Chip dismounting device and consumable cartridge kit

Abstract

A chip dismounting device and a consumable cartridge kit. The chip dismounting device is used for dismounting a chip (21) on a first consumable cartridge (10). The chip dismounting device comprises a fixing base (30) and a dismounting assembly (40). A dismounting channel (31) and a positioning portion (3) for positioning the first consumable cartridge (10) are provided inside the fixing base (30). The dismounting channel (31) intersects the positioning portion (3). The dismounting channel (31) is provided with a communication hole (33). The communication hole (33) is communicated with the positioning portion (3). The dismounting assembly (40) is movably arranged in the dismounting channel (31). The dismounting assembly (40) comprises a dismounting portion (41). At least part of the dismounting portion (41) is arc-shaped. The dismounting portion (41) moves in a first direction, and can be in contact with the first consumable cartridge (10) by means of the communication hole (33), so as to dismount the chip (21). The device solves the technical problem that the chip (21) is prone to damage or cannot be stably dismounted during chip (21) recycling.

Description

A chip removal device and consumable box set

[0001] This application claims priority to Chinese Patent Application No. 202520149361.6, filed on January 21, 2025, entitled "A Chip Removal Device and Consumable Kit Set", the entire contents of which are incorporated herein by reference.

[0002] This application claims priority to Chinese Patent Application No. 202511075651.1, filed on July 31, 2025, entitled "A Chip Removal Device and Consumable Kit Set", the entire contents of which are incorporated herein by reference.

[0003] This application claims priority to Chinese Patent Application No. 202521629689.4, filed on July 31, 2025, entitled "A Chip Removal Device and Consumable Kit Set", the entire contents of which are incorporated herein by reference. Technical Field

[0004] This application relates to the field of printing consumable chip recycling, and more specifically, to a chip removal device and a consumable box set including the chip removal device. Background Technology

[0005] Ink cartridges, detachably installed in the electro-imaging unit, typically contain a chip that stores parameters such as ink level and cartridge model. The electro-imaging unit detects the chip to read the stored information. When the ink in the cartridge is depleted, printing can no longer continue, and a new cartridge needs to be replaced.

[0006] To avoid resource waste, when the ink inside an ink cartridge is depleted, the chip on the old cartridge can be removed and installed in a new cartridge for reuse. Current technology typically involves removing the chip along its edge for recycling; however, this method is unstable and can easily damage the chip, causing breakage or preventing stable removal.

[0007] Therefore, it is urgent to solve the technical problems that chip damage or unstable disassembly can occur during chip recycling. Summary of the Invention

[0008] This application provides a chip removal device and a consumable box kit to solve the technical problem that chip damage or unstable removal is likely to occur during chip recycling.

[0009] To achieve the above objectives, this application provides a chip removal device for removing chips from a first consumable box, the chip removal device comprising:

[0010] A fixing base, wherein the fixing base has a disassembly channel and a positioning part for positioning the first consumable box inside, the disassembly channel and the positioning part are intersecting and arranged, the disassembly channel has a connecting hole, and the connecting hole is connected to the positioning part;

[0011] A disassembly assembly is movably disposed within the disassembly channel. The disassembly assembly includes a disassembly part, at least a portion of which is arc-shaped. The disassembly part moves along a first direction and can contact the first consumable box through the connecting hole to disassemble the chip assembly.

[0012] The chip removal device provided in this application has an arc-shaped removal part, which enhances the strength of the removal part itself. During the chip removal process, it provides a uniform force distribution, reduces the deformation of the removal part, improves the stability of the removal part, and thus improves the accuracy of chip removal position. This solves the problem of chip breakage or failure to cut off caused by unstable removal. In addition, the removal part is configured to move along a first direction to remove the chip, which can reduce the generation of debris during the removal process and prevent debris from sticking to the chip, thus avoiding adverse effects on the secondary use of the chip.

[0013] In one possible implementation, the disassembly assembly further includes a force-applying part, which is movably disposed within the disassembly channel and can drive the disassembly part to move along a first direction.

[0014] In one possible implementation, the disassembly part is movably connected to the force-applying part, and the force-applying part abuts against the top of the disassembly part to drive the disassembly part to move in a first direction.

[0015] In one possible implementation, the disassembly assembly further includes a locking member connected to the force-applying part; the force-applying part is rotatable relative to the locking member; the locking member is movable in a first direction under the influence of the force-applying part; and the disassembly part is sleeved on the locking member.

[0016] In one possible implementation, the locking element includes:

[0017] A connector, wherein the disassembly part is sleeved on the connector, and the connector is connected to the force-applying part through an intermediate part;

[0018] A baffle is connected to the end of the connector away from the force-applying part, and the baffle is disposed away from the first consumable box in a second direction perpendicular to the first direction; and the baffle abuts against the disassembly part.

[0019] In one possible implementation, the disassembly part is fixedly connected to the force-applying part and moves together with the force-applying part.

[0020] In one possible implementation, the connecting hole is located on the sidewall of the disassembly channel to communicate with the positioning part and expose the chip within the disassembly channel;

[0021] The depth direction of the disassembly channel and the length direction of the chip both extend along the first direction.

[0022] In one possible implementation, the fixing base is further provided with a cavity, the connecting hole is provided at the lower end of the cavity, and the disassembly part can pass through the connecting hole to act on the first consumable box to separate the chip from the first consumable box;

[0023] The upper end of the cavity is also provided with a guide hole, and the disassembly channel is defined between the guide hole and the connecting hole.

[0024] In one possible implementation, the force-applying part is threadedly connected to the inner wall of the disassembly channel.

[0025] In one possible implementation, the positioning part includes two positioning cavities, which are arranged side by side and located on opposite sides of the disassembly channel.

[0026] Furthermore, the two positioning cavities have different widths to accommodate the first consumable box of different sizes.

[0027] In one possible implementation, the top of the positioning cavity is tilted downwards along a second direction perpendicular to the first direction, so that the depth to which the first consumable box extends into the disassembly channel gradually decreases along the first direction.

[0028] In one possible implementation, the positioning cavity has an inclined guide on the cavity wall on the side away from the disassembly assembly in a second direction perpendicular to the first direction;

[0029] The first consumable box abuts against the tilting guide portion, so that the chip tilts towards one end of the tilting guide portion along the first direction.

[0030] In one possible implementation, the mounting base includes:

[0031] A fixing body includes a first baffle, a second baffle, and a third baffle. The first baffle and the second baffle are disposed opposite to each other, and the third baffle is connected to the same side of the first baffle and the second baffle. The positioning cavity is formed between the first baffle, the second baffle, and the third baffle.

[0032] A disassembly guide is provided on one side of the first baffle and the second baffle relative to the third baffle, and the disassembly channel is formed within the disassembly guide.

[0033] In one possible implementation, the fixing seat further includes a first limiting part disposed on the side of the disassembly guide facing the positioning cavity, or the first limiting part (36) is disposed on the outer wall surface of the disassembly guide (35); the first limiting part abuts against the first consumable box to limit the position of the first consumable box in the positioning cavity.

[0034] In one possible implementation, the fixing base further includes a second limiting portion disposed on at least one of the first baffle and the second baffle facing the inner wall surface of the positioning cavity, the second limiting portion being configured to abut against one end of the first consumable box so that the position of the chip assembly corresponds to the disassembly channel.

[0035] In one possible implementation, the positioning part includes a mounting cavity and at least one adapter, different adapters having different positioning cavities to adapt to different models of the first consumable box; and the mounting cavity can be adapted to one model of the first consumable box.

[0036] In one possible implementation, at least two positioning ribs are provided on the cavity wall on the side corresponding to the chip in the mounting cavity. The at least two positioning ribs are spaced apart along the first direction and abut against the first consumable box or the adapter.

[0037] In one possible implementation, in a third direction perpendicular to the first direction, a snap-fit ​​is connected to the side of the mounting cavity away from the disassembly channel, the snap-fit ​​abutting against the first consumable box or the adapter to restrict movement of the first consumable box in the third direction.

[0038] This application also provides a consumable box kit, including: a second consumable box; and the aforementioned chip removal device.

[0039] The chip removal device provided in this application embodiment can be adapted to the positioning of first consumable boxes of different sizes, thus being applicable to chip removal from first consumable boxes of various sizes. It can reduce the use of spare parts, reduce costs, and has wider applicability.

[0040] The chip removal device provided in this application embodiment, when the removal part moves along the first direction to remove the chip, realizes that the removal part moves along the length direction of the chip, which helps to prevent the removed debris from contaminating the electrical contact part on the chip surface.

