Immersion cooling device and control method thereof

Abstract

The present disclosure relates to an immersion cooling device and a control method thereof. An immersion cooling device according to an embodiment of the present disclosure may comprise: a plurality of substrates; a substrate adjustment unit for adjusting a gap and an inclination between the substrates; a coolant circulation unit for supplying and recovering a coolant to and from the substrates; and a control unit for collecting temperature data of the substrates and flow rate data of the coolant, and controlling the substrate adjustment unit and the coolant circulation unit on the basis of the temperature data and the flow rate data, wherein the control unit determines the gap and the inclination between the substrates and a flow condition of the coolant for temperature uniformity between the substrates through feedback control.

Description

Immersion cooling device and control method thereof

[0001] The present disclosure relates to an immersion cooling device and a method for controlling the same.

[0002]

[0003] The development of high-performance chips is accelerating due to advancements in cutting-edge technologies such as IoT, AI, 5G mobile communication, and streaming technology. While these high-performance chips feature high integration density and processing speeds to enhance computing power, this has led to the problem of increased heat generation. In particular, high-density chip structures limit heat dissipation, causing overheating issues, which can result in system performance degradation and stability problems.

[0004] Immersion cooling is a technology introduced to solve the heat generation problems of high-performance chips by directly immersing the chips in a coolant to efficiently remove heat. However, even with the immersion cooling method, uneven heat distribution between chips can occur. This is because, as the coolant flows from the bottom to the top, the coolant that absorbs heat first reduces the heat removal efficiency of subsequent chips, leading to a phenomenon called thermal shadowing.

[0005] Thermal shadowing is particularly pronounced in large-scale chip arrays. Excessive heat removal from the lower chips leads to heat accumulation in the upper chips, and this imbalance hinders temperature uniformity in the system and can cause a shortened chip lifespan and system failure due to overheating.

[0006] According to one aspect of the present disclosure, an immersion cooling device and a control method for the immersion cooling device are provided to improve the problem of temperature imbalance between substrates occurring during the immersion cooling process.

[0007]

[0008] An immersion cooling device according to one embodiment of the present disclosure comprises a plurality of substrates, a substrate adjustment unit for adjusting the spacing and inclination between the substrates, a coolant circulation unit for supplying and recovering a coolant to and from the substrates, and a control unit for collecting temperature data of the substrates and flow rate data of the coolant, and controlling the substrate adjustment unit and the coolant circulation unit based on the temperature and flow rate data, wherein the control unit can determine the spacing between the substrates, the inclination, and the flow conditions of the coolant for temperature equalization between the substrates through feedback control.

[0009] According to one embodiment of the present disclosure, the substrate adjustment unit is connected to each substrate and can adjust the spacing and inclination between the substrates based on the spacing and inclination between the substrates determined through the feedback control.

[0010] According to one embodiment of the present disclosure, the substrate adjustment member may include a fixed member coupled to each substrate and a driving motor connected to the fixed member, formed at a location free from interference for each substrate.

[0011] According to one embodiment of the present disclosure, the substrate adjustment unit is formed at a position free from interference for each substrate and includes a fixing unit coupled to each substrate, a first adjustment unit and a second adjustment unit coupled to the fixing unit, a guide gear that guides the movement of the first adjustment unit and the second adjustment unit, and a driving motor that drives the guide gear, thereby enabling adjustment of the spacing and inclination between the substrates by adjusting the spacing between the first adjustment unit and the second adjustment unit.

[0012] The adjustment of the gap between the first adjustment unit and the second adjustment unit according to one embodiment of the present disclosure is performed by the control unit and can be performed in response to a change in temperature distribution between substrates.

[0013] According to one embodiment of the present disclosure, the coolant circulation unit controls the flow rate and flow rate of the coolant and can supply and recover the coolant based on the flow conditions of the coolant determined through the feedback control.

[0014] According to one embodiment of the present disclosure, the control unit can calculate temperature distribution data of each substrate through simulation such as a Computational Fluid Dynamics (CFD) technique and perform the feedback control based thereon.

[0015] The feedback control according to one embodiment of the present disclosure can determine the optimal spacing and slope between the substrates using temperature data collected at a specific location of the substrate as an input value.

[0016] The feedback control according to one embodiment of the present disclosure can determine the optimal flow conditions of the coolant by receiving the inflow and outflow temperature and flow rate data of the coolant as additional input values.

[0017] According to one embodiment of the present disclosure, the control unit may set a sensing point at a specific location to collect data to be used as an input value for the feedback control.

[0018] According to one embodiment of the present disclosure, the sensing point includes a plurality of specific locations within the substrate or specific locations on a plurality of specific substrates, and may optionally include an inlet or outlet port for the coolant.

[0019] According to one embodiment of the present disclosure, the control unit can derive a simplified regression model including a regression equation for temperature equalization between substrates based on data at the sensing point.

[0020] According to one embodiment of the present disclosure, the control unit can determine the optimal spacing between the substrates, the slope, and the flow conditions of the coolant through the simplified regression model.

[0021] According to one embodiment of the present disclosure, the plurality of substrates may include a radial arrangement in which one end is spaced wider than the other end according to the flow direction of the coolant.

[0022] According to one embodiment of the present disclosure, the plurality of substrates may include an arrangement in which, depending on the flow direction of the coolant, one end is formed with a narrower spacing between the substrates than the other end to increase the flow rate of the coolant.

[0023] According to one embodiment of the present disclosure, the plurality of substrates may be arranged asymmetrically so that the coolant at a relatively low temperature preferentially contacts a specific substrate area.

[0024] A control method for an immersion cooling device according to one embodiment of another aspect of the present disclosure may include the steps of collecting temperature data of a substrate, collecting flow rate data of a coolant supplied to the substrate, determining the spacing between substrates, the slope, and the flow conditions of the coolant by performing feedback control with the collected temperature and flow rate data as input values, and adjusting the spacing between substrates, the slope, and the flow conditions of the coolant based on the determined values.

[0025] In accordance with one embodiment of the present disclosure, a sensing point is set to collect data to be used as an input value for the feedback control, wherein the sensing point provides temperature data of the substrate including a plurality of specific locations within the substrate or specific locations on a plurality of specific substrates, and optionally provides temperature and flow rate data at the inlet / outlet of the coolant including the inlet / outlet of the coolant, so that a simplified regression model including a regression equation can be used for temperature equalization between substrates based on the sensing point data.

[0026] The adjustment of the spacing and inclination between the substrates according to one embodiment of the present disclosure may be performed by a substrate adjustment unit connected to each substrate and independently adjusting the spacing and inclination between the substrates determined through the feedback control.

[0027] According to one embodiment of the present disclosure, the substrate may be formed in a radial arrangement such that one end is spaced wider than the other end according to the flow direction of the coolant.

[0028] According to one embodiment of the present disclosure, an immersion cooling device capable of resolving temperature non-uniformity between substrates that may occur in an immersion cooling device can be provided.

[0029] In addition, according to one embodiment of the present disclosure, cooling efficiency can be improved by reducing the temperature difference between substrates by adjusting the spacing and inclination between substrates.

[0030]

[0031] FIG. 1 illustrates the configuration of an immersion cooling device according to one embodiment of the present disclosure.

[0032] FIGS. 2 to 5 illustrate a substrate adjustment unit in a liquid immersion cooling device according to one embodiment of the present disclosure.

[0033] FIG. 6 illustrates a coolant circulation section in a liquid immersion cooling device according to one embodiment of the present disclosure.

