Electric device

Abstract

This electric device comprises: a housing; an operation member in which a first metal plating layer made of a conductive material is formed on an outer surface, and which moves downward when an operation surface is subjected to a pressing operation by a finger of an operator; electrostatic sensors that are provided close to each other in a state of being separated from each other so as not to be electrically connected to the first metal plating layer in the operation member, and detect the finger of the operator on the operation surface; a substrate that is held in the housing and electrically connected to the electrostatic sensors via wiring members; and a metal spring that returns the operation member to an initial position by biasing the operation member upward when the pressing operation by the finger of the operator is released. The metal spring electrically connects the first metal plating layer to a ground terminal part of the substrate by coming into contact with the first metal plating layer of the operation member at one end part and coming into contact with the ground terminal part at the other end part.

Description

Electrical equipment

[0001] The present invention relates to electrical equipment.

[0002] In Patent Document 1 below, regarding a switch device, an operation knob having a conductor layer made of valve metal (for example, chromium, zinc, aluminum, titanium, etc.) formed on its surface and a contact provided in a capacitance detection circuit are electrically connected by a spring made of a conductive material (for example, stainless steel, etc.). The technology is disclosed.

[0003] Japanese Patent Application Laid-Open No. 2022-175627

[0004] However, the above technology of Patent Document 1 is for the purpose of detecting that a person's finger has touched the surface of the operation knob, and is not for the purpose of grounding the operation member in order to suppress the influence of stray capacitance on the electrostatic sensor provided on the operation member. [[ID=()]]

[0005] The electrical equipment according to one embodiment includes a housing, an operation member whose outer surface is formed with a first metal plating layer made of a conductive material, and the operation surface is moved downward by being pressed by the operator's finger, and in the operation member, they are provided close to each other in a state of being separated from each other so as not to be electrically connected to the first metal plating layer, an electrostatic sensor for detecting the operator's finger with respect to the operation surface, a substrate held by the housing and electrically connected to the electrostatic sensor via a wiring member, and when the pressing operation by the operator's finger is released, a metal spring that biases the operation member upward to return the operation member to its initial position. The metal spring is in contact with the first metal plating layer of the operation member at one end and in contact with the ground terminal portion of the substrate at the other end, thereby electrically connecting the first metal plating layer to the ground terminal portion.

[0006] According to the electrical equipment according to one embodiment, the influence of stray capacitance on the electrostatic sensor provided on the operation member having a metal plating layer formed on its outer surface can be suppressed with a relatively simple configuration.

[0007] Cross-sectional view of an input device according to one embodiment. Schematic diagram showing the structure of the spring mounting portion of the input device according to one embodiment. Figure showing an example of the material of the spring mounting portion in the input device according to one embodiment. Schematic diagram showing a modified example of the structure of the spring mounting portion of the input device according to one embodiment.

[0008] An embodiment will be described below with reference to the drawings. For convenience, in the following description, the Z-axis direction in the drawings will be considered as the vertical direction, the Y-axis direction as the left-right direction, and the X-axis direction as the front-back direction. However, the positive Z-axis direction will be considered upward, the positive Y-axis direction as the rightward direction, and the positive X-axis direction as the forward direction. These indicate the relative positional relationships within the device and do not limit the installation or operation direction of the device. Any device with equivalent relative positional relationships within the device, even if installed or operated in a different direction, is included within the scope of the present invention.

[0009] (Configuration of Input Device 100) Figure 1 is a cross-sectional view of an input device 100 according to one embodiment. The input device 100 shown in Figure 1 is an example of an "electrical device". The input device 100 is installed, for example, inside a vehicle such as an automobile and is used for various switch operations on the vehicle.

[0010] As shown in Figure 1, the input device 100 comprises a housing 110, an operating member 120, a slider 130, a coil spring 140, a circuit board 150, and a cover 160.

[0011] The housing 110 is a resin component with a hollow structure. A circuit board 150 and the like are placed inside the housing 110. The entire bottom surface of the housing 110 is a lower opening 110A. The lower opening 110A is closed by a cover 160, and the cover 160 holds the circuit board 150 from below. Both the housing 110 and the cover 160 are examples of "housing".

[0012] The front portion (positive X-axis side) of the housing 110 is provided with a cylindrical portion 111 that penetrates the housing 110 in the vertical direction (Z-axis direction). An operating member 120 is provided on the upper part of the cylindrical portion 111 so as to be slidable in the vertical direction (Z-axis direction). A slider 130 is also provided inside the cylindrical portion 111 so as to be slidable in the vertical direction (Z-axis direction).

