Power conversion device
Patent Information
- Authority / Receiving Office
- WO Β· WO
- Patent Type
- Applications
- Current Assignee / Owner
- MITSUBISHI ELECTRIC MOBILITY CORP
- Filing Date
- 2025-01-22
- Publication Date
- 2026-07-30
Smart Images
Figure JP2025001873_30072026_PF_FP_ABST
Abstract
Description
Power conversion device
[0001] The present disclosure relates to a power conversion device.
[0002] Automobiles such as battery electric vehicles (BEV), hybrid electric vehicles (HEV), and plug-in hybrid electric vehicles (PHEV) are equipped with power conversion devices such as inverters and converters that boost and buck the power supply voltage of the battery. The power conversion device converts the direct current supplied from the battery into an alternating current and drives an electric motor (motor).
[0003] In particular, an inverter includes a semiconductor module equipped with semiconductor switching elements for power conversion that convert direct current into alternating current, a drive circuit for the semiconductor module, a control board that controls them, and a smoothing capacitor for voltage smoothing. In recent years, with the increase in the output of electric motors, an increase in the output of power conversion devices has been demanded. From the perspective of mounting on vehicles, downsizing of the power conversion device has become an important issue.
[0004] In addition, the power conversion device tends to be mounted on an electric motor or a transmission, or integrated with an electric motor or a transmission. Since the power conversion device is subjected to vibrations not only from the road surface during vehicle operation but also from the operations of the engine, electric motor, and transmission, high vibration resistance is required. In particular, the electronic components on the control board and the control terminals of the semiconductor module connected to the control board by solder or the like are likely to be damaged due to the amplification of vibrations by the resonance of the housing and the control board, and improving the vibration resistance of the control board has become an issue.
[0005] A configuration of a power conversion device with improved vibration resistance has been disclosed (see, for example, Patent Document 1). In the configuration disclosed in Patent Document 1, the control board is fixed to a bracket in which fixtures are arranged in accordance with the resonance mode of the control board. By configuring in this way, the vibration resistance of the control board can be improved.
[0006] Japanese Patent No. 5580789
[0007] In Patent Document 1, in order to fix the control board to the bracket, numerous through holes and fasteners are arranged on the control board for fixing. If the bracket and fasteners are made of metal parts in addition to the through holes and fasteners, it is necessary to ensure an insulating distance on the control board. As a result, the degree of freedom in arranging electronic components and wiring circuit patterns on the control board is limited, which leads to the problem of increasing the size of the board and the power conversion device.
[0008] Therefore, the purpose of this disclosure is to obtain a power conversion device that improves the vibration resistance of the control board while maintaining miniaturization.
[0009] The power conversion device of this disclosure comprises a plurality of semiconductor modules arranged in parallel on a first surface including a first direction and a second direction perpendicular to the first direction, an electronic circuit for controlling the operation of the semiconductor modules, a control board arranged opposite to the first surface, and a support plate made of an insulator arranged opposite to a first substrate surface which is one substrate surface of the control board opposite to the first surface, or a second substrate surface which is the other substrate surface opposite to the first substrate surface, wherein the semiconductor modules have one or more control terminals extending in the direction normal to the first substrate surface and connected to the control board, and the support plate has a main body and one or more substrate support parts provided on the main body and supporting the first substrate surface or the second substrate surface, wherein the substrate support parts are arranged between the control terminals of one of the semiconductor modules and the control terminals of another semiconductor module adjacent to the one semiconductor module, and support the control board.
[0010] The power conversion device of this disclosure comprises a plurality of semiconductor modules arranged in parallel on a first surface, a control board arranged opposite to the first surface, and a support plate made of an insulator arranged opposite to the first or second substrate surface of the control board. The semiconductor modules have one or more control terminals that extend in the direction normal to the first substrate surface and are connected to the control board. The support plate has a main body and one or more substrate support parts that support the first or second substrate surface. The substrate support parts are arranged between the control terminals of one semiconductor module and the control terminals of another semiconductor module adjacent to that semiconductor module, and support the control board. Since the control board is supported by the substrate support parts without restricting the freedom of arrangement of electronic components on the control board and the wiring of circuit patterns, it is possible to obtain a power conversion device that improves the vibration resistance of the control board while maintaining miniaturization.
[0011] This is a perspective view showing an outline of the power converter according to Embodiment 1. This is an exploded perspective view showing the configuration of the power converter according to Embodiment 1. This is a plan view showing an outline of the power converter according to Embodiment 1. This is a cross-sectional view of the main part of the power converter cut at the A-A cross-sectional position in Figure 3. This is a cross-sectional view of the main part of another power converter cut at the A-A cross-sectional position in Figure 3. This is a cross-sectional view of the main part of another power converter cut at the A-A cross-sectional position in Figure 3. This is a cross-sectional view of the main part of another power converter cut at the A-A cross-sectional position in Figure 3. This is a cross-sectional view of the main part of the power converter cut at the B-B cross-sectional position in Figure 3. This is a plan view showing an outline of the main part of the support plate of the power converter according to Embodiment 1. This is a diagram showing an example of the installation state of the power converter according to Embodiment 1. This is a perspective view showing the configuration of the support plate of the power converter according to Embodiment 2. This is a side view showing an outline of the configuration of the control board and support plate of the power converter according to Embodiment 2.
[0012] The power conversion device according to the embodiment of this disclosure will be described below with reference to the figures. In each figure, the same or equivalent components and parts will be denoted by the same reference numerals.
[0013] Embodiment 1. Figure 1 is a perspective view showing a schematic of the power converter 100 according to Embodiment 1, Figure 2 is an exploded perspective view showing the configuration of the power converter 100, Figure 3 is a plan view showing a schematic of the power converter 100 and illustrating the arrangement of the substrate support part 32, Figures 4 to 7 are cross-sectional views of the main part of the power converter 100 cut at the A-A cross-sectional position in Figure 3, Figure 8 is a cross-sectional view of the main part of the power converter 100 cut at the B-B cross-sectional position in Figure 3, Figure 9 is a plan view showing a schematic of the main part of the support plate 3 of the power converter 100, and Figure 10 is a diagram showing an example of the installation state of the power converter 100. The power converter 100 is, for example, a device that converts the input current from DC to AC, AC to DC, or input voltage to a different voltage. The power converter 100 in Embodiment 1 is, for example, an inverter mounted on a BEV, HEV, or PHEV. The power converter 100 converts the DC current from a battery, which is a DC power source, into AC current in order to drive a three-phase AC motor. The motor can be for vehicle drive or power generation, and the number of semiconductor modules 1 in the power converter 100 is changed according to the specifications of the motor connected to the power converter 100. The applications of the power converter 100 are not particularly limited and it can be used in various applications other than in vehicles.
