Display panel, display module, and electronic device

Abstract

Embodiments of the present application relate to the technical field of display, and provide a display panel, a display module, and an electronic device. The electronic device comprises a display module, and the display module comprises a bending area and a non-bending area. The display module comprises a display panel. The display panel comprises a functional stack layer and a substrate layer, which are stacked together. The substrate layer comprises a first part and a second part. The material of the first part is glass. The first part is located in the bending area, and the second part is located in the non-bending area. Stress concentration in the bending area when the display module is folded can be reduced, thus mitigating creases during folding of the display module and enhancing the flatness of the display module.

Description

Display panels, display modules and electronic devices

[0001] This application claims priority to Chinese patent application No. 202510109827.4, filed on January 21, 2025, entitled "Flexible Display Module and Electronic Device", and to Chinese patent application No. 202510473432.2, filed on April 15, 2025, entitled "Display Panel, Display Module and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and in particular to a display panel, display module and electronic device. Background Technology

[0003] In foldable electronic devices, the flexible display module is one of the core components that enables the foldable function. The flexible display module has bending and non-bending areas. When the electronic device is bent, the bending area of ​​the flexible display module bends; when the electronic device is unfolded, the bending area of ​​the flexible display module unfolds as well. However, repeated bending of the flexible display module or maintaining a bent state for a long time will cause creep in the bending area. When the flexible display module is unfolded, creases will appear in the bending area, affecting the display effect. Summary of the Invention

[0004] This application provides a display panel, a display module, and an electronic device, which can reduce stress concentration in the bending area when the display module is folded, thereby improving the creases in the bending area and enhancing the flatness of the display module.

[0005] In a first aspect, embodiments of this application provide an electronic device including a display module, which includes a bent region and a non-bent region. The display module includes a display panel, which includes a functional stack and a substrate layer stacked together. The substrate layer includes a first portion and a second portion. The first portion is made of glass and is located in the bent region, while the second portion is located in the non-bent region.

[0006] In this embodiment, since glass is an inorganic material, its creep is negligible, or in other words, very small, and it remains flat and crease-free even after long-term use. Therefore, the first part is made of glass, and its creep is very small. Even after long-term bending and use, the first part remains flat and crease-free, which reduces creep in the bending area of ​​the display module, reduces stress concentration in the bending area, improves creases in the bending area, and enhances the flatness of the bending area, thereby improving the flatness of the display module.

[0007] In some possible implementations, the thickness of the second part is greater than the thickness of the first part.

[0008] In this way, the thickness of the first part is smaller, reducing the difficulty of bending the first part and thus reducing the difficulty of bending the bending area. In addition, the thickness of the second part can be designed to be large, improving the flatness of the non-bending area and thus improving the flatness of the display module.

[0009] In some possible implementations, the side of the substrate away from the functional stack has a first groove, at least a portion of which is located in the bending region, and the groove width of the first groove along the length of the display panel is greater than or equal to the length of the bending region along the length of the display panel.

[0010] In this way, by creating a first groove on the side of the substrate layer away from the functional stack, the first part can be thinned, reducing the difficulty of bending the first part. Additionally, the surface of the substrate layer in contact with the functional stack can be made flat, reducing the difficulty of the substrate layer supporting the functional stack.

[0011] In some possible implementations, the display module also includes a leveling compound located inside the first groove.

[0012] In this way, the first groove is filled with the filling colloid, thus protecting the first part.

[0013] In some possible implementations, the substrate layer includes a first glass layer and multiple structural layers. A portion of the first glass layer is located in a bent region, and another portion is located in a non-bent region. Multiple structural layers are fixedly connected to the side of the first glass layer away from the functional stack. The multiple structural layers are arranged side by side and spaced apart along the length of the display panel, and adjacent structural layers and the first glass layer enclose at least a portion of the groove wall of a first groove.

[0014] In this way, the first glass layer can be UTG glass of uniform thickness, and the thickness of the first glass layer in the bending area is the same as that in the non-bending area. During the manufacturing process of the display panel, the various layers of the functional stack can be fabricated on the first glass layer, and finally the structural layer and the first glass layer are assembled, reducing the difficulty of forming the various layers of the functional stack on the substrate layer and further improving the production efficiency of the display panel.

[0015] In some possible implementations, the structural layer is made of glass.

[0016] This reduces the difficulty of substrate structure design.

[0017] In some possible implementations, the substrate is a one-piece molded glass substrate, which can reduce the number of parts in the display panel and improve the assembly efficiency of the display panel.

[0018] In some possible implementations, the display module further includes a first circuit board, and the functional stack includes a circuit layer, with the circuit layer and the first circuit board located on opposite sides of the substrate. The display panel also includes electrical connectors fixedly connected to the substrate and electrically connected to the circuit layer and the first circuit board.

[0019] In this way, the circuit layer is electrically connected to the first circuit board through the electrical connector. In addition, the substrate layer is fixedly connected to the electrical connector, and the electrical connector has little impact on the black border of the display module, which can realize a narrow bezel design and improve the screen-to-body ratio.

[0020] In some possible implementations, the display panel further includes a first hole that penetrates the substrate layer along the thickness direction of the display panel, and at least a portion of the electrical connector is located inside the first hole.

[0021] This avoids the electrical connectors affecting the black border of the display module, enabling extremely narrow black borders and further increasing the screen-to-body ratio.

[0022] In some possible implementations, the electrical connector includes a conductive post and a conductive layer. The conductive layer is located on the side of the substrate layer away from the circuit layer, the conductive post is located inside the first hole, and the opposite ends of the conductive post are electrically connected to the circuit layer and the conductive layer, respectively. The first circuit board is electrically connected to the conductive layer.

[0023] In this way, by electrically connecting the conductive layer to the first circuit board, the connection area between the electrical connector and the first circuit board can be increased, the connection requirements between the electrical connector and the first circuit board can be reduced, and the reliability of the electrical connection between the first circuit board and the electrical connector can also be improved.

[0024] In some possible implementations, the display module further includes a conductive adhesive layer located between the substrate layer and the first circuit board, the conductive adhesive layer electrically connecting the electrical connector to the first circuit board.

[0025] In this way, while the electrical connector is electrically connected to the first circuit board, the conductive adhesive layer also bonds the first circuit board to the substrate layer, improving the reliability of the connection between the substrate layer and the first circuit board. Furthermore, the conductive adhesive layer can be coated on the surface of the first circuit board. After assembling the first circuit board and the substrate layer, the conductive adhesive layer makes electrical contact with the electrical connector, reducing the difficulty of electrically connecting the electrical connector to the first circuit board and improving efficiency.

[0026] In some possible implementations, at least a portion of the electrical connector is disposed on the sidewall of the substrate layer, which can also reduce the black border of the display module and increase the screen-to-body ratio.

[0027] In some possible implementations, the sidewalls of the substrate are provided with a second groove that accommodates at least a portion of the electrical connector.

[0028] By arranging at least a portion of the electrical connector inside the second recess, the impact of the electrical connector on the black border of the display module can be reduced, which helps to improve the screen-to-body ratio.

[0029] In some possible implementations, the side of the substrate away from the functional stack has a first accommodating space, and the display module also includes a second circuit board, at least a portion of which is located inside the first accommodating space, and the second circuit board is electrically connected to an electrical connector and the first circuit board.

[0030] In this way, the first circuit board is electrically connected to the electrical connector via the second circuit board, achieving electrical connection between the circuit layer and the first circuit board. Furthermore, by accommodating the second circuit board within the first accommodating space, the second circuit board is prevented from affecting the black border of the display module, thus contributing to the achievement of an extremely narrow bezel.

[0031] In some possible implementations, the display module further includes a support layer and a second circuit board. A substrate layer and a first circuit board are located on opposite sides of the support layer, and the support layer and substrate layer enclose at least a portion of the inner wall of a second accommodating space. At least a portion of the second circuit board is located inside the second accommodating space, and the second circuit board is electrically connected to an electrical connector and the first circuit board.

[0032] In this way, the first circuit board is electrically connected to the electrical connector via the second circuit board, achieving electrical connection between the circuit layer and the first circuit board. Furthermore, by accommodating the second circuit board in the second receiving space, the second circuit board is prevented from affecting the black border of the display module, thus contributing to the achievement of an extremely narrow bezel.

[0033] In some possible implementations, the display module further includes a protective adhesive element, at least a portion of which is disposed within the first accommodating space or the second accommodating space, and which covers at least a portion of the second circuit board.

[0034] In this way, by protecting the second circuit board with protective plastic parts, damage to the second circuit board can be avoided, thereby improving the strength and reliability of the module.

[0035] In some possible implementations, both the first circuit board and the second circuit board are flexible circuit boards, and the first circuit board and the second circuit board are an integral structure.

[0036] This reduces the number of process steps in the display module and improves the production efficiency of the display module.

[0037] In some possible implementations, the display module further includes a first circuit board and a second circuit board. The first circuit board is located on the side of the substrate away from the functional stack. The second circuit board is a flexible circuit board, with a first end located on the front side of the functional stack and electrically connected to the circuit layer of the functional stack, and a second end bent to the first circuit board and electrically connected to the first circuit board.

[0038] In this way, existing processes can be used to achieve electrical connection between the circuit layer and the first circuit board, reducing the difficulty and cost of electrical connection.

[0039] In some possible implementations, the display module also includes a support layer, with the support layer and the functional stack located on opposite sides of the substrate layer. Along the thickness direction of the display module, the projection of the support layer coincides with the projection of the first part.

[0040] This allows for support of the substrate and protection of the first part.

[0041] In some possible implementations, the display module also includes multiple second holes located in the bending area and disposed in the support layer.

[0042] In this way, the support layer is a bamboo book layer, which can ensure the bending performance of the bending area.

[0043] In some possible implementations, the display module also includes multiple soft gels, each corresponding to a second hole, with the soft gel filling the interior of the corresponding second hole.

[0044] This improves the bending performance of the bending area.

[0045] In some possible implementations, the support layer is an elastic soft rubber layer.

[0046] This protects the first part and ensures the bending performance of the bending area.

[0047] In some possible implementations, the display module also includes an adhesive layer located between the substrate layer and the support layer, and the adhesive layer is bonded to both the substrate layer and the support layer.

[0048] In this way, the adhesive layer connects the substrate layer and the support layer, reducing the difficulty of connecting the support layer and the substrate layer.

[0049] In some possible implementations, the adhesive layer includes a first adhesive portion and a second adhesive portion, the first adhesive portion being located in the bending region and the second adhesive portion being located in the non-bending region, and the elastic modulus of the first adhesive portion being less than that of the second adhesive portion.

[0050] This reduces the impact of the adhesive layer on the bending area, reduces stress concentration in the bending area, and improves the creases in the bending area.

[0051] In some possible implementations, the adhesive layer comprises multiple adhesive portions, with each non-bending region corresponding to one of the adhesive portions, and the adhesive portions located in the corresponding non-bending regions.

[0052] In this way, the adhesive layer is placed in the non-bending area, and the adhesive layer has almost no effect on the bending area. This can reduce the creep in the bending area, further reduce the stress concentration in the bending area, and improve the creases in the bending area.

[0053] In some possible implementations, the display module also includes at least one protective layer, with the functional stack located between the at least one protective layer and the substrate layer.

[0054] This protects the display panel and improves the reliability of the display module.

[0055] In some possible implementations, the number of protection layers is one.

[0056] In this way, compared with the existing technology that uses two protective layers, the number of layers in the display module can be reduced, thereby reducing the amount of misalignment when the display module is bent.

[0057] In some possible implementations, at least one protective layer is a second glass layer, which includes a first glass portion and a second glass portion, wherein the first glass portion is located in the bending region and the second glass portion is located in the non-bending region, and the thickness of the second glass portion is greater than the thickness of the first glass portion.

[0058] This thinning of the first glass section reduces the difficulty of bending it, as well as the bending difficulty in the bending area. Additionally, the second glass section can be designed with greater thickness, improving the protection of the display panel and enhancing the flatness of non-bending areas.

[0059] In some possible implementations, the display module also includes a protective film, with the protective layer located between the protective film and the display panel.

[0060] This further enhances the protection of the display panel, thereby improving the reliability of the display module.

[0061] Secondly, embodiments of this application provide an electronic device including a display module. The display module includes a cover plate, a display panel, and a first circuit board. The cover plate and the first circuit board are located on opposite sides of the display panel. The display panel includes a substrate layer, a circuit layer, and electrical connectors. The substrate layer is made of glass. The circuit layer and the first circuit board are located on opposite sides of the substrate layer. The circuit layer is located between the substrate layer and the cover plate. The electrical connectors are fixedly connected to the substrate layer and electrically connected to the circuit layer and the first circuit board.

[0062] Because the substrate is made of glass, it has high rigidity, allowing electrical connectors to be directly fabricated on it. Compared to connecting the circuit layer to the first circuit board via a flexible circuit board that is bent, the electrical connectors have less impact on the black border of the display module, enabling narrow black borders and increasing the screen-to-body ratio.

[0063] In some possible implementations, the display panel further includes a first hole that penetrates the substrate layer along the thickness direction of the display panel, and at least a portion of the electrical connector is located inside the first hole.

[0064] This reduces the impact of electrical connectors on the black border of the display module, enabling extremely narrow black borders and further increasing the screen-to-body ratio.

[0065] In some possible implementations, the electrical connector includes a conductive post and a conductive layer. The conductive layer is located on the side of the substrate layer away from the circuit layer, the conductive post is located inside the first hole, and the opposite ends of the conductive post are electrically connected to the circuit layer and the conductive layer, respectively. The first circuit board is electrically connected to the conductive layer.

[0066] In this way, by electrically connecting the conductive layer to the first circuit board, the connection area of ​​the electrical connector can be increased, the electrical connection error requirements between the electrical connector and the first circuit board can be reduced, and the electrical connection reliability between the first circuit board and the electrical connector can also be improved.

[0067] In some possible implementations, the display module further includes a conductive adhesive layer located between the substrate layer and the first circuit board, the conductive adhesive layer being electrically connected to the electrical connector and the first circuit board.

[0068] In this way, while the electrical connector is electrically connected to the first circuit board, the conductive adhesive layer also bonds the first circuit board to the substrate layer, improving the reliability of the connection between the substrate layer and the first circuit board. Furthermore, the conductive adhesive layer can be coated on the surface of the first circuit board. After assembling the first circuit board and the substrate layer, the conductive adhesive layer makes electrical contact with the electrical connector, reducing the difficulty of electrically connecting the electrical connector to the first circuit board and improving efficiency.

[0069] In some possible implementations, at least a portion of the electrical connector is disposed on the sidewall of the substrate layer.

[0070] This minimizes the impact on the black borders of the display module, reducing their size and increasing the screen-to-body ratio.

[0071] In some possible implementations, the sidewalls of the substrate are provided with a second groove that accommodates at least a portion of the electrical connector.

[0072] By placing the electrical connector inside the second recess, the impact of the electrical connector on the black border of the display module can be reduced, which helps to improve the screen-to-body ratio.

[0073] In some possible implementations, the side of the substrate away from the circuit layer has a third accommodating space, and the display module also includes a second circuit board, at least a portion of which is located inside the third accommodating space. The second circuit board is electrically connected to the electrical connector and the first circuit board.

[0074] In this way, the first circuit board is electrically connected to the electrical connector via the second circuit board, achieving electrical connection between the circuit layer and the first circuit board. Furthermore, the third accommodating space houses the second circuit board, preventing it from affecting the black border of the display module and contributing to the achievement of an extremely narrow bezel.

[0075] In some possible implementations, the display module further includes a protective stack and a second circuit board. The protective stack is located between the first circuit board and the substrate, and the substrate and the protective stack enclose a fourth accommodating space. At least a portion of the second circuit board is located within the fourth accommodating space, and the second circuit board is electrically connected to the electrical connector and the first circuit board.

[0076] In this way, the first circuit board is electrically connected to the electrical connector via the second circuit board, achieving electrical connection between the circuit layer and the first circuit board. Furthermore, the fourth accommodating space houses the second circuit board, preventing it from affecting the black border of the display module and contributing to the achievement of an extremely narrow bezel.

[0077] In some possible implementations, the display module also includes a protective adhesive element, at least a portion of which is disposed within a third or fourth accommodating space, and which covers at least a portion of the second circuit board.

[0078] This avoids damage to the second circuit board and improves the module's strength and reliability.

[0079] In some possible implementations, both the first circuit board and the second circuit board are flexible circuit boards, and the first circuit board and the second circuit board are an integral structure.

[0080] This reduces the number of process steps in the display module and improves the production efficiency of the display module.

[0081] In some possible implementations, the projection of the protective adhesive is located inside the projection of the substrate layer along the thickness direction of the display module.

[0082] In this way, the orthogonal projection of the protective component onto the substrate is located inside the substrate, which can prevent the protective component from affecting the black border of the display module and help to achieve a narrow black border.

[0083] In some possible implementations, the projection of the protective adhesive part is located inside the projection of the cover plate along the thickness direction of the display module.

[0084] In this way, the orthogonal projection of the protective adhesive onto the cover plate is located inside the cover plate, which avoids the protective adhesive from affecting the black border of the display module and helps to achieve a narrow display black border. In addition, it reduces the difficulty of applying protective adhesive.

[0085] Thirdly, embodiments of this application provide a display panel, which is a display panel of any of the electronic devices of the first aspect, or a display panel of any of the electronic devices of the second aspect.

[0086] Fourthly, embodiments of this application provide a display module, which is a display module of any of the electronic devices in the first aspect, or a display module of any of the electronic devices in the second aspect.

