Numerical control device and laser determination method

Abstract

According to the present invention, a laser beam that is to be used is determined in accordance with the surface condition of a workpiece so as to achieve a low processing cost.　This numerical control device, which determines a laser to be used to process a workpiece from among a plurality of lasers, includes: an information acquiring unit that acquires first information relating to the surface condition of the workpiece, and second information necessary for calculating the processing costs required for processing using each of a plurality of laser oscillators that output the plurality of lasers; a processing cost calculating unit that calculates the processing costs when each of the plurality of lasers are used, on the basis of the acquired first information and second information; and an output laser determining unit that determines the laser to be used for processing from among the plurality of lasers on the basis of the processing costs of the plurality of lasers.

Description

Numerical control device and laser determination method

[0001] This disclosure relates to a numerical control device and a laser determination method, and more particularly to a numerical control device and a laser determination method for determining which laser to irradiate a workpiece from among multiple lasers.

[0002] A laser system that determines which laser to irradiate a workpiece from among multiple lasers is described in Patent Document 1, and a processing estimation device that can instantly estimate processing time and present an estimate is described in Patent Document 2.

[0003] Patent Document 1 describes a laser system in which, in various embodiments, two laser beams of different wavelengths are used sequentially and / or simultaneously to process a workpiece in various processing stages such as melting, drilling, cutting, and welding. Specifically, Patent Document 1 describes a laser system for processing a workpiece, comprising: a primary laser configured to emit a primary laser beam; a secondary laser configured to emit a secondary laser beam, wherein the wavelength of the primary laser beam is different from that of the secondary laser beam; a laser head that directs at least one of the primary or secondary laser beams onto the workpiece; and a computer-based controller. Patent Document 2 describes a controller configured to, in a first stage, direct at least the secondary laser beam towards the surface of the workpiece, where the energy of the secondary laser beam is absorbed by the workpiece; and in a second stage, after at least a portion of the surface of the workpiece has reacted to the absorption of the energy of the secondary laser beam, direct at least the primary laser beam towards the surface of the workpiece during at least the relative movement between the primary laser beam and the workpiece, thereby cutting the workpiece along a processing path at least partially identified by the relative movement.

[0004] Patent Document 2 describes a processing estimation device that estimates the processing time for processing a part and calculates the processing cost of the part based on the processing time. Specifically, Patent Document 2 describes that the processing estimation device comprises a camera that photographs the part to be estimated, which has been created in advance by cutting sheet metal, and a dimensional reference marker; an image processing unit that extracts the edges of the part photographed by the camera to generate edge data, and enlarges or reduces the edge data to a size corresponding to the actual size of the part based on the size of the dimensional reference marker photographed by the camera; and a processing time calculation unit that calculates the length of the cutting line for cutting the part from the sheet metal based on the edges of the edge data corresponding to the actual size of the part, and calculates the processing time for cutting the cutting line to create the part, corresponding to the material and thickness of the sheet metal. Furthermore, Patent Document 2 describes that the device further comprises a processing cost calculation unit that calculates the processing cost of the part based on the processing time calculated by the processing time calculation unit.

[0005] Patent documents 3 to 6 describe technologies related to laser processing conditions. Patent document 3 describes a laser processing apparatus capable of performing laser processing under appropriate processing conditions. Specifically, Patent document 3 describes a laser beam irradiation means comprising a laser beam oscillation means, an output adjustment means for adjusting the output of the laser beam, and a light concentrator, and a material detection means for detecting the material of the upper surface of the workpiece to be processed. The material detection means comprises a detection light irradiation means arranged at a predetermined distance in the X-axis direction from the light concentrator and irradiating the upper surface of the workpiece to be processed with detection light, and a detection light receiving means that outputs a light receiving signal corresponding to the amount of reflected light of the received detection light to a control means. The control means determines the material and processing conditions from a processing condition control map based on the light receiving signal from the detection light receiving means, determines the timing of the laser beam to be irradiated from the distance between the detection light irradiation means and the light concentrator, and controls the laser beam irradiation means so that the processing conditions determined from the processing condition control map are met.

[0006] Patent Document 4 describes a laser welding system that shortens the time required to register suitable processing conditions for unregistered sheet metal in the processing condition storage unit, thereby enabling early laser welding of various sheet metals. Specifically, Patent Document 4 describes a laser welding system comprising a processing condition selection unit, a welding control unit, a processing condition registration unit, and a processing condition storage unit. The processing condition selection unit, while referring to the processing conditions stored for each sheet metal material and the relationship between the sheet metal W thickness and processing form, selects processing conditions for a sheet metal W made of a material similar to the unregistered sheet metal, with the same processing form as the unregistered sheet metal W, and with the same or a similar sheet metal thickness. The welding control unit controls the laser welding machine to perform a processing test on the unregistered sheet metal while changing the processing parameters of the selected processing conditions. The processing condition registration unit identifies the processing parameters based on the test results of the processing test on the unregistered sheet metal W and registers the processing conditions for the unregistered sheet metal W in the processing condition storage unit.

[0007] Patent Document 5 describes a processing condition adjustment device and a machine learning device that can efficiently adjust the laser processing conditions of a laser processing apparatus. Specifically, Patent Document 5 describes that the machine learning device included in the processing condition adjustment device comprises: a state observation unit that observes processing condition data indicating the laser processing conditions in laser processing and gas target deviation data indicating the target deviation of the pressure loss or flow rate of the assist gas as state variables representing the current state of the environment; a judgment data acquisition unit that acquires work quality judgment data indicating the suitability of processing the workpiece, which determines the quality of the workpiece processed based on the laser processing conditions in laser processing, as judgment data indicating the suitability of processing the workpiece; and a learning unit that learns to associate the target deviation of the pressure loss or flow rate of the assist gas with the adjustment of the laser processing conditions in laser processing using the state variables and the judgment data.

[0008] Patent Document 6 describes a processing system that reduces processing defects by determining the processability of a workpiece based on processing conditions before processing, making it easier to decide whether to keep the processing conditions as they are or change them to more suitable ones. Specifically, Patent Document 6 describes a processing system comprising a processing device for processing a workpiece, an acquisition device for acquiring component information representing the chemical composition of the material of the workpiece, and a determination device for determining the processability of a workpiece based on a determination model created by machine learning, which is input as training data: component information, processing condition information including processing conditions set in advance according to the material and plate thickness, and processing quality evaluation results obtained by actually processing based on the processing conditions. The determination device inputs the component information acquired before processing of the workpiece to be newly processed, and processing condition information including processing conditions set in the processing device according to the material and plate thickness, as estimation data into the determination model, and outputs a determination result of processability based on the processing conditions of the processing to be performed.