[0034] FIG. 7 illustrates a control method for an immersion cooling device according to one embodiment of the present disclosure.

[0035] FIGS. 8 to 11 illustrate the arrangement of substrates according to various embodiments of the present disclosure.

[0036] FIG. 12 illustrates the signal flow of an immersion cooling device according to one embodiment of the present disclosure.

[0037] Hereinafter, the present disclosure will be described in detail with reference to the attached drawings. However, this is merely illustrative and the present disclosure is not limited to the specific embodiments described illustratively.

[0038] Although terms such as "first," "second," etc. are used to describe various elements, components, and / or sections, it goes without saying that these elements, components, and / or sections are not limited by these terms. These terms are used merely to distinguish one element, component, or section from another. Accordingly, the first element, first component, or first section mentioned below may, within the technical scope of the present disclosure, be a second element, second component, or second section.

[0039] The terms used herein are for describing the embodiments and are not intended to limit the disclosure. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. As used herein, "comprises" and / or "made of" do not exclude the presence or addition of one or more other components, steps, actions, and / or elements to the mentioned components, steps, actions, and / or elements.

[0040] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in a meaning commonly understood by those skilled in the art to which this disclosure pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0041]

[0042] FIG. 1 illustrates the configuration of an immersion cooling device according to one embodiment of the present disclosure.

[0043] As illustrated in FIG. 1, a liquid immersion cooling device (1000) according to one embodiment of the present disclosure comprises a plurality of substrates (100), a substrate adjustment unit (200) for adjusting the spacing and inclination between the substrates, a coolant circulation unit (300) for supplying and recovering a coolant to and from the substrates (100), and a control unit (400) for collecting temperature data of the substrates (100) and flow rate data of the coolant, and controlling the substrate adjustment unit (200) and the coolant circulation unit (300) based on the temperature and flow rate data. The control unit (400) can determine the spacing between the substrates, the inclination, and the flow conditions of the coolant for temperature equalization between the substrates through feedback control.

[0044] A plurality of substrates (100) according to one embodiment of the present disclosure are configured to mount or directly include a plurality of semiconductor chips or electronic components to be cooled within a liquid immersion cooling device (1000) (e.g., PCBs), and heat generated from the substrates (100) is removed through contact with a coolant. The substrates (100) may be arranged in various sizes and shapes.

[0045] The plurality of substrates (100) may be configured in a planar or three-dimensional arrangement, and each substrate (100) may transfer heat independently or in an interconnected form. Additionally, the plurality of substrates (100) may be installed by separating them into an upper structure and a lower structure, and the spacing and inclination between each substrate (100) may be adjusted to optimize cooling efficiency and heat distribution.

[0046] A substrate (100) according to one embodiment of the present disclosure may be designed so that the coolant can be distributed as evenly as possible. For example, fine patterns, protrusions, or grooves may be applied to the surface of the substrate (100) to increase the contact area with the coolant, or a separate component (e.g., a heat sink) may be attached.

[0047] Additionally, the plurality of substrates (100) may be arranged radially, linearly, or symmetrically to prevent heat concentration in specific areas. This allows each substrate (100) to maintain uniform heat transfer according to the flow of the coolant.

[0048] Additionally, according to one embodiment of the present disclosure, each substrate (100) provides temperature data through a temperature sensor installed at a specific location, and the spacing and inclination between substrates can be adjusted by the operation of a control unit (400) based on the temperature data.

[0049] Each of the above substrates (100) is physically connected to a substrate adjustment unit (200) so that the spacing and tilt can be adjusted in real time.

[0050] In a specific embodiment, the plurality of substrates (100) are used in a server system including a high-performance processor chip in a data center, and the arrangement of the plurality of substrates (100) can be formed in a shape that efficiently disperses the temperature when the coolant flows from the bottom to the top. For example, a radial arrangement is adopted in which the spacing between the substrates widens toward the top so that the coolant comes into even contact with each substrate (100).

[0051]

[0052] FIGS. 2 to 5 illustrate a substrate adjustment unit in a liquid immersion cooling device according to one embodiment of the present disclosure, through which the spacing and inclination between substrates can be adjusted.

[0053] As described above, the substrate adjustment unit (200) adjusts the spacing and tilt between each substrate and includes a drive motor (240), a fixing unit (220), an adjustment unit (223), (224), a guide gear (225), etc., and optimizes the arrangement by physically moving the substrate (100). The substrate adjustment unit (200) operates based on data derived from the control unit (400), thereby equalizing the heat distribution between specific substrates. For example, the spacing between upper substrates can be widened to increase the residence time of the coolant, or the tilt can be adjusted to promote heat transfer in a specific direction.

[0054] According to one embodiment of the present disclosure, a substrate adjustment unit (200) receives a control signal based on the result through feedback control from a control unit (400). The control signal is converted into a value for optimizing the spacing and slope by analyzing thermal distribution data between substrates. A driving motor (240) operates based on the converted value to widen or narrow the spacing between substrates and adjust the slope of a specific substrate (100) so that the flow of the coolant is efficiently dispersed.

[0055] In a specific embodiment, in an immersion cooling device (1000) for cooling high-performance chips in a data center, a substrate adjustment unit (200) adjusts the inclination of the substrate (100) so that a radial arrangement is implemented in which the spacing between substrates widens toward the top when the coolant flows from the bottom to the top. This adjustment is intended to alleviate heat concentration occurring in a specific substrate (100) and to maintain a uniform heat distribution among all substrates.

[0056]

[0057] According to one embodiment of the present disclosure, a substrate adjustment unit (200) is connected to each substrate (100) and can adjust the spacing and inclination between the substrates based on the spacing and inclination between the substrates determined through the feedback control.

[0058] The above substrate adjustment unit (200) is physically connected to each substrate (100) and adjusts the spacing and inclination between substrates to optimize heat transfer and coolant flow between substrates, thereby maintaining temperature uniformity.

[0059] According to one embodiment of the present disclosure, a control unit (400) determines the optimal spacing and slope between each substrate through feedback control based on temperature and flow rate data, transmits the determined values ​​to a substrate adjustment unit (200), and the substrate adjustment unit (200) controls the position of each substrate (100). For example, if a high temperature is detected in a specific substrate (100), the substrate adjustment unit (200) widens the spacing of the corresponding substrate (100) and changes the slope to increase the supply amount and residence time of the coolant.

[0060] A substrate adjustment unit (200) according to one embodiment of the present disclosure may include a fixed unit (220) connected to each individual substrate (100), a driving motor (240) for operating the fixed unit (223), (224), a guide gear (225), etc., thereby enabling movement and angle adjustment of the substrate (100).

[0061] Specifically, when a temperature difference occurs in a substrate (100) in a specific area of ​​the data center, the control unit (400) transmits a control signal to widen the gap between substrates and increase the slope through feedback control (e.g., model prediction control based on a regression model), and based on this, the substrate adjustment unit (200) controls each drive motor (240) to adjust the gap between substrates and the slope in real time.

[0062] Accordingly, the substrate adjustment unit (200) according to one embodiment of the present disclosure enables temperature uniformity to be achieved by optimizing the heat distribution of each substrate (100) through the adjustment of the substrate (100).

[0063]

[0064] As illustrated in FIGS. 2 and 3, the substrate adjustment unit (200) according to one embodiment of the present disclosure may include a fixing unit (220) formed at an interference-free location for each substrate and coupled to each substrate (100), and a driving motor (240) connected to the fixing unit (220). The driving motor (240) operates by receiving an electrical signal and is connected to the fixing unit (220) to precisely control the position of the substrate (100).