[0087] Fifthly, embodiments of this application provide a display panel applied to a display module having a bending region and a non-bending region. The display panel includes a functional stack and a substrate layer stacked together. The substrate layer includes a first part and a second part. The first part is made of glass and is located in the bending region, while the second part is located in the non-bending region.

[0088] In some possible implementations, the thickness of the second part is greater than the thickness of the first part.

[0089] In some possible implementations, the side of the substrate away from the functional stack has a first groove, at least a portion of which is located in the bending region, and the groove width of the first groove along the length of the display panel is greater than or equal to the length of the bending region along the length of the display panel.

[0090] In some possible implementations, the substrate layer includes a first glass layer and multiple structural layers. A portion of the first glass layer is located in a bent region, and another portion is located in a non-bent region. Multiple structural layers are fixedly connected to the side of the first glass layer away from the functional stack. The multiple structural layers are arranged side by side and spaced apart along the length of the display panel, and adjacent structural layers and the first glass layer enclose at least a portion of the groove wall of a first groove.

[0091] In some possible implementations, the structural layer is made of glass.

[0092] In some possible implementations, the substrate is a monolithically formed glass substrate.

[0093] In some possible implementations, the functional stack includes a circuit layer, and the display panel also includes an electrical connector fixedly connected to the substrate layer. The first end of the electrical connector is electrically connected to the circuit layer, and the second end of the electrical connector is electrically connected to a first circuit board located on the side of the substrate layer away from the circuit layer in the display module.

[0094] In some possible implementations, the display panel further includes a first hole that penetrates the substrate layer along the thickness direction of the display panel, and at least a portion of the electrical connector is located inside the first hole.

[0095] In some possible implementations, the electrical connector includes a conductive post and a conductive layer. The conductive layer is located on the side of the substrate layer away from the circuit layer, the conductive post is located inside the first hole, and the opposite ends of the conductive post are electrically connected to the circuit layer and the conductive layer, respectively. The first circuit board is electrically connected to the conductive layer.

[0096] In some possible implementations, at least a portion of the electrical connector is disposed on the sidewall of the substrate layer.

[0097] In some possible implementations, the sidewalls of the substrate are provided with a second groove that accommodates at least a portion of the electrical connector.

[0098] In some possible implementations, the side of the substrate layer away from the functional stack has a first accommodating space.

[0099] Sixthly, embodiments of this application also provide a display module, which includes a display panel as described in any of the fifth aspects, and the display module includes a bent area and a non-bent area.

[0100] In some possible implementations, the display module includes a first circuit board, and the display panel includes an electrical connector and a circuit layer. The first circuit board and the circuit layer are located on opposite sides of a substrate, and the electrical connector is fixedly connected to the substrate and electrically connects the first circuit board and the circuit layer.

[0101] In some possible implementations, the display panel includes a first hole penetrating the substrate, at least a portion of the electrical connector is located inside the first hole, and the display module further includes a conductive adhesive layer located between the substrate and the first circuit board, the conductive adhesive layer being electrically connected to the electrical connector and the first circuit board.

[0102] In some possible implementations, the display module further includes a second circuit board, at least a portion of which is located within a first accommodating space of the substrate, and the second circuit board is electrically connected to an electrical connector and the first circuit board.

[0103] In some possible implementations, the display module further includes a support layer and a second circuit board. The substrate layer and the first circuit board are located on opposite sides of the support layer, and the support layer and the substrate layer form at least a portion of the inner wall of the second accommodating space. At least a portion of the second circuit board is located inside the second accommodating space, and the second circuit board is electrically connected to an electrical connector and the first circuit board.

[0104] In some possible implementations, the display module further includes a protective adhesive element, at least a portion of which is disposed within the first accommodating space or the second accommodating space, and which covers at least a portion of the second circuit board.

[0105] In some possible implementations, both the first circuit board and the second circuit board are flexible circuit boards, and the first circuit board and the second circuit board are an integral structure.

[0106] In some possible implementations, the display module further includes a first circuit board and a second circuit board. The first circuit board is located on the side of the substrate away from the functional stack. The second circuit board is a flexible circuit board, with a first end located on the front side of the functional stack and electrically connected to the circuit layer of the functional stack, and a second end bent to the first circuit board and electrically connected to the first circuit board.

[0107] In some possible implementations, the display module also includes a support layer, with the support layer and the functional stack located on opposite sides of the substrate layer. Along the thickness direction of the display module, the projection of the support layer coincides with the projection of the first part.

[0108] In some possible implementations, the display module also includes multiple second holes located in the bending area and disposed in the support layer.

[0109] In some possible implementations, the display module also includes multiple soft gels, each corresponding to a second hole, with the soft gel filling the interior of the corresponding second hole.

[0110] In some possible implementations, the support layer is an elastic soft rubber layer.

[0111] In some possible implementations, the display module also includes an adhesive layer located between the substrate layer and the support layer, and the adhesive layer is bonded to both the substrate layer and the support layer.

[0112] In some possible implementations, the adhesive layer includes a first adhesive portion and a second adhesive portion, the first adhesive portion being located in the bending region and the second adhesive portion being located in the non-bending region, and the elastic modulus of the first adhesive portion being less than that of the second adhesive portion.

[0113] In some possible implementations, the adhesive layer comprises multiple adhesive portions, each corresponding to a non-bending region, with the adhesive portion located within the corresponding non-bending region.

[0114] In some possible implementations, the display module also includes at least one protective layer, with the functional stack located between the at least one protective layer and the substrate layer.

[0115] In some possible implementations, the number of protection layers is one.

[0116] In some possible implementations, at least one protective layer is a second glass layer, which includes a first glass portion and a second glass portion, wherein the first glass portion is located in the bending region and the second glass portion is located in the non-bending region, and the thickness of the second glass portion is greater than the thickness of the first glass portion.

[0117] In some possible implementations, the display module also includes a protective film, with the protective layer located between the protective film and the display panel.

[0118] In a seventh aspect, embodiments of this application provide a display panel, which includes a substrate layer, a circuit layer, and an electrical connector. The substrate layer is made of glass, and the electrical connector is fixedly connected to the substrate layer. A first end of the electrical connector is electrically connected to the circuit layer, and a second end of the electrical connector is electrically connected to a first circuit board located on the side of the substrate layer away from the circuit layer.

[0119] In some possible implementations, the display panel further includes a first hole that penetrates the substrate layer along the thickness direction of the display panel, and at least a portion of the electrical connector is located inside the first hole.

[0120] In some possible implementations, the electrical connector includes a conductive post and a conductive layer. The conductive layer is located on the side of the substrate layer away from the circuit layer, the conductive post is located inside the first hole, and the opposite ends of the conductive post are electrically connected to the circuit layer and the conductive layer, respectively. The first circuit board is electrically connected to the conductive layer.

[0121] In some possible implementations, at least a portion of the electrical connector is disposed on the sidewall of the substrate layer.

[0122] In some possible implementations, the sidewalls of the substrate are provided with a second groove that accommodates at least a portion of the electrical connector.

[0123] In some possible implementations, the side of the substrate layer away from the circuit layer has a third accommodating space.

[0124] Eighthly, embodiments of this application also provide a display module, which includes a cover plate, a first circuit board, and a display panel as described in any of the seventh aspects. The cover plate and the first circuit board are located on opposite sides of the display panel. A circuit layer and the first circuit board are located on opposite sides of a substrate layer, with the circuit layer situated between the substrate layer and the cover plate, and electrically connected to the first circuit board via an electrical connector.

[0125] In some possible implementations, the display panel includes a first hole penetrating the substrate, with at least a portion of the electrical connector located inside the first hole. The display module also includes a conductive adhesive layer located between the substrate and the first circuit board, the conductive adhesive layer being electrically connected to the electrical connector and the first circuit board.

[0126] In some possible implementations, the display module further includes a second circuit board, at least a portion of which is located within a third accommodating space of the substrate, and the second circuit board is electrically connected to the electrical connector and the first circuit board.

[0127] In some possible implementations, the display module further includes a protective stack and a second circuit board. The protective stack is located between the first circuit board and the substrate, and the substrate and the protective stack enclose a fourth accommodating space. At least a portion of the second circuit board is located within the fourth accommodating space, and the second circuit board is electrically connected to the electrical connector and the first circuit board.

[0128] In some possible implementations, the display module also includes a protective adhesive element, at least a portion of which is disposed within a third or fourth accommodating space, and which covers at least a portion of the second circuit board.

[0129] In some possible implementations, the projection of the protective adhesive is located inside the projection of the substrate layer along the thickness direction of the display module.

[0130] In some possible implementations, the projection of the protective adhesive part is located inside the projection of the cover plate along the thickness direction of the display module.

[0131] In some possible implementations, both the first and second circuit boards are flexible circuit boards, and the first and second circuit boards are an integral structure. Attached Figure Description

[0132] Figure 1 is a schematic diagram of an electronic device unfolded according to an embodiment of this application;

[0133] Figure 2 is a schematic diagram of an electronic device folded according to an embodiment of this application;

[0134] Figure 3 is a schematic diagram of the display module of the electronic device shown in Figure 1;

[0135] Figure 4 is a schematic diagram of the display panel in Figure 3;

[0136] Figure 5 is a cross-sectional schematic diagram of the substrate layer in Figure 3;

[0137] Figure 6 is a cross-sectional schematic diagram of the second type of substrate layer provided in an embodiment of this application;

[0138] Figure 7 is a cross-sectional schematic diagram of the third type of substrate layer provided in the embodiments of this application;

[0139] Figure 8 is a cross-sectional schematic diagram of the fourth type of substrate layer provided in the embodiments of this application;

[0140] Figure 9 is a cross-sectional schematic diagram of the UFG layer provided in the embodiment of this application;

[0141] Figure 10 is a cross-sectional schematic diagram of another support layer provided in Embodiment 1 of this application;

[0142] Figure 11 is a cross-sectional schematic diagram of the electrical connector, conductive adhesive layer, substrate layer and first circuit board in Figure 3.

[0143] Figure 12 is a cross-sectional schematic diagram of a display module provided in Embodiment 2 of this application;

[0144] Figure 13 is a schematic diagram of another three-dimensional structure of the substrate layer provided in Embodiment 2 of this application;

[0145] Figure 14 is a cross-sectional schematic diagram of the first type of display module provided in Embodiment 3 of this application;

[0146] Figure 15 is a cross-sectional schematic diagram of the second type of display module provided in Embodiment 3 of this application;

[0147] Figure 16 is a cross-sectional schematic diagram of the first type of display module provided in Embodiment 4 of this application;

[0148] Figure 17 is a cross-sectional schematic diagram of the second type of display module provided in Embodiment 4 of this application;

[0149] Figure 18 is a cross-sectional schematic diagram of the first type of display module provided in Embodiment 5 of this application;

[0150] Figure 19 is a cross-sectional schematic diagram of the substrate layer in Figure 18;

[0151] Figure 20 is a cross-sectional schematic diagram of the second type of substrate layer provided in Embodiment 5 of this application;

[0152] Figure 21 is a cross-sectional schematic diagram of the first type of display module provided in Embodiment 6 of this application;

[0153] Figure 22 is a cross-sectional schematic diagram of the substrate layer in Figure 21;

[0154] Figure 23 is a cross-sectional schematic diagram of the second type of display module provided in Embodiment 6 of this application;

[0155] Figure 24 is a cross-sectional schematic diagram of the first type of display module provided in Embodiment 7 of this application;

[0156] Figure 25 is a cross-sectional schematic diagram of the substrate layer, adhesive layer and support layer in Figure 24.

[0157] Figure 26 is a cross-sectional schematic diagram of the second type of display module provided in Embodiment 7 of this application;

[0158] Figure 27 is an exploded schematic diagram of an electronic device provided in Embodiment 8 of this application;

[0159] Figure 28 is a cross-sectional view of the display module in Figure 27;

[0160] Figure 29 is a schematic cross-sectional view of the substrate layer in Figure 28;

[0161] Figure 30 is a cross-sectional schematic diagram of a display module provided in Embodiment 9 of this application;

[0162] Figure 31 is a cross-sectional schematic diagram of a display module provided in Embodiment 10 of this application;

[0163] Figure 32 is a cross-sectional schematic diagram of the substrate layer in Figure 31;

[0164] Figure 33 is a cross-sectional schematic diagram of a display module provided in Embodiment 11 of this application.

[0165] Explanation of reference numerals in the attached drawings: 11. First part; 12. Second part; 123. First accommodating space; 126. Second accommodating space; 13. Third part; 14. Fourth part; 15. Third accommodating space; 18. Fourth accommodating space; 21. First groove; 22. Second groove; 23. First hole; 31. First glass layer; 32. Structural layer; 100. Electronic device; 200. Display module; 210. Protective film; 220. Protective layer; 220a. First protective layer; 220b. Second protective layer; 221. First glass portion; 222. Second glass portion; 223. Thinning groove; 230. Optical adhesive layer; 240. Display panel; 241. Substrate layer; 242. Functional stack; 2421. Circuit layer; 24211. Thin-film transistor; 2422. Display layer; 2423. Encapsulation layer; 2424. Pixel separation layer; 2425. Pixel layer; 2426. Sub-pixel; 2427. Anode; 2428. Light-emitting layer; 2429. Cathode; 243. Electrical connector; 2431. Conductive post; 2432. Conductive layer; 250. Support layer; 251. Second hole; 260. First circuit board; 270. Second circuit board; 271. First connection portion; 272. First bending portion; 273. Second connection portion; 280. Conductive adhesive layer; 290. Protective adhesive component; 310. Soft colloid; 320. Adhesive layer; 321. Colloid portion; 321a. First colloid portion; 321b. Second colloid portion; 340, Filler colloid; 350, Driver chip; 360, Adhesive component; 410, Cover plate; 420, Protective layer; 500, Housing assembly; 510, First housing; 520, Second housing; 530, Rotary shaft assembly; 540, Middle frame; 550, Rear cover; AA, Bending area; NA, Non-bending area. Detailed Implementation

[0166] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0167] The electronic device 100 provided in this application embodiment may include, but is not limited to, mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, touch TVs, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices, virtual reality devices, and other foldable or non-foldable devices.

[0168] When the electronic device 100 is a mobile phone, the mobile phone can be a folding phone, a side-sliding phone, or a candybar phone. Folding phones can be large inward-folding phones, outward-folding phones, small inward-folding phones, multi-folding phones, etc.

[0169] The electronic device 100 provided in this application will be described in detail below with reference to specific embodiments.

[0170] Example 1

[0171] Figure 1 is a schematic diagram of an electronic device 100 provided in an embodiment of this application when unfolded, and Figure 2 is a schematic diagram of an electronic device 100 provided in an embodiment of this application when folded.

[0172] In the accompanying drawings of the embodiments of this application, the X-axis is defined as the length direction of the electronic device 100, the Y-axis is defined as the width direction of the electronic device 100, and the Z-axis is defined as the thickness direction of the electronic device 100. Furthermore, when the electronic device 100 is a foldable phone, more specifically, the X-axis is defined as the length direction of the electronic device 100 in its unfolded state, the Y-axis is defined as the width direction of the electronic device 100 in its unfolded state, and the Z-axis is defined as the thickness direction of the electronic device 100 in its unfolded state.

[0173] In this first embodiment, the electronic device 100 is a foldable mobile phone as an example for illustration.

[0174] Referring to Figure 2, the electronic device 100 includes a display module 200 and a housing device 500. The display module 200 is a flexible display module used for image display and can also function as a virtual keyboard for information input. The display module 200 is mounted on the housing device 500. The housing device 500 supports the display module 200 and allows the electronic device 100 to switch between a folded state and an unfolded state.

[0175] The length of the display module 200 is parallel to the length of the electronic device 100, the width of the display module 200 is parallel to the width of the electronic device 100, and the thickness of the display module 200 is parallel to the thickness of the electronic device 100.

[0176] It should be noted that in the embodiments of this application, the two parallel directions can be absolutely parallel, or a certain degree of error can be allowed. For example, the thickness direction of the display panel 240 and the thickness direction of the display module 200 can be absolutely parallel, or the thickness direction of the display panel 240 and the thickness direction of the display module 200 can be set at an angle, such as 1° or 2°.

[0177] Referring, exemplarily continuing to Figures 1 and 2, the housing device 500 includes a first housing 510, a second housing 520, and a pivot assembly 530. The first housing 510 and the second housing 520 are located on opposite sides of the pivot assembly 530, and the first housing 510 and the second housing 520 are respectively fixedly connected to opposite sides of the pivot assembly 530. In a practical implementation, the pivot assembly 530 can be fixedly connected to the first housing 510 and the second housing 520 by welding, bonding, or bolting. The first housing 510 and the second housing 520 can be relatively unfolded or folded by the movement of the pivot assembly 530. Furthermore, the interiors of the first housing 510 and the second housing 520 can be used to install devices such as processors, batteries, and cameras.

[0178] Referring again to Figure 1, the two ends of the display module 200 are respectively mounted on the first housing 510 and the second housing 520. It should be noted that the display module 200 is disposed on the same surface of the first housing 510, the second housing 520 and the pivot assembly 530, and the pivot assembly 530 can be used to support the display module 200.

[0179] The display module 200 may include a first screen area, a second screen area and a third screen area connected in sequence. The first screen area is fixed on the first housing 510 and the third screen area is fixed on the second housing 520. The first screen area and the third screen area can be fixed by means of adhesive bonding or other methods. The pivot assembly 530 is used to support the second screen area.

