Display module and electronic device

Abstract

The present application provides a display module and an electronic device. The display module comprises a display panel layer and an electrical connection layer. The electrical connection layer is fixedly connected to a non-display side of the display panel layer. The electrical connection layer comprises a main body portion, a first lead-out section, and a second lead-out section. The first lead-out section and the second lead-out section are fixedly connected to the main body portion at intervals and are electrically connected to the main body portion. The first lead-out section and the second lead-out section can both be bent relative to the main body portion. The number of circuit layers of the first lead-out section and the number of circuit layers of the second lead-out section are each greater than the number of circuit layers of the main body portion. The electronic device comprises a first circuit board and a second circuit board. The first lead-out section is electrically connected to the first circuit board, and the second lead-out section is electrically connected to the second circuit board. The first circuit board and the second circuit board can implement mutual power transmission and signal transmission by using the first lead-out section, the main body portion, and the second lead-out section. The display module has a variety of functions, not just a single one. In this way, the internal space of the electronic device is used more efficiently.

Description

Display modules and electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202510107141.1, filed on January 22, 2025, with the China National Intellectual Property Administration, entitled “Display Module and Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display module technology, and in particular to a display module and electronic device. Background Technology

[0003] With the development of technology and the demands of the electronic device market, mobile phones have become one of the electronic devices used daily by users. Traditional electronic devices generally include a display module. The function of a traditional display module is only for display, and its single function leads to low utilization of the internal space of the electronic device. Summary of the Invention

[0004] This application provides a display module and an electronic device. The display module has multiple functions, not just a single one. When the display module is applied to an electronic device, the space utilization of the electronic device is high.

[0005] In a first aspect, this application provides a display module. The display module includes a display panel layer and an electrical connection layer, the electrical connection layer being fixedly connected to the non-display side of the display panel layer; the electrical connection layer includes a main body, a first lead-out section, and a second lead-out section, the first lead-out section and the second lead-out section being fixedly connected to the main body at a distance and electrically connected to the main body, the main body being fixedly connected to the non-display side of the display panel layer, and both the first lead-out section and the second lead-out section being bendable relative to the main body; in the thickness direction of the display module, the main body includes at least one circuit layer, the first lead-out section and the second lead-out section each include at least two circuit layers, the number of circuit layers in the first lead-out section and the number of circuit layers in the second lead-out section are both greater than the number of circuit layers in the main body.

[0006] Understandably, since impedance increases as cross-sectional area decreases, the widths of both the first and second leads are relatively small, resulting in smaller cross-sectional areas for both. However, because both the first and second leads have more circuit layers, their cross-sectional areas can be increased, making a significant decrease in their cross-sectional areas less likely, and consequently, a significant increase in their impedance. The electrical connection layer supports the display panel layer and also provides electrical connections to other structural components, making the display module's functionality quite diverse.

[0007] In one possible implementation, the circuit layer of the first lead-out segment includes a first circuit layer and a second circuit layer; the first lead-out segment includes a first insulating layer and a first conductive element, the first insulating layer of the first lead-out segment is fixedly connected between the first circuit layer and the second circuit layer of the first lead-out segment; the first conductive element is embedded in the first insulating layer of the first lead-out segment, the first end of the first conductive element is fixedly connected to and electrically connected to the first circuit layer of the first lead-out segment, and the second end of the first conductive element is fixedly connected to and electrically connected to the second circuit layer of the first lead-out segment.

[0008] It is understandable that, since the first insulating layer of the first lead-out section is fixedly connected between the first circuit layer of the first lead-out section and the second circuit layer of the first lead-out section, the first circuit layer of the first lead-out section and the second circuit layer of the first lead-out section are not prone to mutual interference, and the reliability of the first circuit layer of the first lead-out section and the reliability of the second circuit layer of the first lead-out section are both high.

[0009] It is understandable that the first circuit layer of the first lead-out segment and the second circuit layer of the first lead-out segment can be conductive, and the first conductive element can realize the electrical connection between the first circuit layer of the first lead-out segment and the second circuit layer of the first lead-out segment.

[0010] In one possible implementation, the first conductive element is a metal pillar, which is embedded in the first insulating layer of the first lead-out section. The first end of the first conductive element is exposed through the first surface of the first insulating layer of the first lead-out section and electrically connected to the first circuit layer of the first lead-out section. The second end of the first conductive element is exposed through the second surface of the first insulating layer of the first lead-out section and electrically connected to the second circuit layer of the first lead-out section. The first surface of the first insulating layer of the first lead-out section faces the first circuit layer of the first lead-out section, and the second surface of the first insulating layer of the first lead-out section faces the second circuit layer of the first lead-out section.

[0011] It is understandable that the first circuit layer of the first lead-out segment and the second circuit layer of the first lead-out segment can be conductive, and the first conductive element can realize the electrical connection between the first circuit layer of the first lead-out segment and the second circuit layer of the first lead-out segment.

[0012] In one possible implementation, the first lead-out segment includes a second insulating layer, which is fixedly connected to the side of the second circuit layer of the first lead-out segment away from the first insulating layer of the first lead-out segment.

[0013] It is understandable that, since the second insulating layer of the first lead-out section is fixedly connected to the side of the first circuit layer of the first lead-out section away from the first insulating layer of the first lead-out section, the second insulating layer of the first lead-out section can also protect the first circuit layer of the first lead-out section, and the first circuit layer of the first lead-out section has high reliability.

[0014] In one possible implementation, the first insulating layer of the first lead-out segment is a polyimide layer, and the second insulating layer of the first lead-out segment is a cover film layer.

[0015] It is understandable that the first insulation layer and the second insulation layer of the first lead-out section can protect the first circuit layer of the first lead-out section, and the first circuit layer of the first lead-out section has high reliability.

[0016] In one possible implementation, the first lead-out segment includes a third insulating layer, a third circuit layer, and a fourth insulating layer; the third insulating layer of the first lead-out segment is fixedly connected to the side of the first circuit layer of the first lead-out segment away from the first insulating layer of the first lead-out segment, the third circuit layer of the first lead-out segment is fixedly connected to the side of the third insulating layer of the first lead-out segment away from the first circuit layer of the first lead-out segment, and the fourth insulating layer of the first lead-out segment is fixedly connected to the side of the third circuit layer of the first lead-out segment away from the third insulating layer of the first lead-out segment.

[0017] It is understandable that the third insulation layer of the first lead-out section can be located between the first circuit layer and the third circuit layer of the first lead-out section. Interference is not likely to occur between the first circuit layer and the third circuit layer of the first lead-out section, and the reliability of both the first circuit layer and the third circuit layer of the first lead-out section is high.

[0018] Understandably, since the fourth insulating layer of the first lead is fixedly connected to the side of the third circuit layer of the first lead away from the third insulating layer of the first lead, the fourth insulating layer of the first lead can also protect the third circuit layer of the first lead, and the reliability of the third circuit layer of the first lead is high.

[0019] In one possible implementation, the third insulating layer of the first lead-out segment is a polyimide layer, and the fourth insulating layer of the first lead-out segment is a cover film layer.

[0020] It is understandable that the third and fourth insulation layers of the first lead-out section can protect the third circuit layer of the first lead-out section, and the third circuit layer of the first lead-out section has high reliability.

[0021] In one possible implementation, the first lead-out segment includes an electromagnetic interference layer, which is fixedly connected to the side of the fourth insulating layer of the first lead-out segment away from the third circuit layer of the first lead-out segment.

[0022] It is understandable that the electromagnetic interference layer of the first lead-out section can shield the circuit layer, the first insulation layer, the second insulation layer, the third insulation layer, the fourth insulation layer, and the first conductive component of the first lead-out section from electromagnetic interference, which helps to ensure the reliability of the circuit layer, the first insulation layer, the second insulation layer, the third insulation layer, the fourth insulation layer, and the first conductive component of the first lead-out section.

[0023] In one possible implementation, the main body includes a first circuit layer, a first insulating layer, and a second insulating layer. The first circuit layer of the main body is fixedly connected between the first insulating layer and the second insulating layer of the main body. The first circuit layer of the main body is disposed on the same layer as the first circuit layer of the first lead-out section.

[0024] It is understandable that by setting the first circuit layer of the main body and the first circuit layer of the first lead-out section on the same layer, it is convenient to realize the electrical connection between the first circuit layer of the main body and the first circuit layer of the first lead-out section.

[0025] In one possible implementation, the first wiring layer of the main body includes a first trace, the first wiring layer of the first lead-out section includes a first trace, and the first trace of the main body is fixedly connected to the first trace of the first lead-out section.

[0026] It is understandable that the first wiring layer of the main body and the first wiring layer of the first lead-out section can be electrically connected through the first wiring of the main body and the first wiring of the first lead-out section, thereby realizing the electrical connection between the main body and the first lead-out section.

[0027] In one possible implementation, the second insulating layer of the main body is provided with a grounding window, the first circuit layer of the main body includes a grounding wire, and the grounding wire of the main body is exposed relative to the second insulating layer of the main body through the grounding window.

[0028] Understandably, the grounding wire of the main body can be used for electrical connection with other structural components.

[0029] In one possible implementation, the thickness T1 of the main body satisfies: 80μm≤T1≤95μm.

[0030] Understandably, a smaller thickness in the main body helps reduce the weight and thickness of the display module, thus facilitating a thinner display module design.

[0031] In one possible implementation, the thickness T2 of the first lead-out segment satisfies: 130μm≤T2≤150μm.

[0032] Understandably, the smaller thickness of the first lead-out section helps reduce the weight and thickness of the display module, thus facilitating a thinner display module design.

[0033] In one possible implementation, the thickness T3 of the first lead-out segment satisfies: 130μm≤T3≤150μm.

[0034] Understandably, the smaller thickness of the second lead-out section helps reduce the weight and thickness of the display module, thus facilitating a thinner display module design.

[0035] In one possible implementation, the first lead-out segment is fixedly connected to the middle of the main body and extends from the middle of the main body to one side of the middle of the main body; or, the first lead-out segment is fixedly connected to the edge of the main body and extends from the edge of the main body to one side of the middle of the main body.

[0036] Understandably, the first lead-out section extends from the middle of the main body to facilitate connection with other structural components.

[0037] Understandably, the scheme in which the first leading-out section extends from the edge of the main body is easier to implement than the scheme in which the first leading-out section extends from the middle of the main body.

[0038] In one possible implementation, at least a portion of the first lead-out segment is bent to the side of the main body away from the display panel layer.

[0039] Understandably, the first lead-out section can extend the main body to a side away from the display panel layer, and the main body can be connected to other structural components.

[0040] In one possible implementation, at least a portion of the second lead-out section is bent to the side of the main body away from the display panel layer.

[0041] Understandably, the second lead-out section can extend the main body to a side away from the display panel layer, and the main body can be connected to other structural components.

