Conductive structure, circuit board assembly, and sensor structure

Abstract

A conductive structure, a circuit board assembly, and a flexible pressure sensor. The circuit board assembly comprises a conductive structure and a PCBA; the conductive structure comprises a base layer and a conductive layer; the conductive layer comprises a plurality of conductive wires; the plurality of conductive wires are threaded through the base layer along the extension direction of the base layer; the conductive layer is electrically connected to the PCBA; and the base layer can be deformed under the action of an external force.

Description

Conductive structures, circuit board assemblies and sensor structures

[0001] This application claims priority to Chinese Patent Application No. 202520150396.1, filed on January 21, 2025, entitled "Circuit Board Assembly and Sensor Structure", the entire contents of which are incorporated herein by reference.

[0002] This application also claims priority to Chinese Patent Application No. 202520462285.4, filed on March 14, 2025, entitled "Flexible Pressure Sensor", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of circuit board technology, and in particular to a circuit board assembly and sensor structure. Background Technology

[0004] Printed circuit boards (PCBs) are carriers of electronic components. Compared to PCBs, flexible circuit boards are thinner and can be bent. Flexible circuit boards and PCBs work together to form rigid-flex circuit board assemblies.

[0005] In related technologies, silver paste is screen-printed or conductive materials are electroplated onto PI or PET films to form flexible circuit boards. Since PI or PET films are polymer film materials, high-precision equipment is required to realize the screen-printing silver paste or electroplating process, resulting in high cost of circuit board components. Summary of the Invention

[0006] The purpose of this application is to provide a circuit board assembly and sensor structure to solve the technical problem that the cost of circuit board assemblies is high due to the formation of flexible circuit boards by screen printing silver paste, gold plating, or carbon and other conductive materials on thin films.

[0007] In a first aspect, this application provides a circuit board assembly, including a conductive structure and a PCBA board. The conductive structure includes a substrate layer and a conductive layer. The conductive layer includes multiple conductive wires, which are interlaced on the substrate layer along the extension direction of the substrate layer. The conductive layer is electrically connected to the PCBA board, and the substrate layer can deform under external force.

[0008] Secondly, this application provides a sensor structure, which includes a sensor module and the circuit board assembly. The sensor module includes a first electrode layer, a second electrode layer and a pressure-sensitive layer. The first electrode layer, the pressure-sensitive layer and the second electrode layer are stacked sequentially. The conductive layer is connected between the first electrode layer and the pressure-sensitive layer and between the second electrode layer and the pressure-sensitive layer.

[0009] Thirdly, this application provides a flexible pressure sensor, including a first electrode layer, a second electrode layer, a pressure-sensitive layer, and a control motherboard, wherein the first electrode layer, the pressure-sensitive layer, and the second electrode layer are stacked sequentially.

[0010] The first electrode layer includes a first substrate and a plurality of first electrodes spaced apart from each other on the first substrate; the second electrode layer includes a second substrate and a plurality of second electrodes spaced apart from each other on the second substrate; and the extending direction of the second electrodes intersects the extending direction of the first electrodes.

[0011] The first electrode and the second electrode are respectively connected to two sides of the pressure-sensitive layer and electrically connected to the pressure-sensitive layer and the control motherboard; the pressure-sensitive layer is used to generate electrical signals, the first electrode and the second electrode are used to transmit the electrical signals, and the control motherboard is used to receive the electrical signals;

[0012] The first substrate, the second substrate, and the pressure-sensitive layer are all made of fabric.

[0013] This application provides a circuit board assembly, including a substrate layer and a conductive layer. The substrate layer is made of a flexible material and can deform under external force. Multiple conductive wires are interlaced on the substrate layer along its extension direction to form the conductive layer. This allows the conductive structure to deform under external force without affecting its conductivity. The conductive structure is connected to a PCBA board to form the circuit board assembly. In this embodiment, the conductive wires are directly interlaced on the substrate layer to form the conductive layer, eliminating the need for high-precision equipment to manufacture the conductive structure. Compared to methods such as screen printing silver paste or electroplating conductive materials on a polymer film, the circuit board assembly of this embodiment has lower manufacturing costs and a relatively simpler process.

[0014] This application provides a flexible pressure sensor, which has the following advantages:

[0015] The flexible pressure sensor of this application includes a first electrode layer, a second electrode layer, a pressure-sensitive layer, and a control motherboard, wherein the first electrode layer, the pressure-sensitive layer, and the second electrode layer are stacked sequentially.