[0014] <Power Conversion Device 100> As shown in Figure 2, the power conversion device 100 comprises a plurality of semiconductor modules 1, each having one or more semiconductor switching elements 1a, a control board 2, and a support plate 3 made of an insulator. The plurality of semiconductor modules 1 are arranged in parallel on a first surface 5a that includes a first direction and a second direction perpendicular to the first direction. In this embodiment, the X direction in which the plurality of semiconductor modules 1 are arranged is defined as the first direction, and the Y direction is defined as the second direction. The direction perpendicular to the X and Y directions is defined as the Z direction. In the following description, the side of the power conversion device 100 viewed from the direction indicated by arrow Z in Figure 1 (hereinafter referred to as the Z direction) will be referred to as the upper side of the power conversion device 100, and the side of the power conversion device 100 viewed from the opposite direction of the Z direction will be referred to as the lower side of the power conversion device 100. The Z direction is the normal direction to the substrate surface of the control board 2.
[0015] As shown in Figure 2, the control board 2 has an electronic circuit 2a that controls the operation of the semiconductor module 1 and is positioned facing the first surface 5a. The electronic circuit 2a is provided, for example, in the area enclosed by the dashed line on the control board 2. The control board 2 has a plurality of through holes 21 used for electrical connection with the semiconductor module 1, and one or more through holes 22 used for fixing. The support plate 3 is positioned facing either the first substrate surface 2b, which is one of the substrate surfaces of the control board 2 facing the first surface 5a, or the second substrate surface 2c, which is the other substrate surface opposite to the first substrate surface 2b. In this embodiment, the support plate 3 is positioned facing the first substrate surface 2b, but is not limited to this, and may also be positioned facing the second substrate surface 2c.
[0016] In this embodiment, the power converter 100 further comprises a housing 5 having a first surface 5a and housing a semiconductor module 1, a control board 2, and a support plate 3, and a spacer 4 that supports the support plate 3. Although not shown here, the power converter 100 also includes, in addition to the above-mentioned components, an input terminal connected to an external DC power supply, a capacitor having a capacitor element for smoothing the voltage, an output terminal connected to an external three-phase AC motor, and connecting conductors connecting them. The DC power supply is, for example, a secondary battery such as a lithium-ion battery.
[0017] <Semiconductor Module 1> The configuration of each part of the power converter 100 will be described in order. First, the semiconductor module 1 will be described. The semiconductor module 1 has a module body 11, which is the main body of the semiconductor module 1 with a semiconductor switching element 1a built in, one or more control terminals 12, and one or more power terminals 13. In this embodiment, a configuration with six semiconductor modules 1 is shown, but the number of semiconductor modules 1 is not limited to this. The number of semiconductor modules 1 may be changed depending on the number and output of motors connected to the power converter 100. The module body 11 is a sealing resin that surrounds the semiconductor switching element 1a. In this embodiment, the module body 11 is formed in the shape of a rectangular parallelepiped. The control terminals 12 and power terminals 13 are made of copper, for example, which has low electrical resistivity and excellent conductivity.
[0018] The control terminal 12 is a control terminal with a relatively small cross-sectional area. The control terminal 12 extends from the module body 11 in the direction normal to the first substrate surface and is connected to the control board 2. In this embodiment, the control terminal 12 protrudes from the side surface of the module body 11, is bent, and extends in the direction normal to the first substrate surface 2b. In this embodiment, the control terminal 12 protrudes from both the side surfaces of the module body 11 on one side and the other side in the Y direction. The portion of the module body 11 on which the control terminal 12 is provided is not limited to this. In this embodiment, one semiconductor module 1 has eight control terminals 12, but the number of control terminals 12 that one semiconductor module 1 has is not limited to this.
[0019] The control terminal 12 is inserted into a through-hole 21 of the control board 2 and electrically connects the semiconductor switching element 1a and the control board 2. The control terminal 12 transmits signals indicating the temperature, operating state, and abnormal state of the semiconductor module 1 from the semiconductor module 1 to the control board 2. The control terminal 12 also transmits control signals for controlling the semiconductor module 1 from the control board 2 to the semiconductor module 1.
[0020] In this embodiment, the control terminal 12 is electrically connected to the control board 2 by solder 7, as shown in Figure 1. This configuration reduces the space required on the control board 2 for connecting the control terminal 12. Because the connection space on the control board 2 is reduced, the size of the control board 2 can be miniaturized. Because the size of the control board 2 is reduced, the power converter 100 can be miniaturized.
[0021] The power terminal 13 is a terminal with a relatively large cross-sectional area for high current conduction, connected to a capacitor or output terminal. The power terminal 13 extends from the module body 11 in the direction normal to the first substrate surface 2b. In this embodiment, the power terminal 13 protrudes from the side surface of the module body 11, is bent, and extends in the direction normal to the first substrate surface 2b. In this embodiment, the power terminal 13 protrudes from both the side surfaces of the module body 11 on one side and the other side in the Y direction. The portion of the module body 11 on which the power terminal 13 is provided is not limited to this. By providing the control terminal 12 and the power terminal 13 on both the side surfaces on one side and the other side in the Y direction, multiple semiconductor modules 1 can be arranged with a narrower spacing in the X direction, thereby reducing the size of the power converter 100 in the X direction.
[0022] In this embodiment, one semiconductor module 1 has three power terminals 13, but the number of power terminals 13 on one semiconductor module 1 is not limited to this. The power terminals 13 in this embodiment are a terminal connected to the positive terminal of a capacitor, a terminal connected to the negative terminal of a capacitor, and a terminal that outputs alternating current to a three-phase AC motor. The power terminals 13 are electrically connected to the terminals or output terminals of the capacitor, for example, by welding or screws.
[0023] In this embodiment, the semiconductor module 1 has two semiconductor switching elements 1a. In the figure, the semiconductor switching elements 1a are shown by dashed lines. The number of semiconductor switching elements 1a is not limited to two; there may be one or more. The semiconductor switching elements 1a may be power control semiconductor elements such as MOSFETs (metal oxide field-effect transistors), IGBTs (insulated gate bipolar transistors), or freewheeling diodes. The semiconductor switching elements 1a are not limited to these; other semiconductor elements such as bipolar transistors may also be used. Furthermore, an RC-IGBT (reverse conducting IGBT), in which the switching element and freewheeling diode are integrated, may also be used.
[0024] The semiconductor switching element 1a is formed on a semiconductor substrate made of materials such as silicon, silicon carbide, or gallium nitride. The semiconductor switching element 1a can be a wide-bandgap semiconductor element with a bandgap wider than that of silicon. When a MOSFET made of silicon carbide, which is a wide-bandgap semiconductor element, is used, the time change amount di / dt of the current generated during switching can be made larger than that of a MOSFET made of silicon. In addition, wide-bandgap semiconductor elements have low on-resistance, low loss, and low heat generation, so the chip area can be reduced. As the chip area is reduced, the semiconductor module 1 can be miniaturized.
