License plate and preparation method therefor

Abstract

Disclosed in the present application is a preparation method for a license plate, the method comprising the following steps: providing a substrate, and preparing a recess in the substrate; placing a chip in the recess, and filling the recess with an encapsulant so as to seal the chip; providing a reflective film, and preparing a hollow-out portion on a reflective layer of the reflective film; laminating the reflective film onto the substrate, and aligning the recess with the hollow-out portion; and punching the laminated reflective film and substrate. The recess provided in the substrate provides a dedicated accommodating space for the chip, allowing a chip of a larger specification to be designed according to actual requirements, thereby improving the storage capacity and processing performance of the chip. Further disclosed in the present application is a license plate prepared by the preparation method.

Description

A license plate and its preparation method Technical Field

[0001] This application relates to a license plate, and more particularly to a license plate that can be identified by millimeter waves and a method for preparing the same. Background Technology

[0002] Currently, license plate recognition primarily relies on high-definition cameras continuously capturing images of license plates, which are then identified using computer vision and image processing technologies. This method is widely used in traffic monitoring, automated toll collection, and parking management. However, under certain circumstances, the license plate images captured by the cameras may be affected by external factors, leading to incorrect license plate recognition. For example, dirt, glare, or human obstruction of the license plate surface can degrade the image quality, thus affecting the accuracy and stability of the recognition system.

[0003] To address this issue, related technologies embed chips in license plates to store and wirelessly transmit license plate information, thereby assisting license plate recognition systems in achieving more efficient and accurate identification. The chips can communicate directly with external recognition devices, and even if the license plate surface is contaminated, reflective, or partially obscured, it can still transmit license plate information wirelessly, significantly improving the reliability of the recognition system. Technical issues

[0004] However, while this solution effectively addresses the issue of image recognition being affected by external factors, the embedding of the chip requires additional space and complex manufacturing processes, increasing the difficulty and cost of license plate production. Furthermore, the size of the embedded chip in the license plate is limited, preventing the accommodation of larger chips. Technical solutions

[0005] In view of this, the purpose of this application is to provide a license plate and a method for its preparation, which not only supports the use of larger-sized chips, but also ensures that the performance of the reflective film is not affected.

[0006] This application provides a method for preparing a license plate, the method comprising the following steps:

[0007] A substrate is provided, and a groove is formed on the substrate; a chip is placed in the groove and filled with adhesive to seal the chip;

[0008] A reflective film is provided, and a perforation is prepared on the reflective layer of the reflective film; the reflective film is attached to the substrate, and the groove is aligned with the perforation;

[0009] The laminated reflective film and substrate are then stamped.

[0010] In one embodiment, the step of fabricating a groove on the substrate includes:

[0011] A cutting machine is provided to perform positioning and cutting on the substrate to form a groove; the cutting power of the cutting machine is 300w-600w, and the cutting speed is 2m / min-8m / min.

[0012] The step of creating a perforation on the reflective layer of the reflective film includes:

[0013] An endorsement machine is provided, which is used to endorse the reflective layer of the reflective film to form a perforation; the endorsement power of the endorsement machine is 2w-5w, and the endorsement speed is 3m / min-5m / min.

[0014] In one embodiment, the step of sealing the chip includes: providing a dispensing machine, positioning the substrate, and dispensing adhesive at the groove using the dispensing head of the dispensing machine; the moving speed of the dispensing head is 10mm / s-100mm / s, the dispensing pressure is 0.3MPa-0.4MPa, the dispensing flow rate is 1mL-3mL, and the adhesive is cured after dispensing.

[0015] In one embodiment, the step of attaching the reflective film to the substrate includes:

[0016] A laminating machine is provided. After aligning the groove with the cutout, the laminating machine is used to apply the reflective film to the substrate. The pressure between the pressure roller and the disc of the laminating machine is 80N-100N, and the laminating speed is 0.5m / s-0.8m / s.

[0017] The stamping steps for the laminated reflective film and substrate include:

[0018] A stamping machine is provided to stamp the laminated and aligned reflective film and substrate; the stamping pressure of the stamping machine is 4 MPa-8 MPa.