[0009] Japanese Patent Publication No. 2022-543152, Japanese Patent Publication No. 2020-140305, Japanese Patent Publication No. 2016-34659, Japanese Patent Publication No. 2021-94569, Japanese Patent Publication No. 2019-166559, Japanese Patent Publication No. 2023-148415

[0010] Metal surfaces may have scratches, oxide films, or protective sheets. When attempting to laser process a metal surface, the desired laser wavelength or light output will vary depending on the surface condition of the workpiece, such as scratches, oxide films, or protective sheets.

[0011] Therefore, a numerical control device and a laser selection method are desired that can determine which laser to irradiate the workpiece from among multiple lasers, depending on the surface condition of the workpiece.

[0012] A typical first aspect of this disclosure is a numerical control device for determining which laser to use for processing a workpiece from a plurality of lasers, comprising: an information acquisition unit that acquires first information relating to the surface state of the workpiece and second information necessary for calculating the processing cost required for processing using a plurality of laser oscillators that output the plurality of lasers; a processing cost calculation unit that calculates the processing cost when using the plurality of lasers based on the acquired first information and second information; and an output laser determination unit that determines which laser to use for processing from the plurality of lasers based on the processing cost of the plurality of lasers.

[0013] A typical second aspect of this disclosure is a laser determination method in which a computer performs the following steps: acquires first information relating to the surface state of a workpiece and second information necessary for calculating the processing cost required for processing using a plurality of laser oscillators that output a plurality of lasers; calculates the processing cost when using the plurality of lasers based on the acquired first information and second information; and determines which laser to be used for processing from the plurality of lasers based on the processing cost of the plurality of lasers.

[0014] This is a block diagram showing an example configuration of a numerical control device according to the first embodiment of this disclosure. This is a flowchart showing an example of a laser determination method according to the first embodiment of this disclosure. This is a block diagram showing an example configuration of a numerical control device according to the second embodiment of this disclosure. This diagram shows how a copper plate with an oxide film formed on a part of it is laser processed by controlling a first laser oscillator and a second laser oscillator using a numerical control device. This is a block diagram showing an example configuration of a numerical control device according to the third embodiment of this disclosure. This diagram shows how the reflected light acquisition unit of the light receiving device receives reflected light from the workpiece when a fiber laser is used. This diagram shows how the reflected light acquisition unit of the light receiving device receives reflected light from the workpiece when a blue laser is used. This is a characteristic diagram showing the relationship between the coordinate values ​​of the processing path and the light absorption rate when a fiber laser and a blue laser are used.

[0015] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. (First Embodiment) Figure 1 is a block diagram showing an example configuration of a numerical control device of the first embodiment of the present disclosure. As shown in Figure 1, the numerical control device 100 includes a processing program analysis unit 101, a first laser processing condition acquisition unit 102, a second laser processing condition acquisition unit 103, an information acquisition unit 104, a processing cost calculation unit 105, an output laser determination unit 106, a first laser output generation unit 107, and a second laser output generation unit 108. The first laser output generation unit 107 outputs a first laser output to the first laser oscillator 200. The second laser output generation unit 108 outputs a second laser output to the second laser oscillator 300. The lasers output from the first laser oscillator 200 and the second laser oscillator 300 are input to a laser head. The laser head irradiates the workpiece with a laser.

[0016] The processing program analysis unit 101 analyzes the processing program and outputs command data for setting the laser processing conditions to the first laser processing condition acquisition unit 102 and the second laser processing condition acquisition unit 103.

[0017] The first laser processing condition acquisition unit 102 stores a table that associates command data with the processing conditions of the first laser corresponding to the command data (hereinafter referred to as the first laser processing conditions). The unit reads the first laser processing conditions corresponding to the command data from the table and outputs the read first laser processing conditions to the output laser determination unit 106. The first laser is, for example, a fiber laser, and the first laser will be described below assuming that it is a fiber laser.

[0018] The second laser processing condition acquisition unit 103 stores a table that associates command data with the processing conditions for the second laser (hereinafter referred to as the second laser processing conditions) corresponding to the command data. The unit reads the second laser processing conditions corresponding to the command data from the table and outputs the read second laser processing conditions to the output laser determination unit 106. The second laser is, for example, a blue laser, and hereafter, the second laser will be described as a blue laser. The first laser processing conditions and the second laser processing conditions include laser output, laser frequency, and laser duty cycle, etc.

[0019] The information acquisition unit 104 acquires information related to the surface condition of the workpiece (also called the workpiece object) (hereinafter referred to as "information related to the surface condition") and information necessary for calculating the processing cost required for processing using the first laser oscillator 200 and the second laser oscillator 300 (hereinafter referred to as "information related to the calculation of processing costs"), and outputs them to the processing cost calculation unit 105. The information related to the surface condition becomes the first information, and the information related to the calculation of processing costs becomes the second information.

[0020] Information related to the surface condition of the workpiece includes, for example, scratches on the workpiece surface or the type of surface material of the workpiece. The surface material of the workpiece is, for example, a metal such as copper, or an oxide film, protective sheet, or coating film applied to the metal surface. Information related to calculating processing costs includes, for example, the initial cost, lifespan, oscillation efficiency, energy required to process the workpiece per unit area, processing area, processing speed, and electricity costs for fiber lasers and blue lasers.

[0021] The information acquired by the information acquisition unit 104, including information related to the surface condition and information related to the calculation of processing costs, may be entered by a user such as an operator, or it may be stored in advance in the storage unit of the information acquisition unit 104 or in an external storage unit. The information related to the calculation of processing costs may be stored in advance in the storage unit of the information acquisition unit 104 or in an external storage unit, and the information related to the surface condition may be entered by the user according to the workpiece.

[0022] The processing cost calculation unit 105 calculates the processing cost for using a first laser (fiber laser) and a second laser (blue laser) based on the surface condition of the workpiece, using information related to the surface condition and information related to the calculation of processing costs, and outputs this to the output laser determination unit 106. The processing cost calculation unit 105 can determine the processing cost using the formula (initial cost per hour + running cost per hour) × (processing time). The initial cost per hour, running cost per hour, and processing time can be calculated using information related to the surface condition and information related to the calculation of processing costs. The processing cost of the laser used changes depending on the surface condition of the workpiece. For example, if there are scratches on the surface of the workpiece, the processing cost will differ between the fiber laser and the blue laser, and the processing cost will also differ between the fiber laser and the blue laser depending on the type of surface material of the workpiece. A specific example of how the processing cost calculation unit 105 calculates the processing cost will be described later.

