Cooling system comprising immersion cooling fluid

Abstract

The present invention relates to a cooling system comprising an immersion cooling fluid and, specifically, provides an immersion cooling system comprising: an electrical / electronic component; a cooling fluid; and a circulation device capable of circulating the cooling fluid, wherein the cooling fluid comprises a compound of chemical formula 1: [Chemical formula 1] In chemical formula 1, R1 and R2 are each independently a linear or branched C1 to C30 alkyl group, a linear or branched C3 to C30 alkenyl group, or a linear or branched C3 to C30 alkynyl group, R1 and R2 may be substituted with one or more R groups, and R is deuterium, , -F, -Cl, -Br, -I, -OCH3, -OCH2CH3, or -CN.

Description

Cooling system including immersion cooling fluid

[0001] The present invention relates to a cooling system comprising an immersion cooling fluid.

[0002]

[0003] Data centers are high-performance infrastructures designed for the storage, processing, and network management of large-scale data, playing an essential role in various digital services of modern society, such as internet services, cloud computing, and AI computation. Data centers operate in environments densely packed with high-performance servers and network equipment, which generate significant amounts of heat during operation. Therefore, one of the key challenges in data center operations is to efficiently dissipate this heat to maintain the stability and performance of the equipment.

[0004] Meanwhile, Energy Storage Systems (ESS) are systems used to efficiently store and manage electricity, playing a crucial role in addressing the intermittent supply issues of renewable energy and enhancing power grid stability. ESSs include various energy storage devices such as lithium-ion batteries, and these battery modules also generate significant heat during the charging and discharging process. Thermal management in ESSs is a critical factor determining the safety, lifespan, and performance of the system, making high-efficiency cooling technology essential.

[0005] In high-heat environments utilizing large-scale devices such as data centers or energy storage systems (ESS), conventional air or water cooling systems often reach their limits. To overcome these limitations, immersion cooling systems are gaining attention. Immersion cooling systems remove heat by directly immersing electrical and electronic components in a cooling fluid, offering superior thermal conductivity and energy efficiency compared to existing cooling technologies.

[0006] However, the development of suitable cooling fluids is essential for the commercialization of immersion cooling systems. Cooling fluids must simultaneously satisfy electrical insulation properties, high thermal conductivity, low viscosity, chemical stability, and environmental friendliness; furthermore, cooling fluids used in data centers or energy storage systems require a high flash point. However, existing cooling fluids have limitations in that they do not sufficiently meet these requirements or exhibit performance degradation in specific environments.

[0007] To solve these problems, the present invention provides a technology that offers excellent heat transfer performance and stability by improving the cooling fluid used in an immersion cooling system. The immersion cooling fluid according to the present invention operates stably even in high-heat environments and has the effect of significantly improving cooling efficiency.

[0008]

[0009] Prior art literature

[0010] Korean Published Patent Application KR 10-2024-0032099A

[0011]

[0012] The present invention aims to solve the problems of the aforementioned prior art and to provide an improved immersion cooling system, particularly a immersion cooling system suitable for use in data centers or Energy Storage Systems (ESS).

[0013]

[0014] To solve the aforementioned problem, the present invention,

[0015] An immersion cooling system comprising an electrical / electronic component; a cooling fluid; and a circulation device capable of circulating the cooling fluid, wherein the cooling fluid comprises a compound of Formula 1.

[0016] [Chemical Formula 1]

[0017]

[0018] In the above formula,

[0019] R 1 and R 2 Each is independently a linear or branched C1 to C30 alkyl group, a linear or branched C3 to C30 alkenyl group, or a linear or branched C3 to C30 alkynyl group, and R 1 and R 2 can be replaced with one or more R, and

[0020] R is deuterium, -F, -Cl, -Br, -I, -OCH3, -OCH2CH3, or -CN.

[0021] According to one embodiment of the present invention, the R 1 The carbon number of R 2 A liquid immersion cooling system is provided, characterized by having three or more carbon atoms than the carbon number of the carbon atoms.

[0022] According to one embodiment of the present invention, the R 1 The carbon number of R 2 A liquid immersion cooling system is provided, characterized by having five or more carbon atoms than the carbon number of the carbon atoms.

