Optical module and manufacturing method for optical module

Abstract

An optical module and a manufacturing method for an optical module, which relate to the technical field of optical apparatuses. The optical module comprises: a substrate; an active device arranged on the substrate and configured to emit and / or receive a light beam; an optical element covering the active device; a support member arranged on the substrate and surrounding the active device, wherein the support member is injection-compression molded; and a lens assembly arranged in the direction of the optical path of the active device and fixedly connected to the support member, wherein the lens assembly is configured to allow the light beam to pass therethrough, and an air gap exists between the lens assembly and the optical element. The method can ensure that the performance of the optical module is not affected.

Description

Optical module and optical module manufacturing method Technical Field

[0001] This application relates to the field of optical equipment technology, specifically to an optical module and a method for manufacturing an optical module. Background Technology

[0002] Biometric technology is a technology that identifies and verifies identity by analyzing the biometric characteristics of a person. It includes technologies such as fingerprint recognition, facial recognition, palm print recognition, iris recognition, voiceprint recognition, and vein recognition. With the development of biometric technology, fingerprint recognition, based on its unique advantages, is widely used in mobile terminal design, automotive electronics, smart homes, and other fields. Fingerprint recognition technology mainly includes capacitive fingerprint recognition, optical fingerprint recognition, and ultrasonic fingerprint recognition. Among them, optical fingerprint recognition technology is widely used in mobile terminals and automotive electronics due to its high convenience. In the field of mobile terminals, such as mobile phones, optical fingerprint recognition technology utilizes the principle of light reflection, embedding an optical sensor under the screen to achieve under-screen unlocking.

[0003] In the packaging process of existing optical fingerprint recognition devices, a filling medium is required between the optical lens and the optical components (transmitter and receiver) to protect the optical components. However, since light needs to pass through the filling medium for transmission, and the filling medium has a high refractive index, it affects the recognition performance of the optical fingerprint recognition device. Summary of the Invention

[0004] In view of the above problems, this application provides an optical module and an optical module manufacturing method, which can ensure that the performance of the optical module is not affected.

[0005] According to one aspect of the embodiments of this application, an optical module is provided, the optical module comprising: a substrate; an active device disposed on the substrate, the active device being used to emit and / or receive a light beam; an optical element disposed on the active device; a support member disposed on the substrate and surrounding the active device, the support member being formed by injection molding; and a lens assembly disposed in the optical path direction of the active device and fixedly connected to the support member, the lens assembly being used to allow the light beam to pass through, and an air gap existing between the lens assembly and the optical element.

[0006] The optical module provided in this application embodiment covers an active device on a substrate with optical elements, and a support member surrounding the active device is injection molded on the substrate. During the injection molding process of the support member, the optical elements not only prevent overflowing injection material from flowing to the active device, but also prevent the active device from being damaged by the support mold, thus ensuring the performance of the optical module. By positioning the lens assembly in the optical path direction and fixing it to the support member, and forming an air gap between the lens assembly and the optical elements, the loss and distortion of the light beam transmitted through the air gap are reduced, improving the recognition performance of the optical module. Furthermore, during the encapsulation of the lens assembly, the optical elements can prevent falling objects from directly impacting the active device, ensuring that the active device is not damaged, thereby guaranteeing the performance of the optical module.

[0007] In one alternative approach, optical elements are coated onto an active device using photopolymerization technology. Photopolymerization allows for the formation of optical elements with uniform thickness on the active device, ensuring consistent optical performance. Furthermore, the photopolymerized optical elements effectively protect the active device from contamination.

[0008] In one alternative approach, the optical element is an optical shaping element. The optical shaping element can shape the light beam emitted or received by the active device, thereby improving the performance of the optical module.

[0009] In one alternative embodiment, the optical module further includes connecting wires encased within a support member. One end of the connecting wire is electrically connected to an active device, and the other end is electrically connected to a substrate. Encasing the connecting wires within the support member eliminates the need for additional air gap space. This eliminates gaps between the support member and the active device, as well as between the optical elements, effectively preventing contamination of the active device by overflowing injection molding material. Furthermore, it reduces the area of ​​the optical module along the x-axis, thereby reducing the overall size of the optical module.

[0010] In one alternative embodiment, the lens assembly includes a glass structure and multiple microlenses. The microlenses are disposed on one or both sides of the glass structure along the beam transmission direction using an imprinting technique. Fabricating the lens assembly using an imprinting technique allows for a more compact structure, saving space for installation and reducing the overall size of the optical module.