[0041] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the chip disassembly device and consumable box kit provided by the embodiments of this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation. Attached Figure Description

[0042] Figure 1 is a diagram showing the usage status of the chip removal device provided in Embodiment 1 of this application;

[0043] Figure 2 is an exploded view of the chip removal device and the first consumable box provided in Embodiment 1 of this application;

[0044] Figure 3 is an exploded view of the chip disassembly device provided in Embodiment 1 of the application;

[0045] Figure 4 is another exploded view of the chip disassembly device provided in Embodiment 1 of the application;

[0046] Figure 5 is a front view of the chip disassembly device provided in Embodiment 1 of this application;

[0047] Figure 6 is a cross-sectional view of the chip disassembly device and the first consumable box provided in Embodiment 1 of this application at the chip assembly location;

[0048] Figure 7 is a cross-sectional view of the fixing base of the chip removal device provided in Embodiment 1 of this application at the position of the connecting hole;

[0049] Figure 8 is a cross-sectional view of the chip removal device and the first consumable box provided in Embodiment 1 of this application at the position of the first limiting part;

[0050] Figure 9 is an enlarged view of the structure at point A in Figure 8;

[0051] Figure 10 is another cross-sectional view of the chip disassembly device provided in Embodiment 1 of this application;

[0052] Figure 11 is a three-dimensional structural diagram of a first consumable box;

[0053] Figure 12 is a three-dimensional structural diagram of the disassembly section of the chip disassembly device provided in an embodiment of this application;

[0054] Figure 13 is a cross-sectional view of the disassembly section shown in Figure 12;

[0055] Figure 14 is a magnified view of a portion of point C in Figure 13;

[0056] Figure 15 is a three-dimensional structural diagram of another disassembly part of the chip disassembly device provided in the embodiment of this application;

[0057] Figure 16 is a cross-sectional view of the disassembly section shown in Figure 15;

[0058] Figure 17 is a usage diagram of the chip removal device provided in Embodiment 2 of this application;

[0059] Figure 18 is a diagram showing another usage state of the chip removal device provided in Embodiment 2 of this application;

[0060] Figure 19 is a side view of a chip removal device and a first consumable box provided in Embodiment 2 of this application;

[0061] Figure 20 is a cross-sectional view of the chip removal device and the first consumable box in Figure 19 at the chip assembly location;

[0062] Figure 21 is a side view of another chip removal device and a first consumable box provided in Embodiment 2 of this application;

[0063] Figure 22 is a cross-sectional view of the chip removal device and the first consumable box in Figure 21 at the chip assembly location;

[0064] Figure 23 is a side view of the chip disassembly device provided in Embodiment 2 of this application;

[0065] Figure 24 is a front view of the chip disassembly device provided in Embodiment 2 of this application;

[0066] Figure 25 is a cross-sectional view of the chip removal device and the first consumable box at the first limiting part position provided in Embodiment 2 of this application;

[0067] Figure 26 is a cross-sectional view of the chip removal device and the first consumable box at the second limiting part position provided in Embodiment 2 of this application;

[0068] Figure 27 is a cross-sectional view of the fixing body of the chip removal device provided in Embodiment 2 of this application at the removal channel position;

[0069] Figure 28 is an exploded view of the chip removal device and the first consumable box provided in Embodiment 2 of this application;

[0070] Figure 29 is a structural schematic diagram of the locking component provided in Embodiment 2 of this application;

[0071] Figure 30 is a structural schematic diagram of a disassembly component provided in Embodiment 2 of this application;

[0072] Figure 31 is a schematic diagram of the chip removal device provided in Embodiment 3 of this application in one usage state;

[0073] Figure 32 is a schematic diagram of the structure of the first consumable box provided in Embodiment 3 of this application installed in the mounting cavity;

[0074] Figure 33 is a schematic diagram of the chip removal device provided in Embodiment 3 of this application in another usage state;

[0075] Figure 34 is a schematic diagram of the chip removal device provided in Embodiment 3 of this application in another usage state;

[0076] Figure 35 is a cross-sectional view of the chip removal device provided in Embodiment 3 of this application at the removal channel position;

[0077] Figure 36 is a cross-sectional view of the fixing seat provided in Embodiment 3 of this application at the disassembly channel position;

[0078] Figure 37 is a structural schematic diagram of the fixing base provided in Embodiment 3 of this application;

[0079] Figure 38 is a magnified view of part B in Figure 37;

[0080] Figure 39 is a schematic diagram of the adapter provided in Embodiment 3 of this application;

[0081] Figure 40 is a structural schematic diagram of the adapter and the first consumable box provided in Embodiment 3 of this application;

[0082] Figure 41 is a schematic diagram of the chip removal device provided in Embodiment 4 of this application in one usage state;

[0083] Figure 42 is a schematic diagram of the chip disassembly device provided in Embodiment 4 of this application;

[0084] Figure 43 is a schematic diagram of the chip removal device provided in Embodiment 4 of this application in another usage state;

[0085] Figure 44 is a cross-sectional view of the chip disassembly device provided in Embodiment 4 of this application;

[0086] Figure 45 is another cross-sectional view of the chip disassembly device provided in Embodiment 4 of this application.

[0087] Explanation of reference numerals in the attached drawings: 10-First consumable box; 11-Housing shell; 12-Ink outlet; 13-Limited part; 14-Handle; 20-Chip assembly; 21-Chip; 22-Bearing part; 3-Positioning part; 30-Fixing base; 31-Disassembly channel; 32-Positioning cavity; 321-Inclined guide part; 33-Communication hole; 34-Fixing body; 341-First baffle; 3411-Guiding surface; 342-Second baffle; 3421-Contact part; 3422-Recessed part; 343-Third baffle; 344-Cavity; 3441-Guide hole; 345-Guide component; 346-Bottom plate; 347-Top plate; 35-Disassembly guide; 351-First disassembly guide; 352-Second disassembly guide; 353-Third disassembly guide; 3531-First opening; 3532-Second opening; 36-First limiting part; 37-Second limiting part; 38-Mounting cavity; 381-Positioning rib; 382-Snap-fit ​​part; 3821-Connecting section; 3822-Bending section; 383-Accommodating groove; 40-Disassembly assembly; 41-Disassembly part; 411-Blade; 412-Through cavity; 413-Extension section; 42-Force application part; 421-Operating handle; 422-Extension post; 43-Locking part; 431-Connecting part; 4311-Center hole; 4312-Snap-fit ​​part; 432-Stop; 4321-Guide part; 4322-Abutting part; 433-Intermediate part; 44-Fixed component; 45-Elastic component; 50-Adapter; 51-Allow-away part; 52-Opening part; 60-Shielding part. Detailed Implementation

[0088] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0089] The consumable cartridge is an important component of an electronic imaging device. When the electronic imaging device is an inkjet printer, the corresponding consumable cartridge is an ink cartridge that stores ink; when the electronic imaging device is a laser printer, the corresponding consumable cartridge is a toner cartridge that stores toner, etc.

[0090] To store information such as the manufacturer, ink volume, type, and color of the consumable cartridge, a chip is installed on the cartridge. The chip can be fixed to the carrier of the consumable cartridge by pasting, soldering, or other means. The chip is difficult to remove directly. Taking ink cartridges as an example, when the ink inside the ink cartridge is used up and the electronic imaging device cannot print, in order to avoid wasting resources, the chip on the ink cartridge needs to be removed and installed on a new ink cartridge for reuse.

[0091] Chip removal devices are tools used to remove chip assemblies from consumable boxes. Currently, blades are typically used to remove the chip and its supporting structure from the consumable box along the chip's edge. However, this method suffers from poor removal stability, the blade is prone to deformation during removal, affecting the removal effect, and the chip may be scratched or damaged, thus affecting the chip's reusability.

[0092] In view of this, the chip removal device provided in this application, since at least part of the removal part is arc-shaped, can enhance the strength of the removal part itself, provide a uniform force distribution during the chip assembly removal process, reduce the problem of deformation of the removal part, improve the stability of the removal part, thereby improving the accuracy of the chip assembly removal position and solving the problem of chip breakage or inability to cut off caused by unstable removal; in addition, the removal part is configured to move along a first direction to remove the chip, which can reduce the generation of debris during the removal process, prevent debris from sticking to the chip, and prevent adverse effects on the secondary use of the chip.

[0093] The chip removal device and consumable box kit provided in the embodiments of this application are described below with reference to the accompanying drawings.

[0094] It should be noted that, in the following description, referring to Figure 1, the length direction of the ink cartridge is defined as the X-axis, the width direction as the Z-axis, and the height direction as the Y-axis. The X-axis, Y-axis, and Z-axis are perpendicular to each other. Furthermore, the first direction in this application is defined as the Z-axis, the second direction as the Y-axis, and the third direction as the X-axis.

[0095] Referring to Figures 1, 2, 11, 19, 24, 25, 26, 27, and 30, this application provides a chip removal device for removing a chip 21 disposed on a first consumable box 10. The removed chip 21 can exist in the form of a chip assembly 20.

[0096] The chip assembly 20 includes a chip 21 and a carrier portion 22 for carrying the chip 21. The chip assembly 20 is located on the outer wall of the first consumable box 10, wherein the first consumable box 10 includes a housing 11, and the carrier portion 22 can be an integrally formed part of the housing 11, and when the chip removal device removes the chip 21, it is peeled off from the housing 11 of the first consumable box 10 together with the chip 21. Alternatively, the carrier portion 22 can be an independent structure bonded to the outer wall of the housing 11, and the chip assembly 20, consisting of the carrier portion 22 and the chip 21, can be peeled off from the outer wall of the housing 11 together by the chip removal device.

[0097] Referring to Figures 2 and 11, the first consumable box 10 has an ink outlet 12 for the toner or ink stored inside the first consumable box 10 to flow out. The support part 22 and the ink outlet 12 are disposed on the same end face of the first consumable box 10. In this example, the first consumable box 10 is generally cubic in shape. The support part 22 and the ink outlet 12 are disposed on the lower surface of the first consumable box 10, that is, the surface of the first consumable box 10 on the +Y axis side. The front surface of the first consumable box 10 is provided with a handle 14, that is, the surface of the first consumable box 10 on the -X axis side is provided with a handle 14, and the handle 14 extends obliquely along the -Y axis direction.

