Substrate processing method and substrate processing device

Abstract

A substrate processing method according to the present invention comprises: a step for preparing a substrate (91) which has a front surface (911) and a rear surface (912) and in which a covering object (93) is laminated on the front surface (911); a step for interposing a processing liquid (92) between the rear surface (912) and a vibration generation unit (81) in a state in which the rear surface (912) and the vibration generation unit (81) face each other; and a step for peeling the covering object (93) from the front surface (911) by generating vibrations from the vibration generation unit (81). Due to such a configuration, damage to the surface of the substrate can be suppressed while achieving appropriate lift-off processing.

Description

Substrate processing method and substrate processing apparatus

[0001] The present invention relates to a substrate processing method and a substrate processing apparatus.

[0002] Various substrate processing apparatuses for performing predetermined processing on various substrates such as semiconductor wafers have been proposed. Patent Document 1 discloses an example of a conventional substrate processing apparatus. The substrate processing apparatus disclosed in this document is an apparatus that performs a lift-off process for collectively peeling a resist layer formed on the surface of a substrate and a metal layer laminated on this resist layer. In the lift-off process disclosed in this document, a technique of applying ultrasonic waves from an ultrasonic wave generating unit of an ultrasonic wave generator to a substrate immersed in a processing liquid is adopted.

[0003] Japanese Patent Application Laid-Open No. 2011-103361

[0004] In the configuration disclosed in this document, ultrasonic waves are applied in a state where an ultrasonic wave generating unit faces the surface of the substrate. A part of the metal layer peeled from the substrate may become a metal piece and float between the substrate and the ultrasonic wave generating unit. If ultrasonic waves directly act on this floating metal piece, there is a risk of damaging the metal layer remaining on the surface of the substrate and forming wirings or the like.

[0005] The present invention has been conceived under the above circumstances, and an object thereof is to provide a substrate processing method and a substrate processing apparatus capable of suppressing damage to the surface of a substrate while realizing an appropriate lift-off process.

[0006] The substrate processing method provided by the first aspect of the present invention includes a step of preparing a substrate having a front surface and a back surface and having a coating laminated on the front surface, a step of interposing a liquid between the back surface and a vibration generating unit in a state where the back surface and the vibration generating unit face each other, and a step of peeling the coating from the front surface by generating vibration from the vibration generating unit.

[0007] In a preferred embodiment of the present invention, in the step of interposing the liquid, at least a part of the substrate and the vibration generating unit is immersed in the liquid.

[0008] In a preferred embodiment of the present invention, in the step of peeling the coating from the surface, the surface faces vertically downward and the vibration generating portion is positioned vertically upward with respect to the back surface.

[0009] In a preferred embodiment of the present invention, the substrate is supported such that the support surface abuts against the peripheral edge of the substrate and the surface and the support surface are separated.

[0010] A substrate processing apparatus provided by a first aspect of the present invention is a substrate processing apparatus that processes a substrate having a front surface and a back surface, wherein a coating is laminated on the front surface, and peels the coating from the front surface, comprising a substrate support and a vibration generating unit, wherein the back surface of the substrate supported by the substrate support and the vibration generating unit are facing each other, and a liquid is interposed between the back surface and the vibration generating unit, and vibration is generated from the vibration generating unit to peel the coating from the front surface.

[0011] In a preferred embodiment of the present invention, a cup for storing the liquid is further provided, and vibration is generated from the vibration generating unit while the substrate supported by the substrate support and at least a part of the vibration generating unit are immersed in the liquid stored in the cup.

[0012] In a preferred embodiment of the present invention, the substrate support portion supports the substrate in a position where the surface faces vertically downward, and the vibration generating portion is located vertically above the back surface.

[0013] In a preferred embodiment of the present invention, the substrate support portion has a support surface that supports the substrate in a state that abuts against the peripheral edge of the substrate and is separated from the surface.