[0011] In one alternative embodiment, the lens assembly further includes a connecting structure layer disposed on the side of the glass structure facing the active device and sandwiched between the glass structure and multiple microlenses. The connecting structure layer is also fixedly connected to a support member. The optical module further includes a connector encased within the support member, with one end electrically connected to the connecting structure layer and the other end grounded. The connector not only directs electrostatic charges conducted by the connecting structure layer to ground but also directs current to ground in the event of an electrical fault in the optical module, improving the safety of the optical module.

[0012] In one alternative embodiment, the active device includes a transmitter and a receiver disposed on a substrate, the transmitter for emitting a light beam and the receiver for receiving the light beam; optical elements include a first optical element and a second optical element, which are respectively disposed on the transmitter and the receiver; a support member surrounds the transmitter and the receiver; air gaps include a first air gap and a second air gap, the first air gap being located between the lens assembly and the first optical element, and the second air gap being located between the lens assembly and the second optical element. Through this method, the optical module can achieve optical recognition functionality, and by effectively utilizing the space of the substrate, the size of the optical module can be reduced.

[0013] In one optional embodiment, the lens assembly includes a first lens assembly and a second lens assembly. The first lens assembly is positioned in the emission direction of the transmitter, and the second lens assembly is positioned in the light-receiving direction of the receiver. Both the first and second lens assemblies are fixedly connected to a support member. A first air gap exists between the first lens assembly and the first optical element, and a second air gap exists between the second lens assembly and the second optical element. By using the first and second lens assemblies to process the passing light beam separately, it is possible to perform different processing on each lens assembly. Furthermore, the area of ​​each lens assembly can be fully utilized to process the passing light beam, avoiding waste of some lens assembly area.

[0014] According to another aspect of the embodiments of this application, an optical module manufacturing method is provided, comprising: placing an active device onto a substrate to obtain a carrier including the active device and the substrate; fabricating a support mold, the support mold being made of a light-transmitting material; depositing an optical material layer on the outer surface of the support mold opposite to the active device; aligning and placing the support mold on the carrier so that the optical material layer is aligned and covers the active device; irradiating the optical material layer through the support mold to fix the optical material layer onto the active device, forming an optical element; injecting injection molding material into a processing mold to form a support, the processing mold being configured such that the height of the support is greater than the total height of the active device and the optical element; and mounting a lens assembly on the support to form an optical module, wherein an air gap exists between the lens assembly and the optical element.

[0015] By using a light-transmitting material to create a support mold, and aligning the support mold with a carrier including a substrate and an active device, and injecting injection molding material into the support mold to form a support surrounding the active device on the substrate, an optical material layer can be formed on the outer surface of the support mold opposite to the active device, allowing the optical material layer to cover the active device. Then, light is shone through the support mold onto the optical material layer, fixing the optical material layer onto the active device to form an optical element. In this way, during the injection molding of the support, the optical element prevents overflowing injection molding material from flowing onto the active device and prevents the active device from being crushed. Furthermore, when the lens assembly is mounted and fixed to the support, the optical element also prevents objects from falling directly onto the active device, avoiding damage to the active device. Therefore, manufacturing an optical module using the above method can effectively guarantee the performance of the optical module.

[0016] According to another aspect of the embodiments of this application, an optical module is provided, which is obtained using the optical module manufacturing method provided in the above embodiments.

[0017] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0018] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0019] Figure 1 is a schematic diagram of the structure of the optical module provided in an embodiment of the present invention;

[0020] Figure 2 is a schematic diagram of the structure of an optical module provided in another embodiment of the present invention;

[0021] Figure 3 is a flowchart illustrating the optical module manufacturing method provided in an embodiment of the present invention;

[0022] Figure 4 is a schematic diagram of the structure of the support mold and carrier in the manufacturing process of the optical module provided in the embodiment of this application.

[0023] The reference numerals in the detailed embodiments are as follows: 10, optical module; 20, air gap; 21, first air gap; 22, second air gap; 30, carrier; 40, support mold; 50, optical material layer; 100, substrate; 200, active device; 210, transmitter; 220, receiver; 300, optical element; 310, first optical element; 320, second optical element; 400, support; 410, connecting line; 420, connector; 500, lens assembly; 510, first lens assembly; 511, glass structure; 512, microlens; 513, connecting structure layer; 520, second lens assembly. Detailed Implementation

[0024] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0026] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0027] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0028] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0029] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0030] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0031] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0032] In the packaging process of existing optical fingerprint recognition devices, a filling medium is required between the optical lens and the optical components (transmitter and receiver) mounted on the PCB (Printed Circuit Board) to protect the optical components. However, the process of filling the medium between the optical components and the optical lens is relatively complex. Furthermore, since light needs to pass through the filling medium for transmission, and the filling medium has a high refractive index, the light beam is severely distorted and the light beam energy loss is relatively large, affecting the recognition performance of the optical fingerprint recognition device.

