Motor, camera module, and electronic device

Abstract

The present application provides a motor, a camera module, and an electronic device. The motor comprises a base, a carrier, a circuit board, and a driver chip. The carrier is movably connected to the base. The circuit board is fixedly connected to the base. The driver chip is fixedly connected to the circuit board and electrically connected to the circuit board. The circuit board comprises a substrate and first pads, and the substrate comprises a first board surface facing away from the base. The substrate is provided with a first recess, and an opening of the first recess is located on the first board surface. The first pads are embedded in the substrate, and at least part of each first pad is located in the first recess. The base comprises first conductive members, and a second soldering surface of each first conductive member extends out from a side surface of the substrate. The first pads are fixedly connected to the second soldering surfaces of the first conductive members by means of first solder joints. In the present application, the first recess is arranged to reduce the thickness of the circuit board, and at least part of each first pad is arranged in the first recess, thereby helping to improve the reliability of soldering between the first pads and the first conductive members.

Description

Motors, camera modules and electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202520177609.X, filed on January 27, 2025, entitled "Motor, Camera Module and Electronic Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic devices, and more particularly to a motor, a camera module, and an electronic device. Background Technology

[0003] Camera modules typically include a motor. The motor supports the lens and drives its movement, enabling image stabilization and focusing. The motor usually consists of a base and a circuit board. The base contains conductive components, which are electrically connected to the circuit board via soldering to transmit signals.

[0004] However, in existing motor structures, the soldering between the conductive components of the base and the circuit board is not strong, which can easily lead to failure of the electrical connection between the conductive components and the circuit board, resulting in a decrease in the reliability of the motor. Summary of the Invention

[0005] This application provides a motor, a camera module, and an electronic device. The soldering effect between the conductive components within the motor's base and the circuit board is good, and the electrical connection between the conductive components and the circuit board is reliable. The camera module and electronic device including this motor have good reliability.

[0006] In a first aspect, embodiments of this application provide a motor. The motor includes a base, a carrier, a circuit board, and a driver chip. The carrier is movably connected to the base, the circuit board is fixedly connected to the base, and the driver chip is fixedly connected to and electrically connected to the circuit board. The circuit board includes a substrate and a first pad. The substrate includes a first plate surface facing away from the base, and the substrate has a first groove. The opening of the first groove is located on the first plate surface. The first pad is embedded in the substrate, and at least a portion of the first pad is located within the first groove. The base includes a first conductive element, and a second welding surface of the first conductive element extends through the side of the substrate. The first pad is fixedly connected to the second welding surface of the first conductive element through a first solder joint.

[0007] It is understood that, in the embodiments of this application, the driver chip is fixedly connected to and electrically connected to the circuit board. The driver chip is electrically connected to the drive mechanism in the motor or other components in the camera module through the circuit board. Therefore, the circuit board has a large number of traces and a large thickness, which affects the reliability of the soldering between the circuit board and the first conductive component.

[0008] This application provides a first groove on the circuit board to reduce the thickness of the circuit board, and at least a portion of the first pad is disposed within the first groove. This results in a smaller distance between the first pad and the second welding surface of the first conductive element in the thickness direction of the circuit board. The first pad and the second welding surface of the first conductive element can be soldered together using a solder ball, thereby reducing the risk of cold solder joints and improving the connection strength between the first pad and the first conductive element. This, in turn, helps ensure the reliability of the electrical connection between the circuit board and the first conductive element.

[0009] In some possible implementations, the first pad includes a first welding surface that is exposed through the bottom wall of the first groove; the first welding surface is fixedly connected to the second welding surface of the first conductive element through a first solder joint.

[0010] It is understood that in this embodiment, the first solder joint can extend from the side of the substrate into the first groove and connect with the first soldering surface, thereby increasing the connection area between the first solder joint and the circuit board, which is beneficial to improving the connection strength between the circuit board and the first conductive component and ensuring the reliability of the electrical connection between the first solder pad and the first conductive component.

[0011] In some possible implementations, the first pad further includes a solder side surface connected to the first solder surface, the solder side surface being exposed relative to the side surface of the substrate; the first solder joint includes a first portion and a second portion, the first portion being fixedly connected to the solder side surface and the second solder surface, and the second portion being fixedly connected to the first solder surface.

[0012] In this embodiment, the first solder joint can also be connected to the first pad through the welding side, thereby increasing the connection area between the first solder joint and the first pad, which is beneficial to improving the connection strength between the first conductive component and the first pad and ensuring the reliability of the electrical connection between the first pad and the first conductive component.

[0013] In some possible implementations, the substrate is further provided with a through hole that penetrates the bottom wall of the first groove, the first plate surface and the side of the substrate; the first welding surface of the first pad is disposed around the edge of the through hole, and the welding side is exposed through the inner wall of the through hole; the second welding surface of the first conductive element is exposed relative to the through hole, and the first part of the first solder joint passes through the through hole.

[0014] In this embodiment, by providing through holes in the substrate and allowing the soldering side of the first pad to be exposed relative to the inner wall of the through holes, the area of ​​the soldering side of the first pad can be increased, thereby increasing the connection area between the first solder joint and the first pad. This is beneficial for improving the connection strength between the first conductive component and the first pad and ensuring the reliability of the electrical connection between the first pad and the first conductive component.

[0015] In some possible implementations, the substrate further includes a second plate surface facing the base, and the first pad further includes a soldering bottom surface exposed relative to the second plate surface. The soldering bottom surface contacts the first conductive element or is fixedly connected to the first conductive element via a first solder joint. This increases the connection area between the first solder joint and the first pad, thereby improving the soldering strength between the first pad and the first conductive element and ensuring the reliability of the electrical connection between the first pad and the first conductive element.

[0016] In some possible implementations, the first groove includes a groove sidewall connected to the bottom wall of the first groove, and the distance between the groove sidewall and the side of the substrate is greater than or equal to 0.5 mm.

[0017] In this embodiment, by setting the distance between the groove sidewall of the first groove and the outer surface of the substrate to be greater than or equal to 0.5 mm, a sufficiently large distance is achieved between the groove sidewall of the first groove and the outer surface of the substrate. This prevents adhesive from covering the first pad when adhesive overflows onto the circuit board, thereby helping to ensure the reliability of the electrical connection between the first pad and the first conductive element.

[0018] In some possible implementations, the substrate includes a first region and a second region, the second region being connected to the first region, a driver chip being fixedly connected to the first region, and a first groove being disposed in the second region; the first region includes a plurality of first wiring layers, which are electrically connected to each other and are electrically connected to the driver chip; the second region includes a plurality of second wiring layers, and the number of second wiring layers is less than the number of first wiring layers, the second wiring layers are electrically connected to the first wiring layers, and the second wiring layers are also electrically connected to a first conductive element through a first pad.

[0019] It is understandable that by removing at least two trace layers on the second region to form the first groove, not only can the thickness of the circuit board be reduced, but the fabrication difficulty of the circuit board is also reduced. Furthermore, in this embodiment, the driver chip is connected to the first region, and the first groove is located in the second region. The motor's structural arrangement is quite reasonable.

[0020] In some possible implementations, there are six first wiring layers arranged sequentially along a first direction, and four second wiring layers arranged sequentially along a first direction from the first surface of the substrate to the base. Along the first direction, the third to sixth first wiring layers are respectively connected to the four second wiring layers one by one, and are disposed on the same layer.

[0021] In this embodiment, by removing the first and second trace layers in the second region of the circuit board along the first direction to form a first groove, the thickness of the circuit board can be reduced. Furthermore, the circuit board structure is relatively simple, and its fabrication is less difficult.

[0022] In some possible implementations, there are six first wiring layers arranged sequentially along a first direction, and two second wiring layers arranged sequentially along a first direction from the first surface of the substrate to the base. Along the first direction, the third and fourth first wiring layers are respectively connected to the two second wiring layers in a one-to-one correspondence and are disposed on the same layer.

[0023] In this embodiment, by removing the first and second trace layers of the second region of the circuit board along the first direction to form a first groove, the thickness of the circuit board can be reduced. Furthermore, by removing the first, second, fifth, and sixth trace layers of the second region of the circuit board, groove structures can be formed on both sides of the second trace layer. The second region of the circuit board can have a symmetrical structure in the first direction, which helps reduce the processing difficulty of the circuit board.

[0024] In some possible implementations, the motor further includes a first anti-shake coil, a first anti-shake magnetic element, a second anti-shake coil, and a second anti-shake magnetic element. The first and second anti-shake coils are fixed to the circuit board at intervals and are both electrically connected to the circuit board. The first and second anti-shake coils are both electrically connected to the driver chip through the circuit board. The carrier includes an anti-shake bracket, which is movably connected to the base. The first and second anti-shake magnetic elements are fixed to the anti-shake bracket at intervals. The first anti-shake coil is disposed facing the first anti-shake magnetic element, and the second anti-shake coil is disposed facing the second anti-shake magnetic element.

[0025] In this embodiment, the driver chip can be electrically connected to the first and second image stabilization coils via a circuit board. The driver chip can be used to control the current in the first and second image stabilization coils, so that the first image stabilization coil, the first image stabilization magnetic component, the second image stabilization coil, and the second image stabilization magnetic component can drive the image stabilization bracket to move relative to the base. It is understood that when the image stabilization bracket moves relative to the base, it can drive the lens to move relative to the base, thereby counteracting the shake generated by the lens and achieving optical image stabilization.

[0026] In some possible implementations, the motor further includes a focusing coil and a focusing magnetic component, the focusing coil being electrically connected to a first conductive component and electrically connected to a driver chip via a circuit board; the carrier further includes a focusing bracket, the focusing bracket being movably connected to an image stabilization bracket, the focusing magnetic component being fixed to the focusing bracket, and the focusing coil being fixed to the image stabilization bracket and facing the focusing magnetic component.

[0027] Understandably, in this embodiment, the first conductive element is electrically connected to the focusing coil, allowing the focusing coil to be electrically connected to the circuit board via the first conductive element. Thus, the driver chip can be electrically connected to the focusing coil via the circuit board. The driver chip can be used to control the current in the focusing coil to drive the focusing bracket to move relative to the base. Understandably, when the focusing bracket moves relative to the base, it can drive the lens to move relative to the base, achieving the focusing function.

[0028] In some possible implementations, the substrate is further provided with a second groove, the opening of the second groove being located on the bottom wall of the first groove, and the first soldering surface being exposed relative to the bottom wall of the second groove; a portion of the first solder joint is located in the second groove and covers the first soldering surface of the first solder pad.

[0029] In this embodiment, a portion of the first solder joint can extend into the second groove and be fixedly connected to the first welding surface, making the connection between the first solder joint and the first pad more secure and preventing the first solder joint from falling off the first pad. This improves the welding strength between the first pad and the first conductive component and ensures the reliability of the electrical connection between the first pad and the first conductive component.

