Display substrate and display device
By setting barrier dams, isolation pillars, and composite barrier structures on the OLED display substrate, the problem of easy damage to the hole edge structure is solved, and a more stable encapsulation effect and display performance are achieved.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2026-01-04
- Publication Date
- 2026-07-30
AI Technical Summary
In the production of rigid OLED displays, the hole edge structure is prone to causing multi-dimensional performance degradation problems, including encapsulation failure, cutting cracks, acid etching damage, cathode material interconnection, and organic film layer separation, leading to display failure.
The design employs barrier dams, isolation pillars, barrier structures, and thin-film encapsulation layers on the substrate. By setting grooves and metal layers between the inorganic and organic layers, a composite barrier structure is formed to block the propagation of cutting cracks. The encapsulation effect is enhanced by the combination of power-off structures and etched barrier structures.
It effectively blocks cutting cracks and acid corrosion, disconnects the cathode material, improves the stability and reliability of the packaging structure, prevents moisture intrusion, and ensures display performance.
Smart Images
Figure CN2026070175_30072026_PF_FP_ABST
Abstract
Description
A display substrate and a display device
[0001] Cross-reference to related applications
[0002] This application claims priority to Chinese Patent Application No. 202510122621.5, filed on January 24, 2025, entitled "A Display Substrate and Display Device", the entire contents of which are incorporated herein by reference. Technical Field
[0003] This disclosure relates to the field of display technology, and in particular to a display substrate and a display device. Background Technology
[0004] Most organic light-emitting diode (OLED) displays on the market currently employ an AA-Hole design. However, in the production of rigid products, the edge structure and manufacturing process of the holes are highly susceptible to multi-dimensional performance degradation, particularly encapsulation failure. Summary of the Invention
[0005] This disclosure provides a display substrate and a display device, the specific solutions of which are as follows:
[0006] This disclosure provides a display substrate, comprising:
[0007] A substrate with a via is provided, a barrier dam located in the periphery region of the via, a plurality of isolation pillars located on the side of the barrier dam away from the display area, a barrier structure located on the side of the plurality of isolation pillars away from the barrier dam, and a thin film encapsulation layer located on the side of the barrier dam away from the substrate; wherein, the periphery region of the via is arranged around the via, and the display area is arranged around the periphery region of the via.
[0008] The thin-film encapsulation layer covers the display area and extends through the barrier dam and the plurality of isolation pillars to the side of the barrier structure opposite to the substrate; at least one inorganic layer is disposed between the plurality of isolation pillars and the substrate; the barrier structure is used to block the propagation of cutting cracks.
[0009] Optionally, in an embodiment of this disclosure, the barrier structure includes at least one groove formed on the side of the at least one inorganic layer away from the substrate, the at least one groove and an organic layer completely filling the at least one groove together forming the barrier structure; each of the grooves penetrates at least a portion of the film layer of the at least one inorganic layer.
[0010] Optionally, in an embodiment of this disclosure, the barrier structure further includes a first metal layer located between the organic layer and the at least one inorganic layer, the first metal layer covering the at least one groove.
[0011] Optionally, in this embodiment of the disclosure, the at least one inorganic layer is multiple layers, and the barrier structure includes a second metal layer disposed between two adjacent inorganic layers in the multiple inorganic layers.
[0012] Optionally, in embodiments of this disclosure, the barrier structure further includes an organic layer located on the side of the multilayer inorganic layer facing away from the substrate.
[0013] Optionally, in this embodiment of the present disclosure, a plurality of intermittently arranged power-off structures are disposed on the side of the barrier structure away from the barrier dam. The plurality of power-off structures are completely covered by the thin film encapsulation layer, and along a direction perpendicular to the plane of the substrate, the distance between the surface of each power-off structure away from the substrate and the substrate is greater than the distance between the surface of the plurality of isolation pillars away from the substrate and the substrate.
[0014] Optionally, in this embodiment of the present disclosure, an organic layer is further included on the side of the at least one inorganic layer facing away from the substrate; the organic layer has a recessed structure in the periphery of the hole located between two adjacent power-off structures; along the direction facing away from the substrate, each power-off structure includes a first sub-part and a second sub-part arranged sequentially, the second sub-part is arranged in the same layer as the plurality of isolation pillars, the first sub-part is arranged in the same layer as the organic layer, and on one side surface of the same power-off structure adjacent to the recessed structure, the edge of the first sub-part coincides with the edge of the recessed structure, and the orthographic projection of the edge of the second sub-part on the substrate completely falls within the area of the orthographic projection of the recessed structure on the substrate.
