Display module and display apparatus

Abstract

The present disclosure relates to the technical field of display, and provides a display module and a display apparatus. The display module of the present disclosure comprises a display substrate, a circuit board bonded to a backlight side of the display substrate, and a shielding cover. The shielding cover comprises a top cover and a side wall connected to the edge of the top cover. The top cover and the side wall form a shielding space for accommodating an electronic component on the circuit board. The end portion of the side wall away from the top cover has connection regions and non-connection regions that are alternately arranged. The shielding cover further comprises a connection portion, and the connection portion is connected to the end portions of the side wall in the connection regions; the connection portion is fixedly connected to the circuit board.

Description

Display modules and display devices Technical Field

[0001] This disclosure belongs to the field of display technology, specifically relating to a display module and a display device. Background Technology

[0002] The display module contains a flexible printed circuit (FPC). The electronic components inside the FPC generate electromagnetic waves and heat during operation. Therefore, the display module needs to be shielded to protect the electronic components of the FPC and isolate them from the external environment. Summary of the Invention

[0003] This disclosure aims to at least solve one of the technical problems existing in the prior art, and to provide a display module and a display device.

[0004] In a first aspect, the technical solution adopted to solve the technical problem of this disclosure is a display module, including a display substrate, a circuit board bonded to the backlight side of the display substrate, and a shielding cover; the shielding cover includes a top cover and a side wall connected to the edge of the top cover; the top cover and the side wall form a shielding space for accommodating electronic components on the circuit board;

[0005] The sidewall has alternating connecting and non-connecting areas at its end away from the top cover; the shield also includes a connecting portion connected to the end of the sidewall located in the connecting area; the connecting portion is used for fixed connection with the circuit board.

[0006] In some embodiments, the top cover has a first opening extending through its thickness direction, the first opening extending in the same direction as the connecting portion; the first opening is used for dispensing adhesive to seal the electronic component.

[0007] In some embodiments, the sidewall includes a first sidewall and a second sidewall disposed opposite to each other along a first direction, and a third sidewall and a fourth sidewall disposed opposite to each other along a second direction; the first direction and the second direction are intersecting.

[0008] The connecting portion includes a first sub-segment and a second sub-segment; the first sub-segment is connected to the first sidewall, and the second sub-segment is connected to the second sidewall.

[0009] In some embodiments, the distance from the first opening to the first sidewall is less than the distance from the first opening to the second sidewall.

[0010] In some embodiments, the third sidewall has a plurality of first heat dissipation holes extending through its thickness direction; the fourth sidewall has a plurality of second heat dissipation holes extending through its thickness direction; the first heat dissipation holes and the second heat dissipation holes are symmetrically arranged.

[0011] In some embodiments, the sidewall includes a first sidewall and a second sidewall disposed opposite to each other along a first direction, and a third sidewall connecting a first end of the first sidewall and a first end of the second sidewall; the connecting portion includes a first sub-segment and a second sub-segment; the first sub-segment is connected to the first sidewall, and the second sub-segment is connected to the second sidewall.

[0012] In some embodiments, the shielding cover further includes a shielding membrane disposed on the side of the top cover opposite to the shielding space; the shielding membrane covers the first opening.

[0013] In some embodiments, the shielding film includes a first conductive cloth and a first insulating layer disposed sequentially along a direction away from the top cover.

[0014] In some embodiments, the top cover, the sidewall, and the connecting portion are connected as a single integral structure.

[0015] In some embodiments, the shielding cover further includes a second opening that extends sequentially through the second sub-segment, a portion of the second sidewall connected to the second sub-segment, and the top cover in a third direction; the second opening is used to detect the sealing condition of the electronic component.

[0016] In some embodiments, the circuit board has a component configuration area and a pad area located at the edge of the component configuration area; the circuit board includes electronic components located in the component configuration area and pads located in the pad area; the pads are fixedly connected to the connection portion.

[0017] In some embodiments, the sidewall includes a first sidewall and a second sidewall disposed opposite to each other along a first direction, and a third sidewall and a fourth sidewall disposed opposite to each other along a second direction; the first direction and the second direction are intersecting; the connecting portion includes a first sub-segment and a second sub-segment; the first sub-segment is connected to the first sidewall, and the second sub-segment is connected to the second sidewall;

[0018] The pad area includes a first sub-pad area and a second sub-pad area, which are located on two opposite sides of the component configuration area in the first direction, respectively; the circuit board includes a first pad located in the first sub-pad area and a second pad located in the second sub-pad area; the first pad is fixedly connected to the first sub-segment, and the second pad is fixedly connected to the second sub-segment.

[0019] In some embodiments, the display module further includes a driver chip disposed on the side of the circuit board near the display substrate; the driver chip is bonded to the display substrate in a first bonding area; the circuit board is bonded to the display substrate in a second bonding area;

[0020] The first bonding area and the second bonding area are respectively located on two opposite sides of the driver chip in the second direction, and the second bonding area is closer to the display area of ​​the display substrate than the first bonding area.

[0021] In some embodiments, the display module further includes a conductive tape disposed on the side of the top cover away from the shielding space; the conductive tape includes a second conductive cloth, a heat dissipation layer, and a second insulating layer disposed sequentially along the direction away from the top cover;

[0022] The second conductive cloth is in direct contact with the top cover.

[0023] In some embodiments, the conductive tape further includes a third insulating layer disposed between the top cover and the second conductive cloth, the third insulating layer having a fourth opening that exposes a portion of the top cover, through which the second conductive cloth contacts the top cover.