[0042] In one possible implementation, the display panel layer includes a display area and a bending area. The bending area is connected to the display area, and a portion of the bending area is bent to the side of the electrical connection layer away from the display area and fixedly connected to the circuit layer of the main body. The bending area has a first connection pad, and the main body has a second connection pad. The first connection pad is electrically connected to the second connection pad by soldering.

[0043] It is understandable that the first and second connecting pads enable electrical connection between the bending area of ​​the display panel layer and the main body. The circuit layer of the main body can transmit power and signals to the bending area of ​​the display panel layer, thereby transmitting power and signals to the display area of ​​the display panel layer. The display area of ​​the display panel layer can realize the display function of the display module.

[0044] In one possible implementation, the display panel layer includes a display area and a bending area. The bending area is connected to the display area, and a portion of the bending area is bent to the side of the electrical connection layer away from the display area and fixedly connected to the circuit layer of the main body. The bending area is electrically connected to the main body through a hot-press soldering process.

[0045] Understandably, the hot-press molten soldering process can precisely control temperature and pressure, enabling precise connections when soldering the bending area and the main body, ensuring the stability of the soldering quality, and thus guaranteeing reliable mechanical connection strength and electrical connection performance between the soldering bending area and the main body.

[0046] In one possible implementation, the display panel layer includes a display area and a bending area, the bending area being connected to the display area, a portion of the bending area being bent to the side of the electrical connection layer away from the display area and fixedly connected to the circuit layer of the main body; the display panel layer also includes conductive adhesive, the conductive adhesive being fixedly connected between the bending area and the main body, the bending area being electrically connected to the main body through the conductive adhesive.

[0047] It is understandable that conductive adhesive enables electrical connection between the bending area of ​​the display panel layer and the main body, and the circuit layer of the main body can transmit power and signals to the bending area of ​​the display panel layer, thereby transmitting power and signals to the display area of ​​the display panel layer, and the display area of ​​the display panel layer can realize the display function of the display module.

[0048] In one possible implementation, the display module further includes a buffer layer, an adhesive layer, and a support layer; the buffer layer is fixedly connected to the surface of the main body of the electrical connection layer facing the display panel layer, the support layer is fixedly connected to the surface of the display panel layer facing the main body of the electrical connection layer, and the adhesive layer is fixedly connected between the buffer layer and the support layer.

[0049] Understandably, when the display module is subjected to external force, the buffer layer acts as a cushion, preventing damage to the display module. The support layer provides support for the display panel layer. The adhesive layer ensures the reliability of the connection between the support layer and the buffer layer, preventing relative slippage between them.

[0050] In one possible implementation, the display module further includes a polarizer layer, an optical adhesive layer, and a cover plate; the polarizer layer, the optical adhesive layer, and the cover plate are sequentially stacked on the display side of the display panel layer.

[0051] Understandably, the polarizer layer reduces stray light from the environment, thereby minimizing interference with the display panel layer and improving its display performance. The optical adhesive layer possesses excellent adhesive and light-transmitting properties, ensuring reliable connection between the cover plate and the polarizer layer without significantly affecting the display panel layer's performance.

[0052] Secondly, this application provides an electronic device. The electronic device includes a housing and the aforementioned display module, the display module being mounted on the housing.

[0053] It is understandable that the display modules of electronic devices have multiple functions.

[0054] In one possible implementation, the display module and the housing enclose a receiving space, and the electronic device includes a first circuit board and a second circuit board, which are fixedly connected to the receiving space at intervals; a first lead is electrically connected to the first circuit board, and a second lead is electrically connected to the second circuit board.

[0055] It is understood that both the first and second leads are electrically connected to the main body. The first and second circuit boards can achieve mutual power and signal transmission using the circuit layers of the first lead, the main body, and the second lead. Furthermore, since the main body, the first lead, and the second lead are all part of the display module structure, the electronic device does not require additional structural components to achieve electrical connection between the first and second circuit boards. This results in a thinner electronic device, facilitating a slimmer design. Moreover, this embodiment eliminates the need for additional structural components to achieve electrical connection between the first and second circuit boards, enabling a slim design. Additionally, the display module in this embodiment can also display images; in other words, it offers multiple functions, making it versatile. This results in high utilization of the internal space of the electronic device.

[0056] In one possible implementation, the electronic device includes a first connector male and a first connector female, one of which is fixed and electrically connected to a first lead-out section, and the other is fixed and electrically connected to a first circuit board, with the first connector male inserted into the first connector female.

[0057] It is understandable that the first connector male and the first connector female can realize the electrical connection between the line layer of the first lead segment and the first circuit board, thereby realizing the power transmission and signal transmission between the first lead segment and the first circuit board.

[0058] In one possible implementation, the electronic device includes a second connector male and a second connector female, one of which is fixed and electrically connected to a second lead-out section, and the other is fixed and electrically connected to a second circuit board, with the second connector male inserted into the second connector female.

[0059] It is understandable that the second connector male and the second connector female can realize the electrical connection between the circuit layer of the second lead section and the second circuit board, thereby realizing the power transmission and signal transmission between the second lead section and the second circuit board.

[0060] It is understood that the first circuit board can be electrically connected to the second circuit board through the first connector male socket, the first connector female socket, the first lead-out section, the main body, the second lead-out section, the second connector male socket, and the second connector female socket, thereby realizing the power transmission and signal transmission between the first circuit board and the second circuit board.

[0061] In one possible implementation, the first lead-out segment includes a first pad, the first circuit board includes a first pad, and the first pad of the first lead-out segment is electrically connected to the first pad of the first circuit board by soldering.

[0062] It is understandable that the first pad of the first lead segment and the first pad of the first circuit board can realize the fixed connection and electrical connection between the circuit layer of the first lead segment and the first circuit board, thereby realizing the power transmission and signal transmission between the first lead segment and the first circuit board.

[0063] In one possible implementation, the second lead-out segment includes a second pad, the second circuit board includes a second pad, and the second pad of the second lead-out segment is electrically connected to the second pad of the second circuit board by soldering.

[0064] It is understandable that the second pad of the second lead-out section and the second pad of the second circuit board can realize the fixed connection and electrical connection between the circuit layer of the second lead-out section and the second circuit board, thereby realizing the power transmission and signal transmission between the second lead-out section and the second circuit board.

[0065] It is understood that the first circuit board can be electrically connected to the second circuit board through the first pad of the first circuit board, the first pad of the first lead-out section, the first lead-out section, the main body, the second lead-out section, the second pad of the second lead-out section, and the second pad of the second circuit board, thereby realizing the power transmission and signal transmission between the first circuit board and the second circuit board.

[0066] In one possible implementation, the first circuit board and the second circuit board transmit electrical energy and signals through the circuit layer of the first lead-out section, the circuit layer of the main body, and the circuit layer of the second lead-out section.

[0067] It is understandable that the first circuit board and the second circuit board can use the circuit layer of the first lead-out section, the circuit layer of the main body and the circuit layer of the second lead-out section to realize mutual power transmission and signal transmission.

[0068] In one possible implementation, the electronic device includes a battery, a charging interface, and a power chip. The battery is fixedly connected within a housing space. The charging interface is electrically connected to a second circuit board, the power chip is electrically connected to a first circuit board, and the battery is electrically connected to the power chip. The charging interface transmits electrical energy to the battery through the second circuit board, the circuit layer of the second lead-out section, the circuit layer of the main body, the circuit layer of the first lead-out section, the first circuit board, and the power chip.

[0069] It is understandable that the charging interface can transmit electrical energy to the battery through the second circuit board, the second lead-out section of the electrical connection layer of the display module, the main body, the first lead-out section, the first circuit board, and the power chip. In this way, the electronic device does not require additional structural components to achieve the electrical connection between the charging interface and the battery, thus facilitating a thinner design. Furthermore, the battery thickness can be increased, thereby increasing the battery capacity and ultimately improving the battery life of the electronic device.

[0070] In one possible implementation, the battery is located between the first circuit board and the second circuit board; in the thickness direction of the electronic device, both the first lead-out section and the second lead-out section are offset from the battery.

[0071] It is understandable that electronic devices have more space in the thickness direction, allowing batteries to be thicker, thereby increasing battery capacity and thus improving the battery life of electronic devices.

[0072] In one possible implementation, the electronic device includes a processor and electronic components. The processor is electrically connected to a first circuit board, and the electronic components are electrically connected to a second circuit board. The electronic components include one or more of a speaker, a fingerprint recognition module, and a SIM card slot. The electronic components transmit signals to the processor through the second circuit board, the wiring layer of the second lead-out section, the wiring layer of the main body, the wiring layer of the first lead-out section, and the first circuit board.

[0073] It is understandable that electronic components can transmit signals to the processor via the second circuit board, the second lead-out section, the main body, the first lead-out section, and the first circuit board. This eliminates the need for additional structural components to establish electrical connections between the electronic components and the processor, facilitating a thinner design for the electronic device. Furthermore, the battery thickness can be increased, thereby enhancing battery capacity and ultimately improving the battery life of the electronic device. Attached Figure Description

[0074] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0075] Figure 2 is a partial cross-sectional view of one embodiment of the electronic device shown in Figure 1 at line AA;

[0076] Figure 3 is a partial structural schematic diagram of the electronic device shown in Figure 1 in one embodiment;

[0077] Figure 4 is a partially exploded view of the electronic device shown in Figure 1 in one embodiment;

[0078] Figure 5 is a partially exploded schematic diagram of the electronic device shown in Figure 1 in another embodiment;

[0079] Figure 6 is a partial cross-sectional schematic diagram of one embodiment of the electronic device shown in Figure 5 at the BB line;

[0080] Figure 7 is a structural schematic diagram of the display module shown in Figure 4 in one embodiment;

[0081] Figure 8 is a structural schematic diagram of the display module shown in Figure 7 from another angle;

[0082] Figure 9 is a partially exploded view of the display module shown in Figure 8 in one embodiment;

[0083] Figure 10 is a partial cross-sectional view of one embodiment of the display module shown in Figure 7 at the CC line;

[0084] Figure 11 is a partially enlarged schematic diagram of the electrical connection layer shown in Figure 9 in one embodiment;

[0085] Figure 12 is a partial structural schematic diagram of the electrical connection layer shown in Figure 9 in another embodiment;

[0086] Figure 13 is a partial cross-sectional view of one embodiment of the display module shown in Figure 8 at the DD line;

[0087] Figure 14 is a partial cross-sectional view of one embodiment of the display module shown in Figure 8 at the EE line;

[0088] Figure 15 is a partial cross-sectional view of another embodiment of the display module shown in Figure 8 at the DD line;

[0089] Figure 16 is a partial cross-sectional view of one embodiment of the electronic device shown in Figure 1 at the FF line;

