Ultrasonic sensor housing, ultrasonic sensor, sensor assembly, detection module and cleaning robot
By using a one-piece molded ultrasonic sensor housing design, the matching layer is eliminated, and the panel is used as the matching layer for the piezoelectric ceramic sheet. This solves the problems of complex structure and unstable performance of traditional ultrasonic sensors, and achieves efficient production and stable operation.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- CHENGDU HUITONG WEST ELECTRONIC CO LTD
- Filing Date
- 2026-03-24
- Publication Date
- 2026-07-30
AI Technical Summary
Existing piezoelectric ceramic ultrasonic sensors have complex housing structures and complicated manufacturing processes, and are prone to performance instability due to loosening of the adhesive structure, especially in harsh working conditions such as cleaning robots.
The ultrasonic sensor adopts a one-piece molded housing design, with the outer shell, annular plate and panel forming an integral structure. The matching layer is eliminated, and the panel is used as the matching layer for the piezoelectric ceramic sheet. Combined with the annular groove, the signal energy is controlled, which simplifies the process and improves consistency.
The manufacturing process has been simplified, the production efficiency and consistency of the sensors have been improved, the detection range has been increased, the impact of assembly tolerances has been reduced, and the requirements for use under high-frequency vibration and harsh working conditions have been met.
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Figure CN2026085749_30072026_PF_FP_ABST
Abstract
Description
Ultrasonic sensor housing, ultrasonic sensor, sensor assembly, detection module and cleaning robot
[0001] Cross-reference of related applications
[0002] This disclosure claims priority to the following three Chinese patent applications filed with the China National Intellectual Property Administration, the entire contents of which are incorporated herein by reference: application number 202520170057X, filed on January 24, 2025, entitled "A Sensor Housing and an Ultrasonic Sensor"; application number 2025107552491, filed on June 6, 2025, entitled "An Ultrasonic Sensor Housing and an Ultrasonic Sensor"; and application number 2025211554457, filed on June 6, 2025, entitled "A Sensor Housing and an Ultrasonic Sensor". Technical Field
[0003] This invention relates to the field of sensor technology, and in particular to ultrasonic sensors and their applications. Background Technology
[0004] Ultrasonic sensors have a wide range of applications in industrial automation, automotive safety, and smart homes. For example, they can be used to detect the movement of people or objects, measure distances, monitor video, and are widely used in smart offices and smart service robots for obstacle avoidance and material recognition.
[0005] With the development of the market, China's intelligent cleaning robots have set sail overseas and occupied more than half of the global market share; the ultrasonic sensors are required to have high frequency, low energy consumption, high precision, small size, and the ability to identify different types of floors, carpets, floor cracks, sliding door tracks, stair cliffs and other working conditions.
[0006] For ultrasonic sensors used in cleaning robots and other applications, the short distance between the sensor and the target (generally 30-100mm) necessitates higher requirements for low residual vibration (generally below 170μs) and high sensitivity (at least 1V echo at 100mm), especially for transceiver ultrasonic sensors. Therefore, existing piezoelectric ceramic ultrasonic sensors typically employ two housings (referred to as a double-housing structure) combined with damping materials to reduce residual vibration and improve sensitivity, and various improvements have been made based on this. For example, Chinese patent CN221464641U discloses an air-medium ultrasonic sensor that uses two housings nested together with a damping layer between them. The sensor is assembled internally using potting material, piezoelectric ceramics, a pin back cover, and a matching layer; the damping layer absorbs energy, reducing residual vibration and improving sensitivity. However, the above technical solutions are complex in structure, cumbersome in process, and have low production efficiency. They also have many variables affecting functionality, making quality control difficult and reducing the consistency of the finished product. Furthermore, because multiple components are connected and fixed by adhesive bonding, there are adhesive structures between the matching layer of the sensor and the small housing (probe housing), and between the small housing and the outer housing. Under harsh working conditions such as those of cleaning robots, including humidity, heat, and high dust levels, coupled with the high-frequency vibrations during sensor operation, these adhesive structures are highly susceptible to delamination, loosening, or even complete failure, damaging the sensor's performance and rendering it inoperable. Although many inventors have attempted some improvements, none have effectively solved the problems caused by the aforementioned technical solutions. Summary of the Invention
[0007] In order to solve all or part of the above problems, the purpose of this disclosure is to provide an ultrasonic sensor housing and an ultrasonic sensor, as well as related devices containing the ultrasonic waves, in order to address the defects caused by the current piezoelectric ceramic ultrasonic sensors generally using a matching layer and two types of housings.
[0008] In a first aspect, this disclosure provides an ultrasonic sensor housing, including an outer shell and a panel formed by a matching layer, the matching layer extending to form the outer shell such that the panel formed by the matching layer and the outer shell form a dielectrically continuous whole, the panel formed by the matching layer being used to connect a piezoelectric ceramic sheet.
[0009] Preferably, it further includes an annular plate formed during the outward extension of the matching layer, the thickness of the annular plate being less than the thickness of the panel formed by the matching layer.
[0010] Preferably, it further includes an inner shell, the outer shell being fitted over the outer side of the inner shell, and the inner shell being connected to at least one of the annular plate (3) and the panel.
[0011] The ultrasonic sensor housing disclosed herein has an annular plate on the inner side of one end of the housing, and a panel is disposed on the inner side of the annular plate. The housing, the annular plate, and the panel are integrally formed, thereby making the housing, the annular plate, and the panel a whole. Since the housing and matching layer of traditional ultrasonic sensors are manufactured separately, secondary assembly of the housing and matching layer is required during sensor production. This is not only structurally complex and cumbersome, but also easily affected by assembly tolerances during the assembly process, resulting in poor product consistency. However, the ultrasonic sensor housing of this disclosure, with its integral housing, annular plate, and panel, allows the piezoelectric ceramic sheet to be connected to the panel during sensor production. The panel is used as the matching layer for the piezoelectric ceramic sheet to transmit signals, thereby realizing coupling between the housing and the piezoelectric ceramic sheet. The additional matching layer is no longer required, greatly simplifying the process.
[0012] More preferably, a first annular groove is provided on the outer side of the annular plate. With the cooperation of a specific acoustic barrel structure, the signal energy level is adjusted, so that the detection range of the ultrasonic sensor after it is made is relatively increased. At the same time, it plays a certain role in constraining the propagation of sound waves, so that the ultrasonic sensor can still meet the usage requirements after the ultrasonic sensor housing is improved as described above.
[0013] Preferably, the ultrasonic sensor housing disclosed herein further includes an inner shell, the outer shell being sleeved on the outside of the inner shell, and the inner shell being connected to at least one of the annular plate and the panel.
[0014] The inner shell is used to protect the inner structure of the outer shell and facilitates assembly.
[0015] Preferably, the inner shell, outer shell, annular plate, and panel are integrally formed.
[0016] The ultrasonic sensor housing disclosed herein is integrally formed from the inner shell, outer shell, annular plate, and panel. Traditional ultrasonic sensors require separate fabrication of the inner shell, outer shell, and matching layer, necessitating secondary assembly during sensor production. This process is not only structurally complex and cumbersome but also susceptible to assembly tolerances, leading to poor product consistency. In contrast, the ultrasonic sensor housing of this disclosure integrates the inner shell, outer shell, annular plate, and panel. During ultrasonic sensor production, the piezoelectric ceramic sheet is connected to the panel, which serves as the matching layer for signal transmission. This allows coupling between the housing and the piezoelectric ceramic sheet, eliminating the need for an additional matching layer and significantly simplifying the process. Furthermore, the integral design of the inner shell and outer shell eliminates the need for an embedded small plastic shell for positioning the piezoelectric ceramic sheet, avoiding assembly tolerances that can occur when assembling two shells. The ultrasonic sensor housing of this disclosure features a simple manufacturing process, effectively reduces variable factors, lowers the difficulty of production quality control, and significantly improves the production efficiency of traditional ultrasonic sensors.
[0017] Preferably, the inner shell and the outer shell are coaxially arranged to ensure the coaxiality of the inner shell and the outer shell, thereby ensuring the symmetry of the vibration of the ultrasonic sensor housing and the uniform transmission of ultrasonic waves.
[0018] Preferably, a first receiving cavity is formed between the inner shell and the panel, the first receiving cavity being used to place the piezoelectric ceramic sheet.
[0019] Preferably, a second receiving cavity is formed between the inner shell, the outer shell, and the annular plate. This second receiving cavity accommodates the damping layer, thereby improving the residual vibration of the piezoelectric ceramic sheet.
[0020] Preferably, the end of the inner shell away from the panel is located inside the outer shell.
[0021] Preferably, the inner shell has a first groove at the end away from the panel. This facilitates the installation of at least one of the positioning terminal wire and the lead wire.
[0022] Preferably, there are at least two first grooves, and all the first grooves are arranged along the circumference of the inner shell.
[0023] The first boss structure is used to protect the inner structure of the housing and facilitates the assembly of the piezoelectric ceramic sheet.
[0024] Preferably, the inner shell is cylindrical.
[0025] Preferably, the outer diameter of the inner shell is Φ8.2mm~Φ11mm.
[0026] Preferably, the inner shell includes at least two first boss structures, all of which are spaced apart circumferentially along the outer shell. One end of each first boss structure is connected to at least one of the front panel and the annular plate. The first boss structures are used to protect the inner structure of the outer shell and facilitate the assembly of piezoelectric ceramic sheets.
