Electronic device comprising magnetic field shielding sheet

Abstract

According to an embodiment of the present invention, an electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201) may comprise: a housing structure (210; 240; 510; 610; 910; 1010; 1120; 1230) for containing electronic components; a battery assembly (520; 620; 720; 820) for supplying power to the electronic components; a magnetic field shielding sheet (530; 630; 730; 830; 930; 1030) overlapping a pair of terminals (522; 622; 822; 922; 1022) of the battery assembly (520; 620; 720; 820) in the thickness direction of the electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201); a first heat dissipator (540; 640; 740; 840; 940; 1040) disposed on one side of the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030); a second heat dissipator (550; 650; 750; 850; 950; 1050) disposed on the other side of the first heat dissipator (540; 640; 740; 840; 940; 1040) with reference to the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030); and a third heat dissipator (560) interconnecting the first heat dissipator (540; 640; 740; 840; 940; 1040) and the second heat dissipator (550; 650; 750; 850; 950; 1050).

Description

Electronic device including a magnetic field shielding sheet

[0001] The following disclosure relates to an electronic device comprising a magnetic field shielding sheet.

[0002] Electronic devices contain numerous electronic components, and the current flowing through these components can generate magnetic fields. Since these generated magnetic fields have the potential to have adverse effects on the human body or surrounding components, it is necessary to shield the magnetic fields to keep their strength within a certain level. For example, some countries have established standards to minimize magnetic field interference between electronic devices and hearing aids when users utilize them. Whether such standards are met can be determined by whether the magnetic field strength measured in a specific area of ​​the electronic device remains within a certain level.

[0003] The aforementioned related art is possessed or acquired during the process of deriving the present disclosure and cannot be considered prior art disclosed to the general public prior to the filing of the present disclosure.

[0004] According to one embodiment, an electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201) comprises a housing structure (210; 240; 510; 610; 910; 1010; 1120; 1230) for accommodating electronic components, a battery assembly (520; 620; 720; 820) for supplying power to said electronic components, and in the thickness direction of said electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201), said battery assembly (520; 620; 720; A magnetic field shielding sheet (530; 630; 730; 830; 930; 1030) overlapping a pair of terminals (522; 622; 822; 922; 1022) of 820), a first heat dissipator (540; 640; 740; 840; 940; 1040) disposed on one side of the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030), and a second heat dissipator (540; 640; 740; 840; 940; 1040) disposed on the opposite side of the first heat dissipator (540; 640; 740; 840; 940; 1040) with respect to the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030). It may include a heat dissipation body (550; 650; 750; 850; 950; 1050), and a third heat dissipation body (560) that interconnects the first heat dissipation body (540; 640; 740; 840; 940; 1040) and the second heat dissipation body (550; 650; 750; 850; 950; 1050).

[0005] According to one embodiment, an electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201) comprises a housing structure (210; 240; 510; 610; 910; 1010; 1120; 1230) for accommodating electronic components, and is installed in the housing structure (210; 240; 510; 610; 910; 1010; 1120; 1230), and visually transmits information to the outside of the electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201). A display (261; 570; 1160; 1250c) providing power to the electronic components, a battery assembly (520; 620; 720; 820) for supplying power to the electronic components, and a display (261; 570; 1160; 1250c) and a battery assembly (520; 620; 720; 820) disposed in the thickness direction of the electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201), wherein a magnetic field generated from at least one terminal (522; 622; 822; 922; 1022) of the battery assembly (520; 620; 720; 820) is disposed between the display (261; 570; 1160; 1250c) and the battery assembly (520; 620; 720; 820) is formed such that, in the thickness direction of the electronic device (501; 601; 701; 801; 101; 201), a magnetic field generated from at least one terminal (522; 622; 822; 922; 1022) of the battery assembly (520; 620; 720; 820) is formed such that the A magnetic field shielding sheet (530; 630; 730; 830; 930; 1030) for reducing leakage toward a display (261; 570; 1160; 1250c), a first heat dissipator (540; 640; 740; 840; 940; 1040) and a second heat dissipator (550; 650; 750; 850; 950; 1050) spaced apart on opposite sides centered on the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030), the first heat dissipator (540; 640; 740; 840; 940; 1040) and the second heat dissipator (550; 650; 750; 850; 950;It may include a third heat dissipator (560) that forms a heat transfer path from one heat dissipator with a higher temperature to the other heat dissipator among the 1050.;

[0006] According to one embodiment, an electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201) comprises a housing structure (210; 240; 510; 610; 910; 1010; 1120; 1230), a circuit board (251; 252; 590; 690; 790; 890) installed in the housing structure (210; 240; 510; 610; 910; 1010; 1120; 1230) and on which electronic components can be arranged, and the housing structure (210; 240; 510; 610; 910; 1010; 1120; 1120; A display (261; 570; 1160; 1250c) installed in the electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201) that visually provides information to the outside of the electronic device (501; 601; 701; 801; 101; 201), a battery cell (521; 621; 821) including a positive electrode and a negative electrode, a pair of terminals (522; 622; 822; 922; 1022) respectively connected to the positive electrode and the negative electrode, and connected to the pair of terminals (522; 622; 822; 922; 1022) and input to the battery cell (521; 621; 821) or the battery cell (521; 621; A battery assembly (520; 620; 720; 820) comprising a circuit module (523; 623; 823; 1023) for controlling current output from (821), disposed between the display (261; 570; 1160; 1250c) and the battery assembly (520; 620; 720; 820) in the thickness direction of the electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201) and the battery assembly (520; 620; 720; 820), and overlapping with a pair of terminals (522; 622; 822; 922; 1022) of the battery assembly (520; 620; 720; 820). Magnetic field shielding sheet (530; 630; 730; 830; 930; 1030), the electronic device (501; 601; 701;801; 101; 201; 102; 104; 901; 1001; 1101; A first sub-heat sink (540; 640; 740; 840; 940; 1040) that overlaps the battery cell (521; 621; 821) in the thickness direction of 1201; a second sub-heat sink (550; 650; 750) that is spaced apart from the first sub-heat sink (540; 640; 740; 840; 940; 1040) and disposed on the opposite side of the first sub-heat sink (540; 640; 740; 840; 940; 1040) with respect to the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030), and overlaps the central processing unit core (791a; 891a) of the main processor among the electronic components; 850; 950; 1050), the first sub-heat sink (540; 640; 740; 840; 940; 1040) and the second sub-heat sink (550; 650; 750; 850; 950; 1050) are interconnected, and the first sub-heat sink (540; 640; 740; 840; 940; 1040) and the second sub-heat sink (550; 650; 750; 850; 950; 1050) have a thermal conductivity value higher than that of the first sub-heat sink (540; 640; 740; 840; 940; 1040) and the second sub-heat sink (550; 650; 750; 850; 950; 1050), and the electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; It may include a main heat sink (560) located at a height closer to the circuit board (251; 252; 590; 690; 790; 890) than the first sub-heat sink (540; 640; 740; 840; 940; 1040) and the second sub-heat sink (550; 650; 750; 850; 950; 1050) in the thickness direction of 1101; 1201.;

[0007] The above and other aspects, features, and advantages according to specific embodiments of the present disclosure will become more apparent from the detailed description below with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment.

[0009] FIG. 2 is a front perspective view of an electronic device according to one embodiment.

[0010] FIG. 3 is a rear perspective view of an electronic device according to one embodiment.

[0011] FIG. 4 is a rear exploded perspective view of an electronic device according to one embodiment.

[0012] FIG. 5 is a front exploded perspective view of an electronic device according to one embodiment.

[0013] FIG. 6 is a plan view taken from the front of an electronic device according to one embodiment with the display separated.

[0014] FIG. 7 is a plan view taken from the front of FIG. 6 with the magnetic field shielding sheet, the first heat dissipator, and the second heat dissipator separated.

[0015] FIG. 8 is a diagram showing the arrangement relationship of electronic components, a battery assembly, a magnetic field shielding sheet, and heat dissipators in an electronic device according to one embodiment.

[0016] FIG. 9 is a plan view from the rear of an electronic device according to one embodiment with the rear plate separated.

[0017] FIG. 10 is a partial perspective view showing the installation of a battery assembly in an electronic device according to one embodiment.

[0018] FIG. 11 is a plan view taken from the front of an electronic device according to one embodiment with the display separated.

[0019] FIG. 12 is an exploded perspective view showing a circuit board, a main processor, and peripheral components in an electronic device according to one embodiment.

[0020] FIG. 13 is a diagram showing the arrangement relationship of electronic components, a battery assembly, a magnetic field shielding sheet, and heat dissipators in an electronic device according to one embodiment.

[0021] FIG. 14 is a diagram showing the results of measuring the magnetic field strength of each region on the front of an electronic device according to one embodiment in the form of contour lines.

[0022] FIG. 15 is a diagram showing the arrangement relationship of electronic components, a battery assembly, a magnetic field shielding sheet, and heat dissipators in an electronic device according to one embodiment.

[0023] FIG. 16 is a plan view taken from the front of an electronic device according to one embodiment with the display separated.

[0024] FIG. 17 is a plan view taken from the front of an electronic device according to one embodiment with the display separated.

[0025] FIG. 18 is a drawing illustrating a first state of an electronic device according to one embodiment.

[0026] FIG. 19 is a drawing illustrating a second state of an electronic device according to one embodiment.

[0027] FIG. 20 is a drawing illustrating a second state of an electronic device according to one embodiment.

[0028] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are given the same reference numeral regardless of the drawing number, and redundant descriptions thereof will be omitted.

[0029]

[0030] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment.

[0031] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0032] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0033] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0034] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0038] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0039] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0040] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0044] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0046] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 eB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0049] An antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0050] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0051] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] The electronic device according to the embodiments may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the embodiments of this document is not limited to the aforementioned devices.

[0054] The embodiments and the terms used therein are not intended to limit the technical features described herein to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or any combination thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0055] The term "module" as used in the embodiments may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0056] According to embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0057]

[0058] FIG. 2 is a front perspective view of an electronic device according to one embodiment. FIG. 3 is a rear perspective view of an electronic device according to one embodiment. FIG. 4 is a rear exploded perspective view of an electronic device according to one embodiment.

[0059] Referring to FIGS. 2 through 4, an electronic device (e.g., the electronic device (101) of FIG. 1) may include a housing structure forming a first surface (or front), a second surface (or rear), and a side that surrounds the space between the first surface and the second surface. It should be noted that the shape of the housing structure shown in the drawings is exemplary.

[0060] An electronic device (201) according to one embodiment may include a housing structure (210) that forms an exterior and accommodates a component inside. The housing structure (210) may form a front side (210a) (e.g., a side facing the + Z direction), a rear side (210b) (e.g., a side facing the - Z direction), and a side (211c) that surrounds the internal space between the front side (210a) and the rear side (210b). In one embodiment, the housing structure (210) may form the side (211c) through a first side (211c-1) (e.g., a side facing the - Y direction) connecting the front side (210a) and the rear side (210b), a second side (211c-2) (e.g., a side facing the + Y direction), a third side (211c-3) (e.g., a side facing the + X direction), and a fourth side (211c-4) (e.g., a side facing the - X direction).

[0061] In one embodiment, the front (210a) may be formed by a front plate (211a) in which at least a portion is substantially transparent. For example, the front plate (211a) may comprise a glass plate or a polymer plate comprising at least one coating layer. In one embodiment, the rear (210b) may be formed by a rear plate (211b) that is substantially opaque. For example, the rear plate (211b) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, magnesium, or a combination thereof), or a combination thereof. In one embodiment, the side (211c) may be formed by a front frame (240) comprising metal and / or polymer, which is coupled to the front plate (211a) and the rear plate (211b). In one embodiment, the rear plate (211b) and the front frame (240) may be formed integrally and seamlessly. In one embodiment, the rear plate (211b) and the front frame (240) may be formed of substantially the same material (e.g., aluminum).

[0062] In one embodiment, the front plate (211a) may include a plurality of first edge regions (212a-1) that are oriented in one direction (e.g., + / - X direction) and extend from at least a portion of the front plate (210a) to the rear plate (211b) and have rounded surfaces, a plurality of second edge regions (212a-2) that are oriented in the other direction (e.g., + / - Y direction) and extend from at least a portion of the front plate (210a) to the rear plate (211b) and have rounded surfaces, and a plurality of third edge regions (212a-3) that are oriented and extend from at least a portion of the front plate (210a) to the rear plate (211b) and are located between the plurality of first edge regions (212a-1) and the plurality of second edge regions (212a-2).

[0063] In one embodiment, the rear plate (211b) may include a plurality of fourth edge regions (212b-1) that are oriented in one direction (e.g., + / - X direction) and extend from at least a portion of the rear plate (210b) to the front plate (211a) and have rounded surfaces, a plurality of fifth edge regions (212b-2) that are oriented in the other direction (e.g., + / - Y direction) and extend from at least a portion of the rear plate (210b) to the front plate (211a) and have rounded surfaces, and a plurality of sixth edge regions (212b-3) that are oriented from at least a portion of the rear plate (210b) to the front plate (211a) and are located between the plurality of fourth edge regions (212b-1) and the plurality of fifth edge regions (212b-2).

[0064] In one embodiment, the front frame (240) may surround at least a portion of the internal space between the front (210a) and the rear (210b). In one embodiment, a display (261) may be located on one side (e.g., +Z direction) of the front frame (240), and a rear plate (211b) may be placed on the other side (e.g., -Z direction) of the front frame (240). In one embodiment, the front frame (240) may include a conductive portion. For example, at least a portion of the front frame (240) may be formed of a conductive material. In one embodiment, the front frame (240) may include a first support structure (241) placed on at least a portion of the side (211c) and a second support structure (242) connected to the first support structure (241) and forming a placement space for the components of the electronic device (201).