[0023] The output laser determination unit 106 determines whether to use the first laser or the second laser for processing based on the processing cost of the first laser (fiber laser) and the second laser (blue laser) depending on the surface condition of the workpiece. If the first laser is determined, it outputs the first laser processing conditions to the first laser output generation unit 107, and if the second laser is determined, it outputs the second laser processing conditions to the second laser output generation unit 108.

[0024] To explain in more detail, if C1 is the processing cost when using a first laser (fiber laser) according to information related to the surface condition, and C2 is the processing cost when using a second laser (blue laser) according to information related to the surface condition, the output laser determination unit 106 will decide to use the blue laser if the processing cost C2 of the blue laser is lower than the processing cost C1 of the fiber laser (C2 < C1), and will output the second laser processing conditions to the second laser output generation unit 108. On the other hand, if the processing cost C1 of the fiber laser is lower than the processing cost C2 of the blue laser (C1 < C2), the output laser determination unit 106 will decide to use the fiber laser and will output the first laser processing conditions to the first laser output generation unit 107. In this way, the output laser determination unit 106 determines and outputs the processing conditions to be used for processing from the first laser processing conditions and the second laser processing conditions.

[0025] The first laser output generation unit 107 outputs a first laser output to the first laser oscillator 200 based on the first laser processing conditions. The second laser output generation unit 108 outputs a second laser output to the second laser oscillator 300 based on the second laser processing conditions.

[0026] (Method for Calculating Processing Costs) Two methods for calculating processing costs by the processing cost calculation unit 105 are described below. (Example 1) The processing cost calculation unit 105 obtains from the information acquisition unit 104 information related to the calculation of processing costs, including initial cost, main unit lifespan, conversion efficiency (also called oscillation efficiency), energy required to process the workpiece per unit area, processing area, processing speed, and electricity cost. The processing cost calculation unit 105 also obtains information related to the surface condition of the workpiece, including whether the surface material of the workpiece is copper, or an oxide film provided on the copper surface.

[0027] The processing cost C can be calculated using the formula: (Initial cost per hour INC + Running cost per hour RUC) × (Processing time T).

[0028] The initial cost per hour, INC, can be calculated using the formula INC = (initial cost) / (main unit lifespan). The initial cost and main unit lifespan are included in the information related to the calculation of processing costs. The initial cost is the price of the laser processing system, including the numerical control device, laser oscillator, and laser head, while the main unit lifespan is the lifespan of the laser oscillator, optical system, etc.

[0029] The running cost per hour (RUC) can be calculated using the formula RUC = P × S × EB, where P is the power input to the laser oscillator per unit area, S is the processing area, and EB is the electricity cost. The processing area S and electricity cost EB are included in the information related to the calculation of processing costs. The power P can be calculated using the formula P = E / (α × AB), where E is the energy required to process the workpiece per unit area, α is the conversion efficiency of the light energy of the laser output from the laser oscillator, and AB is the light absorptivity when the laser energy is absorbed by the workpiece.

[0030] Energy E and conversion efficiency α are included in the information related to the calculation of processing costs. The light absorption rate AB is determined by the processing cost calculation unit 105 based on information related to the surface condition. The processing cost calculation unit 105 stores a table that associates scratches on the surface of the workpiece or the type of surface material of the workpiece with the light absorption rates AB for the first laser (fiber laser) and the second laser (blue laser), and refers to the table to determine the light absorption rates AB for the fiber laser and the blue laser from scratches on the surface of the workpiece or the type of surface material of the workpiece.

[0031] The following describes specific examples of light absorption rates A and B for fiber lasers and blue lasers, corresponding to different types of surface materials of the workpiece. When the surface material of the workpiece is copper, the light absorption rates of the fiber laser and the blue laser are 10% and 65% respectively. When the surface material of the workpiece is an oxide film, the light absorption rates of both the fiber laser and the blue laser are 80% for the oxide film.

[0032] The processing time T can be obtained by the formula T = (processing area) / (processing speed). Therefore, the processing cost C can be obtained by C = (INC + RUC) × T = {INC + (E × S × EB) / (α × AB)} × T.

[0033] Hereinafter, a specific example of the calculation method of the processing cost in the first example will be described.

[0034] <When the workpiece is copper> The processing cost calculation unit 105 obtains from the information acquisition unit 104, as information related to the calculation of the processing cost, for the fiber laser, an initial cost of 100 million yen, a main body life of 100,000 hours, an oscillation efficiency of 30%, and the energy 10 ３ [kW / m ２ ], a processing area of 1.0 × 10 －２ [m ２ ], an electricity cost of 25 [yen / kWh], and a processing speed of 5000 mm / min. For the blue laser, an initial cost of 120 million yen, a main body life of 50,000 hours, an oscillation efficiency of 20%, and the energy 10 ３ [kW / m ２ ], a processing area of 1.0 × 10 －２ [m ２ ] and an electricity cost of 25 [yen / kWh].

[0035] The processing cost calculation unit 105 obtains a light absorption rate of 10% for the fiber laser and a light absorption rate of 65% for the blue laser based on copper, which is information related to the surface state of the workpiece.

[0036] In the case of the fiber laser, the processing cost calculation unit 105 calculates the processing cost as follows. The initial cost INC per hour, in the case of the fiber laser, when the initial cost is represented by INC ｆ is INC ｆ = (initial cost) / (main body life) = 100,000,000 / 100,000 = 1,000 [yen / hour]. In the case of the blue laser, when the initial cost is represented by INC ｂ is INC ｂ = (initial cost) / (main body life) = 120,000,000 / 50,000 = 2,400 [yen / hour].

[0037] The running cost per hour is calculated as RUC for fiber lasers. ｆ As shown, RUC ｆ = (E × S × EB) / (α × AB) = 10 ３ × (1.0 × 10 －２ ) × 25 / (0.3 × 0.1) = 8333 yen / hour. In the case of a blue laser, the running cost is RUC ｂ As shown, RUC ｂ = (E × S × EB) / (α × AB) = 10 ３ × (1.0 × 10 －２ ) × 25 / (0.2 × 0.65) = 1922 yen / hour.

[0038] Processing time is T in the case of a fiber laser. ｆ As shown, T ｆ = (machining area) / (machining speed) = (1.0 x 10 －２ ) / 5000 = 2.0 min = 1 / 30 hour. In the case of a blue laser, the processing time is T ｂ As shown, T ｂ = (machining area) / (machining speed) = (1.0 x 10 －２ ) / 4000 = 3.3 min = 1 / 24 hour. Therefore, the processing cost C1 in the case of a fiber laser is C1 = (INC ｆ +RUC ｆ ) × T ｆ = (1000 + 8333) / 30 = 311 yen. The processing cost C2 in the case of a blue laser is C2 = (INC ｂ +RUC ｂ ) × T ｂ = (2400 + 1922) / 24 = 180 yen.