[0033] To ensure the recognition performance of optical fingerprint recognition devices, a cavity can be created between the optical components and the optical lens, and this cavity can be filled with a gaseous medium. The low refractive index of the gaseous medium effectively reduces interference with the imaging light reaching the optical sensor, ensuring the accuracy of fingerprint detection and recognition. However, during the packaging process, especially during the installation and fixing of the optical lens, improper operation may affect or damage the optical sensor on the PCB, leading to fingerprint recognition failure or a decrease in the fingerprint recognition rate, thus reducing the recognition performance of the optical fingerprint recognition device.

[0034] In response, this application provides an optical module. To control the air gap height of the optical module, a support member is formed on a substrate by injection molding to protect the optical components and support the lens. During the injection molding process of the support member, to prevent injection material from overflowing into the optical components and to avoid damaging them, optical elements are covered on the optical components. The optical elements not only prevent overflowing injection material from contaminating the optical components but also prevent the optical components from being damaged during the packaging process of the optical module. Furthermore, when packaging the optical lens, the optical elements can also block falling objects from impacting the optical components, preventing damage and thus ensuring the performance of the optical module.

[0035] The optical modules provided in this application include, but are not limited to, those used in fingerprint recognition, face recognition, vein recognition, and other fields. This application uses fingerprint recognition as an example for illustration, and it does not constitute a limitation on the scope of protection of this application.

[0036] Please refer to Figure 1, which shows a schematic diagram of the structure of the optical module provided in an embodiment of the present invention. As shown in the figure, the optical module 10 includes a substrate 100, an active device 200, an optical element 300, a support member 400, and a lens assembly 500. The active device 200 is disposed on the substrate 100 and is used to emit and / or receive light beams. The optical element 300 is disposed over the active device 200. The support member 400 is disposed on the substrate 100 and surrounds the active device 200, and is formed by injection molding. The lens assembly 500 is disposed in the optical path direction of the active device 200 and is fixedly connected to the support member 400. The lens assembly 500 is used for the light beam to pass through, and an air gap 20 exists between the lens assembly 500 and the optical element 300.

[0037] The substrate 100 can be a PCB, which has strong rigidity and support, or it can be a rigid-flex board that combines the characteristics of PCB and FPC (Flexible Printed Circuit). The rigid-flex board has higher integration and smaller size than PCB, which can reduce the size of the substrate 100, thereby reducing the overall size of the optical module 10, and meeting the miniaturization requirements while ensuring detection and recognition accuracy. Circuitry can be built into the substrate 100 to transmit power and signals to the active device 200 through the connecting line 410 (as shown in Figure 1).

[0038] The active device 200 can be a transmitter 210 for emitting a light beam or a receiver 220 for receiving a light beam. The transmitter 210 and receiver 220 can be arranged side-by-side on the substrate 100 along the x-axis. The transmitter 210 can be a semiconductor laser, such as a vertical-cavity surface-emitting laser or an edge-emitting laser, for emitting a laser beam; the transmitter 210 can also be an infrared LED light source for emitting an infrared beam. The receiver 220 can be a CMOS (Complementary Metal Oxide Semiconductor) sensor, which includes a photosensitive area for image formation; the receiver 220 can also be a package integrating logic circuitry and an optical sensor, capable of converting received optical signals into electrical signals. Through packaging, the electrical signals from the optical sensor can be led out of the package and transmitted to the substrate 100, where the substrate 100 transmits the electrical signals to the outside of the optical module 10 for connection with external devices for further analysis and processing.

[0039] A transmitter 210 and a receiver 220 can be simultaneously disposed on the substrate 100. The transmitter 210 emits a light beam, which, when transmitted to a fingerprint, is partially reflected by the fingerprint. The reflected beam is then transmitted to the receiver 220, where it converts the optical signal into an electrical signal. Subsequent analysis and processing yield a fingerprint image. This method not only effectively utilizes the space of the substrate 100, reducing the size of the optical module 10, but also reduces the transmission distance of the light beam, thereby increasing the speed of fingerprint recognition. Of course, the substrate 100 may also only contain one of the transmitter 210 and the receiver 220.

[0040] The optical element 300 covering the active device 200 means that the area of ​​the optical element 300 can be equal to or greater than the light-emitting area of ​​the transmitter 210 or the light-sensitive area of ​​the receiver 220, so that the optical element 300 can completely block the light-emitting area of ​​the transmitter 210 or the light-sensitive area of ​​the receiver 220, preventing it from contacting other objects.

