Method of transporting a substrate, carrier assembly for carrying a substrate, shield carrier, and deposition system

Abstract

A carrier assembly comprises a shield carrier detachably connectable to a substrate support component to provide a combined carrier. The substrate support component comprises a chucking device for holding the substrate at a substrate holding surface. The shield carrier comprises: an edge exclusion shield configured to cover an edge region of the substrate support component and of the substrate held at the substrate holding surface, when the substrate support component and the shield carrier are connected; and a shield carrier transport unit configured to interact with a first carrier transport system for transporting the shield carrier along a first carrier transport path in the deposition system. At least one of the substrate support component and the shield carrier comprises at least one connector configured to attach the shield carrier and the substrate support component to each other to provide the combined carrier.

Description

METHOD OF TRANSPORTING A SUBSTRATE, CARRIER ASSEMBLY FOR CARRYING A SUBSTRATE, SHIELD CARRIER, AND DEPOSITION SYSTEMTECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to a method of transporting a substrate through a deposition system, particularly an in-line vacuum deposition system configured to coat a substrate with one or more materials. Further, embodiments of the present disclosure relate to a carrier assembly for carrying a substrate through a deposition system, as well as a deposition system, particularly a vacuum deposition system, for coating a substrate with one or more materials. Embodiments of the present disclosure particularly relate to a vacuum deposition system for coating a substrate with a layer stack in an essentially vertical orientation, e.g., with an OLED layer stack. Methods of transporting and coating substrates in a deposition system in an essentially vertical orientation are described.BACKGROUND

[0002] Organic light-emitting diodes (OLED) are a special type of light-emitting diode in which the emissive layer includes a thin-film of certain organic compounds. OLEDs are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc. for displaying information. OLEDs can also be used for general space illumination. The range of colors and brightness possible with OLED displays is greater than that of traditional LCD displays because OLED material directly emits light. The energy consumption of OLED displays is considerably less than that of traditional LCD displays.

[0003] The fact that OLEDs can be manufactured onto flexible substrates results in further applications. An OLED display may include, for example, layers of organic material situated between two electrodes, for example electrodes made of a metallic material. The OLED is typically placed between two glass panels, and the edges of theglass panels are sealed to encapsulate the OLED therein. Alternatively, the OLED can be encapsulated with thin film technology, e.g. with a barrier film.

[0004] A process to manufacture OLED displays includes transporting a substrate in a vacuum deposition system, and coating the substrate by thermal evaporation of organic materials in a high vacuum. The process may utilize an edge exclusion shield in order to avoid a material deposition on an edge region of the substrate. The substrate edge is positioned behind the edge exclusion shield during material deposition to prevent the substrate edge from being coated.

[0005] Considering a tendency towards larger substrate sizes for display manufacturing, it is beneficial to provide an improved system and improved methods fortransporting and coating substrates in a vacuum deposition system.SUMMARY

[0006] In light of the above, a method of transporting a substrate through a deposition system, a carrier assembly for carrying a substrate through a deposition system, a shield carrier, as well as a deposition system with such a carrier assembly are provided. Further aspects, embodiments, features and details can be derived from the dependent claims, the drawings and the specification.

[0007] According to an embodiment, a method of transporting a substrate through a deposition system is described. The method includes: loading the substrate onto a substrate holding surface of a substrate support component and holding the substrate at the substrate holding surface with a chucking device; transporting, with a first carrier transport system, a shield carrier along a first carrier transport path in the deposition system to a carrier assembly station; connecting the shield carrier and the substrate support component in the carrier assembly station to provide a combined carrier in which an edge exclusion shield of the shield carrier covers an edge region of the substrate support component and of the substrate held at the substrate holding surface; and transporting the combined carrier past at least one deposition source to deposit at least one material on a device region of the substrate, the edge region of the substrate support component and of the substrate being shielded by the edge exclusion shield of the shield carrier.

[0008] According to an embodiment, a carrier assembly for carrying a substrate through a vacuum deposition system is provided. The carrier assembly includes a shield carrier that is detachably connectable to a substrate support component to provide a combined carrier. The substrate support component includes a chucking device for holding the substrate at a substrate holding surface of the substrate support component. The shield carrier includes an edge exclusion shield configured to cover an edge region of the substrate support component and of the substrate held at the substrate holding surface, when the substrate support component and the shield carrier are connected; and a shield carrier transport unit configured to interact with a first carrier transport system for transporting the shield carrier along a first carrier transport path in the vacuum deposition system. The substrate support component and / or the shield carrier comprises at least one connector configured to attach the shield carrier and the substrate support component to each other to provide the combined carrier.

[0009] According to an embodiment, a shield carrier, particularly of a carrier assembly as described herein, is provided, the shield carrier being detachably connectable to a substrate support component to provide a combined carrier. The shield carrier includes: an edge exclusion shield configured to cover an edge region of the substrate support component and of the substrate held at the substrate holding surface, when the substrate support component and the shield carrier are connected; and a shield carrier transport unit configured to interact with a first carrier transport system for transporting the shield carrier along a first carrier transport path. The shield carrier may further include at least one connector configured to attach the shield carrier and the substrate support component to each other to provide the combined carrier.

[0010] According to an embodiment, a method of manufacturing a layer stack of a display, particularly an OLED layer stack, on a large area substrate is provided. The method includes processing a substrate in a deposition system according to any of the embodiments described herein, wherein, at least, a first layer of the layer stack is deposited by a first deposition source and a second layer of the layer stack is deposited by a second deposition source. Further, a substrate coated with a stack of layers in a deposition system as described herein and / or using a substrate transportation method as described herein are provided.

[0011] According to an embodiment, a deposition system, particularly a vacuum deposition system for coating a substrate with one or more materials in a vacuum environment, is provided. The deposition system includes a carrier assembly with a shield carrier that is detachably connectable to a substrate support component in accordance with any of the embodiments described herein. The deposition system further includes a loading station configured to load a substrate onto the substrate holding surface of the substrate support component; a first carrier transport system configured to transport the shield carrier along a first carrier transport path to a carrier assembly station; and a carrier assembly station configured to connect the shield carrier and the substrate support component to each other to provide the combined carrier, in which the edge exclusion shield of the shield carrier is configured to cover an edge region of the substrate support component and of the substrate held at the substrate holding surface.

[0012] Embodiments are also directed at systems for carrying out the disclosed methods and include system parts for performing each described method aspect. The method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments are also directed at methods for operating the described systems. The methods of operating the described systems include method aspects for carrying out every function of the system. Embodiments are also directed at methods of manufacturing substrates, particularly coated substrates, in a deposition system described herein, and substrates manufactured in accordance with the methods and / or using the systems described herein, such as OLED substrates, particularly OLED displays. Also, other devices than OLED displays can be manufactured with the apparatuses and methods described hereinBRIEF DESCRIPTION OF THE DRAWINGS

[0013] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments and are described in the following:FIG. 1 shows a schematic sectional view of a carrier assembly according toembodiments of the present disclosure, wherein the shield carrier and the substrate support component are connected with each other to provide the combined carrier;FIG. 2 shows a schematic sectional view of the carrier assembly of FIG. 1 , wherein the shield carrier and the substrate support component are separate from each other;FIG. 3 illustrates the loading of a substrate onto a substrate support component and a connection of the substrate support component to a shield carrier, according to any of the methods described herein;FIG. 4 is a schematic top view of a deposition system according to some of the embodiments described herein;FIG. 5 shows a schematic sectional view of a carrier assembly according to a modified embodiment of the present disclosure, wherein the shield carrier and the substrate support component are connected to provide the combined carrier;FIG. 6 shows a schematic sectional view of the carrier assembly of FIG. 5, wherein the shield carrier and the substrate support component are separate from each other; andFIG. 7 is a schematic top view of a deposition system according to some of the embodiments described herein.DETAILED DESCRIPTION OF EMBODIMENTS

[0014] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0015] OLED pixels can be deposited on a substrate through a fine metal mask (FMM, also referred to as a pixel mask) that has a plurality (e.g., >100,000) of smallpixel holes that define individual pixel areas on the substrate. A precise alignment between the FMM and the substrate is necessary for the pixel deposition, which is challenging, since each of the small pixels includes a plurality of layers that are to be deposited on top of each other on a respective anode.