[0016] The first and second substrates are made of soft fabric, with the first and second electrodes respectively placed on the fabric as substrates, thus forming a first electrode layer and a second electrode layer. The pressure-sensitive layer is a fabric structure woven from carbon fiber or other high-resistance conductive materials. The first and second electrode layers are respectively attached to the front and back of the pressure-sensitive layer. Utilizing the softness and bending resistance of the fabric, the flexibility and bending resistance of the flexible pressure sensor are improved, making it less prone to noise when applied to a bed. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 is a schematic diagram of the structure of the flexible pressure sensor provided in an embodiment of this application;

[0019] Figure 2 is an exploded view of the flexible pressure sensor provided in an embodiment of this application;

[0020] Figure 3 is a schematic diagram of the structure of the first electrode layer provided in an embodiment of this application;

[0021] Figure 4 is a schematic diagram of the structure of the second electrode layer provided in an embodiment of this application;

[0022] Figure 5 is another exploded view of the flexible pressure sensor provided in the embodiment of this application;

[0023] Figure 6 is a magnified view of part A in Figure 5;

[0024] Figure 7 is a magnified view of part B in Figure 5;

[0025] Figure 8 is a schematic diagram of the circuit board assembly provided in an embodiment of this application;

[0026] Figure 9 is an exploded view of the circuit board assembly provided in an embodiment of this application;

[0027] Figure 10 is a schematic diagram of the sensor structure provided in the embodiment of this application.

[0028] The markings in the image are as follows:

[0029] 10. First electrode layer; 11. First substrate; 12. First electrode; 20. Second electrode layer; 21. Second substrate; 22. Second electrode; 30. Pressure-sensitive layer; 40. Control motherboard; 41. Pin header; 42. Terminal housing; 43. Mounting hole; 50. Outgoing wire layer; 51. Substrate layer; 52. Conductive layer; 53. Insulating layer; 54. Terminal piece; 60. Conductive foam; 70. Reinforcing connecting piece; 81. First insulating layer; 82. Second insulating layer; 90. Protective layer; 100. Flexible pressure sensor; 101. Data cable; 102. Plug-in port; 200. Circuit board assembly; X, first direction; Y, second direction. Embodiments of the present invention

[0030] The specific embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. In the description of this application, it should be noted that the terms "upper," "lower," "front," "rear," "inner," and "outer," etc., used to indicate orientation or positional relationships are based on the positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description. They do not indicate or imply that the devices and elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. In the description of this application, it should be understood that the terms "first," "second," etc., are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.

[0031] As shown in Figures 1 to 4, this embodiment of the application provides a flexible pressure sensor 100 including a first electrode layer 10, a second electrode layer 20, a pressure-sensitive layer 30, and a control motherboard 40. The first electrode layer 10, the pressure-sensitive layer 30, and the second electrode layer 20 are stacked sequentially. The first electrode layer 10 includes a first substrate 11 and a plurality of first electrodes 12 spaced apart from each other on the first substrate 11. The second electrode layer 20 includes a second substrate 21 and a plurality of second electrodes 22 spaced apart from each other on the second substrate 21, and the extension direction of the second electrodes 22 intersects the extension direction of the first electrodes 12. The first electrodes 12 and the second electrodes 22 are respectively connected to two sides of the pressure-sensitive layer 30 and electrically connected to the pressure-sensitive layer 30 and the control motherboard 40. The pressure-sensitive layer 30 is used to generate electrical signals, the first electrodes 12 and the second electrodes 22 are used to transmit electrical signals, and the control motherboard 40 is used to receive electrical signals. The first substrate 11, the second substrate 21, and the pressure-sensitive layer 30 are made of fabric.

[0032] Based on the above technical solution, the first substrate 11 and the second substrate 21 are made of soft fabric, and the first electrode 12 and the second electrode 22 are respectively set on the fabric as a base, thereby forming the first electrode layer 10 and the second electrode layer 20. The pressure-sensitive layer 30 is a fabric structure woven from carbon fiber or other high-resistance conductive materials. In this embodiment, the first electrode layer 10 and the second electrode layer 20 are respectively attached to the front and back sides of the pressure-sensitive layer 30. By utilizing the softness and bending resistance of the fabric, the flexibility of the flexible pressure sensor 100 is improved, and the bending resistance of the sensor is enhanced. After the sensor is squeezed, deformed, and bent, it is not easy for wires to break or short circuit. When the flexible pressure sensor 100 is applied to a bed, the user directly contacts the fabric, which is less likely to generate noise.

[0033] In this embodiment, the extension direction of the second electrode 22 intersects the extension direction of the first electrode 12. The first electrode 12 and the second electrode 22 cover most of the surface of the pressure-sensitive layer 30, increasing the intersection points between the first electrode 12 and the second electrode 22, thereby increasing the pressure-sensitive points of the pressure-sensitive layer 30 to detect pressure and improving the accuracy of pressure detection.

[0034] The first electrode 12 and the second electrode 22 are made of conductive fibers. The conductor is one or more of conductive wire, knitted yarn, conductive yarn, conductive copper foil, or conductive tape. It can be tightly bonded to the fabric substrate by weaving, coating, or weaving to improve the overall flexibility of the electrode layer. In this embodiment, the fabric can be one or more of natural fabric, chemical fabric, cotton fabric, or polyester.

