Chip heat dissipation device in which electrostatic fan is driven on the basis of thermoelectric sheet

Abstract

The present invention belongs to the technical field of chip heat dissipation, and particularly relates to a chip heat dissipation device in which an electrostatic fan is driven on the basis of a thermoelectric sheet, comprising: an electrostatic motor; a housing used for carrying the electrostatic motor and having therein a guide channel for directing an airflow direction; a first heat dissipation member, of which one end is provided with a chip fitting surface for fitting an external chip; and an thermoelectric sheet, of which one end is connected to the end of the first heat dissipation member facing away from the chip fitting surface, and the other end is exposed to the air, wherein the thermoelectric sheet is electrically connected to the electrostatic motor by means of a boost circuit board, and is used for outputting a high-voltage direct current to the electrostatic motor, and the housing is located on an outer side of the first heat dissipation member. The beneficial effects of the present invention are that: the chip heat dissipation device of the present invention has a flexible and variable structural layout and a more flat overall structure, can meet requirements for spaces in electronic devices, has a simple structure and principle, does not require complex components and control circuits, can passively control chip temperature, is energy-efficient, does not consume additional energy, and has higher heat dissipation efficiency.

Description

A chip heat dissipation device based on a thermoelectric element driving an electrostatic fan Technical Field

[0001] This invention relates to the field of chip heat dissipation technology, and in particular to a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan. Background Technology

[0002] Existing heat dissipation methods for electronic device chips include passive heat dissipation technologies (such as graphite heat sinks, heat pipes, thermally conductive metals, thermally conductive adhesives, etc.) and active heat dissipation technologies (such as fans, liquid cooling, VC cooling, etc.). Among them, fan cooling, as an active heat dissipation method, uses the operation of a fan to generate airflow, which removes heat from inside the electronic device, thereby reducing the chip temperature.

[0003] Fan cooling can maintain good heat dissipation, but existing fan cooling structures often use a stacked layout of chips and electromagnetic fans, which often results in a large overall size. Due to the limited thickness design of electronic devices, this fan cooling structure may not be able to fully adapt to space requirements, leading to excessive thickness of electronic devices, affecting appearance and feel. Furthermore, this cooling structure makes the layout and position of the fan relatively fixed. Due to the high coupling between the chip and fan positions, the fan layout cannot be flexibly adjusted, which limits the layout flexibility of other components, especially in space-constrained situations like electronic devices.

[0004] In addition, electromagnetic fans consume a lot of power and require battery power from electronic devices, which further increases the power consumption of electronic devices. At the same time, electromagnetic fans generate a lot of heat in small sizes and enclosed spaces, which leads to a reduction in their heat dissipation efficiency and affects the heat dissipation effect of chips.

[0005] Therefore, there is an urgent need to develop a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan. Summary of the Invention

[0006] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan to solve the above problems.

[0007] The technical solution of this invention is implemented as follows: A chip heat dissipation device based on a thermoelectric element driving an electrostatic fan, comprising:

[0008] electrostatic motor;

[0009] The housing is used to load an electrostatic motor and has an internal flow channel to guide the airflow direction.

[0010] Heat sink 1 has a chip bonding surface at one end for bonding with an external chip;

[0011] The thermoelectric element has one end connected to the end of the heat sink that is away from the chip bonding surface, while the other end is exposed to the air.

[0012] The thermoelectric element is electrically connected to the electrostatic motor via a boost circuit board to output high-voltage DC power to the electrostatic motor, and the housing is located on the outer side of the heat sink.

[0013] Among them, electrostatic motors include:

[0014] The stator component includes a positive electrode and a negative electrode connected to the boost circuit board, and an electrostatic field is formed between the positive and negative electrodes.

[0015] There are multiple positive and negative electrodes, which are distributed crisscrossingly around the circumference of the stator component;

[0016] The rotor assembly, located within the stator assembly, includes a fan assembly and conductive plates;

[0017] The conductive plates of the rotor component can obtain charge from the positive and negative electrodes of the stator component, thereby driving the rotor component to rotate and drive the fan assembly to rotate, disturbing the airflow and causing the airflow to flow along the guide channel to the heat sink.