[0023] According to one embodiment of the present invention, the R 1 The number of carbon atoms of is 10 to 20, and R 2 The present invention provides an immersion cooling system characterized by having a carbon number of 5 to 15.

[0024] According to one embodiment of the present invention, the R 1 The present invention provides an immersion cooling system characterized by having a linear or branched C10 to C20 alkenyl group.

[0025] According to one embodiment of the present invention, the R 2 The present invention provides an immersion cooling system characterized by having a linear or branched 5 to 15 alkyl group.

[0026] According to one embodiment of the present invention, the R 1is a linear C15 to C20 alkenyl group, and R 2 The present invention provides an immersion cooling system characterized by being a linear C8 to C12 alkyl group.

[0027] According to one embodiment of the present invention, an immersion cooling system is provided, characterized in that the compound of Formula 1 is a compound of Formula 1-1 or a compound of Formula 1-2 below:

[0028] [Chemical Formula 1-1]

[0029]

[0030] [Chemical Formula 1-2]

[0031]

[0032] In the above formula,

[0033] R 2 is a linear or branched C5 to C15 alkyl group and can be substituted with one or more Rs, and

[0034] R 3 is a linear or branched C10 to C20 alkenyl group, has one double bond, and can be substituted with one or more Rs, and

[0035] R 4 is a linear or branched C10 to C20 alkenyl group, has two double bonds, and can be substituted with one or more Rs, and

[0036] R is deuterium, -F, -Cl, -Br, -I, -OCH3, -OCH2CH3, or -CN.

[0037] According to one embodiment of the present invention, the R 2 is a linear or branched C8 to C12 alkyl group, and R 3 is a linear or branched C15 to C20 alkenyl group, has one cis double bond, and R 4The present invention provides an immersion cooling system characterized by being a linear or branched C15 to C20 alkenyl group having two cis double bonds.

[0038] According to one embodiment of the present invention, a liquid immersion cooling system is provided, characterized in that the cooling fluid comprises a compound of Formula 1-1 and a compound of Formula 1-2 in a molar ratio of 100:0 to 27:73.

[0039] According to one embodiment of the present invention, a liquid immersion cooling system is provided, characterized in that the cooling fluid is an ester compound obtained from the ester reaction of a tall oil fatty acid (TOFA) and a linear or branched C5 to C15 alkanol.

[0040] According to one embodiment of the present invention, a liquid immersion cooling system is provided, characterized in that the tall oil fatty acid comprises oleic acid and linoleic acid.

[0041] According to one embodiment of the present invention, a liquid immersion cooling system is provided, characterized in that the molar ratio of oleic acid and linoleic acid contained in the tall oil fatty acid is 40:60 to 70:30.

[0042] According to one embodiment of the present invention, a liquid immersion cooling system is provided, characterized in that the cooling fluid comprises 80 wt% to 100 wt% of a compound of Formula 1.

[0043] According to one embodiment of the present invention, a liquid immersion cooling system is provided, characterized in that the cooling fluid has a flash point of 200°C or higher, a kinematic viscosity of 20 cSt or lower at 40°C, and a pour point of 0°C or lower.

[0044] According to one embodiment of the present invention, a liquid immersion cooling system is provided, characterized in that the cooling fluid has a flash point of 240°C or higher, a kinematic viscosity of 15 cSt or lower at 40°C, and a pour point of -10°C or lower.

[0045] According to one embodiment of the present invention, the circulating device comprises a pump and a heat exchanger, thereby providing an immersion cooling system.

[0046] According to one embodiment of the present invention, an immersion cooling system is provided, characterized by additionally including a container in which at least a portion of an electrical / electronic component is immersed in a cooling fluid.

[0047] According to one embodiment of the present invention, an immersion cooling system for a data center or ESS is provided.

[0048]

[0049] The liquid immersion cooling system according to the present invention has the effect of improving overall characteristics such as kinematic viscosity, viscosity index, pour point, flash point, and combustion point compared to conventional liquid immersion cooling systems, and is suitable for use in data centers or ESS.