[0025] A plate (not shown) made of, for example, copper or aluminum is exposed on the first surface 5a side of the module body 11. The plate is insulated from the semiconductor switching element 1a. The portion of the plate exposed from the module body 11 is thermally connected to the first surface 5a via a bonding material such as solder. By thermally connecting the plate and the first surface 5a, the heat generated in the semiconductor module 1 can be efficiently dissipated to the housing 5.
[0026] <Support Plate 3> Next, the support plate 3 will be described. The support plate 3 has a main body portion 31 and one or more substrate support portions 32 provided on the main body portion 31 that support the first substrate surface 2b or the second substrate surface 2c. The substrate support portions 32 protrude from the main body portion 31 toward the control board 2. In this embodiment, the support plate 3 has multiple substrate support portions 32, but the support plate 3 may have only one substrate support portion 32. Also, in this embodiment, as described above, since the support plate 3 is positioned facing the first substrate surface 2b, the substrate support portions 32 support the first substrate surface 2b. When the support plate 3 is positioned facing the second substrate surface 2c, the substrate support portions 32 support the second substrate surface 2c.
[0027] As shown in Figure 4, the support plate 3 has a guide hole 35 in its main body 31 into which the control terminal 12 of the semiconductor module 1 is inserted. The guide hole 35 is a through hole with a large opening on one side in the Z direction. By providing the guide hole 35, the tip of the control terminal 12 of the semiconductor module 1 can be easily guided to the position of the through hole 21 of the control board 2. As shown in Figure 2, the support plate 3 has a through hole 33 for fixing the main body 31 to the spacer 4 or housing 5 by a fixing device 6. In this embodiment, the support plate 3 is fixed to the spacer 4 by the fixing device 6, but the support plate 3 may also be fixed to the housing 5.
[0028] In this embodiment, the support plate 3 is a rectangular flat plate. The external shape and size of the support plate 3 are the same as those of the control board 2, but the shape and size of the support plate 3 are not limited to these. Furthermore, except for the guide holes 35 and through holes 33 through which the control terminals 12 of the semiconductor module 1 pass, the main body 31 is formed by filling it with an insulating resin. The material of the support plate 3 is not particularly limited, but it is required to be insulating and highly rigid, and it is desirable that it be a resin with excellent moldability and processability. Examples of insulating resins include thermoplastic resins such as general-purpose plastics such as polyethylene and polypropylene, engineering plastics such as polyamide (nylon) and polyacetal (POM), super engineering plastics such as polyetheretherketone (PEEK), polyphenylene sulfide (PPS), and polytetrafluoroethylene (PTFE), or thermosetting resins such as phenol and epoxy.
[0029] <Substrate Support Section 32> Details of the substrate support section 32, which is the main part of this disclosure, will now be described. The substrate support section 32 is positioned between a control terminal 12 of one semiconductor module 1 and a control terminal 12 of another semiconductor module 1 adjacent to the first semiconductor module 1, and supports the control substrate 2. In Figure 3, the dashed line indicates the projection portion 32a of the substrate support section as seen from the top side of the power converter 100. The projection portion 32a of the substrate support section is positioned between a through-hole 21 through which a control terminal 12 of one semiconductor module 1 passes and a through-hole 21 through which a control terminal 12 of another semiconductor module 1 adjacent to the first semiconductor module 1 passes. In this embodiment, the substrate support section 32 is also positioned adjacent to the control terminal 12 on one or the other side in the X direction. In this embodiment, the size of the substrate support section 32 provided on one side in the Y direction is different from the size of the substrate support section 32 provided on the other side in the Y direction. At the projection portion 32a of the substrate support portion, the control board 2 is supported by the substrate support portion 32. With this configuration, the control board 2 is supported by the substrate support portion 32 without restricting the freedom of arrangement of electronic components on the control board 2 and the wiring of circuit patterns. Therefore, a power converter 100 can be obtained that maintains miniaturization while improving the vibration resistance of the control board 2.
[0030] The substrate support portion 32 may be in direct contact with the control board 2 and support the control board 2, but the configuration in which the substrate support portion 32 supports the control board 2 is not limited to this. In this embodiment, as shown in Figure 4, the substrate support portion 32 contacts the control board 2 via adhesive 34 and supports the control board 2. In this embodiment, as shown in Figure 2, adhesive 34 is placed on all substrate support portions 32, but this is not limited to this. By placing adhesive 34 between the control board 2 and the substrate support portion 32 in this way, it is possible to prevent a gap from forming between the control board 2 and the substrate support portion 32, thereby reliably reducing the amplitude of the control board 2 caused by external vibrations. In this embodiment, the portion of the substrate support portion 32 adjacent to and facing the control board 2 is a flat surface 32b1 parallel to the first substrate surface 2b. The configuration of the portion of the substrate support portion 32 adjacent to and facing the control board 2 is not limited to a flat surface 32b1. If the adhesive 34 is in liquid form, the portion of the substrate support portion 32 adjacent to and facing the control board 2 may be a recess to prevent the adhesive 34 from spreading to the surrounding area.
[0031] The configuration is not limited to the one shown in Figure 4 with the adhesive 34. In the configuration shown in Figure 5, the substrate support portion 32 contacts the control substrate 2 via the viscoelastic body 34a and supports the control substrate 2. By arranging the viscoelastic body 34a instead of the adhesive 34 in this way, external vibrations can be dampened, thereby reducing the amplitude of the control substrate 2 caused by external vibrations. The viscoelastic body 34a is a sheet-like material with a high damping rate. Examples of viscoelastic materials 34a include rubber, gel, adhesive, UV-curable liquid gasket (CIPG), and self-adhesive materials.
[0032] The configuration is not limited to one in which the main body 31 and the substrate support portion 32 are formed from the same material. In the configuration shown in Figure 6, the substrate support portion 32 is formed from a viscoelastic material 34a. The viscoelastic material 34a, which is the substrate support portion 32, contacts the control substrate 2 and supports the control substrate 2. By forming the substrate support portion 32 from a viscoelastic material 34a and integrating it with the main body 31, the substrate support portion 32 itself can dampen external vibrations, thereby further reducing the amplitude of the control substrate 2 caused by external vibrations.