[0013] The operating member 120 is located at the top of the input device 100 and is a resin component that receives a press operation from the operator. The operating member 120 has a rectangular parallelepiped shape with an open bottom. In a plan view from above (positive Z-axis direction), the operating member 120 has a horizontally elongated rectangular shape with the left-right direction (Y-axis direction) as the longitudinal direction and the front-back direction (X-axis direction) as the short direction. The operating member 120 is supported by the housing 110 via a slider 130 so as to be movable in the vertical direction (Z-axis direction). An operating surface 120A that receives a press operation is provided on the upper surface of the operating member 120.

[0014] A recess 120B is formed on the upper surface of the operating member 120, which is recessed downward (negative Z-axis direction). When viewed from above (positive Z-axis direction) in a plan view, the recess 120B has a horizontally elongated rectangular shape with the left-right direction (Y-axis direction) as its longitudinal direction. A sensor holder 122A is positioned and fixed at the bottom of this recess 120B, surrounded by its inner wall. Above the sensor holder 122A (positive Z-axis side), an operating surface 120A is formed, when viewed from the left-right direction (Y-axis direction), whose surface shape is curved downward to facilitate pressing. A flat electrostatic sensor 121 is positioned and fixed horizontally inside the sensor holder 122A. When viewed from above (positive Z-axis direction) in a plan view, the electrostatic sensor 121 has a horizontally elongated rectangular shape with the left-right direction (Y-axis direction) as its longitudinal direction. The electrostatic sensor 121 detects the contact position of the operator's finger on the operating surface 120A using an electrostatic detection method. The electrostatic sensor 121 is electrically connected to a drive / detection circuit (not shown) provided on the substrate 150 by a wiring member 121A such as an FPC (Flexible Printed Circuits).

[0015] The lower surface of the operating member 120 is provided with a columnar support portion 122 that protrudes downward (in the negative Z-axis direction). The support portion 122 is inserted into the inner diameter side of the upper part of the coil spring 140, thereby supporting the upper part of the coil spring 140.

[0016] The slider 130 is a resin component that is slidably positioned vertically (in the Z-axis direction) inside the cylindrical portion 111 of the housing 110 and below the operating member 120 (negative Z-axis side), and has a through hole through which a coil spring 140 passes. When the operating surface 120A of the operating member 120 is pressed, the slider 130 is pushed downward (in the negative Z-axis direction) by the force of the pressing operation. As a result, the slider 130 can move downward (in the negative Z-axis direction) together with the operating member 120.

[0017] The coil spring 140 is an example of a "metal spring". The coil spring 140 is a metal, wound-shaped member that is installed between the operating member 120 and the base plate 150, passing through the through hole of the slider 130, and is expandable and contractible in the vertical direction (Z-axis direction). The coil spring 140 biases the operating member 120 upward (positive Z-axis direction). When the operating member 120 is pressed against the operating surface 120A, the coil spring 140 is compressed by the operating member 120. Then, when the pressing operation on the operating surface 120A of the operating member 120 is released, the coil spring 140 biases the operating member 120 upward (positive Z-axis direction), allowing the operating member 120 to return to its initial position.

[0018] The circuit board 150 is a flat, plate-shaped component made of resin. The circuit board 150 is fixedly installed on the upper surface of the cover 160 inside the housing 110, in a horizontal position with respect to the XY plane. Various electronic components (for example, switches, LEDs (Light Emitting Diodes), drive and detection circuits for the electrostatic sensor 121, etc.) are mounted on the upper surface 150A of the circuit board 150. For example, a PWB (Printed Wiring Board) is used as the circuit board 150.

[0019] The cover 160 is a resin component that fits into the lower opening 110A of the housing 110, thereby closing the lower opening 110A of the housing 110 and holding the substrate 150, which is placed inside the housing 110, from below (negative Z-axis side).

[0020] With the input device 100 configured as described above, when an operator makes a selection operation on the operating surface 120A of the operating member 120, the electrostatic sensor 121 can detect the selection operation.

[0021] Furthermore, if the operator presses the operating member 120, both the operating member 120 and the slider 130 move downward (in the negative Z-axis direction).

[0022] Consequently, when a switch (not shown) located inside the housing 110 is pressed by the slider 130 and turned on, the input device 100 determines that the selection for the operating surface 120A has been confirmed by the pressing operation.