[0016] Another technique for forming OLED pixels on a substrate uses photo lithography to pattern pixels, instead of using a fine metal mask. Here, a structure that acts as a masking layer is formed directly on the substrate before the actual pixel deposition. Alignment issues can be reduced. However, quickly and reliably coating a substrate with an OLED layer stack without a fine metal mask requires complex equipment and is also challenging.

[0017] If the OLED pixels are formed on the substrate without using a fine metal mask (FMM), it may be beneficial to cover an edge region of the substrate during the material deposition, in order to avoid a deposition of material on the edge region of the substrate and / or in order to avoid a deposition of material on a substrate carrier that holds the substrate. An “edge exclusion mask” or “edge exclusion shield” can be used for covering and shielding the edge region of the substrate and / or of the substrate carrier, so that the edge region remains devoid of deposition material. The edge exclusion shield typically includes a shielding frame that surrounds a large opening (e.g., having a side of >1 m2) that is meant to define the device region of the substrate where the display devices are to be formed. Hence, a pixel mask (FMM) with a plurality of small openings is to be distinguished from an edge exclusion shield as used herein, with one large device opening for covering (only) the edge region of the substrate.

[0018] A process to manufacture OLED displays can include thermal evaporation of organic and / or inorganic materials and the deposition of the materials onto a substrate in a high vacuum environment, i.e. , in a vacuum deposition system. A material can be evaporated in a crucible of an evaporation source, and the evaporated material can be directed toward the substrate by a plurality of nozzles of the evaporation source for coating the substrate with the evaporated material. The substrate can be moved past the evaporation source for depositing a uniform layer on the substrate. In an in-line deposition system, the substrate is typically moved past a plurality of deposition sources in succession for coating the substrate with a layer stack, e.g., with an OLED layer stack. A substrate transport system can be provided for moving a substrate -which is typically carried by a substrate carrier - through the deposition system past the plurality of deposition sources.

[0019] An “edge exclusion mask” or “edge exclusion shield” can be provided in front of the substrate to block evaporated material from reaching a circumferential edge region of the substrate and / or to block evaporated material from reaching the body of the substrate carrier that carries the substrate. For example, the edge exclusion shield can mask the perimeter of a glass substrate, such as a rectangular glass substrate, e.g. with an edge of a few millimeters. While the substrate is moved past one or more deposition sources, the edge region of the substrate may be covered by the edge exclusion shield, so that the material is only deposited on the device region of the substrate, not on the perimeter. The uncoated substrate edges can be used for handling the substrate and are to be kept free of deposition materials.

[0020] Document WO 20204 / 003603 A1 describes a substrate processing system, in which a substrate is moved on a substrate transportation track past evaporation sources, and an edge exclusion shield that is separate from the substrate is moved on a shield transportation track in front of the substrate for shielding the substrate edges during material deposition. If the edge exclusion shield is moved on a track separate from and independently of the substrate transportation track, a distance between the edge exclusion shield and the substrate may lead to a “shadowing effect” because the vapor plumes emitted by the evaporation sources typically have a large opening angle when impinging on the substrate. The larger the distance between the edge exclusion shield and the substrate during the material deposition, the larger the amount of material that is deposited “behind” the edge exclusion shield on the substrate or on the substrate carrier, causing a sloping and possibly blurred layer edge of the deposited material layer. Generally, a small distance between the substrate and the edge exclusion shield is beneficial, in order to keep the shadowing effect small.

[0021] On the other hand, it is beneficial to provide an edge exclusion shield that can be handled and / or transported independently of the substrate carrier, e.g., because the edge exclusion shield may be stored, transported and / or cleaned independently of substrate carriers.

[0022] In view of the above, according to the embodiments described herein, a carrier assembly is provided with an edge exclusion shield that enables a small distance between the edge exclusion shield and the substrate during the material deposition on the substrate, while the edge exclusion shield can be handled easily and independently of other components of the system.

[0023] A carrier assembly 100 for carrying a substrate 10 through a deposition system as described herein is shown in a schematic sectional view in FIG. 1 (upper part) and in a schematic perspective view in FIG. 1 (lower part). As can be seen in FIG. 1 , the carrier assembly 100 includes a shield carrier 120 and a substrate support component 110 that are detachably connected to each other.

[0024] In FIG. 2, the carrier assembly 100 of FIG. 1 is shown, wherein the shield carrier 120 and the substrate support component 110 are provided separate from each other. In the upper part of FIG 2, the shield carrier 120 and the substrate support component 110 are shown separated from each other in a schematic sectional view, and in the lower part of FIG. 2, the shield carrier 120 and the substrate support component 110 are shown separated from each other in a schematic perspective view.

[0025] The substrate support component 110 and the shield carrier 120 can be connected to each other to provide a “combined carrier 130”. A combined carrier 130 as used herein refers to a substrate support component 110 and a shield carrier 120 being attached to each other, as it is shown in FIG. 1. The shield carrier 120 and the substrate support component 110 can typically be connected to and disconnected from each other inside the deposition system, i.e. , under vacuum, particularly in a carrier assembly station as described herein (see FIG. 3).

[0026] As is shown in FIGS. 1 and 2, the substrate support component 110 includes a chucking device 111 for holding a substrate 10 at a substrate holding surface 112. The chucking device 111 may comprise, e.g., a mechanical chuck or an electrostatic chuck (ESC). In some embodiments, the chucking device is an electrostatic chuck (ESC) configured to hold the substrate 10 at the substrate holding surface 112 via electrostatic forces.

[0027] The substrate support component 110 may comprise a body, e.g., a plate-like body, with the substrate holding surface 112 at which the substrate 10 can be held, particularly in an essentially vertical orientation. The chucking device 111 may be provided at or integrated with the substrate support component 110 so that the substrate can be held at the substrate holding surface 112 of the substrate support component via the chucking device 111. The substrate support component 110 can be provided in a horizontal orientation and / or in a vertical orientation while the substrate is held with the chucking device 111. Typically, the substrate is transported through the deposition system and coated with one or more materials while being held with the chucking device 111 at the substrate holding surface 112 in an essentially vertical orientation, as it is shown in FIG. 1. Accordingly, the substrate support component 110 can act as a substrate carrier that carries the substrate 10.

[0028] In some embodiments, the substrate support component 110 further includes a power source for the chucking device 111, e.g., for the electrostatic chuck, particularly a battery. In some embodiments, the substrate support component 110 includes at least one of a controller for controlling the chucking device, e.g., the electrostatic chuck, one or more sensors for measuring one or more parameters (e.g., temperature, pressure, presence of a substrate, etc.), and / or a communication device for wirelessly communicating (transmitting and / or receiving) information to / from a receiver outside the deposition system, e.g., measured values and / or commands from or to the controller of the chucking device 111. For example, the chucking device can receive a de-chucking or chucking command from outside the deposition system via the communication device that is provided at the substrate support component.

[0029] As is further shown in FIG. 1 and FIG. 2, the shield carrier 120 includes an edge exclusion shield 121 configured to cover a circumferential edge region of the substrate support component 110 and / or configured to cover a circumferential edge region of the substrate 10 held at the substrate holding surface 112, when the substrate support component 110 and the shield carrier 120 are connected to each other. As can be seen in the lower part of FIG. 2, the shield carrier 120 may include a mask frame 122 with an opening 123, wherein an inner edge of the mask frame 122 is configured to protrude over the edge region of the substrate for shielding and covering the substrate perimeter.

[0030] The shield carrier 120 can act as an edge exclusion shield that shields a circumferential edge region of the substrate and of the substrate support component, when the combined carrier 130 is provided. By moving the combined carrier 130 past the deposition source(s) for depositing one or more material layers on the substrate, a material deposition on the edge region of the substrate 10 can be reduced or prevented, since the edge region is covered and shielded by the edge exclusion shield 121 of the shield carrier 120. Further, a material deposition on the body of the substrate support component 110 can be reduced or prevented, since the edge region of the substrate support component 110 is covered and shielded by the edge exclusion shield 121 of the shield carrier 120, when the combined carrier 130 is provided. In some embodiments, essentially an entire front surface of the substrate support component 110 is covered by the substrate 10 and by the shield carrier 120 when the combined carrier 130 is provided (see FIG. 1 , where the body of the substrate support component 110 is essentially fully covered by the shield carrier 120), so that a deposition of material on the body of the substrate support component 110 can be reduced or avoided, when the combined carrier 130 is moved past the deposition sources for coating the substrate with one or more materials.