[0065] In one embodiment, the first support structure (241) may form the side (211c) of the housing structure (210) by connecting the edges of the front plate (211a) and the rear plate (211b) and surrounding the space between the front plate (211a) and the rear plate (211b). In one embodiment, the second support structure (242) may be placed inside (or in the body part) of the electronic device (201). The first support structure (241) and the second support structure (242) may be formed integrally or formed separately and connected to each other. In one embodiment, the first support structure (241) and the second support structure (242) may include a conductive portion. For example, the first support structure (241) may be formed of a metal and / or a conductive polymer material. In one embodiment, the second support structure (242) may be formed of a metal and / or conductive polymer material, similar to the first support structure (241).

[0066] In one embodiment, the electronic device (201) may include a display (261) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (261) may be located on the front (210a) of the electronic device (201). In one embodiment, the display (261) may be exposed through at least a portion of the front plate (211a) (e.g., first edge regions (212a-1), second edge regions (212a-2), and third edge region (212a-3)). In one embodiment, the display (261) may have a shape substantially identical to the external contour shape of the front plate (211a). Although not shown in the drawings, the display (261) according to one embodiment may include a touch screen panel (TSP), a pressure sensor, and / or a digitizer (not shown) for detecting a stylus pen.

[0067] In one embodiment, the display (261) may include a screen display area (261a) that is visually exposed to the outside of the electronic device (201) and displays content through pixels or a plurality of cells. In one embodiment, the screen display area (261a) may include a sensing area (261a-1) and a camera area (261a-2). The sensing area (261a-1) may overlap with at least a portion of the screen display area (261a). The sensing area (261a-1) may allow the transmission of an input signal associated with a sensor module (e.g., sensor module (176) of FIG. 1). The sensing area (261a-1) may display content together with the screen display area (261a) that does not overlap with the sensing area (261a-1).

[0068] In one embodiment, the camera area (261a-2) may overlap with at least a portion of the screen display area (261a). The camera area (261a-2) may expose the lens of the first camera module (280a) (e.g., the camera module (180) of FIG. 1) positioned to face the front of the electronic device (201). For example, the camera area (261a-2) may allow the transmission of an optical signal (e.g., light) associated with the first camera module (280a). In one embodiment, the camera area (261a-2) may display content in the same way as the screen display area (261a) that does not overlap with the camera area (261a-2). For example, the camera area (261a-2) may display content while the first camera module (280a) is not in operation.

[0069] In one embodiment, the electronic device (201) may include a sensor module (276). The sensor module (276) may sense a signal applied to the electronic device (201). The sensor module (276) may be located, for example, on the front (210a) of the electronic device (201). The sensor module (276) may be positioned in the electronic device (201) to correspond to a sensing area (261a-1) of a screen display area (261a). For example, the sensor module (276) may be positioned in the internal space of the electronic device (201) to perform its function without being visually exposed through the display (261). The sensor module (276) may receive an input signal passing through the sensing area (261a-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). As another example, the input signal may include a signal related to the user's biometric information (e.g., the user's fingerprint, or voice).

[0070] In one embodiment, the electronic device (201) may include camera modules (280a, 280b) (e.g., camera module (180) of FIG. 1). In one embodiment, the camera modules (280a, 280b) may include a first camera module (280a) and a second camera module (280b). In one embodiment, the electronic device (201) may include a flash (280c) positioned near the first camera module (280a) and the second camera module (280b).

[0071] In one embodiment, the first camera module (280a) is positioned so that a lens is exposed on the front (210a) of the housing structure (210) and can receive an optical signal from the front (e.g., + Z direction) of the electronic device (201). The second camera module (280b) is positioned so that a lens is exposed on the rear (210b) of the housing structure (210) and can receive an optical signal from the rear (e.g., - Z direction) of the electronic device (201). In one embodiment, at least a portion of the first camera module (280a) may be positioned in the housing structure (210) so as to be covered by a display (261). For example, the first camera module (280a) may include an under-display camera (UDC). In one embodiment, the first camera module (280a) can receive an optical signal that passes through a camera area (261a-2). In one embodiment, the second camera module (280b) may include a plurality of cameras (e.g., dual camera, triple camera, or quad camera). In one embodiment, the flash (280c) may include a light-emitting diode or a xenon lamp.

[0072] In one embodiment, the electronic device (201) may include an input module (250) (e.g., the input module (150) of FIG. 1). The input module (250) may receive an operation signal from a user. For example, the input module (250) may include at least one key input device disposed to be exposed on the side (211c) of the housing structure (210).

[0073] In one embodiment, the electronic device (201) may include a connection terminal (278) (e.g., the connection terminal (178) of FIG. 1). In one embodiment, the connection terminal (278) may be disposed on the outer surface of the housing structure (210). The electronic device (201) may be wired to an external device (e.g., another electronic device or an external power source) through the connection terminal (278).

[0074] In one embodiment, the electronic device (201) may include one or more printed circuit boards. For example, the electronic device (201) may include a first circuit board (251) (or, main circuit board) and a second circuit board (252) (or, sub-circuit board). The first circuit board (251) and the second circuit board (252) may be placed inside the electronic device (201), for example, in a second support structure (242). At least one circuit board (251, 252) may be connected to the second support structure (242) through ground. In one embodiment, the first circuit board (251) may be received in a first board slot (242a) of the second support structure (242). In one embodiment, the second circuit board (252) may be received in a second board slot (242b) of the second support structure (242). In one embodiment, the circuit board (251, 252) may be a rigid printed circuit board (PCB) or at least a partially bendable flexible printed circuit board (FPCB).

[0075] In one embodiment, the electronic device (201) may include a battery (289) disposed therein. The battery (289) may be disposed in a battery slot (245) formed in a second support structure (242). In one embodiment, the battery slot (245) and the first substrate slot (242a) may be partitioned by a battery partition (242c). For example, a conductive structure (e.g., a flexible substrate) disposed on one side of the battery (289) may be connected to the first circuit board (251) over the battery partition (242c).

[0076] Meanwhile, the embodiments can be applied to electronic devices of various shapes / forms (e.g., foldable electronic devices, sliderable electronic devices, rollable electronic devices, tablets, notebook-shaped electronic devices, wearable electronic devices, and other electronic devices) in addition to the electronic devices shown in FIGS. 2 to 4.

[0077] For example, the embodiments may be applied to a foldable electronic device comprising a plurality of interconnected housings (e.g., a first housing and a second housing). For example, one or more of the first housing and the second housing may include a battery and an electronic component capable of generating heat. For example, the embodiments may be applied to one or more of the first housing and the second housing. For example, the embodiments may be applied to the first housing and the second housing, respectively.

[0078]

[0079] FIG. 5 is a front exploded perspective view of an electronic device according to one embodiment. FIG. 6 is a front view of the electronic device according to one embodiment with the display separated. FIG. 7 is a front view of the electronic device according to one embodiment with the magnetic field shielding sheet, the first heat dissipator, and the second heat dissipator separated. FIG. 8 is a drawing showing the arrangement relationship of electronic components, a battery assembly, a magnetic field shielding sheet, and heat dissipators in an electronic device according to one embodiment.

[0080] Referring to FIGS. 5 through 8, an electronic device (501) according to one embodiment (e.g., the electronic device (101) of FIG. 1 or the electronic device (201) of FIG. 2) comprises a housing structure (510) (e.g., the housing structure (210) of FIG. 2 or the front frame (240)), a battery assembly (520) (e.g., the battery (189) of FIG. 1 or the battery (289) of FIG. 4), a magnetic field shielding sheet (530), a first heat dissipator (540), a second heat dissipator (550), a third heat dissipator (560), a display (570) (e.g., the display module (160) of FIG. 1 or the display (261) of FIG. 2), a first camera module (581) (e.g., the camera module (180) of FIG. 1 or the first camera module (280a) of FIG. 2), and a second camera module (582) (e.g., the camera of FIG. 1 It may include a module (180) or the second camera module (280b) of FIG. 3, a circuit board (590) (e.g., the first circuit board (251) or the second circuit board (252) of FIG. 4), and a receiver (599) (e.g., the acoustic output module (155) of FIG. 1). For example, the first camera module (581) and the second camera module (582) may be referred to as the "front camera module" and the "rear camera module," respectively. It should be noted that the first camera module (581) and the second camera module (582) may be collectively referred to as the "camera module."

[0081] According to one embodiment, the housing structure (510) can accommodate electronic components of the electronic device (501). For example, the housing structure (510) may include a battery partition (511) (e.g., battery partition (243c) of FIG. 2) that partitions a battery slot (e.g., battery slot (245) of FIG. 2) into which a battery assembly (520) is inserted.

[0082] According to one embodiment, the battery assembly (520) can supply power to electronic components. For example, the battery assembly (520) may include a battery cell (521), a terminal (522), a circuit module (523), and a flexible substrate (524) (e.g., a flexible printed circuit board; FPCB) as illustrated in FIG. 8. According to one embodiment, the battery cell (521) may include a positive electrode and a negative electrode, each connected to a pair of terminals (522). According to one embodiment, the circuit module (523) is connected to the terminal (522) and can control current input to or output from the battery cell (521). For example, the circuit module (523) may include a protection circuit module (PCM). According to one embodiment, the flexible substrate (524) can transmit current between the circuit module (523) and the electronic components. For example, the flexible substrate (524) can be connected to a circuit board (590) on which electronic components are placed. For example, the flexible substrate (524) is formed of at least a portion of a flexible material so that even if the battery cell (521) inside the electronic device (501) moves due to an external impact, its shape can be deformed accordingly, thereby reducing the possibility of a disconnection occurring between the battery cell (521) and the circuit board (590).

[0083] According to one embodiment, the magnetic field shielding sheet (530) can reduce the leakage of a magnetic field generated from electronic components (e.g., battery assembly (520)) of the electronic device (501) toward the outside (e.g., receiver surrounding area (A) of the display (570). The receiver surrounding area (A) can be understood to mean the surrounding area of ​​the portion of the display (570) that overlaps the receiver (599) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501). For example, the receiver (599) can be understood as a speaker configured to output a ringtone during a call using the electronic device (501). For example, the receiver (599) may overlap the front camera module (581) or be positioned adjacent to the front camera module (581) when viewed in the thickness direction of the electronic device (501), but is not limited thereto. For example, the receiver (599) may be located in a position adjacent to the user's ear during a call using the electronic device (501). When the user of the electronic device (501) makes a call with their ear positioned in the area (A) around the receiver, there is a possibility that the magnetic field generated from the electronic components of the electronic device (501) may have a negative effect on the hearing aid worn on the user's ear. According to one embodiment, the magnetic field generated in the direction of the receiver during a call can be reduced, and heat dissipation performance can be secured at the same time.

[0084] For example, the magnetic field shielding sheet (530) may include a film layer and a magnetic material. For example, the film layer may be formed from a polymer synthetic material (e.g., polyester). For example, the magnetic material may be provided in the form of a sheet. For example, the magnetic material may be formed from a soft magnetic material. For example, the soft magnetic material becomes magnetized when an external magnetic field is applied, but leaves almost no residual magnetization when the magnetic field is removed, so it can efficiently shield the magnetic field. For example, the magnetic material may be provided in a form sandwiched between multiple film layers.

[0085] For example, in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501), a magnetic field shielding sheet (530) may be placed between the display (570) and the battery assembly (520). According to such a structure, the leakage of magnetic fields generated from the electronic components (e.g., battery assembly (520)) of the electronic device (501) toward the display (570) can be reduced. Thus, the strength of the magnetic field in the receiver area (A) located on the front of the display (570) can be reduced. For example, the receiver area (A) may be the area surrounding the front camera area (571) formed on the display (570), but is not limited thereto. For example, it should be noted that the electronic device (501) may include an additional magnetic field shielding structure (e.g., sheet) located closer to the receiver (599) than the magnetic field shielding sheet (530) when viewed in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501).

[0086] For example, the magnetic field shielding sheet (530) may overlap at least a portion of the battery assembly (520) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501). For example, the magnetic field shielding sheet (530) may overlap at least one terminal (522). For example, the magnetic field shielding sheet (530) may overlap both of a pair of terminals (522). For example, the magnetic field shielding sheet (530) may include a terminal shielding portion (531), a first extension portion (532), and a second extension portion (533).

[0087] According to one embodiment, the terminal shielding portion (531) may overlap a pair of terminals (522) in the thickness direction (e.g., + / - Z axis direction) of the electronic device (501). For example, the terminal shielding portion (531) may overlap the entire area of ​​the pair of terminals (522) and at least a portion of the area of ​​the circuit module (523) in the thickness direction of the electronic device (501). For example, when viewed in the thickness direction (e.g., + / - Z axis direction) of the electronic device (501), the terminal shielding portion (531) may have a shape that covers the entire area located within 10 mm from the pair of terminals (522) on a plane perpendicular to the thickness direction of the electronic device (501) (e.g., XY plane). For example, the terminal shielding portion (531) may have a rectangular shape, but is not limited thereto. For example, the thickness of the magnetic field shielding sheet (530) may vary in part. For example, the terminal shielding portion (531) may be thicker than the rest of the magnetic field shielding sheet (530) (e.g., the first extension portion (532) and / or the second extension portion (533)). By using such a structure, the magnetic field shielding effect can be enhanced. For example, the portion of the terminal shielding portion (531) located close to a pair of terminals (522) may be thicker than the rest of the terminal shielding portion (531). For example, it should be noted that an additional shielding sheet may be attached to the portion of the terminal shielding portion (531) that overlaps a pair of terminals (522) in the thickness direction of the electronic device (501).

[0088] For example, the area of ​​the terminal shielding portion (531) of the magnetic field shielding sheet (530) may be larger than the area of ​​the remaining portion (e.g., the first extension portion (532) and the second extension portion (533)). For example, the area of ​​the terminal shielding portion (531) may be at least twice the sum of the areas of the first extension portion (532) and the second extension portion (533). With such a structure, the magnetic field shielding sheet (530) can sufficiently cover the area adjacent to a pair of terminals (522), thereby improving the magnetic field shielding effect.