[0033] <Shape and Arrangement of Substrate Support 32> The shape of the substrate support 32 in this embodiment will be described. In this embodiment, as shown in Figure 4, the substrate support 32 has a flat portion 32b that supports the control substrate 2 and a spaced portion 32c that is adjacent to the control terminal 12 and spaced away from the control substrate 2. The flat portion 32b has a flat surface 32b1 that is adjacent to and facing the first substrate surface 2b. The flat surface 32b1 of the flat portion 32b that supports the control substrate 2 is parallel to the first substrate surface 2b. The portion of the spaced portion 32c that faces the first substrate surface 2b is also parallel to the first substrate surface 2b. The flat portion 32b and the spaced portion 32c form a stepped shape. Since the spaced portion 32c is provided and a space is formed between the substrate support 32 and the control substrate 2 by the spaced portion 32c, when the adhesive 34 spreads, the adhesive 34 remains in the spaced portion 32c, so that the adhesive 34 does not adhere to the control terminal 12. Since the adhesion of adhesive 34 to the control terminal 12 is suppressed, it is possible to suppress curing defects of the solder connecting the control board 2 and the control terminal 12.
[0034] The separation portion 32c is not limited to a configuration parallel to the first substrate surface 2b. As shown in Figure 7, the separation portion 32c may also be configured as an inclined surface that increases in distance from the control substrate 2 towards the control terminal 12, starting from the end of the flat surface 32b1. Even if the separation portion 32c is configured as an inclined surface, a space is formed between the substrate support portion 32 and the control substrate 2 by the separation portion 32c. As a result, when the adhesive 34 spreads, the adhesive 34 remains in the separation portion 32c, thus preventing the adhesive 34 from adhering to the control terminal 12.
[0035] In this embodiment shown in Figure 2, the main body portion 31 and the substrate support portion 32 of the support plate 3 are formed integrally, and the support plate 3 is positioned facing the first substrate surface 2b. As shown in Figure 8, when viewed from the top side of the power converter 100 in the direction normal to the first substrate surface 2b, the power terminals 13, the main body portion 31, and the control board 2 overlap. Because the support plate 3 is interposed between the control board 2 and the power terminals 13 in this way, insulation between the control board 2 and the power terminals 13 can be ensured. Because insulation between the control board 2 and the power terminals 13 is ensured, the distance in the Z direction between the control board 2 and the power terminals 13 can be made shorter than the distance required for insulation by space. Because the distance in the Z direction between the control board 2 and the power terminals 13 is shortened, the power converter 100 becomes low profile, and thus the power converter 100 can be miniaturized.
[0036] In this embodiment, the support plate 3 is positioned opposite the first substrate surface 2b, and the main body portion 31 of the support plate 3 overlaps with the semiconductor module 1 when viewed from the top side of the power converter 100 in the direction normal to the first substrate surface 2b. When viewed in the direction normal to the first substrate surface 2b, the height from the first surface 5a of the portion of the main body portion 31 of the support plate 3 that overlaps with the power terminals 13 is different from the height from the first surface 5a of the portion of the main body portion 31 of the support plate 3 that overlaps with the module main body portion 11. In the configuration shown in Figure 8, the height Z1 from the first surface 5a of the portion of the main body portion 31 of the support plate 3 that overlaps with the power terminals 13 is greater than the height Z2 from the first surface 5a of the portion of the main body portion 31 of the support plate 3 that overlaps with the module main body portion 11. This configuration is not the only one; the height from the first surface 5a of the portion of the support plate 3's main body 31 that overlaps with the power terminals 13 may be smaller than the height from the first surface 5a of the portion of the support plate 3's main body 31 that overlaps with the module main body 11.
[0037] The portion of the main body 31 of the support plate 3 that overlaps with the power terminal 13 is positioned close to the control board 2, while the portion of the main body 31 of the support plate 3 that overlaps with the module main body 11 is positioned at a distance from the control board 2. By having portions of the main body 31 of the support plate 3 at different heights in this way, the overall bending rigidity of the support plate 3 can be increased. As the overall bending rigidity of the support plate 3 is increased, the vibration resistance of the power converter 100 can be improved.
[0038] In this embodiment, as shown in Figure 3, the control terminals 12 are arranged in a single line along a straight line, and the substrate support portions 32 are also arranged along the same straight line. In Figure 3, the control terminals 12 and substrate support portions 32 are arranged in two rows. In both rows, the control terminals 12 and substrate support portions 32 are arranged in a single line along a straight line. In Figure 3, the straight line is a straight line extending in the X direction.
[0039] By arranging the control terminals 12 in a line along a straight line, the soldering method can be drawn. Since drawn soldering can be used, the process of the power converter 100 can be simplified, thereby improving the productivity of the power converter 100. Furthermore, by arranging the substrate support parts 32 in a line along the same straight line, the control board 2 is supported by the substrate support parts 32 adjacent to the control terminals 12, so the amplitude of the control board 2 adjacent to the control terminals 12 can be suppressed. Since the amplitude of the control board 2 is suppressed, the vibration resistance of the power converter 100 can be improved. In addition, since the amplitude of the control board 2 adjacent to the control terminals 12 is suppressed, damage to the control terminals 12 can be suppressed.
[0040] <Rigidity of Support Plate 3> In this embodiment, the frequency of the first mode of the eigenvalue in the vibration of the support plate 3 is higher than the frequency of the first mode of the eigenvalue in the vibration of the control board 2. The comparison of the frequencies of the first mode of the eigenvalue is performed for the support plate 3 alone and for the control board 2 alone. By configuring it in this way, the rigidity when the control board 2 and the support plate 3 are stacked on top of each other can be increased, thereby enhancing the effect of suppressing the amplitude of the control board 2 caused by external vibrations.
[0041] Furthermore, even if the frequency of the first mode of the eigenvalue in the vibration of the support plate 3 alone is lower than the frequency of the first mode of the eigenvalue in the vibration of the control board 2 alone, the frequency of the first mode of the eigenvalue when the control board 2 and support plate 3 are considered as a whole can be made relatively higher than the frequency of the first mode of the eigenvalue in the vibration of the control board 2 alone. This allows the amplitude of the control board 2 to be suppressed in response to external vibrations.
[0042] The main deformation modes of the support plate 3 are the bending of the central part of the support plate 3 and the intermediate part between the through holes 33. Therefore, reinforcing ribs (not shown) connecting the through holes 33 and the central part of the support plate 3 may be placed to suppress the amplitude of the control board 2 in response to external vibrations. Alternatively, reinforcing ribs (not shown) connecting one through hole 33 and another through hole 33 of the support plate 3 may be placed to suppress the amplitude of the control board 2 in response to external vibrations.
[0043] <Fixing the control board 2 and support plate 3> The fixing of the control board 2 and support plate 3 will now be explained. The control board 2 does not have through holes 22 in the region that overlaps with the semiconductor module 1 when viewed from the top side of the power converter 100 in the direction normal to the first surface 5a. One or both of the control board 2 and support plate 3 have one or more through holes in the region other than the region that overlaps with the semiconductor module 1 when viewed in the direction normal to the first surface 5a. The control board 2 and support plate 3 are fixed to the housing 5 by fasteners 6 that pass through the through holes. In Figure 3, the region enclosed by the dashed line is the region 2d that overlaps with the semiconductor module 1 when viewed in the direction normal to the first surface 5a. The control board 2 does not have through holes 22 in this region 2d. In the configuration shown in Figure 2, both the control board 2 and support plate 3 have multiple through holes in the region other than the region that overlaps with the semiconductor module 1 when viewed in the direction normal to the first surface 5a. The control board 2 has through holes 22, and the support plate 3 has through holes 33.