[0041] When both the transmitter 210 and the receiver 220 are disposed on the substrate 100, the optical element 300 may include a first optical element 310 and a second optical element 320 as shown in FIG1. ​​The first optical element 310 is disposed over the transmitter 210 and the second optical element 320 is disposed over the receiver 220, so that the first optical element 310 can completely block the light-emitting area of ​​the transmitter 210 and the second optical element 320 can completely block the photosensitive area of ​​the receiver 220, so that they do not come into contact with other objects.

[0042] The optical element 300 can be made of a photosensitive material with light-transmitting properties and fixed to the active device 200 by photopolymerization technology. This optical element 300 allows light beams to pass through and has a certain degree of elasticity, ensuring that the light beam emitted by the transmitter 210 illuminates the fingerprint and that the receiver 220 receives the light beam reflected from the fingerprint. It also reduces the impact of objects during collisions. Photopolymerization technology allows for the formation of a uniformly thick optical element 300 on the active device 200, ensuring consistent optical performance. Furthermore, the photopolymerized optical element 300 effectively protects the active device 200 from contamination.

[0043] Optical element 300 can also be an optical shaping element. Specifically, optical elements 300 with different shaping functions can be selected according to needs, not only allowing the light beam to pass through, but also shaping the passing light beam as needed. Taking the scenario of using optical module 10 for fingerprint recognition as an example, optical element 300 can be a lens with a homogenizing effect, such as a diffuser, which can homogenize the light beam emitted by transmitter 210 or received by receiver 220, making the light spot on the finger more uniform, thereby increasing the fingerprint recognition area and improving the accuracy of fingerprint recognition; or, optical element 300 can be a lens with a focusing effect, such as a Fresnel lens, which can converge the light beam emitted by transmitter 210 or received by receiver 220, making the intensity of the light spot on the finger more concentrated, thereby improving the clarity of the recognized fingerprint and improving the accuracy of fingerprint recognition.

[0044] The support member 400 can be made of a high-temperature resistant material, such as a material that can withstand temperatures above 200°C and supports multiple reflows. The support member 400 surrounding the active device 200 means that, except for the light-emitting area of ​​the transmitter 210 and / or the photosensitive area of ​​the receiver 220, the support member 400 is in contact with other surface areas of the transmitter 210 and / or receiver 220. Furthermore, the support member 400 is also in contact with the side surfaces of the optical elements 300 (first optical element 310 and second optical element 320). Thus, the support member 400 can protect the active device 200 from external contamination or mechanical damage.

[0045] By using the injection-molded support component 400, the height of the air gap 20 can be flexibly adjusted according to requirements, making the thickness adjustment of the optical module 10 more flexible so that the optical module 10 can adapt to different application scenarios. By covering the optical element 300 on the active device 200, during the injection molding process of the support component 400, not only can overflowing injection material be prevented from flowing onto the active device 200, avoiding contamination of the active device 200 by the injection material, but the support component 400 can also be prevented from being damaged by the injection mold during the molding process, thereby ensuring the recognition performance of the optical module 10.

[0046] The lens assembly 500 can be glued and fixed to the support 400. During the installation and fixing of the lens assembly 500, if an operational error causes the lens assembly 500 or the auxiliary installation tool to fall, the optical element 300 can also prevent the lens assembly 500 or the auxiliary installation tool from falling directly onto the active device 200, and reduce the impact of the falling lens assembly 500 or the auxiliary installation tool on the active device 200, preventing damage to the active device 200 and ensuring the performance of the optical module 10.

[0047] In this embodiment, the height of the support member 400 is greater than the total height of the active device 200 and the optical element 300 to ensure that an air gap 20 exists between the mounted and fixed lens assembly 500 and the optical element 300. By setting the air gap 20, the height of the optical module 10 can be minimized, meeting the miniaturization requirements of the optical module 10. Furthermore, the transmission of the light beam through the air gap 20 reduces beam loss and distortion, thereby improving the optical recognition performance of the optical module 10.