[0050] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by a person skilled in the art from the description below.

[0051]

[0052] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described in detail below. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the present invention, and the present invention is defined only by the scope of the claims.

[0053] The terms used herein are for describing the embodiments and are not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. As used herein, "comprises" and / or "comprising" do not exclude the presence or addition of one or more other components in addition to the components mentioned. Throughout the specification, the same reference numerals refer to the same components, and "and / or" includes each of the components mentioned and all combinations of one or more.

[0054] Unless otherwise defined, all terms used herein (including technical and scientific terms) may be used in a meaning commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0055] The present invention provides an immersion cooling system comprising an electrical / electronic component; a cooling fluid; and a circulation device capable of circulating the cooling fluid, wherein the cooling fluid comprises a compound of Formula 1:

[0056] [Chemical Formula 1]

[0057]

[0058] In the above formula,

[0059] R 1 and R 2 Each is independently a linear or branched C1 to C30 alkyl group, a linear or branched C3 to C30 alkenyl group, or a linear or branched C3 to C30 alkynyl group, and R 1 and R 2 can be replaced with one or more R, and

[0060] R is deuterium, -F, -Cl, -Br, -I, -OCH3, -OCH2CH3, or -CN.

[0061] According to one embodiment of the present invention, the R 1 The carbon number of R 2 It can be 3 or more carbon atoms than the carbon number, preferably 5 or more.

[0062] According to one embodiment of the present invention, the R 1 The number of carbon atoms of is 10 to 20, and R 2 The carbon number of can be 5 to 15.

[0063] According to one embodiment of the present invention, the R 1 It may be a linear or branched C10 to C20 alkenyl group.

[0064] According to one embodiment of the present invention, the R 2 It may be a linear or branched C5 to C15 alkyl group.

[0065] According to one embodiment of the present invention, the R 1 is a linear C15 to C20 alkenyl group, and R 2 It can be a linear C8 to C12 alkyl group.

[0066] According to one embodiment of the present invention, the compound of Formula 1 may be a compound of Formula 1-1 or a compound of Formula 1-2.

[0067] [Chemical Formula 1-1]

[0068]

[0069] [Chemical Formula 1-2]

[0070]

[0071] In the above formula,

[0072] R 2 is a linear or branched C5 to C15 alkyl group and can be substituted with one or more Rs, and

[0073] R3 is a linear or branched C10 to C20 alkenyl group, has one double bond, and can be substituted with one or more Rs, and

[0074] R 4 is a linear or branched C10 to C20 alkenyl group, has two double bonds, and can be substituted with one or more Rs, and

[0075] R is deuterium, -F, -Cl, -Br, -I, -OCH3, -OCH2CH3, or -CN.

[0076] According to one embodiment of the present invention, the R 2 is a linear or branched C8 to C12 alkyl group, and R 3 is a linear or branched C15 to C20 alkenyl group, has one cis double bond, and R 4 It may be a linear or branched C15 to C20 alkenyl group and may have two cis double bonds.

[0077] According to one embodiment of the present invention, the cooling fluid may include one or both of the compound of Formula 1-1 and the compound of Formula 1-2. For example, in a cooling fluid comprising the compound of Formula 1-1 and the compound of Formula 1-2, the mole percentage of the compound of Formula 1-1 may be 100% or less, 80% or less, 70% or less, 60% or less, 52% or less, 37% or less, 33% or less, 27% or less, or 0%. In this case, the mole percentage of the compound of Formula 1-2 may be 0% or more, 20% or more, 30% or more, 40% or more, 48% or more, 63% or more, 67% or more, 73% or more, or 100%. Preferably, the cooling fluid may include the compound of Formula 1-1 and the compound of Formula 1-2 in a molar ratio of 100:0 to 33:67. When the above range is satisfied, it has a good viscosity index, high flash point and combustion point, satisfying comprehensive physical properties suitable for use in data centers or ESS.

[0078] According to one embodiment of the present invention, the cooling fluid can be obtained by a commonly known ester preparation method, for example, by a dehydration condensation reaction of a carboxylic acid and an alcohol, but is not particularly limited.

