Magnetic head assembly, magnetic head module, and magnetic disk

Abstract

A magnetic head assembly, a magnetic head module, and a magnetic disk, which relate to the technical field of magnetic sensing. The magnetic head assembly comprises a first magnetic head, a second magnetic head, and a first capacitor, wherein the first magnetic head and the second magnetic head are located in a first loop and a second loop, respectively; a first electrode and a second electrode of the first capacitor are electrically connected to an input end of the first loop and an input end of the second loop, respectively; alternatively, the first electrode and the second electrode are electrically connected to an output end of the first loop and an output end of the second loop, respectively. Therefore, when the magnetic head assembly is subjected to an electrostatic discharge shock, the first capacitor can be turned on, and the first magnetic head and the second magnetic head are connected in parallel to jointly share the electrostatic discharge shock, thereby preventing the electrostatic protection capability from being limited by the installation space, and providing the magnetic head assembly with a stronger electrostatic protection capability.

Description

Head assembly, head module and disk

[0001] This application claims priority to Chinese Patent Application No. 202510121347.X, filed on January 23, 2025, with the invention title "Magnetic Head Assembly, Magnetic Head Module and Disk", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of magnetic sensing technology, and in particular to a magnetic head assembly, a magnetic head module, and a disk. Background Technology

[0003] A magnetic head is a component that reads data from a magnetic medium using magnetic principles. A single magnetic head typically consists of multiple head units, each capable of reading data. Head units are prone to accumulating a large amount of charge through friction with external sources, creating a high potential at the head unit. When the head unit comes into contact with a low-potential component (such as a clamp or operator), electrostatic discharge occurs due to electrostatic induction, causing damage or even burnout to the head unit and affecting its normal operating performance.

[0004] To achieve electrostatic discharge (ESD) protection for the magnetic head, a capacitor and / or a resistor are typically connected in parallel in the circuit of each head unit. The capacitor provides additional charge storage capacity for the circuit, or the resistor shares the current, reducing the instantaneous stress at the head unit during ESD. However, due to manufacturing limitations, the space available for setting up parallel capacitors and resistors is small, which restricts the ESD protection capability and prevents the achievement of a large ESD protection capacity. Summary of the Invention

[0005] This application provides a magnetic head assembly, a magnetic head module, and a hard disk. By connecting capacitors in parallel at the input and / or output terminals of different magnetic heads, the electrostatic shock is shared by the different magnetic heads in parallel when subjected to electrostatic shock, thereby improving the electrostatic protection capability of the magnetic head assembly and solving the problem that the electrostatic protection capability of the magnetic head assembly is limited by the installation space.

[0006] In a first aspect, this application provides a magnetic head assembly, comprising: a first magnetic head and a second magnetic head, respectively located in a first circuit and a second circuit; a first capacitor, including a first electrode and a second electrode, wherein the first electrode is electrically connected to the input terminal of the first circuit, and the second electrode is electrically connected to the input terminal of the second circuit; or, the first electrode is electrically connected to the output terminal of the first circuit, and the second electrode is electrically connected to the output terminal of the second circuit.

[0007] This application provides a magnetic head assembly comprising a first magnetic head, a second magnetic head, and a first capacitor. The first and second magnetic heads are located in a first circuit and a second circuit, respectively, such that voltage changes in the first and second circuits are independent of each other. The reading and / or recording of data by the first and second magnetic heads are also independent, ensuring the accuracy of reading and / or recording by the first and second magnetic heads. The first and second electrodes of the first capacitor are electrically connected to the input terminals of the first and second circuits, respectively, or to the output terminals of the first and second circuits, respectively. This allows the first capacitor to conduct when the magnetic head assembly is subjected to electrostatic discharge (ESD), enabling the first and second magnetic heads to be connected in parallel and share the ESD impact. The ESD protection capability of the magnetic head assembly provided in this application is related to the number of parallel magnetic heads, avoiding the limitation of space constraints on ESD protection capability, thus providing a stronger ESD protection capability.

[0008] In one possible implementation, the capacitance of the first capacitor is less than or equal to the capacitance corresponding to the cutoff frequency of the first circuit. By making the capacitance of the first capacitor less than or equal to the capacitance corresponding to the cutoff frequency of the first circuit, it is ensured that the first capacitor can conduct when the magnetic head assembly is subjected to electrostatic shock, realizing the parallel connection of the first and second magnetic heads. At the same time, the placement of the first capacitor does not occupy too much space, which is beneficial to the miniaturization of the magnetic head assembly.

[0009] In one possible implementation, the voltage of the first circuit and the voltage of the second circuit are equal. By making the voltage of the first circuit and the voltage of the second circuit equal, reverse current flow in the first or second circuit is avoided when subjected to electrostatic discharge, which helps to ensure the stability of current and voltage in the first and second circuits, thereby ensuring the accuracy of reading and / or recording by the first and second magnetic heads.

[0010] In one possible implementation, the magnetic head assembly further includes a second capacitor, which includes a third electrode and a fourth electrode. The third electrode is electrically connected to the output terminal of the first circuit, and the fourth electrode is electrically connected to the output terminal of the second circuit. By including a second capacitor in the magnetic head assembly, with the third and fourth electrodes of the second capacitor electrically connected to the output terminals of the first and second circuits respectively, both the input and output terminals of the first and second circuits can achieve electrostatic discharge (ESD) protection, which helps ensure the ESD protection effect of the magnetic head assembly. Alternatively, having a large total capacitance between the first and second capacitors can improve their ESD protection capability on the output side.

[0011] In one possible implementation, the capacitance of the first capacitor and the capacitance of the second capacitor are equal. Making the capacitances of the first and second capacitors equal simplifies their arrangement, thereby simplifying the setup process of the magnetic head assembly.