[0024] In some embodiments, the conductive tape extends along the second direction to the location where the display substrate is exposed by the circuit board; the location where the display substrate is exposed by the circuit board includes a conductive structure;

[0025] The third insulating layer also has a fifth opening, which exposes a portion of the display substrate, and the second conductive cloth contacts the conductive structure through the fifth opening.

[0026] Secondly, embodiments of this disclosure also provide a display device, including a display module as described in any one of the first aspects. Attached Figure Description

[0027] Figure 1 is a schematic diagram of the display module of Example 1 provided in the present disclosure in the YOZ section;

[0028] Figure 2 is a schematic diagram of the display module in Example 1 provided in the embodiments of this disclosure in the XOZ section;

[0029] Figure 3 is a top view of the shielding cover provided in Example 1 of the present disclosure;

[0030] Figure 4 is a schematic diagram of the end of the sidewall away from the top cover provided in an embodiment of this disclosure;

[0031] Figure 5 is a cross-sectional view of the structure shown in Figure 3 along the A-A' direction;

[0032] Figure 6 is a cross-sectional view of the structure shown in Figure 3 along the B-B' direction;

[0033] Figure 7 is a top view of the shielding cover in Example 2 provided in the embodiments of this disclosure;

[0034] Figure 8 is a schematic diagram of the shielding cover in Example 3 provided in the embodiments of this disclosure;

[0035] Figure 9 is a cross-sectional view along the C-C' direction in Figure 8;

[0036] Figure 10 is a schematic diagram of the shielding cover in Example 4 provided in the embodiments of this disclosure;

[0037] Figure 11 is a cross-sectional view along the D-D' direction in Figure 10;

[0038] Figure 12 is a schematic diagram of the display module of Example 2 provided in the embodiments of this disclosure;

[0039] Figure 13 is a schematic diagram of the display module of Example 3 provided in the embodiments of this disclosure;

[0040] Figure 14 is a schematic diagram of the display module of Example 4 provided in the embodiments of this disclosure;

[0041] Figure 15 is a schematic diagram of the display module of Example 5 provided in the embodiments of this disclosure;

[0042] Figure 16 is a schematic diagram of the display module of Example 6 provided in the embodiments of this disclosure. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. The components of the embodiments of this disclosure described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this disclosure provided in the accompanying drawings is not intended to limit the scope of the claimed disclosure, but merely represents selected embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0044] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0045] In this disclosure, "multiple or several" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0046] It should be noted that in this disclosure, the first direction X, the second direction Y, and the third direction Z intersect each other. In this disclosure, the first direction X and the second direction Y are perpendicular to each other in the plane of the base, the first direction X is horizontal, the second direction Y is vertical, and the third direction Z is vertical, which is perpendicular to the plane of the base. However, this does not constitute a limitation on this disclosure.

[0047] In related technologies, on the one hand, the shielding cover structure is relatively large, and the distance between its inner wall and the electronic components on the FPC board is relatively far. Under limited space, it is particularly difficult to use the shielding cover to apply adhesive to the electronic components. Skirts need to be set around the shielding cover for welding and fixing to the FPC board. However, this design is not conducive to the reduction of FPC board size due to the limitation of skirt size, especially to the reduction of the bonding area in the reverse bonding display module (see the second bonding area B2 below), thus restricting the increase of the overall battery compartment space. On the other hand, the heat dissipation effect of the existing shielding cover is not strong. The temperature of the electronic components on the FPC board rises. If the heat dissipation is not fast enough, it will lead to damage to the electronic components and increased heat radiation, affecting product performance.

[0048] In view of this, embodiments of the present disclosure provide a display module and a display device that substantially eliminate one or more of the problems caused by the limitations and defects of related technologies. For ease of understanding, the shielding cover will first be described in detail.

[0049] In a first aspect, the present disclosure provides a display module. Figure 1 is a schematic diagram of the display module of Example 1 provided in the present disclosure in the YOZ section; Figure 2 is a schematic diagram of the display module of Example 1 provided in the present disclosure in the XOZ section; Figure 3 is a top view of the shielding cover of Example 1 provided in the present disclosure; Figure 4 is a schematic diagram of the end of the side wall away from the top cover provided in the present disclosure; Figure 5 is a cross-sectional view of the structure shown in Figure 3 in the A-A' direction; and Figure 6 is a cross-sectional view of the structure shown in Figure 3 in the B-B' direction.

[0050] As shown in Figures 1 and 2, the display module includes a display substrate 200, a circuit board 300 bonded to the backlight side of the display substrate 200, and a shielding cover 100. As shown in Figures 3 to 5, the shielding cover 100 includes a top cover 1 and a side wall 2 connected to the edge of the top cover 1. The top cover 1 and the side wall 2 form a shielding space Q, which is used to accommodate electronic components 301 on the circuit board 300 to shield the external environment from the influence of the external environment on the electronic components 301 inside the shielding space Q.