[0014] According to the present invention, it is possible to suppress damage to the substrate surface while achieving appropriate lift-off processing.

[0015] Other features and advantages of the present invention will become more apparent from the detailed description below with reference to the accompanying drawings.

[0016] This is a schematic cross-sectional view showing a substrate processing apparatus according to the first embodiment of the present invention. This is a schematic plan view showing a substrate processing apparatus according to the first embodiment of the present invention. This is a partially enlarged schematic cross-sectional view showing a substrate processing apparatus according to the first embodiment of the present invention. This is a flowchart showing an example of operation of the substrate processing apparatus according to the first embodiment of the present invention. This is a partially enlarged cross-sectional view showing a substrate processing method using during lift-off processing (when the coating is peeled off) according to the first embodiment of the present invention. This is a partially enlarged schematic cross-sectional view showing a first modified example of the substrate processing apparatus according to the first embodiment of the present invention. This is a partially enlarged cross-sectional view showing a substrate processing method using the substrate processing apparatus during lift-off processing (when the coating is peeled off) according to the second embodiment of the present invention. This is a partially enlarged cross-sectional view showing a substrate processing method using the substrate processing apparatus during lift-off processing (when the coating is peeled off) according to the third embodiment of the present invention.

[0017] Preferred embodiments of the present invention will be described in detail below with reference to the drawings.

[0018] First Embodiment: Figures 1 to 3 show an ultrasonic generator according to the first embodiment of the present invention. The substrate processing apparatus A1 of this embodiment comprises a cup 1, a stage 2, a drive unit 3, a substrate support unit 4, a drainage chamber 6, and a vibration generator 8. As shown in Figure 6, the substrate processing apparatus A1 performs a lift-off process to remove a coating 93 formed on the surface 911 of the substrate 91. Note that the substrate processing apparatus A1 is not limited to a configuration that only performs the lift-off process, and may further perform a process in which the substrate 91 is submerged in a processing liquid 92 stored in the cup 1 for a long period of time to dissolve the resist layer by swelling it. In this way, the ultrasonic irradiation time (vibration time) can be shortened and the impact on the substrate can be minimized.

[0019] Figure 1 is a schematic cross-sectional view showing the substrate processing apparatus A1. Figure 2 is a schematic plan view showing the substrate processing apparatus A1. Figure 3 is a partially enlarged schematic cross-sectional view showing the substrate processing apparatus A1. In these figures, the circumferential direction θ is the circumferential direction centered on the lifting shaft 31 which extends in the vertical direction z described later, and the radial direction r is the radial direction centered on the lifting shaft 31.

[0020] Cup 1: Cup 1 is capable of storing processing liquid 92 for processing the substrate 91. The shape and material of cup 1 are not limited in any way. In the illustrated example, cup 1 is circular when viewed in the vertical direction z. Also, cup 1 is made of a metal such as stainless steel. As shown in Figures 1 and 2, cup 1 of this embodiment has an upper end portion 11, a side portion 12, and a bottom portion 13. Note that the cup 1 capable of storing processing liquid 92 is not limited to being used for purposes such as storing a fixed amount of processing liquid 92 over a predetermined period of time, but also includes the concept of being used in purposes such as when processing liquid 92 is constantly supplied to cup 1 during a predetermined process, and the processing liquid 92 is temporarily retained in cup 1 before being sequentially discharged.

[0021] The upper end portion 11 is the part of the cup 1 located at the upper end in the vertical direction z. The specific shape of the upper end portion 11 is not limited in any way, and in the illustrated example, it is an annular plate-like portion. The side portion 12 is the part of the cup 1 located radially outward r. The height of the side portion 12 in the vertical direction z is set to a height that can accommodate the stage 2, the drive unit 3, and the substrate support unit 4. The height of the side portion 12 in the vertical direction z is also set to a height that can maintain the liquid level of the processing liquid 92 at a predetermined height relative to the substrate 91. In the illustrated example, the side portion 12 is a tapered inclined portion in which the radial dimension r decreases from the top to the bottom in the vertical direction z. The side portion 12 is annular in shape when viewed along the vertical direction z. The inclination angle of the side portion 12 is not limited in any way, and for example, it is an angle of about 30° to 75° with respect to the horizontal plane (the plane that includes the radial direction r and the circumferential direction θ), and in the illustrated example, it is an angle of about 60° with respect to the horizontal plane.