[0035] For example, a flexible pressure sensor 100 is laid on the surface of a mattress. When a user's body is in contact with the mattress and applies pressure, the pressure-sensitive points of the pressure-sensitive layer 30 are deformed by external force or load. The change in the contact area between the pressure-sensitive layer 30 and the first electrode 12 and the second electrode 22 causes a change in the resistance value of the pressure-sensitive layer 30. The change in resistance value is converted into an electrical signal and transmitted to the control motherboard 40 through the first electrode 12 or the second electrode 22. The control motherboard 40 then transmits the processed electrical signal to an external terminal device.

[0036] In some embodiments, as shown in Figures 3 to 5, the extending direction of the second electrode 22 is perpendicular to the extending direction of the first electrode 12.

[0037] Specifically, on the same plane, the flexible pressure sensor 100 has a first direction X and a second direction Y that are perpendicular to each other. A plurality of first electrodes 12 extend along the first direction X and are spaced apart on the first substrate 11, and second electrodes 22 extend along the second direction Y and are spaced apart on the second substrate 21.

[0038] For example, the first electrode layer 10, the second electrode layer 20, and the pressure-sensitive layer 30 are rectangular, so that the flexible pressure sensor 100 forms a rectangular fabric structure, with their length direction being the second direction Y and their width direction being the first direction X. Of course, the flexible pressure sensor 100 is not limited to a rectangular shape, and can also be other shapes, depending on the specific design of the application scenario.

[0039] In some embodiments, the first electrode 12 and the first substrate 11 are integrally formed, and the second electrode 22 and the second substrate 21 are integrally formed.

[0040] Specifically, the first electrode 12 and the second electrode 22 are conductive fibers. The first electrode 12 is formed on the first substrate 11 by a textile process, and the second electrode 22 is formed on the second substrate 21 by a textile process, so as to form a conductive fabric of cloth material. The conductive fabric can deform under the action of external force and be folded or bent.

[0041] In some embodiments, the first electrode 12 is interposed in the first substrate 11, and the second electrode 22 is interposed in the second substrate 21.

[0042] Specifically, the first electrode 12 is inserted into the first substrate 11 by embroidery or knitting to form a first electrode layer 10 of fabric material, and the second electrode 22 is inserted into the second substrate 21 by embroidery or knitting to form a second electrode layer 20 of fabric material.

[0043] In this embodiment, embroidery or knitting can be done by machine or by hand. The process is relatively simple and can reduce manufacturing costs.

[0044] In some embodiments, as shown in Figures 3 to 5, the flexible pressure sensor 100 further includes a lead-out layer 50. The first electrode 12 and the control motherboard 40, as well as the second electrode 22 and the control motherboard 40, are electrically connected through the lead-out layer 50. The lead-out layer 50 can deform under external force.

[0045] In practical applications, a first electrode 12 is disposed on the side of the first substrate 11 facing the pressure-sensitive layer 30, and a second electrode 22 is disposed on the side of the second substrate 21 facing the pressure-sensitive layer 30. In order to make the first electrode 12 and the second electrode 22 cover most of the surface of the pressure-sensitive layer 30, the area of ​​the first electrode layer 10 and the second electrode layer 20 is usually designed to be larger than the area of ​​the pressure-sensitive layer 30.

[0046] In this embodiment, in the first direction X, the portion of the first substrate 11 larger than the edge of the pressure-sensitive layer 30 is folded towards the side opposite to the pressure-sensitive layer 30 and connected and fixed to the side of the first substrate 11 opposite to the pressure-sensitive layer 30 by a sewing thread. The first electrode 12 of the folded portion is electrically connected to the output layer 50, and the first electrode 12 transmits electrical signals from the output layer 50 to the control main board 40. In the second direction Y, the portion of the second substrate 21 larger than the edge of the pressure-sensitive layer 30 is folded towards the side opposite to the pressure-sensitive layer 30 and connected and fixed to the side of the second substrate 21 opposite to the pressure-sensitive layer 30 by a sewing thread. The second electrode 22 of the folded portion is electrically connected to the output layer 50, and the second electrode 22 transmits electrical signals from the output layer 50 to the control main board 40.

[0047] In the above embodiment, by folding over portions of the first electrode layer 10 and the second electrode layer 20, the projected areas of the first electrode layer 10 and the second electrode layer 20 on the pressure-sensitive layer 30 are equal to or slightly larger than the area of ​​the pressure-sensitive layer 30, thus aligning the overall fabric edges of the flexible pressure sensor 100. Since the lead-out layer 50 can deform under external force and possesses a certain degree of flexibility, the softness of the flexible pressure sensor 100 remains unaffected.

