Display apparatus, display panel and manufacturing method therefor

Abstract

A display apparatus, a display panel and a manufacturing method therefor. The display panel comprises a driving backplane, a plurality of light-emitting devices, a pixel definition layer, and a cut-off layer. Each light-emitting device comprises a first electrode, a light-emitting layer, and a second electrode. The pixel definition layer is provided with a plurality of pixel openings, each pixel opening exposing one first electrode. The pixel definition layer comprises a defining layer and a protective layer covering the defining layer, wherein the protective layer is made of an inorganic material. The cut-off layer is arranged on the surface of the pixel definition layer away from the driving backplane, and is provided with a plurality of cut-off holes overlapping with the pixel openings in a one-to-one correspondence mode. The light-emitting layer and the second electrode of each light-emitting device are located within a region surrounded by a corresponding cut-off hole. The sidewall of each cut-off hole is provided with a cut-off groove surrounding the corresponding pixel opening that overlaps with the cut-off hole. The second electrode within each cut-off hole is in contact with the cut-off layer, and at least part of the second electrode is electrically connected by means of the cut-off layer. Costs may be reduced.

Description

Display device, display panel and manufacturing method thereof

[0001] Cross-referencing

[0002] This disclosure claims priority to Chinese Patent Application No. 202510127886.4, filed on January 27, 2025, entitled “Display Device, Display Panel and Method of Manufacturing Thereof,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of display technology, and more specifically, to a display device, a display panel, and a method for manufacturing the display panel. Background Technology

[0004] Currently, self-emissive display panels using light-emitting diodes as light-emitting devices have been widely used, but their manufacturing process is complex and requires high-end equipment, resulting in high production costs.

[0005] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0006] This disclosure provides a display device, a display panel, and a method for manufacturing the display panel.

[0007] According to one aspect of this disclosure, a display panel is provided, comprising:

[0008] Drive backplane;

[0009] Multiple light-emitting devices are disposed on the driving backplate, and each light-emitting device includes a first electrode, a light-emitting layer, and a second electrode stacked sequentially in a direction away from the driving backplate.

[0010] A pixel definition layer is disposed on the same surface as the light-emitting device on the driving backplate; the pixel definition layer has a plurality of pixel openings, one of the pixel openings exposes a first electrode, and the light-emitting layer of the light-emitting device is stacked on the first electrode exposed by one of the pixel openings; the pixel definition layer includes a defining layer and a protective layer covering the defining layer; the material of the protective layer includes an inorganic material;

[0011] A cut-off layer is disposed on the surface of the pixel definition layer away from the driving backplate, and has a plurality of cut-off holes that overlap with each of the pixel openings. The light-emitting layer and the second electrode of the light-emitting device are located within the area surrounded by one of the cut-off holes. The sidewall of the cut-off hole is provided with a cut-off groove surrounding the pixel opening that overlaps with it. The second electrode in the cut-off hole is in contact with the cut-off layer, and at least a portion of the second electrode is electrically connected through the cut-off layer.

[0012] In one exemplary embodiment of this disclosure, the protective layer includes a first protective sublayer and a second protective sublayer; the first protective sublayer covers the defining layer; the second protective sublayer covers the first protective sublayer and extends to the surface of the first electrode away from the drive backplate.

[0013] In one exemplary embodiment of this disclosure, the cut-off layer includes a conductive layer and a shielding layer stacked sequentially in a direction away from the drive backplate, the shielding layer and the conductive layer being made of different materials; the cut-off groove is located in the conductive layer; a second electrode in the cut-off hole extends into the cut-off groove and contacts the conductive layer.

[0014] In one exemplary embodiment of this disclosure, the depth of the cut-off groove decreases in the direction away from the drive backplate.

[0015] In one exemplary embodiment of this disclosure, the display panel further includes:

[0016] The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer. The first inorganic layer covers the second electrode and the cut-off layer and extends continuously at the cut-off groove. The organic layer is disposed on the surface of the first inorganic layer away from the drive backplane, and the second inorganic layer covers the organic layer.

[0017] In one exemplary embodiment of this disclosure, the light-emitting device includes at least three light-emitting devices with different light-emitting colors, and the depth of the cut-off groove of the cut-off hole that overlaps with the pixel openings of two light-emitting devices with different light-emitting colors is different.

[0018] In one exemplary embodiment of this disclosure, the light-emitting device includes a first light-emitting device that emits red light, a second light-emitting device that emits green light, and a third light-emitting device that emits blue light; the depth of the cut-off groove of the cut-off hole overlapping the pixel opening corresponding to the first light-emitting device is a first depth; the depth of the cut-off groove of the cut-off hole overlapping the pixel opening corresponding to the second light-emitting device is a second depth; and the depth of the cut-off groove of the cut-off hole overlapping the pixel opening corresponding to the third light-emitting device is a third depth.

[0019] The first depth is greater than the second depth, and the second depth is greater than the third depth.

[0020] In one exemplary embodiment of this disclosure, the first depth is not less than 0.3 μm and not greater than 1.5 μm; the second depth is not less than 0.3 μm and not greater than 1.2 μm; and the third depth is not less than 0.3 μm and not greater than 1 μm.

[0021] In one exemplary embodiment of this disclosure, the light-emitting device includes an adjacent first light-emitting device and a second light-emitting device;

[0022] The display panel further includes a light-emitting extension, which is stacked on the surface of the cut-off layer away from the driving backplate and located between two adjacent light-emitting devices; the second electrode includes an electrode extension that covers the light-emitting extension and is disconnected from the second electrode;

[0023] The light-emitting extension includes a first light-emitting extension disposed in the same layer as the light-emitting layer of the first light-emitting device and disconnected, and a second light-emitting extension disposed in the same layer as the light-emitting layer of the second light-emitting device and disconnected; the boundary of the first light-emitting extension away from the first light-emitting device and the boundary of the second light-emitting extension away from the second light-emitting device are connected.

[0024] In one exemplary embodiment of this disclosure, the light-emitting device includes an adjacent first light-emitting device and a second light-emitting device;

[0025] The display panel further includes a light-emitting extension, which is stacked on the surface of the cut-off layer away from the driving backplate and located between two adjacent light-emitting devices; the second electrode includes an electrode extension that covers the light-emitting extension and is disconnected from the second electrode;

[0026] The sidewalls of the electrode extension and the light-emitting extension it covers taper away from the drive backplate.

[0027] According to one aspect of this disclosure, a method for manufacturing a display panel is provided, comprising:

[0028] Forming a drive backplate;

[0029] The first electrodes of multiple light-emitting devices are formed on the driving backplate;

[0030] A defining layer is formed covering each of the first electrodes, the defining layer having a defining opening that corresponds to each of the first electrodes;

[0031] A protective layer is formed covering the defining layer and the first electrode exposed by the defining opening, the material of the protective layer including inorganic materials;

[0032] A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive back plate, and each cut-off hole overlaps with each defined opening in a one-to-one correspondence; each cut-off hole is divided into at least n groups, where n is a positive integer not less than 2;

[0033] The device steps are performed sequentially for each group of cut-off holes, and the device steps include:

[0034] A cut-off groove is formed on the sidewall of the cut-off hole, surrounding and overlapping the defined opening therewith;

[0035] Remove at least a portion of the protective layer covering the first electrode within the cut-off hole to expose the first electrode;

[0036] A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the cut-off hole, the light-emitting layer being broken at the cut-off groove;

[0037] A second electrode is formed covering the light-emitting layer, the second electrode being disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and electrically connected through the cut-off layer.

[0038] In one exemplary embodiment of this disclosure, before performing the device step for the (i+1)th group of cut-off holes, the manufacturing method further includes:

[0039] When performing the device steps for the i-th group of cut-off holes, the second electrode and the light-emitting layer formed in the (i+1)-th group of cut-off holes are removed, 1≤i≤n.

[0040] In one exemplary embodiment of this disclosure, a protective layer is formed covering the defining layer and the first electrode exposed by the defining opening; comprising:

[0041] A first protective sublayer is formed, covering the defining layer and the first electrode exposed by the defining opening;

[0042] The first protective sublayer is patterned, and the first protective sublayer defining the bottom of the opening is removed, so that the first protective sublayer exposes the first electrode.

[0043] A second protective sublayer is formed that covers the first protective sublayer and the first electrode exposed by the first protective sublayer.

[0044] In one exemplary embodiment of this disclosure, a cut-off layer having a plurality of cut-off holes is formed on the surface of the protective layer away from the drive backplate; including:

[0045] A conductive layer is formed covering the protective layer;

[0046] A shielding layer is formed covering the conductive layer; the shielding layer and the conductive layer are made of different materials;

[0047] Multiple cut-off holes are made that penetrate the shielding layer and the conductive layer, and each cut-off hole corresponds to and overlaps with each defined opening.

[0048] In one exemplary embodiment of this disclosure, a cut-off groove is formed on the sidewall of the cut-off hole, surrounding and overlapping a defined opening; including:

[0049] The conductive layer is etched inside the cut-off hole to form a cut-off groove.

[0050] In one exemplary embodiment of this disclosure, the device step further includes:

[0051] A first inorganic layer is formed covering the second electrode, and the first inorganic layer extends continuously at the cut-off groove.

[0052] In one exemplary embodiment of this disclosure, after performing the device step for the nth group of cut-off holes, the manufacturing method further includes:

[0053] An organic layer is formed on the surface of the first inorganic layer away from the drive backplate;

[0054] A second inorganic layer is formed covering the organic layer.

[0055] In one exemplary embodiment of this disclosure, n equals 3, and the cut-off holes include a first group of cut-off holes, a second group of cut-off holes, and a third group of cut-off holes; the light-emitting layers in any two groups of the first group of cut-off holes, the second group of cut-off holes, and the third group of cut-off holes emit different colors.

[0056] According to one aspect of this disclosure, a method for manufacturing a display panel is provided, comprising:

[0057] Forming a drive backplate;

[0058] The first electrodes of multiple light-emitting devices are formed on the driving backplate;

[0059] A defining layer is formed covering each of the first electrodes, the defining layer having a defining opening that corresponds to each of the first electrodes;

[0060] A protective layer is formed covering the defining layer and the first electrode exposed by the defining opening, the material of the protective layer including inorganic materials;

[0061] A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive back plate, and each cut-off hole overlaps with each defined opening in a one-to-one correspondence; each cut-off hole is divided into a first group and a second group, and the cut-off holes in the second group include the first group and the second group.