[0031] The substrate support component 110 and / or the shield carrier 120 include at least one connector 118, 128 configured to (detachably) attach the shield carrier 120 and the substrate support component 110 to each other for providing the combined carrier 130. The at least one connector 118, 128 may be configured such that an attachment and detachment of the substrate support component 110 to / from the shield carrier 120 are possible under vacuum inside the deposition system, particularly in the carrier assembly station.

[0032] The at least one connector 118, 128 may be configured to attach the substrate support component 110 and the shield carrier 120 magnetically (e.g., via a magnet, e.g., an electropermanent magnet) and / or mechanically to each other, e.g., with a clamp, another friction-based connection, or a form-fit connection. For example, at least one or both of the substrate support component and the shield carrier can include a clamp of the group: an electromagnetic clamp, an electropermanent magnetic clamp, and a mechanical clamp. Alternatively or additionally, another clamping or chucking device may be provided for chucking or clamping the substrate support component tothe shield carrier, or vice versa. As is shown in FIG. 1 , the connector may be provided at several positions, for example, above, below, and / or laterally relative to the substrate holding surface 112.

[0033] When the substrate support component 110 and the shield carrier 120 are held together by the connector to provide the combined carrier 130 (as shown in FIG. 1), the edge exclusion shield 121 of the shield carrier 120 covers the edge region 13 of the substrate support component 110 and of the substrate 10 for reducing the “shadowing effect” during the material deposition on the substrate. Therefore, the edge of the substrate can be kept substantially free of coating material, since a distance between the edge exclusion shield and the substrate can be kept small, when the substrate support component and the shield carrier are attached to each other.

[0034] For example, a distance D1 between the edge of the substrate 10 and the edge exclusion shield 121 may be 10 mm or less, particularly 5 mm or less, or even 2 mm or less during the material deposition on the substrate (the substrate thickness can be from, e.g., 0.1 mm to 2 mm, and the distance between the substrate holding surface 112 and the edge exclusion shield 121 may be 12 mm or less, particularly 5 mm or less, or even 3 mm or less). For example, the distance D1 between the edge exclusion shield and the substrate surface may be about 1 mm in some embodiments. A shadowing effect at the substrate edge can be kept small, and a sharp and well-defined layer edge can be ensured on the substrate. Further, material deposition on the body of the substrate support component can be reduced or avoided, reducing cleaning efforts and reducing the risk of material flaking from the substrate support component. The quality of the deposited layer stack can be improved. In some embodiments, the first distance D1 may be >0, i.e. there may be a small distance, e.g. above 0.3 mm and below 3 mm. In other embodiments, the edge exclusion shield 121 may be in contact with the substrate edge.

[0035] Further, as it is shown in FIGS. 1 and 2, the shield carrier 120 can be transported with a first carrier transport system 1010 along a first carrier transport path T1 that extends perpendicularly to the paper plane of FIGS. 1 and 2. The shield carrier 120 may include at least a shield carrier transport unit 125 configured to interact with the first carrier transport system 1010 for transporting the shield carrier 120 along the first carrier transport path T1 in the deposition system. The shield carrier 120 can betransported with the first carrier transport system 1010 along the first transport path T1 , when no substrate support component 110 is attached to the shield carrier, as it is shown in FIG. 2. For example, the shield carrier 120 without a substrate support component can be transported to a carrier assembly station for attaching the substrate support component to the shield carrier. In some embodiments, the shield carrier can also be transported with the first carrier transport system 1010 along the first transport track path T1 , when a substrate support component holding a substrate is attached to the shield carrier.

[0036] In some embodiments, the shield carrier 120 can be transported through the deposition system with and without a substrate support component 110 being attached to the shield carrier 120. The shield carrier 120 can, for example, be transported with the first carrier transport system 1010 to a carrier assembly station for attaching a substrate support component (holding a substrate) to the shield carrier 120. Alternatively or additionally, after detachment of the substrate support component (holding a coated substrate) from the shield carrier in the carrier assembly station, the shield carrier 120 can be transported away from the carrier assembly station, e.g., for being connected to another substrate support component, for being cleaned inside the deposition system, for being stored in a shield carrier magazine, and / or for being unloaded from the deposition system for being cleaned outside the deposition system.

[0037] Thereby, according to the embodiments described herein, a carrier assembly is provided that allows an attachment of a shield carrier to a substrate support component holding a substrate, so that the distance between the edge exclusion shield and the substrate can be kept small, reducing the shadowing effect. Further, the shield carrier 120 that includes at least a shield carrier transport unit 125 for interacting with a first carrier transport system, e.g., with a first magnetic levitation system, can be transported along a first carrier transport track T1. The handling and transport of the shield carrier, with or without a substrate support component being attached, can be facilitated according to embodiments described herein.

[0038] In some embodiments, which can be combined with other embodiments described herein, the first carrier transport system 1010 includes a first magnetic levitation system configured to counteract a weight force of the shield carrier during the shield carrier transport. The shield carrier transport unit 125 provided at the shieldcarrier may include one or more first magnetic units 126 configured to interact with one or more magnetic levitation units 1011 of the first magnetic levitation system. Alternatively or additionally, the shield carrier transport unit 125 includes one or more second magnetic units 127 configured to interact with one or more magnetic drive units 1012 configured to move the shield carrier along the first carrier transport track T 1.

[0039] Optionally, the one or more first magnetic units 126 are provided at or near a top portion of the shield carrier 120, and / or the one or more second magnetic units 127 are provided at or near a bottom portion of the shield carrier 120. In another embodiment, both the one or more first magnetic units 126 and the one or more second magnetic units 127 may be provided at or near a top portion of the shield carrier 120.

[0040] The first magnetic levitation system may include one or more magnetic levitation units 1011 configured to magnetically hold at least a part of the weight of the shield carrier 120, particularly the entire weight of the shield carrier. In some embodiments, the first carrier transport system 1010 may be configured to magnetically hold the shield carrier with or without a substrate support component 110 being supported by the shield carrier 120. In some embodiments, the first magnetic levitation system is configured to magnetically counteract the weight force of the shield carrier (or at least a part thereof), so that the shield carrier can be transported through the deposition system in a contactless or essentially contactless manner.

[0041] In some embodiments, the one or more magnetic levitation units 1011 of the first magnetic levitation system are configured to magnetically interact with the one or more first magnetic units 126 of the shield carrier. The one or more first magnetic units 126 may be or comprise a magnetic material, e.g., a magnetic track, one or more passive magnetic units, or one or more permanent magnetic units, which may be, e.g., arranged at a top portion of the shield carrier. In some embodiments, the one or more magnetic drive units 1012 are configured to magnetically interact with the one or more second magnetic units 127 of the shield carrier. The one or more second magnetic units 127 may be or comprise a magnetic material, e.g., a magnetic track, one or more passive magnetic units, or one or more permanent magnetic units, which may be, e.g., arranged at a bottom portion of the shield carrier.

[0042] The one or more magnetic levitation units 1011 can be actively controlled magnetic bearings configured to generate a levitation force acting on the shield carrier (i.e. , acting on the one or more first magnetic units 126) depending on a measured gap distance between the shield carrier 120 and the first carrier transport system 1010. In other embodiments, the first magnetic levitation system may be a passive magnetic levitation system without an actively controlled magnetic force generation, which may include, e.g., permanent magnets or electromagnets for levitating the shield carrier.

[0043] In some embodiments, the shield carrier transport unit 125 may include one or more second magnetic units 127 configured to interact with the one or more magnetic drive units 1012, e.g., with one or more linear motors, configured to move the shield carrier 120 along the first carrier transport path T1. The one or more magnetic drive units 1012 may optionally be configured to interact with a lower part of the shield carrier (as is depicted in FIGS. 1 and 2).

[0044] Alternatively, another type of carrier transport system may be provided, e.g., a mechanical transport system with rollers for supporting and moving the shield carrier along the first transport path T 1.