[0030] In some possible implementations, the circuit board further includes a second pad embedded in the substrate and spaced apart from the first pad, with the third soldering surface of the second pad exposed through the first surface of the substrate; the base further includes a second conductive element spaced apart from the first conductive element, with the fourth soldering surface of the second conductive element protruding relative to the first surface of the substrate; the third soldering surface of the second pad can be fixedly connected to the fourth soldering surface of the second conductive element through a second solder joint.

[0031] In this embodiment, by providing a fourth welding surface for the second conductive element that protrudes relative to the first surface of the substrate, the connection area between the second solder joint and the second conductive element can be increased, which is beneficial to improving the connection strength between the second solder pad and the second conductive element and ensuring the reliability of the electrical connection between the circuit board and the second conductive element.

[0032] In some possible implementations, the substrate includes an outer side and an inner side, a second welding surface of the first conductive element extends through the outer side of the substrate, and a portion of the fourth welding surface of the second conductive element is disposed opposite to the inner side of the substrate.

[0033] In this embodiment, the first solder joint can utilize one side of the outer surface of the substrate to solder the circuit board to the first conductive component. This makes more efficient use of space. Furthermore, at least a portion of the fourth soldering surface of the second conductive component is positioned opposite the inner surface of the substrate, thus preventing the second conductive component from occupying excessive space inside the base. Simultaneously, it also avoids obstructing other components of the motor.

[0034] Secondly, embodiments of this application provide a camera module. The camera module includes a lens and the aforementioned motor, with the lens mounted on a carrier. This camera module offers superior reliability.

[0035] In some possible implementations, the camera module also includes a variable aperture, which is mounted on the lens. This allows the amount of light entering the camera module to be adjusted by changing the size of the variable aperture's opening.

[0036] In some possible implementations, the variable aperture is electrically connected to a circuit board, and the variable aperture is electrically connected to a driver chip via the circuit board. In this way, the driver chip can control the size of the light-gathering aperture of the variable aperture via the circuit board, thereby adjusting the amount of light entering the camera module.

[0037] Thirdly, embodiments of this application provide an electronic device. The electronic device includes a device housing and the aforementioned camera module, with the camera module disposed within the device housing. This electronic device exhibits superior reliability. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0039] Figure 1 is a schematic diagram of the structure of the electronic device provided in this application in some embodiments;

[0040] Figure 2 is a schematic cross-sectional view of the electronic device shown in Figure 1 cut along point AA in some embodiments;

[0041] Figure 3 is a schematic diagram of the structure of some embodiments of the camera module shown in Figure 1;

[0042] Figure 4 is a partially exploded view of some embodiments of the camera module shown in Figure 3;

[0043] Figure 5 is a partial exploded view of the motor shown in Figure 4 in some embodiments;

[0044] Figure 6 is a structural schematic diagram of the base shown in Figure 5 in some embodiments;

[0045] Figure 7 is a partial exploded view of the base shown in Figure 6 in some embodiments;

[0046] Figure 8 is a structural schematic diagram of the first conductive element shown in Figure 7 in some embodiments;

[0047] Figure 9 is a schematic diagram of a partial cross-sectional structure of the base shown in Figure 6 cut along BB in some embodiments;

[0048] Figure 10 is a structural schematic diagram of the base shown in Figure 6 from another angle;

[0049] Figure 11 is a schematic diagram of the structure of the second conductive element shown in Figure 7 in some embodiments;

[0050] Figure 12 is a schematic diagram of a partial cross-sectional structure of the base shown in Figure 6 cut along CC in some embodiments;

[0051] Figure 13 is a schematic diagram of the circuit board shown in Figure 5 in some embodiments;

[0052] Figure 14 is a partial exploded view of the circuit board shown in Figure 13 in some embodiments;

[0053] Figure 15A is a schematic diagram of a partial cross-sectional structure of the circuit board shown in Figure 14 cut along DD in some embodiments;

[0054] Figure 15B is a schematic diagram of a partial cross-sectional structure of the circuit board shown in Figure 15A in some embodiments;

[0055] Figure 16 is a schematic diagram of a partial cross-sectional structure of the circuit board shown in Figure 14 cut along DD in some other embodiments;

[0056] Figure 17A is a schematic diagram of the structure of the base and circuit board shown in Figure 5 in some embodiments;

[0057] Figure 17B is a schematic diagram of the assembly structure of the base and circuit board shown in Figure 17A;

[0058] Figure 18 is a schematic diagram of a partial cross-sectional structure of the motor shown in Figure 17B in some embodiments, cut along EE.

[0059] Figure 19 is a schematic diagram of a partial cross-sectional structure of the motor shown in Figure 17B in some embodiments, cut along FF.

[0060] Figure 20 is a schematic diagram of a partial cross-sectional structure of the motor shown in Figure 17B in some embodiments, cut along point GG.

[0061] Figure 21 is a partial structural schematic diagram of the motor shown in Figure 4 in some embodiments;

[0062] Figure 22 is a partial structural schematic diagram of the motor shown in Figure 4 in some embodiments;

[0063] Figure 23 is a partial structural schematic diagram of the motor shown in Figure 4 in some embodiments;

[0064] Figure 24 is a schematic diagram of a partial cross-sectional structure of the motor shown in Figure 23, cut along HH.

[0065] Figure 25 is a partial structural schematic diagram of the motor shown in Figure 4 in some embodiments;

[0066] Figure 26 is a partial structural schematic diagram of the motor shown in Figure 4 in some embodiments;

[0067] Figure 27 is a schematic diagram of part of the motor structure shown in Figure 26 from another angle;

[0068] Figure 28 is a schematic diagram of a partial cross-sectional structure of the motor shown in Figure 4, cut along the JJ point in some embodiments. Specific Implementation

[0069] The embodiments of this application are described below with reference to the accompanying drawings.

[0070] In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an electrical connection or a mechanical connection. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. "Movable connection" refers to a connection where the relative positional relationship can change after connection.

[0071] The directional terms mentioned in the embodiments of this application, such as "top," "bottom," "inner," "outer," and "side," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0072] In the embodiments of this application, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," "fourth," "fifth," and "sixth" may explicitly or implicitly include one or more of that feature.

[0073] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0074] References or "some embodiments" as described in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in some embodiments," "in other embodiments," "in still others," "in yet others," etc., appearing in different parts of this specification do not necessarily refer to the same embodiments, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0075] The terms “including,” “having,” and their variations all mean “including but not limited to,” unless otherwise specifically emphasized. The term “multiple” means at least two.

[0076] The terms "parallel" and "perpendicular" are relative to the current technological level, not absolute mathematical definitions. Slight deviations are permissible; approximations of parallelism or perpendicularity are acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, with the angle between them ranging from 0° to 10°. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, with the angle between them ranging from 80° to 100°.

[0077] It is understood that the specific embodiments described herein are merely illustrative of related embodiments and not intended to limit the scope of those embodiments. Furthermore, it should be noted that, for ease of description, only the parts relevant to the embodiments are shown in the accompanying drawings.

[0078] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0079] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0080] Please refer to Figure 1, which is a schematic diagram of the structure of the electronic device 1000 provided in this application in some embodiments.

[0081] In some embodiments, the electronic device 1000 can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR headset, virtual reality (VR) glasses, or VR headset, or other devices with camera functionality. The electronic device 1000 in the embodiment shown in Figure 1 is illustrated using a mobile phone as an example.

[0082] Please refer to Figures 1 and 2. Figure 2 is a schematic cross-sectional view of the electronic device 1000 shown in Figure 1 cut along point AA in some embodiments.

[0083] In some embodiments, the electronic device 1000 may include a camera module 100, a device housing 200, and a screen 300. The camera module 100 may be a rear-facing camera module or a front-facing camera module. It should be noted that FIG1 and the related accompanying drawings only schematically illustrate some components included in the electronic device 1000; the actual shape, size, position, and structure of these components are not limited to FIG1 and the accompanying drawings. Furthermore, when the electronic device 1000 is a device of other forms, the electronic device 1000 may not include the screen 300.

[0084] The device housing 200 may include a frame 201 and a rear cover 202. The rear cover 202 is fixed to the frame 201. For example, the rear cover 202 may be fixedly connected to the frame 201 by means of adhesive, snap-fit, or other methods. The rear cover 202 may also be integrally formed with the frame 201, that is, the rear cover 202 and the frame 201 are a single integral structure.

[0085] In some embodiments, the screen 300 may be located on the side of the bezel 201 away from the back cover 202. In this case, the screen 300 and the back cover 202 may be located on opposite sides of the bezel 201. The screen 300, the bezel 201, and the back cover 202 together enclose the interior of the electronic device 1000. The interior of the electronic device 1000 can be used to house components of the electronic device 1000, such as a battery, receiver, or microphone. The screen 300 may be a flat screen or a curved screen.

[0086] For example, the camera module 100 may be located inside the electronic device 1000. The camera module 100 may be located on the side of the screen 300 facing the rear cover 202. The rear cover 202 may have a light-transmitting hole 203. The shape of the light-transmitting hole 203 is not limited to the circle shown in Figure 1. The light-transmitting hole 203 connects the interior of the electronic device 1000 to the exterior of the electronic device 1000. Light from the exterior of the electronic device 1000 can enter the interior of the electronic device 1000 through the light-transmitting hole 203. The camera module 100 can capture the light entering the interior of the electronic device 1000.

[0087] Please refer to Figures 3 and 4. Figure 3 is a structural schematic diagram of some embodiments of the camera module 100 shown in Figure 1, and Figure 4 is a partially exploded schematic diagram of some embodiments of the camera module 100 shown in Figure 3.

[0088] In some embodiments, the camera module 100 includes a motor 1 and a lens 2. The lens 2 is mounted on the motor 1. The lens 2 can be used to capture ambient light. The optical axis of the lens 2 can be parallel to the Z-axis. The optical axis of the lens 2 and the optical axis of the camera module 100 can be the same direction. It is understood that the camera module 100 may include more or fewer components; for example, the camera module 100 may also include a module circuit board, and / or an image sensor, and / or electronic components, and / or filters, and / or a variable aperture, etc.

[0089] It is understood that, for ease of description, the width direction of the camera module 100 is defined as the Y-axis, the length direction as the X-axis, and the height direction as the Z-axis, with the X, Y, and Z axes being perpendicular to each other. In other embodiments, the coordinate system of the camera module 100 can be flexibly set according to specific actual needs.

[0090] It is understood that motor 1 can be a focusing motor. In this case, motor 1 can control the movement of lens 2 along the Z-axis to achieve autofocus (AF). Motor 1 can also be an image stabilization motor. In this case, motor 1 can control the movement of lens 2 along a plane perpendicular to the Z-axis (i.e., the XY plane). When the camera module 100 collects ambient light, if the electronic device 1000 experiences shaking in the XY plane due to external forces, motor 1 can control the movement of lens 2 in the XY plane to counteract the shaking travel of lens 2, thereby avoiding or reducing the positional offset of lens 2 caused by shaking. In other words, the camera module 100 of this application can control the movement of lens 2 in the XY plane through motor 1 to achieve optical image stabilization (OIS) of the camera module 100, improving the image quality of the camera module 100. Motor 1 can also be a motor integrating image stabilization and focusing. In this case, motor 1 can achieve both autofocus and optical image stabilization by controlling lens 2. This embodiment is described using the example of a motor 1 that is an integrated image stabilization and focusing motor.