[0019] This application also provides a license plate, which is formed by the above-described license plate preparation method. The license plate includes a substrate, a pressure-sensitive adhesive layer and a reflective film stacked together. The substrate has a groove inside, and a chip is disposed inside the groove. The reflective film includes a reflective layer, and the reflective layer has partial cutouts. The position of the cutouts corresponds vertically to the position of the grooves, and the area of ​​the cutouts is greater than or equal to the area of ​​the chip.

[0020] In one embodiment, the reflective film further includes a printing layer, an adhesive layer, a face film layer, a bead layer, and a focal layer arranged sequentially. The reflective layer is located on the side closer to the pressure-sensitive adhesive layer, and the face film layer is located on the side farther from the pressure-sensitive adhesive layer. The printing layer is adhered to the surface of the face film layer through the adhesive layer.

[0021] In one embodiment, the reflective layer is a metallic material, which is any one of aluminum, silver, titanium, chromium, copper, nickel, or indium tin alloy.

[0022] In one embodiment, the thickness of the printed layer is 50μm-200μm, the bonding layer is a UV adhesive, the transmittance of the bonding layer is greater than 90%, and the thickness is 5μm-20μm.

[0023] In one embodiment, the mask layer is an acrylic adhesive layer with a thickness of 20μm-40μm.

[0024] In one embodiment, the bead layer is semi-embedded glass microspheres in acrylic adhesive, the bead layer thickness is 20μm-80μm, the glass microspheres are 200 mesh-500 mesh, and the refractive index of the glass microspheres is 1.9 or 2.2. Beneficial effects

[0025] This application provides a method for manufacturing a license plate. By creating partial cutouts on the reflective film corresponding to the locations of grooves in the substrate, the signal waves emitted by the license plate recognition device can penetrate the reflective film and communicate with a chip disposed within the substrate grooves. Even in complex environments such as low visibility, dirt, strong reflection, or partial obstruction, the license plate can still stably and accurately transmit license plate information. Furthermore, the grooves within the substrate provide dedicated space for the chip, allowing for the design of larger chips according to actual needs, thereby improving the chip's storage capacity and processing performance. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 is a structural schematic diagram of a license plate provided in a preferred embodiment of this utility model.

[0028] Figure 2 is a schematic diagram of the structure of the reflective layer provided in a preferred embodiment of the present invention.

[0029] Figure label:

[0030] 1. Reflective film; 2. Pressure-sensitive adhesive layer; 3. Chip; 4. Substrate; 11. Printing layer; 12. Adhesive layer; 13. Face film layer; 14. Bead layer; 15. Focal point layer; 16. Reflective layer; 41. Groove; 161. Hollowed-out. Embodiments of the present invention

[0031] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this application. Based on the description of this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0032] In the description of this application, unless otherwise expressly specified and limited, the terms "set," "install," "connect," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms based on the specific circumstances.

[0033] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of description and to simplify the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0034] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0035] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0036] Please refer to Figures 1 and 2. An embodiment of this application provides a method for preparing a license plate, which includes the following steps:

[0037] S1. Provide a substrate 4, and prepare a groove 41 on the substrate 4; place the chip 3 in the groove 41 and fill it with glue to seal the chip 3.

[0038] S2. Provide a reflective film 1, and prepare a cutout 161 area on the reflective layer 16 of the reflective film 1; attach the reflective film 1 to the substrate 4, and align the groove 41 with the cutout 161;

[0039] S3. Stamp the laminated reflective film 1 and substrate 4.

[0040] The steps for preparing the groove 41 on the substrate 4 include: providing a cutting machine, fixing the substrate 4, and using the cutting machine to perform positioning and cutting on the substrate 4 to form the groove 41. Specifically, a laser cutting machine is selected as the cutting machine. Laser cutting is a non-contact processing method that does not generate mechanical stress on the substrate 4, thus avoiding material damage or deformation that may be caused by traditional mechanical cutting.