[0065] The drive motor (240) is coupled to the fixed part (220), and a step motor or servo motor capable of providing high torque and precision may be used. The drive motor (240) receives a signal from the control part (400) to adjust the spacing and tilt of the substrate (100), and is coupled to the fixed part (220) so that interference does not occur between each substrate.

[0066] The above-mentioned fixed part (220) stably supports the substrate (100), prevents the movement of the substrate (100) from being hindered by external impact, and transmits power between the driving motor (240) and the substrate. For example, the above-mentioned fixed part (220) may include a fixed base (221) that is coupled to the substrate (100) and stably supports the substrate (100), an acting arm (222) that transmits power between the driving motor (240) and the substrate, etc.

[0067] In a specific embodiment, when a high temperature is detected on a substrate (100) in a specific area where heat is concentrated in a data center, the control unit (400) generates a control signal to widen the gap between substrates in that area and change the tilt. The drive motor (240) operates based on the control signal and performs physical movement of the substrate (100) through the connected fixed part (220).

[0068] In addition, since the spacing and inclination between substrates are set through feedback control, temperature data and coolant flow conditions are reflected in real time.

[0069] Accordingly, the substrate adjustment unit (200) according to one embodiment of the present disclosure independently adjusts the spacing and inclination between substrates through the combination of the driving motor (240) and the fixing unit (220), thereby reducing thermal shadowing and achieving temperature uniformity between substrates.

[0070]

[0071] As illustrated in FIGS. 4 and 5, a substrate adjustment unit (200) according to another embodiment of the present disclosure is formed at a location where there is no interference for each substrate as needed, and comprises a fixing unit (220) coupled to each substrate (100), a first adjustment unit (223) and a second adjustment unit (224) coupled to the fixing unit (220), a guide gear (225) that guides the movement of the first adjustment unit (223) and the second adjustment unit (224), and a driving motor (240) that drives the guide gear (225), thereby allowing the spacing and inclination between the substrates to be adjusted by adjusting the spacing between the first adjustment unit (223) and the second adjustment unit (224).

[0072] The first adjustment unit (223) and the second adjustment unit (224) operate in conjunction with each other through the guide gear (225), and the spacing and inclination between a plurality of substrates can be controlled by adjusting the spacing between the first adjustment unit (223) and the second adjustment unit (224) guided by the guide gear (225). That is, the spacing between the first adjustment unit (223) and the second adjustment unit (224) is used as an adjustment variable, and through this, the inclination between each substrate (100) can be set as a control variable.

[0073] That is, by changing the distance between the first control unit (223) and the second control unit (224), the gap between the substrates can be widened or narrowed depending on the direction of the coolant flow.

[0074] FIG. 5b illustrates that in the embodiment of FIG. 5a, the first adjustment part (223) is moved downward, thereby narrowing the gap between the first adjustment part (223) and the second adjustment part (224) and widening the gap between the substrates. If necessary, the gap between the substrates can be adjusted by moving either the first adjustment part (223) or the second adjustment part (224) to narrow or widen the gap.

[0075] According to one embodiment of the present disclosure, the adjustment of the gap between the first adjustment unit (223) and the second adjustment unit (224) is performed in real time by the control unit (400), and this can be performed in response to changes in the temperature distribution between the substrates. That is, the control unit (400) determines the optimal gap and inclination between the substrates through feedback control based on temperature data collected from the sensing point, and this is transmitted to the drive motor (240), etc., as a control signal to adjust the distance between the first adjustment unit (223) and the second adjustment unit (224), thereby controlling the gap and inclination between the substrates in real time.

[0076] In this way, by adjusting the spacing of the first adjustment unit (223) and the second adjustment unit (224) to optimize the angle and spacing of the substrate (100) in real time, the cooling efficiency of a specific area is increased and temperature uniformity between substrates is maintained.

[0077]

[0078] FIG. 6 illustrates a coolant circulation section in a liquid immersion cooling device according to one embodiment of the present disclosure.

[0079] As described above, a coolant circulation unit (300) according to one embodiment of the present disclosure supplies and recovers the coolant to a substrate (100) in a liquid immersion cooling device (1000), and may include a coolant inlet / outlet port (inlet and outlet) (310), a pump (340), a heat exchanger (350), a valve (360), a cooling tank (380), a flow sensor (320), and a temperature sensor (330), etc.

[0080] The above-mentioned coolant circulation unit (300) controls the flow rate and velocity of the coolant and adjusts the coolant flow conditions in real time in conjunction with the control unit (400). Through this, it is possible to prevent overheating of a specific substrate (100) or to promote temperature uniformity. The coolant is heat-exchanged through a heat exchanger (350) to release heat absorbed from the substrate (100) in a high-temperature state and repeats the circulation process.

[0081] According to one embodiment of the present disclosure, the inlet of the coolant circulation unit (300) supplies coolant between the cooling tank (380) and the substrate (100), and the outlet recovers the coolant that has passed through the substrate (100) and returns it to the cooling tank (380). In addition, the pump (340) operates to maintain the circulation of the coolant, and the valve (360) controls the flow rate of the coolant to optimize cooling efficiency. Furthermore, the heat exchanger (350) restores the recovered coolant to its initial temperature so that it can be reused.

[0082] According to one embodiment of the present disclosure, the coolant circulation unit (300) can set the flow rate and flow rate of the coolant to a specific range, and the inlet and outlet are positioned at the optimal heat exchange location of each substrate (100) to increase contact with the coolant at an appropriate temperature. The coolant circulation unit (300) operates dynamically in conjunction with the control unit (400) based on the coolant flow conditions determined through feedback control.

[0083] For example, if the temperature of a specific substrate (100) rises excessively, the control unit (400) increases the flow rate of the coolant to the substrate (100) through the coolant circulation unit (300) or increases heat exchange by changing the flow between the inlet and the outlet.

[0084] Accordingly, the coolant circulation unit (300) according to one embodiment of the present disclosure efficiently performs the supply and recovery of the coolant to minimize the temperature difference between substrates and maintain the stability of the system.

[0085]

[0086] According to one embodiment of the present disclosure, the coolant circulation unit (300) controls the flow rate and flow rate of the coolant and can supply and recover the coolant based on the flow conditions of the coolant determined through the feedback control.

[0087] The above-mentioned coolant circulation unit (300) supplies and recovers the coolant to the substrate (100). The coolant circulation unit (300) may include a control system capable of controlling the flow rate and flow rate of the coolant, and such control is performed based on the flow conditions of the coolant determined through the feedback control.

[0088] The flow rate indicates the speed at which the coolant flows, and the flow rate refers to the amount of coolant per unit time. The coolant circulation unit (300) includes a flow rate sensor (or flow meter) (320) and a flow rate sensor (or flow meter) to collect real-time data and transmit it to the control unit (400) to maintain appropriate flow conditions.

[0089] According to one embodiment of the present disclosure, the coolant circulation unit (300) optimizes the coolant supply and recovery process according to coolant flow conditions determined through feedback control. To this end, the coolant circulation unit (300) may include a pump (340) and a valve (360) that control the flow rate and flow rate. The pump (340) supplies the coolant to the substrate (100) at a constant pressure, and the valve (360) automatically opens or closes according to the flow rate value determined through feedback control. Additionally, the coolant circulation unit (300) can control the flow direction of the coolant and can adjust the time delay and residence time required to achieve temperature uniformity between substrates.