[0098] The chip 21 can be attached to the side of the carrier 22 facing away from the housing 11 by welding or adhesive, that is, the chip 21 is exposed on the outer wall of the first consumable cartridge 10. The chip 21 can record information such as the ink volume of the first consumable cartridge 10 and the number of times the first consumable cartridge 10 has been used. When the first consumable cartridge 10 is installed in the electronic imaging device, the chip 21 can transmit the information on the chip 21 to the electronic imaging device through electrical connection.

[0099] As shown in Figures 2, 3, 4, 20, 27, 28, 31, 32, and 35, this application provides a chip removal device, including: a fixing base 30 and a removal assembly 40. The fixing base 30 has a removal channel 31 and a positioning part 3 for positioning a first consumable box 10 inside. The removal channel 31 and the positioning part 3 are intersected and arranged. The removal channel 31 has a connecting hole 33, and the connecting hole 33 is connected to the positioning part 3.

[0100] The disassembly assembly 40 is movably disposed within the disassembly channel 31. The disassembly assembly 40 includes a disassembly part 41, at least a portion of which is arc-shaped. The disassembly part 41 moves along a first direction and can contact the first consumable box 10 through the connecting hole 33 to disassemble the chip 21.

[0101] The chip removal device provided in this application has an arc-shaped removal part 41, which enhances the strength of the removal part 41 itself. During the chip removal process, it provides a uniform force distribution, reduces the deformation of the removal part 41, improves the stability of the removal part 41, and improves the accuracy of the chip removal position. This solves the problem of chip breakage or failure to cut off caused by unstable removal.

[0102] Furthermore, the disassembly section 41 moves along the first direction to disassemble the chip 21, which can reduce the generation of debris during the disassembly process, prevent debris from sticking to the chip 21 during the disassembly process, and will not have an adverse effect on the secondary use of the chip.

[0103] In this example, the first direction refers to the direction indicated by the -Z axis in Figure 2.

[0104] In one possible implementation, the projection of the disassembly part 41 along the first direction is in the shape of an arc or an annulus. This is beneficial to improving the structural strength of the disassembly part 41 itself, reducing the deformation of the disassembly part 41 during the disassembly of the chip 21, improving the stability of the structure of the disassembly part 41, ensuring the disassembly accuracy, and preventing damage to the chip 21.

[0105] The chip removal device provided in this application accurately positions the first consumable box 10 through the positioning part 3, so as to ensure that the chip 21 is within the coverage of the cutting trajectory formed by the removal part 41 moving along the first direction in the removal channel 31. This is crucial to ensuring the accuracy and safety of the removal process.

[0106] It should be noted that when the projection of the disassembly part 41 along the first direction is annular, the area that the chip 21 can be covered by the cutting trajectory formed by the movement of the disassembly part 41 along the first direction means that the projection of the chip 21 in the first direction is located inside the annulus.

[0107] When the projection of the disassembly part 41 along the first direction is arc-shaped, the area that the chip 21 can be covered by the cutting trajectory formed by the movement of the disassembly part 41 along the first direction means that the projection of the chip 21 in the first direction is located within the closed space formed after connecting the two ends of the arc.

[0108] It is understandable that the projection of chip 21 in the first direction does not intersect with the projection of disassembly part 41 in the first direction, so as to avoid accidental contact with chip and damage to it when disassembly part 41 moves in the first direction.

[0109] In one possible implementation, referring to Figures 2 and 5, the positioning part 3 includes two positioning cavities 32, which are located on opposite sides of the disassembly channel 31. This allows the two positioning cavities 32 to share the same disassembly channel 31, improving the space utilization of the chip disassembly device. The two positioning cavities 32 can be disposed inside the mounting base 30.

[0110] The widths of the two positioning cavities 32 are H1 and H2, respectively, where H1 ≥ H2. The cavity widths of the two positioning cavities 32 can be different. Along the first direction, i.e., along the Z-axis, the distance between the inner walls of the two positioning cavities 32 is different.

[0111] This is also to take into account that in some electronic imaging devices, the color ink cartridges and the black ink cartridges are different in size. Usually, the black ink cartridges are wider than the color ink cartridges. In order to facilitate the positioning of ink cartridges of different sizes and realize the chip recycling, the positioning cavity 32 in the chip disassembly device provided in this application embodiment has two different widths, so that the first consumable box 10 of two different sizes can be effectively positioned, and the chips 21 of the first consumable box 10 of two different sizes can be disassembled, thereby improving the versatility of the chip disassembly device.

[0112] In another possible implementation, the positioning unit 3 may consist of only a positioning cavity 32, which positions the first consumable box 10. The positioning cavity 32 intersects with the disassembly channel 31 and is connected to the disassembly channel 31 via a connecting hole 33. The connecting hole 33 exposes the chip 21 within the disassembly channel 31, allowing the disassembly unit 41 to disassemble the chip from the first consumable box 10. This further miniaturizes the chip disassembly device, making it easier to carry and store.

[0113] The following description, using the positioning part 3, which includes two positioning cavities 32, as an example, further illustrates the specific structure of the chip disassembly device.

[0114] In one possible implementation, referring to Figures 6, 7, 20, and 27, the connecting hole 33 is located on the side wall of the disassembly channel 31, and the disassembly channel 31 is connected to the positioning part 3 through the connecting hole 33. Correspondingly, both positioning cavities 32 can be connected to the disassembly channel 31 through the connecting hole 33; the depth direction of the disassembly channel 31 and the length direction of the chip 21 are both along the first direction.

[0115] When the disassembly section 41 moves along the first direction to disassemble the chip assembly 20, the disassembly section 41 moves along the length direction of the chip 21, which helps to prevent the debris from being disassembled from contaminating the electrical contacts on the chip surface.

[0116] The connecting hole 33 needs to provide sufficient space and angle to expose the chip 21 within the disassembly channel 31 without affecting the overall structural strength of the mounting base 30. By placing the connecting hole 33 on the side wall of the disassembly channel 31, the chip 21 can be accurately exposed within the disassembly channel 31 in the positioning cavity 32, facilitating the operation of the disassembly assembly 40.

[0117] In one possible implementation, referring to Figures 2, 3 and 4, the fixing base 30 includes a fixing body 34 and a disassembly guide 35. The fixing body 34 includes a first baffle 341, a second baffle 342 and a third baffle 343. The first baffle 341 and the second baffle 342 are disposed opposite to each other, and the third baffle 343 is connected to the same side of the first baffle 341 and the second baffle 342. The positioning cavity 32 is formed between the first baffle 341, the second baffle 342 and the third baffle 343.

[0118] The disassembly guide 35 is disposed on the side of the first baffle 341 and the second baffle 342 opposite to the third baffle 343, and the disassembly channel 31 is formed in the disassembly guide 35.

[0119] The disassembly guide 35 guides the movement of the disassembly assembly 40, enabling the disassembly assembly 40 to move along a preset trajectory. This effectively prevents the movement of the disassembly assembly 40 from deviating, thereby avoiding damage to the chip 21 caused by the disassembly part 41.

[0120] In one possible implementation, the first baffle 341, the second baffle 342, and the third baffle 343 are connected as an integral structure.

[0121] In one possible implementation, the first baffle 341, the second baffle 342, and the third baffle 343 are respectively used to abut against the outer wall surfaces of three different sides of the first consumable box 10, thereby improving the accuracy of positioning the first consumable box 10. The first baffle 341 and the second baffle 342 are connected to the two ends of the third baffle 343, such that the inner wall surfaces of the first baffle 341 and the second baffle 342 are approximately parallel.

[0122] In one possible implementation, referring to Figures 2, 8 and 9, the fixing base 30 further includes a first limiting part 36, which is disposed on the side of the disassembly guide 35 facing the positioning cavity 32. The first limiting part 36 abuts against the first consumable box 10 to limit the position of the first consumable box 10 within the positioning cavity 32.

[0123] In one possible implementation, the first limiting portion 36 may be a boss protruding from the disassembly guide portion 35 or a recessed portion in the disassembly guide portion 35.

[0124] In one possible implementation, referring to Figures 2, 9, and 11, the lower surface of the first consumable box 10 has a limiting portion 13, which may be a protrusion extending beyond the lower surface of the first consumable box 10. When the first consumable box 10 is positioned within the positioning cavity 32, one end of the limiting portion 13 along the X-axis abuts against the first limiting portion 36, restricting the position of the first consumable box 10 within the positioning cavity 32, i.e., restricting the movement of the first consumable box 10 along the X-axis. At this time, the chip assembly 20 is aligned with the connecting hole 33, facilitating the correct and stable disassembly of the chip assembly 20 by the disassembly portion 41.

[0125] In another possible implementation, the lower surface of the first consumable box 10 has a limiting portion 13. When the first consumable box 10 is positioned in the positioning cavity 32, one end of the limiting portion 13 along the X-axis direction abuts against the first limiting portion 36, restricting the movement of the first consumable box 10 along the X-axis direction and ensuring that the chip assembly 20 is aligned with the connecting hole 33. At the same time, the lower surface of the first consumable box 10 abuts against the first limiting portion 36, restricting the movement of the first consumable box 10 along the Y-axis direction. This achieves the limiting effect on the first consumable box 10 along the X-axis and Y-axis directions, thereby improving the accuracy of the position of the first consumable box 10 in the positioning cavity 32 and facilitating the disassembly portion 41 to correctly and stably disassemble the chip assembly 20.