[0039] The output laser determination unit 106 determines that the processing cost C2 of the blue laser is lower than the processing cost C1 of the fiber laser (C2 < C1), and therefore decides to use the blue laser and outputs the second laser processing conditions to the second laser output generation unit 108.

[0040] <When the workpiece is an oxide film> The method for calculating the processing cost when the workpiece is an oxide film is the same as the method for calculating the processing cost when the workpiece is copper, except that the absorption rate when the laser energy is absorbed by the workpiece is different from that when the workpiece is copper.

[0041] Specifically, the initial cost INC when the workpiece has an oxide film. ｆ , INC ｂ、 and processing time T ｆ , T ｂ This is the same as when the workpiece is copper.

[0042] When the surface material of the workpiece is an oxide film, the light absorption rate of the laser relative to the oxide film is 80% for both fiber lasers and blue lasers. The running cost per hour is calculated as follows: For fiber lasers, the running cost is calculated as RUC. ｆ As shown, RUC ｆ = (E × S × EB) / (α × AB) = 10 ３ × (1.0 × 10 －２ ) × 25 / (0.3 × 0.8) = 1042 yen / hour. In the case of a blue laser, the running cost is RUC ｂ As shown, RUC ｂ = (E × S × EB) / (α × AB) = 10 ３ × (1.0 × 10 －２ ) × 25 / (0.2 × 0.8) = 1563 yen / hour. Therefore, the processing cost C1 in the case of a fiber laser is C1 = (INC ｆ +RUC ｆ ) × T ｆ = (1000 + 1042) / 30 = 68 yen. The processing cost C2 in the case of a blue laser is C2 = (INC ｂ +RUC ｂ ) × T ｂ = (2400 + 1563) / 24 = 165 yen.

[0043] The output laser determination unit 106 determines that the processing cost C1 of the fiber laser is lower than the processing cost C2 of the blue laser (C1 < C2), and therefore decides to use the fiber laser and outputs the first laser processing conditions to the first laser output generation unit 107.

[0044] (Second Example) In this example, we will explain the case where the initial cost of the blue laser is lower than in the first example, and the processing cost per unit time is calculated. The processing cost calculation unit 105 obtains from the information acquisition unit 104 information related to the calculation of processing costs, including the initial cost, main unit life, conversion efficiency (also called oscillation efficiency), energy required to process the workpiece per unit area, processing area, processing speed, and electricity cost. The processing cost calculation unit 105 also obtains information related to the surface condition of the workpiece, including that the surface material of the workpiece is copper, or an oxide film provided on the copper surface.

[0045] The processing cost C can be calculated using the formula: (initial cost per hour INC + running cost per hour RUC).

[0046] The initial cost per hour, INC, can be calculated using the formula INC = (initial cost) / (lifetime of the unit), similar to the first example.

[0047] The running cost per hour, RUC, can be calculated using the formula RUC = P × S × EB, similar to the first example, where P is the power input to the laser oscillator per unit area, S is the processing area, and EB is the electricity cost. The power P can be calculated using the formula P = E / (α × AB), similar to the first example, where E is the energy required to process the workpiece per unit area, α is the conversion efficiency of the light energy of the laser output from the laser oscillator, and AB is the light absorptivity when the laser energy is absorbed by the workpiece. Therefore, the processing cost C can be calculated as C = (INC + RUC) = {INC + (E × S × EB) / (α × AB)}.

[0048] The following describes a specific example of the calculation method for processing costs in the second example.

[0049] <When the workpiece is copper> The processing cost calculation unit 105 acquires information from the information acquisition unit 104, similar to the first example, regarding the calculation of processing costs for the fiber laser and the blue laser. In this example, the same information regarding the calculation of processing costs as in the first example is acquired, except that the main unit lifespan for the blue laser is 10,000 hours. Similar to the first example, the processing cost calculation unit 105 determines the light absorption rate of the fiber laser to be 10% and the light absorption rate of the blue laser to be 65% based on the information relating to the surface condition of the workpiece, which is copper.

[0050] The processing cost calculation unit 105 calculates the processing cost in the case of a fiber laser as follows: The initial cost per hour INC is calculated in the case of a fiber laser, as in the first example, by including the initial cost. ｆ INC ｆ = (Initial cost) / (Lifespan of the unit) = 100,000,000 / 100,000 = 1,000 [yen / hour]. In the case of a blue laser, initial cost INC. ｂ INC ｂ = (Initial cost) / (Lifespan of the unit) = 120,000,000 / 10,000 = 12,000 [yen / hour], which is five times higher than in the first example.

[0051] The running cost per hour is the same as in the first example, and the running cost for a fiber laser is RUC ｆ RUC ｆ = (E × S × EB) / (α × AB) = 10 ３ × (1.0 × 10 －２ ) × 25 / (0.3 × 0.1) = 8333 yen / hour. The running cost for a blue laser is RUC ｂ RUC ｂ = (E × S × EB) / (α × AB) = 10 ３ × (1.0 × 10 －２ ) × 25 / (0.2 × 0.65) = 1922 yen / hour. Therefore, the processing cost C1 per unit time in the case of a fiber laser is C1 = (INC ｆ +RUC ｆ ) = (1000 + 8333) = 9333 yen. The processing cost C2 in the case of a blue laser is C2 = (INC ｂ+RUC ｂ ) = (12000 + 1922) = 13922 yen.

[0052] The output laser determination unit 106 determines that the processing cost C1 of the fiber laser is lower than the processing cost C2 of the blue laser (C1 < C2), and therefore decides to use the fiber laser and outputs the first laser processing conditions to the first laser output generation unit 107.

[0053] In the second example, unlike the first example, the output laser determination unit 106 decides to use a fiber laser instead of a blue laser. However, if the processing area is, for example, 2.0 × 10 －２ [m ２ Therefore, the processing cost C1 per unit time in the case of a fiber laser is C1 = (INC ｆ +RUC ｆ ) = (1000 + 16665) = 17665 yen, and the processing cost C2 in the case of a blue laser is C2 = (INC ｂ +RUC ｂ ) = (12000 + 3845) = 15845 yen.

[0054] Therefore, the output laser determination unit 106 determines that the processing cost C1 of the fiber laser is higher than the processing cost C2 of the blue laser (C1 > C2), and outputs the second laser processing conditions to the second laser output generation unit 108.