[0090] Figure 17 is a partial cross-sectional schematic diagram of one embodiment of the electronic device shown in Figure 1 at the GG line;

[0091] Figure 18 is a partial cross-sectional view of another embodiment of the electronic device shown in Figure 1 at the FF line;

[0092] Figure 19 is a partial cross-sectional view of another embodiment of the electronic device shown in Figure 1 at the GG line;

[0093] Figure 20 is a partial structural schematic diagram of the electronic device shown in Figure 1 in one embodiment;

[0094] Figure 21 is a partial structural schematic diagram of the electronic device shown in Figure 1 in one embodiment;

[0095] Figure 22 is a partial structural schematic diagram of the display module shown in Figure 1 in one embodiment;

[0096] Figure 23 is a partial cross-sectional view of one embodiment of the electronic device shown in Figure 1 at line HH;

[0097] Figure 24 is a partial cross-sectional view of another embodiment of the display module shown in Figure 7 at the CC line;

[0098] Figure 25 is a partial cross-sectional view of another embodiment of the display module shown in Figure 7 at the CC line;

[0099] Figure 26 is a partial structural schematic diagram of the electronic device shown in Figure 1 in another embodiment. Detailed Implementation

[0100] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0101] In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation," "connection," "joining," and "joining" should be interpreted broadly. For example, "joining" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an electrical connection or a mechanical connection. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after the connection. Furthermore, the integrated structure obtained by a one-piece molding process means that during the formation of one of the two components, that component is connected to the other component without requiring further processing (such as bonding, welding, snap-fit ​​connection, or screw connection). The relative arrangement of components A and B can be such that component A is projected along the target direction to obtain projection C, and component B is projected along the target direction to obtain projection D, with projection C and projection D at least largely overlapping. In some embodiments, this substantial overlap can be any of the following: projection C is completely within projection D; or projection D is completely within projection C; or projection C and projection D intersect each other, and the intersection area of ​​projection C and projection D accounts for more than 50% of projection C or projection D.

[0102] The directional terms mentioned in the embodiments of this application, such as "top," "bottom," "inner," and "outer," are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0103] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship. "Multiple" means at least two.

[0104] Figure 1 is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application.

[0105] As shown in Figure 1, the electronic device 1000 can be a mobile phone, tablet computer, laptop computer, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR headset, virtual reality (VR) glasses, or VR headset, or any other device with a display module. In this application, a mobile phone is used as an example of the electronic device 1000 for description.

[0106] It is understood that, for ease of description, the width direction of electronic device 1000 is defined as the X-axis, the height direction as the Y-axis, and the thickness direction as the Z-axis in the following text. In other embodiments, the X-axis, Y-axis, and Z-axis can be flexibly set according to actual needs, as long as they are different from each other.

[0107] Figure 2 is a partial cross-sectional view of the electronic device 1000 shown in Figure 1 at line AA in one embodiment. Figure 3 is a partial structural diagram of the electronic device 1000 shown in Figure 1 in one embodiment.

[0108] As shown in Figures 2 and 3, the electronic device 1000 may include a display module 100, a housing 200, a first circuit board 310, a second circuit board 320, a flexible circuit board 330, and a battery 400. The display module 100 may be mounted on the housing 200. The display module 100 and the housing 200 may enclose a receiving space 201. The first circuit board 310, the second circuit board 320, the flexible circuit board 330, and the battery 400 are all located in the receiving space 201. The battery 400 may be located between the first circuit board 310 and the second circuit board 320. The flexible circuit board 330 is electrically connected to the first circuit board 310 and the second circuit board 320. Furthermore, in the thickness direction (i.e., the Z-axis direction) of the electronic device 1000, the flexible circuit board 330 is located between the display module 100 and the battery 400.

[0109] As shown in Figure 2, the display module 100 includes a display panel layer 10, a support layer 50, and a copper foil layer 90 stacked together. The copper foil layer 90 serves to protect and support the display panel layer 10.

[0110] Understandably, in the structure of the electronic device 1000 shown in Figures 2 and 3, although the flexible circuit board 330 can realize the electrical connection between the first circuit board 310 and the second circuit board 320, the electronic device 1000 shown in Figures 2 and 3 also has some technical problems. Furthermore, although the copper foil layer 90 can protect and support the display panel layer 10, the display module 100 shown in Figure 2 also has some technical problems.

[0111] (1) In the thickness direction (i.e. Z-axis direction) of the electronic device 1000, due to the stacking of the display module 100, flexible circuit board 330 and battery 400, the thickness of the electronic device 1000 is large, making it impossible to achieve a thinner electronic device 1000.

[0112] (2) The battery 400 needs to make room by reducing its thickness in order to accommodate the flexible circuit board 330. The battery 400 is thinner and has a smaller capacity, resulting in poorer battery life for the electronic device 1000.

[0113] (3) In order to ensure that the copper foil layer 90 can stably support the display panel layer 10, the thickness of the copper foil layer 90 will be made as thick as possible. As a result, due to the stacking of the display panel layer 10, the support layer 50 and the copper foil layer 90, the overall weight and thickness of the display module 100 will be relatively heavy.

[0114] (4) The display module 100 is only used for display. The single function of the display module 100 results in a low utilization rate of the storage space 201 of the electronic device 1000.

[0115] To address the technical issues raised above, the following section, in conjunction with relevant accompanying drawings, will further describe an electrical connection scheme between electronic components of the electronic device 1000. Details are as follows.

[0116] Figure 4 is a partially exploded schematic diagram of the electronic device 1000 shown in Figure 1 in one embodiment.

[0117] As shown in Figures 1 and 4, by way of example, the electronic device 1000 may include a display module 100, a housing 200, a first circuit board 310, a second circuit board 320, a battery 400, a charging interface 510, a power chip 520, a processor 530, and electronic components 540. It is understood that Figure 4 and the related figures below only schematically illustrate some components included in the electronic device 1000, and the actual shape, size, location, and construction of these components are not limited by Figure 4 and the figures below. In other embodiments, the electronic device 1000 may include more or fewer structures. For example, when the electronic device 1000 includes more structures, it may also include a heat spreader (not shown). As another example, when the electronic device 1000 includes fewer structures, it may not include the battery 400, charging interface 510, power chip 520, processor 530, or electronic components 540, etc.

[0118] Figure 5 is a partially exploded view of the electronic device 1000 shown in Figure 1 in another embodiment. Figure 6 is a partially cross-sectional view of the electronic device 1000 shown in Figure 5 at line BB in one embodiment.

[0119] As shown in Figures 4 to 6, by way of example, the display module 100 can be mounted on the housing 200. The display module 100 and the housing 200 can enclose a receiving space 201.

[0120] Exemplarily, the first circuit board 310 and the second circuit board 320 may be located spaced apart within the receiving space 201. The first circuit board 310 and the second circuit board 320 may be fixedly connected to the housing 200 spaced apart. Thus, the first circuit board 310 and the second circuit board 320 may be fixedly connected spaced apart within the receiving space 201. Furthermore, the display module 100 may be electrically connected to the first circuit board 310 and the second circuit board 320. Thus, power transmission and signal transmission can be achieved between the first circuit board 310 and the second circuit board 320 through the display module 100. The first circuit board 310 may be the main board of the electronic device 1000, and the second circuit board 320 may be a sub-board of the electronic device 1000. In other embodiments, the first circuit board 310 may also be a sub-board of the electronic device 1000, and the second circuit board 320 may also be the main board of the electronic device 1000. Specifically, this application does not limit the specific implementation. It is understood that the electrical connection methods between the display module 100 and the first circuit board 310, and between the display module 100 and the second circuit board 320, will be described in detail below with reference to the relevant accompanying drawings. I will not go into details here.

[0121] For example, the battery 400 may be located within the housing space 201. The battery 400 may be fixedly connected to the housing 200. In this way, the battery 400 can be fixedly connected within the housing space 201.

[0122] In one embodiment, the battery 400 may be located between the first circuit board 310 and the second circuit board 320.

[0123] For example, at least a portion of the charging interface 510 may be located within the receiving space 201. The charging interface 510 may be fixedly connected to the housing 200. The power chip 520 may be located within the receiving space 201. The power chip 520 may be fixedly connected to the first circuit board 310.

[0124] The charging interface 510 can be electrically connected to the second circuit board 320. The power chip 520 can be electrically connected to the first circuit board 310. In addition, the power chip 520 can be electrically connected to the battery 400. Thus, when the charging interface 510 is powered on, it can transmit electrical energy to the battery 400 through the second circuit board 320, the display module 100, the first circuit board 310, and the power chip 520.

[0125] For example, both the processor 530 and the electronic component 540 can be located within the housing space 201. In one embodiment, the processor 530 can be fixedly connected to the first circuit board 310. The electronic component 540 can be fixedly connected to the second circuit board 320.

[0126] For example, electronic component 540 may include one or more of a speaker, a fingerprint recognition module, and a SIM card slot.

[0127] For example, the processor 530 may be electrically connected to the first circuit board 310, and the electronic component 540 may be electrically connected to the second circuit board 320. The electronic component 540 may transmit signals to the processor 530 through the second circuit board 320, the display module 100, and the first circuit board 310.

[0128] Figure 7 is a structural schematic diagram of the display module 100 shown in Figure 4 in one embodiment. Figure 8 is a structural schematic diagram of the display module 100 shown in Figure 7 from another angle. Figure 9 is a partially exploded schematic diagram of the display module 100 shown in Figure 8 in one embodiment.

[0129] As shown in Figures 7 to 9, the display module 100 may, by way of example, include a display panel layer 10 and an electrical connection layer 20. It is understood that Figure 7 and the related figures below only schematically illustrate some components included in the display module 100, and the actual shape, size, location, and construction of these components are not limited to Figure 7 and the figures below.

[0130] For example, the display panel layer 10 may be an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, or the like. This application does not limit the specific type of the display panel layer 10.

[0131] As shown in FIG8, by way of example, the electrical connection layer 20 may include a main body portion 21, a first lead-out segment 22, and a second lead-out segment 23. The first lead-out segment 22 and the second lead-out segment 23 may be fixedly connected to the main body portion 21 at intervals and are electrically connected to the main body portion 21.

[0132] Figure 10 is a partial cross-sectional view of one embodiment of the display module 100 shown in Figure 7 at the CC line.

[0133] As shown in Figures 8 and 10, exemplarily, the electrical connection layer 20 can be fixedly connected to the non-display side of the display panel layer 10. The electrical connection layer 20 can provide support for the display panel layer 10. In one embodiment, the main body 21 can be fixedly connected to the non-display side of the display panel layer 10, and both the first lead-out section 22 and the second lead-out section 23 can be bent relative to the main body 21.