[0041] Excessively fast cutting speeds can lead to uneven laser application, resulting in burrs or irregular edges, which affects the sealing performance of subsequent adhesive filling and the bonding quality of the reflective film 1. Conversely, excessively slow cutting speeds cause heat to accumulate in the cutting area, leading to thermal deformation or ablation of the material, affecting the structural strength of the substrate 4 and the precision of the groove 41. Therefore, in this embodiment, the laser cutting machine has a cutting power of 300W-600W and a cutting rate of 2m / min-8m / min. By rationally selecting the laser cutting machine and its cutting power and rate, both the precision and quality of the groove 41 preparation can be improved, while also ensuring production efficiency.

[0042] The step of preparing the perforated area 161 on the reflective layer 16 of the reflective film 1 includes: providing an annotation machine, fixing the substrate 4, and using the annotation machine to annotate the reflective layer 16 of the reflective film 1 to form the perforation 161. Specifically, the annotation machine is a laser annotation machine, which can achieve precise positioning to ensure that the size and position of the perforation 161 are consistent with the design requirements. At the same time, laser annotation can effectively penetrate the reflective layer 16 without damaging the underlying material.

[0043] However, excessively fast signing speeds result in insufficient time for the laser to penetrate the reflective layer 16 of the reflective film 1, affecting the millimeter-wave transmission. Conversely, excessively slow signing speeds cause the laser to act on the surface of the reflective layer 16 for an extended period, leading to heat accumulation that can ablate the edges of the perforated area 161 and potentially damage the base layer of the reflective film 1. Therefore, in this embodiment, the laser signing machine has a signing power of 2W-5W and a signing speed of 3m / min-5m / min. By appropriately selecting the signing power and speed, not only can precise perforation processing of the perforated area 161 be achieved efficiently, ensuring millimeter-wave transmission performance, but the reflectivity of the reflective film 1 can also be maintained.

[0044] The steps for sealing chip 3 include: providing a dispensing machine, positioning the substrate 4, and using the dispensing head of the dispensing machine to dispense adhesive at the groove 41, followed by curing. However, if the dispensing head moves too quickly, the adhesive may not completely cover chip 3 and its surrounding area, resulting in incomplete sealing, air bubbles, or gaps, thus reducing the sealing effect. Moving too slowly may cause excessive adhesive buildup, leading to overflow. Insufficient dispensing pressure can cause uneven adhesive flow, failing to effectively cover the surface of chip 3 within the groove 41, affecting sealing performance. Excessive dispensing pressure may cause excessive adhesive spraying or a too-fast flow rate, resulting in adhesive overflow around the groove 41 or uneven sealing layer thickness. Furthermore, insufficient adhesive may not completely cover chip 3, leading to gaps or discontinuities in the sealing layer; excessive adhesive can easily cause buildup or overflow. Therefore, in this embodiment, the moving speed of the dispensing head is 10mm / s-100mm / s, the dispensing pressure is 0.3MPa-0.4MPa, and the dispensing flow rate is 1mL-3mL. By optimizing the parameters of the dispensing machine, not only can the chip 3 be fully protected, but its ability to resist environmental interference can also be improved.

[0045] The step of bonding the reflective film 1 to the substrate 4 includes: providing a bonding machine, aligning the groove 41 with the cutout 161, and then bonding the reflective film 1 to the substrate 4 using the bonding machine. Insufficient bonding pressure can lead to loose bonding between the reflective film 1 and the substrate 4, potentially resulting in air bubbles or localized peeling; excessive bonding pressure may damage the substrate 4 or the structure of the reflective film 1. Furthermore, excessively fast bonding speeds may cause inaccurate alignment between the reflective film 1 and the substrate 4; excessively slow bonding speeds can affect production efficiency and may also cause the reflective film 1 to be subjected to excessive stress for an extended period, increasing the risk of film stretching or deformation. Therefore, in this embodiment, the pressure between the pressure roller and the disc of the bonding machine is 80N-100N, and the bonding speed is 0.5m / s-0.8m / s. By controlling the pressure between the pressure roller and the disc and the bonding speed, not only can a tight bond between the reflective film 1 and the substrate 4 be achieved, avoiding air bubbles or misalignment, but also accurate alignment between the cutout 161 area and the groove 41 can be ensured.

