Electronics module
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HIRSCHMANN CAR COMMUNICATION
- Filing Date
- 2025-12-23
- Publication Date
- 2026-07-30
Smart Images
Figure EP2025088933_30072026_PF_FP_ABST
Abstract
Description
[0001] HCC 19.299-PC 1
[0002] Description
[0003] Electronic module
[0004] The invention relates to an electronic module for a vehicle.
[0005] The patent application claims priority over the German patent application.
[0006] 102025102650.5, the disclosure content of which is hereby incorporated by reference.
[0007] Electronic modules, especially radio modules, for vehicles are known from the state of the art.
[0008] The object of the invention is to provide an improved electronic module for a vehicle.
[0009] The object of the invention is achieved by the electronic module of the independent claim. Advantageous embodiments are the subject of the dependent claims.
[0010] According to one aspect, an electronic module, in particular a radio module, for a vehicle, is provided with a module housing and at least one printed circuit board, wherein the module housing comprises a housing base and a housing cover, wherein the housing base defines a receiving space for receiving the printed circuit board, wherein at least one support element is formed in the receiving space, wherein the printed circuit board can be placed at least partially on the support element, wherein the housing cover comprises a contacting element designed as a spring element, wherein the contacting element is configured to contact the printed circuit board and to apply a contact force, and wherein the printed circuit board can be pressed against the at least one support element of the housing base by the applied contact force of the contacting element and can be securely positioned in the module housing.
[0011] This allows for the technical advantage of providing an improved electronic module, particularly a radio module for a vehicle. The electronic module comprises a module housing with a base and a housing cover that can be detachably connected to the base. The base defines a receiving space in which at least one printed circuit board can be arranged. HCC 19.299-PC 2
[0012] The housing base comprises at least one support element on which the printed circuit board can be placed. Furthermore, the housing cover comprises at least one contact element, designed as a spring element and configured to provide a contact force.
[0013] By contacting the circuit board with the contacting element and by applying pressure to the circuit board with the contacting element, the circuit board can be pressed against the support element. This allows the circuit board to be structurally secured in its position within the housing.
[0014] This eliminates the need for additional fixings, such as rivets, which structurally connect the circuit board to the housing base.
[0015] By primarily securing the printed circuit board (PCB) within the module housing by clamping it between the support element of the housing base and the contact element of the housing cover, a simple and secure positioning of the PCB within the housing is ensured. Furthermore, this clamping action allows the PCB to remain movable relative to the housing base and / or the housing cover.
[0016] This allows the circuit board to expand or contract due to thermal stress without causing damage to the circuit board.
[0017] By clamping the circuit board between the support element of the housing base and the contacting element of the housing cover, the structurally stable and secure positioning of the circuit board in the module housing can be ensured despite the thermally induced expansions or contractions of the circuit board.
[0018] Since clamping the circuit board in the module housing eliminates the need for through-holes in the board, as is required when riveting, thermally and mechanically induced stress effects within the circuit board can be reduced. HCC 19.299-PC 3
[0019] Secure positioning, as defined in the application, means that the printed circuit board (PCB) is held in a clearly defined position relative to the housing base. However, the PCB is capable of moving relative to the housing base, for example, due to thermal expansion and / or contraction. These movements do not, however, affect the secure positioning of the PCB.
[0020] According to one embodiment, the circuit board comprises at least one electrically and / or thermally conductive contact area for contacting the contacting element and / or for contacting the support element, wherein the circuit board is electrically and / or thermally contacted with the housing base and / or with the housing cover by pressing it against the support element through the contacting element.
[0021] This allows for the technical advantage that, through the electrically and / or thermally conductive contact area within the circuit board, where the circuit board contacts the contacting element and / or the support element when the circuit board is clamped between the support element and the contacting element, an electrical and / or thermal contact of the circuit board with the housing base and / or the housing cover of the module housing is achieved.
[0022] By electrically and / or thermally contacting the circuit board with the housing base and / or the housing cover, an electrical and / or thermal connection of the circuit board to the module housing can be achieved.
[0023] The electrical connection of the circuit board to the module housing provides a reliable EMC solution.
[0024] The thermal connection of the circuit board to the module housing enables efficient heat dissipation from the electronic components of the circuit board to the module housing and from there to the environment of the electronic module.
