Maintenance device, processing system, and control method for maintenance device

Abstract

This maintenance device performs maintenance for a processing device having a drive mechanism to which is attached a processing wheel used for grinding or polishing. The maintenance device has a holder for holding a cleaning wheel that wipes the attachment surface of the drive mechanism where the processing wheel is attached.

Description

Conservation device, processing system, and control method for conservation device

[0001] The present disclosure relates to a conservation device, a processing system, and a control method for a conservation device.

[0002] The grinding means described in Patent Document 1 includes a spindle, a wheel mount disposed at the lower end of the spindle, and a grinding wheel detachably attached to the lower surface of the wheel mount. The grinding wheel has an annular base and a plurality of grinding wheels provided annularly on the lower surface of the annular base. The grinding wheel is fastened to the wheel mount by bolts.

[0003] Japanese Patent Application Laid-Open No. 2015-178149

[0004] One embodiment of the present disclosure provides a technique capable of suppressing the adhesion of dirt on the mounting surface to which the processing wheel of the drive mechanism is attached.

[0005] The conservation device according to one embodiment of the present disclosure performs conservation of a processing device having a drive mechanism to which a processing wheel used for grinding or polishing is attached. The conservation device has a holder that holds a cleaning wheel for wiping the mounting surface to which the processing wheel of the drive mechanism is attached.

[0006] According to one embodiment of the present disclosure, it is possible to suppress the adhesion of dirt on the mounting surface to which the processing wheel of the drive mechanism is attached.

[0007] Figure 1 is a diagram showing a processing system according to one embodiment. Figure 2 is a plan view showing an example of the layout of the processing system. Figure 3 is a diagram showing an example of a storage station. Figure 4 is a plan view showing an example of a support base for the storage station. Figure 5 is a cross-sectional view along the line V-V in Figure 4. Figure 6 is a plan view showing another example of a support base for the storage station. Figure 7 is a cross-sectional view along the line VII-VII in Figure 6. Figure 8 is a cross-sectional view showing an example of a processing device and a maintenance device. Figure 9 is a cross-sectional view showing an example of a drive mechanism for the processing device. Figure 10 is a bottom view showing an example of a stopper for the processing device. Figure 11 is a cross-sectional view showing an example of work by a maintenance robot. Figure 12 is a cross-sectional view showing another example of work by a maintenance robot. Figure 13 is a cross-sectional view showing yet another example of work by a maintenance robot. Figure 14 is a cross-sectional view showing an example of a storage unit for a transport robot. Figure 15 is a partially enlarged view of Figure 14. Figure 16 is a plan view showing an example of a processing wheel. Figure 17 is a plan view showing an example of a cleaning wheel. Figure 18 is a cross-sectional view showing a modified example of Figure 12. Figure 19 is a cross-sectional view showing a modified example of Figure 13.

[0008] Embodiments of this disclosure will be described below with reference to the drawings. In each drawing, identical or similar components are denoted by the same reference numerals, and their descriptions may be omitted. In this specification, the X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other. The X-axis direction and Y-axis direction are horizontal, and the Z-axis direction is vertical. The X-axis direction includes the positive X-axis direction and the negative X-axis direction, which is the opposite direction to the positive X-axis direction. The Y-axis direction includes the positive Y-axis direction and the negative Y-axis direction, which is the opposite direction to the positive Y-axis direction. The Z-axis direction includes the positive Z-axis direction and the negative Z-axis direction, which is the opposite direction to the positive Z-axis direction.

[0009] An example of the processing system 1 will be described mainly with reference to Figures 1 and 2. The processing system 1 grinds or polishes the substrate W as shown in Figure 9. The substrate W includes a semiconductor substrate or a glass substrate. The semiconductor substrate includes a silicon wafer or a compound semiconductor wafer. The substrate W may be a laminated substrate formed by joining semiconductor substrates together, glass substrates together, or a semiconductor substrate and a glass substrate. The substrate W may further include a plurality of devices formed on the surface of the semiconductor substrate or glass substrate. Each device includes an electronic circuit. The plurality of devices are separated by a plurality of streets that are orthogonal to each other. The processing system 1 grinds or polishes the substrate W from the side opposite to the devices.

[0010] As shown in Figures 1 and 2, the processing system 1 comprises a processing device 100, a maintenance device 200, and a third control circuit 300. The processing device 100 has a drive mechanism 110 and a first control circuit 190. The drive mechanism 110 is to which a processing wheel 10 used for grinding or polishing is attached. Although not shown, one processing device 100 may have multiple drive mechanisms 110. The maintenance device 200 has a transport robot 210, a maintenance robot 220, and a second control circuit 290. The transport robot 210 travels along a travel path set around the processing device 100 and transports the processing wheel 10 or cleaning wheel 20. The maintenance robot 220 moves together with the transport robot 210 and performs maintenance on the processing device 100. It is preferable that there are multiple processing devices 100 and multiple maintenance devices 200.

[0011] The first control circuit 190, the second control circuit 290, and the third control circuit 300 are each composed of, for example, a computer, and each has, for example, an arithmetic unit such as a CPU (Central Processing Unit) and a storage unit such as memory. The arithmetic unit executes the various control operations described in this specification by executing a program stored in the storage unit. The storage unit stores a program for executing the various control operations. The fourth control circuit 490, which will be described later, is configured in a similar manner.