[0091] It is understood that motor 1 can be a motor driven by the force generated by the interaction of a coil and a magnetic component. The driving force of motor 1 can be a force used to drive lens 2 to focus, and / or a force used to drive lens 2 to stabilize image. When motor 1 integrates image stabilization and focusing, the force driving lens 2 to focus and the force driving lens 2 to stabilize image can be different, but at least one of these forces must be a force generated by the interaction of a coil and a magnetic component. For example, the force driving lens 2 to focus is a force generated by the interaction of a coil and a magnetic component, while the force driving lens 2 to stabilize image can be a force generated by the interaction of a coil and a magnetic component, or it can be a force generated by other structural components (such as the stretching force of shape memory alloy (SMA)).

[0092] The above text, with reference to the accompanying diagrams, provides a general overview of the camera module's structure. The following text, also with reference to the accompanying diagrams, will detail the motor's structure.

[0093] Please refer to Figure 5, which is a partial exploded view of the motor 1 shown in Figure 4 in some embodiments.

[0094] In some embodiments, the motor 1 may include a base 11, a carrier 12, a drive mechanism 13, a circuit board 14, a drive chip 15, and a housing 16. The carrier 12 may include an image stabilization bracket 121 and a focusing bracket 122. The drive mechanism 13 may include an image stabilization drive assembly 131 and a focusing drive assembly 132. The image stabilization drive assembly 131 may include a first image stabilization coil 1311, a first image stabilization magnetic element 1312, a second image stabilization coil 1313, and a second image stabilization magnetic element 1314. The focusing drive assembly 132 may include a focusing coil 1321, a focusing magnetic element 1322, and a focusing circuit board 1323. The structure of the carrier 12 and the drive mechanism 13 will be described in detail below with reference to the accompanying drawings, but will not be elaborated further here.

[0095] It is understood that Figure 5 only schematically shows some of the components included in motor 1, and the actual shape, size, location, and construction of these components are not limited to those shown in Figure 5. Motor 1 may include more or fewer components; for example, motor 1 may also exclude housing 16.

[0096] Please refer to Figures 6 and 7. Figure 6 is a structural schematic diagram of the base 11 shown in Figure 5 in some embodiments, and Figure 7 is a partial exploded view of the base 11 shown in Figure 6 in some embodiments.

[0097] In some embodiments, the base 11 may include a base plate 111, a first conductive element 112, a second conductive element 113, and a metal insert 114. The base plate 111 may be an insulating element, for example, it may be made of plastic. The first conductive element 112, and / or the second conductive element 113, and / or the metal insert 114 may be made of copper, aluminum, silver, gold, stainless steel, etc. The number of first conductive elements 112 may be four. The number of second conductive elements 113 may be two. In other examples, the number of first conductive elements 112 may be one, two, three, or more than four. The number of second conductive elements 113 may be one or more than two. This application does not impose strict limitations on these aspects.

[0098] In some embodiments, the base plate 111 may include a top surface 1111 and a bottom surface 1112 disposed opposite to each other. For example, the top surface 1111 and the bottom surface 1112 of the base plate 111 may be disposed opposite to each other in the Z-axis direction. The base plate 111 may be provided with a first mounting hole 1110. The first mounting hole 1110 may penetrate through the top surface 1111 and the bottom surface 1112 of the base plate 111. In this case, the base plate 111 may be generally frame-shaped.

[0099] For example, the base plate 111 may include a first side 1113, a second side 1114, and a third side 1115 connected sequentially. The first side 1113 and the third side 1115 are disposed opposite to each other. It is understood that the first side 1113, the second side 1114, and the third side 1115 may form a first mounting hole 1110. It is understood that a portion of the top surface 1111 of the base plate 111 may be located at the first side 1113, a portion at the second side 1114, and a portion at the third side 1115. A portion of the bottom surface 1112 of the base plate 111 may be located at the first side 1113, a portion at the second side 1114, and a portion at the third side 1115.

[0100] For example, the base plate 111 may further include a fourth side portion 1116. The fourth side portion 1116 may connect to the first side portion 1113 and the third side portion 1115. For example, the fourth side portion 1116 may be connected to the end of the first side portion 1113 and the third side portion 1115 that is away from the second side portion 1114. The fourth side portion 1116 of the base plate 111 may include an inner side surface 1116a and an outer side surface 1116b that are disposed opposite to each other.

[0101] It is understood that the first side 1113, the second side 1114, the third side 1115, and the fourth side 1116 can be divided in multiple ways. This application does not limit the specific division method of the first side 1113, the second side 1114, the third side 1115, and the fourth side 1116.

[0102] For example, the base plate 111 may be provided with a through hole 1117. The through hole 1117 may penetrate the top surface 1111 and the bottom surface 1112 of the base plate 111. A portion of the through hole 1117 may be located at the first side 1113, and a portion may be located at the second side 1114. In some other examples, the through hole 1117 may also be located at other locations on the base plate 111, which is not strictly limited in this application.

[0103] In some embodiments, at least a portion of the metal insert 114 may be embedded within the base plate 111. The metal insert 114 may be used to increase the overall strength of the base 11. Exemplarily, the metal insert 114 may be provided with a mounting groove 1141. At least a portion of the mounting groove 1141 may be exposed relative to the through hole 1117 of the base plate 111.

[0104] Please refer to Figure 8, which is a schematic diagram of the structure of the first conductive element 112 shown in Figure 7 in some embodiments. It is understood that Figure 8 mainly shows the structure of one of the first conductive elements 112 in Figure 7. The structures of the other three first conductive elements 112 are the same as or similar to the structure of the first conductive element 112 shown in Figure 8. The structures of the other three first conductive elements 112 can be referred to the relevant description in Figure 8, and will not be repeated here.

[0105] In some embodiments, the first conductive element 112 may include a first main body portion 1121, a first connecting end 1122, and a second connecting end 1123. The first main body portion 1121 may be connected between the first connecting end 1122 and the second connecting end 1123.

[0106] For example, the first connection end 1122 may include a second welding surface 1122a.

[0107] For example, the first main body 1121 may include a first part 1121a and a second part 1121b, wherein the second part 1121b is connected to the first part 1121a and is bent relative to the first part 1121a. For example, the first part 1121a and the second part 1121b are schematically outlined with dashed lines in FIG8. The end of the first part 1121a away from the second part 1121b can be connected to a first connecting end 1122, and the end of the second part 1121b away from the first part 1121a can be connected to a second connecting end 1123.

[0108] Please refer to Figures 8 and 9. Figure 9 is a schematic diagram of a partial cross-sectional structure of the base 11 shown in Figure 6 cut along BB in some embodiments.

[0109] In some embodiments, the first conductive element 112 may be embedded in the base plate 111, and a portion of the first conductive element 112 may be exposed relative to the base plate 111. It is understood that the base plate 111 and the second conductive element 113 may be formed into an integral structural component by means of in-mold injection molding or similar methods. For example, four first conductive elements 112 are spaced apart.

[0110] For example, the first portion 1121a of the first main body 1121 may be embedded in the first edge 1113 of the base plate 111. A portion of the first portion 1121a may protrude from the top surface 1111 of the base plate 111. In some other examples, the first portion 1121a may also be located inside the base plate 111, that is, the first portion 1121a may not protrude from the base plate 111.

[0111] For example, the first connecting end 1122 may be embedded in the first edge 1113 of the base plate 111, and a portion of the first connecting end 1122 may protrude from the top surface 1111 of the base plate 111. For instance, the second welding surface 1122a of the first connecting end 1122 may protrude from the top surface 1111 of the base plate 111. It is understood that the second welding surface 1122a may be flush with the top surface 1111 of the base plate 111, may be recessed relative to the top surface 1111 of the base plate 111, or may protrude from the top surface 1111 of the base plate 111; this application does not impose strict limitations on this.

[0112] Please refer to Figures 8 and 10. Figure 10 is a structural schematic diagram of the base 11 shown in Figure 6 from another angle.

[0113] In some embodiments, the second portion 1121b of the first main body 1121 may be embedded in the fourth side portion 1116 of the base plate 111. A portion of the second portion 1121b may protrude from the outer side 1116b of the fourth side portion 1116. In other examples, the second portion 1121b may also be located inside the base plate 111, that is, the second portion 1121b may not protrude from the base plate 111.

[0114] For example, the second connecting end 1123 can be embedded in the fourth side portion 1116 of the base plate 111, and a portion of the second connecting end 1123 protrudes from the outer surface 1116b of the fourth side portion 1116. For example, the second connecting end 1123 can protrude from the outer surface 1116b of the fourth side portion 1116. It is understood that the second connecting end 1123 can be flush with the outer surface 1116b of the fourth side portion 1116, or it can be recessed relative to the outer surface 1116b of the fourth side portion 1116, or it can protrude from the outer surface 1116b of the fourth side portion 1116. This application does not impose strict limitations on this.

[0115] Please refer to Figure 11, which is a schematic diagram of the structure of the second conductive element 113 shown in Figure 7 in some embodiments. It is understood that Figure 11 mainly shows the structure of one second conductive element 113 in Figure 7. The structure of another second conductive element 113 is the same as or similar to the structure of the second conductive element 113 shown in Figure 11. The structure of the other second conductive element 113 can be referred to the relevant description in Figure 11, and will not be repeated here.

[0116] In some embodiments, the second conductive element 113 may include a second main body portion 1131, a third connecting end 1132, and a fourth connecting end 1133. The second main body portion 1131 may be connected between the third connecting end 1132 and the fourth connecting end 1133.

[0117] For example, the third connection end 1132 may include a fourth welding surface 1132a.

[0118] For example, the second main body 1131 may include a third part 1131a and a fourth part 1131b, wherein the fourth part 1131b is connected to the third part 1131a and is bent relative to the third part 1131a. The fourth part 1131b is schematically outlined with a dashed box in Figure 11. The end of the third part 1131a away from the fourth part 1131b can be connected to a third connecting end 1132, and the end of the fourth part 1131b away from the third part 1131a can be connected to a fourth connecting end 1133.

[0119] Referring to Figures 10 and 11, in some embodiments, the second conductive element 113 may be embedded in the base plate 111 and spaced apart from the first conductive element 112. A portion of the second conductive element 113 may be exposed relative to the base plate 111. It is understood that the base plate 111 and the second conductive element 113 can be formed into an integral structural component by methods such as in-mold injection molding. For example, two second conductive elements 113 are spaced apart.