[0012] In one possible implementation, the first magnetic head includes a first electrode layer and a second electrode layer, and the second magnetic head includes a third electrode layer and a fourth electrode layer. The first electrode and the second electrode are electrically connected to the first electrode layer and the fourth electrode layer, respectively, and the third electrode and the fourth electrode are electrically connected to the second electrode layer and the third electrode layer, respectively. By electrically connecting the first electrode and the second electrode to the first electrode layer of the first magnetic head and the fourth electrode layer of the second magnetic head, respectively, and by electrically connecting the third electrode and the fourth electrode to the second electrode layer of the first magnetic head and the third electrode layer of the second magnetic head, it is ensured that the first capacitor is located at the input end of the first circuit and the second circuit, and the second capacitor is located at the output end of the first circuit and the second circuit. This ensures that both the input and output ends of the first circuit and the second circuit can achieve electrostatic discharge (ESD) protection, which is beneficial for ensuring the ESD protection effect of the magnetic head assembly.

[0013] In one possible implementation, the magnetic head assembly includes a substrate, with both the first and second magnetic heads located on the same side of the substrate in a first direction. In this first direction, the second electrode layer is located on the side of the first electrode layer closest to the substrate, and the fourth electrode layer is located on the side of the third electrode layer closest to the substrate. By including the substrate in the magnetic head assembly, with the second electrode layer located on the side of the first electrode layer closest to the substrate and the fourth electrode layer located on the side of the third electrode layer closest to the substrate in the first direction, space is provided for the insulation structure between the first and second electrodes in the first capacitor, and also for the insulation structure between the third and fourth electrodes in the second capacitor, which simplifies the arrangement of the first and second capacitors.

[0014] In one possible implementation, the first electrode layer, the third electrode layer, and the first electrode are all at the same distance relative to the substrate in the first direction, and the second electrode layer, the fourth electrode layer, and the second electrode are all at the same distance relative to the substrate in the first direction. By ensuring that the first electrode layer, the third electrode layer, and the first electrode are at the same distance relative to the substrate in the first direction, and that the second electrode layer, the fourth electrode layer, and the second electrode are at the same distance relative to the substrate, the manufacturing process of the magnetic head assembly is simplified.

[0015] In one possible implementation, the first electrode and the first electrode layer are different parts of a first conductive plate, the second electrode and the fourth electrode layer are different parts of a second conductive plate, and an insulating medium is present between the first electrode and the third electrode layer, and between the second electrode and the second electrode layer. By making the first electrode and the first electrode layer different parts of the first conductive plate, and having an insulating medium between the first electrode and the third electrode layer, and the second electrode and the fourth electrode layer different parts of the second conductive plate, and having an insulating medium between the second electrode and the second electrode layer, it is beneficial to simplify the arrangement of the first electrode and the first electrode layer, and the second electrode and the fourth electrode layer, and to avoid electrical connection between the first electrode and the third electrode layer, and between the second electrode and the second electrode layer.

[0016] In one possible implementation, the first electrode and the third electrode layer are connected by an insulating material; alternatively, the first electrode and the third electrode layer are spaced apart. Connecting the first electrode and the third electrode layer with an insulating material ensures a more stable relative position, preventing them from contacting each other. Spaced-apart arrangement avoids electrical connection between the first and third electrode layers, and the spacing between them provides tolerance for errors in the arrangement of components within the magnetic assembly, thus improving the production yield of the magnetic assembly.

[0017] In one possible implementation, the head assembly further includes a third head and a third capacitor. The third head is located in a third circuit, and the two electrodes of the third capacitor are electrically connected to the input terminals of the second and third circuits, respectively. Alternatively, the two electrodes of the third capacitor are electrically connected to the output terminals of the second and third circuits, respectively. The first, second, and third heads are arranged in a straight line. By including a third head and a third capacitor in the head assembly, the number of heads that can be connected in parallel in the head assembly is increased, which is beneficial to improving the electrostatic discharge protection capability of the head assembly. Arranging the first, second, and third heads in a straight line simplifies the configuration of the data reading structure of the head assembly.

[0018] Secondly, this application also provides a magnetic head module, including a first power supply, a second power supply, and a magnetic head assembly as described in any embodiment of the first aspect. The first power supply and the second power supply respectively supply power to the first circuit and the second circuit of the magnetic head assembly, and the voltage of the first power supply and the voltage of the second power supply are equal. By making the voltage of the first power supply and the voltage of the second power supply in the magnetic head module equal, it avoids the current reversing in the first circuit or the second circuit when the first capacitor is turned on due to electrostatic discharge. This helps to ensure the stability of the current in the first circuit and the second circuit, thereby ensuring the accuracy of reading and / or recording by the first and second magnetic heads.

[0019] Thirdly, this application also provides a disk drive, including a magnetic tape, a motor, and the head module described in the second aspect. The motor is used to drive the magnetic tape through the head module, and both the first and second heads of the head module are used to read and write data on the magnetic tape. The beneficial effects of this embodiment are similar to those of the above embodiments, and will not be repeated here. Attached Figure Description

[0020] Figure 1 is a circuit diagram of a magnetic head assembly including a first capacitor provided in an embodiment of this application;

[0021] Figure 2 is a circuit diagram of a magnetic head assembly including a first capacitor and a second capacitor provided in an embodiment of this application.

[0022] Figure 3 is a circuit diagram of a magnetic head assembly provided in an embodiment of this application, in which both the first capacitor and the second capacitor are located at the output terminal.

[0023] Figure 4 is a schematic diagram of the structure of the magnetic head assembly provided in the embodiment of this application;

[0024] Figure 5 is a cross-sectional view of the head assembly at point AA in the embodiment shown in Figure 4;

[0025] Figure 6 is a cross-sectional view of the head assembly at BB in the embodiment shown in Figure 4;

[0026] Figure 7 is a cross-sectional view of a magnetic head assembly with a magnetic conductive layer provided in an embodiment of this application;

[0027] Figure 8 is a schematic diagram of the structure of a magnetic head assembly with three magnetic heads provided in an embodiment of this application;

[0028] Figure 9 is a schematic diagram of the disk structure provided in the embodiments of this application. Detailed Implementation

[0029] The embodiments of this application are described below with reference to the accompanying drawings.