[0048] In some embodiments, the outgoing layer 50 includes a third substrate 51 (also referred to as substrate layer 51) and a plurality of conductive wires spaced apart on the third substrate 51, the conductive wires being interlaced in the third substrate 51; the first electrode 12 and the control main board 40 and the second electrode 22 and the control main board 40 are electrically connected through the conductive wires; wherein, the material of the third substrate 51 is fabric.

[0049] Specifically, the third substrate 51 uses fabric as a base, and conductive wires are interlaced on the third substrate 51 by embroidery or knitting to form a fabric wire layer 50, which improves the flexibility of the flexible pressure sensor 100 and reduces noise during use.

[0050] The conductive wire can be a metal wire, such as copper or silver wire, and has electrical conductivity and tensile strength. The conductive wire is embroidered on the third substrate 51 and can deform with the deformation of the third substrate 51 while maintaining its electrical conductivity.

[0051] In this embodiment, a plurality of spaced conductive wires are disposed on the third substrate 51, and each conductive wire is connected to each first electrode 12 (or second electrode 22) in a one-to-one correspondence. Specifically, in the lead-out layer 50 connected to the first electrode 12, the conductive wires extend along the first direction X and are connected to the first electrode 12 in a one-to-one correspondence; in the lead-out layer 50 connected to the second electrode 22, the conductive wires extend along the second direction Y and are connected to the second electrode 22 in a one-to-one correspondence.

[0052] In some embodiments, as shown in FIG5, the flexible pressure sensor 100 further includes a protective layer 90, and the protective layer 90 is attached to the side of the wire-out layer 50 facing away from the first electrode 12 or the side of the wire-out layer 50 facing away from the second electrode 22.

[0053] Specifically, after folding the first electrode layer 10 and the second electrode layer 20, to prevent direct contact between human skin and the first electrode 12 or the second electrode 22, a protective layer 90 is connected to the folded surfaces of the first electrode layer 10 and the second electrode layer 20 by sewing thread. The protective layer 90 is made of fabric. The protective layer 90 can cover the folded portion of the first electrode 12 or the second electrode 22.

[0054] In some embodiments, as shown in Figures 5 to 7, the flexible pressure sensor 100 further includes conductive foam 60, the first electrode 12 is fixed and electrically connected to the conductive wire through the conductive foam 60; the second electrode 22 is fixed and electrically connected to the conductive wire through the conductive foam 60.

[0055] Specifically, the conductive foam 60 is a conductive cloth wrapped around a flame-retardant sponge, or a foam material with conductive properties composed of a foam substrate and conductive particles or a coating. Because the conductive filaments have small diameters and thin thicknesses, their contact with the first electrode 12 and the second electrode 22 is unstable. In this embodiment, the conductive filaments and the first electrode 12 are respectively fixedly connected to the conductive foam 60 using sewing thread, so that the first electrode 12 is electrically connected to the conductive filaments. For the same purpose, the second electrode 22 and the conductive filaments are respectively fixedly connected to the conductive foam 60 using sewing thread, so that the first electrode 12 is electrically connected to the conductive filaments.

[0056] In this embodiment, conductive foam 60 is fixedly connected to the first electrode 12 and the second electrode 22, which indirectly increases the contact area between the conductive wire and the first electrode 12 and the second electrode 22, making the contact between the first electrode 12 or the second electrode 22 and the conductive wire more stable and the connection stable and reliable.

[0057] In other embodiments, the conductive foam 60 can be replaced with conductive adhesive, conductive rubber block or conductive fabric, as long as it has conductive properties and softness.

[0058] In some embodiments, as shown in FIG5, the flexible pressure sensor 100 further includes a reinforcing connecting piece 70, which is fixedly connected to the side of the lead-out layer 50 facing away from the conductive foam 60, and is used to strengthen the connection strength between the conductive foam 60 and the conductive wire.

[0059] Specifically, the structural strength of the reinforcing connecting piece 70 is greater than that of the conductive foam 60. The reinforcing connecting piece 70 is fixedly connected to the side of the lead-out layer 50 away from the conductive foam 60, thereby strengthening the connection between the conductive foam 60 and the conductive wire and the electrode, improving the contact stability between the first electrode 12 or the second electrode 22 and the conductive wire, and preventing the conductive wire from breaking.

[0060] In some embodiments, the reinforcing connecting piece 70 is a PET film, which is a film material made from polyethylene terephthalate. The thickness of the reinforcing connecting piece 70 is 0.1-0.2 mm. Within this thickness range, it can enhance the connection strength between the conductive foam 60 and the conductive wire without significantly increasing the overall thickness of the flexible pressure sensor 100.

[0061] For example, the thickness of the reinforcing connecting piece 70 is 0.125 mm.