[0180] In this embodiment, referring to Figures 1 and 2, the hinge assembly 530 can switch between an unfolded state and a folded state. When the hinge assembly 530 is in the unfolded state, the first housing 510, the second housing 520, and the display module 200 can be unfolded. At this time, the first housing 510 and the second housing 520 can be approximately 180° apart (a slight deviation is allowed, such as 165°, 177°, or 185°). The second screen area of ​​the display module 200 can be unfolded, and the first screen area and the third screen area can be in the same plane (a slight deviation is allowed). When the hinge assembly 530 is in the folded state, the first housing 510, the second housing 520, and the display module 200 can be folded. At this time, the first housing 510 and the second housing 520 can be completely closed to be parallel to each other (a slight deviation is allowed). The second screen area of ​​the display module 200 is bent and deformed, and the first screen area and the third screen area can also be closed to be parallel to each other (a slight deviation is allowed). Of course, the hinge assembly 530 also has an intermediate state during the switching process between the unfolded state and the folded state. The electronic device 100 can switch between the unfolded state and the folded state of the hinge assembly 530 to make the first housing 510, the second housing 520 and the display module 200 move accordingly, so as to realize the folding and unfolding of the electronic device 100.

[0181] As shown in Figure 2, the housing device 500 may include a pivot assembly 530 and a first housing 510 and a second housing 520 respectively fastened to opposite sides of the pivot assembly 530. The first housing 510 and the second housing 520 can rotate towards each other to overlap and rotate away from each other to the same plane (a slight deviation is allowed). At this time, the electronic device 100 can be folded into two layers.

[0182] Of course, the housing device 500 may also include two or more first housings 510 arranged side by side, with a second housing 520 disposed between every two adjacent first housings 510. Each first housing 510 and its adjacent second housing 520 are connected by a pivot assembly 530. In this case, the electronic device 100 can be folded into three or more layers. For example, the electronic device 100 includes two first housings 510 and one second housing 520. The second housing 520 is disposed between the two first housings 510. The two sides of the second housing 520 are rotatably connected to one of the first housings 510 through a pivot assembly 530. Both first housings can rotate relative to the second housing 520 to face each other to be stacked, or the two first housings can rotate relative to the second housing 520 to be coplanar with the second housing 520 (a slight deviation is allowed). In this case, the electronic device 100 can be folded into three layers.

[0183] As shown in Figure 2, the display module 200 includes a bending region AA and a non-bending region NA. There is at least one bending region AA and at least two non-bending regions NA. The bending regions AA and non-bending regions NA are arranged alternately along the length direction of the electronic device 100 (e.g., the X direction in Figure 2), and adjacent non-bending regions NA are connected by a bending region AA. During the bending process of the electronic device 100, the area in the display module 200 that bends is defined as the bending region AA, and the area in the display module 200 that does not bend is defined as the non-bending region NA.

[0184] In some embodiments, as shown in FIG2, the electronic device 100 is a two-fold device. In this case, there are two non-bending regions NA and one bending region AA, with the bending region AA connecting two non-bending regions NA. Alternatively, in some embodiments, the electronic device 100 is a three-fold device. In this case, there are three non-bending regions NA and two bending regions AA. The bending regions AA and non-bending regions NA are arranged alternately along the length of the electronic device 100, and two adjacent non-bending regions NA are connected by a bending region AA.

[0185] In related technologies, a flexible display module includes a protective film, a first protective layer (first cover layer), a second protective layer (second cover layer), a display panel, a back film, and a bamboo book, all stacked together. The protective film is connected to the first protective layer via an optical adhesive layer; the first protective layer is connected to the second protective layer via an optical adhesive layer; the second protective layer is connected to the display panel via an optical adhesive layer; the back film is connected to the display panel via an optical adhesive layer; and the bamboo book is connected to the back film via an optical adhesive layer.

[0186] However, repeated bending of the flexible display module or prolonged bending can cause creep in the bent area, resulting in creases after unfolding and affecting the display performance. Careful analysis revealed one reason for these creases: the flexible substrate of the display panel is made of PI (polyimide), which undergoes creep (slow plastic deformation) during repeated bending, and this creep is relatively significant. Additionally, the flexible display module has a large number of layers with varying elastic moduli and thermal expansion coefficients, leading to substantial misalignment during bending.

[0187] Figure 3 is a schematic diagram of the display module 200 of the electronic device 100 shown in Figure 1, and Figure 4 is a schematic diagram of the display panel 240 in Figure 3.

[0188] Therefore, this embodiment provides a display module 200, as shown in FIG3. The display module 200 includes a protective film 210, a protective layer 220 (cover layer), a support layer 250, a display panel 240, an adhesive layer 320 (not shown in the figure), and a multilayer optical adhesive layer 230. Along the thickness direction of the display module 200 (Z direction in FIG3), the protective film 210, the protective layer 220, the display panel 240, and the support layer 250 are sequentially arranged. The protective film 210 and the protective layer 220 are located on the display side of the display panel 240, and are used to protect the display panel 240 and reduce the probability of damage to the display panel 240. The support layer 250 is located on the back side of the display panel 240, serving as a support structure to support the display panel 240 and protect it.

[0189] The display side of the display panel 240 is the side of the display panel 240 used to display the screen to the user, while the back side of the display panel 240 refers to the side opposite to the display side of the display panel 240.

[0190] In some embodiments, the thickness direction of the display panel 240, the thickness direction of the protective film 210, the thickness direction of the protective layer 220, and the thickness direction of the support layer 250 are all parallel to the thickness direction of the display module 200 (e.g., the Z direction in FIG3). The length direction of the display panel 240, the length direction of the protective film 210, the length direction of the protective layer 220, and the length direction of the support layer 250 are all parallel to the length direction of the display module 200 (e.g., the X direction in FIG3). The width direction of the display panel 240, the width direction of the protective film 210, the width direction of the protective layer 220, and the width direction of the support layer 250 are all parallel to the width direction of the display module 200 (e.g., the Z direction in FIG3).

[0191] In this embodiment of the application, as shown in FIG3, the number of protective layers 220 is one layer, compared with the prior art which uses two protective layers 220, which can reduce the number of layer structures of the display module 200, thereby reducing the amount of misalignment when the display module 200 is bent.

[0192] The protective film 210, optical adhesive layer 230 and protective layer 220 are all located on the display side of the display panel 240. The protective film 210, optical adhesive layer 230 and protective layer 220 are all made of light-transmitting materials to ensure that the light emitted by the display panel 240 passes through the protective film 210, optical adhesive layer and protective layer 220 and is received by the user.

[0193] As shown in Figure 3, the protective film 210 is connected to the protective layer 220 through the optical adhesive layer 230, and the protective layer 220 is connected to the display panel 240 through the optical adhesive layer 230. The optical adhesive layer 230 is a light-transmitting adhesive, such as OCA (optically clear adhesive).

[0194] The display panel 240 is connected to the support layer 250 via an adhesive layer 320. For example, the adhesive layer 320 can be a backing adhesive, OCA optical adhesive, or PVB (polyvinyl butyral) adhesive.

[0195] In some embodiments, the display module 200 may also include other layer structures, or the display module 200 may also include one of a protective layer 220 and a protective film 210.

[0196] Display panel 240 includes, but is not limited to, organic light-emitting diode (OLED) display panels or quantum dot light-emitting diode (QLED) display panels.

[0197] As shown in Figure 4, the display panel 240 includes a functional stack 242 and a substrate layer 241 stacked together. The substrate layer 241 serves as a support structure to support the functional stack 242. The functional stack 242 is composed of multiple layer structures. In addition, the functional stack 242 can be understood as all the layer structures in the display panel 240 located on the substrate layer 241 facing the protective layer 220.

[0198] For example, as shown in FIG4, the functional stack 242 includes a circuit layer 2421, a display layer 2422 and an encapsulation layer 2423. The circuit layer 2421 is located between the substrate layer 241 and the display layer 2422, and the encapsulation layer 2423 is located on the side of the display layer 2422 away from the substrate layer 241.

[0199] For example, as shown in FIG4, the display layer 2422 may include a pixel definition layer 2424 (PDL) and a pixel layer 2425. The pixel layer 2425 includes a plurality of pixels arranged in an array. According to the color scheme mode of the display panel 240, each pixel includes a corresponding number of sub-pixels 2426. For example, when the display panel 240 adopts a red-green-blue (RGB) color scheme mode, each pixel includes three sub-pixels 2426. The first sub-pixel 2426 is a red sub-pixel 2426, the second sub-pixel 2426 is a green sub-pixel 2426, and the third sub-pixel 2426 is a blue sub-pixel 2426. The red sub-pixel 2426, the green sub-pixel 2426, and the blue sub-pixel 2426 emit red, green, and blue light, respectively.

[0200] As shown in Figure 4, each sub-pixel 2426 includes an anode 2427, a light-emitting layer 2428, and a cathode 2429. The light-emitting layer 2428 can emit light that is directly directed toward the cathode 2429, and this part of the light is directly emitted from the cathode 2429. In addition, the light-emitting layer 2428 also emits light that is directed toward the anode 2427. This part of the light is reflected by the anode 2427 and then emitted from the cathode 2429. Therefore, the light-emitting surface of the display layer 2422 is the surface on the side of the cathode 2429, and the light is emitted from the display layer 2422 toward the encapsulation layer 2423.

[0201] There are multiple anodes 2427, with one anode 2427 corresponding to each sub-pixel 2426, and there is a gap between any two adjacent anodes 2427. In addition, the cathode 2429 of each sub-pixel 2426 is part of the cathode 2429 layer, that is, the cathodes 2429 of any two sub-pixels 2426 are a single structure.

[0202] The pixel separation layer 2424 separates the anodes 2427 of two adjacent sub-pixels 2426. The pixel separation layer 2424 includes multiple openings, including a first opening, a second opening, and a third opening. The first opening corresponds one-to-one with the green sub-pixels 2426, exposing the portion of the anode 2427 of the green sub-pixels 2426 facing the cathode 2429. The second opening corresponds one-to-one with the red sub-pixels 2426, exposing the portion of the anode 2427 of the red sub-pixels 2426 facing the cathode 2429. The third opening corresponds one-to-one with the blue sub-pixels 2426, exposing the portion of the anode 2427 of the blue sub-pixels 2426 facing the cathode 2429. It can be seen that the opening corresponds one-to-one with the sub-pixel 2426. Each opening exposes a part of the anode 2427 of the corresponding sub-pixel 2426. That is, a part of the surface of the anode 2427 facing the cathode 2429 along the thickness direction of the display panel 240 (as shown in the Z direction in Figure 4) is covered by the pixel separation layer 2424, and another part is exposed in the opening and in contact with the light-emitting layer 2428.

[0203] The encapsulation layer 2423 can encapsulate and protect the sub-pixel 2426 to isolate it from water and oxygen, thus ensuring the lifespan of the sub-pixel 2426. In some embodiments, the encapsulation layer 2423 may include a stacked first inorganic layer, an organic layer, and a second inorganic layer.

[0204] For example, as shown in FIG4, the circuit layer 2421 may include a plurality of thin film transistors 24211 (TFT) and a plurality of signal lines (not shown in the figure). The drain of the thin film transistor 24211 (not shown) is electrically connected to the anode 2427 of the sub-pixel 2426. The thin film transistor 24211 is only shown in the figure with the top gate structure.

[0205] It should be noted that, in addition to the layer structures described above, the functional stack 242 may also include other layer structures. In some embodiments, the functional stack 242 may further include a buffer layer (not shown in the figure) located between the circuit layer 2421 and the substrate layer 241, a planarization layer (not shown in the figure) located between the light-emitting layer 2428 and the circuit layer 2421, and a touch layer (not shown in the figure) located on the side of the encapsulation layer 2423 away from the substrate layer 241. The buffer layer can protect the circuit layer 2421 from external moisture, oxygen, etc., the planarization layer covers the circuit layer 2421 and provides a flat surface for the fabrication of the display layer 2422, and the touch layer is used to realize the touch function.

[0206] As shown in Figure 3, the substrate layer 241 includes a first portion 11 and a second portion 12. The first portion 11 is located in the bending region AA, and the second portion 12 is located in the non-bending region NA. Specifically, there is at least one bending region AA, and each bending region AA corresponds to a first portion 11, with the first portion 11 located in the corresponding bending region AA. There are at least two non-bending regions NA, and each non-bending region NA corresponds to a second portion 12, with the second portion 12 located inside the corresponding non-bending region NA. Along the length direction of the display panel 240 (as shown by the X direction in Figure 3), a first portion 11 is disposed between two adjacent second portions 12. For example, as shown in Figure 3, there is one first portion 11 and two second portions 12, with the two second portions 12 connected by the first portion 11.

[0207] It is understandable that "the first part 11 is located in the bending area AA" means that the first part 11 is set inside the bending area AA, and "the second part 12 is located in the non-bending area NA" means that the second part 12 is set inside the non-bending area NA.

[0208] In Embodiment 1, the substrate layer 241 is a one-piece molded glass substrate, and both the first part 11 and the second part 12 are made of glass. Since glass is an inorganic material, its creep is negligible; that is, the creep of glass is small, and it can remain flat and crease-free even after long-term use. When the first part 11 is made of glass, the creep of the first part 11 is very small, and it can remain flat and crease-free even after long-term bending and use. This reduces the creep of the bending area AA of the display module 200, thereby reducing stress concentration in the bending area AA during bending, improving the creases in the bending area AA, and increasing the flatness of the bending area AA. Furthermore, the one-piece molding of the substrate layer 241 reduces the number of parts in the display panel 240 and improves the assembly efficiency of the display panel 240.

[0209] In some possible implementations, as shown in Figure 3, along the thickness direction of the display panel 240 (the Z direction in Figure 3), at least a portion of the thickness of the second portion 12 is greater than the thickness of the first portion 11; for example, the thickness of the second portion 12 is greater than the thickness of the first portion 11. In this way, the substrate layer 241 is a glass substrate of unequal thickness, which can reduce the difficulty of bending the first portion 11. Additionally, increasing the thickness of the second portion 12 can improve the flatness of the non-bending region NA.

[0210] In some embodiments, the thicknesses of the first portion 11 and the second portion 12 may be equal at the junction of the first portion 11 and the second portion 12. In some embodiments, the thicknesses of the first portion 11 and the second portion 12 may also be unequal at the junction of the first portion 11 and the second portion 12.

[0211] In some embodiments, referring to FIG3, the thickness of the first portion 11 decreases and then increases along the direction from the first second portion 12 to the second second portion 12, and the first portion 11 has an unequal thickness design. The first second portion 12 and the second second portion 12 are two adjacent second portions 12.

[0212] In some embodiments, the first part 11 is designed with uniform thickness.

[0213] In some embodiments, the thickness of the first part 11 can be 30um to 200um, making the first part 11 a thin-thickness design and allowing it to be manufactured using common processes, thereby reducing the manufacturing difficulty and cost of the first part 11.

[0214] Of course, in addition to the thickness of the first part 11 being between 30um and 200um, in some embodiments the thickness of the first part 11 may be less than 30um or greater than 200um. For example, the thickness of the first part 11 may be 20um or 250um.

[0215] In some embodiments, as shown in FIG3, the second part 12 is designed with a uniform thickness, meaning that any two second parts 12 have the same thickness. Of course, in some scenarios, at least two second parts 12 may have different thicknesses.

[0216] In some embodiments, at least one second portion 12 may also be designed with unequal thickness, in which case the thickness of any second portion 12 is also greater than the thickness of the first portion 11.

[0217] In some embodiments, the thickness of the second part 12 can be 100um to 500um, so that the second part 12 can be manufactured using common processes, reducing the manufacturing difficulty and cost of the second part 12.

[0218] As shown in Figure 3, the thickness of any second part 12 is greater than the thickness of the first part 11. However, in some embodiments, the partial thickness of at least one second part 12 may be greater than the thickness of the first part 11. For example, when there are two second parts 12, the partial thickness of any second part 12 is greater than the thickness of the first part 11.

[0219] In some possible implementations, as shown in Figure 3, the substrate layer 241 has a first groove 21 on the side away from the functional stack 242, that is, the first groove 21 and the functional stack 242 are located on opposite sides of the substrate layer 241. At least a portion of the first groove 21 is located in the bending region AA, and the groove width of the first groove 21 along the length direction of the display panel 240 is greater than or equal to the length of the bending region AA along the length direction of the display panel 240.

[0220] In this way, by providing the first groove 21 on the side of the substrate layer 241 away from the functional stack 242, the first part 11 can be thinned, which reduces the difficulty of bending the first part 11. In addition, the surface of the substrate layer 241 in contact with the functional stack 242 can also be flat, reducing the difficulty of the substrate layer 241 supporting the functional stack 242.

[0221] Of course, in some embodiments, the first groove 21 can also be disposed on the side of the substrate layer 241 near the functional stack 242. In this case, the first groove 21 can be filled with a low-modulus adhesive. Alternatively, in some embodiments, the first groove 21 can be disposed on both opposite sides of the substrate layer 241, and the first groove 21 located on the side of the substrate layer 241 near the functional stack 242 can be filled with a low-modulus adhesive.

[0222] It is understood that two adjacent second portions 12 and the first portion 11 between two adjacent second portions 12 together form the first groove 21. In addition, the number of first grooves 21 is at least one. For example, when the electronic device 100 is a two-fold device, the number of first grooves 21 is one, or when the electronic device 100 is a three-fold device, the number of first grooves 21 is two.

