, the amount of liquid flowing into the liquid storage pan 2 is not large. At higher temperatures, this liquid is more easily evaporated.

[0143] In one example, leakage may occur not only at the connection between the liquid-cooled base plate 11 and the liquid-cooled cover plate 12, but also at the pipe connections. Therefore, referring to Figures 5 and 8, the liquid supply pipe 4 and the return pipe 5 of the liquid cooling device are both located in the liquid storage pan 2. The second liquid-blocking structure 32 surrounds the liquid supply pipe 4 and the return pipe 5. The liquid supply pipe 4 is used to supply low-temperature coolant to the liquid-cooled block 1, and the return pipe 5 is used to collect the high-temperature coolant output from the liquid-cooled block 1. Referring to Figures 5 and 8, the liquid supply pipe 4 is connected to the liquid inlet pipe 121 of the liquid-cooled block 1, and the return pipe 5 is connected to the liquid outlet pipe 122 of the liquid-cooled block 1.

[0144] For example, one end of the inlet pipe 121 is connected to the side of the liquid cooling cover plate 12 and communicates with the internal chamber containing the coolant. The other end of the inlet pipe 121 is connected to the supply pipe 4. Similarly, one end of the outlet pipe 122 is connected to the side of the liquid cooling cover plate 12 and communicates with the internal chamber. The other end of the outlet pipe 122 is connected to the return pipe 5.

[0145] As an example, the connection between the inlet pipe 121, the outlet pipe 122, and the liquid-cooled cover plate 12 can be integrally formed, or it can be welded. The connection between the inlet pipe 121 and the supply pipe 4 is generally welded, and the connection between the outlet pipe 122 and the return pipe 5 is also generally welded. However, welding can lead to liquid leakage.

[0146] Since both the supply pipe 4 and the return pipe 5 are located in the storage pan 2, even if there is a liquid leak at the connection between the inlet pipe 121 and the supply pipe 4 or at the connection between the outlet pipe 122 and the return pipe 5, the leaked liquid will fall into the storage pan 2 and will not easily flow into the circuit board below.

[0147] Furthermore, referring to Figures 4 and 5, the liquid-cooled base plate 11 has notches 114 at the connection between the liquid inlet pipe 121 and the liquid supply pipe 4, and at the connection between the liquid outlet pipe 122 and the liquid return pipe 5. In the event of leakage at the connection between the liquid inlet pipe 121 and the liquid supply pipe 4, or at the connection between the liquid outlet pipe 122 and the liquid return pipe 5, the overflowing liquid flows directly into the liquid storage pan 2. That is, the overflowing liquid is directly collected by the liquid storage pan 2 and then discharged through the first drain port 23 on the liquid storage pan 2.

[0148] In one example, the liquid reservoir 2 also has some through-thickness mounting holes. To prevent the liquid on the liquid reservoir 2 from flowing onto the circuit board below through these mounting holes, as shown in Figures 7 and 10, the liquid-blocking rings described above are also provided around the mounting holes on the liquid reservoir 2. The liquid-blocking rings surround the mounting holes and protrude relative to the surface of the liquid reservoir 2. The liquid-blocking rings can prevent the liquid on the liquid reservoir 2 from flowing into the mounting holes.

[0149] In one example, an overflow rope can also be placed on the liquid storage tray 2. The overflow rope is used to send an overflow signal to the controller when liquid is detected in the liquid storage tray 2. The overflow signal instructs the controller to activate the overflow alert device to issue an overflow warning. Specifically, the overflow alert device can be an alarm, the overflow warning can be a buzzer, the overflow alert can be a display screen on a network device, and the overflow warning can be a pop-up window on the display screen showing overflow information.

[0150] In one example, the overflow rope is connected to the controller of the network device. When there is no liquid in the reservoir 2, the overflow rope sends a low-level signal to the controller. Alternatively, there is no electrical connection between the overflow rope and the controller. When there is liquid in the reservoir 2, the overflow rope becomes a conductor, establishing an electrical connection with the controller, and can send a high-level signal to the controller. After receiving the overflow signal from the overflow rope, the controller controls the overflow reminder device of the network device to issue an overflow warning. Upon receiving the overflow information, the controller can also control the valve on the supply pipe 4 to close.