[0015] Optionally, in this embodiment of the present disclosure, an etched barrier structure is further included on the side of the plurality of power-off structures away from the barrier dam, the etched barrier structure including a third sub-section disposed in the same layer as the organic layer.
[0016] Optionally, in an embodiment of this disclosure, the etching barrier structure further includes a fourth sub-part disposed on the same layer as the at least one inorganic layer, the fourth sub-part and the third sub-part being disposed opposite to the substrate in sequence, and the orthographic projections of the third sub-part and the fourth sub-part on the substrate overlapping each other.
[0017] Optionally, in this embodiment of the present disclosure, a plurality of riveting structures are further included on the side of the etching barrier structure opposite to the substrate, each of the riveting structures including a fifth sub-part and a sixth sub-part connected to each other; the fifth sub-part is disposed in the same layer as the plurality of isolation pillars; the sixth sub-part is disposed in the same layer as the inorganic encapsulation layer in the thin film encapsulation layer.
[0018] Optionally, in this embodiment of the present disclosure, a touch functional layer is further provided on the side of the thin film encapsulation layer facing away from the substrate; along the direction facing away from the substrate, the touch functional layer includes a third metal layer, a touch insulating layer and a fourth metal layer disposed sequentially; the third metal layer and / or the fourth metal layer at least cover the area between two adjacent isolation pillars.
[0019] Optionally, in this embodiment of the disclosure, the substrate is a rigid substrate.
[0020] Accordingly, embodiments of this disclosure provide a display device, comprising:
[0021] Display substrate as described in any of the above;
[0022] The sensor is positioned at the location corresponding to the via. Attached Figure Description
[0023] Figure 1 is a top view of one of the display substrate structures provided in an embodiment of this disclosure;
[0024] Figure 2 is a schematic diagram of one type of cross-sectional structure along the direction shown by MM in Figure 1;
[0025] Figure 3 is a schematic diagram of one type of cross-sectional structure along the direction shown in NN in Figure 1;
[0026] Figure 4 is a schematic diagram of one type of display substrate including a barrier structure provided in an embodiment of the present disclosure;
[0027] Figure 5 is a schematic diagram of one type of display substrate including a barrier structure provided in an embodiment of the present disclosure;
[0028] Figure 6 is a schematic diagram of one type of display substrate including a barrier structure provided in an embodiment of the present disclosure;
[0029] Figure 7 is a schematic diagram of one type of display substrate including a barrier structure provided in an embodiment of the present disclosure;
[0030] Figure 8 is an enlarged view of one of the structures of region Q in Figure 1;
[0031] Figure 9 is an enlarged view of one of the structures including an etching barrier structure in the actual fabrication process of the display substrate provided in the embodiments of this disclosure;
[0032] Figure 10 is an enlarged view of one of the structures including an etching barrier structure in the actual fabrication process of the display substrate provided in the embodiments of this disclosure;
[0033] Figure 11 is an enlarged view of one of the multiple riveting structures included in the actual manufacturing process of the display substrate provided in the embodiment of this disclosure;
[0034] Figure 12 is an enlarged view of one of the structures in which a third metal layer is included at the edge of the hole during the actual fabrication process of the display substrate provided in the embodiment of this disclosure;
[0035] Figure 13 is an enlarged view of one of the structures in which a fourth metal layer is included at the edge of the hole during the actual fabrication process of the display substrate provided in the embodiments of this disclosure. Detailed Implementation
[0036] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.
[0037] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “inner,” “outer,” “upper,” and “lower” are used only to indicate relative positional relationships; when the absolute position of the described objects changes, the relative positional relationship may also change accordingly.
[0038] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
[0039] In related technologies, when using an AA-Hole design for OLED displays, to prevent moisture from entering the display area along the organic layer and causing oxidation of the organic light-emitting material, leading to display failure, multiple Ti-Al-Ti isolation pillar structures are typically placed at the hole edge to disconnect the organic light-emitting material as much as possible and block lateral water and oxygen channels. However, in the manufacturing process of rigid products, various processes and external loads can cause the isolation pillar structure at the hole edge to fail, failing to effectively block moisture and thus leading to display failure. Specific problems are as follows:
[0040] (1) Cracks caused by cutting: When cutting holes in rigid products, cracks at the cut edge will extend inward, causing damage to the encapsulation structure at the edge, resulting in growth black spot (GDSH) risk and reliability risk.