[0089] According to one embodiment, the first extension portion (532) may have a shape that extends in one direction (e.g., between the - X-axis and + Y-axis) from the terminal shield portion (531). For example, the first extension portion (532) may overlap at least some of the electronic components of the electronic device (501) in the thickness direction of the electronic device (501) (e.g., + / - Z-axis direction).

[0090] According to one embodiment, the electronic components of the electronic device (501) may include a main processor (591) (e.g., the main processor (121) of FIG. 1), a radio frequency power amplifier (RF PA) (592), and / or a radio frequency power management integrated circuit (RF PMIC) (593), as illustrated in FIG. 8. According to one embodiment, the RF PA (592) may amplify the output (e.g., power) of the wireless communication signal of the electronic device (501), and the current flowing through the RF PA (592) may fluctuate during the process of generating the RF signal of the electronic device (501). According to one embodiment, the RF PMIC (593) may control the supply of voltage or current required for the operation of a plurality of RF PAs (592). For example, the first extension portion (532) may overlap at least one of the plurality of RF PAs (592) or at least one of the plurality of RF PMICs (593) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501). According to such a structure, the problem of the magnetic field negatively affecting the user's body or other devices (e.g., hearing aids) of the electronic device (501) can be reduced by reducing the exposure of the magnetic field generated in the RF PA (592) and / or RF PMIC (593) to the outside due to sudden changes in current. For example, the magnetic field shielding sheet (530) may overlap both the plurality of RF PAs (592) and the plurality of RF PMICs (593) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501), as shown in FIG. 8, but is not limited thereto.

[0091] For example, a plurality of RF PAs (592) may be located on the opposite side of the second camera module (582) (e.g., - X-axis direction) with respect to the vertical center axis (e.g., + / - Y-axis direction) of the electronic device (501). For example, a plurality of RF PMICs (593) may be located on the opposite side of the second camera module (582) with respect to the vertical center axis of the electronic device (501). For example, the first extension portion (532) may extend outward from a corner located in the direction away from the battery assembly (520) and the second camera module (582) of the terminal shield portion (531) (e.g., the direction between the - X-axis and + Y-axis). With such a shape, at least one of the plurality of RF PAs (592) or at least one of the plurality of RF PMICs (593) may overlap.

[0092] According to one embodiment, the second extension portion (533) may have a shape that extends from the terminal shield portion (531) in a direction different from the direction in which the first extension portion (532) is formed (e.g., + X-axis direction). For example, the second extension portion (533) may overlap at least a portion of the flexible substrate (524) of the battery assembly (520) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501), thereby attenuating the magnetic field formed by the current flowing along the flexible substrate (524).

[0093] For example, if the magnetic field shielding sheet (530) is installed entirely on a plane (e.g., XY plane) perpendicular to the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501), the magnetic field shielding effect may be enhanced, but the thickness of the electronic device (501) may be increased by the thickness occupied by the magnetic field shielding sheet (530). For example, to reduce the thickness of the electronic device (501), the magnetic field shielding sheet (530) may be placed only in a part of the area, and components (e.g., first heat dissipation body (540) and second heat dissipation body (550)) that perform other functions (e.g., heat dissipation function) may be placed in the remaining area on the same plane as the plane (e.g., XY plane) where the magnetic field shielding sheet (530) is placed. For example, the magnetic field shielding sheet (530) may not overlap with either the first heat dissipator (540) or the second heat dissipator (550) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501). For example, the first heat dissipator (540) may be placed in a first area of ​​one side (e.g., the side in the + Z-axis direction) of the third heat dissipator (560), the second heat dissipator (550) may be placed in a second area spaced apart from the first area of ​​the said side of the third heat dissipator (560), and the magnetic field shielding sheet (530) may be placed in a third area located between the first area and the second area of ​​the said side of the third heat dissipator (560). According to this configuration, the thickness of the electronic device (501) can be reduced by arranging components that perform different functions (e.g., heat dissipation function and magnetic field shielding function) in different regions within the same layer.

[0094] According to one embodiment, the thicknesses of the magnetic field shielding sheet (530), the first heat dissipator (540), and the second heat dissipator (550) may all be the same. For example, when the electronic device (501) is assembled, the heights of the surfaces of the magnetic field shielding sheet (530), the first heat dissipator (540), and the second heat dissipator (550) facing the display (570) may be substantially the same. According to one embodiment, the thickness of at least one of the magnetic field shielding sheet (530), the first heat dissipator (540), and the second heat dissipator (550) may differ from the remaining at least one. For example, the maximum height of at least one of the magnetic field shielding sheet (530), the first heat dissipator (540), and the second heat dissipator (550) may be positioned lower than or equal to the maximum height of the remaining at least one which is thicker than said at least one, and the minimum height of said at least one may be positioned higher than or equal to the minimum height of said remaining at least one.

[0095] For example, the magnetic field shielding sheet (530) may be formed to overlap at least a portion of a magnetic structure placed within the electronic device (501) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501). According to such a structure, the magnetic field generated from the above-described magnetic structure in a direction toward the receiver (599) and / or an external device (e.g., a hearing aid) adjacent to the receiver (599) can be reduced. For example, the electronic device (501) may include elements for wireless charging. According to one embodiment, the elements for wireless charging may include a loop-shaped (or annular) induction coil and a magnetic structure surrounding at least a portion of the induction coil. For example, the electronic device (501) may be coupled and aligned with a counterpart device (charging station or external electronic device) at a specified distance or less to perform wireless charging based on magnetic coupling between the induction coils placed in each device. For example, each of the two devices (e.g., electronic device (501) and the counterpart device) may include a magnetic structure (e.g., a magnetic array including at least one magnetic segment) configured to provide a specified tensile force. For example, the two devices may be attached and aligned using the magnetic force of the magnetic structures provided on both sides. For example, the magnetic structure of each device may be provided in the form of a loop that wraps around the outer edge of the induction coil of each device. A magnetic field shielding sheet (530) according to one embodiment may reduce the magnetic field transmitted to the receiver (599) and the area (A) surrounding the receiver by being formed to overlap at least a portion of the above-described magnetic structure in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501).

[0096] According to one embodiment, the first heat dissipator (540) may be disposed on one side (e.g., the side in the + Y-axis direction) of the magnetic field shielding sheet (530). For example, the first heat dissipator (540) may be provided in the form of a sheet. For example, the first heat dissipator (540) may not overlap with the magnetic field shielding sheet (530) in the thickness direction (e.g., the + / - Z-axis direction) of the electronic device (501). For example, the first heat dissipator (540) may be a graphite sheet and / or a thermal interface material (TIM), but is not limited thereto. For example, it should be noted that the first heat dissipator (540) may be formed by a curable liquid heat dissipation material.

[0097] For example, the first heat dissipator (540) can dissipate heat generated from the electronic components by being installed to overlap at least some of the electronic components (e.g., the second camera module (582) and / or the main processor (591)) in the thickness direction (e.g., the + / - Z-axis direction) of the electronic device (501). For example, the first heat dissipator (540) can overlap the space (e.g., the first substrate slot (242a) in FIG. 4) on the opposite side (e.g., the + Y-axis direction side) of the battery slot (e.g., the battery slot (245) in FIG. 4) with respect to the battery partition (511) in the thickness direction of the electronic device (501).

[0098] According to one embodiment, the second camera module (582) may include an image sensor (not shown) capable of converting an optical signal into an electronic signal, a lens (582a) forming a path for light incident on the image sensor, an electromagnetic actuator (not shown) for adjusting the position of the lens (582a), and a camera shield can (582b) formed to surround the lens (582a). According to one embodiment, the camera shield can (582b) is formed of a metal material (e.g., aluminum, copper and / or nickel) and can attenuate a magnetic field entering from the outside of the second camera module (582). By such a camera shield can (582b), a magnetic field generated from the components of the second camera module (582) to the outside can also be attenuated. Additionally, a significant portion of the second camera module (582) may be occupied by the lens (582a) rather than the electronic components. Consequently, the magnitude of the magnetic field generated in the area surrounding the second camera module (582) can be relatively much smaller than the magnitude of the magnetic field generated in the area surrounding the battery assembly (520). In other words, with respect to the central axis in the vertical direction (e.g., + / - Y-axis direction) of the electronic device (501), the magnetic field strength in the area opposite to the area where the second camera module (582) is located (e.g., - X-axis direction) can be greater. Therefore, by making the area occupied by the magnetic field shielding sheet (530) in the area far from the second camera module (582) larger than the area occupied by the magnetic field shielding sheet (530) in the area close to the second camera module (582) with respect to the central axis in the vertical direction (e.g., + / - Y-axis direction) of the electronic device (501), the magnetic field shielding effect can be maintained above a certain level while improving heat dissipation performance. For example, in the area overlapping with the second camera module (582) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501), heat dissipation performance can be improved by placing the first heat dissipator (540) instead of the magnetic field shielding sheet (530) as illustrated.

[0099] According to one embodiment, the second heat dissipator (550) may be positioned on the opposite side (e.g., the Y-axis side) of the first heat dissipator (540) with respect to the magnetic field shielding sheet (530). For example, the second heat dissipator (550) may be provided in the form of a sheet. For example, the first heat dissipator (540) and the second heat dissipator (550) may be spaced apart on opposite sides with respect to the magnetic field shielding sheet (530). For example, the description of the first heat dissipator (540) may be applied to the second heat dissipator (550), but is not limited thereto. For example, the second heat dissipator (550) may be formed of the same material as the first heat dissipator (540) (e.g., graphite, thermal bonding material and / or curable liquid heat dissipation material), but is not limited thereto. For example, the second heat dissipator (550) may overlap the battery cell (521) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501). For example, the second heat dissipator (550) may overlap the battery slot in the thickness direction of the electronic device (501). The battery assembly (520) generates a lot of heat in the charging environment, and using the second heat dissipator (550) can help dissipate the heat generated in the battery assembly (520).

[0100] According to one embodiment, the third heat dissipator (560) can interconnect the first heat dissipator (540) and the second heat dissipator (550). For example, the third heat dissipator (560) may be attached to the first heat dissipator (540) and / or the second heat dissipator (550) using an adhesive material (e.g., tape), but is not limited thereto. Through such a structure, even if the first heat dissipator (540) and the second heat dissipator (550) are disconnected from each other, a heat transfer path connecting the first heat dissipator (540) and the second heat dissipator (550) through the third heat dissipator (560) can be formed. Accordingly, the above-described structure can reduce the problem of reduced heat dissipation performance of the electronic device (501) while providing space for a magnetic field shielding sheet (530) to be installed in the space between the first heat dissipator (540) and the second heat dissipator (550), thereby allowing the thickness of the electronic device (501) to be reduced. For example, the third heat dissipator (560) may be positioned at a different height from the first heat dissipator (540) and the second heat dissipator (550) in the thickness direction of the electronic device (501) (e.g., + / - Z-axis direction). For example, the third heat dissipator (560) may be positioned at a height closer to the circuit board (590) than the first heat dissipator (540) and the second heat dissipator (550) in the thickness direction of the electronic device (501).

[0101] For example, the third heat dissipator (560) may have a thermal conductance value higher than that of the first heat dissipator (540) and the second heat dissipator (550). For example, the third heat dissipator (560) may be a vapor chamber, but is not limited thereto. For example, it should be noted that the third heat dissipator (560) may be formed of the same material as the first heat dissipator (540) or the second heat dissipator (550) (e.g., graphite, thermal bonding material and / or curable liquid heat dissipation material). For example, the third heat dissipator (560) may be referred to as the "main heat dissipator," and the first heat dissipator (540) and the second heat dissipator (550) may be referred to as the "sub heat dissipators." For example, the third heat dissipator (560) is positioned closer to the electronic components (e.g., second camera module (582), main processor (591), RF PA (592) and / or RF PMIC (593)) installed on the circuit board (590) than the first heat dissipator (540) and the second heat dissipator (550), so as to rapidly dissipate heat emitted from the electronic components.

[0102] For example, the third heat dissipation body (560) can dissipate heat generated from electronic components (e.g., main processor (591), RF PA (592) and / or RF PMIC (593)) placed on the battery assembly (520) and / or circuit board (590) to the outside through the first heat dissipation body (540) and / or the second heat dissipation body (550). For example, the heat dissipation performance of the third heat dissipation body (560) can be improved by contacting the battery assembly (520). For example, the third heat dissipation body (560) can be in direct contact with the battery assembly (520) or indirectly contacted using an adhesive material (e.g., tape). For example, the third heat dissipation body (560) can be in contact with the battery assembly (520) through a first hole (515) formed in the housing structure (510). For example, the third heat dissipation element (560) can have its heat dissipation performance improved by contacting the circuit board (590) and / or electronic components placed on the circuit board (590). For example, the third heat dissipation element (560) may be in direct contact with the circuit board (590) and / or electronic components. For example, the third heat dissipation element (560) may be indirectly contacted with the circuit board (590) and / or electronic components through an adhesive material (e.g., tape) and / or a thermal conductor. For example, the third heat dissipation element (560) may be in contact with the circuit board (590) and / or electronic components placed on the circuit board (590) through a second hole (516) formed in the housing structure (510). Meanwhile, it should be noted that the third heat dissipation element (560) does not necessarily have to be in contact with the electronic components placed on the battery assembly (520) and / or circuit board (590).

[0103] For example, the third heat dissipator (560) can form a heat transfer path from one of the first heat dissipators (540) and the second heat dissipator (550), which has a higher temperature, to the other heat dissipator. For example, in a charging environment where heat generated in the battery assembly (520) is high, even if the amount of cooling provided by the second heat dissipator (550) is insufficient, the heat can be additionally dissipated to the outside through the third heat dissipator (560) and the first heat dissipator (540). For example, in an environment where heat generated in the main processor (591) is high, even if the amount of cooling provided by the first heat dissipator (540) is insufficient, the heat can be additionally dissipated to the outside through the third heat dissipator (560) and the second heat dissipator (550).