[0151] In one example, the overflow rope can be positioned at the lowest point of the storage pan 2, making it easier to detect the liquid. In another example, the overflow rope can also be positioned at the first drain outlet, which also makes it easier to detect the liquid.

[0152] In one example, overflow ropes can be arranged not only in the liquid storage pan 2, but also in locations prone to leakage, such as the connection between the liquid-cooled base plate 11 and the liquid-cooled cover plate 12. Another example is the connection between the liquid supply pipe 4 and the liquid inlet pipe 121 of the liquid-cooled block 1, and the connection between the return pipe 5 and the liquid outlet pipe 122 of the liquid-cooled block 1.

[0153] It should be noted that the overflow rope mentioned above is called an overflow rope because it is rope-shaped. In some examples, the overflow rope is also called a water immersion rope, a leak protection rope, or a leak detection rope, etc.

[0154] It should be noted that the liquid reservoir 2 may not have the cutout 21. However, the liquid reservoir 2 has good thermal conductivity, and even though it is separated from the chip on the circuit board and the liquid cooling base plate 11, it can still transfer the heat from the chip to the liquid cooling base plate 11. In the design where the liquid reservoir 2 does not have the cutout 21, the liquid overflowing onto the surface of the liquid cooling base plate 11 will not flow from the cutout 21 onto the circuit board. Therefore, there is no need to arrange the first liquid-blocking structure 31 between the liquid reservoir 2 and the liquid cooling base plate 11. Thus, the liquid-blocking structure mentioned above may include the second liquid-blocking structure 32, but not the first liquid-blocking structure 31.

[0155] The above describes the features of a liquid cooling device that includes a liquid storage tray. Below, we will introduce the features of another type of liquid cooling device that does not include a liquid storage tray.

[0156] Figures 11 and 12 show a schematic diagram of the structure of a liquid cooling block in another liquid cooling device. Referring to Figures 11 and 12, the liquid cooling device includes a liquid cooling block 1, but does not include a liquid storage pan 2. The liquid cooling block 1 also includes a liquid cooling base plate 11 and a liquid cooling cover plate 12, except that there is only one liquid cooling base plate 11, while there are multiple liquid cooling cover plates 12 (such as two). It can also be understood that multiple liquid cooling base plates 11 are integrated together.

[0157] As shown in Figure 11, the liquid cooling block is specifically a buried tube type liquid cooling block. Referring to Figure 11, the side wall of the liquid cooling base plate 11 has a liquid supply port 115 and a liquid return port 116. The interior of the liquid cooling base plate 11 has a channel connecting the liquid supply port 115 and the internal flow channel (the channel is shown by the dotted line in the figure), and a channel connecting the liquid return port 116 and the flow channel (the channel is shown by the dotted line in the figure). The liquid supply port 115 and the liquid return port 116 of the liquid cooling base plate 11 are used to connect with the cooling capacity distribution equipment to form a secondary side circulation pipeline. The cooling capacity distribution equipment delivers low-temperature coolant to the interior of the liquid cooling base plate 11 through the liquid supply port 115, and the high-temperature coolant inside the liquid cooling base plate 11 is delivered to the cooling capacity distribution equipment through the liquid return port 116.

[0158] Since the pipes connecting the internal flow channels of the liquid cooling block are all embedded inside the liquid cooling base plate 11, there is no possibility of liquid leakage in these pipes. Therefore, the only potential leakage point is the connection between the liquid cooling base plate 11 and the liquid cooling cover plate 12. The liquid-blocking structure can enclose this connection, preventing overflowing liquid from flowing through the outer edge of the liquid cooling base plate 11 onto the circuit board below. Therefore, referring to Figures 11 and 12, the liquid-blocking structure is specifically a structure that protrudes from the surface of the liquid cooling base plate 11 facing the liquid cooling cover plate 12. Furthermore, the liquid-blocking structure surrounds the connection between the liquid cooling base plate 11 and the liquid cooling cover plate, preventing liquid overflowing from this connection and flowing from the outer edge of the liquid cooling base plate 11 onto the circuit board below.