[0022] The bottom portion 13 is connected to the side portion 12 below in the vertical direction z. The shape of the bottom portion 13 is not limited in any way, and in the illustrated example it is circular. The entire bottom portion 13 is contained within the upper end portion 11 when viewed along the vertical direction z. An opening is provided in the center of the bottom portion 13 for inserting the lifting shaft 31, which will be described later.

[0023] Stage 2: Stage 2 is movable vertically z within the cup 1 and supports the substrate support portion 4. The specific configuration of Stage 2 is not limited in any way, and in the illustrated example, it has a base 21 and a disc portion 22.

[0024] The base 21 is a part fixed to the upper end of the lifting shaft 31, which will be described later. The base 21 is made of a metal such as stainless steel or resin. The disc portion 22 is fixed to the base 21 and extends radially r from the base 21. The disc portion 22 is a circular plate-shaped part when viewed along the vertical direction z. The disc portion 22 is made of a metal such as stainless steel.

[0025] Drive Unit 3: The drive unit 3 has a driving function for raising, lowering, and rotating the stage 2. The specific configuration of the drive unit 3 is not limited in any way, and in this embodiment it has a lifting shaft 31, a support part 32, a bellows member 33, a lifting drive mechanism 34, and a rotation drive mechanism 35.

[0026] The lifting shaft 31 has its upper end fixed to the base 21 of the stage 2 and is the shaft for raising and lowering the stage 2 along the vertical direction z. The lifting shaft 31 extends downward in the vertical direction z through the opening in the bottom surface 13 of the cup 1.

[0027] The support portion 32 is attached to the opening in the bottom portion 13 of the cup 1. The lifting shaft 31 is inserted inside the support portion 32. When the support portion 32 is rotated around the lifting shaft 31, the cup 1 and the stage 2 rotate together. The bellows member 33 also rotates together with the cup 1 and the stage 2. Alternatively, the lifting shaft 31 may rotate together with the cup 1 and the stage 2. Depending on the specific configuration of the drive unit 3, the cup 1 and the stage 2 may be configured to rotate independently.

[0028] The bellows member 33 is a bellows-structured member that can expand and contract in the vertical direction z. The material of the bellows member 33 is not limited and can be made of metal such as stainless steel or resin. The upper end of the bellows member 33 is attached to the base 21 of the stage 2 and the lower end is attached to the support part 32. The inside and outside of the bellows member 33 are airtightly separated between the base 21 and the support part 32.

[0029] The lifting drive mechanism 34 is a drive mechanism that raises and lowers the lifting shaft 31. The specific configuration of the lifting drive mechanism 34 is not limited in any way, and a motor, cylinder, etc. can be used as appropriate. In the illustrated example, the lifting drive mechanism 34 is connected to the lower end of the lifting shaft 31, but the position in which the lifting drive mechanism 34 is installed is not limited in any way.

[0030] The rotation drive mechanism 35 is a drive mechanism that rotates the cup 1 and the stage 2 around the lifting shaft 31. The specific configuration of the rotation drive mechanism 35 is not limited in any way, and a motor, gears, etc. can be used as appropriate. In the illustrated example, the rotation drive mechanism 35 is configured to rotate the cup 1 and the stage 2 via the support part 32, but the configuration of the rotation drive mechanism 35 is not limited in any way. For example, it may be configured to rotate the cup 1 directly.

