Electronic device and method for manufacturing same
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- LG ELECTRONICS INC
- Filing Date
- 2025-01-23
- Publication Date
- 2026-07-30
Smart Images
Figure KR2025001381_30072026_PF_FP_ABST
Abstract
Description
Electronic device and method of manufacturing the same
[0001] The present disclosure is applicable to technical fields related to the exteriors of various devices, and, for example, relates to electronic devices and methods for manufacturing the same.
[0002] Generally, the surfaces of electronic devices such as laptop computers can be made of stainless steel (SUS). In this case, the surface can be processed to form various patterns in order to prevent corrosion and fingerprint marks.
[0003] Patterns can be formed on such stainless steel materials using brushes or sandpaper. Additionally, the process of forming patterns on stainless steel can be applied to materials such as aluminum. When using aluminum, this process requires post-processing such as anodizing. However, problems may arise during this post-processing stage, such as reduced pattern visibility or blurring of product logos or brand shapes. In other words, the visibility of the pattern formed on the surface of the metal substrate may decrease during the post-processing stage, and a difference in shape may occur compared to the originally formed pattern.
[0004] Conventionally, the spray method is commonly used to implement exterior colors for electronic devices, but this has the disadvantage of giving a monotonous impression. Aluminum can be used in laptop computers to achieve a metallic feel, but in this case, a pure white color may not be achieved through the commonly performed anodizing process.
[0005] Therefore, measures to resolve such problems are required.
[0006] The present disclosure aims to provide an electronic device and a method for manufacturing the same, which can be produced with uniform quality by applying a pattern to a plurality of electronic devices.
[0007] The present disclosure aims to provide an electronic device capable of implementing various colors, including white, and a method for manufacturing the same.
[0008] The present disclosure aims to provide an electronic device capable of imparting aesthetic appeal and functionality through patterns in addition to color expression, and a method for manufacturing the same.
[0009] The present disclosure aims to provide an electronic device capable of realizing a metallic luster and a method for manufacturing the same.
[0010] The present disclosure aims to provide an electronic device capable of expressing a three-dimensional effect by applying a pattern, and a method for manufacturing the same.
[0011] Furthermore, according to other embodiments of the present invention, those skilled in the art will understand from the entire context of the specification and drawings that there may be additional technical problems not mentioned herein.
[0012] An electronic device according to one aspect of the present disclosure may include: a substrate layer; a color layer comprising a first layer having a first color located on the substrate layer; a first resin layer having a first pattern located on the color layer; a second resin layer having a second pattern located on the first resin layer; and a gloss layer located between the first resin layer and the second resin layer to impart gloss to the color layer.
[0013] A method for manufacturing an electronic device according to one aspect of the present disclosure may include the steps of: surface treating a substrate layer; forming a color layer on the substrate layer; forming a first resin layer on the color layer; bonding a first pattern mold having a first pattern onto the first resin layer; curing the first resin layer; and removing the first pattern mold to expose the first pattern.
[0014] A method for manufacturing an electronic device according to another aspect of the present disclosure may comprise: a method for manufacturing an electronic device having a plate-shaped substrate, the method comprising: a step of surface treating a substrate layer; a step of forming a color resin layer on a resin layer having a color on the substrate layer; a step of bonding a first pattern mold having a first pattern on the color resin layer onto the color resin layer; a step of curing the color resin layer; and a step of removing the first pattern mold to expose the first pattern.
[0015] According to at least one of the various embodiments of the present disclosure, the pattern shape to be implemented on the surface can be expressed as is without change, and there is an advantage that such a pattern can be applied to a plurality of electronic devices to produce them with uniform quality.
[0016] Accordingly, according to the embodiments of the present disclosure, the reproducibility, stability, and productivity of pattern formation can be improved.
[0017] According to the embodiments of the present disclosure, various colors can be realized by applying various colors to a color layer. In particular, patterns can be realized on a white color.
[0018] Meanwhile, a metallic luster can be achieved using a gloss layer, and furthermore, a three-dimensional effect can be expressed by applying optical patterns.
[0019] Accordingly, according to the embodiments of the present disclosure, the appearance of an electronic device can be enhanced with a three-dimensional pattern including a metallic luster. In addition, various functions can be provided.
[0020] Furthermore, according to another embodiment of the present invention, there are additional technical effects not mentioned herein. Those skilled in the art will understand this from the full context of the specification and drawings.
[0021] FIG. 1 is a perspective view showing an electronic device according to embodiments of the present disclosure.
[0022] FIG. 2 is a cross-sectional view showing the top plate of an electronic device according to a first embodiment of the present disclosure.