[0041] (2) Damage caused by acid etching: When using acid to process the back glass of the hole, the fluctuation of the acid etching process can easily damage the driving circuit and even corrode the organic light-emitting material, leading to display failure.
[0042] (3) Reliability issues of cathode material connectivity: Since the cathode material in the light-emitting functional layer may still connect at the edge of the hole to form an electrical path, it leads to reliability failure;
[0043] (4) Organic film separation problem: Due to the poor adhesion of the relevant organic film at the edge of the hole, the film at the cut is very easy to separate after cutting. The external force in the subsequent process will cause the film separation to extend inward, resulting in encapsulation failure and GDSH.
[0044] (5) Water vapor intrusion problem caused by gaps in inorganic layer film formation in packaging structure: When the inorganic layer material in the packaging structure is formed on the isolation pillar structure by chemical vapor deposition (CVD), the inorganic layer is very likely to form a gap at the undercut of the isolation pillar structure, forming a channel from top to bottom, which leads to water vapor intrusion, causing GDSH and reliability failure.
[0045] In view of this, the present disclosure provides a display substrate and a display device to improve the packaging effect of the display substrate and ensure the display effect of the display substrate.
[0046] Referring to Figures 1 and 2, where Figure 1 is a top view of one embodiment of the display substrate provided in this disclosure, and Figure 2 is a cross-sectional view along the direction MM shown in Figure 1, specifically, the display substrate includes:
[0047] The system comprises a substrate 10 with a via H, a barrier dam 20 located in the periphery region BB of the via, a plurality of isolation pillars 30 located on the side of the barrier dam 20 away from the display area AA, a barrier structure 40 located on the side of the plurality of isolation pillars 30 away from the barrier dam 20, and a thin film encapsulation layer 50 located on the side of the barrier dam 20 away from the substrate 10; wherein the periphery region BB is disposed around the via H, and the display area AA is disposed around the periphery region BB.
[0048] The thin-film encapsulation layer 50 covers the display area AA and extends through the barrier dam 20 and the plurality of isolation pillars 30 to the side of the barrier structure 40 away from the substrate 10; at least one inorganic layer 60 is disposed between the plurality of isolation pillars 30 and the substrate 10; the barrier structure 40 is used to block the propagation of cutting cracks.
[0049] In specific implementation, the display substrate includes a substrate 10, a barrier dam 20, multiple isolation pillars 30, a barrier structure 40, and a thin-film encapsulation layer 50. The substrate 10 can be a silicon-based substrate or a glass-based substrate, without limitation. A via H is formed on the substrate 10. The barrier dam 20 is located in the periphery region BB of the via. The multiple isolation pillars 30 are located on the side of the barrier dam 20 facing away from the display area AA. The barrier structure 40 is located on the side of the multiple isolation pillars 30 facing away from the barrier dam 20. The thin-film encapsulation layer 50 is located on the side of the barrier dam 20 facing away from the substrate 10. Furthermore, the periphery region BB surrounds the via H, and the display area AA surrounds the periphery region BB. For example, Figure 1 shows one possible distribution of the display area AA and the periphery region BB. Additionally, the multiple isolation pillars 30 can be two, three, or more. For example, the thin-film encapsulation layer 50 includes a first inorganic encapsulation layer 51, an organic encapsulation layer 52, and a second inorganic encapsulation layer 53, sequentially disposed facing away from the substrate 10.
[0050] Furthermore, the thin-film encapsulation layer 50 covers the display area AA and extends through the barrier dam 20 and multiple isolation pillars 30 to the side of the barrier structure 40 facing away from the substrate 10. In this way, the thin-film encapsulation layer 50 effectively isolates external water and oxygen, ensuring the performance of the display substrate. In addition, at least one inorganic layer 60 is disposed between the multiple isolation pillars 30 and the substrate 10. Exemplarily, the at least one inorganic layer 60 can be one layer, or two or more layers; the specific number of inorganic layers 60 can be set according to actual application needs and is not limited here. Furthermore, the barrier structure 40 is used to block the propagation of cutting cracks. Referring again to the exemplary embodiment shown in FIG2, since the barrier structure 40 is located between the multiple isolation pillars 30 and the via H, and the barrier structure 40 is used to block the propagation of cutting cracks, even when the via H is being cut, the barrier structure 40 can effectively block the propagation of cracks at the edge of the via H (i.e., the hole edge) during the cutting process, improving the encapsulation effect of the display substrate.