[0134] Referring to Figure 8 and in conjunction with Figure 10, exemplarily, at least a portion of the first lead-out section 22 can be bent to the side of the main body 21 away from the display panel layer 10. At least a portion of the second lead-out section 23 can be bent to the side of the main body 21 away from the display panel layer 10.

[0135] Understandably, the first lead-out section 22 extends the main body 21 to a side away from the display panel layer 10, and the main body 21 can be connected to other structural components. The second lead-out section 23 extends the main body 21 to a side away from the display panel layer 10, and the main body 21 can be connected to other structural components.

[0136] For example, the display module 100 may include a buffer layer 30. The buffer layer 30 may be fixedly connected to the side of the main body 21 of the electrical connection layer 20 facing the display panel layer 10. The buffer layer 30 may be fixedly connected to the electrical connection layer 20 by means of adhesive or the like. It is understood that when the display module 100 is subjected to external force, the buffer layer 30 can play a buffering role, and the display module 100 is not easily damaged.

[0137] For example, the display module 100 may further include an adhesive layer 40 and a support layer 50. The support layer 50 may be fixedly connected to the surface of the display panel layer 10 facing the main body portion 21 of the electrical connection layer 20. The adhesive layer 40 may be fixedly connected between the buffer layer 30 and the support layer 50. It is understood that the support layer 50 can provide support for the display panel layer 10. The adhesive layer 40 can ensure the reliability of the connection between the support layer 50 and the buffer layer 30, and prevent relative slippage between the buffer layer 30 and the support layer 50.

[0138] It is understandable that, compared to the display module 100 shown in Figure 2, the support layer 50 and the electrical connection layer 20 of this embodiment can both serve to support the display panel layer 10, thereby eliminating the need for the copper foil layer 90. The display module 100 of this embodiment has a smaller mass and a thinner thickness.

[0139] For example, the display module 100 may further include a polarizing layer 60, an optical adhesive layer 70, and a cover plate 80. The polarizing layer 60, the optical adhesive layer 70, and the cover plate 80 may be sequentially stacked on the display side of the display panel layer 10. In other words, the polarizing layer 60 may be fixedly connected to the side of the display panel layer 10 away from the electrical connection layer 20. The optical adhesive layer 70 may be fixedly connected to the side of the polarizing layer 60 away from the display panel layer 10. The cover plate 80 may be fixedly connected to the side of the optical adhesive layer 70 away from the display panel layer 10. It is understood that the polarizing layer 60 can reduce stray light in the environment, thereby reducing interference with the display panel layer 10 and improving the display effect of the display panel layer 10. The optical adhesive layer 70 has good adhesive properties and light transmission properties, which can ensure the reliability of the connection between the cover plate 80 and the polarizing layer 60, and is not likely to affect the display effect of the display panel layer 10.

[0140] In other embodiments, the display module 100 may also include other structures. This application does not specifically limit the scope of the invention.

[0141] Figure 11 is a partially enlarged schematic diagram of the electrical connection layer 20 shown in Figure 9 in one embodiment.

[0142] As shown in FIG10, by way of example, the first lead-out section 22 can be fixedly connected to the middle of the main body 21, and can extend from the middle of the main body 21 to one side of the middle of the main body 21.

[0143] Understandably, the first lead-out section 22 extends from the middle of the main body 21 to facilitate connection with other structural components.

[0144] For example, the main body 21 may be provided with a first through hole 210, which may be located in the middle of the main body 21. The first lead-out section 22 may extend from the edge of the first through hole 210 and be fixedly connected to the edge of the first through hole 210.

[0145] For example, along the X-axis direction, the width of the first lead-out segment 22 may be smaller than the width of the main body 21.

[0146] For example, the second lead-out section 23 can be fixedly connected to the middle of the main body 21, and can extend from the middle of the main body 21 to one side of the middle of the main body 21.

[0147] Understandably, the second lead-out section 23 extends from the middle of the main body 21 to facilitate connection with other structural components.

[0148] For example, the main body 21 may also be provided with a second through hole 220, which may be located in the middle of the main body 21. The second lead-out section 23 may extend from the edge of the second through hole 220 and be fixedly connected to the edge of the second through hole 220.

[0149] For example, along the X-axis direction, the width of the second lead-out segment 23 may be smaller than the width of the main body 21.

[0150] For example, the first lead-out segment 22 and the second lead-out segment 23 can be arranged along the Y-axis direction. In one embodiment, the first lead-out segment 22 and the second lead-out segment 23 can be staggered or partially overlapped in the X-axis direction.

[0151] Figure 12 is a partial structural schematic diagram of the electrical connection layer 20 shown in Figure 9 in another embodiment.

[0152] As shown in FIG12, by way of example, the first lead-out segment 22 may also be fixedly connected to the edge of the main body 21, and may extend from the edge of the main body 21 toward one side of the middle of the main body 21.

[0153] Understandably, the solution where the first lead-out segment 22 extends from the edge of the main body 21 is easier to implement than the solution where the first lead-out segment 22 extends from the middle of the main body 21.

[0154] For example, the second lead-out section 23 is fixedly connected to the edge of the main body 21 and can extend from the edge of the main body 21 toward one side of the middle of the main body 21.

[0155] Understandably, the solution where the second lead-out section 23 extends from the edge of the main body section 21 is easier to implement than the solution where the second lead-out section 23 extends from the middle of the main body section 21.

[0156] For example, the first lead-out segment 22 and the second lead-out segment 23 may be located on the same side of the main body portion 21. In other embodiments, the first lead-out segment 22 and the second lead-out segment 23 may also be located on different sides of the main body portion 21. Specifically, this application does not limit the scope.

[0157] Figure 13 is a partial cross-sectional view of one embodiment of the display module 100 shown in Figure 8 at the DD line. Figure 14 is a partial cross-sectional view of one embodiment of the display module 100 shown in Figure 8 at the EE line.

[0158] As shown in Figures 13 and 14, exemplarily, in the thickness direction (i.e., the Z-axis direction) of the display module 100, the main body 21 includes at least one circuit layer 21a. The first lead-out segment 22 may include at least two circuit layers 22a. The second lead-out segment 23 may include at least two circuit layers 23a. The circuit layers 21a of the main body 21 may be made of copper, and circuits are etched on the circuit layers 21a of the main body 21. The circuit layers 22a of the first lead-out segment 22 may be made of copper, and circuits are etched on the circuit layers 22a of the first lead-out segment 22. The circuit layers 23a of the second lead-out segment 23 may be made of copper, and circuits are etched on the circuit layers 23a of the second lead-out segment 23.

[0159] For example, the number of line layers 22a in the first lead-out section 22 and the number of line layers 23a in the second lead-out section 23 can both be greater than the number of line layers 21a in the main body 21. It is understood that the main body 21 and the first lead-out section 22 are schematically distinguished by dashed lines in FIG13. In other embodiments, the main body 21 and the first lead-out section 22 may also adopt other configurations. Specifically, this application does not limit the specific configuration.

[0160] Understandably, since impedance increases as cross-sectional area decreases, the widths of the first lead-out segment 22 and the second lead-out segment 23 are both small, resulting in small cross-sectional areas for both. Because the number of line layers 22a in the first lead-out segment 22 and the number of line layers 23a in the second lead-out segment 23 are relatively large, the cross-sectional areas of the first lead-out segment 22 and the second lead-out segment 23 can be increased. Therefore, the cross-sectional areas of the first lead-out segment 22 and the second lead-out segment 23 are less likely to decrease significantly, and the impedances of the first lead-out segment 22 and the second lead-out segment 23 are less likely to increase significantly. Thus, with a relatively small thickness of the electrical connection layer 20, the overall impedance of the electrical connection layer 20 is less likely to increase significantly.

[0161] As shown in FIG13, by way of example, the main body 21 may further include a first insulating layer 211, a second insulating layer 212, a third insulating layer 213, and an electromagnetic interference layer 214.

[0162] For example, the first insulating layer 211 of the main body 21 can be a polyimide layer. The second insulating layer 212 and the third insulating layer 213 of the main body 21 can both be cover films. The polyimide layer can be made of polyimide (PI). The cover film can be made of polyimide and adhesive. In other embodiments, the first insulating layer 211 of the main body 21 can also be made of other materials. The second insulating layer 212 and the third insulating layer 213 of the main body 21 can also be made of other materials. Specifically, this application does not limit the scope.

[0163] For example, the material of the electromagnetic interference layer 214 of the main body 21 may include silver. It is understood that the electromagnetic interference layer 214 of the main body 21 can serve to shield electromagnetic interference.

[0164] In other embodiments, the electromagnetic interference layer 214 of the main body 21 may also be made of other materials. This application does not specifically limit the application to these materials.

[0165] For example, the circuit layer 21a of the main body 21 may include a first circuit layer 215 and a second circuit layer 216.

[0166] For example, the first circuit layer 215 of the main body 21 can be fixedly connected between the first insulating layer 211 and the second insulating layer 212 of the main body 21. The second circuit layer 216 of the main body 21 can be fixedly connected to the side of the first insulating layer 211 of the main body 21 that is away from the first circuit layer 215 of the main body 21. The second insulating layer 212 of the main body 21 can be fixedly connected to the side of the first circuit layer 215 of the main body 21 that is away from the second circuit layer 216 of the main body 21. The third insulating layer 213 of the main body 21 can be fixedly connected to the side of the second circuit layer 216 of the main body 21 that is away from the first insulating layer 211 of the main body 21. The electromagnetic interference layer 214 of the main body 21 can be fixedly connected to the side of the second insulating layer 212 of the main body 21 that is away from the first circuit layer 215 of the main body 21.

[0167] For example, the circuit layer 21a, the first insulating layer 211, the second insulating layer 212, the third insulating layer 213, and the electromagnetic interference layer 214 of the main body 21 can be fixedly connected by an adhesive layer (not shown). In other embodiments, the circuit layer 21a, the first insulating layer 211, the second insulating layer 212, the third insulating layer 213, and the electromagnetic interference layer 214 of the main body 21 can also be fixedly connected by other means. This application does not specifically limit the details.

[0168] As shown in Figure 13, by way of example, the thickness T1 of the main body 21 in the Z-axis direction can satisfy: 80μm (micrometers) ≤ T1 ≤ 95μm. For example, T1 can be equal to 80μm, 85μm, 90μm, 91μm or 95μm, etc.

[0169] Understandably, the smaller thickness of the main body 21 helps to reduce the weight and thickness of the display module 100, thereby facilitating the thinner design of the display module 100.

[0170] In other embodiments, the thickness T1 of the main body 21 may also satisfy other ranges. Specifically, this application does not limit it.

[0171] In other embodiments, the circuit layer 21a of the main body 21 may include more or fewer structures. For example, when the circuit layer 21a of the main body 21 includes more structures, it may include three or more circuit layers. When the circuit layer 21a of the main body 21 includes fewer structures, it may include a first circuit layer 215.