[0090] For example, if conditions of a flow rate of 10 L / min and a flow velocity of 1.5 m / s are required for temperature equalization between substrates through feedback control (e.g., model prediction control by a regression model), the coolant circulation unit (300) adjusts this in real time. If the coolant flow meter measures the current flow rate as 8 L / min, the output of the pump (340) is increased to adjust the flow rate to 10 L / min. Additionally, if the flow velocity meter measures the current flow velocity as 1.2 m / s, the opening of the valve (360) is changed to adjust the flow velocity to 1.5 m / s. This operation is achieved by the control unit (400) providing a control signal to the coolant circulation unit (300) based on real-time data.

[0091] Additionally, during the recovery process after the coolant is supplied to the substrate (100), temperature data of the coolant is collected and transmitted back to the control unit (400). The data is input as an input value for feedback control to derive new flow conditions, and the coolant circulation unit (300) continuously optimizes its operation based on this.

[0092] As such, the coolant circulation unit (300) according to one embodiment of the present disclosure can effectively achieve temperature uniformity between substrates by implementing flow conditions determined through feedback control in real time. Through this, thermal shadowing phenomena can be minimized, and system stability can be ensured through efficient circulation of the coolant.

[0093]

[0094] A control unit (400) according to one embodiment of the present disclosure collects temperature data of a substrate (100) and flow rate data of the coolant, and controls the substrate adjustment unit (200) and the coolant circulation unit (300) based on the temperature and flow rate data. The control unit controls the substrate adjustment unit (200) and the coolant circulation unit (300) by collecting and analyzing the temperature data and flow rate data.

[0095] A control unit (400) according to one embodiment of the present disclosure collects temperature data of a substrate (100) through a temperature sensor installed at a specific location on the substrate (100). The temperature sensor measures the heat distribution between a plurality of substrates and can detect heat concentration or overheating areas. At the same time, it collects data on the flow rate, flow velocity, inflow and outflow temperatures of the coolant through a flow sensor (320) and a temperature sensor (330) installed in the coolant circulation unit (300). This data can be transmitted to an internal processor of the control unit (400) or an external processing device for analysis.

[0096] Additionally, the control unit (400) controls the drive motor (240) and the fixing unit (220) of the substrate adjustment unit (200) to adjust the spacing and tilt between substrates in real time. For example, when a specific substrate (100) reaches an overheated state, the control unit (400) widens the spacing between the substrates or changes the tilt so that the coolant can absorb more heat.

[0097] Additionally, the control unit (400) controls the flow rate and flow velocity of the coolant circulation unit (300). Based on the collected flow rate and temperature data, the control unit (400) adjusts the inflow and outflow rates so that the coolant effectively disperses the thermal load between specific substrates.

[0098]

[0099] According to one embodiment of the present disclosure, the control unit (400) determines the spacing between substrates, the slope, and the flow conditions of the coolant for temperature equalization between the substrates through feedback control.

[0100] According to one embodiment of the present disclosure, the control unit (400) analyzes the temperature distribution of the substrate (100) and the flow characteristics of the coolant through feedback control.

[0101] Feedback control according to one embodiment of the present disclosure may be model prediction control or PID control based on a regression model.

[0102] A feedback control, such as a regression model according to one embodiment of the present disclosure, receives temperature data collected from a sensing point and coolant flow characteristics, such as flow rate, flow velocity, and inflow and outflow temperature data, as input values ​​and learns the correlation. The regression model predicts the relationship between the temperature difference between specific substrates and the coolant flow conditions to provide an optimal control value.

[0103] The above regression model analyzes temperature distribution data between substrates to optimize the spacing between each substrate. For example, if a specific substrate (100) overheats, the control unit (400) increases the contact time of the coolant by widening the spacing between the substrate (100) and adjacent substrates based on the value predicted by the regression model. Conversely, between substrates (100) with relatively low temperatures, the spacing is reduced to increase space utilization and enhance heat conduction.

[0104] Additionally, the slope of the substrate (100) improves heat dissipation by changing the flow path of the coolant, and the control unit (400) adjusts the slope of each substrate (100) using data derived from a regression model. For example, if the coolant does not effectively cover the surface of a specific substrate (100), the control unit (400) adjusts the slope so that the coolant can flow evenly over the entire surface.

[0105] In addition, the regression model analyzes the flow rate, flow velocity, and inflow and outflow temperature data of the coolant to derive optimal flow conditions. The control unit (400) controls the coolant circulation unit (300) based on the data to adjust the flow velocity and flow rate in real time. For example, if heat concentration occurs around a specific substrate (100), the flow rate of the coolant to that area is increased, and the flow rate in other areas is reduced to increase the overall cooling efficiency.

[0106] According to one embodiment of the present disclosure, the result predicted by the regression model is integrated into a Model Predictive Control (MPC) algorithm and utilized for real-time control. MPC is a control method that predicts future states and determines an optimal control strategy, and through this, the control unit (400) is able to comprehensively adjust the spacing between substrates, slope, and coolant flow conditions.

[0107] In a specific embodiment, the control unit (400) in the immersion cooling device (1000) of the data center operates as follows. When a specific substrate (100) overheats, the control unit (400) adjusts the spacing and slope between substrates by applying the spacing increase value and slope change value predicted by the regression model. At the same time, the coolant circulation unit (300) is controlled to increase the coolant flow rate around the corresponding substrate (100).

[0108] Accordingly, according to one embodiment of the present disclosure, cooling performance and energy efficiency are simultaneously optimized by dynamically adjusting the spacing between substrates, slope, and coolant flow conditions, while maintaining a stable heat distribution by minimizing the temperature difference between substrates through regression model-based prediction and control.

[0109]

[0110] A control unit (400) according to one embodiment of the present disclosure can calculate temperature distribution data of each substrate (100) through simulation such as CFD (Computational Fluid Dynamics) and generate the regression model based thereon.

[0111] The above CFD simulation is a technology that simulates fluid flow and heat transfer processes, and generates precise temperature distribution data by analyzing the physical location of each substrate (100), the flow conditions of the coolant, and the heat generation characteristics of the substrate (100). The control unit (400) generates a regression model based on this data to determine the optimal spacing between substrates, slope, and coolant flow conditions for temperature equalization between substrates.

[0112] The above CFD simulation analyzes the location of each substrate (100) and the flow characteristics of the coolant using a 3D model to predict thermal imbalance problems and derive solutions. For example, if the coolant flows too quickly from a specific substrate (100), the simulation results show that the temperature in that area rises, allowing for decisions to be made to modify the coolant flow conditions or adjust the spacing and slope between substrates based on this. Additionally, the CFD simulation analyzes changes in temperature distribution over time in real time by reflecting the inflow and outflow temperatures of the coolant, the flow rate, and the arrangement characteristics of the substrates (100), thereby enabling the regression model to be continuously optimized.

[0113] The temperature distribution data derived from the above CFD simulation is used as input values ​​for generating a regression model. The regression model learns the correlation between multiple variables to quantitatively determine the influence of the spacing and slope between substrates and the coolant flow conditions (e.g., flow rate, velocity, temperature, flow direction) on temperature uniformity. Through this, the control unit (400) constructs a regression model capable of predicting and applying optimal cooling conditions.