[0051] As shown in Figure 4, the end 20 of the sidewall 2 away from the top cover 1 has alternating connecting areas 201 and non-connecting areas 202. As shown in Figures 3, 4, and 6, the shielding cover 100 also includes a connecting portion 3, which is connected to the end 20 of the sidewall 2 located in the connecting area 201. The connecting portion 3 is fixedly connected to the circuit board 300. Specifically, as shown in Figures 1 and 2, the circuit board 300 has a component placement area (not shown) and a pad area (not shown) located at the edge of the component placement area. The circuit board 300 includes electronic components 301 located in the component placement area and pads 302 located in the pad area. The pads 302 are fixedly connected to the connecting portion 3. The circuit board 300 is bonded to the display substrate 200 through an adhesive layer 7. Here, the pads 302 are correspondingly arranged with the connecting portion 3. The shape, position, and size of the pads 302 determine the shape, position, and size of the connecting portion 3 on the shielding cover 100. The size of the pads 302 is larger than the size of the connecting portion 3, which facilitates soldering and fixing during the process.

[0052] The number and position of the connection areas 201 are related to the outline shape of the shielding cover 100. The outline shape of the shielding cover 100 is related to the shape of the circuit board 300 to be shielded. For example, the circuit board 300 includes a component placement area and other areas besides the component placement area (e.g., pad areas and / or second bonding areas B2, etc.). The component placement area mainly houses electronic components 301. If the shape of the component placement area is circular, then the outline shape of the orthographic projection of the top cover 1 on the horizontal reference plane is quasi-circular. "Quasi-circular" refers to a regular circle or an irregular shape that is approximately circular. If the shape of the component placement area is rectangular, then the outline shape of the orthographic projection of the top cover 1 on the horizontal reference plane is quasi-rectangular. "Quasi-rectangular" refers to a regular rectangle or an approximately rectangular polygon. As shown in Figure 3, the four main side extension lines of the top cover 1 can form a rectangle, which is referred to as quasi-rectangular in this disclosure. This embodiment of the disclosure uses the example of the outline shape of the orthographic projection of the top cover 1 on the horizontal reference plane being quasi-rectangular for illustration.

[0053] Optionally, as shown in Figures 4 and 6, the end of the sidewall 2 away from the top cover 1 has two oppositely arranged connection areas 201, and each connection area 201 has a corresponding connection part 3 connected to it at its end. The two connection parts 3 are arranged opposite to each other. Optionally, the two connection parts 3 are symmetrically arranged about a first center line R1 as an axis of symmetry. The first center line R1 is a reference line that extends along a third direction Z and passes through the center of the shield 100.

[0054] Optionally, as shown in Figure 6, the connecting portion 3 protrudes outward from the shielding space Q, and the surface S1 of the connecting portion 3 that is connected to the side wall 2 and away from the top cover 1 is fixedly connected to the electronic board during the assembly stage. Optionally, the dimension of the connecting portion 3 in the first direction X is between 0.05 mm and 0.15 mm. For example, the dimension of the connecting portion 3 in the first direction X is 0.05 mm, 0.1 mm, or 0.15 mm.

[0055] In this embodiment of the disclosure, since the shield 100 includes at least a pair of opposite sides without connecting parts 3, as shown in FIG1, the two opposite sidewalls 2 in the second direction Y are not provided with connecting parts 3. Therefore, the shield 100 can be reduced in the second direction Y, specifically by shortening the width of the two connecting parts 3. At the same time, the circuit board 300 below the shield 100 can also be reduced in size in the second direction Y during the design process, thereby freeing up some space and expanding the space of the battery compartment MQ for battery installation.

[0056] Optionally, as shown in Figure 2, the size of the pad in the first direction X is between 0.35 mm and 0.45 mm. For example, the size of the pad in the first direction X is 0.35 mm, 0.4 mm, or 0.45 mm.

[0057] Optionally, as shown in Figure 2, the horizontal distance L3 from the edge of the first opening 4 near the first sidewall 21 to the nearest electronic component 301 is between 0.25mm and 0.35mm, which facilitates dispensing.

[0058] In some embodiments, as shown in FIG3, the top cover 1 has a first opening 4 extending through its thickness direction, and the extending direction of the first opening 4 is the same as the extending direction of the connecting portion 3; as shown in FIG6, during the assembly stage, the first opening 4 is used for dispensing adhesive to seal the electronic component 301. Here, the extending direction of the first opening 4 is the second direction Y.

[0059] In this embodiment, on the one hand, the first opening 4 is located in the top cover 1. Therefore, during the assembly stage, the shielding cover 100 can be fixed first, and then the electronic component 301 can be sealed by applying adhesive through the first opening 4. This can limit the space of the sealant and avoid the problem of the shielding space Q being occupied by applying adhesive first and then welding the shielding cover 100. On the other hand, the extension direction of the first opening 4 is the same as the extension direction of the connecting part 3, which means that the length direction of the first opening 4 is the second direction Y, and the width direction of the first opening 4 is the first direction X. Therefore, the width of the first opening 4 occupies the overall size of the shielding cover 100 in the first direction X. Even if it increases, it will not affect the size in the second direction Y. That is, the size in the second direction Y will remain in a reduced state. In the subsequent assembly stage, the space in the second direction Y is provided for the battery compartment. Therefore, this design of the first opening 4 will not occupy the space of the battery compartment.

[0060] It should be noted that the actual location of the first opening 4 is related to the concentration of electronic components 301 on the circuit board 300. For example, the concentration or dense location of electronic components 301 on the circuit board 300 may be directly opposite the first opening 4. Alternatively, the location of electronic components 301 on the circuit board 300 that are more affected by the external environment may be directly opposite the first opening 4.