[0126] In one possible implementation, the first limiting part 36 may also abut against the upper and lower surfaces of the first consumable box 10 respectively with the third baffle 343, limiting the movement of the first consumable box 10 along the Y-axis direction. This can effectively prevent the consumable box from moving during disassembly, thereby improving the stability and accuracy of the disassembly operation and helping to prevent damage to the chip assembly 20.

[0127] In some possible implementations, the first limiting part 36 may only abut against the limited part 13 to restrict the movement of the first consumable box 10 in the X-axis direction, and the movement of the first consumable box 10 in the Y-axis direction may be limited by the third baffle 343, or by the side wall of the disassembly guide 35 facing the positioning cavity, that is, it may be the side wall adjacent to the connecting hole 33, or it may be other positions.

[0128] In one possible implementation, referring to Figures 3 and 10, the fixing base 30 further includes a second limiting part 37 disposed on at least one of the first baffle 341 and the second baffle 342 facing the inner wall surface of the positioning cavity 32. The second limiting part 37 is configured to abut against the front surface of the first consumable box 10 to restrict the movement of the first consumable box 10 in the X-axis direction so that the position of the chip assembly 20 corresponds to the disassembly channel 31.

[0129] In one possible implementation, the second limiting part 37 is located at the connection position of the two positioning cavities 32. When the wider first consumable box 10 is installed into the positioning cavity 32, in addition to being abutted by the limiting part 13 and the first limiting part 36, the front surface of the first consumable box 10 also abuts against the second limiting part 37, thus more stably positioning the first consumable box 10 in the fixed body 34.

[0130] In one possible implementation, the second limiting part 37 can be a protruding ridge or a stepped surface. The second limiting part 37 can be located on the inner wall surface of the first baffle 341 facing the positioning cavity 32, or on the inner wall surface of the second baffle 342 facing the positioning cavity 32, or the second limiting part 37 can be provided on both the inner wall surfaces of the first baffle 341 and the second baffle 342 facing the positioning cavity 32.

[0131] In one possible implementation, both ends of the mounting base 30 are open along the X-axis, which facilitates the installation and positioning of the first consumable box 10 into the positioning cavity 32 along the X-axis.

[0132] It is easy to understand that by having the first baffle 341 and the second baffle 342 of the fixing seat 30 abut against the opposite side walls of the first consumable box 10 along the Z-axis, the movement of the first consumable box 10 along the Z-axis can be restricted; by having the disassembly guide 35 and the third baffle 343 block the first consumable box 10, the movement of the first consumable box 10 along the Y-axis can be restricted; by having the first limiting part 36 and / or the second limiting part 37 abut against one end of the first consumable box 10 along the X-axis, the movement of the first consumable box 10 along the X-axis can be restricted, thereby effectively fixing the position of the first consumable box 10 in the positioning cavity 32, improving the stability of the first consumable box 10 during chip disassembly, helping to improve the accuracy of the chip assembly 20 disassembly position, and preventing chip 21 from being damaged or unable to be cut off when the disassembly position deviates.

[0133] In one possible implementation, referring to Figures 2 and 3, the disassembly assembly 40 further includes a force-applying part 42, which is movably disposed within the disassembly channel 31. The force-applying part 42 can drive the disassembly part 41 to move in a first direction so that the disassembly part 41 removes the chip 21 from the first consumable box 10.

[0134] For example, the disassembly part 41 and the force-applying part 42 are movably connected, and the force-applying part 42 can abut against the top of the disassembly part 41. For instance, the disassembly part 41 can be sleeved on the bottom end of the force-applying part 42, and the force-applying part 42 has a stepped surface on the side near the bottom end of the force-applying part 42, and the upper end surface of the disassembly part 41 can abut against the stepped surface of the force-applying part 42. In this way, when the force-applying part 42 moves in the first direction, the force can be transmitted to the disassembly part 41 to drive the disassembly part 41 to move in the first direction, thereby disassembling the chip 21. At the same time, the step surface can also be used to stop the movement of the disassembly part 41 in the Z-axis direction.

[0135] In one possible implementation, the force-applying part 42 extends to the outside of the disassembly channel 31 at one end relative to the disassembly part 41 and is connected to an operating handle 421.

[0136] The force-applying part 42 is used to receive external force to drive the disassembly part 41 to move, so that the disassembly part 41 moves within the disassembly channel 31 to disassemble the chip 21 and the carrier part 22. In this embodiment, the chip disassembly device drives the disassembly part 41 to move along the first direction, i.e., the -Z axis, within the disassembly channel 31 via the force-applying part 42, thereby disassembling the chip 21 and the carrier part 22 on the ink cartridge. Its structure is simple and easy to operate, solving the problem of difficult operation during chip 21 disassembly in the prior art, and greatly improving the reusability of the chip 21.

[0137] In one possible implementation, the operating handle 421 may be, for example, an operating handle. By operating the operating handle 421, an appropriate force can be applied to the force-applying part 42, causing the disassembly part 41 to move along the first direction, i.e., the -Z axis direction, to disassemble the chip assembly 20. The operating handle may be in the shape of an "I" or a "+", etc., to facilitate the user to rotate and press the operating handle to apply external force to the force-applying part 42, so that the force-applying part 42 transmits force to the disassembly part 41.

[0138] In one possible implementation, the operating handle 421 can also be other structures that facilitate the movement of the electrically driven force application part 42, which can improve the operating efficiency and safety of the chip removal device.

[0139] In one possible implementation, referring to FIG3, the force-applying part 42 has an extension post 422 at one end near the disassembly part 41. The extension post 422 has a small diameter and can extend into the cavity enclosed inside the disassembly part 41, which helps to prevent the disassembly part 41 from tilting or other problems, and ensures the effectiveness of disassembling the chip assembly 20.

[0140] In one possible implementation, the disassembly part 41 is cylindrical and has a through cavity 412 extending through it along the Z-axis. The disassembly part 41 has no seams around its perimeter and features high strength and minimal deformation. One end of the disassembly part 41 facing the first consumable box 10 has a blade 411. This blade 411 facilitates the disassembly part 41's access to the connection point between the support part 22 and the housing 11 of the first consumable box 10, thereby disassembling the connection. The cylindrical shape of the disassembly part 41 provides better force distribution and operational stability.

[0141] In one possible implementation, the blade 411 is circular and is used to achieve the connection position between the disassembly support 22 and the housing 11 of the first consumable box 10, so as to remove the chip assembly 20 from the first consumable box 10.

[0142] In one possible implementation, the disassembly part 41 includes a disassembly body, with a blade 411 connected to one end of the disassembly body facing the first consumable box 10. The blade 411 and the disassembly body can be integrally formed or separately provided.

[0143] In one possible implementation, referring to Figures 12 and 13, both the inner and outer walls of the blade 411 are inclined guide surfaces. That is, along the -Z axis direction, the inner wall of the blade 411 gradually slopes towards the outer wall of the blade 411, and the outer wall of the blade 411 gradually slopes towards the inner wall of the blade 411, so that the thickness of the blade 411 gradually decreases along the -Z axis direction. The end of the blade 411 facing the first consumable box 10 is the thinnest position, which facilitates the blade 411 entering the connection position between the support part 22 and the housing 11 of the first consumable box 10 to realize the disassembly of the chip assembly 20.

[0144] Referring to Figures 13 and 14, the disassembly body includes an extension section 413, which is connected to the cutting edge 411. The wall thickness of the extension section 413 is d. The angle between the projection of the outer side of the cutting edge 411 onto the ZOY plane and the extension line of the projection of the outer side wall of the extension section 413 onto the ZOY plane is θ1. The angle between the projection of the inner side of the cutting edge 411 onto the ZOY plane and the extension line of the projection of the inner side wall of the extension section 413 onto the ZOY plane is θ2. The distance from the tip of the cutting edge 411 to the outer wall of the extension section 413 is h.

[0145] In one implementation, the ratio of h to d can be less than or equal to 0.5. For example, the ratio of h to d can be a range of 0.45, 0.4, 0.35, 0.3, 0.25, 0.2, 0.15, 0.1, or any two of these ranges.

[0146] This enhances the strength of the disassembly part 41, reducing its deformation. Simultaneously, disassembly is easier during the disassembly process, and regardless of changes in the disassembly trajectory or the pressure applied to the disassembly part, the disassembly part 41 can be smoothly withdrawn.

[0147] Understandably, θ1 can be equal to θ2 or θ1 can be less than θ2. When θ1 is less than θ2, the slope of the outer side of the cutting edge 411 is greater, providing a wider chip removal channel, reducing the frictional resistance between the chips and the outer side of the cutting edge 411, and preventing chip accumulation or entanglement. Furthermore, it maintains sufficient cutting edge strength while guiding the chips to curl towards the center, facilitating chip breaking.

[0148] In one possible implementation, as shown in Figures 15 and 16, only the inner wall surface of the cutting edge 411 forms an inclined guiding surface, while the outer wall surface of the cutting edge 411 is a vertical surface. That is, along the -Z axis direction, the inner wall of the cutting edge 411 gradually slopes towards the outer wall of the cutting edge 411, and the outer wall of the cutting edge 411 does not slope towards the inner wall of the cutting edge 411. This structure makes the operation of the cutting edge 411 more stable.

[0149] In one possible implementation, the blade 411 can be in the form of a ring, a semi-ring, an arc, or a plane.

[0150] In one possible implementation, the force-applying part 42 is connected to the inner wall of the disassembly channel 31 by a thread.