[0025] The electronic module is designed according to the invention for use in vehicle construction. In particular, the electronic module can be arranged in the roof area of the vehicle. High / low temperatures and strong temperature fluctuations, between +105°C and -40°C, are not uncommon in the roof area of the vehicle. HCC 19.299-PC 4
[0026] Thanks to the efficient thermal connection between the circuit board and the module housing, the heat generated by the electronic components on the circuit board can be effectively dissipated to the module housing and from there to the surrounding environment, even at high ambient temperatures. This ensures reliable and error-free operation of the electronic module, even under extreme temperature conditions.
[0027] According to one embodiment, the support element is designed as a support projection extending from a base surface of the housing base with a support surface, and / or wherein the support element is formed integrally on the housing base.
[0028] This allows for the technical advantage of a secure structural connection of the circuit board to the housing base.
[0029] The contact surface of the support projection allows for a robust and efficient electrical and / or thermal connection of the circuit board to the housing base.
[0030] By resting the circuit board on the support projection extending from the base of the housing, additional module components can be arranged below the circuit board within the housing. This allows for a space-saving design of the entire electronic module.
[0031] By forming the support element as a single piece with the housing base, good thermal and / or electrical connection between the support element and the housing base can be achieved. Furthermore, this allows for simple manufacturing and a robust housing base structure.
[0032] In one embodiment, the contacting element is designed as an S-shaped profile with a first bending area and a second bending area with opposite curvatures, wherein the second bending area defines a contacting area for contacting the printed circuit board, and / or wherein the contacting element can be brought into a preloaded position by locking the housing cover to the housing base. HCC 19.299-PC 5
[0033] This allows the technical advantage to be achieved that a simply designed contacting element can be provided, which is set up to provide a contact force oriented parallel to the normal direction of the housing cover.
[0034] The contact force oriented in this way allows the circuit board to be efficiently clamped between the support element and the contacting element.
[0035] The two bending areas with opposite curvature provide a structurally simple contacting element.
[0036] By locking the housing cover to the housing base, the contact element is brought into a preloaded position in which it can provide the contact force. Locking the housing cover to the housing base presses the contact element against the circuit board and the support element of the housing base, thereby elastically deforming it.
[0037] The elastic deformation of the contacting element, designed as an S-shaped profile, pre-tensions the contacting element and is thus able to generate the contact force.
[0038] According to one embodiment, the contacting element is configured to generate the contact force parallel to a normal direction of the housing cover, and wherein the contacting element is configured to generate a further contact force perpendicular to the normal direction of the housing cover.
[0039] This achieves the technical advantage that, through the additional contact force oriented perpendicular to the normal direction of the housing cover, the contacting element firstly contacts the circuit board and presses against the support element via the contact force oriented parallel to the normal direction, and secondly, through the additional contact force, contacts a side wall of the housing base.
[0040] This results in direct electrical and / or thermal contact between the housing cover and the housing base.
[0041] According to one embodiment, the contacting element comprises a contacting edge and / or contacting surface, wherein the contacting element is configured, HCC 19.299-PC 6
[0042] The additional contact force is used to electrically and / or thermally contact the contacting edge and / or contacting surface with a side wall of the housing base.
[0043] This allows for the technical advantage of a simple electrical and / or thermal connection of the housing cover to the housing base.
[0044] According to one embodiment, the contacting element is designed to notch the side wall of the housing base via the contacting edge.
[0045] This allows the technical advantage to be achieved that by notching the side wall of the housing base with the contacting edge of the contacting element, the electrical and / or thermal contact between the housing cover and the housing base is further improved.
[0046] According to one embodiment, the housing base has a plurality of rib elements spaced apart from each other along the longitudinal axis of the housing base on the side wall.
[0047] This allows for improved electromagnetic shielding.
[0048] Furthermore, the rib elements can improve electrical and / or thermal contact between the housing base and the housing cover via the contacting edge of the contacting element and the rib elements.
[0049] According to one embodiment, the contacting element is formed on an edge region of the housing cover and extends along a longitudinal direction of the housing cover.
[0050] This allows for the technical advantage that, by forming the contacting element in the edge area of the housing cover, a space-saving arrangement of the contacting element on the housing cover is made possible.