[0120] For example, the fourth portion 1131b of the second main body 1131 can be embedded in the fourth side portion 1116 of the base plate 111. A portion of the fourth portion 1131b can protrude from the outer side 1116b of the fourth side portion 1116. In some other examples, the fourth portion 1131b can also be located inside the base plate 111, that is, the fourth portion 1131b may not protrude from the base plate 111.

[0121] For example, the fourth connecting end 1133 can be embedded in the fourth side portion 1116 of the base plate 111, and a portion of the fourth connecting end 1133 can protrude from the outer surface 1116b of the fourth side portion 1116. For example, the fourth connecting end 1133 can protrude from the outer surface 1116b of the fourth side portion 1116. It is understood that the fourth connecting end 1133 can be flush with the outer surface 1116b of the fourth side portion 1116, or it can be recessed relative to the outer surface 1116b of the fourth side portion 1116, or it can protrude from the outer surface 1116b of the fourth side portion 1116. This application does not impose strict limitations on this.

[0122] Please refer to Figures 11 and 12. Figure 12 is a schematic diagram of a partial cross-sectional structure of the base 11 shown in Figure 6 cut along CC in some embodiments.

[0123] In some embodiments, a third portion 1131a of the second main body portion 1131 of a second conductive element 113 may be embedded in the first edge portion 1113 of the base plate 111. A third connecting end 1132 may be embedded in the first edge portion 1113 of the base plate 111, and a portion of the third connecting end 1132 may protrude from the top surface 1111 of the base plate 111. In this case, at least a portion of the fourth welding surface 1132a of the third connecting end 1132 may be exposed through the top surface 1111 of the base plate 111.

[0124] For example, the third portion 1131a of the second main body portion 1131 of another second conductive element 113 can be embedded in the second side portion 1114 and the third side portion 1115 of the base plate 111. The third connecting end 1132 can be embedded in the second side portion 1114 of the base plate 111, and a portion of the third connecting end 1132 can protrude from the top surface 1111 of the base plate 111. At this time, at least a portion of the fourth welding surface 1132a of the third connecting end 1132 can be exposed through the top surface 1111 of the base plate 111.

[0125] In some other embodiments, the base 11 may also not include the second conductive element 113.

[0126] In some other embodiments, the base 11 may also not include the metal insert 114.

[0127] Please refer to Figures 13 and 14. Figure 13 is a schematic diagram of the structure of the circuit board 14 shown in Figure 5 in some embodiments, and Figure 14 is a partial exploded view of the structure of the circuit board 14 shown in Figure 13 in some embodiments.

[0128] In some embodiments, the circuit board 14 may include a substrate 141 and a first pad 142. The substrate 141 may be generally L-shaped. The substrate 141 may include a first surface 1411 and a second surface 1412 disposed opposite to each other. The substrate 141 may also include an outer side surface 1413 and an inner side surface 1414. Both the outer side surface 1413 and the inner side surface 1414 of the substrate 141 are connected between the first surface surface 1411 and the second surface surface 1412. The inner side surface 1414 of the substrate 141 is closer to the center of the motor 1 than the outer side surface 1413 of the substrate 141. It is understood that both the outer side surface 1413 and the inner side surface 1414 of the substrate 141 are sides 1410 of the substrate 141.

[0129] In some embodiments, the substrate 141 is provided with a first groove 1415. The opening of the first groove 1415 is located on the first plate surface 1411 and extends to the outer side surface 1413 of the substrate 141. The first groove 1415 may include a bottom wall 1415a and a groove sidewall 1415b, and the groove sidewall 1415b of the first groove 1415 is connected to the bottom wall 1415a of the first groove 1415.

[0130] For example, the distance between the groove sidewall 1415b of the first groove 1415 and the side surface 1410 of the substrate 141 is greater than or equal to 0.5 mm. For instance, the distance between the groove sidewall 1415b of the first groove 1415 and the outer side surface 1413 is greater than or equal to 0.5 mm. In Figure 14, the distance between the groove sidewall 1415b of the first groove 1415 and the outer side surface 1413 of the substrate 141 is schematically indicated by a dashed double-arrowed line.

[0131] In some embodiments, the substrate 141 further includes through holes 1416. The through holes 1416 can penetrate the bottom wall 1415a of the first groove 1415, the second surface 1412 of the substrate 141, and the outer surface 1413. In this case, the through holes 1416 can communicate with the first groove 1415. In some examples, the number of through holes 1416 can be four, spaced apart. In other embodiments, the number of through holes 1416 can be one, two, three, or more than four; this application does not impose strict limitations on this.

[0132] In some embodiments, the substrate 141 may further be provided with a second groove 1417. The opening of the second groove 1417 is located on the bottom wall 1415a of the first groove 1415 and extends to the outer surface 1413 of the substrate 141. The second groove 1417 may surround and communicate with the through hole 1416. In some examples, the number of second grooves 1417 may be four, with each of the four second grooves 1417 corresponding to one of the four through holes 1416. In other embodiments, the number of second grooves 1417 may be one, two, three, or more than four, and this application does not impose strict limitations on this.

[0133] In some embodiments, the substrate 141 may further be provided with a third groove 1418. The opening of the third groove 1418 may be located on the second surface 1412 of the substrate 141 and extend to the outer surface 1413 of the substrate 141. The third groove 1418 may surround and communicate with the through hole 1416. In some examples, the number of third grooves 1418 may be four, with each of the four third grooves 1418 corresponding to one of the four through holes 1416. In other embodiments, the number of third grooves 1418 may be one, two, three, or more than four, and this application does not impose strict limitations on this.

[0134] Referring to Figures 13 and 14, in some embodiments, a first pad 142 is embedded in a substrate 141. At least a portion of the first pad 142 may be located within a first recess 1415. It is understood that the first pad 142 may be entirely or partially located within the first recess 1415. For example, a portion of the first pad 142 may be located within the first recess 1415, a portion within a through-hole 1416, and a portion within a second recess 1417.

[0135] For example, the first pad 142 may include a first soldering surface 1421, a soldering side surface 1422, and a soldering bottom surface 1423. The first soldering surface 1421 and the soldering bottom surface 1423 are disposed facing away from each other, and the soldering side surface 1422 is connected between the first soldering surface 1421 and the soldering bottom surface 1423. The first soldering surface 1421 of the first pad 142 may be exposed through the bottom wall 1415a of the first groove 1415. For example, the first soldering surface 1421 of the first pad 142 may be located within the second groove 1417 and disposed around the through hole 1416.

[0136] The soldering side 1422 of the first pad 142 can be exposed relative to the side 1410 of the substrate 141. For example, the soldering side 1422 of the first pad 142 can be exposed through the inner wall of the through hole 1416. In this case, the soldering side 1422 of the first pad 142 can be exposed relative to the outer side 1413 of the substrate 141.

[0137] The soldering bottom surface 1423 of the first solder pad 142 may be exposed relative to the second surface 1412 of the substrate 141. For example, the soldering bottom surface 1423 of the first solder pad 142 may be located within the third groove 1418 and disposed around the through hole 1416.

[0138] In some embodiments, the circuit board 14 may further include a second pad 143. The second pad 143 is embedded in the substrate 141 and spaced apart from the first pad 142. Exemplarily, the second pad 143 may include a third soldering surface 1431. The third soldering surface 1431 of the second pad 143 is exposed through the first surface 1411 of the substrate 141.

[0139] For example, the second pad 143 is closer to the inner side 1414 of the substrate 141 than the outer side 1413 of the substrate 141. In some examples, the third solder surface 1431 may extend to the inner side 1414 of the substrate 141.

[0140] For example, the number of second pads 143 can be two, and the two second pads 143 are spaced apart. In some other examples, the number of second pads 143 can also be one or more than two, and this application does not strictly limit this.

[0141] In some embodiments, the circuit board 14 may further include a third pad 144 and a fourth pad 145. Both the third pad 144 and the fourth pad 145 are embedded in the substrate 141 and spaced apart from the first pad 142 and the second pad 143. Exemplarily, the soldering surfaces of both the third pad 144 and the fourth pad 145 may be exposed on the first surface 1411 of the substrate 141.

[0142] For example, there can be two third pads 144, which can be located on opposite sides of the first groove 1415. There can also be two fourth pads 145, which are spaced apart.

[0143] Please continue referring to Figures 13 and 14. In some embodiments, the substrate 141 may include a first region 14A and a second region 14B, with the second region 14B connected to the first region 14A. A first groove 1415 is located in the second region 14B. It is understood that, from the direction of the first surface 1411 of the substrate 141 towards the second surface 1412, the second region 14B may be recessed relative to the first region 14A. In this case, the area where the first groove 1415 is located on the substrate 141 is the second region 14B. The through-hole 1416, the second groove 1417, the third groove 1418, and the first pad 142 of the substrate 141 may all be located in the second region 14B of the substrate 141. For example, the second pad 143, the third pad 144, and the fourth pad 145 may all be located in the first region 14A of the substrate 141.

[0144] Please refer to Figure 15A, which is a schematic diagram of a partial cross-sectional structure of the circuit board 14 shown in Figure 14 cut along DD in some embodiments.

[0145] In some embodiments, a first region 14A of the circuit board 14 includes a plurality of first trace layers 141A. The plurality of first trace layers 141A are electrically connected to each other. It is understood that the plurality of first trace layers 141A can be electrically connected using interlayer connection methods known in the prior art. For example, conductive pathways can be formed by creating holes in the plurality of first trace layers 141A and plating silver or copper inside the holes.

[0146] For example, the number of first wiring layers 141A can be six. The six first wiring layers 141A are arranged sequentially along a first direction. The first direction extends from the first surface 1411 of the substrate 141 to the second surface 1412. It is understood that the first direction is the Z-axis direction. For example, along the first direction, the first region 14A may include a first first wiring layer L1, a second first wiring layer L2, a third first wiring layer L3, a fourth first wiring layer L4, a fifth first wiring layer L5, and a sixth first wiring layer L6. For example, the thickness of the first region 14A in the first direction can be approximately in the range of 0.32 mm to 0.34 mm.

[0147] In some other examples, the number of first routing layers 141A may be more than six. Multiple first routing layers 141A are arranged sequentially along a first direction.

[0148] For example, the material of the first wiring layer 141A may include metals such as copper, silver, and gold, or other materials with good conductivity.

[0149] Please refer to Figures 15A and 15B. Figure 15B is a schematic diagram of a partial cross-sectional structure of the circuit board 14 shown in Figure 15A in some embodiments.

[0150] In some embodiments, the first region 14A may further include a first substrate 142A. Along the first direction, the first substrate 142A may be located between the third first trace layer L3 and the fourth first trace layer L4, and fixedly connected to the third first trace layer L3 and the fourth first trace layer L4. It is understood that the first region 14A can be processed by copper plating, etching, or other processes on the first substrate 142A to obtain the desired circuit pattern, thereby forming multiple first trace layers 141A on both sides of the first substrate 142A.