[0172] As shown in Figure 13, by way of example, the first lead-out segment 22 may also include a first insulating layer 221, a second insulating layer 222, a third insulating layer 223, a fourth insulating layer 224, a first conductive element 225, and an electromagnetic interference layer 226.

[0173] For example, the first insulating layer 221 of the first lead-out segment 22 can be a polyimide layer. The second insulating layer 222 of the first lead-out segment 22 can be a cover film layer. The third insulating layer 223 of the first lead-out segment 22 can be a polyimide layer. The fourth insulating layer 224 of the first lead-out segment 22 can be a cover film layer. In other embodiments, the polyimide layer and the cover film layer may include other materials. Specifically, this application does not limit the scope.

[0174] For example, the material of the electromagnetic interference layer 226 of the first lead-out segment 22 may include silver. It is understood that the electromagnetic interference layer 226 of the first lead-out segment 22 can serve to shield electromagnetic interference.

[0175] In other embodiments, the electromagnetic interference layer 226 of the first lead-out segment 22 may also be made of other materials. This application does not specifically limit the application.

[0176] For example, the line layer 22a of the first lead-out segment 22 may include a first line layer 227, a second line layer 228, and a third line layer 229.

[0177] For example, the first insulating layer 221 of the first lead-out segment 22 can be fixedly connected between the first circuit layer 227 and the second circuit layer 228 of the first lead-out segment 22. The second insulating layer 222 of the first lead-out segment 22 can be fixedly connected to the side of the first circuit layer 227 of the first lead-out segment 22 that is away from the first insulating layer 221 of the first lead-out segment 22.

[0178] It is understandable that, since the first insulating layer 221 of the first lead-out segment 22 is fixedly connected between the first circuit layer 227 and the second circuit layer 228 of the first lead-out segment 22, the first circuit layer 227 and the second circuit layer 228 of the first lead-out segment 22 are not prone to mutual interference, and the reliability of the first circuit layer 227 and the second circuit layer 228 of the first lead-out segment 22 are both high.

[0179] It is understandable that, since the second insulating layer 222 of the first lead-out section 22 is fixedly connected to the side of the first circuit layer 227 of the first lead-out section 22 that is away from the first insulating layer 221 of the first lead-out section 22, the second insulating layer 222 of the first lead-out section 22 can also protect the first circuit layer 227 of the first lead-out section 22, and the reliability of the first circuit layer 227 of the first lead-out section 22 is high.

[0180] For example, the third insulating layer 223 of the first lead-out segment 22 can be fixedly connected to the side of the first circuit layer 227 of the first lead-out segment 22 that is away from the first insulating layer 221 of the first lead-out segment 22. The third circuit layer 229 of the first lead-out segment 22 can be fixedly connected to the side of the third insulating layer 223 of the first lead-out segment 22 that is away from the first circuit layer 227 of the first lead-out segment 22. The fourth insulating layer 224 of the first lead-out segment 22 can be fixedly connected to the side of the third circuit layer 229 of the first lead-out segment 22 that is away from the third insulating layer 223 of the first lead-out segment 22.

[0181] It is understandable that the third insulating layer 223 of the first lead-out section 22 can be located between the first circuit layer 227 and the third circuit layer 229 of the first lead-out section 22. Interference is not likely to occur between the first circuit layer 227 and the third circuit layer 229 of the first lead-out section 22, and the reliability of both the first circuit layer 227 and the third circuit layer 229 of the first lead-out section 22 is high.

[0182] Understandably, since the fourth insulating layer 224 of the first lead-out section 22 is fixedly connected to the side of the third circuit layer 229 of the first lead-out section 22 that is away from the third insulating layer 223 of the first lead-out section 22, the fourth insulating layer 224 of the first lead-out section 22 can also protect the third circuit layer 229 of the first lead-out section 22, and the reliability of the third circuit layer 229 of the first lead-out section 22 is high.

[0183] For example, the electromagnetic interference layer 226 of the first lead-out segment 22 can be fixedly connected to the side of the fourth insulating layer 224 of the first lead-out segment 22 that is away from the third circuit layer 229 of the first lead-out segment 22.

[0184] It is understandable that the electromagnetic interference layer 226 of the first lead-out section 22 can shield the line layer 22a, the first insulating layer 221, the second insulating layer 222, the third insulating layer 223, the fourth insulating layer 224 and the first conductive element 225 of the first lead-out section 22 from electromagnetic interference, which helps to ensure the reliability of the line layer 22a, the first insulating layer 221, the second insulating layer 222, the third insulating layer 223, the fourth insulating layer 224 and the first conductive element 225 of the first lead-out section 22.

[0185] For example, the circuit layer 22a, the first insulating layer 221, the second insulating layer 222, the third insulating layer 223, the fourth insulating layer 224, the first conductive element 225, and the electromagnetic interference layer 226 of the first lead-out segment 22 can be fixedly connected by an adhesive layer (not shown). In other embodiments, the circuit layer 22a, the first insulating layer 221, the second insulating layer 222, the third insulating layer 223, the fourth insulating layer 224, the first conductive element 225, and the electromagnetic interference layer 226 of the first lead-out segment 22 can also be fixedly connected by other means. This application does not specifically limit the details.

[0186] As shown in Figure 13, for example, in the Z-axis direction, the thickness T2 of the first lead-out segment 22 can satisfy: 130μm≤T2≤150μm. For example, T2 can be equal to 130μm, 135μm, 140μm, 146μm or 150μm, etc.

[0187] Understandably, the smaller thickness of the first lead-out segment 22 is beneficial for reducing the weight and thickness of the display module 100, thereby facilitating the thinner design of the display module 100.

[0188] In other embodiments, the thickness T2 of the first lead-out segment 22 may also satisfy other ranges. This application does not specifically limit the details.

[0189] In other embodiments, the circuit layer 22a of the first lead-out segment 22 may include more or fewer structures. For example, when the circuit layer 22a of the first lead-out segment 22 includes more structures, it may include three or more circuit layers. When the circuit layer 22a of the first lead-out segment 22 includes fewer structures, it may include a first circuit layer 227.

[0190] For example, the first conductive element 225 may be embedded within the first insulating layer 221 of the first lead-out section 22. In one embodiment, the first conductive element 225 may be a metal via.

[0191] For example, the first conductive element 225 may include a first end 2251 and a second end 2252. The first end 2251 of the first conductive element 225 may be fixedly connected to and electrically connected to the first circuit layer 227 of the first lead-out segment 22. The second end 2252 of the first conductive element 225 may be fixedly connected to and electrically connected to the second circuit layer 228 of the first lead-out segment 22. In other words, the first circuit layer 227 of the first lead-out segment 22 can be electrically connected to the second circuit layer 228 of the first lead-out segment 22 through the first conductive element 225.

[0192] It is understandable that the first line layer 227 of the first lead-out segment 22 and the second line layer 228 of the first lead-out segment 22 are conductive, and the first conductive element 225 can realize the electrical connection between the first line layer 227 of the first lead-out segment 22 and the second line layer 228 of the first lead-out segment 22.

[0193] For example, at least a portion of the first line layer 227 of the first lead-out segment 22 may be located within the first conductive element 225, or at least a portion of the second line layer 228 of the first lead-out segment 22 may be located within the first conductive element 225, or at least a portion of both the first line layer 227 and the second line layer 228 of the first lead-out segment 22 may be located within the first conductive element 225.

[0194] Figure 15 is a partial cross-sectional view of the display module 100 shown in Figure 8 at the DD line in another embodiment.

[0195] As shown in FIG15, by way of example, the first insulating layer 221 of the first lead-out segment 22 may include a first surface 2211 and a second surface 2212 disposed opposite to each other. By way of example, the first surface 2211 of the first insulating layer 221 of the first lead-out segment 22 may face the first circuit layer 227 of the first lead-out segment 22, and the second surface 2212 of the first insulating layer 221 of the first lead-out segment 22 may face the second circuit layer 228 of the first lead-out segment 22.

[0196] In some embodiments, the first conductive element 225 may be a metal pillar. Exemplarily, the first end 2251 of the first conductive element 225 may be exposed through the first surface 2211 of the first insulating layer 221 of the first lead-out segment 22 and electrically connected to the first circuit layer 227 of the first lead-out segment 222. The second end 2252 of the first conductive element 225 may be exposed through the second surface 2212 of the first insulating layer 221 of the first lead-out segment 22 and electrically connected to the second circuit layer 228 of the first lead-out segment 22. In other words, the first circuit layer 227 of the first lead-out segment 22 can be electrically connected to the second circuit layer 228 of the first lead-out segment 22 through the first conductive element 225.

[0197] It is understandable that the first line layer 227 of the first lead-out segment 22 and the second line layer 228 of the first lead-out segment 22 are conductive, and the first conductive element 225 can realize the electrical connection between the first line layer 227 of the first lead-out segment 22 and the second line layer 228 of the first lead-out segment 22.

[0198] In other embodiments, the first conductive element 225 may also adopt other structures. This application does not specifically limit the application.

[0199] As shown in Figure 13, exemplarily, the first wiring layer 227 of the first lead-out segment 22 can be fixedly connected and electrically connected to the first wiring layer 215 of the main body 21. In one embodiment, the first wiring layer 215 of the main body 21 and the first wiring layer 227 of the first lead-out segment 22 can be disposed on the same layer. It is understood that the main body 21 and the first lead-out segment 22 are schematically distinguished by dashed lines in Figure 13. In other embodiments, the main body 21 and the first lead-out segment 22 can also adopt other arrangement methods. Specifically, this application does not limit the specific arrangement.

[0200] It is understood that the co-layering of the first circuit layer 215 of the main body 21 and the first circuit layer 227 of the first lead-out section 22 can be such that both the first circuit layer 215 of the main body 21 and the first circuit layer 227 of the first lead-out section 22 are located on the same side of the first insulating layer 211 of the main body 21 and the third insulating layer 223 of the first lead-out section 22. Alternatively, the first circuit layer 215 of the main body 21 and the first circuit layer 227 of the first lead-out section 22 can be integrally formed. When component A and component B are co-layered in the following text, the explanation of co-layering can be found here. It will not be repeated below. In other embodiments, the first circuit layer 215 of the main body 21 and the first circuit layer 227 of the first lead-out section 22 can also be fixedly connected and electrically connected in other ways. This application does not limit the specifics.

[0201] It is understood that by placing the first wiring layer 215 of the main body 21 and the first wiring layer 227 of the first lead-out section 22 on the same layer, it is convenient to achieve electrical connection between the first wiring layer 215 of the main body 21 and the first wiring layer 227 of the first lead-out section 22. For example, the first wiring layer 215 of the main body 21 may include a first trace 2151. In one embodiment, the first trace 2151 of the main body 21 may be integrally formed with the first wiring layer 215 of the main body 21.