[0027] Preferably, the outer shell is cylindrical.
[0028] Preferably, the outer shell, the annular plate, and the panel form a closed cavity at one end. That is, there are no through holes in the outer shell, the annular plate, the panel, the connection between the annular plate and the outer shell, or the connection between the annular plate and the panel, to facilitate the assembly of the backing.
[0029] Preferably, the density of the panel is 0.35 g / cm³. 3 ~0.9g / cm 3 .
[0030] Preferably, the thickness of the panel is 1.6mm to 3.0mm.
[0031] This enables the panel to meet the requirements of serving as a matching layer.
[0032] Preferably, a second annular groove is provided on the inner side of the annular plate. The area of the panel in contact with the piezoelectric ceramic sheet is adjusted by the second annular groove, thereby adjusting the residual vibration of the ultrasonic sensor. Furthermore, the third annular groove can be used to fill with elastic adhesive to suppress the vibration of the piezoelectric ceramic sheet towards the outer shell, or it can be filled with backing adhesive to form part of the backing layer for better vibration reduction.
[0033] Preferably, the second annular groove is provided corresponding to the first annular groove, so as to jointly control the thickness of the annular plate and reduce the influence of the annular plate on the vibration of the panel.
[0034] Preferably, the inner surface of the annular plate and the inner surface of the panel are flush, to increase the reliability of the connection between the annular plate and the panel.
[0035] Preferably, the inner side of the annular plate is higher than the inner side of the panel, and the annular plate and the inner side of the panel form a placement groove for placing the piezoelectric ceramic sheet.
[0036] Preferably, reinforcing ribs are connected between the opposite sides of the first annular groove to adjust the strength of the residual vibration, which can be precisely controlled to a certain range.
[0037] Preferably, there are at least two reinforcing ribs, which are spaced apart from each other, and the reinforcing ribs divide the first annular groove into several arc-shaped grooves.
[0038] Multiple reinforcing ribs can further and more precisely control the strength of residual vibration to a certain range. Combined with a specific acoustic barrel structure, it can more precisely control the ultrasonic echo energy to a certain range.
[0039] Specifically, the reinforcing ribs are arranged such that the first annular groove is divided into several arc-shaped grooves, all of which are arranged along the annular shape, and adjacent arc-shaped grooves are spaced apart by reinforcing ribs.
[0040] Preferably, the reinforcing rib, outer shell, annular plate, and panel are integrally formed to facilitate installation, reduce installation steps, and lower costs.
[0041] Preferably, a third annular groove is provided at intervals on the inner side of the first annular groove.
[0042] Preferably, a third annular groove is provided at intervals on the outer side of the first annular groove.
[0043] Preferably, a third annular groove is provided at intervals on both the inner and outer sides of the first annular groove.
[0044] The residual vibration and ultrasonic echo energy are controlled by the cooperation of the first and third annular grooves.
[0045] Preferably, the bottom of the first annular groove is further provided with a bottom groove.
[0046] The residual vibration and ultrasonic echo energy are controlled by the cooperation of the first and third annular grooves.
[0047] Preferably, a portion of at least one side of the bottom groove and the first annular groove are coplanar.
[0048] Preferably, the bottom groove is located at the center of the bottom of the first annular groove along the radial direction of the first annular groove.
[0049] Preferably, at least a portion of the first annular groove extends laterally onto the panel.
[0050] Preferably, the outer surface of the panel protrudes beyond the corresponding end face of the outer casing. Sound waves diffuse outwards along the central axis after passing through the convex interface.
[0051] This results in a wider sound wave emission angle and a more uniform sound field in the near field, making it suitable for detecting large-scale targets and increasing the detection angle.
[0052] Preferably, the outer surface of the panel has a curved surface that bulges outward toward the outer side of the panel. This increases the ultrasonic wave emission and reception angles, resulting in strong emission of sound waves, which is suitable for certain scenarios, such as those requiring a larger detection angle, achieving a wide near-field coverage effect.
[0053] Preferably, the outer surface of the panel has a curved surface, which is recessed towards the inner side of the panel. This forces the sound wave energy to propagate and converge along the normal direction of the concave surface, narrowing the directivity and reducing the beam angle. This addresses the needs of certain scenarios, such as significantly increasing local energy intensity, and with higher frequencies and shorter wavelengths, the focusing ability is stronger.
[0054] Preferably, the projection of the inner side of the panel along the radial direction of the outer casing is located on the side of the first annular groove.
[0055] Preferably, the outer shell is cylindrical.
[0056] In a second aspect, this disclosure provides an ultrasonic sensor, including the ultrasonic sensor housing described in this disclosure, with a panel connected to a piezoelectric ceramic sheet, the panel serving as a matching layer for the piezoelectric ceramic sheet to transmit vibrations.
[0057] This disclosure provides an ultrasonic sensor, including the ultrasonic sensor housing described herein. The ultrasonic sensor housing includes an outer shell, an annular plate on the inner side of one end of the outer shell, and a panel disposed on the inner side of the annular plate. The outer shell, the annular plate, and the panel are integrally formed, thereby making the outer shell, the annular plate, and the panel a whole. Since the inner shell, outer shell, and matching layer of traditional ultrasonic sensors are manufactured separately, secondary assembly of the outer shell, the annular plate, and the panel is required during sensor production. This not only results in a complex structure and cumbersome process, but is also easily affected by assembly tolerances during assembly, leading to poor product consistency. However, the ultrasonic sensor of this disclosure… The ultrasonic sensor housing, outer shell, annular plate, and panel are integrally designed. During sensor production, the piezoelectric ceramic sheet is connected to the panel, which serves as a matching layer for signal transmission by the piezoelectric ceramic sheet. This allows coupling between the housing and the piezoelectric ceramic sheet, eliminating the need for an additional matching layer and greatly simplifying the manufacturing process. Furthermore, a first annular groove is provided on the outer side of the annular plate. With the cooperation of a specific acoustic barrel structure, the signal energy level is adjusted, resulting in a relatively larger detection range for the ultrasonic sensor and a certain constraint on sound wave propagation. Thus, the ultrasonic sensor can still meet the usage requirements after the above improvements to the ultrasonic sensor housing.
[0058] In a third aspect, this disclosure provides an ultrasonic sensor, including an ultrasonic sensor housing as described in this disclosure, and further including a piezoelectric ceramic sheet, a damping layer, a backing layer, terminal wires, and a potting layer. The piezoelectric ceramic sheet and the backing layer are sequentially disposed inside the inner housing, and the piezoelectric ceramic sheet is connected to the panel. The damping layer is also filled between the inner housing and the outer housing, and the potting layer is filled at the end of the outer housing away from the panel. The terminal wires pass through the potting layer and the backing layer and are connected to the lead wires of the piezoelectric ceramic sheet.
[0059] The ultrasonic sensor disclosed herein, during production, sequentially places a piezoelectric ceramic sheet and a backing layer inside the inner shell, with the piezoelectric ceramic sheet connected to a panel. The panel serves as a matching layer for signal transmission by the piezoelectric ceramic sheet, thereby enabling coupling between the shell and the piezoelectric ceramic sheet. This eliminates the need for an additional matching layer, greatly simplifying the manufacturing process. Furthermore, the integrated design of the inner and outer shells eliminates the need for an embedded small plastic shell for positioning the piezoelectric ceramic sheet, avoiding assembly tolerances that can easily occur when assembling two shells, and significantly improving the production efficiency of the ultrasonic sensor.
[0060] Preferably, the backing layer and the vibration damping layer are integrally cast.
[0061] In a fourth aspect, this disclosure provides an ultrasonic sensor, including the ultrasonic sensor housing described in this disclosure, and further including a piezoelectric ceramic sheet, a damping layer, a backing layer, and terminal wires. The piezoelectric ceramic sheet is connected to the inner side of the panel, the damping layer is located in the third annular groove, and the backing layer is disposed on the inner side of the housing. The inner side of the housing is also filled with a potting layer, which is located on the side of the backing layer away from the piezoelectric ceramic sheet. The terminal wires pass through the potting layer and enter the backing layer, and are connected to the lead wires of the piezoelectric ceramic sheet.
[0062] The ultrasonic sensor disclosed herein, during production, involves sequentially placing a piezoelectric ceramic sheet and a backing layer inside the housing, with the piezoelectric ceramic sheet connected to a panel. The panel serves as a matching layer for signal transmission by the piezoelectric ceramic sheet, thereby enabling coupling between the housing and the piezoelectric ceramic sheet. This eliminates the need for an additional matching layer, greatly simplifying the manufacturing process. Furthermore, since the housing, annular plate, and panel are integrally formed, there is no need for an embedded small plastic shell for positioning the piezoelectric ceramic sheet, avoiding assembly tolerances that can easily occur when assembling two housings. This significantly improves the production efficiency of the ultrasonic sensor.
[0063] Preferably, the backing layer and the vibration damping layer are integrally cast.
[0064] Preferably, it also includes a sound barrel, which is disposed on the outside of the panel and connected to at least one of the annular plate (3) and the panel.