[0061] In some embodiments, as shown in Figures 3, 5, and 6, the sidewall 2 includes a first sidewall 21 and a second sidewall 22 disposed opposite to each other along a first direction X, and a third sidewall 23 and a fourth sidewall 24 disposed opposite to each other along a second direction Y; the first direction X and the second direction Y are intersecting, for example, the first direction X and the second direction Y are perpendicular to each other; the connecting portion 3 includes a first sub-segment 31 and a second sub-segment 32; the first sub-segment 31 is connected to the first sidewall 21, and the second sub-segment 32 is connected to the second sidewall 22.

[0062] In this embodiment, a rectangular shielding cover 100 is used as an example. The end of the first sidewall 21 away from the top cover 1 is connected to the first sub-segment 31, and the end of the second sidewall 22 away from the top cover 1 is connected to the second sub-segment 32. The first sub-segment 31 and the second sub-segment 32 are arranged opposite to each other and are used to fix them to the circuit board 300 during the assembly stage. The third sidewall 23 and the fourth sidewall 24 are not connected to the connecting part 3, so as to reduce the size of the shielding cover 100 in the second direction Y, and thus reduce the size of the circuit board 300 in the second direction Y, so as to free up some space for the battery compartment.

[0063] Optionally, as shown in Figure 3, the distance from the first opening 4 to the first sidewall 21 (denoted as the first distance L1) is less than the distance from the first opening 4 to the second sidewall 22 (denoted as the second distance L2).

[0064] Optionally, as shown in Figure 3, the dimension (length) of the first opening 4 in the second direction Y is between 3.2mm and 3.4mm, for example, 3.3mm; the dimension (width) of the first opening 4 in the first direction X is between 0.75mm and 0.85mm, for example, 0.8mm. Optionally, the size of the first opening 4 is 0.8mm × 3.3mm.

[0065] Optionally, the dimensions of the first segment 31 and the second segment 32 in the second direction Y are the same. Optionally, the dimensions of the first sidewall 21 and the second sidewall 22 in the second direction Y are the same. Optionally, the dimension of the first segment 31 in the second direction Y is smaller than the dimension of the first sidewall 21 in the second direction Y; the dimension of the second segment 32 in the second direction Y is smaller than the dimension of the second sidewall 22 in the second direction Y.

[0066] Optionally, as shown in FIG3, the first sidewall 21 and the second sidewall 22 have the same dimensions in the second direction Y. For example, the dimensions of the first sidewall 21 and the second sidewall 22 in the second direction Y are 5.6 mm to 6.6 mm. Optionally, as shown in FIG3, the third sidewall 23 and the fourth sidewall 24 have the same dimensions in the first direction X. For example, the dimensions of the third sidewall 23 and the fourth sidewall 24 in the first direction X are 5.6 mm to 6.6 mm.

[0067] In some embodiments, the display module using the shield 100 of Example 1, as shown in FIG2, includes a first sub-pad area (not shown) and a second sub-pad area (not shown), which are located on opposite sides of the component placement area in the first direction X, respectively; the circuit board 300 includes a first pad 3021 located in the first sub-pad area and a second pad 3022 located in the second sub-pad area; the first pad 3021 is fixedly connected to the first sub-segment 31, and the second pad 3022 is fixedly connected to the second sub-segment 32.

[0068] Optionally, as shown in Figures 1 and 2, the display module further includes a driver chip 400 disposed on the side of the circuit board 300 near the display substrate 200; the orthographic projection of the shield 100 on the display substrate 200 at least partially overlaps with the orthographic projection of the driver chip 400 on the display substrate 200. The driver chip 400 is bonded to the display substrate 200 in a first bonding area B1; the circuit board 300 is bonded to the display substrate 200 in a second bonding area B2 (connected via a third pad 500); the first bonding area B1 and the second bonding area B2 are respectively located on two opposite sides of the driver chip 400 in the second direction Y, and the second bonding area B2 is closer to the display area of ​​the display substrate 200 (not shown in the figures) than the first bonding area B1.

[0069] Here, as shown in Figure 1, the first bonding area B1 and the second bonding area B2 are located on opposite sides of the driver chip 400 in the second direction Y. As shown in Figure 2, the first sub-pad area and the second sub-pad area are located on opposite sides of the component placement area in the first direction X. Therefore, the relative directions of the bonding areas are opposite to the relative directions of the sub-pad areas. Thus, the increased size due to the welding of the first sub-segment 31 to the first pad 3021 and the increased size due to the welding of the second sub-segment 32 to the second pad 3022 will not affect the length of the second bonding area B2. At the same time, since the circuit board 300 does not have pads in the second direction Y, after reducing the pad size, the second bonding area B2 can be moved inward toward the side closer to the electronic component 301, thereby achieving an overall reduction in the size of the circuit board 300 in the second direction Y, thus releasing some reverse bonding space, and further expanding the space of the battery compartment MQ for battery installation.

[0070] It should be noted that, as shown in Figure 1, the so-called "reverse bonding display module" means that the bonding position (second bonding area B2) between the circuit board 300 and the display substrate 200 is located on the left side of the driver chip 400, and the bonding position (first bonding area B1) between the driver chip 400 and the display substrate 200 is located on the right side of the driver chip 400. The "forward reverse bonding display module" has the exact opposite bonding relationship to the "reverse bonding display module," that is, the bonding position (second bonding area B2) between the circuit board 300 and the display substrate 200 is located on the right side of the driver chip 400, and the bonding position (first bonding area B1) between the driver chip 400 and the display substrate 200 is located on the left side of the driver chip 400.