[0030] For ease of understanding, the English abbreviations and related technical terms used in the embodiments of this application will be explained and described below.

[0031] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0032] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0033] It should be understood that the term "and / or" used in this document is merely a description of the same field in the related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0034] Depending on the context, the word "if" as used herein can be interpreted as "when," "when," "in response to determination," or "in response to detection." Similarly, depending on the context, the phrase "if determination" or "if detection (of the stated condition or event)" can be interpreted as "when determination," "in response to determination," "when detection (of the stated condition or event)," or "in response to detection (of the stated condition or event)."

[0035] It should be understood that the terms "first," "second," etc., used in this application are for distinguishing purposes only and should not be construed as indicating or implying relative importance or order.

[0036] In the description of this application, the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0037] In the description of this application, it should be noted that due to manufacturing or assembly errors, there may be slight angular deviations in the design that should be perpendicular or parallel. For example, a deviation within 15 degrees is also considered perpendicular or parallel as described in this embodiment.

[0038] In this application, the phrase "within a range" implies that both endpoints of the range are included, unless otherwise specified. For example, in the range of 1 to 5, it includes the values ​​1 and 5. In this application, unless otherwise specified, "at least one" means "one or more", and "at least two" means "two or more".

[0039] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, they can be fixed connections, detachable connections, mating connections or integral connections; those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0040] It should be understood that in this application, "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in a circuit structure are connected through physical lines that can transmit signals, such as copper foil or wires on a printed circuit board (PCB). "Connection" and "connected" can both refer to a mechanical or physical connection relationship. For example, A and B being connected or A and B being connected can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.

[0041] A magnetic head is a component that reads and records data on a magnetic medium using magnetic principles. A single magnetic head typically comprises multiple head units, each capable of reading and recording data. Each head unit within a single head is located in a different circuit, and each circuit has its own independent power supply. This ensures that each head unit is electrically connected to a different power source, guaranteeing the accuracy of data reading and recording for each head unit and preventing interference between the electrical signals generated by different head units.

[0042] The magnetic head unit is prone to accumulating a large amount of charge due to friction with the external environment, forming a high potential at the magnetic head unit. When the magnetic head unit comes into contact with a low potential component (such as an operating fixture or operator), an electrostatic discharge phenomenon will occur under the action of electrostatic induction. The discharge current is a large instantaneous current, which can easily damage or even burn out the magnetic head unit, affecting the normal working performance of the magnetic head unit. The failure of a single magnetic head unit in a single magnetic head can also lead to the failure of the entire magnetic head, reducing the product yield.

[0043] To achieve electrostatic discharge (ESD) protection for the magnetic head, a capacitor and / or a resistor are typically connected in parallel in the circuit containing each head unit. The capacitor provides additional charge storage capacity to the circuit, or the resistor shares the current, reducing the instantaneous stress at the head unit during ESD, thus providing ESD protection. Since both the capacitor and resistor are connected in parallel with a single head unit, the ESD protection capability of this method depends on the capacitance of the parallel capacitor or the resistance value of the parallel resistor in the circuit. However, due to limitations in layout design and manufacturing capabilities, the space available for placing parallel capacitors or resistors is limited. The performance of both parallel capacitors and resistors is constrained by the available space, resulting in limited ESD protection capabilities.

[0044] The embodiments of this application are described below with reference to the accompanying drawings.

[0045] This application provides a magnetic head assembly 100. Please refer to Figure 1. Figure 1 shows a circuit diagram of a magnetic head assembly 100 including a first capacitor 30 provided in an embodiment of this application. The magnetic head assembly 100 includes a first magnetic head 10 and a second magnetic head 20. Both the first magnetic head 10 and the second magnetic head 20 are used to read and / or record data on a magnetic medium. The first magnetic head 10 is located in a first circuit, and the second magnetic head 20 is located in a second circuit. Both the first circuit and the second circuit have independent power supplies (VCC, Voltage Current Condenser), so that the voltage changes in the first circuit and the voltage changes in the second circuit are independent of each other. The reading and / or recording of data by the first magnetic head 10 and the second magnetic head 20 are independent of each other, ensuring the accuracy of reading and / or recording by the first magnetic head 10 and the second magnetic head 20.

[0046] Referring to Figure 1, the first magnetic head 10 and the second magnetic head 20 can both be equivalently represented as a capacitor (C) and a resistor (R) connected in parallel. The first magnetic head 10 includes a first magnetic head capacitor 11 and a first magnetic head resistor 12. When the first magnetic head 10 reads data from the magnetic medium, the resistance at the first magnetic head capacitor 11 changes, causing a change in the current at the first magnetic head 10, thereby outputting a corresponding signal. Similarly, the second magnetic head 20 includes a second magnetic head capacitor 21 and a second magnetic head resistor 22. When the second magnetic head 20 reads data from the magnetic medium, the resistance at the second magnetic head capacitor 21 changes, causing a change in the current at the second magnetic head 20, thereby outputting a corresponding signal.

[0047] Please refer to Figure 1. The magnetic head assembly 100 also includes a first capacitor 30, which includes a first electrode 31 and a second electrode 32. The first electrode 31 is electrically connected to the input terminal of the first circuit, and the second electrode 32 is electrically connected to the input terminal of the second circuit; or, the first electrode 31 is electrically connected to the output terminal of the first circuit, and the second electrode 32 is electrically connected to the output terminal of the second circuit.