[0051] Furthermore, especially when the contacting element is formed in the form of the S-shaped impact profile, the first and second bending areas of the contacting element, which run accordingly along the longitudinal direction of the housing cover, can result in an HCC 19.299-PC 7
[0052] This is achieved by stiffening the housing cover. By stiffening the housing cover, the contact forces provided by the contacting element can be increased.
[0053] This allows for improved structural positioning of the printed circuit board within the module housing and improved electrical and / or thermal connection of the printed circuit board to the housing base and / or the housing cover.
[0054] According to one embodiment, the contacting area of the contacting element defines a contact line along the longitudinal direction of the housing cover, wherein the contacting element is configured to apply the contact force to the circuit board along the contact line.
[0055] This offers the technical advantage that, thanks to the appropriately aligned contact element, a linear contact with the printed circuit board (PCB) is achieved along the defined contact line. This contact line thus ensures robust, structurally secure positioning of the PCB within the module housing.
[0056] Furthermore, a corresponding linear electrical and / or thermal contact can be achieved between the circuit board and the housing cover. This further improves the electrical and / or thermal connection of the circuit board to the housing cover.
[0057] According to one embodiment, the support element is formed in a side area of the housing base and extends along the longitudinal direction of the housing base.
[0058] This offers the technical advantage that, by integrating the support element into the side of the housing base, a space-saving arrangement of the support element can be achieved. This allows a large area of the housing base's mounting space to be used for arranging additional module components.
[0059] According to one embodiment, the housing base comprises at least one fixing projection for fixing the housing cover to the housing base, wherein the fixing projection extends from the base surface, and wherein the housing cover extends over at least HCC 19.299-PC 8
[0060] a connecting element can be attached to the fixing projection in a fixing position, and wherein in the fixing position the contacting element borders the bearing surface and can thus be brought under preload.
[0061] This allows for the technical advantage that the fixing projections enable a robust fixing of the housing cover to the housing base of the module housing.
[0062] Furthermore, by securing the housing cover in the fixing position at the respective fixing projections using the connecting elements, the contact element can be pre-tensioned. This allows the printed circuit board to be clamped between the support element of the housing base and the contact element of the housing cover. This enables easy assembly of the electronic module.
[0063] According to one embodiment, the circuit board comprises at least one through-hole for passing the at least one fixing projection through the circuit board, wherein, when passing the fixing projection through the through-hole, a gap is formed between an outer surface of the fixing projection and an edge region of the through-hole.
[0064] This achieves the technical advantage that, due to the gap between the outer surfaces of the fixing projections and the edges of the feedthrough openings of the circuit board through which the fixing projections are passed, the circuit board remains movable relative to the fixing projections.
[0065] This allows for the aforementioned thermally induced expansion and contraction of the printed circuit board. The corresponding gaps prevent stress-related damage to the circuit board in the area of the feedthrough holes.
[0066] In one embodiment, the housing cover has at least one groove extending along a transverse direction, and / or wherein the housing base is made of cast metal, and / or wherein the housing cover is made of spring sheet and / or spring steel. HCC 19.299-PC 9
[0067] This allows for the technical advantage that the stiffness of the housing cover can be further improved by the ribs on the housing cover.
[0068] Manufacturing the housing base from cast metal allows for simple production of the module base. Furthermore, the cast metal provides optimal thermal conductivity.
[0069] Manufacturing the housing cover from spring steel or spring sheet allows for simple production of the housing cover. Furthermore, the spring steel or spring sheet material provides good thermal conductivity.
[0070] According to one embodiment, the contacting element is formed in one piece on the housing cover and manufactured via a bending process.
[0071] This allows for the technical advantage that the one-piece design of the contacting element on the housing cover enables optimal electrical and / or thermal connection of the contacting element to the housing cover.
[0072] By manufacturing the contact element through the bending process, an easy-to-manufacture contact element can be provided.
[0073] The invention will be explained in more detail below with reference to the figures. They show:
[0074] Figure 1 shows a perspective schematic representation of an electronic module for a vehicle according to one embodiment.
[0075] Figure 2 shows a schematic sectional view of the electronic module according to one embodiment.
[0076] Figure 3 shows another perspective schematic representation of the electronics module according to one embodiment,
[0077] Figure 4 shows a schematic sectional view of the electronics module according to a
[0078] Design, HCC 19.299-PC 10
[0079] Figure 5 shows another perspective schematic representation of the electronics module according to one embodiment, and
[0080] Figure 6 shows a schematic top view of the electronics module according to one embodiment.