[0114] For example, in a situation where a temperature rise of 80°C or more occurs in a specific substrate (100), the CFD simulation may suggest increasing the flow rate of the coolant adjacent to the substrate (100) and fine-tuning the spacing between substrates to maximize heat transfer efficiency. By reflecting these simulation results in a regression model, a more uniform temperature distribution can be maintained under the same heat generation conditions.

[0115]

[0116] According to one embodiment of the present disclosure, the regression model can determine the optimal spacing and slope between the substrates using temperature data collected at a specific location of the substrate (100) as input values.

[0117] Temperature data at the specific location is collected in real time by a temperature sensor mounted on each substrate (100), and the collected data is transmitted to a control unit (400) for analysis. The regression model aims to equalize the overall temperature distribution by adjusting the spacing and slope between substrates based on the temperature change at the specific location.

[0118] The above regression model stabilizes the temperature by adjusting the spacing and slope between substrates in real time in the event of thermal shadowing effects, non-uniformity of temperature distribution, abnormal temperature rise between substrates, or the occurrence of hot spots at specific locations. This can enhance the precision of temperature control when combined with coolant flow conditions (e.g., flow rate, velocity, temperature, flow direction).

[0119] In a specific embodiment, when a temperature rise of 90°C or more is measured at the center of the substrate (100), the regression model is set to increase the spacing between substrates by 0.5 mm and adjust the slope by 2 degrees to induce more coolant in the central part. At the same time, the spacing and slope of the surrounding substrates (100) are also adjusted to operate in a way that balances the overall temperature. This prevents excessive temperature rise at specific locations and maintains the temperature uniformity of the entire system.

[0120] Accordingly, according to one embodiment of the present disclosure, a regression model determines the optimal spacing and slope between substrates based on temperature data collected at specific locations, thereby minimizing the thermal shadowing effect and achieving uniformity of thermal distribution across the entire system. This effectively resolves problems caused by heat generation in high-performance chips and simultaneously improves cooling efficiency and stability.

[0121]

[0122] According to one embodiment of the present disclosure, the regression model can determine the optimal flow conditions of the coolant by receiving inflow and outflow temperature and flow rate data of the coolant as additional input values.

[0123] The inflow temperature of the coolant is measured before it is supplied through the coolant circulation unit (300), and the outflow temperature is measured after heat exchange between the substrates. Flow rate data is collected in real time through a flow rate sensor (or flow meter) within the coolant circulation unit (300).

[0124] The above regression model comprehensively analyzes the temperature and flow rate data of the coolant to control the coolant circulation unit (300) so that cooling efficiency is maximized under specific conditions. For example, if the difference between the inlet temperature and the outlet temperature is excessively large, or if a phenomenon is detected where the flow rate of the coolant decreases in a specific area, the regression model analyzes the data and readjusts the flow rate and flow rate. This resolves the problem of hot spots occurring at specific locations and maintains temperature uniformity throughout the system.

[0125] For example, if the coolant inflow temperature is measured at 20°C and the outflow temperature at 35°C, the regression model can increase the flow rate from the existing 5L / min to 7L / min to reduce the temperature difference. Additionally, if a temperature rise is detected in a specific substrate (100), the flow rate can be adjusted to concentrate the supply of coolant to that area, or the distance between substrates can be increased to increase the residence time of the coolant. This allows the thermal balance of the entire system to be maintained.

[0126]

[0127] According to one embodiment of the present disclosure, the control unit (400) may set a sensing point at a specific location to collect data to be used as an input value for the regression model.

[0128] The above-mentioned sensing point refers to a location within the substrate (100) capable of measuring the temperature and the flow state of the coolant, and is positioned to precisely monitor the heat distribution and the flow state of the coolant at a specific location. The sensing point is positioned at locations such as the center, corners, or areas where specific heat is concentrated of the substrate (100), and collects temperature and flow rate data in real time.

[0129] The control unit (400) configures a regression model based on data collected from the sensing point and performs temperature equalization between substrates, slope adjustment, and coolant flow rate optimization. Data obtained through the sensing point is transmitted to the control unit (400), and the control unit (400) analyzes the data to diagnose the current cooling state and generates an adjustment signal as needed.

[0130] In a specific embodiment, four sensing points are set at each corner of the substrate (100), and additional sensing points are placed in the center to collect temperature data. For example, if the temperature is measured as 45°C at sensing point A, 50°C at B, 48°C at C, and 52°C at D, the control unit (400) detects the temperature imbalance using a regression model and sends a signal to increase the coolant flow rate to the coolant circulation unit (300). In the above process, the flow conditions of the coolant are adjusted based on the sensing point data to maintain the temperature of all sensing points uniformly at 45°C.

[0131] Additionally, if it is confirmed that the flow rate data decreases at a specific sensing point, the control unit (400) takes measures such as adjusting the spacing between substrates to increase the residence time of the coolant or increase the flow rate. In this way, the control unit (400) maximizes cooling efficiency and effectively solves the thermal shadowing problem.

[0132]

[0133] According to one embodiment of the present disclosure, the sensing point includes a plurality of specific locations within the substrate (100) or specific locations on a plurality of specific substrates (100), and optionally may include an inlet / outlet port (310) of the coolant.

[0134] The above sensing points are strategically positioned to more accurately measure the temperature of the substrate (100) and the coolant flow rate data. Multiple specific locations may include the center, corners, or areas where heat is likely to be concentrated on the substrate (100), and may also include locations such as the center, middle, and top of the substrate (100). These locations are established to more precisely determine the temperature distribution and cooling efficiency within the substrate (100). By establishing specific locations on multiple specific substrates (100), for example, the first substrate, the middle substrate, and the Nth substrate, it is possible to collect important data for each substrate.

[0135] The above sensing point may optionally be placed at the coolant inlet / outlet port (310) and monitors the flow status of the coolant in real time by measuring temperature and flow rate data at the inlet / outlet port (310). This improves the efficiency of supplying and recovering the coolant and can mitigate thermal shadowing problems. Data collected from the above sensing point is transmitted to the control unit (400) to perform regression model-based analysis and optimization, and is utilized for various control tasks such as temperature equalization between substrates, slope adjustment, and coolant flow condition adjustment.

[0136] In a specific embodiment, sensing points are installed at the center and four corners of each substrate (100), respectively, to collect data from a total of five sensing points. For example, when the temperature is measured as 45°C, 47°C, 50°C, 46°C, and 49°C at sensing points A, B, C, D, and E of a specific substrate (100), the control unit (400) maintains a uniform temperature distribution by adjusting the spacing and slope between substrates using a regression model. Additionally, sensing points are additionally installed at the inlet / outlet port (310) of the coolant to collect flow rate data and temperature data at the inlet / outlet port (310), and the flow conditions of the coolant are adjusted in real time based on this.

[0137] The flow rate of the coolant and the spacing between each substrate are adjusted using data collected from the above sensing point to optimize the temperature distribution between substrates, and the inclination of the substrate (100) is also adjusted if necessary. For example, if the temperature of the inlet / outlet port (310) rises by 5°C, the coolant flow rate is increased and the spacing between substrates is adjusted to optimize the residence time.

[0138] Accordingly, a sensing point according to one embodiment of the present disclosure uniformly adjusts the temperature distribution between substrates by providing precise temperature and flow rate data at a plurality of specific locations, and optionally optimizes the flow conditions of the coolant in real time by collecting data at the coolant inlet / outlet port (310), thereby minimizing thermal shadowing and improving the stability and performance of the entire system.

[0139]

[0140] A control unit (400) according to one embodiment of the present disclosure can derive a simplified regression model including a regression equation for temperature equalization between substrates based on data at the sensing point.