[0023] FIG. 3 is a cross-sectional view showing the top plate of an electronic device according to a modified example of the first embodiment of the present disclosure.
[0024] FIG. 4 is a cross-sectional view showing the top plate of an electronic device according to a second embodiment of the present disclosure.
[0025] FIGS. 5 to 10 are cross-sectional views illustrating the process of manufacturing an electronic device according to a first embodiment of the present disclosure.
[0026] FIGS. 11 and FIGS. 12 are cross-sectional views illustrating the process of manufacturing an electronic device according to a second embodiment of the present disclosure.
[0027] FIG. 13 is a flowchart illustrating the process of manufacturing an electronic device according to a first embodiment of the present disclosure.
[0028] FIG. 14 is a flowchart illustrating the process of manufacturing an electronic device according to a second embodiment of the present disclosure.
[0029] FIG. 15 is a cross-sectional view showing the top plate of an electronic device according to a third embodiment of the present disclosure.
[0030] FIG. 16 is a cross-sectional view showing the top plate of an electronic device according to a fourth embodiment of the present disclosure.
[0031] Hereinafter, embodiments related to the present disclosure will be described in more detail with reference to the drawings. The suffixes "module" and "part" for components used in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not have distinct meanings or roles in themselves.
[0032] The electronic device according to the embodiment of the present disclosure may be, for example, a computer, a laptop computer, a tablet, etc., and may also be applicable to a smartphone in some cases. In addition, the plate-shaped substrate applied to the electronic device according to the embodiment of the present disclosure may also be applied to interior and exterior materials for automobiles, aircraft, ships, etc.
[0033] FIG. 1 is a perspective view showing an electronic device according to embodiments of the present disclosure.
[0034] Referring to FIG. 1, a perspective view of an electronic device (10) according to embodiments of the present disclosure is shown. Here, a notebook computer is shown as a specific example of the electronic device (10).
[0035] For example, embodiments of the present disclosure may be applied to electronic devices (10) such as notebook computers. However, the embodiments of the present disclosure are not limited thereto and may be used for interior and exterior materials of various electronic devices such as smartphones, tablets, TVs, and desktop computers. In addition, the embodiments of the present disclosure may be used for various interior and exterior materials of automobiles, ships, etc. Furthermore, the embodiments of the present disclosure may be used for interior and exterior materials of buildings as well as for interior and exterior materials of general furniture.
[0036] In the following, a notebook computer is described as a specific example of an electronic device (10). Hereinafter, the electronic device (10) and the notebook computer (10) are described using the same reference numerals.
[0037] An electronic device (10), such as a notebook computer, can typically be composed of a top plate (110) and a bottom plate (120). Among these, the top plate (110) may include functional layers for color, pattern, and gloss for aesthetic appeal, durability, tactile feel, and other sensory qualities. Additionally, the top plate (110) may have text or patterns such as the brand, manufacturer, or logo of the electronic device (10) marked on it.
[0038] Referring to FIG. 1, an example is shown in which a brand (130) is marked on the top plate (110) of an electronic device (10). Additionally, an example is shown in which a pattern (201, 202) is provided on the surface layer of the top plate (110) of the electronic device (10). For example, such a pattern (201, 202) can function to improve the aesthetic appearance. For example, such a pattern (201, 202) can improve the touch sensation, grip sensation, and grip sensation without slipping when a user touches the top plate (110). For example, such a pattern (201, 202) can prevent damage such as corrosion of the top plate (110). For example, such a pattern (201, 202) can prevent contamination such as fingerprint marks from the user.
[0039] FIG. 2 is a cross-sectional view showing the top plate of an electronic device according to a first embodiment of the present disclosure.
[0040] Referring to FIG. 2, a schematic representation is shown of a state in which functional layers (210, 220, 230) are provided on a top plate (110) of an electronic device (10) according to a first embodiment of the present disclosure.
[0041] Here, the first embodiment of the present disclosure exemplarily illustrates a state in which functional layers (210, 220, 230) are provided on the top plate (110) of an electronic device (10). Accordingly, the top plate (110) of the electronic device (10) may be referred to as a substrate layer. That is, the functional layers (210, 220, 230) may be implemented by combining with the substrate layer of various products. For example, a substrate layer including these functional layers (210, 220, 230) may be referred to as a plate-type substrate.
[0042] Hereinafter, the top plate (110) and the substrate layer (110) are described using the same reference numeral.
[0043] For example, the substrate layer (110) may include a metal substrate. For example, the substrate layer (110) may include aluminum (Al) or magnesium (Mg). For example, the substrate layer (110) may be formed of aluminum (Al) or magnesium (Mg).