[0159] To distinguish it from the liquid-blocking structure described above, the liquid-blocking structure shown in Figures 11 and 12 can also be referred to as the third liquid-blocking structure 33. The third liquid-blocking structure 33 protrudes above the surface of the liquid-cooled base plate by a height greater than or equal to 7 mm.

[0160] In one example, there may be one third liquid-blocking structure 33, which completely surrounds the connection between the liquid-cooled base plate 11 and all the liquid-cooled cover plates 12. In another example, there may be multiple third liquid-blocking structures 33, which surround the connection between the liquid-cooled base plate 11 and multiple liquid-cooled cover plates 12. For example, one third liquid-blocking structure 33 surrounds the connection between the liquid-cooled base plate 11 and one liquid-cooled cover plate 12.

[0161] In one example, because the liquid-cooled base plate 11 has mounting holes that penetrate the thickness, liquid overflowing from the connection between the liquid-cooled base plate 11 and the liquid-cooled cover plate 12 will also flow from the mounting holes onto the circuit board below. Therefore, referring to FIG12, all mounting holes penetrating the liquid-cooled base plate 11 are located outside the area enclosed by the third liquid-blocking structure 33.

[0162] To drain the liquid accumulated within the third liquid-blocking structure 33, correspondingly, referring to Figure 12, the liquid-cooled base plate 11 has a drain port (denoted as the second drain port 117), which is connected to the area enclosed by the third liquid-blocking structure 33. For example, referring to Figure 12, the surface of the liquid-cooled base plate 11 has a sink 118 located within the area enclosed by the third liquid-blocking structure 33, and the side wall of the liquid-cooled base plate 11 has a second drain port 117 connected to the sink 118. Therefore, the liquid accumulated within the area enclosed by the third liquid-blocking structure 33 can flow into the sink 118, then through the sink 118 to the second drain port 117, and finally be discharged outwards from the second drain port 117.

[0163] In one example, if the liquid cooling block 1 shown in Figure 12 is arranged vertically in a network device, for example, the liquid cooling block 1 is applied to a switching board, which is generally vertically inserted into a cabinet, then, to prevent overflowing liquid from flowing out, as shown in Figure 13, a schematic diagram of the liquid cooling block structure, the liquid cooling block 1 also includes a cover plate 13. The cover plate 13 is fixed to the third liquid-blocking structure 33 and covers the area enclosed by the third liquid-blocking structure 33. Therefore, under the cover plate 13, even if the liquid cooling block 1 is arranged vertically in the network device, the liquid accumulated within the area enclosed by the third liquid-blocking structure 33 will only be discharged outwards from the second drain port.

[0164] It should be noted that the liquid cooling device shown in Figures 11 to 13 may also include the aforementioned liquid storage tray. In this case, the liquid cooling base plate is located in the liquid storage tray, and the liquid overflowing from the liquid cooling base plate can flow into the liquid storage tray and be discharged outward through the first drain port on the liquid storage tray. For details, please refer to the above description, which will not be repeated here.

[0165] In this embodiment of the disclosure, the liquid cooling device for chip heat dissipation includes a liquid-blocking structure. In the event of leakage at the connection between the liquid cooling base plate and the liquid cooling cover plate, the liquid-blocking structure can block the leaked liquid from flowing onto the circuit board fixed to the liquid cooling base plate, thereby protecting the circuit board.

[0166] This embodiment also provides a board, which includes a circuit board, a chip, and the liquid cooling device described above. The chip is fixed on the circuit board, and the liquid cooling base plate of the liquid cooling device is located on the surface of the chip facing away from the circuit board, and the liquid cooling base plate is also fixed to the circuit board.