[0062] A cut-off groove is formed on the sidewall of the first set of cut-off holes, surrounding and overlapping the defined opening therewith;

[0063] Remove at least a portion of the protective layer covering the first electrode within the first set of cut-off holes to expose the first electrode;

[0064] A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the first set of cut-off holes, the light-emitting layer being broken at the cut-off groove;

[0065] A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer;

[0066] Remove the light-emitting layer and the second electrode formed in the second set of cut-off holes when the light-emitting layer and the second electrode are formed in the first set of cut-off holes;

[0067] A cut-off groove is formed on the sidewall of the second set of cut-off holes, surrounding and overlapping the defined opening therewith;

[0068] Remove at least part of the protective layer covering the first electrode within the second set of cut-off holes to expose the first electrode;

[0069] A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the first group of cut-off holes, the light-emitting layer being broken at the cut-off groove;

[0070] A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer;

[0071] When the light-emitting layer and the second electrode are formed in the cut-off holes of the first group, the light-emitting layer and the second electrode formed in the cut-off holes of the second group are removed, exposing the first electrode;

[0072] A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the cut-off holes in the second group, the light-emitting layer being broken at the cut-off groove;

[0073] A second electrode is formed covering the light-emitting layer, the second electrode being disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and electrically connected through the cut-off layer.

[0074] According to one aspect of this disclosure, a method for manufacturing a display panel is provided, comprising:

[0075] Forming a drive backplate;

[0076] The first electrodes of multiple light-emitting devices are formed on the driving backplate;

[0077] A defining layer is formed covering each of the first electrodes, the defining layer having a defining opening that corresponds to each of the first electrodes;

[0078] A protective layer is formed covering the defining layer and the first electrode exposed by the defining opening, the material of the protective layer including inorganic materials;

[0079] A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive back plate, and each cut-off hole overlaps with each defined opening in a one-to-one correspondence; each cut-off hole is divided into a first group, a second group and a third group;

[0080] A cut-off groove is formed on the sidewall of each of the cut-off holes, surrounding and overlapping the defined opening therewith;

[0081] Remove at least a portion of the protective layer covering the first electrode to expose the first electrode;

[0082] A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the first set of cut-off holes, the light-emitting layer being broken at the cut-off groove;

[0083] A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer;

[0084] When the light-emitting layer and the second electrode are formed in the first set of cut-off holes, the light-emitting layer and the second electrode formed in the second and third sets of cut-off holes are removed, exposing the first electrode;

[0085] A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the second set of cut-off holes, the light-emitting layer being broken at the cut-off groove;

[0086] A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer;

[0087] When the light-emitting layer and the second electrode are formed in the second set of cut-off holes, the light-emitting layer and the second electrode formed in the third set of cut-off holes are removed, exposing the first electrode;

[0088] A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the third set of cut-off holes, the light-emitting layer being broken at the cut-off groove;

[0089] A second electrode is formed covering the light-emitting layer, the second electrode being disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and electrically connected through the cut-off layer.

[0090] According to one aspect of this disclosure, a display device is provided, comprising the display panel described in any of the preceding claims.

[0091] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0092] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0093] Figure 1 is a top view schematic diagram of one embodiment of the display panel of this disclosure.

[0094] Figure 2 is a cross-sectional schematic diagram of one embodiment of the display panel of this disclosure.

[0095] Figure 3 is a schematic diagram of the light-emitting layer in one embodiment of the display panel of this disclosure.

[0096] Figure 4 is a schematic diagram of the light-emitting layer in another embodiment of the display panel of this disclosure.

[0097] Figures 5-24 are cross-sectional schematic diagrams corresponding to some steps in the first embodiment of the first type of display panel of this disclosure.

[0098] Figures 25 and 26 are cross-sectional schematic diagrams corresponding to some steps in the second embodiment of the first type of display panel of this disclosure.

[0099] Figure 27 is a cross-sectional schematic diagram of some steps in the second type of embodiment of the display panel of this disclosure. Detailed Implementation

[0100] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0101] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0102] In this paper, the "overlap" of features A and B means that the orthographic projections of features A and B on a plane at least partially coincide; the plane can be the surface of the drive backplate or other planes parallel to the drive backplate.

[0103] This disclosure provides a display panel, as shown in FIG1, which can be divided into at least a display area AA and an outer peripheral area WA located outside the display area AA. The outer peripheral area WA can be a continuous annular area surrounding the display area AA, or it can be a discontinuous area surrounding the display area AA. For example, the outer peripheral area WA can be distributed on both sides of the display area AA. The display area AA can be used to emit light to display images, while the outer peripheral area WA does not emit light.

[0104] As shown in Figure 2, the display panel may include a driving backplate BP and multiple light-emitting devices (LDs) disposed on one side of the driving backplate BP, wherein:

[0105] The driving backplane (BP) has a driving circuit that drives the light-emitting diode (LD) to emit light to display an image. In some embodiments of this disclosure, the driving backplane (BP) may include a substrate (SU) and a circuit layer located on one side of the substrate (SU). The substrate (SU) may be a flat plate structure, and its material may be a rigid material such as glass or a flexible material such as polyimide. Furthermore, the substrate (SU) may be a single-layer or multi-layer structure.

[0106] The circuit layer includes the aforementioned driving circuitry. For example, the driving circuitry may include pixel circuitry located in display area AA and peripheral circuitry located in peripheral area WA. The pixel circuitry can be a 7T1C, 8T1C, or similar structure, as long as it can drive the light-emitting diode (LD) to emit light. No special limitations are placed on its structure here. Here, nTmC indicates that one pixel circuit includes n thin-film transistors (represented by the letter "T") and m capacitors (represented by the letter "C"). The number of pixel circuits can be the same as the number of LDs, and they are connected one-to-one with each LD. Of course, multiple LDs can be connected to the same pixel circuit; no special limitations are placed here.

[0107] The peripheral circuit is connected to the pixel circuit and is used to input driving signals to the pixel circuit in order to control the light-emitting device (LD) to emit light. The peripheral circuit may include a gate driving circuit and a light-emitting control circuit, and of course, it may also include other circuits. The specific structure of the peripheral circuit is not specifically limited here.

[0108] As shown in Figure 2, in some embodiments of this disclosure, the circuit layer may include a transistor layer TL and a connection layer CL stacked on the side of the transistor layer TL away from the substrate SU. The thin-film transistors and capacitors of the driving circuit may be located in the transistor layer TL. The thin-film transistors may be top-gate or bottom-gate type thin-film transistors. Each thin-film transistor may include an overlapping active layer and a gate. The active layers of each thin-film transistor are disposed on the same semiconductor layer; or, the active layers of different thin-film transistors may be distributed on different semiconductor layers. The material of the semiconductor layer may be polycrystalline silicon or metal oxide, without special limitation.

[0109] Taking a top-gate thin-film transistor as an example, the transistor layer TL may include a semiconductor layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, and an interlayer dielectric layer, which are stacked sequentially along the direction away from the substrate SU. The active layer of each thin-film transistor is located on the semiconductor layer, the gate is located on the gate layer, and the two plates of the capacitor are located on the first gate layer and the second gate layer. The interconnect layer CL may include at least one source / drain layer and a planarization layer. The surface of the planarization layer farthest from the substrate SU is the surface of the driving backplate BP used to mount the light-emitting device LD.

[0110] Each source / drain layer SD is covered by a planarization layer PLN to achieve planarization. Connections can be established between at least some thin-film transistors and between thin-film transistors and capacitors through the source / drain layers SD to transmit drive signals. The type of drive signal and the specific pattern of each film layer depend on the specific configuration of the drive circuit and are not specifically limited here. For example, there may be one source / drain layer SD and one planarization layer PLN, with the source / drain layer SD stacked on the surface of the transistor layer TL away from the substrate SU, and the planarization layer PLN covering the source / drain layer SD; or, there may be two source / drain layers SD and two planarization layers PLN, including a first source / drain layer, a first planarization layer, a second source / drain layer, and a second planarization layer stacked sequentially in a direction away from the substrate SU, with the second source / drain layer disposed on the surface of the first planarization layer away from the substrate SU. Further, the first source / drain layer may be covered by a passivation layer, and the first planarization layer covers the passivation layer.

[0111] As shown in Figure 2, the light-emitting device (LD) can be stacked on the driving backplane (BP). For example, the LD can be stacked on the surface of the planar layer (PLN) furthest from the substrate (SU). Simultaneously, the LD is located within the display area (AA). It can be an OLED (Organic Light-Emitting Diode) using organic light-emitting materials, or a Mini LED (sub-millimeter light-emitting diode, size 100μm-200μm), Micro LED (micro light-emitting diode, size no larger than 100μm), or LED (light-emitting diode, size larger than 200μm) using inorganic light-emitting materials. No special limitations are imposed here, as long as it can emit light.

[0112] As shown in Figure 2, taking OLED as an example, the light-emitting device LD may include a first electrode ANO, a light-emitting layer EL, and a second electrode CAT stacked sequentially in the direction away from the driving backplane BP. By applying an electrical signal to the first electrode ANO and the second electrode CAT, the light-emitting layer EL can be excited to emit light. The specific light-emitting principle will not be described in detail here.

[0113] The first electrode ANO can serve as the anode, and its material can include conductive materials such as metals and metal oxides, for example, metals such as Ti (titanium), Al (aluminum), Mg (magnesium), and Ag (silver), and of course, metal oxides such as ITO (indium tin oxide). Furthermore, the first electrode ANO can be a single-layer or multi-layer structure. For example, the first electrode ANO may include a first metal layer, a second metal layer, and a third metal layer stacked sequentially along a direction away from the driving backplane BP, where the first and third metal layers are made of Ti, and the second metal layer is made of Al.

[0114] The second electrode CAT can serve as a cathode, and its material can include conductive materials such as metals and metal oxides, for example, metals such as Al (aluminum), Mg (magnesium), Ag (silver), and Yb (ytterbium); it can also include metal oxides such as IZO (indium zinc oxide) and ITO; it can also be metal oxides doped with other elements, such as aluminum-doped zinc oxide (AZO), fluorine-doped tin oxide (FTO), antimony-doped tin oxide (ATO), gallium-doped zinc oxide (GZO), etc. Of course, zinc oxide can also be doped with other elements, or titanium oxide (TiO2) doped with other elements; for example, the second electrode CAT can include a first conductive layer, a second conductive layer, and a third conductive layer stacked sequentially in a direction away from the driving backplane BP. The material of the first conductive layer is either Al or Mg, or an alloy of the two, the material of the second conductive layer is IZO, and the material of the third conductive layer is Al2O3.

