Electronic control device and electric vehicle
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- DENSO CORP
- Filing Date
- 2026-01-20
- Publication Date
- 2026-07-30
Smart Images
Figure JP2026001566_30072026_PF_FP_ABST
Abstract
Description
Electronic control device and electric vehicle Cross-reference to related applications
[0001] This application is based on Patent Application No. 2025-008815 filed on January 22, 2025, the contents of which are incorporated herein by reference.
[0002] This disclosure relates to an electronic control device and an electric vehicle.
[0003] Conventionally, an electronic control device for controlling the rotation of a motor is known. For example, in Patent Document 1, drive elements of an inverter circuit are mounted on the first surface of a substrate, and a motor drive circuit is mounted on the second surface opposite to the first surface of the substrate.
[0004] Japanese Unexamined Patent Application Publication No. 2024-112634
[0005] In Patent Document 1, a motor drive circuit is provided for each inverter circuit, and the motor drive circuit and the inverter circuit are arranged adjacent to each other. Here, for example, when the drive elements are paralleled and the number of elements increases, the wiring length between the drive elements and the motor drive circuit becomes longer, resulting in an increase in inductance, or an inductance difference may occur due to variations in the wiring length. An object of the present disclosure is to provide an electronic control device capable of appropriately controlling the drive of a rotating electrical machine and an electric vehicle.
[0006] The electronic control device of the present disclosure controls the drive of a rotating electrical machine having windings of a plurality of phases, and includes a substrate, drive elements, and a control IC. The drive elements are mounted on the first surface, which is one mounting surface of the substrate, and switch the energization to the windings. The control IC is mounted on the second surface, which is the mounting surface opposite to the first surface of the substrate, and outputs a drive signal to the drive elements.
[0007] The control IC is provided for each winding, and is on the back side of the element mounting region, which is a region where the drive elements connected to the winding are mounted, and at least a part thereof is mounted so as to overlap with the projection region of the element mounting region. Thereby, the wiring inductance is reduced, and the drive of the rotating electrical machine can be appropriately controlled.
[0008] The above-mentioned objectives and other objectives, features and advantages of this disclosure will become clearer with reference to the attached drawings and the detailed description below. The drawings are as follows: Figure 1 is a schematic diagram showing an electric vehicle according to the first embodiment; Figure 2 is a cross-sectional view showing an electric motor unit according to the first embodiment; Figure 3 is a circuit diagram showing a motor section and power element group according to the first embodiment; Figure 4 is a circuit diagram showing a power element group according to the first embodiment; Figure 5 is a plan view showing the motor surface of the substrate according to the first embodiment; Figure 6 is a plan view showing the cover surface of the substrate according to the first embodiment; Figure 7 is a schematic diagram showing the U1 region according to the first embodiment; Figure 8 is a schematic exploded perspective view showing the U1 region according to the first embodiment. Figure 9 is a schematic diagram showing the U1 region according to the second embodiment, Figure 10 is a schematic diagram showing the U1 region according to the third embodiment, Figure 11 is a schematic diagram showing the U1 region according to the fourth embodiment, Figure 12 is a plan view showing the motor surface of the substrate according to the fifth embodiment, Figure 13 is a plan view showing the cover surface of the substrate according to the fifth embodiment, Figure 14 is a schematic diagram showing an electric vehicle according to another embodiment, Figure 15 is a schematic diagram showing an electric vehicle according to another embodiment, Figure 16 is a schematic diagram showing the U1 region according to a reference example, and Figure 17 is a schematic diagram showing the U1 region according to a reference example.
[0009] Hereinafter, the electronic control device and electric vehicle according to this disclosure will be described with reference to the drawings. In the following multiple embodiments, substantially identical components will be denoted by the same reference numerals and their descriptions will be omitted.
[0010] (First Embodiment) The first embodiment is shown in Figures 1 to 8. As shown in Figure 1, the motor unit 10 having an electrical circuit section 30 (see Figure 2) as an electronic control device is applied to, for example, an electric vehicle 90. The electric vehicle 90 is, for example, an electric two-wheeled vehicle having a front wheel 91 and a rear wheel 92, and is configured so that a driver D can ride it. The electric vehicle 90 is also equipped with a battery 95 (see Figure 3).