[0167] In this context, a board, also known as a circuit board, can refer to a board within a chassis-type or box-type network device, such as a service board, switching board, or control board. A board can also be a board within a server in a data center.

[0168] This embodiment also provides a network device, which includes the aforementioned board. Specifically, the network device can be a chassis-type network device or a box-type network device. The chassis-type network device can specifically be a chassis router or a chassis switch, and the box-type network device can specifically be a box router or a box switch. Furthermore, because the heat dissipation of this network device includes liquid cooling, in some examples, the network device is also referred to as a liquid-cooled cabinet device, liquid-cooled equipment, or liquid-cooled cabinet, etc.

[0169] Figure 14 shows a schematic diagram of the architecture of a cabinet-type or chassis-type network device, and Figure 15 shows a logical schematic diagram of network device 100. Referring to Figures 14 and 15, the network device includes a main control board 110, a switching board 120, a service board 130, a cabinet 140, and a power module 150, etc. At least one of the main control board 110, the switching board 120, and the service board 130 includes the liquid cooling device described above.

[0170] The main control board 110, also known as a control board, main processing unit (MPU), or route processor card, is the core of control and management. It is primarily used for controlling and managing various components within the network device 100, including functions such as route calculation, device management, device maintenance, and protocol processing. There can be one or more main control boards 110, such as two.

[0171] The switch board 120 can also be called a switch fabric unit (SFU) or switch fabric board. The switch board 120 is used for data forwarding. Specifically, the switch board 120 has switching chips (a single switch board 120 may include one or more switching chips), and the switch board 120 is responsible for data switching in the network plane through these switching chips. For example, in the case where the network device 100 has multiple service boards 130, the switch board 120 is used to complete the data exchange between the service boards 130. Referring to Figure 15, two service boards 130 can communicate through the switch board 120. The number of switch boards 120 can be multiple, such as eight.

[0172] Service board 130 is also called interface board, line processing unit (LPU), or line card. Service board 130 provides various service interfaces and is responsible for data reception and transmission. Specifically, service board 130 has service chips (a single service board 130 may include one or more service chips), and service board 130 uses these service chips to handle data reception and transmission. Referring again to Figure 15, service board 130 also includes service interfaces, also called physical interfaces, physical interface cards, or sub-cards, used to implement physical layer interfacing functions. Data enters service board 130 through these interfaces, and processed data is sent out from the service interfaces. The number of service boards 130 can be multiple, such as 16.

[0173] This embodiment also provides a liquid cooling system, which includes a cooling device, a cooling capacity distribution device, and the aforementioned network device. The cooling capacity distribution device and the primary side of the cooling device are connected by a pipeline, and the secondary side of the cooling capacity distribution device and the network device are connected by a pipeline. For example, the secondary side of the cooling capacity distribution device and the liquid cooling block of the network device are connected by a pipeline.

[0174] This embodiment also provides a liquid storage tray, which is applied to a circuit board with a liquid cooling block 1. The liquid storage tray 2 is used to be arranged on the circuit board of the circuit board, and the liquid cooling base plate 11 of the liquid cooling block 1 is arranged in the liquid storage tray 2.

[0175] In one example, the liquid reservoir 2 can be a heat-conducting disc-shaped or plate-shaped structure laid on the circuit board. Some components on the circuit board, such as chips, capacitors, resistors, and inductors, are located below the liquid reservoir 2. The liquid cooling block 1 mentioned above is arranged on the liquid reservoir 2. The liquid reservoir 2 is used to isolate the liquid cooling block 1 from the components on the circuit board to prevent the leaked liquid from flowing onto the circuit board when the liquid cooling block 1 leaks, which could cause a short circuit between the components on the circuit board and lead to board burnout.

[0176] In one example, to enhance heat transfer between the chip and the liquid cooling block 1, correspondingly, as shown in Figures 7 and 10, the liquid reservoir 2, which is isolated between the chip and the liquid cooling base plate 11 of the liquid cooling block 1, has a cutout 21 for allowing the liquid cooling base plate 11 to contact the chip on the circuit board.