[0202] For example, the first circuit layer 227 of the first lead-out segment 22 may include a first trace 2271. In one embodiment, the first trace 2271 of the first lead-out segment 22 may be integrally formed with the first circuit layer 227 of the first lead-out segment 22.

[0203] For example, the first trace 2151 of the main body 21 can be fixedly connected to the first trace 2271 of the first lead-out section 22, and electrically connected.

[0204] It is understandable that the first line layer 215 of the main body 21 and the first line layer 227 of the first lead-out section 22 can be electrically connected through the first trace 2151 of the main body 21 and the first trace 2271 of the first lead-out section 22, thereby realizing the electrical connection between the main body 21 and the first lead-out section 22.

[0205] In other embodiments, the main body 21 may be electrically connected to the first lead-out section 22 in other ways. This application does not specify the particular method.

[0206] As shown in Figure 14, by way of example, the second lead-out segment 23 may further include a first insulating layer 231, a second insulating layer 232, a third insulating layer 233, a fourth insulating layer 234, a first conductive element 235, and an electromagnetic interference layer 236. The circuit layer 23a of the second lead-out segment 23 may include a first circuit layer 237, a second circuit layer 238, and a third circuit layer 239.

[0207] For example, along the Z-axis direction, the electromagnetic interference layer 236, the fourth insulating layer 234, the third circuit layer 239, the third insulating layer 233, the first circuit layer 237, the first insulating layer 231, the second circuit layer 238, and the second insulating layer 232 of the second lead-out section 23 can be stacked sequentially.

[0208] As shown in Figure 14, by way of example, the thickness T3 of the second lead-out segment 23 can satisfy: 130μm≤T3≤150μm. For example, T3 can be equal to 130μm, 135μm, 140μm, 146μm or 150μm, etc.

[0209] Understandably, the smaller thickness of the second lead-out section 23 is beneficial for reducing the weight and thickness of the display module 100, thereby facilitating the thinner design of the display module 100.

[0210] In other embodiments, the thickness T3 of the first lead-out segment 23 may also satisfy other ranges. This application does not specifically limit the details.

[0211] It is understood that the second lead-out segment 23 and the first lead-out segment 22 can have the same or similar structure, a symmetrical structure or a partially symmetrical structure, or different structures. In this embodiment, the second lead-out segment 23 and the first lead-out segment 22 have similar structures. The basic design of the component structure of the second lead-out segment 23, the design of the connection relationship between components, and the design of the connection relationship between components and other structures besides the assembly can all refer to the relevant scheme of the first lead-out segment 22. At the same time, it is permissible for the second lead-out segment 23 and the first lead-out segment 22 to have slight differences in the detailed structure or positional arrangement of components. Specific details will not be elaborated here.

[0212] Figure 16 is a partial cross-sectional view of one embodiment of the electronic device 1000 shown in Figure 1 at the FF line. Figure 17 is a partial cross-sectional view of one embodiment of the electronic device 1000 shown in Figure 1 at the GG line.

[0213] As shown in Figures 16 and 17, by way of example, the first lead-out section 22 can be electrically connected to the first circuit board 310, and the second lead-out section 23 can be electrically connected to the second circuit board 320.

[0214] Please refer to Figures 16 and 17, and in conjunction with Figures 13 and 14, for example, the first circuit board 310 and the second circuit board 320 can transmit electrical energy and signals through the line layer 22a of the first lead-out section 22, the line layer 21a of the main body 21, and the line layer 23a of the second lead-out section 23.

[0215] It is understood that both the first lead-out section 22 and the second lead-out section 23 are electrically connected to the main body 21 (see Figure 11). The first circuit board 310 and the second circuit board 320 can achieve mutual power and signal transmission using the circuit layer 22a of the first lead-out section 22, the circuit layer 21a of the main body 21, and the circuit layer 23a of the second lead-out section 23. Furthermore, since the main body 21, the first lead-out section 22, and the second lead-out section 23 are all part of the display module 100, the electronic device 1000 does not require additional structural components to achieve electrical connection between the first circuit board 310 and the second circuit board 320. The electronic device 1000 is relatively thin, which is beneficial for achieving a slim design.

[0216] It is understandable that, compared to the electronic device 1000 shown in Figures 2 and 3, the electrical connection layer 20 of the display module 100 of the electronic device 1000 in this embodiment can serve the same function as the flexible circuit board 330 shown in Figure 3, realizing the electrical connection between the first circuit board 310 and the second circuit board 320. This embodiment eliminates the need for additional structural components, allowing for a thinner design of the electronic device 1000. Furthermore, the display module 100 in this embodiment can also display images; in other words, it offers multiple functions, making it versatile and multifunctional. This results in a higher utilization rate of the internal space of the electronic device 1000.

[0217] In other embodiments, the first lead-out segment 22 may also be electrically connected to the first circuit board 310 through other processes. The second lead-out segment 23 may also be electrically connected to the second circuit board 320 through other processes. Specific details are not limited in this application.

[0218] Please refer to Figures 16 and 17, and in conjunction with Figure 8, for example, in the thickness direction (i.e., the Z-axis direction) of the electronic device 1000, both the first lead-out segment 22 and the second lead-out segment 23 can be offset from the battery 400.

[0219] It is understandable that electronic device 1000 has more space in the thickness direction, and battery 400 can have a greater thickness, thereby increasing the capacity of battery 400 and thus improving the battery life of electronic device 1000.

[0220] It is understandable that in the electronic device 1000 shown in Figure 3, the battery 400 and the flexible circuit board 330 are not staggered. The battery 400 needs to make room to accommodate the flexible circuit board 330. Therefore, the battery 400 is relatively thin and has a relatively small capacity, resulting in a weaker battery life for the electronic device 1000 shown in Figure 3. Compared to the electronic devices 1000 shown in Figures 2 and 3, the electronic device 1000 of this embodiment has a thicker battery 400, thus having a larger capacity and a stronger battery life.

[0221] In other embodiments, the first lead-out segment 22 may also be electrically connected to the second circuit board 320, and the second lead-out segment 23 may also be electrically connected to the first circuit board 310. This application does not specifically limit the details.

[0222] As shown in FIG16, by way of example, the electronic device 1000 may also include a first connector male socket 610 and a first connector female socket 620.

[0223] Referring to Figure 16 and in conjunction with Figure 13, exemplarily, one of the first connector male socket 610 and the first connector female socket 620 can be fixedly and electrically connected to the line layer 22a of the first lead-out segment 22, and the other can be fixedly and electrically connected to the first circuit board 310. In one embodiment, the first connector male socket 610 can be fixedly and electrically connected to the line layer 22a of the first lead-out segment 22, and the first connector female socket 620 can be fixedly and electrically connected to the first circuit board 310. In other embodiments, the first connector female socket 620 can be fixedly and electrically connected to the line layer 22a of the first lead-out segment 22, and the first connector male socket 610 can be fixedly and electrically connected to the first circuit board 310.

[0224] For example, the first connector male socket 610 can be plugged into the first connector female socket 620.

[0225] It is understandable that the first connector male socket 610 and the first connector female socket 620 can realize the electrical connection between the line layer 22a of the first lead-out section 22 and the first circuit board 310, thereby realizing the power transmission and signal transmission between the first lead-out section 22 and the first circuit board 310.

[0226] As shown in FIG17, by way of example, the electronic device 1000 may also include a second connector male socket 710 and a second connector female socket 720.

[0227] Referring to Figure 17 and in conjunction with Figure 14, exemplarily, one of the second connector male socket 710 and the second connector female socket 720 can be fixedly and electrically connected to the wiring layer 23a of the second lead-out segment 23, and the other can be fixedly and electrically connected to the second circuit board 320. In one embodiment, the second connector male socket 710 can be fixedly and electrically connected to the wiring layer 23a of the second lead-out segment 23, and the second connector female socket 720 can be fixedly and electrically connected to the first circuit board 310. In other embodiments, the second connector female socket 720 can be fixedly and electrically connected to the wiring layer 23a of the second lead-out segment 23, and the second connector male socket 710 can be fixedly and electrically connected to the first circuit board 310.

[0228] For example, the second connector male socket 710 can be plugged into the second connector female socket 720.

[0229] It is understandable that the second connector male socket 710 and the second connector female socket 720 can realize the electrical connection between the line layer 23a of the second lead segment 23 and the second circuit board 320, thereby realizing the power transmission and signal transmission between the second lead segment 23 and the second circuit board 320.

[0230] It is understood that the first circuit board 310 can be electrically connected to the second circuit board 320 through the first connector male socket 610, the first connector female socket 620, the first lead-out section 22, the main body 21, the second lead-out section 23, the second connector male socket 710 and the second connector female socket 720, thereby realizing the power transmission and signal transmission between the first circuit board 310 and the second circuit board 320.

[0231] Figure 18 is a partial cross-sectional view of another embodiment of the electronic device 1000 shown in Figure 1 at the FF line.

[0232] As shown in FIG18, in some embodiments, the first lead-out segment 22 may include a first pad 22b, the first circuit board 310 may include a first pad 311, and the first pad 22b of the first lead-out segment 22 may be electrically connected to the first pad 311 of the first circuit board 310 by soldering.

[0233] It is understood that the first pad 22b of the first lead-out segment 22 and the first pad 311 of the first circuit board 310 can realize the fixed connection and electrical connection between the line layer 23a of the first lead-out segment 22 (see Figure 13) and the first circuit board 310, thereby realizing the power transmission and signal transmission between the first lead-out segment 22 and the first circuit board 310.

[0234] Figure 19 is a partial cross-sectional view of another embodiment of the electronic device 1000 shown in Figure 1 at the GG line.

[0235] As shown in Figure 19, in some embodiments, the second lead-out segment 23 may include a second pad 23b, and the second circuit board 320 may include a second pad 321. The second pad 23b of the second lead-out segment 23 may be electrically connected to the second pad 321 of the second circuit board 320 by soldering.

[0236] It is understood that the second pad 23b of the second lead-out segment 23 and the second pad 321 of the second circuit board 320 can realize the fixed connection and electrical connection between the line layer 23a of the second lead-out segment 23 (see Figure 14) and the second circuit board 320, thereby realizing the power transmission and signal transmission between the second lead-out segment 23 and the second circuit board 320.

[0237] It is understood that the first circuit board 310 can be electrically connected to the second circuit board 320 through the first pad 311 of the first circuit board 310, the first pad 22b of the first lead-out segment 22, the first lead-out segment 22, the main body 21, the second lead-out segment 23, the second pad 23b of the second lead-out segment 23, and the second pad 321 of the second circuit board 320, thereby realizing the power transmission and signal transmission between the first circuit board 310 and the second circuit board 320.