[0044] Referring to FIG. 2, a color layer (220) may be positioned on the top plate (110; substrate layer). For example, a chemical treatment may be performed to prevent corrosion of the substrate layer (110) and / or to improve adhesion. Accordingly, a chemical layer or primer (210) formed as a result of the chemical treatment may be provided between the substrate layer (110) and the color layer (220).
[0045] A color layer (220) including a first layer having a first color may be positioned on such a chemical layer or primer (210). For example, the color layer (220) may be formed as a first layer having a first color.
[0046] The color layer (220) can impart a color to the substrate layer (110). For example, white, gray, black, or other colors can be imparted to the substrate layer (110). For example, two or more such color layers (220) may be provided to express the intensity of the color. Meanwhile, particles (223) for expressing the color may be provided in the color layer (220). This will be described later with reference to FIG. 3.
[0047] When characters or patterns (130; see FIG. 1) such as the brand, manufacturer, or logo of an electronic device (10) are displayed, such characters or patterns (130) can be displayed using a color layer (220).
[0048] A resin layer (230) may be positioned on the color layer (220). A pattern (201) having unit shapes (231) may be provided on the surface of the resin layer (230). This pattern (201) may include at least one of a non-directional pattern, a hairline pattern, an etched pattern, an embossed pattern, a sandblasted pattern, a mirror pattern, and an optical pattern.
[0049] Due to such a pattern (201), the reflected light (R) from the incident light (A) is diffusely reflected at various angles, so that the resin layer (230) can improve the appearance of the surface together with the color layer (220). Meanwhile, as described above, the resin layer (230) having the pattern (201) can improve the appearance of the electronic device (10) including the substrate layer (110). For example, the resin layer (230) having the pattern (201) can improve sensory qualities such as touch sensation, grip sensation, and grip sensation. For example, the resin layer (230) having the pattern (201) can prevent damage such as corrosion of the top plate (110) and prevent contamination such as fingerprint marks of the user.
[0050] For example, the surface of electronic devices such as laptop computers can be made of stainless steel (SUS). In this case, the surface can be processed to form various patterns to prevent corrosion and fingerprint marks.
[0051] Patterns can be formed on such stainless steel materials using brushes or sandpaper. Additionally, the process of forming patterns on stainless steel can be applied to materials such as aluminum. When using aluminum, this process requires post-processing such as anodizing. However, problems may arise during this post-processing stage, such as reduced pattern visibility or blurring of product logos or brand shapes. In other words, the visibility of the pattern formed on the surface of the metal substrate may decrease during the post-processing stage, and a difference in shape may occur compared to the originally formed pattern.
[0052] However, according to the embodiments of the present disclosure as described above, the pattern shape to be implemented can be expressed as is without change, and there is an advantage in that such a pattern can be applied to multiple electronic devices to produce them with uniform quality. In this way, according to the embodiments of the present disclosure, the reproducibility, stability, and productivity of pattern formation can be improved.
[0053]
[0054] FIG. 3 is a cross-sectional view showing the top plate of an electronic device according to a modified example of the first embodiment of the present disclosure.
[0055] As mentioned above, with reference to FIG. 3, the color layer (220) may be provided with two or more layers to express the intensity of the color. For example, the color layer (220) may include a first layer (221) having a first color and a second layer (222) located on the first layer (221) and having a second color. However, the present disclosure is not limited thereto. For example, a color layer (220) comprising a single layer (221) may be sufficient to express a color.
[0056] For example, a darker color tone can be expressed by using a color layer (220) comprising a first layer (221) having a first color and a second layer (222) having a second color. For example, the first color and the second color may be the same. For example, the first color and the second color may be colors of the same color family. For example, the first color and the second color may be gray colors with different brightness levels. As an exemplary embodiment, the first color and the second color may be the same white. In this way, a darker color tone can be expressed by using two layers (221, 222) or more layers.
[0057] Meanwhile, the color layer (220) may be provided with particles (223) for color expression. These particles (223) may impart additional color or gloss to the color layer (220). For example, the particles (223) may impart a pearl color or metallic gloss. For example, these particles (223) may include metal particles or metal oxide particles.
[0058]
[0059] FIG. 4 is a cross-sectional view showing the top plate of an electronic device according to a second embodiment of the present disclosure.
[0060] Referring to FIG. 4, a schematic representation is shown of a state in which functional layers (210, 220, 230, 240, 250) are provided on a top plate (110) of an electronic device (10) according to a second embodiment of the present disclosure.