[0223] In some embodiments, the first groove 21 extends along the width direction of the display panel 240. In this case, the length direction of the first groove 21 is parallel to the width direction of the display panel 240, the width direction of the first groove 21 is parallel to the length direction of the display panel 240, and the length of the first groove 21 is equal to the width of the substrate layer 241 in the width direction of the display panel 240. Thus, the first groove 21 is a strip-shaped groove.

[0224] Figure 5 is a cross-sectional schematic diagram of the substrate layer 241 in Figure 3, Figure 6 is a cross-sectional schematic diagram of the second type of substrate layer 241 provided in the embodiment of this application, Figure 7 is a cross-sectional schematic diagram of the third type of substrate layer 241 provided in the embodiment of this application, and Figure 8 is a cross-sectional schematic diagram of the fourth type of substrate layer 241 provided in the embodiment of this application.

[0225] The specific shape of the first groove 21 is not limited here. In some embodiments, as shown in FIG5, the cross-sectional shape of the first groove 21 is arc-shaped, and the cross-section of the first groove 21 is perpendicular to the width direction of the display panel 240. In this case, the groove depth of the first groove 21 first decreases and then increases.

[0226] In some embodiments, as shown in FIG6, the cross-sectional shape of the first groove 21 may include a first vertical line segment, a first horizontal line segment, and a second vertical line segment connected in sequence, wherein the first vertical line segment and the second vertical line segment are perpendicular to the first horizontal line segment.

[0227] In some embodiments, the cross-sectional shape of the first groove 21 may include a first transition segment, a second horizontal segment, and a second transition segment connected in sequence. The first transition segment and the second transition segment may be inclined straight lines (as shown in FIG7) or arc lines (as shown in FIG8), etc. The first transition segment and the second transition segment may be arc-transitioned to the second horizontal segment, and the first transition segment and the second transition segment may be arc-transitioned to the side surface of the substrate layer 241 away from the functional stack 242.

[0228] For example, the transition length of the first transition segment and the second transition segment can be 5mm to 70mm, wherein the transition length is the length of the first transition segment or the second transition segment in the length direction of the display panel 240.

[0229] In some possible implementations, the protective layer 220 can be made of glass, that is, the protective layer 220 is a second glass layer. In this case, the part of the protective layer 220 located in the bending region AA is made of glass. The glass material has low creep, which can further reduce the creep of the bending region AA of the display module 200 and further improve the crease of the bending region AA.

[0230] Figure 9 is a cross-sectional schematic diagram of the protective layer 220 provided in the embodiment of this application, which is a UFG layer.

[0231] In some embodiments, the second glass layer can be a UTG (ultra-thin glass) layer or a UFG (ultra-flexible glass) layer. Therefore, the protective layer 220 can be a UTG layer (as shown in Figure 3) or a UFG layer (as shown in Figure 9).

[0232] When the second glass layer is a UFG layer, as shown in Figure 9, the second glass layer includes a first glass portion 221 and a second glass portion 222. The first glass portion 221 corresponds one-to-one with the bending region AA and is located in the corresponding bending region AA. The second glass portion 222 corresponds one-to-one with the non-bending region NA and is located in the corresponding non-bending region NA. The thickness of the second glass portion 222 is greater than the thickness of the first glass portion 221. In this way, the first glass portion 221 is thinned, reducing the difficulty of bending the first glass portion 221 and improving the bending performance of the bending region AA.

[0233] In some embodiments, the thickness of the first glass portion 221 can be 20um to 100um, which makes it easier to bend the first glass portion 221.

[0234] Of course, in addition to the thickness of 20um to 100um, in some embodiments the thickness of the first glass portion 221 may also be greater than 100um or less than 20um.

[0235] In some embodiments, the thickness of the second glass portion 222 can be 100um to 500um, so that the thickness of the second glass portion 222 is designed to improve the stiffness of the non-bending region NA and improve the flatness of the non-bending region NA.

[0236] When the protective layer 220 is a UFG layer, at least one of the first and second sides of the protective layer 220 is provided with a thinning groove 223, as shown in Figure 9. At least a portion of the thinning groove 223 is located in the bending region AA. The length direction of the thinning groove 223 is parallel to the width direction of the display module 200, and the width direction of the thinning groove 223 is parallel to the length direction of the display module 200. The length of the thinning groove 223 is equal to the width of the protective layer 220 along the width direction of the display module 200, and the groove opening width of the thinning groove 223 is greater than or equal to the length of the bending region AA along the length direction of the display module 200. Thus, by providing the thinning groove 223, the first glass portion 221 is thinned.

[0237] The cross-sectional shape of the thinning groove 223 can be arc-shaped (as shown in Figure 9), or it can be U-shaped. Alternatively, the cross-sectional shape of the thinning groove 223 can be formed by sequentially connecting a third transition line segment, a third horizontal line segment, and a fourth transition line segment. The third transition line segment and the fourth transition line segment can be arcs, inclined straight lines, etc.

[0238] In some embodiments, the lengths of the third transition segment and the fourth transition segment can be 5mm to 70mm.

[0239] In other embodiments, the material of the protective layer 220 may also be a non-glass material, such as PET (polyethylene terephthalate), CPI (colorless polyimide), etc.

[0240] In some possible implementations, when the material of the protective layer 220 is glass, the functional stack 242 also includes a protective film layer (not shown in the figure). The protective film layer is stacked with the protective layer 220. The protective film layer is located on the side of the protective layer 220 closer to the substrate layer 241 or on the other side of the protective layer 220 away from the substrate layer 241. The protective film layer plays the role of explosion protection and impact resistance.

[0241] The protective film can be an optical epoxy resin film or a polymer material film, etc.

[0242] Figure 10 is a cross-sectional schematic diagram of another support layer 250 provided in Embodiment 1 of this application.

[0243] In some possible implementations, the support layer 250 can be a bamboo book layer (as shown in Figure 10), an elastic soft rubber layer, or a stainless steel plate (SUS), etc.

[0244] When the support layer 250 is a bamboo book layer, the display module 200 also includes a plurality of second holes 251, as shown in Figure 10. The plurality of second holes 251 are located in the bending area AA and the second holes 251 are disposed in the support layer 250.

[0245] As shown in Figure 10, the second hole 251 can be a through hole that penetrates the support layer 250 along the thickness direction of the display panel 240, or the second hole 251 can be a blind hole.

[0246] The material for the bamboo book layer can be carbon fiber, titanium alloy, stainless steel, aluminum alloy, etc.

[0247] The elastic soft rubber layer can be an elastic epoxy resin film, a TPU film (thermoplastic polyurethane film), a TPE film (thermoplastic elastomer film), a rubber film, etc.

[0248] In some embodiments, the elastic soft rubber layer is a solid structure.

[0249] In some possible implementations, the thickness of the elastic soft rubber layer can be 100um to 200um, which can be manufactured using common processes, reducing manufacturing costs, and also avoiding the problem of the support layer 250 being too thick and affecting the bending performance of the bending area AA.

[0250] In some possible implementations, the projection of the support layer 250 along the thickness direction of the display module 200 coincides with the projection of the first portion 11. That is, the orthographic projection of the support layer 250 on the substrate layer 241 coincides with the first portion 11. In this way, the support layer 250 protects the thinner first portion 11 and prevents damage to the first portion 11.

[0251] In some embodiments, the orthographic projection of the support layer 250 onto the substrate layer 241 partially coincides with the projection of the first portion 11. Alternatively, along the thickness direction of the display module 200, the projection of the support layer 250 partially coincides with the projection of the first portion 11.

[0252] In some embodiments, as shown in FIG3, the orthographic projection of the support layer 250 on the substrate layer 241 at least partially coincides with the projection of the second portion 12, that is, the projection of the support layer 250 at least partially coincides with the projection of the second portion 12. This can provide support and protection for the second portion 12.

[0253] In some embodiments, the orthographic projection of the support layer 250 on the substrate layer 241 does not coincide with the second portion 12, and the orthographic projection of the support layer 250 on the substrate layer 241 coincides with the first portion 11. In this case, the support layer 250 is attached to the surface of the first portion 11 away from the functional stack 242, or in other words, the support layer 250 is located in the bending region AA.

[0254] It should be noted that when there are multiple bending regions AA, there are multiple support layers 250. Each support layer 250 corresponds to one bending region AA, and the support layer 250 is located in the corresponding bending region AA.

[0255] In some embodiments, the support layer 250 can be directly connected to the substrate layer 241. For example, when the side of the support layer 250 facing the substrate layer 241 is adhesive, the support layer 250 is bonded to the substrate layer 241.

[0256] In some embodiments, the support layer 250 may also be indirectly connected to the substrate layer 241, for example, by providing an adhesive layer 320 between the support layer 250 and the substrate layer 241.

[0257] In some possible implementations, as shown in Figure 3, the display module 200 further includes a first circuit board 260 and a driver chip 350 (DDIC). The circuit layer 2421 and the first circuit board 260 are located on opposite sides of the substrate layer 241. A first end of the first circuit board 260 is electrically connected to the circuit layer 2421, and a second end of the first circuit board 260 is electrically connected to the motherboard of the electronic device 100. The driver chip 350 and the substrate layer 241 are located on opposite sides of the first circuit board 260, and the driver chip 350 is electrically connected to the first circuit board 260. The display panel 240 also includes an electrical connector 243, which is fixedly connected to the substrate layer 241. A first end of the electrical connector 243 is electrically connected to the circuit layer 2421, and a second end of the electrical connector 243 is electrically connected to the first circuit board 260.

[0258] In this way, the display panel 240 is electrically connected to the circuit layer 2421 and the first circuit board 260 through the electrical connector 243, and the driver chip 350 can control the display panel 240. In addition, the substrate layer 241 is made of glass, and the electrical connector 243 can be directly fabricated on the substrate layer 241. The electrical connector 243 has little impact on the black border of the display module 200, which can realize a narrow bezel design and improve the screen ratio.

[0259] In some embodiments, the first circuit board 260 is a flexible circuit board (FPC). In this case, the driver chip 350 can be directly packaged on the first circuit board 260 using COF (chip on film) technology.

[0260] In some embodiments, the first circuit board 260 may also be a printed circuit board (PCB).

[0261] In some embodiments, the first circuit board 260 can be connected to the substrate layer 241 by an adhesive 360, for example, the adhesive 360 ​​can be a backing adhesive or an optical adhesive layer 230, etc.

[0262] In some embodiments, as shown in FIG3, the orthographic projections of the first circuit board 260 and the support layer 250 on the substrate layer 241 do not overlap, and the first circuit board 260 and the support layer 250 are not stacked, which can reduce the thickness of the display module 200 and is beneficial to the thinner and lighter design of the electronic device 100.

[0263] There are multiple electrical connectors 243, and no limit is set here.

[0264] The electrical connector 243 is made of a conductive material, for example, a metallic material. The metallic material can be a low-resistivity conductive metal such as copper, silver, gold, or aluminum.

[0265] In some possible implementations, the display panel 240 also includes a first hole 23 that penetrates the substrate layer 241 along the thickness direction of the display panel 240 (as shown in FIG. 5), and at least a portion of the electrical connector 243 is located inside the first hole 23 (as shown in FIG. 3).

[0266] This avoids the electrical connector 243 affecting the black border of the display module 200, enabling an extremely narrow black border and further increasing the screen-to-body ratio.

[0267] In some embodiments, when at least a portion of the electrical connector 243 is disposed inside the first hole 23, the orthographic projection of the electrical connector 243 on the substrate 241 is located inside the substrate 241, which can further reduce the impact of the electrical connector 243 on the black border of the display.

[0268] There are multiple first holes 23, and each first hole 23 corresponds to an electrical connector 243. Each first hole 23 accommodates at least a portion of the corresponding electrical connector 243.

[0269] The first hole 23 can be a circular through hole, a rectangular through hole, a hexagonal through hole, etc., and there are no restrictions here. In addition, when there are multiple shapes of the first hole 23, at least two of the first holes 23 can have the same shape, which can improve the efficiency of drilling the first hole 23 and reduce costs.

[0270] In some embodiments, the aperture of the first hole 23 can be 10um to 50um, and it can be manufactured using common processes, reducing the manufacturing difficulty of the first hole 23.

[0271] In some embodiments, the first hole 23 can be formed on the substrate layer 241 using processes such as TGV, laser drilling, and CNC drilling. CNC drilling refers to high-precision drilling technology controlled by a computer program. TGV stands for through-glass via, an advanced packaging process that forms vertical electrical interconnects on a glass substrate.

[0272] In some embodiments, as shown in FIG3, the orthographic projection of the first hole 23 on the first circuit board 260 can be located inside the first circuit board 260, thereby shortening the connection path between the electrical connector 243 and the first circuit board 260.

[0273] The first hole 23 can be located near the edge of the substrate layer 241, or it can be located directly below the position inside the circuit layer 2421 where conduction is required. In other words, the first hole 23 can also be opened in the internal region of the substrate layer 241.

[0274] Figure 11 is a cross-sectional view of the electrical connector 243, conductive adhesive layer 280, substrate layer 241 and first circuit board 260 in Figure 3.

[0275] In some possible implementations, as shown in FIG11, the electrical connector 243 includes a conductive post 2431 and a conductive layer 2432. The conductive layer 2432 is located on the side of the substrate layer 241 away from the circuit layer 2421 of the functional stack 242. The conductive post 2431 is located inside the first hole 23. The opposite ends of the conductive post 2431 are electrically connected to the circuit layer 2421 (not shown in FIG11) and the conductive layer 2432, respectively. The first circuit board 260 is electrically connected to the conductive layer 2432.

[0276] In this way, by electrically connecting the conductive layer 2432 to the first circuit board 260, the connection area of ​​the electrical connector 243 can be increased, the electrical connection error requirement between the electrical connector 243 and the first circuit board 260 can be reduced, and the electrical connection reliability between the first circuit board 260 and the electrical connector can also be improved.

[0277] In some embodiments, as shown in FIG11, the conductive post 2431 may be a solid conductive post 2431. Alternatively, in some embodiments, the conductive post 2431 may be a hollow conductive post 2431. Or, in some embodiments, the conductive post 2431 may include a solid post portion and a hollow post portion, which are stacked along the thickness direction of the display module 200.

[0278] The conductive post 2431 is made of a metallic conductive material or a non-metallic conductive material. For example, the conductive post 2431 can be a conductive metal post formed of a low resistivity conductive metal such as copper, silver, gold, or aluminum.

[0279] The shape of the orthographic projection of the conductive layer 2432 onto the substrate layer 241 can be rectangular, circular, or other shapes.

[0280] The conductive layer 2432 is made of a metallic conductive material or a non-metallic conductive material. For example, the conductive layer 2432 can be a conductive metal layer formed of low resistivity conductive metals such as copper, silver, gold, and aluminum.

[0281] In some embodiments, the conductive layer 2432 and the conductive pillar 2431 can be integrally formed to improve the reliability of the electrical connection between the conductive layer 2432 and the conductive pillar 2431.

[0282] In some embodiments, as shown in FIG11, the conductive layer 2432 and the conductive pillar 2431 can be a separate structure.

[0283] It should be noted that, in addition to being composed of conductive post 2431 and conductive layer 2432, the electrical connector 243 can also be without conductive layer 2432 in some scenarios. In this case, the electrical connector 243 is the conductive post 2431 located inside the first hole 23.

[0284] In some possible implementations, as shown in Figure 3, the display module 200 further includes a conductive adhesive layer 280, which is located between the substrate layer 241 and the first circuit board 260. The first end of the conductive adhesive layer 280 is in electrical contact with the electrical connector 243, and the second end of the conductive adhesive layer 280 is in electrical contact with the first circuit board 260. That is, the conductive adhesive layer 280 electrically connects the electrical connector 243 and the first circuit board 260.

[0285] In this way, while the electrical connector 243 is electrically connected to the first circuit board 260, the conductive adhesive layer 280 also bonds the first circuit board 260 to the substrate layer 241, improving the reliability of the connection between the substrate layer 241 and the first circuit board 260. Furthermore, the conductive adhesive layer 280 can be coated on the surface of the first circuit board 260. After assembling the first circuit board 260 and the substrate layer 241, the conductive adhesive layer 280 makes electrical contact with the electrical connector 243, reducing the difficulty of electrically connecting the electrical connector 243 to the first circuit board 260 and improving efficiency.

[0286] In some embodiments, when the electrical connector 243 is formed by the conductive post 2431 and the conductive layer 2432, as shown in FIG11, the conductive layer 2432 is located between the first circuit board 260 and the substrate layer 241, and at least a portion of the conductive adhesive layer 280 fills the space between the conductive layer 2432 and the first circuit board 260, and the conductive layer 2432 is electrically connected to the first circuit board 260 through the conductive adhesive layer 280.

[0287] In some embodiments, when the electrical connector 243 is a conductive post 2431, at least a portion of the conductive adhesive layer 280 is filled between the conductive post 2431 and the first circuit board 260, and the conductive post 2431 is electrically connected to the first circuit board 260 through the conductive adhesive layer 280.

[0288] In some embodiments, the conductive adhesive layer 280 may be made of conductive ACF (anisotropic conductive film) to ensure that the electrical connector 243 is electrically connected to the first circuit board 260.

[0289] Of course, the material of the conductive adhesive layer 280 can also be other conductive adhesives, such as conductive silver paste, nano silver paste, conductive copper paste, etc.

[0290] Example 2

[0291] Figure 12 is a cross-sectional schematic diagram of a display module 200 provided in Embodiment 2 of this application.