[0151] For example, the material of the first substrate 142A may include polyimide (PI), polyethylene terephthalate (PET), etc.

[0152] In some embodiments, the first region 14A may further include two first protective films 143A. The material of the first protective film 143A may include polyimide. Along the first direction, the first first protective film 143A may be located between the second first wiring layer L2 and the third first wiring layer L3, and may be fixedly connected to the third first wiring layer L3 by adhesive; the second first protective film 143A may be located between the fourth first wiring layer L4 and the fifth first wiring layer L5, and may be fixedly connected to the fourth first wiring layer L4 by adhesive.

[0153] In some embodiments, the first region 14A may further include a plurality of first plating layers 144A. The material of the first plating layers 144A may include copper, tin, etc. The first plating layers 144A can be used to improve the conductivity of the circuit board 14.

[0154] For example, the number of first plating layers 144A can be four. Along the first direction, the first first plating layer 144A can be located on the side of the first first wiring layer L1 away from the second first wiring layer L2, and is fixedly connected to the first first wiring layer L1; the second first plating layer 144A can be located between the first first wiring layer L1 and the second first wiring layer L2, and is fixedly connected to the second first wiring layer L2; the third first plating layer 144A can be located between the fifth first wiring layer L5 and the sixth first wiring layer L6, and is fixedly connected to the fifth first wiring layer L5; the fourth first plating layer 144A can be located on the side of the sixth first wiring layer L6 away from the fifth first wiring layer L5, and is fixedly connected to the sixth first wiring layer L6.

[0155] In some embodiments, the first region 14A may further include a plurality of first insulating layers 145A. The material of the first insulating layer 145A may include polypropylene (PP), polyimide (PI), etc.

[0156] For example, the number of first insulating layers 145A can be four. Along the first direction, the first first insulating layer 145A can be located between the first first routing layer L1 and the second first routing layer L2, and is fixedly connected to the first first routing layer L1; the second first insulating layer 145A can be located between the second first routing layer L2 and the third first routing layer L3, and is fixedly connected to the second first routing layer L2; the third first insulating layer 145A can be located between the fourth first routing layer L4 and the fifth first routing layer L5, and is fixedly connected to the fifth first routing layer L5; the fourth first insulating layer 145A can be located between the fifth first routing layer L5 and the sixth first routing layer L6, and is fixedly connected to the sixth first routing layer L6.

[0157] In other embodiments, the layer structure of the first region 14A may also have other design schemes, which are not strictly limited in this application.

[0158] Please continue referring to Figures 15A and 15B. In some embodiments, the second region 14B includes multiple second trace layers 141B, and the number of second trace layers 141B is less than the number of first trace layers 141A. The second trace layers 141B electrically connect the first trace layer 141A and the first pad 142. For example, the material of the second trace layers 141B may include metals such as copper, silver, and gold, or other materials with good conductivity.

[0159] It is understood that in this embodiment, the circuit board 14 may include multiple wiring layers. By removing at least two wiring layers in a certain area of ​​the circuit board 14, a first groove 1415 is formed. The area forming the first groove 1415 is the second area 14B, and the remaining areas are the first area 14A. For example, the circuit board 14 may include at least six wiring layers, and the multiple wiring layers are arranged sequentially in a first direction. By removing at least two wiring layers in a certain area of ​​the circuit board 14 to form the first groove 1415, the thickness of the circuit board 14 can be reduced. Furthermore, the circuit board 14 is easier to manufacture. Additionally, the first area 14A can be used to connect the driver chip 15. The structure of the motor 1 is reasonably designed. It is understood that when a wiring layer in the second area 14B is removed, the insulating layer and plating layer connecting that wiring layer are also removed accordingly.

[0160] For example, the number of second routing layers 141B can be four. The four second routing layers 141B are arranged sequentially along the first direction. For example, along the first direction, the second region 14B may include a first second routing layer F1, a second second routing layer F2, a third second routing layer F3, and a fourth second routing layer F4. For example, the thickness of the second region 14B in the first direction can be approximately 0.21 mm.

[0161] For example, along the first direction, the four second routing layers 141B are respectively connected to the third to sixth first routing layers 141A one by one, and are arranged on the same layer. In other words, along the first direction, the first second routing layer F1 is connected to the third first routing layer L3 and is arranged on the same layer; the second second routing layer F2 is connected to the fourth first routing layer L4 and is arranged on the same layer; the third second routing layer F3 is connected to the fifth first routing layer L5 and is arranged on the same layer; the fourth second routing layer F4 is connected to the sixth first routing layer L6 and is arranged on the same layer.

[0162] It is understood that in this embodiment, the circuit board 14 may include six wiring layers, and the multiple wiring layers are arranged sequentially in the first direction. By removing the first and second wiring layers of the second region 14B of the circuit board 14 along the first direction to form the first groove 1415, the thickness of the circuit board 14 can be reduced. Furthermore, the structure of the circuit board 14 is relatively simple, and the processing difficulty of the circuit board 14 is relatively low.

[0163] In other examples, the number of second routing layers 141B can also be one, two, or three. When the number of second routing layers 141B is two or three, the two or three second routing layers 141B are arranged sequentially along the first direction.

[0164] In some embodiments, the second region 14B may further include a second substrate 142B. The material of the second substrate 142B may include polyimide (PI), polyethylene terephthalate (PET), etc. Along the first direction, the second substrate 142B may be located between the first second wiring layer F1 and the second second wiring layer F2, and fixedly connect the first second wiring layer F1 and the second second wiring layer F2. Exemplarily, the second substrate 142B may be connected to and disposed in the same layer as the first substrate 142A.

[0165] In some embodiments, the second region 14B may further include two second protective films 143B. The material of the second protective films 143B may include polyimide (PI). Along the first direction, the first second protective film 143B may be located on the side of the first second wiring layer F1 away from the second second wiring layer F2, and may be fixedly connected to the first second wiring layer F1 by adhesive; the second second protective film 143B may be located between the second second wiring layer F2 and the third second wiring layer F3, and may be fixedly connected to the second second wiring layer F2 by adhesive. The first second protective film 143B may be connected to and co-layered with the first first protective film 143A. The second second protective film 143B may be connected to and co-layered with the second first protective film 143A.

[0166] In some embodiments, the second region 14B may further include multiple second plating layers 144B. The material of the second plating layers 144B may include copper, tin, etc. The second plating layers 144B can be used to improve the conductivity of the circuit board 14.

[0167] For example, there can be two second plating layers 144B. Along the first direction, the first second plating layer 144B can be located between the third second wiring layer F3 and the fourth second wiring layer F4, and is fixedly connected to the third second wiring layer F3; the second second plating layer 144B can be located on the side of the fourth second wiring layer F4 away from the third second wiring layer F3, and is fixedly connected to the fourth second wiring layer F4. The first second plating layer 144B can be connected to and disposed in the same layer as the third first plating layer 144A. The second second plating layer 144B can be connected to and disposed in the same layer as the fourth first plating layer 144A.

[0168] In some embodiments, the second region 14B may further include a plurality of second insulating layers 145B. The material of the second insulating layer 145B may include polypropylene (PP), polyimide (PI), etc.

[0169] For example, there can be two second insulating layers 145B. Along the first direction, the first second insulating layer 145B can be located between the second second wiring layer F2 and the third second wiring layer F3, and is fixedly connected to the third second wiring layer F3; the second second insulating layer 145B can be located between the third second wiring layer F3 and the fourth second wiring layer F4, and is fixedly connected to the fourth second wiring layer F4. The first second insulating layer 145B can be connected to and disposed in the same layer as the third first insulating layer 145A. The second second plating layer 144B can be connected to and disposed in the same layer as the fourth first insulating layer 145A.

[0170] In other embodiments, the layer structure of the second region 14B may also have other design schemes, which are not strictly limited in this application.

[0171] In the embodiment of the application, the second region 14B is formed by removing two trace layers to create the first groove 1415. To prevent adhesive from overflowing and covering the first pad 142 after the trace layers are removed, this embodiment sets the distance between the groove sidewall 1415b of the first groove 1415 and the outer surface 1413 of the substrate 141 to be greater than or equal to 0.5 mm. In other words, the trace layers of the circuit board 14 are recessed to avoid this, so that there is a sufficiently large distance between the groove sidewall 1415b of the first groove 1415 and the outer surface 1413 of the substrate 141. This makes it less likely for adhesive to overflow and cover the first pad 142, which helps to ensure the reliability of the electrical connection between the first pad 142 and the first conductive element 112.

[0172] In some embodiments, the number of first pads 142 is the same as the number of second trace layers 141B in the second region 14B. Each first pad 142 corresponds to and is electrically connected to each second trace layer 141B.

[0173] Please refer to Figure 16, which is a partial cross-sectional view of the circuit board 14 shown in Figure 14 cut along DD in some other embodiments. It is understood that the circuit board 14 shown in Figure 16 is similar to the circuit boards 14 shown in Figures 15A and 15B. The following mainly describes the differences between the two, and the most common aspects of the two will not be repeated.

[0174] In some embodiments, the number of first routing layers 141A can be six. The structure of the first region 14A is the same as that of the first region 14A in the embodiments shown in FIG15A and FIG15B, and can be referred to the relevant descriptions in FIG15A and FIG15B, which will not be repeated here.

[0175] In some embodiments, the number of second routing layers 141B can be two. The two second routing layers 141B are arranged sequentially along a first direction. It is understood that, along the first direction, the second region 14B may include a first second routing layer F1 and a second second routing layer F2. It is understood that, in this embodiment, the circuit board 14 may include at least six routing layers, and the multiple routing layers are arranged sequentially along the first direction. A first groove 1415 is formed by removing at least two routing layers from a certain region of the circuit board 14. The region forming the first groove 1415 is the second region 14B, and the remaining regions are the first region 14A. It is understood that when a routing layer in the second region 14B is removed, the insulating layer and plating layer connecting that routing layer, and other stacked structures, are also removed accordingly.

[0176] It is understood that in this embodiment, by removing the first and second trace layers of the second region 14B of the circuit board 14 to form the first groove 1415 along the first direction, the thickness of the circuit board 14 can be reduced. Furthermore, the structure of the circuit board 14 is relatively simple, and its processing is less difficult.

[0177] For example, along the first direction, the two second routing layers 141B are respectively connected to the third and fourth first routing layers 141A, and are arranged on the same layer. In other words, along the first direction, the first second routing layer F1 is connected to the third first routing layer L3, and is arranged on the same layer; the second second routing layer F2 is connected to the fourth first routing layer L4, and is arranged on the same layer.

[0178] It is understood that the circuit board 14 may include six routing layers, and the routing layers are arranged sequentially in the first direction. Along the first direction, by removing the first, second, fifth, and sixth routing layers of the second region 14B of the circuit board 14, the remaining two second routing layers 141B of the second region 14B can be suspended. At this time, a first groove 1415 can be formed on one side of the two second routing layers 141B, and a groove structure can also be formed on the other side. Thus, the second region 14B of the circuit board 14 can have a symmetrical structure in the first direction, which helps to reduce the processing difficulty of the circuit board 14.