[0115] As shown in Figures 3 and 4, the light-emitting layer EL may include at least one light-emitting sublayer. A light-emitting sublayer may include a hole transport layer HTL, a light-emitting material layer EML, and an electron transport layer ETL stacked sequentially along a direction away from the driving backplane BP. The light-emitting sublayer may also include a hole injection layer HIL and an electron injection layer EIL distributed along a direction away from the driving backplane BP, with the hole transport layer HTL, the light-emitting material layer EML, and the electron transport layer ETL distributed between the hole injection layer HIL and the electron injection layer EIL along a direction away from the driving backplane BP. Furthermore, for multiple light-emitting sublayers, a charge generation layer CGL may be provided between adjacent light-emitting sublayers, and adjacent light-emitting sublayers are electrically connected through this charge generation layer CGL. The specific structure of the light-emitting layer EL is not specifically limited here, as long as it can cooperate with the first electrode ANO and the second electrode CAT to emit light.

[0116] In addition, an electron blocking layer (EBL) can be placed between the hole transport layer (HTL) and the luminescent material layer (EML) to block electrons; alternatively, a luminescent functional layer (Prime) can be placed between the hole transport layer (HTL) and the luminescent material layer (EML), which can be made of amines, biphenyls, naphthalenes, or other materials, to reduce the potential barrier, block electrons, and improve luminous efficiency; a hole blocking layer (HBL) can also be placed between the electron transport layer (ETL) and the luminescent material layer (EML) to block holes.

[0117] In some embodiments of this disclosure, each light-emitting sublayer in the same light-emitting device (LD) can emit light, and the light-emitting color of each light-emitting sublayer in the same light-emitting device (LD) can be the same. The brightness can be improved by using multiple light-emitting sublayers.

[0118] It should be noted that this article only describes the implementation of multiple light-emitting devices (LDs) with different emission colors. However, this disclosure does not exclude other situations. For example, different light-emitting sub-layers of the same light-emitting device LD emit different colors, and different light-emitting devices LDs emit the same color. In this case, a color filter layer can be provided on the side of the light-emitting device LD away from the driving backplate BP. The color filter layer has filter parts with different colors. One filter part overlaps with one light-emitting device LD, so that color display can be achieved through the color filter layer + light-emitting device LD.

[0119] As shown in Figure 2, the display panel may further include a pixel definition layer (PDL) separating light-emitting devices (LDs). The PDL may be disposed on the same surface as the LDs on the driving backplane (BP). For example, the PDL and the first electrodes (ANOs) may be disposed on the surface of the planar layer furthest from the substrate (SU). Simultaneously, the thickness of the PDL is greater than the thickness of the first electrodes (ANOs), and the PDL has pixel openings (PH) exposing each of the first electrodes (ANOs), with one pixel opening (PH) exposing one first electrode (ANO). Furthermore, a pixel opening (PH) is smaller than the first electrode (ANO) it exposes; that is, the PDL extends to the surface of the first electrode (ANO) furthest from the driving backplane (BP), covering the edge of the first electrode (ANO).

[0120] As shown in Figure 2, the light-emitting layer EL and the second electrode CAT are stacked sequentially on the first electrode ANO within the pixel opening PH. In some embodiments, the light-emitting layer EL has an intermittent structure, with the light-emitting layer EL of each light-emitting device LD being independently spaced, and the light emission colors of different light-emitting devices LD can be different; the second electrode CAT of different light-emitting devices LD can be an integral structure or conductively connected.

[0121] As shown in Figure 2, each light-emitting device (LD) is defined by the pixel definition layer (PDL). The range of the pixel opening (PH) is the range of the LD; that is, the shape and size of the orthographic projection of the pixel opening (PH) onto the substrate (SU) are the same as the shape and size of the orthographic projection of the LD onto the substrate (SU). Simultaneously, the shape of the pixel opening (PH) is the shape of its orthographic projection onto the driving backplane (BP) and the substrate (SU), etc. This shape can be a rectangle or other polygon, or a circle, etc. In this paper, the definition of the shape and size of the LD is based on the shape and size of the pixel opening (PH). For example, the size of the LD is the size of its pixel opening (PH).

[0122] The aforementioned light-emitting device (LD) includes at least two types of light-emitting devices with different emission colors. Each light-emitting device (LD) can be divided into multiple light-emitting units. One light-emitting unit includes multiple light-emitting devices (LDs), and at least some of the light-emitting devices (LDs) in the same light-emitting unit emit different emission colors.

[0123] As shown in Figure 2, in some embodiments of this disclosure, each light-emitting device (LD) includes a first light-emitting device LD1, a second light-emitting device LD2, and a third light-emitting device LD3 with different light-emitting colors. For example, the first light-emitting device LD1 emits red light, the second light-emitting device LD2 emits green light, and the third light-emitting device LD3 emits blue light.

[0124] The number of light-emitting devices (LDs) for each color is multiple, but the number of LDs for different colors is not necessarily the same. For example, a light-emitting unit may include a first light-emitting device LD1, a second light-emitting device LD2, and a third light-emitting device LD3; or, a light-emitting unit may include a first light-emitting device LD1, two second light-emitting devices LD2, and a third light-emitting device LD3.

[0125] In some embodiments of this disclosure, since the lifespan of the light-emitting layer EL of light-emitting devices LDs of different emitting colors varies, the degree of luminous efficiency decay varies with the increase of luminous duration. In order to ensure that the size of the light-emitting devices LDs can be different under the condition of different luminous efficiencies, the larger size can be used to make up for the lack of luminous efficiency. For example, under the same luminous duration, in terms of the degree of luminous efficiency decay, the material emitting blue light is smaller than the material emitting red light, and the material emitting red light is smaller than the material emitting green light. Therefore, the size of the third light-emitting device LD3 can be larger than the size of the first light-emitting device LD1, and the size of the first light-emitting device LD1 can be larger than the size of the second light-emitting device LD2, so as to improve the brightness of the three in a uniform way.

[0126] Of course, the dimensions of the first light-emitting device LD1 and the second light-emitting device LD2 can also be the same, and both can be larger than the second light-emitting device LD2, or the dimensions of each light-emitting device LD can be the same.

[0127] As shown in Figure 2, to prevent corrosion from external moisture, the display panel may also include a TFE encapsulation layer, which can cover each light-emitting device (LD). For example, the TFE encapsulation layer can be a thin-film encapsulation method, which may include a first inorganic layer CVD1, an organic layer IJP, and a second inorganic layer CVD2, wherein:

[0128] The first inorganic layer CVD1 can cover each light-emitting device LD, that is, the first inorganic layer CVD1 can cover the surface of the second electrode CAT away from the driving backplane BP; the material of the first inorganic layer CVD1 can include inorganic insulating materials such as silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide.

[0129] The organic layer IJP can be disposed on the surface of the first inorganic layer CVD1 away from the driving backplane BP, and the boundary of the organic layer IJP can be defined inside the boundary of the first inorganic layer CVD1 by a barrier dam located in the peripheral region WA. At the same time, the boundary of the orthographic projection of the organic layer IJP on the driving backplane BP can be located in the peripheral region WA, ensuring that the organic layer IJP can cover each light-emitting device LD.

[0130] The second inorganic layer CVD2 can cover the organic layer IJP and the first inorganic layer CVD1, which is not covered by the organic layer IJP. The second inorganic layer CVD2 can block the intrusion of water and oxygen, and planarization is achieved by the organic layer IJP, which is fluid before curing. The material of the second inorganic layer CVD2 can include inorganic insulating materials such as silicon nitride and silicon oxide.

[0131] When forming the light-emitting layer (EL) of a display panel, a photomask is required. Light-emitting materials are deposited onto the first electrode (ANO) using processes such as vapor deposition. To achieve high resolution, high brightness, long lifespan, and low power consumption, the photomask is typically a fine metal mask (FFM) to allow for the arrayed arrangement of the EL layers and independent emission of the light-emitting diodes (LDs). However, due to limitations in materials and mesh fabrication processes, the larger the display panel, the greater the sag of the photomask under gravity, resulting in poorer pixel position accuracy (PPA). This significantly increases the risk of poor color mixing during vapor deposition, thus limiting the improvement of pixel aperture ratio and brightness.

[0132] To address this issue, the inventors have provided a solution for forming the EL (emissive electron microscope) layer without using an external photomask, thus eliminating the high costs of photomask design and fabrication, as well as the equipment costs associated with purchasing screen tensioning equipment. A detailed explanation follows:

[0133] As shown in Figure 2, a cutoff layer CSL can be set on the surface of the pixel definition layer PDL away from the driving backplane BP. Multiple cutoff holes CH are formed in the cutoff layer CSL, overlapping each other with the pixel openings PH. That is, one light-emitting device LD is exposed by another cutoff hole CH. Furthermore, cutoff grooves CHs can be formed on the sidewalls of the cutoff holes CH, surrounding the overlapping pixel openings PH, forming an undercut structure. That is, the sidewalls of the cutoff grooves CHs away from the driving backplane BP are cantilever structures. When forming the light-emitting layer EL, the cutoff layer CSL can be used as a mask to vaporize the light-emitting material. The light-emitting material cannot be continuous due to the presence of the cutoff grooves CHs and is broken at the cutoff grooves CHs, thus forming the light-emitting layer EL of a light-emitting device LD within the cutoff hole CH. The light-emitting layers EL in adjacent cutoff holes CH are cut off by the cutoff grooves CHs to achieve independent light emission.

[0134] When the second electrode CAT is formed, the second electrode CAT is also disconnected at the cut-off groove CHs. The second electrode CAT in the cut-off hole CH can contact the cut-off layer CSL. The cut-off layer CSL is at least partially conductive, so that at least part of the second electrode CAT can be electrically connected through the cut-off layer CSL, so as to transmit signals to the second electrode CAT of multiple light-emitting devices LD at the same time.

[0135] To facilitate the formation of cut-off grooves (CHs), the cut-off layer (CSL) can be a multi-layered structure, with at least two layers made of different materials. A wet etching process can be used to etch the specific material, thereby forming the undercut structure mentioned above, i.e., the cut-off grooves (CHs). Alternatively, the cut-off layer (CSL) can be a single-layer structure, with the cut-off grooves (CHs) directly formed on the sidewall of the cut-off hole (CH).