[0011] As shown in Figure 2, the motor unit 10 comprises a motor section 20 and an electrical circuit section 30, etc. The motor unit 10 is a so-called "mechatronics-integrated" type, with the electrical circuit section 30 provided on one side of the motor section 20 in the axial direction, and is housed in a common housing 11.
[0012] The housing 11 comprises a housing body 12, a frame member 13, and a cover 14. The housing body 12 has a cylindrical portion 121 and a substrate housing portion 125, and is integrally formed, for example, from metal. The cylindrical portion 121 is formed in a substantially bottomed cylindrical shape that opens on the side opposite to the electrical circuit portion 30.
[0013] The substrate housing section 125 is provided on one axial side of the cylindrical section 121, and one radial side is formed to protrude radially outward in a substantially rectangular shape. A connector 15 and a heat dissipation fin 126 are provided on the portion of the substrate housing section 125 that protrudes radially outward from the cylindrical section 121. The heat dissipation fin 126 is provided to protrude radially and axially.
[0014] The frame member 13 is provided at the end of the cylindrical portion 121 opposite to the substrate housing portion 125, so as to close the opening. The cover 14 is provided so as to close the opening on the substrate housing portion 125 side. The cover 14 is provided with heat dissipation fins 141. By providing the heat dissipation fins 126 and 141, the cooling efficiency of the electrical circuit portion 30 by the airflow during driving can be increased.
[0015] The motor section 20 is, for example, a three-phase brushless motor and has two sets of motor windings 21 and 22, a stator 23, a rotor 24, and a shaft 25, etc., and constitutes a magnetic circuit. The motor windings 21 and 22 are wound around the stator 23 and fixed to the cylindrical section 121. The rotor 24 is provided radially inside the stator 23 and is provided so as to be rotatable relative to the stator 23.
[0016] The shaft 25 is fitted into the rotor 24 and rotates integrally with the rotor 24. The shaft 25 is rotatably supported in the housing 11 by bearings 251 and 252. A magnet 26 is provided at one end of the shaft 25 and is exposed to the electrical circuit section 30 side through a hole 122 formed in the housing body 12. The magnet 26 rotates integrally with the shaft 25 and is used for rotation detection. The other end of the shaft 25 is an output end 255, which is exposed to the outside of the housing 11 through a hole 131 formed in the frame member 13. The output end 255 is connected to the rear wheel 92 (see Figure 1) via a gear or the like (not shown). As a result, the rear wheel 92, which is a drive wheel, is driven by the driving force of the motor section 20. The drive wheel may be the front wheel 91. The electric vehicle 90 runs on the driving force of the motor section 20, which is a drive motor (so-called main motor).
[0017] The electrical circuit section 30 has a circuit board 31 and is housed in a circuit board housing section 125. The circuit board 31 is a laminated circuit board and is fixed to the housing body 12 by fixing members such as screws (not shown). Hereinafter, the side of the circuit board 31 facing the motor section 20 will be referred to as the motor surface 311, and the side facing the cover 14 will be referred to as the cover surface 312. The circuit board 31 is connected to a connector 15.
[0018] Electronic components such as power element groups 41-46, 51-56, microcontroller 60 (see Figure 5), control ICs 61-66 (see Figure 6), relay circuit element 71, inductor 72 and capacitor 73 constituting the filter circuit, and ASIC 75 (see Figure 12) are mounted on the circuit board 31. Figure 2 is a schematic cross-sectional view, showing the components mounted on the circuit board 31, and does not necessarily correspond to the actual arrangement. Also, there may be multiple circuit boards.
[0019] As shown in Figure 3, motor winding 21 has motor wire connection sections 321-323 to which U1 winding 211, V1 winding 212, and W1 winding 213 are connected, and is Y-connected. Motor winding 22 has U2 winding 221, V2 winding 222, and W2 winding 223, and is Y-connected. The connection method may also be a delta connection, etc. In Figure 3, the connection sections of motor windings 21 and 22 overlap, but they are assumed to be individually connected.
[0020] Power element groups 41-46 are connected to the motor winding 21. Power element groups 41-43 are located on the high-potential side, and power element groups 44-46 are located on the low-potential side. They are bridge-connected to form an inverter circuit, which switches the energization of the motor winding 21. Power element groups 51-56 are connected to the motor winding 22. Power element groups 51-53 are located on the high-potential side, and power element groups 54-56 are located on the low-potential side. They are bridge-connected to form an inverter circuit, which switches the energization of the motor winding 22. Hereinafter, the configuration corresponding to the motor winding 21 will be referred to as the first system, and the configuration corresponding to the motor winding 22 as the second system.