[0179] In other examples, the number of second routing layers 141B can also be one, three, or four. When the number of second routing layers 141B is three or four, the three or four second routing layers 141B are arranged sequentially along the first direction.

[0180] In some embodiments, the second region 14B may further include a second substrate 142B. The material of the second substrate 142B may include polyimide (PI), polyethylene terephthalate (PET), etc. Along the first direction, the second substrate 142B may be located between the first second wiring layer F1 and the second second wiring layer F2, and fixedly connect the first second wiring layer F1 and the second second wiring layer F2. Exemplarily, the second substrate 142B may be connected to and disposed in the same layer as the first substrate 142A.

[0181] In some embodiments, the second region 14B may further include two second protective films 143B. The material of the second protective films 143B may include polyimide (PI). Along the first direction, the first second protective film 143B may be located on the side of the first second wiring layer F1 away from the second second wiring layer F2, and may be fixedly connected to the first second wiring layer F1 by adhesive; the second second protective film 143B may be located on the side of the second second wiring layer F2 away from the first second wiring layer F1, and may be fixedly connected to the second second wiring layer F2 by adhesive. The first second protective film 143B may be connected to and co-layered with the first first protective film 143A. The second second protective film 143B may be connected to and co-layered with the second first protective film 143A.

[0182] It is understood that the above description, in conjunction with the accompanying drawings (Figures 15A to 16), introduced two stack-up structures for the circuit board 14. It is also understood that, in addition to the two embodiments described above, the stack-up structure of the first region 14A and the second region 14B of the circuit board 14 can be other structures. The number of the first routing layer 141A and / or the second routing layer 141B of the circuit board 14, the correspondence between the first routing layer 141A and the second routing layer 141B, and the connection relationships, etc., can all be adjusted according to requirements.

[0183] Please refer to Figures 17A and 17B. Figure 17A is a structural schematic diagram of the base 11 and circuit board 14 shown in Figure 5 in some embodiments, and Figure 17B is a schematic diagram of the assembly structure of the base 11 and circuit board 14 shown in Figure 17A.

[0184] In some embodiments, the circuit board 14 is fixedly connected to the base 11. For example, the substrate 141 of the circuit board 14 can be fixedly connected to the top surface 1111 of the base plate 111 by adhesive. In this case, the first surface 1411 of the substrate 141 can face away from the base 11.

[0185] For example, the second welding surface 1122a of the first conductive element 112 can extend through the outer side surface 1413 of the substrate 141, that is, the second welding surface 1122a of the first conductive element 112 can extend through the side surface 1410 of the substrate 141.

[0186] For example, the second soldering surface 1122a of the first conductive element 112 may be exposed relative to the through hole 1416 of the circuit board 14.

[0187] Please refer to Figures 17B and 18 in conjunction. Figure 18 is a partial cross-sectional view of the structure of the motor 1 shown in Figure 17B in some embodiments, taken along EE. Exemplarily, Figure 17B mainly shows the assembly structure of the base 11 and circuit board 14 of the motor 1.

[0188] In some embodiments, the first pad 142 can be fixedly connected to the first conductive element 112 of the base 11 of the first solder joint 17. It is understood that, in this embodiment, the second trace layer 141B of the second region 14B can be electrically connected to the first conductive element 112 via the first pad 142.

[0189] For example, the first soldering surface 1421 of the first pad 142 can be fixedly connected to the second soldering surface 1122a of the first conductive element 112 via the first solder point 17. In this way, the first conductive element 112 can be electrically connected to the circuit board 14 via the first solder point 17. Furthermore, the first solder point 17 can extend from the side surface 1410 of the substrate 141 into the first groove 1415 and connect with the first soldering surface 1421, thereby increasing the connection area between the first solder point 17 and the circuit board, which helps to improve the connection strength between the circuit board 14 and the first conductive element 112, ensuring the reliability of the electrical connection between the first pad 142 and the first conductive element 112. For example, the first solder point 17 can extend from the outer side surface 1413 of the substrate 141 into the first groove 1415. The first solder point 17 can utilize one side space of the outer side surface 1413 of the substrate 141 to achieve the soldering of the circuit board 14 and the first conductive element 112. The motor 1 makes more efficient use of space.

[0190] In some embodiments, the first solder joint 17 is formed by welding a single solder ball. Compared to a solution where the solder joint is formed by stacking at least two solder balls, the first solder joint 17 in this embodiment can avoid the risk of cold solder joints caused by stacked solder balls.

[0191] For example, the first solder joint 17 may include a first portion 171 and a second portion 172. The first portion 171 and the second portion 172 are schematically divided by dashed lines in Figure 18. The first portion 171 of the first solder joint 17 can pass through the through hole 1416 and is fixedly connected to the welding side surface 1422 of the first pad 142 and the second welding surface 1122a of the first conductive element 112. In this embodiment, the first solder joint 17 can be connected to the first pad 142 through the welding side surface 1422, thereby increasing the connection area between the first solder joint 17 and the first pad 142. This improves the connection strength between the first conductive element 112 and the first pad 142, ensuring the reliability of the electrical connection between the first pad 142 and the first conductive element 112.

[0192] In this embodiment, by providing a through hole 1416 and allowing the welding side 1422 of the first pad 142 to be exposed relative to the inner wall of the through hole 1416, the area of ​​the welding side 1422 of the first pad 142 can be increased, thereby increasing the connection area between the first solder joint 17 and the first pad 142. This is beneficial to improving the connection strength between the first conductive element 112 and the first pad 142, and ensuring the reliability of the electrical connection between the first pad 142 and the first conductive element 112.

[0193] In this embodiment, a portion of the first part 171 of the first solder joint 17 may also be located within the third groove 1418, and fixedly connect the welding bottom surface 1423 of the first solder pad 142 and the second welding surface 1122a of the first conductive element 112. This increases the connection area between the first solder joint 17 and the first solder pad 142, thereby improving the welding strength between the first solder pad 142 and the first conductive element 112, and ensuring the reliability of the electrical connection between the first solder pad 142 and the first conductive element 112. In other embodiments, the welding bottom surface 1423 of the first solder pad 142 may also contact the first welding surface 1421 of the first conductive element 112.

[0194] In this embodiment, the second portion 172 of the first solder joint 17 is fixedly connected to the first welding surface 1421 of the first solder pad 142. The second portion 172 of the first solder joint 17 can extend into the second groove 1417 and be fixedly connected to the first welding surface 1421, making the connection between the first solder joint 17 and the first solder pad 142 more secure. This prevents the first solder joint 17 from easily detaching from the first solder pad 142, thereby improving the welding strength between the first solder pad 142 and the first conductive element 112 and ensuring the reliability of the electrical connection between the first solder pad 142 and the first conductive element 112.

[0195] For example, the second portion 172 of the first solder joint 17 may be located within the second groove 1417 and cover the first welding surface 1421 of the pad. It is understood that the second portion 172 of the first solder joint 17 can completely cover the first welding surface 1421, thereby increasing the connection area between the first solder joint 17 and the first pad 142, improving the welding strength between the first pad 142 and the first conductive element 112, and ensuring the reliability of the electrical connection between the first pad 142 and the first conductive element 112.

[0196] In some other embodiments, the second portion 172 of the first solder joint 17 may also partially cover the first solder surface 1421.

[0197] Please refer to Figure 19, which is a schematic diagram of a partial cross-sectional structure of the motor 1 shown in Figure 17B in some embodiments, cut along FF.

[0198] In some embodiments, the third connection end 1132 of the second conductive element 113 may be located inside the base plate 111. For example, at least a portion of the third connection end 1132 of the second conductive element 113 may be located within the first mounting hole 1110. A portion of the fourth welding surface 1132a of the second conductive element 113 may be disposed opposite to the inner surface 1414 of the substrate 141.

[0199] In this embodiment, by bending the third connection end 1132 of the second conductive element 113 towards the inner side surface 1414 of the substrate 141, a portion of the fourth welding surface 1132a of the second conductive element 113 is positioned opposite to the inner side surface 1414 of the substrate 141, thereby preventing the second conductive element 113 from occupying too much space inside the base 11. Simultaneously, it also avoids obstructing the motor 1 or other components of the camera module 100.

[0200] For example, a portion of the fourth welding surface 1132a of the second conductive element 113 may protrude beyond the first surface 1411 of the substrate 141. At least a portion of the second solder joint 18 is located between the third welding surface 1431 of the second pad 143 and the fourth welding surface 1132a of the second conductive element 113, and is fixedly connected to the third welding surface 1431 and the fourth welding surface 1132a. At this time, the second conductive element 113 can be fixedly connected to the circuit board 14 through the second solder joint 18 and electrically connected to the circuit board 14. In this embodiment, the portion of the fourth welding surface 1132a of the second conductive element 113 may protrude beyond the first surface 1411 of the substrate 141, which can increase the connection area between the second solder joint 18 and the second conductive element 113, which is beneficial to improving the connection strength between the second pad 143 and the second conductive element 113 and ensuring the reliability of the electrical connection between the circuit board 14 and the second conductive element 113.

[0201] Please refer to Figures 20 and 21. Figure 20 is a partial cross-sectional view of the motor 1 shown in Figure 17B in some embodiments, taken along section GG. Figure 21 is a partial structural view of the motor 1 shown in Figure 4 in some embodiments. Exemplarily, Figure 21 mainly shows the assembly structure of the base 11 and the drive chip 15 of the motor 1.

[0202] In some embodiments, the driver chip 15 is fixedly connected to and electrically connected to the circuit board 14. Exemplarily, at least a portion of the driver chip 15 may be located within the mounting groove 1141 of the base 11 and exposed relative to the through hole 1117 of the base 11. The driver chip 15 is disposed opposite to and fixedly connected to the first region 14A of the circuit board 14.

[0203] It is understood that, in this embodiment of the application, compared to the camera module 100 where the driver chip 15 is located outside the motor 1, this application places the driver chip 15 on the base 11, allowing the driver chip 15 to be fixedly connected to the circuit board 14 and electrically connected to the circuit board 14. In this way, the circuit board 14 does not need to have additional complex wiring extending to the outside of the motor 1 to electrically connect to the driver chip 15, resulting in a simpler structure and better reliability of the electrical connection between the circuit board 14 and the driver chip 15.

[0204] It is understood that in this embodiment, the driver chip 15 is electrically connected to the drive mechanism 13 or other components within the camera module 100 via the circuit board 14. Therefore, the circuit board 14 has a large number of traces and a relatively large thickness, affecting the soldering reliability between the circuit board 14 and the first conductive element 112. For example, the first region 14A of the circuit board 14 may include at least six first trace layers 141A. The first region 14A has a relatively large thickness in the first direction, requiring at least two solder balls to be stacked to achieve soldering between the circuit board 14 and the first conductive element 112, which easily leads to cold solder joints. The first direction extends from the first surface 1411 of the substrate 141 towards the base 11.