[0071] In some embodiments, FIG7 is a top view of the shielding cover under Example 2 provided in the present disclosure. As shown in FIG7, the third sidewall 23 has a plurality of first heat dissipation holes 231 extending along its thickness direction; the fourth sidewall 24 has a plurality of second heat dissipation holes 232 extending along its thickness direction; the first heat dissipation holes 231 and the second heat dissipation holes 232 are symmetrically arranged, and their axis of symmetry is a second center line R2 extending along the third direction Z and passing through the center of the shielding cover 100.

[0072] Optionally, the first heat dissipation hole 231 and the second heat dissipation hole 232 have the same shape and size. Optionally, both the first heat dissipation hole 231 and the second heat dissipation hole 232 are circular holes with a diameter between 0.5mm and 1.5mm. For example, the diameter of the circular hole is 0.5mm, 1mm, or 1.5mm. Optionally, there are multiple first heat dissipation holes 231 arranged in an array. The hole spacing between two adjacent first heat dissipation holes 231 is between 0.5mm and 1.5mm. For example, the hole spacing is 0.5mm, 1mm, or 1.5mm. Optionally, there are multiple second heat dissipation holes arranged in an array. The hole spacing between two adjacent second heat dissipation holes 232 is between 0.5mm and 1.5mm. For example, the hole spacing is 0.5mm, 1mm, or 1.5mm.

[0073] In this embodiment, the third sidewall 23 and the fourth sidewall 24 are arranged opposite each other along the second direction Y, and the first heat dissipation hole 231 and the second heat dissipation hole 232 are symmetrical through holes, which is beneficial for subsequent heat dissipation of electronic components 301 in the shielded space Q. At the same time, the smaller hole diameter helps to prevent electromagnetic interference leakage while ensuring a certain heat dissipation area.

[0074] Of course, the shapes of the first heat dissipation hole 231 and the second heat dissipation hole 232 can also be selected from various regular shapes such as triangles, quadrilaterals, pentagons, and hexagons, or irregularly shaped holes with smaller sizes. Without departing from the specific structural features of this embodiment, the shape of the heat dissipation hole can be modified and improved in various ways, and these modifications and improvements are also considered to be within the scope of protection of this disclosure. This disclosure chooses circular heat dissipation holes mainly because circular heat dissipation holes are simpler to process and have less impact on electromagnetic shielding performance.

[0075] The difference between the shield 100 in Example 2 and Example 1 is that it has added heat dissipation holes. The other structures are the same, and the repeated parts will not be described again.

[0076] In some embodiments, FIG8 is a schematic diagram of the shielding cover under Example 3 provided in the present disclosure, and FIG9 is a cross-sectional view in the C-C' direction of FIG8. As shown in FIG8 and FIG9, the sidewall 2 includes a first sidewall 21 and a second sidewall 22 disposed opposite to each other along the first direction X, and a third sidewall 23 connecting the first end 211 of the first sidewall 21 and the first end 221 of the second sidewall 22; the connecting part 3 includes a first sub-segment 31 and a second sub-segment 32; the first sub-segment 31 is connected to the first sidewall 21, and the second sub-segment 32 is connected to the second sidewall 22.

[0077] The difference between the shielding cover 100 in Example 3 and Example 1 is that the second end 212 of the first sidewall 21 and the second end 222 of the second sidewall 22 are not connected. The sidewall 2 in Example 3 only includes three sides.

[0078] Optionally, as shown in FIG8, the first sidewall 21 and the second sidewall 22 have the same dimensions in the second direction Y. For example, the dimensions of the first sidewall 21 and the second sidewall 22 in the second direction Y are 4.8 mm to 5.8 mm. Optionally, as shown in FIG8, the third sidewall 23 and the fourth sidewall 24 have the same dimensions in the first direction X. For example, the dimensions of the third sidewall 23 and the fourth sidewall 24 in the first direction X are 5.6 mm to 6.6 mm.

[0079] In this embodiment, a rectangular shielding cover 100 is used as an example. The end of the first sidewall 21 away from the top cover 1 is connected to the first sub-segment 31, and the end of the second sidewall 22 away from the top cover 1 is connected to the second sub-segment 32. The first sub-segment 31 and the second sub-segment 32 are arranged opposite to each other and are used to fix the circuit board 300 during the assembly stage. The third sidewall 23 is not connected to the connecting part 3, which can reduce the size of the shielding cover 100 in the second direction Y. At the same time, the side of the shielding cover 100 opposite to the third sidewall 23 is hollowed out, that is, the fourth sidewall 24 is not provided. Therefore, the size of the shielding cover 100 in the second direction Y can be further reduced, and thus the size of the circuit board 300 in the second direction Y can be reduced to free up some space for the battery compartment.

[0080] In addition, the perforation on the side of the shielding cover 100 opposite to the third sidewall 23 not only further reduces the size of the shielding cover 100 in the second direction Y, but also facilitates heat dissipation for the electronic components 301 within the shielding space Q. It should be noted that the electronic components 301 will be fully encapsulated in adhesive during the subsequent assembly stage, and the perforation, combined with the shielding structure covered during the assembly stage (conductive tape 8 as shown in Figure 16), will not affect the shielding performance of the shielding cover 100.