[0046] The step of stamping the laminated reflective film 1 and substrate 4 includes providing a stamping machine to stamp the laminated and aligned reflective film 1 and substrate 4. However, if the stamping pressure is too low, a tight bond between the reflective film 1 and substrate 4 cannot be fully achieved; if the stamping pressure is too high, the substrate 4 or chip 3 may be damaged. Therefore, in this embodiment, the stamping pressure of the stamping machine is 4 MPa-8 MPa. By controlling the stamping pressure, not only can a firm bond between the reflective film 1 and substrate 4 be ensured, avoiding delamination and loosening problems, but the chip 3 and its sealing layer can also be protected from damage.

[0047] This application embodiment also provides a license plate, which is formed by the above-described license plate preparation method. The license plate includes a substrate 4, a pressure-sensitive adhesive layer 2 and a reflective film 1 stacked together. The substrate 4 has a groove 41 inside, and a chip 3 is disposed inside the groove 41. The reflective film 1 includes a reflective layer 16, and the reflective layer 16 has a partial cutout 161. The position of the cutout 161 corresponds vertically to the position of the groove 41, and the area of ​​the cutout 161 is greater than or equal to the area of ​​the chip 3.

[0048] Preferably, the reflective film 1 further includes a printing layer 11, an adhesive layer 12, a face film layer 13, a beaded layer 14, and a focal layer 15 arranged sequentially. The reflective layer 16 is located on the side closer to the pressure-sensitive adhesive layer 2, and the face film layer 13 is located on the side farther from the pressure-sensitive adhesive layer 2. The printing layer 11 is adhered to the surface of the face film layer 13 through the adhesive layer 12. The face film layer 13 is made of acrylic acid with a thickness of 20μm-40μm, possessing good flexibility and transparency, effectively protecting the beaded layer 14. The reflective layer 16 is mainly used to reflect light illuminating the license plate, while the focal layer 15 is used to adjust the propagation path of the reflected light, making it more focused and ensuring high visibility of the license plate under low-light conditions.

[0049] The printed layer 11 is adhered to the surface of the film layer 13 via the adhesive layer 12. It is made of aging-resistant PVC material with a thickness of 50μm-200μm. License plate information, such as vehicle number and related patterns, is printed on the surface of the printed layer 11. The aging-resistant PVC material has excellent UV resistance and weather resistance, effectively resisting aging phenomena caused by long-term exposure to harsh environments such as sunlight, rain, and high temperatures, thereby extending the lifespan of the license plate. Specifically, the adhesive layer 12 is a UV adhesive with a thickness of 5μm-20μm and a transmittance greater than 90%, effectively ensuring the transmission of light and signal waves and avoiding affecting the performance of other functional layers within the reflective film 1.

[0050] In this embodiment, the reflective layer 16 is made of a metallic material, which can be any one of aluminum, silver, titanium, chromium, copper, nickel, or indium tin alloy. These metallic materials all have high reflectivity, which can effectively improve reflective performance.

[0051] Preferably, the bead layer 14 is a semi-embedded glass microsphere in acrylic adhesive, with a thickness of 20μm-80μm. The glass microspheres are 200-500 mesh with a refractive index of 1.9 or 2.2, ensuring stable fixation. Simultaneously, the exposed portion of the glass microspheres effectively reflects light under illumination, enhancing the visibility and recognition of the license plate. It should be noted that only the reflective film 1 with embedded glass microspheres can be bonded to the substrate 4 and then stamped. Due to the good flexibility of the microsphere reflective film 1, it can effectively adapt to changes in the surface of the substrate 4 during stamping, preventing cracking or delamination and ensuring that the reflective performance of the film layer is not damaged after stamping.

[0052] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0053] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the appended claims.