[0031] Substrate support section 4: The substrate support section 4 is provided on the stage 2 and supports the substrate 91. The specific configuration of the substrate support section 4 is not limited in any way, and in the illustrated example, it is composed of multiple blocks. The multiple blocks are fixed on the disc portion 22 of the stage 2 and are arranged at equal pitches along the circumferential direction θ. In the illustrated example, four blocks are arranged at a 90° pitch, but this is just one example, and the number of blocks and the size of the pitch are not limited in any way. The material of the substrate support section 4 is preferably one that can properly support the substrate 91 without causing unwanted reactions or damage to the substrate 91, such as resin.

[0032] In this example, as shown in Figure 3, each block of the substrate support section 4 has a support surface 41. That is, the substrate support section 4 has multiple support surfaces 41. The specific shape of each support surface 41 is not limited in any way, and in the illustrated example, it is a horizontal plane. The multiple support surfaces 41 support the substrate 91 by contacting a part of the surface 911.

[0033] Drainage chamber 6: The drainage chamber 6 is where the processed liquid 92 is discharged from the cup 1 after processing. The specific configuration of the drainage chamber 6 is not limited in any way. Furthermore, the substrate processing apparatus according to the present invention may not have a structure such as the drainage chamber 6 for receiving the processed liquid 92 discharged from the cup 1.

[0034] Vibration Generator 8: The vibration generator 8 is a device that generates vibrations to act on the substrate 91 during the lift-off process. The specific frequency and other characteristics of the vibrations generated by the vibration generator 8 are not limited in any way. In this example, the vibration generator 8 is configured to generate ultrasonic waves. The specific configuration of the vibration generator 8 is not limited in any way, and in this embodiment, it has a vibration generating unit 81, a power supply unit 82, and a position adjustment unit 85.

[0035] The vibration generating unit 81 is the part that generates vibrations that act on the substrate 91. In this example, ultrasonic waves are generated from the vibration generating unit 81. The specific configuration of the vibration generating unit 81 is not limited in any way. One example of a vibration generating unit 81 is a configuration in which a piezoelectric element 811 is built into a metal rod-shaped member. Other configurations of the vibration generating unit 81 include, for example, one that incorporates a Langevin-type ultrasonic element, an ultrasonic diaphragm, etc., as a vibration source.

[0036] The power supply unit 82 supplies power to the piezoelectric element 811 to generate ultrasonic waves, for example. The power supply unit 82 supplies AC power (AC voltage and AC current) to the piezoelectric element 811, for example. The power supply unit 82 also has a function to adjust the output of the AC power so that ultrasonic waves are generated from the piezoelectric element 811 in a predetermined state. The vibration generating unit 81 and the power supply unit 82 are connected via a cable.

[0037] The position adjustment unit 85 adjusts the position of the vibration generating unit 81. In this embodiment, it adjusts the depth in the vertical z direction of the vibration generating unit 81, the portion of which including the lower end in the vertical z direction is immersed in the processing liquid 92. The specific configuration of the position adjustment unit 85 is not limited in any way, and in this embodiment, it has a linear motion mechanism 851, a rocking mechanism 852, a rocking arm 853, and a control unit 854.

[0038] As shown in Figure 3, the linear motion mechanism 851 supports the vibration generating unit 81 and is a drive mechanism that raises and lowers the vibration generating unit 81 in the vertical direction z. For example, a linear actuator can be used as the linear motion mechanism 851.

[0039] As shown in Figure 2, the oscillating mechanism 852 is a drive mechanism that oscillates the vibration generating unit 81 around an axis extending in the vertical direction z. The specific configuration of the oscillating mechanism 852 is not limited in any way, and for example, an electric motor can be used. In this embodiment, the vibration generating unit 81 is supported by the oscillating mechanism 852 via an oscillating arm 853. Driven by the oscillating mechanism 852, the oscillating arm 853 oscillates as shown in the figure. The oscillation angle α at this time is set, for example, so that the vibration generating unit 81 reaches from the center of the substrate 91 to the outer edge of the substrate 91 when viewed in the vertical direction z.