[0048] In an embodiment where a transmitter 210 and a receiver 220 are simultaneously disposed on a substrate 100, and a first optical element 310 and a second optical element 320 are simultaneously covered on the transmitter 210 and receiver 220, after the lens assembly 500 is fixedly connected to the support member 400, a first air gap 21 exists between the lens assembly 500 and the first optical element 310, and a second air gap 22 exists between the lens assembly 500 and the second optical element 320. The first air gap 21 reduces the loss and distortion of the light beam emitted by the transmitter 210, allowing the light beam to maintain high energy and be accurately transmitted to the fingerprint. The second air gap 22 reduces the loss and distortion of the light beam received by the receiver 220, ensuring that the receiver 220 can accurately receive the high-energy light beam reflected from the fingerprint, obtaining a clearer fingerprint image. This embodiment can reduce the size of the optical module 10 while achieving the optical recognition function of the optical module 10.

[0049] The lens assembly 500 can reflect light of a certain wavelength, thus providing a certain filtering effect. The lens assembly 500 can have coatings with different light-transmitting functions on one or both sides to control the wavelength of the light signal transmitted through it. By configuring a receiver 220 that can simultaneously process multiple signal or data stream paths, the optical module 10 can achieve multi-channel optical recognition functionality.

[0050] For example, the lens assembly 500 may be entirely coated with an IRP (infrared transmittance) coating or an IRBP (infrared bandwidth transmittance) coating on the side facing the active device 200 to allow infrared light to pass through or to allow infrared light within a certain wavelength range to pass through. The lens assembly 500 may also be coated with an IRP or IRBP coating on the side facing the transmitter 210, in the area through which the light beam emitted by the transmitter 210 passes, to allow infrared light to pass through or to allow infrared light within a certain wavelength range to pass through; and on the side facing the receiver 220, in the area through which the light beam transmitted to the receiver 220 passes, an IPC (infrared cutoff) coating to block infrared light from passing through.

[0051] The lens assembly 500 needs to cover the light-emitting area of ​​the transmitter 210 and / or the light-sensing area of ​​the receiver 220, so that the light beam emitted by the transmitter 210 can pass through the lens assembly 500 and be transmitted to the fingerprint, and / or the light beam reflected by the fingerprint can pass through the lens assembly 500 and be transmitted to the receiver 220.

[0052] The optical module 10 provided in this application embodiment covers an optical element 300 on an active device 200 on a substrate 100, and a support member 400 surrounding the active device 200 is injection molded on the substrate 100. During the injection molding process of the support member 400, the optical element 300 not only prevents overflowing injection material from flowing to the active device 200, but also prevents the active device 200 from being damaged by the support member mold, thus ensuring the performance of the optical module 10. By positioning the lens assembly 500 in the optical path direction and fixing it to the support member 400, and forming an air gap 20 between the lens assembly 500 and the optical element 300, the loss and distortion of the light beam transmitted through the air gap 20 are reduced, improving the recognition performance of the optical module 10. Furthermore, during the encapsulation of the lens assembly 500, the optical element 300 can prevent falling objects from directly impacting the active device 200, ensuring that the active device 200 is not damaged, thereby guaranteeing the performance of the optical module 10.

[0053] To reduce the volume of the optical module 10, this application further proposes an embodiment. Please continue to refer to FIG1. ​​The optical module 10 also includes a connecting line 410, which is covered within the support member 400. One end of the connecting line 410 is electrically connected to the active device 200, and the other end of the connecting line 410 is electrically connected to the substrate 100.

[0054] The connecting wire 410 can be gold wire and / or copper wire, or other metal wires or conductive wires can be selected as needed. Multiple connecting wires 410 can also be provided as needed. When a transmitter 210 and a receiver 220 are simultaneously provided on the substrate 100, multiple connecting wires 410 can be provided for the transmitter 210 and receiver 220 respectively, so that the substrate 100 can transmit electrical energy and signals to the transmitter 210 and receiver 220 through the connecting wires 410.

[0055] During the manufacturing process of the optical module 10, the connecting wire 410 is soldered to the substrate 100 and then to the active device 200. Next, a support member 400 is injection molded, allowing the injection molding material to enclose the connecting wire 410 within the support member 400. Specifically, the connecting wire 410 is soldered to the non-light-emitting area of ​​the transmitter 210 and to the non-photosensitive area of ​​the receiver 220.

[0056] In this way, the connecting line 410 passes through the support member 400 and connects to the active device 200 without occupying additional space in the air gap 20. On the one hand, this ensures that there are no gaps between the support member 400 and the active device 200, and between the optical element 300, effectively preventing overflowing injection molding material from contaminating the active device 200. On the other hand, it also reduces the area of ​​the optical module 10 along the x-axis, thereby reducing the volume of the optical module 10.