[0018] Furthermore, the stator components also include:

[0019] The upper support frame is a ring structure;

[0020] The lower support frame is a ring structure;

[0021] The upper support frame and the lower support frame are connected by multiple vertical fins arranged in the circumferential direction. The fins are distributed in the circumferential direction as positive and negative electrodes between the upper support frame and the lower support frame. The positive electrode is electrically connected to the positive electrode of the boost circuit board through the positive electrode connection line, and the negative electrode is electrically connected to the negative electrode of the boost circuit board through the negative electrode connection line.

[0022] The fins form an angle with the upper and lower support frames.

[0023] Furthermore, the rotor assembly also includes:

[0024] A frame assembly that is rotatable and is at least partially located within a stator component;

[0025] Multiple conductive sheets are provided and distributed on the circumferential outer side of the frame assembly, and can pass through the corona regions of the positive and negative electrodes.

[0026] The fan assembly is fixedly connected to the frame assembly.

[0027] Furthermore, the framework components include:

[0028] The outer frame includes outer frame one and outer frame two, both of which are annular, and the conductive sheet is located between outer frame one and outer frame two.

[0029] The inner frame includes inner frame one and inner frame two, both of which are regular polygons.

[0030] The fan assembly includes several guide vanes circumferentially distributed between the outer frame and the inner frame. The guide vanes are fixedly installed on the outer edge of the inner frame, and a support beam is fixedly installed between the outer corner of the inner frame and the inner edge of the outer frame.

[0031] Furthermore, it also includes:

[0032] A brush, located on the positive electrode, negative electrode, and / or conductive plate, is capable of providing a flexible connection between the electrode and the conductive plate.

[0033] Furthermore, the brush is made of silver wire and is located on the electrode, with its cantilever end contacting the conductive sheet radially inward.

[0034] Furthermore, the housing includes:

[0035] The air inlet is located on one side of the upper part of the casing;

[0036] The air outlet is located on the side of the casing facing the heat sink, and a flow channel is formed between the air inlet and the air outlet;

[0037] The lower support frame is installed at the bottom of the housing, and the upper support frame is installed on the air inlet at the top of the housing.

[0038] Furthermore, the boost circuit board is located below and adjacent to the housing.

[0039] Furthermore, the heat sink includes:

[0040] Heat sink one, the chip bonding surface is located on the outer side of heat sink one;

[0041] A plurality of heat-conducting fins are provided and are located on the side of the heat sink that is away from the chip bonding surface. The plurality of heat-conducting fins are distributed at equal intervals.

[0042] The thermoelectric element is installed at the end of the heat-conducting fin that is away from the heat sink.

[0043] The beneficial effects of this invention are as follows:

[0044] The chip heat dissipation device of the present invention has a flexible and variable structural layout, and the overall device is more flat, which can meet the space requirements of small electronic devices. The structure and principle are simple, without the need for complex components and control circuits, and can achieve passive control of chip temperature. It is highly efficient and energy-saving, without consuming additional energy and has higher heat dissipation efficiency. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 is a schematic diagram of the overall structure of the chip heat dissipation device according to a specific embodiment of the present invention;

[0047] Figure 2 is an exploded view of the chip heat dissipation device according to a specific embodiment of the present invention;

[0048] Figure 3 is an exploded view of the rotor component and stator component according to a specific embodiment of the present invention;

[0049] Figure 4 is a schematic diagram of the electrostatic fan according to a specific embodiment of the present invention;

[0050] Figure 5 is a schematic diagram of the electrical module according to a specific embodiment of the present invention;

[0051] Figure 6 is a schematic diagram of the overall structure of the chip heat dissipation device according to a specific embodiment of the present invention. Detailed Implementation

[0052] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0053] In the description of this application, it should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0054] Example 1:

[0055] As shown in Figures 1 to 6, this invention discloses a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan, comprising:

[0056] 100 electrostatic motors;

[0057] The housing 200 is used to load the electrostatic motor 100, and has a flow channel inside to guide the airflow direction.

[0058] The heat sink 300 has a chip bonding surface at one end for bonding with an external chip.

[0059] The thermoelectric element 400 has one end connected to the end of the heat sink 300 that is away from the chip bonding surface, while the other end is exposed to the air.

[0060] The thermoelectric element 400 is electrically connected to the electrostatic motor 100 through the boost circuit board 500 to output high voltage DC power to the electrostatic motor 100. The housing 200 is located on the outside of the heat sink 300.