[0045] In some embodiments, the shield carrier includes a mask frame 122 with an opening 123, particularly a rectangular opening, defining a device region of the substrate. The opening 123 of the mask frame 122 has typically an area of at least 1 m2, or even 2 m2or more, particularly 4 m2or more, or even 6 m2or more. An inner edge 124 of the mask frame may be configured to protrude over the edge region of the substrate, e.g., at a distance of 0.5 mm or more and 10 mm or less from the substrate. The inner edge of the mask frame protruding over the substrate edge is shown in FIG. 1. The inner edge 124 of the mask frame can project over the substrate, in particular over a second distance D2 of, e.g., 1 mm or more, 5 mm or more, 10 mm or more, or even 15 mm or more and / or 50 mm or less, particularly 30 mm or less, respectively measured from the outer substrate edge. The edge exclusion shield can project over the substrate edge on all four sides of the substrate, so that a circumferential outer area of the substrate having a width from the outer substrate edge of, e.g., 1 mm or more and 50 mm or less, particularly 5 mm or more and 30 mm or less, can be kept essentially free of deposition material.

[0046] The mask frame 122 may be a single-part mask frame, or the mask frame 122 may be a multi-part mask frame, which includes several frame parts attached to each other to provide the mask frame 122.

[0047] In some embodiments, which can be combined with other embodiments described herein, the shield carrier 120 is configured to support the substrate support component 110 and to carry the substrate support component through the vacuum deposition system along the first carrier transport track T 1 , when the shield carrier and the substrate support component are attached to each other to provide the combined carrier 130. In particular, the shield carrier 120 may be configured to carry the weight of the substrate support component 110 holding the substrate 10, when the substrate 10 is moved past one or more deposition sources.

[0048] A method of transporting a substrate 10 through a vacuum deposition system according to embodiments described herein is schematically illustrated in FIG. 3.

[0049] A substrate 10 is loaded onto a substrate holding surface 112 of a substrate support component 110, and the substrate 10 is held at the substrate holding surface 112 with the chucking device 111, e.g., with an electrostatic chuck (ESC). The substrate 10 can be loaded onto the substrate holding surface 112 in an essentially horizontal orientation.

[0050] The orientation of the substrate support component 110 holding the substrate 10 may be changed from the essentially horizontal orientation to an essentially vertical orientation, as it is schematically depicted in FIG. 3.

[0051] The first carrier transport system 1010 is used for transporting a shield carrier 120 along a first carrier transport track T1 to the carrier assembly station 1200.

[0052] In the carrier assembly station 1200, the shield carrier 120 and the substrate support component 110 holding the substrate are connected to each other to provide the combined carrier shown, e.g., in FIG. 1. When the substrate support component 110 and the shield carrier 120 are attached to each other, the edge exclusion shield of the shield carrier circumferentially covers the edge region of the substrate support component and of the substrate held at the substrate holding surface.

[0053] The combined carrier is transported through the deposition system past at least one deposition source to deposit at least one material on a device region of the substrate, while the edge region of the substrate support component and of the substrate are shielded by the edge exclusion shield 121 of the shield carrier 120.

[0054] The shield carrier 120 may be transported to the carrier assembly station 1200 and / or away from the carrier assembly station via the first carrier transport system 1010, which may be a first magnetic levitation system.

[0055] The first magnetic levitation system may include one or more magnetic levitation units 1011 configured to magnetically hold at least a part of the weight of the substrate carrier. Further, the first carrier transport system 1010 may include one or more magnetic drive units, particularly a linear motor, configured to move the shield carrier along the first carrier transport track.

[0056] At the carrier assembly station 1200, the shield carrier and the substrate support component may be connected to each other in an essentially vertical orientation.

[0057] In some implementations, the substrate support component 110 and / or the shield carrier 120 include at least one connector 118, 128 configured to attach the shield carrier 120 and the substrate support component 110 to each other.

[0058] The at least one connector 118, 128 may include a magnet, particularly an electropermanent magnet, configured to attach the shield carrier and the substrate support component to each other by magnetic force. For example, the shield support component may include one or more magnets, and the shield carrier may include a magnetic material that is attractable by the one or more magnets, or vice versa, so that the shield support component and the shield carrier can be magnetically held together to provide the combined carrier. In particular, the at least one connector 118, 128 may include an electropermanent magnet provided at the substrate support component (or at the shield carrier), the electropermanent magnet including a permanent magnet that can be switched between an attachment state and a detachment state, e.g., by a pulse of electric current in a wire winding around a part of the magnet.

[0059] Alternatively or additionally, the at least one connector 118, 128 may be configured to enable a form-fit connection or a friction-based connection between the shield carrier and the substrate support component. For example, the at least one connector 118, 128 may include a protrusion provided at the shield carrier or at the substrate support component and a recess configured to receive the protrusion, the recess provided at the other component of the shield carrier and the substrate support component. For example, the protrusion may be provided at the shield carrier and the recess may be provided at the substrate support component (or vice versa), so that at least a part of the weight of the substrate support component can be supported by the protrusion, as it is schematically depicted in FIG. 3 (see the connector 128 that is formed as a protrusion configured to protrude into the connector 118, so that the substrate support component can “hang” at the shield carrier 120 in the combined state; alternatively or additionally, a magnetic connector may be provided).

[0060] In some embodiments, the at least one connector 118, 128 includes a protrusion, particularly a pin or wedge configured to project into an opening, particularly into an alignment recess or alignment opening. For example, an alignment pin having a wedge-like or tapered shape may be provided that is configured to protrude into an alignment opening which has a corresponding shape configured to receive the alignment pin. The connector may further include a recess for receiving the protrusion, particularly an alignment recess, for providing a form-fit connection. The protrusion may be provided at one of the shield carrier and the substrate support component, and the recess may be provided at the other one of the shield carrier and the substrate support component.

[0061] In some embodiments, when the shield carrier 120 and the substrate support component 110 are connected to each other to provide the combined carrier 130, the shield carrier 120 supports the substrate support component 110 and carries the substrate support component through the deposition system past the at least one deposition source. In other words, the shield carrier 120 may carry the weight of the substrate support component 110, and the first carrier transport system 1010 may carry the weight of the shield carrier (and of the substrate support component), when the combined carrier 130 is transported through the deposition system past the at least one deposition source.

[0062] FIG. 4 is a schematic top view of a deposition system 1000 according to some of the embodiments described herein. The deposition system 1000 is a vacuum deposition system with a plurality of vacuum chambers enabling a transport of substrates through the deposition system 1000 under vacuum from a loading station 1100 past at least a deposition source 1300, particularly past a plurality of deposition sources, e.g., evaporation sources as described herein.

[0063] Carrier assemblies 100 as described herein are transported through the deposition system 1000 in vacuum from the loading station 1100 to a processing vacuum chamber 1301 that houses at least a deposition source 1300. The carrier assemblies 100 as described herein are transported past the at least a deposition source 1300 for depositing one or more material layers on a substrate held by the carrier assembly.

[0064] The loading station 1100 is configured to load a substrate 10 onto the substrate loading surface of the substrate support component 110, particularly in a horizontal orientation. The orientation of the substrate support component 110 holding the substrate 10 can be changed from the horizontal orientation to an essentially vertical orientation in the loading station 1100.

[0065] A first carrier transport system 1010 is provided for transporting shield carriers through the deposition system 1000 along the first carrier transport track T1, particularly between the carrier assembly station 1200 and one or more processing vacuum chambers. The first carrier transport system 1010 is configured to transport a shield carrier 120 along the first carrier transport track T1 to the carrier assembly station 1200, which can optionally be provided adjacent to the loading station 1100. The carrier assembly station 1200 is configured to connect the substrate support component 110 to the shield carrier 120 for providing the combined carrier 130. The substrate support component 110 and the shield carrier 120 may be connected to each other, when both the substrate support component 110 and the shield carrier 120 are provided in an essentially vertical orientation, as is schematically shown in FIG. 3. In particular, the carrier assembly station 1200 may be configured to connect the vertically oriented substrate support component 110 to the vertically oriented shield carrier 120.

[0066] Alternatively, the substrate support component 110 and the shield carrier 120 may be connected to each other, when both the substrate support component 110 and the shield carrier 120 are provided in an essentially horizontal orientation. In the latter embodiment, the orientation of the shield carrier 120 can be changed from the essentially vertical orientation to the essentially horizontal orientation at the carrier assembly station, and the orientation of the combined carrier can be changed back to the essentially vertical orientation for enabling the carrier transport along the first carrier transport path T 1.

[0067] When the substrate support component 110 is attached to the shield carrier 120, the edge exclusion shield of the shield carrier 120 covers the edge region of the substrate support component 110 and of the substrate 10 that is held at the substrate holding surface of the substrate support component.