[0065] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0066] The ultrasonic sensor housing disclosed herein has an annular plate on the inner side of one end of the housing, and a panel is disposed on the inner side of the annular plate. The housing, the annular plate, and the panel are integrally formed, thus making the housing, the annular plate, and the panel a whole. Traditional ultrasonic sensors have their housings and matching layers manufactured separately, requiring secondary assembly of the housing and matching layer during sensor production. This is not only structurally complex and cumbersome, but also susceptible to assembly tolerances, leading to poor product consistency. In contrast, the ultrasonic sensor housing of this disclosure, with its integral housing, annular plate, and panel, allows the piezoelectric ceramic sheet to be connected to the panel during sensor production. The panel serves as the matching layer for signal transmission by the piezoelectric ceramic sheet, thereby achieving coupling between the housing and the piezoelectric ceramic sheet without the need for an additional matching layer, greatly simplifying the process. Further preferably, a first annular groove is provided on the outer side of the annular plate. With the cooperation of a specific acoustic barrel structure, the signal energy level is controlled, resulting in a relatively larger detection range of the ultrasonic sensor and a certain constraint on sound wave propagation. Therefore, the ultrasonic sensor can still meet the usage requirements after the above improvements to the ultrasonic sensor housing.
[0067] Other features and advantages of this disclosure will be set forth in the following description.
[0068] Overview of the attached figures
[0069] The accompanying drawings are provided to further understand the technical solutions of this disclosure and constitute a part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure.
[0070] Figure 1 is a three-dimensional schematic diagram of the ultrasonic sensor housing of this disclosure (with an inner shell).
[0071] Figure 2 is a two-dimensional schematic diagram of the ultrasonic sensor housing of this disclosure (with an inner shell).
[0072] Figure 3 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (with an inner shell and a first groove).
[0073] Figure 4 is a dimensioned diagram of the inner shell, annular plate, and front panel (with inner shell and first groove).
[0074] Figure 5 is a schematic diagram of the ultrasonic sensor disclosed herein.
[0075] Figure 6 is a cross-sectional view of the ultrasonic sensor (with an inner shell).
[0076] Figure 7 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (with an inner shell and no first groove; wherein (a) the annular plate 3 has a first annular groove 50 on its outer side, while (b) the first annular groove 50 is not provided).
[0077] Figure 8 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (having an inner shell, the inner shell being shorter; wherein (a) the annular plate 3 has a first annular groove 50 on its outer side, while (b) the first annular groove 50 is not provided).
[0078] Figure 9 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (having a first boss structure; wherein (a) the annular plate 3 has a first annular groove 50 on its outer side, while (b) the first annular groove 50 is not provided).
[0079] Figure 10 is a three-dimensional schematic diagram of the ultrasonic sensor housing of this disclosure (with a first boss structure).
[0080] Figure 11 is a bottom view of the ultrasonic sensor housing of this disclosure (with a first annular groove).
[0081] Figure 12 is a bottom view of the ultrasonic sensor housing of this disclosure (with an arc-shaped groove).
[0082] Figure 13 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (with a third annular groove; wherein (a) the annular plate 3 has a first annular groove 50 on its outer side, while (b) the first annular groove 50 is not provided).
[0083] Figure 14 is a cross-sectional view (without inner shell) of the ultrasonic sensor disclosed herein.
[0084] Figure 15 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (with a shallow placement groove).
[0085] Figure 15-1 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (with a deep placement groove).
[0086] Figure 16 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (type one of bottom grooves).
[0087] Figure 17 is an enlarged schematic diagram of part A in Figure 16 of this disclosure.
[0088] Figure 18 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (type two of bottom groove).
[0089] Figure 19 is an enlarged schematic diagram of part A in Figure 18 of this disclosure.
[0090] Figure 20 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (with a third annular groove).
[0091] Figure 21 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (type three of bottom groove).
[0092] Figure 22 is an enlarged schematic diagram of part A in Figure 21 of this disclosure.
[0093] Figure 23 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (the inner side of the annular plate and the panel are flush; wherein the outer side of the annular plate 3 in (a) is provided with a first annular groove 50, while in (b) the first annular groove 50 is not provided).
[0094] Figure 24 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (the outer side of the panel protrudes from the corresponding side of the outer shell; wherein (a) the outer side of the annular plate 3 is provided with a first annular groove 50, while (b) the first annular groove 50 is not provided).
[0095] Figure 25 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (the arc-shaped part is convex; wherein (a) the annular plate 3 is provided with a first annular groove 50 on the outside, while (b) the first annular groove 50 is not provided).
[0096] Figure 26 is a cross-sectional view of the ultrasonic sensor housing of this disclosure (the arc-shaped part is concave; wherein (a) the annular plate 3 is provided with a first annular groove 50 on the outer side, while (b) the first annular groove 50 is not provided).
[0097] Figure 27 is a schematic diagram of the fit between the ultrasonic sensor housing and the acoustic barrel of this disclosure.
[0098] Figure 28 is a schematic diagram of an embodiment of a sensor assembly based on an ultrasonic sensor according to the present disclosure.
[0099] Figure 29 is a structural schematic diagram of the ultrasonic sensor disclosed herein used in a cleaning robot.
[0100] Figure 30 is a block diagram of the principle of ultrasonic sensor performance testing (actual measurement).
[0101] Figure 31 shows the simulation and measurement results of several embodiments of the ultrasonic sensor disclosed herein.
[0102] Figure 32 shows simulation results for some other embodiments of the ultrasonic sensor disclosed herein.
[0103] Figure 33 shows the aging test comparison curves of the ultrasonic sensor of this disclosure and the ultrasonic sensor of the prior art.
[0104] Preferred embodiments of this disclosure
[0105] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be arbitrarily combined to form new technical solutions; or, based on the technical solutions, technical means, inventive concepts, and technical ideas disclosed in this disclosure, combinations can be made to solve related technical problems and achieve related technical effects.
[0106] The present invention will be further described in detail below with reference to specific embodiments. However, this should not be construed as limiting the scope of the above-mentioned subject matter of the present invention to the following embodiments. All technologies implemented based on the content of the present invention fall within the scope of the present invention. Unless otherwise specified, in the description of the specific embodiments of the present invention, terms such as "upper," "lower," "left," "right," "center," "inner," and "outer," indicating orientation or positional relationships, are expressions based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationship in which the product / equipment / device of the invention is usually placed during use. These terms of orientation or positional relationships are merely for the purpose of facilitating the description of the present invention or simplifying the description in the specific embodiments, and for enabling those skilled in the art to quickly understand the solution, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, they should not be construed as limitations on the present invention.
[0107] Furthermore, the use of terms such as "horizontal," "vertical," "suspended," and "parallel" does not imply that the corresponding device / component / element must be absolutely horizontal, vertical, suspended, or parallel, but rather that it can be slightly tilted or have a deviation. For example, "horizontal" merely means that its direction is more horizontal relative to "vertical," not that the structure must be completely horizontal, but that it can be slightly tilted. Alternatively, it can be simplified to mean that the corresponding device / component / element, when set in a "horizontal," "vertical," "suspended," or "parallel" direction, can have an error / deviation of ±10% relative to the corresponding direction, more preferably within ±8%, more preferably within ±6%, more preferably within ±5%, and more preferably within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the present invention. In addition, the use of terms such as "first," "second," and "third" is merely used to distinguish the description of the same or similar components and should not be construed as emphasizing or implying the relative importance of a specific component. Furthermore, in the description of the embodiments of the present invention, "several," "multiple," and "several" represent at least two. The number of components can be any number, including two, three, four, or more. Furthermore, in the description of the technical solution of this invention, unless otherwise explicitly specified / limited / restricted, the terms "set up," "install," "connect," "link," "provide," "lay out," and "arrange" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can be common connection methods in the art, such as welding, riveting, bolting, and threaded connections. Such connections can be mechanical, electrical, or communication connections; they can be direct connections or indirect connections through an intermediate medium; and they can be internal connections between two components.
[0108] In this disclosure, for ease of description, the plane in which the ultrasonic sensor housing panel 4 is radially located is taken as the reference plane, the normal direction of the plane is taken as the Z-axis, and it points to the rear end of the housing (the end away from the panel 4), as shown in Figure 27.
[0109] To ensure consistent terminology and avoid unnecessary ambiguity, unless otherwise specified or indicated, the sensor in this disclosure refers to an ultrasonic sensor, and the housing refers to the ultrasonic sensor housing.
[0110] Example 1
[0111] As shown in Figures 1-3, the ultrasonic sensor housing described in this embodiment includes an inner shell 1, an outer shell 2 coaxially arranged on the outside of the inner shell 1, an annular plate 3 between the top of the inner shell 1 and the outer shell 2, and a panel 4 arranged at one end of the inner shell 1 near the annular plate 3. The panel 4 is used to connect a piezoelectric ceramic sheet 5. The inner shell 1, the outer shell 2, the annular plate 3 and the panel 4 are integrally formed.