[0061] The electrostatic motor 100 includes:

[0062] The stator component 110 includes a positive electrode 111 and a negative electrode 112 connected to the boost circuit board 500, and an electrostatic field is formed between the positive electrode 111 and the negative electrode 112.

[0063] There are multiple positive electrodes 111 and multiple negative electrodes 112, which are distributed in a crisscross pattern around the stator component 100.

[0064] Rotor component 120 is located within stator component 110, and rotor component 120 includes fan assembly 121 and conductive sheet 122;

[0065] The conductive sheet 122 of the rotor component 120 can obtain charge from the positive electrode 111 and the negative electrode 112 of the stator component 110, so that the rotor component 120 is driven to rotate by the stator component 110, thereby driving the fan assembly 121 to rotate and disturb the airflow so that the airflow flows along the guide channel to the heat sink 300.

[0066] In this embodiment, the working principle of the electrostatic motor is shown in Figure 4. When a high DC voltage is applied to the positive and negative electrodes respectively, an electrostatic field is formed between the positive and negative electrodes, and a corona region is formed near the positive and negative electrodes (the electric field strength near the electrodes is very high, which can ionize the nearby air to form a corona region, so that the air near the electrodes carries the same charge as the electrode plates). When the conductive plate on the rotor component (which can carry charge in the electric field) passes the positive (or negative) electrode, the conductive plate will carry the same charge as the plate. Thus, a repulsive force is generated between the conductive plate and the electrode (positive electrode), which drives the rotor component to move. At the same time, the rotor carrying the charge will move to the next stage (negative electrode) under the action of the electric field. The charge on the conductive plate is first neutralized and then introduced into the same charge as the negative electrode. Thus, a repulsive force is generated between the conductive plate and the electrode (negative electrode), which drives the rotor component to move. This cycle repeats to form a continuous driving force.

[0067] In the wiring method of this embodiment, the output end of the thermoelectric element is connected to the input end of the boost circuit board. The DC electromotive force generated by the thermoelectric element can reach the voltage range required to drive the electrostatic fan after being amplified by the boost circuit board. The output end of the boost circuit board is connected to the electrostatic motor. The structure and principle are simple and do not require complex components and control circuits.

[0068] In this embodiment, the working principle of the thermoelectric element is as follows: The thermoelectric element generates electricity using the Seebeck effect, which refers to the thermoelectric phenomenon caused by the temperature difference between two different electrical conductors or semiconductors, resulting in a voltage difference between the two substances. The basic principle is that in different metals, the concentration of charge carriers (here, electrons) is different. For the same metal, when the temperatures at both ends are different, the speed of electron movement at both ends is also different. Therefore, the rate at which electrons diffuse from one end to the other end is also different, thus generating a potential difference at both ends of the same metal conductor. A potential difference is also generated for another metal. The two potential differences are different, so there is an additional potential difference in the circuit, which generates current.

[0069] In this embodiment, the thermoelectric element can be other types of thermoelectric materials, and its size and thickness can also be adjusted;

[0070] Heat sink 1 is attached to the chip through the chip connection surface. Most of the heat generated by the chip during operation can be transferred to the heat sink through thermal conduction. One side of the thermoelectric pad is attached to heat sink 1, while the other side is exposed to the air. A large temperature difference can be generated between the two surfaces of the thermoelectric pad during chip operation. Electromotive force is generated under the action of the Seebeck effect under the action of the temperature difference at both ends.

[0071] By adopting the above technical solution, the chip heat dissipation device formed by the cooperation of thermoelectric sheet, heat sink and electrostatic motor, compared with the traditional chip and electromagnetic fan stacked on top of each other, the chip heat dissipation device of the present invention can be more flexible and variable in structural layout, and the overall device is more flat, which can meet the space requirements of electronic equipment. The structural parameters of electrostatic motor, such as size, thickness, number of fan blades, shape, installation angle, etc. can be adjusted according to different installation requirements.

[0072] By connecting to high-voltage direct current, an alternating electric field is formed in the circumference. The charged conductive sheet will be subjected to force and move in the high-voltage electric field, thereby driving the fan assembly to rotate, so as to disturb the airflow and make the airflow flow along the guide channel, and be discharged from the air outlet to the heat sink to remove heat.