[0104] For example, a first portion of the third heat dissipator (560) (e.g., a portion in the + Y-axis direction) may be in surface contact with either the first heat dissipator (540) or the second heat dissipator (550) (e.g., the first heat dissipator (540)), and a second portion of the third heat dissipator (560) (e.g., a portion in the - Y-axis direction) may be in surface contact with the other heat dissipator among the first heat dissipator (540) and the second heat dissipator (550) (e.g., the second heat dissipator (550)). Heat transferred from electronic components to the third heat dissipator (560) may be transferred to the first heat dissipator (540) and / or the second heat dissipator (550), and then distributed across the entire screen of the display (570). For example, the sum of the areas of the magnetic field shielding sheet (530), the first heat dissipator (540), and the second heat dissipator (550) may be greater than the area of ​​the third heat dissipator (560). For example, in the thickness direction of the electronic device (501) (e.g., + / - Z-axis direction), the area where the first heat dissipator (540) overlaps the display (570) may be greater than the area where the first heat dissipator (540) overlaps the third heat dissipator (560). For example, in the thickness direction of the electronic device (501) (e.g., + / - Z-axis direction), the area where the second heat dissipator (550) overlaps the display (570) may be greater than the area where the second heat dissipator (550) overlaps the third heat dissipator (560). According to this structure, for example, even when the thermal conductivity of the first heat dissipator (540) and the second heat dissipator (550) is lower than the thermal conductivity of the third heat dissipator (560), the heat generated from the electronic components can be rapidly dissipated to the outside while reducing the bottleneck in the heat flow.

[0105] According to one embodiment, the edge portion of any one of the magnetic field shielding sheet (530), the first heat dissipator (540), and the second heat dissipator (550) may be arranged to be in contact with one or more adjacent edge portions. With such a structure, the heat dissipation effect or the magnetic field shielding effect can be improved. Meanwhile, this is merely one example, and it should be noted that any one of the magnetic field shielding sheet (530), the first heat dissipator (540), and the second heat dissipator (550) may be arranged spaced apart from one or more adjacent edge portions. For example, the magnetic field shielding sheet (530), the first heat dissipator (540), and the second heat dissipator (550) may all be spaced apart so as not to come into contact with each other.

[0106]

[0107] FIG. 9 is a rear view of an electronic device according to one embodiment with the rear plate separated. FIG. 10 is a partial perspective view showing the battery assembly installed in an electronic device according to one embodiment. FIG. 11 is a front view of an electronic device according to one embodiment with the display separated.

[0108] Referring to FIGS. 9 through 11, an electronic device (601) according to one embodiment (e.g., electronic device (101) of FIG. 1, electronic device (201) of FIG. 2, or electronic device (501) of FIG. 5) comprises a housing structure (610) (e.g., housing structure (210) of FIG. 2, front frame (240), or housing structure (510) of FIG. 5), a battery assembly (620) (e.g., battery (189) of FIG. 1, battery (289) of FIG. 4, or battery assembly (520) of FIG. 5), a magnetic field shielding sheet (630) (e.g., magnetic field shielding sheet (530) of FIG. 5), a first heat dissipator (640) (e.g., first heat dissipator (540) of FIG. 5), a second heat dissipator (650) (e.g., second heat dissipator (550) of FIG. 5), and a third heat dissipator (e.g., FIG. 5 It may include a third heat dissipator (560), a display (e.g., the display module (160) of FIG. 1, the display (261) of FIG. 2, or the display (570) of FIG. 5), a first camera module (e.g., the camera module (180) of FIG. 1, the first camera module (280a) of FIG. 2, or the first camera module (581) of FIG. 6), a second camera module (682) (e.g., the camera module (180) of FIG. 1, the second camera module (280b) of FIG. 3, or the second camera module (582) of FIG. 8), and a circuit board (690) (e.g., the first circuit board (251) of FIG. 4, the second circuit board (252) of FIG. 4, or the circuit board (590) of FIG. 8).

[0109] According to one embodiment, the battery assembly (620) may include a battery cell (621) (e.g., battery cell (521) of FIG. 8), a pair of terminals (622) (e.g., a pair of terminals (522) of FIG. 8), a circuit module (623) (e.g., circuit module (523) of FIG. 8), and a flexible substrate (624) (e.g., flexible substrate (524) of FIG. 8).

[0110] According to one embodiment, the flexible substrate (624) may be connected to the circuit board (690) over the battery partition (611) of the housing structure (610) (e.g., the battery partition (243c) of FIG. 2 or the battery partition (511) of FIG. 5). For example, the flexible substrate (624) may be formed to have a length sufficiently longer than the shortest distance between the battery assembly (620) and the circuit board (690) to prevent disconnection of the flexible substrate (624) due to the movement of the battery assembly (620) when the electronic device (601) falls. For example, the flexible substrate (624) may be installed between the circuit module (623) and the circuit board (690) with a portion of the flexible substrate (624) bent. For example, the flexible substrate (624) may include a first part (624a) connected to a circuit module (623), a second part (624b) connected to a circuit board (690) on which electronic components are placed, a bending part (624c) that interconnects the first part (624a) and the second part (624b) and has a shape bent at 180 degrees, and a substrate connector (624d) located at the end of the second part (624b) and interconnects the second part (624b) and the circuit board (690). According to this shape, the direction of the current flowing through the first part (624a) (e.g., + X-axis direction) and the direction of the current flowing through the second part (624b) (e.g., - X-axis direction) are opposite to each other, so the magnetic field generated by the current flowing through the first part (624a) and the magnetic field generated by the current flowing through the second part (624b) can be sufficiently canceled out. Therefore, according to the above-described structure, the strength of the magnetic field generated in the area where the first part (624a) and the second part (624b) overlap each other in the thickness direction of the electronic device (601) can be reduced, so as a result, even if the part corresponding to that area of ​​the magnetic field shielding sheet (630) (e.g., the second extension part (533) of FIG. 8) is omitted, the reduction in magnetic field shielding performance caused by this can be reduced.For example, in the thickness direction of the electronic device (601), a magnetic field shielding sheet (630) may be placed in the area of ​​the second part (624b) that does not overlap with the first part (624a). For example, in the thickness direction of the electronic device (601), a magnetic field shielding sheet (630) may be placed in the area that overlaps with the substrate connector (624d).

[0111] According to one embodiment, the magnetic field shielding sheet (630) may include a terminal shielding portion (631) (e.g., the terminal shielding portion (531) of FIG. 8) and an extension portion (632) (e.g., the first extension portion (532) of FIG. 8). For example, the magnetic field shielding sheet (630) may not include a second extension portion (533) as shown in FIG. 8. According to one embodiment, the terminal shielding portion (631) may overlap the entire area of ​​a pair of terminals (622) and at least a portion of the area of ​​the circuit module (623) in the thickness direction (e.g., + / - Z axis direction) of the electronic device (601). According to one embodiment, the extension portion (632) may overlap with the main processor (691) (e.g., the main processor (121) of FIG. 1 or the main processor (591) of FIG. 8), a plurality of RF PAs (692) and a plurality of RF PMICs (693) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (501).

[0112] According to one embodiment, in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (601), a first heat dissipator (640) may be overlapped with a portion of the flexible substrate (624), and a magnetic field shielding sheet (630) may be overlapped with the remaining portion or all of the flexible substrate (624). For example, the first heat dissipator (640) may be placed on an area (hereinafter referred to as the "overlap area") where the first portion (624a) and the second portion (624b) overlap each other in the thickness direction of the electronic device (601). According to the structure of the flexible substrate (624) according to the above-described embodiment, heat dissipation performance can be improved while reducing the reduction in magnetic field shielding performance. For example, the flexible substrate (624) may be positioned in the direction in which the second camera module (682) is positioned (e.g., + X-axis direction) relative to the center axis in the vertical direction (e.g., + / - Y-axis direction) of the electronic device (601). For example, the first heat dissipator (640) may overlap the second camera module (682) and the aforementioned overlap area in the thickness direction (e.g., + / - Z-axis direction) of the electronic device. According to such a structure, heat generated in the second camera module (682) and the flexible substrate (624) can be dissipated by a single first heat dissipator (640) having a continuous shape, without the need to additionally provide a separate heat dissipator for heat dissipation of the flexible substrate (624). Meanwhile, unless otherwise stated, it should be noted that in the thickness direction of the electronic device (601), the first heat dissipation body (640) and the magnetic field shielding sheet (630) may not be arranged to overlap the aforementioned overlap area, or may not overlap each other.

[0113]

[0114] FIG. 12 is an exploded perspective view showing a circuit board, a main processor, and peripheral components in an electronic device according to one embodiment. FIG. 13 is a diagram showing the arrangement relationship of electronic components, a battery assembly, a magnetic field shielding sheet, and heat dissipators in an electronic device according to one embodiment.

[0115] Referring to FIGS. 9 through 11, an electronic device (701) according to one embodiment (e.g., electronic device (101) of FIG. 1, electronic device (201) of FIG. 2, electronic device (501) of FIG. 5, or electronic device (601) of FIG. 9) comprises a housing structure (e.g., housing structure (210) of FIG. 2, front frame (240), housing structure (510) of FIG. 5, or housing structure (610) of FIG. 9), a battery assembly (720) (e.g., battery (189) of FIG. 1, battery (289) of FIG. 4, battery assembly (520) of FIG. 5, or battery assembly (620) of FIG. 9), a magnetic field shielding sheet (730) (e.g., magnetic field shielding sheet (530) of FIG. 5 or magnetic field shielding sheet (630) of FIG. 11), and a first heat dissipation body (740) (e.g., the first of FIG. 5 A heat sink (540 or the first heat sink (640) of FIG. 11), a second heat sink (750) (e.g., the second heat sink (550) of FIG. 5 or the second heat sink (650) of FIG. 11), a third heat sink (e.g., the third heat sink (560) of FIG. 5), a display (e.g., the display module (160) of FIG. 1, the display (261) of FIG. 2 or the display (570) of FIG. 5), a first camera module (e.g., the camera module (180) of FIG. 1, the first camera module (280a) of FIG. 2 or the first camera module (581) of FIG. 6), a second camera module (e.g., the camera module (180) of FIG. 1, the second camera module (280b) of FIG. 3, the second camera module (582) of FIG. 8 or the second camera module (682) of FIG. 9)), and a circuit It may include a substrate (790) (e.g., the first circuit board (251) of FIG. 4, the second circuit board (252), the circuit board (590) of FIG. 8, or the circuit board (690) of FIG. 9).

[0116] According to one embodiment, a main processor (791) (e.g., the main processor (121) of FIG. 1, the main processor (591) of FIG. 8, or the main processor (691) of FIG. 9) and a memory (794) (e.g., the memory (130) of FIG. 1) may be installed on a circuit board (790). For example, a processor shield can (795) surrounding the main processor (791) and the memory (794) may be installed on the circuit board (790). For example, a thermal interface material (TIM) (796) and a metal sheet (797) may be installed on one side of the processor shield can (795).

[0117] According to one embodiment, the processor shield can (795) may be placed on the circuit board (790) and formed to surround the main processor (791). According to one embodiment, the processor shield can (795) may be formed of a metal material (e.g., aluminum, copper and / or nickel) and may attenuate the magnetic field flowing into the main processor (791). By such a processor shield can (795), the magnetic field generated from the main processor (791) to the outside may also be attenuated.

[0118] According to one embodiment, a metal sheet (797) is positioned to cover an opening penetrating the processor shield can (795) and can transfer heat generated from the main processor (791) to a third heat dissipator. For example, the metal sheet (797) is formed of a metal material (e.g., copper) and can perform not only a heat dissipation function but also a function of attenuating a magnetic field.

[0119] According to one embodiment, the thermal bonding material (796) can absorb heat generated from the main processor (791) and transfer it to other parts. For example, the thermal bonding material (796) may be placed between the metal sheet (797) and the main processor (791). For example, the thermal bonding material (796) may be placed within an opening penetrating the processor shield can (795). For example, heat generated from the main processor (791) may pass sequentially through the thermal bonding material (796), the metal sheet (797), the third heat dissipator, and the first heat dissipator (740) and be emitted outward through the entire area of ​​the display.

[0120] As described above, according to the processor shield can (795) and / or metal sheet (797), the magnetic field generated from the main processor (791) to the outside can be attenuated, so the magnitude of the magnetic field generated in the area surrounding the main processor (791) can be relatively much smaller than the magnitude of the magnetic field generated in the area surrounding the battery assembly (720). Meanwhile, the main processor (791) may have a significantly higher heat generation level compared to other electronic components of the electronic device (701). For example, in a general usage environment rather than a charging environment, the heat generated from the main processor (791) may be greater than that generated from other electronic components. For example, in the thickness direction of the electronic device (701) (e.g., + / - Z-axis direction), the area where the first heat dissipation body (740) overlaps the main processor (791) can be made larger than the area where the magnetic field shielding sheet (730) overlaps the main processor (791). With this configuration, the reduction in magnetic field shielding performance due to the reduction in the area of ​​the magnetic field shielding sheet (730) can be reduced, while the heat dissipation performance can be sufficiently improved.

[0121] According to one embodiment, the first heat dissipation body (740) may overlap more than 50% (e.g., more than 70% or more than 90%) of the area occupied by the main processor (791) on a plane (e.g., XY plane) perpendicular to the thickness direction (e.g., + / - Z-axis direction) of the electronic device (701). For example, the first heat dissipation body (740) may overlap in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (701) over the entire area where the central processing unit core (791a) of the main processor (791) is located. According to one embodiment, since the central processing unit core (791a) belongs to the part of the main processor (791) with the highest heat generation, the heat dissipation performance of the electronic device (701) can be improved by having the first heat dissipation body (740) cover all areas of the central processing unit core (791a).