[0136] As shown in Figure 2, in some embodiments of this disclosure, the cutoff layer CSL includes a conductive layer CS1 and a shielding layer CS2 stacked sequentially along a direction away from the driving backplane BP, wherein:

[0137] The cut-off groove CHs is an annular groove surrounding the pixel opening PH and located in the conductive layer CS1. This means that the cut-off groove CHs causes the conductive layer CS1 to be recessed relative to the shielding layer CS2, forming an undercut structure. A portion of the shielding layer CS2 is a cantilever structure. The shielding layer CS2 and the conductive layer CS1 are made of different materials. For example, the conductive layer CS1 may be made of metals or alloys such as Cu (copper), Ag, Al, Mo (molybdenum), and AlNd (aluminum-neodymium alloy), and may also include metal oxides such as ITO and IZO. The shielding layer CS2 may be made of inorganic insulating materials such as silicon oxide and silicon nitride. The cut-off hole CH can penetrate through the shielding layer CS2 and the conductive layer CS1, overlapping with the pixel opening PH and being no smaller than the pixel opening PH, thus avoiding obstruction of the light-emitting device LD.

[0138] The cut-off layer CSL with cut-off holes CH can be etched by wet etching, causing the conductive layer CS1 to shrink inward, thereby forming cut-off grooves CHs. The cut-off grooves CHs have two opposing sidewalls and a bottom surface connecting the two sidewalls. The two sidewalls are distributed in a direction away from the driving backplane BP. One sidewall is the surface of the pixel definition layer PDL away from the driving backplane BP, and the other sidewall is the surface of the masking layer CS2 close to the driving backplane BP.

[0139] A cut-off layer (CSL) can be used instead of a dedicated photomask. During the deposition of the luminescent material to form the luminescent layer (EL), the luminescent material breaks off at the cut-off grooves (CHs) and cannot extend continuously. This allows for patterning of the EL layer through the cut-off holes (CHs) and grooves (CHs), eliminating the need for a photomask. Simultaneously, the cut-off grooves (CHs) also disconnect the second electrode (CAT). However, the second electrode (CAT) within the cut-off holes (CHs) can extend into the cut-off grooves (CHs) and contact the bottom surface of the grooves (CHs), i.e., contact with the conductive layer (CS1). This allows for electrical connection of the second electrodes (CAT) of different luminescent devices (LDs) through the conductive layer (CS1), enabling the simultaneous transmission of the same common power signal to multiple LDs.

[0140] The luminescent material is deposited from the side of the cut-off layer CSL away from the driving backplate BP. Furthermore, in some embodiments, the depth of the cut-off groove CHs can be reduced in the direction away from the driving backplate BP, that is, the inner wall of the cut-off groove CHs contracts in the direction away from the driving backplate BP, which can prevent the luminescent material from continuously passing through the cut-off groove CHs to the greatest extent and ensure that the luminescent layer EL can be broken at the cut-off groove CHs.

[0141] Furthermore, as shown in Figure 2, the first inorganic layer CVD1 of the encapsulation layer TFE can cover the second electrode CAT and the cut-off layer CSL. Since the light-emitting layer EL and the second electrode CAT have already filled the cut-off groove CHs to a certain extent, the first inorganic layer CVD1 can extend continuously at the cut-off groove CHs without being broken, which can prevent external water vapor and oxygen from corroding the light-emitting device LD.

[0142] Based on the aforementioned implementation method, the light-emitting layer EL and the second electrode CAT of the same light-emitting device LD can be located within the range surrounded by a cut-off hole CH, and stacked on the first electrode ANO corresponding to the cut-off hole CH.

[0143] The inventors also discovered that when using the cut-off layer (CSL) to pattern the light-emitting layer (EL), only one color of light-emitting device (LD) EL can be formed at a time, thus requiring the sequential formation of EL layers of various colors. When forming LDs of other colors, it is necessary to remove the EL layers remaining from the formation of those LDs. However, these residues are difficult to completely remove, especially within the cut-off grooves (CHs). Due to their depth, residues are more likely to remain inside, and the greater the depth, the easier it is for residues to remain. Conversely, if the depth is too shallow, it is difficult to cut off the EL layers. Therefore, the inventors proposed limiting the depth of the cut-off grooves (CHs) according to the formation order of different color EL layers to reduce the impact of residues. Specifically, for any two LDs with different emitting colors, the depth of the cut-off grooves (CHs) of the overlapping cut-off holes (PH) of their pixel openings can be different. Furthermore, the depth of the cut-off grooves (CHs) corresponding to the first formed LD can be greater than that corresponding to the later formed LD, because the later the cut-off grooves (CHs) are formed, the more likely they are to retain more luminescent material.

[0144] As shown in Figure 2, in some embodiments of this disclosure, the light-emitting device (LD) includes a first light-emitting device LD1 emitting red light, a second light-emitting device LD2 emitting green light, and a third light-emitting device emitting blue light. Different colored organic light-emitting materials have different sensitivities to temperature. Red light-emitting materials are less affected by high temperatures, followed by green light-emitting materials, while blue light-emitting materials are the most sensitive to high temperatures. Since the first light-emitting material needs to undergo multiple high-temperature processes when forming LDs of different colors sequentially, when forming three colored LDs, the first light-emitting device LD1 can be formed first, followed by the second light-emitting device LD2, and finally the third light-emitting device LD3.

[0145] For ease of description, the depth of the cut-off groove CHs of the cut-off hole CH overlapping with the pixel opening PH corresponding to the first light-emitting device LD1 can be taken as the first depth S1; the depth of the cut-off groove CHs of the cut-off hole CH overlapping with the pixel opening PH corresponding to the second light-emitting device LD2 can be taken as the second depth S2; and the depth of the cut-off groove CHs of the cut-off hole CH overlapping with the pixel opening PH corresponding to the third light-emitting device LD3 can be taken as the third depth S3.

[0146] Based on the above explanation, the first depth S1 can be greater than the second depth S2, and the second depth S2 can be greater than the third depth S3. This means the depth of the cutoff groove CHs corresponding to the final formed third light-emitting device LD3 is the smallest, and the depth of the cutoff groove CHs corresponding to the first formed first light-emitting device LD1 is the largest. Furthermore, the first depth S1 can be no less than 0.3 μm and no more than 1.5 μm; the second depth S2 can be no less than 0.3 μm and no more than 1.2 μm; and the third depth S3 can be no less than 0.3 μm and no more than 1 μm. This avoids the collapse of the shielding layer CS2 at the cutoff groove CHs, ensures that the cutoff groove CHs can cut off the light-emitting layer EL, and maximizes the compression of the space for residual light-emitting material.

[0147] The depth of the cut-off groove CHs is the maximum distance between the bottom surface and the side wall of the cut-off groove CHs. If the bottom surface contracts in a direction away from the drive back plate BP, then the depth is the distance between the boundary of the bottom surface near the drive back plate BP and the side wall of the cut-off groove CHs near that boundary.

[0148] Regarding the above-described embodiments, the inventors discovered that when creating cut-off grooves CHs on the sidewalls of the cut-off holes CH, a wet etching process is typically used. However, this process can easily damage the first electrode ANO while etching the cut-off layer CSL. Therefore, the inventors proposed a new pixel definition layer PDL structure. This structure protects the first electrode ANO during the formation of the cut-off grooves CHs. Then, during the formation of the light-emitting layer EL, the pixel definition layer PDL covering the first electrode ANO is removed, exposing the first electrode ANO, before the light-emitting layer EL is formed.

[0149] As shown in Figure 2, in some embodiments of this disclosure, the pixel definition layer PDL may include a limiting layer PD1 and a protective layer PD2, wherein:

[0150] The defining layer PD1 can be disposed on the same surface of the driving backplane BP as the light-emitting device LD. For example, the defining layer PD1 can be disposed on the surface of the planar layer PLN furthest from the substrate SU, away from the substrate SU, along with the first electrode ANO. The defining layer PD1 can be made of resin or other organic materials, and its thickness is greater than that of the first electrode ANO. The defining layer PD1 has defined openings exposing each of the first electrodes ANO, with one defined opening exposing one first electrode ANO. Simultaneously, one defined opening is smaller than the first electrode ANO it exposes; that is, the defining layer PD1 extends to the surface of the first electrode ANO away from the driving backplane BP, covering the edge of the first electrode ANO.

[0151] The protective layer PD2 covers the defining layer PD1 and extends to the surface of the first electrode ANO away from the driving backplane BP, that is, it extends into the defined opening of the defining layer PD1. The pixel opening PH is formed in the protective layer PD2, and the sidewalls of the defined opening of the defining layer PD1 surround the pixel opening PH. Meanwhile, the material of the protective layer PD2 includes inorganic materials that are not easily corroded, such as silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide. Before forming the cut-off grooves CHs, the protective layer PD2 can cover the first electrode ANO, that is, the pixel opening PH is not formed, but the thickness of the protective layer PD2 can be less than that of the defining layer PD1, thus creating a recess at the defined opening of the defining layer PD1. When forming the cut-off grooves CHs, the protective layer PD2 can protect the first electrode ANO, preventing the etching solution from corroding the first electrode ANO. After forming the cut-off grooves CHs and before forming the light-emitting layer EL, the protective layer PD2 covering the first electrode ANO can be removed to form the pixel opening PH.

[0152] Furthermore, as shown in Figure 2, in some embodiments of this disclosure, the protective layer PD2 includes a first protective sublayer PD21 and a second protective sublayer PD22, wherein:

[0153] The first protective sublayer PD21 covers the defining layer PD1 and extends into the defining opening, that is, extends to the surface of the first electrode ANO away from the driving backplane BP. The first protective sublayer PD21 exposes the first electrode ANO, that is, the first protective sublayer PD21 has a protective opening exposing the first electrode ANO, and the protective opening is smaller than the defining opening. The material of the first protective sublayer PD21 may include corrosion-resistant inorganic materials such as silicon oxide, aluminum oxide, and silicon nitride, and the thickness may be 500 angstroms to 2000 angstroms.

[0154] The second protective sublayer PD22 can cover the first protective sublayer PD21 and extend to the surface of the first electrode ANO away from the driving backplane BP, that is, extend into the protective opening. The pixel opening PH can be formed in the second protective sublayer PD22. The material of the second protective sublayer PD22 can include corrosion-resistant inorganic materials such as silicon oxide, silicon nitride, and silicon oxynitride, and the thickness can be 500 angstroms-1500 angstroms.