[0073] Compared to traditional electromagnetic fans, electrostatic motors have the characteristics of low current (microamp level), low noise, high energy conversion efficiency, high power density, and almost no heat generation. Cooling fans driven by electrostatic motors can be more miniaturized and flattened. Compared to electromagnetic motors, electrostatic motors are more suitable for working at low speeds and have extremely low power consumption. For the same heat sink size, the power consumption is approximately below 0.2W.

[0074] Compared to traditional electromagnetic motors, this embodiment does not require a flat motor to drive the fan assembly to rotate, eliminating the physical obstruction of the motor and allowing airflow to flow more freely, improving the overall efficiency of the fan. At the same time, without the interference of the motor, the fan operates with lower noise.

[0075] The electromotive force generated by the temperature difference between the two ends of the thermoelectric element drives an electrostatic motor to dissipate heat from the chip. Since the power consumption of the electrostatic motor is extremely low, the power consumption is only 10-20mW when the fan diameter is 2cm, which is much lower than that of an electromagnetic fan of the same size. Therefore, the electrical energy generated by the thermoelectric element is sufficient to drive the electrostatic fan. On the one hand, there is no need to consume the energy of the battery. On the other hand, compared with the electromagnetic fan, the size of the required thermoelectric element can be reduced, so that the entire device can be built into an electronic device.

[0076] In addition, the present invention can achieve passive control of chip temperature. The heating power of the thermoelectric element is related to the temperature difference between its two surfaces. Therefore, the chip temperature will affect the power generation of the thermoelectric element. When the chip operating temperature is high, the power generation is increased, and when the chip operating temperature is low, the power generation is low. This adjusts the speed and heat dissipation effect of the electrostatic fan, and ultimately stabilizes the chip temperature within a certain range.

[0077] In summary, the chip heat dissipation device of the present invention has a flexible and variable structural layout, and the overall device is more flat, which can meet the internal space requirements of small electronic devices (such as mobile phones). The structure and principle are simple, without the need for complex components and control circuits, and can achieve passive control of chip temperature. It is highly efficient and energy-saving, does not consume additional energy, and has higher heat dissipation efficiency.

[0078] Example 2:

[0079] This embodiment provides a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0080] Furthermore, the stator component 110 also includes:

[0081] The upper support frame 113 is a ring structure;

[0082] The lower support frame 114 is a ring structure;

[0083] The upper support frame 113 and the lower support frame 114 are connected by a plurality of vertical fins arranged in the circumferential direction. The fins are distributed in the circumferential direction as positive electrode 111 and negative electrode 112, and are intersected between the upper support frame 113 and the lower support frame 114. The positive electrode 111 is electrically connected to the positive electrode of the boost circuit board 500 through a positive electrode connection line, and the negative electrode 112 is electrically connected to the negative electrode of the boost circuit board 500 through a negative electrode connection line.

[0084] The fins form an angle with the upper support frame 113 and the lower support frame 114.

[0085] In this embodiment, the upper support frame and the lower support frame are insulators, and adjacent positive and negative electrodes will not transfer charge because they are fixed to the upper and lower support frames;

[0086] In this embodiment, a cross-shaped frame structure is provided on the radially inner side of both the upper support frame and the lower support frame to ensure the stability of the upper support frame and the lower support frame structure.

[0087] In this embodiment, the fins are made of carbon fiber sheets, which have better structural strength and are lighter.

[0088] In this embodiment, the positive and negative electrodes are obliquely placed carbon fiber plates that are uniformly distributed circumferentially, and are alternately connected to the positive and negative electrodes of high voltage DC, thereby forming a high voltage electric field between the plates.

[0089] By adopting the above technical solution, the conductive sheet carries an electric charge and is forced to move between the electrodes, thereby giving the rotor component torque. The fan assembly, as a component that rotates and disturbs the airflow to make the airflow flow along the guide channel, is set in the electrostatic motor, making it more miniaturized and improving the structural utilization rate. At the same time, the annular frame that fixes the conductive sheet strengthens the structural strength of the entire rotor.

[0090] Example 3:

[0091] This embodiment provides a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0092] Furthermore, the rotor assembly 120 also includes:

[0093] A frame assembly that is rotatable and is at least partially located within the stator component 110;

[0094] Multiple conductive sheets 122 are provided and distributed on the circumferential outer side of the frame assembly, and can pass through the corona regions of the positive electrode 111 and the negative electrode 112.