[0122] According to one embodiment, the magnetic field shielding sheet (730) may include a terminal shielding portion (731) (e.g., the terminal shielding portion (531) of FIG. 8 or the terminal shielding portion (631) of FIG. 11) and an extension portion (732) (e.g., the first extension portion (532) of FIG. 8 or the extension portion (632) of FIG. 11). According to one embodiment, the extension portion (732) may include a recessed portion (732a) cut in one direction (e.g., - X-axis direction) to avoid the entire area where the central processing unit core (791a) is located in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (701). Through such a shape, the heat dissipation performance for the central processing unit core (791a) can be improved by increasing the area of ​​the first heat dissipator (740).

[0123] According to one embodiment, the first heat dissipation element (740) may include a protruding portion that covers the entire area where the central processing unit core (791a) is located in the thickness direction of the electronic device (701). For example, the above-described protruding portion may be understood as a portion located in the recessed portion (732a).

[0124]

[0125] FIG. 14 is a diagram showing the results of measuring the magnetic field strength in each region on the front of an electronic device according to one embodiment in the form of contour lines. FIG. 15 is a diagram showing the arrangement relationship of electronic components, a battery assembly, a magnetic field shielding sheet, and a heat dissipator in an electronic device according to one embodiment.

[0126] For reference, Figure 14 is the result of measuring the strength of the magnetic field leaking to the front of the electronic device, but it should be noted that it has been modified and illustrated in the form viewed from the rear of the electronic device to show the relationship between the positions of the electronic components of the electronic device and the magnetic field strength.

[0127] Referring to FIGS. 14 and 15, an electronic device (801) according to one embodiment (e.g., electronic device (101) of FIG. 1, electronic device (201) of FIG. 2, electronic device (501) of FIG. 5, electronic device (601) of FIG. 9, or electronic device (701) of FIG. 13) comprises a housing structure (e.g., housing structure (210) of FIG. 2, front frame (240), housing structure (510) of FIG. 5, or housing structure (610) of FIG. 9), a battery assembly (820) (e.g., battery (189) of FIG. 1, battery (289) of FIG. 4, battery assembly (520) of FIG. 5, battery assembly (620) of FIG. 9, or battery assembly (720) of FIG. 13), and a magnetic field shielding sheet (830) (e.g., magnetic field shielding sheet (530) of FIG. 5, magnetic field shielding of FIG. 11). Sheet (630) or magnetic field shielding sheet (730) of FIG. 13), first heat dissipator (840) (e.g., first heat dissipator (540) of FIG. 5, first heat dissipator (640) of FIG. 11, or first heat dissipator (740) of FIG. 13), second heat dissipator (850) (e.g., second heat dissipator (550) of FIG. 5, second heat dissipator (650) of FIG. 11, or second heat dissipator (750) of FIG. 13), third heat dissipator (e.g., third heat dissipator (560) of FIG. 5), display (e.g., display module (160) of FIG. 1, display (261) of FIG. 2, or display (570) of FIG. 5), first camera module (e.g., camera module (180) of FIG. 1, first camera module (280a) of FIG. 2, or first camera of FIG. 6 It may include a module (581)), a second camera module (882) (e.g., the camera module (180) of FIG. 1, the second camera module (280b) of FIG. 3, the second camera module (582) of FIG. 8, or the second camera module (682) of FIG. 9), and a circuit board (890) (e.g., the first circuit board (251) of FIG. 4, the second circuit board (252), the circuit board (590) of FIG. 8, the circuit board (690) of FIG. 9, or the circuit board (790) of FIG. 13).

[0128] According to one embodiment, the battery assembly (820) may include a battery cell (821) (e.g., the battery cell (521) of FIG. 8 or the battery cell (621) of FIG. 9), a pair of terminals (822) (e.g., the pair of terminals (522) of FIG. 8 or the pair of terminals (622) of FIG. 9), a circuit module (823) (e.g., the circuit module (523) of FIG. 8 or the circuit module (623) of FIG. 9)), and a flexible substrate (824) (e.g., the flexible substrate (524) of FIG. 8 or the flexible substrate (624) of FIG. 9).

[0129] According to one embodiment, the magnetic field shielding sheet (830) may include a terminal shielding portion (831) (e.g., the terminal shielding portion (531) of FIG. 8, the terminal shielding portion (631) of FIG. 11, or the terminal shielding portion (731) of FIG. 13)) and an extension portion (832) (e.g., the first extension portion (532) of FIG. 8, the extension portion (632) of FIG. 11, or the extension portion (732) of FIG. 13).

[0130] According to one embodiment, the extension portion (832) may have a shape that extends in one direction (e.g., between the - X-axis and the + Y-axis) from the terminal shielding portion (831). For example, the magnetic field shielding sheet (830) may have an asymmetric shape with respect to the vertical center axis (e.g., the + / - Y-axis direction) of the electronic device. Referring to FIG. 14, it can be seen that the magnetic field strength in the area where the RF PA (892) and RF PMIC (893) are located is measured to be greater than that in the area where the second camera module (882) is located, with respect to the vertical center axis of the electronic device (801). Therefore, compared to the case where a magnetic field shielding sheet having a symmetric shape with the same area is used, the magnetic field shielding effect when using the magnetic field shielding sheet with the asymmetric structure described above may be higher.

[0131] According to one embodiment, the extension portion (832) may overlap at least one of a plurality of RF PAs (892) or at least one of a plurality of RF PMICs (893) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (801). According to one embodiment, as shown in FIG. 15, in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (801), the magnetic field shielding sheet (830) (e.g., terminal shielding portion (831) and / or extension portion (832)) may cover all of the plurality of RF PMICs (893). With such a structure, electric field noise and / or magnetic field noise that may be generated in the electronic components (e.g., switching converter and / or output terminal of the converter) included in the RF PMIC (893) can be reduced.

[0132] Meanwhile, as can be seen from the magnetic field strength measurement results of FIG. 14, the magnitude of the magnetic field generated in the surrounding area of ​​the RF PA (892) may be relatively small compared to the magnitude of the magnetic field generated in the surrounding area of ​​a pair of terminals (822) of the battery assembly (820). Meanwhile, the RF PA (892) consumes a large amount of power in the process of generating a high-output RF signal, and a significant portion of the consumed power may be converted into heat. According to one embodiment, by reducing the area of ​​the extension part (832) and increasing the area of ​​the first heat dissipator (840), the first heat dissipator (840) can be placed in the area where the RF PA (892) and / or RF PMIC (893) are placed that is not covered by the extension part (832).

[0133] According to one embodiment, the first heat dissipation body (840) may overlap at least one of the remaining RF PAs (892) that are not covered by the extension portion (832) among the plurality of RF PAs (892) and / or at least one of the remaining RF PMICs (893) that are not covered by the extension portion (832) among the plurality of RF PMICs (893) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (801). For example, the first heat dissipation body (840) may cover all parts among the plurality of RF PAs (892) and the plurality of RF PMICs (893) that are not covered by the magnetic field shielding sheet (830).

[0134] According to one embodiment, the first heat dissipator (840) can cover the RF PA (892) among the plurality of RF PAs (892) that is not overlapped by the magnetic field shielding sheet (830) in the thickness direction of the electronic device (801). For example, it should be noted that in the thickness direction of the electronic device (801), one part of the RF PA (892) may be overlapped by the first heat dissipator (840), and another part of the RF PA (892) may be overlapped by the magnetic field shielding sheet (830). For example, the first heat dissipator (840) may be positioned to cover an area of ​​50% or more of the area occupied by the plurality of RF PAs (892) when viewed in the thickness direction of the electronic device (801). Through such a structure, heat dissipation performance can be improved while reducing the reduction of the magnetic field shielding effect. For example, based on the vertical direction (e.g., + / - Y-axis direction) of the electronic device (801), the minimum width (W_h1) of the first heat dissipator (840) may be greater than the maximum width (W_m1) of the portion of the magnetic field shielding sheet (830) that extends beyond the battery partition (811) (e.g., the battery partition (243c) of FIG. 2, the battery partition (511) of FIG. 5, or the battery partition (611) of FIG. 9) (e.g., the portion of the magnetic field shielding sheet (830) located close to the first heat dissipator (840) based on the battery partition (811). According to the magnetic field measurement results of FIG. 14, by reducing the area of ​​the magnetic field shielding sheet (830) that is placed in a portion where the magnetic field strength is relatively low as described above, the area occupied by the first heat dissipator (840) can be sufficiently increased.

[0135] As described above, according to one embodiment, the first heat dissipator (840) can dissipate heat generated from the electronic components by being installed to overlap at least some of the electronic components (e.g., second camera module (882), main processor (891) (e.g., central processing unit core (891a)), and / or RF PA (892)) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (801). Through measurement tests, it was confirmed that the heat generation temperature of the electronic device (801) can be lowered by about 0.5 degrees simply by deforming the extended portion (632) of the shape shown in FIG. 11 to the extended portion (832) of FIG. 15. A difference of 0.5 degrees in the critical temperature for entering AP throttling can have a significant impact on the user's perceived performance.

[0136] According to one embodiment, the second heat dissipator (850) may overlap the center (B_c) of the battery assembly (820). For example, based on the vertical direction (e.g., + / - Y-axis direction) of the electronic device (801), the minimum width (W_h2) of the second heat dissipator (850) may be greater than the maximum width (W_m2) of the portion of the magnetic field shielding sheet (830) that extends beyond the battery partition (811) (e.g., the portion of the magnetic field shielding sheet (830) located close to the second heat dissipator (850) based on the battery partition (811)). According to the magnetic field measurement results of FIG. 14, the area occupied by the second heat dissipator (850) can be sufficiently increased by reducing the area of ​​the magnetic field shielding sheet (830) that is placed in a portion where the magnetic field strength is relatively low as described above. According to this design, the heat generation temperature of the electronic device (801) can be lowered.

[0137] According to one embodiment, the width W_m2 may be larger than the width W_m1. For example, the circuit board (890) may be located on the opposite side of the battery assembly (820). For example, with respect to a pair of terminals (822), the length (W_m2) of the second part of the magnetic field shielding sheet (830) extending in the opposite direction of the circuit board (890) (e.g., - Y-axis direction) may be longer than the length (W_m1) of the first part of the magnetic field shielding sheet (830) extending in the direction toward the circuit board (890) (e.g., + Y-axis direction). For example, the magnetic field shielding sheet (830) may be positioned biased toward the second heat dissipator (850) with respect to the battery bulkhead (811). For example, based on the battery partition (811), the length (W_m1) of the first part of the magnetic field shielding sheet (830) located closer to the circuit board (890) may be longer than the length (W_m2) of the second part located closer to the battery slot (e.g., battery slot (245) in FIG. 4). With such a structure, the shielding efficiency against the magnetic field generated in the same area of ​​the magnetic field shielding sheet (830) can be improved.

[0138]

[0139] FIG. 16 is a plan view taken from the front of an electronic device according to one embodiment with the display separated.

[0140] Referring to FIG. 16, an electronic device (901) according to one embodiment (e.g., electronic device (101) of FIG. 1, electronic device (201) of FIG. 2, electronic device (501) of FIG. 5, electronic device (601) of FIG. 9, electronic device (701) of FIG. 13, or electronic device (801) of FIG. 15) comprises a housing structure (910) (e.g., housing structure (210) of FIG. 2, front frame (240), housing structure (510) of FIG. 5, or housing structure (610) of FIG. 9), a battery assembly (e.g., battery (189) of FIG. 1, battery (289) of FIG. 4, battery assembly (520) of FIG. 5, battery assembly (620) of FIG. 9, battery assembly (720) of FIG. 13, or battery assembly (820) of FIG. 15), and a magnetic field shielding sheet (930) (e.g., magnetic field shielding of FIG. 5 Sheet (530), magnetic field shielding sheet (630) of FIG. 11, magnetic field shielding sheet (730) of FIG. 13, or magnetic field shielding sheet (830) of FIG. 15, first heat dissipator (940) (e.g., first heat dissipator (540) of FIG. 5, first heat dissipator (640) of FIG. 11, first heat dissipator (740) of FIG. 13, or first heat dissipator (840) of FIG. 15), second heat dissipator (950) (e.g., second heat dissipator (550) of FIG. 5, second heat dissipator (650) of FIG. 11, second heat dissipator (750) of FIG. 13, or second heat dissipator (850) of FIG. 15), connecting heat dissipator (955), third heat dissipator (e.g., third heat dissipator (560) of FIG. 5), display (e.g., display of FIG. 1 Module (160), display (261) of FIG. 2 or display (570) of FIG. 5), first camera module (e.g., camera module (180) of FIG. 1, first camera module (280a) of FIG. 2 or first camera module (581) of FIG. 6), second camera module (e.g., camera module (180) of FIG. 1, second camera module (280b) of FIG. 3, second camera module (582) of FIG. 8 or second camera module (682) of FIG. 9 or second camera module (882) of FIG. 15) and circuit board (e.g., first circuit board (251) of FIG. 4, second circuit board (252),It may include the circuit board (590) of FIG. 8, the circuit board (690) of FIG. 9, the circuit board (790) of FIG. 13, or the circuit board (890) of FIG. 14.

[0141] A connecting heat dissipator (955) according to one embodiment may interconnect the first heat dissipator (940) and the second heat dissipator (950). For example, the connecting heat dissipator (955) may not overlap with either the first heat dissipator (940) or the second heat dissipator (950) in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (901). For example, the first heat dissipator (940), the second heat dissipator (950), and the connecting heat dissipator (955) may be integrally formed from the same material (e.g., graphite), but are not limited thereto. For example, according to the connecting heat dissipation element (955), the first heat dissipation element (940) and the second heat dissipation element (950) can be additionally connected through the connecting heat dissipation element (955) as well as the third heat dissipation element, so that the heat transfer efficiency between the first heat dissipation element (940) and the second heat dissipation element (950) is improved, and as a result, the heat dissipation performance of the electronic device (901) can be improved.

[0142] A magnetic field shielding sheet (930) according to one embodiment may include a slit (935) into which a connecting heat dissipator (955) is inserted. Through such a configuration, a structure in which the connecting heat dissipator (955) and the magnetic field shielding sheet (930) are laminated in parallel within a single layer can be provided.