[0061] Here, the second embodiment of the present disclosure exemplarily illustrates a state in which functional layers (210, 220, 230, 240, 250) are provided on the top plate (110) of an electronic device (10). Accordingly, the top plate (110) of the electronic device (10) may be referred to as a substrate layer. That is, the functional layers (210, 220, 230, 240, 250) may be implemented by combining with the substrate layer of various products. For example, a substrate layer including these functional layers (210, 220, 230) may be referred to as a plate-type substrate. Hereinafter, the top plate (110) and the substrate layer (110) will be described using the same reference numerals.
[0062] For example, the substrate layer (110) may include a metal substrate. For example, the substrate layer (110) may include aluminum (Al) or magnesium (Mg). For example, the substrate layer (110) may be formed of aluminum (Al) or magnesium (Mg).
[0063] Referring to FIG. 4, a color layer (220) may be positioned on the top plate (110; substrate layer). For example, a chemical treatment may be performed to prevent corrosion of the substrate layer (110) and / or to improve adhesion. Accordingly, a chemical layer or primer (210) formed as a result of the chemical treatment may be provided between the substrate layer (110) and the color layer (220).
[0064] A color layer (220) including a first layer having a first color may be positioned on such a chemical layer or primer (210). For example, the color layer (220) may be formed as a first layer having a first color.
[0065] The color layer (220) can impart a color to the substrate layer (110). For example, white, gray, black, or other colors can be imparted to the substrate layer (110). For example, two or more layers of such a color layer (220) may be provided to express the intensity of the color (see FIG. 3). Meanwhile, particles (223) for expressing the color may be provided in the color layer (220) (see FIG. 3).
[0066] When characters or patterns (130; see FIG. 1) such as the brand, manufacturer, or logo of an electronic device (10) are displayed, such characters or patterns (130) can be displayed using a color layer (220).
[0067] A resin layer (230; hereinafter, first resin layer) may be positioned on the color layer (220). A pattern (201; hereinafter, first pattern) having unit shapes (231) may be provided on the surface of the first resin layer (230). This first pattern (201) may include at least one of a non-directional pattern, a hairline pattern, an etched pattern, an embossed pattern, a sandblasted pattern, a mirror pattern, and an optical pattern.
[0068] Due to this first pattern (201), the reflected light (R) from the incident light (A) is diffusely reflected at various angles, so that the first resin layer (230) can improve the appearance of the color layer (220). Meanwhile, as described above, the first resin layer (230) having the pattern (201) can improve the appearance of the electronic device (10) including the substrate layer (110).
[0069] A gloss layer (240) that imparts gloss to the color layer (220) may be positioned on the first resin layer (230). For example, this gloss layer (240) may impart a metallic gloss.
[0070] For example, this gloss layer (240) may include either chromium (Cr) or zirconium (Zr). However, the present disclosure is not limited thereto. For example, the gloss layer (240) may be formed on the first resin layer (230) by a Physical Vapor Deposition (PVD) method.
[0071] For example, when characters or patterns (130; see FIG. 1) such as the brand, manufacturer, or logo of an electronic device (10) are displayed, such characters or patterns (130) may be displayed using a gloss layer (240). For example, characters or patterns (130) may be formed using a PVD (Physical Vapor Deposition) method.
[0072] A second resin layer (250) may be positioned on the gloss layer (240). A pattern (202; hereinafter referred to as the second pattern) having unit shapes (251) may be provided on the surface of the second resin layer (240). This second pattern (202) may include at least one of a non-directional pattern, a hairline pattern, an etched pattern, an embossed pattern, a sandblasted pattern, a mirror pattern, and an optical pattern. This second pattern (202) and the first pattern (201) may be the same or different from each other.
[0073] For example, the second resin layer (250) having the second pattern (202) can be exposed to the outside to improve sensory quality such as touch, grip, and hold. For example, the second resin layer (250) having the pattern (202) can prevent damage such as corrosion of the top plate (110) and prevent contamination such as fingerprint marks of the user.
[0074] In this way, a gloss layer (240) that imparts gloss to the color layer (220) may be provided between the first resin layer (230) and the second resin layer (250).
[0075] As mentioned above, at least one of the first pattern (201) and the second pattern (202) may include at least one of a non-directional pattern, a hairline pattern, an etched pattern, an embossed pattern, a sandblasted pattern, a mirror pattern, and an optical pattern.
[0076]
[0077] FIGS. 5 to 10 are cross-sectional views illustrating the process of manufacturing an electronic device according to a first embodiment of the present disclosure. FIG. 13 is a flowchart illustrating the process of manufacturing an electronic device according to a first embodiment of the present disclosure.