[0112] The inner shell 1 and the outer shell 2 are connected by an annular plate 3, and a panel 4 is provided at one end of the inner shell 1 near the annular plate 3. The inner shell 1, outer shell 2, annular plate 3, and panel 4 are integrally formed, thus making the inner shell 1, outer shell 2, and panel 4 a whole. Since the two shells and matching layer of traditional ultrasonic sensors are made separately, secondary assembly of the two shells and matching layer is required during the production of the sensor. This is not only complex in structure and cumbersome in process, but also easy to be affected by the assembly tolerance during the assembly process, resulting in poor product consistency. However, the ultrasonic sensor shell disclosed in this invention has an integral setting of the inner shell 1, outer shell 2, and panel 4. During sensor production, the piezoelectric ceramic sheet 5 is connected to the panel 4, and the panel 4 is used as a matching layer for the piezoelectric ceramic sheet 5 to transmit signals. This allows the housing to be coupled with the piezoelectric ceramic sheet 5, eliminating the need for an additional matching layer and greatly simplifying the process. Furthermore, since the inner shell 1 and the outer shell 2 are integrated, there is no need for an embedded small plastic shell to position the piezoelectric ceramic sheet 5, and it also avoids the assembly tolerances that are easy to occur when assembling the two types of housings. The ultrasonic sensor housing disclosed in this invention has a simple process, effectively reduces variable factors, lowers the difficulty of production quality control, and effectively improves the production efficiency of traditional ultrasonic sensors.
[0113] In ultrasonic sensors, the matching layer is designed to reduce reflection and refraction losses during ultrasonic wave propagation, thereby improving energy transfer efficiency. To achieve this, the thickness of the matching layer is typically one-quarter (λ / 4) of the ultrasonic wavelength λ within the matching layer. However, it can be increased by an integer number of wavelengths λ, or by half a wavelength, to meet the requirements of insufficient thickness for manufacturing and increased strength. Preferably, it satisfies (n+1)λ / 4 (n=0,1,3,5…), effectively avoiding energy loss due to interference caused by reflection. Simultaneously, its material should have an acoustic impedance similar to that of the acoustic wave transmission medium in contact with the matching layer, and between the acoustic impedance of the piezoelectric ceramic sheet and the transmission medium. This allows the ultrasonic wave to propagate more smoothly into the transmission medium, effectively reducing reflection. In this disclosure, ultrasonic waves enter the air from the matching layer of the sensor. The material constituting the matching layer has a similar acoustic impedance to air, resulting in high transmission efficiency. However, if only the matching layer material is used and an integrated ultrasonic sensor housing is fabricated using existing structures, the entire housing will have high energy transmission efficiency both internally and externally. The entire housing will constitute an ideal transmission path for ultrasonic energy, negatively impacting the sensor's residual vibration and sensitivity, and failing to meet the corresponding requirements. Of course, it can be applied to specific scenarios where the requirements for residual vibration and sensitivity are low, or where the transmitter and receiver are separated.
[0114] In this disclosure, the inner shell 1, outer shell 2, annular plate 3, and panel 4 are preferably integrally formed using injection molding or machining. Taking injection molding as an example, a punch and die are prefabricated to design the shell shape. The shell material is preferably epoxy resin, with fillers added to reduce its density to a range of 0.35 g / cm³. 3 ~0.9g / cm 3 This ensures the uniformity of the housing material and meets the material properties required for the matching layer of the corresponding ultrasonic sensor. During the one-piece molding process, the housing material, which is in a semi-fluid state at room temperature, is first poured into the cavity mold. Then, the convex and concave molds are locked together and baked to solidify, forming the ultrasonic sensor housing described in this disclosure.
[0115] If the housing is manufactured using machining, the housing material is first batch-cured into profiles (generally rods), and then machined using a lathe or other cutting equipment according to the dimensional tolerances of the housing to meet the finished product requirements. Although this method requires the pre-preparation of rods and machining into a complete integrated housing, seemingly increasing production steps, these steps can be completed simultaneously with the production of other components of the ultrasonic sensor, or prepared in advance, or even outsourced. Currently, the aforementioned injection molding process suffers from relatively low efficiency due to its long curing time, difficulty in batch production and demolding efficiency, while machining is a mature process with high precision, high production efficiency, and good product consistency, resulting in a shorter production cycle for the ultrasonic sensor. The integrated housings in subsequent embodiments can all be manufactured using the aforementioned machining method, which will not be elaborated further.
[0116] The ultrasonic sensor housing disclosed herein eliminates the need for traditional outer shells and embedded plastic shells, thereby reducing material costs and solving the problem of difficult quality control caused by the complex structure and numerous variables of traditional housings.
[0117] In one or more embodiments, the density of the panel 4 and the entire ultrasonic sensor housing, made of the matching layer material, is 0.35 g / cm³. 3 ~0.9g / cm 3 As shown in Figure 4, the thickness of panel 4 is 'a', which is generally one-quarter of the wavelength of the ultrasonic wave in the matching layer material (similarly, the following embodiments also use a similar configuration), and the dimension of 'a' is 1.6 mm to 3.0 mm. The thickness of panel 4, which is composed of the matching layer, directly affects the coupling frequency and impedance parameters after the piezoelectric ceramic sheet 5 is bonded to the shell, and its control range is 1.6 mm to 3.0 mm.
[0118] In an alternative embodiment, as shown in FIG. 4, the outer diameter of the inner shell 1 is b. The outer diameter of the inner shell 1 affects the vibration of the product and the magnitude of ultrasonic energy, and its control range is Φ8.2 mm to Φ11 mm.
[0119] Preferably, as shown in FIG. 4, the thickness of the annular plate 3 is c. Different thicknesses of the annular plate 3 will affect the acoustic characteristics such as after-vibration and sensitivity of the formed sensor, and the thickness of the annular plate 3 is also directly related to the connection strength between the inner shell 1 and the outer shell 2. Its control range is 1 mm to 1.5 mm. That is, c < a is always maintained. The following embodiments are similar.
[0120] In one or several embodiments, as shown in FIG. 3, a first accommodation cavity 10 is formed between the inner shell 1 and the panel 4. The first accommodation cavity 10 is used to place the piezoelectric ceramic sheet 5, as shown in FIG. 6.
[0121] The piezoelectric ceramic sheet 5 is placed in the first accommodation cavity 10, and the piezoelectric ceramic sheet 5 is bonded to the panel 4. The first accommodation cavity 10 is used to accommodate the piezoelectric ceramic sheet 5, and the panel 4 is used as the matching layer of the piezoelectric ceramic sheet 5. There is no need to embed a small plastic shell for positioning the piezoelectric ceramic sheet 5, nor is it necessary to separately set up an additional matching layer. While ensuring the normal use of the piezoelectric ceramic sheet 5, the structure of the shell is simplified.
[0122] In an alternative embodiment, as shown in FIG. 3, a second accommodation cavity 20 is formed between the inner shell 1, the outer shell 2 and the annular plate 3.
[0123] By filling a damping layer 6 in the second accommodation cavity 20, the effect of buffering the after-vibration of the piezoelectric ceramic sheet 5 is achieved, as shown in FIG. 6.
[0124] In an alternative embodiment, as shown in FIG. 3, one end of the inner shell 1 away from the panel 4 is located inside the outer shell 2, so that the inner shell 1 does not protrude from the outer shell 2. During the subsequent assembly of the ultrasonic sensor, it is convenient to fill a potting layer 9 at the end of the outer shell 2 to block the inner shell 1, as shown in FIG. 6.
[0125] In an alternative embodiment, as shown in FIG. 1, a first groove 11 is further provided at one end of the inner shell 1 away from the panel 4. By providing the first groove 11 at one end of the inner shell 1 away from the panel 4, when installing the terminal wire 8 subsequently, it is convenient to snap the terminal wire 8 into the first groove 11 for fixing the terminal wire 8. There is no need to set up a pin rear cover as the intermediate connection part between the lead-out wire 30 of the piezoelectric ceramic sheet 5 and the terminal wire 8, and the direct connection between the terminal wire 8 and the lead-out wire 30 is realized. Without affecting the function of the ultrasonic sensor, the structural setting of the ultrasonic sensor is simplified, as shown in FIG. 6.
[0126] In an alternative embodiment, the annular plate 3 is flush with the panel 4. In an alternative embodiment, the inner shell 1 is cylindrical.
[0127] In an optional embodiment, the inner shell 1 and the outer shell 2 are cylindrical structures, with the inner shell 1 located inside the cavity of the outer shell 2, and the annular plate 3 connecting the inner shell 1 and the outer shell 2 into a whole.
[0128] In an optional embodiment, the inner shell 1 includes at least two first boss structures 40, all of which are arranged circumferentially around the outer shell 2, and one end of each first boss structure 40 is connected to the panel 4 or the annular plate 3.
[0129] Example 2
[0130] As shown in Figures 1-24, the ultrasonic sensor housing of this embodiment includes a shell 2. An annular plate 3 is located on the inner side of one end of the shell 2. A panel 4 is disposed on the inner side of the annular plate 3. The panel 4 is used to connect a piezoelectric ceramic sheet 5. The shell 2, the annular plate 3, and the panel 4 are integrally formed. A first annular groove 50 is provided on the outer side of the annular plate 3. Of course, in some figures, the first annular groove 50 is only present in Figure (a), while it is not present in Figure (b), but the other structures are the same.