[0044] By configuring it in this way, since the control board 2 does not have through holes 22 in the region 2d, the degree of freedom of the wiring of the circuit pattern arranged on the control board 2 is not restricted, so that the control board 2 can be miniaturized. Since the control board 2 is miniaturized, the power conversion device 100 can be miniaturized. The control board 2 is directly fixed to the housing 5 by the fixture 6 penetrating through the through hole 22, so that the amplitude of the control board 2 caused by vibration from the outside can be suppressed.
[0045] The configuration is not limited to that shown in FIG. 2, and either the control board 2 or the support board 3 may have one or more through holes in a region other than the region overlapping with the semiconductor module 1 when viewed in the normal direction of the first surface 5a. When only the control board 2 has the through hole 22, the board support portion 32 of the support board 3 is adhered and fixed to the control board 2, and by integrating the control board and the support board 3, the support board 3 can be indirectly fixed to the housing 5. When only the support board 3 has the through hole 33, the board support portion 32 of the support board 3 is adhered and fixed to the control board 2, and by integrating the control board and the support board 3, the control board 2 can be indirectly fixed to the housing 5.
[0046] In the present embodiment, both the control board 2 and the support board 3 have one or more coaxial through holes that overlap with each other and are arranged coaxially in a region other than the region overlapping with the semiconductor module 1 when viewed in the normal direction of the first surface 5a. The control board 2 and the support board 3 are fixed to the housing 5 by the fixture 6 penetrating through the coaxial through holes of both the control board 2 and the support board 3. The control board 2 has coaxial through holes 22a, and the support board 3 has coaxial through holes 33a.
[0047] By configuring it in this way, when fixing the control board 2 and the support board 3 to the housing 5, the support board 3 and the control board 2 can be tightened together by the same fixture 6. Since the support board 3 and the control board 2 can be tightened together by the same fixture 6, the number of fixtures 6 can be reduced. Since the number of fixtures 6 is reduced, the power conversion device 100 can be cost-reduced. Also, since the number of fixtures 6 is reduced, the productivity of the power conversion device 100 can be improved.
[0048] In this embodiment, a configuration in which the support plate 3 and the control board 2 are fastened together by the same fixture 6 has been shown, but the configuration for fixing the support plate 3 and the control board 2 is not limited to this. When viewed in the normal direction of the first surface 5a, the through holes 33 of the support plate 3 and the through holes 22 of the control board 2 may be arranged so as not to overlap. In that case, fixtures 6 for individually fixing the support plate 3 and the control board 2 are provided.
[0049] A modification example of the through hole 33 and the coaxial through hole 33a of the support plate 3 will be described with reference to FIG. 9. The support plate 3 has one or more through holes 33 or one or more coaxial through holes 33a. The through hole 33 has a cylindrical cylindrical member 33b made of metal, and the main body portion 31 and the cylindrical member 33b of the support plate 3 are integrally formed, and the fixture 6 penetrates through the cylindrical member 33b. The coaxial through hole 33a has a cylindrical coaxial cylindrical member 33c made of metal, and the main body portion 31 and the cylindrical member 33b of the support plate 3 are integrally formed, and the fixture 6 penetrates through the coaxial cylindrical member 33c. The cylindrical member 33b and the coaxial cylindrical member 33c are, for example, a collar or a bush. The collar or the bush is insert-molded on the support plate 3. The materials of the cylindrical member 33b and the coaxial cylindrical member 33c are, for example, stainless steel or copper.
[0050] By providing the cylindrical member 33b or the coaxial cylindrical member 33c, when the support plate 3 is fixed to the housing 5 by the fixture 6 and is exposed to temperature changes from the outside, deterioration due to sagging or the like at the fixed portion can be suppressed. Since deterioration of the fixed portion is suppressed, the vibration resistance of the power conversion device 100 can be maintained for a long time.
[0051] <Control Board 2> Next, the control board 2 will be described. The control board 2 monitors the drive, temperature, operating state, and abnormal state of the semiconductor module 1, and controls the semiconductor module 1. The control board 2 is, for example, a printed circuit board made of a multilayer substrate. The control board 2 has a plurality of through holes 21 into which the control terminals 12 of the semiconductor module 1 are inserted. The control board 2 has one or more through holes 22 for fixing the control board 2 to the spacer 4 or housing 5 with a fixing device 6. In this embodiment, as shown in Figure 2, the control board 2 has a plurality of through holes 22 and is fixed to the spacer 4 at a plurality of locations. By fixing the control board 2 at a plurality of locations, the vibration resistance and heat dissipation of the control board 2 can be improved.
[0052] The control board 2 has a flat area on its surface where no mounted components are present, in the region of the first substrate surface 2b where the substrate support portion 32 overlaps, between the control terminal 12 of the semiconductor module 1 and the control terminal 12 of another adjacent semiconductor module 1. This area is occupied by the circuit pattern of the electronic circuit that controls the operation of the semiconductor module 1. When bonding the substrate support portion 32 and the control board 2, having flat surfaces without mounted components allows for uniform application of adhesive and adhesion thickness, thus enabling stable bonding between the two. Mounted components may be provided on the projection portion 32a of the substrate support portion on the second substrate surface 2c.
[0053] <Spacer 4> Next, the spacer 4 will be described. The spacer 4 is a structure for mounting and fixing the control board 2 and the support plate 3 to the housing 5. As shown in Figure 2, the spacer 4 is fixed to the first surface 5a of the housing 5. The control board 2 and the support plate 3 are fixed to the spacer 4 via the fasteners 6. In this embodiment, a configuration with 11 spacers 4 is shown, but the number of spacers 4 is not limited to this. The spacer 4 is manufactured by forging from a metal material such as iron. The spacer 4 has a female thread on the side that connects to the control board 2 and the support plate 3, and a male thread on the side that connects to the housing 5.
[0054] In this embodiment, the spacer 4 is a separate structure from the housing 5, but the spacer 4 may be formed integrally with the housing 5. In that case, the spacer 4 is made of the same material as the housing 5, for example, a metal material such as aluminum.
[0055] <Housing 5> Next, the housing 5 will be described. The housing 5 has a first surface 5a which is both a mounting surface on which the semiconductor module 1 is mounted and a cooling surface. The housing 5 is made of a metal such as aluminum. The method of manufacturing the housing 5 is, for example, die casting. The material of the housing 5 is not limited to aluminum, but may be an aluminum alloy, a magnesium alloy, copper, or a copper alloy. In this embodiment, the housing 5 is formed in a block shape, but the shape of the housing 5 is not limited to this. The housing 5 may be formed in a box shape with a bottom, and the semiconductor module 1, the control board 2, and the support plate 3 may be housed inside the housing 5.