[0095] Fan assembly 121 is fixedly connected to frame assembly.

[0096] In this embodiment, the conductive sheet is a carbon fiber sheet;

[0097] By adopting the above technical solution, a conductive sheet is used, which can carry more charge. The conductive sheet is a carbon fiber sheet, which is conductive, has very high strength, and is lighter.

[0098] In addition, depending on actual needs, the length of the conductive sheet in the vertical direction can be further increased to obtain a greater electrostatic driving torque.

[0099] Example 4:

[0100] This embodiment provides a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0101] Furthermore, the framework components include:

[0102] The outer frame includes outer frame one 123 and outer frame two 124. Both outer frame one 123 and outer frame two 124 are annular. The conductive sheet 122 is located between outer frame one 123 and outer frame two 124.

[0103] The inner frame includes inner frame one 125 and inner frame two 126, both of which are regular polygons.

[0104] The fan assembly 121 includes several guide vanes circumferentially distributed between the outer frame and the inner frame. The guide vanes are fixedly installed on the outer edge of the inner frame, and a support beam is fixedly installed between the outer corner of the inner frame and the inner edge of the outer frame.

[0105] In this embodiment, the number of air guide blades of the fan assembly can be increased or decreased as needed, and the shape of the fan blades can be other than the shape shown in the accompanying drawings of this application;

[0106] In this embodiment, the inner frame is connected to the cross-shaped frames on its upper and lower sides by bearings and a rotating shaft, allowing the fan assembly to rotate freely.

[0107] By adopting the above technical solution, when the conductive sheet is pushed, the rotor will be moved by electrostatic force and thus rotate the outer frame. Since the inner frame is connected to the inner frame by the support beam, the inner frame can drive the air guide blades to rotate together. In addition, the setting of the support beam between the inner frame and the outer frame makes the rotor assembly more stable and reliable when it moves. When the electronic device with the chip heat dissipation device is subjected to external impact, its internal rotor assembly is not easily affected.

[0108] Example 5:

[0109] This embodiment provides a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0110] Furthermore, it also includes:

[0111] The brush 2000 is located on the positive electrode 111, the negative electrode 112 and / or the conductive sheet 122, and can flexibly connect the electrode to the conductive sheet 122.

[0112] Furthermore, the brush 2000 is made of silver wire and is located on the electrode, with its cantilever end contacting the conductive sheet 122 radially inward.

[0113] By adopting the above technical solution, the magnitude of the electrostatic driving force of the electrostatic motor also depends on the gap between the rotor and the stator. The smaller the gap, the closer the rotor is to the electrode (the closer to the electrode, the stronger the corona field), thus obtaining more charge. To avoid rubbing and to obtain a larger electrostatic driving torque, the gap between the rotor and stator components must be reduced. However, due to the precision issues of processing and assembly, the gap cannot be made very small. By inserting a silver wire brush radially into the electrode, soft contact between the rotor and the electrode is achieved, resulting in a zero gap between the rotor conductive plate and the electrode. Although the use of the brush increases the rotor resistance, the increase in electrostatic force is greater than the increase in resistance, resulting in a larger electrostatic driving torque. This effectively improves the starting performance, operating stability, efficiency and energy consumption, noise and vibration control of the heat dissipation device.

[0114] Example 6:

[0115] This embodiment provides a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0116] Furthermore, the housing 200 includes:

[0117] The air inlet is located on one side of the upper end of the housing 200;

[0118] The air outlet is located on the side of the housing 200 facing the heat sink 300, and a guide channel is formed between the air inlet and the air outlet.

[0119] The lower support frame 114 is installed at the bottom of the housing 200, and the upper support frame 113 is installed on the air inlet at the upper end of the housing 200.

[0120] In this embodiment, the housing can be connected and fixed to the motherboard of the electronic device it is adapted to, or connected and fixed to the outer shell of the electronic device it is adapted to, so that the housing can be fixed on any side of the outer periphery of the heat sink, and the arrangement position can be adjusted and is flexible.

[0121] By adopting the above technical solution, the air guide blades can draw in external air through the air inlet after rotation, and then blow it through the air outlet to the heat sink.