[0131] The ultrasonic sensor housing disclosed herein includes an outer shell 2, an annular plate 3 on the inner side of one end of the outer shell 2, and a panel 4 disposed on the inner side of the annular plate 3. The outer shell 2, the annular plate 3, and the panel 4 are integrally formed, thereby making the outer shell 2, the annular plate 3, and the panel 4 a whole. Since the outer shell and the matching layer of traditional ultrasonic sensors are manufactured separately, secondary assembly of the outer shell and the matching layer is required during sensor production. This is not only structurally complex and cumbersome, but also easily affected by assembly tolerances during the assembly process, resulting in poor product consistency. However, the ultrasonic sensor housing of this disclosure, with the outer shell 2, the annular plate 3, and the panel 4 being integrally set, allows the piezoelectric ceramic sheet to be connected to the panel during sensor production. The panel 4 is used as the matching layer for the piezoelectric ceramic sheet to transmit signals, thereby realizing the coupling between the housing and the piezoelectric ceramic sheet. This eliminates the need for an additional matching layer and greatly simplifies the process.
[0132] Furthermore, a first annular groove 50 is provided on the outer side of the annular plate 3. With the cooperation of a specific acoustic barrel structure, the signal energy level is adjusted, thereby increasing the detection range of the ultrasonic sensor and constraining the sound wave propagation. This ensures that the ultrasonic sensor can still meet the usage requirements after the above-mentioned improvements to the ultrasonic sensor housing. As shown in Figure 27, in a preferred embodiment, the specific acoustic barrel structure is preferably, for example, a horn-shaped acoustic barrel 80 or a hollow cone-shaped structure.
[0133] All embodiments of the ultrasonic sensor housing described in this disclosure can be used in conjunction with the aforementioned acoustic barrel structure. The ultrasonic sensor housings provided in each embodiment, referring to Figures 5 and 6, configure the piezoelectric ceramic sheet 5 and related components to form an ultrasonic sensor. These are then combined with the corresponding acoustic barrel structure to form a sensor assembly, which can be used as a whole, such as by installing it on a cleaning robot to meet requirements such as target detection.
[0134] In one preferred embodiment, a piezoelectric ceramic sheet 5 is adhered to one side of the panel 4.
[0135] In this disclosure, the outer shell 2, the annular plate 3, and the panel 4 are preferably integrally formed using injection molding. Taking injection molding as an example, a punch and die are made in advance, and the shape of the shell is designed using the punch and die. The main component of the shell material is preferably epoxy resin, and fillers are added to the epoxy resin to reduce its density to a range of 0.35 g / cm³. 3 ~0.9g / cm 3 This ensures the uniformity of the housing material and meets the material properties required for the matching layer of the corresponding ultrasonic sensor. During the one-piece molding process, the housing material, which is in a semi-fluid state at room temperature, is first poured into the cavity mold. Then, the convex and concave molds are locked together and baked to solidify, forming the ultrasonic sensor housing described in this disclosure.
[0136] The ultrasonic sensor housing disclosed herein eliminates the need for traditional outer shells and embedded plastic shells, reducing material costs and solving the problem of complex structures and numerous variables in traditional housings, which leads to difficult quality control. This effectively improves the consistency and performance stability of the finished product. Furthermore, since the housing is integrally molded from the material constituting the matching layer, it forms a fully enclosed structure with an opening only at the rear end (away from panel 4) (also filled with a potting layer 9 for sealing). Moreover, because there are no adhesive, filling, or open areas with the outside environment in the direction facing panel 4 (where the matching layer is formed), external moisture, corrosive gases, dust, etc., will not penetrate the sensor's interior, nor will they be affected by high temperature, high humidity, or dust. This ensures that the sensor constructed using the embodiments provided in this disclosure has excellent performance. The structures in other embodiments also possess the same performance, which will not be described further below.
[0137] As shown in Figure 4, in one or more embodiments, the preferred density of panel 4 is 0.35 g / cm³. 3 ~0.9g / cm 3 The thickness of panel 4 is a, and the preferred size of a is 1.6mm to 3.0mm.
[0138] The thickness of panel 4 directly affects the coupling frequency and impedance parameters after the piezoelectric ceramic sheet 5 is bonded to panel 4, and its control range is preferably 1.6mm to 3.0mm.
[0139] In a preferred embodiment, the ultrasonic sensor housing disclosed herein further includes an inner shell 1, with an outer shell 2 fitted over the outer side of the inner shell 1. The inner shell 1 is connected to at least one of the annular plate 3 and the panel 4. The inner shell 1 serves to protect the inner structure of the outer shell 2 and facilitates assembly.
[0140] Preferably, the inner shell 1, outer shell 2, annular plate 3, and panel 4 are integrally formed.
[0141] The inner shell 1, outer shell 2, annular plate 3, and panel 4 are integrally formed, thus making the inner shell 1, outer shell 2, and panel 4 a single unit. Because traditional ultrasonic sensors have two shells and matching layers manufactured separately, secondary assembly of the two shells and matching layers is required during sensor production. This not only results in a complex structure and cumbersome process, but also makes the two shells susceptible to assembly tolerances during assembly, leading to poor product consistency. In contrast, the ultrasonic sensor housing disclosed herein, with its integral design of the inner shell 1, outer shell 2, and panel 4, allows for the connection of the piezoelectric ceramic sheet 5 to the panel 4 during sensor production.
[0142] By using panel 4 as a matching layer for the transmission of signals by the piezoelectric ceramic sheet 5, coupling with the piezoelectric ceramic sheet 5 using the housing is achieved, eliminating the need for an additional matching layer and greatly simplifying the process. Furthermore, due to the integrated design of the inner shell 1 and the outer shell 2, there is no need for an embedded small plastic shell for positioning the piezoelectric ceramic sheet 5, and assembly tolerances that are easy to occur when assembling the two types of shells are avoided. The ultrasonic sensor housing disclosed in this invention has a simple process, effectively reduces variable factors, lowers the difficulty of production quality control, and effectively improves the production efficiency of traditional ultrasonic sensors.
[0143] In this disclosure, the inner shell 1, outer shell 2, annular plate 3, and panel 4 are integrally molded using injection molding. A convex and concave mold is pre-fabricated to design the shell shape. The shell material is primarily epoxy resin, with fillers added to reduce its density to a range of 0.35 g / cm³. 3 ~0.9g / cm 3This ensures the uniformity of the housing material and meets the material properties required for the matching layer of the corresponding ultrasonic sensor. During the one-piece molding process, the housing material, which is in a semi-fluid state at room temperature, is first poured into the cavity mold. Then, the convex and concave molds are locked and baked to solidify, forming the ultrasonic sensor housing described in this disclosure. In a preferred embodiment, the inner shell 1 and the outer shell 2 are coaxially arranged to ensure the coaxiality of the inner and outer shells, thereby ensuring the symmetry of the ultrasonic sensor housing vibration and the uniform transmission of ultrasonic waves.
[0144] In a preferred embodiment, as shown in Figure 4, the outer diameter of the inner shell 1 is b. The outer diameter of the inner shell 1 affects the vibration and ultrasonic energy of the product, and its control range is Φ8.2mm~Φ11mm.
[0145] In a preferred embodiment, as shown in FIG4, the thickness of the annular plate 3 is c. Different thicknesses of the annular plate 3 will affect the acoustic characteristics of the sensor, such as residual vibration and sensitivity. The thickness of the annular plate 3 is also related to the connection strength between the inner shell 1 and the outer shell 2, and its control range is 1mm to 1.5mm.
[0146] As shown in Figure 3, in one or more embodiments, a first receiving cavity 10 is formed between the inner shell 1 and the panel 4. As shown in Figure 6, the first receiving cavity 10 is used to place the piezoelectric ceramic sheet 5.
[0147] The piezoelectric ceramic sheet 5 is placed in the first receiving cavity 10 and is bonded to the panel 4. The first receiving cavity 10 accommodates the piezoelectric ceramic sheet 5, and the panel 4 serves as a matching layer for the piezoelectric ceramic sheet 5. There is no need to embed a small plastic shell for positioning the piezoelectric ceramic sheet 5, nor is there a need to set a matching layer. The shell structure is simplified while ensuring that the piezoelectric ceramic sheet 5 can be used normally.
[0148] In a preferred embodiment, as shown in Figures 3 and 6, a second receiving cavity 20 is formed between the inner shell 1, the outer shell 2, and the annular plate 3. The second receiving cavity 20 is used to accommodate the vibration damping layer, thereby improving the residual vibration of the piezoelectric ceramic sheet 5.
[0149] In a preferred embodiment, as shown in Figures 3 and 6, the end of the inner shell 1 away from the panel 4 is located inside the outer shell 2, so that the inner shell 1 does not protrude from the outer shell 2. During the subsequent assembly of the ultrasonic sensor, it is convenient to fill the end of the outer shell 2 with a potting layer 9 to seal the inner shell 1.
[0150] In a preferred embodiment, as shown in FIG1, the inner shell 1 is further provided with a first groove 11 at the end away from the panel 4. By providing a first groove 11 at the end of the inner shell 1 away from the panel 4, it is convenient to snap the terminal wire 8 into the first groove 11 for fixing the terminal wire 8 during subsequent installation. It is not necessary to set up a pin back cover as an intermediate connection part between the lead wire 30 of the piezoelectric ceramic sheet 5 and the terminal wire 8, so as to realize the direct connection between the terminal wire 8 and the lead wire 30. The structure of the ultrasonic sensor is simplified without affecting the function of the ultrasonic sensor, as shown in FIG6.