[0177] In one example, to prevent liquid overflowing onto the surface of the liquid-cooled base plate 11 from flowing from the edge of the liquid-cooled base plate 11 onto the liquid storage tray 2, and then from the cutout 21 of the liquid storage tray 2 onto the circuit board below, a first liquid-blocking structure 31 is arranged on the liquid storage tray 2, as shown in Figures 7 and 10. The first liquid-blocking structure 31 surrounds the cutout 21, and the orthographic projection of the first liquid-blocking structure 31 onto the liquid-cooled base plate 11 falls within the area enclosed by the outer edge of the liquid-cooled base plate 11.

[0178] The orthographic projection of the first liquid-blocking structure 31 onto the liquid-cooled base plate 11 falls within the area enclosed by the outer edge of the liquid-cooled base plate 11.

[0179] In one example, to prevent liquid overflowing onto the surface of the liquid-cooled base plate 11 from flowing from the edge of the liquid-cooled base plate 11 onto the liquid storage tray 2, and then from the through holes in the liquid storage tray 2 onto the circuit board below, correspondingly, referring to Figures 7 and 10, the first liquid-blocking structure 31 surrounds the cutout 21 and the plurality of through holes 22, and the orthographic projection of the first liquid-blocking structure 31 on the liquid-cooled base plate 11 falls within the area enclosed by the outer edge of the liquid-cooled base plate 11.

[0180] The through holes 22 on the liquid storage tray 2 correspond one-to-one with the mounting holes 112 on the liquid cooling base plate 11, so that screws or bolts can pass through the mounting holes 112 and the through holes 22 and be fixed on the circuit board to fix the liquid cooling base plate 11 to the circuit board.

[0181] In one example, the first liquid-blocking structure 31 is a sealing ring, or the first liquid-blocking structure 31 is a raised structure disposed on the surface of the liquid storage tray 2 and protruding relative to the surface.

[0182] For example, as shown in Figure 7, the first liquid-blocking structure 31 is a sealing ring, and a sealing groove is provided on the surface of the liquid storage tray 2, with the sealing ring located in the sealing groove.

[0183] For example, as shown in Figure 10, the first liquid-blocking structure 31 is a protruding structure. Then, as shown in Figure 9, the first liquid-blocking structure 31 is used to extend into a groove on the surface of the liquid-cooled base plate 11 facing the liquid storage tray 2.

[0184] In one example, the liquid storage tray 2 has a first drain port 23 outside the area enclosed by the first liquid blocking structure 31. The first drain port 23 is used to drain the liquid accumulated in the liquid storage tray 2, for example, to the drain port of the network device.

[0185] In one example, the surface of the liquid reservoir 2 facing the liquid-cooled base plate 11 has a slope, and the first drain port 23 is located at the bottom of the slope of the liquid reservoir 2. The location of the first drain port 23 at the bottom of the slope of the liquid reservoir 2 is more conducive to draining the liquid on the liquid reservoir.

[0186] In one example, referring to Figures 7 and 10, the surface of the liquid reservoir 2 has a second liquid-blocking structure 32 for surrounding the liquid-cooled base plate 11 located on the liquid reservoir 2. The second liquid-blocking structure 32 is used to prevent liquid accumulated on the liquid reservoir 2 from flowing from the outer edge of the liquid reservoir 2 to the circuit board below.

[0187] In one example, referring to Figures 7 and 10, the second liquid-blocking structure 32 is a raised structure located at the outer edge of the liquid storage tray 2 and protruding relative to the surface of the liquid storage tray 2.