[0122] Example 7:

[0123] This embodiment provides a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0124] Furthermore, the boost circuit board 500 is located below and adjacent to the housing 200.

[0125] By adopting the above technical solution, and through the positioning of the boost circuit board and the housing, the boost circuit board generates some heat during operation. The electrostatic motor can remove some of the heat generated by the boost circuit board to maintain the normal operating temperature of the boost circuit board.

[0126] Example 8:

[0127] This embodiment provides a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0128] Furthermore, the heat sink 300 includes:

[0129] Heat sink one, the chip bonding surface is located on the outer side of heat sink one;

[0130] A plurality of heat-conducting fins are provided and are located on the side of the heat sink away from the chip bonding surface. The plurality of heat-conducting fins are distributed at equal intervals.

[0131] The thermoelectric element 400 is installed at the end of the heat-conducting fin that is away from the heat sink.

[0132] In the above technical solution, the heat sink can be adjusted at different installation angles to change the position of the air inlet end of the heat-conducting fins. For example, when the heat-conducting fins are arranged horizontally as shown in Figure 2, both the left and right ends of the heat-conducting fins can be used as air inlets, and the housing can be placed on the left or right side of the heat sink. When the heat-conducting fins are arranged vertically, the housing can be placed on the front or rear side of the heat sink. In addition to the above two placement positions of the heat sink, the installation angle of the heat sink can be adjusted according to actual needs, and the housing can be installed according to the actual air inlet position. The installation layout is flexible and variable.

[0133] By adopting the above technical solution, the arrangement of the heat-conducting fins allows several air intake channels to be formed between the thermoelectric element and the heat sink. The air blown out through the air outlet of the housing passes through the air intake channels, which can effectively dissipate heat from the chip.

[0134] Example 9

[0135] This embodiment provides a chip heat dissipation device based on a thermoelectric element driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0136] Furthermore, it also includes:

[0137] A heat-conducting plate 600 is sandwiched between a heat-conducting fin and a thermoelectric plate 400. Specifically, the heat-conducting plate 600 is connected to the side of the heat-conducting fin that is away from the heat sink, and together with the heat sink, forms a heat sink 300 with a double bottom structure. The thermoelectric plate 400 is installed on the side of the heat-conducting plate 600 that is away from the heat-conducting fin.

[0138] Heat sink 2 700;

[0139] Among them, heat sink 2700 includes:

[0140] Heat sink 2 is attached to the side of thermoelectric pad 400 that is away from heat conduction pad 600;

[0141] Several heat-conducting fins are provided on the side of the heat sink 2 away from the thermoelectric plate 400, and the several heat-conducting fins 2 are distributed at equal intervals.

[0142] By adopting the above technical solution, the heat sink is added to form a double bottom structure, which can effectively increase the contact area between the thermoelectric element and the heat sink, thereby increasing the heat flow from the chip to one side of the thermoelectric element (i.e., the hot side) and effectively increasing the temperature of the hot side of the thermoelectric element.

[0143] Adding a heat dissipation component to the side of the thermoelectric element exposed to the air (i.e., the cold side) can increase the contact area between the thermoelectric element and the air, thereby improving the heat exchange effect of the thermoelectric element and the air convection, which is beneficial to maintaining the temperature of the cold side of the thermoelectric element.

[0144] By setting up the above structure, the temperature difference between the hot and cold surfaces of the thermoelectric element can be further increased, thereby improving the power generation of the thermoelectric element and making it easier to meet the power requirements of the electrostatic fan, thus maintaining the stable rotation of the fan and the stable operation of the entire negative feedback system.