Claims

1. A method for preparing a license plate, characterized in that, The method includes the following steps: A substrate (4) is provided, and a groove (41) is prepared on the substrate (4); a chip (3) is placed in the groove (41) and filled with glue to seal the chip (3); A reflective film (1) is provided, and a perforation (161) is prepared on the reflective layer (16) of the reflective film (1); the reflective film (1) is attached to the substrate (4), and the groove (41) is aligned with the perforation (161); The laminated reflective film (1) and substrate (4) are stamped.

2. The method for preparing a license plate as described in claim 1, characterized in that, The step of preparing the groove (41) on the substrate (4) includes: A cutting machine is provided to perform positioning cutting on the substrate (4) to form a groove (41); the cutting power of the cutting machine is 300w-600w and the cutting speed is 2m / min-8m / min; The step of preparing a perforation (161) on the reflective layer (16) of the reflective film (1) includes: A signature machine is provided, which is used to sign the reflective layer (16) of the reflective film (1) to form a hollow (161); the signature power of the signature machine is 2w-5w and the signature speed is 3m / min-5m / min.

3. The method for preparing a license plate as described in claim 1, characterized in that, The step of sealing the chip (3) includes: providing a dispensing machine, positioning the substrate (4), and dispensing glue at the groove (41) using the dispensing head of the dispensing machine; the moving speed of the dispensing head is 10mm / s-100mm / s, the dispensing pressure is 0.3MPa-0.4MPa, the dispensing flow rate is 1mL-3mL, and the glue is cured after dispensing.

4. The method for preparing a license plate as described in claim 1, characterized in that, The step of attaching the reflective film (1) to the substrate (4) includes: A laminating machine is provided. After aligning the groove (41) with the cutout (161), the reflective film (1) is laminated onto the substrate (4) using the laminating machine. The pressure between the pressure roller and the disc of the laminating machine is 80N-100N, and the laminating speed is 0.5m / s-0.8m / s. The stamping steps for the laminated reflective film (1) and substrate (4) include: A stamping machine is provided to stamp the laminated and aligned reflective film (1) and substrate (4); the stamping pressure of the stamping machine is 4Mpa-8Mpa.

5. A license plate, characterized in that, The license plate is prepared by the license plate preparation method according to any one of claims 1-4. The license plate includes a substrate (4), a pressure-sensitive adhesive layer (2), and a reflective film (1) stacked together. The substrate (4) has a groove (41) inside, and a chip (3) is disposed inside the groove (41). The reflective film (1) includes a reflective layer (16). The reflective layer (16) has a partial cutout (161). The position of the cutout (161) corresponds vertically to the position of the groove (41). The area of ​​the cutout (161) is greater than or equal to the area of ​​the chip (3).

6. The license plate as described in claim 5, characterized in that, The reflective film (1) further includes a printing layer (11), an adhesive layer (12), a face film layer (13), a bead layer (14), and a focal layer (15) arranged in sequence. The reflective layer (16) is located on the side close to the pressure-sensitive adhesive layer (2), and the face film layer (13) is located on the side away from the pressure-sensitive adhesive layer (2). The printing layer (11) is attached to the surface of the face film layer (13) through the adhesive layer (12).

7. The license plate as described in claim 5, characterized in that, The reflective layer (16) is a metallic material, which is any one of aluminum, silver, titanium, chromium, copper, nickel or indium tin alloy.

8. The license plate as described in claim 6, characterized in that, The thickness of the printed layer (11) is 50μm-200μm, the bonding layer (12) is a UV adhesive, the transmittance of the bonding layer (12) is greater than 90%, and the thickness is 5μm-20μm.

9. The license plate as described in claim 6, characterized in that, The mask layer (13) is an acrylic adhesive layer with a thickness of 20μm-40μm.

10. The license plate as described in claim 6, characterized in that, The bead layer (14) is a semi-embedded glass microsphere in acrylic glue. The thickness of the bead layer (14) is 20μm-80μm. The glass microsphere is 200 mesh-500 mesh and the refractive index of the glass microsphere is 1.9 or 2.2.

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