[0055] <When the workpiece is an oxide film> The method for calculating the processing cost when the workpiece is an oxide film is the same as the method for calculating the processing cost when the workpiece is copper, except that the absorption rate when the laser energy is absorbed by the workpiece is different from that when the workpiece is copper. Specifically, the initial cost INC. when the workpiece is an oxide film ｆ , INC ｂ This is the same as when the workpiece is copper.

[0056] When the surface material of the workpiece is an oxide film, the light absorption rate of the laser relative to the oxide film is 80% for both fiber lasers and blue lasers.

[0057] The running cost per hour, in the case of a fiber laser, if the running cost is represented by RUC ｆ is shown as, RUC ｆ = (E × S × EB) / (α × AB) = 10 ３ × (1.0 × 10 －２ ) × 25 / (0.3 × 0.8) = 1042 yen / hour. In the case of a blue laser, if the running cost is represented by RUC ｂ is shown as, RUC ｂ = (E × S × EB) / (α × AB) = 10 ３ × (1.0 × 10 －２ ) × 25 / (0.2 × 0.8) = 1563 yen / hour. Therefore, the processing cost C1 in the case of a fiber laser is C1 = (INC ｆ + RUC ｆ ) = (1000 + 1042) = 2042 yen. The processing cost C2 in the case of a blue laser is C2 = (INC ｂ + RUC ｂ ) = (12000 + 1563) = 13563 yen.

[0058] Since the processing cost C1 of the fiber laser is lower than the processing cost C2 of the blue laser (C1 < C2), the output laser determination unit 106 determines to use the fiber laser and outputs the first laser processing conditions to the first laser output generation unit 107. When the processing area is, for example, 2.0 × 10 －２ [m ２ , the processing cost C1 per unit time in the case of a fiber laser is C1 = (INC ｆ + RUC ｆ ) = (1000 + 2084) = 3084 yen, and the processing cost C2 in the case of a blue laser is C2 = (INC ｂ + RUC ｂ ) = (12000 + 3126) = 15126 yen. Therefore, similar to the case where the processing area is 1.0 × 10 －２ [m ２ , since the processing cost C1 of the fiber laser is higher than the processing cost C2 of the blue laser (C1 > C2), the output laser determination unit 106 determines to use the blue laser and outputs the second laser processing conditions to the second laser output generation unit 108.

[0059] Figure 2 is a flowchart showing an example of a laser determination method according to a first embodiment of the present disclosure. In the following description, an example in which the laser determination method of the present disclosure is executed by a numerical control device 100 will be described, but the laser determination method of the present disclosure can also be executed by a configuration other than the numerical control device 100.

[0060] In step S1, the information acquisition unit 104 acquires information relating to the surface condition of the workpiece and information relating to the calculation of processing costs for the first laser oscillator 200 that outputs the fiber laser and the blue laser.

[0061] In step S2, the processing cost calculation unit 105 calculates the processing cost C1 of the first laser (fiber laser) and the processing cost C2 of the second laser (blue laser) based on the surface condition of the workpiece.

[0062] In step S3, the output laser determination unit 106 determines the relative magnitude of the processing cost C1 of the first laser and the processing cost C2 of the second laser, based on the surface condition of the workpiece. If the processing cost C1 of the first laser is lower than the processing cost C2 of the second laser (C1 < C2), the output laser determination unit 106 proceeds to step S4. If the processing cost C1 of the first laser is higher than or equal to the processing cost C2 of the second laser (C1 > C2 or C1 = C2), the unit proceeds to step S5. If C1 = C2, the unit may proceed to step S4.

[0063] In step S4, the output laser determination unit 106 determines that the laser to be used for processing the workpiece is the first laser (fiber laser). In step S5, the output laser determination unit 106 determines that the laser to be used for processing the workpiece is the second laser (blue laser).

[0064] In step S6, the information acquisition unit 104 determines whether the surface state of the workpiece has changed. If the surface state of the workpiece has changed, the process proceeds to step S2; if the surface state of the workpiece has not changed, the process ends.

[0065] As described above, the numerical control device and laser selection method of this embodiment allow for the selection of a laser that optimizes the processing cost according to the surface condition of the workpiece, thereby reducing costs. Furthermore, the numerical control device and laser selection method of this embodiment eliminate the need for the user to check the surface condition of the workpiece and set the processing conditions each time, thus reducing the burden on the operator.

[0066] (Second Embodiment) In the first embodiment, the information related to the surface state acquired by the information acquisition unit was either input by the user according to the workpiece or stored in the memory unit. In this embodiment, the information acquisition unit acquires the surface image of the workpiece output from the imaging device as information related to the surface state.

[0067] Figure 3 is a block diagram showing an example configuration of a numerical control device according to a second embodiment of the present disclosure. As shown in Figure 3, in the numerical control device 100A, the information acquisition unit 104 and the processing cost calculation unit 105 of the numerical control device 100 shown in Figure 1 are replaced by an information acquisition unit 104A and a processing cost calculation unit 105A. The information acquisition unit 104A is connected to an imaging device 400 equipped with an image acquisition unit 401. The imaging device 400 is attached to a laser head that irradiates a workpiece with a laser, and the laser output from the first laser oscillator 200 or the second laser oscillator 300 is input to the laser head.

[0068] The operation of the numerical control device 100A is the same as that of the numerical control device 100 in the first embodiment, except for the information acquisition unit 104A and the processing cost calculation unit 105A. Therefore, the explanation of the operations other than those of the information acquisition unit 104A and the processing cost calculation unit 105A will be omitted. The laser determination method in this embodiment is the same as the laser determination method in the first embodiment, except that steps S1 and S2 in Figure 2 are executed by the information acquisition unit 104A and the processing cost calculation unit 105A.

[0069] The information acquisition unit 104A acquires a surface image of the workpiece from the image acquisition unit 401 of the imaging device 400, and, similar to the information acquisition unit 104, acquires information related to the calculation of processing costs for the first laser oscillator 200 and the second laser oscillator 300. The information acquisition unit 104A then outputs the surface image of the workpiece and the information related to the calculation of processing costs to the processing cost calculation unit 105. The surface image of the workpiece contains information related to the surface condition of the workpiece.

[0070] The processing cost calculation unit 105A detects scratches on the surface of the workpiece or the type of surface material of the workpiece by analyzing the surface image of the workpiece (for example, surface inspection), and identifies the light absorption rate. The surface of the workpiece may include an oxide film, a protective sheet, or a coating film. When the processing cost calculation unit 105A determines the type of surface material from the surface image, it performs a surface inspection using the surface image, detects the surface material of the workpiece from color identification, etc., and determines the light absorption rate. Then, the processing cost calculation unit 105A calculates the processing cost of the first laser and the second laser based on the light absorption rate obtained as a result of the surface image analysis and the information related to the calculation of processing costs.