[0238] In other embodiments, the first lead-out segment 22 may also be electrically connected to the first circuit board 310 in other ways. The second lead-out segment 23 may also be electrically connected to the second circuit board 320 in other ways. Specific details are not limited in this application.

[0239] Figure 20 is a partial structural schematic diagram of the electronic device 1000 shown in Figure 1 in one embodiment. It is understood that, in order to show the internal structure of the electronic device 1000 more clearly, the display module 100 is schematically hidden in Figure 20.

[0240] Please refer to Figure 20, and in conjunction with Figures 13, 16 and 17, as exemplarily, the charging interface 510 can transmit electrical energy to the battery 400 through the second circuit board 320, the line layer 23a of the second lead-out section 23 of the display module 100, the line layer 21a of the main body 21 of the display module 100, the line layer 22a of the first lead-out section 22 of the display module 100, the first circuit board 310 and the power chip 520.

[0241] It is understood that the charging interface 510 can transmit electrical energy to the battery 400 through the second circuit board 320, the second lead-out section 23 of the electrical connection layer 20 of the display module 100, the main body 21, the first lead-out section 22, the first circuit board 310, and the power chip 520. In this way, the electronic device 1000 does not need additional structural components to achieve the electrical connection between the charging interface 510 and the battery 400, thereby facilitating a thinner design for the electronic device 1000. Furthermore, the thickness of the battery 400 can be increased, thereby increasing the capacity of the battery 400 and thus improving the battery life of the electronic device 1000. In other embodiments, when the electronic device 1000 adopts other structures, the charging interface 510 can also transmit electrical energy to the battery 400 in other ways. Specifically, this application does not limit the specific implementation.

[0242] Figure 21 is a partial structural schematic diagram of the electronic device 1000 shown in Figure 1 in one embodiment. It is understood that, in order to show the internal structure of the electronic device 1000 more clearly, Figure 21 schematically hides the housing 200.

[0243] Please refer to Figure 21, and in conjunction with Figures 13, 16 and 17, as an example, electronic component 540 can transmit signals to processor 530 through second circuit board 320, line layer 23a of second lead-out section 23, line layer 21a of main body 21, line layer 22a of first lead-out section 22 and first circuit board 310.

[0244] Understandably, electronic component 540 can transmit signals to processor 530 via second circuit board 320, second lead-out section 23, main body 21, first lead-out section 22, and first circuit board 310. In this way, electronic device 1000 can achieve electrical connection between electronic component 540 and processor 530 without additional structural components, thereby facilitating a thinner design for electronic device 1000. Furthermore, the thickness of battery 400 can be increased, thereby increasing battery capacity and thus improving the battery life of electronic device 1000.

[0245] In other embodiments, when the electronic device 1000 adopts other structures, the electronic component 540 may also transmit signals to the processor 530 in other ways.

[0246] Figure 22 is a partial structural schematic diagram of the display module 100 shown in Figure 1 in one embodiment. Figure 23 is a partial cross-sectional schematic diagram of the electronic device 1000 shown in Figure 1 at line HH in one embodiment.

[0247] As shown in Figures 22 and 23, by way of example, the second insulating layer 212 of the main body 21 may be provided with a grounding window 2121. The first wiring layer 215 of the main body 21 may include a grounding wire 2152, which is exposed relative to the second insulating layer 212 of the main body 21 through the grounding window 2121. It is understood that the grounding wire 2152 of the main body 21 can be used for electrical connection with other structural components.

[0248] It is understood that Figure 22 only schematically shows the approximate location and shape of the grounding window 2121. In other embodiments, the grounding window 2121 may also be located at other locations on the second insulating layer 212 of the main body 21, and the grounding window 2121 may also be approximately circular, triangular, or irregular in shape. In actual products, the location and shape of the grounding window 2121 can be flexibly set according to actual needs. Specifically, this application does not limit it.

[0249] As shown in Figure 23, by way of example, the electronic device 1000 also includes a grounding element 800, which can be fixedly connected to the housing 200 and electrically connected to the housing 200. In one embodiment, the grounding element 800 can be conductive foam, a metal spring, or other structures.

[0250] As shown in Figures 22 and 23, by way of example, at least a portion of the grounding member 800 may be located within the grounding window 2121 and may be electrically connected to the grounding wire 2152 of the main body 21 to achieve grounding of the display module 100.

[0251] It is understandable that by setting the grounding component 800 to be electrically connected to the main body 21, the display module 100 and the housing 200 can be grounded, and the grounding potential of the display module 100 and the housing 200 can be unified.

[0252] As shown in Figures 22 and 23, by way of example, the main body 21 may also include an antioxidant layer 218, which may be fixedly connected to the side of the first circuit layer 215 of the main body 21 near the second insulating layer 212 of the main body 21 and exposed relative to the grounding window 2121.

[0253] It is understandable that the anti-oxidation layer 218 can improve the anti-oxidation performance of the portion of the first circuit layer 215 of the main body 21 exposed relative to the ground window 2121, thereby improving the reliability of the first circuit layer 215 of the main body 21.

[0254] For example, the anti-oxidation layer 218 can be formed on the surface of the second insulating layer 212 near the body portion 21 of the first circuit layer 215 by an electroless nickel and immersion gold (ENIG) process. Electroless nickel and immersion gold plating is a process that involves chemically displacing palladium on the surface of copper, then electrolessly plating a nickel-phosphorus alloy layer onto the palladium core, and finally plating a layer of gold onto the surface of nickel by a displacement reaction.

[0255] It is understandable that the anti-oxidation layer 218 formed on the surface of the first circuit layer 215 of the main body 21 by the nickel plating process can improve the anti-oxidation performance of the first circuit layer 215 of the main body 21 and improve the reliability of the first circuit layer 215 of the main body 21.

[0256] In other embodiments, the antioxidant layer 218 may be formed in other ways on the surface of the second insulating layer 212 facing the body portion 21 of the first circuit layer 215 of the body portion 21.

[0257] In other embodiments, the antioxidant properties of the first circuit layer 215 of the main body 21 can be improved in other ways. This application does not specifically limit the details.

[0258] Figure 24 is a partial cross-sectional view of another embodiment of the display module 100 shown in Figure 7 at the CC line.

[0259] As shown in Figure 24, exemplarily, the display panel layer 10 includes a display area 11 and a bending area 12. The bending area 12 can connect to the display area 11, and a portion of the display area 11 can be bent to the side of the electrical connection layer 20 away from the display area 11 and fixedly connected to the electrical connection layer 20. The display area 11 can be used to implement the display function of the display module 100. It is understood that the display area 11 and the bending area 12 are schematically distinguished by dashed lines in Figure 24. In other embodiments, the display area 11 and the bending area 12 may also adopt other configurations. Specifically, this application does not limit the specific configuration.

[0260] Referring to Figure 24 and in conjunction with Figure 13, by way of example, the bending area 12 of the display panel layer 10 can be fixedly connected to the circuit layer 21a of the main body 21.

[0261] For example, the bending area 12 can be electrically connected to the main body 21 via a hot-press soldering process. This hot-press soldering process is a welding method that primarily utilizes heat provided by a hot press head. After the hot press head is heated to a certain temperature, it comes into contact with tin material. Heat is transferred to the tin, causing it to reach its melting point and melt. Under pressure, the liquid tin fills the tiny gaps between the workpieces being welded. Upon cooling, the liquid tin solidifies into solid tin, which enables both a fixed connection and an electrical connection between the welded workpieces.

[0262] Understandably, the hot-press molten soldering process can precisely control temperature and pressure, and can achieve a precise connection when welding the bending area 12 and the main body 21, ensuring the stability of the welding quality, thereby ensuring reliable mechanical connection strength and electrical connection performance between the bending area 12 and the main body 21.

[0263] For example, the bending area 12 may have a first connecting pad 12a, and the main body 21 may have a second connecting pad 21b. The first connecting pad 12a and the second connecting pad 21b may be arranged opposite to each other, and the first connecting pad 12a may be electrically connected to the second connecting pad 21b by soldering.

[0264] It is understood that the first connecting pad 12a and the second connecting pad 21b can realize the electrical connection between the bending area 12 of the display panel layer 10 and the main body 21. The circuit layer 21a of the main body 21 can transmit power and signals to the bending area 12 of the display panel layer 10, thereby transmitting power and signals to the display area 11 of the display panel layer 10. The display area 11 of the display panel layer 10 can realize the display function of the display module 100.

[0265] Figure 25 is a partial cross-sectional view of the display module 100 shown in Figure 7 at the CC line, representing another embodiment.

[0266] As shown in Figure 25, exemplarily, the display panel layer 10 may further include conductive adhesive 13. The conductive adhesive 13 may be an anisotropic conductive film, primarily composed of silver-coated thermosetting resin particles. Upon heating and pressurization, the thermosetting resin particles are slightly broken down, thereby achieving a reliable electrical connection between the solder joints. In other embodiments, the conductive adhesive 13 may also be made of other materials. This application does not specifically limit its application.

[0267] For example, the conductive adhesive 13 can be fixedly connected between the bending area 12 and the main body 21, and the bending area 12 can be electrically connected to the main body 21 through the conductive adhesive 13.

[0268] It is understood that the conductive adhesive 13 can realize the electrical connection between the bending area 12 of the display panel layer 10 and the main body 21. The circuit layer 21a of the main body 21 can transmit power and signals to the bending area 12 of the display panel layer 10, thereby transmitting power and signals to the display area 11 of the display panel layer 10. The display area 11 of the display panel layer 10 can realize the display function of the display module 100.

[0269] In other embodiments, the bending area 12 of the display panel layer 10 can be fixedly connected and electrically connected to the circuit layer 21a of the main body 21 in other ways. This application does not specifically limit the details.

[0270] Figure 26 is a partial structural schematic diagram of the electronic device 1000 shown in Figure 1 in another embodiment. It is understood that the housing 200 is schematically hidden in Figure 26 in order to show the internal structure of the electronic device 1000 more clearly.

[0271] As shown in Figure 26, a portion of the first lead-out section 22 can be disposed opposite to the battery 400 in the thickness direction of the electronic device 1000. In other words, the first lead-out section 22 can span at least a portion of the battery 400.

[0272] For example, a portion of the first lead-out segment 22 may extend from one edge of the battery 400 toward the side of the battery 400 away from the display module 100, and then extend out of the battery 400 through the other edge of the battery 400.

[0273] In other embodiments, the positional relationship between the first lead-out segment 22 and the battery 400 is not specifically limited.

[0274] It is understandable that the positional relationship between the second lead-out segment 23 and the battery 400 can also be referred to the positional relationship between the first lead-out segment 22 and the battery 400 shown in Figure 26. Specific details will not be elaborated here.