[0081] Optionally, as shown in Figure 8, the distance from the second end 212 of the first sidewall 21 to the end of the first sub-segment 31 away from the third sidewall 23 is less than the distance from the first end 211 of the first sidewall 21 to the end of the first sub-segment 31 near the third sidewall 23. Similarly, the distance from the second end 222 of the second sidewall 22 to the end of the second sub-segment 32 away from the third sidewall 23 is less than the distance from the first end 221 of the second sidewall 22 to the end of the second sub-segment 32 near the third sidewall 23.

[0082] Optionally, the second end 212 of the first sidewall 21 is aligned with the end of the first sub-segment 31 away from the third sidewall 23. The first end 211 of the first sidewall 21 is aligned with the end of the first sub-segment 31 near the third sidewall 23. The second end 222 of the second sidewall 22 is aligned with the end of the second sub-segment 32 away from the third sidewall 23. The first end 221 of the second sidewall 22 is aligned with the end of the second sub-segment 32 near the third sidewall 23.

[0083] Optionally, as shown in Figure 8, the distance from the first opening 4 to the first sidewall 21 (denoted as the first distance L1) is less than the distance from the first opening 4 to the second sidewall 22 (denoted as the second distance L2).

[0084] Optionally, as shown in Figure 8, the dimension (length) of the first opening 4 in the second direction Y is between 3.2mm and 3.4mm, for example, 3.3mm; the dimension (width) of the first opening 4 in the first direction X is between 0.75mm and 0.85mm, for example, 0.8mm. Optionally, the size of the first opening 4 is 0.8mm × 3.3mm.

[0085] In some embodiments, FIG10 is a schematic diagram of the shielding cover under Example 4 provided in the present disclosure. As shown in FIG10, the shielding cover 100 further includes a shielding film 5 disposed on the side of the top cover 1 away from the shielding space Q, and the shielding film 5 covers the first opening 4. Compared with Examples 1 to 3 above, the shielding cover 100 of Example 4 can further improve the shielding performance of the shielding cover 100 by using the shielding film 5 to cover the first opening 4.

[0086] Optionally, Figure 11 is a cross-sectional view along the D-D' direction in Figure 10. As shown in Figure 11, the shielding film 5 includes a first conductive cloth 51 and a first insulating layer 52 arranged sequentially along the direction away from the top cover 1. The first conductive cloth 51 can electromagnetically shield the external environment from the electronic components 301 within the shielded space Q, and also provides anti-static properties. Specifically, the first conductive cloth 51 has metallic properties and is in direct contact with the shielding cover 100, which also has metallic properties, thus reducing electromagnetic interference and static electricity accumulation. Simultaneously, the first insulating layer 52 is superimposed on the first conductive cloth 51 to protect it.

[0087] Optionally, the first insulating layer 52 is Mylar sheet, which has dimensional stability, flatness and excellent tear strength, heat and cold resistance, moisture and water resistance, chemical corrosion resistance, and super insulation properties, as well as excellent electrical, mechanical, heat resistance and chemical resistance properties, which are beneficial to protecting the first conductive cloth 51.

[0088] The shielding film 5 in this embodiment can be applied to the structure of the shielding cover 100 in Example 2 (as shown in Figure 7) and the structure of the shielding cover 100 in Example 3 (as shown in Figure 8). The structural features of each example are described in detail in the above embodiments, and repeated parts will not be repeated.

[0089] In some embodiments, as shown in Figures 3, 7, and 8, the top cover 1, side wall 2, and connecting portion 3 are connected as a single-piece structure, which facilitates maintaining a shorter distance between the inner wall of the shield 100 and the electronic component 301. Simultaneously, the single-piece shield 100 is easier to manufacture and assemble, saving on process costs.

[0090] In some embodiments, as shown in FIG3, FIG8 or FIG10, the shield 100 further includes a second opening 6, which passes through the second sub-segment 32, the portion of the second sidewall 22 connected to the second sub-segment 32 and the top cover 1 in a third direction Z. During the assembly stage, the second opening 6 is used to detect the sealing condition of the electronic component 301 to determine the quality of the adhesive sealing of the electronic component 301 and avoid defective outflow.

[0091] In this embodiment, the second opening 6 is located on the opposite side of the first opening 4, which can improve the accuracy of seal detection.

[0092] Optionally, as shown in Figure 10, the shielding film 5 covers at least a portion of the second opening 6 located in the top cover 1, further improving the sealing performance.

[0093] Optionally, as shown in Figure 3 or Figure 8, the dimension of the second opening 6 in the first direction X is between 0.75mm and 0.85mm, for example, 0.8mm. The dimension of the second opening 6 in the second direction Y is between 0.75mm and 0.85mm, for example, 0.8mm. Optionally, the size of the second opening 6 is 0.8mm × 0.8mm.

[0094] Optionally, as shown in Figure 3 or Figure 8, the outline shape of the second opening 6 projected onto the horizontal reference plane is rectangular.

[0095] In some embodiments, the material of the shielding cover 100 may be one or more of stainless steel (SUS), nickel silver, and zinc-tin-nickel alloy, which have good weldability and heat dissipation. Optionally, the thickness of the shielding cover 100 may be 0.1 mm.

[0096] In some embodiments, FIG12 is a schematic diagram of the display module of Example 2 provided in the present disclosure. As shown in FIG12, the display module further includes a conductive tape 8 disposed on the side of the top cover 1 away from the shielding space Q; the conductive tape 8 includes a second conductive cloth 81, a heat dissipation layer 82 and a second insulating layer 83 arranged sequentially along the direction away from the top cover 1; the second conductive cloth 81 is in direct contact with the top cover 1. In this embodiment, the conductive tape 8 is superimposed on the shielding cover 100, which can be used to further improve the shielding performance and heat dissipation capacity of the shielding cover 100.