[0188] In one example, referring to Figures 5 and 8, the liquid reservoir 2 is arranged on the circuit board of the circuit board. The liquid cooling block 1, the inlet pipe 121 and outlet pipe 122 of the liquid cooling block 1, the supply pipe 4 connected to the inlet pipe 121, and the return pipe 5 connected to the outlet pipe 122 are all arranged in the liquid reservoir 2. Therefore, when a leak occurs at the connection between the liquid cooling base plate 11 and the liquid cooling cover plate 12, the leaked liquid is caught by the liquid reservoir 2. Similarly, when a leak occurs at the connection between the inlet pipe 121 and the supply pipe 4, the leaked liquid is also caught by the liquid reservoir 2. Likewise, when a leak occurs at the connection between the outlet pipe 122 and the return pipe 5, the leaked liquid is also caught by the liquid reservoir 2. This arrangement ensures that when a leak occurs at any connection, the leaked liquid flows into the liquid reservoir 2 instead of onto the circuit board, which helps protect the circuit board.

[0189] In one example, a liquid-absorbing sheet is arranged in the liquid storage tray 2 to absorb the liquid in the liquid storage tray 2. As described above, the material of the liquid-absorbing sheet can be one or more of activated carbon, cotton cloth, absorbent sponge, absorbent polymer, and absorbent paper towel. The liquid-absorbing sheet on the liquid storage tray 2 can promptly absorb the liquid accumulated on the liquid storage tray 2.

[0190] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A liquid cooling device, characterized in that, The liquid cooling device includes a liquid cooling base plate (11) and a liquid cooling cover plate (12); The first surface of the liquid-cooled base plate (11) has multiple flow channels, and the liquid-cooled cover plate (12) is fixed to the first surface of the liquid-cooled base plate (11) and covers the multiple flow channels; The plurality of flow channels are used to allow coolant to flow between the liquid-cooled base plate (11) and the liquid-cooled cover plate (12), and the second surface of the liquid-cooled base plate (11) facing away from the flow channels is used to absorb heat from the chip. The liquid cooling device also includes a liquid-blocking structure, which is used to prevent the coolant from flowing onto the circuit board where the chip is located.

2. The liquid cooling device according to claim 1, characterized in that, The liquid cooling device also includes a liquid storage pan (2), and the liquid cooling base plate (11) is located in the liquid storage pan (2).

3. The liquid cooling device according to claim 2, characterized in that, The liquid storage tray (2) has a cutout (21), which is used to allow the second surface of the liquid cooling base plate (11) facing away from the flow channel to contact the chip; The liquid-blocking structure includes a first liquid-blocking structure (31), which is located between the liquid storage pan (2) and the liquid-cooled base plate (11), and within the area enclosed by the outer edge of the liquid-cooled base plate (11), and surrounds the hollow (21).

4. The liquid cooling device according to claim 3, characterized in that, The liquid-cooled base plate (11) has multiple mounting holes (112) that penetrate the thickness, and the multiple mounting holes (112) are used to fix the liquid-cooled base plate (11) and the circuit board; The liquid storage tray (2) also has a plurality of through holes (22) that penetrate through the thickness, and the plurality of through holes (22) and the plurality of mounting holes (112) are positioned opposite each other; The first liquid-blocking structure (31) surrounds the cutout (21) and the plurality of through holes (22).

5. The liquid cooling device according to claim 3 or 4, characterized in that, The first liquid-blocking structure (31) is a sealing ring, or the first liquid-blocking structure (31) is a protrusion structure disposed on the surface of the liquid storage tray (2) and protruding relative to the surface.

6. The liquid cooling device according to claim 5, characterized in that, The first liquid-blocking structure (31) is a sealing ring. A sealing groove is provided on the surface of the liquid storage plate (2) facing the liquid-cooled base plate (11), or a sealing groove is provided on the surface of the liquid-cooled base plate (11) facing the liquid storage plate (2), and the sealing ring is located in the sealing groove.

7. The liquid cooling device according to claim 5, characterized in that, The first liquid-blocking structure (31) is a raised structure, and the surface of the liquid-cooled base plate (11) facing the liquid storage tray (2) has a groove, and the raised structure is located in the groove.