[0023] In this case, the input device 100 can control the function corresponding to the selected operating surface 120A.

[0024] Subsequently, when the operator releases the pressing operation of the operating member 120, the input device 100 is biased directly by the coil spring 140, causing the operating member 120 to move upward (in the positive Z-axis direction), and the slider 130, which is held to move together with the operating member 120, also moves upward (in the positive Z-axis direction) and returns to its initial position.

[0025] (Structure of the spring mounting section) Figure 2 is a schematic diagram showing the structure of the spring mounting section of an input device 100 according to one embodiment.

[0026] As shown in Figure 2, the spring mounting section of the input device 100 has a configuration in which a coil spring 140 is interposed between the operating member 120 and the ground terminal section 151 provided on the upper surface 150A of the substrate 150.

[0027] The coil spring 140 is formed using a conductive material. In this embodiment, as an example, the coil spring 140 is formed using stainless steel.

[0028] A first metal plating layer 123 made of a conductive material is formed on all outer surfaces of the operating member 120, excluding the operating surface 120A. The ground terminal portion 151 is a horizontal plate-shaped or film-shaped member. The ground terminal portion 151 is formed using a conductive material and is grounded via wiring provided on the substrate 150.

[0029] In other words, when viewed from above (positive Z-axis direction) in plan view, the operating member 120 has a rectangular frame-shaped outer surface surrounding the rectangular electrostatic sensor 121, and the first metal plating layer 123 is formed on the outer surface of the lower surface of the operating member 120. Therefore, it can be said that the operating member 120 is configured to be provided in close proximity to each other, spaced apart from each other, so that the electrostatic sensor 121 does not electrically connect with the first metal plating layer 123.

[0030] The first metal plating layer 123 formed on the lower surface of the operating member 120 and on the support portion 122 is in contact with the tip and inner diameter side of the upper ground portion 140A of the coil spring 140. The ground terminal portion 151 is in contact with the tip side of the lower ground portion 140B of the coil spring 140. As a result, the first metal plating layer 123 formed on the operating member 120 is electrically connected to the ground terminal portion 151 via the coil spring 140.

[0031] The upper contact portion 140A is provided at the upper end of the coil spring 140 (an example of "one end") and is a region having a predetermined vertical width. The lower contact portion 140B is provided at the lower end of the coil spring 140 (an example of "the other end") and is a region having a predetermined vertical width. A suitable predetermined vertical width is, for example, about 5 to 10 turns from the tip. Furthermore, it is desirable to make the region having this vertical width a tightly wound coil spring as shown in Figure 1, in order to prevent entanglement of springs during transport and deformation when inserting the support portion 122.

[0032] As a result, the input device 100 according to one embodiment uses a coil spring 140 for returning the operating member 120 to its initial position as a grounding member, thereby enabling the first metal plating layer 123 to be grounded to the ground terminal 151 in an inexpensive, space-efficient, and reliable manner. Consequently, the input device 100 according to one embodiment can suppress the retention of stray capacitance in the first metal plating layer 123, thereby suppressing the influence of such stray capacitance on the detection accuracy of the electrostatic sensor 121.

[0033] Therefore, according to the input device 100 of one embodiment, the influence of stray capacitance on the electrostatic sensor 121 provided on the operating member 120, which has a metal plating layer formed on its outer surface, can be suppressed with a relatively simple configuration.

[0034] Here, as shown in Figure 2, the ground terminal portion 151 has a second metal plating layer 151A formed on its entire outer surface. On the other hand, the coil spring 140 has a third metal plating layer 141 formed only on the outer surface of the lower ground portion 140B (an example of the "region at the other end") that contacts the ground terminal portion 151.

[0035] The second metal plating layer 151A and the third metal plating layer 141 are made of the same material. In this embodiment, as an example, gold (Au) is used for both the second metal plating layer 151A and the third metal plating layer 141.

[0036] As a result, the input device 100 according to one embodiment can reduce the potential difference between the earth terminal portion 151 and the lower ground portion 140B of the coil spring 140, thereby making it less likely for electrolytic corrosion to occur at the contact point between the earth terminal portion 151 and the lower ground portion 140B of the coil spring 140, and therefore making it less likely for poor contact between the earth terminal portion 151 and the lower ground portion 140B of the coil spring 140 to occur.