[0081] Figure 1 shows a perspective schematic representation of an electronic module 100 for a vehicle according to one embodiment.
[0082] According to the invention, the electronic module 100 comprises a module housing 101 and at least one printed circuit board 103, which is arranged in the module housing 101.
[0083] The module housing 101 comprises a housing base 105 and a housing cover 107 that can be detachably connected to the housing base.
[0084] The housing base 105 defines a receiving space 109 in which the circuit board 103 can be arranged.
[0085] For this purpose, the housing base 105 includes at least one support element 111 on which the circuit board 103 can be at least partially placed.
[0086] To securely position the circuit board 103 in the module housing 101, the housing cover 107 comprises at least one contacting element 113. According to the invention, the contacting element 113 is designed as a spring element and configured to provide a contact force F1, to contact the circuit board 103 and to apply the contact force F1.
[0087] The contact force F1 allows the circuit board 103 to be clamped between the support element 111 of the housing base 105 and the contacting element 113 of the housing cover 107 and thus securely positioned in the module housing 101.
[0088] In the embodiment shown, the housing cover 107 comprises two contact elements 113. The two contact elements 113 are each formed on opposite edge regions 135 of the housing cover 107 and extend along the longitudinal direction L of the housing cover 107. HCC 19.299-PC 11
[0089] Similarly, the housing base 105 comprises two support elements 111, which are arranged on opposite side areas 137 of the housing base 105.
[0090] According to one embodiment, the support elements 111 are formed integrally on the housing base.
[0091] In the embodiment shown, the circuit board 103 thus rests on the two support elements 111 of the housing base 105 and is pressed against the respective support elements 111 by the two contact elements 113 of the housing cover 107 and is thus securely positioned within the module housing 101.
[0092] In the illustrated embodiment, the circuit board 103 further comprises contact areas 115. The contact areas 115 are formed accordingly on edge regions of the circuit board 103 and, in the illustrated embodiment, each contact the support element 111 and the corresponding contacting element 113.
[0093] According to one embodiment, the contact areas 115 of the printed circuit board 103 are electrically and / or thermally conductive and thus enable electrical and / or thermal contacting of the printed circuit board 103 with the housing base 105 and / or the housing cover 107 by pressing the printed circuit board 103 between the support elements 111 of the housing base 105 and the contacting elements 113 of the housing cover 107.
[0094] The contact areas 115 can, for example, be designed as metallic coatings or metallic elements that extend through the circuit board 103.
[0095] In the illustrated embodiment, the contact elements 113 are each designed as S-shaped profiles with a first bending area 123 and a second bending area 125. The first and second bending areas 123, 125 have opposite curvatures, resulting in the predominantly S-shaped profile of the respective contact element 113.
[0096] In the embodiment shown, the bending axes of the first and second bending areas 123, 125 are formed parallel to the longitudinal direction L of the housing cover 107. HCC 19.299-PC 12
[0097] In the embodiment shown, the second bending area 125 defines a contacting area 127 of the contacting element 113. The contacting of the printed circuit board 103 by the respective contacting element 113 takes place via the contacting area 127.
[0098] In the illustrated embodiment, the contacting elements 113 each have a contacting edge 129. The contacting edge 129 borders directly on the second bending area 125.
[0099] As an alternative to the embodiment shown, the contact edges 129 can also be designed as planar contact surfaces. These contact surfaces can, for example, be realized via additional bending areas formed on the edge regions of the housing cover 107.
[0100] In the embodiment shown, the contacting edge 129 is formed by a side edge 155 of the housing cover 107.
[0101] In the embodiment shown, the contacting elements 113 are further configured to contact side walls 131 of the housing base 105 via the contacting edge 129.
[0102] In the illustrated embodiment, the two support elements 111 are each designed as support projections 119 with support surfaces 121. The support projections 119 extend from a base surface 117 of the housing base 105 into the receiving space 109. In the illustrated embodiment, the support surfaces 121 are oriented parallel to the base surface 117.
[0103] To ensure the secure positioning and contacting of the circuit board 103, the circuit board 103, in the embodiment shown, rests with its respective contact areas 115 on the support surfaces 121 of the support projections 119.