[0051] In this embodiment of the present disclosure, Figure 3 shows a schematic cross-sectional structure along the direction NN shown in Figure 1. Specifically, within the display area AA, the display substrate includes, sequentially disposed away from the substrate 10, a buffer layer 11, an active layer 12, a first gate insulating layer 13, a first gate layer 14, a second gate insulating layer 15, a second gate layer 16, an interlayer insulating layer 17, a first source / drain layer 18, a passivation layer 19, a first planarization layer 21, a second source / drain layer 22, a second planarization layer 23, an anode layer 24, a pixel definition layer 25, a light-emitting layer 26, a cathode layer 27, a first inorganic encapsulation layer 51, an organic encapsulation layer 52, a second inorganic encapsulation layer 53, a third metal layer 951, a touch insulating layer 952, a fourth metal layer 953, and a touch protection layer 96. The specific arrangement of the film layer structures involved can be implemented with reference to related technologies, and will not be described in detail here.
[0052] In this embodiment of the disclosure, the barrier structure 40 may be configured in the following manner, but is not limited to this.
[0053] In one exemplary embodiment, as shown in Figures 4 to 6, the barrier structure 40 includes at least one groove 70 formed on the side of the at least one inorganic layer 60 away from the substrate 10, the at least one groove 70 and an organic layer 80 completely filled in the at least one groove 70 together form the barrier structure 40; each of the grooves 70 penetrates at least a portion of the film layer of the at least one inorganic layer 60.
[0054] In specific implementation, at least one inorganic layer 60 has at least one groove 70 on the side facing away from the substrate 10. Exemplarily, the at least one groove 70 can be one, or two or more, without limitation. In the exemplary embodiments shown in Figures 4 to 6, there are three grooves 70. Furthermore, each groove 70 penetrates at least a portion of the film layer of the at least one inorganic layer 60. Referring again to the exemplary embodiment shown in Figure 3, the at least one inorganic layer 60 can be at least one of the following: a buffer layer 11, a first gate insulating layer 13, a second gate insulating layer 15, an interlayer insulating layer 17, and a passivation layer 19. The specific configuration can be determined according to actual application needs and is not limited here. Exemplarily, each groove 70 penetrates a portion of the film layer of the at least one inorganic layer 60, as shown in Figures 4 and 6. Exemplarily, each groove 70 penetrates the entire film layer of the at least one inorganic layer 60, as shown in Figure 5. Furthermore, the barrier structure 40 includes at least one groove 70 formed on the side of at least one inorganic layer 60 facing away from the substrate 10, and an organic layer 80 completely filling the at least one groove 70, together forming the barrier structure 40. Referring again to the exemplary embodiment shown in FIG3, the organic layer 80 may be a first planarization layer 21. In the exemplary embodiments shown in FIGS. 4 to 6, the barrier structure 40 includes portions of the organic layer 80 filling each groove 70, and portions completely covering each groove 70. In this way, the propagation of cutting cracks is effectively blocked by the at least one groove 70 formed on the side of at least one inorganic layer 60 facing away from the substrate 10 and the corresponding organic layer 80, thereby improving the packaging effect.
[0055] In one exemplary embodiment, the barrier structure 40 further includes a first metal layer 90 located between the organic layer 80 and the at least one inorganic layer 60, the first metal layer 90 covering the at least one groove 70.
[0056] Referring again to the exemplary embodiment shown in FIG. 6, the barrier structure 40 further includes a first metal layer 90 located between the organic layer 80 and at least one inorganic layer 60, the first metal layer 90 covering at least one recess 70. Referring again to the exemplary embodiment shown in FIG. 3, the first metal layer 90 is disposed in the same layer as the second source / drain layer 22 within the display area AA. Exemplarily, the material of the second source / drain layer 22 may be Ti / Al / Ti. In this way, the barrier structure 40 is further strengthened by the first metal layer 90, thereby effectively blocking the propagation of cracks and improving the encapsulation effect.
[0057] It should be noted that, in the embodiments disclosed herein, unless otherwise specified, "same layer" refers to the deposition and preparation of the same layer in the process; or, deposition by different processes, but physically located in the same layer.
[0058] In one exemplary embodiment, the at least one inorganic layer 60 is multilayered, and the barrier structure 40 includes a second metal layer 91 disposed between two adjacent inorganic layers in the multilayer inorganic layers.