[0048] When the head assembly 100 is not subjected to electrostatic discharge (ESD), the first capacitor 30 can be considered an open circuit. The first head 10 and the second head 20 are located in independent first and second circuits, respectively, ensuring the accuracy of reading and / or recording by the first head 10 and the second head 20. When the ESD incident on the head assembly 100 is minor, the first capacitor 30 can store the charge generated by static electricity. The first capacitor 30 can also be considered an open circuit. The first head 10 and the second head 20 are located in independent first and second circuits, respectively, ensuring the accuracy of reading and / or recording by the first head 10 and the second head 20. In this case, the ESD protection capability of the head assembly 100 is related to the capacitance of the first capacitor 30; the larger the capacitance of the first capacitor 30, the stronger the ESD protection capability. When the magnetic head assembly 100 is subjected to a large electrostatic shock, the first capacitor 30 is turned on, and the first magnetic head 10 and the second magnetic head 20 are connected in parallel. The first magnetic head 10 and the second magnetic head 20 share the electrostatic shock. At this time, the electrostatic protection capability of the magnetic head assembly 100 is related to the number of magnetic heads connected in parallel. The more magnetic heads connected in parallel, the stronger the electrostatic protection capability.

[0049] Referring to Figure 1, as described above, the first magnetic head 10 and the second magnetic head 20 can both be equivalent to a capacitor and a resistor connected in parallel. When an electrostatic discharge (ESD) causes the first capacitor 30 to conduct, the first magnetic head 10 and the second magnetic head 20 are connected in parallel. This can be considered as the first magnetic head 10 being connected in parallel with the second magnetic head capacitor 21 and the second magnetic head resistor 22. The second magnetic head capacitor 21 and the second magnetic head resistor 22 provide ESD protection for the first magnetic head 10. The ESD protection for the second magnetic head 20 is similar to that for the first magnetic head 10. In practical applications, the magnetic head assembly 100 typically has multiple magnetic heads. When multiple magnetic heads are connected in parallel, it can be considered that one magnetic head is connected in parallel with multiple magnetic head capacitors and magnetic head resistors. This makes the magnetic head assembly 100 provided in this application have stronger ESD protection capabilities compared to a single magnetic head being connected in parallel with a capacitor or resistor alone.

[0050] In one embodiment, the magnetic head assembly 100 includes a plurality of magnetic heads and a first capacitor 30. The number of first capacitors 30 is one less than the number of magnetic heads. The first electrode 31 and the second electrode 32 of a single first capacitor 30 are electrically connected to the input terminals of two different magnetic heads, or the first electrode 31 and the second electrode 32 of a single first capacitor 30 are electrically connected to the output terminals of two different magnetic heads. This allows the multiple magnetic heads to be connected in parallel when the magnetic head assembly 100 is subjected to electrostatic discharge (ESD), ensuring that the magnetic head assembly 100 has strong ESD protection capabilities. Furthermore, since the number of first capacitors 30 is less than the number of magnetic heads, compared to a single magnetic head connected in parallel with a capacitor or resistor, the magnetic head assembly 100 provided in this application requires fewer first capacitors 30, occupying less space, which is beneficial for miniaturizing the magnetic head assembly 100.

[0051] Referring to Figure 1, based on the voltage levels of the first and second circuits, the capacitance of the first capacitor 30 should be of a certain size to prevent it from breaking down when the head assembly 100 is subjected to electrostatic discharge (ESD). The normal operation of the first capacitor 30 ensures the conductivity of the head assembly 100 at the first capacitor 30. That is, when the head assembly 100 is not subjected to ESD, the first and second circuits are independent; when the head assembly 100 is subjected to a significant ESD, the first and second circuits are connected in parallel. This helps ensure the accuracy of reading and / or recording by the first and second heads 10 and 20, and gives the head assembly 100 strong ESD protection capabilities.

[0052] Referring to Figure 1, based on the resistance and cutoff frequency of the first circuit, the capacitance of the first capacitor 30 should be less than a certain value, that is, the capacitance of the first capacitor 30 should be less than or equal to the capacitance corresponding to the cutoff frequency of the first circuit. This ensures that when the head assembly 100 is subjected to electrostatic discharge (ESD), the first capacitor 30 can conduct, enabling the first magnetic head 10 and the second magnetic head 20 to be connected in parallel, thus guaranteeing that the head assembly 100 has strong ESD protection capabilities. When the capacitance of the first capacitor 30 is greater than the capacitance corresponding to the cutoff frequency of the first circuit, the capacitance of the first capacitor 30 is too large, requiring a large amount of space, which is not conducive to the miniaturization of the head assembly 100. Furthermore, the placement of the first capacitor 30 can easily affect the signal output of the first magnetic head 10 and the second magnetic head 20. It is understandable that the maximum capacitance of the first capacitor 30 is also affected by the second circuit. The capacitance of the first capacitor 30 should be less than or equal to the capacitance corresponding to the cutoff frequency of the second circuit, so that the first capacitor 30 can conduct when the magnetic head assembly 100 is subjected to electrostatic shock, thereby realizing the parallel connection of the first magnetic head 10 and the second magnetic head 20.

[0053] Referring to Figure 1, the first electrode 31 and the second electrode 32 of the first capacitor 30 can be electrically connected to the input terminals of the first circuit and the second circuit, respectively. The first power supply 201 supplies power to the first circuit, and the second power supply 202 supplies power to the second circuit, such that the first electrode 31 and the second electrode 32 of the first capacitor 30 are electrically connected to the positive terminals of the first power supply 201 and the second power supply 202, respectively. When the first capacitor 30 is turned on by an electrostatic discharge, the positive terminals of the first power supply 201 and the second power supply 202 are connected through the first capacitor 30. The voltage of the first power supply 201 and the voltage of the second power supply 202 can be equal, so that the potential at the positive terminal of the first power supply 201 and the positive terminal of the second power supply 202 are equal. This avoids the current from flowing backward in the first or second circuit when the first capacitor 30 is turned on, which helps to ensure the stability of the current in the first and second circuits, thereby ensuring the accuracy of reading and / or recording by the first magnetic head 10 and the second magnetic head 20. At the same time, it also makes the voltage of the first circuit equal to the voltage of the second circuit. When the first capacitor 30 is turned on, the voltage across the first magnetic head 10 and the second magnetic head 20 are connected in parallel. The voltage across the first magnetic head 10 and the voltage across the second magnetic head 20 remain unchanged, which helps to ensure the stability of the voltage in the first circuit and the second circuit, thereby ensuring the accuracy of reading and / or recording by the first magnetic head 10 and the second magnetic head 20.