[0141] The thermal distribution of each substrate (100) can be analyzed using temperature and flow rate data measured at the above sensing points, and a regression equation can be generated to calculate the optimal spacing between substrates and the slope based on this. The simplified regression model removes unnecessary variables to process data efficiently and improves computational speed by using only key variables.

[0142] The above simplified regression model is performed based on the thermal distribution data of each substrate (100) and calculates the optimal conditions required for adjusting the spacing and slope between substrates. Through this, the control unit (400) adjusts the substrate spacing and coolant flow conditions in real time to maintain a uniform temperature distribution.

[0143] In a specific embodiment, a regression equation to minimize the temperature difference can be derived by utilizing temperature data measured at the center and edges of each substrate (100). For example, data obtained from a sensing point can generate a simplified regression equation as follows.

[0144]

[0145] Here, Ti is the temperature at a specific substrate (100), di is the spacing between substrates, θi is the slope, F is the coolant flow condition (e.g., flow rate, velocity, temperature, flow direction, etc.), and a, b, c, and d are coefficients derived from a regression model. Through the above regression equation, the optimal d is obtained by using the temperature data measured at each substrate (100) as input values. i , θ i , the F value can be calculated. This simplified regression model can be applied in real time and can reduce the time required for complex calculations.

[0146] Accordingly, by introducing a simplified regression model according to an embodiment of the present invention, temperature data analysis and optimization calculations are performed rapidly, thereby effectively achieving temperature uniformity between substrates. Furthermore, by improving data processing speed and accuracy, the spacing and slope between substrates can be adjusted in real time, which effectively mitigates thermal shadowing problems and increases the overall efficiency of the cooling system.

[0147]

[0148] A control unit (400) according to one embodiment of the present disclosure can determine the optimal spacing between substrates, slope, and coolant flow conditions through the simplified regression model.

[0149] The control unit (400) utilizes data collected from the sensing point, namely temperature data at a specific location of the substrate (100) and coolant inflow and outflow temperature and flow rate data, as input values. Through this, the spacing and slope between the substrates can be adjusted and the coolant flow conditions can be optimized.

[0150] This simplified regression model is generated based on data collected from sensing points and is designed to enable efficient calculations by simplifying the complex data analysis process.

[0151] The above simplified regression model is generated by combining CFD simulation results and real-time data, and can homogenize the temperature distribution between substrates and optimize cooling efficiency.

[0152] In a specific embodiment, when a plurality of substrates (100) are arranged within a liquid immersion cooling device (1000), real-time temperature data and coolant flow rate data are input into the simplified regression model to determine the optimal spacing and slope between each substrate, and the flow rate and flow rate of the coolant are controlled to maximize the cooling effect. For example, if the temperature distribution in a specific area is uneven, the spacing and slope are readjusted so that the coolant flows more effectively in the specific area.

[0153] Accordingly, according to an embodiment of the present invention, the uniformity of the temperature distribution between substrates can be effectively achieved by optimizing the spacing between substrates, slope, and coolant flow conditions in real time based on a simplified regression model. This minimizes thermal shadowing problems and improves the overall cooling efficiency of the system.

[0154]

[0155] As such, the liquid immersion cooling device (1000) according to one embodiment of the present disclosure can effectively achieve temperature uniformity among a plurality of substrates to minimize the thermal shadowing effect. Through this, the heat generation problem of high-performance chips can be resolved, energy consumption can be reduced by optimizing coolant circulation, and the stability of the system can be improved by improving the heat distribution of the substrate (100).

[0156]

[0157] FIG. 7 illustrates a control method for an immersion cooling device according to one embodiment of the present disclosure. The description of parts of the control method for an immersion cooling device according to one embodiment of the present disclosure that overlap with the embodiments of the immersion cooling device described above is to be omitted.

[0158] As described above, a control method for an immersion cooling device according to one embodiment of the present disclosure may include: a step of collecting temperature data of a substrate (S510); a step of collecting flow rate data of a coolant supplied to the substrate (S520); a step of determining the spacing between substrates, the slope, and the flow conditions of the coolant by performing feedback control with the collected temperature and flow rate data as input values ​​(S530); and a step of adjusting the spacing between substrates, the slope, and the flow conditions of the coolant based on the determined values ​​(S540).

[0159] A control method for an immersion cooling device according to an embodiment of the present disclosure begins with a step of collecting temperature data of a substrate (S510) and a step of collecting flow rate data of a coolant supplied to the substrate (S520). The above steps may be performed using a temperature sensor installed on the substrate and a flow rate sensor placed in the coolant circulation unit. Such data is transmitted to a control unit in real time, and the temperature data is provided by measuring the surface temperature of each substrate, and the flow rate data is provided by measuring the amount of coolant flow.

[0160] The collected temperature data and flow rate data are used as input values ​​for performing feedback control. The feedback control analyzes the temperature distribution between each substrate and, based on this, determines the spacing between the substrates, the slope, and the flow conditions of the coolant (S530).

[0161] Feedback control according to one embodiment of the present disclosure may be model prediction control or PID control based on a regression model.

[0162] According to one embodiment of the present disclosure, feedback control, such as Model Predictive Control (MPC) based on a regression model, is utilized to optimize control variables in real time in response to changes in data. For example, if the temperature of a specific substrate exceeds an allowable range, the model increases the flow rate of the coolant or adjusts the spacing between substrates to achieve thermal balance.

[0163] The above-determined values ​​are applied to the spacing and slope between substrates, and the coolant flow conditions (S540). In the above step, the substrate adjustment unit and the coolant circulation unit are each activated to perform adjustments. The substrate adjustment unit finely changes the spacing and slope through a drive motor, etc., and the coolant circulation unit controls the flow of the coolant by controlling a pump and a valve.

[0164] As a specific embodiment, temperature data of the substrate is measured through sensing points on the substrate surface, and coolant flow rate data is collected by flow sensors installed at the coolant inlet and outlet. The collected data is analyzed through a regression model; for example, if the amount of heat generated from a specific substrate is measured to be relatively high, the regression model determines an optimal value that increases the coolant flow rate and decreases the spacing between substrates.

[0165] Based on the determined values, the control unit adjusts the spacing and inclination between substrates through the substrate adjustment unit, and dynamically controls the inflow and outflow temperatures, flow rates, and flow rate data through the coolant circulation unit. This effectively removes excessive heat generated from specific substrates and maintains the thermal balance of the entire system.

[0166]

[0167] According to one embodiment of the present disclosure, a sensing point is set to collect data to be used as an input value for the regression model, wherein the sensing point provides temperature data of the substrate including a plurality of specific locations within the substrate or specific locations on a plurality of specific substrates, and optionally provides temperature and flow rate data at the inlet / outlet of the coolant including the inlet / outlet of the coolant, so that a simplified regression model including a regression equation can be used for temperature equalization between substrates based on the sensing point data.

[0168] The above-mentioned sensing point is a specific point set to collect data to be used as input values ​​for a regression model, and includes multiple specific locations within a substrate or specific locations on multiple specific substrates.

[0169] These sensing points are selected at locations capable of precisely measuring temperature distribution data of each substrate and may optionally be placed at the coolant inlet and outlet. The sensing points placed at the coolant inlet and outlet measure the temperature and flow rate data of the coolant, providing additional input values ​​for coolant circulation conditions. These input values ​​are analyzed through a regression model and utilized as data for temperature equalization between substrates.

