Electronic device
By adding infrared devices and light guides to electronic devices, the problem of poor appearance performance of single camera modules has been solved, achieving improved appearance performance and reduced costs.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- VIVO MOBILE COMM CO LTD
- Filing Date
- 2026-01-20
- Publication Date
- 2026-07-30
AI Technical Summary
The inclusion of a camera module in existing electronic devices results in poor appearance and performance.
Infrared devices and light guides are added to electronic devices. Infrared remote control is performed using the infrared devices, and infrared light is exported through the light guide. The curved surface of the light guide is combined with the light-transmitting lens, and the appearance and structure are consistent with the camera module.
It improves the appearance of electronic devices, saves time searching for remote controls, and reduces the number of camera modules, thus lowering costs.
Smart Images
Figure CN2026073604_30072026_PF_FP_ABST
Abstract
Description
electronic devices
[0001] Cross-references to related applications
[0002] This application claims priority to Chinese Patent Application No. 202510111331.0, filed on January 23, 2025, entitled “Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field
[0003] This application belongs to the field of communication technology, and specifically relates to an electronic device. Background Technology
[0004] In related technologies, mobile phones and other electronic devices are usually equipped with multiple camera modules. For electronic devices with only one camera module, their appearance performance is relatively poor, which poses a great challenge to the appearance design. Summary of the Invention
[0005] This application provides an electronic device that can solve the problem in related technologies where setting up a camera module in an electronic device results in poor appearance performance.
[0006] This application provides an electronic device, including a device body, a camera module, a light-transmitting lens, and an infrared device. The camera module and the infrared device are both disposed on the device body. The light-transmitting lens is disposed on the surface of the device body and has a first light-transmitting area and a second light-transmitting area. The camera module is opposite to the first light-transmitting area. The device body includes a light guide portion. The infrared device, the light guide portion, and the second light-transmitting area are sequentially opposite each other. Infrared light emitted by the infrared device passes through the light guide portion and is emitted from the second light-transmitting area. The light guide portion has an arc surface, and the arc surface protrudes from the side where the light-transmitting lens is located.
[0007] In this embodiment, for electronic devices such as mobile phones and tablets with camera modules, an infrared device is further added. This infrared device enables infrared remote control of various home appliances such as televisions and air conditioners, eliminating the need for separate remote controls and saving time spent searching for them. Furthermore, the infrared device and light guide are located on the side of the light-transmitting lens facing away from the user. The curved surface of the light guide bulges out on the side where the light-transmitting lens is located. Therefore, the appearance of the light guide is identical to that of the camera module's lens. The combination of the light guide and the light-transmitting lens results in a consistent appearance with the camera module. Although this type of electronic device can have only one camera module, its appearance is identical to that of electronic devices with multiple camera modules, thus improving the overall aesthetics of the device. Attached Figure Description
[0008] Figure 1 is an exploded view of an electronic device disclosed in an embodiment of this application;
[0009] Figure 2 is a partial cross-sectional view of an electronic device disclosed in an embodiment of this application;
[0010] Figure 3 is a schematic diagram of the cooperation between the light-transmitting lens and the light-transmitting cover disclosed in the embodiments of this application;
[0011] Figure 4 is a top view of the light-transmitting cover disclosed in the embodiment of this application;
[0012] Figure 5 is an exploded view of an electronic device disclosed in another embodiment of this application;
[0013] Figure 6 is a partial cross-sectional view of an electronic device disclosed in another embodiment of this application;
[0014] Figure 7 is a schematic diagram of a partial structure in Figure 6;
[0015] Figure 8 is a top view of the package disclosed in an embodiment of this application.
[0016] Explanation of reference numerals in the attached drawings: 100-Equipment body, 100a-Gap, 110-First circuit board, 120-Circuit board support, 121-Abutment groove, 130-Light-transmitting cover, 131-Textured structure, 140-Packaging component, 150-Second circuit board, 160-Conductive component, 170-Decorative ring, 180-Frame, 200-Camera module, 300-Light-transmitting lens, 310-First light-transmitting area, 320-Second light-transmitting area, 330-Light-blocking layer, 400-Infrared device, 500-Light guide section, 510-Curved surface, 600-Depth of field section, 610-Annular cone surface, 620-Plane, A-First direction, B-Second direction. Detailed Implementation
[0017] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.