[0104] The side walls 131 of the housing base 105 are formed, each in a transverse direction, closing onto the bearing surfaces 121 of the bearing projections 119.
[0105] Due to the transversely directed termination Q of the side walls 131 relative to the support projections 119, the aforementioned support surfaces 121 are freed, so that the HCC 19.299-PC 13
[0106] The circuit board 103 rests on the support surfaces 121 and is bounded in the transverse direction by the side walls 131 of the housing base 105.
[0107] In the illustrated embodiment, the housing base 105 further comprises at least one fixing projection 139, which extends from the base surface 117 along a vertical direction H oriented perpendicular to the transverse direction Q into the receiving space 109. The housing cover 107 can be fixed to the fixing projections 139 by means of connecting means 141 and thus be firmly connected to the housing base 105.
[0108] The fasteners 141 can be designed, for example, as screw connections, stamped connections, welded connections, adhesive connections or snap-fit connections.
[0109] The housing cover 107 includes a corresponding number of through-openings 157. The end regions of the fixing projections 139 can be passed through the housing cover 107 via the through-openings 157 and provided with the corresponding connecting means 141 for a fixed connection of the housing cover 107 to the housing base 105.
[0110] The through-openings 157 can additionally be provided with slotted elements, not shown in Figure 1. When the connecting bases (159) are installed
[0111] The fixing projections 139 cause the through-openings 157 to be widened and the housing cover 107 to be plastically deformed in the area of the through-openings.
[0112] The plastic deformation prevents the housing cover 107 from being removed from the housing base 105, because when the fixing projections 139 are pulled out of the through-holes 157, the plastically deformed areas of the housing cover 107 cut into the fixing projections 139, creating a snap-fit connection between the housing cover 107 and the fixing projections 139.
[0113] In the embodiment shown, the housing cover 107 further comprises a plurality of beads 151 extending along the transverse direction Q and spaced apart from one another along the longitudinal direction L. HCC 19.299-PC 14
[0114] According to the embodiment shown, the contacting elements 113 are formed integrally on the housing cover 107. In particular, the contacting elements 113 can be formed on the housing cover 107 by means of appropriate bending processes.
[0115] According to one embodiment, the housing cover 107 is made of spring sheet or spring steel. The housing base 105 can be made of cast metal.
[0116] Figure 2 shows a schematic sectional view of the electronic module 100 according to one embodiment.
[0117] The embodiment shown is based on the embodiment in Figure 1 and includes all the features described therein.
[0118] Figure 2 shows in detail the S-shaped profile of the contact elements 113 with the first and second bending areas 123, 125. The second bending area 125 represents the contacting area 127 for contacting the printed circuit board 103. The printed circuit board 103 comprises the contact areas 115, which enable contact with the contacting area 127 of the respective contact element 113 and the contact surface 121 of the respective support element 111.
[0119] Figure 2 further shows the extension of the depicted fixing projections 139 from the base surface 117 of the housing base 105 into the receiving space 109.
[0120] In the embodiment shown, the fixing projections 139 further comprise, in end regions 161, a base plane 153 and a connecting base 159 projecting from the base plane 153. In the embodiment shown, the connecting bases 159 extend through the housing cover 107.
[0121] The connecting bases 159 enable the housing cover 107 to be fixed to the housing base 105 via the corresponding connecting means 141.
[0122] In the embodiment shown, the base plane 153 of the fixing projections 139 defines a fixing position FS of the housing cover 107 on the housing base 105.HCC 19.299-PC 15
[0123] Figure 2 shows the housing cover 107 in a neutral position NS, in which the housing cover 107 is not yet fixed to the housing base 105 via the connecting means 141.
[0124] To fix the housing cover 107 to the housing base 105, the housing cover 107 is pressed from the neutral position NS shown into the fixing position FS, in which the housing cover 107 rests on the base planes 153 of the fixing projections 139.
[0125] By appropriately attaching the connecting elements to the connecting bases 159 of the fixing projections 139, the housing cover 107 is thus fixed to the housing base 105.
[0126] By positioning the housing cover 107 in the fixing position FS and fixing it accordingly in the fixing position FS, the illustrated contact elements 113 are placed under preload. This preload causes the contact elements 113, designed as spring elements, to generate the contact force F1 oriented parallel to the normal direction N of the housing cover.