[0040] The control unit 854 controls the depth in the vertical direction z and the oscillation angle α in the circumferential direction θ of the vibration generating unit 81 by driving and controlling the linear motion mechanism 851 and the oscillation mechanism 852. The specific configuration of the control unit 854 is not limited in any way and may include, for example, a CPU and various interfaces.

[0041] Next, the substrate processing method according to this embodiment using the substrate processing apparatus A1 will be described below.

[0042] Figure 4 is a flowchart showing a substrate processing method according to this embodiment. This substrate processing method includes the steps of preparing a substrate 91, interposing a liquid, and peeling off a coating 93.

[0043] In the step of preparing the substrate 91, a substrate 91 having a front surface 911 and a back surface 912 facing opposite to each other in the thickness direction is used. The material of the substrate 91 is not limited in any way and is, for example, a semiconductor material such as Si or SiC. A coating 93 is formed on the front surface 911. The specific configuration of the coating 93 is not limited in any way and in this example includes a resist film 931 formed on the front surface 911 and a metal film 932 laminated on the resist film 931. The resist film 931 is made of resin or the like. The resist film 931 is patterned so as to be able to form wiring patterns or the like formed on the front surface 911, and partially exposes the front surface 911. The metal film 932 is formed so as to cover most of the resist film 931 and the front surface 911 and is formed, for example, by sputtering or CVD. Note that it is preferable that the metal film 932 is not formed on the portion of the front surface 911 that abuts on the support surface 41.

[0044] Next, in the step of interposing a liquid, with the back surface 912 of the substrate 91 and the vibration generating unit 81 facing each other, a processing liquid 92 as a liquid is interposed between the back surface 912 and the vibration generating unit 81. The specific method of the step of interposing a liquid is not limited in any way. A configuration in which at least a part of the substrate 91 and the vibration generating unit 81 are immersed in the processing liquid 92 may be used, or a configuration in which a liquid layer (liquid film) exists between the back surface 912 and the vibration generating unit 81 may be used. In this example, the step of interposing a liquid includes the step of immersing the substrate 91 and the step of immersing the vibration generating unit 81.

[0045] In the step of immersing the substrate 91, for example, the substrate 91 is supported by the substrate support portion 4. In this example, the substrate 91 is supported by the substrate support portion 4 in a posture in which the front surface 911 faces downward in the vertical direction z and the back surface 912 faces upward in the vertical direction z. Specifically, a part near the peripheral edge 913 of the substrate 91 is brought into contact with a plurality of support surfaces 41. Next, the processing liquid 92 is stored in the substrate 91. The processing liquid 92 is, for example, an insoluble liquid that is not soluble in the resist film 931. Examples of the insoluble liquid include pure water. The injection amount of the processing liquid 92 is set to an amount such that the substrate 91 placed on the substrate support portion 4 is sufficiently immersed in the processing liquid 92. As a result, as shown in FIG. 5A, the substrate 91 is immersed in the processing liquid 92.

[0046] In the step of immersing the vibration generating unit 81, a part including the lower end of the vibration generating unit 81 is immersed in the processing liquid 92 stored in the cup 1. At this time, for example, the vibration generating unit 81 is lowered from above to below in the vertical direction z by the linear motion mechanism unit 851. Thereby, at least a part including the lower end of the vibration generating unit 81 is immersed in the processing liquid 92. At this time, the vibration generating unit 81 is located above the back surface 912 in the vertical direction z. Thereby, as shown in FIG. 5B, with the back surface 912 and the vibration generating unit 81 facing each other, the processing liquid 92 is interposed between the back surface 912 and the vibration generating unit 81.