[0057] To reduce the production cost of the optical module 10, this application further proposes an embodiment in which a transmitter 210 and a receiver 220 are simultaneously disposed on the substrate 100, a first optical element 310 is covered on the transmitter 210, and a second optical element 320 is covered on the receiver 220. Please refer to Figure 2 for details. Figure 2 shows a schematic diagram of an optical module structure provided by another embodiment of this application. As shown in Figure 2, the lens assembly 500 includes a first lens assembly 510 and a second lens assembly 520. The first lens assembly 510 is disposed in the emission direction of the transmitter 210, and the second lens assembly 520 is disposed in the light-incoming direction of the receiver 220. Both the first lens assembly 510 and the second lens assembly 520 are fixedly connected to the support member 400. A first air gap 21 exists between the first lens assembly 510 and the first optical element 310, and a second air gap 22 exists between the second lens assembly 520 and the second optical element 320.

[0058] Specifically, the light beam emitted by the transmitter 210 passes through the first optical element 310, the first air gap 21 and the first lens assembly 510 in sequence and is transmitted to the fingerprint. Then, the light beam reflected by the fingerprint passes through the second lens assembly 520, the second air gap 22 and the second optical element 320 in sequence and reaches the receiver 220.

[0059] The first lens assembly 510 and the second lens assembly 520 are configured to process the passing light beam respectively. On the one hand, this facilitates different processing of each lens assembly, thereby facilitating the control of the light signal band transmitted through different lens assemblies. On the other hand, it allows full utilization of the area of ​​each lens assembly to process the passing light beam, avoiding the situation where no light beam passes through the gap between the lens assembly and the transmitter 210 and receiver 220 when only one lens assembly is used to process the passing light beam, thus avoiding the waste of part of the lens assembly area.

[0060] To reduce the volume of the optical module 10, this application further proposes an embodiment. Please continue to refer to FIG1. ​​The lens assembly 500 includes a glass structure 511 and a plurality of microlenses 512. The plurality of microlenses 512 are disposed on the glass structure 511 by imprinting technology and distributed on one or both sides of the glass structure 511 along the beam transmission direction.

[0061] As shown in Figure 1, the glass structure 511 can have multiple microlenses 512 on both sides, or multiple microlenses 512 can be set on only one side. The microlenses 512 can have the functions of collimating light, focusing light, or expanding the light spot. The specific microlenses 512 with different functions can be selected according to the needs.

[0062] When only the transmitter 210 is disposed on the substrate 100, or when both the transmitter 210 and the receiver 220 are disposed on the substrate 100, an IRP coating or an IRBP coating is deposited on the side of the glass structure 511 facing the transmitter 210; when only the receiver 220 is disposed on the substrate 100, an IPC coating is deposited on the side of the glass structure 511 facing the receiver 220. During the manufacturing process, an optical functional structure layer is first deposited on the side of the glass structure 511 facing the active device 200, and the glass structure 511 is processed into the required pattern. Then, multiple microlenses 512 are fixed onto the glass structure 511 using an imprinting technique to obtain the lens assembly 500. The lens assembly 500 is manufactured using an imprinting technique, which allows for a more compact structure, saves space for mounting the lens assembly 500, and reduces the volume of the optical module 10.

[0063] Similarly, the first lens assembly 510 and the second lens assembly 520 in the above embodiments may both include a glass structure 511 and a plurality of microlenses 512. The structure and processing method of the first lens assembly 510 and the second lens assembly 520 can refer to the structure and processing method of the lens assembly 500, and will not be repeated here.

[0064] To improve the safety of the optical module 10, this application further proposes an embodiment. Referring to FIG1, the lens assembly 500 also includes a connecting structure layer 513. The connecting structure layer 513 is disposed on the side of the glass structure 511 facing the active device 200 and sandwiched between the glass structure 511 and the plurality of microlenses 512. The connecting structure layer 513 is also fixedly connected to the support member 400. The optical module 10 also includes a connector 420, which is enclosed within the support member 400. One end of the connector 420 is electrically connected to the connecting structure layer 513, and the other end of the connector 420 is grounded.

[0065] The connecting structure layer 513 can be an ITO coating. The ITO coating has high transmittance, allowing most of the light beam to pass through. In addition, the ITO coating also has high conductivity, which can conduct the charge accumulated on the surface of the microlens 512 to the connector 420.

[0066] On the side of the glass structure 511 facing the active device 200, the connection structure layer 513 can be directly provided, or the connection structure layer 513 can be provided on the glass structure 511 after it has been coated with an IRP coating, an IRBP coating, or an IPC coating. Then, multiple microlenses 512 are fixed to the side of the glass structure 511 facing the active device 200 by imprinting technology, thus sandwiching the connection structure layer 513 between the glass structure 511 and the multiple microlenses 512.