[0205] This application provides a first groove 1415 on the circuit board 14, for example, by reducing the trace layer of the second region 14B of the circuit board 14 to form the first groove 1415, thereby reducing the thickness of the circuit board. Furthermore, at least a portion of the first pad 142 is disposed within the first groove 1415 for soldering to the first conductive element 112. Thus, in the first direction, the distance between the first pad 142 and the second soldering surface 1122a of the first conductive element 112 is smaller, allowing soldering between the first pad 142 and the second soldering surface 1122a of the first conductive element 112 to be achieved using a single solder ball. This reduces the risk of cold solder joints and improves the connection strength between the first pad 142 and the first conductive element 112, thereby ensuring the reliability of the electrical connection between the circuit board 14 and the first conductive element 112. Simultaneously, by reducing the distance between the first pad 142 and the second soldering surface 1122a of the first conductive element 112, the soldering effect can be observed vertically under a microscope.

[0206] Please refer to Figure 22, which is a partial structural schematic diagram of the motor 1 shown in Figure 4 in some embodiments. Exemplarily, Figure 22 mainly shows the assembly structure of the base 11, circuit board 14, first anti-shake coil 1311 and second anti-shake coil 1313.

[0207] In some embodiments, the first anti-shake coil 1311 and the second anti-shake coil 1313 can be fixedly connected to the first surface 1411 of the substrate 141. The first anti-shake coil 1311 and the second anti-shake coil 1313 are spaced apart and both are spaced apart from the first groove 1415. The two terminals of the first anti-shake coil 1311 can be electrically connected to the two third pads 144 of the circuit board 14, thereby allowing the first anti-shake coil 1311 to be electrically connected to the driver chip 15 (see Figure 21). The two terminals of the second anti-shake coil 1313 can be electrically connected to the two fourth pads 145 of the circuit board 14, thereby allowing the second anti-shake coil 1313 to be electrically connected to the driver chip 15.

[0208] Please refer to Figures 22 to 24. Figure 23 is a partial structural schematic diagram of the motor 1 shown in Figure 4 in some embodiments, and Figure 24 is a partial cross-sectional schematic diagram of the motor 1 shown in Figure 23 cut along HH. Exemplarily, Figures 23 and 24 mainly show the assembly structure of the base 11, circuit board 14, anti-shake drive assembly 131, and anti-shake bracket 121.

[0209] In some embodiments, the image stabilization bracket 121 is movably connected to the base 11. Exemplarily, the image stabilization bracket 121 may include a first bracket 1211 and a second bracket 1212. Exemplarily, the base 11 may have three first mounting slots 115, and the first bracket 1211 may have three second mounting slots 1213 (only two second mounting slots 1213 are schematically shown in Figure 24). The three second mounting slots 1213 of the first bracket 1211 correspond one-to-one with the three first mounting slots 115 of the base 11. The motor 1 may also include three first balls 191, which correspond one-to-one with the three first mounting slots 115 and one-to-one with the three second mounting slots 1213. A portion of each first ball 191 may be partially located within the corresponding first mounting slot 115, and a portion may be located within the corresponding second mounting slot 1213. In this case, the first bracket 1211 can be movably connected to the base 11 via the three second balls 192. For example, the first mounting groove 115 can limit and guide the first ball 191, so that the first bracket 1211 can slide relative to the base 11 along the Y-axis direction.

[0210] For example, the first bracket 1211 may also be provided with three third mounting slots 1214 (only two third mounting slots 1214 are schematically shown in Figure 24). The third mounting slots 1214 are arranged opposite to the second mounting slots 1213. The second bracket 1212 may be provided with three fourth mounting slots 1215 (only two fourth mounting slots 1215 are schematically shown in Figure 24). The three fourth mounting slots 1215 of the second bracket 1212 are arranged one-to-one with the three third mounting slots 1214 of the first bracket 1211. The motor 1 may also include three second balls 192, which are arranged one-to-one with the three third mounting slots 1214 and one-to-one with the three fourth mounting slots 1215. A portion of each second ball 192 may be located in the corresponding third mounting slot 1214, and a portion may be located in the corresponding fourth mounting slot 1215. At this time, the second bracket 1212 can be movably connected to the first bracket 1211 via three second balls 192, thereby being movably connected to the base 11. For example, the third groove 1418 can limit and guide the second balls 192, so that the second bracket 1212 can slide relative to the base 11 in the X-axis direction.

[0211] It is understood that in some other embodiments, the image stabilization bracket 121 may also have other structures. The image stabilization bracket 121 may also be movably connected to the base 11 using a sliding shaft structure or other structures. This application does not impose strict limitations on this.

[0212] In some embodiments, both the first stabilizing magnetic element 1312 and the second stabilizing magnetic element 1314 (see Figure 5) can be mounted on the stabilization bracket 121. Both the first stabilizing magnetic element 1312 and the second stabilizing magnetic element 1314 can be magnets or magnetic components. The first stabilizing magnetic element 1312 can include at least two opposite polarity directions. For example, the first stabilizing magnetic element 1312 can include three magnets arranged along the X-axis. It is understood that the polarity direction can be from the North Pole (N) to the South Pole (S), or from the South Pole (S) to the North Pole (N). The second stabilizing magnetic element 1314 includes at least two opposite polarity directions. For example, the second stabilizing magnetic element 1314 can include three magnets arranged along the Y-axis.

[0213] For example, the first stabilization coil 1311 and the first stabilization magnetic element 1312 are arranged in the Z-axis direction, with the first stabilization coil 1311 facing the first stabilization magnetic element 1312, for driving the stabilization bracket 121 to move relative to the base 11 in the X-axis direction. Here, "the first stabilization coil 1311 facing the first stabilization magnetic element 1312" means that the winding plane of the first stabilization coil 1311 faces the first stabilization magnetic element 1312. For example, the winding plane of the first stabilization coil 1311 can be parallel to the XY plane.

[0214] For example, the second stabilization coil 1313 and the second stabilization magnetic element 1314 are arranged in the Z-axis direction, and the second stabilization coil 1313 is disposed facing the second stabilization magnetic element 1314, for driving the stabilization bracket 121 to move relative to the base 11 in the second direction Y.

[0215] It is understood that, driven by the first image stabilization coil 1311, the first image stabilization magnetic component 1312, the second image stabilization coil 1313, and the second image stabilization magnetic component 1314, the image stabilization bracket 121 can drive the lens 2 (see Figure 3) to move relative to the base 11 along the X-axis and / or Y-axis directions, thereby counteracting the shake generated by the lens 2 in the XY plane, realizing optical image stabilization of the camera module 100, and improving the imaging quality of the camera module 100. In this embodiment, the driving chip 15 can be electrically connected to the first image stabilization coil 1311 and the second image stabilization coil 1313 through the circuit board 14. The driving chip 15 can be used to control the current on the first image stabilization coil 1311 and the second image stabilization coil 1313 to drive the image stabilization bracket 121 to move relative to the base 11, thereby realizing the optical image stabilization function of the camera module 100.

[0216] Please refer to Figures 25 to 27. Figure 25 is a partial structural schematic diagram of the motor 1 shown in Figure 4 in some embodiments; Figure 26 is a partial structural schematic diagram of the motor 1 shown in Figure 4 in some embodiments; and Figure 27 is a partial structural schematic diagram of the motor 1 shown in Figure 26 from another angle. Exemplarily, Figure 25 mainly shows the assembly structure of the base 11, the image stabilization bracket 121, the focusing coil 1321, and the focusing circuit board 1323. Figures 26 and 27 mainly show the assembly structure of the base 11, the image stabilization bracket 121, the focusing coil 1321, the focusing circuit board 1323, and the focusing bracket 122.

[0217] In some embodiments, the focusing circuit board 1323 can be fixedly connected to the base 11 and the image stabilization bracket 121. For example, a portion of the focusing circuit board 1323 can be fixedly connected to the second connection terminal 1123 of the first conductive element 112 and electrically connected to the first conductive element 112. The focusing coil 1321 can be electrically connected to the circuit board 14 through the first conductive element 112, thereby electrically connected to the driver chip 15. In this way, the driver chip 15 can be used to control the current on the focusing coil 1321 to drive the image stabilization bracket 121 to move relative to the base 11, thereby enabling the focusing function of the camera module 100.

[0218] For example, a portion of the focusing circuit board 1323 may be fixedly connected to the fourth connection terminal 1133 of the second conductive element 113, and electrically connected to the second conductive element 113. The focusing coil 1321 may be electrically connected to the circuit board 14 through the second conductive element 113, thereby being electrically connected to the driver chip 15.

[0219] For example, a portion of the focusing circuit board 1323 may be fixedly connected to the image stabilization bracket 121 and located inside the image stabilization bracket 121. For example, the focusing circuit board 1323 may be a flexible circuit board.

[0220] For example, the focusing coil 1321 can be fixedly connected to and electrically connected to the focusing circuit board 1323. For example, the focusing coil 1321 can be located on the side of the focusing circuit board 1323 away from the image stabilization bracket 121. The focusing coil 1321 can be electrically connected to the first conductive element 112 and the second conductive element 113 via the focusing circuit board 1323. In other examples, the camera module 100 can also electrically connect the focusing coil 1321 to the first conductive element 112 and the second conductive element 113 via a structure such as wires.

[0221] In some embodiments, the focusing bracket 122 may be slidably connected to the image stabilization bracket 121.

[0222] For example, the focusing bracket 122 may be generally frame-shaped and has a mounting space 1221. The mounting space 1221 can be used to mount the lens 2 (see Figure 3). The focusing bracket 122 may also include two slides 1222. The two slides 1222 may be positioned opposite to the mounting space 1221 and spaced apart. For example, the image stabilization bracket 121 may be generally frame-shaped and has a second mounting hole 1216. The image stabilization bracket 121 may have two sliding posts 1217. The two sliding posts 1217 are spaced apart and may be located on both sides of the focusing coil 1321.

[0223] For example, the focusing bracket 122 can be located within the second mounting hole 1216 of the image stabilization bracket 121. The two sliding grooves 1222 of the focusing bracket 122 can be correspondingly arranged with the two sliding posts 1217 of the image stabilization bracket 121, with a portion of each sliding post 1217 located within the corresponding sliding groove 1222. In this way, the focusing bracket 122 can slide relative to the sliding posts 1217 along the Z-axis, thereby allowing it to move relative to the base 11 along the Z-axis.

[0224] In other embodiments, the positions of the sliding column 1217 and the sliding groove 1222 can also be interchanged.