[0054] In one possible implementation, please refer to FIG2, which shows a circuit diagram of a magnetic head assembly 100 including a first capacitor 30 and a second capacitor 40 provided in an embodiment of this application. The magnetic head assembly 100 further includes a second capacitor 40, which includes a third electrode 41 and a fourth electrode 42. The third electrode 41 is electrically connected to the output terminal of the first circuit, and the fourth electrode 42 is electrically connected to the output terminal of the second circuit.

[0055] Please refer to Figure 2. When the first electrode 31 of the first capacitor 30 is electrically connected to the input terminal of the first circuit, and the second electrode 32 of the first capacitor 30 is electrically connected to the input terminal of the second circuit, the first capacitor 30 and the second capacitor 40 are located at the input terminal and output terminal of the first circuit / second circuit, respectively. The first capacitor 30 is used to realize electrostatic protection on the input terminal side of the first circuit and the second circuit, and the second capacitor 40 is used to realize electrostatic protection on the output terminal side of the first circuit and the second circuit, so that both the input terminal and the output terminal of the first circuit and the second circuit can realize electrostatic protection, which is beneficial to ensuring the electrostatic protection effect of the magnetic head assembly 100.

[0056] Please refer to Figure 3, which shows a circuit diagram of a magnetic head assembly 100 in an embodiment of this application where both the first capacitor 30 and the second capacitor 40 are located at the output terminal. When the first electrode 31 of the first capacitor 30 is electrically connected to the output terminal of the first circuit, and the second electrode 32 of the first capacitor 30 is electrically connected to the output terminal of the second circuit, both the first capacitor 30 and the second capacitor 40 are located at the output terminals of the first and second circuits. Both the first capacitor 30 and the second capacitor 40 are used to achieve electrostatic discharge (ESD) protection on the output terminal side of the first and second circuits. The first capacitor 30 and the second capacitor 40 are connected in parallel, so that the first capacitor 30 and the second capacitor 40 have a large total capacitance, which is beneficial to improving the ESD protection capability of the first capacitor 30 and the second capacitor 40 on the output terminal side. It can be understood that the first capacitor 30 and the second capacitor 40 can also be located at the input terminals of the first and second circuits, so that both the first capacitor 30 and the second capacitor 40 are used to achieve ESD protection on the input terminal side of the first and second circuits, thereby improving the ESD protection capability of the first capacitor 30 and the second capacitor 40 on the input terminal side.

[0057] In one embodiment, referring to Figures 2 and 3, the capacitance of the first capacitor 30 and the capacitance of the second capacitor 40 are equal, making the structural configurations of the first capacitor 30 and the second capacitor 40 more similar. This simplifies the configuration of the first capacitor 30 and the second capacitor 40, thereby simplifying the configuration process of the magnetic head assembly 100.

[0058] The circuit configuration of the head assembly 100 has been described above. The structural configuration of the head assembly 100 will be described below.

[0059] In one possible implementation, please refer to FIG4, which shows a schematic diagram of the structure of a magnetic head assembly 100 provided in an embodiment of this application. The magnetic head assembly 100 includes a first magnetic head 10 and a second magnetic head 20. The first magnetic head 10 includes a first electrode layer 13, a first magnetoresistive layer 15, and a second electrode layer 14. The first magnetoresistive layer 15 is located between the first electrode layer 13 and the second electrode layer 14. The second magnetic head 20 includes a third electrode layer 23, a second magnetoresistive layer 25, and a fourth electrode layer 24. The second magnetoresistive layer 25 is located between the third electrode layer 23 and the fourth electrode layer 24. The materials of the first electrode layer 13, the second electrode layer 14, the third electrode layer 23, and the fourth electrode layer 24 can be conductive materials such as metal materials, including but not limited to copper and ruthenium. The materials of the first magnetoresistive layer 15 and the second magnetoresistive layer 25 are insulating media, including but not limited to aluminum oxide and silicon oxide.

[0060] Please refer to Figures 4 and 5. Figure 5 shows a cross-sectional view of the magnetic head assembly 100 at point AA in the embodiment shown in Figure 4. In the first direction (Z direction as shown in Figures 4 and 5), the first electrode layer 13 and at least part of the second electrode layer 14 are disposed opposite to each other. The first electrode layer 13 can be electrically connected to the input terminal of the first circuit, and the second electrode layer 14 can be electrically connected to the output terminal of the first circuit, so that the first electrode layer 13, the first magnetoresistive layer 15 and the second electrode layer 14 form a capacitor, which ensures the realization of the function of the first magnetic head 10, and the first magnetic head 10 forms a circuit and is located in the first circuit.

[0061] Similarly, please refer to Figures 4 and 6. Figure 6 shows a cross-sectional view of the head assembly 100 at BB in the embodiment shown in Figure 4. In the first direction (Z direction as shown in Figure 6), the third electrode layer 23 and at least a portion of the fourth electrode layer 24 are disposed opposite each other. The fourth electrode layer 24 can be electrically connected to the input terminal of the second circuit, and the third electrode layer 23 can be electrically connected to the output terminal of the second circuit. This allows the third electrode layer 23, the second magnetoresistive layer 25, and the fourth electrode layer 24 to form a capacitor, ensuring the realization of the function of the second magnetic head 20. The second magnetic head 20 forms a circuit and is located in the second circuit. The first magnetic head 10 and the second magnetic head 20 are located in the first circuit and the second circuit, respectively, ensuring the accuracy of reading and / or recording by the first magnetic head 10 and the second magnetic head 20.