[0079] The above alcohol may be a C3 to C30 alcohol, examples of which include n-hexanol, n-heptanol, n-octanol, n-nonanol, n-decanol, n-undecanol, n-dodecanol, n-tridecanol, n-tetradecanol, ethylhexanol, butyloctanol, pentylnonanol, hexyldecanol, heptylundecanol, octyldodecanol, methylheptadecanol, etc. Preferably, it may be a linear or branched C5 to C15 alkanol, and more preferably, a linear or branched C8 to C12 alkanol.

[0080] The above carboxylic acid may be a saturated or unsaturated carboxylic acid having C4 to C31. For example, saturated carboxylic acids may include n-hexanoic acid, n-heptanoic acid, n-octanoic acid, n-nonanoic acid, n-decanoic acid, n-undecanoic acid, n-dodecanoic acid, n-tridecanoic acid, n-tetradecanoic acid, ethylhexanoic acid, butyloctanoic acid, pentylnonanoic acid, hexyldecanoic acid, heptylundecanoic acid, octyldodecanoic acid, methylheptadecanoic acid, etc. As the unsaturated carboxylic acid, a carboxylic acid having one or two double bonds may be used, for example, 3-hexenic acid, 3-heptene acid, 5-decene acid, 5-undecenic acid, 6-dodecene acid, (E)-9-heptadecenoic acid, (9E,12E)-heptadeca-9,12-dienoic acid, etc. Additionally, a mixture containing two or more of the carboxylic acids mentioned above may be used, and preferably, a carboxylic acid having one double bond and a carboxylic acid having two double bonds may be used. For example, a mixture of oleic acid and linoleic acid may be used.

[0081] The mixture of the above carboxylic acids may be obtained by mixing single carboxylic acid compounds, but may also be obtained from tall oil fatty acids (TOFA). The tall oil fatty acids include oleic acid and linoleic acid, and specifically, may include oleic acid and linoleic acid in a molar ratio of 40:60 to 70:30.

[0082] According to one embodiment of the present invention, the cooling fluid may contain 80 wt% to 100 wt% of the compound of Formula 1. If the cooling fluid contains the compound of Formula 1 in an amount less than the above range, it may not be able to sufficiently exhibit cooling performance.

[0083] In the present invention, the cooling fluid may consist solely of the compound of Formula 1, but may also include additives to the extent that it does not impede the purpose of the present invention. For example, viscosity index improvers, antioxidants, cleaning dispersants, friction modifiers (oilers, extreme pressure agents), anti-wear agents, metal deactivators, pour point depressants, and defoaming agents may be added as needed.

[0084] According to one embodiment of the present invention, the cooling fluid may have a flash point of 200°C or higher, a kinematic viscosity of 20 cSt or lower at 40°C, and a pour point of 0°C or lower. More preferably, the cooling fluid may have a flash point of 240°C or higher, a kinematic viscosity of 15 cSt or lower at 40°C, and a pour point of -10°C or lower.

[0085] The above electrical / electronic components include any electrical / electronic device that generates thermal energy. Examples include batteries, fuel cells, aircraft electronics, computer electronics such as microprocessors, uninterruptible power supply (UPS), power electronics (e.g., IGBTs, SCRs, thyristors, capacitors, diodes, transistors, rectifiers, etc.), inverters, DC-DC converters, chargers (e.g., in loading stations or charging stations), phase change inverters, electric motors, electric motor controllers, DC-AC inverters, and photovoltaics, and the immersion cooling system of the present invention is particularly useful for cooling data centers or ESS.

[0086] According to one embodiment of the present invention, an electrical / electronic component may be immersed in a cooling fluid within a container, at least partially or completely. The container may be any container suitable for accommodating the cooling fluid in which the electrical / electronic component is immersed. For example, the container may be a container, a housing, a battery module, etc.

[0087] According to one embodiment of the present invention, the circulation device may include a pump and a heat exchanger. The pump circulates a cooling fluid through a circulation pipeline, thereby transferring thermal energy generated from electrical / electronic components to the cooling fluid. Additionally, the heat exchanger may be any heat transfer unit capable of cooling the heated cooling fluid to a specific temperature. For example, the heat exchanger may use air cooling or liquid cooling.