[0145] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip heat dissipation device based on a thermoelectric element driving an electrostatic fan, characterized in that, include: electrostatic motor (100); The housing (200) is used to load the electrostatic motor (100) and has a flow channel inside to guide the airflow direction; Heat sink 1 (300) has a chip bonding surface at one end for bonding with an external chip; The thermoelectric element (400) has one end connected to the end of the heat sink (300) that is away from the chip bonding surface, and the other end exposed to the air; Among them, the thermoelectric element (400) is electrically connected to the electrostatic motor (100) through the boost circuit board (500) to output high voltage DC power to the electrostatic motor (100), and the housing (200) is located on the outside of the heat sink (300); The electrostatic motor (100) includes: The stator component (110) includes a positive electrode (111) and a negative electrode (112) connected to the boost circuit board (500), and an electrostatic field is formed between the positive electrode (111) and the negative electrode (112). There are multiple positive electrodes (111) and multiple negative electrodes (112), which are distributed crosswise around the stator component (100); The rotor component (120) is located within the stator component (110), and the rotor component (120) includes a fan assembly (121) and a conductive sheet (122). The conductive plate (122) of the rotor component (120) can obtain charge from the positive electrode (111) and negative electrode (112) of the stator component (110), so that the rotor component (120) is driven to rotate by the stator component (110) to drive the fan assembly (121) to rotate and disturb the airflow so that the airflow flows along the guide channel to the heat sink (300).

2. The chip heat dissipation device based on a thermoelectric element-driven electrostatic fan according to claim 1, characterized in that, The stator component (110) also includes: The upper support frame (113) is a ring structure; The lower support frame (114) is a ring structure; The upper support frame (113) and the lower support frame (114) are connected by multiple vertical fins arranged in the circumferential direction. The fins, as positive electrodes (111) and negative electrodes (112), are distributed in the circumferential direction between the upper support frame (113) and the lower support frame (114). The positive electrode (111) is electrically connected to the positive electrode of the boost circuit board (500) through the positive electrode connection line, and the negative electrode (112) is electrically connected to the negative electrode of the boost circuit board (500) through the negative electrode connection line. The fins form an angle with the upper support frame (113) and the lower support frame (114).

3. A chip heat dissipation device based on a thermoelectric element-driven electrostatic fan according to claim 2, characterized in that, The rotor assembly (120) also includes: A frame assembly that is rotatable and at least partially located within the stator component (110); Multiple conductive sheets (122) are provided and distributed on the circumferential outer side of the frame assembly, and can pass through the corona regions of the positive electrode (111) and the negative electrode (112). Fan assembly (121), which is fixedly connected to frame assembly.

4. A chip heat dissipation device based on a thermoelectric element-driven electrostatic fan according to claim 3, characterized in that, The framework components include: The outer frame includes an outer frame one (123) and an outer frame two (124). Both the outer frame one (123) and the outer frame two (124) are annular, and the conductive sheet (122) is located between the outer frame one (123) and the outer frame two (124). The inner frame includes inner frame one (125) and inner frame two (126), both of which are regular polygons; The fan assembly (121) includes several guide vanes distributed circumferentially between the outer frame and the inner frame. The guide vanes are fixedly installed on the outer edge of the inner frame, and a support beam is fixedly installed between the outer corner of the inner frame and the inner edge of the outer frame.

5. A chip heat dissipation device based on a thermoelectric element-driven electrostatic fan according to claim 4, characterized in that, Also includes: A brush (2000) is located on the positive electrode (111), the negative electrode (112) and / or the conductive sheet (122), and is capable of softly connecting the electrode to the conductive sheet (122).

6. A chip heat dissipation device based on a thermoelectric element-driven electrostatic fan according to claim 5, characterized in that, The brush (2000) is made of silver wire and is located on the electrode, with its cantilever end in radial inward contact with the conductive sheet (122).

7. A chip heat dissipation device based on a thermoelectric element-driven electrostatic fan according to claim 1, characterized in that, The housing (200) includes: An air inlet is located on one side of the upper end of the housing (200); An air outlet is located on the side of the housing (200) facing the heat sink (300), and a flow channel is formed between the air inlet and the air outlet; The lower support frame (114) is installed at the bottom of the housing (200), and the upper support frame (113) is installed on the air inlet at the upper end of the housing (200).

8. A chip heat dissipation device based on a thermoelectric element-driven electrostatic fan according to claim 1, characterized in that, The boost circuit board (500) is located below and adjacent to the housing (200).

9. A chip heat dissipation device based on a thermoelectric element-driven electrostatic fan according to claim 1, characterized in that, Heat sink 1 (300) includes: Heat sink one, with the chip bonding surface located on the outer side of heat sink one; A plurality of heat-conducting fins are provided and are located on the side of the heat sink that is away from the chip bonding surface. The plurality of heat-conducting fins are distributed at equal intervals. The thermoelectric element (400) is installed at the end of the heat-conducting fin that is away from the heat sink.

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