[0059] Referring to the exemplary embodiment shown in FIG7, at least one inorganic layer 60 includes two inorganic layers, namely a first inorganic layer 61 and a second inorganic layer 62 disposed sequentially opposite to the substrate 10. The barrier structure 40 includes a second metal layer 91 disposed between the first inorganic layer 61 and the second inorganic layer 62. Referring again to the exemplary embodiment shown in FIG3, the second metal layer 91 is disposed on the same layer as the first gate layer 14 within the display area AA. In this way, while simplifying the manufacturing process, the second metal layer 91 effectively blocks the propagation of cracks, improving the packaging effect.
[0060] Referring again to the exemplary embodiment shown in FIG7, the barrier structure 40 further includes an organic layer 80 located on the side of the multilayer inorganic layer opposite to the substrate 10. In this way, the propagation of cracks is effectively blocked by the second metal layer 91 and the organic layer 80 located on the side of the multilayer inorganic layer opposite to the substrate 10, thereby improving the encapsulation effect.
[0061] In this embodiment of the present disclosure, the display substrate further includes a plurality of intermittently arranged power-off structures 92 disposed on the side of the barrier structure 40 away from the barrier dam 20. The plurality of power-off structures 92 are completely covered by the thin film encapsulation layer 50, and along the direction perpendicular to the plane where the substrate 10 is located, the distance between the surface of each power-off structure 92 away from the substrate 10 and the substrate 10 is greater than the distance between the surface of the plurality of isolation pillars 30 away from the substrate 10 and the substrate 10.
[0062] Referring again to the exemplary embodiment shown in FIG2, the display substrate further includes a plurality of intermittently arranged power-off structures 92 disposed on the side of the barrier structure 40 away from the barrier dam 20. Exemplarily, the plurality of power-off structures 92 can be two, or three or more, without limitation herein. Furthermore, the plurality of power-off structures 92 are completely covered by the thin-film encapsulation layer 50, and along a direction perpendicular to the plane of the substrate 10, the distance between the surface of each power-off structure 92 facing away from the substrate 10 and the substrate 10 is greater than the distance between the surface of each isolation pillar 30 facing away from the substrate 10 and the substrate 10. Correspondingly, the step difference between each power-off structure 92 is greater than the step difference between each isolation pillar 30. In this way, the plurality of power-off structures 92 can effectively isolate the subsequent related film layers covering them. As shown by arrow Z in FIG2, the direction is along the direction perpendicular to the plane of the substrate 10, where d1 represents the distance between the surface of the power-off structure 92 facing away from the substrate 10 and the substrate 10, d2 represents the distance between the surface of the isolation pillar 30 facing away from the substrate 10 and the substrate 10, and d1 > d2. Of course, the specific values between the isolation pillar 30 and the side surface of the power-off structure 92 facing away from the substrate 10 and the substrate 10 can be set according to the actual application needs, and no limitation is made here.
[0063] In this embodiment, the display substrate further includes an organic layer 80 located on the side of the at least one inorganic layer 60 facing away from the substrate 10; the organic layer 80 has a recessed structure 81 located between two adjacent power-off structures 92 in the periphery region BB of the hole; along the direction facing away from the substrate 10, each power-off structure 92 includes a first sub-part 921 and a second sub-part 922 arranged sequentially, the second sub-part 922 is arranged in the same layer as the plurality of isolation pillars 30, the first sub-part 921 is arranged in the same layer as the organic layer 80, and on one side surface of the same power-off structure 92 adjacent to the recessed structure 81, the edge of the first sub-part 921 coincides with the edge of the recessed structure 81, and the orthographic projection of the edge of the second sub-part 922 on the substrate 10 completely falls within the area of the orthographic projection of the recessed structure 81 on the substrate 10.
[0064] In a specific implementation, the display substrate also includes an organic layer 80 located on the side of at least one inorganic layer 60 facing away from the substrate 10. For example, the organic layer 80 is a first planarization layer 21. Figure 8 shows an enlarged view of one structure of region Q in Figure 1. To clearly illustrate the specific structural details of the power-off structure 92, other film layers covering the power-off structure 92 are not shown in Figure 8. Specifically, the organic layer 80 has a recessed structure 81 located between two adjacent power-off structures 92 in the periphery region BB of the hole; along the direction facing away from the substrate 10, each power-off structure 92 includes a first sub-part 921 and a second sub-part 922 arranged sequentially. The second sub-part 922 is co-layered with multiple isolation pillars 30, and the first sub-part 921 is co-layered with the organic layer 80. For example, the second sub-part 922 and multiple isolation pillars 30 are co-layered with the second source / drain layer 22, and the first sub-part 921 is co-layered with the first planarization layer 80.