[0170] Measuring devices, such as temperature sensors and flow sensors, may be placed at the aforementioned sensing points, thereby enabling the real-time collection of data from various locations within the substrate or the collection of flow rate data. By designating multiple specific locations, temperature and flow rate data can be analyzed more accurately spatially, allowing a regression model to optimize the spacing and slope between substrates based on this analysis. The locations of the sensing points are selected through CFD simulation or empirical analysis and may be set at points where significant temperature changes are expected.

[0171] In a specific embodiment, sensing points may be placed at the center and edge locations of each substrate in an immersion cooling device comprising multiple substrates. Each sensing point collects temperature data in real time from a fixed position and inputs this data into a regression model. Additional sensing points are also placed near the coolant inlet and outlet to measure the inflow and outflow temperatures and flow rates of the coolant. This data is used in the regression model, and through a simplified regression model, optimized values ​​for temperature equalization between substrates can be derived.

[0172] By collecting data on the substrate and coolant through sensing points, the accuracy of the input values ​​of the regression model can be improved, and based on this, temperature uniformity between substrates can be effectively achieved. This prevents overheating of the substrate and optimizes the flow conditions of the coolant.

[0173]

[0174] According to one embodiment of the present disclosure, the adjustment of the spacing and slope between the substrates may be performed by a substrate adjustment unit connected to each substrate and independently adjusting the spacing and slope between the substrates determined by the regression model.

[0175] The substrate adjustment unit operates based on data derived from a regression model, thereby achieving temperature uniformity between substrates. During the adjustment process, the substrate adjustment unit processes temperature data and coolant flow rate data in real time, enabling precise adjustment of the gap and slope.

[0176] The substrate adjustment unit may include various mechanical components such as a drive motor, a fixing unit, an adjustment unit, and a guide gear. For example, the drive motor operates to change the tilt of each substrate, and the spacing between substrates can be adjusted by adjusting the distance between two adjustment units. The substrate adjustment unit operates according to a control signal received from the control unit, and all operations can be performed in real time.

[0177]

[0178] Meanwhile, FIGS. 8 to 11 illustrate the arrangement of substrates according to various embodiments of the present disclosure.

[0179] As illustrated in FIG. 8, according to one embodiment of the present disclosure, the plurality of substrates (100) may include a radial arrangement in which one end is spaced wider than the other end according to the flow direction of the coolant.

[0180] The above radial arrangement is intended to reduce the difference in residence time depending on the direction of coolant flow and to maximize the heat exchange efficiency between the coolant and the substrate. This allows the coolant velocity to be controlled according to the substrate spacing, thereby inducing more uniform dispersion of the coolant.

[0181] In other words, as the coolant flows, heat is absorbed at a rapid rate when the gap between the substrates is narrow, and when the gap is wide, the flow rate of the coolant is reduced, thereby increasing the heat exchange time with the surface of the substrate (100). Through this, a uniform temperature distribution is formed across the entire substrate (100), and the thermal shadowing phenomenon can be minimized.

[0182] This arrangement is optimized by comprehensively considering variables such as the flow conditions of the coolant, the spacing between substrates, and the slope of the substrate (100).

[0183] Accordingly, according to one embodiment of the present disclosure, the flow of the coolant is optimized through a radial arrangement to equalize the heat distribution between substrates, thereby minimizing the thermal shadowing phenomenon and improving the cooling efficiency of the substrate (100).

[0184]

[0185] As illustrated in FIG. 9, according to one embodiment of the present disclosure, the plurality of substrates (100) may include an arrangement in which, according to the flow direction of the coolant, one end is formed with a narrower spacing between the substrates than the other end to increase the flow rate of the coolant.

[0186] This slope adjustment optimizes the contact time between the coolant and the substrate (100) to maintain a uniform heat distribution and minimize thermal shadowing. The arrangement can effectively control the high amount of heat generated, especially in high-performance chips.

[0187] Specifically, the plurality of substrates (100) may have a structure in which the spacing between the substrates gradually narrows as it moves upward when the flow direction of the coolant moves from the bottom to the top. This arrangement increases the average flow rate of the coolant, thereby maximizing the heat transfer efficiency between the substrates. In other words, it ensures that cold coolant is supplied more quickly to lower the temperature of the upper part of the substrate (100) more quickly. Through this, the coolant recovers heat more intensively from the top and reduces the temperature difference between the substrates.

[0188] As the flow rate of the coolant increases, the control unit (400) adjusts the slope in real time using a regression model, thereby ensuring that the temperature uniformity of all substrates (100) is maintained.

[0189] Accordingly, according to an embodiment of the present disclosure, temperature uniformity is achieved by minimizing the temperature difference between substrates through an increase in the flow rate of the coolant. The slope arrangement through the adjustment of the spacing between substrates maximizes cooling efficiency and can effectively suppress thermal shadowing.

[0190]

[0191] As illustrated in FIGS. 10 and 11, according to one embodiment of the present disclosure, the plurality of substrates (100) may be arranged asymmetrically so that the coolant at a relatively low temperature preferentially contacts a specific substrate (100) area. Here, asymmetrical arrangement means that the front surface direction of the substrates (100) does not face the same direction, but is arranged to face a specific direction only for the specific substrate (100).

[0192] The example illustrated in FIG. 10 illustrates that the front surfaces of a set of substrates (100) are arranged to face each other, and the gap between the substrates is formed such that one end is narrower than the other end according to the direction of flow of the coolant, and FIG. 11 illustrates that the front surfaces of a pair of substrates (100) are arranged to face each other, and the gap between the substrates is formed such that one end is alternately wider and narrower than the other end according to the direction of flow of the coolant.

[0193] This asymmetric arrangement allows for the priority removal of heat from a specific substrate (100) region by controlling the flow path of the coolant. The asymmetric arrangement is configured such that the position and angle of the substrate (100) are adjusted so that the coolant is not evenly distributed across each substrate (100), and more coolant is preferentially or intensively delivered to the substrate (100) where heat generation is high.

[0194] The preferential or intensive contact of the coolant is monitored in real time by the control unit (400) and is implemented through the substrate adjustment unit (200) which adjusts the arrangement state of the substrate (100), or in the case of any specific substrate (100), it may be implemented to have an asymmetric arrangement from the initial setting. Through this, the temperature of the specific substrate (100) area is effectively controlled, and temperature uniformity between the entire substrate is maintained.

[0195] For example, if substrate (100) A has the highest thermal load, the first contact point where the coolant is introduced can be set to the area of ​​substrate (100) A. To this end, the location of substrate (100) A is positioned as the initial point of the coolant flow path, or a path is set to concentrate the flow of the coolant to substrate (100) A. Through Computational Fluid Dynamics (CFD) simulation, it can be confirmed that this asymmetric arrangement optimizes the flow of the coolant and maximizes cooling performance in a specific area.

[0196] Accordingly, the asymmetric arrangement according to one embodiment of the present disclosure can secure temperature uniformity of the entire system by primarily solving the heat generation problem of a specific substrate (100). In addition, by primarily placing a coolant with a relatively low temperature in the most important area of ​​the substrate (100), cooling efficiency is maximized, overheating of the specific substrate (100) is prevented, and the stability of the system is ensured.

[0197]

[0198] FIG. 12 illustrates the signal flow of an immersion cooling device according to one embodiment of the present disclosure.

[0199] Collect temperature and flow rate data from the sensing point (S611):

[0200] Sensing points are set at specific locations within a plurality of substrates or at specific locations on a specific substrate, and the data collected from the sensing points includes temperature and coolant flow rate information.