[0021] As shown in Figure 4, power element group 41 consists of four power elements 411 to 414 connected in parallel. Similarly, power element group 44 consists of four power elements 441 to 444 connected in parallel. Likewise, power element groups 42, 43, 45, 46, and 51 to 56 each consist of four power elements connected in parallel, but the number of parallel connections is not limited to four. The power elements in this embodiment are GaN (gallium nitride) FETs, but SiC (silicon carbide) FETs or IGBTs (insulated gate bipolar transistors) may also be used. Note that in Figure 3, for simplification, a group of elements consisting of multiple elements connected in parallel is represented by a single element symbol.
[0022] Figure 5 shows the motor side 311 of the substrate 31, and Figure 6 shows the cover side 312 of the substrate 31. Figures 5 and 6 mainly show the mounting locations of the power element groups 41-46 and 51-56, and descriptions of relay circuit elements 71, inductors 72, capacitors 73, and ASIC 75 have been omitted.
[0023] As shown in Figures 5 and 6, the motor wire connection portions 321 to 323 connected to windings 211 to 213 are arranged in a straight line at equal intervals, and the motor wire connection portions 324 to 326 connected to windings 221 to 223 are arranged in a straight line at equal intervals. The arrangement is not limited to a straight line; it may also be arranged in an arc. In addition, the circuit board 31 has a power terminal connection portion 328 to which the power terminal is connected, and a ground terminal connection portion 329 to which the ground terminal is connected.
[0024] As shown in Figure 5, power elements constituting power element groups 41-46 and 51-56 are mounted on the motor surface 311 of the substrate 31. The four power elements 411-414 constituting power element group 41 are mounted together in a 2x2 configuration. The element arrangement of power element group 41 is not limited to a 2x2 configuration; it may also be a 1x4 configuration or an arrangement where the number of elements differs between the first and second rows. Similarly, the power elements constituting power element groups 42-46 and 51-56 are mounted in the same manner.
[0025] Here, the imaginary line Ld that separates the area where components related to the first system are mounted from the area where components related to the second system are mounted is defined as the system demarcation line Ld. Power element groups 41 to 46 are arranged approximately parallel to the system demarcation line Ld, in the order of U-phase power element groups 41 and 44, V-phase power element groups 42 and 45, and W-phase power element groups 43 and 46, from one side. Power element groups 51 to 56 are arranged approximately parallel to the system demarcation line Ld on the opposite side of the system demarcation line Ld from power element groups 41 to 46, in the order of U-phase power element groups 51 and 54, V-phase power element groups 52 and 55, and W-phase power element groups 53 and 56, from one side.
[0026] Hereinafter, the region where the power element groups 41 and 44 related to the U phase of the first system are mounted will be referred to as the U1 region Ru1. In this embodiment, the U1 region Ru1 is a rectangular region that defines the outermost frame of the power elements constituting the power element groups 41 and 44. Similarly, the region where the power element groups 42 and 45 related to the V phase of the first system are mounted will be referred to as the V1 region Rv1, the region where the power element groups 43 and 46 related to the W phase are mounted will be referred to as the W1 region Rw1, the region where the power element groups 51 and 54 related to the U phase of the second system are mounted will be referred to as the U2 region Ru2, the region where the power element groups 52 and 55 related to the V phase are mounted will be referred to as the V2 region Rv2, and the region where the power element groups 53 and 56 related to the W phase are mounted will be referred to as the W2 region Rw2. In this embodiment, the regions Ru1, Rv1, and Rw2 of the first system and the regions Ru2, Rv2, and Rw2 of the second system are arranged symmetrically on both sides of the system demarcation line Ld.
[0027] The motor wire connection section 321 is provided adjacent to the U1 region Ru1 on the opposite side of the system boundary line Ld. The motor wire connection section 321 is also provided outside the U1 region Ru1 and at an intermediate position between the power element groups 41 and 44. Similarly, the motor wire connection section 322 is provided adjacent to the V1 region Rv1 at an intermediate position between the power element groups 42 and 45 on the opposite side of the system boundary line Ld, and the motor wire connection section 323 is provided adjacent to the W1 region Rw1 at an intermediate position between the power element groups 43 and 46 on the opposite side of the system boundary line Ld.