[0292] The difference between Embodiment 2 and Embodiment 1 lies in the structure of the electrical connector 243, the number of layers in the protective layer 220, the inclusion of a filler 340 in the display module 200, and the removal of the support layer 250. The differences between Embodiment 2 and Embodiment 1 will be described in detail below with reference to the accompanying drawings.

[0293] In some embodiments, as shown in FIG12, the display module 200 further includes a leveling colloid 340 located inside the first groove 21, thereby leveling the first groove 21 and protecting the first portion 11.

[0294] In some embodiments, the filler 340 is made of a glue with a modulus of 1 MPa to 2 GPa, which gives the filler 340 a low modulus and reduces the effect of the filler 340 on the creases of the bending area AA.

[0295] It should be noted that the display module 200 in Figure 12 does not have a support layer 250. However, in some scenarios, the display module 200 may also include a support layer 250. The support layer 250 is located on the side of the substrate layer 241 away from the functional stack 241. The support layer 250 can be connected to the substrate layer 241 through the adhesive layer 320. In this case, the orthographic projection of the support layer 250 and the first circuit board 260 on the substrate layer 241 may partially overlap or not overlap.

[0296] In some embodiments, as shown in FIG12, the protective layer 220 has two layers, namely a first protective layer 220a and a second protective layer 220b. The first protective layer 220a is located between the protective film 210 and the second protective layer 220b, and is connected to the protective film 210 by an optical adhesive layer 230. The second protective layer 220b is located between the first protective layer 220a and the display panel 240, and is also connected to the display panel 240 by the optical adhesive layer 230.

[0297] By setting two protective layers 220, the protection effect on the display panel 240 can be further improved, and the reliability of the display module 200 can be further improved.

[0298] In some possible implementations, at least one protective layer 220 is made of materials such as glass, polyester resin (PET), transparent polyimide (CPI), or thermoplastic polyurethane elastomer (TPU).

[0299] In some embodiments, at least one protective layer 220 is a second glass layer. For example, both the first protective layer 220a and the second protective layer 220b are second glass layers, or one of the first protective layer 220a and the second protective layer 220b is a second glass layer. Thus, when the protective layer 220 is a second glass layer, the creep of the bending region AA can be further reduced, stress concentration in the bending region AA can be reduced, and creases in the bending region AA can be improved.

[0300] When the second glass layer can be a UTG layer, the second glass layer can include a first glass portion 221 and a second glass portion 222. The first glass portion 221 is located in the bending region AA, and the second glass portion 222 is located in the non-bending region NA. The thickness of the first glass portion 221 is the same as the thickness of the second glass portion 222, and the second glass layer is designed with equal thickness.

[0301] When the second glass layer is a UTG layer, the thickness of the protective layer 220 can be 30um to 200mm, which makes the thickness of the second glass layer small, reduces the difficulty of bending the second glass layer, and ensures the bending performance of the bending area AA.

[0302] In some embodiments, at least one protective layer 220 is a second glass layer, and at least one second glass layer is a UTG layer. For example, both protective layers 220 are second glass layers, and one of the two second glass layers is a UTG layer.

[0303] When the second glass layer can be a UFG layer, the thickness of the second glass portion 222 is greater than the thickness of the first glass portion 221. In this way, the first glass portion 221 is thinned, reducing the difficulty of bending the first glass portion 221 and improving the bending performance of the bending region AA.

[0304] For instructions on how to make the thickness of the second glass portion 222 greater than the thickness of the first glass portion 221, please refer to the relevant description of the protective layer 220 in Embodiment 1.

[0305] In some embodiments, at least one protective layer 220 is a second glass layer, and at least one second glass layer is a UFG layer.

[0306] In some possible implementations, as shown in Figure 12, at least a portion of the electrical connector 243 is disposed on the sidewall of the substrate layer 241. In this way, the electrical connector 243 has little impact on the black border of the display module 200 and can improve the screen ratio.

[0307] The material description of the electrical connector 243 can be found in the description in Embodiment 1, so it will not be repeated here.

[0308] In some embodiments, the electrical connector 243 is a conductive trace, which can be formed by methods such as additive processing, printed electronics, inkjet printing, and laser direct structuring (LDS).

[0309] In some embodiments, the electrical connector 243 is in direct contact with the substrate layer 241. In other embodiments, the electrical connector 243 is in indirect contact with the substrate layer 241.

[0310] Figure 13 is a three-dimensional structural diagram of another substrate layer 241 provided in Embodiment 2 of this application.

[0311] In some possible implementations, as shown in Figure 13, the sidewall of the substrate 241 is provided with a second groove 22, which accommodates at least a portion of the electrical connector 243. This arrangement of the electrical connector 243 within the second groove 22 further reduces its impact on the black border of the display module 200, thus helping to improve the screen-to-body ratio.

[0312] In some embodiments, there are multiple second grooves 22. For example, as shown in FIG13, there are four second grooves 22. Of course, the number of second grooves 22 may be more or less than four. Each second groove 22 corresponds to an electrical connector 243, and the second groove 22 accommodates the corresponding electrical connector 243.

[0313] In some embodiments, the number of second grooves 22 may also be one, in which case all electrical connectors 243 are disposed inside the second groove 22.

[0314] In some embodiments, the depth of the second groove 22 is greater than the maximum thickness of the corresponding electrical connector 243 along the depth direction of the second groove 22, ensuring that the second groove 22 accommodates the entire electrical connector 243. This avoids the electrical connector 243 affecting the black border of the display module 200, further improving the screen-to-body ratio.

[0315] In some embodiments, the groove depth of the second groove 22 may also be less than the maximum thickness of the corresponding electrical connector 243 along the depth direction of the second groove 22.

[0316] In some possible implementations, as shown in Figure 12, the display module 200 also includes an insulating adhesive, such as NCF adhesive (non-conductive film), which fills the space between the first circuit board 260 and the substrate layer 241 and contacts the electrical connectors 243, providing mechanical support and maintaining electrical insulation to prevent short circuits between adjacent electrical connectors 243.

[0317] Of course, insulating adhesives can also be other types, such as UV-cured non-conductive adhesives.

[0318] Example 3

[0319] Figure 14 is a cross-sectional schematic diagram of the first type of display module 200 provided in Embodiment 3 of this application, and Figure 15 is a cross-sectional schematic diagram of the second type of display module 200 provided in Embodiment 3 of this application.

[0320] The difference between Embodiment 3 and Embodiment 1 lies in the structure of the substrate layer 241. Specifically, as shown in Figure 14, the substrate layer 241 is a UTG layer. In this case, the thickness of the first part 11 is the same as the thickness of the second part 12. The substrate layer 241 is made of UTG glass of equal thickness, which can reduce the creep of the bending region AA and improve the creases in the bending region AA. In addition, it can also reduce the manufacturing difficulty of the display panel 240 and improve the production efficiency of the display panel 240.

[0321] In some embodiments, the thickness of the substrate layer 241 can be 30µm to 200µm, in which case the thickness of the first portion 11 and the second portion 12 are both 30µm to 200µm. By controlling the thickness of the substrate layer 241 to 30µm to 200µm, the difficulty of bending the first portion 11 can be reduced, which helps to ensure the bending performance of the bending region AA.

[0322] For example, as shown in FIG14, the substrate layer 241 is a monolithically formed UTG layer.

[0323] However, in some embodiments, along the thickness direction of the display module 200, the substrate layer 241 may also include multiple stacked glass sublayers. For example, the substrate layer 241 includes two stacked glass sublayers, and the two adjacent glass sublayers can be connected by adhesives or films such as hot melt adhesive, OCA optical adhesive, and backing adhesive located inside the non-bending region NA.

[0324] For example, as shown in FIG14, the protective layer 220 is a single layer. In this case, the material of the protective layer 220 can be glass, polyester resin (PET), transparent polyimide (CPI), or thermoplastic polyurethane elastomer (TPU), etc. In addition, when the material of the protective layer 220 is glass, the protective layer 220 can be a UTG layer or a UFG layer (as shown in FIG14).

[0325] Of course, the number of protective layers 220 can also exceed two. In some embodiments, as shown in Figure 15, the number of protective layers 220 is two. The relevant settings of the two protective layers 220 can be referred to the description in Embodiment 2, so they will not be described in detail here.

[0326] Example 4

[0327] Figure 16 is a cross-sectional schematic diagram of the first type of display module 200 provided in Embodiment 4 of this application, and Figure 17 is a cross-sectional schematic diagram of the second type of display module 200 provided in Embodiment 4 of this application.

[0328] The difference between Embodiment 4 and Embodiment 1 lies in the different electrical connection scheme between the circuit layer 2421 and the first circuit board 260. Specifically, as shown in FIG16, the display module 200 further includes a second circuit board 270, which is a flexible printed circuit board (FPC). The first end of the second circuit board 270 is located on the front side of the functional stack 242 and is electrically connected to the circuit layer 2421 of the functional stack 242. The second end of the second circuit board 270 is bent to the first circuit board 260 and is electrically connected to the first circuit board 260. The second circuit board 270 forms a slit with the sidewall of the display panel 240. In this way, the electrical connection between the circuit layer 2421 and the first circuit board 260 can be achieved using existing processes, reducing the difficulty and cost of electrical connection.

[0329] For example, the first end of the second circuit board 270 can be bonded to the connection terminal (e.g., pad) on the front side of the functional stack 242 by ACF adhesive, thereby realizing the electrical connection between the second circuit board 270 and the circuit layer 2421.

[0330] In some embodiments, as shown in FIG16, the second circuit board 270 includes a first connecting portion 271, a first bending portion 272, and a second connecting portion 273. The first connecting portion 271 is located on the front side of the functional stack 242 and is electrically connected to the circuit layer 2421 of the functional stack 242. The second connecting portion 273 is located on the side of the substrate layer 241 away from the functional stack 242 and is electrically connected to the first circuit board 260. At this time, the cross-sectional shape of the second circuit board 270 is similar to a U-shape.

[0331] In some embodiments, as shown in FIG16, the orthographic projection of the first connecting portion 271 and the protective layer 220 on the substrate layer 241 does not coincide. In this case, the protective layer 220 is recessed and offset from the first connecting portion 271. The orthographic projections of the optical adhesive layer 230 connected to the functional stack 242 and the first connecting portion 271 on the substrate layer 241 may not coincide, and the optical adhesive layer 230 connected to the functional stack 242 may be recessed and offset from the first connecting portion 271. In this way, the thickness of the optical adhesive layer 230 connected to the functional stack 242 can be avoided, which helps to reduce the thickness of the display module 200.

[0332] In some embodiments, as shown in FIG17, the orthographic projections of the optical adhesive layer 230 connected to the functional stack 242 and the first connection portion 271 on the substrate layer 241 may also partially overlap. The optical adhesive layer 230 connected to the functional stack 242 covers the first connection portion 271, thereby protecting the first connection portion 271.

[0333] The thickness of the optical adhesive layer 230 connected to the functional stack 242 can be 15um to 100um. While ensuring coverage of the first connecting part 271, the thickness of the optical adhesive layer 230 connected to the functional stack 242 is avoided to prevent it from being too thick, which helps to reduce the thickness of the display module 200.

[0334] It should be noted that the protective layer 220 can be one layer or two layers. Of course, when the protective layer 220 has two layers, the optical adhesive layer 230 between the protective layer 220 closest to the substrate layer 241 and the substrate layer 241 can cover or not cover the first connecting portion 271.

[0335] Example 5

[0336] Figure 18 is a cross-sectional schematic diagram of the first type of display module 200 provided in Embodiment 5 of this application, Figure 19 is a cross-sectional schematic diagram of the substrate layer 241 in Figure 18, and Figure 20 is a cross-sectional schematic diagram of the second type of substrate layer 241 provided in Embodiment 5 of this application.

[0337] The difference between Example 5 and Example 1 is that the substrate layer 241 is a split structure, that is, the substrate layer 241 is not integrally formed.

[0338] Specifically, as shown in Figures 18 and 19, the substrate layer 241 includes a first glass layer 31 and multiple structural layers 32. A portion of the first glass layer 31 is located in the bending region AA, and another portion is located in the non-bending region NA. The structural layers 32 are connected to the first glass layer 31, and all structural layers 32 are located on the side of the first glass layer 31 away from the functional stack 242. The multiple structural layers 32 are arranged side by side and spaced apart along the length of the display panel 240. Each structural layer 32 corresponds to a non-bending region NA, and at least a portion of the structural layer 32 is located in the corresponding non-bending region NA. Two adjacent structural layers 32 and the first glass layer 31 enclose at least a portion of the groove wall of a first groove 21.

[0339] As shown in Figure 19, the first glass layer 31 is UTG glass of uniform thickness. The thickness of the first glass layer 31 in the bending region AA is the same as the thickness of the first glass layer 31 in the non-bending region NA. During the manufacturing process of the display panel 240, the various layer structures of the functional stack 242 can be fabricated on the first glass layer 31, and finally the structural layer 32 and the first glass layer 31 are assembled. This reduces the difficulty of forming the various layer structures of the functional stack 242 on the substrate layer 241, and further improves the production efficiency of the display panel 240.

[0340] As shown in Figure 18, two adjacent structural layers 32 and the first glass layer 31 surround and form at least a portion of the groove wall of a first groove 21, such that the thickness of the first part 11 is less than the thickness of the second part 12. Furthermore, there are two second parts 12, and both second parts 12 have the same thickness. Of course, in some scenarios, the thicknesses of the two second parts 12 may not be the same.

[0341] The relevant description of the first groove 21 can be found in the relevant description in Embodiment 1, so it will not be described in detail here.

[0342] In some embodiments, the thickness of the first glass layer 31 can be 20um to 100um, and the first glass layer 31 can be manufactured using common processes, reducing the manufacturing difficulty of the first glass layer 31.

[0343] In some embodiments, the thickness of the structural layer 32 can be 100µm to 500µm, enabling the structural layer 32 to be manufactured using common processes, thus reducing the manufacturing difficulty of the structural layer 32. Additionally, it can improve the flatness of the non-bending region NA.

[0344] In some possible implementations, the material of the structural layer 32 is glass. In this way, the structural layer 32 is bonded to the first glass layer 31, which can reduce the spacing between the structural layer 32 and the first glass layer 31, thereby reducing the thickness of the substrate layer 241 and helping to reduce the thickness of the display module 200.

[0345] In some embodiments, when the material of the structural layer 32 is glass, as shown in FIG19, a portion of the structural layer 32 is located in the corresponding non-bending region NA and another portion is located in the bending region AA. In this case, the first portion 11 is jointly formed by the portion of the first glass layer 31 located in the bending region AA and the portion of the structural layer 32 located in the bending region AA.

[0346] In some embodiments, when the material of the structural layer 32 is glass, the structural layer 32 may also be located in the corresponding non-bending region NA. In this case, the first part 11 is composed of the portion of the first glass layer 31 located in the bending region AA.

[0347] In some embodiments, along the length of the display panel 240, the end of the structural layer 32 near the bending area AA may be provided with a gradually transitioning bevel (as shown in Figure 19), a C-corner, a rounded chamfer (as shown in Figure 20), or other structures.

[0348] In some possible implementations, the substrate layer 241 further includes multiple adhesive layers (not shown in the figure), each corresponding to a structural layer 32. The adhesive layers are located between the first glass layer 31 and the corresponding structural layer 32, and are bonded to both the first glass layer 31 and the corresponding structural layer 32. This reduces the difficulty of connecting the first glass layer 31 and the structural layer 32, further improving the efficiency of the connection between the first glass layer 31 and the structural layer 32.

[0349] The adhesive layer can be hot melt adhesive, OCA optical adhesive, backing adhesive, or other adhesives or films.

[0350] Of course, in some possible implementations, the structural layer 32 and the first glass layer 31 may be made of different materials than the same material. In this case, the structural layer 32 is located inside the corresponding non-bending region NA.

[0351] The structural layer 32 can be made of materials such as carbon fiber board, fiberglass board, PBO fiber board, acrylic board, plastic board, titanium alloy board, and SUS stainless steel board.

[0352] It should be noted that in some scenarios, when the material of the structural layer 32 is not glass, a portion of the structural layer 32 can be located in the bending region AA and another portion in the corresponding non-bending region NA.

[0353] Example 6

[0354] Figure 21 is a cross-sectional schematic diagram of the first type of display module 200 provided in Embodiment 6 of this application, Figure 22 is a cross-sectional schematic diagram of the substrate layer 241 in Figure 21, and Figure 23 is a cross-sectional schematic diagram of the second type of display module 200 provided in Embodiment 6 of this application.

[0355] The difference between Embodiment Six and Embodiment Five lies in the different structures of the substrate layer 241 and the different electrical connection schemes between the circuit layer 2421 and the first circuit board 260. Specifically, as shown in FIG22, the substrate layer 241 has a first accommodating space 123, which is located on the side of the substrate layer 241 away from the functional stack 242. As shown in FIG21, the display module 200 further includes a second circuit board 270, at least a portion of which is located inside the first accommodating space 123. The second circuit board 270 is electrically connected to the electrical connector 243 and the first circuit board 260.

[0356] In this way, the first circuit board 260 is electrically connected to the electrical connector 243 through the second circuit board 270, realizing the electrical connection between the circuit layer 2421 and the first circuit board 260. In addition, by accommodating the second circuit board 270 through the first accommodating space 123, the second circuit board 270 is prevented from affecting the black border of the display module 200, which helps to achieve an extremely narrow bezel.