[0201] Data transmission to control unit (S612):

[0202] Temperature and flow rate data collected from the sensing points are transmitted to the control unit. The control unit uses this data to perform simulation-based analyses, such as regression models and CFD.

[0203] Simulation-based data analysis such as CFD (S613):

[0204] The control unit performs CFD (Computational Fluid Dynamics) simulations based on the received data to analyze the temperature distribution and flow rate changes of each substrate.

[0205] Regression Model Generation (S614):

[0206] The control unit generates a regression model based on the CFD simulation analysis results and collected data.

[0207] Determination of optimal inter-substrate spacing and slope (S615):

[0208] The optimal values ​​for the spacing between substrates and the slope are determined through a regression model.

[0209] Determination of optimal coolant flow conditions (S616):

[0210] The regression model also determines optimal values ​​for optimizing the coolant flow rate, flow rate, and temperature.

[0211] Board adjustment unit control (S617):

[0212] The determined spacing and inclination between substrates are adjusted by the substrate adjustment unit.

[0213] Coolant circulation unit control (S618):

[0214] The determined coolant flow conditions are controlled by the coolant circulation unit. The coolant circulation unit regulates the flow velocity and flow rate of the coolant and maintains optimal coolant flow conditions.

[0215] Optimization of substrate arrangement and coolant flow conditions (S619):

[0216] Finally, substrate arrangement and coolant flow conditions are optimized through the control of the substrate adjustment unit and the coolant circulation unit. This ensures temperature uniformity between substrates and improves cooling efficiency, thereby minimizing thermal shadowing problems.

[0217]

[0218] As such, according to one embodiment of the present disclosure, the thermal shadowing problem is minimized, temperature uniformity between substrates is achieved, and the flow conditions of the coolant are optimized, thereby providing the effect of increasing the stability and efficiency of a high-performance system.

[0219]

[0220] Various embodiments of the present disclosure may be implemented as software (e.g., a program) comprising one or more instructions stored in a storage medium (e.g., internal memory or external memory) that can be read by a machine (e.g., an electronic device).

[0221] For example, a processor of a device (e.g., an electronic device) may call at least one of one or more instructions stored from a storage medium and execute it. This enables the device to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0222] Methods according to various embodiments of the present disclosure may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) (or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0223] The above description is merely an example of applying the principles of the present disclosure, and other configurations may be further included without departing from the scope of the present invention. For example, at least some of the various embodiments of the present disclosure described above may be combined.

Claims

1. Multiple substrates; A substrate adjustment unit for adjusting the spacing and inclination between the above substrates; A coolant circulation unit that supplies and recovers a coolant to the above substrate; It includes a control unit that collects temperature data of the substrate and flow rate data of the coolant, and controls the substrate adjustment unit and the coolant circulation unit based on the temperature and flow rate data. The above control unit is an immersion cooling device that determines the spacing between substrates, the slope, and the flow conditions of the coolant for temperature equalization between the substrates through feedback control.

2. In Paragraph 1, The above substrate adjustment unit is, An immersion cooling device connected to each substrate and adjusting the spacing and inclination between the substrates based on the spacing and inclination between the substrates determined through the feedback control.

3. In Paragraph 2, The above substrate adjustment unit is, It is formed at an interference-free location for each substrate, and A liquid immersion cooling device comprising a fixed part coupled to each substrate and a driving motor connected to the fixed part.

4. In Paragraph 2, The above substrate adjustment unit is, It is formed at an interference-free location for each substrate, and Fixing parts coupled to each substrate; A first adjustment part and a second adjustment part coupled to the above-mentioned fixed part; A guide gear that guides the movement of the first adjustment unit and the second adjustment unit, and Including a drive motor that drives the above guide gear, A liquid immersion cooling device that adjusts the spacing and inclination between substrates by adjusting the spacing between the first adjustment unit and the second adjustment unit.

5. In Paragraph 4, The adjustment of the gap between the first adjustment part and the second adjustment part is, An immersion cooling device that is performed by the above-mentioned control unit and is performed in response to changes in temperature distribution between substrates.

6. In Paragraph 1, The above-mentioned coolant circulation unit is, Controlling the flow rate and flow rate of the above-mentioned coolant, An immersion cooling device that supplies and recovers coolant based on coolant flow conditions determined through the above feedback control.

7. In Paragraph 1, The above control unit is, An immersion cooling device that calculates temperature distribution data of each substrate through CFD (Computational Fluid Dynamics) simulation and performs the feedback control based thereon.

8. In Paragraph 7, The above feedback control is, An immersion cooling device that determines the optimal spacing and slope between the substrates using temperature data collected at a specific location on the substrate as an input value.

9. In Paragraph 8, The above feedback control is, An immersion cooling device that receives inlet and outlet temperature and flow rate data of the coolant as additional input values ​​and determines the optimal flow conditions of the coolant.

10. In Paragraph 1, The above control unit is, An immersion cooling device that sets a sensing point at a specific location to collect data to be used as an input value for the above feedback control.

11. In Paragraph 10, The above sensing point is, It includes a plurality of specific locations within the substrate or specific locations on a plurality of specific substrates, A liquid immersion cooling device optionally comprising an inlet or outlet port for the coolant.

12. In Paragraph 11, The above control unit is, An immersion cooling device that derives a simplified regression model including a regression equation for temperature equalization between substrates based on data from the above-mentioned sensing points.

13. In Paragraph 12, The above control unit is, An immersion cooling device that determines the optimal spacing and slope between the substrates and the flow conditions of the coolant through the simplified regression model above.

14. In Paragraph 1, The above plurality of substrates are, A liquid immersion cooling device comprising a radial arrangement in which one end is spaced wider than the other end according to the flow direction of the coolant.

15. In Paragraph 1, The above plurality of substrates are, An immersion cooling device comprising an arrangement in which, depending on the flow direction of the coolant, the gap between substrates is formed narrower at one end than at the other end to increase the flow rate of the coolant.

16. In Paragraph 1, The above plurality of substrates are, An immersion cooling device configured such that the above-mentioned coolant at a relatively low temperature is arranged asymmetrically and preferentially contacts a specific substrate area.

17. Step of collecting temperature data of the substrate; A step of collecting flow rate data of the coolant supplied to the above substrate; A step of determining the spacing between substrates, slope, and flow conditions of the coolant by performing feedback control using the collected temperature and flow rate data as input values; and A method for controlling an immersion cooling device comprising the step of adjusting the spacing between substrates, the slope, and the flow conditions of the coolant based on the above-determined values.

18. In Paragraph 17, Sensing points are set to collect data to be used as input values ​​for the above feedback control, The above sensing point is, The temperature data of the substrate is provided, including a plurality of specific locations within the substrate or specific locations on a plurality of specific substrates. Optionally, temperature and flow rate data at the inlet / outlet of the coolant, including the inlet / outlet of the coolant, are provided, A control method for an immersion cooling device using a simplified regression model including a regression equation for temperature equalization between substrates based on the above sensing point data.

19. In Paragraph 17, The adjustment of the spacing and inclination between the above substrates is, A control method for an immersion cooling device performed by a substrate adjustment unit connected to each substrate and independently adjusting the spacing and slope between the substrates determined by the feedback control.

20. In Paragraph 17, The above substrate is, A control method for a liquid immersion cooling device formed in a radial arrangement in which one end is spaced wider than the other end according to the flow direction of the coolant.

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