[0012] The first control circuit 190, the second control circuit 290, and the third control circuit 300 each include electronic circuits such as a CPU, GPU (Graphics Processing Unit), FPGA (Field Programmable Gate Array), or ASIC (Application Specific Integrated Circuit), and perform various control operations described in this specification by executing instruction codes stored in a storage medium such as memory, or by designing circuits for special applications. The fourth control circuit 490, described later, is configured similarly.

[0013] The first control circuit 190 monitors the amount of wear on the processing wheel 10 attached to the drive mechanism 110. The processing wheel 10 includes, for example, a disc 11 and a grinding wheel 12 provided on the lower surface of the disc 11. As the grinding wheel 12 wears down, the position of the disc 11 at which the grinding wheel 12 begins to contact the substrate W is displaced downward. Therefore, the amount of wear on the processing wheel 10 can be calculated from the amount of displacement of the position of the disc 11 at which the grinding wheel 12 begins to contact the substrate W. The processing wheel 10 may also have a polishing pad instead of a grinding wheel 12. The amount of wear on the processing wheel 10 can also be expressed in terms of the number of substrates W processed or the processing time.

[0014] The first control circuit 190 generates a command to replace the machining wheel 10 when the amount of wear on the machining wheel 10 exceeds a threshold. The replacement command specifies the location of the drive mechanism 110 and the type of machining wheel 10. The location of the drive mechanism 110 is distinguished by identification information such as the identification number of the machining device 100 and identification information such as the identification number of the drive mechanism 110. The type of machining wheel 10 is distinguished by, for example, the material and particle size of the abrasive grains that make up the machining wheel 10. The type of machining wheel 10 may also be distinguished by the shape and dimensions of the disc 11.

[0015] The first control circuit 190 transmits a command to replace the machining wheel 10 to the third control circuit 300 wirelessly or via wired connection. Upon receiving the replacement command from the first control circuit 190, the third control circuit 300 checks the operating status of multiple maintenance devices 200 and selects the maintenance device 200 to which the replacement command will be sent. The third control circuit 300 then controls the selected maintenance device 200 to transmit the replacement command to the second control circuit 290. The replacement command specifies the location of the drive mechanism 110 and the type of machining wheel 10. Note that if the maintenance device 200 to be used for each location of the drive mechanism 110 is predetermined, checking the operating status is unnecessary. Also, if there is only one maintenance device 200, checking the operating status and selecting the maintenance device 200 are unnecessary.

[0016] If the location of the drive mechanism 110 is the same, the type of processing wheel 10 is basically the same before and after replacement. However, even if the location of the drive mechanism 110 is the same, the type of processing wheel 10 may change when the type of product manufactured by the processing system 1 changes. In such cases where the type of processing wheel 10 changes before and after replacement, the first control circuit 190 creates a replacement command specifying the new type.

[0017] Furthermore, if the type of machined wheel 10 changes between before and after the replacement, the first control circuit 190 does not need to create a replacement command specifying the type after the change. The first control circuit 190 may create a replacement command specifying the type before the change. The third control circuit 300 receives a signal specifying the type after the change from, for example, an input device 500 that accepts user input operations. Based on the signal received from the input device 500, the third control circuit 300 corrects the replacement command received from the first control circuit 190 and transmits the corrected replacement command to the second control circuit 290.

[0018] When the second control circuit 290 receives a replacement command from the third control circuit 300, it controls the transport of the processing wheel 10 of the type specified in the replacement command toward the drive mechanism 110 at the location specified in the replacement command. This makes it possible to transport the processing wheel 10 of the desired type to the desired location.

[0019] When the second control circuit 290 receives a replacement command from the third control circuit 300, it may perform control to transport the cleaning wheel 20 together with the processing wheel 10 of the type specified in the replacement command toward the drive mechanism 110 at the location specified in the replacement command. This allows the processing wheel 10 and the cleaning wheel 20 of the type specified by the processing device 100 to be transported to the location specified by the processing device 100. Preferably, the disc 21 of the cleaning wheel 20 and the disc 11 of the processing wheel 10, which are transported simultaneously, have the same shape and dimensions.

[0020] The second control circuit 290, after removing the processing wheel 10 from the drive mechanism 110 and before attaching another processing wheel 10 to the drive mechanism 110, controls the cleaning wheel 20 to wipe the mounting surface 111 of the drive mechanism 110 where the processing wheel 10 is attached. This allows the dirty water adhering to the mounting surface 111 to be wiped away, and prevents solid matter such as processing debris contained in the dirty water from adhering to the mounting surface 111.

[0021] Furthermore, solid matter adhering to the mounting surface 111 forms a gap between the processing wheel 10 and the drive mechanism 110, allowing contaminated water to seep into this gap and promoting the accumulation of solid matter. The accumulated solid matter is then sandwiched between the processing wheel 10 and the drive mechanism 110. If the solid matter is crushed, the bolt 119 will loosen. According to this embodiment, contaminated water adhering to the mounting surface 111 can be wiped away with the cleaning wheel 20, thereby suppressing the accumulation of solid matter.