[0071] The processing cost calculation unit 105A stores a table that associates multiple colors, multiple surface materials, and multiple light absorption rates. It identifies the surface material from the color of the surface image of the workpiece and identifies the light absorption rate from the surface material. For example, if copper is reddish-brown, the thermal oxide film on copper is black, and the protective sheet is blue, the surface material can be identified by color identification and the light absorption rate can be determined. The operation of the numerical control device 100A after determining the light absorption rate is the same as the operation of the numerical control device 100.

[0072] When laser processing a substrate that has scratches, oxide films, protective sheets, or coatings on a portion of its surface, and the material surface of the substrate and the non-material surface are being processed, the material of the laser-processed surface changes during the process. Therefore, it is necessary to switch the laser in response to the change in the material of the laser-processed surface. The following explanation describes an example where the workpiece is a copper plate with an oxide film formed on a portion of it.

[0073] Figure 4 shows how a copper plate with an oxide film formed on a portion of it is laser-processed by controlling a first laser oscillator and a second laser oscillator using a numerical control device. As shown in Figure 4, when laser-processing a processing area M1 on the copper surface of the copper plate 10, the numerical control device 100A selects the blue laser L2. After the laser processing of the processing area M1 on the copper surface of the copper plate 10 is completed, when laser-processing the processing area M2 of the oxide film 11, the numerical control device 100A switches from the blue laser L2 to the fiber laser L1.

[0074] In this embodiment, the information acquisition unit 104A acquires a surface image of the workpiece from the image acquisition unit 401 of the imaging device 400, and the processing cost calculation unit 105A analyzes the surface image of the workpiece to detect that the laser processing surface has switched from the processing area M1 of the copper surface of the copper plate 10 to the processing area M2 of the oxide film 11, and switches the light absorption rate. Based on the processing cost calculated by the processing cost calculation unit 105A, the output laser determination unit 106 can switch the laser used to process the workpiece surface from the blue laser L2 to the fiber laser L1 during laser processing.

[0075] As described above, the numerical control device and laser determination method of this embodiment offer advantages over those of the first embodiment, eliminating the need for the user to input or store information related to the surface condition of the workpiece. Furthermore, the numerical control device and laser determination method of this embodiment allow for automatic switching of the laser during laser processing.

[0076] (Third Embodiment) In the second embodiment, as shown in Figure 3, the information acquisition unit 104A outputs a surface image of the workpiece, output from the imaging device 400, to the processing cost calculation unit 105A, and the processing cost calculation unit 105A uses the surface image of the workpiece to determine the light absorption rate. In this embodiment, as shown in Figure 5, the information acquisition unit 104B outputs reflected light data of the workpiece, output from the light receiving device 500, to the processing cost calculation unit 105B, and the processing cost calculation unit 105B uses this reflected light data to determine the light absorption rate.

[0077] Figure 5 is a block diagram showing an example configuration of a numerical control device according to a third embodiment of the present disclosure. As shown in Figure 5, in the numerical control device 100B, the information acquisition unit 104 and the processing cost calculation unit 105 of the numerical control device 100 shown in Figure 1 are replaced by an information acquisition unit 104B and a processing cost calculation unit 105B. The information acquisition unit 104B is connected to a light receiving device 500 equipped with a reflected light acquisition unit 501. The light receiving device 500 is attached to a laser head that irradiates a workpiece with a laser, and the laser output from the first laser oscillator 200 or the second laser oscillator 300 is input to the laser head.

[0078] The operation of the numerical control device 100B is the same as that of the numerical control device 100 in the first embodiment, except for the information acquisition unit 104B and the processing cost calculation unit 105B. Therefore, the explanation of the operations other than those of the information acquisition unit 104B and the processing cost calculation unit 105B will be omitted. The laser determination method in this embodiment is the same as the laser determination method in the first embodiment, except that steps S1 and S2 in Figure 2 are executed by the information acquisition unit 104B and the processing cost calculation unit 105B.

[0079] The light receiving device 500 is a device that can acquire various information from light received by the device. The light receiving device 500 incorporates a sensor called a light receiving element (for example, a photodiode), and the magnitude of the current flowing through the light receiving element changes depending on the intensity of the light received. Based on the magnitude of the current that flows, the light receiving device 500 can acquire the wavelength of the received light or the intensity of the reflected light during laser processing (which becomes reflected light data). The reflectance and absorptance can be determined from the intensity of the light irradiated onto the workpiece and the intensity of the light reflected from the workpiece. When acquiring the intensity of reflected light, the light receiving element becomes a reflected light acquisition unit 501.

[0080] The information acquisition unit 104B acquires reflected light data from the workpiece from the reflected light acquisition unit 501 of the light receiving device 500, and, similar to the information acquisition unit 104, acquires information related to the calculation of processing costs for the first laser oscillator 200 and the second laser oscillator 300. The information acquisition unit 104B then outputs the reflected light data and the information related to the calculation of processing costs to the processing cost calculation unit 105B. The reflected light data contains information related to the surface condition of the workpiece.

[0081] The processing cost calculation unit 105B obtains the light absorption rate, which is information related to the surface state of the workpiece, based on the reflected light data. Then, the processing cost calculation unit 105B calculates the processing costs of the first laser and the second laser based on the obtained light absorption rate and information related to the calculation of the processing cost. The operation of the numerical control device 100B after obtaining the light absorption rate is the same as the operation of the numerical control device 100.

[0082] When the workpiece is, for example, a substrate with scratches, an oxide film, a protective sheet, or a coating material in a partial region on the surface, and laser processing is performed on the material surface of the substrate and the material surface other than the substrate material, since the material of the laser processing surface changes during laser processing, it is required to switch the laser in response to the change in the material of the laser processing surface. In the following description, an example in which the workpiece is a copper plate with an oxide film formed in a partial region will be described.

[0083] FIG. 6 is a diagram showing a state in which the reflected light acquisition unit of the light receiving device receives reflected light from the workpiece when using a fiber laser. FIG. 7 is a diagram showing a state in which the reflected light acquisition unit of the light receiving device receives reflected light from the workpiece when using a blue laser.

[0084] Hereinafter, the operation of the numerical control device 100B will be described separately for before laser processing and during laser processing. First, the operation of the numerical control device 100B before processing will be described. Before laser processing, as shown in FIGS. 6 and 7, the numerical control device 100B irradiates the fiber laser L1 and the blue laser L2 with small outputs respectively on the processing path of the copper plate 10 having the oxide film 11 between the coordinate value X Ａ from the coordinate value X Ｂ and controls so as to perform linear laser processing.