[0127] The contact force F1, which is applied to the circuit board 103 by the contacting elements 113 via the contacting areas 127, clamps the circuit board 103 between the support elements 111 and the respective contacting elements 113.
[0128] As already mentioned, this provides the structural fixation of the circuit board 103 in the module housing 101 and the electrical and / or thermal connection of the circuit board 103 to the module housing 101 via the housing base 105 and / or the housing cover 107.
[0129] In the embodiment shown, the S-shaped profile of the contacting elements 113 also generates a further contact force F2 oriented perpendicular to the normal direction N.
[0130] By pre-tensioning the S-shaped profile of the contacting elements 113 by pressing the housing cover 107 against the base planes 153 of the fixing projections 139 and the corresponding pressing of the second bending areas 125HCC 19.299-PC 16
[0131] The contacting edges 129, which are directly adjacent to the second bending areas 125, are pressed outwards, i.e. in the direction of the side walls 131 of the housing base 105, in the defined contacting areas 127 on the circuit board 103 resting on the support elements 111.
[0132] The contact edges 129 are moved away from the first bending areas 123 of the respective contact element 113. The additional contact force F2 generated by this movement causes the contact edges 129 of the respective contact elements 113 to be pressed against the side walls 131 of the housing base 105.
[0133] This results in a structural, electrical and / or thermal contact between the housing cover 107 and the housing base 105.
[0134] In the embodiment shown, a width B1 of the housing base 105, defined by the opposing side walls 131 of the housing base 105, is greater than a width B2 of the housing cover 107, defined by the opposing contact edges 129 (contact surfaces of the contacting elements 113) formed by the side edges 155 of the housing cover 107. The widths B1 and B2 refer to the transverse direction Q of the housing base 105 and the housing cover 107, respectively.
[0135] As mentioned above, in the illustrated embodiment the contact edges 129 are defined by the side edges 155 of the housing cover 107. The width B2 of the housing cover 107 is thus defined by the two opposite side edges 155.
[0136] The width B2 of the housing cover 107 is smaller than the width B1 of the housing base 105, in particular, when the housing cover 107 is in the neutral position NS and the contact elements 113, designed as S-shaped impact profiles, are not pre-tensioned. When the housing cover 107 is moved into the fixed position FS and the contact elements 113 are thereby pre-tensioned, the contact edges 129, i.e., the side edges 155 of the housing cover 107, move away from each other in the transverse direction, and the width B2 is increased accordingly. HCC 19.299-PC 17
[0137] This results in the contacting of the side walls 131 of the housing base 105 by the contacting edges 129 of the contacting elements 113 of the housing cover when it is brought into the fixing position FS and fixed there.
[0138] According to one embodiment, the second contacting force F2 generated accordingly causes the contacting edges 129 of the contacting elements 113, which contact the side walls 131, to indent the respective side walls 131.
[0139] Figure 3 shows another perspective schematic representation of the electronic module 100 according to one embodiment.
[0140] The embodiment shown is based on the embodiment in Figure 2 and shows all the features described therein.
[0141] Figure 3 again shows the generation of the contact force F1 and the further contact force F2 by fixing the housing cover 107 in the fixing position FS and the corresponding pre-tensioning of the contacting elements 113 designed as S-shaped impact profiles.
[0142] The corresponding contact forces F1, F2 cause the circuit board 103 to be pressed against the corresponding support elements 111 and the contacting of the side walls 131 by the contacting edges 129.
[0143] Figure 4 shows another schematic sectional view of the electronic module 100 according to one embodiment.
[0144] The embodiment shown in Figure 4 is based on the embodiments shown in Figures 1 to 3 and includes all the features described therein.
[0145] Figure 4 again shows the generation of the contact forces F1, F2 by positioning and fixing the housing cover 107 in the fixing position FS and the corresponding pre-tensioning of the contacting elements 113.
[0146] Figure 5 shows another perspective schematic representation of the electronic module 100 according to one embodiment. HCC 19.299-PC 18
[0147] The embodiment shown in Figure 5 is based on the preceding embodiments shown in Figures 1 to 4 and includes all the features described therein.
[0148] In the illustrated embodiment, several rib elements 133 are shown on the side walls 131 of the housing base 105. The rib elements 133 extend along the vertical direction H of the housing base 105 and are spaced apart from each other along the longitudinal direction L of the housing base 105.