[0151] Preferably, there are at least two first grooves 11, and all first grooves 11 are arranged circumferentially along the inner shell 1.
[0152] In a preferred embodiment, the inner shell 1 is cylindrical. Without the first groove 11, the Z-axis vibration is small, the vibration at the product end face is relatively weak, and more energy is concentrated at the rear end, resulting in greater vibration at the rear end. With the first groove 11 present, the manufactured ultrasonic sensor vibrates significantly along the Z-axis, the vibration at the product end face is stronger, energy transfer is more efficient, and residual vibration is smaller. The outer diameter of the inner shell is preferably Φ8.2mm to Φ11mm.
[0153] As shown in Figures 9 and 10, in a preferred embodiment, the inner shell 1 includes at least two first boss structures 40, all of which are arranged circumferentially around the outer shell 2. One end of each first boss structure 40 is connected to at least one of the panel 4 and the annular plate 3. The difference between Figures 9(a) and 9(b) is that in Figure 9(a), the annular plate 3 has a first annular groove 50 on its outer side, while in Figure 9(b), the annular groove 50 is not provided.
[0154] Since all the first boss structures 40 are arranged at intervals along the circumference of the outer shell 2, the manufactured ultrasonic sensor vibrates greatly along the Z-axis, the vibration of the product end face is stronger, it can generate more energy transfer, and the residual vibration is smaller.
[0155] In a preferred embodiment, the outer shell 2 is cylindrical.
[0156] In a preferred embodiment, the outer shell 2, the annular plate 3, and the panel 4 form an inner cavity 21 that is closed at one end. That is, there are no through holes in the outer shell 2, the annular plate 3, the panel 4, the connection between the annular plate 3 and the outer shell 2, or the connection between the annular plate 3 and the panel 4.
[0157] In a preferred embodiment, a solder joint receiving groove 41 is provided on the inner side of the panel 4 to receive solder joints on the piezoelectric ceramic sheet 5, and at the same time, it can be used for positioning the piezoelectric ceramic sheet 5.
[0158] In a preferred embodiment, the weld joint receiving groove 41 extends partially onto the annular plate 3.
[0159] As shown in Figure 13, in a preferred embodiment, a second annular groove 60 is provided on the inner side of the annular plate 3.
[0160] The area of the panel in contact with the piezoelectric ceramic sheet is adjusted by the second annular groove 60, thereby adjusting the residual vibration of the ultrasonic sensor. Furthermore, the third annular groove can be used to fill with elastic adhesive to suppress the vibration of the piezoelectric ceramic sheet toward the shell, or it can be filled with backing adhesive to form part of the backing layer for better vibration reduction.
[0161] As shown in Figure 13, in a preferred embodiment, the second annular groove 60 is provided correspondingly to the first annular groove 50, thereby jointly controlling the thickness of the annular plate 3 to reduce the influence of the annular plate 3 on the vibration of the panel 4.
[0162] As shown in Figure 23, in a preferred embodiment, the annular plate 3 is flush with the inner side of the panel 4.
[0163] In a preferred embodiment, the inner shell 1 and the outer shell 2 are cylindrical structures, with the inner shell 1 located inside the cavity of the outer shell 2, and the annular plate 3 connecting the inner shell 1 and the outer shell 2 into a whole.
[0164] As shown in Figures 15 and 15-1, in a preferred embodiment, the inner side of the annular plate 3 is higher than the inner side of the panel 4, and the annular plate 3 and the inner side of the panel 4 form a placement groove 42 for placing the piezoelectric ceramic sheet 5. The placement groove 42 is used to place the piezoelectric ceramic sheet 5.
[0165] As shown in Figure 12, preferably, a reinforcing rib 54 is connected between the opposite sides of the first annular groove 50.
[0166] As shown in Figure 12, in a preferred embodiment, there are at least two reinforcing ribs 54, which are spaced apart from each other, and the reinforcing ribs 54 divide the first annular groove 50 into several arc-shaped grooves 51.
[0167] Preferably, the reinforcing ribs 54 are arranged such that the first annular groove 50 is divided into several arc-shaped grooves 51, all of which are arranged in a ring, and adjacent arc-shaped grooves 51 are spaced apart by the reinforcing ribs 54.
[0168] In a preferred embodiment, the reinforcing rib 54, the outer shell 2, the annular plate 3, and the panel 4 are integrally formed.
[0169] In a preferred embodiment, a third annular groove 52 is provided at intervals on the inner side of the first annular groove 50.
[0170] In a preferred embodiment, a third annular groove 52 is provided at intervals on the outer side of the first annular groove 50.
[0171] In a preferred embodiment, a third annular groove 52 is provided at intervals on both the inner and outer sides of the first annular groove 50.
[0172] The residual vibration and ultrasonic echo energy are controlled by the cooperation of the first annular groove 50 and the third annular groove 52.
[0173] In a preferred embodiment, the bottom of the first annular groove 50 is further provided with a bottom groove 53.
[0174] Preferably, a portion of at least one side of the bottom groove 53 and the first annular groove 50 are coplanar.
[0175] In a preferred embodiment, the bottom groove 53 is disposed in the middle of the bottom of the first annular groove 50 along the radial direction of the first annular groove 50.
[0176] In a preferred embodiment, at least a portion of the first annular groove 50 extends laterally onto the panel 4.
[0177] In a preferred embodiment, the outer surface of the panel 4 protrudes from the end face of the corresponding side of the outer shell 2. After passing through the convex interface, the sound waves diffuse outwards along the central axis, resulting in a wider sound wave emission angle, a more uniform sound field in the near-field region, and suitability for detecting large-area targets, while also increasing the detection angle.
[0178] In a preferred embodiment, the outer surface of the panel 4 has an arcuate portion 43, which convex outwards toward the outer side of the panel 4. This convex surface increases the ultrasonic wave emission and reception angles, resulting in strong emission of sound waves. This addresses the needs of certain scenarios, such as those requiring a larger detection angle, achieving wide near-field coverage.
[0179] In a preferred embodiment, the outer surface of the panel 4 has an arcuate portion 43, which is recessed towards the inner side of the panel 4. This concave design forces sound wave energy to propagate and converge along the normal direction of the concave surface, resulting in narrower directivity and a smaller beam angle. To meet certain user needs, this can significantly improve local energy intensity, and the higher the frequency, the shorter the wavelength, and the stronger the focusing ability.
[0180] In one preferred embodiment, the projection of the inner side surface of the panel 4 along the radial direction of the outer casing 2 lies on the side surface of the first annular groove 50. In another preferred embodiment, the outer casing 2 is cylindrical. In yet another preferred embodiment, at least a portion of the first annular groove 50 extends laterally onto the panel 4.
[0181] Example 3
[0182] Based on Embodiment 1, as shown in Figures 5-6, the ultrasonic sensor described in this embodiment includes a piezoelectric ceramic sheet 5, a damping layer 6, a backing layer 7, a terminal wire 8, a potting layer 9, and a housing structure as described in Embodiment 1. The piezoelectric ceramic sheet 5 and the backing layer 7 are sequentially disposed inside the inner housing 1, and the piezoelectric ceramic sheet 5 is connected to the panel 4. The damping layer 6 is also filled between the inner housing 1 and the outer housing 2, and the end of the outer housing 2 away from the panel 4 is filled with the potting layer 9. The terminal wire 8 passes through the potting layer 9 and the backing layer 7 and is connected to the lead wire 30 of the piezoelectric ceramic sheet 5.
[0183] During production, the piezoelectric ceramic sheet 5 and the backing layer 7 are sequentially placed inside the inner shell 1, and the piezoelectric ceramic sheet 5 is connected to the panel 4. The panel 4 serves as a matching layer for the piezoelectric ceramic sheet 5 to transmit signals, thereby enabling coupling between the shell and the piezoelectric ceramic sheet 5. This eliminates the need for an additional matching layer, greatly simplifying the process. Furthermore, since the inner shell 1 and the outer shell 2 are integrated, there is no need to embed a small plastic shell for positioning the piezoelectric ceramic sheet 5, which also avoids assembly tolerances that are prone to occur when assembling the two shells, greatly improving the production efficiency of ultrasonic sensors.
[0184] Preferably, as shown in Figure 6, the backing layer 7 and the vibration damping layer 6 are integrally cast, thereby reducing the number of processes and increasing efficiency.
[0185] This embodiment also discloses a method for producing an ultrasonic sensor, the specific steps of which are: (1) preparing the housing material; (2) injecting the housing material into the cavity mold using a precision dispensing machine, the amount of adhesive being controlled by the dispensing air pressure and dispensing time; (3) welding the lead wires 30 of the piezoelectric ceramic sheet 5, the welding using professional laser welding equipment, the lead wires 30 being silver-plated copper wires; (4) pre-installing the piezoelectric ceramic sheet 5 with the welded lead wires 30 on the punch platform and adsorbing it under negative pressure; (5) then locking the punch and cavity molds together. Baking one end for a time to cure, then demolding, (6) demolding, using a mechanical gripper to separate the convex and concave molds, and taking out the sensor housing; (7) soldering the external terminal wire 8 to the lead wire 30 of the piezoelectric ceramic sheet 5; (8) using a precision dispensing machine to inject backing adhesive into the inner shell 1 to form a backing layer 7, the amount of adhesive is controlled by dispensing air pressure and dispensing time; (9) using a precision dispensing machine to inject potting adhesive into the outer shell 2 to form a potting layer 9, the amount of adhesive is controlled by dispensing air pressure and dispensing time, completing the fabrication of the ultrasonic sensor. The lead wire 30 includes a positive electrode wire 81 and a negative electrode wire 82.