[0068] The first carrier transport system 1010 may be configured to transport the combined carrier 130, i.e. , the substrate support component 110 attached to the shield carrier 120, along the first transport path T1 into one or more processing vacuum chambers, where at least a deposition source 1300 is arranged. During the transport, the shield carrier 120 may support and carry the weight of the substrate support component 110 holding the substrate, as shown in FIG. 1, and the shield carrier 120 may interact with the first carrier transport system 1010, which may be the first magnetic levitation system.

[0069] The combined carrier 130 may be transported along the first transport path T 1 past the at least a deposition source 1300 for depositing a material on the substrate. During the material deposition, the edge exclusion shield of the shield carrier 120 covers the edge region of the substrate and of the substrate support component, so that the material is deposited (only) on the device region of the substrate and on the shield carrier 120, but not on the body of the substrate support component 110.

[0070] The substrate may be transported past several deposition sources in succession for depositing a layer stack on the substrate, e.g., an OLED layer stack. After the deposition of the layer stack, the combined carrier may be transported back to the carrier assembly station 1200 or to another carrier assembly station for separating the substrate support component 110 from the shield carrier under vacuuminside the deposition system. In other words, the carrier assembly station 1200 may be configured both to attach and detach the substrate support component to / from the shield carrier, or a second carrier assembly station may be provided for the detachment.

[0071] Before or after the separation of the substrate support component 110 from the shield carrier 120, the orientation of the substrate support component 110 may be changed from the essentially vertical orientation to the essentially horizontal orientation, and the coated substrate that is essentially horizontally oriented may be unloaded from the substrate support component 110 and moved out of the vacuum deposition system.

[0072] The orientation change of the substrate support component 110 and the unloading of the substrate may be carried out in the loading station 1100, or in a second loading station (not shown in FIG. 4). For example, it is alternatively possible to provide a second carrier assembly station and / or a second loading station for detaching substrate support components holding coated substrates from the respective shield carriers and for unloading the coated substrates from the respective substrate support components and moving the coated substrates out of the vacuum deposition system.

[0073] In some embodiments, which can be combined with other embodiments described herein, the first carrier transport system 1010 is configured to transport the combined carrier 130 past a plurality of deposition sources, wherein the combined carrier 130 includes the substrate support component 110 attached to the shield carrier 120. The substrate support component holds the substrate, and the shield carrier interacts with the first carrier transport system 1010 and supports the substrate support component 110 during the transport past the deposition sources. In the embodiment shown in FIG. 4, the first carrier transport system 1010 is configured to transport the shield carrier 120 through the deposition system along the first carrier transport path T1 from the carrier assembly station 1200 to the deposition sources and back to the carrier assembly station 1200 for detaching the substrate support component from the shield carrier. Alternatively, the coated substrates may be transported back to another carrier assembly station for detaching the substrate support component from the shield carrier.

[0074] The carrier transport path T1 shown in FIG. 4, which includes two rotation modules for changing the transport direction of the shield carriers, is only an example, and, alternatively, less than two or more than two rotation modules may be provided for changing the transport direction of the shield carriers, e.g., by 90° or by 180°. In some embodiments, the coated substrates are not necessarily transported back to the carrier assembly station 1200, but may rather be transported to a second carrier assembly station for unloading the coated substrates, e.g., along another transport path than shown in FIG. 4.

[0075] For example, a first rotation module 1302 may be provided downstream of a first plurality of deposition sources along the first carrier transport path T1 for inverting the carrier transport direction, whereupon the substrates can be transported past a second plurality of deposition sources on the way back toward the carrier assembly station 1200 or toward a second carrier assembly station. For example, a second rotation module 1303 may be provided for changing the carrier transport direction, for example, by 90°.

[0076] In some implementations, the loading station 1100 is configured to change the orientation of the substrate support component 110 between an essentially horizontal orientation for loading the substrate onto the substrate holding surface and an essentially vertical orientation for transporting the substrate support component 110 supported by the shield carrier 120 along the first carrier transport track T 1. The loading station 1100 (or a second loading station) may be configured to change the orientation of the substrate support component 110 between the essentially vertical orientation for transport and the essentially horizontal orientation for unloading the coated substrate from the substrate support component.

[0077] In some embodiments, which can be combined with other embodiments described herein, a first magazine 1305 may be provided for storing a first plurality of shield carriers inside the deposition system, e.g., a plurality of clean shield carriers. Alternatively or additionally, a second magazine 1306 may be provided for storing a second plurality of shield carriers inside the deposition system, e.g., a plurality of used shield carriers. If a shield carrier has been used over a predetermined time in the deposition system for carrying substrate support components past the deposition sources, the shield carrier may be covered with coating material. Hence, it may bebeneficial to exchange a used shield carrier with a clean shield carrier at predetermined time intervals, in order to reduce or avoid a contamination of the vacuum chambers of the deposition system. The shield carriers stored in the first magazine 1305 may be clean shield carriers meant for replacing used shield carriers after predetermined time intervals of use. The used shield carrier can be stored in the second magazine 1306. The used shield carriers can be removed from the deposition system for cleaning, e.g., outside the deposition system, when clean shield carriers are needed, whereupon the cleaned shield carriers can be returned into the deposition system for being stored, e.g., in the first magazine 1305 for use.

[0078] In other embodiments, a cleaning station may be provided for cleaning used shield carriers inside the deposition system. For example, an in-situ cleaning station may be provided for cleaning used shield carriers inside the deposition system.

[0079] Alternatively or additionally, a used shield carrier to be exchanged with a clean shield carrier can be unloaded from the deposition system for being stored under atmospheric conditions. When a predetermined number of used shield carriers are present in the atmospheric storage, the used shield carrier may be cleaned ex-situ, i.e. , outside the deposition system. The cleaned shield carrier can be re-inserted into the deposition system for further use.

[0080] According to some embodiments, which can be combined with other embodiments described herein, the substrate thickness of the substrates 10 that are coated in the deposition system can be from 0.1 to 1.8 mm. The substrate thickness can be about 0.9 mm or below, such as 0.5 mm. The term “substrate” as used herein may particularly embrace substantially inflexible substrates, e.g., a glass plate or other substrates. However, the present disclosure is not limited thereto and the term “substrate” may also embrace flexible substrates such as a web or a foil. The term “substantially inflexible” is understood to distinguish over “flexible”. Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.9 mm or below, such as 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.

[0081] According to embodiments described herein, shield carriers are provided that can be transported via a first carrier transports system, particularly via a first magnetic levitation system, in the deposition system, which facilitates an easy and quick handling of the shield carriers. During the material deposition, substrate support components holding the substrates are attached to the shield carriers, which ensures a small distance between the substrates and the edge exclusion shields, reducing the shadowing effect. Further, as compared to the transport of an edge exclusion shield past the deposition source on a separate track, the deposition speed can be substantially increased and the tact time of the system can be reduced according to the embodiments described herein, because there is no need for a shield movement relative to the substrate movement between the individual deposition actions. Rather, the shield carrier and the substrate support component can continuously remain connected to each other, and can be moved together as the combined carrier, during the deposition of several material layers on the substrate.

[0082] FIG. 5 shows a carrier assembly 200 according to a modified embodiment of the present disclosure in a schematic sectional view. In FIG. 5, the shield carrier 120 and the substrate support component 210 are attached to each other to provide the combined carrier 130.

[0083] FIG. 6 shows a schematic sectional view of the carrier assembly 200 of FIG. 5, wherein the shield carrier 120 and the substrate support component 210 are separated from each other.

[0084] In the embodiment of FIGS. 5 and 6, the shield carrier 120 can be transported along a first carrier transport path T1 with a first carrier transport system 1010, similar to the embodiment of FIGS. 1 and 2. In addition, the substrate support component 210 can be transported (with and without a shield carrier attached thereto) along a second carrier transport track T2 with a second carrier transport system 1020, particularly with a second magnetic levitation system. Apart from said difference, the embodiment of FIGS. 5 and 6 is generally similar to the embodiment of FIGS. 1 and 2, so that reference can be made to the above explanations, which are not repeated.

[0085] The combined carrier 130 is shown in FIG. 5: The shield carrier 120 and the substrate support component 210 are attached to each other via the at least oneconnector 118, 128 so that the edge exclusion shield 121 of the shield carrier 120 covers the edge region 13 of the substrate support component 210 and of the substrate 10 and prevents said regions from being coated.