[0155] Under the same etching process, the etching rate of the first protective sublayer PD21 is less than the etching rate of the second protective sublayer PD22. For example, the ratio of the etching rate of the second protective sublayer PD22 to the etching rate of the first protective sublayer PD21 is greater than 2. Therefore, the first protective sublayer PD21 can be used as an etching barrier layer for the second protective sublayer PD22 to protect the organic material limiting layer PD1. When forming the cutoff trench CHs, the second protective sublayer PD22 covers the first electrode ANO, while the first protective sublayer PD21 exposes the first electrode ANO. The first electrode ANO is protected by the second protective sublayer PD22. After forming the cutoff trench CHs and before forming the light-emitting layer EL, a pixel opening PH can be opened in the second protective sublayer PD22 to expose the first electrode ANO.

[0156] As shown in Figure 2, in some embodiments of this disclosure, the display panel may further include a light-emitting extension Es, which is stacked on the surface of the cut-off layer CSL away from the driving backplane BP and located between two adjacent light-emitting devices LD; the second electrode CAT includes an electrode extension CAs that covers the light-emitting extension Es and is disconnected from the second electrode CAT.

[0157] With adjacent first light-emitting device LD1 and second light-emitting device LD2: the light-emitting extension Es includes a first light-emitting extension Es1 disposed in the same layer as the light-emitting layer EL of the first light-emitting device LD1 and disconnected, and a second light-emitting extension Es2 disposed in the same layer as the light-emitting layer EL of the second light-emitting device LD2 and disconnected; the boundary of the first light-emitting extension Es1 away from the first light-emitting device LD1 and the boundary of the second light-emitting extension Es2 away from the second light-emitting device LD2 are connected, that is, the first light-emitting extension Es1 and the second light-emitting extension Es2 do not overlap.

[0158] It should be noted that in this article, A and B "set in the same layer" means that A and B belong to different regions that are continuous or discontinuous in the same film layer. Each region can be formed at the same time. The light-emitting extension Es can be regarded as the part of the light-emitting layer EL that has not been removed, and the electrode extension CAs can be regarded as the part of the second electrode CAT that has not been removed.

[0159] Furthermore, although the above embodiments are based on the example of the presence of a light-emitting extension Es and an electrode extension CAs between the first light-emitting device LD1 and the second light-emitting device LD2, the first light-emitting device LD1 and the second light-emitting device LD2 do not specifically refer to the light-emitting devices LD that emit red and green light in the example above. Here, they refer to any two adjacent light-emitting devices LD, rather than two specific light-emitting devices LD.

[0160] As shown in Figure 2, in some embodiments of this disclosure, the sidewalls of the electrode extension CAs and the light-emitting extension Es covered by them can contract in a direction away from the driving backplate BP, that is, gradually narrow. For example, the cross-section of the electrode extension CAs and the light-emitting extension Es covered by them along the plane perpendicular to the driving backplate BP can be trapezoidal.

[0161] This disclosure also provides a method for manufacturing a display panel, which can be any of the display panels described in the above embodiments. The specific structure of the display panel will not be detailed here. In this manufacturing method, light-emitting devices (LDs) of different colors can be formed sequentially, and the cut-off grooves (CHs) can be formed in batches or simultaneously. There are multiple implementation methods. For ease of description, the manufacturing method can be divided into two categories based on the formation timing of the cut-off grooves (CHs). The first category involves the batch formation of the cut-off grooves (CHs), which can be further divided into at least two types. The second category involves the simultaneous formation of all cut-off grooves (CHs). A detailed description follows:

[0162] As shown in Figures 5-24, the first type of manufacturing method includes steps S110-S150, wherein:

[0163] Step S110: Form the drive backplane;

[0164] Step S120: Form the first electrode of multiple light-emitting devices on the driving backplane;

[0165] Step S130: Form a limiting layer covering each first electrode, the limiting layer having a limiting opening that corresponds to each first electrode;

[0166] Step S140: Form a protective layer covering the defining layer and the first electrode exposed by the defined opening, wherein the material of the protective layer includes inorganic materials;

[0167] Step S150: Form a cut-off layer with multiple cut-off holes on the surface of the protective layer away from the drive backplate, with each cut-off hole overlapping with each defined opening in a one-to-one correspondence; each cut-off hole is divided into at least n groups, where n is a positive integer not less than 2.

[0168] Step S160: Perform device steps sequentially for each group of cut-off holes; these device steps include steps S161-S162, wherein:

[0169] Step S161: Form a cut-off groove around the defined opening that overlaps with the cut-off hole on the sidewall;

[0170] Step S162: Remove at least part of the protective layer covering the first electrode inside the cut-off hole to expose the first electrode;

[0171] Step S163: Form a light-emitting layer covering the cut-off layer and the first electrode exposed by the cut-off hole, wherein the light-emitting layer is broken at the cut-off groove;

[0172] Step S164: Form a second electrode covering the light-emitting layer. The second electrode is disconnected at the cut-off groove. At least part of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer.

[0173] The first manufacturing method of the first type described above can be used to pattern the light-emitting layer EL by utilizing the cut-off layer CSL, eliminating the need for expensive photomasks and reducing production costs. At the same time, when forming the cut-off groove CHs, the first electrode ANO is protected by the protective layer PD2 to prevent corrosion, reduce the risk of abnormal light emission, and improve product yield.

[0174] The steps of the first type of manufacturing method described above are illustrated below:

[0175] In steps S110 and S120, a driving circuit can be fabricated on the substrate SU through processes such as coating, exposure, and etching to obtain a driving backplate BP. The specific structure can be referred to the above-described implementation of the display panel. The first electrode ANO of each light-emitting device LD can be fabricated on the driving backplate BP using photolithography.

[0176] As shown in Figure 5, in step S130, a limiting layer PD1 of the pixel definition layer PDL can be formed on the driving backplate BP, and patterned by processes such as exposure to form a limiting opening LH that defines and exposes the first electrode ANO; the limiting layer PD1 can be made of photoresist or other organic materials.

[0177] As shown in Figures 6 and 7, in step S140, a protective layer PD2 of the pixel definition layer PDL can be formed, wherein:

[0178] The protective layer PD2 can be a single layer or a multi-layer structure, for example:

[0179] In some embodiments of this disclosure, step S140 may include steps S140-S143, wherein:

[0180] Step S141: Form a first protective sublayer covering the limiting layer and the first electrode exposed by the limiting opening.

[0181] As shown in Figure 6, the first protective sublayer PD21 of inorganic materials can be formed by plasma-enhanced chemical vapor deposition (PECVD) or other processes.

[0182] Step S142: Pattern the first protective sublayer, remove the first protective sublayer that defines the bottom of the opening, so that the first protective sublayer exposes the first electrode.

[0183] As shown in Figure 6, the first protective sublayer PD21 can be patterned by photolithography to obtain the protective opening SH that exposes the first electrode ANO.

[0184] Step S143: Form a second protective sublayer covering the first protective sublayer and the first electrode exposed by the first protective sublayer.

[0185] As shown in Figure 7, a second protective sublayer PD22 can be formed by plasma-enhanced chemical vapor deposition or other processes, and the second protective sublayer PD22 covers the area exposed by the protected opening of the first electrode ANO.

[0186] If the protective layer PD2 is a single-layer structure, it can be directly formed to cover the limiting layer PD1 and the first electrode ANO.

[0187] As shown in Figure 8, in step S150, a cutoff layer CSL can be formed on the pixel definition layer PDL and patterned to form multiple cutoff holes CH, with each cutoff hole CH overlapping a defined opening. Simultaneously, during step S150, the protective layer PD2 continues to cover the first electrode ANO as an etching barrier layer, thus protecting the first electrode ANO.

[0188] For the cutoff layer CSL, which includes a conductive layer CS1 and a shielding layer CS2, step S150 may include steps S151-S153, wherein:

[0189] Step S151: Form a conductive layer covering the protective layer.

[0190] The conductive layer CS1 can be formed by sputtering, and the material can be a conductive material such as a metal or a metal oxide.

[0191] Step S152: Form a shielding layer covering the conductive layer; the shielding layer and the conductive layer are made of different materials.

[0192] The shielding layer CS2 was formed using a plasma-enhanced chemical vapor deposition process.

[0193] Step S153: Open multiple cut-off holes that penetrate the shielding layer and the conductive layer, with each cut-off hole corresponding to and overlapping with each defined opening.

[0194] As shown in Figure 8, patterning can be achieved through exposure and etching processes to form the cut-off hole CH that exposes the protective layer PD2. The materials of the conductive layer CS1 and the shielding layer CS2 can be referred to the implementation method of the display panel above, and will not be described in detail here.

[0195] In some embodiments of this disclosure, the light-emitting device (LD) includes n different light-emitting devices of different colors. A cut-off hole (CH) overlaps with one light-emitting device (LD). Accordingly, each cut-off hole (CH) can be divided into at least n groups, with each group of cut-off holes (CH) corresponding to a light-emitting device (LD) of one color, where n is a positive integer not less than 2. As shown in Figures 2 and 8, for example, the light-emitting device (LD) includes a first light-emitting device (LD1), a second light-emitting device (LD2), and a third light-emitting device (LD3), where n = 3. The cut-off holes (CH) are divided into 3 groups: the cut-off holes (CH) corresponding to the first light-emitting device (LD1) are in the first group, the cut-off holes (CH) corresponding to the second light-emitting device (LD2) are in the second group, and the cut-off holes (CH) corresponding to the third light-emitting device (LD3) are in the third group.

[0196] In step S160, device steps are performed sequentially for each group of cut-off holes CH. That is, device steps are performed for each group of cut-off holes CH. Each time a device step is performed, a light-emitting device LD is formed in a group of cut-off holes CH. Therefore, after performing n device steps, all light-emitting devices LD can be formed.

[0197] The above-described device steps may include steps S161-S162, wherein:

[0198] Step S161: Form a cut-off groove around the defined opening that overlaps with the cut-off hole on the sidewall of the cut-off hole.

[0199] As shown in Figure 9, the structure of the cutoff layer CSL and the cutoff groove CHs can be referred to the implementation method of the display panel above, and will not be described in detail here. Before forming the cutoff groove CHs, the area outside the cutoff groove CHs targeted by the device steps can be covered with a resist layer P1. The material of the resist layer P1 can be photoresist.