[0022] The processing system 1 preferably includes a storage station 400. The storage station 400 is provided adjacent to the travel path of the maintenance device 200. The storage station 400 stores multiple processing wheels 10 of different types. The storage station 400 may also store cleaning wheels 20.

[0023] When the second control circuit 290 receives a replacement command from the third control circuit 300, it receives a processing wheel 10 of the type specified in the replacement command from the storage station 400 and controls its transport toward the drive mechanism 110 at the location specified in the replacement command. By stocking the processing wheels 10 in advance at the storage station 400, preparation time can be reduced. Downtime of the processing device 100 can be reduced, and the operating rate of the processing device 100 can be improved.

[0024] When the second control circuit 290 receives a replacement command from the third control circuit 300, it may perform control to receive the processing wheel 10 and cleaning wheel 20 of the type specified in the replacement command from the storage station 400 and transport them toward the drive mechanism 110 at the location specified in the replacement command. By stocking the cleaning wheel 20 in advance at the storage station 400, the preparation time can be shortened.

[0025] An example of a storage station 400 will be described with reference to Figures 3 to 7. As shown in Figure 3, the processing wheel 10 has a recording medium 19. The recording medium 19 records identification information that identifies the type of processing wheel 10. Similarly, the cleaning wheel 20 may have a recording medium 29. The recording medium 29 records identification information that identifies the type of cleaning wheel 20. The type of cleaning wheel 20 is distinguished, for example, by the shape and dimensions of the disc 21.

[0026] The recording media 19 and 29 are, for example, printing media such as metal or ceramic. Identification information is printed on the printing media, for example, by laser printing. The printing media may be a part of the processing wheel 10 or cleaning wheel 20, or the identification information may be printed directly onto the processing wheel 10 or cleaning wheel 20 itself by laser printing. The identification information is represented by a one-dimensional code such as a barcode, or a two-dimensional code such as a QR code (registered trademark), but may also be represented by letters, numbers, or symbols. The recording media 19 and 29 may also be electronic media. The electronic media may be RFID tags, etc. RFID tags are media that can read and write information via wireless communication.

[0027] The storage station 400 preferably has a first reader 410. The first reader 410 reads the identification information recorded on the recording media 19 and 29. The first reader 410 is, for example, a barcode reader, a QR code reader, or an RFID reader. By the first reader 410 reading the identification information recorded on the recording media 19, inventory management of the processing wheels 10 can be performed.

[0028] It is preferable that the storage station 400 has a plurality of storage shelves 420. The plurality of storage shelves 420 individually store a plurality of processing wheels 10. The storage shelves 420 may also store cleaning wheels 20. Each storage shelf 420 stores one processing wheel 10 or one cleaning wheel 20. In this case, a first reader 410 may be provided for each storage shelf 420. The type of processing wheel 10 or cleaning wheel 20 stored in each storage shelf 420 can be detected.

[0029] Each storage shelf 420 may be provided with a storage cover 421. The storage cover 421 has, for example, a side wall provided on the upper surface of the storage shelf 420 and a ceiling provided on the upper surface of the side wall. The storage shelf 420 and the storage cover 421 form a space for storing the processing wheel 10 or the cleaning wheel 20. When the recording media 19, 29 are attached to the upper surfaces of the disks 11, 21, the first reader 410 is preferably provided on the lower surface of the ceiling.

[0030] Furthermore, as will be described later, if the storage station 400 has a moving mechanism 430 and the moving mechanism 430 moves a plurality of storage shelves 420, the number of first readers 410 may be less than the number of storage shelves 420, for example, there may be only one. One first reader 410 is provided next to a passage through which the plurality of storage shelves 420 pass, and sequentially reads the identification information recorded on the recording medium 19 or 29 of the processing wheel 10 or cleaning wheel 20 stored in each storage shelf 420.

[0031] The moving mechanism 430 moves the storage rack 420 between, for example, a handover position P1 and a standby position P2 away from the handover position P1. The handover position P1 is the position where the storage rack 420 hands over the processing wheel 10 or cleaning wheel 20 to the maintenance device 200. In this embodiment, there is only one handover position P1, but there may be multiple. In this embodiment, the moving mechanism 430 is a vertical circulation system, but any common system used in mechanical parking systems may be used, such as an elevator system, a pit system, a lifting and traversing system, or a horizontal circulation system.

[0032] The storage station 400 has a fourth control circuit 490. The fourth control circuit 490 receives signals from the third control circuit 300. When the third control circuit 300 receives a replacement command from the first control circuit 190, it performs control to transmit a first signal to the fourth control circuit 490 indicating the type of processing wheel 10 specified in the replacement command. In addition to the type of processing wheel 10 specified in the replacement command, the first signal may also include identification information such as the identification number of the maintenance device 200 that is scheduled to receive the processing wheel 10.

[0033] When the fourth control circuit 490 receives a first signal from the third control circuit 300, it searches for a storage shelf 420 containing a processing wheel 10 of the type specified by the first signal, and controls the storage shelf 420 to move to the handover position P1. The maintenance device 200 receives the desired processing wheel 10 at the preset handover position P1. This reduces wasted time spent searching for the processing wheel 10.