[0018] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0019] The electronic device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.
[0020] Please refer to Figures 1-8. The electronic device disclosed in this application includes a device body 100, a camera module 200, a light-transmitting lens 300, and an infrared device 400. The device body 100 serves as the main component of the electronic device and as the mounting base for the camera module 200, the light-transmitting lens 300, and the infrared device 400. The camera module 200 is used for taking pictures and videos. The light-transmitting lens 300 is used to protect the lens of the camera module 200. The infrared device 400 is used to emit infrared light to perform infrared remote control functions.
[0021] Both the camera module 200 and the infrared device 400 are disposed on the main body 100 of the device. A light-transmitting lens 300 is disposed on the surface of the main body 100 to cover the camera module 200 and the infrared device 400. Optionally, the camera module 200 and the infrared device 400 can be disposed on the main body 100 by welding, bonding, or other methods, and the light-transmitting lens 300 can be connected to the main body 100 by bonding or other methods. Furthermore, the light-transmitting lens 300 has a first light-transmitting area 310 and a second light-transmitting area 320, which are spaced apart. The camera module 200 faces the first light-transmitting area 310, and the infrared device 400 faces the second light-transmitting area 320. Thus, external light enters the camera module 200 through the first light-transmitting area 310, enabling photo and video recording functions, while infrared light emitted by the infrared device 400 exits through the second light-transmitting area 320, enabling infrared remote control functions.
[0022] Optionally, both the first light-transmitting area 310 and the second light-transmitting area 320 can be circular areas, square areas, etc., as shown in Figures 3 and 7. The light-transmitting lens 300 can be transparent glass, or of course, other lenses with light-transmitting effects.
[0023] For electronic devices such as mobile phones and tablets with camera modules 200, an infrared device 400 is further added. The infrared device 400 is used for infrared remote control to control various home appliances such as televisions and air conditioners, so that televisions, air conditioners and other home appliances no longer need to be equipped with corresponding remote controls, saving time spent looking for remote controls.
[0024] In this embodiment, referring to Figures 2 and 3, and Figures 6 and 7, the main body 100 of the device includes a light guide section 500, which is used for guiding light. The infrared device 400, the light guide section 500, and the second light-transmitting area 320 are sequentially opposite each other. The infrared light emitted by the infrared device 400 passes through the light guide section 500 and is emitted from the second light-transmitting area 320. Moreover, the light guide section 500 is provided with an arc surface 510, which protrudes towards the side where the light-transmitting lens 300 is located. Optionally, the arc surface 510 can be part of a sphere; of course, the arc surface 510 can also be an aspherical structure. In this way, after the infrared light is guided by the light guide section 500, it is emitted from the arc surface 510 of the light guide section 500. The arc surface 510 helps to increase the emission area, which is beneficial to the divergence of infrared light and expands the divergence angle of infrared light.
[0025] In this embodiment, the infrared device 400 and the light guide 500 are located on the side of the light-transmitting lens 300 facing away from the user. The arc surface 510 of the light guide 500 protrudes towards the side where the light-transmitting lens 300 is located. Therefore, the appearance structure of the light guide 500 is the same as that of the lens of the camera module 200. The light guide 500 and the light-transmitting lens 300 are combined and their appearance structure is consistent with that of the camera module 200. Although this electronic device can be equipped with one camera module 200, its appearance performance is the same as that of an electronic device equipped with multiple camera modules 200. Therefore, the appearance performance of this electronic device is improved.
[0026] Furthermore, camera modules 200 typically include optical components such as lenses, which require high precision and therefore have high costs. The electronic device in this application, however, can use only one camera module 200. Compared to electronic devices with multiple camera modules 200, the reduced number of camera modules 200 helps lower costs. Therefore, the electronic device in this embodiment can use only one camera module 200, simultaneously improving aesthetics and reducing costs.