[0062] In some embodiments, the first electrode 12 is inserted into the first substrate 11, and the second electrode 22 is inserted into the second substrate 21; conductive wires are inserted into the first substrate 11 and the second substrate 21; the first electrode 12 and the control main board 40 and the second electrode 22 and the control main board 40 are electrically connected by conductive wires (not shown in the figures).

[0063] In this embodiment, the first substrate 11 is based on fabric, and the first electrode 12 and conductive wires are interwoven and disposed on the first substrate 11 by embroidery or knitting. There is no need to set a separate lead-out layer 50. It is equivalent to directly molding the lead-out layer 50 and the first electrode layer 10 onto the fabric. Similarly, the second substrate 21 is based on fabric, and the second electrode 22 and conductive wires are interwoven and disposed on the second substrate 21 by embroidery or knitting. There is no need to set a lead-out layer 50. The lead-out layer 50 and the second electrode layer 20 are directly molded onto the fabric, thereby forming a flexible pressure sensor 100 made of fabric material, improving the flexibility of the sensor.

[0064] In some embodiments, as shown in Figures 1 and 2, the flexible pressure sensor 100 further includes a first insulating layer 81 and a second insulating layer 82. The first insulating layer 81 is attached to the side of the first electrode layer 10 away from the pressure-sensitive layer 30, and the second insulating layer 82 is attached to the side of the second electrode layer 20 away from the pressure-sensitive layer 30. The first insulating layer 81 and the second insulating layer 82 are made of fabric.

[0065] Specifically, the first insulating layer 81 can be fixed to the side of the first electrode layer 10 away from the pressure-sensitive layer 30 by sewing thread, and the second insulating layer 82 can be fixed to the side of the second electrode layer 20 away from the pressure-sensitive layer 30 by sewing thread. The first insulating layer 81 and the second insulating layer 82 provide protection for the first electrode layer 10 and the second electrode layer 20 respectively, preventing the first electrode layer 10 and the second electrode layer 20 from being exposed to the external environment, reducing electrode damage caused by friction, scratching or other factors, and extending the service life of the flexible pressure sensor 100.

[0066] In this embodiment, the first insulating layer 81 and the second insulating layer 82 are made of fabric, which has a certain degree of flexibility. When subjected to external force, they can better adapt to deformation and increase user comfort, reduce friction and discomfort between the flexible pressure sensor 100 and the skin, and improve the user experience.

[0067] In some embodiments, as shown in Figures 1 and 2, the flexible pressure sensor 100 further includes a data cable 101, one end of which is connected to the control motherboard 40, and the other end of which is connected to a plug-in port 102.

[0068] Specifically, the data cable 101 is used to transmit the electrical signals received by the control motherboard 40 to external devices in real time and quickly through the plug-in port 102, so as to facilitate the monitoring and analysis of pressure changes. The plug-in port 102 can connect to various types of external devices, such as computers, data acquisition devices, and displays, enhancing the system's scalability and enabling the flexible pressure sensor 100 to be suitable for different application scenarios and needs.

[0069] Traditional techniques involve screen printing silver paste, gold plating, or carbon plating onto PI or PET films to form flexible circuit boards. However, screen printing silver paste or plating conductive materials requires high-precision equipment and involves processes such as printing, plating, circuit patterning, and etching. These processes are complex and have high manufacturing costs.

[0070] As shown in Figures 8 and 9, this embodiment of the application provides a circuit board assembly 200, which includes a conductive structure 50 and a PCBA board 40. The conductive structure 50 includes a substrate layer 51 and a conductive layer 52. The conductive layer 52 includes multiple conductive wires, which are interlaced along the extension direction of the substrate layer 51. The conductive layer 52 is electrically connected to the PCBA board 40, and the substrate layer 51 can deform under external force. This conductive structure 50 can also be referred to as a lead-out layer 50, and the PCBA board 40 can also be referred to as a control board 40.

[0071] Based on the above technical solution, the substrate layer 51 is made of a flexible material and has a certain degree of flexibility, allowing it to deform under external force. Multiple conductive wires are interlaced along the extension direction of the substrate layer 51 by embroidery to form a conductive layer 52. This allows the conductive structure 50 to deform under external force without affecting its conductivity. The conductive structure 50 is connected to the PCBA board 40 to form a circuit board assembly 200. In this embodiment, the conductive wires are directly interlaced on the substrate layer 51 to form the conductive layer 52, eliminating the need for high-precision equipment to manufacture the conductive structure 50. Compared to screen printing silver paste or electroplating conductive materials on a polymer film, the manufacturing cost of the circuit board assembly 200 in this embodiment is lower, and the process is relatively simpler.

[0072] In this embodiment, the substrate layer 51 can be any material selected from fabric, foam, rubber film, or silicone film, or other flexible substrate materials that can deform under external force, folding or bending. The conductive wire can be a metal wire, such as copper or silver wire, possessing both electrical conductivity and tensile strength. The conductive wire is embroidered on the substrate layer 51, allowing it to deform with the substrate layer 51 while maintaining its electrical conductivity.