[0037] In particular, in the input device 100 according to one embodiment, in the coil spring 140, at the upper grounding portion 140A, the oxide film on the contact surface is peeled off due to sliding caused by minute relative movement with the support portion 122, so inexpensive materials that are more prone to oxide film formation than gold (Au) can be used. On the other hand, at the lower grounding portion 140B, the coil spring 140 remains in contact with the earth terminal portion 151 and there is no relative movement, so there is no sliding, and the oxide film on the contact surface is not peeled off. For this reason, although expensive, gold (Au), a material that is less prone to oxide film formation, is used for the contact surface. However, since the third metal plating layer 141 is provided only on the outer surface of the lower grounding portion 140B, the amount of metal plating material (gold (Au) in this embodiment) used can be reduced, and thus the cost of forming the third metal plating layer 141 can be reduced.

[0038] The earth terminal portion 151 may be formed by forming a second metal plating layer 151A on the outer surface of a base material made of another metal material (for example, copper (Cu)), or the second metal plating layer 151A may be formed directly on the surface of the substrate 150.

[0039] (Example of material for spring mounting part) Figure 3 is a diagram showing an example of the material for the spring mounting part in an input device 100 according to one embodiment.

[0040] <Prerequisites> In this embodiment, as a prerequisite, the first metal plating layer 123 formed on the outer surface of the operating member 120 and the contact surface of the coil spring 140 are formed using materials with the same or similar ionization tendencies, thereby reducing the potential difference to zero or small. As a result, the input device 100 according to this embodiment can make it difficult for galvanic corrosion to occur at the contact area between the first metal plating layer 123 and the coil spring 140, and therefore, it can make it difficult for poor contact between the operating member 120 and the coil spring 140 to occur.

[0041] In particular, in this embodiment, as a prerequisite, a material with a smaller potential difference is used to form the first metal plating layer 123 formed on the outer surface of the operation member 120 and the contact surface of the coil spring 140. As a result, the input device 100 according to this embodiment can further reduce the occurrence of electrolytic corrosion at the contact portion between the first metal plating layer 123 and the coil spring 140, and therefore can further reduce the occurrence of poor contact between the operation member 120 and the coil spring 140.

[0042] Based on the test results, the inventors determined the combination of materials so that the potential difference is less than 1.66 [V], and found that electrolytic corrosion is less likely to occur even in a humidity storage test (temperature and humidity cycle storage test).

[0043] Specifically, the inventors confirmed that in the case of a combination of materials (for example, copper (Cu) and gold (Au)) with a potential difference of 1.18 [V], electrolytic corrosion is less likely to occur in a humidity storage test.

[0044] On the other hand, the inventors found that in the case of a combination of materials (for example, tin (Sn) and gold (Au)) with a potential difference of 1.66 [V], and in the case of a combination of materials (for example, nickel (Ni) and gold (Au)) with a potential difference of 1.78 [V], although electrolytic corrosion occurs in the humidity storage test, it is within the allowable range and is the lower limit of the allowable range.

[0045] Furthermore, the inventors confirmed that in the case of a combination of materials (for example, chromium (Cr) and gold (Au)) with a potential difference of 2.26 [V], electrolytic corrosion definitely occurs and is NG in the storage test.

[0046] From the above, the inventors found that there is a critical condition around a potential difference of 1.66 [V] to 1.78 [V], and in order to surely prevent electrolytic corrosion, it is preferable to determine the combination of materials so that the potential difference is smaller than the lower limit value of this critical condition (1.66 [V]).

[0047] <First Embodiment> As shown in FIG. 3, in the input device 100 according to the first embodiment, the first metal plating layer 123 formed on the outer surface of the operation member 120 is formed using chromium (Cr), the coil spring 140 is formed using stainless steel (SUS), and the outer surface of the coil spring 140 also exposes stainless steel (SUS). Therefore, in the input device 100 according to the first embodiment, the upper potential difference of the spring installation portion (the potential difference between the contact surface of the first metal plating layer 123 and the coil spring 140) is "-1.08 [V]".

[0048] Thus, since the potential difference is smaller than the above-described 1.66 [V], the input device 100 according to the first embodiment can make it difficult for electrolytic corrosion to occur at the contact portion between the first metal plating layer 123 and the coil spring 140, and therefore, it can make it difficult for a contact failure to occur between the operation member 120 and the coil spring 140.