[0149] In the illustrated embodiment, the second contact force F2 causes the contacting edges 129 of the contacting elements 113 to make contact with the rib elements 133. The rib elements 133 can be notched, in particular, by the contacting edges 129, thereby improving electrical and / or thermal contact between the housing cover 107 and the housing base 105.
[0150] Figure 6 shows a schematic top view of the electronic module 100 according to one embodiment.
[0151] The embodiment shown is based on the embodiments of Figures 1 to 5 and includes all the features described therein.
[0152] The top view shown only depicts the housing base 105 and the circuit board 103. The housing cover 107 is not shown for better visibility.
[0153] In the illustrated embodiment, the circuit board 103 has several feedthrough openings 143. The fixing projections 139 are guided through the feedthrough openings 143 of the circuit board.
[0154] The feedthrough openings 143 are designed such that, when the printed circuit board 103 rests on the support elements 111 of the housing base 105 and when the fixing projections 139 are passed through the feedthrough openings 143, a gap 145 is open in each feedthrough opening 143 between an outer surface 147 of the respective fixing projection 139 and an edge 149 of the respective feedthrough opening 143. HCC 19.299-PC 19
[0155] The corresponding column 145 allows movement of the printed circuit board along the longitudinal direction L and / or the transverse direction Q or thermal contraction or expansion of the printed circuit board 103 without causing stress effects on the printed circuit board 103 in the area of the feedthrough openings 143.
[0156] In the embodiment shown, it is further shown that the contact areas 115 of the circuit board 103 are formed along the longitudinal direction L on edge areas 163 of the circuit board 103 defined with respect to the transverse direction Q.
[0157] Linear contact of the printed circuit board 103 by the contacting elements 113 of the housing cover 107 is made possible by the linear contact areas 115 formed accordingly along the longitudinal direction L of the printed circuit board 103 and by the contacting elements 113 formed accordingly along the longitudinal direction L of the housing cover 107 and by the contacting areas 127 defined accordingly by the second bending areas 125 of the S-shaped impact profile.
[0158] This enables, in particular, a linear application of the contact force F1 to the circuit board 103 along a contact line defined by the bending axis of the second bending area 125 of the respective contacting elements 113 of the housing cover.
[0159] This allows the electrical and / or thermal contacting of the circuit board 103 by the housing cover 107 to be improved from a point-like contacting, as is known from the prior art, to an extended line-like contacting.
[0160] This improves the electrical and / or thermal connection of the printed circuit board 103 to the housing cover 107 and strengthens the structurally secured positioning of the printed circuit board 103 within the module housing 101 by clamping the printed circuit board 103 between the support elements 111 of the housing base 105 and the contact elements 113 of the housing cover 107.HCC 19.299-PC
[0161] Reference symbol list
[0162] 100 electronic modules
[0163] 101 module housings
[0164] 103 Circuit board
[0165] 105 Case base
[0166] 107 Case cover
[0167] 109 Recording Room
[0168] 111 Support element
[0169] 113 Contacting element 115 Contact area
[0170] 117 Base area
[0171] 119 Support margin 121 Contact area
[0172] 123 First bending area 125 Second bending area 127 Contacting area 129 Contacting edge 131 Side wall
[0173] 133 Rib element
[0174] 135 Edge area
[0175] 137 page area
[0176] 139 Fixing projection 141 Connecting element 143 Feedthrough opening 145 Gap
[0177] 147 outdoor area
[0178] 149 Rand
[0179] 151 groove
[0180] 153 Base level
[0181] 155 side edge
[0182] 157 Through opening 159 Connecting base 161 End area
[0183] 163 Edge area HCC 19.299-PC
[0184] 21
[0185] F1 contact force
[0186] F2 further contact force L longitudinal direction
[0187] Q transverse direction
[0188] N Normal direction NS Neutral position
[0189] FS Fixing Position
[0190] B1 width
[0191] B2 width
Claims
HCC 19.299-PC 22 Patent claims 1. Electronic module (100), in particular radio module, for a vehicle, comprising a module housing (101) and at least one printed circuit board (103), wherein the module housing (101) comprises a housing base (105) and a housing cover (107), wherein the housing base (105) defines a receiving space (109) for receiving the printed circuit board (103), wherein at least one support element (111) is formed in the receiving space (109), wherein the printed circuit board (103) can be placed at least partially on the support element (111), wherein the housing cover (107) comprises a contacting element (113) designed as a spring element, wherein the contacting element (113) is configured to contact the printed circuit board (103) and to exert a contact force (F1), and wherein the printed circuit board (103) is pressed against the at least one support element by the applied contact force (F1) of the contacting element (113). (111) can be pressed against the housing base (105) and securely positioned in the module housing (101).