[0073] In some embodiments, the conductive wire includes a plurality of first conductive portions and a plurality of second conductive portions (not shown in the figures), with each first conductive portion and each second conductive portion alternately connected; the substrate layer 51 has a first surface and a second surface that are opposite to each other, the first conductive portion is disposed on the first surface of the substrate layer 51, and the second conductive portion is disposed on the second surface of the substrate layer 51.

[0074] Specifically, the first conductive portion and the second conductive portion are alternately disposed on the base layer 51 by embroidery or knitting. Each first conductive portion is spaced apart on the first surface, and each second conductive portion is spaced apart on the second surface, so that the conductive wires are interlaced on the base layer 51. In this embodiment, the embroidery or knitting can be performed by machine or by hand.

[0075] In a specific example, the substrate layer 51 is fabric, and the conductive wire is copper wire. The copper wire is embroidered onto the fabric by a machine to form a conductive structure 50.

[0076] In a specific example, the substrate layer 51 is a rubber film, and the conductive wire is a silver wire. The silver wire is artificially embroidered onto the rubber film to form a conductive structure 50.

[0077] In the above example, the conductive wires are embroidered onto the fabric or rubber film by means of embroidery or knitting. The process is relatively simple and can reduce manufacturing costs.

[0078] In some embodiments, as shown in FIG9, the conductive structure 50 includes an insulating layer 53, which is attached to the surface of the substrate layer 51 and covers the conductive layer 52. The insulating layer 53 can deform under the action of external force.

[0079] Specifically, the insulating layer 53 is a thin insulating film. The insulating film is attached to the surface of the substrate layer 51 by hot pressing or bonding, and the insulating film covers the conductive layer 52, thereby protecting the conductive wire. The insulating film can be deformed under external force, such as bending, stretching or twisting, without affecting the conductivity of the conductive layer 52, so that the conductive structure 50 can be bent or folded.

[0080] In some embodiments, the side of the insulating layer 53 facing the substrate layer 51 is adhesive, or an adhesive element is provided between the insulating layer 53 and the substrate layer 51 (not shown in the figures).

[0081] Specifically, in this embodiment, by selecting an adhesive insulating layer 53 material or providing an adhesive element on the surface of the insulating layer 53, the insulating layer 53 is bonded to the surface of the substrate layer 51, thereby achieving stable adhesion between the insulating layer 53 and the substrate layer 51 and simplifying the manufacturing process.

[0082] In some embodiments, as shown in FIG9, the conductive structure 50 further includes a plurality of terminal pieces 54, which are connected one-to-one with a plurality of conductive wires; the PCBA board 40 includes a plurality of pin headers 41, which are connected one-to-one with a plurality of terminal pieces 54.

[0083] Specifically, terminal 54 is a metal pin made of hard alloy material, such as tungsten carbide (also known as hard alloy), which has high hardness and strength. Each metal pin is connected to a conductive wire by welding or crimping to ensure stable contact between the metal pin and the conductive wire. The pin header 41 of PCBA board 40 is connected to the metal pins, thereby realizing the electrical connection between conductive structure 50 and PCBA board 40.

[0084] In other embodiments, the terminal 54 may also be a conductive wire or a conductive metal sheet, etc. The terminal 54 has conductive properties and realizes the electrical connection between the conductive wire and the pin 41.

[0085] In some embodiments, as shown in Figures 8 and 9, the circuit board assembly 200 further includes a terminal housing 42, which has mounting holes 43, and a plurality of terminal pieces 54 are inserted into the mounting holes 43; the terminal housing 42 is detachably mounted on the PCBA board 40, and the pin header 41 is connected to the terminal pieces 54 in the mounting holes 43.

[0086] Specifically, the terminal housing 42 is a plastic shell with insulating properties. The terminal housing 42 ensures a reliable connection between the terminal 54 and the pin header 41, while also protecting and securing the terminal 54. During long-term use, the terminal housing 42 maintains a stable connection between the terminal 54 and the pin header 41.

[0087] After the terminal piece 54 is connected and fixed to the conductive wire, the terminal piece 54 is inserted into the mounting hole 43 of the terminal housing 42. Then, the terminal housing 42 is assembled onto the PCBA board 40, and the pin header 41 of the PCBA board 40 is connected to the terminal piece 54 of the conductive structure 50 within the mounting hole 43, thereby achieving an electrical connection between the conductive structure 50 and the PCBA board 40. The terminal housing 42 can be fixed to the PCBA board 40 by clips, screws, or other detachable methods.