[0078] Hereinafter, a process (S100) for manufacturing an electronic device according to a first embodiment of the present disclosure will be described step by step with reference to FIGS. 5 to 10 and FIG. 13 together.
[0079] First, referring to FIG. 5, the substrate layer (110) of the electronic device (10) can be surface treated (S110). For example, the substrate layer (110) of the electronic device (10) can be chemically treated or a primer (210) can be applied.
[0080] Accordingly, a chemical layer or primer (210) formed as a result of chemical treatment may be formed on the substrate layer (110). This chemical layer or primer (210) can improve the adhesion of a functional layer, for example, a color layer (220), that is subsequently formed.
[0081] Subsequently, referring to FIG. 6, a color layer (220) can be formed on the substrate layer (110) (S120). This color layer (220) can be white, gray, black, or other colors. There are no restrictions on the colors applied to the color layer (220), so a color layer (220) of various colors can be formed.
[0082] In particular, a white color can be realized in the color layer (220). Although it is usually difficult to achieve a white color through post-processing of metal (e.g., anodizing), according to the embodiments of the present disclosure, a color layer (220) having a clear white color can be realized.
[0083] The step of forming such a color layer (220) can be achieved by performing silk printing on the substrate layer (110).
[0084] When characters or patterns (130; see FIG. 1), such as a brand, manufacturer, or logo of an electronic device (10), are to be displayed, such characters or patterns (130) can be displayed using a color layer (220). For example, after printing a first layer (221) having a first color on a substrate layer (110), characters or patterns (130), such as a brand, manufacturer, or logo, can be printed on the first layer (221).
[0085] Meanwhile, for example, such a color layer (220) may be provided in two or more layers to express the intensity of the color. For example, the step of forming the color layer (220) may include the step of forming a first layer (221; see FIG. 3) having a first color and the step of forming a second layer (222; see FIG. 3) having a second color on the first layer. In some cases, the second layer (222) having a second color may include the letters or patterns (130) such as the brand, manufacturer, or logo described above.
[0086] In an exemplary embodiment, the color layer (220) may be provided with particles (223; see FIG. 3) for color expression. For example, after applying the color layer (220), the particles (223) for color expression may be applied, or silk printing may be performed using a material containing the particles (223). These particles (223) may include metal or metal oxide particles. For example, the process of forming the color layer (220) may include the process of applying metal or metal oxide particles.
[0087] Next, referring to FIG. 7, a first resin layer (232) can be formed on the color layer (220) (S130). This first resin layer (232) may be in a flexible state as a resin layer prior to curing. Meanwhile, in addition to resin, various materials that can be cured through post-processing may be used. For example, in addition to resin, various materials that can be cured by heat or light (ultraviolet rays) may be used.
[0088] Referring to FIG. 8, a first pattern mold (300) having a first pattern (201) or a corresponding pattern (310) corresponding to the first pattern (201) can be placed on the first resin layer (232).
[0089] Subsequently, as illustrated in FIG. 9, the first pattern mold (300) can be bonded to the first resin layer (232) (S140). Accordingly, a first resin layer (233) that has a unit shape (231) corresponding to the first pattern can be formed. In this way, a first pattern (201; see FIG. 2) having a unit shape (231) corresponding to the corresponding pattern (310) of the first pattern mold (300) can be formed on the upper surface of the first resin layer (232).
[0090] Next, the first resin layer (232) can be cured (S150). This curing process may depend on the characteristics of the first resin layer (232). For example, if the first resin layer (232) is a UV-curing film, UV light can be irradiated onto the first resin layer (232) using a UV lamp (400). As another example, if the first resin layer (232) is a heat-curing film, heat can be applied to the first resin layer (232) to cure the first resin layer (232).
[0091] Afterward, referring to FIG. 10, the first pattern mold (300) can be removed (S160). Through this process, the first resin layer (230) can be cured with a pattern (201) having unit shapes (231) formed on its surface. In this process, the first pattern (201) can be exposed.
[0092]
[0093] FIGS. 11 and 12 are cross-sectional views illustrating the process of manufacturing an electronic device according to a second embodiment of the present disclosure. FIG. 14 is a flowchart illustrating the process of manufacturing an electronic device according to a second embodiment of the present disclosure.
[0094] Hereinafter, a process (S200) for manufacturing an electronic device according to a first embodiment of the present disclosure is described step-by-step with reference to FIGS. 11, 12, and 14. Here, processes common to the first embodiment are omitted, and subsequent processes are briefly described.
[0095] Referring to FIG. 11, a gloss layer (240) can be formed on the first pattern (201) formed by the process described above (S210). Since this gloss layer (240) is formed on the first pattern (201), it can be formed along the surface of the first pattern (201).