[0047] Next, as shown in FIG. 6, by generating vibration (ultrasonic wave) from the vibration generating unit 81, the coating 93 is peeled off from the surface 911. The peeling of the coating 93 is not limited to the process of peeling off all of the coating 93, and includes the process of peeling off a desired part of the coating 93. In this example, the resist film 931 among the coatings 93 is peeled off from the surface 911. Thereby, the portion of the metal film 932 laminated on the resist film 931 is peeled off together with the resist film 931. On the other hand, the portion of the metal film 932 directly formed on the surface 911 remains on the surface 911. This remaining metal film 932 constitutes a wiring pattern or the like.

[0048] The principle by which the vibration from the vibration generating unit 81 peels off the coating 93 is not limited in any way. For example, when ultrasonic waves are generated from the vibration generating unit 81, the coating 93 may be peeled off due to pressure fluctuations and temperature changes caused by cavitation in the processing liquid 92. Alternatively, the coating 93 may be peeled off due to the vibration of the substrate 91 caused by the vibration from the vibration generating unit 81.

[0049] Next, the operations of the substrate processing apparatus A1 and the substrate processing method according to the present embodiment will be described.

[0050] According to this embodiment, as shown in Figure 6, the back surface 912 and the vibration generating unit 81 face each other, and with the processing liquid 92 interposed between the back surface 912 and the vibration generating unit 81, vibration is generated from the vibration generating unit 81 to peel off the coating 93. Therefore, the vibration from the vibration generating unit 81 does not directly act on the surface 911. This makes it possible to reduce, for example, the vibration (ultrasound) directly acting on a part of the metal film 932 that floats in the processing liquid 92 after peeling off from the surface 911, and damage to the metal film 932 remaining on the surface 911 by this part of the metal film 932. Thus, it is possible to suppress damage to the surface 911 of the substrate 91 while achieving appropriate lift-off processing.

[0051] Furthermore, even if the vibration generating unit 81 is brought closer to the substrate 91 or the vibration level generated from the vibration generating unit 81 is increased in order to perform the peeling of the coating 93 under more favorable conditions, damage to the surface 911 can be suppressed because the vibration generating unit 81 is located on the opposite side from the surface 911. Therefore, it is possible to apply vibrations (ultrasonic waves) at a higher level than the vibration level described in Patent Document 1, etc., at a closer distance than the distance between the vibration generating unit 81 and the substrate 91 in the lift-off process described in Patent Document 1, etc. In this embodiment, it is possible to apply vibration levels that are, for example, 2 to 5 times the conventional vibration level (input power), and the distance between the vibration generating unit 81 and the substrate 91 (back surface 912) can be reduced to, for example, 0.1 mm to 5 mm. In this way, even when the vibration generating unit 81 is brought closer to the substrate 91, it is expected that problems such as damage to the metal film 932 can be suppressed compared to when the vibration generating unit 81 is facing the surface 911.

[0052] By generating vibrations from the vibration generating unit 81 while the substrate 91 is immersed, it is possible to more reliably interpose the processing liquid 92 between the back surface 912 and the vibration generating unit 81. This allows the vibrations from the vibration generating unit 81 to act more effectively on the coating 93. Furthermore, because the surface 911 is immersed in the processing liquid 92, the peeled resist film 931 and metal film 932 float in the processing liquid 92 and can be removed from the surface 911 more quickly.

[0053] As shown in Figure 6, in this embodiment, vibration is generated from the vibration generating unit 81 with 911 facing downward in the vertical direction z and the vibration generating unit 81 positioned above the vertical direction z relative to the back surface 912. As a result, the coating 93 that has peeled off from the surface 911 sinks downward in the vertical direction z due to gravity. Therefore, it is possible to avoid unintended problems such as damage caused by a part of the coating 93 that has peeled off from the surface 911 reattaching to the surface 911. Furthermore, the configuration in which the vibration generating unit 81 is positioned above the vertical direction z relative to the back surface 912 is suitable for avoiding complexity in the device configuration of the substrate processing apparatus A1.