[0357] For example, as shown in FIG22, the first accommodating space 123 is located in the non-bending region NA and in the second portion 12. There are at least two second portions 12, and at least one of the second portions 12 has the first accommodating space 123. For example, as shown in FIG22, one of the two second portions 12 has the first accommodating space 123.

[0358] At least a portion of the orthographic projection of the second circuit board 270 onto the substrate 241 is located inside the substrate 241. For example, the orthographic projection of the second circuit board 270 onto the substrate 241 is located inside the substrate 241, thereby reducing the impact of the second circuit board 270 on the black border of the display.

[0359] In some embodiments, the width of the first accommodating space 123 along the width direction of the display module 200 is equal to the width of the substrate layer 241, which can reduce the processing requirements of the substrate layer 241.

[0360] However, in some embodiments, the width of the first accommodating space 123 along the width direction of the display module 200 may also be smaller than the width of the substrate layer 241, which can improve the stiffness of the non-bending region NA.

[0361] In some embodiments, the cross-sectional shape of the first accommodating space 123 may be L-shaped, U-shaped, etc., and the cross-section of the first accommodating space 123 is perpendicular to the width direction of the display module 200.

[0362] In some embodiments, as shown in FIG21, the number of first accommodating spaces 123 is one; however, in some embodiments, the number of first accommodating spaces 123 may also be multiple.

[0363] In some embodiments, as shown in FIG22, the substrate layer 241 includes a first glass layer 31 and two structural layers 32, wherein one of the structural layers 32 and the first glass layer 31 are arranged to form a first accommodating space 123.

[0364] In some embodiments, the substrate layer 241 may also be an integrally formed glass substrate.

[0365] Since the substrate 241 has a first accommodating space 123, the substrate 241 is designed with unequal thickness. At this time, the thickness relationship between the second part 12 and the first part 11 is not restricted.

[0366] In some embodiments, as shown in FIG22, the thickness relationship between the second part 12 (without the first accommodating space 123) and the first part 11 can be referred to the thickness relationship between the first part 11 and the second part 12 in Embodiment 1.

[0367] In some embodiments, as shown in FIG22, the thickness of a portion of the second portion 12 having the first accommodating space 123 may be greater than the thickness of the first portion 11.

[0368] In some embodiments, as shown in FIG22, the second portion 12 having the first accommodating space 123 may form a first groove 21 with the first portion 11.

[0369] In some embodiments, as shown in FIG21, the display panel 240 further includes a first hole 23, the first hole 23 penetrating the substrate layer 241 and communicating with the first accommodating space 123, and at least a portion of the electrical connector 243 is located inside the first hole 23.

[0370] In some embodiments, at least a portion of the electrical connector 243 may also be disposed on the sidewall of the substrate layer 241.

[0371] In some embodiments, the second circuit board 270 is a flexible circuit board, which can reduce the difficulty of electrically connecting the second circuit board 270 to the electrical connector 243 and the first circuit board 260.

[0372] The specific structure of the second circuit board 270 after bending is not limited here. In some embodiments, the second circuit board 270 includes a third connecting portion, an inclined portion and a fourth connecting portion connected in sequence. The third connecting portion is electrically connected to the electrical connector 243, and the fourth connecting portion is electrically connected to the first circuit board 260. The third connecting portion and the fourth connecting portion are located on opposite sides of the inclined portion, so that the cross-sectional shape of the second circuit board 270 is similar to a Z-shape (as shown in Figure 21).

[0373] In some embodiments, the second circuit board 270 includes a third connecting portion, a second bending portion, and a fourth connecting portion connected in sequence. The third connecting portion and the fourth connecting portion are located on the same side of the second bending portion. The third connecting portion is electrically connected to the electrical connector 243, and the fourth connecting portion is electrically connected to the first circuit board 260. The third connecting portion, the second bending portion, and the fourth connecting portion constitute a second circuit board 270 with a U-shaped cross-section (as shown in FIG23).

[0374] There are no restrictions on how the second circuit board 270 is electrically connected to the electrical connector 243. For example, the electrical connector 243 and the second circuit board 270 can be electrically connected using an ACF bonding process.

[0375] In some embodiments, the first circuit board 260 is a flexible circuit board, and the second circuit board 270 and the first circuit board 260 can be an integral structure. In this way, the process steps of the display module 200 can be reduced and the production efficiency of the display module 200 can be improved.

[0376] In some embodiments, the first circuit board 260 and the second circuit board 270 may also be independent circuit boards, that is, the first circuit board 260 and the second circuit board 270 are separate structures.

[0377] In some possible implementations, as shown in Figure 21, the display module 200 may further include a protective adhesive element 290, at least a portion of which is disposed inside the first accommodating space 123. For example, the protective adhesive element 290 is disposed inside the first accommodating space 123, and the protective adhesive element 290 covers at least a portion of the second circuit board 270. This protects the second circuit board 270, preventing damage and improving the module's strength and reliability.

[0378] The protective adhesive component 290 can be cured using protective adhesives such as hot melt adhesive, UV adhesive, epoxy resin, or acrylic adhesive. Alternatively, the protective adhesive can be applied to the interior of the first accommodating space 123 using processes such as dispensing or inkjet printing.

[0379] In some embodiments, referring to FIG21, along the thickness direction of the display module 200, the projection of the protective adhesive 290 is located inside the projection of the substrate layer 241. That is, the orthogonal projection of the protective adhesive 290 on the substrate layer 241 is located inside the substrate layer 241, which avoids the protective adhesive 290 affecting the display black border of the display module 200 and helps the display module 200 to achieve a narrow bezel design.

[0380] In some embodiments, referring to FIG21, the orthographic projections of the protective adhesive 290 and the substrate layer 241 on the protective layer 220 are both located inside the protective layer 220. This can also prevent the protective adhesive 290 from affecting the display black border of the display module 200, which helps the display module 200 to achieve a narrow bezel design.

[0381] Example 7

[0382] Figure 24 is a cross-sectional schematic diagram of the first type of display module 200 provided in Embodiment 7 of this application; Figure 25 is a cross-sectional schematic diagram of the substrate layer 241, adhesive layer 320 and support layer 250 in Figure 24 in cooperation; and Figure 26 is a cross-sectional schematic diagram of the second type of display module 200 provided in Embodiment 7 of this application.

[0383] The difference between Embodiment 7 and Embodiment 6 lies in the structure of the substrate 241, the structure and arrangement of the support layer 250, and the connection position of the first circuit board 260. Specifically, as shown in FIG24, the substrate 241 and the first circuit board 260 are located on opposite sides of the support layer 250. As shown in FIG25, the substrate 241 and the support layer 250 form at least a portion of the inner wall of the second accommodating space 126, and at least a portion of the second circuit board 270 is located inside the second accommodating space 126. For example, the second circuit board 270 is located inside the second accommodating space 126, and the electrical connector 243 is electrically connected to the first circuit board 260 through the second circuit board 270.

[0384] In this way, the first circuit board 260 is electrically connected to the electrical connector 243 through the second circuit board 270, realizing the electrical connection between the circuit layer 2421 and the first circuit board 260. In addition, by accommodating the second circuit board 270 through the second accommodating space 126, the impact of the second circuit board 270 on the display black border of the display module 200 is reduced, which helps to realize the bezel.

[0385] The first circuit board 260 is fixedly connected to the support layer 250. For example, the first circuit board 260 can be connected to the support layer 250 by adhesives 360 such as adhesive backing or OCA adhesive.

[0386] In some embodiments, the support layer 250 is directly connected to the substrate layer 241, in which case the support layer 250 and the substrate layer 241 enclose a second accommodating space 126.

[0387] In some embodiments, the support layer 250 is indirectly connected to the substrate layer 241 through the adhesive layer 320. In this case, the support layer 250, the substrate layer 241 and the adhesive layer 320 surround and form a second accommodating space 126.

[0388] In some embodiments, the orthographic projection of the second circuit board 270 on the substrate 241 is located inside the substrate 241, so as to avoid the second circuit board 270 affecting the display black border of the display module 200 and to achieve an extremely narrow bezel.

[0389] In some embodiments, as shown in FIG25, the display panel 240 has a first hole 23 penetrating the substrate layer 241, the first hole 23 communicating with the second accommodating space 126, and at least a portion of the electrical connector 243 being located inside the first hole 23.

[0390] In some embodiments, at least a portion of the electrical connector 243 may also be disposed on the sidewall of the substrate layer 241.

[0391] In some embodiments, as shown in FIG24, the substrate layer 241 is designed with a uniform thickness. The substrate layer 241 can be a one-piece molded glass substrate, or the substrate layer 241 can be a split structure. For example, the substrate layer 241 is composed of multiple stacked glass sub-layers, and adjacent glass sub-layers can be connected by adhesives or films such as hot melt adhesive, OCA optical adhesive, and backing adhesive located in the non-bending region NA.

[0392] In some embodiments, the substrate 241 may also be designed with uneven thickness. In this case, the substrate 241 may include, but is not limited to, the substrate 241 described in Embodiment 1, Embodiment 5, Embodiment 6, etc.

[0393] In some possible implementations, as shown in Figure 24, the display module 200 may further include a protective adhesive element 290, at least a portion of which is disposed within the second accommodating space 126. For example, the protective adhesive element 290 is disposed within the second accommodating space 126. The protective adhesive element 290 covers at least a portion of the second circuit board 270. This protects the second circuit board 270 from damage, thereby improving the module's strength and reliability.

[0394] The protective adhesive component 290 can be cured using protective adhesives such as hot melt adhesive, UV adhesive, epoxy resin, or acrylic adhesive. Alternatively, the protective adhesive can be applied to the interior of the second accommodating space 126 using processes such as dispensing or inkjet printing.

[0395] In some embodiments, the orthographic projection of the protective adhesive 290 on the substrate 241 is located inside the substrate 241, which avoids the protective adhesive 290 affecting the display black border of the display module 200 and helps the display module 200 achieve a narrow bezel design.

[0396] In some embodiments, the orthographic projections of the protective adhesive 290 and the substrate layer 241 onto the protective layer 220 are both located inside the protective layer 220. This can also prevent the protective adhesive 290 from affecting the black border of the display module 200, which helps the display module 200 achieve a narrow bezel design.

[0397] In some possible implementations, the display module 200 also includes a plurality of second holes 251, as shown in FIG25. The plurality of second holes 251 are located in the bending region AA and the second holes 251 are disposed in the support layer 250, such that the support layer 250 is a bamboo book layer.

[0398] In some embodiments, the second hole 251 is a through hole that penetrates the support layer 250 along the thickness direction of the display panel 240.

[0399] In some embodiments, the thickness of the bamboo book layer can be 100um to 200um. Of course, the thickness of the bamboo book layer can also be other thicknesses, for example, less than 100um or greater than 200um.

[0400] It should be noted that the detailed description of the bamboo book layer has been described in Embodiment 1, and can be referred to the description in Embodiment 1. It will not be repeated here.

[0401] In some possible implementations, as shown in Figure 24, the display module 200 further includes multiple soft gel bodies 310, each corresponding to a second hole 251, with the soft gel body 310 filling the interior of the corresponding second hole 251. This improves the bending performance of the bending area AA.

[0402] The soft colloid 310 can be filled with a low-modulus soft colloid, for example, the modulus of the soft colloid 310 can be 10 kPa to 5 MPa.

[0403] In some possible implementations, as shown in Figure 25, the display module 200 further includes an adhesive layer 320, which is located between the substrate layer 241 and the support layer 250. The adhesive layer 320 is bonded to both the substrate layer 241 and the support layer 250, and the support layer 250 is connected to the substrate layer 241 through the adhesive layer 320.

[0404] In some embodiments, the thickness of the adhesive layer 320 can be 15µm to 50µm, which can reduce the impact of the adhesive layer 320 on the thickness of the display module 200 and help to thin the display module 200.

[0405] In some possible implementations, as shown in Figure 25, the adhesive layer 320 includes multiple adhesive portions 321, each including a first adhesive portion 321a and a second adhesive portion 321b. The first adhesive portion 321a corresponds one-to-one with the bending region AA, and the second adhesive portion 321b corresponds one-to-one with the non-bending region NA, also located within the corresponding non-bending region NA. The first adhesive portions 321a and second adhesive portions 321b are arranged alternately along the length of the display module 200, with a first adhesive portion 321a positioned between two adjacent second adhesive portions 321b. The first adhesive portions 321a and second adhesive portions 321b have the same modulus. This reduces the impact of the adhesive layer 320 on the bending region AA, decreases stress concentration in the bending region AA, and improves the appearance of creases in the bending region AA.

[0406] The adhesive layer 320 can be made of a low-modulus adhesive, for example, the modulus of the adhesive layer 320 can be 10 kPa to 5 MPa.

[0407] Of course, in addition to having the same modulus, the elastic modulus of the first colloidal portion 321a and the second colloidal portion 321b may also be smaller than that of the second colloidal portion 321b in some embodiments. This way, while ensuring the bending performance of the bending region AA, the flatness of the non-bending region NA can be improved.

[0408] The first colloidal portion 321a is made of a low-modulus adhesive, for example, the first colloidal portion 321a can be made of a low-modulus adhesive with a modulus of 10 kPa to 5 MPa.

[0409] The second colloidal portion 321b is made of a high-modulus adhesive. For example, the second colloidal portion 321b can be made of a high-modulus adhesive with a modulus of 1 MPa to 100 MPa.

[0410] Of course, in addition to a portion being located inside the bending region AA and another portion being located in the non-bending region NA, in some possible implementations, as shown in Figure 26, the adhesive layer 320 includes multiple adhesive portions 321, each corresponding to a non-bending region NA. The adhesive portion 321 is located in the corresponding non-bending region NA, or in other words, an adhesive portion 321 is provided inside any non-bending region NA.

[0411] In this way, the adhesive layer 320 is arranged on the outside of the bending area AA, which can reduce the creep of the bending area AA, further reduce the stress concentration of the bending area AA, and improve the crease of the bending area AA.

[0412] The colloidal portion 321 can be made of a high-modulus adhesive. For example, the colloidal portion 321 can be made of a high-modulus adhesive with a modulus of 1 MPa to 100 MPa.

[0413] Based on the above embodiments one through seven, it can be seen that:

[0414] Provided that the material of the first part 11 is glass, the substrate layer 241 may have designs including but not limited to the following: 1. The substrate layer 241 has a uniform thickness design, and the substrate layer 241 may be integrally formed or a separate structure. 2. The substrate layer 241 has an unequal thickness design, and the substrate layer 241 may be integrally formed or a separate structure. 4. The substrate layer 241 has a first accommodating space 123, in which case the substrate layer 241 may have a uniform thickness design or an unequal thickness design.

[0415] When the substrate layer 241 has an uneven thickness design, the first groove 21 can be filled by the leveling colloid 340. Additionally, the substrate layer 241 and the support layer 250 form a second accommodating space 126. It should be noted that the display module 200 contains either a first accommodating space 123 or a second accommodating space 126.

[0416] Electrical connection scheme between circuit layer 2421 and first circuit board 260: 1. Electrical connector 243 electrically connects circuit layer 2421 and first circuit board 260. At least part of electrical connector 243 is located inside the first hole 23, or at least part of electrical connector 243 is disposed on the sidewall of substrate layer 241. 2. Electrical connector 243 is electrically connected to first circuit board 260 through conductive adhesive layer 280. 3. Electrical connector 243 is electrically connected to first circuit board 260 through second circuit board 270. At this time, at least part of second circuit board 270 is disposed inside the first accommodating space 123 or the second accommodating space 126. 4. The first end of second circuit board 270 is bonded to the front side of functional stack 242, and the second end of second circuit board 270 is bent to first circuit board 260 and electrically connected to first circuit board 260. Second circuit board 270 and display panel 240 form a slit.

[0417] The relationship between the first circuit board 260 and the second circuit board 270 is as follows: 1. The first circuit board 260 and the second circuit board 270 are independent circuit boards. 2. The first circuit board 260 and the second circuit board 270 are an integrated structure.

[0418] The structure of the support layer 250 is as follows: 1. The support layer 250 is a bamboo-like layer, an elastic soft rubber layer, or a stainless steel plate (SUS). 2. The support layer 250 is at least partially located in the bending area AA. 3. The orthographic projection of the support layer 250 and the first circuit board 260 on the substrate layer 241 does not coincide or partially coincides. 4. When the support layer 250 is a bamboo-like layer, the second hole 251 is filled with soft rubber 310.

[0419] The structure of adhesive layer 320: 1. A portion of adhesive layer 320 is disposed inside the bending region AA, and another portion is disposed inside the non-bending region NA. In this case, the modulus of the portion of adhesive layer 320 in the bending region AA and the portion of adhesive layer 320 in the non-bending region NA may be the same or different. 2. Adhesive layer 320 is disposed inside the non-bending region NA.

[0420] The structure of the protective layer 220: 1. The number of protective layers 220 is one or two. 2. At least one protective layer 220 can be a UTG layer, a UFG layer, a CPI layer, a PET layer, etc.

[0421] Therefore, provided that the material of the first part 11 is glass, the various structures of the substrate layer 241, the various electrical connection schemes, the various relationships between the first circuit board 260 and the second circuit board 270, the various structures of the support layer 250, the various structures of the adhesive layer 320, the various structures of the protective layer 220, the leveling colloid 340, the second accommodating space 126, etc., can be freely combined. The display module 200 obtained by free combination can include, but is not limited to, the display module 200 in Embodiments 1 to 7.