[0096] This polish layer (240) may have a metallic luster. The polish layer (240) may include either chromium (Cr) or zirconium (Zr). However, it goes without saying that the polish layer (240) may also be formed from various metals such as silver (Ag), aluminum (Al), titanium (Ti), magnesium (Mg), and gold (Au).
[0097] As an exemplary embodiment, the gloss layer (240) can be formed by a PVD (Physical Vapor Deposition) method. However, the gloss layer (240) can also be formed by various other methods of forming a metal thin film.
[0098] Afterwards, referring to FIG. 12, a second resin layer (250) can be formed on the gloss layer (240) (S220). Afterwards, a second pattern (202) can be formed on the second resin layer (250). The process of forming this second pattern (202) may be the same as the process of forming the first pattern (201) described above.
[0099] For example, the process of forming the second pattern (202) may include a process (230) of bonding a second pattern mold (320) having the second pattern or a corresponding pattern (330) corresponding to the second pattern onto the second resin layer (250), a process (S240) of curing the second resin layer (250), and a process (S250) of removing the second pattern mold (320). Through this process, the second pattern (202) may be exposed.
[0100] At this time, for example, at least one of the first pattern (201) and the second pattern (202) may include at least one of a non-directional pattern, a hairline pattern, an etched pattern, an embossed pattern, a sandblasted pattern, a mirror pattern, and an optical pattern.
[0101] According to the embodiments of the present disclosure as described above, various colors can be realized by applying various colors to the color layer (220). In particular, patterns can be realized in white. Conventional methods for realizing white color generally involve a spray method, but this has the disadvantage of having a monotonous feel. Aluminum can be used in notebook computers to create a metallic feel, and in this case, anodizing is typically used as a post-processing step, but a white color may not be realized through this process.
[0102] However, according to the embodiments of the present disclosure, a white color can be applied, and at the same time, additional functions can be provided through pattern formation.
[0103] Meanwhile, a metallic luster can be achieved using a gloss layer, and furthermore, a three-dimensional effect can be expressed by applying optical patterns.
[0104] Accordingly, according to the embodiments of the present disclosure, the appearance of an electronic device can be enhanced with a three-dimensional pattern including a metallic luster. In addition, various functions can be provided.
[0105]
[0106] FIG. 15 is a cross-sectional view showing the top plate of an electronic device according to a third embodiment of the present disclosure.
[0107] Referring to FIG. 15, a schematic representation is shown of a state in which functional layers (210, 220) are provided on the top plate (110) of an electronic device (10) according to a third embodiment of the present disclosure.
[0108] Here, the third embodiment of the present disclosure exemplarily illustrates a state in which functional layers (210, 220) are provided on the top plate (110) of an electronic device (10). Accordingly, the top plate (110) of the electronic device (10) may be referred to as a substrate layer. That is, the functional layers (210, 220) may be implemented by combining with the substrate layer of various products. For example, a substrate layer including these functional layers (210, 220) may be referred to as a plate-type substrate.
[0109] Hereinafter, the top plate (110) and the substrate layer (110) are described using the same reference numeral.
[0110] For example, the substrate layer (110) may include a metal substrate. For example, the substrate layer (110) may include aluminum (Al) or magnesium (Mg). For example, the substrate layer (110) may be formed of aluminum (Al) or magnesium (Mg).
[0111] Referring to FIG. 15, a color layer (220) may be positioned on a top plate (110; substrate layer). For example, a chemical treatment may be performed to prevent corrosion of the substrate layer (110) and / or to improve adhesion. Accordingly, a chemical layer or primer (210) formed as a result of the chemical treatment may be provided between the substrate layer (110) and the color layer (220).
[0112] A color layer (220) including a first layer having a first color may be positioned on such a chemical layer or primer (210). For example, the color layer (220) may be formed as a first layer having a first color.
[0113] The color layer (220) can impart color to the substrate layer (110). For example, white, gray, black, or other colors can be imparted to the substrate layer (110).
[0114] FIG. 15 (a) shows a state in which a first color layer (224) with a first color is provided. FIG. 15 (b) shows a state in which a second color layer (225) with a first color is provided. FIG. 15 (c) shows a state in which a third color layer (226) with a first color is provided. Meanwhile, the color layer (220) may be provided with particles (223; see FIG. 3) for color expression.
[0115] When characters or patterns (130; see FIG. 1) such as the brand, manufacturer, or logo of an electronic device (10) are displayed, such characters or patterns (130) can be displayed using a color layer (220).