[0067] The connector 420 can be made of copper, such as a copper pillar, or other metals or conductive materials can be selected as needed. When only a transmitter 210, a receiver 220, or both a transmitter 210 and a receiver 220 are provided on the substrate 100, only one connector 420 can be provided.

[0068] The packaging process of connector 420 can be referred to the packaging process of connector 410, and will not be repeated here.

[0069] The other end of the connector 420 can be grounded, which can be a ground connection between the connector 420 and the substrate 100. In this way, the connector 420 can conduct the electrostatic charge conducted by the connection structure layer 513 to the ground. Furthermore, in the event of an electrical fault in the optical module 10, such as leakage, the connector 420 can conduct the current to the ground, preventing the optical module 10 from causing injury to the user's fingers and improving the safety of the optical module 10.

[0070] In embodiments where the connecting structure layer 513 is an ITO coating, multiple metal contacts can be provided on the surface of the ITO coating. These metal contacts can be connected and fixed to the microlenses 512 respectively via an imprinted glass structure 511 and multiple microlenses 512. When the ITO coating contacts the metal contacts, a closed circuit is formed, allowing current to flow and activating the transmitter 210 to emit a laser beam. When one of the microlenses 512 falls off due to an external impact, the metal contact connected to that microlens 512 also falls off, separating from the ITO coating. The closed circuit is broken, preventing further flow to the transmitter 210, which then stops emitting the laser beam. In this way, when the microlens 512 detaches from the ITO coating due to external force, the supply of power to the transmitter 210 can be immediately stopped, ensuring that the transmitter 210 no longer emits a laser beam, thereby improving the safety of the optical module 10.

[0071] According to another aspect of the embodiments of this application, an optical module manufacturing method is proposed, which is used to manufacture the optical module 10 in the foregoing embodiments. Figure 3 shows a flowchart of the optical module manufacturing method provided by the embodiments of this application, and Figure 4 shows a structural schematic diagram of the support mold and carrier during the optical module manufacturing process provided by the embodiments of this application. As shown in Figures 3 and 4, the optical module manufacturing method includes the following steps:

[0072] Step 101: Place the active device 200 onto the substrate 100 to obtain a carrier 30 including the active device 200 and the substrate 100.

[0073] Specifically, the active device 200 can be glued to the substrate 100.

[0074] Step 102: Make support mold 40, which is made of light-transmitting material.

[0075] As shown in the figure, the outer contour of the support mold 40 is adapted to the surface of the carrier 30, so that when the support mold 40 is placed on the carrier 30, the support mold 40 can fit snugly against the carrier 30.

[0076] The light-transmitting material is one that allows at least ultraviolet light to pass through, such that the support mold 40 allows at least ultraviolet light to pass through.

[0077] Step 103: An optical material layer 50 is disposed on the outer surface of the support mold 40 opposite to the active device 200.

[0078] As shown in the figure, optical material layers 50 are provided on the outer surfaces of the support mold 40 that are opposite to the transmitter 210 and the receiver 220. The optical material layers 50 can be adhered to the outer surfaces of the support mold 40.

[0079] Step 104: Align and place the support mold 40 on the carrier 30 so that the optical material layer 50 is aligned and covers the active device 200.

[0080] Step 105: Irradiate light onto the optical material layer 50 through the support mold 40 so that the optical material layer 50 is fixed on the active device 200 to form the optical element 300.

[0081] Specifically, the optical material layer 50 can be heated to melt it, transforming it into a liquid or viscous state, and uniformly covering the surface of the active device 200. Then, ultraviolet light can be irradiated onto the optical material layer 50 through the support mold 40, causing the melted optical material layer 50 to transform into a solid state, thereby solidifying it on the active device 200.

[0082] Step 106: Inject injection molding material into the support mold 40 to form the support 400. The support mold 40 is configured such that the height of the support 400 is greater than the total height of the active device 200 and the optical element 300.

[0083] After the injection molding material is injected and the mold is pressed, the support mold 40 is closed. Mechanical pressure is used to make the injection molding material conform to the shape of the support mold 40. When the injection molding material cools and solidifies, the support 400 is formed.

[0084] If the height of the support mold 40 is greater than the total height of the active device 200 and the optical element 300, then the height of the support 400 can be greater than the total height of the active device 200 and the optical element 300.

[0085] Step 107: Install the lens assembly 500 on the support 400 to form an optical module 10. There is an air gap 20 between the lens assembly 500 and the optical element 300.