[0054] Figures 7 to 9 show modified examples and other embodiments of the present invention. In these figures, elements identical or similar to those in the above embodiments are denoted by the same reference numerals. Furthermore, the configurations of the parts in each modified example and each embodiment can be appropriately combined with each other to the extent that no technical inconsistencies arise.

[0055] First Embodiment, First Modification: Figure 7 shows a first modification of the substrate processing apparatus A1. In this modification, the substrate processing apparatus A11 has a different configuration of the support surface 41 compared to the substrate processing apparatus A1 described above.

[0056] The support surface 41 is inclined with respect to the vertical direction z. The support surface 41 is inclined such that it is positioned higher in the vertical direction z as it moves outward in the radial direction r. In this modified example, the substrate support portion 4 supports the substrate 91 by having multiple support surfaces 41 abut against the peripheral edge 913 of the substrate 91. That is, in this modified example, the peripheral edge 913 and the support surface 41 are in contact, and the surface 911 and the support surface 41 are separated, forming a support structure. The peripheral edge 913 and the support surface 41 are in line contact or point contact.

[0057] This modified configuration also makes it possible to suppress damage to the surface 911 of the substrate 91 while achieving appropriate lift-off processing. Furthermore, because the surface 911 is separated from the support surface 41, even if the coating 93 is formed in a region that reaches the peripheral edge 913 of the substrate 91, it is possible to avoid improper contact of the metal film 932, etc., with the support surface 41. Therefore, it is possible to form the coating 93 over a wider area of ​​the substrate 91, thereby increasing the yield of semiconductor devices and the like manufactured from the substrate 91.

[0058] The configuration of the support surface 41 is not limited in any specific shape, etc., as long as it is a configuration that can realize a support structure in which the peripheral edge 913 and the support surface 41 are in contact and the surface 911 and the support surface 41 are separated. The support surface 41 is not limited to an inclined plane, but may be, for example, a curved surface, a bent surface with corners, etc. These curved and bent surfaces may be in line contact with the peripheral edge 913 or in point contact.

[0059] Second Embodiment: Figure 8 shows an ultrasonic generating device according to a second embodiment of the present invention. In the substrate processing apparatus A2 of this embodiment, the substrate is supported by the substrate support portion 4 with the front surface 911 facing upward in the vertical direction z and the back surface 912 facing downward in the vertical direction z. The vibration generating portion 81 is located below the back surface 912 in the vertical direction z.

[0060] Even with this embodiment, it is possible to suppress damage to the surface 911 of the substrate 91 while achieving appropriate lift-off processing. Furthermore, as can be understood from this embodiment, as long as the vibration generating unit 81 is facing the surface 911, the orientation of the substrate 91 is not limited in any way, and may be in an upright position along the vertical direction z, or an inclined position with respect to the vertical direction z, etc., in addition to the orientation in the substrate processing apparatus A1, A2.

[0061] Third Embodiment: Figure 9 shows an ultrasonic generator according to the third embodiment of the present invention. The substrate processing apparatus A3 of this embodiment differs from the embodiment described above in the configuration of the vibration generating unit 81. In the substrate processing apparatus A3, the vibration generating unit 81 has a processing liquid hole 812. Processing liquid 92 that flows in from the right side in the figure flows out from the processing liquid hole 812 toward the substrate 91. The vibration generating unit 81 has a transducer 813 built in. The transducer 813 is located, for example, above the processing liquid hole 812 and is connected to an oscillator 814. The transducer 813 vibrates due to control and power supply by the oscillator 814. The processing liquid 92 receives vibration from the vibration generating unit 81 as it flows through the processing liquid hole 812. As a result, cavitation occurs in the processing liquid 92 in the processing liquid hole 812. This cavitated processing liquid 92 flows out toward the back surface 912 of the substrate 91. On the substrate 91, cavitation occurs in the processing liquid 92, causing a portion of the coating 93 to peel off from the surface 911. The surface 911 side of the substrate 91 may be immersed in the processing liquid 92 or other liquid, or it may be wet or dry due to being sprayed with a cleaning solution (not shown) or the like.