[0200] As shown in Figure 10, a set of cut-off holes CH corresponding to light-emitting devices (LDs) of the same emission color can be etched inwards using exposure and wet etching processes. For example, for a cut-off layer CSL containing a conductive layer CS1 and a shielding layer CS2, the etching solution can etch the conductive layer CS1 within the cut-off hole CH, while the inorganic shielding layer CS2 is either not etched or etched at a lower etching rate than the conductive layer CS1, thereby forming cut-off grooves CHs on the sidewalls of the cut-off hole CH. Simultaneously, other sets of cut-off holes CH are covered and filled by the resist layer P1, thus preventing the formation of cut-off grooves CHs.

[0201] Each device step targets the cut-off holes CH corresponding to the same color light-emitting device LD. However, when performing device steps on the cut-off holes CH corresponding to different light-emitting devices LD, the depth of the inward etching in step S161 can be different. As mentioned above, the first depth can be greater than the second depth, and the second depth can be greater than the third depth. That is, the depth of the cut-off groove CHs corresponding to the last formed third light-emitting device LD3 is the smallest, and the depth of the cut-off groove CHs corresponding to the first formed first light-emitting device LD1 is the largest. Furthermore, the first depth can be not less than 0.3μm and not more than 1.5μm, the second depth can be not less than 0.3μm and not more than 1.2μm, and the third depth can be not less than 0.3μm and not more than 1μm. This can both prevent the shielding layer CS2 from collapsing at the cut-off groove CHs and ensure that the cut-off groove CHs can cut off the light-emitting layer EL, and maximize the compression of the space of residual light-emitting material.

[0202] During the formation of the cut-off grooves CHs described above, the first electrode ANO is always covered by the protective layer PD2. That is, the bottom surface of the cut-off hole CH is the surface of the protective layer PD2 away from the driving backplane BP, not the surface of the first electrode ANO away from the driving backplane BP. The protective layer PD2 acts as an etching barrier layer, protecting the first electrode ANO from etching. For example, regarding the protective layer PD2 mentioned above, which includes a first protective sublayer PD21 and a second protective sublayer PD22, it is the second protective sublayer PD22 that protects the first electrode ANO.

[0203] Step S162: Remove at least part of the protective layer covering the first electrode inside the cut-off hole to expose the first electrode.

[0204] As shown in Figure 10, for the cut-off hole CH where cut-off grooves CHs are formed in step S161, the exposed protective layer PD2 can be removed to expose the first electrode ANO. For example, the area outside the cut-off hole CH where cut-off grooves CHs are formed can be covered by a resist layer P2 to expose the cut-off hole CH with cut-off grooves CHs; the material of the resist layer P2 can be photoresist; then, through exposure and dry etching processes, at least a portion of the protective layer PD2 exposed by the cut-off hole CH is removed to expose the pixel first electrode ANO, and the removed protective layer PD2 can be a second protective sublayer PD22.

[0205] Step S163: Form a light-emitting layer covering the cut-off layer and the first electrode exposed by the cut-off hole, wherein the light-emitting layer is broken at the cut-off groove.

[0206] As shown in Figure 11, a light-emitting layer EL of a certain color can be formed on the cut-off layer CSL after step S162 using a vacuum evaporation device. The light-emitting layer EL is broken at the cut-off grooves CHs. Simultaneously, the light-emitting layer EL extends into the cut-off holes CH where the cut-off grooves CHs are not formed, and extends continuously. However, since the first electrode ANO corresponding to the cut-off hole CH where the cut-off grooves CHs are not formed is still covered by the protective layer PD2, the light-emitting layer EL does not contact the first electrode ANO covered by the protective layer PD2. In this way, it can be ensured that the light-emitting layer EL only contacts the first electrode ANO exposed in the same set of cut-off holes CH, so that a light-emitting device LD of the same color can be formed accordingly. The light-emitting layer EL in other sets of cut-off holes CH will not form a light-emitting device LD.

[0207] Step S164: Form a second electrode covering the light-emitting layer. The second electrode is disconnected at the cut-off groove. At least part of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer.

[0208] As shown in Figure 11, a second electrode CAT covering the light-emitting layer EL can be formed using equipment such as vacuum evaporation equipment. The second electrode CAT can be disconnected at the cut-off grooves CHs, and within the area surrounded by the cut-off grooves CHs, it forms a light-emitting device LD with the light-emitting layer EL and the first electrode ANO. Simultaneously, the disconnected second electrode CAT can extend into the cut-off grooves CHs and contact the bottom surface of the cut-off grooves CHs, i.e., contact the conductive layer CS1, thereby achieving electrical connection with the conductive layer CS1. Furthermore, the second electrode CAT extends continuously within the cut-off holes CHs where the cut-off grooves CHs are not formed, and although it covers the light-emitting layer EL, due to the presence of the protective layer PD2, the light-emitting device LD is not formed within these cut-off holes CHs.

[0209] The above-described device steps can be performed n times, each time forming a light-emitting device LD of one color for a set of cut-off holes CH, thereby forming n light-emitting devices LD with different emitting colors. In some embodiments of this disclosure, n equals 3, and the light-emitting devices LD include a first light-emitting device LD1, a second light-emitting device LD2, and a third light-emitting device LD3 with different emitting colors. Correspondingly, the cut-off holes CH include a first set of cut-off holes CH for forming the first light-emitting device LD1, a second set of cut-off holes CH for forming the second light-emitting device LD2, and a third set of cut-off holes CH for forming the third light-emitting device LD3. The above-described device steps can be performed first for the first set of cut-off holes CH, then for the second set of cut-off holes CH, and finally for the third set of cut-off holes CH.

[0210] Figures 13-17 are schematic diagrams of each step in the second execution of the device step. In Figure 15, the resist layer P4 is used to protect the already formed first light-emitting device LD1 and the cut-off hole CH for which the third light-emitting device LD3 does not need to be formed for the time being.

[0211] Figures 18-23 are schematic diagrams of each step in the third execution of the device step. In Figure 18, the resist layer P5 is used to protect the already formed second light-emitting device LD2. When removing the light-emitting layer EL and the second electrode CAT in the third set of cut-off holes CH, the film layer stacked on the first light-emitting device LD1 can be thinned at the same time, that is, the light-emitting layer EL and the second electrode CAT stacked on the first light-emitting device LD1 are removed.

[0212] Furthermore, since a light-emitting layer EL and a second electrode CAT are formed in the cut-off holes CH where the cut-off groove CHs are not formed each time a device step is performed, and a light-emitting layer EL and a second electrode CAT are also formed on the surface of the cut-off layer CSL away from the driving backplate BP, only the light-emitting layer EL and the second electrode CAT that form the light-emitting device LD with the first electrode ANO participate in light emission. After multiple device steps are performed, the same area will accumulate multiple layers of light-emitting layer EL and second electrode CAT with a large thickness and step difference. Therefore, before each device step is performed, the light-emitting layer EL and second electrode CAT that do not form the light-emitting device LD remaining after the previous device step can be removed. For example, in some embodiments of this disclosure, before performing the device step for the (i+1)th group of cut-off holes, the manufacturing method further includes:

[0213] Step S170: Remove the second electrode and light-emitting layer formed in the (i+1)th group of cut-off holes during the device execution step for the i-th group of cut-off holes, where 1≤i≤n.

[0214] As shown in Figures 13 and 14, during the device step of the i-th group, the light-emitting layer EL and the second electrode CAT are formed in the cut-off holes CH outside the i-th group and on the surface of the cut-off layer CSL away from the driving backplane BP. However, only the cut-off groove CHs are formed in the cut-off holes CH of the i-th group, and a light-emitting device LD is formed. Before the light-emitting device LD is formed in the cut-off holes CH of the (i+1)-th group through the device step, a resist layer P3 can be formed by low-temperature exposure and other processes. The resist layer P3 can cover the cut-off holes CH of the i-th group and the light-emitting device LD inside them, as well as the cut-off holes CH before the i-th group and the light-emitting devices LD inside them. That is, the resist layer P3 is used to cover the already formed light-emitting device LD and protect the light-emitting device LD. Subsequently, the light-emitting layer EL and the second electrode CAT of the cut-off holes CH of the (i+1)-th group can be removed by dry etching and other processes, exposing the protective layer PD2 inside the cut-off holes CH of the (i+1)-th group.

[0215] After performing step S170 above, the surface of the cut-off layer CSL away from the driving backplate BP may retain a light-emitting layer EL and a second electrode CAT. However, due to the presence of the cut-off grooves CHs, the remaining light-emitting layer EL and the second electrode CAT are disconnected from the light-emitting device LD. Furthermore, after performing the above device steps n times, the surface of the cut-off layer CSL away from the driving backplate BP retains light-emitting layers EL of multiple colors, and this surface may have two colors of light-emitting layers EL in the region between two adjacent cut-off holes CH, which are the same color as the light-emitting device LD in the two cut-off holes CH.

[0216] In some embodiments of this disclosure, the device steps may further include:

[0217] Step S165: Form a first inorganic layer covering the second electrode, the first inorganic layer extending continuously at the cut-off groove.

[0218] As shown in Figure 12, a first inorganic layer CVD1 can be formed using low-temperature chemical vapor deposition or other processes. The first inorganic layer CVD1 can cover the second electrode CAT. Due to the stacking of the light-emitting layer EL and the second electrode CAT, the first inorganic layer CVD1 can continuously extend at the cut-off groove CHs, thus protecting the already formed light-emitting device LD from corrosion by moisture and oxygen. Each time a device step is completed, a layer of the first inorganic layer CVD1 is formed.

[0219] As shown in Figure 24, in some embodiments of this disclosure, the manufacturing method further includes:

[0220] Step S100: After forming the last set of light-emitting devices (LDs), the resist layer P7 can be used to cover the last set of light-emitting devices (LDs), and the light-emitting layer EL, the second electrode CAT, and the first inorganic layer CVD1 on the previously formed light-emitting devices (LDs) can be removed to reduce the step difference.

[0221] Furthermore, step S170 may also include: removing the first inorganic layer CVD1 formed in the (i+1)th group of cut-off holes CH during the device execution step for the i-th group of cut-off holes, and this layer can be removed simultaneously with the light-emitting layer EL and the second electrode CAT through processes such as dry etching.

[0222] In some embodiments of this disclosure, a first inorganic layer CVD1 can be formed each time a device step is performed, and a portion of the first inorganic layer CVD1 is removed in step S170. After n device steps are performed, the first inorganic layer CVD1 formed in each device step and not removed can be used as a whole to cover each light-emitting device (LD). Meanwhile, the aforementioned first inorganic layer CVD1 can be a single-layer structure, with a thickness that is 1.5 times the thickness of the conductive layer CS1; of course, the first inorganic layer CVD1 can also be a multi-layer structure, with a thickness ranging from 400 nm to 1200 nm.