[0086] The substrate 10 is held at the substrate holding surface 112 of the substrate support component 210 by the chucking device 111, particularly via an electrostatic chuck (ESC).

[0087] At least one of the substrate support component 210 and the shield carrier 120 includes the at least one connector 118, 128 configured to attach the shield carrier 120 and the substrate support component 210 to each other. For example, one of the shield carrier and the substrate support component includes a magnet, e.g., an electropermanent magnet, and the other one of the shield carrier and the substrate support component includes a magnetic unit configured to be attracted by the magnet for connecting the shield carrier and the substrate support component to each other. Alternatively or additionally, the at least one connector may be configured to provide a form-fit and / or friction-based connection between the shield carrier and the substrate support component. For example, the connector shown in FIG. 5 is both magnetic and based on a form-fit connection. Optionally, the form-fit connection may facilitate a correct alignment between the shield carrier and the substrate support component in the connected state. For example, the connector may include an alignment pin configured to protrude into an alignment recess, e.g., a tapered slot or recess and / or a tapered or wedge-like pin or protrusion, that centers the respective components relative to each other during the connection process.

[0088] As is shown in FIG. 6, the shield carrier 120 can be transported with the first carrier transport system 1010 along the first carrier transport path T 1 , particularly inside the deposition system to a carrier assembly station for being connected to the substrate support component 210. For example, as described with respect to figures 1 to 3, the first carrier transport system 1010 may include a first magnetic levitation system with one or more magnetic levitation units 1011 (e.g., active or passive maglev units) configured to interact with one or more first magnetic units 126 of the shield carrier 120 for magnetically counteracting at least a part of the weight force of the shield carrier, particularly for holding the shield carrier below a respective transportation track. Withrespect to the transport of the shield carrier 120 along the first carrier transport path T1 , reference can be made to the embodiment shown in figures 1 to 3.

[0089] In the embodiment of FIGS. 5 and 6, a second carrier transport system 1020 is provided for transporting the substrate support component 210 (with and / or without a shield carrier 120 attached thereto) along a second carrier transport path T2 (which extends perpendicularly to the paper plane of FIGS. 5 and 6). In particular, the second carrier transport system 1020 is configured to transport the substrate support component 210 along a second carrier transport path T2 to a carrier assembly station for combining the substrate support component and the shield carrier at the carrier assembly station. The second carrier transport track T2 may optionally extend from the carrier assembly station to one or more processing vacuum chambers that house a plurality of deposition sources, so that the substrate support component (particularly supporting both the substrate and the shield carrier) can be transported between the carrier assembly station and the material deposition area with the second carrier transport system 1020.

[0090] The carrier assembly at the carrier assembly station is schematically illustrated in FIG. 6. The substrate support component 210 may be moved along the second carrier transport track T2 to the carrier assembly station, and the shield carrier 120 may be moved along the first carrier transport track T1 to the carrier assembly station. At the carrier assembly station, the shield carrier 120 and the substrate support component 210 are connected to each other, e.g., by moving at least one of the substrate support component and the shield carrier in a transverse direction X toward the respective other component, and / or via the first carrier transport track T1 and the second carrier transport track T2 approaching each other during the carrier transport, until the at least one connector 118 of the substrate support component engages with the at least one connector 128 of the shield carrier to provide the combined carrier 130.

[0091] In some embodiments, the second carrier transport system 1020 for transporting the substrate support component 210 includes a second magnetic levitation system. The second magnetic levitation may extend along the second carrier transport path T2. The second magnetic levitation system may include one or more magnetic levitation units 1021 configured to magnetically hold at least a part of the weight of the substrate support component 210. The second magnetic levitationsystem may include one or more magnetic drive units, particularly a linear motor, configured to move the substrate support component along the second carrier transport path T2, particularly while being magnetically levitated.

[0092] As is schematically shown in FIGS. 5 and 6, the substrate support component 210 may include at least a substrate carrier transport unit 215 configured to interact with the second carrier transport system 1020 for transporting the substrate support component 210 along the second carrier transport path T2 through the vacuum deposition system. In particular, the substrate support component 210 may include one or more first magnetic units 216 configured to interact with the one or more magnetic levitation units 1021 of the second magnetic levitation system and / or one or more second magnetic units 217 configured to interact with one or more magnetic drive units of the second magnetic levitation system.

[0093] The second magnetic levitation system may be configured similar to the first magnetic levitation system. For example, both magnetic levitation systems may be actively controlled magnetic levitation systems or passive magnetic levitation systems as described herein. An active maglev system as used herein relates to a magnetic levitation system in which a gap distance between the levitated component and a stationary track is measured, and the magnetic force generated by the magnetic levitation units is continuously controlled based on the measured gap distance. A passive maglev system does not use actively controlled magnetic bearings. For example, a passive maglev system may use permanent magnets or electromagnets for generating a predetermined levitation force.

[0094] In some embodiments, which can be combined with other embodiments described herein, the second carrier transport system 1020 is configured to transport the substrate support component 210 along the second carrier transport path T2 to the carrier assembly station for combining the substrate support component and the shield carrier at the carrier assembly station. Further, the first carrier transport system 1010 may be configured to transport the shield carrier along the first carrier transport path T1 to the carrier assembly station for combining the substrate support component and the shield carrier at the carrier assembly station.

[0095] The combined carrier 130 can be transported from the carrier assembly station with the second carrier transport system 1020, and / or with the first carrier transport system 1010, into one or more processing vacuum chambers for moving the combined carrier 130 past one or more deposition sources. In particular, when the shield carrier and the substrate support component are connected, the substrate support component 210 may act as a shield carrier-carrier that supports the shield carrier 120 and carries the shield carrier through the deposition system past the at least one deposition source. A “shield carrier-carrier” as used herein refers to a carrier that carries the shield carrier through the deposition system. The substrate support component 210 depicted in FIG. 5 supports both the shield carrier and the substrate and is configured to carry both the shield carrier and the substrate through the deposition system.

[0096] Alternatively or additionally, when the shield carrier and the substrate support component are connected to provide the combined carrier 130, the shield carrier 120 may support and carry the substrate support component 210 through the deposition system (not shown in the figures), e.g., past the at least one deposition source. In other words, in some embodiments, the shield carrier 120 can not only include the edge exclusion shield, but can also be configured to carry the substrate support component (acting as a “substrate carrier”) through the deposition system, even if the substrate support component 210 can be transported on its own with the second carrier transport system 1020 and includes the substrate carrier transport unit 215 that is configured to interact with the second carrier transport system 1020.

[0097] The combined carrier 130 may be transported with the second carrier transport system 1020 past the at least a deposition source 1300. During the transport from the carrier assembly station toward the deposition sources, the second carrier transport system 1020 may interact with the substrate carrier transport unit 215 of the substrate support component 210, while the shield carrier 120 can be carried by the substrate support component. The shield carrier 120 while being carried by the substrate support component acting as the shield carrier-carrier is a “passively transported” component. On the other hand, the shield carrier can also be “actively transported”, namely by the first carrier transport system 1010 along the first carriertransport path T1, e.g., to the carrier assembly station and away from the carrier assembly station, as will be explained in further detail with respect to FIG. 7.

[0098] FIG. 7 is a schematic top view of a deposition system 2000 according to some of the embodiments described herein. The deposition system 2000 is a vacuum deposition system with a plurality of vacuum chambers enabling a transport of substrates through the deposition system 2000 under vacuum from a loading station 1100 past at least a deposition source 1300, particularly past a plurality of deposition sources. The deposition sources may be evaporation sources configured to coat the substrates with one or more material layers.

[0099] Carrier assemblies 200 as described herein are transported through the deposition system 2000 past the at least a deposition source 1300 for depositing one or more material layers on the substrate held by the respective carrier assembly.

[0100] The deposition system 2000 includes at least a loading station 1100 configured to load a substrate 10 onto the substrate loading surface of the substrate support component 210, particularly in a horizontal orientation. The orientation of the substrate support component 210 holding the substrate 10 can be changed from the horizontal orientation to an essentially vertical orientation in the loading station 1100.