[0275] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments described in this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0276] It should be noted that all the above-described figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application. The above are merely some embodiments and implementations of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module (100), characterized in that, It includes a display panel layer (10) and an electrical connection layer (20), wherein the electrical connection layer (20) is fixedly connected to the non-display side of the display panel layer (10); The electrical connection layer (20) includes a main body (21), a first lead-out section (22), and a second lead-out section (23). The first lead-out section (22) and the second lead-out section (23) are fixedly connected to the main body (21) at intervals and are electrically connected to the main body (21). The main body (21) is fixedly connected to the non-display side of the display panel layer (10). Both the first lead-out section (22) and the second lead-out section (23) can be bent relative to the main body (21). In the thickness direction of the display module (100), the main body (21) includes at least one circuit layer (21a), and the first lead-out section (22) and the second lead-out section (23) each include at least two circuit layers. The number of circuit layers (22a) of the first lead-out section (22) and the number of circuit layers (23a) of the second lead-out section (23) are both greater than the number of circuit layers (21a) of the main body (21).

2. The display module (100) according to claim 1, characterized in that, The line layer (22a) of the first lead-out segment (22) includes a first line layer (227) and a second line layer (228); The first lead-out section (22) includes a first insulating layer (221) and a first conductive element (225). The first insulating layer (221) of the first lead-out section (22) is fixedly connected between the first circuit layer (227) and the second circuit layer (228) of the first lead-out section (22). The first conductive element (225) is embedded in the first insulating layer (221) of the first lead-out section (22). The first end (2251) of the first conductive element (225) is fixedly connected to the first circuit layer (227) of the first lead-out section (22) and electrically connected. The second end (2252) of the first conductive element (225) is fixedly connected to the second circuit layer (228) of the first lead-out section (22) and electrically connected.

3. The display module (100) according to claim 2, characterized in that, The first lead-out section (22) includes a second insulating layer (222), which is fixedly connected to the side of the second circuit layer (228) of the first lead-out section (22) away from the first insulating layer (221) of the first lead-out section (22).

4. The display module (100) according to claim 3, characterized in that, The first lead-out section (22) includes a third insulating layer (223), a third circuit layer (229), and a fourth insulating layer (224); The third insulating layer (223) of the first lead-out segment (22) is fixedly connected to the side of the first circuit layer (227) of the first lead-out segment (22) away from the first insulating layer (221) of the first lead-out segment (22). The third circuit layer (229) of the first lead-out segment (22) is fixedly connected to the side of the third insulating layer (223) of the first lead-out segment (22) away from the first circuit layer (227) of the first lead-out segment (22). The fourth insulating layer (224) of the first lead-out segment (22) is fixedly connected to the side of the third circuit layer (229) of the first lead-out segment (22) away from the third insulating layer (223) of the first lead-out segment (22).

5. The display module (100) according to claim 4, characterized in that, The first lead-out section (22) includes an electromagnetic interference layer (226), which is fixedly connected to the side of the fourth insulating layer (224) of the first lead-out section (22) away from the third circuit layer (229) of the first lead-out section (22).

6. The display module (100) according to any one of claims 2 to 5, characterized in that, The main body (21) includes a first circuit layer (215), a first insulating layer (211) and a second insulating layer (212), wherein the first circuit layer (215) of the main body (21) is fixedly connected between the first insulating layer (211) and the second insulating layer (212) of the main body (21); The first line layer (215) of the main body (21) is disposed on the same layer as the first line layer (227) of the first lead-out section (22).

7. The display module (100) according to claim 6, characterized in that, The first wiring layer (215) of the main body (21) includes a first trace (2151), and the first wiring layer (227) of the first lead-out section (22) includes a first trace (2271). The first trace (2151) of the main body (21) is fixedly connected to the first trace (2271) of the first lead-out section (22).

8. The display module (100) according to claim 6 or 7, characterized in that, The second insulating layer (212) of the main body (21) is provided with a grounding window (2121), and the first circuit layer (215) of the main body (21) includes a grounding wire (2152). The grounding wire (2152) of the main body (21) is exposed relative to the second insulating layer (212) of the main body (21) through the grounding window (2121).

9. The display module (100) according to any one of claims 1 to 8, characterized in that, The thickness T1 of the main body (21) satisfies: 80μm≤T1≤95μm; And / or, the thickness T2 of the first lead-out segment (22) satisfies: 130μm≤T2≤150μm; And / or, the thickness T3 of the second lead-out segment (23) satisfies: 130μm≤T3≤150μm.

10. The display module (100) according to any one of claims 1 to 9, characterized in that, The first lead-out section (22) is fixedly connected to the middle of the main body (21) and extends from the middle of the main body (21) to one side of the middle of the main body (21), or the first lead-out section (22) is fixedly connected to the edge of the main body (21) and extends from the edge of the main body (21) to one side of the middle of the main body (21).

11. The display module (100) according to any one of claims 1 to 10, characterized in that, At least a portion of the first lead-out section (22) is bent to the side of the main body (21) away from the display panel layer (10); and / or, at least a portion of the second lead-out section (23) is bent to the side of the main body (21) away from the display panel layer (10).

12. The display module (100) according to any one of claims 1 to 11, characterized in that, The display panel layer (10) includes a display area (11) and a bending area (12). The bending area (12) is connected to the display area (11). A portion of the bending area (12) is bent to the side of the electrical connection layer (20) away from the display area (11) and is fixedly connected to the circuit layer (21a) of the main body (21). The bending area (12) has a first connecting pad (12a), and the main body (21) has a second connecting pad (21b). The first connecting pad (12a) is electrically connected to the second connecting pad (21b) by soldering.

13. The display module (100) according to any one of claims 1 to 11, characterized in that, The display panel layer (10) includes a display area (11) and a bending area (12). The bending area (12) is connected to the display area (11). A portion of the bending area (12) is bent to the side of the electrical connection layer (20) away from the display area (11) and is fixedly connected to the circuit layer (21a) of the main body (21). The bending area (12) is electrically connected to the main body (21) by a hot-press molten soldering process.

14. The display module (100) according to any one of claims 1 to 11, characterized in that, The display panel layer (10) includes a display area (11) and a bending area (12). The bending area (12) is connected to the display area (11). A portion of the bending area (12) is bent to the side of the electrical connection layer (20) away from the display area (11) and is fixedly connected to the circuit layer (21a) of the main body (21). The display panel layer (10) further includes conductive adhesive (13), which is fixedly connected between the bending area (12) and the main body (21). The bending area (12) is electrically connected to the main body (21) through the conductive adhesive (13).

15. The display module (100) according to any one of claims 1 to 14, characterized in that, The display module (100) further includes a buffer layer (30), an adhesive layer (40), and a support layer (50); The buffer layer (30) is fixedly connected to the surface of the main body (21) of the electrical connection layer (20) facing the display panel layer (10), the support layer (50) is fixedly connected to the surface of the main body (21) of the display panel layer (10) facing the electrical connection layer (20), and the adhesive layer (40) is fixedly connected between the buffer layer (30) and the support layer (50).

16. The display module (100) according to any one of claims 1 to 15, characterized in that, The display module (100) further includes a polarizer layer (60), an optical adhesive layer (70), and a cover plate (80); the polarizer layer (60), the optical adhesive layer (70), and the cover plate (80) are stacked sequentially on the display side of the display panel layer (10).

17. An electronic device (1000), characterized in that, It includes a housing (200) and a display module (100) as claimed in any one of claims 1 to 16, the display module (100) being mounted on the housing (200).

18. The electronic device (1000) according to claim 17, characterized in that, The display module (100) and the housing (200) enclose a receiving space (201). The electronic device (1000) includes a first circuit board (310) and a second circuit board (320), which are fixedly connected to the receiving space (201) at intervals. The first lead-out section (22) is electrically connected to the first circuit board (310), and the second lead-out section (23) is electrically connected to the second circuit board (320).

19. The electronic device (1000) according to claim 18, characterized in that, The electronic device (1000) includes a first connector male socket (610) and a first connector female socket (620). One of the first connector male socket (610) and the first connector female socket (620) is fixed and electrically connected to the first lead-out section (22), and the other is fixed and electrically connected to the first circuit board (310). The first connector male socket (610) is inserted into the first connector female socket (620). And / or, the electronic device (1000) includes a second connector male (710) and a second connector female (720), one of the second connector male (710) and the second connector female (720) being fixed and electrically connected to the second lead-out section (23), and the other being fixed and electrically connected to the second circuit board (320), with the second connector male (710) being inserted into the second connector female (720).

20. The electronic device (1000) according to claim 18, characterized in that, The first lead-out segment (22) includes a first pad (22b), the first circuit board (310) includes a first pad (311), and the first pad (22b) of the first lead-out segment (22) is electrically connected to the first pad (311) of the first circuit board (310) by soldering. And / or, the second lead-out segment (23) includes a second pad (23b), the second circuit board (320) includes a second pad (321), and the second pad (23b) of the second lead-out segment (23) is electrically connected to the second pad (321) of the second circuit board (320) by soldering.

21. The electronic device (1000) according to any one of claims 18 to 20, characterized in that, The first circuit board (310) and the second circuit board (320) transmit electrical energy and signals through the line layer (22a) of the first lead-out section (22), the line layer (21a) of the main body (21), and the line layer (23a) of the second lead-out section (23).

22. The electronic device (1000) according to claim 21, characterized in that, The electronic device (1000) includes a battery (400), a charging interface (510), and a power chip (520), wherein the battery (400) is fixedly connected to the receiving space (201); The charging interface (510) is electrically connected to the second circuit board (320), the power chip (520) is electrically connected to the first circuit board (310), the battery (400) is electrically connected to the power chip (520), and the charging interface (510) transmits electrical energy to the battery (400) through the second circuit board (320), the line layer (23a) of the second lead-out section (23), the line layer (21a) of the main body (21), the line layer (22a) of the first lead-out section (22), the first circuit board (310), and the power chip (520).

23. The electronic device (1000) according to claim 22, characterized in that, The battery (400) is located between the first circuit board (310) and the second circuit board (320); In the thickness direction of the electronic device (1000), both the first lead-out section (22) and the second lead-out section (23) are offset from the battery (400).

24. The electronic device (1000) according to claim 21, characterized in that, The electronic device (1000) includes a processor (530) and electronic components (540), wherein the processor (530) is electrically connected to the first circuit board (310), and the electronic components (540) are electrically connected to the second circuit board (320), wherein the electronic components (540) include one or more of a speaker, a fingerprint recognition module, and a SIM card slot; The electronic component (540) transmits signals to the processor (530) through the second circuit board (320), the line layer (23a) of the second lead-out section (23), the line layer (21a) of the main body (21), the line layer (22a) of the first lead-out section (22), the first circuit board (310), and the processor (530).

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