[0151] In one possible implementation, referring to Figures 2 and 3, the outer wall surface of the force-applying part 42 is provided with an external thread, and the inner wall surface of the disassembly channel 31 is provided with an internal thread. The threaded connection is achieved by the cooperation of the external thread and the internal thread, which has the effect of precisely adjusting the position of the force-applying part 42 in the disassembly channel 31, thereby facilitating the control of the force applied to the disassembly part 41.

[0152] In one possible implementation, the force-applying part 42 is slidably disposed within the disassembly channel 31, which guides the movement of the force-applying part 42 and prevents it from deviating during movement.

[0153] The chip removal device provided in this application, by setting a fixed body 34 for positioning the first consumable box 10 of different sizes, can reduce the use of spare parts and reduce costs.

[0154] The chip removal device provided in this application allows the carrier and the chip installed on the carrier to be detached together from the first consumable box 10, which facilitates the recycling and reuse of the chip and avoids the waste of chip resources.

[0155] Example 2:

[0156] Based on the above embodiments, this application also provides another specific implementation of the chip removal device. The main difference between this embodiment and the above embodiments is that the chip removal device in this embodiment can tilt the first consumable box 10 in the positioning part 3, so that the removal part 41 can tilt and remove the chip 21 or the chip 21 and the supporting part 22 together from the first consumable box 10. Furthermore, in this embodiment, the removal component 40 has a different structure.

[0157] The following describes this embodiment in further detail with reference to Figures 17 to 30.

[0158] Referring to Figures 17 and 18, the positioning part 3 of this embodiment also includes two positioning cavities 32. The two positioning cavities 32 are disposed in the fixing base 30, and the two positioning cavities 32 are arranged side by side on opposite sides of the disassembly channel 31.

[0159] The two positioning cavities 32 have different cavity widths to accommodate the removal of the chip 21 on the first consumable cartridge 10 of different sizes. For example, the chip 21 on the color cartridge and the chip 21 on the black cartridge can be removed separately through the two positioning cavities 32.

[0160] It should be noted that in Figures 20 and 22, the chip removal device and the first consumable box 10 are rotated 90° clockwise for observation.

[0161] As one implementation, as shown in Figures 19 and 20, along a second direction perpendicular to the first direction, i.e., the height direction of the ink cartridge, and referring to the +Y axis direction in Figures 19-20, the top of the positioning cavity 32 is inclined downwards, so that the first consumable cartridge 10 extends obliquely into the disassembly channel 31, and the plane where the chip 21 is located intersects the plane where the side wall of the disassembly part 41 is located. That is to say, at this time, the disassembly part 41 does not cut vertically into the first consumable cartridge 10. This arrangement allows for a smoother transition of cutting force, a smoother cut surface, and can disperse impact loads, resulting in more uniform wear of the cutting edge and extending the service life of the disassembly part 41.

[0162] Furthermore, the depth to which the first consumable box 10 extends into the disassembly channel 31 can gradually decrease along the first direction.

[0163] In this way, the chip 21 on the first consumable box 10 can be tilted and placed in the disassembly channel 31. At this time, along the first direction (the -Z axis direction in the figure), the depth of the first consumable box 10 extending into the disassembly channel 31 gradually decreases.

[0164] Since the disassembly part 41 is movably disposed within the disassembly channel 31, when the disassembly part 41 moves along the first direction, the position where the disassembly part 41 first contacts the first consumable box 10 is far away from the chip 21. Furthermore, as the disassembly part 41 continues to move downward along the first direction, the contact position between the disassembly part 41 and the first consumable box 10 gradually moves closer to the chip 21, but does not come into contact with the chip 21 or the chip assembly 20. This avoids the disassembly part 41 accidentally touching the chip 21 and causing damage to the chip 21 when it moves downward, and also makes the disassembly process more labor-saving.

[0165] Understandably, the thickness of the chip assembly 20 after being cut by the disassembly section 41 gradually decreases along the first direction.

[0166] In one possible implementation, the bottom of the positioning cavity 32 can be configured as a horizontal surface or an inclined surface, which can be adapted to the shape of the first consumable box 10, and is not limited here.

[0167] As another implementation, as shown in Figures 21 and 22, along the second direction perpendicular to the first direction, i.e. the height direction of the ink cartridge, referring to the +Y axis direction in Figures 21-22, the bottom of the positioning cavity 32 can be tilted upward so that the first consumable box 10 is tilted into the disassembly channel 31, and the plane where the chip 21 is located intersects with the plane where the side wall of the disassembly part 41 is located.

[0168] Furthermore, the depth to which the first consumable box 10 extends into the disassembly channel 31 can gradually increase along the first direction.

[0169] Similar to the above embodiments, this arrangement also allows the chip 21 on the first consumable box 10 to be tilted in the disassembly channel 31. The technical effects of this arrangement will not be elaborated here.

[0170] For example, referring to Figures 20 and 22, the angle between the plane containing the sidewall of the disassembly part 41 and the plane containing the chip 21 can be greater than 1 degree. This allows the chip assembly 20 cut by the disassembly part 41 to have a identifiable thickness difference along the Z-axis direction. For example, the chip 21 may be thicker at the upper end and thinner at the lower end in the Z-axis direction; or the chip 21 may be thicker at the lower end and thinner at the upper end in the Z-axis direction. Thus, the thickness variation of the disassembled chip assembly 20 can be associated with the original mounting direction of the chip assembly 20 on the first consumable box 10, which is beneficial for distinguishing the mounting direction of the recycled chip on the second consumable box. Furthermore, the cutting force is evenly distributed at this time, reducing the concentrated force on the blade tip and protecting the blade 411.

[0171] Referring to Figures 23 and 24, the fixing base 30 in this embodiment includes a fixing body 34. The fixing body 34 includes a first baffle 341, a second baffle 342, and a third baffle 343. The first baffle 341 and the second baffle 342 are disposed opposite to each other, and the third baffle 343 is connected to the same side of the first baffle 341 and the second baffle 342. The positioning cavity 32 is formed between the first baffle 341, the second baffle 342, and the third baffle 343.

[0172] For example, the second baffle 342 may include contact portions 3421 and recesses 3422 arranged alternately in sequence along the second direction. When the chip 21 on the first consumable box 10 is removed, the multiple contact portions 3421 can contact the surface of the first consumable box 10 and, together with the first baffle 341, restrict the displacement of the first consumable box 10 in the first direction to prevent the first consumable box 10 from shaking when the removal part 41 cuts.

[0173] There is a gap between the recessed portion 3422 and the surface of the first consumable box 10. This can reduce the contact area between the second baffle 342 and the first consumable box 10 while ensuring positioning, thereby reducing the wear on the surface of the first consumable box 10 during use and making it easier to insert the first consumable box 10 into the positioning cavity 32.

[0174] In one possible implementation, the positioning cavity 32 may have an inclined guide 321 on the cavity wall on the side away from the disassembly assembly 40 in a second direction perpendicular to the first direction. The inclined guide 321 may abut against the first consumable box 10 to tilt the chip 21 toward one end of the inclined guide 321 in the first direction.

[0175] It is understandable that the tilting guide 321 can also tilt the first consumable box 10 into the disassembly channel 31. It has the same function as the positioning cavity 32, which is tilted downward at the top or tilted upward at the bottom. Its effect will not be described in detail here.

[0176] For example, continuing to refer to FIG24, the tilting guide portion 321 protrudes from the inner wall surface of the third baffle 343 and extends in the third direction (X-axis direction) into the two positioning cavities 32.

[0177] The thickness of the inclined guide portion 321 in the corresponding positioning cavity 32 gradually decreases along the first direction (-Z axis direction), thereby allowing the first consumable box 10 to be inclined downward. Alternatively, the thickness of the inclined guide portion 321 in the corresponding positioning cavity 32 gradually increases along the first direction (-Z axis direction), thereby allowing the first consumable box 10 to be inclined upward.

[0178] In some other embodiments, the inclined guide portion 321 in the positioning cavity 32 may not be provided, that is, a horizontal surface is provided on the cavity wall of the positioning cavity 32 on the side away from the disassembly assembly 40 in the second direction perpendicular to the first direction.

[0179] Referring again to Figures 20, 23, and 24, the fixing base 30 in this embodiment further includes a disassembly guide 35. The disassembly guide 35 is disposed on the side of the first baffle 341 and the second baffle 342 opposite to the third baffle 343, and a disassembly channel 31 is formed within the disassembly guide 35.

[0180] The disassembly guide 35 may include a first disassembly guide 351 and a second disassembly guide 352. The first disassembly guide 351 and the second disassembly guide 352 are connected and together form a disassembly channel 31. Furthermore, the second disassembly guide 352 protrudes from the outer surface of the first disassembly guide 351.

[0181] The disassembly guide 35 guides the movement of the disassembly assembly 40, enabling the disassembly assembly 40 to move along a preset trajectory. This effectively prevents the movement of the disassembly assembly 40 from deviating, thereby avoiding damage to the chip 21 caused by the disassembly part 41.

[0182] Referring to Figures 17 to 21 and Figure 25, the fixing base 30 further includes a first limiting part 36, which is disposed on the outer wall surface of the disassembly guide part 35. The first limiting part 36 abuts against the first consumable box 10 to limit the position of the first consumable box 10 within the positioning cavity 32.

[0183] For example, the first limiting part 36 may be a groove recessed into the outer wall of the disassembly guide part 35, and the first consumable box 10 may be provided with a limiting part 13 protruding from the outer wall of the first consumable box 10. The first limiting part 36 may abut against the limiting part 13.