[0027] In an optional embodiment, referring to Figures 3 and 7, the device body 100 includes a depth-of-field section 600. The depth-of-field section 600 is used to guide or block the infrared light after it has been guided by the light guide section 500, thereby limiting the emission range of the infrared light. Specifically, the depth-of-field section 600 is arranged around the light guide section 500. The minimum distance between the depth-of-field section 600 and the light-transmitting lens 300 is less than the minimum distance between the light guide section 500 and the light-transmitting lens 300. The depth-of-field section 600 is relatively close to the light-transmitting lens 300 relative to the light guide section 500. Therefore, the infrared light guided by the light guide section 500 is further emitted from the area surrounded by the depth-of-field section 600.
[0028] The depth-of-field section 600 is provided with an annular conical surface 610, which surrounds the arc surface 510. The depth-of-field section 600 mainly relies on the annular conical surface 610 to define the infrared light emission range, ensuring that the infrared light passing through the arc surface 510 is emitted within the range defined by the annular conical surface 610. The minimum distance between the annular conical surface 610 and the light-transmitting lens 300 is less than the minimum distance between the arc surface 510 and the light-transmitting lens 300, and the annular conical surface 610 is relatively close to the light-transmitting lens 300 relative to the arc surface 510. Referring to Figures 2-3 and 6-7, along the second direction B, the size of the annular conical surface 610 increases in the first direction A. The first direction A is parallel to the plane where the light-transmitting lens 300 is located, and the second direction B is the arrangement direction of the infrared device 400, the light guide section 500, and the light-transmitting lens 300.
[0029] Optionally, the depth-of-field section 600 and the light guide section 500 can be an integrated structure or a separate structure; the annular cone surface 610 can be a square annular cone surface, in which case the first direction A is the width direction of the annular cone surface 610, or the annular cone surface 610 can also be a circular annular cone surface, in which case the dimension of the annular cone surface 610 in the first direction A is the diameter of the annular cone surface 610, and the diameter of the annular cone surface 610 increases along the second direction B.
[0030] In this embodiment, the main body 100 of the device is equipped with a depth-of-field section 600. The annular conical surface 610 of the depth-of-field section 600 surrounds the arc surface 510. Since the annular conical surface 610 is closer to the light-transmitting lens 300 than the arc surface 510, and the arc surface 510 is further away from the light-transmitting lens 300, the sense of depth created by the light guide section 500, the depth-of-field section 600 and the light-transmitting lens 300 is stronger. The structure after the light guide section 500, the depth-of-field section 600 and the light-transmitting lens 300 are combined is more consistent with the appearance structure of the camera module 200, which is conducive to further improving the appearance performance of the electronic device.
[0031] Optionally, the surface of the depth field 600 facing the light-transmitting lens 300 is provided with a spark pattern. Specifically, referring to Figure 3, the surface of the depth field 600 facing the light-transmitting lens 300 includes a plane 620 and the annular conical surface 610 mentioned above. The plane 620 is parallel to the light-transmitting lens 300 and connected to the annular conical surface 610. Both the plane 620 and the annular conical surface 610 are provided with spark patterns, or one of the plane 620 and the annular conical surface 610 is provided with spark patterns. This arrangement, by providing spark patterns, helps to further improve the appearance performance of the electronic device.
[0032] Of course, in other embodiments, the device body 100 may not have a depth field 600, and may rely solely on the light guide 500 and the light-transmitting lens 300 to make the light-emitting structure of the infrared device 400 and the structure of the camera module 200 appear similar.
[0033] In one alternative embodiment, the depth-of-field portion 600 may contact the light-transmitting lens 300, that is, there is no gap 100a between the depth-of-field portion 600 and the light-transmitting lens 300.
[0034] In another embodiment, referring to Figures 3 and 7, there is a gap 100a between the depth-of-field portion 600 and the light-transmitting lens 300, and the depth-of-field portion 600 and the light-transmitting lens 300 are not in direct contact.
[0035] In this embodiment, since there is a gap 100a between the depth-of-field portion 600 and the light-transmitting lens 300, the depth-of-field portion 600 is further away from the light-transmitting lens 300, and the depth of field of the curved surface 510 is further improved. The structure after the light guide portion 500, the depth-of-field portion 600 and the light-transmitting lens 300 are combined has a higher similarity to the appearance structure of the camera module 200, which is conducive to further improving the appearance performance of the electronic device.