[0034] If there are multiple handover positions P1, the fourth control circuit 490 transmits a second signal to the second control circuit 290 specifying the handover position P1. The second signal may also be transmitted from the fourth control circuit 490 to the second control circuit 290 via the third control circuit 300. The maintenance device 200 receives the machined wheel 10 at the handover position P1 specified by the second signal. This reduces wasted time spent searching for the handover position P1.

[0035] Even if the storage station 400 does not have a moving mechanism 430, if the storage station 400 has a first leader 410, it is preferable that the third control circuit 300 transmits the first signal to the fourth control circuit 490. The fourth control circuit 490 searches for a storage location for the type of processing wheel 10 specified by the first signal and transmits a third signal indicating the found storage location to the second control circuit 290. The third signal may also be transmitted from the fourth control circuit 490 to the second control circuit 290 via the third control circuit 300. The maintenance device 200 receives the desired type of processing wheel 10 at the storage location indicated by the third signal. This reduces wasted time spent searching for the processing wheel 10.

[0036] When the fourth control circuit 490 receives a first signal from the third control circuit 300, it may search for a storage shelf 420 containing a cleaning wheel 20 associated with a processing wheel 10 of the type specified by the first signal, and then move the found storage shelf 420 to the handover position P1. The maintenance device 200 receives the cleaning wheel 20 at the pre-set handover position P1. This reduces wasted time spent searching for the cleaning wheel 20.

[0037] If there are multiple handover positions P1, the fourth control circuit 490 transmits a fourth signal to the second control circuit 290 specifying the handover position P1. The fourth signal may also be transmitted from the fourth control circuit 490 to the second control circuit 290 via the third control circuit 300. The maintenance device 200 receives the cleaning wheel 20 at the handover position P1 specified by the fourth signal. This reduces wasted time spent searching for the handover position P1.

[0038] As shown in Figure 3, the storage station 400 has a support base 440. The support base 440 supports the processing wheel 10 or the cleaning wheel 20. The support base 440 is provided on the upper surface of the storage shelf 420. Preferably, the support base 440 supports the disc 11 so as to form a gap between the upper surface of the storage shelf 420 and the lower surface of the grinding wheel 12. This allows the grinding wheel 12 to be separated from the storage shelf 420, and damage to the grinding wheel 12 can be suppressed.

[0039] As shown in Figures 4 and 5, the machining wheel 10 has a through hole 13 formed in the center of the disc 11 and a notch 14 formed on the wall surface of the through hole 13. The through hole 13 has, for example, a stepped surface 13a, a first hole 13b provided above the stepped surface 13a, and a second hole 13c provided below the stepped surface 13a. The notch 14 is formed on the wall surface of the first hole 13b.

[0040] As shown in Figures 6 and 7, the cleaning wheel 20 has a through hole 23 formed in the center of the disc 21 and a notch 24 formed on the wall surface of the through hole 23. The through hole 23 has, for example, a stepped surface 23a, a first hole 23b provided above the stepped surface 23a, and a second hole 23c provided below the stepped surface 23a. The notch 24 is formed on the wall surface of the first hole 23b.

[0041] Multiple support bases 440 are provided, and each of the multiple support bases 440 supports one processing wheel 10 or one cleaning wheel 20. The multiple support bases 440 are arranged at intervals from each other. Space can be provided between the multiple support bases 440, which helps to reduce weight. Although not shown in the figures, one support base 440 may support one processing wheel 10 or one cleaning wheel 20.

[0042] The support base 440 has a mounting surface 441 on which the discs 11 and 21 are placed. The mounting surface 441 abuts against, for example, the stepped surfaces 13a and 23a of the through holes 13 and 23. The mounting surface 441 is provided horizontally, but may also be provided at an angle. Above the mounting surface 441, a curved surface 442 and a projection 443, which will be described later, are provided.

[0043] As shown in Figures 4 and 6, the support base 440 has a curved surface 442. The curved surface 442 follows the wall surface of the through holes 13 and 23, specifically the wall surface of the first holes 13b and 23b. The curved surface 442 of the support base 440 follows the wall surface of the through holes 13 and 23 of the discs 11 and 21, thereby determining the center position of the discs 11 and 21.

[0044] The support base 440 has a protrusion 443. The protrusion 443 protrudes from the curved surface 442 and is fitted into the cutouts 14 and 24. When the protrusion 443 of the support base 440 is fitted into the cutouts 14 and 24 of the discs 11 and 21, the rotation angles of the discs 11 and 21 are determined.

[0045] The protrusion 443 and the cutout 14 are preferably formed so that the rotation angle of the disc 11 is uniquely determined. Specifically, it is preferably formed non-rotationally symmetric with respect to the center of the disc 11. The number, position, and shape of each of the protrusion 443 and the cutout 14 are set so that the protrusion 443 and the cutout 14 are non-rotationally symmetric with respect to the center of the disc 11. The number of each of the protrusion 443 and the cutout 14 is not limited to two, and may be one or three or more.

[0046] Similarly, the protrusion 443 and the cutout 24 are preferably formed so that the rotation angle of the disc 21 is uniquely determined. Specifically, it is preferably formed non-rotationally symmetric with respect to the center of the disc 21. The number, position, and shape of each of the protrusion 443 and the cutout 24 are set so that the protrusion 443 and the cutout 24 are non-rotationally symmetric with respect to the center of the disc 21. The number of each of the protrusion 443 and the cutout 24 is not limited to two, and may be one or three or more.

