Liquid-cooled heat sink and electronic device
By using fins and distributors in the liquid cooler to optimize the flow of the cooling medium, the problem of insufficient heat dissipation capacity of immersion liquid cooling systems is solved, achieving efficient and uniform heat distribution and heat dissipation effect, and ensuring the stability of electronic equipment.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ZTE CORP
- Filing Date
- 2026-01-26
- Publication Date
- 2026-07-30
AI Technical Summary
Existing immersion liquid cooling systems have weak heat dissipation capabilities and cannot meet the heat dissipation requirements of high heat flux density chips. In particular, when the heat is uneven, the temperature in some areas is too high, which affects the stability of electronic devices.
A liquid-cooled radiator with multiple fins spaced apart is combined with a distributor to distribute the cooling medium flow in a jet manner, which enhances the heat exchange efficiency between the heat and the cooling medium. The flow of the cooling medium is optimized by the design of the fin openings and the heat spreader, so as to achieve uniform heat distribution.
It improves the heat dissipation efficiency and temperature uniformity of the radiator, and can quickly eliminate heat in areas with high heat flux density, ensuring the stable operation of electronic equipment.
Smart Images
Figure CN2026074902_30072026_PF_FP_ABST