[0086] Specifically, adhesive can be applied to the support 400, and then the lens assembly 500 can be attached to the support 400. Since the height of the support 400 can be greater than the total height of the active device 200 and the optical element 300, there is an air gap 20 between the lens assembly 500 and the optical element 300 that are mounted and fixed on the support 400.

[0087] By using a light-transmitting material to make a support mold 40, during the process of aligning the support mold 40 with the carrier 30 including the substrate 100 and the active device 200, and injecting injection molding material into the support mold 40 to form a support 400 surrounding the active device 200 on the substrate 100, an optical material layer 50 can be provided on the outer surface of the support mold 40 opposite to the active device 200, so that the optical material layer 50 can cover the active device 200. Subsequently, light is irradiated onto the optical material layer 50 through the support mold 40, fixing the optical material layer 50 onto the active device 200 to form the optical element 300. Thus, during injection molding of the support 400, the optical element 300 prevents overflowing injection material from flowing onto the active device 200 and prevents the active device 200 from being crushed. Furthermore, when the lens assembly 500 is mounted and fixed onto the support 400, the optical element 300 also prevents objects from falling directly onto the active device 200, avoiding damage to the active device 200. Therefore, by manufacturing the optical module 10 using the above method, the performance of the optical module can be effectively guaranteed.

[0088] According to another aspect of the embodiments of this application, an optical module is provided, which is processed using the optical module manufacturing method provided in the above embodiments.

[0089] The specific implementation process and beneficial effects of the above embodiments can be referred to the foregoing embodiments, and will not be repeated here.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An optical module, characterized in that, The optical module includes: substrate; An active device is disposed on the substrate, the active device being used to emit and / or receive a light beam; Optical elements are disposed on the active device; A support member, disposed on the substrate and surrounding the active device, is formed by injection molding; and A lens assembly is disposed in the optical path direction of the active device and fixedly connected to the support member. The lens assembly is used to allow the light beam to pass through, and there is an air gap between the lens assembly and the optical element.

2. The optical module according to claim 1, characterized in that, The optical elements are applied to the active device using photopolymerization technology.

3. The optical module according to claim 1, characterized in that, The optical element is an optical shaping element.

4. The optical module according to claim 1, characterized in that, The optical module also includes a connecting line, which is encased within the support member. One end of the connecting line is electrically connected to the active device, and the other end of the connecting line is electrically connected to the substrate.

5. The optical module according to claim 1, characterized in that, The lens assembly includes a glass structure and multiple microlenses, which are disposed on the glass structure by imprinting technology and distributed on one or both sides of the glass structure along the beam transmission direction.

6. The optical module according to claim 5, characterized in that, The lens assembly further includes a connecting structure layer, which is disposed on the side of the glass structure facing the active device and sandwiched between the glass structure and the plurality of microlenses. The connecting structure layer is also fixedly connected to the support member. The optical module also includes a connector, which is enclosed within the support member. One end of the connector is electrically connected to the connection structure layer, and the other end of the connector is grounded.

7. The optical module according to claim 1, characterized in that, The active device includes a transmitter and a receiver disposed on the substrate, wherein the transmitter is used to emit a light beam and the receiver is used to receive the light beam; The optical element includes a first optical element and a second optical element, which are respectively disposed on the transmitter and the receiver. The support structure surrounds the transmitter and the receiver; The air gap includes a first air gap and a second air gap, the first air gap being located between the lens assembly and the first optical element, and the second air gap being located between the lens assembly and the second optical element.

8. The optical module according to claim 7, characterized in that, The lens assembly includes a first lens assembly and a second lens assembly. The first lens assembly is disposed in the emission direction of the transmitter, and the second lens assembly is disposed in the light-receiving direction of the receiver. Both the first lens assembly and the second lens assembly are fixedly connected to the support member. The first lens assembly and the first optical element have the first air gap between them, and the second lens assembly and the second optical element have the second air gap between them.

9. A method for manufacturing an optical module, characterized in that, The method includes: An active device is disposed on a substrate to obtain a carrier including the active device and the substrate; A support mold is manufactured, the support mold being made of a light-transmitting material; An optical material layer is disposed on the outer surface of the support mold opposite to the active device; The support mold is aligned and placed on the carrier so that the optical material layer is aligned and covers the active device; Light is irradiated onto the optical material layer through the support mold, so that the optical material layer is fixed on the active device to form an optical element; Injection material is injected into the support mold to form a support, wherein the support mold is configured such that the height of the support is greater than the total height of the active device and the optical element; The lens assembly is mounted on the support to form an optical module, and there is an air gap between the lens assembly and the optical element.

10. An optical module, characterized in that, The optical module is obtained using the optical module manufacturing method of claim 9.

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