[0065] Furthermore, on one side surface of the same power-off structure 92 adjacent to the recessed structure 81, the edge of the first sub-part 921 coincides with the edge of the recessed structure 81, and the orthographic projection of the edge of the second sub-part 922 onto the substrate 10 completely falls within the area of the orthographic projection of the recessed structure 81 onto the substrate 10. In this way, the corresponding edges of the first sub-part 921 and the second sub-part 922 corresponding to the same power-off structure 92 form an undercut structure. This simplifies the process and, even when the cathode material in the light-emitting functional layer covers multiple power-off structures 92, effectively disconnects the corresponding cathode material. This effectively avoids the reliability failure problem caused by the cathode material forming an electrical path at the hole edge, thereby improving the performance of the display substrate.
[0066] In this embodiment of the present disclosure, still in conjunction with the exemplary embodiment shown in FIG2, the display substrate further includes an etching barrier structure 93 located on the side of the plurality of power-off structures 92 away from the barrier dam 20, the etching barrier structure 93 including a third sub-part 931 disposed in the same layer as the organic layer 80.
[0067] In the specific implementation process, the display substrate also includes an etching barrier structure 93 located on the side of the multiple power-off structures 92 away from the barrier dam 20. Figure 9 shows an enlarged view of one structure including the etching barrier structure 93 in the actual fabrication process. The etching barrier structure 93 includes a third sub-section 931 disposed on the same layer as the organic layer 80, where L indicates the cut position and C indicates the acid etching surface. For example, the etching barrier structure 93 is disposed on the same layer as the first planarization layer 80. In this way, when the back side of the substrate 10 at the via H is opened with acid, the third sub-section 931 disposed on the same layer as the organic layer 80 at the cut position can, to a certain extent, prevent the acid from corroding the organic light-emitting material in the light-emitting functional layer, thereby ensuring the display effect of the display substrate.
[0068] In one exemplary embodiment, the etching barrier structure 93 further includes a fourth sub-part 932 disposed on the same layer as the at least one inorganic layer 60. The fourth sub-part 932 and the third sub-part 931 are disposed opposite to the substrate 10, and the orthographic projections of the third sub-part 931 and the fourth sub-part 932 on the substrate 10 overlap each other.
[0069] Figure 10 shows an enlarged view of one possible structure including the etch barrier structure 93 in the actual fabrication process. The etch barrier structure 93 further includes a fourth sub-section 932 disposed co-layered with at least one inorganic layer 60. The fourth sub-section 932 and the third sub-section 931 are sequentially disposed away from the substrate 10. In other words, the etch barrier structure 93 includes a third sub-section 931 disposed co-layered with the organic layer 80, and a fourth sub-section 932 disposed co-layered with at least one inorganic layer 60. This improves the acid corrosion resistance of the film structure related to the hole edge, ensuring the display effect of the display substrate.
[0070] In this embodiment of the present disclosure, still referring to the exemplary embodiment shown in FIG2, the display substrate further includes a plurality of riveting structures 94 located on the side of the etching barrier structure 93 facing away from the substrate 10. Each riveting structure 94 includes a fifth sub-part 941 and a sixth sub-part 942 connected to each other. The fifth sub-part 941 is disposed in the same layer as the plurality of isolation pillars 30. The sixth sub-part 942 is disposed in the same layer as the inorganic encapsulation layer in the thin film encapsulation layer 50.
[0071] In specific implementation, the display substrate also includes multiple riveting structures 94 located on the side of the etching barrier structure 93 facing away from the substrate 10. Exemplarily, the multiple riveting structures 94 can be two, or three or more, without limitation. Figure 11 shows an enlarged view of one structure including multiple riveting structures 94 in the actual fabrication process. Specifically, each riveting structure 94 includes a fifth sub-part 941 and a sixth sub-part 942 connected to each other; wherein, the fifth sub-part 941 is disposed in the same layer as multiple isolation pillars 30; the sixth sub-part 942 is disposed in the same layer as the inorganic encapsulation layer in the thin film encapsulation layer 50. It should be noted that the "inorganic encapsulation layer" here includes the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53. Exemplarily, the groove corresponding to the undercut of the fifth sub-part 941 is riveted together with the protrusion of the formed inorganic encapsulation layer. In this way, the adhesion strength of the relevant film layers at the cut is improved, and even with the application of external force in subsequent processes, it is difficult to separate the relevant film layers, thereby improving the encapsulation effect.