[0028] Furthermore, the motor wire connection portion 324 is provided adjacent to the U2 region Ru2 at an intermediate position between the power element groups 51 and 54 on the opposite side of the system boundary line Ld, the motor wire connection portion 325 is provided adjacent to the V2 region Rv2 at an intermediate position between the power element groups 52 and 55 on the opposite side of the system boundary line Ld, and the motor wire connection portion 326 is provided adjacent to the W2 region Rw2 at an intermediate position between the power element groups 53 and 56 on the opposite side of the system boundary line Ld.
[0029] A microcontroller 60 and a rotation angle sensor 69 are mounted on the motor surface 311 of the circuit board 31. The microcontroller 60 is mounted on the system demarcation line Ld, between the U1 region Ru1 and the U2 region Ru2, but the mounting location of the microcontroller 60 may be different. The rotation angle sensor 69 is mounted at a location opposite to the magnet 26. In this embodiment, the rotation angle sensor 69 is located on the system demarcation line Ld, but the position opposite the magnet 26 may be at a location different from the system demarcation line Ld. Also, on the W1 region Rw1 and W2 region Rw2 side of the circuit board 31, power terminal connection part 328 and ground terminal connection part 329 are formed on both sides of the system demarcation line Ld.
[0030] As shown in Figure 6, control ICs 61 to 66 are mounted on the cover surface 312 of the substrate 31. For illustrative purposes, Figure 6 shows the arrangement in a transparent state as seen from the motor side 311. The same applies to Figure 13, which will be described later. Control ICs 61 to 66 are so-called pre-driver ICs that include pre-drivers that output gate signals, which are drive signals that control the on / off operation of the power elements.
[0031] The control IC 61 is mounted on the cover surface 312 side of the substrate 31, within the projected region obtained by projecting the U1 region Ru1 in the thickness direction of the substrate 31. Hereinafter, when simply referred to as "projection," it means projection in the thickness direction of the substrate 31. In this embodiment, the control IC 61 is mounted in the center of the projected region obtained by projecting the U1 region Ru1. Here, "center" does not necessarily mean strictly in the center; for example, a deviation that can be considered to have uniform inductance depending on the formation of the wiring pattern is permitted.
[0032] Hereinafter, in the case of the cover surface 312, if it is mounted within the projected area of the area on the motor surface 311 side, it will be referred to as "mounted on the back surface of the said area." Control IC 62 is mounted in the center of the back surface of area V1 Rv1, control IC 63 is mounted in the center of the back surface of area W1 Rw1, control IC 64 is mounted in the center of the back surface of area U2 Ru2, control IC 65 is mounted on the back surface of area V2 Rv2, and control IC 66 is mounted in the center of the back surface of area W2 Rw2.
[0033] The connection between the control IC and the power elements will be explained based on Figures 7 and 8. Since the connection between the control ICs 61 to 66 and the power elements is the same in each region, the connection between the power element groups 41 and 44 related to the first U-phase and the control IC 61 will be explained as an example. In Figures 7 and 8, the power elements mounted on the motor surface 311 are shown by solid lines, the inner layer patterns of the substrate 31 are shown by dashed lines, and the control IC mounted on the cover surface 312 is shown by a dashed-dotted line.
[0034] The inner layer pattern 351 is formed planarly on the inner layer of the substrate 31 and is connected to the high-potential power elements 411 to 414 that switch simultaneously. The inner layer pattern 352 is formed planarly on the inner layer of the substrate 31 and is connected to the low-potential power elements 441 to 444 that switch simultaneously. If the substrate 31 has multiple inner layers, the inner layer patterns 351 and 352 may be formed on the same layer or on different layers.
[0035] Each power element 411 to 414 is mounted such that at least a portion of it overlaps with the projection area of the inner layer pattern 351, and is connected to the inner layer pattern 351 by through holes 361 to 364 formed at the overlapping area. Each power element 441 to 444 is mounted such that at least a portion of it overlaps with the projection area of the inner layer pattern 352, and is connected to the inner layer pattern 352 by through holes 371 to 372 formed at the overlapping area.