[0143] A slit (935) according to one embodiment may be positioned so as not to overlap a pair of terminals (922) of a battery assembly (e.g., a pair of terminals (522) of FIG. 8, a pair of terminals (622) of FIG. 9, or a pair of terminals (822) of FIG. 14) in the thickness direction (e.g., + / - Z-axis direction) of an electronic device (901). In other words, a slit (935) may not be formed in the portion of the magnetic field shielding sheet (930) that overlaps with a pair of terminals (922) of the battery assembly in the thickness direction of the electronic device (901). Through such a structure, the heat dissipation performance of the electronic device (901) can be improved, while reducing the reduction in magnetic field shielding effect due to the reduction in the area of ​​the magnetic field shielding sheet (930) compared to a magnetic field shielding sheet of another shape having the same area.

[0144] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1, electronic device (201) of FIG. 2, electronic device (501) of FIG. 5, electronic device (601) of FIG. 9, electronic device (701) of FIG. 13, electronic device (801) of FIG. 15, or electronic device (901) of FIG. 16) may not include a connecting heat dissipator (955). Even with such a shape, heat can pass through the slit (935), so heat dissipation performance can be improved compared to the case where the slit (935) is not provided.

[0145] According to one embodiment, a magnetic field shielding sheet (e.g., magnetic field shielding sheet (530) of FIG. 5, magnetic field shielding sheet (630) of FIG. 11, magnetic field shielding sheet (730) of FIG. 13, magnetic field shielding sheet (830) of FIG. 15, or magnetic field shielding sheet (930) of FIG. 16) may include a mesh shape instead of the slit (935) shown in FIG. 16. With such a shape, heat can pass through the mesh-shaped holes, so heat dissipation performance may be improved compared to the case where the mesh shape is not included. For example, a heat dissipator may be placed in the mesh-shaped holes. For example, the heat dissipator may be formed by a curable liquid heat dissipation material, but is not limited thereto. For example, it should be noted that the magnetic field shielding sheet may include both the slit (935) and the mesh shape.

[0146]

[0147] FIG. 17 is a plan view taken from the front of an electronic device according to one embodiment with the display separated.

[0148] Referring to FIG. 17, an electronic device (1001) according to one embodiment (e.g., electronic device (101) of FIG. 1, electronic device (201) of FIG. 2, electronic device (501) of FIG. 5, electronic device (601) of FIG. 9, electronic device (701) of FIG. 13, electronic device (801) of FIG. 15, or electronic device (901) of FIG. 16) comprises a housing structure (1010) (e.g., housing structure (210) of FIG. 2, front frame (240), housing structure (510) of FIG. 5, housing structure (610) of FIG. 9, or housing structure (1010) of FIG. 16), a battery assembly (e.g., battery (189) of FIG. 1, battery (289) of FIG. 4, battery assembly (520) of FIG. 5, battery assembly (620) of FIG. 9, battery assembly (720) of FIG. 13, or battery of FIG. 15 Assembly (820)), magnetic field shielding sheet (1030) (e.g., magnetic field shielding sheet (530) of FIG. 5, magnetic field shielding sheet (630) of FIG. 11, magnetic field shielding sheet (730) of FIG. 13, magnetic field shielding sheet (830) of FIG. 15, or magnetic field shielding sheet (930) of FIG. 16), first heat dissipator (1040) (e.g., first heat dissipator (540) of FIG. 5, first heat dissipator (640) of FIG. 11, first heat dissipator (740) of FIG. 13, first heat dissipator (840) of FIG. 15, or first heat dissipator (940) of FIG. 16), second heat dissipator (1050) (e.g., second heat dissipator (550) of FIG. 5, second heat dissipator (650) of FIG. 11, second heat dissipator (750) of FIG. 13, The second heat dissipator (850) of FIG. 15 or the second heat dissipator (950) of FIG. 16), a connecting heat dissipator (1055) (e.g., the connecting heat dissipator (955) of FIG. 16), a third heat dissipator (e.g., the third heat dissipator (560) of FIG. 5), a display (e.g., the display module (160) of FIG. 1, the display (261) of FIG. 2, or the display (570) of FIG. 5), a first camera module (e.g., the camera module (180) of FIG. 1, the first camera module (280a) of FIG. 2, or the first camera module (581) of FIG. 6), a second camera module (e.g., the camera module (180) of FIG. 1),It may include a second camera module (280b) of FIG. 3, a second camera module (582) of FIG. 8, a second camera module (682) of FIG. 9, or a second camera module (882) of FIG. 15, and a circuit board (e.g., a first circuit board (251) of FIG. 4, a second circuit board (252), a circuit board (590) of FIG. 8, a circuit board (690) of FIG. 9, a circuit board (790) of FIG. 13, or a circuit board (890) of FIG. 14).

[0149] A connecting heat dissipator (1055) according to one embodiment may interconnect the first heat dissipator (1040) and the second heat dissipator (1050). For example, the first heat dissipator (1040), the second heat dissipator (1050), and the connecting heat dissipator (1055) may be integrally formed from the same material (e.g., graphite), but are not limited thereto.

[0150] For example, the connecting heat sink (1055) may be placed at the edge of the magnetic field shielding sheet (1030). For example, the location where the connecting heat sink (1055) is placed may be the edge further from the terminal (1022) (e.g., terminal (522) in FIG. 8, terminal (622) in FIG. 9, terminal (822) in FIG. 14, or terminal (922) in FIG. 16) among the edges on both sides (e.g., + X-axis direction or - X-axis direction) of the magnetic field shielding sheet (1030).

[0151] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1, electronic device (201) of FIG. 2, electronic device (501) of FIG. 5, electronic device (601) of FIG. 9, electronic device (701) of FIG. 13, electronic device (801) of FIG. 15, electronic device (901) of FIG. 16, or electronic device (1001) of FIG. 17)) may include a magnetic field shielding member attached to a circuit module (e.g., protection circuit module (523) of FIG. 8 or protection circuit module (623) of FIG. 9, circuit module (823) of FIG. 14 or circuit module (1023) of FIG. 17). For example, the magnetic field shielding member may be provided in a size corresponding to the circuit module. For example, a magnetic field shielding member may be additionally placed separately from a magnetic field shielding sheet (e.g., magnetic field shielding sheet (530) of FIG. 5, magnetic field shielding sheet (630) of FIG. 11, magnetic field shielding sheet (730) of FIG. 13, magnetic field shielding sheet (830) of FIG. 15, magnetic field shielding sheet (930) of FIG. 16, or magnetic field shielding sheet (1030) of FIG. 17). Meanwhile, the magnetic field shielding member may reduce the efficiency of heat generated in the circuit module being transferred to the third heat dissipator (e.g., third heat dissipator (560) of FIG. 5) and may cause a decrease in charging performance. For example, to reduce the problem of such a decrease in heat dissipation performance, only the magnetic field shielding member described above may be installed, and the magnetic field shielding sheet (e.g., magnetic field shielding sheet (530) of FIG. 5) may be omitted.

[0152]

[0153] FIG. 18 is a drawing illustrating a first state of an electronic device according to one embodiment. FIG. 19 is a drawing illustrating a second state of an electronic device according to one embodiment. For example, the first state may be referred to as an unfolded state, and the second state may be referred to as a folded state.

[0154] Referring to FIGS. 18 and 19, an electronic device (1101) according to one embodiment (e.g., electronic device (101) of FIG. 1, electronic device (201) of FIG. 2, electronic device (501) of FIG. 5, electronic device (601) of FIG. 9, electronic device (701) of FIG. 13, electronic device (801) of FIG. 15, electronic device (901) of FIG. 16, or electronic device (1001) of FIG. 17) comprises a plurality of housings (1110, 1120, 1130) (e.g., housing structure (210) of FIG. 2, front frame (240), housing structure (510) of FIG. 5, housing structure (610) of FIG. 9, or housing structure (1010) of FIG. 16), a hinge assembly (not shown) rotatably connecting the plurality of housings (1110, 1120, 1130), and at least a part of the hinge assembly A hinge housing (1140) for receiving, a battery assembly (e.g., battery (189) of FIG. 1, battery (289) of FIG. 4, battery assembly (520) of FIG. 5, battery assembly (620) of FIG. 9, battery assembly (720) of FIG. 13, or battery assembly (820) of FIG. 15), a magnetic field shielding sheet (e.g., magnetic field shielding sheet (530) of FIG. 5, magnetic field shielding sheet (630) of FIG. 11, magnetic field shielding sheet (730) of FIG. 13, magnetic field shielding sheet (830) of FIG. 15, magnetic field shielding sheet (930) of FIG. 16, or magnetic field shielding sheet (1030) of FIG. 17), a first heat dissipator (e.g., first heat dissipator (540) of FIG. 5, first heat dissipator (640) of FIG. 11, first heat dissipator (740) of FIG. 13), FIG. A first heat dissipator (840) of FIG. 15, a first heat dissipator (940) of FIG. 16, or a first heat dissipator (1040) of FIG. 17), a second heat dissipator (e.g., a second heat dissipator (550) of FIG. 5, a second heat dissipator (650) of FIG. 11, a second heat dissipator (750) of FIG. 13, a second heat dissipator (850) of FIG. 15, a second heat dissipator (950) of FIG. 16, or a second heat dissipator (1050) of FIG. 17), a third heat dissipator (e.g., a third heat dissipator (560) of FIG. 5), a display (1150),It may include 1160) (e.g., the display module (160) of FIG. 1, the display (261) of FIG. 2, or the display (570) of FIG. 5), a first camera module (e.g., the camera module (180) of FIG. 1, the first camera module (280a) of FIG. 2, or the first camera module (581) of FIG. 6), a second camera module (e.g., the camera module (180) of FIG. 1, the second camera module (280b) of FIG. 3, the second camera module (582) of FIG. 8, or the second camera module (682) of FIG. 9, or the second camera module (882) of FIG. 15), and a circuit board (e.g., the first circuit board (251) of FIG. 4, the second circuit board (252), the circuit board (590) of FIG. 8, the circuit board (690) of FIG. 9, the circuit board (790) of FIG. 13, or the circuit board (890) of FIG. 14).

[0155] According to one embodiment, a plurality of housings (1110, 1120, 1130) may be rotatably connected to each other. Meanwhile, it should be noted that, unlike what is illustrated, the electronic device (1101) may be composed of two housings (e.g., a first housing (1110) and a second housing (1120)) or may include four or more housings. In contrast to the case where the electronic device is composed of two housings, an electronic device composed of three or more housings may be referred to as a multi-foldable electronic device.

[0156] FIG. 18 illustrates an embodiment in which the closest pair of housings among the first housing (1110), the second housing (1120), and the third housing (1130) are rotatably connected to each other. For example, the second housing (1120) may be rotatably connected to the first housing (1110) with respect to a first folding axis (A_a). For example, the first folding axis (A_a) may be a virtual line that changes according to the degree of folding or unfolding of the electronic device (1101). For example, the first housing (1110) and the second housing (1120) may be rotated with respect to a single physical axis, but alternatively, they may be rotated with respect to a plurality (e.g., two) of physical axes. For example, the first folding axis (A_a) can be understood as corresponding to the center of curvature of the first connected display part (1150d) that is curved, based on the state of the electronic device (1101). For example, the third housing (1130) can be rotatably connected to the second housing (1120) based on the second folding axis (A_b). For example, the description of the first folding axis (A_a) can also be applied to the second folding axis (A_b). For example, the second folding axis (A_b) can be understood as corresponding to the center of curvature of the second connected display part (1150e) that is curved, based on the state of the electronic device (1101).

[0157] According to one embodiment, the display (1150, 1160) may include a first display (1150) that is unfolded when the electronic device (1101) is in an unfolded state and folded when the electronic device (1101) is in a folded state, and a second display (1160) located on the opposite side of the first display (1150) based on the electronic device (1101) being in an unfolded state.

[0158] According to one embodiment, the first display (1150) may be a flexible display formed of a flexible material. For example, a plurality of housings (1110, 1120, 1130) may be folded in an in-folding or out-folding manner with respect to each folding axis (A_a, A_b). An in-folding method means a method in which mutually adjacent display parts are folded in a direction facing each other. An out-folding method means a method in which mutually adjacent display parts are folded in a direction not facing each other.

[0159] For example, as illustrated in FIG. 19, a plurality of housings (1110, 1120, 1130) can be folded in an in-folding manner with respect to each folding axis (A_a, A_b). According to this method, when the electronic device (1101) is in a folded state, the first display (1150) may not be exposed from the outside. For example, the first display (1150) may include a first-1 display portion (1150a) accommodated in a first housing (1110), a first-2 display portion (1150b) accommodated in a second housing (1120), a first-3 display portion (1150c) accommodated in a third housing (1130), a first connecting display portion (1150d) interconnecting the first-1 display portion (1150a) and the first-2 display portion (1150b), and a second connecting display portion (1150e) interconnecting the first-2 display portion (1150b) and the first-3 display portion (1150c).

[0160] According to one embodiment, the second display (1160) may be exposed to the outside when the electronic device (1101) is in a folded state, as shown in FIG. 19. With such a structure, the electronic device (1101) can be operated through the second display (1160) exposed to the outside when the electronic device (1101) is in a folded state. For example, even when the electronic device (1101) is in a folded state, the user can receive an incoming call by operating the second display (1160). For example, among a plurality of housings (1110, 1120, 1130), a receiver (e.g., the acoustic output module (155) of FIG. 1 or the receiver (599) of FIG. 5) may be located in the housing (e.g., the second housing (1120)) where the display (e.g., the second display (1160)) exposed to the outside when the electronic device (1101) is in a folded state is located. For example, the part of the second display (1160) where the user's ear is located adjacent to it during a call can be referred to as the receiver area (e.g., receiver area (A) in FIG. 5). For example, displays may be placed on each side of at least one of the plurality of housings (1110, 1120, 1130), e.g., the second housing (1120). For example, the first-second display portion (1150b) may be placed on one side of the second housing (1120) (e.g., the side in the + Z-axis direction of FIG. 18), and the second display (1160) may be placed on the other side of the second housing (1120) (e.g., the side in the - Z-axis direction of FIG. 18).