[0422] Example 8

[0423] Figure 27 is an exploded view of an electronic device 100 provided in Embodiment 8 of this application, Figure 28 is a cross-sectional view of the display module 200 in Figure 27, and Figure 29 is a cross-sectional view of the substrate layer 241 in Figure 28.

[0424] In this eighth embodiment, as shown in Figure 27, the electronic device 100 is a candybar mobile phone as an example for explanation.

[0425] Referring to Figure 27, the electronic device 100 includes a housing 500 and a display module 200. The display module 200 is a rigid display module and is connected to the housing 500. The housing 500 may include a mid-frame 540 and a rear cover 550. The rear cover 550 and the display module 200 are located on opposite sides of the mid-frame 540 and are respectively connected to the mid-frame 540. The rear cover 550 and the mid-frame 540 can form a cavity for accommodating a battery, a motherboard, and a camera module.

[0426] It should be noted that the display module 200 provided in Embodiment 8 can be applied not only to candybar phones, but also to slide-out phones and the outer screen of foldable phones. The outer screen can be understood as the screen exposed when the foldable phone is folded. Alternatively, it can also be applied to the display screen of a laptop, the screen of a smart TV, the display screen of a smartwatch, the display screen of a wearable device, and so on.

[0427] As shown in Figure 28, the display module 200 includes a cover plate 410 (gurved class, CG), a display panel 240, a first circuit board 260, and a protective stack 420. The cover plate 410 and the first circuit board 260 are located on opposite sides of the display panel 240. The orthographic projection of the display panel 240 onto the cover plate 410 is located inside the cover plate 410, and the edge of the cover plate 410 extends beyond the display panel 240, protecting the display panel 240. The protective stack 420 and the first circuit board 260 are located on the same side of the display panel 240, and the protective stack 420 can protect the display panel 240.

[0428] It should be noted that, in addition to the parts shown in FIG28, the display module 200 may also include other parts. For example, the display module 200 may also include a polarizer (POL). The polarizer is located between the cover plate 410 and the display panel 240. The polarizer is connected to the cover plate 410 through an optical adhesive layer 230, and the polarizer is connected to the display panel 240 through an optical adhesive layer 230.

[0429] The cover plate 410 is made of a light-transmitting material, such as glass, to ensure that the light emitted by the display panel 240 is acceptable to the user. Additionally, the cover plate 410 can be connected to the display panel 240 via an optical adhesive layer 230.

[0430] The optical adhesive layer 230 can be made of optically clear adhesive (OCA), such as acrylic or silicone optically clear adhesives. Alternatively, the optical adhesive layer 230 can also be made of optically clear resin (OCR), such as epoxy resin.

[0431] In some embodiments, the protective layer 420 includes at least one protective sublayer. When there are multiple protective sublayers, the multiple protective sublayers are stacked along the thickness direction of the display module 200, and adjacent protective sublayers are connected by adhesive. The protective sublayer closest to the display panel 240 in the multiple protective sublayers is connected to the display panel 240 by adhesive.

[0432] The bonding adhesive can be optically clear adhesive (OCA), optically clear resin (OCR), etc.

[0433] In some embodiments, the protective stack 420 may include two protective sub-layers. The material of the protective sub-layer closest to the display panel 240 may be PET, and the material of the protective sub-layer furthest from the display panel 240 may be copper foil or aluminum foil.

[0434] Display panel 240 includes, but is not limited to, organic light-emitting diode (OLED) display panels or quantum dot light-emitting diode (QLED) display panels.

[0435] As shown in Figure 28, the display panel 240 includes a substrate layer 241 and a functional stack 242 stacked together. The functional stack 242 is located between the substrate layer 241 and the cover plate 410, and the functional stack 242 and the cover plate 410 are connected by an optical adhesive layer 230. The substrate layer 241 can serve as a support structure to support the functional stack 242. The functional stack 242 is composed of multiple layer structures. In addition, the functional stack 242 can be understood as all the layer structures in the display panel 240 located on the substrate layer 241 facing the protective layer 220.

[0436] For example, referring to FIG4, the functional stack 242 includes a circuit layer 2421, a display layer 2422 and an encapsulation layer 2423. The circuit layer 2421 is located between the substrate layer 241 and the display layer 2422, and the encapsulation layer 2423 is located on the side of the display layer 2422 away from the substrate layer 241.

[0437] It should be noted that the specific structure of the functional stack 242 can be referred to the description in Embodiment 1, so it will not be described in detail here.

[0438] In this eighth embodiment, the substrate 241 is made of glass, making it a glass substrate. In some embodiments, as shown in FIG29, the substrate 241 can be a UTG layer. In other embodiments, the substrate 241 can also be a UFG layer (for example, as shown in FIG3), and the surface of the substrate 241 near the functional stack 242 is a flat surface.

[0439] In some embodiments, the thickness of the substrate 241 can be 30µm to 200µm, and it can be manufactured using existing processes, resulting in a thinner substrate 241.

[0440] As shown in Figure 3, the first circuit board 260 carries the driver chip 350 (DDIC). The circuit layer 2421 of the first circuit board 260 and the functional stack 242 are located on opposite sides of the substrate layer 241, respectively. The first end of the first circuit board 260 is electrically connected to the circuit layer 2421, and the second end of the first circuit board 260 is electrically connected to the motherboard of the electronic device 100.

[0441] In some embodiments, the first circuit board 260 is a flexible circuit board (FPC). In this case, the driver chip 350 can be directly packaged on the first circuit board 260 using COF (chip on film) technology.

[0442] In some embodiments, the first circuit board 260 may also be a printed circuit board (PCB).

[0443] In some embodiments, as shown in FIG28, the orthographic projections of the first circuit board 260 and the protective stack 420 on the cover plate 410 do not coincide, the first circuit board 260 and the protective stack 420 are offset in the thickness direction of the display module 200, and the first circuit board 260 is connected to the substrate layer 241.

[0444] In some embodiments, the first circuit board 260 and the display panel 240 may also be located on opposite sides of the protective stack 420, with the first circuit board 260 connected to the protective stack 420.

[0445] In some embodiments, as shown in FIG28, the display module 200 further includes an adhesive 360, through which the first circuit board 260 can be connected to the substrate layer 241 or the protective stack 420. For example, the adhesive 360 ​​can be a backing adhesive or an optical adhesive layer 230, etc.

[0446] As shown in Figure 28, the display panel 240 also includes an electrical connector 243, which is fixedly connected to the substrate layer 241 and electrically connected to the circuit layer 2421 and the first circuit board 260. Since the substrate layer 241 is made of glass, it has high rigidity, allowing the electrical connector 243 to be directly fabricated on it. The electrical connector 243 has minimal impact on the black border of the display module 200, enabling a narrow black border and improving the screen-to-body ratio.

[0447] The number of electrical connectors 243 can be one or more, and there is no limit to the number.

[0448] The electrical connector 243 is made of a conductive material, for example, a metallic material. The metallic material can be a low-resistivity conductive metal such as copper, silver, gold, or aluminum.

[0449] In some possible implementations, as shown in Figures 28 and 29, the display panel 240 further includes a first hole 23. The first hole 23 penetrates the substrate layer 241 along the thickness direction of the display panel 240 (the Z direction in Figure 29), and at least a portion of the electrical connector 243 is located inside the first hole 23. This avoids the electrical connector 243 affecting the black border of the display module 200, enabling an extremely narrow black border and further improving the screen-to-body ratio.

[0450] There are multiple first holes 23, and each first hole 23 corresponds to an electrical connector 243. Each first hole 23 can accommodate at least a portion of the corresponding electrical connector 243.

[0451] The first hole 23 can be a circular through hole, a rectangular through hole, a hexagonal through hole, etc., and there are no restrictions here. In addition, when there are multiple shapes of the first hole 23, at least two of the first holes 23 can have the same shape, which can improve the efficiency of drilling the first hole 23 and reduce costs.

[0452] In some embodiments, the aperture of the first hole 23 can be 10um to 50um, and it can be manufactured using common processes, reducing the manufacturing difficulty of the first hole 23.

[0453] In some embodiments, the first hole 23 can be formed on the substrate layer 241 using processes such as TGV, laser drilling, and CNC drilling. CNC drilling refers to high-precision drilling technology controlled by a computer program. TGV stands for through-glass via, an advanced packaging process that forms vertical electrical interconnects on a glass substrate.

[0454] In some embodiments, referring to FIG28, the orthographic projection of the first hole 23 on the first circuit board 260 can be located inside the first circuit board 260, shortening the connection path between the electrical connector 243 and the first circuit board 260. In addition, the first hole 23 can be close to the edge of the substrate layer 241, or it can be directly below the position inside the circuit layer 2421 where conduction is required, that is, the first hole 23 can also be formed in the internal region of the substrate layer 241.

[0455] In some embodiments, the orthographic projection of the electrical connector 243 onto the substrate 241 is located inside the substrate 241, which can further reduce the impact of the electrical connector 243 on the black border of the display.

[0456] In some possible implementations, as shown in FIG28, the electrical connector 243 includes a conductive post 2431 and a conductive layer 2432. The conductive layer 2432 is located on the side of the substrate layer 241 away from the circuit layer 2421. The conductive post 2431 is located inside the first hole 23. The opposite ends of the conductive post 2431 are electrically connected to the circuit layer 2421 and the conductive layer 2432, respectively. The first circuit board 260 is electrically connected to the conductive layer 2432.

[0457] In this way, by electrically connecting the conductive layer 2432 to the first circuit board 260, the connection area of ​​the electrical connector 243 can be increased, the electrical connection error requirement between the electrical connector 243 and the first circuit board 260 can be reduced, and the electrical connection reliability between the first circuit board 260 and the electrical connector can also be improved.

[0458] In some embodiments, as shown in FIG28, the conductive post 2431 may be a solid conductive post. Alternatively, in some embodiments, the conductive post 2431 may be a hollow conductive post. Or, in some embodiments, the conductive post 2431 may include a solid post portion and a hollow post portion, which are stacked along the thickness direction of the display module 200.

[0459] The conductive post 2431 is made of a metallic conductive material or a non-metallic conductive material. For example, the conductive post 2431 can be a conductive metal post formed of a low resistivity conductive metal such as copper, silver, gold, or aluminum.

[0460] The shape of the orthographic projection of the conductive layer 2432 onto the substrate layer 241 can be rectangular, circular, or other shapes.

[0461] The conductive layer 2432 is made of a metallic conductive material or a non-metallic conductive material. For example, the conductive layer 2432 can be a conductive metal layer formed of low resistivity conductive metals such as copper, silver, gold, and aluminum.

[0462] In some embodiments, as shown in FIG28, the conductive layer 2432 and the conductive pillar 2431 are separate structures.

[0463] In some embodiments, the conductive layer 2432 and the conductive pillar 2431 can be integrally formed to improve the reliability of the electrical connection between the conductive layer 2432 and the conductive pillar 2431.

[0464] It should be noted that, in addition to being composed of conductive post 2431 and conductive layer 2432, the electrical connector 243 can also be without conductive layer 2432 in some scenarios. In this case, the electrical connector 243 is the conductive post 2431 located inside the first hole 23.

[0465] In some possible implementations, as shown in FIG28, the display module 200 further includes a conductive adhesive layer 280, which is located between the substrate layer 241 and the first circuit board 260. The first end of the conductive adhesive layer 280 is in electrical contact with the electrical connector 243, and the second end of the conductive adhesive layer 280 is in electrical contact with the first circuit board 260.

[0466] In this way, while the electrical connector 243 is electrically connected to the first circuit board 260, the conductive adhesive layer 280 also bonds the first circuit board 260 to the substrate layer 241, improving the reliability of the connection between the substrate layer 241 and the first circuit board 260. Furthermore, the conductive adhesive layer 280 can be coated on the surface of the first circuit board 260. After assembling the first circuit board 260 and the substrate layer 241, the conductive adhesive layer 280 makes electrical contact with the electrical connector 243, reducing the difficulty of electrically connecting the electrical connector 243 to the first circuit board 260 and improving efficiency.

[0467] In some embodiments, when the electrical connector 243 is formed by the conductive post 2431 and the conductive layer 2432, the conductive layer 2432 is located between the first circuit board 260 and the substrate layer 241, and at least a portion of the conductive adhesive layer 280 is filled between the conductive layer 2432 and the first circuit board 260, and the conductive layer 2432 is electrically connected to the first circuit board 260 through the conductive adhesive layer 280.

[0468] In some embodiments, when the electrical connector 243 is a conductive post 2431, at least a portion of the conductive adhesive layer 280 is filled between the conductive post 2431 and the first circuit board 260, and the conductive post 2431 is electrically connected to the first circuit board 260 through the conductive adhesive layer 280.

[0469] In some embodiments, the conductive adhesive layer 280 may be made of conductive ACF (anisotropic conductive film) to ensure that the electrical connector 243 is electrically connected to the first circuit board 260.

[0470] Of course, the material of the conductive adhesive layer 280 can also be other conductive adhesives, such as conductive silver paste, nano silver paste, conductive copper paste, etc.

[0471] Example 9

[0472] Figure 30 is a cross-sectional schematic diagram of a display module 200 provided in Embodiment 9 of this application.

[0473] The difference between Embodiment Nine and Embodiment Eight lies in the structure of the electrical connector 243. Specifically, as shown in FIG30, at least a portion of the electrical connector 243 is disposed on the sidewall of the substrate layer 241. In this way, the electrical connector 243 has a smaller impact on the black border of the display module 200, thereby reducing the black border of the display module 200 and increasing the screen-to-body ratio.

[0474] In some embodiments, the electrical connector 243 is a conductive trace, which can be formed by methods such as additive processing, printed electronics, inkjet printing, and laser direct structuring (LDS).

[0475] In some embodiments, the electrical connector 243 is in direct contact with the substrate layer 241. In other embodiments, the electrical connector 243 is in indirect contact with the substrate layer 241.

[0476] In some possible implementations, the sidewall of the substrate 241 is provided with a second groove 22, which accommodates at least a portion of the electrical connector 243. This arrangement of the electrical connector 243 within the second groove 22 reduces its impact on the black border of the display module 200, thus helping to further improve the screen-to-body ratio.

[0477] In some embodiments, there are multiple second grooves 22, each corresponding to an electrical connector 243, and each second groove 22 accommodates at least a portion of the corresponding electrical connector 243.

[0478] In some embodiments, the number of second grooves 22 is one, and the second groove 22 accommodates at least a portion of any electrical connector 243.

[0479] In some embodiments, the depth of the second groove 22 is greater than the maximum thickness of the corresponding electrical connector 243 along the depth direction of the second groove 22, ensuring that the second groove 22 accommodates the entire electrical connector 243. This prevents the electrical connector 243 from affecting the black border of the display module 200.

[0480] In some embodiments, the groove depth of the second groove 22 may also be less than the maximum thickness of the corresponding electrical connector 243 along the depth direction of the second groove 22.

[0481] In some embodiments, as shown in FIG30, the display module 200 further includes an insulating adhesive, such as NCF adhesive (non-conductive film), which fills between the first circuit board 260 and the substrate layer 241 and contacts the electrical connector 243, providing mechanical support and maintaining electrical insulation to prevent short circuits between two adjacent electrical connectors 243.

[0482] Example 10

[0483] Figure 31 is a cross-sectional schematic diagram of a display module 200 provided in Embodiment 10 of this application, and Figure 32 is a cross-sectional schematic diagram of the substrate layer 241 in Figure 31.

[0484] The difference between Embodiment 10 and Embodiment 8 lies in the different structures of the substrate layer 241 and the different electrical connection schemes between the circuit layer 2421 and the first circuit board 260. Specifically, as shown in FIG32, the substrate layer 241 has a third accommodating space 15, which is located on the side of the substrate layer 241 away from the circuit layer 2421. The display module 200 also includes a second circuit board 270, which is a flexible circuit board. At least a portion of the second circuit board 270 is located inside the third accommodating space 15, and the second circuit board 270 is electrically connected to the electrical connector 243 and the first circuit board 260.

[0485] In this way, the first circuit board 260 is electrically connected to the electrical connector 243 through the second circuit board 270, realizing the electrical connection between the circuit layer 2421 and the first circuit board 260. In addition, by accommodating the second circuit board 270 through the third accommodating space 15, the impact of the second circuit board 270 on the display black border of the display module 200 is reduced, and a narrow bezel can be achieved.

[0486] For example, as shown in FIG32, the substrate layer 241 includes a third portion 13 and a fourth portion 14, which are arranged side by side along the length direction of the display panel 240 (X direction in FIG32). The thickness of the third portion 13 is less than the thickness of the fourth portion 14, and the third portion 13 and the fourth portion 14 enclose a third accommodating space 15.

[0487] In some embodiments, the orthographic projection of the second circuit board 270 onto the substrate 241 is located inside the substrate 241, which can prevent the second circuit board 271 from affecting the black border of the display module 200.

[0488] In some embodiments, as shown in FIG32, the display panel 240 further includes a first hole 23, which penetrates the substrate layer 241 along the thickness direction of the display module 200. The first hole 23 communicates with the third accommodating space 15, and at least a portion of the electrical connector 243 is located inside the first hole 23.

[0489] In some embodiments, at least a portion of the electrical connector 243 may also be disposed on the sidewall of the substrate layer 241.

[0490] The specific structure of the second circuit board 270 after bending is not limited here. In some embodiments, the second circuit board 270 includes a third connecting portion, an inclined portion and a fourth connecting portion connected in sequence. The third connecting portion is electrically connected to the electrical connector 243, and the fourth connecting portion is electrically connected to the first circuit board 260. The third connecting portion and the fourth connecting portion are located on opposite sides of the inclined portion, so that the cross-section of the second circuit board 270 is Z-shaped (as shown in Figure 31).