[0036] The inner layer pattern 351 is connected to the control IC 61 via a through-hole 365. The inner layer pattern 352 is connected to the control IC 61 via a through-hole 375. The through-holes 365 and 375 are formed in the center of the inner layer patterns 351 and 352. The control IC 61 and the through-holes 365 and 375 are connected by wiring patterns 366 and 376 on the cover surface 312 side of the substrate 31.
[0037] As a result, gate signals related to the on / off operation of power elements 411 to 414 are output from the control IC 61 to power elements 411 to 414 via the wiring pattern 366, through-hole 365, inner layer pattern 351, and through-holes 361 to 364. Similarly, gate signals related to the on / off operation of power elements 441 to 444 are output from the control IC 61 to power elements 441 to 444 via the wiring pattern 376, through-hole 375, inner layer pattern 352, and through-holes 371 to 374.
[0038] Here, if the distance between the inverter-driven power elements 411-414 and 441-444 and the control IC 61 is long, signal delay occurs due to the inductance component of the wiring. In particular, in this embodiment, GaN-FETs capable of high-speed switching are used as power elements 411-414 and 441-444, but if signal delay occurs, high-speed switching becomes difficult. Also, if switching at low speed, efficiency decreases and heat generation occurs due to losses during the on / off transition of the power elements. For this reason, it is desirable to shorten the wiring length between the control IC 61 and the power elements 411-414 and 441-444.
[0039] In this embodiment, control ICs 61 to 66 are mounted on the back surfaces of regions Ru1, Rv1, Rw1, Ru2, Rv2, and Rw2, respectively, and the control ICs 61 to 66 are connected to the power element groups 41 to 46 and 51 to 56 via inner layer patterns and through-holes. This makes it possible to shorten the wiring distance between the power elements and the control ICs.
[0040] Furthermore, the motor unit 10 in this embodiment is the main motor of the electric vehicle 90 and requires high output. To accommodate the increased output and current, multiple (four in this embodiment) power elements are connected in parallel in the electrical circuit section 30. For example, as shown in the reference example in Figure 16, if the power elements 411-414, 441-444 and the control IC 61 are mounted on the same side of the board and the control IC 61 is located outside the U1 region Ru1, the wiring length becomes longer. Also, if there is a difference in wiring inductance due to the difference in wiring length to the control IC 61 between the power elements connected in parallel, there is a risk that the switching timing will vary. If the switching timing varies between parallel elements, current will concentrate in one element, which may lead to increased heat generation and losses.
[0041] Furthermore, as shown in the reference example in Figure 17, variations in inductance between elements can be reduced by providing inner layer patterns 351 and 352. However, when the control IC 61 is mounted spaced apart from the U1 region Ru1, the linear wiring connecting the inner layer patterns 351 and 352 to the control IC 61 becomes longer, resulting in a relatively large wiring inductance.
[0042] In this embodiment, the control IC 61 is mounted in the projection area on the back surface of the U1 region Ru1, and a planar inner layer pattern 351 is formed in the inner layer of the substrate 31, overlapping at least a portion with the projection areas of the multiple parallel-connected power elements 411 to 414, and the control IC 61 and the power elements 411 to 414 are connected by through-holes 361 to 365. Similarly, a planar inner layer pattern 352 is formed in the inner layer of the substrate 31, overlapping at least a portion with the projection areas of the multiple parallel-connected power elements 441 to 444, and the control IC 61 and the power elements 441 to 444 are connected by through-holes 371 to 375. This makes it possible to equalize the wiring lengths between parallel-connected elements, equalize the wiring inductance, and suppress variations in switching timing between power elements that are switched simultaneously.
[0043] As described above, the electric circuit unit 30 controls the drive of the motor unit 20 having a plurality of phase windings 211 to 213, 221 to 223, and includes a substrate 31, power elements that constitute power element groups 41 to 46, 51 to 56, and control ICs 61 to 66. The power elements that constitute the power element groups 41 to 46, 51 to 56 are mounted on the motor surface 311 which is one mounting surface of the substrate 31, and switch the energization to the windings 211 to 213, 221 to 223.
[0044] The control ICs 61 to 66 are mounted on the cover surface 312 which is the mounting surface on the opposite side of the motor surface 311 of the substrate 31, and output drive signals to the power elements. The control ICs 61 to 66 are provided for each of the windings 211 to 213, 221 to 2, and are on the back side of the regions Ru1, Rv1, Rw1, Ru2, Rv2, Rw2 which are the regions where the power elements connected to the windings 211 to 213, 221 to 223 are mounted, and at least a part thereof is mounted overlapping the projection regions of the regions Ru1, Rv1, Rw1, Ru2, Rv2, Rw2.