[0049] Also, as shown in FIG. 3, in the input device 100 according to the first embodiment, the second metal plating layer 151A formed on the outer surface of the ground terminal portion 151 and the third metal plating layer 141 formed on the outer surface of the lower ground portion 140B of the coil spring 140 are both formed using gold (Au). Therefore, in the input device 100 according to the first embodiment, the lower potential difference of the spring installation portion (the potential difference between the second metal plating layer 151A and the third metal plating layer 141) is "0 [V]".

[0050] Thus, the input device 100 according to the first embodiment can make it difficult for electrolytic corrosion to occur at the contact portion between the second metal plating layer 151A and the third metal plating layer 141, and therefore, it can make it difficult for a contact failure to occur between the ground terminal portion 151 and the coil spring 140.

[0051] <Second Embodiment> As shown in Figure 3, in the input device 100 according to the second embodiment, the first metal plating layer 123 formed on the outer surface of the operating member 120 is made of chromium (Cr), and the coil spring 140 is made of tin (Sn), with the outer surface of the coil spring 140 also exposed with tin (Sn). Therefore, in the input device 100 according to the second embodiment, the upper potential difference of the spring mounting part (potential difference between the first metal plating layer 123 and the coil spring 140) is "-0.60 [V]".

[0052] As a result, since the potential difference is smaller than the aforementioned 1.66 [V], the input device 100 according to the second embodiment can make it less likely for galvanic corrosion to occur at the contact point between the first metal plating layer 123 and the coil spring 140, and therefore, it can make it less likely for poor contact to occur between the operating member 120 and the coil spring 140.

[0053] Furthermore, as shown in Figure 3, in the input device 100 according to the second embodiment, the second metal plating layer 151A formed on the outer surface of the earth terminal portion 151 and the third metal plating layer 141 formed on the outer surface of the lower ground portion 140B of the coil spring 140 are both made of gold (Au). Therefore, in the input device 100 according to the second embodiment, the lower potential difference of the spring mounting portion (the potential difference between the second metal plating layer 151A and the third metal plating layer 141) becomes "0 [V]".

[0054] As a result, the input device 100 according to the second embodiment can make it less likely for galvanic corrosion to occur at the contact point between the second metal plating layer 151A and the third metal plating layer 141, and therefore, it can make it less likely for poor contact to occur between the ground terminal portion 151 and the coil spring 140.

[0055] <Third Embodiment> As shown in Figure 3, in the input device 100 according to the third embodiment, the first metal plating layer 123 formed on the outer surface of the operating member 120 is made of copper (Cu), and the coil spring 140 is made of stainless steel (SUS), which has an ionization tendency almost the same as that of copper (Cu), and the outer surface of the coil spring 140 is also exposed stainless steel (SUS). Therefore, in the input device 100 according to the third embodiment, the upper potential difference of the spring mounting part (the potential difference between the first metal plating layer 123 and the coil spring 140) is approximately "0 [V]".

[0056] As a result, the input device 100 according to the third embodiment is less prone to galvanic corrosion at the contact point between the first metal plating layer 123 and the coil spring 140, and therefore less prone to poor contact between the operating member 120 and the coil spring 140.

[0057] Furthermore, as shown in Figure 3, in the input device 100 according to the third embodiment, the second metal plating layer 151A formed on the outer surface of the earth terminal portion 151 and the third metal plating layer 141 formed on the outer surface of the lower ground portion 140B of the coil spring 140 are both made of gold (Au). Therefore, in the input device 100 according to the third embodiment, the lower potential difference of the spring installation portion (the potential difference between the second metal plating layer 151A and the third metal plating layer 141) becomes "0 [V]".

[0058] As a result, the input device 100 according to the third embodiment can make it less likely for galvanic corrosion to occur at the contact area between the second metal plating layer 151A and the third metal plating layer 141, and therefore, it can make it less likely for poor contact to occur between the ground terminal portion 151 and the coil spring 140.

[0059] (A modified example of the structure of the spring mounting section) Figure 4 is a schematic diagram showing a modified example of the structure of the spring mounting section of an input device 100 according to one embodiment.

[0060] As shown in Figure 4, the spring mounting portion according to this modified example differs from the spring mounting portion shown in Figure 2 in that, in the coil spring 140, a fourth metal plating layer 142 is further formed on the outer surface of the upper contact portion 140A that contacts the first metal plating layer 123 formed on the outer surface of the operating member 120.

[0061] In the spring mounting section of this modified example, the first metal plating layer 123 formed on the outer surface of the operating member 120 is made of chromium (Cr), and the coil spring 140 is made of stainless steel (SUS).