[0062] Referring to Figures 5 and 6, the first electrode layer 13 and the fourth electrode layer 24 are electrically connected to the input terminals of the first and second circuits, respectively. The first electrode 31 and the second electrode 32 of the first capacitor 30 are electrically connected to the first electrode layer 13 and the fourth electrode layer 24, respectively, so that the first electrode 31 and the second electrode 32 are electrically connected to the input terminals of the first and second circuits, respectively. The first capacitor 30 is located at the input terminals of the first and second circuits. The second electrode layer 14 and the third electrode layer 23 are electrically connected to the output terminals of the first and second circuits, respectively. The third electrode 41 and the fourth electrode 42 of the second capacitor 40 are electrically connected to the second electrode layer 14 and the third electrode layer 23, respectively, so that the third electrode 41 and the fourth electrode 42 are electrically connected to the output terminals of the first and second circuits, respectively. The second capacitor 40 is located at the output terminals of the first and second circuits. Both the input and output terminals of the first and second circuits can achieve electrostatic discharge (ESD) protection, which helps ensure the ESD protection effect of the magnetic head assembly 100.

[0063] The positions of the first electrode 31 and the second electrode 32 of the first capacitor 30 and the third electrode 41 and the fourth electrode 42 of the second capacitor 40 can be set according to actual needs, ensuring that the first capacitor 30 and the second capacitor 40 are electrically connected to the first magnetic head 10 and the second magnetic head 20, respectively. For example, etching or other processes can be used to achieve the electrical connection between the first capacitor 30 or the second capacitor 40 and the first magnetic head 10 and the second magnetic head 20.

[0064] Referring to Figures 4 and 5, the magnetic head assembly 100 may include a substrate 70. The first magnetic head 10 and the second magnetic head 20 may both be located on the same side of the substrate 70 in a first direction (the Z direction as shown in Figures 4 and 5). In this first direction, the second electrode layer 14 is located on the side of the first electrode layer 13 closest to the substrate 70, and the fourth electrode layer 24 is located on the side of the third electrode layer 23 closest to the substrate 70. The first electrode 31 and the second electrode 32 of the first capacitor 30 are electrically connected to the first electrode layer 13 and the fourth electrode layer 24, respectively, such that the distance between the first electrode 31 and the substrate 70 can be similar to the distance between the first electrode layer 13 and the substrate 70, and the distance between the second electrode 32 and the substrate 70 can be similar to the distance between the fourth electrode layer 24 and the substrate 70. In the first direction, the distance between the first electrode layer 13 and the substrate 70 is greater than the distance between the fourth electrode layer 24 and the substrate 70, making the distance between the first electrode 31 and the substrate 70 greater than the distance between the second electrode 32 and the substrate 70. This provides space for the insulation structure between the first electrode 31 and the second electrode 32, simplifying the arrangement of the first capacitor 30.

[0065] Similarly, referring to Figures 4 and 6, the third electrode 41 and the fourth electrode 42 of the second capacitor 40 are electrically connected to the second electrode layer 14 and the third electrode layer 23, respectively, such that the distance of the third electrode 41 relative to the substrate 70 can be similar to the distance of the second electrode layer 14 relative to the substrate 70, and the distance of the fourth electrode 42 relative to the substrate 70 can be similar to the distance of the third electrode layer 23 relative to the substrate 70. In the first direction, the distance of the third electrode layer 23 relative to the substrate 70 is greater than the distance of the second electrode layer 14 relative to the substrate 70, making the distance of the fourth electrode 42 relative to the substrate 70 greater than the distance of the third electrode 41 relative to the substrate 70. This provides space for the installation of an insulating structure between the third electrode 41 and the fourth electrode 42, which helps to simplify the installation of the second capacitor 40.

[0066] In one embodiment, referring to Figures 4, 5, and 6, the substrate 70, the first magnetic head 10, the second magnetic head 20, the first capacitor 30, and the second capacitor 40 are all coplanar with a plane perpendicular to the first direction (the Z direction as shown in Figures 4, 5, and 6). That is, the above structures are all coplanar with the planes containing the second direction (the X direction as shown in Figures 4, 5, and 6) and the third direction (the Y direction as shown in Figure 4). This simplifies the arrangement of the above structures and thus simplifies the manufacturing of the magnetic head assembly 100. At the same time, the structure of the substrate 70, the first magnetic head 10, the second magnetic head 20, the first capacitor 30, and the second capacitor 40 is more regular, which is conducive to the compact arrangement of the above structures and realizes the miniaturization of the magnetic head assembly 100.

[0067] Referring to Figures 5 and 6, in the first direction (the Z direction as shown in Figures 5 and 6), the distances of the first electrode layer 13, the third electrode layer 23, the first electrode 31, and the fourth electrode 42 relative to the substrate 70 can be the same. This allows the first electrode layer 13, the third electrode layer 23, the first electrode 31, and the fourth electrode 42 to be manufactured simultaneously during the production of the magnetic head assembly 100, which simplifies the manufacturing process of the magnetic head assembly 100. Similarly, the distances of the second electrode layer 14, the fourth electrode layer 24, the second electrode 32, and the third electrode 41 relative to the substrate 70 can also be the same, allowing the second electrode layer 14, the fourth electrode layer 24, the second electrode 32, and the third electrode 41 to be manufactured simultaneously, which also simplifies the manufacturing process of the magnetic head assembly 100.