[0045] As a result, the wiring length from the control ICs 61 to 66 to the power elements is shortened, so that the wiring inductance can be reduced. Further, in the present embodiment, the power element is a gallium nitride semiconductor, and high-speed switching is possible.
[0046] The power elements are provided in parallel on the high potential side and the low potential side for each of the windings 211 to 213. Hereinafter, the configuration corresponding to the power element group 41 provided on the high potential side of the U1 winding 211 and the power element group 44 provided on the low potential side will be described.
[0047] Power elements 411 to 414 are provided in parallel on the high-potential side of the U1 winding 211, and power elements 441 to 444 are provided in parallel on the low-potential side of the U1 winding 211. The U1 region Ru1 is a rectangular region that defines the outermost frames of a plurality of power elements 411 to 414 and 441 to 444 that are connected in parallel on the high-potential side and the low-potential side of the U1 winding 211. The control IC 61 is mounted inside the projection region of the U1 region Ru1. Thereby, the wiring inductance between the control IC 61 and the power elements 411 to 414 and 441 to 444 can be further reduced.
[0048] The control IC 61 and the power elements 411 to 414 and 441 to 444 are connected via inner layer patterns 351 and 352 formed on the inner layer of the substrate 31. By connecting the control IC 61 and the power elements 411 to 414 and 441 to 444 with surface patterns formed on the inner layer of the substrate 31, the wiring inductance can be further reduced.
[0049] The plurality of power elements 411 to 414 connected in parallel are connected to the control IC 61 via a common inner layer pattern 351, and are each mounted on the substrate 31 such that at least a part thereof overlaps with the projection region of the inner layer pattern 351, and are connected to the inner layer pattern 351 by through holes 361 to 364 formed at the overlapping portions. Further, the plurality of power elements 441 to 444 connected in parallel are connected to the control IC 61 via a common inner layer pattern 352, and are each mounted on the substrate 31 such that at least a part thereof overlaps with the projection region of the inner layer pattern 352, and are connected to the inner layer pattern 352 by through holes 371 to 374 formed at the overlapping portions. In the present embodiment, the power elements 411 to 414 and the projection region of the inner layer pattern 351 are arranged so that the overlapping areas are equal. Similarly, the power elements 441 to 444 and the projection region of the inner layer pattern 352 are arranged so that the overlapping areas are equal. Thereby, the variation in the wiring inductance between the parallel connections can be reduced.
[0050] The control IC 61 is connected to the inner layer patterns 351 and 352 via through-holes 365 and 375, which are formed at the center of the inner layer patterns 351 and 352. This reduces variations in the wiring inductance between parallel components. Note that the "center of the inner layer pattern" allows for a deviation that is sufficient to ensure that the inductances between the connected power elements are considered uniform.
[0051] The electric vehicle 90 of this embodiment includes an electric motor unit 10 having an electrical circuit section 30 and a motor section 20. The electric motor unit 10 of this embodiment is suitably applicable as the main motor of an electric vehicle 90 that requires high output.
[0052] (Second and Third Embodiments) The second embodiment is shown in Figure 9, and the third embodiment in Figure 10. In Figures 9 and 10, the U-phase of the first system will be used as an example, as in Figure 7. The fourth embodiment is similar. In the above embodiments, the power element groups 41 and 44 are arranged adjacent to each other in a straight line, whereas in the second embodiment shown in Figure 9, the power element group 44 is arranged with its orientation rotated by 90° from that of the power element group 41.
[0053] The control IC 61 is mounted on the back surface of the U1 region Ru1, which is a rectangular region defining the outermost frame of the power elements constituting the power element groups 41 and 44. In the second embodiment, the control IC 61 is positioned along the outer edge of the U1 region Ru1 on the power element group 41 side, overlapping with the projected area of the power elements 413, 414, 443, and 444. The wiring patterns 366 and 376 connecting the control IC 61 to the through-holes 365 and 375 are preferably formed to be as short as possible, and the wiring shape may differ from that shown in Figure 9. The same applies to the third embodiment.