[0062] Therefore, if the fourth metal plating layer 142 is not provided on the coil spring 140, the upper potential difference of the spring mounting portion (the potential difference between the first metal plating layer 123 and the coil spring 140) will be "-1.08 [V]".

[0063] On the other hand, in the spring mounting section according to this modified example, a fourth metal plating layer 142 is provided on the outer surface of the upper ground portion 140A of the coil spring 140, and this fourth metal plating layer 142 is formed using tin (Sn). Therefore, in the spring mounting section according to this modified example, the upper potential difference of the spring mounting section (the potential difference between the first metal plating layer 123 (chromium (Cr)) and the fourth metal plating layer 142 (tin (Sn))) is -0.60 [V].

[0064] As a result, in this modified spring mounting section, the material of the first metal plating layer 123 is chromium, which is a material that has a good appearance, and the material of the coil spring 140 is stainless steel, which is a material that has good durability against repeated compression operations. However, since the first metal plating layer 123 (chromium (Cr)) is in contact with the fourth metal plating layer 142 (tin (Sn)), the potential difference between the contact parts between them becomes smaller, making it less likely for galvanic corrosion to occur, and therefore, poor contact between the operating member 120 and the coil spring 140 can be made less likely.

[0065] The fourth metal plating layer 142 may be formed using chromium (Cr). In this case, the spring mounting portion according to this modified example can have the upper potential difference of the spring mounting portion (the potential difference between the first metal plating layer 123 and the fourth metal plating layer 142) set to "0 [V]", and further reduce the likelihood of galvanic corrosion.

[0066] Although one embodiment of the present invention has been described in detail above, the present invention is not limited to these embodiments, and various modifications or changes are possible within the scope of the gist of the present invention as described in the claims.

[0067] This international application claims priority based on Japanese Patent Application No. 2025-010963, filed on 24 January 2025, and the entire contents of said application are incorporated herein by reference.

[0068] 100 Input device 110 Housing 110A Lower opening 111 Cylindrical section 120 Operating member 120A Operating surface 120B Recess 121 Electrostatic sensor 121A Wiring member 122 Support section 123 First metal plating layer 130 Slider 140 Coil spring 140A Upper grounding section 140B Lower grounding section 141 Third metal plating layer 142 Fourth metal plating layer 150 Substrate 150A Top surface 151 Grounding terminal section 151A Second metal plating layer 160 Cover

Claims

1. An electrical device comprising: a housing; an operating member having a first metal plating layer made of a conductive material formed on its outer surface and moving downward when the operating surface is pressed by the operator's finger; an electrostatic sensor provided close to the operating member at a distance from each other so as not to be electrically connected to the first metal plating layer, and detecting the operator's finger on the operating surface; a substrate held in the housing and electrically connected to the electrostatic sensor via a wiring member; and a metal spring that biases the operating member upward when the pressing operation by the operator's finger is released, thereby returning the operating member to its initial position, wherein the metal spring contacts the first metal plating layer of the operating member at one end and contacts the ground terminal portion of the substrate at the other end, thereby electrically connecting the first metal plating layer to the ground terminal portion.

2. The electrical device according to claim 1, characterized in that the earth terminal portion of the substrate has a second metal plating layer formed on its outer surface, and the metal spring has a third metal plating layer made of the same material as the second metal plating layer formed only on the outer surface of the region of the other end.

3. The electrical apparatus according to claim 2, characterized in that both the second metal plating layer and the third metal plating layer are formed using gold.

4. The electrical device according to claim 3, characterized in that the first metal plating layer of the operating member and the metal spring are formed using materials having the same or similar ionization tendencies.

5. The electrical device according to claim 4, characterized in that the first metal plating layer of the operating member and the metal spring are formed using materials that have a potential difference less than 1.66 [V].

6. The electrical device according to claim 5, characterized in that the first metal plating layer of the operating member is formed using chromium, and the metal spring is formed using stainless steel.

7. The electrical device according to claim 5, wherein the metal spring has a fourth metal plating layer formed on the outer surface of the region at one end, and the first metal plating layer of the operating member and the fourth metal plating layer of the metal spring are formed using materials having the same or similar ionization tendencies.

8. The electrical device according to claim 7, characterized in that the first metal plating layer of the operating member is formed using chromium, and the fourth metal plating layer of the metal spring is formed using tin or chromium.

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