[0088] Secondly, as shown in FIG10, this application provides a sensor structure, including a sensor module and a circuit board assembly 200. The sensor module includes a first electrode layer 10, a second electrode layer 20 and a pressure-sensitive layer 30. The first electrode layer 10, the pressure-sensitive layer 30 and the second electrode layer 20 are stacked sequentially. A conductive layer 52 is connected between the first electrode layer 10 and the pressure-sensitive layer 30 and between the second electrode layer 20 and the pressure-sensitive layer 30.

[0089] Specifically, the first electrode layer 10 and the second electrode layer 20 are respectively attached to the front and back sides of the pressure-sensitive layer 30. Applying pressure causes the pressure-sensitive layer 30 to generate a resistance signal. The first electrode layer 10 and the second electrode layer 20 transmit the resistance signal to the PCBA board 40 through the conductive layer 52. The PCBA board 40 performs corresponding control according to the change and distribution of the pressure value.

[0090] In some embodiments, the first electrode layer 10, the pressure-sensitive layer 30, and the second electrode layer 20 may deform under the action of external force.

[0091] In this embodiment, the first electrode layer 10, the pressure-sensitive layer 30, and the second electrode layer 20 all have a certain degree of flexibility, and the sensor structure of this embodiment is a flexible pressure sensor. The first electrode layer 10 and the second electrode layer 20 can be made of fabric, and conductive lines are set on the fabric as a substrate to form the electrode layer; the pressure-sensitive layer 30 is made of piezoresistive film or resistive thin film.

[0092] For example, the sensor structure of this embodiment is applied to a smart seat.

[0093] It should be noted that while a single electrode layer on one side of the pressure-sensitive layer 30 can achieve pressure detection, the detection results are not accurate due to incomplete coverage of the conductive lines. Therefore, in this embodiment, a first electrode layer 10 and a second electrode layer 20 are respectively provided on both sides of the pressure-sensitive layer 30. This provides wider coverage of the conductive lines, is applicable to both sides, and results in more accurate pressure detection.

[0094] In some embodiments, as shown in FIG10, the sensor module includes conductive foam 60, the first electrode layer 10 and the conductive layer 52 are electrically connected through the conductive foam 60, and the second electrode layer 20 and the conductive layer 52 are electrically connected through the conductive foam 60.

[0095] It should be noted that conductive foam 60 is a type of foam material with conductive properties, consisting of a flame-retardant sponge wrapped with conductive cloth, or a foam substrate and conductive particles or coating.

[0096] Specifically, a conductive structure 50 is provided between the first electrode layer 10 and the pressure-sensitive layer 30, and a conductive structure 50 is also provided between the second electrode layer 20 and the pressure-sensitive layer 30. The conductive layer 52 transmits the resistance value signals received by the first electrode layer 10 and the second electrode layer 20 to the PCBA board 40. Because the conductive wires in the conductive layer 52 have small diameters and thin thicknesses, the contact between the conductive wires and the first electrode layer 10 and the second electrode layer 20 is unstable. In this embodiment, conductive foam 60 is used to connect the conductive wires. By attaching the conductive foam 60 to the first electrode layer 10 and the second electrode layer 20 respectively, the contact area between the conductive wires and the first electrode layer 10 and the second electrode layer 20 is indirectly expanded, resulting in more stable contact and better reliability.

[0097] In other embodiments, the conductive foam 60 may be replaced with conductive adhesive, conductive rubber block, or conductive fabric, etc.

[0098] In some embodiments, the first electrode layer 10 includes a first substrate and a plurality of first electrodes, the plurality of first electrodes being arranged at intervals on the first substrate; the second electrode layer 20 includes a second substrate and a plurality of second electrodes, the plurality of second electrodes being arranged at intervals on the second substrate, the extension direction of the second electrodes intersecting the extension direction of the first electrodes; the first electrodes and the second electrodes are respectively connected to two sides of the pressure-sensitive layer 30 and electrically connected to the pressure-sensitive layer 30.

[0099] Specifically, the conductive lines of the first electrode layer 10 intersect with the conductive lines of the second electrode layer 20, and the first electrode layer 10 and the second electrode layer 20 are attached to both sides of the pressure-sensitive layer 30 so that both the first electrode and the second electrode are electrically connected to the pressure-sensitive layer 30. Since multiple second electrodes and multiple first electrodes are arranged in an intersecting manner, the conductive lines of the two electrode layers can cover most of the surface of the pressure-sensitive layer 30. The pressure-sensitive layer 30 can sense the pressure applied to each point on the surface and transmit it outward in the form of a resistance value signal, thereby improving the accuracy of pressure detection.

[0100] It should be understood that the term "and / or" as used in this application and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations. It should be noted that, herein, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system.