[0054] In the third embodiment shown in Figure 10, the arrangement of the control IC 61 differs from that of the second embodiment. The control IC 61 is positioned towards the center of the U1 region Ru1 so as to overlap with the projection regions of the power elements 412, 441, and 442. This configuration also produces the same effects as the above embodiment.
[0055] (Fourth Embodiment) A fourth embodiment is shown in Figure 11. In the above embodiment, the control IC 61 is mounted on the cover surface 312 such that the entire IC is within the projected area of the U1 region Ru1. In the fourth embodiment, a portion of the control IC 61 is mounted on the cover surface 312 (not shown in Figure 11) such that a portion of the control IC 61 is within the projected area of the U1 region Ru1. This configuration also produces the same effects as the above embodiment. In Figure 11, the arrangement of the power element groups 41 and 44 is described as being the same as in the first embodiment, but the element arrangement may be the same as in the second embodiment, the third embodiment, or other arrangements. Also, in Figure 11, the depiction of through-holes and wiring patterns is omitted.
[0056] (Fifth Embodiment) The fifth embodiment is shown in Figures 12 and 13. In this embodiment, the first power element group 41 to 46 is arranged on one of the motor wire connection sections 321 to 326 which are arranged in a straight line, and the second power element group 51 to 56 is arranged on the other. Note that in Figure 13, the motor wire connection sections 321 to 326, the power terminal connection section 328, and the ground terminal connection section 329 are omitted from the description.
[0057] More specifically, from the top of the paper, the U-phase motor wire connection sections 321 and 324 are arranged adjacent to each other, the V-phase motor wire connection sections 322 and 325 are arranged adjacent to each other, and the W-phase motor wire connection sections 323 and 326 are arranged adjacent to each other.
[0058] Region U1 Ru1 and Region U2 Ru2 are positioned on either side of the motor wire connection parts 321 and 324, with their positions offset vertically on the paper so that the motor wire connection parts 321 and 324 are in an intermediate position relative to each region. Similarly, Region V1 Rv1 and Region V2 Rv2 are positioned on either side of the motor wire connection parts 322 and 325, with their positions offset vertically on the paper. Furthermore, Region W1 Rw1 and Region W2 Rw2 are positioned on either side of the motor wire connection parts 323 and 326, with their positions offset vertically on the paper.
[0059] The control ICs 61 to 66 are mounted in the center of the back surface of regions Ru1, Rv1, Rw1, Ru2, Rv2, and Rw2, respectively, and are connected to the power elements via inner layer patterns and through-holes (not shown in Figures 12 and 13). This configuration also produces the same effects as the embodiment described above.
[0060] In this embodiment, the electric motor unit 10 corresponds to the "rotating electric machine unit," the motor section 20 to the "rotating electric machine," the electrical circuit section 30 to the "electronic control device," the motor surface 311 of the substrate 31 to the "first surface," the cover surface 312 to the "second surface," the power elements constituting the power element groups 41-46 and 51-56 to the "driving elements," the through-holes 361-364 and 371-374 to the "element-side through-holes," and the through-holes 365 and 375 to the "IC-side through-holes." Furthermore, regions Ru1, Rv1, Rw1, Ru2, Rv2, and Rw2 correspond to the "element mounting regions."
[0061] (Other Embodiments) In the above embodiment, the electronic control device is applied to the main motor of an electric motorcycle. In other embodiments, the electronic control device may be applied to electric mobility other than electric motorcycles. For example, it may be applied to mobility such as the electric vehicle shown in Figure 14, the small electric bus shown in Figure 15, or a golf cart. Furthermore, the electronic control device may be applied to on-board auxiliary motors other than the main motor of an electric vehicle, or to something other than a vehicle.
[0062] In the above embodiment, the electric motor unit is provided with the electrical circuit section protruding radially outward from the motor section. In other embodiments, the electrical circuit section may be provided so as to be within the region projected axially from the motor section. The motor section may also be a so-called motor-generator that also functions as a generator. The component configuration and arrangement of the electric motor unit may differ.
[0063] (Disclosure of Technical Ideas) This specification discloses several technical ideas as described in the following paragraphs. Some paragraphs may be written in a multiple dependent form, where subsequent paragraphs optionally refer to preceding paragraphs. Furthermore, some paragraphs may be written in a multiple dependent form, where they refer to other multiple dependent forms. These paragraphs written in multiple dependent forms define several technical ideas.