[0088]

[0089] Hereinafter, embodiments of the present invention will be described in detail.

[0090]

[0091] Examples

[0092]

[0093] Preparation of cooling fluids of Examples 1 to 10

[0094] A carboxylic acid (oleic acid, linoleic acid, or a mixture thereof) and n-decanol were added to a flask in the molar ratios shown in Table 1 below, followed by the addition of p-toluenesulfonic acid (p-TSA) at an amount of 0.1–0.5 wt% of the total mass. After setting up the Dean-Stark apparatus, the mixture was refluxed at 130–150°C while stirring. To ensure that water generated during the reaction could escape, the Dean-Stark apparatus was wrapped in aluminum foil and kept hot.

[0095] After 6 hours, the mixture was cooled to room temperature, a small amount of sodium bicarbonate was added, and the mixture was stirred for an additional 10 minutes to neutralize it, after which water was removed with MgSO4. Subsequently, anhydrous hexane was added and the mixture was diluted to approximately 1.5 times its volume. The reaction mixture was then passed through a column filled with acidic aluminum oxide and filtered. Based on a 500g scale of the reaction mixture, the aluminum oxide was filled to a height of approximately 12cm in a 6cm diameter column tube and filtered once. Afterward, the mixture was heated to 80°C and dried using a high vacuum to remove the hexane.

[0096]

[0097] Preparation of cooling fluids of Comparative Examples 1 to 3

[0098] The cooling fluid of Comparative Examples 1 to 3 was a carboxylic acid compound, and a product from TCI was used.

[0099]

[0100] The specific ingredient content is shown in Table 1 below.

[0101] C1C2C3E1E2E3E4E5E6E7E8E9E10Oleic acid 100640100755450644035 30250Linoleic acid 03610002546503660 65 7075100n-Decanol 000100100100100100100 100 100100100

[0102] C1 to C3: Comparative Examples 1 to 3

[0103] E1 to E10: Examples 1 to 10

[0104]

[0105] Analysis of the physical properties of the cooling fluid

[0106] - Kinematic viscosity (KV) was analyzed at 40°C and 100°C, respectively, according to ASTM D 445.

[0107] - The viscosity index (VI) was analyzed according to ASTM D 2270.

[0108] - The pour point was analyzed according to ASTM D 97.

[0109] - Flash point and fire point were analyzed according to ASTM D 92.

[0110]

[0111] The results are shown in Table 2 below.

[0112] Kinematic viscosity (40℃, cSt) 13.6 18.1 19.4 10.2 9.9 110.4 9.4 79.4 159.2 69.2 29.0 58.9 678 Kinematic viscosity (100℃, cSt) 4.00 4.7 04.8 03.3 3.1 843.2 63.1 13.0 963.0 73.0 63.0 33.0 142.8 Viscosity Index 185190218208215208222221225225227228242 Pour Point (°C) -13-211-18-13-18-16-18-18-18-21-18-18 Flash Point (°C) 210208216260258252264256260252250246238 Combustion Point (°C) 232238230276280280282280276282280280274

[0113] C1 to C3: Comparative Examples 1 to 3

[0114] E1 to E10: Examples 1 to 10

[0115]

[0116] As shown in Table 2 above, the embodiment of the present invention was confirmed to have an effect of improving overall characteristics such as kinematic viscosity, viscosity index, pour point, flash point, and combustion point.

[0117] Specifically, it was confirmed that Examples 1 to 10 of the present invention all have lower kinematic viscosity and higher flash point and combustion point compared to Comparative Examples 1 to 3.

[0118] In addition, among the above examples, Examples 1 to 8 have a good viscosity index and a high flash point (250°C or higher) and combustion point, satisfying comprehensive physical properties that are more suitable for use in data centers or ESS.