Claims

A conductive structure, the conductive structure comprising: The base layer is a fabric. A conductive layer comprising multiple conductive filaments, wherein the multiple conductive filaments are embroidered or knitted onto the substrate layer to form the conductive layer; The conductive structure is used to electrically connect with the sensor module and the PCBA board to transmit the signal generated by the sensor module to the PCBA board. The electrically conductive structure according to claim 1, wherein The conductive wire includes a plurality of first conductive portions and a plurality of second conductive portions, wherein each first conductive portion and each second conductive portion are alternately connected; and The substrate layer has a first surface and a second surface that are opposite to each other. The first conductive part is embroidered on the first surface of the substrate layer by means of embroidery or knitting, and the second conductive part is embroidered on the second surface of the substrate layer by means of embroidery or knitting. The electrically conductive structure according to claim 1, wherein The conductive structure includes an insulating layer, which is attached to the surface of the substrate layer and covers the conductive layer by hot pressing or adhesive bonding. The insulating layer can deform under external force. The electrically conductive structure according to claim 3, wherein The side of the insulating layer facing the substrate layer is adhesive; or... An adhesive element is provided between the insulating layer and the substrate layer. The electrically conductive structure according to any one of claims 1 to 4, wherein The conductive structure also includes multiple terminal pieces, each of which is connected to a corresponding conductive wire. The electrically conductive structure according to claim 5, wherein The terminal component includes a conductive wire or a conductive metal sheet. The electrically conductive structure according to claim 5, wherein The terminal component includes a metal pin, which is connected to the conductive wire by welding or crimping. The electrically conductive structure according to claim 7, wherein Each of the metal pins is fixedly connected to one of the conductive wires. A circuit board assembly, the circuit board assembly including the PCBA board and a conductive structure as described in any one of claims 1 to 8, the PCBA board being electrically connected to the conductive structure as described in any one of claims 1 to 8. The circuit board assembly of claim 9, wherein, The PCBA board includes multiple pin headers, each of which is electrically connected to a corresponding conductive wire. A flexible pressure sensor includes a first electrode layer, a second electrode layer, a pressure-sensitive layer, and a control motherboard, wherein the first electrode layer, the pressure-sensitive layer, and the second electrode layer are stacked sequentially. The first electrode layer includes a first substrate and a plurality of first electrodes spaced apart from each other on the first substrate; the second electrode layer includes a second substrate and a plurality of second electrodes spaced apart from each other on the second substrate; and the extending direction of the second electrodes intersects the extending direction of the first electrodes. The first electrode and the second electrode are respectively connected to two sides of the pressure-sensitive layer and electrically connected to the pressure-sensitive layer and the control motherboard; the pressure-sensitive layer is used to generate electrical signals, the first electrode and the second electrode are used to transmit the electrical signals, and the control motherboard is used to receive the electrical signals; and The first substrate, the second substrate, and the pressure-sensitive layer are made of fabric. The flexible pressure sensor of claim 11, wherein, The first electrode and the first substrate are integrally formed, and the second electrode and the second substrate are integrally formed. The flexible pressure sensor of claim 12, wherein, The flexible pressure sensor also includes a lead-out layer. The first electrode and the control motherboard, as well as the second electrode and the control motherboard, are electrically connected through the lead-out layer. The lead-out layer can deform under external force. The flexible pressure sensor of claim 13, wherein, The outgoing layer includes a third substrate and a plurality of conductive wires spaced apart in the third substrate, the conductive wires being interwoven in the third substrate; The first electrode and the control motherboard, as well as the second electrode and the control motherboard, are electrically connected via the conductive wire. as well as The material of the third substrate is fabric. The flexible pressure sensor of claim 14, wherein, The flexible pressure sensor further includes conductive foam, and the first electrode is fixed and electrically connected to the conductive wire through the conductive foam; or, the second electrode is fixed and electrically connected to the conductive wire through the conductive foam. The flexible pressure sensor of claim 15, wherein, The flexible pressure sensor also includes a reinforcing connecting piece, which is fixedly connected to the side of the lead-out layer facing away from the conductive foam. The reinforcing connecting piece is used to strengthen the connection strength between the conductive foam and the conductive wire. The flexible pressure sensor of claim 11, wherein, The first electrode is interposed in the first substrate, and the second electrode is interposed in the second substrate. The flexible pressure sensor of claim 17, wherein, Conductive wires are interlaced on the first substrate and the second substrate; and The first electrode and the control motherboard, as well as the second electrode and the control motherboard, are electrically connected via the conductive wire. The flexible pressure sensor of claim 11, wherein The flexible pressure sensor further includes a first insulating layer and a second insulating layer. The first insulating layer is attached to the side of the first electrode layer away from the pressure-sensitive layer, and the second insulating layer is attached to the side of the second electrode layer away from the pressure-sensitive layer. as well as The first and second insulating layers are made of fabric. The flexible pressure sensor according to any one of claims 11 to 19, wherein The flexible pressure sensor also includes a data cable, one end of which is connected to the control motherboard, and the other end of which is connected to a plug-in port.

Images