[0184] When the first consumable box 10 moves in the positioning cavity 32 along the third direction, when the outer contour of the limiting part 13 abuts against the first limiting part 36, the first consumable box cannot move further, thereby limiting the first consumable box 10 in the third direction (X-axis direction) so that the chip 21 is aligned with the disassembly channel 31.

[0185] In one possible implementation, the height of the first limiting part 36 in the first direction can be matched with the corresponding positioning cavity 32. For example, the height of the first limiting part 36 in the first direction is greater than or equal to the cavity width of the corresponding positioning cavity 32, thereby making the contact between the first limiting part 36 and the first consumable box 10 more reliable.

[0186] Referring to FIG26, the fixing base 30 further includes a second limiting part 37. The second limiting part 37 is disposed on at least one of the first baffle 341 and the second baffle 342 and faces the inner wall surface of the positioning cavity 32. The second limiting part 37 is configured to abut against one end of the first consumable box 10 so that the position of the chip 21 or the chip assembly 20 corresponds to the disassembly channel 31.

[0187] It is understood that the setting of the second limiting part 37 in this embodiment can refer to the description of the second limiting part 37 of the chip disassembly device in the previous embodiment, and will not be repeated here.

[0188] Referring to Figure 27, the connecting hole 33 is located on the side wall of the disassembly channel 31, and the disassembly channel 31 and the positioning part 3 can be connected through the connecting hole 33. Correspondingly, both positioning cavities 32 can be connected to the disassembly channel 31 through the connecting hole 33.

[0189] When the first consumable box 10 is installed in one of the positioning cavities 32, the chip 21 and the carrier 22 can be inserted into the disassembly channel 31 through the connecting hole 33, so that the chip 21 can be accurately exposed in the disassembly channel 31 in the positioning cavity 32, which facilitates the subsequent operation of the disassembly assembly 40.

[0190] The specific structure of the disassembly component 40 in Embodiment 2 will be further described below.

[0191] Referring to FIG28, the disassembly assembly 40 includes a disassembly part 41, a force-applying part 42, and a locking member 43. The disassembly part 41, the force-applying part 42, and the locking member 43 are all movably disposed within the disassembly channel 31. Furthermore, the disassembly part 41 is movably disposed between the force-applying part 42 and at least a portion of the locking member 43, and the force-applying part 42 can drive the locking member 43 and the disassembly part 41 to move along a first direction (the direction of the -Z axis).

[0192] The locking member 43 is connected to the force-applying part 42, and the force-applying part 42 can rotate relative to the locking member 43. The locking member 43 can move along the first direction (the direction where the -Z axis is located) under the drive of the force-applying part 42.

[0193] The disassembly part 41 is fitted onto the locking member 43, and the disassembly part 41 can move together with the locking member 43. Thus, when the locking member 43 moves downward in the first direction under the action of the force-applying part 42, the disassembly part 41 can also move downward in the first direction, thereby disassembling the chip 21 or the chip 21 and the carrier part 22. Furthermore, after removing the chip 21 or the chip 21 and the carrier part 22 from the first consumable box 10, by moving the force-applying part 42 upward in the Z-axis direction, the locking member 43 can drive the disassembly part 41, which was originally blocked at the connecting hole 33, upward, thereby restoring the connection between the positioning cavity 32 and the disassembly channel 31, so that the first consumable box 10 can be installed in the positioning cavity 32 during the next disassembly.

[0194] It is understandable that when the force-applying part 42 is connected to the inner wall of the disassembly channel 31 by a thread, the disassembly part 41 can be driven to move upward along the Z-axis by rotating the force-applying part 42 in the opposite direction.

[0195] The disassembly part 41 is movably disposed outside the locking member 43. The disassembly part 41 may also be detachably connected to the locking member 43. For example, the disassembly part 41 may be sleeved on the locking member 43 and snapped into the locking member 43. Alternatively, the disassembly part 41 may be sleeved on the locking member 43 and threadedly connected to the locking member 43. No limitation is made here.

[0196] Referring to Figures 28-30, in one possible implementation, the locking member 43 includes a connecting member 431 and a stop 432. The disassembly part 41 is sleeved on the connecting member 431, and the connecting member 431 is connected to the force-applying part 42 via an intermediate member 433, so that the locking member 43 can move downwards in a first direction under the action of the force-applying part 42.

[0197] The connector 431 has a central hole 4311, through which the intermediate member 433 passes, and the intermediate member 433 can rotate relative to the connector 431. For example, the inner wall of the side of the connector 431 that contacts the intermediate member 433 may have a protrusion to reduce the contact area between the connector 431 and the intermediate member 433, thereby reducing the friction between the connector 431 and the intermediate member 433 and allowing the intermediate member 433 to rotate relative to the connector 431.

[0198] As one implementation method, as shown in Figure 25, one end of the intermediate part 433 may be provided with an external thread, which can cooperate with the internal thread of the force-applying part 42 to achieve a threaded connection, so as to make the connection between the two stable.

[0199] As another implementation, as shown in FIG30, one end of the intermediate member 433 can be closely attached to the inner wall of the force-applying part 42, that is, the intermediate member 433 and the force-applying part 42 are interference-fitted to realize the connection between the two.

[0200] It should be noted that when the force-applying part 42 is connected to the disassembly channel 31 by a thread, the force-applying part 42 will rotate along its axis while moving in the first direction. At this time, the intermediate part 433 may be driven to rotate together. However, since the intermediate part 433 can rotate relative to the connecting part 431, the connecting part 431 and the disassembly part 41 will only move in the first direction and will not rotate.

[0201] In other embodiments, the intermediate component 433 can be connected to the force-applying part 42 via a bearing. The outer ring of the bearing is fixedly connected to the internal cavity of the force-applying part 42, and the inner ring of the bearing is fixedly connected to the intermediate component 433. Thus, rotational isolation between the force-applying part 42 and the intermediate component 433 can be achieved by rotating the outer ring of the bearing relative to the inner ring. In this case, the intermediate component 433 will not rotate with the force-applying part 42, thereby preventing the connecting component 431 from rotating.

[0202] The baffle 432 is connected to the end of the connector 431 away from the force-applying part 42, and the baffle 432 is disposed away from the first consumable box 10 in the second direction (the direction where the Y-axis is located). Furthermore, the baffle 432 abuts against the disassembly part 41.

[0203] Understandably, to avoid obstructing the disassembly part 41 on the Y-axis side near the first consumable box 10 and thus preventing interference with the disassembly part 41's disassembly of the chip 21, the stop 432 is only located on the side of the Y-axis away from the first consumable box 10. Furthermore, the connector 431 has an asymmetrical structure. The connector 431 on the Y-axis side near the first consumable box 10 has a smaller extension length in the first direction to prevent it from interfering with the insertion of the first consumable box 10 into the disassembly channel 31.

[0204] In one possible implementation, the outer wall of the baffle 432 can slide along the inner wall of the disassembly channel 31 formed by the second disassembly guide 352. The force-applying part 42 moves within the disassembly channel 31 formed by the first disassembly guide 351 so that when the disassembly part 41 moves within the disassembly channel 31, both its upper and lower ends are constrained and it does not deviate in the Y-axis direction.

[0205] In this way, the first disassembly guide 351 to guide the force application part 42 and the second disassembly guide 352 to guide the movement of the baffle 432, so that the disassembly part 41 disassembles the chip 21 or chip assembly 20 on the first consumable box 10 along a preset trajectory, thereby reducing the risk of the disassembly part 41 deviating when moving in the first direction and improving the reliability of the chip disassembly device.

[0206] Referring again to FIG29, in one possible implementation, the stop 432 includes a guide portion 4321 and an abutment portion 4322. The abutment portion 4322 abuts against the bottom of the disassembly portion 41, allowing the disassembly portion 41 to move upward along the Z-axis direction under the influence of the stop 432 after disassembly, returning to its initial position and awaiting the next disassembly. The guide portion 4321 is provided with an inclined surface to guide the bottom end of the disassembly portion 41 to abut against the abutment portion 4322. Furthermore, the guide portion 4321 can also abut against the side wall of the disassembly portion 41 away from the first consumable box 10 in the second direction to limit the displacement of the disassembly portion 41 in the Y-axis direction, thereby preventing slight wobbling of the disassembly portion 41 during disassembly and further improving cutting strength.

[0207] Example 3:

[0208] Based on the above embodiments, this application also provides another specific implementation of a chip removal device. The main difference between this embodiment and the above embodiments is that the connecting hole 33 in this embodiment is located at the lower end of the inner cavity of the fixing base 30, and the positioning part 3 is arranged differently from the above embodiments. In addition, the connection method of the removal assembly 40 is different in this embodiment.

[0209] Referring to Figures 31-36, the positioning part 3 in this embodiment may include a mounting cavity 38 or a mounting cavity 38 and at least one adapter 50. The mounting cavity 38 is disposed within the fixing base 30. The mounting cavity 38 can be adapted to one type of first consumable box 10. The adapter 50 can be installed within the mounting cavity 38. Different adapters 50 have different positioning cavities 32, thereby adapting to different types of first consumable boxes 10.

[0210] As can be understood, as shown in Figure 32, the chip removal device in this embodiment can be directly adapted to the positioning of a first consumable cartridge 10 of a certain type through the mounting cavity 38, thereby realizing the removal of the chip 21 on the first consumable cartridge 10. At this time, it can be adapted to the removal of the chip 21 of a large-size ink cartridge.