[0223] In some embodiments of this disclosure, after performing the device steps for the nth group of cut-off holes CH, that is, after performing the device steps for all cut-off holes CH, the manufacturing method further includes steps S180 and S190, wherein:

[0224] Step S180: An organic layer is formed on the surface of the first inorganic layer away from the drive backplate.

[0225] As shown in Figure 2, the organic layer IJP can be coated on the surface of the first inorganic layer CVD1 away from the drive backplate BP by means of printing or other methods, and the boundary of the organic layer IJP can be limited to the inside of the boundary of the first inorganic layer CVD1 by the blocking dam located in the peripheral area WA.

[0226] Step S190: Form a second inorganic layer covering the organic layer.

[0227] As shown in Figure 2, the second inorganic layer CVD2 can cover the organic layer IJP and the first inorganic layer CVD1, which is not covered by the organic layer IJP. The second inorganic layer CVD2 can block the intrusion of water and oxygen, and planarization is achieved by the organic layer IJP, which is fluid before curing. The material of the second inorganic layer CVD2 can include inorganic insulating materials such as silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide.

[0228] The first type of manufacturing method can divide the light-emitting devices (LDs) of n colors into m groups, where m < n. If the display panel includes 3 or more light-emitting devices (LDs) of different colors, they can be divided into 2 groups. Therefore, the light-emitting devices (LDs) of different colors can be grouped into one group, and the number of light-emitting devices (LDs) in different groups can be different. Correspondingly, the cut-off holes (CHs) corresponding to the light-emitting devices (LDs) of different colors can be grouped into one group.

[0229] For example, there are three types of light-emitting devices (LDs): a first light-emitting device LD1, a second light-emitting device LD2, and a third light-emitting device LD3. Meanwhile, n can be 2. Correspondingly, the cut-off holes CH include a first set of cut-off holes corresponding to the first light-emitting device LD1 and a second set of cut-off holes corresponding to the second light-emitting device LD2 and the third light-emitting device LD3.

[0230] The first type of manufacturing method includes steps S210-S225, wherein:

[0231] Step S210: Form the drive backplane;

[0232] Step S211: Form the first electrode of multiple light-emitting devices on the driving backplane;

[0233] Step S212: Form a limiting layer covering each first electrode, the limiting layer having a limiting opening that corresponds to each first electrode;

[0234] Step S213: Form a protective layer covering the defining layer and the first electrode exposed by the defined opening, wherein the material of the protective layer includes inorganic materials;

[0235] Step S214: A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive backplate, with each cut-off hole overlapping with each defined opening in a one-to-one correspondence; each cut-off hole is divided into a first group and a second group, and the second group of cut-off holes includes the first group and the second group.

[0236] Step S215: Form a cut-off groove around the defined opening that overlaps with the first set of cut-off holes on the sidewall;

[0237] Step S216: Remove at least part of the protective layer covering the first electrode inside the first set of cut-off holes to expose the first electrode;

[0238] Step S217: Form a light-emitting layer covering the cut-off layer and the first electrode exposed by the first set of cut-off holes, wherein the light-emitting layer is broken at the cut-off groove;

[0239] Step S218: Form a second electrode covering the light-emitting layer, the second electrode is disconnected at the cut-off groove; at least part of the second electrode is in contact with the cut-off layer and electrically connected through the cut-off layer;

[0240] Step S219: Remove the light-emitting layer and the second electrode formed in the second set of cut-off holes when the light-emitting layer and the second electrode are formed in the first set of cut-off holes.

[0241] Step S220: Form a cut-off groove around the defined opening that overlaps with the second set of cut-off holes on the sidewall;

[0242] Step S221: Remove at least part of the protective layer covering the first electrode within the second set of cut-off holes to expose the first electrode;

[0243] Step S222: Form a light-emitting layer covering the cut-off layer and the first electrode exposed by the first group of cut-off holes, wherein the light-emitting layer is broken at the cut-off groove;

[0244] Step S223: Form a second electrode covering the light-emitting layer, the second electrode is disconnected at the cut-off groove; at least part of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer;

[0245] When the light-emitting layer and the second electrode are formed in the first group of cut-off holes, the light-emitting layer and the second electrode formed in the second group of cut-off holes are removed, exposing the first electrode;

[0246] Step S224: Form a light-emitting layer covering the cut-off layer and the first electrode exposed by the second group of cut-off holes, wherein the light-emitting layer is broken at the cut-off groove;

[0247] Step S225: Form a second electrode covering the light-emitting layer, the second electrode being disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and electrically connected through the cut-off layer.

[0248] As shown in Figures 25 and 26, based on the second manufacturing method described above, cut-off grooves CHs are first formed for the first group of cut-off holes CH, and a first light-emitting device LD1 is formed. The specific process can be referred to the first execution of the device steps in the first embodiment, and will not be detailed here. Then, cut-off grooves CHs are formed for the first group of cut-off holes CH in the second group of cut-off holes CH, and a second light-emitting device LD2 is formed. Subsequently, cut-off grooves CHs are formed for the second group of cut-off holes CH, and a third light-emitting device LD3 is formed. The specific method for forming the cut-off grooves CHs can be referred to the method for forming the cut-off grooves CHs in the above embodiment, and will not be detailed here.

[0249] Before forming the second light-emitting device LD2, the films (light-emitting layer EL, second electrode CAT, and protective layer PD2) within the second set of cut-off holes CH need to be removed until the first electrode ANO is exposed. The light-emitting layer EL and the second electrode CAT can be removed simultaneously before forming the cut-off grooves CHs, while the protective layer PD2 can be removed after forming the cut-off grooves CHs. The removal process can refer to the first embodiment described above. Before forming the third light-emitting device LD3, the films (light-emitting layer EL and second electrode CAT) within the second set of cut-off holes CH need to be removed until the first electrode ANO is exposed. Since the cut-off grooves CHs of the second set of cut-off holes CH are already formed when forming the second light-emitting device LD2, the process of forming the cut-off grooves CHs and removing the protective layer PD2 before each formation of the light-emitting device LD can be eliminated, simplifying the process.

[0250] Furthermore, after each formation of the light-emitting device LD, a first inorganic layer CVD1 can also be formed. Therefore, the second manufacturing method requires the formation of the first inorganic layer CVD1 three times. In the step of removing the film layer in the cut-off hole CH to expose the first electrode ANO, the first inorganic layer CVD1 formed earlier is also removed.

[0251] The second type of manufacturing method may include steps S310-S360, wherein:

[0252] Step S310: Form the drive backplane;

[0253] Step S311: Form the first electrode of multiple light-emitting devices on the driving backplane;

[0254] Step S312: Form a limiting layer covering each first electrode, the limiting layer having a limiting opening that corresponds to each first electrode;

[0255] Step S313: Form a protective layer covering the defined layer and the first electrode exposed by the defined opening, wherein the material of the protective layer includes inorganic materials;

[0256] Step S314: A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive backplate, with each cut-off hole overlapping with each defined opening in a one-to-one correspondence; each cut-off hole is divided into a first group, a second group and a third group.

[0257] Step S315: Form a cut-off groove around the defined opening that overlaps with each cut-off hole on the sidewall of each cut-off hole;

[0258] Step S316: Remove at least a portion of the protective layer covering the first electrode to expose the first electrode;

[0259] Step S317: Form a light-emitting layer covering the cut-off layer and the first electrode exposed by the first set of cut-off holes, wherein the light-emitting layer is broken at the cut-off groove;

[0260] Step S318: Form a second electrode covering the light-emitting layer, the second electrode is disconnected at the cut-off groove; at least part of the second electrode is in contact with the cut-off layer and electrically connected through the cut-off layer;

[0261] Step S319: Remove the light-emitting layer and the second electrode formed in the second and third sets of cut-off holes when the light-emitting layer and the second electrode are formed in the first set of cut-off holes, and expose the first electrode.

[0262] Step S320: Form a light-emitting layer covering the cut-off layer and the first electrode exposed by the second set of cut-off holes, wherein the light-emitting layer is broken at the cut-off groove;

[0263] Step S321: Form a second electrode covering the light-emitting layer, the second electrode is disconnected at the cut-off groove; at least part of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer;

[0264] Step S322: Remove the light-emitting layer and the second electrode formed in the third set of cut-off holes when the light-emitting layer and the second electrode are formed in the second set of cut-off holes, and expose the first electrode.

[0265] Step S323: Form a light-emitting layer covering the cut-off layer and the first electrode exposed by the third set of cut-off holes, wherein the light-emitting layer is broken at the cut-off groove;

[0266] Step S324: Form a second electrode covering the light-emitting layer. The second electrode is disconnected at the cut-off groove. At least part of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer.

[0267] For details of each step of the second type of manufacturing method, please refer to the implementation method of the display panel and the implementation method of the first type of manufacturing method mentioned above. The main difference between the second type of manufacturing method and the first type of manufacturing method is that, as shown in Figure 27, the second type of manufacturing method simultaneously forms cut-off grooves CHs for each cut-off hole CH, and then forms light-emitting devices LD of different colors. In this way, the process can be simplified to the greatest extent. However, the first type of manufacturing method can reduce the risk of residual light-emitting material in the cut-off grooves CHs. In particular, in the first type of manufacturing method, when the light-emitting layer EL of a light-emitting device LD of a certain color is formed each time, only the corresponding cut-off hole CHs are formed in the cut-off hole CH, while the cut-off grooves CHs have not yet been formed in the cut-off holes CH of other colors of light-emitting devices LD. This can avoid the light-emitting material remaining in the cut-off grooves CHs.

[0268] The manufacturing method disclosed herein can complete the fabrication of a full-color OLED display panel without an FMM (finger-mounted mirror) by multiple depositions of light-emitting diodes (LDs) and multiple photolithography processes. This results in higher dimensional accuracy, an increase in effective light-emitting area (aperture ratio) of approximately 60% compared to traditional FMMs, and a pixel density exceeding 1500 ppi. Furthermore, this manufacturing method can be applied to the silicon-based Micro OLED field, replacing the existing white OLED (multiple layers of different color light-emitting layers) + color filter technology for color display. It can even achieve 6 times the device lifespan or 4 times the brightness. Simultaneously, by utilizing the cut-off layer (CSL) between the LDs, the color mixing problem between the LDs in the display panel and the crosstalk problem during low-brightness driving can be solved, further improving display clarity, color performance (color gamut), uniformity, and other image quality performance.