[0101] A second carrier transport system 1020 as described herein is provided for transporting the substrate support components 210 from the loading station 1100 to the carrier assembly station 1200 along a second carrier transport path T2, particularly in an essentially vertical orientation. Further, a first carrier transport system 1010 as described herein is provided for transporting the shield carriers 120 from a shield carrier loading or storage area to the carrier assembly station 1200 along a first carrier transport path T1 , particularly in an essentially vertical orientation.

[0102] The carrier assembly station 1200 is configured to connect the substrate support component 210 to the shield carrier 120 for providing the combined carrier 130. The substrate support component 210 and the shield carrier 120 may be connected to each other, when both the substrate support component 210 and the shield carrier 120 are provided in the essentially vertical orientation, as is schematically shown in FIG. 7. In particular, the carrier assembly station 1200 may be configured toconnect the vertically oriented shield carrier 120 to the vertically oriented substrate support component 210.

[0103] When the substrate support component 210 is attached to the shield carrier 120, the edge exclusion shield of the shield carrier 120 covers the edge region of the substrate support component 210 and of the substrate 10 that is held at the substrate holding surface of the substrate support component.

[0104] The combined carrier 130 may be transported with the second carrier transport system 1020 along the second transport path T2 past the at least a deposition source 1300 for depositing a material on the substrate. During material deposition, the edge exclusion shield of the shield carrier 120 covers the edge region of the substrate and of the substrate support component, so that the material is deposited (only) on the device region of the substrate and on the shield carrier 120, but not on the body of the substrate support component 210.

[0105] The substrate may be transported past several deposition sources in succession for depositing a layer stack on the substrate, e.g., an OLED layer stack. After the deposition of the layer stack, the combined carrier 130 may be transported back to the carrier assembly station 1200 or to another carrier assembly station for separating the substrate support component 210 from the shield carrier 120 under vacuum inside the deposition system. In particular, the carrier assembly station 1200 may be configured both to attach and detach the substrate support component to / from the shield carrier, or a second carrier assembly station may be provided for the detachment.

[0106] The separation of the shield carrier from the substrate support component may include at least one of: a deactivation of a mechanical, a magnetic and / or an electrostatic clamp between the shield carrier and the substrate support component; a deactivation of an electropermanent magnet, e.g., via an electric pulse, a relative shift between the shield carrier and the substrate support component, e.g., in a direction transverse to the respective transport direction and / or in a vertical direction, e.g., a relative shift between a first track defined by the first carrier transport system 1010 and a second track defined by the second carrier transport system 1020, e.g., in a horizontal and / or vertical direction, wherein said shift is adapted to disengage, e.g., aform-fit connection between the at least one connector 118, 128 of the shield carrier and of the substrate support component.

[0107] After the separation of the shield carrier 120 from the substrate support component 210, the substrate support component 210 holding the coated substrate may be transported with the second carrier transport system 1020 back to the loading station 1100 or to a second loading station (not shown in FIG. 7) for unloading the coated substrate from the substrate support component 210 and for moving the coated substrate out of the deposition system.

[0108] After the separation of the shield carrier 120 from the substrate support component 210 in the carrier assembly station 1200, the shield carrier 120 may be attached to another substrate support component holding a subsequent substrate to be coated, e.g., in the carrier assembly station 1200 or in a second carrier assembly station (not shown in FIG. 7). Alternatively or additionally, the shield carrier 120 being separated from the substrate support component may be transported with the first carrier transport system 1010, independently of the substrate support component, along the first carrier transport path T1 away from the carrier assembly station 1200, for example, to a second carrier assembly station or to a shield carrier storage magazine.

[0109] Since the shield carriers and the substrate support components can be transported independently of each other with a respective carrier transport system, the transport flexibility can be increased and the handling of the shield carriers and of the substrate support components under vacuum can be facilitated. In particular, each of the shield carriers and the substrate support components may include one or more respective carrier transport unit(s) configured to interact with a respective carrier transport system. This enables a transport of the shield carriers and a transport of the substrate support components, for example, into different loading / unloading and / or storage areas of the deposition system, as is schematically depicted in FIG. 7. In addition, since the shield carriers can be attached to the substrate support components acting a shield carrier-carriers, the substrate support components holding both the edge exclusion shields and the substrates can be moved past a plurality of deposition sources in succession via the second carrier transport system 1020, the deposition speed can be increased and the shadowing effect can be reduced.

[0110] In some implementations, the orientation change of the substrate support component 210 and the unloading of the substrate from the substrate support component 210 can be carried out in the loading station 1100 or in a second loading station (not shown in FIG. 7). For example, it is alternatively possible to provide a second loading station for unloading the coated substrates from the respective substrate support components and for moving the coated substrates out of the vacuum deposition system.

[0111] The second carrier transport path T2 shown in FIG. 7, which includes two rotation modules for changing the transport direction of the substrate support components, is only an example, and, alternatively, less than two or more than two rotation modules may be provided for changing the transport direction, e.g., by 90° or by 180°. In some embodiments, the coated substrates are not necessarily transported back to the loading station 1100, but may be transported to a second loading station for unloading the coated substrates, e.g., along a second transport path different from the transport path shown in FIG. 7.

[0112] In some embodiments, a first rotation module may be provided downstream of a first plurality of deposition sources along the second carrier transport path T2 for inverting the carrier transport direction, whereupon the combined carriers can be transported past a second plurality of deposition sources on the way back toward the carrier assembly station 1200 or toward a second carrier assembly station. In some embodiments, a second rotation module may be provided for changing the transport direction of the shield carriers along the first carrier transport path T1 and / or for changing the transport direction of the substrate support components along the second carrier transport path T2, for example, by 90°.

[0113] In some implementations, the loading station 1100 is configured to change the orientation of the substrate support component 210 between an essentially horizontal orientation for loading the substrate onto the substrate holding surface and an essentially vertical orientation for transporting the substrate support component 210 along the second carrier transport path T2 toward the carrier assembly station 1200. Further, the loading station 1100 (or a second loading station) may be configured to change the orientation of the substrate support component 210 between the essentiallyvertical orientation for carrier transport and the essentially horizontal orientation for unloading the coated substrate from the substrate support component.

[0114] In some embodiments, which can be combined with other embodiments described herein, a first magazine 1305 may be provided for storing a first plurality of shield carriers inside the deposition system, e.g., a plurality of clean shield carriers. Alternatively or additionally, a second magazine 1306 may be provided for storing a second plurality of shield carriers inside the deposition system, e.g., a plurality of used shield carriers. If a shield carrier has been used over a predetermined time in the deposition system for protecting substrate edges from being coated, the shield carrier is typically covered with coating material. Hence, it may be beneficial to exchange a used shield carrier with a clean shield carrier at predetermined time intervals. The shield carriers stored in the first magazine 1305 may be clean shield carriers meant for replacing used shield carriers after predetermined time intervals of use. The used shield carriers can be stored in the second magazine 1306. The used shield carriers can be removed from the deposition system for cleaning, e.g., outside the deposition system, when new clean shield carriers are needed, whereupon the cleaned shield carriers can be returned into the deposition system for being stored, e.g., in the first magazine 1305 for use.

[0115] In other embodiments, a cleaning station may be provided for cleaning used shield carriers inside the deposition system. For example, an in-situ cleaning station may be provided for cleaning used shield carriers inside the deposition system.

[0116] Alternatively or additionally, a used shield carrier to be exchanged with a clean shield carrier can be unloaded from the deposition system for being stored under atmospheric conditions. When a predetermined number of used shield carriers are present in the atmospheric storage, the used shield carrier may be cleaned ex-situ, i.e. , outside the deposition system. The cleaned shield carrier can be re-inserted into the deposition system for further use.

[0117] Unlike the deposition system 1000 shown in FIG. 4, the deposition system 2000 of FIG. 7 includes the second carrier transport system 1020 extending along the second carrier transport path T2 and configured to transport the substrate support component 210 along the second carrier transport path T2, particularly to the carrierassembly station 1200 for connecting the shield carrier 120 to the substrate support component 210. The second carrier transport system 1020 may be further configured to transport the combined carrier 130 past at least a deposition source 1300 or past a plurality of deposition sources in succession. The combined carrier 130 includes the substrate support component 210 acting as a shield carrier-carrier that carries the shield carrier through the deposition system. The substrate support component 210 interacts with the second carrier transport system 1020 and supports the shield carrier 120 during the transport past the deposition sources.