[0116] Such color layers (224, 225, 226; 220) can be implemented as resin layers. As described above, various materials that can be cured through post-processing can be used for these resin layers. For example, in addition to resin, various materials that can be cured by heat or light (ultraviolet rays) can be used.
[0117] A color layer (220; color resin layer) implemented with such a resin layer may be provided with a pattern (201) having unit shapes (227). This pattern (201) may include at least one of a non-directional pattern, a hairline pattern, an etched pattern, an embossed pattern, a sandblasted pattern, a mirror pattern, and an optical pattern.
[0118] Due to such a pattern (201), the reflected light (R) from the incident light (A) is diffusely reflected at various angles, and the color layer (220; 224, 225, 226; color resin layer) having the pattern (201) can improve the appearance. Meanwhile, as described above, the color layer (220) having the pattern (201) can improve the appearance of the electronic device (10) including the substrate layer (110). For example, the color layer (220) having the pattern (201) can improve sensory quality such as touch sensation, grip sensation, and grip sensation. For example, the resin layer (230) having the pattern (201) can prevent damage such as corrosion of the top plate (110) and prevent contamination such as fingerprint marks of the user.
[0119] For example, the surface of electronic devices such as laptop computers can be made of stainless steel (SUS). In this case, the surface can be processed to form various patterns to prevent corrosion and fingerprint marks.
[0120] Patterns can be formed on such stainless steel materials using brushes or sandpaper. Additionally, the process of forming patterns on stainless steel can be applied to materials such as aluminum. When using aluminum, this process requires post-processing such as anodizing. However, problems may arise during this post-processing stage, such as reduced pattern visibility or blurring of product logos or brand shapes. In other words, the visibility of the pattern formed on the surface of the metal substrate may decrease during the post-processing stage, and a difference in shape may occur compared to the originally formed pattern.
[0121] However, according to the embodiments of the present disclosure as described above, the pattern shape to be implemented can be expressed as is without change, and there is an advantage in that such a pattern can be applied to multiple electronic devices to produce them with uniform quality. In this way, according to the embodiments of the present disclosure, the reproducibility, stability, and productivity of pattern formation can be improved.
[0122] According to the present embodiment, by using a color layer (220; 224, 225, 226; color resin layer) implemented as a resin layer having a pattern (201) having these unit shapes (227), the laminated structure of the functional layer is simplified, and accordingly, the manufacturing steps and manufacturing costs can be reduced.
[0123]
[0124] FIG. 16 is a cross-sectional view showing the top plate of an electronic device according to a fourth embodiment of the present disclosure.
[0125] Referring to FIG. 16, a schematic representation is shown of a state in which functional layers (210, 241, 220) are provided on a top plate (110) of an electronic device (10) according to a fourth embodiment of the present disclosure.
[0126] The substrate layer (110) may include a metal substrate. For example, the substrate layer (110) may include aluminum (Al) or magnesium (Mg). For example, the substrate layer (110) may be formed of aluminum (Al) or magnesium (Mg).
[0127] A substrate layer (110) containing such a metal substrate may include a mirror-polished polished layer (241). For example, the surface of the substrate layer (110) may be mirror-polished (polished) to form the polished layer (241). This polished layer (241) has a metallic luster, and accordingly, it may be possible to achieve an appearance with a metallic luster.
[0128] A color layer (220; 224; color resin layer) implemented as a resin layer having a pattern (201) having unit shapes (227) may be positioned on such a polishing layer (241). This color layer (224) may be the same as the third embodiment described above. Therefore, redundant descriptions are omitted.
[0129] The electronic device according to the third and fourth embodiments described above may include a simplified manufacturing process compared to the other embodiments described above.
[0130] For example, in the manufacturing process of an electronic device according to the third and fourth embodiments, the step of forming a first resin layer (232) on a color layer (220) in the manufacturing step described above with reference to FIG. 13 may be omitted (S130). That is, a color layer (220; 224, 225, 226; color resin layer) may be formed with a color-applied resin layer, and a first pattern (201) may be formed on this color layer (220). In some cases, the color layer (220; 224, 225, 226) may be formed through a process of forming a resin layer and applying color to this resin layer.
[0131] Referring to FIG. 13, the manufacturing process of the electronic device according to the third and fourth embodiments may include the steps of surface treating a substrate layer (110) (S110), forming a color resin layer (224, 225, 226) having a color applied to the resin layer on the substrate layer (110) (S130), bonding a first pattern mold (300) having a first pattern onto the color resin layer (224, 225, 226) (S140), curing the color resin layer (224, 225, 226) (S150), and removing the first pattern mold (300) to expose the first pattern (201) (S160).