[0186] The ultrasonic sensor described in this embodiment is preferably used for material identification and distance measurement.
[0187] Example 4
[0188] As shown in Figures 5-6, the ultrasonic sensor described in this embodiment includes the ultrasonic sensor housing described in Embodiment 1 or 2. The ultrasonic sensor housing includes an outer shell, an annular plate on the inner side of one end of the outer shell, and a panel on the inner side of the annular plate. The outer shell, the annular plate, and the panel are integrally formed, thus making the outer shell, the annular plate, and the panel a single unit. Since the inner shell, outer shell, and matching layer of traditional ultrasonic sensors are manufactured separately, secondary assembly of the outer shell, the annular plate, and the panel is required during sensor production. This not only results in a complex structure and cumbersome process but is also easily affected by assembly tolerances, leading to poor product consistency. However, the ultrasonic sensor housing disclosed in this invention, with its outer shell, annular plate, and matching layer all integrally formed, provides a unified structure. The integrated design of the annular plate and the panel allows the piezoelectric ceramic sheet to be connected to the panel during sensor production. The panel serves as a matching layer for the piezoelectric ceramic sheet's signal transmission, thereby enabling coupling between the housing and the piezoelectric ceramic sheet without the need for an additional matching layer. This significantly simplifies the manufacturing process. Furthermore, a first annular groove is provided on the outer side of the annular plate to increase the signal transmission and reception angles, resulting in a relatively larger detection range for the manufactured ultrasonic sensor. It also provides a certain focusing effect on sound waves, ensuring that the ultrasonic sensor still meets usage requirements even after the aforementioned improvements to the ultrasonic sensor housing.
[0189] Furthermore, since the outer shell 2, the annular plate 3 and the panel 4 are integrated, there is no need to embed a small plastic shell for positioning the piezoelectric ceramic sheet 5, and the assembly tolerance that is easy to occur when assembling the two shells is avoided. The ultrasonic sensor shell disclosed herein has a simple process, effectively reduces variable factors, reduces the difficulty of production quality control, and effectively improves the production efficiency of traditional ultrasonic sensors.
[0190] In this disclosure, the outer shell 2, the annular plate 3, and the panel 4 are integrally molded using injection molding. A convex and concave mold is pre-fabricated to design the shape of the shell. The shell material is primarily epoxy resin, with fillers added to reduce its density to a range of 0.35 g / cm³. 3 ~0.9g / cm 3 This ensures the uniformity of the housing material and meets the material properties required for the matching layer of the corresponding ultrasonic sensor. During the integral molding process, the housing material, which is in a semi-fluid state at room temperature, is first poured into the cavity mold, and then the convex and concave molds are locked and baked to form the ultrasonic sensor housing described in this disclosure.
[0191] The ultrasonic sensor housing disclosed herein eliminates the need for traditional outer shells and embedded plastic shells, thereby reducing material costs and solving the problem of difficult quality control caused by the complex structure and numerous variables of traditional housings.
[0192] In one or more embodiments, the density of panel 4 is 0.35 g / cm³. 3 ~0.9g / cm 3 As shown in Figure 4, the thickness of panel 4 is 'a', and the dimension of 'a' is 1.6 mm to 3.0 mm. The thickness of panel 4 directly affects the coupling frequency and impedance parameters after the piezoelectric ceramic sheet 5 is bonded to the shell, and its control range is 1.6 mm to 3.0 mm.
[0193] In an optional embodiment, as shown in Figure 4, the thickness of the annular plate 3 is c. Different thicknesses of the annular plate 3 will affect the acoustic characteristics of the sensor, such as residual vibration and sensitivity. The thickness of the annular plate 3 is also related to the connection strength between the inner shell 1 and the outer shell 2, and its control range is 1mm to 1.5mm.
[0194] The piezoelectric ceramic sheet 5 is bonded to the panel 4 and accommodated by the first receiving cavity 10. The panel 4 serves as a matching layer for the piezoelectric ceramic sheet 5. There is no need for an embedded small plastic shell to position the piezoelectric ceramic sheet 5, nor is there a need to set up a matching layer. The shell structure is simplified while ensuring that the piezoelectric ceramic sheet 5 can be used normally.
[0195] The ultrasonic sensor described in this embodiment is preferably used for material identification and distance measurement.
[0196] Example 5
[0197] As shown in Figures 5-6, the ultrasonic sensor described in this embodiment includes the ultrasonic sensor housing described in embodiment 2, and also includes a piezoelectric ceramic sheet 5, a damping layer 6, a backing layer 7, and a terminal wire 8. The difference between this embodiment and embodiment 3 or 4 is that the piezoelectric ceramic sheet 5 is connected to the inner side of the panel 4, the damping layer 6 is located in the second annular groove 60, and the backing layer 7 is disposed on the inner side of the outer shell 2.
[0198] The inner side of the outer casing 2 is also filled with a potting layer 9, which is located on the side of the backing layer 7 away from the piezoelectric ceramic sheet 5; the terminal wire 8 passes through the potting layer 9 and enters the backing layer 7, and is connected to the lead wire 30 of the piezoelectric ceramic sheet 5.
[0199] A second annular groove 60 is provided on the inner side of the annular plate 3. The area of the panel in contact with the piezoelectric ceramic sheet is adjusted by the second annular groove 60, thereby adjusting the residual vibration of the ultrasonic sensor. Furthermore, the second annular groove 60 is used to fill elastic adhesive to suppress the vibration of the piezoelectric ceramic sheet toward the outer shell. It can also be filled with backing adhesive to form part of the backing layer for better vibration reduction.
[0200] In the production of the ultrasonic sensor described in this disclosure, the piezoelectric ceramic sheet 5 and the backing layer 7 are sequentially arranged inside the housing 2, and the piezoelectric ceramic sheet 5 is connected to the panel 4. The panel 4 serves as a matching layer for the transmission of signals by the piezoelectric ceramic sheet 5, thereby achieving coupling between the housing and the piezoelectric ceramic sheet 5. This eliminates the need for an additional matching layer, greatly simplifying the process. Furthermore, since the housing 2, the annular plate 3, and the panel 4 are integrally formed, there is no need for an embedded small plastic shell for positioning the piezoelectric ceramic sheet, and assembly tolerances that are prone to occur when assembling two housings are avoided, greatly improving the production efficiency of the ultrasonic sensor. Alternatively, during production, the piezoelectric ceramic sheet 5 and the backing layer 7 can be sequentially placed inside the inner shell 1, with the piezoelectric ceramic sheet 5 connected to the panel 4. The panel 4 serves as a matching layer for the piezoelectric ceramic sheet 5 to transmit signals, thereby enabling coupling between the shell and the piezoelectric ceramic sheet 5. This eliminates the need for an additional matching layer, greatly simplifying the process. Furthermore, since the outer shell 2, the annular plate 3, and the panel 4 are integrally formed, there is no need for an embedded small plastic shell to position the piezoelectric ceramic sheet 5. This also avoids assembly tolerances that are prone to occur when assembling two shells, greatly improving the production efficiency of ultrasonic sensors.
[0201] In an optional implementation, as shown in Figure 6, the backing layer 7 and the vibration damping layer 6 are integrally cast, thereby reducing the number of processes and increasing efficiency.
[0202] This disclosure also discloses a method for manufacturing an ultrasonic sensor, the specific steps of which are: a. preparing the housing material; b. injecting the housing material into the cavity mold using a precision dispensing machine, the amount of adhesive being controlled by dispensing air pressure and dispensing time; c. welding the lead wires 30 of the piezoelectric ceramic sheet 5 using professional laser welding equipment, the lead wires 30 being made of silver-plated copper wire; d. pre-installing the piezoelectric ceramic sheet 5 with the welded lead wires 30 on the punch platform and adsorbing it under negative pressure; e. then assembling and locking the punch and cavity molds together, and baking. f. Demolding: Use a robotic gripper to separate the convex and concave molds and remove the ultrasonic sensor housing; g. Solder the external terminal wires 8 to the lead wires 30 of the piezoelectric ceramic sheet 5; h. Use a precision dispensing machine to inject backing adhesive into the inner shell 1 to form a backing layer 7. The amount of adhesive is controlled by dispensing air pressure and dispensing time; i. Use a precision dispensing machine to inject potting compound into the outer shell 2 to form a potting layer 9. The amount of adhesive is controlled by dispensing air pressure and dispensing time, thus completing the fabrication of the ultrasonic sensor.
[0203] As an improvement, the production method can also produce the ultrasonic sensor housing by machining, the specific steps of which have been described above. After obtaining the ultrasonic sensor housing formed by machining, the piezoelectric ceramic sheet 5 is bonded to the panel 4, and other components are configured using steps similar to the injection molding process described above, thereby forming the ultrasonic sensor.