[0097] The second conductive cloth 81 is in direct contact with the top cover 1, which can electromagnetically shield the influence of the external environment on the electronic components 301 in the shielded space Q, as well as provide anti-static properties. Specifically, the second conductive cloth 81 has metallic properties and is in direct contact with the shielding cover 100, which also has metallic properties, thus reducing electromagnetic interference and static electricity accumulation.

[0098] Furthermore, a heat dissipation layer 82 is superimposed on the second conductive cloth 81, which is beneficial for heat dissipation. For example, the material of the heat dissipation layer 82 can be graphene with high thermal conductivity and high thermal emissivity to further improve the heat dissipation capacity.

[0099] Furthermore, a second insulating layer 83 is superimposed on the heat dissipation layer 82 to protect the heat dissipation layer 82. For example, the second insulating layer 83 is a Mylar sheet.

[0100] Optionally, the thickness of the second conductive cloth 81 is between 19µm and 21µm; the thickness of the heat dissipation layer 82 is between 16µm and 18µm; and the thickness of the second insulating layer 83 is between 9µm and 11µm. For example, a stack of 20µm thick conductive cloth + 17µm thick graphene + 10µm thick Mylar sheet can be used to achieve an integrated design for heat dissipation, shielding, and reinforcement.

[0101] In some embodiments, FIG13 is a schematic diagram of the display module of Example 3 provided in the present disclosure. As shown in FIG13, the display module further includes a conductive tape 8 disposed on the side of the top cover 1 away from the shielding space Q. The conductive tape 8 includes a third insulating layer 84, a second conductive cloth 81, a heat dissipation layer 82, and a second insulating layer 83 disposed sequentially along the direction away from the top cover 1. The third insulating layer 84 has a third opening 841, which exposes a portion of the top cover 1, and the second conductive cloth 81 contacts the top cover 1 through the third opening 841. In this embodiment, the conductive tape 8 is superimposed on the shielding cover 100, which can be used to further improve the shielding performance and heat dissipation capacity of the shielding cover 100.

[0102] A third insulating layer 84 is attached to the top cover 1 to protect the top cover 1 and improve the impact resistance of the shield 100. For example, the third insulating layer 84 is Mylar sheet.

[0103] Furthermore, a second conductive cloth 81 is superimposed on the third insulating layer 84. The second conductive cloth 81 contacts the top cover 1 through the third opening 841 on the third insulating layer 84, which can electromagnetically shield the influence of the external environment on the electronic components 301 in the shielded space Q, as well as provide antistatic protection. Specifically, the second conductive cloth 81 has metallic properties and is in direct contact with the shielding cover 100, which also has metallic properties, which can reduce electromagnetic interference and static electricity accumulation.

[0104] Furthermore, a heat dissipation layer 82 is superimposed on the second conductive cloth 81, which is beneficial for heat dissipation. For example, the material of the heat dissipation layer 82 can be graphene with high thermal conductivity and high thermal emissivity to further improve the heat dissipation capacity.

[0105] Furthermore, a second insulating layer 83 is superimposed on the heat dissipation layer 82 to protect the heat dissipation layer 82. For example, the second insulating layer 83 is a Mylar sheet.

[0106] Optionally, the thickness of the third insulating layer 84 is between 9µm and 11µm; the thickness of the second conductive cloth 81 is between 19µm and 21µm; the thickness of the heat dissipation layer 82 is between 16µm and 18µm; and the thickness of the second insulating layer 83 is between 9µm and 11µm. For example, a stack of 10µm thick Mylar sheet + 20µm thick conductive cloth + 17µm thick graphene + 10µm thick Mylar sheet can be used to achieve an integrated design for heat dissipation, shielding, and reinforcement.

[0107] Optionally, as shown in Figure 13, the conductive tape 8 extends along the second direction Y to the location of the display substrate 200 exposed by the circuit board 300; the location of the display substrate 200 exposed by the circuit board 300 includes a conductive structure (not shown in the figure); the third insulating layer 84 also has a fourth opening 842, which exposes a portion of the display substrate 200, and the second conductive cloth 81 contacts the conductive structure through the fourth opening 842, which can electromagnetically shield the influence of the external environment on the electronic components 301 in the shielding space Q, as well as provide antistatic properties. Specifically, the second conductive cloth 81 has metallic properties and is in direct contact with the conductive structure, which also has metallic properties, thereby reducing electromagnetic interference and static electricity accumulation. For example, the conductive structure can be a support on the back of the display substrate 200, such as exposed copper on the back (e.g., surface conductive film SCF) or a stainless steel (SUS) or copper (Cu) structure on the back of a folded product, thereby achieving an integrated grounding and heat dissipation design.

[0108] The display module of Example 1 shown in Figure 12 and the display module of Example 2 shown in Figure 13 are both described using the shielding cover 100 of Example 1 as an example. In fact, the conductive tape 8 shown in Figure 12 can also be applied to the display module with the shielding cover 100 of Example 2, as shown in Figure 14; the repeated parts will not be described again. The conductive tape 8 shown in Figure 13 can also be applied to the display module with the shielding cover 100 of Example 2, as shown in Figure 15; the repeated parts will not be described again. Alternatively, the conductive tape 8 shown in Figure 13 can also be applied to the display module with the shielding cover 100 of Example 3, as shown in Figure 16; the repeated parts will not be described again.