[0068] In one embodiment, referring to FIG5, the first electrode 31 and the first electrode layer 13 can be different parts of the first conductive plate, which simplifies the arrangement of the first electrode 31 and the first electrode layer 13 and ensures the electrical connection between the first electrode 31 and the first electrode layer 13. The structure of the first electrode 31 and the first electrode layer 13 is more compact, which is beneficial to the miniaturization of the magnetic head assembly 100. The first conductive plate can be a plate-shaped structure made of conductive material, including but not limited to a copper plate. The first electrode 31 and the first electrode layer 13 can be two connected parts on the first conductive plate, or the first electrode 31 and the first electrode layer 13 can be two spaced-apart parts on the first conductive plate and electrically connected through the middle part of the first conductive plate.

[0069] Similarly, referring to Figure 6, in this embodiment, the second electrode 32 and the fourth electrode layer 24 can be different parts of the second conductive plate, simplifying the arrangement of the second electrode 32 and the fourth electrode layer 24 while ensuring their electrical connection. The structure of the second electrode 32 and the fourth electrode layer 24 is more compact, which is beneficial for miniaturizing the magnetic head assembly 100. The material and shape of the second conductive plate are similar to those of the first conductive plate. The second electrode 32 and the fourth electrode layer 24 can be two connected parts on the second conductive plate, or they can be two spaced-apart parts on the second conductive plate.

[0070] Referring to Figure 5, the first electrode 31 and the first electrode layer 13 can contact each other, thus electrically connecting them. However, the first electrode 31 and the third electrode layer 23 are not electrically connected, allowing for an insulating medium between them to prevent electrical connection. The insulating medium includes, but is not limited to, air and insulating materials. When the insulating medium is air, the first electrode 31 and the third electrode layer 23 are spaced apart, preventing electrical connection between them. This spacing also provides tolerance for errors in the placement of components within the magnetic assembly, improving production yield. When the insulating medium is an insulating material, the first electrode 31 and the third electrode layer 23 are separated by the insulating material, resulting in a more stable relative position and ensuring they do not contact each other. It is understood that the above-described insulating dielectric structure can be provided between the second electrode 32 and the second electrode layer 14, between the third electrode 41 and the fourth electrode layer 24, and between the fourth electrode 42 and the first electrode layer 13.

[0071] In one embodiment, please refer to FIG7, which shows a cross-sectional view of a magnetic head assembly 100 with a magnetically conductive layer provided in this application. The first magnetoresistive layer 15 includes two first magnetic layers 151 and a single first non-magnetic insulating layer 152. The single first non-magnetic insulating layer 152 is located between the two first magnetic layers 151, so that a magnetic field can be formed between the two first magnetic layers 151, ensuring the realization of the function of the first magnetic head 10. The first magnetic head 10 also includes a portion of a first magnetically conductive layer 16 and a portion of a second magnetically conductive layer 17. The first magnetically conductive layer 16 is located on the side of the first electrode layer 13 away from the second electrode layer 14, and the second magnetically conductive layer 17 is located on the side of the second electrode layer 14 away from the first electrode layer 13, so that the first electrode 31, the first magnetoresistive layer 15 and the second electrode 32 are located between the first magnetically conductive layer 16 and the second magnetically conductive layer 17. The first magnetically conductive layer 16 and the second magnetically conductive layer 17 are used to control the reading direction of the first electrode 31, the first magnetoresistive layer 15 and the second electrode 32, which helps to simplify the data reading of the magnetic head assembly 100.

[0072] Similarly, referring to Figure 7, the second magnetoresistive layer 25 includes two second magnetic layers 251 and a single second non-magnetic insulating layer 252. The single second non-magnetic insulating layer 252 is located between the two second magnetic layers 251, so that a magnetic field can be formed between the two second magnetic layers 251. The third electrode 41, the second magnetoresistive layer 25, and the fourth electrode 42 are located between the first magnetic permeable layer 16 and the second magnetic permeable layer 17, so that the second magnetic head 20 includes another part of the first magnetic permeable layer 16 and another part of the second magnetic permeable layer 17. The first magnetic permeable layer 16 and the second magnetic permeable layer 17 are also used to control the reading direction of the third electrode 41, the second magnetoresistive layer 25, and the fourth electrode 42, which helps to simplify the data reading of the magnetic head assembly 100.

[0073] In one possible implementation, please refer to Figures 1 and 8. Figure 8 shows a schematic diagram of the structure of a magnetic head assembly 100 with three magnetic heads provided in an embodiment of this application. The magnetic head assembly 100 may further include a third magnetic head 50, which is located in a third circuit, such that the first magnetic head 10, the second magnetic head 20 and the third magnetic head 50 are located in different circuits, ensuring that the reading and / or recording of data by the first magnetic head 10, the second magnetic head 20 and the third magnetic head 50 are independent of each other, thereby ensuring the accuracy of the reading and / or recording of data by the first magnetic head 10, the second magnetic head 20 and the third magnetic head 50.

[0074] Referring to Figure 8, the head assembly 100 also includes a third capacitor 60, which includes a fifth electrode and a sixth electrode. The fifth and sixth electrodes are electrically connected to the input terminals of the second and third circuits, respectively, or to the output terminals of the second and third circuits, respectively. This ensures that when the head assembly 100 is subjected to a large electrostatic discharge (ESD), the third head 50 and the second head 20 are connected in parallel. As mentioned above, when the head assembly 100 is subjected to a large ESD, the first head 10 and the second head 20 are connected in parallel. Therefore, connecting the first head 10, the second head 20, and the third head 50 in parallel provides the head assembly 100 with stronger ESD protection capabilities.

[0075] Please refer to Figure 8. The first magnetic head 10, the second magnetic head 20, and the third magnetic head 50 are arranged in a straight line along the second direction (X direction as shown in Figure 8). The second direction is perpendicular to the first direction (Z direction as shown in Figure 8). This allows the magnetic head assembly 100 to have multiple magnetic heads, which are arranged sequentially on the same straight line. This simplifies the setup of the data reading structure of the magnetic head assembly 100.