[0085] The information acquisition unit 104B acquires reflected light data from the reflected light acquisition unit 501 of the light receiving device 500 and outputs the reflected light data to the processing cost calculation unit 105B. The processing cost calculation unit 105B obtains the light absorption rate using the reflected light data. FIG. 8 is a characteristic diagram showing the relationship between the coordinate values of the processing path and the light absorption rate when using the fiber laser L1 and the blue laser L2. Coordinate value X ＡFrom coordinate value X Ｂ The processing area between them is 1.0 x 10 －２ [m ２ ] and coordinate value X Ａ From coordinate value X Ｂ The processing area outside of that area is 2.0 x 10 －２ [m ２ Let's assume that ]. As shown in Figure 8, the coordinate value X Ａ From coordinate value X Ｂ Outside of this range, the light absorption rate is higher when using the blue laser L2 than when using the fiber laser L1, and the coordinate value X Ａ From coordinate value X Ｂ Between these two points, the light absorption rates of the fiber laser L1 and the blue laser L2 are approximately the same. The coordinate values ​​of the processing path can be determined by the position detector of the laser head's drive device (not shown), and the detected coordinate values ​​are output to the processing cost calculation unit 105B.

[0086] The processing cost calculation unit 105B calculates the processing costs for the first laser (fiber laser) and the second laser (blue laser) for the coordinate values ​​of the processing path, based on the relationship between the coordinate values ​​of the processing path and the light absorption rate, and information related to the calculation of processing costs, and outputs this to the output laser determination unit 106. The output laser determination unit 106 stores the coordinate values ​​for switching between the first laser and the second laser based on the processing costs for the coordinate values ​​in its own memory unit or an external memory unit.

[0087] Specifically, in the first example of the processing cost calculation method of the first embodiment, the coordinate value X Ａ From coordinate value X Ｂ In the section other than between, the processing cost C1 in the case of a fiber laser is C1 = (INC ｆ +RUC ｆ ) × T ｆ = (1000 + 16665) / 15 = 1178 yen. The processing cost C2 in the case of a blue laser is C2 = (INC ｂ +RUC ｂ ) × T ｂ = (2400 + 3845) / 12 = 520 yen. Coordinate value X Ａ From coordinate value X Ｂ In the interval between these points, the processing cost C1 in the case of a fiber laser is given by C1 = (INC ｆ +RUCｆ ) × T ｆ = (1000 + 1042) / 30 = 68 yen. The processing cost C2 in the case of a blue laser is C2 = (INC ｂ +RUC ｂ ) × T ｂ = (2400 + 1563) / 24 = 165 yen.

[0088] In the second example of the processing cost calculation method of the first embodiment, the coordinate value X Ａ From coordinate value X Ｂ In the section other than between, the processing cost C1 in the case of a fiber laser is C1 = (INC ｆ +RUC ｆ ) = (1000 + 16665) = 17665 yen. The processing cost C2 in the case of a blue laser is C2 = (INC ｂ +RUC ｂ ) = (12000 + 3845) = 15845 yen. Coordinate value X Ａ From coordinate value X Ｂ In the interval between these points, the processing cost C1 in the case of a fiber laser is given by C1 = (INC ｆ +RUC ｆ ) = (1000 + 1042) = 2042 yen. The processing cost C2 in the case of a blue laser is C2 = (INC ｂ +RUC ｂ ) × T ｂ = (12000 + 1563) = 13563 yen.

[0089] In both the first and second processing cost calculation methods of the first embodiment, the coordinate value X Ａ From coordinate value X Ｂ Outside of the interval between these two points, blue lasers have lower processing costs than fiber lasers, and coordinate value X Ａ From coordinate value X Ｂ In the interval between these two points, the fiber laser has a lower processing cost than the blue laser. Therefore, the output laser determination unit 106 determines the coordinate value X to switch from the blue laser to the fiber laser. Ａ The coordinate value X that switches from fiber laser to blue laser. Ｂ The numerical control device 100B stores this information in its own memory or in an external memory. The numerical control device 100B performs the above operations before laser processing.

[0090] Next, the operation of the numerical control device 100B during laser processing will be described. During laser processing, the output laser determination unit 106 reads the coordinate values ​​stored in the memory unit before processing to switch between the first laser and the second laser, and switches between the first laser and the second laser when the coordinate values ​​obtained from the position detector of the laser head's drive device (not shown) match the read coordinate values.

[0091] As described above, the numerical control device and laser determination method of this embodiment provide effects similar to those of the first and second embodiments. Furthermore, in the numerical control device and laser determination method of this embodiment, by storing the coordinate values ​​for switching the laser before laser processing, the laser can be automatically switched based on these coordinate values ​​during laser processing.

[0092] As described above, in order to realize the functional blocks included in the numerical control device in each embodiment, the numerical control device can be implemented by hardware, software, or a combination thereof. Similarly, the laser determination method can also be implemented by hardware, software, or a combination thereof. Here, implementation by software means that it is implemented by a computer reading and executing a program.

[0093] To implement the components included in a numerical control unit through software or a combination thereof, the numerical control unit includes an arithmetic processing unit such as a CPU (Central Processing Unit). The arithmetic processing unit functions as an execution unit. The numerical control unit also includes auxiliary storage devices such as an HDD (Hard Disk Drive) that store various control programs such as application software or an OS (Operating System), and main memory such as RAM (Random Access Memory) for storing data temporarily required for the arithmetic processing unit to execute programs.

[0094] The numerical control unit then reads application software or an operating system from the auxiliary storage device, expands the read application software or OS into the main memory, and performs calculations based on this application software or OS. Furthermore, it controls various hardware components of the numerical control unit based on these calculation results. This realizes the functional blocks of this embodiment. The laser determination method can also be realized with a configuration similar to that of the numerical control unit.

[0095] The components included in a numerical control device can be realized by hardware, including electronic circuits. When a numerical control device is configured as hardware, some or all of the functions of each component included in the numerical control device can be implemented using integrated circuits (ICs) such as ASICs (Application Specific Integrated Circuits), gate arrays, FPGAs (Field Programmable Gate Arrays), and CPLDs (Complex Programmable Logic Devices).

[0096] Programs can be stored and supplied to a computer using various types of non-transitor computer-readable media. Non-transitor computer-readable media include various types of tangible storage media. Examples of non-transitor computer-readable media include magnetic recording media (e.g., hard disk drives), magneto-optical recording media (e.g., magneto-optical disks), CD-ROMs (Read Only Memory), CD-Rs, CD-R / Ws, and semiconductor memory (e.g., mask ROMs, PROMs (Programmable ROMs), EPROMs (Erasable PROMs), flash ROMs, and RAMs (random access memory)). Furthermore, the program may be supplied to the computer by various types of temporary computer-readable media.