[0062] Even with such embodiments, it is possible to suppress damage to the surface 911 of the substrate 91 while achieving appropriate lift-off processing. Furthermore, as can be understood from this embodiment, the configuration in which the back surface 912 and the vibration generating unit 81 face each other and vibration is generated from the vibration generating unit 81 with a liquid interposed between the back surface 912 and the vibration generating unit 81 is not limited to a configuration in which the substrate 91 is immersed in a processing liquid 92 or the like, but is acceptable as long as there is a liquid that functions as a medium for the vibration generated from the vibration generating unit 81 to act on the substrate 91.

[0063] The substrate processing method and substrate processing apparatus according to the present invention are not limited to the embodiments described above. The specific configuration of the substrate processing method and substrate processing apparatus according to the present invention can be modified in various ways.

[0064] A1, A2, A3: Substrate processing apparatus, 1: Cup, 2: Stage, 3: Drive unit, 4: Substrate support unit, 6: Drainage chamber, 8: Vibration generator, 11: Upper end, 12: Side part, 13: Bottom part, 21: Base, 22: Disc part, 31: Lifting shaft, 32: Support part, 33: Bellows member, 34: Lifting drive mechanism, 35: Rotation drive mechanism, 41: Support surface, 81: Vibration generator, 82: Electric Source unit, 85: Position adjustment unit, 91: Substrate, 92: Processing liquid, 93: Coating material, 811: Piezoelectric element, 812: Processing liquid hole, 813: Vibrator, 814: Oscillator, 851: Linear motion mechanism, 852: Oscillating mechanism, 853: Oscillating arm, 854: Control unit, 911: Front surface, 912: Back surface, 931: Resist film, 932: Metal film, r: Radial direction, z: Vertical direction, α: Oscillating angle, θ: Circumferential direction

Claims

1. A substrate processing method comprising the steps of: preparing a substrate having a front surface and a back surface, wherein a coating material is laminated on the front surface; interposing a liquid between the back surface and the vibration generating part while the back surface and the vibration generating part are facing each other; and peeling the coating material from the front surface by generating vibrations from the vibration generating part.

2. The substrate processing method according to claim 1, wherein in the step of interposing the liquid, the substrate and at least a part of the vibration generating part are immersed in the liquid.

3. The substrate processing method according to claim 2, wherein in the step of peeling the coating from the surface, the surface faces vertically downward and the vibration generating portion is positioned vertically upward with respect to the back surface.

4. The substrate processing method according to claim 2 or 3, wherein the substrate is supported such that the support surface is in contact with the peripheral edge of the substrate and the surface and the support surface are separated.

5. A substrate processing apparatus for peeling off a coating from a surface, with a substrate having a front surface and a back surface and a coating laminated on the front surface as the object to be processed, comprising: a substrate support unit; and a vibration generating unit, wherein the back surface of the substrate supported by the substrate support unit is faced to the vibration generating unit, and a liquid is interposed between the back surface and the vibration generating unit, and vibration is generated from the vibration generating unit to peel off the coating from the surface.

6. The substrate processing apparatus according to claim 5, further comprising a cup for storing the liquid, wherein the substrate supported by the substrate support and at least a portion of the vibration generating unit are immersed in the liquid stored in the cup, and vibration is generated from the vibration generating unit.

7. The substrate processing apparatus according to claim 6, wherein the substrate support portion supports the substrate in a position where the surface faces vertically downward, and the vibration generating portion is located vertically upward with respect to the back surface.

8. The substrate processing apparatus according to claim 6 or 7, wherein the substrate support portion has a support surface that abuts against the peripheral edge of the substrate and supports the substrate while being separated from the surface.

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