[0161] According to one embodiment, a heat dissipation element and a magnetic field shielding sheet structure according to the above-described embodiments are disposed in the second housing (1120), thereby allowing sufficient heat dissipation performance to be secured while reducing the thickness of the electronic device (1101). For example, the magnetic field shielding sheet disposed in the second housing (1120) may be disposed closer to the second display (1160) than to the battery assembly disposed in the second housing (1120). With such a structure, the magnetic field emitted in the direction toward the second display (1160) within the second housing (1120) is reduced, thereby reducing the negative impact on the user or the hearing aid worn on the user's ear.

[0162] According to one embodiment, the first housing (1110) and / or the third housing (1130) may not have a structure in which a magnetic field shielding sheet is disposed between segmented heat dissipators. For example, the first housing (1110) and / or the third housing (1130) may include a heat dissipator and / or a battery. For example, the heat dissipators of the first housing (1110) and / or the third housing (1130) may be disposed to overlap the terminals of the battery provided in each housing in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (1101). For example, the heat dissipation performance of the first housing (1110) and / or the third housing (1130) can be improved by being positioned to overlap electronic components (e.g., the second camera module (582) of FIG. 8, the main processor (591), the RF PA (592), and / or the RF PMIC (593)) and the battery assembly (e.g., the battery assembly (520) of FIG. 8) in the thickness direction (e.g., the + / - Z-axis direction) that are placed in the first housing (1110) and / or the third housing (1130). According to one embodiment, the first housing (1110) and / or the third housing (1130) may have a structure in which a magnetic field shielding sheet is placed between segmented heat dissipators.

[0163]

[0164] FIG. 20 is a drawing illustrating a second state of an electronic device according to one embodiment.

[0165] Referring to FIG. 20, an electronic device (1201) according to one embodiment (e.g., electronic device (101) of FIG. 1, electronic device (201) of FIG. 2, electronic device (501) of FIG. 5, electronic device (601) of FIG. 9, electronic device (701) of FIG. 13, electronic device (801) of FIG. 15, electronic device (901) of FIG. 16, electronic device (1001) of FIG. 17, or electronic device (1101) of FIG. 18) comprises a plurality of housings (1210, 1220, 1230) (e.g., housing structure (210) of FIG. 2, front frame (240), housing structure (510) of FIG. 5, housing structure (610) of FIG. 9, housing structure (1010) of FIG. 16, or a plurality of housings (1110, 1120, 1130) of FIG. 18), a plurality of A hinge assembly (not shown) rotatably connecting housings (1210, 1220, 1230), a hinge housing for accommodating at least a portion of the hinge assembly (e.g., hinge housing (1140) of FIG. 18), a battery assembly (e.g., battery (189) of FIG. 1, battery (289) of FIG. 4, battery assembly (520) of FIG. 5, battery assembly (620) of FIG. 9, battery assembly (720) of FIG. 13, or battery assembly (820) of FIG. 15), a magnetic field shielding sheet (e.g., magnetic field shielding sheet (530) of FIG. 5, magnetic field shielding sheet (630) of FIG. 11, magnetic field shielding sheet (730) of FIG. 13, magnetic field shielding sheet (830) of FIG. 15, magnetic field shielding sheet (930) of FIG. 16, or magnetic field shielding sheet (1030) of FIG. 17), a first A heat dissipator (e.g., the first heat dissipator (540) of FIG. 5, the first heat dissipator (640) of FIG. 11, the first heat dissipator (740) of FIG. 13, the first heat dissipator (840) of FIG. 15, the first heat dissipator (940) of FIG. 16, or the first heat dissipator (1040) of FIG. 17), a second heat dissipator (e.g., the second heat dissipator (550) of FIG. 5, the second heat dissipator (650) of FIG. 11, the second heat dissipator (750) of FIG. 13, the second heat dissipator (850) of FIG. 15, the second heat dissipator (950) of FIG. 16, or the second heat dissipator (1050) of FIG. 17),A third heat sink (e.g., the third heat sink (560) of FIG. 5), a display (1250) (e.g., the display module (160) of FIG. 1, the display (261) of FIG. 2, the display (570) of FIG. 5, the first display (1150) or the second display (1160) of FIG. 18), a first camera module (e.g., the camera module (180) of FIG. 1, the first camera module (280a) of FIG. 2, or the first camera module (581) of FIG. 6), a second camera module (e.g., the camera module (180) of FIG. 1, the second camera module (280b) of FIG. 3, the second camera module (582) of FIG. 8, or the second camera module (682) of FIG. 9, or the second camera module (882) of FIG. 15)) and a circuit board (e.g., the first circuit board (251) of FIG. 4, the second circuit board (252), the circuit of FIG. 8 It may include a substrate (590), a circuit board (690) of FIG. 9, a circuit board (790) of FIG. 13, or a circuit board (890) of FIG. 14.

[0166] According to one embodiment, the closest pair of housings among the first housing (1210) (e.g., the first housing (1110) of FIG. 18), the second housing (1220) (e.g., the second housing (1120) of FIG. 18), and the third housing (1230) (e.g., the third housing (1130) of FIG. 18) may be rotatably connected to each other.

[0167] According to one embodiment, the display (1250) may include a first display portion (1250a) (e.g., the first-1 display portion (1150a) of FIG. 18) which is received in a first housing (1210), a second display portion (1250b) (e.g., the first-2 display portion (1150b) of FIG. 18) which is received in a second housing (1220), and a third display portion (1250c) (e.g., the first-3 display portion (1150c) of FIG. 18) which is received in a third housing (1130). For example, the display (1250) may further include a first connecting display part (e.g., the first connecting display part (1150d) of FIG. 18) that interconnects the first display part (1250a) and the second display part (1250b), and a second connecting display part (e.g., the second connecting display part (1150e) of FIG. 18) that interconnects the second display part (1250b) and the third display part (1250c). For example, each of the above-described display parts may have a connected structure. For example, the display (1250) may be a flexible display formed of a flexible material.

[0168] For example, as illustrated in FIG. 20, the first housing (1210) and the second housing (1220) adjacent to the first folding axis (A_a) can be folded in an in-folding manner with respect to the first folding axis (A_a). For example, as illustrated in FIG. 20, the second housing (1220) and the third housing (1230) adjacent to the second folding axis (A_b) can be folded in an out-folding manner with respect to the second folding axis (A_b). According to this method, when the electronic device (1201) is in a folded state, the third display portion (1250c) located in the third housing (1230) of the display (1250) can be exposed to the outside.

[0169] For example, among the plurality of housings (1210, 1220, 1230), a receiver (e.g., the acoustic output module (155) of FIG. 1 or the receiver (599) of FIG. 5) may be located in the housing (e.g., the third housing (1230)) where a display (e.g., the third display portion (1250c)) is located and exposed to the outside when the electronic device (1201) is folded. For example, the portion of the third display portion (1250c) where the user's ear is located adjacent to during a call may be referred to as the receiver surrounding area (e.g., the receiver surrounding area (A) of FIG. 5).

[0170] According to one embodiment, a heat dissipation element and a magnetic field shielding sheet structure according to the above-described embodiments are disposed in the third housing (1230), thereby allowing sufficient heat dissipation performance to be secured while reducing the thickness of the electronic device (1201). For example, the magnetic field shielding sheet disposed in the third housing (1230) may be disposed closer to the third display portion (1250c) than to the battery assembly disposed in the third housing (1230). With such a structure, the magnetic field emitted in the direction toward the third display portion (1250c) of the third housing (1230) is reduced, thereby reducing the negative impact on the user or the hearing aid worn on the user's ear.

[0171] According to one embodiment, the first housing (1210) and / or the second housing (1220) may not have a structure in which a magnetic field shielding sheet is disposed between segmented heat dissipators. For example, the first housing (1210) and / or the second housing (1220) may include a heat dissipator and / or a battery. For example, the heat dissipators of the first housing (1210) and / or the second housing (1220) may be disposed to overlap the terminals of the battery provided in each housing in the thickness direction (e.g., + / - Z-axis direction) of the electronic device (1201). For example, the heat dissipation performance of the first housing (1210) and / or the second housing (1220) can be improved by being positioned to overlap electronic components (e.g., the second camera module (582) of FIG. 8, the main processor (591), the RF PA (592), and / or the RF PMIC (593)) and the battery assembly (e.g., the battery assembly (520) of FIG. 8) in the thickness direction (e.g., the + / - Z-axis direction) of the first housing (1210) and / or the second housing (1220). According to one embodiment, the first housing (1210) and / or the second housing (1220) may have a structure in which a magnetic field shielding sheet is placed between segmented heat dissipators.

[0172]

[0173] According to one embodiment, an electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201) comprises a housing structure (210; 240; 510; 610; 910; 1010; 1120; 1230) for accommodating electronic components, a battery assembly (520; 620; 720; 820) for supplying power to said electronic components, and in the thickness direction of said electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201), said battery assembly (520; 620; 720; A magnetic field shielding sheet (530; 630; 730; 830; 930; 1030) overlapping a pair of terminals (522; 622; 822; 922; 1022) of 820), a first heat dissipator (540; 640; 740; 840; 940; 1040) disposed on one side of the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030), and a second heat dissipator (540; 640; 740; 840; 940; 1040) disposed on the opposite side of the first heat dissipator (540; 640; 740; 840; 940; 1040) with respect to the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030). It may include a heat dissipation body (550; 650; 750; 850; 950; 1050), and a third heat dissipation body (560) that interconnects the first heat dissipation body (540; 640; 740; 840; 940; 1040) and the second heat dissipation body (550; 650; 750; 850; 950; 1050).

[0174] According to one embodiment, the first heat dissipator is disposed in a first region of one side of the third heat dissipator, the second heat dissipator is disposed in a second region of the one side of the third heat dissipator that is spaced apart from the first region, and the magnetic field shielding sheet may be disposed in a third region of the one side of the third heat dissipator located between the first region and the second region.

[0175] According to one embodiment, in the thickness direction of the electronic device, the magnetic field shielding sheet may not overlap with either the first heat dissipator or the second heat dissipator.

[0176] According to one embodiment, the electronic device may further include a display installed in the housing structure and providing information visually to the outside of the electronic device. For example, in the thickness direction of the electronic device, the magnetic field shielding sheet may be disposed between the display and the battery assembly.

[0177] According to one embodiment, the battery assembly may include a battery cell comprising a pair of terminals, a positive electrode and a negative electrode respectively connected to the pair of terminals, and a circuit module connected to the pair of terminals for controlling a current input to or output from the battery cell. For example, the magnetic field shielding sheet may overlap the entire area of ​​the pair of terminals and at least a portion of the area of ​​the circuit module in the thickness direction of the electronic device.

[0178] According to one embodiment, the battery assembly may further include a flexible substrate that transmits current between the circuit module and the electronic components. For example, the flexible substrate may include a first portion connected to the circuit module, a second portion connected to a circuit board on which the electronic components are placed, and a bending portion that interconnects the first portion and the second portion and has a shape bent at 180 degrees. For example, the first heat dissipator may be disposed on an area where the first portion and the second portion overlap each other in the thickness direction of the electronic device.

[0179] According to one embodiment, the electronic components may include a plurality of radio frequency power amplifiers (RF PAs) for amplifying the output of a wireless communication signal of the electronic device, and a plurality of radio frequency power management integrated circuits (RF PMICs) for controlling the supply of voltage or current required for the operation of the plurality of RF PAs. For example, the magnetic field shielding sheet may overlap at least one of the plurality of RF PAs or at least one of the plurality of RF PMICs in the thickness direction of the electronic device.

[0180] According to one embodiment, the first heat sink may overlap at least one of the remainder of the plurality of RF PAs or at least one of the remainder of the plurality of RF PMICs in the thickness direction of the electronic device.

[0181] According to one embodiment, the electronic components may further include a main processor. For example, the first heat sink may overlap in the thickness direction of the electronic device at least 50% of the area occupied by the main processor on a plane perpendicular to the thickness direction.

[0182] According to one embodiment, the first heat sink may overlap in the thickness direction of the electronic device over the entire area where the central processing unit core of the main processor is located.

[0183] According to one embodiment, when viewed in the thickness direction of the electronic device, the magnetic field shielding sheet may have a shape that covers all areas located within 10 mm from the pair of terminals on a plane perpendicular to the thickness direction.

[0184] According to one embodiment, when viewed in the thickness direction of the electronic device, the first heat dissipation may overlap some of the electronic components. For example, the second heat dissipation may overlap the center of the battery assembly.

[0185] According to one embodiment, the electronic components may include a camera module capable of receiving an optical signal from the outside, a plurality of radio frequency power amplifiers (RF PAs) located on the opposite side of the camera module with respect to the vertical central axis of the electronic device and for amplifying the output of a wireless communication signal of the electronic device, and a plurality of radio frequency power management integrated circuits (RF PMICs) located on the opposite side of the camera module with respect to the central axis and for controlling the supply of voltage or current required for the operation of the plurality of radio frequency power amplifiers. For example, the first heat sink may overlap at least a portion of the camera module in the thickness direction of the electronic device. For example, the magnetic field shielding sheet may include a terminal shielding portion having a rectangular shape that overlaps the pair of terminals in the thickness direction of the electronic device, and an extension portion that extends outwardly from a corner of the terminal shielding portion located away from the battery assembly and the camera module, and overlaps at least one of the plurality of RF PAs or at least one of the plurality of RF PMICs in the thickness direction of the electronic device.

[0186] According to one embodiment, the electronic device may further include a connecting heat dissipator that interconnects the first heat dissipator and the second heat dissipator. For example, the magnetic field shielding sheet may include a slit into which the connecting heat dissipator is inserted.