8. The liquid cooling device according to any one of claims 3 to 7, characterized in that, The liquid storage tray (2) has a first drain port (23) outside the area enclosed by the first liquid-blocking structure (31).

9. The liquid cooling device according to claim 8, characterized in that, The surface of the liquid storage tray (2) facing the liquid-cooled base plate (11) has a slope, and the first drain port (23) is located at the bottom of the slope of the liquid storage tray (2).

10. The liquid cooling device according to any one of claims 2 to 9, characterized in that, The liquid-blocking structure includes a second liquid-blocking structure (32), which is located on the surface of the liquid storage tray (2) facing the liquid-cooled base plate (11) and surrounds the liquid-cooled base plate (11).

11. The liquid cooling device according to claim 10, characterized in that, The second liquid-blocking structure (32) is a protruding structure located at the outer edge of the liquid storage tray (2) and protruding relative to the surface of the liquid storage tray (2).

12. The liquid cooling device according to any one of claims 2 to 11, characterized in that, The liquid cooling device further includes a liquid supply pipe (4) and a liquid return pipe (5). The liquid cooling cover plate (12) includes a liquid inlet pipe (121) and a liquid outlet pipe (122). The liquid inlet pipe (121) is connected to the liquid supply pipe (4), and the liquid outlet pipe (122) is connected to the liquid return pipe (5). The liquid supply pipe (4), the liquid return pipe (5), the liquid inlet pipe (121), and the liquid outlet pipe (122) are all located in the liquid storage pan (2).

13. The liquid cooling device according to any one of claims 2 to 12, characterized in that, The liquid-cooled base plate (11) has multiple mounting holes (112) that penetrate the thickness, and the multiple mounting holes (112) are used to fix the liquid-cooled base plate (11) and the circuit board; On the surface of the liquid-cooled base plate (11) facing the liquid-cooled cover plate (12), there is a liquid-retaining ring (113) at the position corresponding to each mounting hole (112) that surrounds the mounting hole (112) and protrudes relative to the surface of the liquid-cooled base plate (11).

14. The liquid cooling device according to any one of claims 2 to 13, characterized in that, The liquid storage tray (2) is provided with a liquid absorption plate, which is used to absorb the liquid in the liquid storage tray (2).

15. The liquid cooling device according to any one of claims 2 to 14, characterized in that, An overflow rope is arranged on the liquid storage pan (2). The overflow rope is used to send an overflow signal to the controller connected to the liquid cooling device when liquid is detected in the liquid storage pan (2). The overflow signal is used to instruct the controller to control the overflow reminder device to remind the user of overflow.

16. The liquid cooling device according to claim 1, characterized in that, The liquid-blocking structure is a structure that is provided on the surface of the liquid-cooled base plate (11) facing the liquid-cooled cover plate (12) and protrudes relative to the surface, and the liquid-blocking structure surrounds the fixed connection between the liquid-cooled base plate (11) and the liquid-cooled cover plate (12).

17. The liquid cooling device according to claim 16, characterized in that, The liquid-cooled base plate (11) has multiple mounting holes (112) that penetrate the thickness, and the multiple mounting holes (112) are used to fix the liquid-cooled base plate (11) and the circuit board. Multiple mounting holes (112) are located outside the area enclosed by the liquid-blocking structure.

18. The liquid cooling device according to claim 16 or 17, characterized in that, The liquid-cooled base plate (11) has a second drain port (117), which is connected to the area enclosed by the liquid-blocking structure.

19. The liquid cooling device according to any one of claims 16 to 18, characterized in that, The sidewall of the liquid-cooled base plate (11) has a liquid supply port (115) and a liquid return port (116). The interior of the liquid-cooled base plate (11) has a channel connecting the liquid supply port (115) and the flow channel, and a channel connecting the liquid return port (116) and the flow channel.

20. A circuit board, characterized in that, The board includes a circuit board, a chip, and the liquid cooling device according to any one of claims 1 to 19; The chip is fixed on the circuit board, and the liquid cooling base plate (11) of the liquid cooling device is located on the surface of the chip facing away from the circuit board, and the liquid cooling base plate is fixed to the circuit board.