[0047] When the center positions and rotation angles of the discs 11 and 21 are determined, the positions of the recording media 19 and 29 are determined. The recording media 19 and 29 are not particularly limited, but are, for example, attached to the upper surface or side surface of the discs 11 and 21. By determining the center positions and rotation angles of the discs 11 and 21, the recording media 19 and 29 can be directed toward the first reader 410. Therefore, the occurrence of a reading error of the identification information recorded on the recording media 19 and 29 can be suppressed.

[0048] In addition, when one first reader 410 is provided next to the passage through which the plurality of storage shelves 420 pass, and the plurality of storage shelves 420 pass next to the first reader 410 in order, it is preferable to determine the center positions and rotation angles of the discs 11 and 21. The recording media 19 and 29 can be directed toward the first reader 410, and the occurrence of a reading error of the identification information recorded on the recording media 19 and 29 can be suppressed.

[0049] An example of the processing apparatus 100 will be described with reference to Figures 8 to 10. In Figure 10, the wall surface of the through hole 13 is shown with a dot pattern. The drive mechanism 110 of the processing apparatus 100 has a flange 112 to which the disc 11 of the processing wheel 10 is attached, and a stopper 113 below the flange 112 that prevents the disc 11 from falling. As shown in Figure 10, when viewed from below, the stopper 113 is smaller than the notch 14 of the disc 11. When the disc 11 is attached to the lower surface of the flange 112, the notch 14 of the disc 11 can pass through the stopper 113. After that, before the disc 11 is fixed to the lower surface of the flange 112, the disc 11 is rotated to a position where, when viewed from below as shown in Figure 10, the notch 14 does not overlap with the stopper 113. This prevents the stopper 113 from falling. From the viewpoint of preventing the processing wheel 10 from falling, it is preferable to provide multiple stoppers 113. Therefore, it is preferable to provide multiple notches 14. The number of notches 14 may be equal to or greater than the number of stoppers 113, and may be greater than the number of stoppers 113.

[0050] As shown in Figures 8 and 9, the processing apparatus 100 may include a holding mechanism 120 and a rotating mechanism 130 in addition to the drive mechanism 110. The holding mechanism 120 includes a chuck for holding the substrate W. The chuck is not particularly limited, but for example, it is a vacuum chuck. The rotating mechanism 130 rotates the holding mechanism 120. The rotating mechanism 130 includes a rotary motor. The rotating mechanism 130 may also include a transmission mechanism that transmits the rotational driving force of the rotary motor to the holding mechanism 120. The transmission mechanism includes a timing belt or gears, etc.

[0051] As shown in Figure 9, the drive mechanism 110 drives the processing wheel 10. The drive mechanism 110 presses the processing wheel 10 against the substrate W and processes the substrate W. In addition to the flange 112, the drive mechanism 110 includes a rotation mechanism 114 for rotating the flange 112 and a lifting mechanism 115 for raising and lowering the flange 112.

[0052] The rotating mechanism 114 includes, for example, a rotating motor 114a and a rotating shaft 114b that is rotated by the rotating motor 114a. A flange 112 is provided at the lower end of the rotating shaft 114b. The lower surface of the flange 112 is a mounting surface 111 to which the processing wheel 10 is attached. The rotating motor 114a rotates the flange 112 and the processing wheel 10 together with the rotating shaft 114b.

[0053] The lifting mechanism 115 includes, for example, a Z-axis guide 115a, a Z-axis slider 115b that moves along the Z-axis guide 115a, and a lifting motor 115c that moves the Z-axis slider 115b. A rotary motor 114a is fixed to the Z-axis slider 115b via a motor holder 116. The lifting mechanism 115 has a ball screw (not shown) that converts the rotational motion of the lifting motor 115c into the linear motion of the Z-axis slider 115b.

[0054] The lifting mechanism 115 lowers the processing wheel 10 from the standby position. The processing wheel 10 rotates as it descends, contacting the upper surface of the substrate W which rotates separately from the processing wheel 10, and grinding the entire upper surface of the substrate W. When the thickness of the substrate W reaches a set value, the lifting mechanism 115 stops the descent of the processing wheel 10. After that, the lifting mechanism 115 raises the processing wheel 10 back to the standby position.

[0055] An example of the maintenance device 200 will be described with reference to Figures 8 and 11 to 16. The maintenance device 200 performs the tasks of attaching the machined wheel 10 to the flange 112 and removing the machined wheel 10 from the flange 112. As shown in Figure 8, the maintenance robot 220 of the maintenance device 200 includes, for example, a first articulated robot 221A and a second articulated robot 221B.

[0056] As shown in Figure 11, the maintenance robot 220 has, for example, an operating mechanism 222 at the tip of the first articulated robot 221A. The operating mechanism 222 operates a bolt 119. The bolt 119 fastens the processing wheel 10 to the flange 112. The operating mechanism 222 loosens or tightens the bolt 119 using, for example, a first tool 223. The operating mechanism 222 has a rotation axis 222a for rotating the first tool 223 and a lifting axis 222b for raising and lowering the first tool 223. The operating mechanism 222 also raises and lowers the bolt 119 using a second tool 224. The operating mechanism 222 has a lifting axis 222c for raising and lowering the second tool 224.