[0056] In this embodiment, a semiconductor module 1 is mounted on the first surface 5a of the housing 5, and the module body portion 11 of the semiconductor module 1 and the first surface 5a of the housing 5 are thermally connected. The housing 5 has a flow path (not shown) for cooling the semiconductor module 1 via the first surface 5a. A refrigerant flows through the flow path to forcibly cool the semiconductor module 1. The refrigerant is, for example, a liquid such as water or ethylene glycol solution, or a gas such as air. When the semiconductor module 1 is driven, the heat generated from the semiconductor switching element 1a and electronic circuits is cooled by the refrigerant flowing through the flow path. This suppresses the temperature rise of the semiconductor module 1, so that the power converter 100 can be driven efficiently.
[0057] <Installation Example of Power Converter 100> An installation example of the power converter 100 will be described. The power converter 100 is, for example, a device mounted on an automobile 50. The automobile 50 has vibration sources 51 such as an engine, transmission, gearbox, and motor. As shown in Figure 10, the power converter 100 is rigidly connected to at least one of the vibration sources 51 in the automobile 50, namely the engine, transmission, gearbox, and motor. In this embodiment, the housing 5 is rigidly connected to the vibration source 51.
[0058] With the power converter 100 configured as described above, even if the power converter 100 is rigidly connected to the vibration source 51 of the automobile 50, which has strict vibration resistance requirements, the vibration resistance of the power converter 100 can be ensured. A rigid connection is a connection in which both connected members do not bend at the connection point. Because the power converter 100 is rigidly connected, there is no need to connect the power converter 100 via vibration-absorbing members such as vibration-damping rubber when installing the power converter 100, thus eliminating the need for vibration-absorbing materials, and thus reducing the cost of both the power converter 100 and the automobile 50.
[0059] As described above, the power conversion device 100 according to Embodiment 1 comprises a plurality of semiconductor modules 1 arranged in parallel on a first surface 5a, a control board 2 arranged opposite to the first surface 5a, and a support plate 3 made of an insulator arranged opposite to the first substrate surface 2b or the second substrate surface 2c of the control board 2, wherein the semiconductor modules 1 have one or more control terminals 12 that extend in the direction normal to the first substrate surface 2b and are connected to the control board 2, and the support plate 3 has a main body portion 31 and supports the first substrate surface 2b or the second substrate surface 2c. The power converter 100 has one or more substrate support parts 32, and the substrate support parts 32 are arranged between a control terminal 12 of one semiconductor module 1 and a control terminal 12 of another semiconductor module 1 adjacent to the first semiconductor module 1, and support the control board 2. As the control board 2 is supported by the substrate support parts 32 without restricting the freedom of arrangement of electronic components on the control board 2 and the wiring of circuit patterns, it is possible to obtain a power converter 100 that maintains miniaturization while improving the vibration resistance of the control board 2.
[0060] When the substrate support portion 32 is in contact with the control substrate 2 via the adhesive 34 and supports the control substrate 2, it is possible to prevent a gap from forming between the control substrate 2 and the substrate support portion 32, thereby reliably reducing the amplitude of the control substrate 2 caused by external vibrations.
[0061] When the substrate support portion 32 contacts the control substrate 2 via a viscoelastic body 34a and supports the control substrate 2, by arranging the viscoelastic body 34a instead of the adhesive 34, external vibrations can be dampened, thereby reducing the amplitude of the control substrate 2 caused by external vibrations.
[0062] When the substrate support portion 32 is formed of a viscoelastic material 34a, and the viscoelastic material 34a contacts and supports the control substrate 2, integrating the substrate support portion 32 formed of the viscoelastic material 34a with the main body portion 31 allows the substrate support portion 32 itself to dampen external vibrations, thereby further reducing the amplitude of the control substrate 2 caused by external vibrations.
[0063] If the control board 2 does not have through holes 22 in the region overlapping with the semiconductor module 1 when viewed in the direction normal to the first surface 5a, and one or both of the control board 2 and the support plate 3 have one or more through holes in regions other than the region overlapping with the semiconductor module 1 when viewed in the direction normal to the first surface 5a, and the control board 2 and the support plate 3 are fixed to the housing 5 by fasteners 6 that pass through the through holes, then since the control board 2 does not have through holes 22 in region 2d, the degree of freedom of wiring of the circuit pattern arranged on the control board 2 is not restricted, and the control board 2 can be miniaturized. Because the control board 2 is miniaturized, the power converter 100 can be miniaturized. Since the control board 2 is directly fixed to the housing 5 by fasteners 6 that pass through the through holes 22, the amplitude of the control board 2 caused by external vibrations can be suppressed.
[0064] When both the control board 2 and the support plate 3 are viewed in the direction normal to the first surface 5a, they have one or more coaxial through-holes that overlap with each other and are arranged coaxially in areas other than the area overlapping with the semiconductor module 1, and the control board 2 and the support plate 3 are fixed to the housing 5 by fasteners 6 that pass through the coaxial through-holes of both the control board 2 and the support plate 3, the support plate 3 and the control board 2 can be fastened together with the same fasteners 6 when fixing the control board 2 and the support plate 3 to the housing 5. Since the support plate 3 and the control board 2 can be fastened together with the same fasteners 6, the number of fasteners 6 can be reduced. As the number of fasteners 6 is reduced, the power converter 100 can be made cheaper. Also, as the number of fasteners 6 is reduced, the productivity of the power converter 100 can be improved.
[0065] If the substrate support portion 32 has a flat portion 32b that supports the control board 2 and a separated portion 32c adjacent to the control terminal 12 and spaced away from the control board 2, a space is formed between the substrate support portion 32 and the control board 2 by the separated portion 32c. As a result, when the adhesive 34 spreads, the adhesive 34 remains in the separated portion 32c, thus preventing the adhesive 34 from adhering to the control terminal 12. Since the adhesion of the adhesive 34 to the control terminal 12 is suppressed, curing defects of the solder connecting the control board 2 and the control terminal 12 can be suppressed.
[0066] In the support plate 3, the main body portion 31 and the substrate support portion 32 are integrally formed, and the support plate 3 is positioned facing the first substrate surface 2b. When the power terminals 13, the main body portion 31, and the control board 2 overlap when viewed in the direction normal to the first substrate surface 2b, the support plate 3 is interposed between the control board 2 and the power terminals 13, thus ensuring insulation between the control board 2 and the power terminals 13. Because insulation between the control board 2 and the power terminals 13 is ensured, the distance in the Z direction between the control board 2 and the power terminals 13 can be made shorter than the distance required for spatial insulation. As the distance in the Z direction between the control board 2 and the power terminals 13 is shortened, the power converter 100 becomes lower in profile, thus allowing the power converter 100 to be miniaturized.