[0491] In some embodiments, the second circuit board 270 includes a third connecting portion, a second bending portion, and a fourth connecting portion connected in sequence. The third connecting portion and the fourth connecting portion are located on the same side of the second bending portion. The third connecting portion is electrically connected to the electrical connector 243, and the fourth connecting portion is electrically connected to the first circuit board 260. The third connecting portion, the second bending portion, and the fourth connecting portion form a U-shape. In this case, the cross-sectional shape of the second circuit board 270 is U-shaped (as shown in FIG23).

[0492] There are no restrictions on how the second circuit board 270 is electrically connected to the electrical connector 243. For example, the electrical connector 243 and the second circuit board 270 can be electrically connected using an ACF bonding process.

[0493] In some embodiments, the first circuit board 260 is a flexible circuit board, and the second circuit board 270 and the first circuit board 260 can be an integral structure. This reduces the number of process steps in the display module 200 and improves the production efficiency of the display module 200.

[0494] In some embodiments, the first circuit board 260 and the second circuit board 270 may also be independent circuit boards, that is, the first circuit board 260 and the second circuit board 270 are separate structures.

[0495] In some possible implementations, as shown in Figure 31, the display module 200 may further include a protective adhesive element 290, at least a portion of which is disposed within the third accommodating space 15, and which covers at least a portion of the second circuit board 270. This prevents damage to the second circuit board 270 and improves the module's strength and reliability.

[0496] The protective adhesive component 290 can be cured using protective adhesives such as hot melt adhesive, UV adhesive, epoxy resin, or acrylic adhesive. Alternatively, the protective adhesive can be applied to the interior of the third accommodating space 15 using processes such as dispensing or inkjet printing.

[0497] In some embodiments, a portion of the protective adhesive element 290 is located inside the third accommodating space 15, and another portion of the protective adhesive element 290 is located outside the third accommodating space 15.

[0498] In some embodiments, referring to FIG31, the orthographic projection of the protective adhesive element 290 on the cover plate 410 is located inside the cover plate 410, and the orthographic projection of the protective adhesive element 290 on the cover plate 410 partially overlaps with the orthographic projection of the substrate layer 241 on the cover plate 410. This reduces the difficulty of dispensing the protective adhesive.

[0499] In some embodiments, the orthographic projection of the protective adhesive 290 onto the substrate 241 is located inside the substrate 241.

[0500] Example 11

[0501] Figure 33 is a cross-sectional schematic diagram of a display module 200 provided in Embodiment 11 of this application.

[0502] The difference between Embodiment 11 and Embodiment 10 is that the substrate layer 241 and the protective stack 420 form a fourth accommodating space 18 for accommodating the second circuit board 270.

[0503] Specifically, as shown in Figure 33, the substrate 241 and the first circuit board 260 are located on opposite sides of the protective stack 420, forming a fourth accommodating space 18 with the protective stack 420 and the substrate 241. At least a portion of the second circuit board 270 is located inside the fourth accommodating space 18, and the second circuit board 270 is electrically connected to the electrical connector 243 and the first circuit board 260. This reduces the manufacturing difficulty of the substrate 241 and improves the production efficiency of the display panel 240. Furthermore, it increases the area of ​​the protective stack 420 that protects the substrate 241.

[0504] In some embodiments, the orthographic projection of the second circuit board 270 onto the substrate 241 is located inside the substrate 241, which can prevent the second circuit board 271 from affecting the black border of the display module 200.

[0505] In some embodiments, as shown in FIG32, the display panel 240 further includes a first hole 23, which penetrates the substrate layer 241 along the thickness direction of the display module 200. The first hole 23 communicates with the fourth accommodating space 18, and at least a portion of the electrical connector 243 is located inside the first hole 23.

[0506] In some embodiments, at least a portion of the electrical connector 243 may also be disposed on the sidewall of the substrate layer 241.

[0507] In some possible implementations, as shown in Figure 33, the display module 200 may further include a protective adhesive element 290, at least a portion of which is disposed within the fourth accommodating space 18, and which covers at least a portion of the second circuit board 270. This prevents damage to the second circuit board 270 and improves the module's strength and reliability.

[0508] The protective adhesive component 290 can be cured using protective adhesives such as hot melt adhesive, UV adhesive, epoxy resin, or acrylic adhesive. Alternatively, the protective adhesive can be applied to the interior of the fourth accommodating space 18 using processes such as dispensing or inkjet printing.

[0509] In some embodiments, as shown in FIG33, a portion of the protective adhesive 290 is located inside the fourth accommodating space 18, and another portion of the protective adhesive 290 is located outside the fourth accommodating space 18.

[0510] In summary, based on Examples 8 to 11, it can be concluded that:

[0511] When the material of the substrate 241 is glass, the substrate 241 may have designs including but not limited to the following: 1. The substrate 241 has a uniform thickness design, or the substrate 241 has a non-uniform thickness design. 2. The substrate 241 has a third accommodating space 15.

[0512] The substrate layer 241 and the protective stack 420 form a fourth accommodating space 18. It should be noted that the display module 200 contains either a third accommodating space 15 or a fourth accommodating space 18.

[0513] The connection scheme between the electrical connector 243 and the substrate layer 241 can be: 1. At least a portion of the electrical connector 243 is located inside the first hole 23. 2. At least a portion of the electrical connector 243 is disposed on the sidewall of the substrate layer 241.

[0514] The connection scheme between the electrical connector 243 and the first circuit board 260 can be as follows: 1. The electrical connector 243 is electrically connected to the first circuit board 260 through the conductive adhesive layer 280. 2. The electrical connector 243 is electrically connected to the first circuit board 260 through the second circuit board 270. In this case, at least a portion of the second circuit board 270 can be disposed inside the third accommodating space 15 or the fourth accommodating space 18.

[0515] The relationship between the first circuit board 260 and the second circuit board 270 is as follows: 1. The first circuit board 260 and the second circuit board 270 are independent circuit boards. 2. The first circuit board 260 and the second circuit board 270 are an integrated structure.

[0516] The structure of the protective layer 220: 1. The number of protective layers 220 is one or two. 2. At least one protective layer 220 can be a UTG layer, a UFG layer, a CPI layer, a PET layer, etc.

[0517] Provided that the material of the substrate 241 is glass, the various connection schemes between the electrical connector 243 and the substrate 241, the various connection schemes between the electrical connector 243 and the first circuit board 260, the various relationships between the first circuit board 260 and the second circuit board 270, the various structures of the protective layer 220, the various structures of the substrate 241, and the formation of the fourth accommodating space 18 by the substrate 241 and the protective stack 420 can be freely combined. The display module 200 obtained by free combination can include, but is not limited to, the display module 200 of Embodiments 8 to 11.

[0518] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0519] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device (100), characterized in that, It includes a display module (200), which includes a bent area (AA) and a non-bent area (NA); The display module (200) includes a display panel (240), which includes a functional stack (242) and a substrate layer (241) stacked together. The substrate layer (241) includes a first part (11) and a second part (12). The first part (11) is made of glass and is located in the bending region (AA). The second part (12) is located in the non-bending region (NA).

2. The electronic device (100) according to claim 1, characterized in that, The thickness of at least a portion of the second part (12) is greater than the thickness of the first part (11).

3. The electronic device (100) according to claim 1 or 2, characterized in that, The substrate layer (241) has a first groove (21) on the side away from the functional stack (242), at least a portion of the first groove (21) is located in the bending region (AA), and the groove width of the first groove (21) along the length direction of the display panel (240) is greater than or equal to the length of the bending region (AA) along the length direction of the display panel (240).

4. The electronic device (100) according to claim 3, characterized in that, The display module (200) also includes a leveling colloid (340) located in the first groove (21).

5. The electronic device (100) according to claim 3 or 4, characterized in that, The substrate layer (241) includes: A first glass layer (31), a portion of which is located in the bent region (AA) and another portion of which is located in the non-bent region (NA); Multiple structural layers (32) are fixedly connected to the side of the first glass layer (31) away from the functional stack (242). The multiple structural layers (32) are arranged side by side and spaced apart along the length of the display panel (240). Two adjacent structural layers (32) and the first glass layer (31) surround and form at least a portion of the groove wall of the first groove (21).

6. The electronic device (100) according to claim 5, characterized in that, The material of the structural layer (32) is glass.

7. The electronic device (100) according to any one of claims 1-4, characterized in that, The substrate layer (241) is a one-piece molded glass substrate.

8. The electronic device (100) according to any one of claims 1-7, characterized in that, The display module (200) further includes a first circuit board (260), and the functional stack (242) includes a circuit layer (2421). The circuit layer (2421) and the first circuit board (260) are located on opposite sides of the substrate layer (241). The display panel (240) further includes an electrical connector (243), which is fixedly connected to the substrate layer (241) and electrically connected to the circuit layer (2421) and the first circuit board (260).

9. The electronic device (100) according to claim 8, characterized in that, The display panel (240) further includes a first hole (23) that penetrates the substrate layer (241) along the thickness direction of the display panel (240), and at least a portion of the electrical connector (243) is located inside the first hole (23).

10. The electronic device (100) according to claim 9, characterized in that, The electrical connector (243) includes a conductive post (2431) and a conductive layer (2432). The conductive layer (2432) is located on the side of the substrate layer (241) away from the circuit layer (2421). The conductive post (2431) is located inside the first hole (23). The opposite ends of the conductive post (2431) are electrically connected to the circuit layer (2421) and the conductive layer (2432) respectively. The first circuit board (260) is electrically connected to the conductive layer (2432).

11. The electronic device (100) according to claim 9 or 10, characterized in that, The display module (200) further includes a conductive adhesive layer (280), which is located between the substrate layer (241) and the first circuit board (260) and electrically connects the electrical connector (243) to the first circuit board (260).

12. The electronic device (100) according to claim 8, characterized in that, At least a portion of the electrical connector (243) is disposed on the sidewall of the substrate layer (241).

13. The electronic device (100) according to claim 12, characterized in that, The sidewall of the substrate (241) is provided with a second groove (22), which accommodates at least a portion of the electrical connector (243).

14. The electronic device (100) according to any one of claims 8-13, characterized in that, The substrate layer (241) has a first accommodating space (123) on the side away from the functional stack (242), and the display module (200) further includes a second circuit board (270), at least a portion of which is located inside the first accommodating space (123), and the second circuit board (270) is electrically connected to the electrical connector (243) and the first circuit board (260).

15. The electronic device (100) according to any one of claims 8-13, characterized in that, The display module (200) also includes: A support layer (250), the substrate layer (241) and the first circuit board (260) are respectively located on opposite sides of the support layer (250), and the support layer (250) and the substrate layer (241) surround and form at least a portion of the inner wall of the second accommodating space (126); A second circuit board (270), at least a portion of which is located inside the second accommodating space (126), is electrically connected to the electrical connector (243) and the first circuit board (260).

16. The electronic device (100) according to claim 14 or 15, characterized in that, The display module (200) further includes a protective adhesive component (290), at least a portion of which is disposed within a first accommodating space (123) or a second accommodating space (126), and which covers at least a portion of the second circuit board (270); and / or, Both the first circuit board (260) and the second circuit board (270) are flexible circuit boards, and the first circuit board (260) and the second circuit board (270) are an integral structure.

17. The electronic device (100) according to any one of claims 1-7, characterized in that, The display module (200) also includes: A first circuit board (260) is located on the side of the substrate layer (241) away from the functional stack (242); The second circuit board (270) is a flexible circuit board. The first end of the second circuit board (270) is located on the front side of the functional stack (242) and is electrically connected to the circuit layer (2421) of the functional stack (242). The second end of the second circuit board (270) is bent to the first circuit board (260) and is electrically connected to the first circuit board (260).

18. The electronic device (100) according to any one of claims 1-17, characterized in that, The display module (200) further includes a support layer (250), the support layer (250) and the functional stack (242) are located on opposite sides of the substrate layer (241), and along the thickness direction of the display module (200), the projection of the support layer (250) coincides with the projection of the first part (11).

19. The electronic device (100) according to claim 18, characterized in that, The display module (200) further includes a plurality of second holes (251), which are located in the bending region (AA) and are disposed in the support layer (250).

20. The electronic device (100) according to claim 19, characterized in that, The display module (200) also includes a plurality of soft gels (310), each of which corresponds to a second hole (251) and is filled inside the corresponding second hole (251).

21. The electronic device (100) according to any one of claims 18-20, characterized in that, The display module (200) further includes an adhesive layer (320), which is located between the substrate layer (241) and the support layer (250). The adhesive layer (320) is bonded to both the substrate layer (241) and the support layer (250), wherein: The adhesive layer (320) includes a first adhesive portion (321a) and a second adhesive portion (321b), wherein the first adhesive portion (321a) is located in the bending region (AA), and the second adhesive portion (321b) is located in the non-bending region (NA), and the elastic modulus of the first adhesive portion (321a) is less than the elastic modulus of the second adhesive portion (321b); or, The adhesive layer (320) includes a plurality of adhesive portions (321), and the non-bending area (NA) corresponds one-to-one with the adhesive portion (321), with the adhesive portion (321) located in the corresponding non-bending area (NA).

22. The electronic device (100) according to any one of claims 1-21, characterized in that, The display module (200) further includes at least one protective layer (220), and the functional stack (242) is located between the at least one protective layer (220) and the substrate layer (241).

23. The electronic device (100) according to claim 22, characterized in that, The number of protective layers (220) is one.

24. The electronic device (100) according to claim 22, characterized in that, At least one of the protective layers (220) is a second glass layer, and the at least one second glass layer includes a first glass portion (221) and a second glass portion (222). The first glass portion (221) is located in the bending region (AA), and the second glass portion (222) is located in the non-bending region (NA). The thickness of the second glass portion (222) is greater than the thickness of the first glass portion (221).

25. The electronic device (100) according to any one of claims 22-24, characterized in that, The display module (200) also includes a protective film (210), and the protective layer (220) is located between the protective film (210) and the display panel (240).

26. An electronic device (100), characterized in that, It includes a display module (200), which includes a cover plate (410), a display panel (240), and a first circuit board (260); The cover plate (410) and the first circuit board (260) are located on opposite sides of the display panel (240); The display panel (240) includes a substrate layer (241), a circuit layer (2421), and an electrical connector (243). The substrate layer (241) is made of glass. The circuit layer (2421) and the first circuit board (260) are located on opposite sides of the substrate layer (241). The circuit layer (2421) is located between the substrate layer (241) and the cover plate (410). The electrical connector (243) is fixedly connected to the substrate layer (241) and electrically connects the circuit layer (2421) and the first circuit board (260).

27. The electronic device (100) according to claim 26, characterized in that, The display panel (240) further includes a first hole (23) that penetrates the substrate layer (241) along the thickness direction of the display panel (240), and at least a portion of the electrical connector (243) is located inside the first hole (23).

28. The electronic device (100) according to claim 27, characterized in that, The electrical connector (243) includes a conductive post (2431) and a conductive layer (2432). The conductive layer (2432) is located on the side of the substrate layer (241) away from the circuit layer (2421). The conductive post (2431) is located inside the first hole (23). The opposite ends of the conductive post (2431) are electrically connected to the circuit layer (2421) and the conductive layer (2432) respectively. The first circuit board (260) is electrically connected to the conductive layer (2432).

29. The electronic device (100) according to claim 27 or 28, characterized in that, The display module (200) further includes a conductive adhesive layer (280), which is located between the substrate layer (241) and the first circuit board (260) and electrically connects the electrical connector (243) to the first circuit board (260).

30. The electronic device (100) according to claim 26, characterized in that, The electrical connector (243) is disposed on the sidewall of the substrate layer (241).

31. The electronic device (100) according to claim 30, characterized in that, The sidewall of the substrate (241) is provided with a second groove (22), which accommodates at least a portion of the electrical connector (243).

32. The electronic device (100) according to any one of claims 26-31, characterized in that, The substrate layer (241) has a third accommodating space (15) on the side away from the circuit layer (2421), and the display module (200) further includes a second circuit board (270), at least a portion of which is located inside the third accommodating space (15), and the second circuit board (270) is electrically connected to the electrical connector (243) and the first circuit board (260).

33. The electronic device (100) according to any one of claims 26-31, characterized in that, The display module (200) also includes: A protective stack (420) is located between the first circuit board (260) and the substrate layer (241), and the protective stack (420) and the substrate layer (241) form a fourth accommodating space (18); A second circuit board (270), at least a portion of which is located inside the fourth accommodating space (18), is electrically connected to the electrical connector (243) and the first circuit board (260).

34. The electronic device (100) according to claim 32 or 33, characterized in that, The display module (200) further includes a protective adhesive element (290), at least a portion of which is disposed within a third accommodating space (15) or a fourth accommodating space (18), the protective adhesive element (290) covering at least a portion of the second circuit board (270); and / or, Both the first circuit board (260) and the second circuit board (270) are flexible circuit boards, and the first circuit board (260) and the second circuit board (270) are an integral structure.

35. A display panel (240), characterized in that, The display panel (240) is the display panel (240) of the electronic device (100) as claimed in any one of claims 1-25, or the display panel (240) is the display panel (240) of the electronic device (100) as claimed in any one of claims 26-34.

36. A display module (200), characterized in that, The display module (200) is the display module (200) of the electronic device (100) as claimed in any one of claims 1-25, or the display module (200) is the display module (200) of the electronic device (100) as claimed in any one of claims 26-34.

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