2. Electronic module (100) according to claim 1, wherein the circuit board (103) comprises at least one electrically and / or thermally conductive contact area (115) for contacting the contacting element (113) and / or for contacting the support element (111), and wherein the circuit board (103) is electrically and / or thermally contacted with the housing base (105) and / or with the housing cover (107) by pressing it against the support element (111) through the contacting element (113).
3. Electronic module (100) according to claim 1 or 2, wherein the support element (111) is designed as a support projection (119) extending from a base surface (117) of the housing base (105) with a support surface (121), and / or wherein the support element (111) is formed integrally on the housing base (105).
4. Electronic module (100) according to one of the preceding claims, wherein the contacting element (113) is designed as an S-shaped profile with a first bending region (123) and a second bending region (125) with opposite curvatures, and wherein the second bending region (125) defines a contacting area (127) for contacting the printed circuit board (103), and / or wherein the contacting element (113) can be brought into a biased position by locking the housing cover (107) to the housing base (105). HCC 19.299-PC 23 5. Electronic module (100) according to claim 4, wherein the contacting element (113) is configured to generate the contact force (F1) parallel to a normal direction (N) of the housing cover (107), and wherein the contacting element (113) is configured to generate a further contact force (F2) perpendicular to the normal direction (N) of the housing cover (107).
6. Electronic module (100) according to claim 4 or 5, wherein the contacting element (113) comprises an outer contacting surface and / or contacting edge (129), and wherein the contacting element (113) is configured to electrically and / or thermally contact the outer contacting surface and / or contacting edge (129) with a side wall (131) of the housing base (105) via the further contacting force (F2).
7. Electronic module (100) according to claim 6, wherein the contacting element (113) is configured to notch the side wall (131) of the housing base (105) via the contacting edge (129).
8. Electronic module (100) according to claim 6 or 7, wherein the housing base (105) has a plurality of rib elements (133) spaced apart from each other along the longitudinal axis (L) of the housing base (105) on the side wall (131).
9. Electronic module (100) according to any one of the preceding claims 4 to 8, wherein the contacting element (113) is formed on an edge region (135) of the housing cover (107) and extends along the longitudinal direction (L) of the housing cover (107).
10. Electronic module (100) according to claim 9, wherein the contact area (127) of the contacting element (113) extends linearly along the longitudinal direction (L) of the housing cover (107) and defines a contact line, and wherein the contacting element (113) is configured to apply the contact force (F1) to the printed circuit board (103) along the contact line. HCC 19.299-PC 24 11. Electronic module (100) according to claim 9 or 10, wherein the support element (111) is formed in a side region (137) of the housing base (105) and extends along the longitudinal direction of the housing base (105).
12. Electronic module (100) according to one of the preceding claims, wherein the housing base (105) comprises at least one fixing projection (139) for fixing the housing cover (107) to the housing base (105), wherein the fixing projection (139) extends from the base surface (117), wherein the housing cover (107) can be attached to the fixing projection (139) in a fixing position via at least one connecting means (141), and wherein in the fixing position the contacting element (113) adjoins the contact surface and can thus be brought into preload.
13. Electronic module (100) according to claim 11, wherein the printed circuit board (103) comprises at least one through-hole (143) for passing the at least one fixing projection (139) through the printed circuit board (103), and wherein, when passing the fixing projection (139) through the through-hole (143), a gap (145) is formed between an outer surface (147) of the fixing projection (139) and an edge (149) of the through-hole (143).
14. Electronic module (100) according to one of the preceding claims, wherein the housing cover (107) has at least one groove (151) extending along a transverse direction (Q), and / or wherein the housing base (105) is made of cast metal, and / or wherein the housing cover (107) is made of spring sheet and / or spring steel.
15. Electronic module (100) according to one of the preceding claims, wherein the contacting element (113) is formed in one piece on the housing cover (107) and is manufactured by a bending process.