[0036] In the scheme of this application, referring to Figures 1-4, the main body of the device 100 includes a first circuit board 110, a circuit board support 120, and a light-transmitting cover 130. The first circuit board 110 is located on the side of the infrared device 400 that is away from the light-transmitting lens 300. The infrared device 400 is electrically connected to the first circuit board 110. The first circuit board 110 is used to supply power to the infrared device 400 so that the infrared device 400 can smoothly emit infrared light. Optionally, the infrared device 400 can be directly soldered to the first circuit board 110 to achieve electrical connection between the two.
[0037] The light-transmitting cover 130 is located between the infrared device 400 and the light-transmitting lens 300. The light-transmitting cover 130 covers the outside of the infrared device 400, and the infrared light emitted by the infrared device 400 is emitted through the light-transmitting cover 130. The first circuit board 110 and the light-transmitting cover 130 are respectively mounted on the circuit board bracket 120. Optionally, referring to Figure 2, the circuit board bracket 120 has an opening, the light-transmitting cover 130 is located at the opening, and the light-transmitting cover 130 is engaged with the edge of the opening, thereby mounting the light-transmitting cover 130 on the circuit board bracket 120, so that the circuit board bracket 120 surrounds the light-transmitting cover 130. Of course, the light-transmitting cover 130 can also be mounted on the circuit board bracket 120 by welding, bonding or other methods, so that the relative positions of the circuit board bracket 120 and the light-transmitting cover 130 are fixed. Optionally, the surface of the circuit board bracket 120 facing away from the light-transmitting lens 300 has a relief groove 121, which communicates with the opening. The first circuit board 110 and the bottom wall of the relief groove 121 can be connected by welding, bonding or other methods, thereby mounting the first circuit board 110 on the circuit board bracket 120, so that the relative positions of the first circuit board 110 and the circuit board bracket 120 are fixed.
[0038] The light-transmitting cover 130 can be made of a semi-transparent material, such as plastic or other materials with a certain degree of transparency. Optionally, the light-transmitting cover 130 can be black. Referring to Figure 3, the light-transmitting cover 130 includes a light-guiding part 500 and a depth-of-field part 600, where the depth-of-field part 600 is used for light guiding. That is, the surface of the light-transmitting cover 130 facing the light-transmitting lens 300 includes an arc surface 510 and an annular conical surface 610.
[0039] In this embodiment, the main body of the device 100 does not need to be separately equipped with a light guide 500 and a depth of field 600. The light guide 500 and the depth of field 600 are formed directly by using the light-transmitting cover 130 with an arc surface 510 and an annular conical surface 610. This helps to reduce the number of components in the electronic device, realize the miniaturization of the electronic device, and reduce costs.
[0040] In an optional embodiment, referring to FIG3, the surface of the light-transmitting cover 130 near the infrared device 400 is provided with a textured structure 131 to increase the light emission range of the light-transmitting cover 130. Optionally, the textured structure 131 can be a spark pattern or other textures.
[0041] The texture structure 131 can be used in conjunction with the curved surface 510 to determine the light emission range of the infrared device. By changing the curvature of the texture structure 131 and the curved surface 510, the light emission range of the infrared device 400 can be changed. Therefore, the optimal combination between the texture structure 131, the curvature of the curved surface 510, and the light emission range of the infrared device 400 can be determined through optical simulation, so that the infrared device 400 can achieve the required light emission range.
[0042] In this embodiment, the light-transmitting cover 130 is provided with a textured structure 131. The textured structure 131 can concentrate infrared light, and the textured structure 131 cooperates with the curved surface 510, which is beneficial to increase the emission range of infrared light and make the emission range of infrared light wider.
[0043] Of course, in other embodiments, the light-incident surface may not have a texture structure 131, that is, the light-incident surface may be a plane or a curved surface.
[0044] In one alternative embodiment, the light-transmitting cover 130 and the circuit board support 120 can be fixedly connected by non-removable means such as welding or bonding.
[0045] In another embodiment, referring to FIG2, the light-transmitting cover 130 is detachably connected to the circuit board support 120. Optionally, the light-transmitting cover 130 and the circuit board support 120 can be connected by a detachable method such as snap-fit or bolt connection. The embodiments of this application do not limit the detachable connection form of the light-transmitting cover 130 and the circuit board support 120.