[0067] If the support plate 3 is positioned facing the first substrate surface 2b, and the main body portion 31 of the support plate 3 overlaps with the semiconductor module 1 when viewed in the direction normal to the first substrate surface 2b, and the height from the first surface 5a of the portion of the main body portion 31 of the support plate 3 that overlaps with the power terminals 13 is different from the height from the first surface 5a of the portion of the main body portion 31 of the support plate 3 that overlaps with the module main body portion 11, then the overall bending rigidity of the support plate 3 can be increased by having portions of the main body portion 31 of the support plate 3 with different heights. As the overall bending rigidity of the support plate 3 is increased, the vibration resistance of the power conversion device 100 can be improved.
[0068] If the frequency of the first mode of the eigenvalue in the vibration of the support plate 3 is higher than the frequency of the first mode of the eigenvalue in the vibration of the control board 2, the rigidity when the control board 2 and the support plate 3 are stacked on top of each other can be increased, thereby enhancing the effect of suppressing the amplitude of the control board 2 caused by external vibrations.
[0069] If the support plate 3 has one or more through holes 33, each through hole 33 has a cylindrical member 33b made of metal, and the main body 31 and the cylindrical member 33b of the support plate 3 are integrally molded, and the fixing device 6 penetrates the cylindrical member 33b, then when the support plate 3 is fixed to the housing 5 by the fixing device 6 and exposed to external temperature changes, deterioration due to sagging, etc., at the fixed location can be suppressed. Because deterioration at the fixed location is suppressed, the vibration resistance of the power converter 100 can be maintained.
[0070] If the coaxial through-hole 33a has a cylindrical coaxial member 33c made of metal, and the main body 31 and the cylindrical member 33b of the support plate 3 are integrally molded, and the fixing device 6 penetrates the coaxial cylindrical member 33c, then when the support plate 3 is fixed to the housing 5 by the fixing device 6 and exposed to external temperature changes, deterioration due to sagging, etc., at the fixed location can be suppressed. Since deterioration at the fixed location is suppressed, the vibration resistance of the power converter 100 can be maintained.
[0071] When the control terminals 12 are arranged in a line along a straight line, and the substrate support parts 32 are also arranged along the same straight line, drawing solder can be used as the soldering method. Because drawing solder can be used, the process of the power converter 100 can be simplified, thereby improving the productivity of the power converter 100. Furthermore, by arranging the substrate support parts 32 in a line along the same straight line, the control board 2 is supported by the substrate support parts 32 adjacent to the control terminals 12, so the amplitude of the control board 2 adjacent to the control terminals 12 can be suppressed. Because the amplitude of the control board 2 is suppressed, the vibration resistance of the power converter 100 can be improved.
[0072] When the control terminal 12 is electrically connected to the control board 2 by solder, the space required on the control board 2 to connect the control terminal 12 can be reduced. Because the connection space is reduced, the size of the control board 2 can be made smaller. Because the size of the control board 2 is made smaller, the power converter 100 can be made smaller.
[0073] If the power converter 100 is mounted on an automobile 50 and rigidly connected to at least one of the vibration sources 51 in the automobile 50, namely the engine, transmission, gearbox, and motor, then the power converter 100 with the above configuration can ensure vibration resistance even when rigidly connected to the vibration sources 51 of an automobile 50, which has strict vibration resistance requirements. Because the power converter 100 is rigidly connected, there is no need to connect the power converter 100 via vibration-absorbing materials such as vibration-damping rubber when installing the power converter 100, thus eliminating the need for vibration-absorbing materials and reducing the cost of the power converter 100.
[0074] Embodiment 2. The power converter 100 according to Embodiment 2 will be described. Figure 11 is a perspective view showing the configuration of the support plate 3 of the power converter 100 according to Embodiment 2, and Figure 12 is a side view showing a schematic of the configuration of the control board 2 and the support plate 3 of the power converter 100. The power converter 100 according to Embodiment 2 has a different configuration of the support plate 3 than Embodiment 1. Configurations that are equivalent to those shown in Embodiment 1 will not be described.
[0075] The support plate 3 extends in the direction normal to the first substrate surface 2b and has a plurality of snap-fit ββmechanisms that clamp the control substrate 2. In this embodiment, as shown in Figure 12, the support plate 3 has three snap-fits 36 on one side and the other side in the X direction. The number and arrangement of the snap-fits 36 are not limited to this. The snap-fits 36 may also be arranged on one side and the other side in the Y direction. The snap-fit ββ36 ββis a snap-fit ββmechanism in which the end on the other side in the Z direction has an umbrella shape. The control substrate 2 can be clamped in the umbrella-shaped portion. The shape for clamping the control substrate 2 is not limited to this and may be a shape according to the method of fixing the control substrate 2, such as tapping screws or heat crimping.
[0076] This configuration allows the control board 2 and the support plate 3 to be pre-assembled and integrated. Since the control board 2 and the support plate 3 are pre-assembled and integrated, the assembly process of the power converter 100 can be simplified. Furthermore, when the adhesive 34 is placed between the substrate support portion 32 and the control board 2, the substrate support portion 32 and the control board 2 can be bonded in close contact.
[0077] The support plate 3 is provided on the main body 31 and further has one or more additional substrate support portions 37 that support the first substrate surface 2b or the second substrate surface 2c. The additional substrate support portions 37 are arranged opposite the peripheral edge of the control substrate 2 and support the peripheral edge of the control substrate 2. In this embodiment, the support plate 3 has two additional substrate support portions 37 on each of the one and the other sides in the Y direction. The number and arrangement of the additional substrate support portions 37 are not limited to this. The additional substrate support portions 37 may also be arranged on each of the one and the other sides in the X direction.
[0078] By configuring the control board 2 in this way, an additional substrate support portion 37 is placed at the periphery of the control board 2 where electronic components cannot be mounted due to manufacturing constraints, thereby supporting the control board 2 without restricting the freedom of placement of electronic components and wiring of circuit patterns on the control board 2. Since the control board 2 is supported by the additional substrate support portion 37 without restricting the freedom of placement of electronic components and wiring of circuit patterns on the control board 2, a power converter 100 can be obtained that maintains miniaturization while further improving the vibration resistance of the control board 2.
[0079] As shown in Figure 12, the main body portion 31 of the support plate 3 has a curved shape in which the central portion 38 is closest to the control board 2 and the peripheral portion 39 is further away from the control board 2 than the central portion 38. Figure 12 is a side view showing only the control board 2 and the main body portion 31 of the support plate 3. With this configuration, when the control board 2 and the support plate 3 are placed on top of each other, the central portion 38 of the support plate 3 and the central portion of the control board 2 can be easily brought close together. The peripheral portion 39 of the support plate 3 and the peripheral portion of the control board 2 are fixed together by the fixing device 6 through the through holes in both, so that the peripheral portion 39 of the support plate 3 and the peripheral portion of the control board 2 can be brought close together.