[0109] For example, the display module may include, but is not limited to, an organic electroluminescence display (OLED) display module, a quantum dot light-emitting diode (QLED) display module, or a micro light-emitting diode (Micro LED) display module.

[0110] In addition, this disclosure also provides a display device, which includes the display module of any of the above embodiments. This display device can be, for example, any product with display functionality such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or in-vehicle device. Other essential components of this display device are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting this disclosure.

[0111] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display module, comprising a display substrate, a circuit board bonded to the backlight side of the display substrate, and a shielding cover; the shielding cover includes a top cover and a sidewall connected to the edge of the top cover; the top cover and the sidewall form a shielding space for accommodating electronic components on the circuit board; The sidewall has alternating connecting and non-connecting areas at its end away from the top cover; the shield also includes a connecting portion connected to the end of the sidewall located in the connecting area; the connecting portion is fixedly connected to the circuit board.

2. The display module according to claim 1, wherein, The top cover has a first opening extending through its thickness direction, the first opening extending in the same direction as the connecting portion; the first opening is used for dispensing adhesive to seal the electronic component.

3. The display module according to claim 2, wherein, The sidewall includes a first sidewall and a second sidewall arranged opposite to each other along a first direction, and a third sidewall and a fourth sidewall arranged opposite to each other along a second direction; the first direction and the second direction are intersecting. The connecting portion includes a first sub-segment and a second sub-segment; the first sub-segment is connected to the first sidewall, and the second sub-segment is connected to the second sidewall.

4. The display module according to claim 3, wherein, The distance from the first opening to the first sidewall is less than the distance from the first opening to the second sidewall.

5. The display module according to claim 3, wherein, The third sidewall has a plurality of first heat dissipation holes extending through its thickness direction; the fourth sidewall has a plurality of second heat dissipation holes extending through its thickness direction; the first heat dissipation holes and the second heat dissipation holes are symmetrically arranged.

6. The display module according to claim 1, wherein, The sidewall includes a first sidewall and a second sidewall disposed opposite to each other along a first direction, and a third sidewall connecting a first end of the first sidewall and a first end of the second sidewall; the connecting portion includes a first sub-segment and a second sub-segment; the first sub-segment is connected to the first sidewall, and the second sub-segment is connected to the second sidewall.

7. The display module according to any one of claims 2 to 6, wherein, The shielding cover also includes a shielding film disposed on the side of the top cover opposite to the shielding space; the shielding film covers the first opening.

8. The display module according to claim 7, wherein, The shielding film includes a first conductive cloth and a first insulating layer arranged sequentially in a direction away from the top cover.

9. The display module according to any one of claims 1 to 6, wherein, The top cover, the side wall, and the connecting part are connected as a single integral structure.

10. The display module according to any one of claims 3 to 6, wherein, The shielding cover also includes a second opening, which extends sequentially through the second sub-segment, the portion of the second sidewall connected to the second sub-segment, and the top cover in a third direction; the second opening is used to detect the sealing condition of the electronic components.

11. The display module according to claim 1, wherein, The circuit board has a component placement area and a pad area located at the edge of the component placement area; the circuit board includes electronic components located in the component placement area and pads located in the pad area; the pads are fixedly connected to the connection portion.

12. The display module according to claim 11, wherein, The sidewall includes a first sidewall and a second sidewall arranged opposite to each other along a first direction, and a third sidewall and a fourth sidewall arranged opposite to each other along a second direction; the first direction and the second direction are intersecting; the connecting part includes a first sub-segment and a second sub-segment; the first sub-segment is connected to the first sidewall, and the second sub-segment is connected to the second sidewall; The pad area includes a first sub-pad area and a second sub-pad area, which are located on two opposite sides of the component configuration area in the first direction, respectively; the circuit board includes a first pad located in the first sub-pad area and a second pad located in the second sub-pad area; the first pad is fixedly connected to the first sub-segment, and the second pad is fixedly connected to the second sub-segment.

13. The display module according to claim 12, wherein, The display module further includes a driver chip disposed on the side of the circuit board near the display substrate; the driver chip is bonded to the display substrate in a first bonding area; the circuit board is bonded to the display substrate in a second bonding area; The first bonding area and the second bonding area are respectively located on two opposite sides of the driver chip in the second direction, and the second bonding area is closer to the display area of ​​the display substrate than the first bonding area.

14. The display module according to claim 12 or 13, wherein, The display module further includes a conductive tape disposed on the side of the top cover away from the shielding space; the conductive tape includes a second conductive cloth, a heat dissipation layer and a second insulating layer disposed sequentially along the direction away from the top cover. The second conductive cloth is in direct contact with the top cover.

15. The display module according to claim 14, wherein, The conductive tape further includes a third insulating layer disposed between the top cover and the second conductive cloth. The third insulating layer has a fourth opening that exposes a portion of the top cover, and the second conductive cloth contacts the top cover through the fourth opening.

16. The display module according to claim 15, wherein, The conductive tape extends along the second direction to the location where the display substrate is exposed by the circuit board; the location where the display substrate is exposed by the circuit board includes a conductive structure; The third insulating layer also has a fifth opening, which exposes a portion of the display substrate, and the second conductive cloth contacts the conductive structure through the fifth opening.

17. A display device comprising a display module as claimed in any one of claims 1 to 16.

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