[0072] In this embodiment of the present disclosure, the display substrate further includes a touch function layer 95 disposed on the side of the thin film encapsulation layer 50 away from the substrate 10; along the direction away from the substrate 10, the touch function layer 95 includes a third metal layer 951, a touch insulating layer 952 and a fourth metal layer 953 disposed sequentially; the third metal layer 951 and / or the fourth metal layer 953 at least cover the area between two adjacent isolation pillars 30.
[0073] In a specific implementation, the display substrate also includes a touch functional layer 95 disposed on the side of the thin-film encapsulation layer 50 facing away from the substrate 10. For example, the various film layers of the touch functional layer 95 can be directly fabricated on the thin-film encapsulation layer 50, and the touch functional layer 95 is disposed within the film layer structure, thus eliminating the need for a separate touch substrate. This ensures both a thin and lightweight design of the display substrate and its touch functionality. Furthermore, along the direction facing away from the substrate 10, the touch functional layer 95 includes a third metal layer 951, a touch insulating layer 952, and a fourth metal layer 953 disposed sequentially. For example, an organic insulating material can be used to prepare the touch insulating layer 952. The specific arrangement of the touch functional layer 95 is described in related technologies and will not be detailed here. Additionally, the third metal layer 951 and / or the fourth metal layer 953 at least cover the area between two adjacent isolation pillars 30. In this way, even if there is a gap at the undercut of the isolation pillar 30 when the inorganic layer material is filmed on the isolation pillar 30 in the packaging structure, the gap can be effectively blocked by the third metal layer 951 and / or the fourth metal layer 953, which can effectively prevent water vapor from entering along the plane perpendicular to the substrate 10, thereby improving the packaging effect.
[0074] In one exemplary embodiment, still referring to FIG2, the third metal layer 951 at least covers the area between two adjacent isolation pillars 30. Exemplarily, FIG12 shows an enlarged view of one structure including the third metal layer 951 at the edge of the hole during actual fabrication.
[0075] In one exemplary embodiment, as shown in FIG13, the fourth metal layer 953 covers at least the area between two adjacent isolation pillars 30.
[0076] In one exemplary embodiment, the third metal layer 951 and the fourth metal layer 953 at least cover the area between two adjacent isolation pillars 30.
[0077] It should be noted that, in this embodiment, the display substrate may further include a post spacer (PS) layer (not shown in the figure) disposed on the side of the second planarization layer 23 facing away from the substrate 10. For example, the barrier dam 20 in this embodiment may be composed of a first planarization layer 21, a second planarization layer 23, a pixel definition layer 25, and a post spacer layer. Furthermore, unless otherwise specified, the plurality of isolation pillars 30, barrier structures 40, at least one groove 70, plurality of power-off structures 92, etching barrier structures 93, and plurality of riveting structures 94 in this embodiment are all disposed around the via H.
[0078] In addition, in this embodiment, the display substrate, besides including the aforementioned film layer structures, may also include a touch protection layer 96 and a leveling layer 97 located on the side of the touch functional layer 95 facing away from the substrate 10, thereby effectively filling the step differences in the related film layer structures while protecting the touch functional layer 95. For example, the leveling layer 97 can be prepared using inkjet printing. The display substrate may also include a filter layer 98, an adhesive layer 99, and a protective cover plate 100 sequentially disposed on the side of the leveling layer 97 facing away from the substrate 10. For example, the filter layer 98 can be a polarizer or a color filter. Polarizers are generally thicker. When the filter layer 98 uses a color filter, a Color Filter On Encapsulation (COE) technology is employed, thereby ensuring a thinner and lighter design for the display substrate. Of course, the display substrate provided in this embodiment may include other film layer structures besides those described above, depending on the actual application requirements, and is not limited here.
[0079] In this embodiment, the substrate 10 is a rigid substrate. Exemplarily, the substrate 10 can be a silicon-based substrate or a glass-based substrate, and is not limited thereto. This improves the structural stability of the display substrate.
[0080] Based on the same disclosed concept, this disclosure also provides a display device, which includes:
[0081] The display substrate as described in any of the preceding items;
[0082] The sensor is positioned at the location corresponding to the via H.
[0083] For example, the sensor is at least one of a camera, an optical sensor, a handset, or other similar devices.
[0084] Since the principle by which this display device solves the problem is similar to that of the aforementioned display substrate, the implementation of this display device can refer to the implementation of the aforementioned display substrate, and the repeated parts will not be described again.