[0211] Alternatively, as shown in Figures 33 and 34, the mounting cavity 38 can be used in combination with adapters 50 of different sizes to achieve adaptation to first consumable boxes 10 of different sizes.

[0212] For example, in Figure 28, the width of the positioning cavity 32 formed by the adapter 50 and the mounting cavity 38 is h1, and in Figure 29, the width of the positioning cavity 32 formed by the adapter 50 and the mounting cavity 38 is h2, where h1 < h2. Thus, by selecting the size of the adapter 50, it can be adapted to first consumable boxes 10 of different widths.

[0213] In this way, the first consumable box 10 can be adapted to various devices by using the mounting cavity 38 itself or by combining different adapters 50 with the mounting cavity 38, thereby further improving the applicability of the chip removal device.

[0214] Referring to Figures 35 and 36, a cavity 344 is provided inside the fixing base 30, which can accommodate the disassembly assembly 40. A connecting hole 33 is provided at the lower end of the cavity 344. Furthermore, a guide hole 3441 is provided at the upper end of the cavity 344. The disassembly assembly 40 can pass through the guide hole 3441 and enter the cavity 344.

[0215] The guide hole 3441 and the connecting hole 33 define a disassembly channel 31, and the connecting hole 33 allows the disassembly channel 31 to communicate with the positioning part 3. Thus, when the disassembly part 41 moves along the first direction (-Z axis direction), it can pass through the connecting hole 33 and act on the first consumable box 10 to separate the chip 21 or chip assembly 20 from the first consumable box 10.

[0216] In one possible implementation, the fixing base 30 is connected to a guide member 345, which is connected to the lower end of the cavity 344. A connecting hole 33 is provided on the guide member 345. The lower end of the cavity 344 is set as an open opening. The cooperation between the guide member 345 and the cavity 344 can cover the open opening at the lower end of the cavity 344 and guide the disassembly part 41 to move in the first direction. Furthermore, the disassembly part 41 can extend into the positioning part 3 through the connecting hole 33.

[0217] In another possible implementation, the connecting hole 33 can be directly formed in the bottom wall of the cavity 344, and the disassembly part 41 can extend into the positioning part 3 through the connecting hole 33 formed in the bottom wall of the cavity to cut and disassemble the chip 21 on the first consumable box 10. In this way, the number of parts of the chip disassembly device can be reduced.

[0218] In one possible implementation, the disassembly assembly 40 includes a disassembly part 41 and a force-applying part 42. The disassembly part 41 and the force-applying part 42 are fixedly connected by a fastener 44, allowing the disassembly part 41 to move together with the force-applying part 42. When the disassembly channel 31 and the force-applying part 42 are connected by a thread, rotating the force-applying part 42 will cause the disassembly part 41 to rotate and move up and down along the Z-axis.

[0219] Referring to FIG36, at least two positioning ribs are provided on the cavity wall of the mounting cavity 38 on the side corresponding to the chip 21, and the at least two positioning ribs are spaced apart along the first direction; and the at least two positioning ribs abut against the first consumable box 10 or the adapter 50.

[0220] Taking the installation cavity 38 with two positioning ribs 381 as an example, when the two positioning ribs 381 directly abut against the first consumable box 10, the first consumable box 10 is directly installed in the installation cavity 38. A cavity is formed between the two positioning ribs 381 to avoid the location of the chip 21 and prevent wear on the chip 21. When the two positioning ribs 381 abut against the adapter 50, the movement of the first consumable box 10 installed in the adapter 50 is restricted by limiting the movement of the adapter 50 in the second direction.

[0221] The positioning rib 381 can directly or indirectly restrict the movement of the first consumable box 10 in the second direction, thereby further improving the stability of the first consumable box 10 when it is being cut.

[0222] Referring to Figure 36, in a third direction perpendicular to the first direction, a receiving groove 383 may be provided on the cavity wall of the mounting cavity 38 to receive the handle 14 of the first consumable box 10.

[0223] Referring to Figures 32, 36 and 37, in one possible implementation, in the third direction, a snap-fit ​​member 382 is connected to the side of the mounting cavity 38 away from the disassembly channel 31. The snap-fit ​​member 382 abuts against the first consumable box 10 or the adapter 50 to restrict the movement of the first consumable box 10 in the third direction.

[0224] Referring to FIG38, the snap-fit ​​component 382 includes a connecting section 3821 and a bending section 3822. The connecting section 3821 is connected to the bottom wall of the mounting cavity 38. The bending section 3822 is connected to the connecting section 3821 and protrudes from the bottom wall of the mounting cavity 38. The bending section 3822 can abut against the first consumable box 10 or the adapter 50.

[0225] It is understandable that when the adapter 50 or the first consumable box 10 is installed into the mounting cavity 38 along a third direction, the bent section 3822 will be squeezed by the adapter 50 or the first consumable box 10. At this time, the snap-fit ​​part 382 can swing downwards in a small range relative to the bottom wall of the mounting cavity 38, and return to the initial state after the adapter 50 or the first consumable box 10 is installed into the mounting cavity 38, so as to achieve the adaptation and locking of the adapter 50 or the first consumable box 10.

[0226] The specific structure of the fixing base 30 in this embodiment will be further described below.

[0227] Referring to Figure 37, the mounting base 30 includes a first baffle 341, a second baffle 342, a third baffle 343, a bottom plate 346, and a top plate 347. The mounting cavity 38 is formed by the first baffle 341, the second baffle 342, the third baffle 343, the bottom plate 346, and the top plate 347.

[0228] The first baffle 341 and the second baffle 342 are disposed opposite to each other, and the third baffle 343 is connected to the first baffle 341. The base plate 346 is connected to the first baffle 341, the second baffle 342, and the third baffle 343, and a notch is formed between the base plate 346 and the third baffle 343 and the second baffle 342. The chip 21 on the first consumable box 10 can be exposed in the notch. Furthermore, when the disassembly part 41 passes through the connecting hole 33 in the first direction, it can be inserted into the notch to disassemble the chip 21.

[0229] Referring to Figures 39 and 40, this application also provides an adapter 50. The adapter 50 can be installed in the mounting cavity 38 described above. The adapter 50 is provided with an opening 52 to fit into the first consumable box 10. Furthermore, a clearance portion 51 is provided on the outer wall of the adapter 50 to avoid the ink outlet 12 on the first consumable box 10.

[0230] Referring to FIG40, the limiting part 13 on the first consumable box 10 can abut against the outer wall of the adapter 50 to achieve positioning of the first consumable box in a third direction.

[0231] Example 4

[0232] Based on the above embodiments, this application also provides another specific implementation of a chip disassembly device. This embodiment is an improvement on the above embodiment two. Based on the above embodiment two, this embodiment adds an elastic component and a shielding component during the chip disassembly process.

[0233] The following describes this embodiment in further detail with reference to Figures 41 to 45.

[0234] Referring to Figures 41 to 45, the chip removal device of this embodiment has an extension section at the front end of the second removal guide 352 to form a third removal guide 353. The third removal guide 353 is further away from the force application part 42. The third removal guide 353 is approximately U-shaped, with its top wall closed to the left and right side walls, and the left and right side walls are also connected to the outer peripheral wall of the first baffle 341. That is, the left and right side walls are side walls extending downward from the top wall. The front end of the third removal guide 353 has a first opening 3531 and the lower end has a second opening 3532, both of which are completely open. Taking the orientation of the paper in Figure 44 as an example, the opening direction of the first opening 3531 is towards the -Z direction, and the opening direction of the second opening 3532 is towards the -Y direction.

[0235] In addition, as shown in Figures 43 and 44, an elastic element 45 is also provided in the disassembly channel 31. Specifically, the elastic element is provided at the connector 431. A latching part 4312 is formed on the back side of the connector 431 where it abuts against the force-applying part 42. The latching part 4312 protrudes from the bottom surface of the connector 431 and is provided with a latch that can engage with the elastic element 45. One end of the elastic element 45 engages with the latching part 4312, and the other end is freely suspended towards the outside of the disassembly channel 31. That is, the other end of the elastic element 45 is set towards the chip 21 of the ink cartridge. Here, the elastic element 45 can be a spring, torsion spring, or sheet spring, etc.

[0236] Based on Embodiment 2, by adding the elastic element 45, when the disassembly component disassembles the chip 21 on the ink cartridge, the elastic element 45 applies a forward force to the chip 21. When the disassembled chip assembly 20 is separated from the ink cartridge, the chip assembly 20 can pop forward (away from the force application part 42) to prevent the chip assembly 20 from getting stuck in the disassembly channel 31 and being difficult to remove.

[0237] As shown in Figures 44 and 45, at least a portion of the upper end of the first baffle 341 where it connects with the disassembly channel 31 is provided with a guide surface 3411. The guide surface 3411 extends forward and downward from the upper end of the first baffle 341. The guide surface 3411 connects with the second opening 3532 of the third disassembly guide 353 at its front end. With the guide surface 3411 provided, the disassembled chip assembly 20 can fall out from the second opening 3532 along the guide surface 3411, making it convenient for the user to pick it up.

[0238] Furthermore, as shown in Figures 41 and 42, in order to prevent the chip assembly 20 from popping out of the first opening 3531 under the action of the elastic member 45, a blocking part 60 is also provided at the front end of the third disassembly guide 353. The blocking part 60 can block at least part of the first opening 3531 so that the chip assembly 20 cannot be separated from the disassembly channel 31 from the first opening 3531.