[0132] Meanwhile, the manufacturing process of the electronic device according to the third and fourth embodiments may further include a process of mirror polishing (grinding) the surface of the metal when the substrate layer (110) includes metal. For example, according to the manufacturing process of the electronic device according to the fourth embodiment, the process of polishing (grinding) the surface of the metal forming the substrate layer (110) to form a polished layer (241) may further include a process of forming a polished layer (241).
[0133] For parts not otherwise described, the manufacturing process described above with reference to the first and second embodiments may be applied in the same way.
[0134]
[0135] The electronic device described above is not limited to the configuration and method of the embodiments described above; rather, all or part of each embodiment may be selectively combined to allow for various modifications to be made.
[0136] The above description is merely an illustrative explanation of the technical concept of the present disclosure, and those skilled in the art to which the present disclosure pertains may make various modifications and variations within the scope of the essential characteristics of the present disclosure without departing from its nature.
[0137] Accordingly, the embodiments disclosed in this disclosure are intended to explain, not limit, the technical concept of this disclosure, and the scope of the technical concept of this disclosure is not limited by these embodiments.
[0138] The scope of protection of the present disclosure shall be interpreted by the claims below, and all technical ideas within the equivalent scope shall be interpreted as being included within the scope of rights of the present disclosure.
[0139] According to the present disclosure, an electronic device and a method for manufacturing the same can be provided.
Claims
1. Record layer; A color layer comprising a first layer located on the above substrate layer and having a first color; A first resin layer located on the above-mentioned color layer and having a first pattern; A second resin layer located on the first resin layer and having a second pattern; and A gloss layer positioned between the first resin layer and the second resin layer to impart gloss to the color layer Electronic device.
2. In claim 1, the substrate layer comprises aluminum or magnesium. Electronic device.
3. In claim 1, the color layer further comprises a second layer having a second color. Electronic device.
4. In claim 1, the color layer further comprises metal or metal oxide particles Electronic device.
5. In claim 1, the gloss layer has a metallic luster. Electronic device.
6. In claim 1, at least one of the first pattern and the second pattern comprises at least one of a non-directional pattern, a hairline pattern, an etched pattern, an embossed pattern, a sandblasted pattern, a mirror pattern, and an optical pattern. Electronic device.
7. A method for manufacturing an electronic device having a plate-shaped substrate, Step of surface treating the substrate layer; A step of forming a color layer on the above substrate layer; A step of forming a first resin layer on the above color layer; A step of bonding a first pattern mold having a first pattern onto the first resin layer; A step of curing the first resin layer; and A step comprising removing the first pattern mold to expose the first pattern Method of manufacturing an electronic device.
8. In claim 7, the substrate layer comprises aluminum or magnesium. Method of manufacturing an electronic device.
9. In claim 7, the surface treatment step Chemical treatment of the surface of the substrate layer or coating of a primer on the surface of the substrate layer Method of manufacturing an electronic device.
10. In claim 7, the step of forming the color layer A step of forming a first layer having a first color; and A step comprising forming a second layer having a second color on the first layer. Method of manufacturing an electronic device.
11. In claim 7, the step of forming the color layer A step comprising applying metal or metal oxide particles Method of manufacturing an electronic device.
12. In claim 7, the step of forming a gloss layer on the first pattern is further included Method of manufacturing an electronic device.
13. In claim 12, the gloss layer comprises either chromium (Cr) or zirconium (Zr). Method of manufacturing an electronic device.
14. In Clause 12, the step of forming a second resin layer on the gloss layer; A step of bonding a second pattern mold having a second pattern onto the second resin layer; A step of curing the second resin layer; and The method further includes the step of removing the second pattern mold to expose the second pattern. Method of manufacturing an electronic device.
15. In claim 7, at least one of the first pattern and the second pattern comprises at least one of a non-directional pattern, a hairline pattern, an etched pattern, an embossed pattern, a sandblasted pattern, a mirror pattern, and an optical pattern. Method of manufacturing an electronic device.
16. A method for manufacturing an electronic device having a plate-shaped substrate, Step of surface treating the substrate layer; A step of forming a colored resin layer on the above substrate layer, wherein the resin layer is colored; A step of bonding a first pattern mold having a first pattern on the color resin layer onto the color resin layer; A step of curing the above-mentioned color resin layer; and A step comprising removing the first pattern mold to expose the first pattern Method of manufacturing an electronic device.
17. In paragraph 16, the above-mentioned substrate layer comprises metal, and The method further includes the step of polishing the metal surface. Method of manufacturing an electronic device.