[0085] In specific implementation, the display device provided in the embodiments of the present invention can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of this display device are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting the present invention.
[0086] Although preferred embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.
[0087] Obviously, those skilled in the art can make various modifications and variations to this disclosure without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.
Claims
1. A display substrate, wherein, include: A substrate with a via is provided, a barrier dam located in the periphery region of the via, a plurality of isolation pillars located on the side of the barrier dam away from the display area, a barrier structure located on the side of the plurality of isolation pillars away from the barrier dam, and a thin film encapsulation layer located on the side of the barrier dam away from the substrate; wherein, the periphery region of the via is arranged around the via, and the display area is arranged around the periphery region of the via. The thin-film encapsulation layer covers the display area and extends through the barrier dam and the plurality of isolation pillars to the side of the barrier structure opposite to the substrate; at least one inorganic layer is disposed between the plurality of isolation pillars and the substrate; the barrier structure is used to block the propagation of cutting cracks.
2. The display substrate as claimed in claim 1, wherein, The barrier structure includes at least one groove formed on the side of the at least one inorganic layer away from the substrate, the at least one groove and an organic layer completely filling the at least one groove together forming the barrier structure; each of the grooves penetrates at least a portion of the film layer of the at least one inorganic layer.
3. The display substrate as described in claim 2, wherein, The barrier structure further includes a first metal layer located between the organic layer and the at least one inorganic layer, the first metal layer covering the at least one groove.
4. The display substrate as claimed in claim 1, wherein, The at least one inorganic layer is multilayered, and the barrier structure includes a second metal layer disposed between two adjacent inorganic layers in the multilayered inorganic layers.
5. The display substrate as claimed in claim 4, wherein, The barrier structure also includes an organic layer located on the side of the multilayer inorganic layer opposite to the substrate.
6. The display substrate according to any one of claims 1-5, wherein, It also includes a plurality of intermittently arranged power-off structures disposed on the side of the barrier structure away from the barrier dam. The plurality of power-off structures are completely covered by the thin film encapsulation layer, and along the direction perpendicular to the plane where the substrate is located, the distance between the surface of each power-off structure away from the substrate and the substrate is greater than the distance between the surface of the plurality of isolation pillars away from the substrate and the substrate.
7. The display substrate as claimed in claim 6, wherein, It also includes an organic layer located on the side of the at least one inorganic layer facing away from the substrate; the organic layer has a recessed structure in the periphery of the hole located between two adjacent power-off structures; along the direction facing away from the substrate, each power-off structure includes a first sub-part and a second sub-part arranged sequentially, the second sub-part is arranged in the same layer as the plurality of isolation pillars, the first sub-part is arranged in the same layer as the organic layer, and is adjacent to the recessed structure on one side surface of the same power-off structure, the edge of the first sub-part coincides with the edge of the recessed structure, and the orthogonal projection of the edge of the second sub-part on the substrate completely falls within the area of the orthogonal projection of the recessed structure on the substrate.
8. The display substrate as claimed in claim 7, wherein, It also includes an etched barrier structure located on the side of the plurality of power-off structures away from the barrier dam, the etched barrier structure including a third sub-section disposed in the same layer as the organic layer.
9. The display substrate as claimed in claim 8, wherein, The etching barrier structure further includes a fourth sub-part disposed on the same layer as the at least one inorganic layer. The fourth sub-part and the third sub-part are disposed opposite to the substrate in sequence, and the orthographic projections of the third sub-part and the fourth sub-part on the substrate overlap each other.
10. The display substrate as claimed in claim 8 or 9, wherein, It also includes a plurality of riveting structures located on the side of the etching barrier structure away from the substrate, each of the riveting structures including a fifth sub-section and a sixth sub-section connected to each other; the fifth sub-section is disposed in the same layer as the plurality of isolation pillars; the sixth sub-section is disposed in the same layer as the inorganic encapsulation layer in the thin film encapsulation layer.
11. The display substrate according to any one of claims 1-5 and 7-9, wherein, It also includes a touch function layer disposed on the side of the thin film encapsulation layer away from the substrate; along the direction away from the substrate, the touch function layer includes a third metal layer, a touch insulating layer and a fourth metal layer disposed sequentially; the third metal layer and / or the fourth metal layer at least cover the area between two adjacent isolation pillars.
12. The display substrate according to any one of claims 1-5 and 7-9, wherein, The substrate is a rigid substrate.
13. A display device, wherein, include: The display substrate as described in any one of claims 1-12; The sensor is positioned at the location corresponding to the via.