[0057] The maintenance robot 220 may have a second reader 229 at the tip of the first articulated robot 221A. The second reader 229 reads identification information recorded on the recording media 19 and 29. The second reader 229 is, for example, a barcode reader, a QR code reader, or an RFID reader. By reading the identification information recorded on the recording media 19, the type of processing wheel 10 that is scheduled to be installed or has already been removed can be confirmed. Also, by reading the identification information recorded on the recording media 29, the type of cleaning wheel 20 can be confirmed.

[0058] As shown in Figures 12 and 13, the maintenance robot 220 has, for example, a gripper 225 and a rotating mechanism 226 at the tip of the second articulated robot 221B. The gripper 225 is an example of a holder for holding the processing wheel 10 or the cleaning wheel 20. The gripper 225 grips, for example, the walls of the second holes 13c and 23c of the through holes 13 and 23 of the discs 11 and 21. The walls of the second holes 13c and 23c may be tapered surfaces that narrow towards the top. The rotating mechanism 226 rotates the processing wheel 10 or the cleaning wheel 20 together with the gripper 225.

[0059] As shown in Figures 18 and 19, the maintenance robot 220 may have a container 228 as a holder instead of the gripper 225 shown in Figures 12 and 13. The container 228 holds the machining wheel 10 or cleaning wheel 20 from below. The container 228 has, for example, a grooved ring 228a with a receiving groove formed on its upper surface, and a flange 228b formed along the inner circumference of the grooved ring 339a. The grooved ring 228a accommodates the portions of the discs 11 and 21 below the stepped surfaces 13a and 23a inside its receiving groove.

[0060] The container 228 has a first fitting portion 228d. The first fitting portion 228d is provided on the upper surface of the flange 228b and fits with the second fitting portions 13d and 23d. The second fitting portions 13d and 23d are provided on the stepped surfaces 13a and 23a of the discs 11 and 21. The first fitting portion 228d is a pin, and the second fitting portions 13d and 23d are pin holes. However, the first fitting portion 228d may be a pin hole and the second fitting portions 13d and 23d may be pins. The fitting of the first fitting portion 228d and the second fitting portions 13d and 23d restricts the rotation of the processing wheel 10 or cleaning wheel 20 relative to the container 228. The rotation mechanism 226 shown in Figures 12 and 13 can rotate the processing wheel 10 or cleaning wheel 20 together with the container 228.

[0061] The second control circuit 290 controls the rotation of the cleaning wheel 20 while pressing it against the mounting surface 111. This allows the cleaning wheel to suck up the dirty water adhering to the mounting surface 111 and also scrape off any solid particles of dirty water that have adhered to the mounting surface 111. The force with which the cleaning wheel 20 is pressed against the mounting surface 111 can be detected by a force sensor 227 attached to the second articulated robot 221B.

[0062] The second control circuit 290 controls the cleaning wheel 20 to wipe the mounting surface 111 of the drive mechanism 110 while rotating the cleaning wheel 20 together with a holder such as a gripper 225 or a container 228 using the rotating mechanism 226 shown in Figures 12 and 13. Alternatively, instead of rotating the cleaning wheel 20 with the rotating mechanism 226, the mounting surface 111 of the drive mechanism 110 may be rotated using the rotating mechanism 114 shown in Figure 8. The second control circuit 290 may also control the cleaning wheel 20 to wipe the mounting surface 111 of the drive mechanism 110 by transmitting a command to the first control circuit 190 to rotate the mounting surface 111 of the drive mechanism 110 using the rotating mechanism 114. The first control circuit 190 controls the rotation of the mounting surface 111 of the drive mechanism 110 using the rotating mechanism 114 in accordance with the command from the second control circuit 290. The second control circuit 290 may directly transmit a command to the first control circuit 190 to rotate the mounting surface 111 of the drive mechanism 110 using the rotating mechanism 114, or it may transmit the command to the first control circuit 190 via the third control circuit 300.

[0063] The cleaning wheel 20 has a fiber layer 22 that contacts the mounting surface 111 of the drive mechanism 110. The fiber layer 22 is not particularly limited as long as it can absorb dirty water, and may be a nonwoven fabric or a woven fabric. The fiber layer 22 preferably contains resin fibers. The resin fibers are not particularly limited, but may be nylon fibers or polyester fibers, for example.

[0064] The cleaning wheel 20 has a disc 21 that supports a fiber layer 22. The fiber layer 22 is attached, for example, to the upper surface of the disc 21. Preferably, the cleaning wheel 20 has a detachable part 25 for attaching and detaching the fiber layer 22 to and from the disc 21. The detachable part 25 is not particularly limited, but may include, for example, a hook-and-loop fastener.

[0065] The detachable part 25 is not required. The fiber layer 22 can be reused by washing it.