[0269] It should be noted that although the various steps of the manufacturing method in this disclosure are described in a specific order in the accompanying drawings, this does not require or imply that these steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps.

[0270] This disclosure also provides a display device, which may include a display panel. The display panel may be any of the display panels described in the above embodiments, and its specific structure and beneficial effects will not be repeated here. The display device may be a mobile phone, a television, a tablet computer, or a VR (Virtual Reality) device, a smartwatch, or other wearable device, which will not be listed here.

[0271] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A display panel, comprising: Drive backplane; Multiple light-emitting devices are disposed on the driving backplate, and each light-emitting device includes a first electrode, a light-emitting layer, and a second electrode stacked sequentially in a direction away from the driving backplate. A pixel definition layer is disposed on the same surface as the light-emitting device on the driving backplate; the pixel definition layer has a plurality of pixel openings, one of the pixel openings exposes a first electrode, and the light-emitting layer of the light-emitting device is stacked on the first electrode exposed by one of the pixel openings; the pixel definition layer includes a defining layer and a protective layer covering the defining layer; the material of the protective layer includes an inorganic material; A cut-off layer is disposed on the surface of the pixel definition layer away from the driving backplate, and has a plurality of cut-off holes that overlap with each of the pixel openings. The light-emitting layer and the second electrode of the light-emitting device are located within the area surrounded by one of the cut-off holes. The sidewall of the cut-off hole is provided with a cut-off groove surrounding the pixel opening that overlaps with it. The second electrode in the cut-off hole is in contact with the cut-off layer, and at least a portion of the second electrode is electrically connected through the cut-off layer.

2. The display panel according to claim 1, wherein, The protective layer includes a first protective sublayer and a second protective sublayer; the first protective sublayer covers the defining layer; the second protective sublayer covers the first protective sublayer and extends to the surface of the first electrode away from the drive backplate.

3. The display panel according to claim 1, wherein, The cut-off layer includes a conductive layer and a shielding layer stacked sequentially in a direction away from the drive backplate, the shielding layer and the conductive layer being made of different materials; the cut-off groove is located in the conductive layer; the second electrode in the cut-off hole extends into the cut-off groove and contacts the conductive layer.

4. The display panel according to claim 2, wherein, The depth of the cut-off groove decreases in the direction away from the drive backplate.

5. The display panel according to claim 1, wherein, The display panel also includes: The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer. The first inorganic layer covers the second electrode and the cut-off layer and extends continuously at the cut-off groove. The organic layer is disposed on the surface of the first inorganic layer away from the drive backplane, and the second inorganic layer covers the organic layer.

6. The display panel according to claim 1, wherein, The light-emitting device includes at least three light-emitting devices with different light-emitting colors, and the depth of the cut-off groove of the cut-off hole that overlaps with the pixel opening of two light-emitting devices with different light-emitting colors is different.

7. The display panel according to claim 6, wherein, The light-emitting device includes a first light-emitting device that emits red light, a second light-emitting device that emits green light, and a third light-emitting device that emits blue light; the depth of the cut-off groove of the cut-off hole that overlaps with the pixel opening corresponding to the first light-emitting device is a first depth; the depth of the cut-off groove of the cut-off hole that overlaps with the pixel opening corresponding to the second light-emitting device is a second depth; and the depth of the cut-off groove of the cut-off hole that overlaps with the pixel opening corresponding to the third light-emitting device is a third depth. The first depth is greater than the second depth, and the second depth is greater than the third depth.

8. The display panel according to claim 7, wherein, The first depth is not less than 0.3 μm and not more than 1.5 μm; the second depth is not less than 0.3 μm and not more than 1.2 μm; and the third depth is not less than 0.3 μm and not more than 1 μm.

9. The display panel according to claim 1, wherein, The light-emitting device includes an adjacent first light-emitting device and a second light-emitting device; The display panel further includes a light-emitting extension, which is stacked on the surface of the cut-off layer away from the driving backplate and located between two adjacent light-emitting devices; the second electrode includes an electrode extension that covers the light-emitting extension and is disconnected from the second electrode; The light-emitting extension includes a first light-emitting extension disposed in the same layer as the light-emitting layer of the first light-emitting device and disconnected, and a second light-emitting extension disposed in the same layer as the light-emitting layer of the second light-emitting device and disconnected; the boundary of the first light-emitting extension away from the first light-emitting device and the boundary of the second light-emitting extension away from the second light-emitting device are connected.

10. The display panel according to claim 1, wherein, The light-emitting device includes an adjacent first light-emitting device and a second light-emitting device; The display panel further includes a light-emitting extension, which is stacked on the surface of the cut-off layer away from the driving backplate and located between two adjacent light-emitting devices; the second electrode includes an electrode extension that covers the light-emitting extension and is disconnected from the second electrode; The sidewalls of the electrode extension and the light-emitting extension it covers taper away from the drive backplate.

11. A method for manufacturing a display panel, wherein, include: Forming a drive backplate; The first electrodes of multiple light-emitting devices are formed on the driving backplate; A defining layer is formed covering each of the first electrodes, the defining layer having a defining opening that corresponds to each of the first electrodes; A protective layer is formed covering the defining layer and the first electrode exposed by the defining opening, the material of the protective layer including inorganic materials; A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive back plate, and each cut-off hole overlaps with each defined opening in a one-to-one correspondence; each cut-off hole is divided into at least n groups, where n is a positive integer not less than 2; The device steps are performed sequentially for each group of cut-off holes, and the device steps include: A cut-off groove is formed on the sidewall of the cut-off hole, surrounding and overlapping the defined opening therewith; Remove at least a portion of the protective layer covering the first electrode within the cut-off hole to expose the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the cut-off hole, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, the second electrode being disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and electrically connected through the cut-off layer.

12. The manufacturing method according to claim 11, wherein, Before performing the device step for the (i+1)th group of cut-off holes, the manufacturing method further includes: When performing the device steps for the i-th group of cut-off holes, the second electrode and the light-emitting layer formed in the (i+1)-th group of cut-off holes are removed, 1≤i≤n.

13. The manufacturing method according to claim 11, wherein, A protective layer is formed covering the defining layer and the first electrode exposed by the defining opening; comprising: A first protective sublayer is formed, covering the defining layer and the first electrode exposed by the defining opening; The first protective sublayer is patterned, and the first protective sublayer defining the bottom of the opening is removed, so that the first protective sublayer exposes the first electrode. A second protective sublayer is formed that covers the first protective sublayer and the first electrode exposed by the first protective sublayer.

14. The manufacturing method according to claim 11, wherein, A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive backplate; including: A conductive layer is formed covering the protective layer; A shielding layer is formed to cover the conductive layer; the shielding layer and the conductive layer are made of different materials; Multiple cut-off holes are made that penetrate the shielding layer and the conductive layer, and each cut-off hole corresponds to and overlaps with each defined opening.

15. The manufacturing method according to claim 14, wherein, A cut-off groove is formed on the sidewall of the cut-off hole, surrounding and overlapping the defined opening therewith; including: The conductive layer is etched inside the cut-off hole to form a cut-off groove.

16. The manufacturing method according to claim 11, wherein, The device step also includes: A first inorganic layer is formed covering the second electrode, and the first inorganic layer extends continuously at the cut-off groove.

17. The manufacturing method according to claim 16, wherein, After performing the device step for the nth group of cut-off holes, the manufacturing method further includes: An organic layer is formed on the surface of the first inorganic layer away from the drive backplate; A second inorganic layer is formed covering the organic layer.

18. The manufacturing method according to any one of claims 11-17, wherein, n equals 3, and the cut-off holes include a first group of cut-off holes, a second group of cut-off holes, and a third group of cut-off holes; the light-emitting layers in any two groups of the first group of cut-off holes, the second group of cut-off holes, and the third group of cut-off holes emit different colors.

19. A method for manufacturing a display panel, comprising: Forming a drive backplate; The first electrodes of multiple light-emitting devices are formed on the driving backplate; A defining layer is formed covering each of the first electrodes, the defining layer having a defining opening that corresponds to each of the first electrodes; A protective layer is formed covering the defining layer and the first electrode exposed by the defining opening, the material of the protective layer including inorganic materials; A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive back plate, and each cut-off hole overlaps with each defined opening in a one-to-one correspondence; each cut-off hole is divided into a first group and a second group, and the cut-off holes in the second group include the first group and the second group. A cut-off groove is formed on the sidewall of the first set of cut-off holes, surrounding and overlapping the defined opening therewith; Remove at least a portion of the protective layer covering the first electrode within the first set of cut-off holes to expose the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the first set of cut-off holes, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer; Remove the light-emitting layer and the second electrode formed in the second set of cut-off holes when the light-emitting layer and the second electrode are formed in the first set of cut-off holes; A cut-off groove is formed on the sidewall of the second set of cut-off holes, surrounding and overlapping the defined opening therewith; Remove at least part of the protective layer covering the first electrode within the second set of cut-off holes to expose the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the first group of cut-off holes, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer; When the light-emitting layer and the second electrode are formed in the cut-off holes of the first group, the light-emitting layer and the second electrode formed in the cut-off holes of the second group are removed, exposing the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the cut-off holes in the second group, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, the second electrode being disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and electrically connected through the cut-off layer.

20. A method for manufacturing a display panel, comprising: Forming a drive backplate; The first electrodes of multiple light-emitting devices are formed on the driving backplate; A defining layer is formed covering each of the first electrodes, the defining layer having a defining opening that corresponds to each of the first electrodes; A protective layer is formed covering the defining layer and the first electrode exposed by the defining opening, the material of the protective layer including inorganic materials; A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive back plate, and each cut-off hole overlaps with each defined opening in a one-to-one correspondence; each cut-off hole is divided into a first group, a second group and a third group; A cut-off groove is formed on the sidewall of each of the cut-off holes, surrounding and overlapping the defined opening therewith; Remove at least a portion of the protective layer covering the first electrode to expose the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the first set of cut-off holes, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer; When the light-emitting layer and the second electrode are formed in the first set of cut-off holes, the light-emitting layer and the second electrode formed in the second and third sets of cut-off holes are removed, exposing the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the second set of cut-off holes, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer; When the light-emitting layer and the second electrode are formed in the second set of cut-off holes, the light-emitting layer and the second electrode formed in the third set of cut-off holes are removed, exposing the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the third set of cut-off holes, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, the second electrode being disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and electrically connected through the cut-off layer.

21. A display device comprising the display panel according to any one of claims 1-10.

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