[0204] All embodiments of the ultrasonic sensor housing described in this disclosure can be used in conjunction with the aforementioned acoustic barrel structure. The ultrasonic sensor housings provided in each embodiment, referring to Figures 5 and 6, configure the piezoelectric ceramic sheet 5 and related components to form an ultrasonic sensor. These are then combined with the corresponding acoustic barrel structure to form a sensor assembly, which can be used as a whole, such as by installing it on a cleaning robot to meet requirements such as target detection.
[0205] The ultrasonic sensor housing described in this disclosure, and the related technical solutions for ultrasonic sensors using the housing, can be used for material identification and distance measurement.
[0206] In one embodiment of the sensor assembly based on the ultrasonic sensor of this disclosure shown in Figure 28, unlike the sensor assemblies based on ultrasonic sensors and acoustic barrel structures disclosed previously, the sensor assembly of this embodiment adds a mounting sleeve 91 at the rear end of the ultrasonic sensor based on the housing structure provided in the aforementioned embodiments. This mounting sleeve is used for mounting and fixing to a cleaning robot and related equipment. A potting compound is poured into the mounting sleeve to form a second potting layer 92. Furthermore, a rear cover can be added to the rear end of the sensor. The rear cover can be constructed using a PCB board (printed computer board) to form a rear cover PCB board 31, which provides further sealing and protection for the sensor and facilitates the connection of the lead wires 30 and terminal wires 8. Specifically, the lead wires 30 and terminal wires 8 are soldered to the rear cover PCB board 31 to achieve electrical connection, which also facilitates manufacturing. This rear cover PCB board 31 can also be used in the sensors provided in the aforementioned embodiments. The assembly provided in this embodiment, by setting the mounting sleeve 91, can meet the installation needs of different users (such as mounting on a cleaning robot to meet target detection requirements), thereby improving the product's adaptability and increasing production efficiency.
[0207] Figure 29 illustrates the application of the ultrasonic sensor disclosed herein in a cleaning robot, used for the robot to identify the material of the cleaning target (the target being detected) and measure its distance. The ultrasonic sensor is connected to a drive circuit, and under the action of the drive circuit, the sensor generates ultrasonic waves and receives the echoes to detect the target; the ultrasonic sensor and the drive circuit together form a detection module.
[0208] To further test the performance of the ultrasonic sensor of this disclosure, Figure 30 provides a corresponding detection circuit for testing the performance of the ultrasonic sensor (echo detection of a baffle 100mm away from the sensor), and reading the waveform signal of the echo using an oscilloscope. Figure 31 shows the detection structure of the sensor provided in several embodiments of this disclosure based on this circuit.
[0209] Figure 31 shows the simulation and actual measurement results of multiple embodiments of the ultrasonic sensor of the present disclosure. Figure 31(b) is a continuation of Figure 31(a). The simulation and actual measurement are carried out under the same simulation and test conditions. The obtained detection structures are shown in Table 1. The connecting ribs in the table are the annular plates 3 in the foregoing embodiments. However, the foregoing annular plates 3 are continuous planar structures, while the connecting ribs can be structures with gap ports, connecting the panel 4 formed by the matching layer and the housing 2 and becoming an integral body. Or rather, the matching layer material forming the panel 4 extends to form the annular plate 3 or the connecting ribs, and further extends to form the housing 2. The thickness of the connecting ribs is less than the thickness of the matching layer. In each embodiment of Table 1, the same matching layer (thickness a) is used. Among them, A - F are simulated and actually measured with connecting ribs of different thicknesses (thickness c < a); while for the structures formed by the extension of the matching layer material at the positions of the connecting ribs of H - J, the thickness is the same as that of the matching layer (a = c, or a < c). From the simulation and actual measurement results in Table 1, the simulation and actual measurement both have the same trend. When c < a, for different sizes of c, the actual measured after - vibration of the corresponding sensor is less than 160 μs (simulation is less than 21 μs), and the actual measured sensitivity (another name for signal sensitivity, a physical quantity used to measure the sound wave detection ability of an ultrasonic sensor) is greater than 1 V. The simulated emitted sound pressure performance is very ideal. This emitted sound pressure reflects the sensitivity. The higher the sound pressure, the better the sensitivity (higher sensitivity). When a ≤ c, neither the after - vibration nor the sensitivity of the simulation or actual measurement can meet the usage requirements. Especially during the actual measurement process, the sensitivity cannot obtain effective data, and the after - vibration is relatively high.
[0210] Table 1:
[0211] Figure 32 shows the simulation of connecting ribs with the same thickness (thickness c) and matching layers with the same thickness (thickness a), where c < a, and the connecting ribs are at different positions; Figure 32(b) is a continuation of Figure 32(a). The simulation results are shown in Table 2, where H1 < H2 < H3 …… < H 10 . Given that the trends of the simulation and actual measurement results in Table 1 are the same, only simulation is carried out in this table. According to the simulation results, no matter how the position of the connecting ribs changes in the Z - direction, their after - vibration and sensitivity are relatively ideal and can meet the application requirements. Only for different positions, the simulation results are slightly different.
[0212] Table 2:
[0213] Based on the simulation and measurement results above, when the entire shell is made of the matching layer material, as long as the thickness of the connection part (connecting rib or annular plate 3) between the matching layer (i.e., panel 4) and the outer shell 2 is less than that of the matching layer, the residual vibration of the sensor can be effectively reduced and its sensitivity improved. However, the residual vibration, sensitivity and other indicators of the sensor will vary slightly depending on the thickness and position. In the aforementioned embodiments, by setting annular grooves on the inner and outer sides of the annular plate 3, the essence is to reduce the thickness at this point (that is, during the transmission of ultrasonic waves from the matching layer to the outer shell 2, the cross-sectional area of the transmission path at this point suddenly decreases, and of course, the connection stiffness also decreases with the reduction of the cross-sectional area). Then, the cross-sectional area suddenly increases at the outer shell 2, thereby forming multiple reflecting surfaces. The ultrasonic waves are reflected multiple times in these surfaces and form interference or natural attenuation inside the shell material made of the matching layer material, thereby reducing the energy transfer to the outer shell, effectively reducing the residual vibration, and also improving the sensitivity of the sensor (the ultrasonic waves received by the sensor through the matching layer are also reflected by the reflecting surfaces due to the sudden change in cross-section and converge on the matching layer). In fact, the reduction of stiffness also plays a certain role. Therefore, as the integrated sensor housing design of this disclosure, as long as the cross-section of the matching layer extends into the outer shell and abruptly (becomes smaller), that is, a concave step is formed inward toward the interior of the matching layer, multiple reflective interfaces are formed through this abrupt change, reducing stiffness and achieving effective attenuation in the energy transfer process, thereby suppressing residual vibration and improving sensitivity.
[0214] The ultrasonic sensor housing described in this disclosure, and the related technical solutions for ultrasonic sensors using the housing, can be used for material identification and distance measurement. The appropriate technical solution disclosed in the corresponding embodiment can be selected for use depending on the application scenario and material conditions. Of course, the technical solutions can also be applied to other similar scenarios or technical fields; and, where the relevant technical indicators meet the requirements, related applications can also be carried out.
[0215] This disclosure has significant advantages over existing technologies in terms of performance indicators. Tables 3, 4, and 5 provide a comparison of the relevant technical parameters. It should be noted that in Tables 3 and 4, since the same driving circuit is used, the residual vibration of the same sensor remains unchanged. As can be seen from the tables, the relevant technical indicators of the embodiments of this disclosure are significantly superior to those of the prior art.
[0216] Table 3: Measured results of key technical indicators of existing ultrasonic sensors with dual-shell structures.
[0217] Table 4: Measured results of key technical indicators of the ultrasonic sensor provided in one embodiment of this disclosure.
[0218] Table 5: Comparison of standard deviations of relevant technical indicators of a product according to an embodiment of this disclosure and existing dual-shell structure sensors (statistical results obtained from actual measurements of 2000 units each).
[0219] Based on previous experiments and trial production, the technical solution disclosed herein improves production efficiency by more than 40% and achieves a high yield rate. In the prior art, the yield rate of ultrasonic sensors with double-shell structures is only 80%, while the yield rate of ultrasonic sensors disclosed herein is over 90%, which is significantly better than the prior art.
[0220] Furthermore, as shown in Figure 33, the sensor described in this disclosure and the existing dual-shell ultrasonic sensor were subjected to a dual 85-degree aging test (85°C, 85% humidity, also known as a high-temperature and high-humidity test, used for aging tests of electronic devices) under the same conditions. The sensor's performance was judged by detecting its signal sensitivity. In the figure, signal sensitivity was detected by detecting the second echo. After 5 days, a significant difference was observed in the second echoes of the two sensors. The signal sensitivity of the dual-shell structure had decreased significantly, to approximately 70% of its initial value, while the sensor in this disclosure showed no significant change. In particular, after 30 days, the signal sensitivity of the dual-shell structure had decreased significantly, to only 60% of its initial value, while the sensor in this disclosure still maintained more than 90% of its initial value. Although both still meet the relevant requirements, the embodiment of this disclosure exhibits stronger stability and reliability, and a longer service life.
[0221] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
[0222] It should be noted that, unless otherwise stated, the technical or scientific terms used in this disclosure shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure pertains.
[0223] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. In the description of this disclosure, "a plurality of" means two or more, unless otherwise expressly and specifically defined.
[0224] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and not to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure, and they should all be covered within the scope of the claims and specification of this disclosure. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. This disclosure is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.