[0239] For example, the shielding portion 60 at least partially surrounds the left and right sidewalls of the third disassembly guide portion 353 and the first opening, that is, the two ends of the shielding portion 60 are adhered to the left and right sidewalls of the third disassembly guide portion 353, and the middle portion is directly opposite the first opening 3531. The shielding portion 60 can be a label, sealing film, or self-adhesive, as long as it is convenient to stick to the third disassembly guide portion 353. Since the two ends of the shielding portion 60 need to be adhered to the left and right sidewalls of the third disassembly guide portion 353, there are adhesive areas at the two ends of the shielding portion 60, while the middle portion of the shielding portion 60 may or may not have an adhesive area, preferably no adhesive area, to prevent the disassembled chip assembly from bouncing into the middle area of ​​the shielding portion 60 and getting stuck.

[0240] Based on Embodiment 2, by adding a shielding part 60, when the chip assembly is disassembled, the middle area of ​​the shielding part 60 can be used to offset the popping force applied to the chip assembly 20 by the elastic member 45, so that the chip assembly 20 can fall normally from the second opening 3532, avoiding uncontrolled peeling of the chip assembly 20 and effectively controlling the falling direction of the chip assembly 20.

[0241] When the chip removal device of this embodiment is used to remove the chip assembly 20 on the ink cartridge, the force application part 42 is rotated and the removal part 41 moves forward along the removal channel 31 to remove the chip assembly 20 on the ink cartridge. At this time, the elastic member 45 will abut against the chip assembly 20. As the removal part 41 continues to remove, the elastic member 45 will give the removed chip assembly 20 a forward (outward) elastic force, making the removal smoother and preventing the chip assembly 20 from getting stuck in the removal channel 31. When the chip assembly 20 is completely removed, the chip assembly 20 will fall from the second opening 3532 along the guide surface 3411, or the chip assembly 20 may pop out due to the excessive elastic force and fall from the second opening 3532 under the cover of the shielding part 60.

[0242] This application also provides a consumable box kit, including: a second consumable box (not shown in the figure), and the chip removal device described above.

[0243] In one possible implementation, the recycled chip 21 or chip assembly 20 can be installed into a second consumable box. The outer wall of the second consumable box is provided with a chip mounting position. To facilitate the installation of the recycled chip 21 or chip assembly 20, the chip 21 or chip assembly 20 can be installed into the chip mounting position by means of snap-fit ​​or adhesive. In addition, a detachable chip holder with a mounting slot can be provided on the chip mounting position. The chip holder has a mounting slot in which the chip 21 or chip assembly 20 can be placed. The chip 21 or chip assembly 20 can be installed into the mounting slot by means of snap-fit ​​or adhesive, which realizes the recycling and reuse of the chip 21, which helps to save resources and reduce costs.

[0244] In the description of this application, it should be understood that the terms “center,” “length,” “width,” “thickness,” “top,” “bottom,” “upper,” “lower,” “left,” “right,” “front,” “rear,” “vertical,” “horizontal,” “inner,” “outer,” “axial,” and “circumferential” used to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the location or original must have a specific orientation, or a specific construction and operation, and therefore should not be construed as a limitation of this application.

[0245] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0246] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0247] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0248] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A chip removal device for removing a chip (21) from a first consumable box (10), characterized in that, The chip removal device includes: A fixing base (30) has a disassembly channel (31) and a positioning part (3) for positioning the first consumable box (10) inside. The disassembly channel (31) and the positioning part (3) are intersected. The disassembly channel (31) has a connecting hole (33) and the connecting hole (33) are connected to the positioning part (3). The disassembly assembly (40) is movably disposed within the disassembly channel (31). The disassembly assembly (40) includes a disassembly part (41), at least a portion of which is arc-shaped. The disassembly part (41) moves along a first direction and can contact the first consumable box (10) through the connecting hole (33) to disassemble the chip (21).

2. The chip removal device according to claim 1, characterized in that, The disassembly assembly (40) further includes a force-applying part (42), which is movably disposed within the disassembly channel (31) and can drive the disassembly part (41) to move along a first direction.

3. The chip removal device according to claim 2, characterized in that, The disassembly part (41) is movably connected to the force-applying part (42), and the force-applying part (42) abuts against the top of the disassembly part (41) to drive the disassembly part (41) to move along the first direction.

4. The chip removal device according to claim 2, characterized in that, The disassembly assembly (40) also includes a locking element (43); The locking member (43) is connected to the force-applying part (42); the force-applying part (42) can rotate relative to the locking member (43); the locking member (43) can move along the first direction under the drive of the force-applying part (42); Furthermore, the disassembly part (41) is fitted onto the locking member (43).

5. The chip removal device according to claim 4, characterized in that, The locking element (43) includes: The connector (431) is fitted onto the connector (431), and the connector (431) is connected to the force-applying part (42) via an intermediate part (433). A baffle (432) is connected to the end of the connector (431) away from the force-applying part (42), and the baffle (432) is disposed away from the first consumable box (10) in a second direction perpendicular to the first direction; and the baffle (432) abuts against the disassembly part (41).

6. The chip removal device according to claim 2, characterized in that, The disassembly part (41) is fixedly connected to the force-applying part (42) and moves together with the force-applying part (42).

7. The chip removal device according to claim 1, characterized in that, The connecting hole (33) is located on the side wall of the disassembly channel (31) so that the disassembly channel (31) communicates with the positioning part (3) and exposes the chip (21) inside the disassembly channel (31); The depth direction of the disassembly channel (31) and the length direction of the chip (21) both extend along the first direction.

8. The chip removal device according to claim 1, characterized in that, The fixing base (30) is also provided with a cavity (344), and the connecting hole (33) is provided at the lower end of the cavity (344). The disassembly part (41) can pass through the connecting hole (33) and act on the first consumable box (10) to separate the chip (21) from the first consumable box (10). The upper end of the cavity (344) is also provided with a guide hole (3441), and the guide hole (3441) and the connecting hole (33) define the disassembly channel (31).

9. The chip removal apparatus according to any one of claims 2-8, characterized in that, The force-applying part (42) is connected to the inner wall of the disassembly channel (31) by a thread.

10. The chip removal apparatus according to any one of claims 1-7, characterized in that, The positioning part (3) includes two positioning cavities (32), which are arranged side by side and located on opposite sides of the disassembly channel (31); Furthermore, the two positioning cavities (32) have different cavity widths to accommodate the first consumable box (10) of different sizes.

11. The chip removal device according to claim 10, characterized in that, Along a second direction perpendicular to the first direction, the top of the positioning cavity (32) is inclined downward so that the depth of the first consumable box (10) extending into the disassembly channel (31) gradually decreases along the first direction.

12. The chip removal device according to claim 10, characterized in that, In a second direction perpendicular to the first direction, the positioning cavity (32) has an inclined guide (321) on the cavity wall on the side away from the disassembly assembly (40); The first consumable box (10) abuts against the tilt guide (321) so that the chip (21) tilts toward one end of the tilt guide (321) along the first direction.

13. The chip removal device according to claim 10, characterized in that, The fixing base (30) includes: A fixing body (34) includes a first baffle (341), a second baffle (342), and a third baffle (343). The first baffle (341) and the second baffle (342) are disposed opposite to each other, and the third baffle (343) is connected to the same side of the first baffle (341) and the second baffle (342). The positioning cavity (32) is formed between the first baffle (341), the second baffle (342), and the third baffle (343). A disassembly guide (35) is provided on one side of the first baffle (341) and the second baffle (342) relative to the third baffle (343), and a disassembly channel (31) is formed in the disassembly guide (35).

14. The chip removal device according to claim 13, characterized in that, The fixing seat (30) further includes a first limiting part (36), which is disposed on the side of the disassembly guide part (35) facing the positioning cavity (32), or the first limiting part (36) is disposed on the outer wall surface of the disassembly guide part (35). The first limiting part (36) abuts against the first consumable box (10) to limit the position of the first consumable box (10) in the positioning cavity (32).

15. The chip removal device according to claim 13, characterized in that, The fixing base (30) further includes a second limiting part (37), which is disposed on at least one of the first baffle (341) and the second baffle (342) facing the inner wall surface of the positioning cavity (32). The second limiting part (37) is configured to abut against one end of the first consumable box (10) so that the position of the chip (21) corresponds to the disassembly channel (31).

16. The chip removal apparatus according to any one of claims 1-6 and 8, characterized in that, The positioning part (3) includes a mounting cavity (38) and at least one adapter (50). Different adapters (50) have different positioning cavities (32) to adapt to different models of the first consumable box (10). Furthermore, the mounting cavity (38) can be adapted to one model of the first consumable box (10).

17. The chip removal device according to claim 16, characterized in that, At least two positioning ribs (381) are provided on the cavity wall of the mounting cavity (38) on the side corresponding to the chip (21). The at least two positioning ribs (381) are spaced apart along the first direction and abut against the first consumable box (10) or the adapter (50).

18. The chip removal device according to claim 16, characterized in that, In the third direction perpendicular to the first direction, a snap-fit ​​member (382) is connected to the side of the mounting cavity (38) away from the disassembly channel (31). The snap-fit ​​member (382) abuts against the first consumable box (10) or the adapter (50) to restrict the movement of the first consumable box (10) in the third direction.

19. A consumables box set, characterized in that, include: Second consumable box; as well as, The chip removal apparatus according to any one of claims 1-18.

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