[0076] This application also provides a magnetic head module 200. Please refer to Figure 1. The magnetic head module 200 includes a first power supply 201, a second power supply 202, and a magnetic head assembly 100 as described in any of the above embodiments. The first power supply 201 and the second power supply 202 supply power to the first circuit and the second circuit of the magnetic head assembly 100, respectively, so that the voltage changes in the first circuit and the voltage changes in the second circuit are independent of each other. The reading and / or recording of data by the first magnetic head 10 and the second magnetic head 20 are independent of each other, ensuring the accuracy of reading and / or recording by the first magnetic head 10 and the second magnetic head 20.

[0077] The voltage of the first power supply 201 is equal to the voltage of the second power supply 202, so that the potential at the positive terminal of the first power supply 201 is equal to the potential at the positive terminal of the second power supply 202. This avoids the current from flowing backward in the first or second circuit when the first capacitor 30 is turned on due to electrostatic discharge. This helps to ensure the stability of the current in the first and second circuits, thereby ensuring the accuracy of reading and / or recording by the first magnetic head 10 and the second magnetic head 20.

[0078] This application also provides a disk 300. Please refer to Figures 1 and 9. Figure 9 shows a schematic diagram of the structure of the disk 300 provided in an embodiment of this application. The disk 300 includes a magnetic tape 301, a motor 302, and a magnetic head module 200 as described in any of the above embodiments. The motor 302 is used to drive the magnetic tape 301 through the magnetic head module 200. The first magnetic head 10 and the second magnetic head 20 of the magnetic head module 200 are both used to read and write data on the magnetic head.

[0079] It is understood that the disk 300 in this embodiment has the head module 200 in the above embodiments. Therefore, the disk 300 in this embodiment has all the technical effects of the head module 200 in the above embodiments. Since the technical effects of the head module 200 have been fully explained in the above embodiments, they will not be repeated here.

[0080] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A magnetic head assembly, characterized in that, include: The first and second magnetic heads are located in the first and second circuits, respectively. The first capacitor includes a first electrode and a second electrode, wherein the first electrode is electrically connected to the input terminal of the first circuit, and the second electrode is electrically connected to the input terminal of the second circuit; or, the first electrode is electrically connected to the output terminal of the first circuit, and the second electrode is electrically connected to the output terminal of the second circuit.

2. The magnetic head assembly according to claim 1, characterized in that, The capacitance of the first capacitor is less than or equal to the capacitance corresponding to the cutoff frequency of the first circuit.

3. The magnetic head assembly according to claim 1 or 2, characterized in that, The voltage of the first circuit is equal to the voltage of the second circuit.

4. The magnetic head assembly according to any one of claims 1 to 3, characterized in that, The magnetic head assembly further includes a second capacitor, which includes a third electrode and a fourth electrode. The third electrode is electrically connected to the output terminal of the first circuit, and the fourth electrode is electrically connected to the output terminal of the second circuit.

5. The magnetic head assembly according to claim 4, characterized in that, The capacitance of the first capacitor is equal to the capacitance of the second capacitor.

6. The magnetic head assembly according to claim 4 or 5, characterized in that, The first magnetic head includes a first electrode layer and a second electrode layer, and the second magnetic head includes a third electrode layer and a fourth electrode layer. The first electrode and the second electrode are electrically connected to the first electrode layer and the fourth electrode layer, respectively, and the third electrode and the fourth electrode are electrically connected to the second electrode layer and the third electrode layer, respectively.

7. The magnetic head assembly according to claim 6, characterized in that, The magnetic head assembly includes a substrate, with the first magnetic head and the second magnetic head both located on the same side of the substrate in a first direction. In the first direction, the second electrode layer is located on the side of the first electrode layer closer to the substrate, and the fourth electrode layer is located on the side of the third electrode layer closer to the substrate.

8. The magnetic head assembly according to claim 7, characterized in that, The first electrode layer, the third electrode layer, and the first electrode are all at the same distance from the substrate in the first direction, and the second electrode layer, the fourth electrode layer, and the second electrode are all at the same distance from the substrate in the first direction.

9. The magnetic head assembly according to claim 8, characterized in that, The first electrode and the first electrode layer are different parts of the first conductive plate, the second electrode and the fourth electrode layer are different parts of the second conductive plate, and there is an insulating medium between the first electrode and the third electrode layer, and between the second electrode and the second electrode layer.

10. The magnetic head assembly according to claim 9, characterized in that, The first electrode and the third electrode layer are connected by an insulating material; or, the first electrode and the third electrode layer are spaced apart.

11. The magnetic head assembly according to any one of claims 1 to 10, characterized in that, The magnetic head assembly further includes a third magnetic head and a third capacitor. The third magnetic head is located in the third circuit. The two electrodes of the third capacitor are electrically connected to the input terminal of the second circuit and the input terminal of the third circuit, respectively. Alternatively, the two electrodes of the third capacitor are electrically connected to the output terminal of the second circuit and the output terminal of the third circuit, respectively. The first magnetic head, the second magnetic head, and the third magnetic head are arranged in a straight line.

12. A magnetic head module, characterized in that, The device includes a first power supply, a second power supply, and a magnetic head assembly as described in any one of claims 1 to 11, wherein the first power supply and the second power supply supply power the first circuit and the second circuit of the magnetic head assembly, respectively, and the voltage of the first power supply and the voltage of the second power supply are equal.

13. A hard disk, characterized in that, The device includes a magnetic tape, a motor, and the magnetic head module as described in claim 12, wherein the motor is used to drive the magnetic tape through the magnetic head module, and the first and second magnetic heads of the magnetic head module are both used to read and write data on the magnetic tape.

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