[0080] Furthermore, while this disclosure describes various exemplary embodiments and examples, the various features, aspects, and functions described in one or more embodiments are not limited to the application of a particular embodiment, but are applicable individually or in various combinations to the embodiments. Accordingly, countless variations not illustrated are conceivable within the scope of the art disclosed in this specification. For example, these include modifying, adding, or omitting at least one component, or even extracting at least one component and combining it with a component from another embodiment.
[0081] 1 Semiconductor module, 1a Semiconductor switching element, 11 Module body, 12 Control terminal, 13 Power terminal, 2 Control board, 2a Electronic circuit, 2b First board surface, 2c Second board surface, 2d Region, 21 Through hole, 22 Through hole, 22a Coaxial through hole, 3 Support plate, 31 Main body, 32 Board support part, 32a Projection part of board support part, 32b Flat part, 32b1 Flat surface, 32c Separation part, 33 Through hole, 33a Coaxial through hole, 33b Cylindrical member, 33c Coaxial cylindrical member, 34 Adhesive, 34a Viscoelastic material, 35 Guide hole, 36 Snap fit, 37 Additional board support part, 38 Central part, 39 Peripheral part, 4 Spacer, 5 Housing, 5a First surface, 6 Fixing device, 7 Solder, 50 Automobile, 51 Vibration source, 100 power converter
Claims
1. A power conversion device comprising: a plurality of semiconductor modules arranged in parallel on a first surface including a first direction and a second direction perpendicular to the first direction; a control board having an electronic circuit for controlling the operation of the semiconductor modules and arranged opposite to the first surface; and a support plate made of an insulator arranged opposite to a first substrate surface, which is one substrate surface of the control board opposite to the first surface, or a second substrate surface, which is the other substrate surface opposite to the first substrate surface; wherein the semiconductor modules have one or more control terminals extending in the direction normal to the first substrate surface and connected to the control board; the support plate has a main body and one or more substrate support parts provided on the main body and supporting the first substrate surface or the second substrate surface; and the substrate support parts are arranged between the control terminals of one of the semiconductor modules and the control terminals of another semiconductor module adjacent to the one semiconductor module, and support the control board.
2. The power conversion device according to claim 1, wherein the substrate support portion abuts against the control substrate via an adhesive and supports the control substrate.
3. The power conversion device according to claim 1, wherein the substrate support portion contacts the control substrate via a viscoelastic material and supports the control substrate.
4. The power conversion device according to claim 1, wherein the substrate support portion is formed of a viscoelastic material, and the viscoelastic material abuts against the control substrate and supports the control substrate.
5. The power conversion device according to any one of claims 1 to 4, further comprising a housing having the first surface and housing the semiconductor module, the control board, and the support plate, wherein the control board does not have through holes in a region that overlaps with the semiconductor module when viewed in the direction normal to the first surface, one or both of the control board and the support plate have one or more through holes in a region other than the region that overlaps with the semiconductor module when viewed in the direction normal to the first surface, and the control board and the support plate are fixed to the housing by fasteners that pass through the through holes.
6. The power conversion device according to any one of claims 1 to 4, further comprising a housing having the first surface and housing the semiconductor module, the control board, and the support plate, wherein the control board does not have through holes in a region that overlaps with the semiconductor module when viewed in the direction normal to the first surface, both the control board and the support plate have one or more coaxial through holes that overlap each other and are arranged coaxially in regions other than the region that overlaps with the semiconductor module when viewed in the direction normal to the first surface, and the control board and the support plate are fixed to the housing by fasteners that pass through the coaxial through holes of both the control board and the support plate.
7. The power conversion device according to any one of claims 1 to 6, wherein the substrate support portion has a flat portion that supports the control substrate and a spaced portion adjacent to the control terminals and spaced apart from the control substrate.
8. The power conversion device according to any one of claims 1 to 7, wherein the semiconductor module has one or more power terminals extending in the direction normal to the first substrate surface from the module body portion which is the main body portion of the semiconductor module, the main body portion and the substrate support portion of the support plate are formed integrally, the support plate is arranged facing the first substrate surface, and the power terminals, the main body portion and the control board overlap when viewed in the direction normal to the first substrate surface.
9. The power conversion device according to any one of claims 1 to 8, wherein the semiconductor module has one or more power terminals extending in the direction normal to the first substrate surface from the module body portion which is the main body portion of the semiconductor module, the support plate is arranged opposite to the first substrate surface, the main body portion of the support plate overlaps with the semiconductor module when viewed in the direction normal to the first substrate surface, and the height from the first surface of the portion of the main body portion of the support plate that overlaps with the power terminals is different from the height from the first surface of the portion of the main body portion of the support plate that overlaps with the module body portion when viewed in the direction normal to the first substrate surface.
10. The power conversion device according to any one of claims 1 to 9, wherein the frequency of the first mode of the eigenvalue in the vibration of the support plate is higher than the frequency of the first mode of the eigenvalue in the vibration of the control board.
11. The power conversion device according to any one of claims 1 to 10, wherein the support plate extends in the direction normal to the first substrate surface and has a plurality of snap-fit ββmechanisms that clamp the control substrate.
12. The power conversion device according to any one of claims 1 to 11, wherein the support plate further has one or more additional substrate support portions provided on the main body portion and supporting the first substrate surface or the second substrate surface, the additional substrate support portions being arranged opposite to the peripheral edge portion of the control substrate and supporting the peripheral edge portion of the control substrate.
13. The power conversion device according to any one of claims 1 to 12, wherein the shape of the main body portion of the support plate is a curved shape in which the central portion is closest to the control board and the peripheral portion is further away from the control board than the central portion.
14. The power conversion device according to claim 5, wherein the support plate has one or more through holes, the through holes of the support plate have cylindrical members made of metal, the main body and the cylindrical members of the support plate are integrally molded, and the fixing device penetrates the cylindrical members.
15. The power conversion device according to claim 6, wherein the coaxial through-hole of the support plate has a cylindrical coaxial member made of metal, the main body portion and the coaxial cylindrical member of the support plate are integrally molded, and the fixing device penetrates the coaxial cylindrical member.
16. The power conversion device according to any one of claims 1 to 15, wherein the control terminals are arranged in a line along a straight line, and the substrate support portion is arranged along the straight line.
17. The power conversion device according to any one of claims 1 to 16, wherein the control terminal is connected to the control board by solder.
18. A power conversion device according to any one of claims 1 to 17, which is mounted on an automobile and rigidly connected to at least one of the engine, transmission, gearbox, and motor, which are sources of vibration in the automobile.