[0118] While the foregoing is directed to some embodiments, other and further embodiments may be devised without departing from the scope, and the scope is determined by the claims that follow.

Claims

CLAIMS1. A method of transporting a substrate (10) through a deposition system (1000, 2000), comprising;loading a substrate (10) onto a substrate holding surface of a substrate support component (110, 210) and holding the substrate at the substrate holding surface with a chucking device (111);transporting, with a first carrier transport system (1010), a shield carrier (120) along a first carrier transport path (T1) in the deposition system to a carrier assembly station (1200);connecting the shield carrier (120) and the substrate support component (110, 210) in the carrier assembly station to provide a combined carrier (130) in which an edge exclusion shield (121 ) of the shield carrier covers an edge region of the substrate support component and of the substrate held at the substrate holding surface; andtransporting the combined carrier (130) past at least a deposition source (1300) to deposit at least one material on a device region of the substrate, the edge region of the substrate support component and of the substrate being shielded by the edge exclusion shield (121) of the shield carrier.

2. The method of claim 1 , wherein the chucking device (111) holds the substrate at the substrate holding surface by an electrostatic force.

3. The method of claim 1, wherein the first carrier transport system (1010) comprises a first magnetic levitation system with one or more magnetic levitation units (1011) configured to magnetically hold at least a part of a weight of the shield carrier (120) and / or with one or more magnetic drive units (1012) configured to move the shield carrier along the first carrier transport path (T 1 ).

4. The method of claim 1, wherein, at the carrier assembly station (1200), the shield carrier and the substrate support component are connected to each other in an essentially vertical orientation, the substrate support component and / or the shieldcarrier comprising at least one connector (118, 128) configured to attach the shield carrier and the substrate support component to each other.

5. The method of claim 4, wherein the at least one connector (118, 128) comprises a magnet, particularly an electropermanent magnet, configured to attach the shield carrier and the substrate support component to each other by magnetic force.

6. The method of claim 4 or 5, wherein the at least one connector (118, 128) provides a form-fit connection between the shield carrier and the substrate support component and includes at least one element of the group consisting of:a protrusion, particularly a pin or wedge configured to project into an alignment recess, and a recess for receiving a protrusion, particularly an alignment recess.

7. The method of any of claims 1 to 6, wherein, when the shield carrier and the substrate support component are connected, the shield carrier (120) supports the substrate support component (110) and carries the substrate support component through the deposition system past the at least a deposition source (1300).

8. The method of any of claims 1 to 6, wherein, when the shield carrier and the substrate support component are connected, the substrate support component (210) acts as a shield carrier-carrier that supports the shield carrier (120) and carries the shield carrier through the deposition system past the at least a deposition source (1300).

9. The method of any of claims 1 to 8, further comprising:transporting, with a second carrier transport system (1020), the substrate support component (210) along a second carrier transport path (T2) to the carrier assembly station (1200) for combining the substrate support component and the shield carrier.

10. The method of claim 9, wherein, after the combining, the substrate support component (210) acts as a shield carrier-carrier, and the combined carrier is transported with the second carrier transport system (1020) past the at least a deposition source (1300), the second carrier transport system (1020) interacting with a substrate carrier transport unit (215) of the substrate support component (210).

11. A carrier assembly (100, 200) for carrying a substrate (10) through a deposition system (1000, 2000), the carrier assembly comprising a shield carrier (120) detachably connectable to a substrate support component (110, 210) to provide a combined carrier (130),the substrate support component (110, 210) comprising:a chucking device (111) for holding the substrate at a substrate holding surface (112); andthe shield carrier (120) comprising:an edge exclusion shield (121) configured to cover an edge region (13) of the substrate support component (110, 210) and of the substrate (10) held at the substrate holding surface, when the substrate support component and the shield carrier are connected; anda shield carrier transport unit (125) configured to interact with a first carrier transport system (1010) for transporting the shield carrier along a first carrier transport path (T 1 ),wherein at least one of the substrate support component and the shield carrier comprises at least one connector (118, 128) configured to attach the shield carrier (120) and the substrate support component to each other to provide the combined carrier (130).

12. The carrier assembly of claim 11, wherein the chucking device (111) is an electrostatic chuck configured to hold the substrate at the substrate holding surface by an electrostatic force.

13. The carrier assembly of claim 11 or 12, wherein the shield carrier transport unit (125) comprises one or more first magnetic units (126) configured to interact with one or more magnetic levitation units (1011 ) of a first magnetic levitation system and / or one or more second magnetic units (127) configured to interact with one or more magnetic drive units (1012) configured to move the shield carrier along the first carrier transport path (T1).

14. The carrier assembly of any of claims 11 to 13, wherein the shield carrier (120) comprises a mask frame (122) with a rectangular opening (123) defining a device region of the substrate having an area of at least 1 m2, an inner edge (124) of the mask frame configured to protrude over the edge region of the substrate at a distance of 0.5 mm or more and 10 mm or less from the substrate.

15. The carrier assembly of any of claims 11 to 14, wherein, when the shield carrier and the substrate support component are connected to provide the combined carrier (130), the shield carrier (120) is configured to support the substrate support component (110) and to carry the substrate support component through the deposition system along the first carrier transport path (T1 ).

16. The carrier assembly of any of claims 11 to 14, wherein the substrate support component (210) further includes:a substrate carrier transport unit (215) configured to interact with a second carrier transport system (1020) for transporting the substrate support component (210) along a second carrier transport path (T2) through the deposition system.

17. The carrier assembly of claim 16, wherein the substrate carrier transport unit (215) comprises one or more first magnetic units (216) configured to interact with one or more magnetic levitation units (1021) of a second magnetic levitation system and / or one or more second magnetic units (217) configured to interact with one or more magnetic drive units.

18. The carrier assembly of claim 16 or 17, wherein the substrate support component (210) is configured to act as a shield carrier-carrier that supports the shield carrier (120) while carrying the shield carrier through the deposition system along the second carrier transport path (T2), when the shield carrier (120) and the substrate support component (210) are connected to provide the combined carrier (130).

19. A shield carrier, particularly for a carrier assembly (100, 200) of any of claims 11 to 18, the shield carrier being detachably connectable to a substrate support component to provide a combined carrier, the shield carrier comprising:an edge exclusion shield (121) configured to cover an edge region (13) of the substrate support component and of the substrate (10) held at the substrate holding surface, when the substrate support component and the shield carrier are connected; anda shield carrier transport unit (125) configured to interact with a first carrier transport system (1010) for transporting the shield carrier along a first carrier transport path (T 1 ).

20. A deposition system (1000, 2000) for coating a substrate with one or more materials, comprising:a carrier assembly (100, 200) comprising a shield carrier (120) detachably connectable to a substrate support component (110, 210) in accordance with any of claims 11 to 18;a loading station (1100) configured to load a substrate (10) onto the substrate holding surface (112) of the substrate support component (110, 210);a first carrier transport system (1010) configured to transport the shield carrier (120) along a first carrier transport path to a carrier assembly station (1200); andthe carrier assembly station (1200) configured to connect the shield carrier (120) and the substrate support component (110, 210) to provide the combined carrier, in which the edge exclusion shield of the shield carrier is configured to cover an edge region of the substrate support component and of the substrate held at the substrate holding surface with a chucking device.

21. The deposition system of claim 20, wherein the first carrier transport system (1010) is configured to transport the combined carrier past a deposition source (1300), the combined carrier comprising the shield carrier interacting with the first carrier transport system (1010) and supporting the substrate support component (110) during the transport past the deposition source (1300).

22. The deposition system of claim 20, further comprising:a second carrier transport system (1020) configured to transport the substrate support component (210) along a second carrier transport path (T2) to the carrier assembly station (1200) for connecting the shield carrier (120) to the substrate support component (210), the second carrier transport system (1020) being further configured to transport the combined carrier past a deposition source (1300), the combined carrier comprising the substrate support component (210) acting as a shield carrier-carrier interacting with the second carrier transport system (1020) and supporting the shield carrier (120) during the transport past the deposition source (1300).

23. The deposition system of any of claims 19 to 22, wherein the loading station (1100) is configured to change an orientation of the substrate support component (110, 210) between an essentially horizontal orientation for substrate loading onto the substrate holding surface and an essentially vertical orientation for transporting the substrate support component along the first carrier transport path (T1) and / or along the second carrier transport path (T2).

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