[0066] As shown in Figure 14, the transport robot 210 has a third reader 219. The third reader 219 reads identification information recorded on the recording media 19 and 29. The third reader 219 is, for example, a barcode reader, a QR code reader, or an RFID reader. By reading the identification information recorded on the recording media 19, the type of processing wheel 10 that is scheduled to be installed or has already been removed can be confirmed. Also, by reading the identification information recorded on the recording media 29, the type of cleaning wheel 20 can be confirmed.

[0067] The transport robot 210 has a storage compartment 211. The storage compartment 211 stores the processing wheel 10 or the cleaning wheel 20. The transport robot 210 also has storage shelves 212A, 212B, and 212C. The storage shelves 212A, 212B, and 212C are housed inside the storage compartment 211. The storage shelves 212A, 212B, and 212C hold the processing wheel 10 or the cleaning wheel 20.

[0068] The second control circuit 290 controls the maintenance robot 220 to move the processing wheel 10 between a position where it is attached to the mounting surface 111 of the drive mechanism 110 and a position where it is placed on the storage shelves 212A and 212C. The second control circuit 290 also controls the maintenance robot 220 to move the cleaning wheel 20 between a position where it wipes the mounting surface 111 of the drive mechanism 110 and a position where it is placed on the storage shelf 212B.

[0069] As shown in Figure 14, storage shelves 212A, 212B, and 212C are arranged in this order from top to bottom. The upper storage shelf 212A holds the machining wheel 10 that is to be attached to the drive mechanism 110. The middle storage shelf 212B holds the cleaning wheel 20. The lower storage shelf 212C holds the machining wheel 10 that has been removed from the drive mechanism 110. The thickness of the grinding wheel 12 of the machining wheel 10 to be attached is greater than the thickness of the grinding wheel of the removed machining wheel 10.

[0070] The cleaning wheel 20 and the removed processing wheel 10 may be contaminated with wastewater containing processing debris. To prevent wastewater from dripping onto the processing wheel 10 to be installed inside the storage compartment 211, it is preferable to position the processing wheel 10 to be installed above the cleaning wheel 20 and the removed processing wheel 10.

[0071] In particular, the removed processing wheel 10 is highly likely to be contaminated with wastewater containing processing debris. It is preferable to position the cleaning wheel 20 above the removed processing wheel 10 so that the wastewater does not drip onto the cleaning wheel 20 inside the storage compartment 211.

[0072] The transport robot 210 has a support base 230. The support base 230 supports the processing wheel 10 or the cleaning wheel 20. The support base 230 is provided on the upper surface of the storage shelves 212A, 212B, and 212C. Preferably, the support base 230 supports the disc 11 such that a gap is formed between the upper surface of the storage shelves 212A, 212C and the lower surface of the grinding wheel 12. This allows the grinding wheel 12 to be separated from the storage shelves 212A, 212C, and damage to the grinding wheel 12 can be suppressed.

[0073] Multiple support bases 230 are provided, and each of the multiple support bases 230 supports one processing wheel 10 or one cleaning wheel 20. The multiple support bases 230 are arranged at intervals from each other. Space can be provided between the multiple support bases 230, which helps to reduce weight. Although not shown in the figures, one support base 230 may support one processing wheel 10 or one cleaning wheel 20.

[0074] As shown in Figure 15, the support base 230 has a mounting surface 231 on which the discs 11 and 21 are placed. The mounting surface 231 abuts against, for example, the stepped surfaces 13a and 23a of the through holes 13 and 23. The mounting surface 231 is provided horizontally, but may also be provided at an angle. Above the mounting surface 231, a curved surface 232 and a projection 233, which will be described later, are provided.

[0075] As shown in Figures 16 and 17, the support base 230 has a curved surface 232. The curved surface 232 follows the walls of the through holes 13 and 23, specifically the walls of the first holes 13b and 23b. The curved surface 232 of the support base 230 follows the walls of the through holes 13 and 23 of the discs 11 and 21, thereby determining the center positions of the discs 11 and 21.

[0076] The support base 230 has projections 233. The projections 233 protrude from the curved surface 232 and fit into notches 14 and 24. The rotation angles of the discs 11 and 21 are determined when the projections 233 of the support base 230 fit into the notches 14 and 24 of the discs 11 and 21.

[0077] The projections 233 and notches 14 are preferably formed such that the rotation angle of the disk 11 is uniquely determined, and more specifically, they are preferably formed asymmetrically with respect to the center of the disk 11. The number, position, and shape of the projections 233 and notches 14 are set so that they are asymmetrically formed with respect to the center of the disk 11. The number of projections 233 and notches 14 is not limited to two, and may be one or three or more.

[0078] Similarly, the projections 233 and notches 24 are preferably formed such that the rotation angle of the disk 21 is uniquely determined, and more specifically, they are preferably formed as rotationally symmetric with respect to the center of the disk 21. The number, position, and shape of the projections 233 and notches 24 are set so that they are as rotationally symmetric with respect to the center of the disk 21. The number of projections 233 and notches 24 is not limited to two, and may be one or three or more.

[0079] The positions of the recording media 19 and 29 are determined by determining the center positions and rotation angles of the disks 11 and 21. The recording media 19 and 29 are not particularly limited, but for example, they are attached to the upper surfaces of the disks 11 and 21. By determining the center positions and rotation angles of the disks 11 and 21, the recording media 19 and 29 can be directed toward the third reader 219. Therefore, the occurrence of reading errors of the identification information recorded on the recording media 19 and 29 can be suppressed.