21. A network device, characterized in that, The network device includes a cabinet and the board as described in claim 20, the board being located in the cabinet.

22. A liquid cooling system, characterized in that, The liquid cooling system includes a cooling device, a cooling capacity distribution device, and the network device as described in claim 21. The primary side of the cooling capacity distribution device is connected to the cooling device via a pipeline, and the secondary side of the cooling capacity distribution device is connected to the network device via a pipeline.

23. A liquid storage tray, characterized in that, The liquid storage tray (2) is applied to a board with a liquid cooling block (1), the liquid storage tray (2) is used to be arranged on the circuit board of the board, and the liquid cooling base plate (11) of the liquid cooling block (1) is arranged in the liquid storage tray (2).

24. The liquid storage tray according to claim 23, characterized in that, The liquid storage tray (2) has a cutout (21) for the liquid cooling base plate (11) to contact the chip on the circuit board.

25. The liquid storage tray according to claim 24, characterized in that, A first liquid-blocking structure (31) is arranged on the liquid storage tray (2), the first liquid-blocking structure (31) surrounds the hollow (21), and the orthographic projection of the first liquid-blocking structure (31) on the liquid-cooled base plate (11) falls on the area enclosed by the outer edge of the liquid-cooled base plate (11).

26. The liquid storage tray according to claim 25, characterized in that, The liquid storage tray (2) also has a plurality of through holes (22) with a through thickness, and the plurality of through holes (22) and the plurality of through mounting holes (112) with a through thickness on the liquid cooling base plate (11) are positioned opposite each other; The first liquid-blocking structure (31) surrounds the cutout (21) and the plurality of through holes (22).

27. The liquid storage tray according to claim 25 or 26, characterized in that, The first liquid-blocking structure (31) is a sealing ring, or the first liquid-blocking structure (31) is a protrusion structure disposed on the surface of the liquid storage tray (2) and protruding relative to the surface.

28. The liquid storage tray according to claim 27, characterized in that, The first liquid-blocking structure (31) is a sealing ring, and a sealing groove is provided on the surface of the liquid storage tray (2), with the sealing ring located in the sealing groove.

29. The liquid storage tray according to claim 27, characterized in that, The first liquid-blocking structure (31) is a protruding structure, and the first liquid-blocking structure (31) is used to extend into a groove on the surface of the liquid-cooled base plate (11) facing the liquid storage tray (2).

30. The liquid storage tray according to claim 25, characterized in that, The liquid storage tray (2) has a first drain port (23) outside the area enclosed by the first liquid-blocking structure (31).

31. The liquid storage tray according to claim 30, characterized in that, The surface of the liquid storage tray (2) facing the liquid-cooled base plate (11) has a slope, and the first drain port (23) is located at the bottom of the slope of the liquid storage tray (2).

32. The liquid storage tray according to claim 23, characterized in that, The surface of the liquid storage tray (2) has a second liquid-blocking structure (32) for surrounding the liquid-cooled base plate (11) located on the liquid storage tray (2).

33. The liquid storage tray according to claim 32, characterized in that, The second liquid-blocking structure (32) is a protruding structure located at the outer edge of the liquid storage tray (2) and protruding relative to the surface of the liquid storage tray (2).

34. The liquid storage tray according to claim 23, characterized in that, The liquid storage tray (2) is used to be arranged on the circuit board of the board, and the liquid cooling block (1) of the board, the liquid inlet pipe (121) and the liquid outlet pipe (122) of the liquid cooling block (1), the liquid supply pipe (4) connected to the liquid inlet pipe (121), and the liquid return pipe (5) connected to the liquid outlet pipe (122) are all arranged in the liquid storage tray (2).

35. The liquid storage tray according to claim 23, characterized in that, The liquid storage tray (2) is provided with a liquid absorption plate, which is used to absorb the liquid in the liquid storage tray (2).

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