[0097] According to the numerical control device and laser determination method of this disclosure, including the embodiments described above, the laser to be used can be determined in a way that reduces processing costs according to the surface condition of the workpiece, thus saving energy. Furthermore, according to the numerical control device and laser determination method of this embodiment, the user does not need to check the surface condition of the workpiece and set the processing conditions each time, thereby reducing the burden on the operator.

[0098] While the embodiments described above are preferred embodiments of the present invention, the scope of the present invention is not limited to these embodiments, and various modifications can be made to implement the invention without departing from the spirit of the invention.

[0099] With respect to the above embodiment, the following additional information is disclosed. (Addendum 1) A numerical control device (100, 100A, 100B) for determining which laser to use for processing a workpiece from a plurality of lasers, comprising: an information acquisition unit (104, 104A, 104B) that acquires first information relating to the surface state of the workpiece and second information necessary for calculating the processing cost required for processing using a plurality of laser oscillators that output the plurality of lasers; a processing cost calculation unit (105, 105A, 105B) that calculates the processing cost when using the plurality of lasers based on the acquired first information and second information; and an output laser determination unit (106) that determines which laser to use for processing from the plurality of lasers based on the processing cost of the plurality of lasers.

[0100] (Note 2) The numerical control device as described in Note 1, wherein the information acquisition unit (104A) acquires a surface image of the workpiece from the image acquisition unit (401) of the imaging device (400) as the first information, and the processing cost calculation unit (105A) analyzes the surface image and calculates the processing cost of the plurality of lasers based on the analysis results and the second information.

[0101] (Note 3) The numerical control device described in Note 2, wherein the processing cost calculation unit (105A) performs a surface inspection using the surface image and detects at least scratches or types of scratches or surface materials of the workpiece, including an oxide film, protective sheet, or coating film, determines the light absorption rate of the plurality of lasers for the workpiece based on the type of scratches or surface material as the analysis result, and calculates the processing cost of the plurality of lasers based on the light absorption rate and the second information.

[0102] (Note 4) The numerical control device according to Note 1, wherein the information acquisition unit (104B) acquires at least reflected light data from the reflected light acquisition unit (501) of the light receiving device (500) as the first information, and the processing cost calculation unit (105B) calculates the processing cost of the plurality of lasers based on the reflected light data and the second information.

[0103] (Note 5) The numerical control device described in Note 4, wherein the processing cost calculation unit (105B) determines the light absorption rate of the plurality of lasers for the workpiece based on the reflected light data, and calculates the processing cost of the plurality of lasers based on the light absorption rate and the second information.

[0104] (Note 6) A numerical control device according to any one of Notes 1 to 5, comprising: a processing program analysis unit (101) that analyzes at least one processing program and generates command data for setting laser processing conditions; and a plurality of laser processing condition acquisition units (102, 103) that acquire a plurality of laser processing conditions based on the command data, wherein the output laser determination unit (106) determines the laser processing conditions of the laser to be used for processing from the plurality of laser processing conditions based on the processing costs of the plurality of lasers.

[0105] (Note 7) A laser determination method comprising the steps of: a computer acquiring first information relating to the surface condition of a workpiece and second information necessary for calculating the processing cost required for processing using multiple laser oscillators that output multiple lasers; calculating the processing cost when using the multiple lasers based on the acquired first information and second information; and determining which laser to be used for processing from the multiple lasers based on the processing cost of the multiple lasers.

[0106] 100, 100A, 100B Numerical control device 101 Processing program analysis unit 102 First laser processing condition acquisition unit 103 Second laser processing condition acquisition unit 104, 104A, 104B Information acquisition unit 105, 105A, 105B Processing cost calculation unit 106 Output laser determination unit 107 First laser output generation unit 108 Second laser output generation unit 200 First laser oscillator 300 Second laser oscillator 400 Imaging device 401 Image acquisition unit 500 Light receiving device 501 Reflected light acquisition unit

Claims

A numerical control device that determines which laser to use for processing a workpiece from among multiple lasers, An information acquisition unit that acquires first information relating to the surface state of the workpiece and second information necessary for calculating the processing cost required for processing using the multiple laser oscillators that output the multiple lasers, A processing cost calculation unit calculates the processing cost when using the multiple lasers based on the acquired first and second information, A numerical control device comprising: an output laser determination unit that determines which laser to be used for processing from among the plurality of lasers based on the processing cost of the plurality of lasers. 　 The information acquisition unit acquires a surface image of the workpiece from the image acquisition unit of the imaging device as the first information, The numerical control device according to claim 1, wherein the processing cost calculation unit analyzes the surface image and calculates the processing cost of the plurality of lasers based on the analysis results and the second information. 　 The numerical control device according to claim 2, wherein the processing cost calculation unit performs a surface inspection using the surface image and detects at least scratches or types of scratches or surface materials of the workpiece, including an oxide film, protective sheet, or coating film; determines the light absorption rate of the plurality of lasers for the workpiece based on the type of scratches or surface material as an analysis result; and calculates the processing cost of the plurality of lasers based on the light absorption rate and the second information. 　 The information acquisition unit acquires at least reflected light data from the reflected light acquisition unit of the light receiving device as the first information, The numerical control device according to claim 1, wherein the processing cost calculation unit calculates the processing cost of the plurality of lasers based on the reflected light data and the second information. 　 The numerical control device according to claim 4, wherein the processing cost calculation unit determines the light absorption rate of the plurality of lasers for the workpiece based on the reflected light data, and calculates the processing cost of the plurality of lasers based on the light absorption rate and the second information. 　 The information acquisition unit acquires, as the second information, information necessary for calculating processing costs, including at least the initial cost and lifespan of the laser, the electricity cost during processing, and the processing speed. The numerical control device according to claim 1, wherein the processing cost calculation unit calculates the processing cost using the acquired information. 　 A processing program analysis unit analyzes at least one processing program and generates command data for setting laser processing conditions, The system includes multiple laser processing condition acquisition units that acquire multiple laser processing conditions based on the command data, The numerical control device according to any one of claims 1 to 6, wherein the output laser determination unit determines the laser processing conditions of the laser to be used for processing from the plurality of laser processing conditions based on the processing costs of the plurality of lasers. 　 Computers The steps include obtaining first information relating to the surface condition of the workpiece and second information necessary for calculating the processing cost required for processing using multiple laser oscillators that output multiple lasers, A step of calculating the processing cost when using the multiple lasers based on the acquired first and second information, A laser determination method comprising the steps of determining which laser to use for processing from among the plurality of lasers based on the processing costs of the plurality of lasers.

Images