[0187] According to one embodiment, the electronic device may further include a battery partition partitioning a battery slot into which the battery assembly is inserted, and a circuit board located on the opposite side of the battery assembly with respect to the battery partition. For example, with respect to the pair of terminals, the length of a second portion of the magnetic field shielding sheet extending in the opposite direction of the circuit board may be longer than the length of a first portion of the magnetic field shielding sheet extending in the direction toward the circuit board.

[0188] According to one embodiment, an electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201) comprises a housing structure (210; 240; 510; 610; 910; 1010; 1120; 1230) for accommodating electronic components, and is installed in the housing structure (210; 240; 510; 610; 910; 1010; 1120; 1230), and visually transmits information to the outside of the electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201). A display (261; 570; 1160; 1250c) providing power to the electronic components, a battery assembly (520; 620; 720; 820) for supplying power to the electronic components, and a display (261; 570; 1160; 1250c) and a battery assembly (520; 620; 720; 820) disposed in the thickness direction of the electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201), wherein a magnetic field generated from at least one terminal (522; 622; 822; 922; 1022) of the battery assembly (520; 620; 720; 820) is disposed between the display (261; 570; 1160; 1250c) and the battery assembly (520; 620; 720; 820) is formed such that, in the thickness direction of the electronic device (501; 601; 701; 801; 101; 201), a magnetic field generated from at least one terminal (522; 622; 822; 922; 1022) of the battery assembly (520; 620; 720; 820) is formed such that the A magnetic field shielding sheet (530; 630; 730; 830; 930; 1030) for reducing leakage toward a display (261; 570; 1160; 1250c), a first heat dissipator (540; 640; 740; 840; 940; 1040) and a second heat dissipator (550; 650; 750; 850; 950; 1050) spaced apart on opposite sides centered on the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030), the first heat dissipator (540; 640; 740; 840; 940; 1040) and the second heat dissipator (550; 650; 750; 850; 950;It may include a third heat dissipator (560) that forms a heat transfer path from one heat dissipator with a higher temperature to the other heat dissipator among the 1050.;

[0189] According to one embodiment, a first portion of the third heat dissipator may be in surface contact with either the first heat dissipator or the second heat dissipator. For example, a second portion of the third heat dissipator may be in surface contact with the other heat dissipator among the first heat dissipator and the second heat dissipator.

[0190] According to one embodiment, an electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201) comprises a housing structure (210; 240; 510; 610; 910; 1010; 1120; 1230), a circuit board (251; 252; 590; 690; 790; 890) installed in the housing structure (210; 240; 510; 610; 910; 1010; 1120; 1230) and on which electronic components can be arranged, and the housing structure (210; 240; 510; 610; 910; 1010; 1120; 1120; A display (261; 570; 1160; 1250c) installed in the electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201) that visually provides information to the outside of the electronic device (501; 601; 701; 801; 101; 201), a battery cell (521; 621; 821) including a positive electrode and a negative electrode, a pair of terminals (522; 622; 822; 922; 1022) respectively connected to the positive electrode and the negative electrode, and connected to the pair of terminals (522; 622; 822; 922; 1022) and input to the battery cell (521; 621; 821) or the battery cell (521; 621; A battery assembly (520; 620; 720; 820) comprising a circuit module (523; 623; 823; 1023) for controlling current output from (821), disposed between the display (261; 570; 1160; 1250c) and the battery assembly (520; 620; 720; 820) in the thickness direction of the electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201) and the battery assembly (520; 620; 720; 820), and overlapping with a pair of terminals (522; 622; 822; 922; 1022) of the battery assembly (520; 620; 720; 820). Magnetic field shielding sheet (530; 630; 730; 830; 930; 1030), the electronic device (501; 601; 701;801; 101; 201; 102; 104; 901; 1001; 1101; A first sub-heat sink (540; 640; 740; 840; 940; 1040) that overlaps the battery cell (521; 621; 821) in the thickness direction of 1201; a second sub-heat sink (550; 650; 750) that is spaced apart from the first sub-heat sink (540; 640; 740; 840; 940; 1040) and disposed on the opposite side of the first sub-heat sink (540; 640; 740; 840; 940; 1040) with respect to the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030), and overlaps the central processing unit core (791a; 891a) of the main processor among the electronic components; 850; 950; 1050), the first sub-heat sink (540; 640; 740; 840; 940; 1040) and the second sub-heat sink (550; 650; 750; 850; 950; 1050) are interconnected, and the first sub-heat sink (540; 640; 740; 840; 940; 1040) and the second sub-heat sink (550; 650; 750; 850; 950; 1050) have a thermal conductivity value higher than that of the first sub-heat sink (540; 640; 740; 840; 940; 1040) and the second sub-heat sink (550; 650; 750; 850; 950; 1050), and the electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; It may include a main heat sink (560) located at a height closer to the circuit board (251; 252; 590; 690; 790; 890) than the first sub-heat sink (540; 640; 740; 840; 940; 1040) and the second sub-heat sink (550; 650; 750; 850; 950; 1050) in the thickness direction of 1101; 1201.;

[0191] According to one embodiment, the sum of the areas of the magnetic field shielding sheet, the first sub-heat radiator, and the second sub-heat radiator may be greater than the area of ​​the main heat radiator.

[0192] According to one embodiment, the first sub-heat sink and the second sub-heat sink may be graphite sheets. For example, the main heat sink may be a vapor chamber.

[0193] According to one embodiment, the first heat sink may overlap all of the remainder of the plurality of RF PAs and all of the remainder of the plurality of RF PMICs in the thickness direction of the electronic device.

[0194] According to one embodiment, the housing structure may include a battery partition that partitions a battery slot into which the battery assembly is inserted. For example, the first heat dissipator may overlap the space on the opposite side of the battery slot with respect to the battery partition in the thickness direction of the electronic device. For example, the second heat dissipator may overlap the battery slot in the thickness direction of the electronic device.

[0195] According to one embodiment, with respect to the longitudinal direction of the electronic device, the minimum width of the first heat dissipator may be greater than the maximum width of the portion of the magnetic field shielding sheet located close to the first heat dissipator with respect to the battery partition.

[0196] According to one embodiment, the first heat dissipator, the second heat dissipator, and the connecting heat dissipator may be integrally formed of the same material.

[0197] According to one embodiment, the electronic device may further include a processor shield can disposed on the circuit board and formed to surround the main processor, a metal sheet disposed to cover an opening penetrating the processor shield can and capable of transferring heat generated from the main processor to the third heat dissipator, and a thermal bonding material disposed between the metal sheet and the main processor.

[0198] According to one embodiment, the camera module may include an image sensor capable of converting an optical signal into an electronic signal, a lens forming a path for light incident on the image sensor, and a camera shield can formed to surround the lens.

[0199] According to one embodiment, the first extension portion may include a recessed portion cut to avoid the entire area where the central processing unit core is located in the thickness direction of the electronic device.

[0200] According to one embodiment, the slit may not overlap the pair of terminals in the thickness direction of the electronic device.

[0201] According to one embodiment, the electronic device may further include a circuit board installed in the housing structure and on which the electronic components are arranged. For example, the magnetic field shielding sheet may include a first portion that overlaps the circuit board in the thickness direction of the electronic device, and a second portion that overlaps the battery assembly. For example, the area of ​​the second portion may be larger than the area of ​​the first portion.

[0202] According to one embodiment, the housing structure may include a battery partition that partitions a battery slot into which the battery assembly is inserted. For example, the electronic device may further include a circuit board disposed in a substrate slot located opposite the battery slot with respect to the battery partition. For example, with respect to the battery partition, the length of a second portion of the magnetic field shielding sheet located closer to the battery slot may be longer than the length of a first portion of the magnetic field shielding sheet located closer to the circuit board.

[0203]

[0204] The embodiments of this document are illustrative and are not intended to be limiting. Various modifications to the details of the disclosure may be made, including to the appended claims and their equivalents. Any of the embodiment(s) described herein may be used in combination with the embodiment(s) described herein.

Claims

1. In an electronic device (501; 601; 701; 801; 101; 201; 102; 104; 901; 1001; 1101; 1201), Housing structure for accommodating electronic components (210; 240; 510; 610; 910; 1010; 1120; 1230); A battery assembly (520; 620; 720; 820) for supplying power to the above electronic components; A magnetic field shielding sheet (530; 630; 730; 830; 930; 1030) that overlaps a pair of terminals (522; 622; 822; 922; 1022) of a battery assembly (520; 620; 720; 820) in the thickness direction of the electronic device (501; 601; 701; 801; 101; 201); A first heat dissipator (540; 640; 740; 840; 940; 1040) disposed on one side of the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030); A second heat dissipator (550; 650; 750; 850; 950; 1050) disposed on the opposite side of the first heat dissipator (540; 640; 740; 840; 940; 1040) with respect to the magnetic field shielding sheet (530; 630; 730; 830; 930; 1030); and A third heat dissipator (560) interconnecting the first heat dissipator (540; 640; 740; 840; 940; 1040) and the second heat dissipator (550; 650; 750; 850; 950; 1050), Electronic device.

2. In Paragraph 1, The first heat dissipator is disposed in a first region of one of the two sides of the third heat dissipator, and The second heat dissipator is disposed in a second region spaced apart from the first region among the surfaces of the third heat dissipator, and The magnetic field shielding sheet is disposed in a third region located between the first region and the second region among the surfaces of the third heat dissipation body. Electronic device.

3. In Paragraph 1 or 2, In the thickness direction of the electronic device, the magnetic field shielding sheet does not overlap with either of the first heat dissipator and the second heat dissipator. Electronic device.

4. In any one of paragraphs 1 through 3, The above electronic device is, It further includes a display installed in the above housing structure and providing information visually to the outside of the electronic device, In the thickness direction of the electronic device, the magnetic field shielding sheet is disposed between the display and the battery assembly. Electronic device.

5. In any one of paragraphs 1 through 4, The above battery assembly is, The above pair of terminals; A battery cell comprising a positive electrode and a negative electrode respectively connected to the pair of terminals above; and It includes a circuit module connected to the above pair of terminals and for controlling the current input to or output from the battery cell, and The magnetic field shielding sheet overlaps the entire area of ​​the pair of terminals and at least a portion of the area of ​​the circuit module in the thickness direction of the electronic device. Electronic device.

6. In Paragraph 5, The above battery assembly is, It further includes a flexible substrate that transmits current between the circuit module and the electronic components, The above flexible substrate is, A first part connected to the above circuit module; A second part connected to a circuit board on which the above electronic components are placed; and The first part and the second part are interconnected, and the bending part has a shape bent at 180 degrees, and In the thickness direction of the electronic device, the first heat dissipation element is disposed on the region where the first part and the second part overlap each other. Electronic device.

7. In any one of paragraphs 1 through 6, The above electronic components are, A plurality of radio frequency power amplifiers (RF PAs) for amplifying the output of a wireless communication signal of the above electronic device; and It includes a plurality of radio frequency power management integrated circuits (RF PMICs) for controlling the supply of voltage or current required for the operation of the plurality of RF PAs, and The magnetic field shielding sheet overlaps at least one of the plurality of RF PAs or at least one of the plurality of RF PMICs in the thickness direction of the electronic device. Electronic device.

8. In Paragraph 7, The first heat sink overlaps at least one of the remainder of the plurality of RF PAs or at least one of the remainder of the plurality of RF PMICs in the thickness direction of the electronic device. Electronic device.

9. In any one of paragraphs 1 through 8, The above electronic components further include a main processor, The first heat sink overlaps in the thickness direction of the electronic device at least 50% of the area occupied by the main processor on a plane perpendicular to the thickness direction. Electronic device.

10. In Paragraph 9, The first heat sink is overlapped in the thickness direction of the electronic device over the entire area where the central processing unit core of the main processor is located. Electronic device.

11. In any one of paragraphs 1 through 10, When viewed in the thickness direction of the electronic device, the magnetic field shielding sheet has a shape that covers the entire area located within 10 mm from the pair of terminals on a plane perpendicular to the thickness direction. Electronic device.

12. In any one of paragraphs 1 through 11, When viewed in the thickness direction of the above electronic device, The first heat sink is overlapped with some of the electronic components, and The second heat dissipation element is overlapped at the center of the battery assembly, Electronic device.

13. In any one of paragraphs 1 through 12, The above electronic components are, A camera module capable of receiving optical signals from the outside; A plurality of radio frequency power amplifiers (RF PAs) located on the opposite side of the camera module with respect to the vertical central axis of the electronic device and for amplifying the output of the wireless communication signal of the electronic device; and Based on the above central axis, it includes a plurality of radio frequency power management integrated circuits (RF PMICs) located on the opposite side of the camera module and for controlling the supply of voltage or current required for the operation of the plurality of radio frequency power amplifiers. The first heat sink overlaps at least a portion of the camera module in the thickness direction of the electronic device, and The above magnetic field shielding sheet is, A terminal shield portion having a rectangular shape that overlaps the pair of terminals in the thickness direction of the electronic device; and A terminal shield portion extending outwardly from a corner located in a direction away from the battery assembly and the camera module, and including an extension portion that overlaps in the thickness direction of the electronic device with at least one of the plurality of RF PAs or at least one of the plurality of RF PMICs. Electronic device.

14. In any one of paragraphs 1 through 13, The above electronic device is, It further includes a connecting heat dissipator that interconnects the first heat dissipator and the second heat dissipator, and The magnetic field shielding sheet includes a slit into which the connecting heat dissipation element is inserted. Electronic device.

15. In any one of paragraphs 1 through 14, The above electronic device is, A battery partition partitioning a battery slot into which the above-mentioned battery assembly is inserted; and It further includes a circuit board located on the opposite side of the battery assembly based on the battery partition, and Based on the above pair of terminals, the length of the second portion of the magnetic field shielding sheet extending in the opposite direction of the circuit board is longer than the length of the first portion of the magnetic field shielding sheet extending in the direction toward the circuit board. Electronic device.

Images