[0119]

[0120] Although embodiments of the present invention have been described above, those skilled in the art will understand that the present invention may be implemented in other specific forms without altering its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

Claims

1. Electrical / Electronic Components; Cooling fluid; and A liquid immersion cooling system comprising a circulation device capable of circulating a cooling fluid, A liquid immersion cooling system characterized in that the above cooling fluid comprises a compound of Chemical Formula 1: [Chemical Formula 1] In the above formula, R 1 and R 2 Each is independently a linear or branched C1 to C30 alkyl group, a linear or branched C3 to C30 alkenyl group, or a linear or branched C3 to C30 alkynyl group, and R 1 and R 2 can be replaced with one or more R, and R is deuterium, -F, -Cl, -Br, -I, -OCH3, -OCH2CH3, or -CN.

2. In paragraph 1, the above R 1 The carbon number of R 2 An immersion cooling system characterized by having three or more carbon atoms than the carbon number of the carbon atoms.

3. In paragraph 2, the above R 1 The carbon number of R 2 An immersion cooling system characterized by having five or more carbon atoms than the carbon number of the carbon atoms.

4. In paragraph 3, the above R 1 The number of carbon atoms of is 10 to 20, and R 2 A liquid immersion cooling system characterized by having a carbon number of 5 to 15.

5. In paragraph 4, the above R 1 An immersion cooling system characterized by having a linear or branched C10 to C20 alkenyl group.

6. In paragraph 5, the above R 2 A liquid immersion cooling system characterized by being a linear or branched C5 to C15 alkyl group.

7. In paragraph 4, the above R 1 is a linear C15 to C20 alkenyl group, and R 2 A liquid immersion cooling system characterized by being a linear C8 to C12 alkyl group.

8. A liquid immersion cooling system according to claim 1, characterized in that the compound of Formula 1 is a compound of Formula 1-1 or a compound of Formula 1-2 below: [Chemical Formula 1-1] [Chemical Formula 1-2] In the above formula, R 2 is a linear or branched C5 to C15 alkyl group and can be substituted with one or more Rs, and R 3 is a linear or branched C10 to C20 alkenyl group, has one double bond, and can be substituted with one or more Rs, and R 4 is a linear or branched C10 to C20 alkenyl group, has two double bonds, and can be substituted with one or more Rs, and R is deuterium, -F, -Cl, -Br, -I, -OCH3, -OCH2CH3, or -CN.

9. In Paragraph 8, The above R 2 is a linear or branched C8 to C12 alkyl group, and The above R 3 It is a linear or branched C15 to C20 alkenyl group and has one cis double bond, and The above R 4 An immersion cooling system characterized by being a linear or branched C15 to C20 alkenyl group and having two cis double bonds.

10. In Paragraph 8, A liquid immersion cooling system characterized in that the cooling fluid comprises a compound of Formula 1-1 and a compound of Formula 1-2 in a molar ratio of 100:0 to 27:

73.

11. In Paragraph 8, An immersion cooling system characterized in that the cooling fluid is an ester compound obtained from the esterification reaction of a tall oil fatty acid (TOFA) and a linear or branched C5 to C15 alkanol.

12. In Paragraph 11, A liquid immersion cooling system characterized in that the above tall oil fatty acids include oleic acid and linoleic acid.

13. In Paragraph 12, A liquid immersion cooling system characterized by the molar ratio of oleic acid and linoleic acid contained in the tall oil fatty acid being 40:60 to 70:

30.

14. A liquid immersion cooling system according to any one of claims 1 to 13, wherein the cooling fluid comprises 80 wt% to 100 wt% of a compound of Formula 1.

15. A liquid immersion cooling system according to any one of claims 1 to 13, wherein the cooling fluid has a flash point of 200°C or higher, a kinematic viscosity of 20 cSt or lower at 40°C, and a pour point of 0°C or lower.

16. A liquid immersion cooling system according to claim 15, characterized in that the cooling fluid has a flash point of 240°C or higher, a kinematic viscosity of 15 cSt or lower at 40°C, and a pour point of -10°C or lower.

17. An immersion cooling system according to any one of claims 1 to 13, wherein the circulation device comprises a pump and a heat exchanger.

18. An immersion cooling system according to any one of claims 1 to 13, further comprising a container in which at least a portion of an electrical / electronic component is immersed in a cooling fluid.

19. An immersion cooling system for a data center or ESS, in any one of paragraphs 1 to 13.

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