[0225] In some embodiments, the focusing magnetic element 1322 (see Figure 5) can be fixedly connected to the focusing bracket 122. The focusing magnetic element 1322 can be a magnet or a magnetic component. In this embodiment, the focusing magnetic element 1322 includes two magnets arranged along the Z-axis. Exemplarily, the focusing coil 1321 can be correspondingly arranged with the focusing magnetic element 1322. For example, the focusing coil 1321 is arranged facing the focusing magnetic element 1322 to drive the focusing bracket 122 to move relative to the image stabilization bracket 121 along the Z-axis. When the focusing bracket 122 moves relative to the image stabilization bracket 121 along the Z-axis, the focusing bracket 122 can drive the lens 2 mounted thereon to move along the Z-axis. At this time, the motor 1 can realize the autofocus of the camera module 100.

[0226] Understandably, in this embodiment, the first conductive element 112 is used to electrically connect with the focusing coil 1321 of the drive mechanism 13, so that the focusing coil 1321 can be electrically connected to the circuit board 14 through the first conductive element 112. Thus, the drive chip 15 can be electrically connected to the focusing coil 1321 through the circuit board 14. The drive chip 15 can be used to control the current on the focusing coil 1321 to drive the focusing bracket 122 to move relative to the base 11, thereby enabling the focusing function of the camera module 100.

[0227] In other embodiments, the first conductive element 112 may also be used to electrically connect to the image stabilization coil (e.g., the first image stabilization coil 1311 and / or the second image stabilization coil 1313), such that the image stabilization coil can be electrically connected to the circuit board 14 via the first conductive element 112, thereby electrically connecting to the driver chip 15. In this way, the driver chip 15 can be used to control the current on the image stabilization coil to drive the image stabilization bracket 121 to move relative to the base 11, thereby enabling the optical image stabilization function of the camera module 100.

[0228] In other embodiments, the camera module 100 may further include a variable aperture (not shown), which may be mounted on the lens 2. The first conductive element 112 may also be used for electrical connection with the variable aperture, allowing the variable aperture to be electrically connected to the circuit board 14 via the first conductive element 112, thereby electrically connecting to the driver chip 15. In this way, the driver chip 15 can control the size of the light-gathering aperture of the variable aperture via the circuit board 14, thereby adjusting the amount of light entering the camera module 100. Furthermore, the electrical connection between the driver chip 15 and the variable aperture has good reliability.

[0229] Please refer to Figure 28, which is a schematic diagram of a partial cross-sectional structure of the motor 1 shown in Figure 4 cut along JJ in some embodiments.

[0230] In some embodiments, the housing 16 may be generally square-shaped. The housing 16 is provided with a through hole 161. Part of the structure of the motor 1 may be exposed through the through hole 161.

[0231] For example, the housing 16 can be adapted to the shape of the motor 1, and the housing 16 can be mounted on the base 11. The housing 16 can be fixedly connected to the base 11 by means of adhesive or other methods. The housing 16 can be assembled and fitted with the base 11 to jointly encapsulate and protect the internal structure of the motor 1. For example, the focusing bracket 122 (see Figure 27) and part of the lens 2 can be exposed through the through hole 161 of the housing 16.

[0232] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0233] The above are merely some embodiments of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A motor (1), characterized in that, It includes a base (11), a carrier (12), a circuit board (14), and a driver chip (15). The carrier (12) is movably connected to the base (11), the circuit board (14) is fixedly connected to the base (11), and the driver chip (15) is fixedly connected to the circuit board (14) and electrically connected to the circuit board (14). The circuit board (14) includes a substrate (141) and a first pad (142). The substrate (141) includes a first plate surface (1411) facing away from the base (11). The substrate (141) is provided with a first groove (1415). The opening of the first groove (1415) is located on the first plate surface (1411). The first pad (142) is embedded in the substrate (141). At least a portion of the first pad (142) is located in the first groove (1415). The base (11) includes a first conductive element (112), and the second welding surface (1122a) of the first conductive element (112) extends through the side surface (1410) of the substrate (141). The first pad (142) is fixedly connected to the second welding surface (1122a) of the first conductive element (112) via the first solder point (17).

2. The motor (1) according to claim 1, characterized in that, The first pad (142) includes a first welding surface (1421), which is exposed through the bottom wall (1415a) of the first groove (1415); The first welding surface (1421) is fixedly connected to the second welding surface (1122a) of the first conductive element (112) through the first welding point (17).

3. The motor (1) according to claim 2, characterized in that, The first pad (142) further includes a soldering side surface (1422), which is connected to the first soldering surface (1421) and is exposed relative to the side surface (1410) of the substrate (141). The first weld point (17) includes a first part (171) and a second part (172). The first part (171) is fixedly connected to the welding side surface (1422) and the second welding surface (1122a), and the second part (172) is fixedly connected to the first welding surface (1421).

4. The motor (1) according to claim 3, characterized in that, The substrate (141) is also provided with a through hole (1416), which penetrates the bottom wall (1415a) of the first groove (1415), the first plate surface (1411) and the side surface (1410) of the substrate (141). The first welding surface (1421) of the first pad (142) is arranged around the edge of the through hole (1416), and the welding side surface (1422) is exposed through the inner wall of the through hole (1416); The second welding surface (1122a) of the first conductive element (112) is exposed relative to the through hole (1416), and the first portion (171) of the first solder joint (17) passes through the through hole (1416).

5. The motor (1) according to claim 1, characterized in that, The substrate (141) further includes a second plate surface (1412) facing the base (11). The first pad (142) further includes a soldering bottom surface (1423) exposed relative to the second plate surface (1412). The soldering bottom surface (1423) is in contact with the first conductive element (112) or fixedly connected to the first conductive element (112) through the first solder point (17).

6. The motor (1) according to claim 1, characterized in that, The first groove (1415) includes a groove sidewall (1415b) connected to the bottom wall (1415a) of the first groove (1415), and the distance between the groove sidewall (1415b) and the side surface (1410) of the substrate (141) is greater than or equal to 0.5 mm.

7. The motor (1) according to any one of claims 1 to 6, characterized in that, The substrate (141) includes a first region (14A) and a second region (14B), the second region (14B) is connected to the first region (14A), the driving chip (15) is fixedly connected to the first region (14A), and the first groove (1415) is provided in the second region (14B). The first region (14A) includes a plurality of first wiring layers (141A), which are electrically connected to each other, and the first wiring layers (141A) are electrically connected to the driver chip (15). The second region (14B) includes a plurality of second trace layers (141B), and the number of second trace layers (141B) is less than the number of first trace layers (141A). The second trace layers (141B) are electrically connected to the first trace layer (141A), and the second trace layers (141B) are also electrically connected to the first conductive element (112) through the first pad (142).

8. The motor (1) according to claim 7, characterized in that, The number of first wiring layers (141A) is six, and the six first wiring layers (141A) are arranged sequentially along a first direction. The number of second wiring layers (141B) is four, and the four second wiring layers (141B) are arranged sequentially along the first direction, which extends from the first surface (1411) of the substrate (141) to the base (11). Along the first direction, the third to sixth first routing layers (141A) are respectively connected to the four second routing layers (141B) one by one, and are arranged on the same layer.

9. The motor (1) according to claim 7, characterized in that, The number of first wiring layers (141A) is six, and the six first wiring layers (141A) are arranged sequentially along a first direction. The number of second wiring layers (141B) is two, and the two second wiring layers (141B) are arranged sequentially along the first direction. The first direction points from the first plate surface (1411) of the substrate (141) to the base (11). Along the first direction, the third and fourth first routing layers (141A) are respectively connected to the two second routing layers (141B) in a one-to-one correspondence and are arranged on the same layer.

10. The motor (1) according to any one of claims 1 to 6, characterized in that, The motor (1) further includes a first anti-shake coil (1311), a first anti-shake magnetic component (1312), a second anti-shake coil (1313), and a second anti-shake magnetic component (1314). The first anti-shake coil (1311) and the second anti-shake coil (1313) are fixed to the circuit board (14) at intervals and are both electrically connected to the circuit board (14). The first anti-shake coil (1311) and the second anti-shake coil (1313) are both electrically connected to the drive chip (15) through the circuit board (14). The carrier (12) includes a stabilization bracket (121), which is movably connected to the base (11). The first stabilization magnetic component (1312) and the second stabilization magnetic component (1314) are fixed to the stabilization bracket (121) at intervals. The first stabilization coil (1311) is disposed facing the first stabilization magnetic component (1312), and the second stabilization coil (1313) is disposed facing the second stabilization magnetic component (1314).

11. The motor (1) according to claim 10, characterized in that, The motor (1) further includes a focusing coil (1321) and a focusing magnetic component (1322). The focusing coil (1321) is electrically connected to the first conductive component (112), and the focusing coil (1321) is electrically connected to the driving chip (15) through the circuit board (14). The carrier (12) further includes a focusing bracket (122), which is movably connected to the image stabilization bracket (121). The focusing magnetic element (1322) is fixed to the focusing bracket (122), and the focusing coil (1321) is fixed to the image stabilization bracket (121) and faces the focusing magnetic element (1322).

12. The motor (1) according to any one of claims 2 to 4, characterized in that, The substrate (141) is further provided with a second groove (1417), the opening of the second groove (1417) is located on the bottom wall (1415a) of the first groove (1415), and the first welding surface (1421) is exposed relative to the bottom wall of the second groove (1417). A portion of the first solder joint (17) is located within the second groove (1417) and covers the first solder surface (1421) of the first solder pad (142).

13. The motor (1) according to any one of claims 1 to 6, characterized in that, The circuit board (14) further includes a second pad (143), which is embedded in the substrate (141) and spaced apart from the first pad (142). The third soldering surface (1431) of the second pad (143) is exposed through the first plate surface (1411) of the substrate (141). The base (11) further includes a second conductive element (113), which is spaced apart from the first conductive element (112), and the fourth welding surface (1132a) of the second conductive element (113) protrudes relative to the first plate surface (1411) of the substrate (141). The third soldering surface (1431) of the second solder pad (143) can be fixedly connected to the fourth soldering surface (1132a) of the second conductive element (113) through the second solder point (18).

14. The motor (1) according to claim 13, characterized in that, The substrate (141) includes an outer side (1413) and an inner side (1414). The second welding surface (1122a) of the first conductive element (112) extends through the outer side (1413) of the substrate (141), and a portion of the fourth welding surface (1132a) of the second conductive element (113) is disposed opposite to the inner side (1414) of the substrate (141).

15. A camera module (100), characterized in that, Includes a lens (2) and a motor (1) as claimed in any one of claims 1 to 14, wherein the lens (2) is mounted on the carrier (12).

16. The camera module (100) according to claim 15, characterized in that, The camera module (100) also includes a variable aperture, which is mounted on the lens (2).

17. The camera module (100) according to claim 16, characterized in that, The variable aperture is electrically connected to the circuit board (14), and the variable aperture is electrically connected to the driver chip (15) through the circuit board (14).

18. An electronic device (1000), characterized in that, It includes a device housing (200) and a camera module (100) as described in any one of claims 15 to 17, the camera module (100) being disposed in the device housing (200).

Images