[0046] Using this embodiment, the light-transmitting cover 130 can be installed and disassembled as needed. When the light-transmitting cover 130 is damaged, it is convenient to maintain and replace the light-transmitting cover 130 without replacing the overall structure of the light-transmitting cover 130 and the circuit board bracket 120, which helps to reduce costs.
[0047] In another embodiment of this application, referring to Figures 5-8, the device body 100 includes a first circuit board 110, a circuit board support 120, and a package 140. The first circuit board 110 is located on the side of the infrared device 400 facing away from the light-transmitting lens 300. The infrared device 400 is electrically connected to the first circuit board 110, and the first circuit board 110 supplies power to the infrared device 400 to enable it to emit infrared light smoothly. Optionally, the infrared device 400 can be directly soldered to the first circuit board 110 to achieve electrical connection between them.
[0048] The package 140 is located between the infrared device 400 and the light-transmitting lens 300, covering the outside of the infrared device 400. The first circuit board 110 is mounted on the circuit board bracket 120 to fix the position of the first circuit board 110. Optionally, referring to Figure 6, the circuit board bracket 120 has an opening, and the package 140 and the infrared device 400 are located at the opening, so that the circuit board bracket 120 surrounds the package 140. The surface of the circuit board bracket 120 facing away from the light-transmitting lens 300 has a relief groove 121, which communicates with the opening. The first circuit board 110 and the bottom wall of the relief groove 121 can be connected by welding, bonding or other means, so that the first circuit board 110 is mounted on the circuit board bracket 120 and the position of the first circuit board 110 relative to the circuit board bracket 120 is fixed. The package 140 has the arc surface 510 mentioned above. The package 140 serves as a light guide 500. The circuit board support 120 has the annular conical surface 610 mentioned above. The circuit board support 120 includes a depth of field 600, which is used for light blocking.
[0049] Optionally, the infrared device 400 can be packaged as a dual in-line package, with the package 140 made of plastic or ceramic; or, the infrared device 400 can be packaged as a small outline package, a quad flat package, etc.
[0050] In this embodiment, the main body of the device 100 does not need to be separately equipped with a light guide 500 and a depth of field 600. The light guide 500 is formed by using the arc surface 510 of the package 140, and the depth of field 600 is formed by using the annular conical surface 610 of the circuit board bracket 120. This helps to reduce the number of components in the electronic device, realize the miniaturization of the electronic device, and reduce costs.
[0051] In one optional embodiment, the surface of the curved surface 510 facing the light-transmitting lens 300 is coated with a film, and the coating is attached to the curved surface 510. Optionally, the coating can be attached to the curved surface 510 by means of bonding or other methods. The embodiments of this application do not limit the specific type and form of the coating.
[0052] In this embodiment, by adding a coating, the coating has a certain reflective effect, which is beneficial to increasing the reflectivity of the curved surface 510. The reflective effect of the curved surface 510 is better, which is more conducive to improving the lens feel of the curved surface 510 and further improving the appearance performance of the electronic device.
[0053] Of course, in other embodiments, the surface of the curved surface 510 facing the light-transmitting lens 300 may not be provided with a reflective film, and the curved surface 510 may be directly polished to reduce the roughness of the curved surface 510 and make the curved surface 510 brighter to improve the reflection effect.
[0054] In this application, the main body 100 of the device includes a circuit board support 120, a first circuit board 110, a second circuit board 150, and a conductive component 160. The first circuit board 110 is located on the side of the infrared device 400 facing away from the light-transmitting lens 300, and the infrared device 400 is electrically connected to the first circuit board 110, which supplies power to the infrared device 400. Optionally, the infrared device 400 can be directly soldered to the first circuit board 110 to achieve electrical connection. Electronic components are mounted on the surface of the second circuit board 150. The second circuit board 150 is located on the side of the first circuit board 110 facing away from the infrared device 400. In other words, the second circuit board 150 serves as the main circuit board for the electronic device, and other electronic components can be mounted on the second circuit board 150 to supply power to them.