[0080] The transport robot 210 preferably has a sliding mechanism 240. The sliding mechanism 240 is provided for each storage shelf 212A, 212B, and 212C, and moves each storage shelf 212A, 212B, and 212C individually between a storage position P3 and a handover position P4. The storage position P3 is the position where the processing wheel 10 or cleaning wheel 20 is stored inside the storage compartment 211. The handover position P4 is the position where the processing wheel 10 or cleaning wheel 20 is handed over to the maintenance robot 220 outside the storage compartment 211.

[0081] The above describes the maintenance device, processing system, and control method for the maintenance device related to this disclosure, but this disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These also naturally fall within the technical scope of this disclosure.

[0082] This application claims priority based on Japanese Patent Application No. 2025-008678, filed with the Japan Patent Office on January 21, 2025, and the entire contents of Japanese Patent Application No. 2025-008678 are incorporated herein by reference.

[0083] 10 Machining wheel 20 Cleaning wheel 100 Machining device 110 Drive mechanism 111 Mounting surface 200 Maintenance device 225 Gripper 226 Rotation mechanism

Claims

1. A maintenance device for performing maintenance on a processing apparatus having a drive mechanism to which a processing wheel used for grinding or polishing is attached, the maintenance device comprising a holder for holding a cleaning wheel for wiping the mounting surface of the drive mechanism to which the processing wheel is attached.

2. The maintenance device according to claim 1, wherein the holder is a gripper that grips the cleaning wheel, and the maintenance device has a rotating mechanism for rotating the gripper.

3. The maintenance device according to claim 1, comprising a control circuit, wherein the control circuit controls wiping the mounting surface of the drive mechanism with the cleaning wheel after removing the processing wheel from the drive mechanism and before attaching another processing wheel to the drive mechanism.

4. The maintenance device according to claim 1, comprising: a second articulated robot having the holder provided at its tip; a storage compartment for storing the cleaning wheel; a storage shelf housed inside the storage compartment; and a control circuit, wherein the control circuit controls the movement of the cleaning wheel between a position for wiping the mounting surface of the drive mechanism and a position for placing it on the storage shelf.

5. The maintenance device according to claim 4, wherein the holder is a gripper for gripping the cleaning wheel, the maintenance device has a rotating mechanism for rotating the gripper, and the gripper and the rotating mechanism are provided at the tip of the second articulated robot.

6. The maintenance device according to claim 4, wherein the control circuit controls the movement of the processing wheel between a position on which it is mounted on the mounting surface of the drive mechanism and a position on which it is placed on the storage shelf.

7. The maintenance device according to claim 4, comprising, in this order from top to bottom, a storage shelf for placing the processing wheel to be attached to the drive mechanism, a storage shelf for placing the cleaning wheel, and a storage shelf for placing the processing wheel that has been removed from the drive mechanism.

8. The maintenance device according to claim 1, wherein the cleaning wheel comprises a fiber layer that contacts the mounting surface of the drive mechanism and a disc that supports the fiber layer.

9. The maintenance device according to claim 8, wherein the cleaning wheel has a detachment portion for attaching and detaching the fiber layer to and from the disc.

10. The maintenance device according to claim 1, comprising: an operating mechanism for operating bolts that fasten the processing wheel to the drive mechanism; and a first articulated robot with the operating mechanism provided at its tip.

11. The maintenance device according to any one of claims 1 to 10, further comprising a transport robot that travels along a travel path set around the processing device and transports the cleaning wheel.

12. A processing system comprising a maintenance device according to claim 11, a processing device, and a storage station adjacent to the travel path for storing the cleaning wheel, wherein the maintenance device has a control circuit, and the control circuit of the maintenance device controls the receiving of the cleaning wheel from the storage station and its transport toward the processing device.

13. A method for controlling a maintenance device for maintaining a machining apparatus having a drive mechanism to which a machining wheel used for grinding or polishing is attached, wherein the maintenance device comprises a holder for holding a cleaning wheel for wiping the mounting surface of the drive mechanism to which the machining wheel is attached, and a control circuit, and the control circuit controls the cleaning wheel to wipe the mounting surface of the drive mechanism after the machining wheel has been removed from the drive mechanism and before another machining wheel has been attached to the drive mechanism.

14. The maintenance device having a rotating mechanism for rotating the holder, and the control circuit controlling the cleaning wheel to wipe the mounting surface of the drive mechanism with the cleaning wheel while the cleaning wheel rotates the cleaning wheel together with the holder by the rotating mechanism, according to claim 13.

15. The maintenance device comprises a second articulated robot having the holder provided at its tip, a storage compartment for storing the cleaning wheel, and a storage shelf stored inside the storage compartment, wherein the control circuit controls the movement of the cleaning wheel between a position for wiping the mounting surface of the drive mechanism and a position for placing it on the storage shelf, the method for controlling the maintenance device according to claim 13.

16. The control method for a maintenance device according to claim 15, wherein the control circuit controls the movement of the processing wheel between a position on which it is mounted on the mounting surface of the drive mechanism and a position on which it is placed on the storage shelf.

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