[0064] (Technical Concept 1) An electronic control device for controlling the drive of a rotating electric machine (20) having multiple phase windings (211-213, 221-223), comprising: a substrate (31); drive elements (411-414, 441-444) mounted on a first surface (311), which is one mounting surface of the substrate, for switching the supply of current to the windings; and control ICs (61-66) mounted on a second surface (312), which is the mounting surface of the substrate opposite to the first surface, for outputting drive signals to the drive elements, wherein the control ICs are provided for each winding, and are mounted on the back side of an element mounting area, which is the area on which the drive elements connected to the windings are mounted, with at least a portion overlapping the projected area of the element mounting area. (Technical Concept 2) The electronic control device according to Technical Concept 1, wherein the multiple drive elements are provided in parallel on the high-potential and low-potential sides of each winding, the element mounting area is a rectangular area defining the outermost frame of the multiple drive elements connected in parallel on the high-potential and low-potential sides of the winding, and the control IC is mounted inside the projected area of the element mounting area. (Technical Concept 3) The electronic control device according to Technical Concept 1 or 2, wherein the control IC and the drive elements are connected via an inner layer pattern (351, 352) formed on the inner layer of the substrate. (Technical Concept 4) The electronic control device according to Technical Concept 3, wherein the multiple drive elements connected in parallel are connected to the control IC via a common inner layer pattern, and each is mounted on the substrate such that at least a portion of it overlaps with the projected area of the inner layer pattern, and is connected to the inner layer pattern by element-side through holes (361-364, 371-374) formed at the overlapping location. (Technical Idea 5) The control IC is connected to the inner layer pattern via IC-side through-holes (365, 375), and the IC-side through-holes are formed at the center of the inner layer pattern, as described in Technical Idea 3 or 4. (Technical Idea 6) The driving element is a gallium nitride semiconductor, as described in any one of Technical Ideas 1 to 5.(Technical Concept 7) An electric vehicle comprising an electronic control device (30) described in any one of Technical Concepts 1 to 6, and a rotating electric machine unit (10) having the rotating electric machine.
[0065] The present disclosure is not limited in any way to the embodiments described above, and can be implemented in various forms without departing from its spirit.
[0066] This disclosure is described in accordance with embodiments. However, this disclosure is not limited to such embodiments and structures. This disclosure also includes various modifications and variations within the scope of equivalents. Furthermore, various combinations and forms, as well as other combinations and forms that include only one, more, or fewer of those elements, fall within the scope and idea of this disclosure.
Claims
1. An electronic control device for controlling the drive of a rotating electric machine (20) having multiple phase windings (211-213, 221-223), comprising: a substrate (31); drive elements (411-414, 441-444) mounted on a first surface (311), which is one mounting surface of the substrate, for switching the supply of current to the windings; and control ICs (61-66) mounted on a second surface (312), which is the mounting surface of the substrate opposite to the first surface, for outputting drive signals to the drive elements, wherein the control ICs are provided for each winding, and are mounted on the back side of an element mounting area, which is the area on which the drive elements connected to the windings are mounted, with at least a portion overlapping the projected area of the element mounting area.
2. The electronic control device according to claim 1, wherein the drive elements are provided in parallel in multiples on the high-potential side and the low-potential side of each winding, the element mounting region is a rectangular region defining the outermost frame of the multiple drive elements connected in parallel on the high-potential side and the low-potential side of the winding, and the control IC is mounted inside the projected region of the element mounting region.
3. The electronic control device according to claim 1 or 2, wherein the control IC and the drive element are connected via inner layer patterns (351, 352) formed in the inner layer of the substrate.
4. The electronic control device according to claim 3, wherein a plurality of parallel-connected drive elements are connected to the control IC via a common inner layer pattern, and each is mounted on the substrate such that at least a portion of it overlaps with the projection area of the inner layer pattern, and is connected to the inner layer pattern by element-side through holes (361-364, 371-374) formed at the overlapping locations.
5. The control IC is connected to the inner layer pattern via IC-side through-holes (365, 375), and the IC-side through-holes are formed at the center of the inner layer pattern, as described in claim 3.
6. The electronic control device according to claim 1, wherein the driving element is a gallium nitride semiconductor.
7. An electric vehicle comprising the electronic control device (30) according to claim 1, and a rotating electric machine unit (10) having the rotating electric machine.