[0055] The first circuit board 110 is mounted on the circuit board bracket 120 to fix its position. Optionally, the first circuit board 110 can be mounted on the circuit board bracket 120 by means of soldering, bonding, etc., to fix its position relative to the circuit board bracket 120. Further optionally, referring to Figures 2 and 6, the surface of the circuit board bracket 120 facing away from the light-transmitting lens 300 is provided with a relief groove 121, and the first circuit board 110 is mounted on the bottom wall of the relief groove 121. Optionally, the second circuit board 150 can be mounted on the circuit board bracket 120. The second circuit board 150 can be mounted on the circuit board bracket 120 by means of soldering, bonding, etc., to fix its position. Of course, the second circuit board 150 can also be mounted on other components other than the circuit board bracket 120 to fix its position relative to the first circuit board 110.
[0056] Furthermore, the conductive element 160 is used to electrically connect the first circuit board 110 and the second circuit board 150. The conductive element 160 is located between the first circuit board 110 and the second circuit board 150, and the first circuit board 110 is electrically connected to the second circuit board 150 through the conductive element 160. That is to say, the second circuit board 150 also supplies power to the first circuit board 110. Optionally, the conductive element 160 is a metallic conductive structure, and the material of the conductive element 160 can be copper, aluminum, etc. The conductive element 160 can be soldered or made in contact with the first circuit board 110, and the conductive element 160 can be soldered or made in contact with the second circuit board 150.
[0057] In this embodiment, in addition to the second circuit board 150 which mainly provides power, the electronic device also includes a first circuit board 110 and a conductive component 160. The first circuit board 110 is closer to the light-transmitting lens 300 than the second circuit board 150, which makes it easier to place the infrared device 400 at a position relatively far away from the second circuit board 150. That is, placing the infrared device 400 on the first circuit board 110 makes it easier for the infrared device 400 to be closer to the light-transmitting lens 300, which is also closer to the second light-transmitting area 320. This facilitates the infrared light emitted by the infrared device 400 to pass smoothly through the light guide 500 and also makes it easier for the light guide 500 to be closer to the second light-transmitting area 320, thereby improving the lens-like appearance of the curved surface 510 and enhancing the overall appearance of the electronic device.
[0058] Of course, in other embodiments, the first circuit board 110 and the second circuit board 150 may be the same circuit board, and the infrared device 400 and other electronic devices of the electronic device are all disposed on the circuit board.
[0059] In an optional embodiment, the conductive element 160 includes a conductive spring. Optionally, one end of the conductive spring contacts the first circuit board 110, and the other end of the conductive spring contacts the second circuit board 150; or, one end of the conductive spring is soldered to the first circuit board 110, and the other end of the conductive spring is soldered to the second circuit board 150. In short, the first circuit board 110 and the second circuit board 150 are electrically connected through the conductive element 160.
[0060] In this embodiment, the conductive spring has elastic properties, so the conductive spring can generate elastic deformation according to the distance between the first circuit board 110 and the second circuit board 150. For different types of electronic devices, the height between the first circuit board 110 and the second circuit board 150 is different, and the conductive spring can adapt to the different heights between the first circuit board 110 and the second circuit board 150, thus having a wider range of applications.
[0061] Of course, in other embodiments, the conductive element 160 may adopt a non-elastic conductive structure, and the conductive element 160 can only connect the first circuit board 110 and the second circuit board 150 with a constant spacing.
[0062] In an optional embodiment, the light-transmitting lens 300 also has a non-light-transmitting area. Referring to Figures 3 and 7, a light-blocking layer 330 is provided on the surface of the light-transmitting lens 300 facing the light-guiding portion 500, and the light-blocking layer 330 is opposite to the non-light-transmitting area. Optionally, all areas of the light-transmitting lens 300 except for the first light-transmitting area 310 and the second light-transmitting area 320 are non-light-transmitting areas, which are adjacent to and surround the first light-transmitting area 310 and the second light-transmitting area 320. The light-blocking layer 330 can be black ink, or other coatings with light-blocking effects.
[0063] In this embodiment, by adding a light-blocking layer 330, infrared light is prevented from passing through areas other than the first light-transmitting area 310 and the second light-transmitting area 320. This facilitates the accurate emission of infrared light from the second light-transmitting area 320, thereby enabling the remote control function of the infrared device 400.
[0064] Of course, in other embodiments, the light-transmitting lens 300 may not have a light-blocking layer 330 on the surface facing the light-guiding part 500, and the portion of the light-transmitting lens 300 other than the first light-transmitting area 310 and the second light-transmitting area 320 may have a light-blocking structure.
[0065] In an optional embodiment, referring to Figures 1 and 5, the device body 100 further includes a decorative ring 170 and a frame 180. The decorative ring 170 is used to decorate the camera module 200, surrounds the camera module 200, and is connected to the light-transmitting lens 300. Optionally, the decorative ring 170 and the light-transmitting lens 300 can be connected by welding, bonding, or other methods. The frame 180 serves as a supporting component for the circuit board bracket 120, which is disposed on the frame 180. Optionally, the circuit board bracket 120 is installed on the frame 180 by welding, bonding, or other methods.
[0066] The electronic devices disclosed in this application can be smartphones, tablets, e-book readers, wearable devices, video game consoles, etc. This application does not limit the specific types of electronic devices.
[0067] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
Claims
1. An electronic device, comprising a device body, a camera module, a light-transmitting lens, and an infrared device, wherein the camera module and the infrared device are both disposed on the device body, the light-transmitting lens is disposed on the surface of the device body, and the light-transmitting lens has a first light-transmitting area and a second light-transmitting area, the camera module being opposite to the first light-transmitting area. The main body of the device includes a light guide section. The infrared device, the light guide section and the second light-transmitting area are arranged in sequence opposite to each other. The infrared light emitted by the infrared device passes through the light guide section and is emitted from the second light-transmitting area. The light guide section is provided with an arc surface, and the arc surface protrudes on the side where the light-transmitting lens is located.
2. The electronic device according to claim 1, wherein, The main body of the device includes a depth-of-field section, which surrounds the light guide section. The minimum distance between the depth-of-field section and the light-transmitting lens is less than the minimum distance between the light guide section and the light-transmitting lens. The depth-of-field section is provided with an annular conical surface. Along the second direction, the size of the annular conical surface increases in the first direction. The first direction is parallel to the plane where the light-transmitting lens is located. The second direction is the direction in which the infrared device, the light guide section, and the light-transmitting lens are arranged.
3. The electronic device according to claim 2, wherein, There is a gap between the depth of field and the light-transmitting lens.
4. The electronic device according to claim 2, wherein, The main body of the device includes a first circuit board, a circuit board bracket, and a light-transmitting cover. The first circuit board is located on the side of the infrared device facing away from the light-transmitting lens, and the infrared device is electrically connected to the first circuit board. The light-transmitting cover is located between the infrared device and the light-transmitting lens. The light-transmitting cover and the first circuit board are respectively mounted on the circuit board bracket. The light-transmitting cover is placed over the infrared device, and the light-transmitting cover includes the light guide portion and the depth-of-field portion.
5. The electronic device according to claim 4, wherein, The surface of the light-transmitting cover near the infrared device has a textured structure.
6. The electronic device according to claim 4, wherein, The light-transmitting cover is detachably connected to the circuit board support.
7. The electronic device according to claim 2, wherein, The main body of the device includes a first circuit board, a circuit board bracket, and a package. The first circuit board is located on the side of the infrared device facing away from the light-transmitting lens, and the infrared device is electrically connected to the first circuit board. The package is located between the infrared device and the light-transmitting lens, and the package covers the outside of the infrared device. The first circuit board is mounted on the circuit board bracket. The packaged component serves as the light guide, and the circuit board bracket includes the depth-of-field portion.
8. The electronic device according to claim 1, wherein, The curved surface facing the light-transmitting lens is coated with a film.
9. The electronic device according to claim 1, wherein, The main body of the device includes a circuit board bracket, a first circuit board, a second circuit board, and conductive components. The first circuit board is located on the side of the infrared device facing away from the light-transmitting lens, and the infrared device is electrically connected to the first circuit board. The second circuit board is located on the side of the first circuit board facing away from the infrared device, and electronic components are provided on the surface of the second circuit board. The first circuit board is mounted on the circuit board bracket. The conductive element is located between the first circuit board and the second circuit board, and the first circuit board is electrically connected to the second circuit board through the conductive element.
10. The electronic device according to claim 1, wherein, The light-transmitting lens also has a non-light-transmitting area. A light-blocking layer is provided on the surface of the light-transmitting lens facing the light guide portion. The light-blocking layer is disposed opposite to the non-light-transmitting area.